JP7276674B1 - Prepregs, metal foil clad laminates and printed wiring boards - Google Patents

Abstract

A prepreg comprising a base material and a thermosetting resin composition impregnated or applied to the base material, and a cured product for evaluation obtained by thermally curing the prepreg under conditions of 230° C./100 minutes. , a prepreg that satisfies the following conditions (1) to (4). (1) The loss elastic modulus of the cured product for evaluation measured by the DMA method according to JIS C6481 (1996) has a maximum point at 200°C or higher. (2) The ratio of the loss elastic modulus L (100) of the cured product for evaluation at 100 ° C. measured by the DMA method to the loss elastic modulus L (max) of the cured product for evaluation at the maximum point is L(100)/L(max) is 0.70 or more. (3) The ratio of the loss elastic modulus L (150) of the cured product for evaluation at 150 ° C. measured by the DMA method and the L (max) is 0 as L (150) / L (max) .60 or higher. (4) The ratio of the loss elastic modulus L (200) of the cured product for evaluation at 200 ° C. measured by the DMA method and the L (max) is 0 as L (200) / L (max) .70 or higher.

Description

The present invention relates to a prepreg, a metal foil clad laminate and a printed wiring board.

In recent years, as semiconductor packages, which are widely used in electronic devices, communication devices, and personal computers, have become more sophisticated and smaller, the integration and high-density mounting of each component for semiconductor packages has accelerated in recent years. are doing. Along with this, various characteristics required for printed wiring boards for semiconductor packages are becoming more and more severe. Properties required for such printed wiring boards include, for example, a low coefficient of thermal expansion, chemical resistance, and peel strength.

Against this background, Patent Document 1 discloses a curable composition containing an alkenylphenol, an epoxy-modified silicone, and an epoxy compound other than the epoxy-modified silicone, or a curable composition containing a polymer having these as structural units. is applied to prepregs, resin sheets, metal foil-clad laminates and printed wiring boards.

WO2020/022084

According to the technique described in Patent Document 1, it is said that excellent compatibility, low thermal expansion, and chemical resistance can be exhibited. On the other hand, in the use of laminates for semiconductor packages, there is an increasing demand for a reduction in the coefficient of thermal expansion in the plane direction of laminates (hereinafter also simply referred to as "coefficient of thermal expansion"). Hereinafter, a low coefficient of thermal expansion is also referred to as "excellent in low thermal expansion properties". In particular, from the viewpoint of low thermal expansion when made into a prepreg, the technique described in Patent Document 1 still has room for improvement.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a prepreg, a metal foil-clad laminate, and a printed wiring board that are excellent in low thermal expansion properties.

The present inventors have made extensive studies to solve the above problems. As a result, the loss elastic modulus at 100° C., 150° C. and 200° C. and the loss elastic modulus at the maximum point obtained by subjecting the prepreg to the loss elastic modulus measurement by the DMA method, if the prepreg satisfies a predetermined relationship, the above We have found that the problem can be solved, and have completed the present invention.

（式（３）中、Ｒ_５は、各々独立して、水素原子又はメチル基を表し、ｎ_１は１以上の整数を表す。）

（式（３’）中、Ｒ^１３は各々独立に、水素原子、炭素数１～５のアルキル基、又はフェニル基を示し、ｎ^４は１以上１０以下の整数を示す。）。
〔１０〕
前記熱硬化性樹脂組成物中の前記重合体Ｄの含有量が、前記重合体Ｄ及び前記化合物Ｅの合計１００質量％に対して、５～６０質量％である、〔７〕～〔９〕のいずれかに記載のプリプレグ。
〔１１〕
前記エポキシ変性シリコーンＢが、下記式（１）で表されるエポキシ変性シリコーンを含む、〔２〕～〔１０〕のいずれかに記載のプリプレグ。

（上記式（１）中、Ｒ^１は、各々独立に、単結合、アルキレン基、アリーレン基又はアラルキレン基を示し、Ｒ^２は、各々独立に、炭素数１～１０のアルキル基又はフェニル基を示し、ｎは、０～１００の整数を示す。）
〔１２〕
前記エポキシ変性シリコーンＢが、１４０～２５０ｇ／ｍｏｌのエポキシ当量を有するエポキシ変性シリコーンを含有する、〔２〕～〔１１〕のいずれかに記載のプリプレグ。
〔１３〕
前記アルケニルフェノールＡが、ジアリルビスフェノール及び／又はジプロペニルビスフェノールを含有する、〔２〕～〔１２〕のいずれかに記載のプリプレグ。
〔１４〕
前記エポキシ化合物Ｃが、ビフェニル型エポキシ樹脂を含む、〔２〕～〔１３〕のいずれかに記載のプリプレグ。
〔１５〕
前記エポキシ化合物Ｃが、ナフチレンエーテル型エポキシ樹脂及び／又はナフタレンクレゾールノボラック型エポキシ樹脂を含む、〔２〕～〔１３〕のいずれかに記載のプリプレグ。
〔１６〕
前記熱硬化性樹脂組成物が、芳香族リン化合物Ｐを更に含む、〔１〕～〔１５〕のいずれかに記載のプリプレグ。
〔１７〕
前記芳香族リン化合物Ｐが、環状ホスファゼン化合物、リン酸エステル化合物及び亜リン酸エステル化合物からなる群より選択される少なくとも１種を含む、〔１６〕に記載のプリプレグ。
〔１８〕
前記熱硬化性樹脂組成物中の前記芳香族リン化合物Ｐの含有量が、樹脂固形分１００質量部に対して、３～１５質量部である、〔１６〕又は〔１７〕に記載のプリプレグ。
〔１９〕
前記熱硬化性樹脂組成物が、無機充填材を更に含有し、
前記無機充填材の含有量が、樹脂固形分１００質量部に対し、５０～１０００質量部である、〔１〕～〔１８〕のいずれかに記載のプリプレグ。
〔２０〕
前記無機充填材が、シリカ類、ベーマイト及びアルミナからなる群より選択される少なくとも１種を含む、〔１９〕に記載のプリプレグ。
〔２１〕
〔１〕～〔２０〕のいずれかに記載のプリプレグを硬化させてなる硬化物。
〔２２〕
〔１〕～〔２０〕のいずれかに記載のプリプレグ及び／又は〔２１〕に記載の硬化物を含む積層体と、
前記積層体の片面又は両面に配置された金属箔と、
を含む、金属箔張積層板。
〔２３〕
〔２１〕に記載の硬化物を含む絶縁層と、
前記絶縁層の表面に形成された導体層と、
を含む、プリント配線板。That is, the present invention is as follows.
[1]
A prepreg comprising a base material and a thermosetting resin composition impregnated or applied to the base material,
A cured product for evaluation obtained by thermally curing the prepreg under the conditions of 230° C./100 minutes is a prepreg that satisfies the following conditions (1) to (4).
(1) The loss elastic modulus of the cured product for evaluation measured by the DMA method according to JIS C6481 (1996) has a maximum point at 200°C or higher.
(2) The ratio of the loss elastic modulus L (100) of the cured product for evaluation at 100 ° C. measured by the DMA method to the loss elastic modulus L (max) of the cured product for evaluation at the maximum point is L(100)/L(max) is 0.70 or more.
(3) The ratio of the loss elastic modulus L (150) of the cured product for evaluation at 150 ° C. measured by the DMA method and the L (max) is 0 as L (150) / L (max) .60 or higher.
(4) The ratio of the loss elastic modulus L (200) of the cured product for evaluation at 200 ° C. measured by the DMA method and the L (max) is 0 as L (200) / L (max) .70 or higher.
[2]
The prepreg according to [1], wherein the thermosetting resin composition contains alkenylphenol A, epoxy-modified silicone B, and epoxy compound C other than epoxy-modified silicone B.
[3]
The thermosetting resin composition contains a polymer D containing a structural unit derived from alkenylphenol A, a structural unit derived from epoxy-modified silicone B, and a structural unit derived from epoxy compound C, [1 ] The prepreg described in .
[4]
[3], wherein the thermosetting resin composition further contains at least one selected from the group consisting of alkenylphenol A, epoxy-modified silicone B, and an epoxy compound C other than the epoxy-modified silicone B. prepreg.
[5]
The prepreg according to [3] or [4], wherein the polymer D has a weight average molecular weight of 3.0×10 ³ to 5.0×10 ⁴ .
[6]
Any one of [3] to [5], wherein the content of the structural unit derived from the epoxy-modified silicone B in the polymer D is 20 to 60% by mass with respect to the total mass of the polymer D. The prepreg described in .
[7]
[ 2] The prepreg according to any one of [6].
[8]
The prepreg according to [7], wherein the cyanate ester compound includes a naphthol aralkyl-type cyanate ester compound and/or a novolak-type cyanate ester compound.
[9]
The maleimide compounds include bis(4-maleimidophenyl)methane, 2,2-bis{4-(4-maleimidophenoxy)-phenyl}propane, bis(3-ethyl-5-methyl-4-maleimidophenyl)methane, The prepreg according to [7] or [8], comprising at least one selected from the group consisting of a maleimide compound represented by the following formula (3) and a maleimide compound represented by the following formula (3′).

(In formula (3), each R ₅ independently represents a hydrogen atom or a methyl group, and n ₁ represents an integer of 1 or more.)

(In formula (3′), each R ¹³ independently represents a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, or a phenyl group, and n ⁴ represents an integer of 1 or more and 10 or less.).
[10]
The content of the polymer D in the thermosetting resin composition is 5 to 60% by mass with respect to the total 100% by mass of the polymer D and the compound E [7] to [9] The prepreg according to any one of
[11]
The prepreg according to any one of [2] to [10], wherein the epoxy-modified silicone B contains an epoxy-modified silicone represented by the following formula (1).

(In formula (1) above, each R ¹ independently represents a single bond, an alkylene group, an arylene group or an aralkylene group, and each R ² independently represents an alkyl group having 1 to 10 carbon atoms or a phenyl group. and n is an integer from 0 to 100.)
[12]
The prepreg according to any one of [2] to [11], wherein the epoxy-modified silicone B contains an epoxy-modified silicone having an epoxy equivalent of 140-250 g/mol.
[13]
The prepreg according to any one of [2] to [12], wherein the alkenylphenol A contains diallyl bisphenol and/or dipropenyl bisphenol.
[14]
The prepreg according to any one of [2] to [13], wherein the epoxy compound C contains a biphenyl type epoxy resin.
[15]
The prepreg according to any one of [2] to [13], wherein the epoxy compound C contains a naphthylene ether type epoxy resin and/or a naphthalene cresol novolac type epoxy resin.
[16]
The prepreg according to any one of [1] to [15], wherein the thermosetting resin composition further contains an aromatic phosphorus compound P.
[17]
The prepreg according to [16], wherein the aromatic phosphorus compound P contains at least one selected from the group consisting of a cyclic phosphazene compound, a phosphate ester compound and a phosphite ester compound.
[18]
The prepreg according to [16] or [17], wherein the content of the aromatic phosphorus compound P in the thermosetting resin composition is 3 to 15 parts by mass with respect to 100 parts by mass of resin solid content.
[19]
The thermosetting resin composition further contains an inorganic filler,
The prepreg according to any one of [1] to [18], wherein the content of the inorganic filler is 50 to 1000 parts by mass with respect to 100 parts by mass of the resin solid content.
[20]
The prepreg according to [19], wherein the inorganic filler contains at least one selected from the group consisting of silicas, boehmite and alumina.
[21]
A cured product obtained by curing the prepreg according to any one of [1] to [20].
[22]
a laminate comprising the prepreg according to any one of [1] to [20] and/or the cured product according to [21];
a metal foil disposed on one side or both sides of the laminate;
A metal foil clad laminate comprising:
[23]
[21] an insulating layer containing the cured product;
a conductor layer formed on the surface of the insulating layer;
printed wiring boards, including;

ADVANTAGE OF THE INVENTION According to this invention, the prepreg, metal foil clad laminated board, and printed wiring board which are excellent in low thermal expansion property can be provided.

Hereinafter, a mode for carrying out the present invention (hereinafter referred to as "this embodiment") will be described in detail, but the present invention is not limited to this, and various modifications can be made without departing from the scope of the invention. It is possible.

As used herein, the term "resin solid content" refers to the components excluding the solvent and filler in the thermosetting resin composition of the present embodiment, unless otherwise specified, and the resin solid content is 100 parts by mass. means that the total of the components excluding the solvent and filler in the thermosetting resin composition is 100 parts by mass. Moreover, 100 mass % of resin solid content means that the sum total of the component except a solvent and a filler in a thermosetting resin composition is 100 mass %.

[Prepreg]
The prepreg of the present embodiment is a prepreg containing a substrate and a thermosetting resin composition impregnated or applied to the substrate, and the prepreg is thermally cured under conditions of 230 ° C./100 minutes. The obtained cured product for evaluation satisfies the following conditions (1) to (4).
(1) The loss elastic modulus of the cured product for evaluation measured by the DMA method according to JIS C6481 (1996) has a maximum point at 200°C or higher.
(2) The ratio of the loss elastic modulus L (100) of the cured product for evaluation at 100 ° C. measured by the DMA method to the loss elastic modulus L (max) of the cured product for evaluation at the maximum point is L(100)/L(max) is 0.70 or more.
(3) The ratio of the loss elastic modulus L (150) of the cured product for evaluation at 150 ° C. measured by the DMA method and the L (max) is 0 as L (150) / L (max) .60 or higher.
(4) The ratio of the loss elastic modulus L (200) of the cured product for evaluation at 200 ° C. measured by the DMA method and the L (max) is 0 as L (200) / L (max) .70 or higher.
Since the prepreg of the present embodiment is configured as described above, it is excellent in low thermal expansion.

The prepreg of this embodiment includes a substrate and a thermosetting resin composition impregnated or applied to the substrate. The prepreg of the present embodiment is not particularly limited in its production method as long as it satisfies the above-described configuration. It can be obtained by semi-curing (to B stage) by heating and drying at a temperature of 200°C.

The cured product of the prepreg of the present embodiment is not particularly limited as long as it is obtained by curing the prepreg of the present embodiment. The heating conditions for such curing are not particularly limited, and can be, for example, 180 to 230° C./60 to 180 minutes. Among the cured products of the prepreg of the present embodiment, those obtained by curing the prepreg of the present embodiment under the conditions of 230° C./100 minutes are used for loss elastic modulus evaluation in the present embodiment. Yes, and it is specifically referred to as "evaluation cured product".

The content of the thermosetting resin composition in the prepreg of the present embodiment is preferably 30 to 90% by volume, more preferably 35 to 90% by volume, based on the total amount of the prepreg, in terms of the thermosetting resin composition solid content. 85% by volume, more preferably 40 to 80% by volume. When the content of the thermosetting resin composition is within the above range, moldability tends to be further improved. In calculating the content of the thermosetting resin composition, it does not matter whether the thermosetting resin composition is uncured, semi-cured, or cured. In addition, the thermosetting resin composition solid content as used herein means a component obtained by removing the solvent from the thermosetting resin composition. For example, the filler described later is included in the thermosetting resin composition solid content. .

[Base material]
The substrate is not particularly limited, and examples thereof include known substrates used as materials for various printed wiring boards. Specific examples of the substrate include glass substrates, inorganic substrates other than glass (for example, inorganic substrates composed of inorganic fibers other than glass such as quartz), organic substrates (for example, wholly aromatic polyamide, polyester , polyparaphenylenebenzoxazole, and organic base materials composed of organic fibers such as polyimide). These substrates are used singly or in combination of two or more. Among these, a glass substrate is preferable from the viewpoint of being more excellent in dimensional stability under heating.

Examples of fibers constituting the glass base material include fibers of E glass, D glass, S glass, T glass, Q glass, L glass, NE glass, HME glass, and the like. Among these, the fibers constituting the glass substrate are the group consisting of E glass, D glass, S glass, T glass, Q glass, L glass, NE glass and HME glass, from the viewpoint of being more excellent in strength and low water absorption. One or more selected fibers are preferred.

The form of the substrate is not particularly limited, but examples thereof include forms such as woven fabric, non-woven fabric, roving, chopped strand mat, and surfacing mat. The weaving method of the woven fabric is not particularly limited, but for example, plain weave, Nanako weave, twill weave, etc. are known, and it is possible to appropriately select and use from these known ones depending on the intended use and performance. . In addition, glass woven fabrics surface-treated with a silane coupling agent or the like are preferably used. Although the thickness of the base material is not particularly limited, a thickness of about 0.01 to 0.1 mm is usually suitably used.

