JP6808460B2 - 半導体装置及びその製造方法 - Google Patents

半導体装置及びその製造方法 Download PDF

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Publication number
JP6808460B2
JP6808460B2 JP2016231339A JP2016231339A JP6808460B2 JP 6808460 B2 JP6808460 B2 JP 6808460B2 JP 2016231339 A JP2016231339 A JP 2016231339A JP 2016231339 A JP2016231339 A JP 2016231339A JP 6808460 B2 JP6808460 B2 JP 6808460B2
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Japan
Prior art keywords
insulating film
semiconductor substrate
semiconductor device
insulating
hole
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JP2016231339A
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English (en)
Japanese (ja)
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JP2018088487A (ja
JP2018088487A5 (https=
Inventor
秀将 大重
秀将 大重
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Canon Inc
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Canon Inc
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Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2016231339A priority Critical patent/JP6808460B2/ja
Priority to US15/800,567 priority patent/US10388592B2/en
Publication of JP2018088487A publication Critical patent/JP2018088487A/ja
Publication of JP2018088487A5 publication Critical patent/JP2018088487A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H10F39/026—Wafer-level processing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/811—Interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/021—Manufacture or treatment of interconnections within wafers or substrates
    • H10W20/023—Manufacture or treatment of interconnections within wafers or substrates the interconnections being through-semiconductor vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/021—Manufacture or treatment of interconnections within wafers or substrates
    • H10W20/023—Manufacture or treatment of interconnections within wafers or substrates the interconnections being through-semiconductor vias
    • H10W20/0234—Manufacture or treatment of interconnections within wafers or substrates the interconnections being through-semiconductor vias comprising etching via holes that stop on pads or on electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/021—Manufacture or treatment of interconnections within wafers or substrates
    • H10W20/023—Manufacture or treatment of interconnections within wafers or substrates the interconnections being through-semiconductor vias
    • H10W20/0242—Manufacture or treatment of interconnections within wafers or substrates the interconnections being through-semiconductor vias comprising etching via holes from the back sides of the chips, wafers or substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/021—Manufacture or treatment of interconnections within wafers or substrates
    • H10W20/023—Manufacture or treatment of interconnections within wafers or substrates the interconnections being through-semiconductor vias
    • H10W20/0265—Manufacture or treatment of interconnections within wafers or substrates the interconnections being through-semiconductor vias characterised by the sidewall insulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/071—Manufacture or treatment of dielectric parts thereof
    • H10W20/074—Manufacture or treatment of dielectric parts thereof of dielectric parts comprising thin functional dielectric layers, e.g. dielectric etch-stop, barrier, capping or liner layers
    • H10W20/075—Manufacture or treatment of dielectric parts thereof of dielectric parts comprising thin functional dielectric layers, e.g. dielectric etch-stop, barrier, capping or liner layers of multilayered thin functional dielectric layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/071—Manufacture or treatment of dielectric parts thereof
    • H10W20/074—Manufacture or treatment of dielectric parts thereof of dielectric parts comprising thin functional dielectric layers, e.g. dielectric etch-stop, barrier, capping or liner layers
    • H10W20/076—Manufacture or treatment of dielectric parts thereof of dielectric parts comprising thin functional dielectric layers, e.g. dielectric etch-stop, barrier, capping or liner layers in via holes or trenches
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/20—Interconnections within wafers or substrates, e.g. through-silicon vias [TSV]

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  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Formation Of Insulating Films (AREA)
JP2016231339A 2016-11-29 2016-11-29 半導体装置及びその製造方法 Active JP6808460B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2016231339A JP6808460B2 (ja) 2016-11-29 2016-11-29 半導体装置及びその製造方法
US15/800,567 US10388592B2 (en) 2016-11-29 2017-11-01 Semiconductor device and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016231339A JP6808460B2 (ja) 2016-11-29 2016-11-29 半導体装置及びその製造方法

Publications (3)

