JP6869279B2 - 基板処理装置および基板処理方法 - Google Patents
基板処理装置および基板処理方法 Download PDFInfo
- Publication number
- JP6869279B2 JP6869279B2 JP2019027647A JP2019027647A JP6869279B2 JP 6869279 B2 JP6869279 B2 JP 6869279B2 JP 2019027647 A JP2019027647 A JP 2019027647A JP 2019027647 A JP2019027647 A JP 2019027647A JP 6869279 B2 JP6869279 B2 JP 6869279B2
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- JP
- Japan
- Prior art keywords
- substrate
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- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000012545 processing Methods 0.000 title claims description 33
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- 238000001514 detection method Methods 0.000 claims description 62
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- 239000007788 liquid Substances 0.000 claims description 10
- 238000003825 pressing Methods 0.000 claims description 10
- 238000007599 discharging Methods 0.000 claims description 4
- 238000000576 coating method Methods 0.000 description 39
- 238000012937 correction Methods 0.000 description 36
- 239000011248 coating agent Substances 0.000 description 30
- 230000007246 mechanism Effects 0.000 description 29
- 238000000034 method Methods 0.000 description 18
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- 238000010586 diagram Methods 0.000 description 6
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- 230000006835 compression Effects 0.000 description 2
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- 239000000428 dust Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
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- 239000010949 copper Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 239000010438 granite Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
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- 239000004575 stone Substances 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0254—Coating heads with slot-shaped outlet
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Coating Apparatus (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019027647A JP6869279B2 (ja) | 2019-02-19 | 2019-02-19 | 基板処理装置および基板処理方法 |
CN201911203575.2A CN111584391B (zh) | 2019-02-19 | 2019-11-29 | 基板处理装置及基板处理方法 |
TW108144463A TWI743614B (zh) | 2019-02-19 | 2019-12-05 | 基板處理裝置及基板處理方法 |
KR1020200004777A KR102323711B1 (ko) | 2019-02-19 | 2020-01-14 | 기판 처리 장치 및 기판 처리 방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019027647A JP6869279B2 (ja) | 2019-02-19 | 2019-02-19 | 基板処理装置および基板処理方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020136480A JP2020136480A (ja) | 2020-08-31 |
JP6869279B2 true JP6869279B2 (ja) | 2021-05-12 |
Family
ID=72111383
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019027647A Active JP6869279B2 (ja) | 2019-02-19 | 2019-02-19 | 基板処理装置および基板処理方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6869279B2 (zh) |
KR (1) | KR102323711B1 (zh) |
CN (1) | CN111584391B (zh) |
TW (1) | TWI743614B (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2022050918A (ja) * | 2020-09-18 | 2022-03-31 | 株式会社Screenホールディングス | 真空処理装置 |
JP7264857B2 (ja) * | 2020-09-18 | 2023-04-25 | 株式会社Screenホールディングス | 基板保持装置、および、基板保持方法 |
JP7337766B2 (ja) * | 2020-09-18 | 2023-09-04 | 株式会社Screenホールディングス | 真空処理装置 |
CN113070169B (zh) * | 2021-04-19 | 2022-08-05 | 深圳市弘德胜自动化设备有限公司 | 电子纸涂覆设备 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004235386A (ja) * | 2003-01-30 | 2004-08-19 | Sharp Corp | 位置決めテーブルおよび位置決め方法 |
JP4105613B2 (ja) * | 2003-09-04 | 2008-06-25 | 大日本スクリーン製造株式会社 | 基板処理装置 |
JP2006170733A (ja) * | 2004-12-15 | 2006-06-29 | Sharp Corp | 基板位置決め保持方法及び装置 |
JP2007250851A (ja) * | 2006-03-16 | 2007-09-27 | Dainippon Screen Mfg Co Ltd | 基板処理装置、基板処理システムおよび基板処理方法 |
JP2008078304A (ja) * | 2006-09-20 | 2008-04-03 | Olympus Corp | 基板保持機構およびそれを用いた基板検査装置 |
JP2013168461A (ja) * | 2012-02-15 | 2013-08-29 | Tokyo Electron Ltd | 基板処理装置及び基板処理方法 |
JP5977042B2 (ja) * | 2012-02-27 | 2016-08-24 | 株式会社Screenホールディングス | 塗布装置、基板保持装置および基板保持方法 |
JP6516664B2 (ja) * | 2015-12-16 | 2019-05-22 | 株式会社Screenホールディングス | 基板保持装置、塗布装置、基板保持方法 |
-
2019
- 2019-02-19 JP JP2019027647A patent/JP6869279B2/ja active Active
- 2019-11-29 CN CN201911203575.2A patent/CN111584391B/zh active Active
- 2019-12-05 TW TW108144463A patent/TWI743614B/zh active
-
2020
- 2020-01-14 KR KR1020200004777A patent/KR102323711B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
TW202032623A (zh) | 2020-09-01 |
KR20200101277A (ko) | 2020-08-27 |
TWI743614B (zh) | 2021-10-21 |
KR102323711B1 (ko) | 2021-11-08 |
CN111584391B (zh) | 2022-04-05 |
CN111584391A (zh) | 2020-08-25 |
JP2020136480A (ja) | 2020-08-31 |
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