The cured product for evaluation obtained by thermally curing the prepreg of the present embodiment under the conditions of 230° C./100 minutes has (1) loss of the cured product for evaluation measured by the DMA method in accordance with JIS C6481 (1996). Since the elastic modulus has a maximum point at 200° C. or higher, it has excellent heat resistance. From the same viewpoint as above, the loss elastic modulus of the cured product for evaluation preferably has a maximum point at 240 ° C. or higher, more preferably has a maximum point at 250 ° C. or higher, and has a maximum point at 260 ° C. or higher. More preferably, it may have a maximum point at 270° C. or higher. The temperature of the maximum point of the loss elastic modulus may be a higher value, and is not particularly limited. For example, the loss elastic modulus may have a maximum point at 290° C. or higher.

The cured product for evaluation obtained by thermally curing the prepreg of the present embodiment under the conditions of 230° C./100 minutes has (2) loss elastic modulus L of the cured product for evaluation at 100° C. measured by the DMA method ( 100) and the loss elastic modulus L (max) of the cured product for evaluation at the maximum point is 0.70 or more as L (100) / L (max), so it is excellent in low thermal expansion. . From the same viewpoint as above, L(100)/L(max) is preferably 0.71 or more, more preferably 0.73 or more. The L(100)/L(max) may be a higher value and is not particularly limited. It may be 95.

The cured product for evaluation obtained by thermally curing the prepreg of the present embodiment under conditions of 230° C./100 minutes has (3) loss elastic modulus L of the cured product for evaluation at 150° C. measured by the DMA method ( 150) and the L(max) is 0.60 or more as L(150)/L(max), so the low thermal expansion property is excellent. From the same viewpoint as above, L(150)/L(max) is preferably 0.65 or more, more preferably 0.68 or more. The L(150)/L(max) may be a higher value, and is not particularly limited. It may be 90.

The cured product for evaluation obtained by thermally curing the prepreg of the present embodiment under the conditions of 230° C./100 minutes has (4) loss elastic modulus L of the cured product for evaluation at 200° C. measured by the DMA method ( 200) and the L(max) is 0.70 or more as L(200)/L(max), so that the low thermal expansion property is excellent. From the same viewpoint as above, L(200)/L(max) is preferably 0.71 or more, more preferably 0.75 or more. The above L(200)/L(max) may be a higher value and is not particularly limited, but for example, the above L(200)/L(max) may be 0.95.

More specifically, the loss elastic modulus L (max), the loss elastic modulus L (100), the loss elastic modulus L (150), and the loss elastic modulus L (200) in the present embodiment are described in Examples below. method.
In the present embodiment, the components of the thermosetting resin composition include, but are not limited to, aromatic phosphorus compound P, alkenylphenol A, epoxy-modified silicone B, other than the epoxy-modified silicone B, which will be described later. Epoxy compound C, polymer D and/or compound E, and especially reducing the functional group equivalent ratio (cyanate equivalent/epoxy equivalent) between cyanate group and epoxy group in the second composition described later. Thus, loss elastic modulus L(max), loss elastic modulus L(100), loss elastic modulus L(150), and loss elastic modulus L(200) can be preferably adjusted within the ranges described above. From the above viewpoint, in the present embodiment, the value of cyanate equivalent/epoxy equivalent is preferably less than 0.8.

[Thermosetting resin composition]
As long as the prepreg of the present embodiment satisfies the above configuration, the thermosetting resin composition of the present embodiment is not particularly limited. On the other hand, from the viewpoint of excellent low thermal expansion properties, the thermosetting resin composition in the present embodiment may contain alkenylphenol A, epoxy-modified silicone B, and an epoxy compound C other than the epoxy-modified silicone B. preferable. Hereinafter, the thermosetting resin composition containing alkenylphenol A, epoxy-modified silicone B, and epoxy compound C other than epoxy-modified silicone B is also referred to as "first composition". From the same point of view, the thermosetting resin composition in the present embodiment comprises structural units derived from alkenylphenol A, structural units derived from epoxy-modified silicone B, and an epoxy compound C other than the epoxy-modified silicone B. It is also preferable to include a polymer D containing a structural unit derived from. Hereinafter, a thermosetting polymer D containing a structural unit derived from alkenylphenol A, a structural unit derived from epoxy-modified silicone B, and a structural unit derived from an epoxy compound C other than the epoxy-modified silicone B The resin composition is also called "second composition".
Hereinafter, when referred to as "thermosetting resin composition in the present embodiment" or simply "thermosetting resin composition", unless otherwise specified, "first composition" and "second composition shall include both "things".

[Alkenylphenol A]
Alkenylphenol A is not particularly limited as long as it is a compound having a structure in which one or more alkenyl groups are directly bonded to a phenolic aromatic ring. The thermosetting resin composition in the present embodiment tends to be excellent in low thermal expansion properties due to the inclusion of alkenylphenol A.

Examples of alkenyl groups include, but are not limited to, alkenyl groups having 2 to 30 carbon atoms such as vinyl, allyl, propenyl, butenyl, and hexenyl groups. Among them, the alkenyl group is preferably an allyl group and/or a propenyl group, more preferably an allyl group, from the viewpoint of more effectively and reliably exhibiting the effects of the present embodiment. The number of alkenyl groups directly bonded to one phenolic aromatic ring is not particularly limited, and is, for example, 1-4. The number of alkenyl groups directly bonded to one phenolic aromatic ring is preferably 1 to 2, more preferably 1, from the viewpoint of more effectively and reliably exhibiting the effects of the present embodiment. Also, the bonding position of the alkenyl group to the phenolic aromatic ring is not particularly limited, but the ortho positions (2,6 positions) are preferable.

A phenolic aromatic ring is one in which one or more hydroxyl groups are directly bonded to an aromatic ring, and examples thereof include a phenol ring and a naphthol ring. The number of hydroxyl groups directly bonded to one phenolic aromatic ring is not particularly limited, and is, for example, 1 to 2, preferably 1.

The phenolic aromatic ring may have substituents other than alkenyl groups. Examples of such substituents include linear alkyl groups having 1 to 10 carbon atoms, branched alkyl groups having 3 to 10 carbon atoms, cyclic alkyl groups having 3 to 10 carbon atoms, linear alkyl groups having 1 to 10 carbon atoms, A chain alkoxy group, a branched alkoxy group having 3 to 10 carbon atoms, a cyclic alkoxy group having 3 to 10 carbon atoms, and a halogen atom. When the phenolic aromatic ring has substituents other than alkenyl groups, the number of such substituents directly bonded to one phenolic aromatic ring is not particularly limited, and is, for example, 1-2. Also, the bonding position of the substituent to the phenolic aromatic ring is not particularly limited.

Alkenylphenol A may have one or more structures in which one or more alkenyl groups are directly attached to a phenolic aromatic ring. From the viewpoint of achieving the effects of the present embodiment more effectively and reliably, alkenylphenol A preferably has one or two structures in which one or more alkenyl groups are directly bonded to a phenolic aromatic ring. It is preferable to have

（式（１Ａ）中、Ｒｘａは、各々独立して、炭素数２～８のアルケニル基を表し、Ｒｘｂは、各々独立して、炭素数１～１０のアルキル基、又は水素原子を表し、Ｒｘｃは、各々独立して、炭素数４～１２の芳香環を表し、Ｒｘｃは、ベンゼン環と縮合構造を形成してもよく、Ｒｘｃは、存在していてもよく、存在していなくてもよく、Ａは、炭素数１～６のアルキレン基、炭素数７～１６のアラルキレン基、炭素数６～１０のアリーレン基、フルオレニリデン基、スルホニル基、酸素原子、硫黄原子又は直接結合（単結合）を表し、Ｒｘｃが存在しない場合は、１つのベンゼン環にＲｘａ及び／又はＲｘｂの基を２つ以上有してもよい。）

（式（１Ｂ）中、Ｒｘｄは、各々独立して、炭素数２～８のアルケニル基を表し、Ｒｘｅは、各々独立して、炭素数１～１０のアルキル基又は水素原子を表し、Ｒｘｆは、炭素数４～１２の芳香環を表し、Ｒｘｆは、ベンゼン環と縮合構造を形成してもよく、Ｒｘｆは、存在していても、存在していなくてもよく、Ｒｘｆが存在しない場合は、１つのベンゼン環にＲｘｄ及び／又はＲｘｅの基を２つ以上有してもよい。）Alkenylphenol A may be, for example, a compound represented by the following formula (1A) or the following formula (1B).

(In formula (1A), Rxa each independently represents an alkenyl group having 2 to 8 carbon atoms, Rxb each independently represents an alkyl group having 1 to 10 carbon atoms, or a hydrogen atom, and Rxc each independently represents an aromatic ring having 4 to 12 carbon atoms, Rxc may form a fused structure with a benzene ring, Rxc may or may not be present , A is an alkylene group having 1 to 6 carbon atoms, an aralkylene group having 7 to 16 carbon atoms, an arylene group having 6 to 10 carbon atoms, a fluorenylidene group, a sulfonyl group, an oxygen atom, a sulfur atom or a direct bond (single bond). and when Rxc does not exist, one benzene ring may have two or more Rxa and/or Rxb groups.)

(In formula (1B), Rxd each independently represents an alkenyl group having 2 to 8 carbon atoms, Rxe each independently represents an alkyl group having 1 to 10 carbon atoms or a hydrogen atom, and Rxf is , represents an aromatic ring having 4 to 12 carbon atoms, Rxf may form a fused structure with a benzene ring, Rxf may or may not exist, and when Rxf does not exist , one benzene ring may have two or more Rxd and/or Rxe groups.)

In the formulas (1A) and (1B), the alkenyl group having 2 to 8 carbon atoms represented by Rxa and Rxd is not particularly limited, and examples thereof include vinyl group, allyl group, propenyl group, butenyl group and hexenyl group. etc.

In formulas (1A) and (1B), when the groups represented by Rxc and Rxf form a condensed structure with a benzene ring, examples thereof include compounds containing a naphthol ring as the phenolic aromatic ring. . Further, in the case where the groups represented by Rxc and Rxf are not present in the formulas (1A) and (1B), for example, compounds containing a phenol ring can be mentioned as the phenolic aromatic ring.

In formulas (1A) and (1B), the alkyl group having 1 to 10 carbon atoms represented by Rxb and Rxe is not particularly limited, and examples thereof include methyl group, ethyl group, propyl group, butyl group, and pentyl group. , straight-chain alkyl groups such as hexyl group, branched alkyl groups such as isopropyl group, isobutyl group and tert-butyl group.

In formula (1A), the alkylene group having 1 to 6 carbon atoms represented by A is not particularly limited, and examples thereof include methylene group, ethylene group, trimethylene group and propylene group. Although the aralkylene group having 7 to 16 carbon atoms represented by A is not particularly limited, for example, the formulas: -CH ₂ -Ar-CH ₂ -, -CH ₂ -CH ₂ -Ar-CH ₂ -CH ₂ - , or a group represented by the formula: —CH ₂ —Ar—CH ₂ —CH ₂ — (wherein Ar represents a phenylene group, a naphthylene group, or a biphenylene group). The arylene group having 6 to 10 carbon atoms represented by A is not particularly limited, but includes, for example, a phenylene ring.

In the compound represented by formula (1B), Rxf is preferably a benzene ring (a compound containing a dihydroxynaphthalene skeleton) from the viewpoint of more effectively and reliably exhibiting the effects of the present embodiment.

From the viewpoint of further improving the balance between heat resistance and low thermal expansion, alkenylphenol A is preferably an alkenylbisphenol in which one alkenyl group is bonded to each of two phenolic aromatic rings of a bisphenol. From a similar point of view, alkenyl bisphenol is diallyl bisphenol in which two phenolic aromatic rings of bisphenols are respectively bonded to one allyl group, and/or bisphenols in which two phenolic aromatic rings are respectively bonded to one propenyl group. Dipropenyl bisphenol is preferred.

Examples of diallyl bisphenol include, but are not limited to, o, o'-diallyl bisphenol A ("DABPA", a product of Daiwa Kasei Kogyo Co., Ltd.), o, o'-diallyl bisphenol F, and o, o'-diallyl bisphenol S. , o,o'-diallylbisphenol fluorene. Examples of dipropenyl bisphenol include, but are not limited to, o,o'-dipropenylbisphenol A ("PBA01" available from Gunei Chemical Industry Co., Ltd.), o,o'-dipropenylbisphenol F, o,o'- Dipropenyl bisphenol S, o,o'-dipropenyl bisphenol fluorene.

The average number of phenol groups per molecule of alkenylphenol A is preferably 1 or more and less than 3, and 1.5 or more and 2.5 or less, from the viewpoint of more effectively and reliably exhibiting the effects of the present embodiment. is more preferred. The average number of phenol groups is calculated by the following formula.

In the above formula, A represents the number of phenol groups of alkenylphenol having i phenol groups in the molecule, Xi represents the ratio of alkenylphenol having i phenol groups in the molecule to the total alkenylphenol, X ₁ +X ₂ + . . . X _n =1.

[Epoxy-modified silicone B]
Epoxy-modified silicone B is not particularly limited as long as it is a silicone compound or resin modified with an epoxy group-containing group. The thermosetting resin composition in the present embodiment tends to exhibit excellent low thermal expansion and chemical resistance by containing the epoxy-modified silicone B.

The silicone compound or resin is not particularly limited as long as it is a compound having a polysiloxane skeleton in which siloxane bonds are repeatedly formed. The polysiloxane skeleton may be a linear skeleton, a cyclic skeleton, or a network skeleton. Among these, a linear skeleton is preferred from the viewpoint of more effectively and reliably exhibiting the effects of the present embodiment.

（式（ａ１）中、Ｒ^０は、アルキレン基（例えば、メチレン基、エチレン基、プロピレン基等の炭素数１～５のアルキレン基）を表し、Ｘは、下記式（ａ２）で表される１価の基又は下記式（ａ３）で表される１価の基を表す。）

Examples of the epoxy group-containing group include, but are not particularly limited to, groups represented by the following formula (a1).

(In formula (a1), R ⁰ represents an alkylene group (for example, a methylene group, an ethylene group, an alkylene group having 1 to 5 carbon atoms such as a propylene group), and X is represented by the following formula (a2). represents a monovalent group or a monovalent group represented by the following formula (a3).)

Epoxy-modified silicone B preferably contains an epoxy-modified silicone having an epoxy equivalent of 140-250 g/mol. By containing an epoxy-modified silicone having an epoxy equivalent within the above range, epoxy-modified silicone B tends to further improve low thermal expansion and chemical resistance in a well-balanced manner. From the same viewpoint, the epoxy equivalent is more preferably 145 to 245 g/mol, still more preferably 150 to 240 g/mol.

Epoxy-modified silicone B preferably contains two or more epoxy-modified silicones from the viewpoint of further improving the balance between heat resistance and low thermal expansion properties. In this case, the two or more epoxy-modified silicones preferably have different epoxy equivalents, and an epoxy-modified silicone having an epoxy equivalent of 50 to 350 g/mol (hereinafter also referred to as "low equivalent epoxy-modified silicone B1"). and an epoxy-modified silicone having an epoxy equivalent of 400 to 4000 g/mol (hereinafter also referred to as "high equivalent epoxy-modified silicone B2"), and an epoxy having an epoxy equivalent of 140 to 250 g/mol. More preferably, it contains a modified silicone (low-equivalent epoxy-modified silicone B1′) and an epoxy-modified silicone having an epoxy equivalent of 450 to 3000 g/mol (high-equivalent epoxy-modified silicone B2′).

（上記式中、Ｅｉは、２種以上のエポキシ変性シリコーンのうちの１種のエポキシ変性シリコーンのエポキシ当量を表し、Ｗｉは、エポキシ変性シリコーンＢ中の上記エポキシ変性シリコーンの割合を表し、Ｗ_１＋Ｗ_２＋…Ｗ_ｎ＝１である。）When the epoxy-modified silicone B contains two or more epoxy-modified silicones, the average epoxy equivalent of the epoxy-modified silicone B is preferably 140 to 3000 g/mol, more preferably 250 to 2000 g/mol. More preferably 300 to 1000 g/mol. The average epoxy equivalent is calculated by the following formula.

