JP7233813B2 - 加工装置 - Google Patents

加工装置 Download PDF

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Publication number
JP7233813B2
JP7233813B2 JP2018227441A JP2018227441A JP7233813B2 JP 7233813 B2 JP7233813 B2 JP 7233813B2 JP 2018227441 A JP2018227441 A JP 2018227441A JP 2018227441 A JP2018227441 A JP 2018227441A JP 7233813 B2 JP7233813 B2 JP 7233813B2
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JP
Japan
Prior art keywords
workpiece
cassette
guide rail
moving
contact
Prior art date
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Active
Application number
JP2018227441A
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English (en)
Japanese (ja)
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JP2020092143A (ja
Inventor
云峰 楊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Priority to JP2018227441A priority Critical patent/JP7233813B2/ja
Priority to KR1020190151532A priority patent/KR20200067747A/ko
Publication of JP2020092143A publication Critical patent/JP2020092143A/ja
Application granted granted Critical
Publication of JP7233813B2 publication Critical patent/JP7233813B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Dicing (AREA)
JP2018227441A 2018-12-04 2018-12-04 加工装置 Active JP7233813B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2018227441A JP7233813B2 (ja) 2018-12-04 2018-12-04 加工装置
KR1020190151532A KR20200067747A (ko) 2018-12-04 2019-11-22 가공 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018227441A JP7233813B2 (ja) 2018-12-04 2018-12-04 加工装置

Publications (2)

Publication Number Publication Date
JP2020092143A JP2020092143A (ja) 2020-06-11
JP7233813B2 true JP7233813B2 (ja) 2023-03-07

Family

ID=71013136

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018227441A Active JP7233813B2 (ja) 2018-12-04 2018-12-04 加工装置

Country Status (2)

Country Link
JP (1) JP7233813B2 (ko)
KR (1) KR20200067747A (ko)

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000232080A (ja) 1999-02-10 2000-08-22 Disco Abrasive Syst Ltd 被加工物の分割システム及びペレットの移し替え装置
JP2002231801A (ja) 2001-01-30 2002-08-16 Kondo Seisakusho:Kk 半導体基板搬送用フィンガ
JP2007321242A (ja) 2006-06-05 2007-12-13 Marunaka Kogyo Kk 電気メッキ装置におけるクリップ式のワークハンガー
JP2011192781A (ja) 2010-03-15 2011-09-29 Disco Corp パッケージ基板の加工方法
JP2013026270A (ja) 2011-07-15 2013-02-04 Hitachi High-Tech Instruments Co Ltd フレーム供給装置およびフレーム供給方法
JP2013033882A (ja) 2011-08-03 2013-02-14 Disco Abrasive Syst Ltd パッケージ基板分割装置
JP2013222953A (ja) 2012-04-19 2013-10-28 Seiko Epson Corp 基板搬送装置及び基板処理装置
JP2015095515A (ja) 2013-11-11 2015-05-18 株式会社ディスコ 切削装置及び切削方法
JP2016207987A (ja) 2015-04-28 2016-12-08 株式会社ディスコ 切削装置
JP2017008346A (ja) 2015-06-18 2017-01-12 大日本印刷株式会社 基板搬送装置および保持部
JP2017112228A (ja) 2015-12-16 2017-06-22 株式会社ディスコ 加工装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014204020A (ja) 2013-04-08 2014-10-27 株式会社ディスコ 加工装置

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000232080A (ja) 1999-02-10 2000-08-22 Disco Abrasive Syst Ltd 被加工物の分割システム及びペレットの移し替え装置
JP2002231801A (ja) 2001-01-30 2002-08-16 Kondo Seisakusho:Kk 半導体基板搬送用フィンガ
JP2007321242A (ja) 2006-06-05 2007-12-13 Marunaka Kogyo Kk 電気メッキ装置におけるクリップ式のワークハンガー
JP2011192781A (ja) 2010-03-15 2011-09-29 Disco Corp パッケージ基板の加工方法
JP2013026270A (ja) 2011-07-15 2013-02-04 Hitachi High-Tech Instruments Co Ltd フレーム供給装置およびフレーム供給方法
JP2013033882A (ja) 2011-08-03 2013-02-14 Disco Abrasive Syst Ltd パッケージ基板分割装置
JP2013222953A (ja) 2012-04-19 2013-10-28 Seiko Epson Corp 基板搬送装置及び基板処理装置
JP2015095515A (ja) 2013-11-11 2015-05-18 株式会社ディスコ 切削装置及び切削方法
JP2016207987A (ja) 2015-04-28 2016-12-08 株式会社ディスコ 切削装置
JP2017008346A (ja) 2015-06-18 2017-01-12 大日本印刷株式会社 基板搬送装置および保持部
JP2017112228A (ja) 2015-12-16 2017-06-22 株式会社ディスコ 加工装置

Also Published As

Publication number Publication date
JP2020092143A (ja) 2020-06-11
KR20200067747A (ko) 2020-06-12

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