JP6645199B2 - Sensor assembly and method of manufacturing sensor assembly - Google Patents

Description

  The present invention relates to a sensor assembly constituting a torque sensor and a method for manufacturing the sensor assembly.

  For example, Patent Literature 1 discloses a magnetic sensor circuit having a magnetic sensing element constituting a torque sensor, in which a resin is surrounded by insert molding around a magnetic sensor circuit.

JP-A-2015-31600

  By the way, when insert molding a resin, the resin is set to a high temperature in order to give the resin a fluidity, and the resin is set to a high pressure in order to pour the resin into a mold. When high-temperature and high-pressure resin comes into contact with the magnetic sensor circuit during insert molding, there is a concern that the reliability of the magnetic sensor circuit may be reduced.

  The present invention has been made in view of such circumstances, and an object of the present invention is to provide a sensor assembly and a method of manufacturing the sensor assembly that can suppress a decrease in reliability of a magnetic sensor circuit.

Hereinafter, the means for solving the above-described problems and the effects thereof will be described.
1. In the sensor assembly constituting the torque sensor, the sensor assembly outputs a magnetic flux output from the magnetic flux output device as a detection value of a torque applied to the torsion bar, and a holder holding the magnetic sensor circuit. , A case for housing the holder, wherein the holder has an A- holder part having an A- holder main surface facing one of a pair of circuit main surfaces of the magnetic sensor circuit, A B- holder portion having a B- holder main surface facing the other of the pair of circuit main surfaces, and projecting toward the B- holder portion side with respect to the A- holder main surface in the A- holder portion; by admitting a portion of the magnetic sensor circuit in the space defined by the second a holder sidewall, which holds the magnetic sensor circuit, Serial-A holder sidewall is in contact inclined inwardly of the holder to the first B holder portion, the case is made of resin, the A holder sidewall is the outer surface of the first A holder sidewall It is characterized by being in contact with the outer surface.

In the above configuration, since the side wall of the A-th holder is inclined and contacts the B- side holder portion and the case is in contact with the outer surface of the side wall of the A- holder, the resin constituting the case may enter the holder during molding of the case. Is suppressed. Therefore, with the above configuration, it is possible to suppress a decrease in the reliability of the magnetic sensor circuit.

2. 2. In the sensor assembly according to the above item 1, the A-th holder side wall includes a pair of side walls extending from respective opposing sides of the A-th holder main surface, and the B-th holder portion is provided on the B-th holder main surface. A B- side holder side wall that is a side wall protruding toward the A- holder section side, wherein the B- side holder side wall includes a pair of side walls extending from each of opposing sides of the B- side holder main surface; the one is the first a holder sidewall, than one of the pair of the first B holder sidewall disposed adjacent to the outer or inner, the other of the pair of the first a holder sidewalls, a pair of the first B holder sidewall of is arranged adjacent to the outer or inner side than the other, to a resin wherein the a holder sidewall inclined inward in contact with the first B holder portion and the second a holder sidewall outer surface constituting said case That having a structure you are touching at least.

When the case is formed by insert molding, it is possible to more reliably suppress the resin from entering the holder.
That is, when one and the other of the A holder portion and the B holder portion are the first holder portion and the second holder portion, respectively , the resin material exerts pressure on the side wall of the first holder during insert molding , for example. When an event occurs in which the one holder side wall is inclined inward and comes into contact with the second holder portion, the second holder portion and the inclined first holder side wall prevent the resin from entering the inside of the holder. Further, for example, in a case where the resin material exerts a pressure on the second holder side wall at the time of insert molding and the second holder side wall is tilted inward to contact the first holder portion, the first holder portion and the tilted second holder are generated. The sidewall prevents the resin from entering the holder.

  Here, in the above configuration, the occurrence of any one of the above events suppresses the resin from entering the inside of the holder. Therefore, the flow of the resin into the mold when the second holder side wall is provided is less than the probability that one of the above-described events occurs due to the resin flowing into the mold when the second holder side wall is not provided. The probability of an event occurring is higher. Therefore, when the sensor assembly is regarded as a mass-produced product, it is possible to more reliably suppress the resin from entering the holder.