(In the above formula, Ei represents the epoxy equivalent of one epoxy-modified silicone among two or more epoxy-modified silicones, Wi represents the ratio of the epoxy-modified silicone in the epoxy-modified silicone B, and W ₁ + _W2 +... _Wn =1.)

（式（１）中、Ｒ^１は、各々独立に、単結合、アルキレン基、アリーレン基又はアラルキレン基を表し、Ｒ^２は、各々独立して炭素数１～１０のアルキル基又はフェニル基を表し、ｎは、０～１００の整数を示す。）Epoxy-modified silicone B preferably contains an epoxy-modified silicone represented by the following formula (1) from the viewpoint of further improving low thermal expansion and chemical resistance in a well-balanced manner.

(In formula (1), each R ¹ independently represents a single bond, an alkylene group, an arylene group or an aralkylene group, and each R ² independently represents an alkyl group having 1 to 10 carbon atoms or a phenyl group. , n represents an integer from 0 to 100.)

In formula (1), the alkylene group represented by R ¹ may be linear, branched or cyclic. The number of carbon atoms in the alkylene group is preferably 1-12, more preferably 1-4. Examples of alkylene groups include, but are not limited to, methylene, ethylene, and propylene groups. Among these, R ¹ is preferably a propylene group.

In formula (1), the arylene group represented by R ¹ may have a substituent. The number of carbon atoms in the arylene group is preferably 6-40, more preferably 6-20. The arylene group includes, for example, a phenylene group, a cyclohexylphenylene group, a hydroxyphenylene group, a cyanophenylene group, a nitrophenylene group, a naphthylene group, a biphenylene group, an anthrylene group, a pyrenylene group, a fluorenylene group and the like. These groups may contain an ether bond, a ketone bond or an ester bond.

（式（Ｘ－Ｉ）中、＊は、結合手を表す。）In formula (1), the aralkylene group represented by R ¹ preferably has 7 to 30 carbon atoms, more preferably 7 to 13 carbon atoms. The aralkylene group is not particularly limited, but includes, for example, groups represented by the following formula (XI).

(In formula (XI), * represents a bond.)

In formula (1), the group represented by R ¹ may further have a substituent. Examples of substituents include linear alkyl groups having 1 to 10 carbon atoms, branched alkyl groups, cyclic alkyl groups having 3 to 10 carbon atoms, linear alkoxy groups having 1 to 10 carbon atoms, branched alkoxy groups having 3 to 10 carbon atoms, and cyclic alkoxy groups having 3 to 10 carbon atoms. be done. Among these, R ¹ is particularly preferably a propylene group.

In formula (1), each R ² independently represents an alkyl group having 1 to 10 carbon atoms or a phenyl group. The above alkyl group and phenyl group may have a substituent. The alkyl group having 1 to 10 carbon atoms may be linear, branched or cyclic. Examples of alkyl groups include, but are not limited to, methyl, ethyl, propyl, butyl, pentyl, hexyl, isopropyl, isobutyl, and cyclohexyl groups. Among these, R ² is preferably a methyl group or a phenyl group.

In formula (1), n represents an integer of 0 or more, for example, 0-100. From the viewpoint of further improving low thermal expansion and chemical resistance in a well-balanced manner, n is preferably 50 or less, more preferably 30 or less, and even more preferably 20 or less.

Epoxy-modified silicone B preferably contains two or more epoxy-modified silicones represented by formula (1) from the viewpoint of further improving low thermal expansion and chemical resistance in a well-balanced manner. In this case, two or more types of epoxy-modified silicones preferably have different values of n. It is more preferable to contain a certain epoxy-modified silicone.

（上記式中、Ｂｉは、分子中にｉ個のエポキシ基を有するエポキシ変性シリコーンのエポキシ基数を表し、Ｙｉは、分子中にｉ個のエポキシ基を有するエポキシ変性シリコーンのエポキシ変性シリコーン全体に占める割合を表し、Ｙ_１＋Ｙ_２＋…Ｙ_ｎ＝１である。）The average number of epoxy groups per molecule of the epoxy-modified silicone B is preferably 1 or more and less than 3, and is 1.5 or more and 2.5 or less, from the viewpoint of more effectively and reliably exhibiting the effects of the present embodiment. is more preferable. The average number of epoxy groups is calculated by the following formula.

(In the above formula, Bi represents the number of epoxy groups of the epoxy-modified silicone having i epoxy groups in the molecule, and Yi represents the epoxy-modified silicone having i epoxy groups in the molecule in the entire epoxy-modified silicone. represents a ratio, Y ₁ +Y ₂ +... Y _n = 1.)

The content of the epoxy-modified silicone B is 5 to 95% by mass with respect to the total 100% by mass of the epoxy-modified silicone B and the epoxy compound C, from the viewpoint of expressing even better low thermal expansion and chemical resistance. , more preferably 10 to 90% by mass, even more preferably 40 to 85% by mass, even more preferably 50 to 80% by mass.

As the epoxy-modified silicone B, a commercial product may be used, or a product manufactured by a known method may be used. Examples of commercially available products include "X-22-163" and "KF-105" manufactured by Shin-Etsu Chemical Co., Ltd.

[Epoxy compound C]
Epoxy compound C is an epoxy compound other than epoxy-modified silicone B, more specifically, an epoxy compound that does not have a polysiloxane skeleton. By containing the epoxy compound C, the thermosetting resin composition in the present embodiment tends to exhibit excellent heat resistance, chemical resistance, copper foil adhesion and insulation reliability.

The epoxy compound C is not particularly limited as long as it is an epoxy compound other than the epoxy-modified silicone B. As the epoxy compound C in the thermosetting resin composition, typically, a bifunctional epoxy compound having two epoxy groups in one molecule or a polyfunctional epoxy compound having three or more epoxy groups in one molecule is used. can do. Epoxy compound C preferably contains a bifunctional epoxy compound and/or a polyfunctional epoxy compound from the viewpoint of being able to exhibit even better heat resistance, chemical resistance, copper foil adhesion and insulation reliability.

（式（３ａ）中、Ａｒ^３は、各々独立して、ベンゼン環又はナフタレン環を表し、Ａｒ^４は、ベンゼン環、ナフタレン環又はビフェニル環を表し、Ｒ^３ａは、各々独立して、水素原子又はメチル基を表し、ｋは１～５０の整数を表し、
ここで、Ａｒ^３におけるベンゼン環又はナフタレン環は、さらに一又は複数の置換基を有してもよく、当該置換基は、図示しないグリシジルオキシ基であってもよく、その他の置換基、例えば、炭素数１～５のアルキル基、フェニル基等であってもよく、
Ａｒ^４におけるベンゼン環、ナフタレン環又はビフェニル環は、さらに一又は複数の置換基を有してもよく、当該置換基は、グリシジルオキシ基であってもよく、その他の置換基、例えば、炭素数１～５のアルキル基、フェニル基等であってもよい。）The epoxy compound C in the thermosetting resin composition is not particularly limited, but a compound represented by the following formula (3a) can be used.

(In Formula (3a), Ar ³ each independently represents a benzene ring or naphthalene ring, Ar ⁴ represents a benzene ring, naphthalene ring or biphenyl ring, and R ^3a each independently represents a hydrogen atom. or represents a methyl group, k represents an integer of 1 to 50,
Here, the benzene ring or naphthalene ring in Ar ³ may further have one or more substituents, and the substituent may be a glycidyloxy group (not shown), or other substituents such as It may be an alkyl group having 1 to 5 carbon atoms, a phenyl group, etc.
The benzene ring, naphthalene ring or biphenyl ring in Ar ⁴ may further have one or more substituents, which may be a glycidyloxy group, other substituents such as carbon number It may be an alkyl group of 1 to 5, a phenyl group, or the like. )

（式（ｂ１）中、Ａｒ^３は、各々独立して、ベンゼン環又はナフタレン環を表し、Ａｒ^４は、ベンゼン環、ナフタレン環又はビフェニル環を表し、Ｒ^３ａは、各々独立して、水素原子又はメチル基を表し、
ここで、Ａｒ^３におけるベンゼン環又はナフタレン環は、さらに一又は複数の置換基を有してもよく、当該置換基は、例えば、炭素数１～５のアルキル基やフェニル基等のグリシジルオキシ基以外の置換基であってもよく、
Ａｒ^４におけるベンゼン環、ナフタレン環又はビフェニル環は、さらに一又は複数の置換基を有してもよく、当該置換基は、例えば、炭素数１～５のアルキル基やフェニル基等のグリシジルオキシ基以外の置換基であってもよい。）Among the compounds represented by the above formula (3a), examples of bifunctional epoxy compounds include compounds represented by the following formula (b1).

(In formula (b1), each Ar ³ independently represents a benzene ring or naphthalene ring, each Ar ⁴ represents a benzene ring, naphthalene ring or biphenyl ring, and each R ^3a independently represents a hydrogen atom or represents a methyl group,
Here, the benzene ring or naphthalene ring in Ar ³ may further have one or more substituents, and the substituents are, for example, a glycidyloxy group such as an alkyl group having 1 to 5 carbon atoms or a phenyl group. It may be a substituent other than
The benzene ring, naphthalene ring or biphenyl ring in Ar ⁴ may further have one or more substituents, and the substituents are, for example, glycidyloxy groups such as alkyl groups having 1 to 5 carbon atoms and phenyl groups. It may be a substituent other than )

（式中、Ａｒ^３１は、各々独立して、ベンゼン環又はナフタレン環を表し、Ａｒ^４１は、各々独立して、ベンゼン環、ナフタレン環又はビフェニル環を表し、Ｒ^３１ａは、各々独立して、水素原子又はメチル基を表し、ｐは、１を表し、ｋｚは１～５０の整数を表し、各環は、グリシジルオキシ基以外の置換基（例えば、炭素数１～５のアルキル基、炭素数１～５のアルコキシ基又はフェニル基）を有してもよく、Ａｒ^３１及びＡｒ^４１の少なくとも一方はナフタレン環を表す。）The compound represented by formula (3a) is preferably a phenolic novolac type epoxy resin in which Ar ⁴ in formula (3a) is at least substituted with a glycidyloxy group. The phenolic novolak-type epoxy resin is not particularly limited, but for example, a compound having a structure represented by the following formula (3-1) (a naphthalene skeleton-containing polyfunctional epoxy resin having a naphthalene skeleton) and a naphthalene cresol novolac-type Epoxy resins may be mentioned.

(wherein each Ar ³¹ independently represents a benzene ring or a naphthalene ring, each Ar ⁴¹ independently represents a benzene ring, a naphthalene ring or a biphenyl ring, each R ^31a independently represents represents a hydrogen atom or a methyl group, p represents 1, kz represents an integer of 1 to 50, each ring represents a substituent other than a glycidyloxy group (for example, an alkyl group having 1 to 5 carbon atoms, a 1 to 5 alkoxy groups or phenyl groups), and at least one of Ar ³¹ and Ar ⁴¹ represents a naphthalene ring.)

（式中、Ｒは、メチル基を表し、ｋｚは、上記式（３－１）中のｋｚと同義である。）Compounds having a structure represented by formula (3-1) include compounds having a structure represented by formula (3-2).

(Wherein, R represents a methyl group, and kz is synonymous with kz in the above formula (3-1).)

The naphthalene cresol novolak type epoxy resin is not particularly limited, but for example, a cresol/naphthol novolak type epoxy resin represented by the following formula (NE) is preferable. The compound represented by the following formula (NE) is a random copolymer of a cresol novolak epoxy structural unit and a naphthol novolac epoxy structural unit, and both cresol epoxy and naphthol epoxy can be terminals.

m and n in the formula (NE) each represent an integer of 1 or more. The upper limit of m and n and the ratio thereof are not particularly limited, but from the viewpoint of low thermal expansion, m: n (here, m + n = 100) is preferably 30 to 50: 70 to 50, and 45 to 55:55-45 is more preferred.

As the naphthalene cresol novolac type epoxy resin, a commercially available product or a product manufactured by a known method may be used. Examples of commercially available products include "NC-7000", "NC-7300" and "NC-7300L" manufactured by Nippon Kayaku Co., Ltd., and "HP-9540" and "HP-9500" manufactured by DIC Corporation. and "HP-9540" is particularly preferred.

The compound represented by formula (3a) may be a compound (hereinafter also referred to as "aralkyl epoxy resin") that does not correspond to the phenolic novolac epoxy resins described above.
Aralkyl-type epoxy resins include compounds in which Ar ³ is a naphthalene ring and Ar ⁴ is a benzene ring in the formula (3a) (also referred to as a "naphthol aralkyl- ^type epoxy resin"); It is preferably a compound in which it is a benzene ring and Ar ⁴ is a biphenyl ring (also referred to as a "biphenylaralkyl-type epoxy resin"), and more preferably a biphenylaralkyl-type epoxy resin.

As the naphthol aralkyl type epoxy resin, a commercially available product or a product manufactured by a known method may be used. Examples of commercially available products include "HP-5000" and "HP-9900" manufactured by DIC Corporation, and "ESN-375" and "ESN-475" manufactured by Nippon Steel Chemical & Materials Co., Ltd.

（式中、ｋａは、１以上の整数を表し、１～２０が好ましく、１～６がより好ましい。）The biphenyl aralkyl type epoxy resin is preferably a compound represented by the following formula (3b).

(Wherein, ka represents an integer of 1 or more, preferably 1 to 20, more preferably 1 to 6.)

Among the compounds represented by the formula (3b), examples of bifunctional epoxy compounds include compounds in which ka is 1 in the formula (3b).

As the biphenyl aralkyl type epoxy resin, a commercially available product or a product manufactured by a known method may be used. Examples of commercially available products include "NC-3000", "NC-3000L", and "NC-3000FH" manufactured by Nippon Kayaku Co., Ltd.

Moreover, as the epoxy compound C in the thermosetting resin composition, it is preferable to use a naphthalene-type epoxy resin (excluding those corresponding to the compound represented by the formula (3a)). The naphthalene-type epoxy resin is preferably a naphthylene ether-type epoxy resin from the viewpoint of further improving heat resistance, chemical resistance, copper foil adhesion, and insulation reliability.

（式中、Ｒ_１３は、各々独立して、水素原子、炭素数１～３のアルキル基（例えば、メチル基又はエチル基）、又は炭素数２～３のアルケニル基（例えば、ビニル基、アリル基又はプロペニル基）を表す。）

（式中、Ｒ_１４は、各々独立して、水素原子、炭素数１～３のアルキル基（例えば、メチル基又はエチル基）、又は炭素数２～３のアルケニル基（例えば、ビニル基、アリル基又はプロペニル基）を表す。）From the viewpoint of further improving heat resistance, chemical resistance, copper foil adhesion and insulation reliability, the naphthylene ether type epoxy resin is a bifunctional epoxy compound represented by the following formula (3-3) or the following formula (3 -4) is preferably a polyfunctional epoxy compound or a mixture thereof.

(In the formula, each R ₁₃ is independently a hydrogen atom, an alkyl group having 1 to 3 carbon atoms (eg, methyl group or ethyl group), or an alkenyl group having 2 to 3 carbon atoms (eg, vinyl group, allyl group or propenyl group).)

(In the formula, each R ₁₄ is independently a hydrogen atom, an alkyl group having 1 to 3 carbon atoms (eg, methyl group or ethyl group), or an alkenyl group having 2 to 3 carbon atoms (eg, vinyl group, allyl group or propenyl group).)

A commercially available product or a product manufactured by a known method may be used as the naphthylene ether type epoxy resin. Commercially available naphthylene ether type epoxy resins include, for example, DIC Corporation products "HP-6000", "EXA-7300", "EXA-7310", "EXA-7311", "EXA-7311L", " EXA7311-G3", "EXA7311-G4", "EXA-7311G4S", "EXA-7311G5", etc., and HP-6000 is particularly preferred.

（式（ｂ３）中、Ｒ^３ｂは、各々独立して、水素原子、炭素数１～５のアルキル基（例えば、メチル基又はエチル基）、アラルキル基、ベンジル基、ナフチル基、少なくとも１つのグリシジルオキシ基を含有するナフチル基又は少なくとも１つのグリシジルオキシ基を含有するナフチルメチル基を表し、ｎは、０以上の整数（例えば、０～２）を表す。）Examples of naphthalene-type epoxy resins other than those described above include, but are not limited to, compounds represented by the following formula (b3).