Publication Number Publication Date
JP2018088487A JP2018088487A (ja) 2018-06-07
JP2018088487A5 JP2018088487A5 (https=) 2019-12-26
JP6808460B2 true JP6808460B2 (ja) 2021-01-06

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JP2016231339A Active JP6808460B2 (ja) 2016-11-29 2016-11-29 半導体装置及びその製造方法

Country Status (2)

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US (1) US10388592B2 (https=)
JP (1) JP6808460B2 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10679924B2 (en) 2018-03-05 2020-06-09 Win Semiconductors Corp. Semiconductor device with antenna integrated
JP2020155591A (ja) * 2019-03-20 2020-09-24 株式会社東芝 半導体装置
DE102019107760A1 (de) 2019-03-26 2020-10-01 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur herstellung einer verbindungsstruktur und halbleiterbauelement
US11973006B2 (en) * 2019-10-11 2024-04-30 Semiconductor Components Industries, Llc Self-aligned contact openings for backside through substrate vias
EP3813101B1 (en) * 2019-10-25 2026-03-25 ams AG Method of producing a semiconductor body with a trench

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0222845A (ja) * 1988-07-12 1990-01-25 Toshiba Corp 半導体装置の製造方法
US5851603A (en) * 1997-07-14 1998-12-22 Vanguard International Semiconductor Corporation Method for making a plasma-enhanced chemical vapor deposited SiO2 Si3 N4 multilayer passivation layer for semiconductor applications
JP3926083B2 (ja) * 2000-03-07 2007-06-06 三菱電機株式会社 半導体装置、液晶表示装置、半導体装置の製造方法、液晶表示装置の製造方法
DE10145724A1 (de) * 2001-09-17 2003-04-10 Infineon Technologies Ag Verfahren zum Herstellen einer Halbleiterstruktur unter Verwendung einer Schutzschicht und Halbleiterstruktur
US20060290001A1 (en) * 2005-06-28 2006-12-28 Micron Technology, Inc. Interconnect vias and associated methods of formation
JP4380718B2 (ja) 2007-03-15 2009-12-09 ソニー株式会社 半導体装置の製造方法
JP5259197B2 (ja) 2008-01-09 2013-08-07 ソニー株式会社 半導体装置及びその製造方法
JP2010161215A (ja) * 2009-01-08 2010-07-22 Sharp Corp 半導体装置及びその製造方法
JP5885904B2 (ja) 2009-08-07 2016-03-16 東京エレクトロン株式会社 半導体装置の製造方法
US8525343B2 (en) * 2010-09-28 2013-09-03 Taiwan Semiconductor Manufacturing Company, Ltd. Device with through-silicon via (TSV) and method of forming the same
JP2012222141A (ja) 2011-04-08 2012-11-12 Elpida Memory Inc 半導体チップ
US8816505B2 (en) * 2011-07-29 2014-08-26 Tessera, Inc. Low stress vias
JP5984134B2 (ja) 2012-05-15 2016-09-06 ローム株式会社 半導体装置およびその製造方法、電子部品
JP6309243B2 (ja) 2013-10-30 2018-04-11 ラピスセミコンダクタ株式会社 半導体装置およびその製造方法
US9633930B2 (en) * 2014-11-26 2017-04-25 Kookmin University Industry Academy Cooperation Foundation Method of forming through-hole in silicon substrate, method of forming electrical connection element penetrating silicon substrate and semiconductor device manufactured thereby
JP6335132B2 (ja) 2015-03-13 2018-05-30 東芝メモリ株式会社 半導体装置、および、半導体装置の製造方法
JP6682327B2 (ja) 2016-04-01 2020-04-15 キヤノン株式会社 電子デバイス、その製造方法及びカメラ
JP7009111B2 (ja) * 2017-08-17 2022-01-25 キヤノン株式会社 半導体装置及びその製造方法

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Publication number Publication date
US10388592B2 (en) 2019-08-20
JP2018088487A (ja) 2018-06-07
US20180151475A1 (en) 2018-05-31

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