3. 3. The sensor assembly according to 1 or 2, further comprising: a harness in which a plurality of wires connected to the magnetic sensor circuit are bundled; wherein the holder includes a harness receiving portion; and the harness receiving portion of the A-th holder portion is provided. And a portion of the B-th holder portion that accommodates the harness accommodates an end of the harness. The harness connects the plurality of wires and the plurality of wires. A cover that covers and forms an outer periphery of the harness; and a member that is filled in the cover together with the plurality of wirings and is easier to deform than the cover.

In the above configuration, since the easily deformable member is filled inside the cover of the harness, the harness is less likely to be deformed in the radial direction than in the case where the same material as the cover is used instead of the easily deformable member. Easy. Therefore, when the harness is accommodated between the A-th holder portion and the B-th holder portion, the harness can be easily deformed. Therefore, it is possible to prevent the harness from hindering the contact between the A-th holder portion and the B-th holder portion. For this reason, formation of a gap between the A-th holder portion and the B-th holder portion due to harness tolerance can be suppressed.

4. In a method for manufacturing a sensor assembly that constitutes a torque sensor including a magnetic flux output device that outputs a magnetic flux corresponding to the torsion of both ends of a torsion bar, the sensor assembly may be configured to apply a magnetic flux output from the magnetic flux output device to a torque applied to the torsion bar. A magnetic sensor circuit that outputs the detected value of the magnetic sensor circuit, a holder that holds the magnetic sensor circuit, and a case that houses the holder, wherein the holder has a pair of circuit main surfaces of the magnetic sensor circuit. while a first a holder portion having a first a holder main surface opposed to the out, and the B holder portion having a first B holder main surface facing the other of said pair of circuit main surface, wherein the a the magnetic sensor in a space defined by the first a holder sidewalls projecting to the first B holder portion side with respect to the first a holder principal surface at the holder portion A housing step of housing the part of the magnetic sensor circuit by housing a part of the road, and holding the part of the magnetic sensor circuit in the holder, and a holder housing the part of the magnetic sensor circuit. A molding step of injection-molding the case by disposing a resin material having fluidity into the mold by disposing the resin material in the mold that partitions the case, and in the molding step, There by applying pressure to press the first a holder sidewall to the first a holder sidewalls inwardly, wherein the first a holder sidewall contacts the second B holder portion inclined inwardly.

In the above method, the case for housing the holder is formed by insert molding. Here, the holder, since a combination of the first A holder portion and the B holder portion, when the resin material from the gap between the first A holder portion and the B holder unit enters during insert molding, the magnetic The reliability of the sensor circuit may be reduced. On the other hand, in the above method, the resin material applies pressure to the A- holder side wall, whereby the A- holder side wall is inclined inward and comes into contact with the B- holder portion, so that the resin material may enter the inside of the holder. Is suppressed. Therefore, in the above method, a decrease in the reliability of the magnetic sensor circuit can be suppressed.

5. 5. In the method of manufacturing the sensor assembly according to the item 4, the A- side holder side wall includes a pair of side walls extending from each of opposing sides of the A- side holder main surface, and the B-th holder portion includes the B-th holder. comprising a first B holder sidewall is a sidewall that protrudes to the first a holder portion side to the main surface, the first B holder sidewalls, a pair of side walls extending from respective opposite sides of the first B holder main surface In the containing step, one of the pair of A- holder side walls is disposed adjacent to the outside or inside of one of the pair of B- side holder side walls, and the other of the pair of A- holder side walls is disposed, than the other of the pair of the first B holder sidewall disposed adjacent to the outer or inner, in the molding step, the pressure of the resin material pushes the first a holder sidewall inward to the first a holder sidewall Elephant that you contact with the first B holder portion and the second A holder sidewall inclined inwardly by adding the arising least.

In the above method, when one and the other of the A holder portion and the B holder portion are the first holder portion and the second holder portion, respectively, the resin material exerts a pressure on the first holder side wall and the first holder side wall. When the first event occurs in which the second holder portion tilts inward and contacts the second holder portion, the second holder portion and the tilted first holder side wall prevent the resin from entering the inside of the holder. Further, when the resin material exerts a pressure on the second holder side wall to cause the second holder side wall to be inclined inward and a second event to contact the first holder portion to occur, the first holder portion and the inclined second holder side wall cause: Intrusion of resin into the holder is suppressed.