(In the formula (b3), each R ^3b is independently a hydrogen atom, an alkyl group having 1 to 5 carbon atoms (e.g., methyl group or ethyl group), an aralkyl group, a benzyl group, a naphthyl group, at least one glycidyl represents a naphthyl group containing an oxy group or a naphthylmethyl group containing at least one glycidyloxy group, and n represents an integer of 0 or more (eg, 0 to 2).)

Examples of commercially available products of the compound represented by the above formula (b3) include "HP-4032" (n = 0 in the above formula (b3)) and "HP-4710" (the above formula (b3)) manufactured by DIC Corporation. ) where n=0 and R ^3b is a naphthylmethyl group containing at least one glycidyloxy group).

（式（ｂ２）中、Ｒａは、各々独立して、炭素数１～１０のアルキル基又は水素原子を表す。）Moreover, as the epoxy compound C in the thermosetting resin composition, it is preferable to use a biphenyl-type epoxy resin (excluding those corresponding to the epoxy compound C described above).
The biphenyl-type epoxy resin is not particularly limited, but includes, for example, a compound represented by the following formula (b2) (compound b2).

(In formula (b2), each Ra independently represents an alkyl group having 1 to 10 carbon atoms or a hydrogen atom.)

In formula (b2), the alkyl group having 1 to 10 carbon atoms may be linear, branched or cyclic. Examples of alkyl groups include, but are not limited to, methyl, ethyl, propyl, butyl, pentyl, hexyl, isopropyl, isobutyl, and cyclohexyl groups.

When the biphenyl-type epoxy resin is compound b2, the biphenyl-type epoxy resin may be in the form of a mixture of compounds b2 having different numbers of Ra as alkyl groups. Specifically, it is preferably a mixture of biphenyl-type epoxy resins having different numbers of Ra as alkyl groups. It is more preferred to be a mixture of compounds b2 which are

（式中、Ｒ^３ｃは、各々独立し、水素原子又は炭素数１～５のアルキル基を表し、ｋ２は、０～１０の整数を表す。）Moreover, as the epoxy compound C in the thermosetting resin composition, a dicyclopentadiene type epoxy resin (excluding those corresponding to the epoxy compound C described above) can be used.
The dicyclopentadiene-type epoxy resin is not particularly limited, but includes, for example, compounds represented by the following formula (3-5).

(In the formula, each R ^3c independently represents a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, and k2 represents an integer of 0 to 10.)

（式（ｂ４）中、Ｒ^３ｃは、各々独立し、水素原子又は炭素数１～５のアルキル基（例えば、メチル基又はエチル基）を表す。）The compound represented by the above formula (3-5) is not particularly limited, but may be, for example, a compound represented by the following formula (b4).

(In formula (b4), each R ^3c independently represents a hydrogen atom or an alkyl group having 1 to 5 carbon atoms (eg, methyl group or ethyl group).)

As the dicyclopentadiene type epoxy resin, a commercially available product or a product manufactured by a known method may be used. Examples of commercially available dicyclopentadiene type epoxy resins include "EPICRON HP-7200L", "EPICRON HP-7200", "EPICRON HP-7200H" and "EPICRON HP-7000HH" manufactured by Dainippon Ink and Chemicals. mentioned.

Among these, the epoxy compound C is an epoxy compound represented by the formula (3a), a naphthalene-type epoxy resin and a biphenyl, from the viewpoint of being able to exhibit even better heat resistance, chemical resistance, copper foil adhesion and insulation reliability. is preferably one or more selected from the group consisting of type epoxy resins, and in this case, the epoxy compound represented by formula (3a) includes a naphthalene cresol novolak type epoxy resin, and the naphthalene type epoxy resin is naphthylene It preferably contains an ether type epoxy resin. That is, the epoxy compound C preferably contains a naphthalene cresol novolak type epoxy resin and/or a naphthylene ether type epoxy resin.

Epoxy compound C may contain other epoxy compounds that do not correspond to the epoxy compounds described above.
Examples of other epoxy compounds include, but are not limited to, bisphenol-type epoxy resins, trisphenolmethane-type epoxy resins, anthracene-type epoxy resins, glycidyl ester-type epoxy resins, polyol-type epoxy resins, isocyanurate ring-containing epoxy resins, and fluorene-type epoxy resins. Examples thereof include resins, epoxy resins composed of bisphenol A structural units and hydrocarbon structural units, and the like.
Among the above-described other epoxy compounds, from the viewpoint of further improving chemical resistance, copper foil adhesion, and insulation reliability, bisphenol-type epoxy resins can be included. Examples of bisphenol-type epoxy resins include diallyl Bisphenol type epoxy resins (for example, diallyl bisphenol A type epoxy resin, diallyl bisphenol E type epoxy resin, diallyl bisphenol F type epoxy resin, diallyl bisphenol S type epoxy resin, etc.) and the like can be used.

As the epoxy compound C, one of the above-described epoxy compounds and epoxy resins may be used alone, or two or more thereof may be used in combination.

（上記式中、Ｃｉは、分子中にｉ個のエポキシ基を有するエポキシ化合物のエポキシ基数を表し、Ｚｉは、分子中にｉ個のエポキシ基を有するエポキシ化合物のエポキシ化合物全体に占める割合を表し、Ｚ_１＋Ｚ_２＋…Ｚ_ｎ＝１である。）The average number of epoxy groups per molecule of the epoxy compound C is preferably 1 or more and less than 3, and 1.5 or more and 2.5 or less, from the viewpoint of more effectively and reliably exhibiting the effects of the present embodiment. is more preferred. The average number of epoxy groups is calculated by the following formula.

(In the above formula, Ci represents the number of epoxy groups in an epoxy compound having i epoxy groups in the molecule, and Zi represents the ratio of the epoxy compounds having i epoxy groups in the molecule to the total number of epoxy compounds. , Z ₁ +Z ₂ + . . . Z _n =1.)

The content of the epoxy compound C is, from the viewpoint of being able to exhibit even better heat resistance, chemical resistance, copper foil adhesion and insulation reliability, the total amount of the epoxy-modified silicone B and the epoxy compound C being 100% by mass, It is preferably 5 to 95% by mass, more preferably 10 to 90% by mass, still more preferably 15 to 60% by mass, and particularly preferably 20 to 50% by mass.

[Compound E]
From the viewpoint of further improving heat resistance, low thermal expansion, chemical resistance and copper foil adhesion, the thermosetting resin composition in the present embodiment contains a maleimide compound, a cyanate ester compound, and a phenol other than the alkenylphenol A. It is preferable to further include at least one compound E selected from the group consisting of compound A' and alkenyl-substituted nadimide compounds. Although compound E is not particularly limited, it is preferably bifunctional or higher, and may be trifunctional or higher polyfunctional.

The content of compound E in the thermosetting resin composition of the present embodiment is preferably 10 to 80% by mass, preferably 20 to 60% by mass, relative to 100% by mass of the resin solid content. is more preferred, and 30 to 50% by mass is even more preferred.

（式（３）中、Ｒ_５は、各々独立して、水素原子又はメチル基を表し、ｎ_１は１以上の整数を表す。）(maleimide compound)
The thermosetting resin composition in the present embodiment preferably contains a maleimide compound from the viewpoint of further improving heat resistance, low thermal expansion and chemical resistance. The maleimide compound is not particularly limited as long as it is a compound having one or more maleimide groups in one molecule. -hydroxyphenylmaleimide, etc.), polymaleimide compounds having two or more maleimide groups in one molecule (e.g., bis(4-maleimidophenyl)methane, 2,2-bis{4-(4-maleimidophenoxy)-phenyl} propane, bis(3-ethyl-5-methyl-4-maleimidophenyl)methane, bis(3,5-dimethyl-4-maleimidophenyl)methane, bis(3,5-diethyl-4-maleimidophenyl)methane), m-phenylene bismaleimide, 4-methyl-1,3-phenylene bismaleimide, 1,6'-bismaleimide-(2,2,4-trimethyl)hexane, a maleimide compound represented by the following formula (3), Maleimide compounds represented by the formula (3′), prepolymers of these maleimide compounds and amine compounds, and the like are included.

(In formula (3), each R ₅ independently represents a hydrogen atom or a methyl group, and n ₁ represents an integer of 1 or more.)

n ₁ is 1 or more, preferably 1-100, more preferably 1-10.

These maleimide compounds are used singly or in combination of two or more. Among these, from the viewpoint of further improving low thermal expansion and chemical resistance, the maleimide compound is preferably a compound having two or more maleimide groups in one molecule, and bis(4-maleimidophenyl)methane , 2,2-bis{4-(4-maleimidophenoxy)-phenyl}propane, bis(3-ethyl-5-methyl-4-maleimidophenyl)methane, a maleimide compound represented by formula (3), and the following More preferably, it contains at least one selected from the group consisting of maleimide compounds represented by formula (3′).

（式（３’）中、Ｒ^１３は各々独立に、水素原子、炭素数１～５のアルキル基、又はフェニル基を示し、ｎ^４は１以上１０以下の整数を示す。）。

(In formula (3′), each R ¹³ independently represents a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, or a phenyl group, and n ⁴ represents an integer of 1 or more and 10 or less.).

As the maleimide compound, a commercially available product or a product manufactured by a known method may be used. Commercially available maleimide compounds include "BMI-70", "BMI-80" and "BMI-1000P" manufactured by K.I. -4000”, “BMI-5100”, “BMI-7000”, “BMI-2300”, Nippon Kayaku Co., Ltd. product “MIR-3000-70MT” (R ¹³ in formula (3′) are all hydrogen atoms and ⁿ⁴ is a mixture of 1 to 10.) and the like.

From the viewpoint of further improving low thermal expansion and chemical resistance, the content of the maleimide compound is preferably 1 to 50 parts by mass, preferably 5 to 40 parts by mass, relative to 100 parts by mass of the resin solid content. More preferably, 10 to 40 parts by mass is even more preferable.

（式（４）中、Ｒ_６は、各々独立して、水素原子又はメチル基を示し、ｎ_２は１以上の整数を表す。）

（式（５）中、Ｒｙａは、各々独立して、炭素数２～８のアルケニル基又は水素原子を表し、Ｒｙｂは、各々独立して、炭素数１～１０のアルキル基又は水素原子を表し、Ｒｙｃは、各々独立して、炭素数４～１２の芳香環又は水素原子を表し、Ｒｙｃは、ベンゼン環と縮合構造を形成してもよく、Ｒｙｃは、存在していてもよく、存在していなくてもよく、Ａ^１ａは、各々独立して、炭素数１～６のアルキレン基、炭素数７～１６のアラルキレン基、炭素数６～１０のアリーレン基、フルオレニリデン基、スルホニル基、酸素原子、硫黄原子、又は直接結合（単結合）を表し、Ｒｙｃが水素原子である場合は、１つのベンゼン環にＲｙａ及び／又はＲｙｂの基を２つ以上有してもよい。ｎは、１～２０の整数を表す。）(Cyanate ester compound)
The thermosetting resin composition in the present embodiment preferably contains a cyanate ester compound from the viewpoint of further improving heat resistance, low thermal expansion properties and chemical resistance. The cyanate ester compound is not particularly limited as long as it is a compound having two or more cyanate groups (cyanate ester groups) in one molecule. For example, a naphthol aralkyl compound represented by the following formula (4) type cyanate ester compounds, novolak-type cyanate ester compounds such as compounds represented by the following formula (5) excluding compounds represented by formula (4), biphenyl aralkyl-type cyanates, diallyl bisphenol-type cyanates compounds, bis(3,3-dimethyl-4-cyanatophenyl)methane, bis(4-cyanatophenyl)methane, 1,3-dicyanatobenzene, 1,4-dicyanatobenzene, 1,3,5- tricyanatobenzene, 1,3-dicyanatonaphthalene, 1,4-dicyanatonaphthalene, 1,6-dicyanatonaphthalene, 1,8-dicyanatonaphthalene, 2,6-dicyanatonaphthalene, 2,7-dicyanato Naphthalene, 1,3,6-tricyanatonaphthalene, 4,4'-dicyanatobiphenyl, bis(4-cyanatophenyl)ether, bis(4-cyanatophenyl)thioether, bis(4-cyanatophenyl)sulfone , 2,2-bis(4-cyanatophenyl)propane. These cyanate ester compounds are used singly or in combination of two or more. In the present embodiment, from the viewpoint of heat resistance, low thermal expansion, and chemical resistance, the cyanate ester compound is a polyfunctional cyanate ester compound such as a naphthol aralkyl-type cyanate ester compound and/or a novolac-type cyanate ester compound. and more preferably a naphthol aralkyl-type cyanate ester compound and/or a novolak-type cyanate ester compound.

(In formula (4), each R ₆ independently represents a hydrogen atom or a methyl group, and n ₂ represents an integer of 1 or more.)

(In formula (5), each Rya independently represents an alkenyl group having 2 to 8 carbon atoms or a hydrogen atom, and each Ryb independently represents an alkyl group having 1 to 10 carbon atoms or a hydrogen atom. , Ryc each independently represents an aromatic ring having 4 to 12 carbon atoms or a hydrogen atom, Ryc may form a condensed structure with a benzene ring, Ryc may be present or may be present A ^1a each independently represents an alkylene group having 1 to 6 carbon atoms, an aralkylene group having 7 to 16 carbon atoms, an arylene group having 6 to 10 carbon atoms, a fluorenylidene group, a sulfonyl group, an oxygen atom. , represents a sulfur atom or a direct bond (single bond), and when Ryc is a hydrogen atom, one benzene ring may have two or more Rya and/or Ryb groups.n is 1 to represents an integer of 20.)

Among these, the cyanate ester compound preferably contains a compound represented by formula (4) and/or formula (5) from the viewpoint of further improving heat resistance and low thermal expansion in a well-balanced manner, and formula (4 ) is more preferably included.

In formula (4), _n2 represents an integer of 1 or more, preferably an integer of 1-20, more preferably an integer of 1-10.

In formula (5), the alkenyl group having 2 to 8 carbon atoms represented by Rya is not particularly limited, and examples thereof include vinyl group, allyl group, propenyl group, butenyl group, hexenyl group and the like.

In formula (5), the alkyl group having 1 to 10 carbon atoms represented by Ryb is not particularly limited. branched alkyl groups such as isopropyl group, isobutyl group and tert-butyl group;

In formula (5), the alkylene group having 1 to 6 carbon atoms represented by A ^1a is not particularly limited, but includes methylene group, ethylene group, trimethylene group and propylene group. In formula (5), the aralkylene group having 7 to 16 carbon atoms represented by A ^1a is not particularly limited, and examples thereof include formulas: —CH ₂ —Ar—CH ₂ — and —CH ₂ —CH _{2 .} -Ar-CH ₂ -CH ₂ -, or a group represented by the formula: -CH ₂ -Ar-CH ₂ -CH ₂ - (wherein Ar represents a phenylene group, a naphthylene group, or a biphenylene group) is mentioned. Furthermore, the arylene group having 6 to 10 carbon atoms represented by A ^1a is not particularly limited, but includes, for example, a phenylene ring.

In formula (5), n represents an integer of 1-20, preferably an integer of 1-15, more preferably an integer of 1-10.

（式（ｃ１）中、Ｒｘは、各々独立して、水素原子又はメチル基を表し、Ｒは、各々独立して、炭素数２～８のアルケニル基、炭素数１～１０のアルキル基又は水素原子を表し、ｎは、１～１０の整数を表す。）The compound represented by Formula (5) is preferably a compound represented by Formula (c1) below.

(In formula (c1), each Rx independently represents a hydrogen atom or a methyl group, each R independently represents an alkenyl group having 2 to 8 carbon atoms, an alkyl group having 1 to 10 carbon atoms, or hydrogen represents an atom, and n represents an integer from 1 to 10.)

These cyanate ester compounds may be produced according to known methods. Specific production methods include, for example, the method described in JP-A-2017-195334 (particularly paragraphs 0052 to 0057).

