JP7097670B2 - スパッタリングターゲット及びその製造方法 - Google Patents

スパッタリングターゲット及びその製造方法 Download PDF

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Publication number
JP7097670B2
JP7097670B2 JP2016574826A JP2016574826A JP7097670B2 JP 7097670 B2 JP7097670 B2 JP 7097670B2 JP 2016574826 A JP2016574826 A JP 2016574826A JP 2016574826 A JP2016574826 A JP 2016574826A JP 7097670 B2 JP7097670 B2 JP 7097670B2
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Prior art keywords
target
base material
target members
less
surface roughness
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Japanese (ja)
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JPWO2016129622A1 (ja
Inventor
幸三 長田
純 梶山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JX Nippon Mining and Metals Corp
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JX Nippon Mining and Metals Corp
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Ceramic Products (AREA)
JP2016574826A 2015-02-13 2016-02-10 スパッタリングターゲット及びその製造方法 Active JP7097670B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015026552 2015-02-13
JP2015026552 2015-02-13
PCT/JP2016/053897 WO2016129622A1 (ja) 2015-02-13 2016-02-10 スパッタリングターゲット及びその製造方法

Related Child Applications (1)

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JP2020072864A Division JP7101717B2 (ja) 2015-02-13 2020-04-15 スパッタリングターゲット及びその製造方法

Publications (2)

Publication Number Publication Date
JPWO2016129622A1 JPWO2016129622A1 (ja) 2018-01-11
JP7097670B2 true JP7097670B2 (ja) 2022-07-08

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ID=56614702

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JP2016574826A Active JP7097670B2 (ja) 2015-02-13 2016-02-10 スパッタリングターゲット及びその製造方法
JP2020072864A Active JP7101717B2 (ja) 2015-02-13 2020-04-15 スパッタリングターゲット及びその製造方法

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JP2020072864A Active JP7101717B2 (ja) 2015-02-13 2020-04-15 スパッタリングターゲット及びその製造方法

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JP (2) JP7097670B2 (zh)
TW (1) TWI704245B (zh)
WO (1) WO2016129622A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6220091B1 (ja) * 2017-03-22 2017-10-25 Ｊｘ金属株式会社 スパッタリングターゲット及び、その製造方法
JP7158316B2 (ja) * 2019-03-05 2022-10-21 Ｊｘ金属株式会社 スパッタリングターゲット及びその製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004315931A (ja) 2003-04-18 2004-11-11 Dainippon Printing Co Ltd スパッタリングターゲット
JP2008523251A (ja) 2004-12-14 2008-07-03 ヴェー ツェー ヘレーウス ゲゼルシャフト ミット ベシュレンクテル ハフツング ターゲット管と支持管との間に配置された結合層を備える管状ターゲット
JP2008184640A (ja) 2007-01-29 2008-08-14 Tosoh Corp 円筒形スパッタリングターゲット及びその製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11236664A (ja) * 1998-02-24 1999-08-31 Mitsui Chem Inc スパッタリング用ターゲットのバッキングプレート
JP4470029B2 (ja) * 1999-06-01 2010-06-02 東ソー株式会社 分割ｉｔｏスパッタリングターゲット
JP3724346B2 (ja) * 2000-07-10 2005-12-07 東ソー株式会社 スパッタリングターゲットおよびその製造方法
JP5467735B2 (ja) * 2007-07-02 2014-04-09 東ソー株式会社 円筒形スパッタリングターゲット
JP5482020B2 (ja) * 2008-09-25 2014-04-23 東ソー株式会社 円筒形スパッタリングターゲット及びその製造方法
WO2011062002A1 (ja) * 2009-11-20 2011-05-26 Jx日鉱日石金属株式会社 スパッタリングターゲット－バッキングプレート接合体及びその製造方法
JP2013253298A (ja) 2012-06-08 2013-12-19 Ulvac Japan Ltd ターゲットユニットの製造方法及びターゲットユニットの製造装置
JP2014105383A (ja) * 2012-11-29 2014-06-09 Tosoh Corp 円筒型スパッタリングターゲットおよびその製造方法
JP2015183284A (ja) * 2014-03-26 2015-10-22 住友金属鉱山株式会社 円筒形スパッタリングターゲットおよびその製造方法
JP5781714B1 (ja) * 2015-04-23 2015-09-24 Jx日鉱日石金属株式会社 スパッタリングターゲット及びその製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004315931A (ja) 2003-04-18 2004-11-11 Dainippon Printing Co Ltd スパッタリングターゲット
JP2008523251A (ja) 2004-12-14 2008-07-03 ヴェー ツェー ヘレーウス ゲゼルシャフト ミット ベシュレンクテル ハフツング ターゲット管と支持管との間に配置された結合層を備える管状ターゲット
JP2008184640A (ja) 2007-01-29 2008-08-14 Tosoh Corp 円筒形スパッタリングターゲット及びその製造方法

Also Published As

Publication number Publication date
JP7101717B2 (ja) 2022-07-15
TW201629251A (zh) 2016-08-16
TWI704245B (zh) 2020-09-11
WO2016129622A1 (ja) 2016-08-18
JPWO2016129622A1 (ja) 2018-01-11
JP2020111837A (ja) 2020-07-27

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