  Here, in the above-described method, the occurrence of any of the above-described events suppresses the resin from entering the inside of the holder. Therefore, the flow of the resin into the mold when the second holder side wall is provided is less than the probability that one of the above-described events occurs due to the resin flowing into the mold when the second holder side wall is not provided. The probability of an event occurring is higher. Therefore, when the sensor assembly is regarded as a mass-produced product, it is possible to more reliably suppress the resin from entering the holder.

  6. In the method of manufacturing a sensor assembly according to the above item 4 or 5, the magnetic sensor circuit is obtained by soldering an integrated circuit having a magnetic sensing element to a substrate, and the main surface of the circuit is a main surface of the substrate. is there.

  In the above method, the integrated circuit is soldered to the substrate. For this reason, when the substrate is heated by a high-temperature resin during insert molding, there is a possibility that the solder connecting the integrated circuit and other components to the substrate may be melted. In addition, when high-pressure resin applies pressure to a component mounted on a board during insert molding, the pressure may cause poor connection between the mounted component and the board. For this reason, the merit of particularly preventing the resin from entering the inside of the holder by inclining the holder side wall by the pressure of the resin at the time of insert molding is particularly great.

7. 7. The method for manufacturing a sensor assembly according to any one of the items 4 to 6, further comprising: a harness in which a plurality of wires connected to the magnetic sensor circuit are bundled; wherein the holder includes a harness accommodating portion; The end of the harness is accommodated by a part of the A holder part that constitutes the harness accommodation part, and a part of the B holder part that accommodates the harness. And a cover that covers the plurality of wires and forms the outer periphery of the harness, and a member that is filled in the cover together with the plurality of wires and is more easily deformable than the cover. A part of the harness is accommodated in the holder, and a part of the magnetic sensor circuit and a part of the harness are accommodated in the molding step. The holder was placed in a mold defining the case when pouring a resin material having fluidity into the mold, wherein the B composing the first A holder portion constituting the harness receiving portion the harness receiving portion A pressure is applied to each of the holder portions in a direction in which the A-th holder portion and the B-th holder portion face each other.

In the above configuration, in the forming step, the harness is deformed in accordance with the pressure, since a pressure for sandwiching the harness from both sides is applied to the A-th holder portion and the B-th holder portion. Therefore, it is possible to prevent the harness from hindering the contact between the A-th holder portion and the B-th holder portion. And thereby, in a molding process, it can suppress that a resin material invades the inside of a harness accommodation part.

FIG. 2 is a perspective view showing a magnetic flux output device according to the first embodiment. FIG. 2 is a perspective view showing a sensor assembly according to the embodiment. FIG. 2 is a perspective view showing a holder and a magnetic sensor circuit according to the same embodiment. The top view showing the holder concerning the embodiment. 5-5 sectional drawing of FIG. 4A to 4C are cross-sectional views illustrating a manufacturing process of the sensor assembly according to the first embodiment. (A)-(d) is sectional drawing of the holder assembly concerning 2nd Embodiment. 4A and 4B are cross-sectional views illustrating a manufacturing process of the sensor assembly according to the first embodiment. FIG. 13 is a sectional view of a holder according to a third embodiment. The perspective view of the holder concerning the embodiment. FIG. 4 is a sectional view of the sensor assembly according to the same embodiment. FIG. 4 is a side view showing a holder supporting method during injection molding of the case according to the embodiment. Sectional drawing of the holder concerning the comparative example of the embodiment.

<First embodiment>
Hereinafter, a first embodiment of a sensor assembly and a method of manufacturing the sensor assembly will be described with reference to the drawings.

  FIG. 1 shows a magnetic flux output device 10 provided in the torque sensor. The magnetic flux output device 10 is a device that generates and outputs a magnetic flux according to the torsion of a torsion bar TB connected to an input shaft INS that rotates with the steering wheel. The magnetic flux output device 10 includes magnetic yokes 12a and 12b, magnetic flux collecting rings 14a and 14b, and a cylindrical permanent magnet 18 connected to the input shaft INS. The permanent magnet 18 has N poles and S poles alternately arranged at equal intervals in the circumferential direction. The magnetic yoke 12a is provided with teeth 13a at regular intervals along the circumferential direction, and the magnetic yoke 12b is provided with teeth 13b at regular intervals along the circumferential direction. Each number of the teeth 13a and 13b is equal to the number of N poles (the number of S poles) of the permanent magnet 18. The magnetic flux collection rings 14a and 14b are cylindrical members. The magnetic flux collection ring 14a is provided with a magnetic flux collection portion 16a, and the magnetic flux collection ring 14b is provided with a magnetic flux collection portion 16b.