From the viewpoint of further improving heat resistance, low thermal expansion and chemical resistance, the content of the cyanate ester compound is preferably 5 to 70 parts by mass with respect to 100 parts by mass of the resin solid content. It is more preferably from 10 to 40 parts by mass, more preferably from 10 to 40 parts by mass.

(Phenolic compound A' other than alkenylphenol A)
The thermosetting resin composition in the present embodiment can contain a phenol compound A' other than alkenylphenol A from the viewpoint of being able to exhibit even better chemical resistance. The phenolic compound A′ is not particularly limited, but may be a bisphenol-type phenol resin (e.g., bisphenol A-type resin, bisphenol E-type resin, bisphenol F-type resin, bisphenol S-type resin, etc.), phenolic novolak resin (e.g., phenol novolac resins, naphthol novolak resins, cresol novolac resins, aminotriazine novolac resins described later, etc.), glycidyl ester type phenolic resins, naphthalene type phenolic resins, anthracene type phenolic resins, dicyclopentadiene type phenolic resins, biphenyl type phenolic resins, alicyclic Phenolic resins, polyol-type phenolic resins, aralkyl-type phenolic resins (for example, naphthol-aralkyl-type phenolic resins), phenol-modified aromatic hydrocarbon-formaldehyde resins, fluorene-type phenolic resins, and the like can be mentioned. These phenol compounds are used singly or in combination of two or more.

Among these, the phenolic compound A' preferably contains a bifunctional phenolic compound having two phenolic hydroxyl groups in one molecule or an aminotriazine novolak resin from the viewpoint of exhibiting even better chemical resistance.

Examples of the bifunctional phenol compound include, but are not limited to, bisphenol, biscresol, bisphenols having a fluorene skeleton (e.g., bisphenol having a fluorene skeleton, biscresol having a fluorene skeleton, etc.), biphenols (e.g., p, p'- biphenol, etc.), dihydroxydiphenyl ether (e.g., 4,4'-dihydroxydiphenyl ether, etc.), dihydroxydiphenyl ketone (e.g., 4,4'-dihydroxydiphenyl ketone, etc.), dihydroxydiphenyl sulfide (e.g., 4,4'-dihydroxydiphenyl sulfide) etc.), and dihydroxyarene (eg, hydroquinone, etc.). These bifunctional phenol compounds are used singly or in combination of two or more. Among these, the bifunctional phenol compound preferably contains at least one selected from the group consisting of bisphenol, biscresol, and bisphenols having a fluorene skeleton, from the viewpoint of being able to exhibit even better chemical resistance. It is more preferable to contain bisphenols having a fluorene skeleton. From the same viewpoint as above, bis-cresol fluorene is preferable as the bisphenols having a fluorene skeleton.

The thermosetting resin composition in this embodiment may contain an aminotriazine novolak resin as the phenolic compound A', as described above. When the aminotriazine novolak resin is contained, the terminal hydroxyl group or epoxy group generated by the reaction of the alkenylphenol A, the epoxy-modified silicone B, and the epoxy compound C other than the epoxy-modified silicone B, and the aminotriazine novolac resin are further combined. It tends to react and increase terminal functional groups such as hydroxyl groups and amino groups. As a result, a large number of terminal functional groups having high reactivity with the thermosetting resin are present, so that the compatibility and crosslink density are improved, and the peel strength of the copper foil tends to be improved.

The aminotriazine novolac resin is not particularly limited, but from the viewpoint of improving copper foil peel strength, it is preferably a novolac resin having 2 to 20 phenolic hydroxyl groups per triazine skeleton in the molecule. More preferably, it is a novolac resin having 2 to 15 phenolic hydroxyl groups for one triazine skeleton in the molecule, and a novolak resin having 2 to 10 phenolic hydroxyl groups for one triazine skeleton in the molecule. is more preferred.

The content of alkenylphenol A in the thermosetting resin composition is the total amount of alkenylphenol A, epoxy-modified silicone B, epoxy compound C and phenol compound A' from the viewpoint of further improving the balance between heat resistance and low thermal expansion. It is preferably 1 to 50 parts by mass, more preferably 3 to 30 parts by mass, and even more preferably 5 to 20 parts by mass with respect to 100 parts by mass.

The content of the epoxy-modified silicone B in the thermosetting resin composition is set to alkenylphenol A, epoxy-modified silicone B, epoxy compound C, and phenol compound A from the viewpoint of achieving better balance between low thermal expansion and chemical resistance. It is preferably 5 to 70 parts by mass, more preferably 10 to 60 parts by mass, and even more preferably 20 to 55 parts by mass with respect to 100 parts by mass of the total amount of '.

The content of the epoxy compound C in the thermosetting resin composition is, from the viewpoint of being able to express even better chemical resistance, copper foil adhesion and insulation reliability, alkenylphenol A, epoxy-modified silicone B, epoxy compound C and phenol It is preferably 5 to 50 parts by mass, more preferably 10 to 30 parts by mass, even more preferably 15 to 25 parts by mass, relative to 100 parts by mass of the total amount of compound A'.

The content of the phenolic compound A' in the thermosetting resin composition is 100 parts by mass in total of the alkenylphenol A, the epoxy-modified silicone B, the epoxy compound C and the phenolic compound A', from the viewpoint of expressing even better chemical resistance. The amount is preferably 5 to 30 parts by mass, more preferably 10 to 25 parts by mass, and even more preferably 15 to 20 parts by mass.

In addition, when the thermosetting resin composition does not contain the phenol compound A′, the contents of the alkenylphenol A, the epoxy-modified silicone B, and the epoxy compound C are the same as those of the alkenylphenol A, the epoxy-modified silicone B, and the epoxy compound. It represents the content per 100 parts by mass of the total amount of C.

（式（２ｄ）中、Ｒ_１は、各々独立して、水素原子、又は炭素数１～６のアルキル基（例えば、メチル基又はエチル基）を表し、Ｒ_２は、炭素数１～６のアルキレン基、フェニレン基、ビフェニレン基、ナフチレン基、又は下記式（６）若しくは下記式（７）で表される基を表す。）

（式（６）中、Ｒ_３は、メチレン基、イソプロピリデン基、ＣＯ、Ｏ、Ｓ又はＳＯ_２を表す。）

（式（７）中、Ｒ_４は、各々独立して、炭素数１～４のアルキレン基、又は炭素数５～８のシクロアルキレン基を表す。）(Alkenyl-Substituted Nadimide Compound)
The thermosetting resin composition in the present embodiment preferably contains an alkenyl-substituted nadimide compound from the viewpoint of further improving heat resistance. The alkenyl-substituted nadimide compound is not particularly limited as long as it is a compound having one or more alkenyl-substituted nadimide groups in one molecule, and examples thereof include compounds represented by the following formula (2d).

(In formula (2d), _each R ₁ independently represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms (e.g., a methyl group or an ethyl group); represents an alkylene group, a phenylene group, a biphenylene group, a naphthylene group, or a group represented by the following formula (6) or (7).)

(In formula (6), _R3 represents a methylene group, an isopropylidene group, CO, O, S or _SO2 .)

(In formula (7), each R ₄ independently represents an alkylene group having 1 to 4 carbon atoms or a cycloalkylene group having 5 to 8 carbon atoms.)

As the alkenyl-substituted nadimide compound represented by formula (2d), a commercially available product or a product manufactured according to a known method may be used. Commercially available products include “BANI-M” and “BANI-X” manufactured by Maruzen Petrochemical Co., Ltd.

From the viewpoint of further improving heat resistance, the content of the alkenyl-substituted nadimide compound is preferably 1 to 40 parts by mass, more preferably 5 to 35 parts by mass, based on 100 parts by mass of the resin solid content. , more preferably 10 to 30 parts by mass.

[Polymer D]
The second composition contains polymer D containing structural units derived from alkenylphenol A, structural units derived from epoxy-modified silicone B, and structural units derived from epoxy compound C. Moreover, the polymer D may further contain a structural unit derived from a phenol compound A' other than the alkenylphenol A. In the present specification, "structural units derived from alkenylphenol A,""structural units derived from epoxy-modified silicone B,""structural units derived from epoxy compound C," and "phenol compounds A other than alkenylphenol A The description to the effect that it contains a 'structural unit derived from' is a structure in which each component of alkenylphenol A, epoxy-modified silicone B, epoxy compound C and, if necessary, phenol compound A' is polymerized in polymer D. It includes the case of containing a unit and the case of containing a structural unit formed by a reaction or the like that can give a similar structural unit. Alkenylphenol A, epoxy-modified silicone B, epoxy compound C, and phenol compound A' are as described above.
By including the polymer D, the second composition can exhibit excellent heat resistance, low thermal expansion, chemical resistance, copper foil adhesion, and insulation reliability in a well-balanced manner.

Hereinafter, a structural unit derived from alkenylphenol A, a structural unit derived from epoxy-modified silicone B, a structural unit derived from epoxy compound C, and a structural unit derived from phenol compound A' other than alkenylphenol A, respectively. Also referred to as units A, B, C, and A'.

The second composition, in addition to the polymer D, is optionally selected from the group consisting of the above-described maleimide compounds, cyanate ester compounds, phenol compounds A' other than the alkenylphenol A, and alkenyl-substituted nadimide compounds. may further contain at least one compound E. The compound E may be an unreacted component remaining after polymerization of the polymer D, or may be a component newly added to the synthesized polymer D.

In addition to the polymer D, the second composition may contain at least one selected from the group consisting of alkenylphenol A, epoxy-modified silicone B and epoxy compound C described above. In this case, the alkenylphenol A, the epoxy-modified silicone B, or the epoxy compound C contained in the second composition may be an unreacted component remaining after the polymerization of the polymer D, or Alternatively, it may be a component added anew.

The weight-average molecular weight of the polymer D is preferably 3.0×10 ³ to 5.0×10 ⁴ and more preferably 3.0×10 ³ to 2.0×10 in terms of polystyrene in gel permeation chromatography. ⁴ is more preferred. With a weight average molecular weight of 3.0×10 ³ or more, the second composition tends to exhibit even better copper foil adhesion and chemical resistance. A weight average molecular weight of 5.0×10 ⁴ or less tends to further improve the balance between heat resistance and low thermal expansion.

The content of the structural unit A in the polymer D is preferably 5 to 50% by mass with respect to the total mass of the polymer D. When the content of the structural unit A is within the above range, the second composition tends to further improve the balance between heat resistance and low thermal expansion. From the same point of view, the content of structural unit A is more preferably 10 to 45% by mass, even more preferably 10 to 40% by mass.

The content of the structural unit B in the polymer D is preferably 20 to 60% by mass with respect to the total mass of the polymer D. When the content of the structural unit B is within the above range, the second composition tends to exhibit even better low thermal expansion and chemical resistance in a well-balanced manner. From the same point of view, the content of the structural unit B is more preferably 25 to 55% by mass, even more preferably 30 to 55% by mass.

Structural unit B is an epoxy-modified silicone having an epoxy equivalent of 50 to 350 g/mol (low equivalent epoxy-modified silicone B1) and an epoxy-modified silicone having an epoxy equivalent of 400 to 4000 g/mol (high equivalent epoxy-modified silicone B2). It preferably contains a structural unit derived from. Low-equivalent epoxy-modified silicone B1 and high-equivalent epoxy-modified silicone B2 have an epoxy equivalent of 140-250 g/mol (low-equivalent epoxy-modified silicone B1′) and 450-3000 g/mol, respectively. Epoxy-modified silicone (high-equivalent epoxy-modified silicone B2') is more preferred.

The content of the structural unit B1 derived from the low-equivalent epoxy-modified silicone B1 in the polymer D is preferably 5 to 25% by mass, more preferably 7.5 to 20% by mass, relative to the total mass of the polymer D. is more preferable, and 10 to 17% by mass is even more preferable.

The content of the structural unit B2 derived from the high-equivalent epoxy-modified silicone B2 in the polymer D is preferably 15 to 55% by mass, more preferably 20 to 52.5% by mass, relative to the total mass of the polymer D. and more preferably 25 to 50% by mass.

The mass ratio of the content of the structural unit B2 to the content of the structural unit B1 is preferably 1.5 to 4, more preferably 1.5 to 3.5, and 1.5 to 3.3. is more preferable. When the contents of the structural unit B1 and the structural unit B2 have the above relationship, the copper foil adhesion and chemical resistance tend to be further improved.

As the structural unit C in the polymer D, the compound represented by the above formula (b1), the compound represented by the above formula (b2), the compound represented by the above formula (b3), and the above formula (b4) It is preferably a unit derived from at least one selected from the group consisting of the compounds represented. Among these, the structural unit C in the polymer D is more preferably a unit derived from the compound represented by the above formula (b2).

The content of the structural unit C in the polymer D is preferably 5 to 40% by mass with respect to the total mass of the polymer D. When the content of the structural unit C is within the above range, the second composition tends to exhibit even better heat resistance, chemical resistance, copper foil adhesion and insulation reliability. From the same point of view, the content of structural unit C is preferably 10 to 30% by mass, more preferably 15 to 25% by mass.

Further, the content of the structural unit C is preferably 5 to 95% by mass, more preferably 10 to 90% by mass, relative to the total mass of the structural unit B and the structural unit C, and 15 to 60% by mass. % by mass is more preferred, and 20 to 50% by mass is particularly preferred. When the contents of the structural unit B and the structural unit C have the above relationship, the heat resistance, chemical resistance, copper foil adhesion, and insulation reliability tend to be further improved.

The content of the structural unit A' in the polymer D is preferably 5 to 30% by mass with respect to the total mass of the polymer D. When the content of the structural unit A' is within the above range, the second composition tends to exhibit even better chemical resistance. From the same point of view, the content of the structural unit A' is preferably 10 to 27.5% by mass, more preferably 10 to 25% by mass, relative to the total mass of the polymer D.

The alkenyl group equivalent weight of the polymer D is preferably 300-1500 g/mol. When the alkenyl group equivalent is 300 g/mol or more, the cured product of the second composition tends to have a further decreased elastic modulus, and as a result, the thermal expansion coefficient of the substrate obtained using the cured product decreases. It tends to be even lower. When the alkenyl group equivalent is 1500 g/mol or less, the chemical resistance and insulation reliability of the second composition tend to be further improved. From the same point of view, the alkenyl group equivalent is preferably 350-1200 g/mol, more preferably 400-1000 g/mol.

The content of the polymer D in the second composition is preferably 5 to 50% by mass, more preferably 10 to 45% by mass, relative to 100% by mass of the resin solid content, and 15 to 40% by mass. % by mass is more preferred. When the content is within the above range, the second composition tends to exhibit even better heat resistance, low thermal expansion, chemical resistance, copper foil adhesion and insulation reliability in a well-balanced manner.

As described above, the second composition may further contain compound E in addition to polymer D, if desired. By further containing the compound E in addition to the polymer D, the second composition tends to be further improved in heat resistance, low thermal expansion and chemical resistance.

When the second composition contains the polymer D and the compound E, the content of the polymer D in the second composition is 5 to 60% by mass with respect to the total 100% by mass of the polymer D and the compound E. %, more preferably 10 to 55% by mass, even more preferably 20 to 50% by mass. When the content is within the above range, the second composition tends to exhibit even better heat resistance, low thermal expansion, chemical resistance, copper foil adhesion and insulation reliability in a well-balanced manner.

When the second composition contains the polymer D and the compound E, the content of the compound E in the second composition is preferably 20 to 80 with respect to the total 100% by mass of the polymer D and the compound E. % by mass is preferable, 35 to 75% by mass is more preferable, and 45 to 65% by mass is even more preferable.

Polymer D is obtained, for example, by a step of reacting alkenylphenol A, epoxy-modified silicone B, epoxy compound C, and optionally phenol compound A' in the presence of polymerization catalyst G. The reaction may be performed in the presence of an organic solvent. More specifically, in the above steps, the addition reaction between the epoxy group of the epoxy-modified silicone B and the epoxy compound C and the hydroxyl group of the alkenylphenol A, and the hydroxyl group of the resulting addition reaction product and the epoxy-modified silicone B and The polymer D can be obtained by the progress of an addition reaction with the epoxy group of the epoxy compound C.

The polymerization catalyst G is not particularly limited, and examples thereof include imidazole catalysts and phosphorus-based catalysts. These catalysts are used individually by 1 type or in combination of 2 or more types. Among these, imidazole catalysts are preferred.

