JP6758527B1 - 炭化珪素インゴット成長用粉末及びそれを用いた炭化珪素インゴットの製造方法 - Google Patents
炭化珪素インゴット成長用粉末及びそれを用いた炭化珪素インゴットの製造方法 Download PDFInfo
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- JP6758527B1 JP6758527B1 JP2020066603A JP2020066603A JP6758527B1 JP 6758527 B1 JP6758527 B1 JP 6758527B1 JP 2020066603 A JP2020066603 A JP 2020066603A JP 2020066603 A JP2020066603 A JP 2020066603A JP 6758527 B1 JP6758527 B1 JP 6758527B1
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- silicon carbide
- ingot
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B23/00—Single-crystal growth by condensing evaporated or sublimed materials
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/0635—Carbides
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B19/00—Liquid-phase epitaxial-layer growth
- C30B19/08—Heating of the reaction chamber or the substrate
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B23/00—Single-crystal growth by condensing evaporated or sublimed materials
- C30B23/002—Controlling or regulating
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B23/00—Single-crystal growth by condensing evaporated or sublimed materials
- C30B23/02—Epitaxial-layer growth
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/08—Reaction chambers; Selection of materials therefor
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/10—Heating of the reaction chamber or the substrate
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/36—Carbides
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B35/00—Apparatus not otherwise provided for, specially adapted for the growth, production or after-treatment of single crystals or of a homogeneous polycrystalline material with defined structure
- C30B35/002—Crucibles or containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Carbon And Carbon Compounds (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020190083910A KR102068933B1 (ko) | 2019-07-11 | 2019-07-11 | 탄화규소 잉곳 성장용 분말 및 이를 이용한 탄화규소 잉곳의 제조방법 |
KR10-2019-0083910 | 2019-07-11 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP6758527B1 true JP6758527B1 (ja) | 2020-09-23 |
JP2021014395A JP2021014395A (ja) | 2021-02-12 |
Family
ID=69369525
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020066603A Active JP6758527B1 (ja) | 2019-07-11 | 2020-04-02 | 炭化珪素インゴット成長用粉末及びそれを用いた炭化珪素インゴットの製造方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US10822720B1 (zh) |
EP (1) | EP3763852A1 (zh) |
JP (1) | JP6758527B1 (zh) |
KR (1) | KR102068933B1 (zh) |
CN (1) | CN112210824A (zh) |
TW (1) | TWI725816B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN117328138A (zh) * | 2023-10-10 | 2024-01-02 | 江苏超芯星半导体有限公司 | 一种碳化硅晶锭生长质量一致性的控制方法 |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102340110B1 (ko) * | 2019-10-29 | 2021-12-17 | 주식회사 쎄닉 | 탄화규소 잉곳, 웨이퍼 및 이의 제조방법 |
KR102195325B1 (ko) * | 2020-06-16 | 2020-12-24 | 에스케이씨 주식회사 | 탄화규소 잉곳, 웨이퍼 및 이의 제조방법 |
KR102235858B1 (ko) * | 2020-04-09 | 2021-04-02 | 에스케이씨 주식회사 | 탄화규소 잉곳의 제조방법 및 탄화규소 잉곳 제조용 시스템 |
KR102236396B1 (ko) | 2020-05-29 | 2021-04-02 | 에스케이씨 주식회사 | 탄화규소 잉곳의 제조방법 및 탄화규소 잉곳 제조용 시스템 |
JPWO2021215120A1 (zh) * | 2020-04-22 | 2021-10-28 | ||
KR102192518B1 (ko) | 2020-07-14 | 2020-12-17 | 에스케이씨 주식회사 | 웨이퍼 및 웨이퍼의 제조방법 |
KR102236395B1 (ko) * | 2020-09-22 | 2021-04-02 | 에스케이씨 주식회사 | 탄화규소 잉곳 제조방법, 탄화규소 웨이퍼 및 탄화규소 웨이퍼 제조방법 |