  The magnetic flux output device 10 has the magnetic yokes 12a and 12b opposed to the permanent magnet 18, the magnetic flux collection ring 14a opposed to the magnetic yoke 12a, the magnetic flux collection ring 14b opposed to the magnetic yoke 12b, and a coaxial input shaft INS. Are arranged by disposing magnetic yokes 12a and 12b and magnetic flux collecting rings 14a and 14b. Specifically, at this time, the magnetic yokes 12a and 12b and the magnetic flux collecting rings 14a and 14b are fixed to an output shaft fixed to an end opposite to the input shaft INS via a torsion bar TB. Further, the teeth 13a of the magnetic yoke 12a and the teeth 13b of the magnetic yoke 12b are arranged so that their circumferential positions are shifted from each other.

  In such a configuration, the magnetic flux generated in the magnetic yoke 12a is collected in the magnetic flux collecting portion 16a via the magnetic flux collecting ring 14a, and the magnetic flux generated in the magnetic yoke 12b is collected in the magnetic flux collecting portion 16b through the magnetic flux collecting ring 14b. The magnetic flux density between the magnetic flux collecting portions 16a and 16b changes depending on the positional relationship between the permanent magnet 18 and the magnetic yokes 12a and 12b. Since the permanent magnet 18 is fixed to the input shaft INS and the magnetic yokes 12a and 12b are fixed to the output shaft, the positional relationship between the permanent magnet 18 and the magnetic yokes 12a and 12b is It changes according to the degree of twist. In other words, the positional relationship between the permanent magnet 18 and the magnetic yokes 12a, 12b changes according to the torque input to the input shaft INS. For this reason, the magnetic flux density between the magnetic flux collecting parts 16a and 16b changes according to the torque input to the input shaft INS. The magnetic flux output device 10 outputs a magnetic flux according to the torque input to the input shaft INS from between the magnetic flux collecting units 16a and 16b.

  FIG. 2 shows a sensor assembly SA that detects the magnetic flux output from the magnetic flux output device 10. The sensor assembly SA includes a case 20 that accommodates an integrated circuit 64 having a Hall element. The harness 30 outputs an output signal of the integrated circuit 64 to a control device that operates a steering actuator that steers steered wheels. It is connected. The case 20 includes a main body 22 that houses the integrated circuit 64 and a flange 24 that fixes the sensor assembly SA to the housing of the magnetic flux output device 10. A hole 26 is formed in the flange portion 24, and a bolt is inserted into the hole 26 and fastened to the housing of the magnetic flux output device 10.

  FIG. 3 shows the holder HR accommodated in the main body 22 of the case 20. The holder HR holds the magnetic sensor circuit 60 by housing a part of the magnetic sensor circuit 60 including the integrated circuit 64 and the substrate 62 on which the integrated circuit 64 is mounted. More specifically, as shown in FIG. 3, the holder HR is configured by combining a first holder portion 40 and a second holder portion 50. The case 20 is injection-molded by housing the holder HR in a mold and pouring molten resin into the mold. In other words, it is insert-molded.

FIG. 4 shows a plan configuration of the holder HR.
FIG. 5 shows a cross-sectional configuration of the sensor assembly SA. The cross section shown in FIG. 5 includes the 5-5 cross section of FIG. In other words, it is a cross-sectional view orthogonal to the direction in which the substrate 62 protrudes from the holder HR. In the following, a direction parallel to the substrate 62 and perpendicular to the direction in which the substrate 62 protrudes will be referred to as a width direction W of the substrate 62.

  The first holder portion 40 has a first holder side wall 44 protruding from the first holder base 42. The first holder side wall 44 is a thin plate-like member that protrudes toward the second holder portion 50 with respect to the first holder main surface 42a of the first holder base 42 facing the main surface 62a of the substrate 62. Here, the main surface is a flat surface having a relatively large area. The first holder side walls 44 are provided on both sides of the first holder base 42 in the width direction W of the substrate 62. In other words, the first holder part 40 is a pair of side walls extending from each of the opposing sides of the first holder main surface 42a. The first holder section 40 is made of resin and is formed by injection molding. Incidentally, the same material as the material of the case 20 is used for the material of the first holder portion 40.