The imidazole catalyst is not particularly limited. -cyanoethyl-2-ethyl-4-methylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2,3-dihydro-1H-pyrrolo[1, imidazoles such as 2-a]benzimidazole ("TBZ", a product of Shikoku Kasei Kogyo Co., Ltd.) and 2,4,5-triphenylimidazole ("TPIZ", a product of Tokyo Kasei Kogyo Co., Ltd.); Among these, from the viewpoint of preventing homopolymerization of the epoxy component, 2,3-dihydro-1H-pyrrolo[1,2-a]benzimidazole (“TBZ”, a product of Shikoku Kasei Kogyo Co., Ltd.) and / or 2,4 ,5-triphenylimidazole (“TPIZ”, a product of Tokyo Chemical Industry Co., Ltd.) is preferred.

The amount of polymerization catalyst G (preferably imidazole catalyst) to be used is not particularly limited, and is, for example, 0.5 parts per 100 parts by mass of alkenylphenol A, epoxy-modified silicone B, epoxy compound C, and phenol compound A′. It is preferably 1 to 10 parts by mass, and from the viewpoint of increasing the weight average molecular weight of the polymer D, the amount of the polymerization catalyst G used is preferably 0.5 parts by mass or more and 4.0 parts by mass or less. is more preferable.

The organic solvent is not particularly limited, and for example, a polar solvent or a non-polar solvent can be used. Polar solvents include, but are not limited to, ketones such as acetone, methyl ethyl ketone, and methyl isobutyl ketone; cellosolve solvents such as propylene glycol monomethyl ether and propylene glycol monomethyl ether acetate; ethyl lactate, methyl acetate, ethyl acetate, and acetic acid; Ester solvents such as butyl, isoamyl acetate, ethyl lactate, methyl methoxypropionate and methyl hydroxyisobutyrate; and amides such as dimethylacetamide and dimethylformamide. The nonpolar solvent is not particularly limited, but examples thereof include aromatic hydrocarbons such as toluene and xylene. These solvents are used singly or in combination of two or more.

The amount of the organic solvent used is not particularly limited, and is, for example, 50 to 150 parts by mass with respect to 100 parts by mass of the total amount of alkenylphenol A, epoxy-modified silicone B, epoxy compound C and phenol compound A'.

The reaction temperature is not particularly limited, and may be, for example, 100 to 170°C. The reaction time is also not particularly limited, and may be, for example, 3 to 8 hours.

After completion of the reaction in this step, polymer D may be separated and purified from the reaction mixture by a conventional method.

The thermosetting resin composition of the present embodiment may further contain other resins as long as the effects of the present embodiment are not impaired. Other resins include, for example, oxetane resins, benzoxazine compounds, compounds having polymerizable unsaturated groups, and the like. These resins are used singly or in combination of two or more.

Examples of the oxetane resin include, but are not limited to, oxetane, 2-methyloxetane, 2,2-dimethyloxetane, 3-methyloxetane, alkyloxetane such as 3,3-dimethyloxetane, 3-methyl-3-methoxy Methyloxetane, 3,3'-di(trifluoromethyl)perfluoxetane, 2-chloromethyloxetane, 3,3-bis(chloromethyl)oxetane, biphenyl type oxetane, "OXT-101" manufactured by Toagosei Co., Ltd. , “OXT-121” and the like.

The term "benzoxazine compound" as used herein refers to a compound having two or more dihydrobenzoxazine rings in one molecule. Examples of the benzoxazine compound include, but are not limited to, "Bisphenol F-type benzoxazine BF-BXZ" and "Bisphenol S-type benzoxazine BS-BXZ" manufactured by Konishi Chemical Co., Ltd., and the like.

Examples of compounds having a polymerizable unsaturated group include, but are not limited to, vinyl compounds such as ethylene, propylene, styrene, divinylbenzene, and divinylbiphenyl; methyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate; , 2-hydroxypropyl (meth)acrylate, polypropylene glycol di(meth)acrylate, trimethylolpropane di(meth)acrylate, trimethylolpropane tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol hexa(meth)acrylate ) monohydric or polyhydric alcohol (meth)acrylates such as acrylate; epoxy (meth)acrylates such as bisphenol A type epoxy (meth)acrylate and bisphenol F type epoxy (meth)acrylate; benzocyclobutene resin, etc. be done.

[Aromatic phosphorus compound P]
The thermosetting resin composition in the present embodiment preferably further contains an aromatic phosphorus compound P from the viewpoint of further improving low thermal expansion properties. The aromatic phosphorus compound P is not particularly limited as long as it contains a phosphorus atom in its molecule and exhibits aromaticity.

In the present embodiment, from the viewpoint of flame retardancy and chemical resistance, the aromatic phosphorus compound P is at least selected from the group consisting of cyclic phosphazene compounds, phosphate ester compounds, phosphite ester compounds and phosphaphenanthrene compounds. It is preferred that one species is included. The aromatic phosphorus compound P more preferably contains at least one selected from the group consisting of a cyclic phosphazene compound, a phosphate ester compound, and a phosphite ester compound from the viewpoint of further improving low thermal expansion properties. , a cyclic phosphazene compound and a phosphate ester compound.

（上記式（Ｐ１）中、Ｐｈ１、Ｐｈ２及びＰｈ３は、置換又は非置換のアリール基を表し、当該Ｐｈ１、Ｐｈ２及びＰｈ３は、同一であっても異なっていてもよい。
上記式（Ｐ２）中、Ｐｈ１及びＰｈ２は、置換又は非置換のアリール基を表し、当該Ｐｈ１及びＰｈ２は、同一であっても異なっていてもよく、Ｒは、炭素数１～３０のアルキル基又は炭素数６～３０のアリール基を表す。）

（上記式（Ｐ３）中、Ａは、各々独立して、水素原子、メチル基、ヒドロキシル基、シアノ基、アミノ基、カルボキシル基、グリシジルオキシ基、パラヒドロキシフェニルジメチル基、パラグリシジルオキシフェニルジメチル基、パラヒドロキシフェニルスルホン基、パラグリシジルオキシフェニルスルホン基、炭素数２～３０のアルキル基、炭素数２～３０のアルケニル基又は炭素数６～３０のアリール基を表し、Ｒは、各々独立して、水素原子、メチル基又は炭素数２～３０のアルキル基を表し、ｎは３～１５の整数を表す。
上記式（Ｐ４）中、Ｒは水素原子、炭素数２～３０のアルキル基又は置換若しくは非置換のアリール基を表す。）In the present embodiment, from the viewpoint of nonvolatility and chemical stability (thermal stability) when the thermosetting resin composition is thermally cured, the aromatic phosphorus compound P is represented by the following formulas (P1) and (P2) , (P3) or (P4).

(In formula (P1) above, Ph1, Ph2 and Ph3 represent a substituted or unsubstituted aryl group, and Ph1, Ph2 and Ph3 may be the same or different.
In the above formula (P2), Ph1 and Ph2 represent a substituted or unsubstituted aryl group, the Ph1 and Ph2 may be the same or different, and R is an alkyl group having 1 to 30 carbon atoms. or represents an aryl group having 6 to 30 carbon atoms. )

(In the above formula (P3), A is each independently a hydrogen atom, a methyl group, a hydroxyl group, a cyano group, an amino group, a carboxyl group, a glycidyloxy group, a parahydroxyphenyldimethyl group, a paraglycidyloxyphenyldimethyl group , a parahydroxyphenylsulfone group, a paraglycidyloxyphenylsulfone group, an alkyl group having 2 to 30 carbon atoms, an alkenyl group having 2 to 30 carbon atoms or an aryl group having 6 to 30 carbon atoms, and each R is independently , a hydrogen atom, a methyl group or an alkyl group having 2 to 30 carbon atoms, and n is an integer of 3 to 15.
In formula (P4) above, R represents a hydrogen atom, an alkyl group having 2 to 30 carbon atoms, or a substituted or unsubstituted aryl group. )

In the present embodiment, from the viewpoint of nonvolatility and chemical stability when the thermosetting resin composition is heat cured, the aromatic phosphorus compound P is an aromatic phosphorus compound P′ represented by the following formula (P5). ' is preferably included.

The content of the aromatic phosphorus compound P in the thermosetting resin composition in the present embodiment is 3 to 15 parts by mass with respect to 100 parts by mass of the resin solid content, from the viewpoint of achieving well-balanced heat resistance and low thermal expansion. parts, more preferably 3 to 12 parts by mass, even more preferably 4 to 10 parts by mass.

[Inorganic filler]
The thermosetting resin composition in the present embodiment preferably further contains an inorganic filler from the viewpoint of further improving low thermal expansion properties. The inorganic filler is not particularly limited, and examples thereof include silicas, silicon compounds (e.g., white carbon, etc.), metal oxides (e.g., alumina, titanium white, zinc oxide, magnesium oxide, zirconium oxide, etc.), metal nitrides. substances (e.g., boron nitride, aggregated boron nitride, silicon nitride, aluminum nitride, etc.), metal sulfates (e.g., barium sulfate, etc.), metal hydroxides (e.g., aluminum hydroxide, aluminum hydroxide heat-treated products (e.g., aluminum hydroxide heat-treated to reduce part of the water of crystallization), boehmite, magnesium hydroxide, etc.), molybdenum compounds (e.g., molybdenum oxide, zinc molybdate, etc.), zinc compounds (e.g., zinc borate, zinc stannate, etc.), clay, kaolin, talc, calcined clay, calcined kaolin, calcined talc, mica, E-glass, A-glass, NE-glass, C-glass, L-glass, D-glass, S-glass , M-Glass G20, glass short fibers (including fine glass powders such as E glass, T glass, D glass, S glass, Q glass, etc.), hollow glass, spherical glass, and the like. These inorganic fillers are used individually by 1 type or in combination of 2 or more types. Among these, the inorganic filler is preferably at least one selected from the group consisting of silicas, metal hydroxides and metal oxides, from the viewpoint of further improving low thermal expansion properties. Silicas, boehmite and alumina, and more preferably silicas.

Silicas include, for example, natural silica, fused silica, synthetic silica, aerosil, and hollow silica. These silicas are used individually by 1 type or in combination of 2 or more types. Among these, fused silica is preferable from the viewpoint of dispersibility, and two or more types of fused silica having different particle sizes are more preferable from the viewpoint of filling properties and fluidity.

The content of the inorganic filler is preferably 50 to 1000 parts by mass, more preferably 70 to 500 parts by mass, with respect to 100 parts by mass of the resin solid content, from the viewpoint of further improving the low thermal expansion property. , more preferably 100 to 300 parts by mass.

[Silane coupling agent]
The thermosetting resin composition in this embodiment may further contain a silane coupling agent. By containing a silane coupling agent, the thermosetting resin composition further improves the dispersibility of the inorganic filler, and further increases the adhesive strength between the components of the thermosetting resin composition and the substrate described later. It tends to improve.

The silane coupling agent is not particularly limited, and includes silane coupling agents generally used for surface treatment of inorganic substances, aminosilane compounds (eg, γ-aminopropyltriethoxysilane, N-β-(aminoethyl) -γ-aminopropyltrimethoxysilane, etc.), epoxysilane compounds (eg, γ-glycidoxypropyltrimethoxysilane, etc.), acrylsilane compounds (eg, γ-acryloxypropyltrimethoxysilane, etc.), cationic Examples include silane compounds (eg, N-β-(N-vinylbenzylaminoethyl)-γ-aminopropyltrimethoxysilane hydrochloride), styrylsilane compounds, phenylsilane compounds, and the like. A silane coupling agent is used individually by 1 type or in combination of 2 or more types. Among these, the silane coupling agent is preferably an epoxysilane compound. Examples of epoxysilane compounds include "KBM-403", "KBM-303", "KBM-402", and "KBE-403" manufactured by Shin-Etsu Chemical Co., Ltd.

The content of the silane coupling agent is not particularly limited, but may be 0.1 to 5.0 parts by mass with respect to 100 parts by mass of the resin solid content.

[Wetting and dispersing agent]
The thermosetting resin composition in this embodiment may further contain a wetting and dispersing agent. The thermosetting resin composition tends to further improve the dispersibility of the filler by containing a wetting and dispersing agent.

As the wetting and dispersing agent, any known dispersing agent (dispersion stabilizer) used for dispersing fillers may be used. 161, BYK-W996, W9010, W903 and the like.

The content of the wetting and dispersing agent is not particularly limited, but is preferably 0.5 parts by mass or more and 5.0 parts by mass or less with respect to 100 parts by mass of the resin solid content.

[solvent]
The thermosetting resin composition in this embodiment may further contain a solvent. By containing a solvent, the thermosetting resin composition has a lower viscosity during preparation of the thermosetting resin composition, further improving the handling property (handleability), and further improving the impregnating property into the substrate. tend to fall.

The solvent is not particularly limited as long as it can dissolve some or all of the components in the thermosetting resin composition, but examples include ketones (acetone, methyl ethyl ketone, etc.), aromatic hydrocarbons (e.g., toluene, xylene, etc.), amides (eg, dimethylformaldehyde, etc.), propylene glycol monomethyl ether and its acetate, and the like. These solvents are used singly or in combination of two or more.

The method for producing the thermosetting resin composition in the present embodiment is not particularly limited, and examples thereof include a method of collectively or sequentially blending each component with a solvent and stirring the mixture. At this time, in order to uniformly dissolve or disperse each component, known treatments such as stirring, mixing, and kneading are used.

[Other physical properties of thermosetting resin composition]
In the case where the thermosetting resin composition in the present embodiment contains the epoxy compound C, the compound E and the inorganic filler (such a thermosetting resin composition is hereinafter also referred to as “thermosetting resin composition a”). , the thermosetting resin composition a preferably has the following physical properties. That is, a thermosetting resin composition a containing an epoxy compound C, a compound E and an inorganic filler, and a cured product a for evaluation obtained by subjecting the thermosetting resin composition a to the following test, It is preferable to satisfy the conditions (1a) to (4a).
(Loss modulus evaluation test)
A composite of the thermosetting resin composition a and an S glass woven fabric as a base material, wherein the content of the thermosetting resin composition in the composite is 40 to 80% by volume. prepare. This mixture is thermally cured at 155-165° C. for 5 minutes to obtain a composite. Next, two sheets of this composite were stacked, and further electrodeposited copper foils having a thickness of 12 μm were arranged above and below, and lamination molding was performed at a pressure of 30 kgf/cm ² and a temperature of 230° C. for 100 minutes to obtain a thickness of 0.22 mm. A test copper foil clad laminate is obtained, which includes an insulating layer having a thickness. After cutting this test copper foil-clad laminate into a size of 12.7×30 mm with a dicing saw, the copper foil on the surface is removed by etching to obtain a cured product a for evaluation.
(Conditions (1a) to (4a))
Condition (1a) The loss elastic modulus of the cured product a for evaluation measured by the DMA method according to JIS C6481 (1996) has a maximum point at 200° C. or higher.
Condition (2a) Loss elastic modulus L′ (100) of the cured product a for evaluation at 100° C. measured by the DMA method, and loss elastic modulus L′ (max) of the cured product for evaluation at the maximum point is 0.70 or more as L'(100)/L'(max).
Condition (3a) The ratio of the loss elastic modulus L′(150) of the cured product a for evaluation at 150° C. measured by the DMA method to the L′(max) is L′(150)/L′ (max) is 0.60 or more.
Condition (4a) The ratio of the loss elastic modulus L'(200) of the cured product a for evaluation at 200°C measured by the DMA method to the L'(max) is L'(200)/L' (max) is 0.70 or more.

The thermosetting resin composition a can be said to be one aspect of the thermosetting resin composition in the above-described present embodiment, and includes the epoxy compound C, the compound E, and the inorganic filler as essential, except that the above-described present A configuration similar to that of the thermosetting resin composition in the embodiment can be adopted.

(1a) The cured product for evaluation a has a maximum point of loss elastic modulus measured by the DMA method according to JIS C6481 (1996) at 200° C. or higher, and therefore has excellent heat resistance. From the same viewpoint as above, the loss elastic modulus of the cured product a for evaluation preferably has a maximum point at 240 ° C. or higher, more preferably has a maximum point at 250 ° C. or higher, and has a maximum point at 260 ° C. or higher. More preferably, it may have a maximum point at 270° C. or higher. The temperature of the maximum point of the loss elastic modulus may be a higher value, and is not particularly limited. For example, the loss elastic modulus may have a maximum point at 290° C. or higher.

