JP6812333B2 - 化合物半導体基板 - Google Patents
化合物半導体基板 Download PDFInfo
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- JP6812333B2 JP6812333B2 JP2017235743A JP2017235743A JP6812333B2 JP 6812333 B2 JP6812333 B2 JP 6812333B2 JP 2017235743 A JP2017235743 A JP 2017235743A JP 2017235743 A JP2017235743 A JP 2017235743A JP 6812333 B2 JP6812333 B2 JP 6812333B2
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- 239000004065 semiconductor Substances 0.000 title claims description 250
- 239000000758 substrate Substances 0.000 title claims description 121
- 150000001875 compounds Chemical class 0.000 title claims description 65
- 150000004767 nitrides Chemical class 0.000 claims description 177
- 239000002131 composite material Substances 0.000 claims description 113
- 239000000203 mixture Substances 0.000 claims description 20
- 229910052799 carbon Inorganic materials 0.000 claims description 7
- 230000004888 barrier function Effects 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- 229910052733 gallium Inorganic materials 0.000 claims description 3
- 230000006835 compression Effects 0.000 claims description 2
- 238000007906 compression Methods 0.000 claims description 2
- 125000004432 carbon atom Chemical group C* 0.000 claims 1
- 229910002601 GaN Inorganic materials 0.000 description 158
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 158
- 229910010271 silicon carbide Inorganic materials 0.000 description 37
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 35
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 33
- 239000013078 crystal Substances 0.000 description 23
- 239000010409 thin film Substances 0.000 description 20
- 238000000034 method Methods 0.000 description 14
- 239000000463 material Substances 0.000 description 12
- 238000005259 measurement Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 239000007789 gas Substances 0.000 description 7
- 229910002704 AlGaN Inorganic materials 0.000 description 5
- XCZXGTMEAKBVPV-UHFFFAOYSA-N trimethylgallium Chemical compound C[Ga](C)C XCZXGTMEAKBVPV-UHFFFAOYSA-N 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 150000001721 carbon Chemical group 0.000 description 4
- 230000001965 increasing effect Effects 0.000 description 4
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- VOITXYVAKOUIBA-UHFFFAOYSA-N triethylaluminium Chemical compound CC[Al](CC)CC VOITXYVAKOUIBA-UHFFFAOYSA-N 0.000 description 3
- RGGPNXQUMRMPRA-UHFFFAOYSA-N triethylgallium Chemical compound CC[Ga](CC)CC RGGPNXQUMRMPRA-UHFFFAOYSA-N 0.000 description 3
- JLTRXTDYQLMHGR-UHFFFAOYSA-N trimethylaluminium Chemical compound C[Al](C)C JLTRXTDYQLMHGR-UHFFFAOYSA-N 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000010000 carbonizing Methods 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 238000004943 liquid phase epitaxy Methods 0.000 description 2
- 238000001451 molecular beam epitaxy Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- -1 CS2 compound Chemical class 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000001427 coherent effect Effects 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000000116 mitigating effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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Description
2 SiC(炭化ケイ素)層(下地層の一例)
3 AlN(窒化アルミニウム)バッファー層(バッファー層の一例)
4 複合層(下部複合層の一例)
5 複合層(上部複合層の一例)
7,42a,42b,51a,51b,51c GaN(窒化ガリウム)層(下部GaN層の一例、上部GaN層の一例、電子走行層の一例)
10,41a,41b,41c,52a,52b Al(アルミニウム)窒化物半導体層(下部窒化物半導体層の一例、上部窒化物半導体層の一例、障壁層の一例)
BR1,BR2 界面
CS1,CS2 化合物半導体基板
Claims (12)
- 化合物半導体基板であって、
下地層と、
前記下地層上に形成されたAlNよりなるバッファー層と、
前記バッファー層上に形成された下部複合層と、
前記下部複合層上に形成された上部複合層とを備え、
前記下部複合層は、
上下方向に積層され、Alを含む複数の下部窒化物半導体層と、
前記複数の下部窒化物半導体層の各々の間に形成された下部GaN層とを含み、
前記上部複合層は、
上下方向に積層された複数の上部GaN層と、
前記複数の上部GaN層の各々の間に形成されたAlを含む上部窒化物半導体層とを含み、
前記下部GaN層と前記下部GaN層の下地となる下部窒化物半導体層との界面は、滑り面であり、
前記上部窒化物半導体層と前記上部窒化物半導体層の下地となる上部GaN層との界面は、滑り面であり、
前記下部複合層を構成する下部GaN層は、前記化合物半導体基板に凹形状の反りを発生させ、
前記上部複合層を構成する上部窒化物半導体層は、前記化合物半導体基板に凸形状の反りを発生させる、化合物半導体基板。 - 前記下地層はSiCよりなる、請求項1に記載の化合物半導体基板。
- 前記下部GaN層は、3nm以上100nm以下の厚さを有する、請求項1または2に記載の化合物半導体基板。
- 前記上部窒化物半導体層は、3nm以上50nm以下の厚さを有する、請求項1〜3のいずれかに記載の化合物半導体基板。
- 前記複数の下部窒化物半導体層は3層であり、
前記下部GaN層は2層である、請求項1〜4のいずれかに記載の化合物半導体基板。 - 前記複数の下部窒化物半導体層は、AlおよびGaを含み、
前記複数の下部窒化物半導体層の各々のAlの平均組成比を比較した場合、前記下地層から離れた位置に形成された下部窒化物半導体層である程、Alの平均組成比が小さくなる、請求項1〜5のいずれかに記載の化合物半導体基板。 - 前記複数の上部GaN層は3層であり、
前記上部窒化物半導体層は2層である、請求項1〜6のいずれかに記載の化合物半導体基板。 - 前記複数の下部窒化物半導体層のうち前記下部GaN層と接触して前記下部GaN層上に形成された下部窒化物半導体層は、引張り歪みを含み、
前記複数の上部GaN層のうち前記上部窒化物半導体層と接触して前記上部窒化物半導体層上に形成された上部GaN層は、圧縮歪みを含む、請求項1〜7のいずれかに記載の化合物半導体基板。 - 前記上部窒化物半導体層はAlNよりなる、請求項1〜8のいずれかに記載の化合物半導体基板。
- 前記上部複合層上に形成されたGaNよりなる電子走行層と、
前記電子走行層上に形成された障壁層とをさらに備えた、請求項1〜9のいずれかに記載の化合物半導体基板。 - 前記複数の上部GaN層の各々は、1×1018個/cm3以上1×1021個/cm3以下の平均炭素原子濃度を有する、請求項1〜10のいずれかに記載の化合物半導体基板。
- 前記複数の上部GaN層の各々は、550nm以上3000nm以下の厚さを有する、請求項1〜11のいずれかに記載の化合物半導体基板。
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