  On the other hand, the second holder part 50 includes a large base part 52 and a small base part 54 whose area in a plane parallel to the substrate 62 is smaller than the large base part 52 by the step part 53. The surface of the small base 54 forms a second holder main surface 54a facing the main surface 62b of the substrate 62. The steps 53 are provided on both sides of the large base 52 in the width direction of the substrate 62, and are arranged to face the first holder side walls 44. The second holder 50 is made of resin, and is formed by injection molding. Incidentally, the same material as the material of the case 20 is used for the material of the second holder portion 50.

  The first holder side wall 44 is inclined inward in the width direction W of the substrate 62 and is in contact with the end surface 54b of the small base portion 54 of the second holder portion 50. The case 20 is in contact with a first holder side wall outer surface 44a which is an outer surface of the first holder side wall 44 in the width direction W.

Here, the operation of the present embodiment will be described.
FIG. 6A shows a housing process in which a part of the substrate 62 of the magnetic sensor circuit 60 is housed in the holder HR in the manufacturing process of the sensor assembly SA. Here, the first holder side wall 44 extends in a direction orthogonal to the first holder main surface 42a.

  FIG. 6B shows a state in which the holder HR is housed in the mold 70 of the case 20 and the resin material 80 is poured into the mold 70. In other words, an insert molding process is shown. The resin material 80 to be introduced into the mold 70 is at a high temperature (for example, 230 ° C.), has a fluidity, and has a high pressure.

  FIG. 6C shows the latter stage of the insert molding process. As shown in FIG. 6C, when the high-pressure resin material 80 comes into contact with the first holder side wall 44, the first holder side wall 44 is pushed inward in the width direction W of the substrate 62 on the first holder side wall outer surface 44a. Power is added. Then, the first holder side wall 44 is tilted inward, and comes into contact with the end surface 54b of the small base portion 54 of the second holder portion 50. The displacement of the first holder side wall 44 due to the application of pressure by the resin material 80 to the first holder side wall outer surface 44a is regulated by the first holder side wall 44 contacting the end surface 54b of the small base 54.

  At this time, the small base 54 pushes back the first holder side wall 44 as a reaction of a force of the resin material 80 applied to the first holder side wall outer surface 44a to press the small base 54. Therefore, a large pressure is applied to the contact portion between the first holder side wall 44 and the small base portion 54, so that the resin material 80 outside the holder HR is suppressed from entering the inside of the holder HR.

According to the present embodiment described above, the following effects can be obtained.
(1) When the resin material 80 applies pressure to the first holder side wall 44, the first holder side wall 44 is inclined inward and comes into contact with the second holder portion 50, so that the resin material 80 enters the inside of the holder HR. Can be suppressed, and a decrease in the reliability of the magnetic sensor circuit 60 can be suppressed. That is, the magnetic sensor circuit 60 is formed by soldering the integrated circuit 64 and the like to the substrate 62, and the melting point of the solder (for example, 220 ° C.) is lower than the melting point of the resin material 80. Therefore, when the resin material 80 enters the holder HR, the solder on the substrate 62 may have a melting point higher than the melting point and may be peeled off. Further, when the resin material 80 enters the holder HR due to the high pressure of the resin material 80, there is a possibility that the solder may be removed by the pressure. Further, when the heat of the resin material 80 is transmitted to the integrated circuit 64, there is a concern that the reliability of the integrated circuit 64 may be reduced.

<Second embodiment>
Hereinafter, the second embodiment will be described with reference to the drawings, focusing on differences from the first embodiment.

FIG. 7 is a cross-sectional view of the sensor assembly SA according to the present embodiment. The sectional view shown in FIG. 7 corresponds to the sectional view shown in FIG.
As shown in FIG. 7, the second holder portion 50 according to the present embodiment includes a second holder side wall 56 which is a thin plate-shaped member extending toward the first holder portion 40 with respect to the second holder main surface 54 a of the small base portion 54. It has. Specifically, a second holder side wall 56 is provided on each side of the small base 54 in the width direction W of the substrate 62. In other words, the second holder side wall 56 is a pair of side walls extending from each of the opposing sides of the second holder main surface 54a. On the other hand, the first holder portion 40 has a concave portion 46 at a position facing each of the pair of second holder side walls 56.