The cured product for evaluation a has (2a) a loss elastic modulus L′ (100) of the cured product for evaluation at 100° C. measured by the DMA method, and a loss elastic modulus L of the cured product for evaluation at the maximum point. '(max) is 0.70 or more as L'(100)/L'(max), so it is excellent in low thermal expansion. From the same viewpoint as above, L'(100)/L'(max) is preferably 0.71 or more, more preferably 0.73 or more. The L'(100)/L'(max) may be a higher value, and is not particularly limited. For example, the L'(100)/L'(max) is 0.90, 0.95 There may be.

In the evaluation cured product a, (3a) the ratio of the loss elastic modulus L' (150) of the evaluation cured product a at 150 ° C. measured by the DMA method to the L' (max) is L' ( 150)/L'(max) is 0.60 or more, so it is excellent in low thermal expansion. From the same viewpoint as above, L'(150)/L'(max) is preferably 0.65 or more, more preferably 0.68 or more. The L'(150)/L'(max) may be a higher value, and is not particularly limited. For example, the L'(150)/L'(max) is 0.85, 0.90 There may be.

In the evaluation cured product a, (4a) the ratio of the loss elastic modulus L '(200) of the evaluation cured product a at 200 ° C. measured by the DMA method and the L ' (max) is L ' ( 200)/L'(max) is 0.70 or more, so it is excellent in low thermal expansion. From the same viewpoint as above, L'(200)/L'(max) is preferably 0.71 or more, more preferably 0.75 or more. The L'(200)/L'(max) may be a higher value, and is not particularly limited. For example, the L'(200)/L'(max) may be 0.95. .

More specifically, the loss elastic modulus L'(max), the loss elastic modulus L'(100), the loss elastic modulus L'(150), and the loss elastic modulus L'(200) in the present embodiment are described later. It can be measured by the method described in the examples.
In the present embodiment, although not particularly limited, for example, the above-mentioned aromatic phosphorus compound P, alkenylphenol A, epoxy-modified silicone B, and epoxy other than the epoxy-modified silicone B are used as components of the evaluation cured product a. By using the compound C, the polymer D and / or the compound E, especially by reducing the functional group equivalent ratio (cyanate equivalent / epoxy equivalent) of the cyanate group and the epoxy group in the cured product for evaluation a, loss elasticity The modulus L'(max), the loss modulus L'(100), the loss modulus L'(150) and the loss modulus L'(200) can be preferably adjusted within the ranges described above. From the above viewpoint, in the present embodiment, the value of cyanate equivalent/epoxy equivalent is preferably less than 0.8. That is, even if it does not contain any of the aromatic phosphorus compound P, the alkenylphenol A, the epoxy-modified silicone B, the epoxy compound C other than the epoxy-modified silicone B, the polymer D, and the compound E, for example, the cyanate equivalent / By adjusting the value of the epoxy equivalent, the loss elastic modulus L'(max), the loss elastic modulus L'(100), the loss elastic modulus L'(150) and the loss elastic modulus L'(200) can be controlled, and Without adjusting the value of cyanate equivalent/epoxy equivalent, for example, an aromatic phosphorus compound P, alkenylphenol A, epoxy-modified silicone B, an epoxy compound C other than the epoxy-modified silicone B, polymer D and compound E can be combined appropriately. , loss elastic modulus L'(max), loss elastic modulus L'(100), loss elastic modulus L'(150) and loss elastic modulus L'(200) can be controlled.

[Use of thermosetting resin composition]
The thermosetting resin composition in the present embodiment can exhibit excellent low thermal expansion properties as described above. Therefore, by using the thermosetting resin composition of the present embodiment, it is possible to obtain the prepreg of the present embodiment having excellent low thermal expansion properties. However, the thermosetting resin composition of the present embodiment can also be applied to uses other than prepreg, taking advantage of its excellent low thermal expansion properties. Specific examples thereof include a resin sheet containing the above-described thermosetting resin composition a.
Moreover, a metal foil-clad laminate or a printed wiring board can be obtained by performing predetermined processing using the prepreg and resin sheet of the present embodiment. That is, the thermosetting resin composition in the present embodiment is also suitably used as a metal foil-clad laminate and a printed wiring board.

In particular, in the above applications (prepreg, resin sheet, metal foil-clad laminate, and printed wiring board), the second composition contains, in addition to the polymer D and the aromatic phosphorus compound P, at least an epoxy compound C (polymer It preferably contains an epoxy compound C) which is present separately from the constituent unit C in D.
In this case, the polymer D preferably has units derived from the bifunctional epoxy compound described above as units derived from the epoxy compound C, and more preferably has units derived from the biphenyl type epoxy resin described above. More preferably, a compound b2 having a unit derived from the compound (compound b2) represented by the above formula (b2), more preferably the number of R ^a is 0, and the number of R ^a being an alkyl group is 4 (commercially available, for example, the product name "YL-6121H" manufactured by Mitsubishi Chemical Corporation).
As the epoxy compound C present separately from the structural unit C in the polymer D, the above-mentioned naphthylene ether type epoxy resin (commercially available products, for example, "HP-6000" manufactured by DIC Corporation) and / Or naphthalene cresol novolak type epoxy resin (commercially available, for example, "HP-9540" manufactured by DIC Corporation) is preferably included.
Further, it is preferred that the cyanate equivalent/epoxy equivalent value in the second composition is less than 0.8. The cyanate equivalent/epoxy equivalent (functional group equivalent ratio) is the equivalent of the cyanate group in the cyanate ester compound that may be contained in the second composition, and the "polymer D It is the equivalent ratio of the epoxy group in the epoxy compound C that exists separately from the structural unit C in the inside, and is calculated by the following formula (1). In the present embodiment, it is possible to use two or more types of either the cyanate ester compound or the epoxy compound. For each component, the number of functional groups (that is, the equivalent weight of cyanate groups and the equivalent weight of epoxy groups) is calculated, and these values are summed up to calculate the equivalent weight of all cyanate groups and the equivalent weight of all epoxy groups. The functional group equivalent ratio is a value obtained by dividing the equivalent weight of all cyanate groups by the equivalent weight of all epoxy groups. The number of functional groups is a value obtained by dividing the parts by mass of a component by the functional group equivalent of the component.
Calculation formula (1): functional group equivalent ratio = (parts by mass of cyanate ester compound in thermosetting resin composition/functional group equivalent weight of cyanate ester compound)/(epoxy compound in thermosetting resin composition) Parts by mass/functional group equivalent of epoxy compound)

[Resin sheet]
The resin sheet of the present embodiment contains the thermosetting resin composition a, and may be a laminated resin sheet having a support or a single-layer resin sheet having no support.

The laminated resin sheet of this embodiment has a support and a thermosetting resin composition a disposed on one side or both sides of the support. The method for producing the laminated resin sheet is not particularly limited, and for example, it can be produced by coating a support with a solution obtained by diluting the thermosetting resin composition a with a solvent and drying the sheet.

Examples of the support used here include polyethylene film, polypropylene film, polycarbonate film, polyethylene terephthalate film, ethylene tetrafluoroethylene copolymer film, and a release film obtained by applying a release agent to the surface of these films, Examples include organic film substrates such as polyimide films, conductor foils such as copper foil and aluminum foil, and plate-like substrates such as glass plates, SUS plates, and FRP, but are not particularly limited thereto.

Examples of the coating method include a method in which a solution obtained by diluting the thermosetting resin composition a with a solvent is coated on the support using a bar coater, die coater, doctor blade, baker applicator, or the like.

Further, the single-layer resin sheet of the present embodiment is formed by molding the thermosetting resin composition a into a sheet. That is, the single-layer resin sheet of this embodiment contains the thermosetting resin composition a. The method for producing a single-layer resin sheet is not particularly limited. A method of peeling or etching the support from the resin sheet can be used. In addition, a solution obtained by diluting the thermosetting resin composition a with a solvent is supplied into a mold having a sheet-shaped cavity and dried to form a sheet, so that a single layer can be obtained without using a support. A resin sheet (resin sheet) can also be obtained.

In the production of the single-layer resin sheet or laminated resin sheet of the present embodiment, the drying conditions for removing the solvent are not particularly limited. A temperature of 20° C. to 170° C. and a time of 1 to 90 minutes are preferable because the curing of the composition proceeds.

In addition, the thickness of the resin layer of the single layer or laminated sheet of the present embodiment can be adjusted by the concentration of the solution of the thermosetting resin composition a and the coating thickness, and is not particularly limited, but generally the coating thickness The thickness is preferably 0.1 to 500 μm because the solvent tends to remain during drying as the thickness increases.

[Metal foil clad laminate]
The metal foil-clad laminate of the present embodiment includes a laminate containing the prepreg of the present embodiment and/or the cured product of the present embodiment, and metal foil arranged on one side or both sides of the laminate. The laminate may contain one prepreg and/or cured product, or may contain a plurality of prepregs and/or cured products.

The metal foil (conductor layer) may be a metal foil that is used for various printed wiring board materials, and examples thereof include metal foils of copper, aluminum, and the like. Copper foil, such as foil, is mentioned. The thickness of the conductor layer is, for example, 1 to 70 μm, preferably 1.5 to 35 μm.

The molding method and molding conditions for the metal foil-clad laminate are not particularly limited, and general techniques and conditions for printed wiring board laminates and multilayer boards can be applied. For example, a multistage press machine, a multistage vacuum press machine, a continuous molding machine, an autoclave molding machine, or the like can be used when molding a laminate (laminate described above) or a metal foil-clad laminate. In the molding of a laminate (laminate described above) or a metal foil-clad laminate (lamination molding), the temperature is 100 to 300° C., the pressure is 2 to 100 kgf/cm ² , and the heating time is 0.05 to 5. Time ranges are common. Furthermore, if desired, post-curing can be performed at a temperature of 150-300°C. Particularly when a multistage press is used, the temperature is preferably 200° C. to 250° C., the pressure is 10 to 40 kgf/cm ² , the heating time is 80 minutes to 130 minutes, and the temperature is 215° C. to 215° C., from the viewpoint of sufficiently accelerating the curing of the prepreg. More preferably, the temperature is 235° C., the pressure is 25 to 35 kgf/cm ² , and the heating time is 90 to 120 minutes. Moreover, it is also possible to form a multi-layer board by combining the above-mentioned prepreg and a wiring board for an inner layer separately prepared and performing lamination molding.

[Printed wiring board]
The printed wiring board of this embodiment has an insulating layer containing the cured product of this embodiment, and a conductor layer formed on the surface of the insulating layer. The printed wiring board of the present embodiment can be formed, for example, by etching the metal foil of the metal foil-clad laminate of the present embodiment into a predetermined wiring pattern to form a conductor layer.

Specifically, the printed wiring board of this embodiment can be produced, for example, by the following method. First, the metal foil-clad laminate of this embodiment is prepared. An inner layer board having a conductor layer (inner layer circuit) is produced by etching the metal foil of the metal foil clad laminate into a predetermined wiring pattern. Next, on the surface of the conductor layer (internal circuit) of the inner layer substrate, a predetermined number of insulating layers and a metal foil for the outer layer circuit are laminated in this order, and heat-pressed to integrally mold (laminate molding). A laminate is obtained. The laminate molding method and molding conditions are the same as the laminate molding method and molding conditions for the laminate and the metal foil-clad laminate described above. Next, the laminate is perforated for through holes and via holes, and the wall surfaces of the holes thus formed are plated with a metal film for conducting the conductor layer (internal circuit) and the metal foil for the outer layer circuit. to form Next, the metal foil for the outer layer circuit is etched into a predetermined wiring pattern to form an outer layer substrate having a conductor layer (outer layer circuit). A printed wiring board is thus manufactured.

In the case of not using a metal foil-clad laminate, a printed wiring board may be produced by forming a conductor layer to form a circuit on the insulating layer. At this time, an electroless plating technique can be used to form the conductor layer.

EXAMPLES The present embodiment will be described in more detail below with reference to Examples, but the present embodiment is not limited to these Examples.

（式中、Ｒ^２ａは、水素原子を表し、ｍは、１～１０の整数を表す。）(Synthesis Example 1) Synthesis of 1-naphthol aralkyl-type cyanate ester compound (SN495V-CN) α-naphthol aralkyl-type phenolic resin (SN495V, hydroxyl group equivalent: 236 g) in which all R ^2a in the following formula (2b) are hydrogen atoms / eq., manufactured by Nippon Steel Chemical Co., Ltd.) 300 g (1.28 mol in terms of hydroxy group) and 194.6 g (1.92 mol) of triethylamine (1.5 mol per 1 mol of hydroxy group) are dissolved in 1800 g of dichloromethane, This was referred to as Solution 1. 125.9 g (2.05 mol) of cyanogen chloride (1.6 mol per 1 mol of hydroxy group), 293.8 g of dichloromethane, 194.5 g (1.92 mol) of 36% hydrochloric acid (1.5 mol per 1 mol of hydroxy group), Solution 1 was poured into 1205.9 g of water over 30 minutes while stirring and maintaining the liquid temperature at -2 to -0.5°C. After pouring solution 1, the mixture was stirred at the same temperature for 30 minutes. I ordered over. After pouring solution 2, the mixture was stirred at the same temperature for 30 minutes to complete the reaction. After that, the reaction liquid was allowed to stand to separate the organic phase and the aqueous phase. The resulting organic phase was washed 5 times with 1300 g of water. The electrical conductivity of the wastewater after the fifth washing was 5 μS/cm, and it was confirmed that the ionic compounds that could be removed were sufficiently removed by washing with water. The organic phase after washing with water is concentrated under reduced pressure and finally concentrated to dryness at 90° C. for 1 hour to obtain the desired 1-naphthol aralkyl cyanate ester compound (SN495V-CN, cyanate group equivalent: 261 g/eq. ) (orange viscous substance) 331 g were obtained. The infrared absorption spectrum of the obtained SN495V-CN showed absorption at 2250 cm ^-1 (cyanate group) and no absorption of hydroxy group.

(Wherein, R ^2a represents a hydrogen atom and m represents an integer of 1 to 10.)

(Example 1)
In a three-necked flask equipped with a thermometer and a Dimroth, 5.0 parts by mass of diallyl bisphenol A (DABPA, Daiwa Kasei Kogyo Co., Ltd.), 5.4 parts by mass of biscresol fluorene (BCF, Osaka Gas Chemical Co., Ltd.), epoxy Modified silicone b1 (X-22-163, Shin-Etsu Chemical Co., Ltd., functional group equivalent 200 g / mol) 3.7 parts, epoxy-modified silicone b2 (KF-105, Shin-Etsu Chemical Co., Ltd., functional group equivalent 490 g /mol) 11.0 parts by mass, biphenyl type epoxy resin c1 (YL-6121H, Mitsubishi Chemical Corporation) 4.9 parts by mass, propylene glycol monomethyl ether acetate (DOWANOL PMA, Dow Chemical Japan Co., Ltd.) as a solvent 30 parts by mass was added, and the mixture was heated and stirred to 120° C. in an oil bath. After confirming that the raw material was dissolved in the solvent, 0.3 parts by mass of imidazole catalyst g1 (TBZ, Shikoku Kasei Kogyo Co., Ltd.) was added, the temperature was raised to 140 ° C., stirred for 5 hours, and after cooling, the phenoxy A polymer solution (solid content: 50% by mass) was obtained (polymer production step).

In addition, diallyl bisphenol A corresponds to "alkenylphenol A", epoxy-modified silicone b1 and epoxy-modified silicone b2 correspond to "epoxy-modified silicone B", and biphenyl type epoxy resin c1 corresponds to "epoxy compound C". Equivalent to.
In addition, the phenoxy polymer solution contained a polymer D containing a structural unit derived from alkenylphenol A, a structural unit derived from epoxy-modified silicone B, and a structural unit derived from epoxy compound C. Hereinafter, polymer D is also referred to as phenoxy polymer.
The content of structural unit B with respect to polymer D was 48.8% by mass.
The content of structural unit C with respect to the total amount of structural unit B and structural unit C was 25% by mass.

