JP7067674B2 - 圧力検出装置、圧力検出システム、及び圧力検出装置の製造方法 - Google Patents

圧力検出装置、圧力検出システム、及び圧力検出装置の製造方法 Download PDF

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JP7067674B2
JP7067674B2 JP2021524671A JP2021524671A JP7067674B2 JP 7067674 B2 JP7067674 B2 JP 7067674B2 JP 2021524671 A JP2021524671 A JP 2021524671A JP 2021524671 A JP2021524671 A JP 2021524671A JP 7067674 B2 JP7067674 B2 JP 7067674B2
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Prior art keywords
pressure
layer
sensitive
deformed
detection device
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Japanese (ja)
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JPWO2020246084A1 (https=
JPWO2020246084A5 (https=
Inventor
真奈 橋本
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NEC Corp
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NEC Corp
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measurement Of Radiation (AREA)
  • Manipulator (AREA)
  • Force Measurement Appropriate To Specific Purposes (AREA)
JP2021524671A 2019-06-03 2020-02-27 圧力検出装置、圧力検出システム、及び圧力検出装置の製造方法 Active JP7067674B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019103564 2019-06-03
JP2019103564 2019-06-03
PCT/JP2020/007949 WO2020246084A1 (ja) 2019-06-03 2020-02-27 圧力検出装置、圧力検出システム、及び圧力検出装置の製造方法

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JPWO2020246084A1 JPWO2020246084A1 (https=) 2020-12-10
JPWO2020246084A5 JPWO2020246084A5 (https=) 2022-02-16
JP7067674B2 true JP7067674B2 (ja) 2022-05-16

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US (1) US20220316965A1 (https=)
JP (1) JP7067674B2 (https=)
WO (1) WO2020246084A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202424442A (zh) * 2022-11-30 2024-06-16 致伸科技股份有限公司 壓力感測式按鍵模組及其壓力感測式開關結構

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4644101A (en) * 1985-12-11 1987-02-17 At&T Bell Laboratories Pressure-responsive position sensor
JPH0654269B2 (ja) * 1988-04-05 1994-07-20 株式会社エニックス 凹凸面圧力分布検出用感圧板
US6715359B2 (en) * 2001-06-28 2004-04-06 Tactex Controls Inc. Pressure sensitive surfaces
US20050093690A1 (en) * 2003-09-11 2005-05-05 Joseph Miglionico Pressure-detection device and method
US9524020B2 (en) * 2010-10-12 2016-12-20 New York University Sensor having a mesh layer with protrusions, and method
JP2012122823A (ja) * 2010-12-08 2012-06-28 Seiko Epson Corp 検出装置、電子機器、及びロボット
US10064502B1 (en) * 2015-06-19 2018-09-04 Amazon Technologies, Inc. Shelf with integrated electronics
EP3353756A4 (en) * 2015-09-24 2019-05-01 T+Ink, Inc. METHOD FOR PROCESSING DATA FROM AN INTELLIGENT SHELF AND DISPATCHING A CODE
WO2017061799A1 (ko) * 2015-10-06 2017-04-13 엘지이노텍 주식회사 압력 감지 의자
JP6741995B2 (ja) * 2016-04-15 2020-08-19 パナソニックＩｐマネジメント株式会社 フレキシブルタッチセンサおよびその製造方法
US11346727B2 (en) * 2016-09-27 2022-05-31 Sony Corporation Sensor, electronic device, wearable terminal, and control method
GB201621094D0 (en) * 2016-12-12 2017-01-25 Altro Ltd Improvements in or relating to floor coverings
KR102520722B1 (ko) * 2018-04-05 2023-04-11 삼성디스플레이 주식회사 압력 센서
CN208140284U (zh) * 2018-05-25 2018-11-23 北京京东方技术开发有限公司 一种压力感应器件

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US20220316965A1 (en) 2022-10-06
JPWO2020246084A1 (https=) 2020-12-10
WO2020246084A1 (ja) 2020-12-10

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