JP6722679B2 - 導電性ペースト - Google Patents

導電性ペースト Download PDF

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Publication number
JP6722679B2
JP6722679B2 JP2017537778A JP2017537778A JP6722679B2 JP 6722679 B2 JP6722679 B2 JP 6722679B2 JP 2017537778 A JP2017537778 A JP 2017537778A JP 2017537778 A JP2017537778 A JP 2017537778A JP 6722679 B2 JP6722679 B2 JP 6722679B2
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JP
Japan
Prior art keywords
silver
fine particles
conductive paste
metal powder
metal
Prior art date
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Active
Application number
JP2017537778A
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English (en)
Japanese (ja)
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JPWO2017038572A1 (ja
Inventor
治之 中城
治之 中城
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Harima Chemical Inc
Original Assignee
Harima Chemical Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Harima Chemical Inc filed Critical Harima Chemical Inc
Publication of JPWO2017038572A1 publication Critical patent/JPWO2017038572A1/ja
Application granted granted Critical
Publication of JP6722679B2 publication Critical patent/JP6722679B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/102—Metallic powder coated with organic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
  • Powder Metallurgy (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Non-Insulated Conductors (AREA)
JP2017537778A 2015-08-31 2016-08-24 導電性ペースト Active JP6722679B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015170478 2015-08-31
JP2015170478 2015-08-31
PCT/JP2016/074621 WO2017038572A1 (ja) 2015-08-31 2016-08-24 導電性ペースト

Publications (2)

Publication Number Publication Date
JPWO2017038572A1 JPWO2017038572A1 (ja) 2018-06-14
JP6722679B2 true JP6722679B2 (ja) 2020-07-15

Family

ID=58188782

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017537778A Active JP6722679B2 (ja) 2015-08-31 2016-08-24 導電性ペースト

Country Status (3)

Country Link
JP (1) JP6722679B2 (zh)
TW (1) TWI690946B (zh)
WO (1) WO2017038572A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6998713B2 (ja) * 2017-09-25 2022-02-04 古河電気工業株式会社 金属微粒子含有組成物
JP6736782B2 (ja) * 2018-08-23 2020-08-05 バンドー化学株式会社 接合用組成物
JPWO2021025003A1 (zh) * 2019-08-07 2021-02-11
WO2024058074A1 (ja) * 2022-09-14 2024-03-21 株式会社ダイセル 接合性導体ペースト

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4157468B2 (ja) * 2003-12-12 2008-10-01 日立電線株式会社 配線基板
JP5890603B2 (ja) * 2009-08-28 2016-03-22 Ｄｏｗａエレクトロニクス株式会社 金属ナノ粒子とその凝集体、金属ナノ粒子分散体、それを用いて形成された部材
JP4870223B1 (ja) * 2010-09-02 2012-02-08 ニホンハンダ株式会社 ペースト状銀粒子組成物、金属製部材接合体の製造方法および金属製部材接合体
WO2012059974A1 (ja) * 2010-11-01 2012-05-10 Ｄｏｗａエレクトロニクス株式会社 低温焼結性導電性ペーストおよびそれを用いた導電膜と導電膜の形成方法
JP6039320B2 (ja) * 2012-09-03 2016-12-07 石原産業株式会社 金属微粒子分散液及びその製造方法並びにそれを用いて形成した電極、配線パターン、塗膜、その塗膜を形成した装飾物品、抗菌性物品
JP5509283B2 (ja) * 2012-09-13 2014-06-04 ニホンハンダ株式会社 加熱焼結性金属微粒子の製造方法、ペースト状金属微粒子組成物、固形状金属または固形状金属合金の製造方法、金属製部材の接合方法、プリント配線板の製造方法および電気回路接続用バンプの製造方法
JP5558547B2 (ja) * 2012-12-05 2014-07-23 ニホンハンダ株式会社 ペースト状金属微粒子組成物、固形状金属または固形状金属合金の製造方法、金属製部材の接合方法、プリント配線板の製造方法および電気回路接続用バンプの製造方法
JP2015133182A (ja) * 2014-01-09 2015-07-23 旭硝子株式会社 導電性ペーストおよび導電膜付き基材

Also Published As

Publication number Publication date
JPWO2017038572A1 (ja) 2018-06-14
TW201719677A (zh) 2017-06-01
TWI690946B (zh) 2020-04-11
WO2017038572A1 (ja) 2017-03-09

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