[Measurement method of weight average molecular weight Mw]
The weight average molecular weight Mw of the phenoxy polymer obtained as described above was measured as follows. Analysis was performed by injecting 20 μL of a solution obtained by dissolving 0.5 g of the phenoxy polymer solution in 2 g of THF into a high-performance liquid chromatography (manufactured by Shimadzu Corporation, pump: LC-20AD). The columns were Shodex GPC KF-804 (length 30 cm x inner diameter 8 mm) manufactured by Showa Denko, Shodex GPC KF-803 (length 30 cm x inner diameter 8 mm), Shodex GPC KF-802 (length 30 cm x inner diameter 8 mm), Shodex GPC. A total of 4 tubes of KF-801 (length 30 cm x inner diameter 8 mm) were used, THF (solvent) was used as the mobile phase, the flow rate was 1 mL/min, and RID-10A was used as the detector. The weight average molecular weight Mw was obtained by GPC method using standard polystyrene as a standard substance.
The weight average molecular weight Mw of the phenoxy polymer measured as described above was 12,000.

15 parts by mass of a novolac maleimide compound (BMI-2300, Daiwa Kasei Kogyo Co., Ltd.) and 5 parts of a bismaleimide compound (BMI-80, Daiwa Kasei Kogyo Co., Ltd.) are added to 30 parts by mass of this phenoxy polymer solution (in terms of solid content). Parts by mass, naphthalene cresol novolak type epoxy resin (HP-9540, DIC Corporation, functional group equivalent 244 g/mol) 26 parts by mass, phenol novolac type cyanate ester compound (PT-30, Lonza, functional group equivalent 127 g/mol) mol) 14 parts by mass, phosphate ester compound (PX-200, Daihachi Chemical Industry Co., Ltd.) 10 parts by mass, slurry silica as filler (SC-2050MB, Admatechs Co., Ltd.) 140 parts by mass, wet dispersion A varnish was obtained by mixing 1 part by mass of an agent (DISPERBYK-161, BYK-Chemie Japan Co., Ltd.) and 5 parts by mass of a silane coupling agent (KBM-403, Shin-Etsu Chemical Co., Ltd.) (varnish production step). This varnish was impregnated and coated on an S glass woven fabric (thickness 100 μm), dried by heating at 165 ° C. for 5 minutes, and the content of the thermosetting resin composition solid content (including filler) was 58.2% by volume. of prepreg was obtained (prepreg manufacturing process).

(Example 2)
A prepreg having a thermosetting resin composition solid content (including filler) content of 58.2% by volume was obtained in the same manner as in Example 1, except for the following points. That is, 14 parts by mass of SN495V-CN was used instead of PT-30 in the varnish production step.

(Example 3)
A prepreg having a thermosetting resin composition solid content (including filler) content of 58.2% by volume was obtained in the same manner as in Example 1, except for the following points. That is, in the varnish production step, the amount of BMI-2300 used was changed to 16.5 parts by mass, the amount of BMI-80 used was changed to 5.5 parts by mass, and 15 parts of SN495V-CN was used instead of PT-30. The amount of HP-9540 was changed to 28 parts by mass, the amount of PX-200 was changed to 5 parts by mass, and the amount of SC-2050MB was changed to 200 parts by mass. Furthermore, in the prepreg manufacturing process, the heat drying conditions were changed to 155° C. for 5 minutes.

(Example 4)
A prepreg having a thermosetting resin composition solid content (including filler) content of 58.2% by volume was obtained in the same manner as in Example 2, except for the following points. That is, in the varnish production step, the amount of SC-2050MB used was changed to 200 parts by mass. Furthermore, in the prepreg manufacturing process, the heat drying conditions were changed to 155° C. for 5 minutes.

(Example 5)
A prepreg having a thermosetting resin composition solid content (including filler) content of 58.2% by volume was obtained in the same manner as in Example 4, except for the following points. That is, in the varnish production step, 30 parts by mass of a naphthylene ether type epoxy resin (HP-6000, DIC Corporation, functional group equivalent: 250 g/mol) is used instead of HP-9540, and the amount of SN495V-CN used is reduced to was changed to 15 parts by mass, and the amount of PX-200 used was changed to 5 parts by mass.

(Example 6)
A prepreg having a thermosetting resin composition solid content (including filler) content of 58.2% by volume was obtained in the same manner as in Example 3, except for the following points. That is, in the varnish production process, the amount of BMI-2300 used was changed to 16 parts by mass, the amount of HP-9540 used was changed to 32.5 parts by mass, and the amount of SN495V-CN used was changed to 16 parts by mass. , PX-200 was not used.

(Comparative example 1)
A prepreg having a thermosetting resin composition solid content (including filler) content of 58.2% by volume was obtained in the same manner as in Example 1, except for the following points. That is, in the varnish production step, the amount of HP-9540 used was changed to 32 parts by mass, the amount of PT-30 used was changed to 18 parts by mass, and PX-200 was not used.

(Comparative example 2)
A prepreg having a thermosetting resin composition solid content (including filler) content of 58.2% by volume was obtained in the same manner as in Comparative Example 1, except for the following points. That is, in the prepreg manufacturing process, the heat drying conditions were changed to 155° C. for 5 minutes.

(Comparative Example 3)
A prepreg having a thermosetting resin composition solid content (including filler) content of 58.2% by volume was obtained in the same manner as in Example 1, except for the following points. That is, in the varnish production process, the phenoxy polymer solution was not used, the amount of BMI-2300 used was changed to 24.6 parts by mass, BMI-80 was not used, and HP-6000 was replaced with 38 parts of HP-9540. .6 parts by mass were used, 36.8 parts by mass of SN495V-CN was used instead of PT-30, the amount of SC-2050MB was changed to 200 parts by mass, and PX-200 was not used.

(Comparative Example 4)
A prepreg having a thermosetting resin composition solid content (including filler) content of 58.2% by volume was obtained in the same manner as in Example 1, except for the following points. That is, in the varnish production step, the amount of BMI-2300 used was changed to 17 parts by mass, BMI-80 was not used, 27 parts by mass of HP-6000 was used in place of HP-9540, and PT-30 was replaced with SN495V-CN was used in an amount of 26 parts by mass, and PX-200 was not used.

(Comparative Example 5)
A prepreg having a thermosetting resin composition solid content (including filler) content of 58.2% by volume was obtained in the same manner as in Comparative Example 3, except for the following points. That is, in the varnish production step, the amount of BMI-2300 used was changed to 20 parts by mass, the amount of HP-6000 used was changed to 35 parts by mass, the amount of SN495V-CN used was changed to 30 parts by mass, and SC The amount of -2050MB used was changed to 140 parts by mass, and 15 parts by mass of silicone acrylic graft (US-350, Toagosei Co., Ltd.) was used as the low-elasticity component. Furthermore, in the prepreg manufacturing process, the heat drying conditions were changed to 140° C. for 3 minutes.

(Comparative Example 6)
A prepreg having a thermosetting resin composition solid content (including filler) content of 58.2% by volume was obtained in the same manner as in Comparative Example 5, except for the following points. That is, in the varnish production step, 15 parts by mass of an acrylic resin (SG-80H, Nagase ChemteX Corporation) was used as a low-elasticity component instead of US-350.

(Comparative Example 7)
A prepreg having a thermosetting resin composition solid content (including filler) content of 58.2% by volume was obtained in the same manner as in Comparative Example 5, except for the following points. That is, in the varnish production step, 15 parts by mass of a silicone resin (KR-480, Shin-Etsu Chemical Co., Ltd.) was used as a low-elasticity component instead of US-350. Furthermore, in the prepreg manufacturing process, the heat drying conditions were changed to 150° C. for 3 minutes.

[Preparation of metal foil-clad laminate]
Two sheets of the prepreg obtained in each of Examples 1 to 6 and Comparative Examples 1 to 7 were stacked, and an electrolytic copper foil (3EC-M2S-VLP, manufactured by Mitsui Kinzoku Mining Co., Ltd.) having a thickness of 12 μm was further added. They were placed one on top of the other and laminated at a pressure of 30 kgf/cm ² and a temperature of 230° C. for 100 minutes to obtain a copper foil clad laminate including an insulating layer having a thickness of 0.22 mm as a metal foil clad laminate. . The properties of the obtained copper foil clad laminates were evaluated by the methods described below. Table 1 shows the evaluation results.

[Tg and loss modulus]
After cutting the obtained copper foil-clad laminate into a size of 12.7 mm×30 mm with a dicing saw, the copper foil on the surface was removed by etching to obtain a sample for measurement. Using this measurement sample, the loss elastic modulus E'' is measured by the DMA method using a dynamic viscoelasticity analyzer (manufactured by TA Instruments) in accordance with JIS C6481 (1996). ' was defined as Tg (unit: °C). Also, the loss elastic modulus L (max) at the maximum point, the loss elastic modulus L (100) at 100 ° C., the loss elastic modulus L (150) at 150 ° C. and the loss elastic modulus L (200) obtained by the measurement From the values, L(100)/L(max), L(150)/L(max) and L(200)/L(max) were calculated respectively.

[Coefficient of linear thermal expansion (CTE)]
The coefficient of linear thermal expansion in the longitudinal direction of the glass cloth was measured for the insulating layer of the laminate. Specifically, after removing the copper foil on both sides of the copper foil-clad laminate (10 mm × 6 mm × 0.22 mm) obtained above by etching, it was heated in a constant temperature bath at 220 ° C. for 2 hours and molded. Removed the stress. After that, using a thermal expansion measuring device (horizontal dilatometer manufactured by Linseis), the temperature was raised from 40 ° C. to 320 ° C. at 10 ° C. per minute, and the coefficient of linear thermal expansion (CTE) (unit: ppm/°C) was measured.

INDUSTRIAL APPLICABILITY The present invention has industrial applicability as prepregs, metal foil-clad laminates, printed wiring boards, and the like.

Claims (24)

A prepreg comprising a base material and a thermosetting resin composition impregnated or applied to the base material,
A cured product for evaluation obtained by thermally curing the prepreg under conditions of 230° C./100 minutes satisfies the following conditions (1) to (4),
A prepreg in which the thermosetting resin composition contains a polymer D containing structural units derived from alkenylphenol A, structural units derived from epoxy-modified silicone B, and structural units derived from epoxy compound C.
(1) The loss elastic modulus of the cured product for evaluation measured by the DMA method according to JIS C6481 (1996) has a maximum point at 200°C or higher.
(2) The ratio of the loss elastic modulus L (100) of the cured product for evaluation at 100 ° C. measured by the DMA method to the loss elastic modulus L (max) of the cured product for evaluation at the maximum point is L(100)/L(max) is 0.70 or more.
(3) The ratio of the loss elastic modulus L (150) of the cured product for evaluation at 150 ° C. measured by the DMA method and the L (max) is 0 as L (150) / L (max) .60 or higher.
(4) The ratio of the loss elastic modulus L (200) of the cured product for evaluation at 200 ° C. measured by the DMA method and the L (max) is 0 as L (200) / L (max) .70 or higher. The prepreg according to claim 1 , wherein the thermosetting resin composition further comprises an aromatic phosphorus compound P. The prepreg according to claim 2 , wherein the aromatic phosphorus compound P contains at least one selected from the group consisting of a cyclic phosphazene compound, a phosphate ester compound and a phosphite ester compound. 4. The prepreg according to claim 2 , wherein the content of said aromatic phosphorus compound P in said thermosetting resin composition is 3 to 15 parts by mass with respect to 100 parts by mass of resin solid content. wherein the thermosetting resin composition further comprises at least one compound E selected from the group consisting of a maleimide compound, a cyanate ester compound, a phenol compound A' other than the alkenylphenol A, and an alkenyl-substituted nadimide compound. Item 3. The prepreg according to Item 1 or 2 . The prepreg according to claim 5 , wherein the cyanate ester compound comprises a naphthol aralkyl-type cyanate ester compound and/or a novolak-type cyanate ester compound. The maleimide compounds include bis(4-maleimidophenyl)methane, 2,2-bis{4-(4-maleimidophenoxy)-phenyl}propane, bis(3-ethyl-5-methyl-4-maleimidophenyl)methane, The prepreg according to claim 5 , comprising at least one selected from the group consisting of a maleimide compound represented by the following formula (3) and a maleimide compound represented by the following formula (3').

(In formula (3), each R ₅ independently represents a hydrogen atom or a methyl group, and n ₁ represents an integer of 1 or more.)

(In formula (3'), each R ¹³ independently represents a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, or a phenyl group, and n ⁴ represents an integer of 1 or more and 10 or less.). The prepreg according to claim 5 , wherein the content of the polymer D in the thermosetting resin composition is 5 to 60% by mass with respect to the total 100% by mass of the polymer D and the compound E. . 3. The prepreg according to claim 1 , wherein the polymer D has a weight average molecular weight of 3.0×10 ³ to 5.0×10 ⁴ . 3. The prepreg according to claim 1 , wherein the content of structural units derived from the epoxy-modified silicone B in the polymer D is 20 to 60% by mass with respect to the total mass of the polymer D. The prepreg according to claim 1 or 2 , wherein the epoxy-modified silicone B contains an epoxy-modified silicone represented by the following formula (1).

(1)
(In formula (1) above, each R ¹ independently represents a single bond, an alkylene group, an arylene group or an aralkylene group, and each R ² independently represents an alkyl group having 1 to 10 carbon atoms or a phenyl group. and n is an integer from 0 to 100.) The prepreg according to claim 1 or 2 , wherein the epoxy-modified silicone B contains an epoxy-modified silicone having an epoxy equivalent of 140-250 g/mol. The prepreg according to claim 1 or 2 , wherein said alkenylphenol A contains diallyl bisphenol and/or dipropenyl bisphenol. The prepreg according to claim 1 or 2 , wherein the epoxy compound C contains a biphenyl type epoxy resin. 3. The thermosetting resin composition according to claim 1 or 2 , further comprising at least one selected from the group consisting of alkenylphenol A, epoxy-modified silicone B, and an epoxy compound C other than the epoxy-modified silicone B. Prepreg as described. 16. The prepreg according to claim 15 , wherein the epoxy compound C comprises a naphthylene ether type epoxy resin and/or a naphthalene cresol novolac type epoxy resin. 6. The thermosetting resin composition according to claim 5 , wherein the thermosetting resin composition further contains at least one selected from the group consisting of alkenylphenol A, epoxy-modified silicone B, and an epoxy compound C other than the epoxy-modified silicone B. prepreg. 18. The prepreg according to claim 17 , wherein the epoxy compound C comprises a naphthylene ether type epoxy resin and/or a naphthalene cresol novolac type epoxy resin. The thermosetting resin composition further contains an inorganic filler,
The prepreg according to claim 1 or 2 , wherein the content of the inorganic filler is 50 to 1000 parts by mass with respect to 100 parts by mass of resin solid content. The prepreg according to claim 19 , wherein the inorganic filler contains at least one selected from the group consisting of silicas, boehmite and alumina. A prepreg comprising a base material and a thermosetting resin composition impregnated or applied to the base material,
A cured product for evaluation obtained by thermally curing the prepreg under conditions of 230° C./100 minutes satisfies the following conditions (1) to (4),
A prepreg, wherein the thermosetting resin composition contains alkenylphenol A, epoxy-modified silicone B, and an epoxy compound C other than the epoxy-modified silicone B.
(1) The loss elastic modulus of the cured product for evaluation measured by the DMA method according to JIS C6481 (1996) has a maximum point at 200°C or higher.
(2) The ratio of the loss elastic modulus L (100) of the cured product for evaluation at 100 ° C. measured by the DMA method to the loss elastic modulus L (max) of the cured product for evaluation at the maximum point is L(100)/L(max) is 0.70 or more.
(3) The ratio of the loss elastic modulus L (150) of the cured product for evaluation at 150 ° C. measured by the DMA method and the L (max) is 0 as L (150) / L (max) .60 or higher.
(4) The ratio of the loss elastic modulus L (200) of the cured product for evaluation at 200 ° C. measured by the DMA method and the L (max) is 0 as L (200) / L (max) .70 or higher. A cured product obtained by curing the prepreg according to claim 1 . a laminate comprising the prepreg according to claim 1 and/or the cured product according to claim 22 ;
a metal foil disposed on one side or both sides of the laminate;
A metal foil clad laminate comprising: An insulating layer containing the cured product according to claim 22 ,
a conductor layer formed on the surface of the insulating layer;
printed wiring boards, including;