JP7197057B2 - 伝送線路 - Google Patents

伝送線路 Download PDF

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Publication number
JP7197057B2
JP7197057B2 JP2022521921A JP2022521921A JP7197057B2 JP 7197057 B2 JP7197057 B2 JP 7197057B2 JP 2022521921 A JP2022521921 A JP 2022521921A JP 2022521921 A JP2022521921 A JP 2022521921A JP 7197057 B2 JP7197057 B2 JP 7197057B2
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JP
Japan
Prior art keywords
conductor
connection
connection electrode
ground conductor
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022521921A
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English (en)
Japanese (ja)
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JPWO2021230224A5 (https=
JPWO2021230224A1 (https=
Inventor
賢二 松田
卓哉 橋本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of JPWO2021230224A1 publication Critical patent/JPWO2021230224A1/ja
Publication of JPWO2021230224A5 publication Critical patent/JPWO2021230224A5/ja
Application granted granted Critical
Publication of JP7197057B2 publication Critical patent/JP7197057B2/ja
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/026—Coplanar striplines [CPS]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/48—Earthing means; Earth screens; Counterpoises
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09281—Layout details of a single conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Structure Of Printed Boards (AREA)
  • Waveguides (AREA)
JP2022521921A 2020-05-15 2021-05-11 伝送線路 Active JP7197057B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020085754 2020-05-15
JP2020085754 2020-05-15
PCT/JP2021/017809 WO2021230224A1 (ja) 2020-05-15 2021-05-11 伝送線路

Publications (3)

Publication Number Publication Date
JPWO2021230224A1 JPWO2021230224A1 (https=) 2021-11-18
JPWO2021230224A5 JPWO2021230224A5 (https=) 2022-12-08
JP7197057B2 true JP7197057B2 (ja) 2022-12-27

Family

ID=78525887

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022521921A Active JP7197057B2 (ja) 2020-05-15 2021-05-11 伝送線路

Country Status (4)

Country Link
US (1) US12191553B2 (https=)
JP (1) JP7197057B2 (https=)
CN (1) CN218827761U (https=)
WO (1) WO2021230224A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025069696A (ja) * 2023-10-18 2025-05-01 キヤノン株式会社 伝送装置及び伝送システム

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002184898A (ja) 2000-10-04 2002-06-28 Murata Mfg Co Ltd 高周波モジュール
JP2007287916A (ja) 2006-04-17 2007-11-01 Fujitsu Ltd 電子部品パッケージ
WO2014050238A1 (ja) 2012-09-28 2014-04-03 株式会社村田製作所 信号線路モジュールおよび通信端末装置
WO2019189050A1 (ja) 2018-03-30 2019-10-03 株式会社村田製作所 アンテナモジュールおよびそれを搭載した通信装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4004048B2 (ja) * 2003-04-11 2007-11-07 Ｔｄｋ株式会社 高周波伝送線路
JP4574322B2 (ja) 2004-10-21 2010-11-04 大日本印刷株式会社 インピーダンスコントロール配線板の製造方法
JP2009004809A (ja) 2008-09-16 2009-01-08 Kyocera Corp 配線基板
JP5730152B2 (ja) 2011-07-26 2015-06-03 京セラサーキットソリューションズ株式会社 配線基板
WO2016163436A1 (ja) 2015-04-09 2016-10-13 株式会社村田製作所 複合伝送線路および電子機器
CN207009625U (zh) 2015-09-25 2018-02-13 株式会社村田制作所 天线模块以及电子设备
JP6950747B2 (ja) * 2017-11-16 2021-10-13 株式会社村田製作所 樹脂多層基板、電子部品およびその実装構造
JP2019106680A (ja) 2017-12-14 2019-06-27 日本電信電話株式会社 高周波伝送線路
CN217062469U (zh) * 2019-10-02 2022-07-26 株式会社村田制作所 传输线路以及电路基板
JP7180788B2 (ja) * 2019-11-15 2022-11-30 株式会社村田製作所 伝送線路及び電子機器

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002184898A (ja) 2000-10-04 2002-06-28 Murata Mfg Co Ltd 高周波モジュール
JP2007287916A (ja) 2006-04-17 2007-11-01 Fujitsu Ltd 電子部品パッケージ
WO2014050238A1 (ja) 2012-09-28 2014-04-03 株式会社村田製作所 信号線路モジュールおよび通信端末装置
WO2019189050A1 (ja) 2018-03-30 2019-10-03 株式会社村田製作所 アンテナモジュールおよびそれを搭載した通信装置

Also Published As

Publication number Publication date
US12191553B2 (en) 2025-01-07
CN218827761U (zh) 2023-04-07
WO2021230224A1 (ja) 2021-11-18
US20230066411A1 (en) 2023-03-02
JPWO2021230224A1 (https=) 2021-11-18

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