  FIG. 7A shows that, in the width direction W of the substrate 62, each of the pair of second holder side walls 56 is inclined inward to come into contact with each of the concave portions 46 of the pair of first holder portions 40, and the second holder side wall 56 is formed. The structure in which the case 20 is in contact with the outer surface 56a of the second holder side wall, which is the outer surface of the case 20, is shown. FIG. 7B shows that, in the width direction W of the substrate 62, each of the pair of first holder side walls 44 is inclined inward and comes into contact with each of the second holder side walls 56, and the case 20 is placed on the first holder side wall outer surface 44 a. The configuration in contact is shown.

  FIG. 7C shows that, in the direction L of the width direction W of the substrate 62, the second holder side wall 56 is inclined inward to come into contact with the concave portion 46 of the first holder portion 40, and the case is formed on the second holder side wall outer surface 56a. 20 shows an example in which the first holder side wall 44 is inclined inward in the direction R to contact the second holder side wall 56 in the direction R, and the case 20 is in contact with the first holder side wall outer surface 44a. FIG. 7D shows that, in the direction L of the width direction W of the substrate 62, the first holder side wall 44 is inclined inward and comes into contact with the second holder side wall 56, and the case 20 comes into contact with the first holder side wall outer surface 44a. Then, in the direction R, an example is shown in which the second holder side wall 56 is inclined inward to contact the concave portion 46 of the first holder portion 40 and the case 20 is in contact with the second holder side wall outer surface 56a.

Here, the operation of the present embodiment will be described.
FIG. 8A shows an insert molding process of the sensor assembly SA shown in FIGS. 7B and 7D. As shown in FIG. 8A, when the resin material 80 is introduced into the mold 70, the resin material 80 pushes the first holder side wall 44 inward on the first holder side wall outer surface 44a in the width direction W of the substrate 62. Effect. Thereby, the first holder side wall 44 is tilted inward, and comes into contact with the end surface 54b of the small base portion 54 of the first holder portion 40. This suppresses the resin material 80 from entering the inside of the holder HR.

  FIG. 8B shows an insert molding step of the sensor assembly SA shown in FIGS. 7A and 7C. As shown in FIG. 8B, when the resin material 80 is introduced into the mold 70, the resin material 80 pushes the second holder side wall 56 toward the second holder side wall outer surface 56 a in the width direction W of the substrate 62. Exert force. Thereby, the second holder side wall 56 is tilted inward, and comes into contact with the concave portion 46 of the first holder portion 40. This suppresses the resin material 80 from entering the inside of the holder HR. 8B, the second holder side wall 56 extends in a direction orthogonal to the second holder main surface 54a before the resin material 80 contacts.

Note that whether the structure of the sensor assembly SA is any of FIGS. 7A to 7D depends on individual differences between the first holder 40 and the second holder 50 and the like.
According to the present embodiment described above, the following effects can be further obtained in addition to the effects of the first embodiment.

  (2) The first holder side wall 44 and the second holder side wall 56 constitute a labyrinth structure. Since the probability of occurrence of either the event shown in FIG. 8A or the event shown in FIG. 8B is higher than the probability of occurrence of the event shown in FIG. As compared with the case where the two holder side walls 56 are not provided, it is possible to more reliably suppress the resin from entering the holder HR.

<Third embodiment>
Hereinafter, the third embodiment will be described with reference to the drawings, focusing on differences from the first embodiment.

FIG. 9 shows a cross-sectional configuration of the holder HR according to the present embodiment. In FIG. 9, members corresponding to those shown in FIG. 3 and the like are denoted by the same reference numerals for convenience.
As shown in FIG. 9, in the present embodiment, the holder HR includes a sensor housing SH in which a part of the magnetic sensor circuit 60 is housed and a harness housing HH in which a part of the harness 30 is housed. It is formed integrally. Specifically, the sensor holder SH and the harness holder HH are configured by the first holder 40 and the second holder 50. Here, the first holder section 40 in the harness storage section HH extends in the direction opposite to the direction in which the substrate 62 protrudes from the holder HR with respect to the first holder section 40 in the sensor storage section SH. Further, the second holder portion 50 in the harness storage portion HH extends in the direction opposite to the direction in which the substrate 62 projects from the holder HR with respect to the second holder portion 50 in the sensor storage portion SH.

