JP6869279B2 - 基板処理装置および基板処理方法 - Google Patents

基板処理装置および基板処理方法 Download PDF

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Publication number
JP6869279B2
JP6869279B2 JP2019027647A JP2019027647A JP6869279B2 JP 6869279 B2 JP6869279 B2 JP 6869279B2 JP 2019027647 A JP2019027647 A JP 2019027647A JP 2019027647 A JP2019027647 A JP 2019027647A JP 6869279 B2 JP6869279 B2 JP 6869279B2
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JP
Japan
Prior art keywords
substrate
stage
moving
straightening member
straightening
Prior art date
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Active
Application number
JP2019027647A
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English (en)
Japanese (ja)
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JP2020136480A (ja
Inventor
上野　幸一
幸一 上野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Screen Holdings Co Ltd
Original Assignee
Screen Holdings Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Screen Holdings Co Ltd filed Critical Screen Holdings Co Ltd
Priority to JP2019027647A priority Critical patent/JP6869279B2/ja
Priority to CN201911203575.2A priority patent/CN111584391B/zh
Priority to TW108144463A priority patent/TWI743614B/zh
Priority to KR1020200004777A priority patent/KR102323711B1/ko
Publication of JP2020136480A publication Critical patent/JP2020136480A/ja
Application granted granted Critical
Publication of JP6869279B2 publication Critical patent/JP6869279B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0254—Coating heads with slot-shaped outlet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
JP2019027647A 2019-02-19 2019-02-19 基板処理装置および基板処理方法 Active JP6869279B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2019027647A JP6869279B2 (ja) 2019-02-19 2019-02-19 基板処理装置および基板処理方法
CN201911203575.2A CN111584391B (zh) 2019-02-19 2019-11-29 基板处理装置及基板处理方法
TW108144463A TWI743614B (zh) 2019-02-19 2019-12-05 基板處理裝置及基板處理方法
KR1020200004777A KR102323711B1 (ko) 2019-02-19 2020-01-14 기판 처리 장치 및 기판 처리 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019027647A JP6869279B2 (ja) 2019-02-19 2019-02-19 基板処理装置および基板処理方法

Publications (2)

Publication Number Publication Date
JP2020136480A JP2020136480A (ja) 2020-08-31
JP6869279B2 true JP6869279B2 (ja) 2021-05-12

Family

ID=72111383

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019027647A Active JP6869279B2 (ja) 2019-02-19 2019-02-19 基板処理装置および基板処理方法

Country Status (4)

Country Link
JP (1) JP6869279B2 (zh)
KR (1) KR102323711B1 (zh)
CN (1) CN111584391B (zh)
TW (1) TWI743614B (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022050918A (ja) * 2020-09-18 2022-03-31 株式会社Ｓｃｒｅｅｎホールディングス 真空処理装置
JP7264857B2 (ja) * 2020-09-18 2023-04-25 株式会社Ｓｃｒｅｅｎホールディングス 基板保持装置、および、基板保持方法
JP7337766B2 (ja) * 2020-09-18 2023-09-04 株式会社Ｓｃｒｅｅｎホールディングス 真空処理装置
CN113070169B (zh) * 2021-04-19 2022-08-05 深圳市弘德胜自动化设备有限公司 电子纸涂覆设备

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004235386A (ja) * 2003-01-30 2004-08-19 Sharp Corp 位置決めテーブルおよび位置決め方法
JP4105613B2 (ja) * 2003-09-04 2008-06-25 大日本スクリーン製造株式会社 基板処理装置
JP2006170733A (ja) * 2004-12-15 2006-06-29 Sharp Corp 基板位置決め保持方法及び装置
JP2007250851A (ja) * 2006-03-16 2007-09-27 Dainippon Screen Mfg Co Ltd 基板処理装置、基板処理システムおよび基板処理方法
JP2008078304A (ja) * 2006-09-20 2008-04-03 Olympus Corp 基板保持機構およびそれを用いた基板検査装置
JP2013168461A (ja) * 2012-02-15 2013-08-29 Tokyo Electron Ltd 基板処理装置及び基板処理方法
JP5977042B2 (ja) * 2012-02-27 2016-08-24 株式会社Ｓｃｒｅｅｎホールディングス 塗布装置、基板保持装置および基板保持方法
JP6516664B2 (ja) * 2015-12-16 2019-05-22 株式会社Ｓｃｒｅｅｎホールディングス 基板保持装置、塗布装置、基板保持方法

Also Published As

Publication number Publication date
TW202032623A (zh) 2020-09-01
KR20200101277A (ko) 2020-08-27
TWI743614B (zh) 2021-10-21
KR102323711B1 (ko) 2021-11-08
CN111584391B (zh) 2022-04-05
CN111584391A (zh) 2020-08-25
JP2020136480A (ja) 2020-08-31

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