JP7274056B1 - 配線板 - Google Patents

配線板 Download PDF

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Publication number
JP7274056B1
JP7274056B1 JP2022554448A JP2022554448A JP7274056B1 JP 7274056 B1 JP7274056 B1 JP 7274056B1 JP 2022554448 A JP2022554448 A JP 2022554448A JP 2022554448 A JP2022554448 A JP 2022554448A JP 7274056 B1 JP7274056 B1 JP 7274056B1
Authority
JP
Japan
Prior art keywords
wiring
wiring portion
signal
substrate
point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022554448A
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English (en)
Japanese (ja)
Other versions
JPWO2023170895A1 (https=
JPWO2023170895A5 (https=
Inventor
幸司 宮川
哲 大和田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Application granted granted Critical
Publication of JP7274056B1 publication Critical patent/JP7274056B1/ja
Publication of JPWO2023170895A1 publication Critical patent/JPWO2023170895A1/ja
Publication of JPWO2023170895A5 publication Critical patent/JPWO2023170895A5/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P9/00—Delay lines of the waveguide type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P9/00—Delay lines of the waveguide type
    • H01P9/02—Helical lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0228—Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09263—Meander

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Structure Of Printed Boards (AREA)
  • Waveguides (AREA)
JP2022554448A 2022-03-11 2022-03-11 配線板 Active JP7274056B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/010751 WO2023170895A1 (ja) 2022-03-11 2022-03-11 配線板

Publications (3)

Publication Number Publication Date
JP7274056B1 true JP7274056B1 (ja) 2023-05-15
JPWO2023170895A1 JPWO2023170895A1 (https=) 2023-09-14
JPWO2023170895A5 JPWO2023170895A5 (https=) 2024-02-14

Family

ID=86321970

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022554448A Active JP7274056B1 (ja) 2022-03-11 2022-03-11 配線板

Country Status (6)

Country Link
US (1) US20240397611A1 (https=)
JP (1) JP7274056B1 (https=)
KR (1) KR102730729B1 (https=)
CN (1) CN118830334A (https=)
DE (1) DE112022006365T5 (https=)
WO (1) WO2023170895A1 (https=)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4899436U (https=) * 1972-02-25 1973-11-24
JPH08114667A (ja) * 1994-10-13 1996-05-07 Honda Motor Co Ltd レーダーモジュール
JP2004063698A (ja) * 2002-07-26 2004-02-26 Murata Mfg Co Ltd 積層インダクタ及びその外部電極端子形成方法
US6828876B1 (en) * 2001-11-02 2004-12-07 Thin Film Technology Corp. Tapered delay line
US20100060379A1 (en) * 2008-09-05 2010-03-11 Asustek Computer Inc. Delay line for printed circuit broad
JP2020202382A (ja) * 2013-02-19 2020-12-17 株式会社村田製作所 インダクタブリッジおよび電子機器

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006173401A (ja) 2004-12-16 2006-06-29 Canon Inc プリント配線板
JP2007335811A (ja) * 2006-06-19 2007-12-27 Matsushita Electric Ind Co Ltd プリント配線板及び電子機器
JP6620565B2 (ja) * 2016-01-20 2019-12-18 セイコーエプソン株式会社 プリント配線板、情報通信装置、および表示システム
JP2018078495A (ja) * 2016-11-10 2018-05-17 住友電気工業株式会社 増幅回路および光送信装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4899436U (https=) * 1972-02-25 1973-11-24
JPH08114667A (ja) * 1994-10-13 1996-05-07 Honda Motor Co Ltd レーダーモジュール
US6828876B1 (en) * 2001-11-02 2004-12-07 Thin Film Technology Corp. Tapered delay line
JP2004063698A (ja) * 2002-07-26 2004-02-26 Murata Mfg Co Ltd 積層インダクタ及びその外部電極端子形成方法
US20100060379A1 (en) * 2008-09-05 2010-03-11 Asustek Computer Inc. Delay line for printed circuit broad
JP2020202382A (ja) * 2013-02-19 2020-12-17 株式会社村田製作所 インダクタブリッジおよび電子機器

Also Published As

Publication number Publication date
CN118830334A (zh) 2024-10-22
DE112022006365T5 (de) 2024-10-31
JPWO2023170895A1 (https=) 2023-09-14
WO2023170895A1 (ja) 2023-09-14
KR20240138118A (ko) 2024-09-20
US20240397611A1 (en) 2024-11-28
KR102730729B1 (ko) 2024-11-14

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