JP6985072B2 - リードフレーム及びその製造方法 - Google Patents
リードフレーム及びその製造方法 Download PDFInfo
- Publication number
- JP6985072B2 JP6985072B2 JP2017171314A JP2017171314A JP6985072B2 JP 6985072 B2 JP6985072 B2 JP 6985072B2 JP 2017171314 A JP2017171314 A JP 2017171314A JP 2017171314 A JP2017171314 A JP 2017171314A JP 6985072 B2 JP6985072 B2 JP 6985072B2
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- Prior art keywords
- lead frame
- plate
- layer
- shaped portion
- processed
- Prior art date
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- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
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Description
[リードフレームの構造]
図1は、第1の実施の形態に係るリードフレームを例示する平面図である。図1を参照するに、リードフレーム1は、平面視略矩形状の基板フレーム10に、複数の単位リードフレーム群20が離間して配列された構造を有している。
次に、第1の実施の形態に係るリードフレームの製造方法について、単位リードフレーム30を図示しながら説明する。図4〜図6は、第1の実施の形態に係るリードフレームの製造工程を例示する図であり、図2(b)に対応する断面を示している。
第1の実施の形態の変形例1では、第1の実施の形態とは金属膜の形成領域が異なるリードフレームの例を示す。なお、第1の実施の形態の変形例1において、既に説明した実施の形態と同一構成部についての説明は省略する場合がある。
第1の実施の形態の変形例2では、第1の実施の形態の変形例1の製造工程の順番を変更する例を示す。なお、第1の実施の形態の変形例2において、既に説明した実施の形態と同一構成部についての説明は省略する場合がある。
第2の実施の形態では、第1の実施の形態とはタイプの異なるリードフレームの例を示す。なお、第2の実施の形態において、既に説明した実施の形態と同一構成部についての説明は省略する場合がある。
次に、第2の実施の形態に係るリードフレームの製造方法について、単位リードフレーム90を図示しながら説明する。図17〜図22は、第2の実施の形態に係るリードフレームの製造工程を例示する図である。
第2の実施の形態の変形例では、枠部91の下面側をハーフエッチングしたリードフレームの例を示す。なお、第2の実施の形態の変形例において、既に説明した実施の形態と同一構成部についての説明は省略する場合がある。
C194材で作製された縦80mm×横250mm×厚さ0.127mmの板材を準備し、第1の実施の形態の図4(a)〜図5(b)の工程を実行した。そして、図5(c)の工程として、図5(b)に示す構造体を常温において塩化第二銅水溶液からなる化学研磨液に20秒浸漬させ、板状部31の下面側の表層に形成された加工変質層200を除去した。その後、塩酸洗浄及び水洗を実施し、レジスト320を剥離した。更に、硫酸洗浄及び水洗を実施後、乾燥させて、図5(d)に示す構造体を得た。なお、図5(d)に示す構造体は、6個作製した。
2、2A、2B、2C 半導体装置
10 基板フレーム
10x スリット
20 単位リードフレーム群
30、30A、90、90A 単位リードフレーム
31 板状部
32 突起部
33、34、35、96、97 金属膜
40 半導体チップ
41 電極端子
50 接着材
60 金属線
70 樹脂部
80 はんだバンプ
91 枠部
92 第1リード
93 第1接続端子
94 第2リード
95 第2接続端子
200 加工変質層
210 ベイルビー層
220 微細結晶層
311 チップ搭載部
321 接続端子
Claims (10)
- 表層に加工変質層が形成された加工変質層形成領域と、表層に加工変質層が形成されていない加工変質層非形成領域と、を有するリードフレームであって、
板状部と、
前記板状部と一体に形成され、前記板状部の一の面から突起する突起部と、を有し、
前記突起部の先端面は、前記加工変質層形成領域であり、
前記板状部の前記一の面の前記突起部が形成されていない領域は、前記加工変質層非形成領域であり、
前記板状部の一の面と対向する他の面は、前記加工変質層非形成領域を有するリードフレーム。 - 前記突起部の前記加工変質層形成領域に形成された第1金属膜と、
前記板状部の前記他の面に形成された第2金属膜と、を有する請求項1に記載のリードフレーム。 - 前記第2金属膜は、前記板状部の前記他の面の、前記第1金属膜と平面視で重複する領域に形成されている請求項2に記載のリードフレーム。
- 前記板状部の前記他の面の全面は、前記加工変質層非形成領域である請求項1乃至3の何れか一項に記載のリードフレーム。
- 前記第2金属膜は、前記加工変質層形成領域に形成されている請求項2又は3に記載のリードフレーム。
- 前記板状部の前記他の面の前記第2金属膜が形成されていない領域は、前記加工変質層非形成領域である請求項5に記載のリードフレーム。
- 両面側の表層に加工変質層が形成された金属板をエッチングし、板状部、及び前記板状部の一の面から突起する突起部、を形成する工程と、
前記板状部の他の面をエッチングし、前記他の面側の表層に形成されている前記加工変質層を除去する工程と、を有し、
前記突起部の先端面は、表層に加工変質層が形成された加工変質層形成領域となり、
前記板状部の前記一の面の前記突起部が形成されていない領域は、表層に加工変質層が形成されていない加工変質層非形成領域となるリードフレームの製造方法。 - 前記加工変質層を除去する工程では、前記板状部の前記他の面側の全面の表層に形成されている前記加工変質層を除去し、
前記加工変質層を除去する工程よりも後に、
前記突起部の前記加工変質層形成領域に第1金属膜を形成する工程と、
前記板状部の前記他の面の前記加工変質層非形成領域に第2金属膜を形成する工程と、を有する請求項7に記載のリードフレームの製造方法。 - 前記突起部の前記加工変質層形成領域に第1金属膜を形成する工程と、
前記板状部の前記他の面の前記加工変質層形成領域に第2金属膜を形成する工程と、を有し、
前記第1金属膜を形成する工程及び前記第2金属膜を形成する工程よりも後に、前記加工変質層を除去する工程を実行し、前記板状部の前記他の面の前記第2金属膜が形成されていない領域の前記加工変質層を除去する請求項7に記載のリードフレームの製造方法。 - 前記第2金属膜は、前記板状部の前記他の面の、前記第1金属膜と平面視で重複する領域に形成される請求項8又は9に記載のリードフレームの製造方法。
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JP2017171314A JP6985072B2 (ja) | 2017-09-06 | 2017-09-06 | リードフレーム及びその製造方法 |
US16/106,460 US10381292B2 (en) | 2017-09-06 | 2018-08-21 | Lead frame and method of manufacturing lead frame |
TW107129577A TWI805606B (zh) | 2017-09-06 | 2018-08-24 | 引線框架及其製造方法 |
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