KR102442732B1 (ko) * | 2021-11-05 | 2022-09-13 | 주식회사 쎄닉 | 탄화규소 웨이퍼 및 이의 제조방법 |
KR102442731B1 (ko) * | 2021-12-23 | 2022-09-13 | 주식회사 쎄닉 | 탄화규소 분말 및 이를 이용하여 탄화규소 잉곳을 제조하는 방법 |
KR20240029434A (ko) * | 2022-08-26 | 2024-03-05 | 주식회사 쎄닉 | 탄화규소 분말 및 이를 이용하여 탄화규소 잉곳을 제조하는 방법 |
KR102581526B1 (ko) * | 2022-08-22 | 2023-09-20 | 주식회사 쎄닉 | 탄화규소 분말, 이의 제조방법 및 이를 이용하여 탄화규소 잉곳을 제조하는 방법 |
KR102567936B1 (ko) * | 2022-08-22 | 2023-08-17 | 주식회사 쎄닉 | 탄화규소 분말, 이의 제조방법 및 이를 이용하여 탄화규소 잉곳을 제조하는 방법 |
Family Cites Families (18)
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US4699202A (en) * | 1986-10-02 | 1987-10-13 | Bethlehem Steel Corporation | System and method for controlling secondary spray cooling in continuous casting |
JP4061700B2 (ja) * | 1998-03-19 | 2008-03-19 | 株式会社デンソー | 単結晶の製造方法 |
ATE335872T1 (de) * | 2003-04-24 | 2006-09-15 | Norstel Ab | Vorrichtung und verfahren zur herstellung von einkristallen durch dampfphasenabscheidung |
JP2011233638A (ja) * | 2010-04-26 | 2011-11-17 | Sumitomo Electric Ind Ltd | 炭化珪素基板およびその製造方法 |
JP5706671B2 (ja) * | 2010-11-15 | 2015-04-22 | 独立行政法人産業技術総合研究所 | 昇華再結晶法による炭化ケイ素単結晶製造用炭化ケイ素粉体及びその製造方法 |
KR101854731B1 (ko) | 2011-07-28 | 2018-05-04 | 엘지이노텍 주식회사 | 잉곳 제조 방법 |
JP5696630B2 (ja) | 2011-09-21 | 2015-04-08 | 住友電気工業株式会社 | 炭化珪素基板およびその製造方法 |
JP6230106B2 (ja) * | 2013-07-31 | 2017-11-15 | 太平洋セメント株式会社 | 炭化珪素単結晶の製造方法 |
KR20170012272A (ko) * | 2014-05-30 | 2017-02-02 | 신닛테츠스미킹 마테리알즈 가부시키가이샤 | 벌크상 탄화 규소 단결정의 평가 방법, 및 그 방법에 사용되는 참조용 탄화 규소 단결정 |
US20170121844A1 (en) * | 2014-07-07 | 2017-05-04 | Sumitomo Electric Industries, Ltd. | Method for manufacturing silicon carbide single crystal and silicon carbide substrate |
WO2016051485A1 (ja) * | 2014-09-30 | 2016-04-07 | 新日鉄住金マテリアルズ株式会社 | 炭化珪素単結晶ウェハ、及び炭化珪素単結晶インゴットの製造方法 |
US20180233562A1 (en) * | 2014-10-01 | 2018-08-16 | Sumitomo Electric Industries, Ltd. | Silicon carbide epitaxial substrate |
JP6443103B2 (ja) * | 2015-02-13 | 2018-12-26 | 住友電気工業株式会社 | 炭化珪素単結晶の製造方法 |
GB2537648B (en) * | 2015-04-22 | 2020-01-08 | Cosmetic Warriors Ltd | Composition |
JP6640680B2 (ja) * | 2016-08-25 | 2020-02-05 | 太平洋セメント株式会社 | 炭化珪素単結晶の製造方法 |
JP6493690B2 (ja) * | 2016-08-31 | 2019-04-03 | 昭和電工株式会社 | SiCエピタキシャルウェハ及びその製造方法、並びに、ラージピット欠陥検出方法、欠陥識別方法 |
KR101809642B1 (ko) | 2016-12-20 | 2017-12-15 | 에스케이씨 주식회사 | 대구경 탄화규소 단결정 잉곳의 성장방법 |
JP6597873B2 (ja) * | 2018-11-22 | 2019-10-30 | 住友電気工業株式会社 | 炭化珪素単結晶の製造方法 |
-
2019
- 2019-07-11 KR KR1020190083910A patent/KR102068933B1/ko active IP Right Grant
-
2020
- 2020-04-02 JP JP2020066603A patent/JP6758527B1/ja active Active
- 2020-04-13 TW TW109112360A patent/TWI725816B/zh active
- 2020-05-29 US US16/887,263 patent/US10822720B1/en active Active
- 2020-06-10 EP EP20179127.4A patent/EP3763852A1/en not_active Ceased
- 2020-06-11 CN CN202010531612.9A patent/CN112210824A/zh active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN117328138A (zh) * | 2023-10-10 | 2024-01-02 | 江苏超芯星半导体有限公司 | 一种碳化硅晶锭生长质量一致性的控制方法 |
Also Published As
Publication number | Publication date |
---|---|
CN112210824A (zh) | 2021-01-12 |
JP2021014395A (ja) | 2021-02-12 |
EP3763852A1 (en) | 2021-01-13 |
TWI725816B (zh) | 2021-04-21 |
TW202102730A (zh) | 2021-01-16 |
KR102068933B1 (ko) | 2020-01-21 |
US10822720B1 (en) | 2020-11-03 |
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