  However, as shown in FIG. 10, in the present embodiment, the second holder portion 50 in the harness storage portion HH locally positions the second holder side wall 56 in a direction parallel to the direction in which the substrate 62 projects from the holder HR. It has two places.

  FIG. 11 is a cross-sectional view of the sensor assembly SA in the harness storage section HH. Specifically, FIG. 11 corresponds to the section 11-11 in FIG. 10, but is not the section of the holder HR but the section of the sensor assembly SA.

  As shown in FIG. 11, the harness 30 is sandwiched between a first holder portion 40 and a second holder portion 50 which are arranged to face each other. In the present embodiment, the second holder side wall 56 is disposed outside the first holder side wall 44 in the width direction W. Then, the pair of first holder side walls 44 is inclined inward and is in contact with the second holder portion 50, and the outer peripheral surfaces of the pair of first holder side walls 44 (the first holder side wall outer surfaces 44 a) are in contact with the case 20. are doing.

  The harness 30 includes a plurality of wires 32, a cover 36 that accommodates the plurality of wires 32 and forms the outer periphery of the harness 30, and a thread 34 that fills the cover 36 together with the wires 32. The cross section of the harness 30 shown in FIG. 11 has a substantially elliptical shape in which a circular shape is crushed in a direction in which the first holder portion 40 and the second holder portion 50 are opposed to each other and the width direction W is a long axis. .

Here, the operation of the present embodiment will be described.
The case 20 is formed by injection molding, as in the molding process illustrated in FIGS. 6B and 6C. However, in the present embodiment, as shown in FIG. 12, a contact surface 49 of the first holder portion 40 that is in contact with the punch pin 90 on the harness storage portion HH side, and a harness storage portion of the second holder portion 50. On the HH side, pressure is applied by the punch pin 90 to the contact surface 59, which is the portion where the punch pin 90 contacts. Specifically, a pressure is applied in a direction in which the first holder section 40 and the second holder section 50 face each other. That is, a hole for inserting the punch pin 90 is formed in the mold 70, and the injection pin 90 is inserted from the hole to perform injection molding while holding the contact surfaces 49 and 59 of the holder HR.

  Here, when pressure is applied to the contact surfaces 49 and 59 by the punch pin 90, a force is applied to the harness 30 to crush the harness 30 in a direction orthogonal to the width direction W. Since the harness 30 has a structure in which the yarn 34 is filled therein, it is easy to be deformed in the radial direction. Therefore, the harness 30 is configured so that the diameter in the direction orthogonal to the width direction W is reduced by the above-described force. Deform. Therefore, assuming that no force is applied by the punch pin 90, even if the first holder portion 40 and the second holder portion 50 do not overlap in the direction orthogonal to the width direction W due to the tolerance of the harness 30, By deforming the harness 30 by applying a force, the first holder portion 40 and the second holder portion 50 can be overlapped in the above direction. For this reason, as shown in FIG. 11, the tip 44 c side of the first holder side wall 44 can be brought into contact with the second holder 50. Then, by the injection molding, the first holder side wall 44 is inclined inward and comes into contact with the second holder portion 50, whereby the penetration of the resin material 80 into the inside of the harness accommodation portion HH is sufficiently suppressed.

  On the other hand, in the comparative example shown in FIG. 13, the cover 36 covers the wiring 32 around the harness 30, and the cover 36 is thicker than in the present embodiment. Therefore, even if a force is exerted by the punch pin 90, the harness 30 is hardly deformed. For this reason, the gap between the first holder part 40 and the second holder part 50 becomes large, and the resin material 80 may enter the harness accommodation part HH in the molding process.

<Other embodiments>
Note that at least one of the items of the above embodiment may be changed as follows. In the following, the correspondence between the items described in the section of “Means for Solving the Problems” and the items in the above-described embodiment is exemplified by reference numerals and the like. Is not intended to be limited. Incidentally, structures described in the "2" column of the "means for solving the problems" is a case where the first A holder portion and the first holder portion 40, shown in FIG. 7 (b) structure, 7A, the structure on the direction R side, the structure on the direction L side in FIG. 7D, and the structure shown in FIG. 7A when the B holder unit is the first holder unit 40 . 7 (c) and the structure on the direction R side in FIG. 7 (d). The event described in “5” is the event shown in FIG. 8A in the case where the A-th holder portion is the first holder portion 40 and the event shown in FIG. 8A in the case where the B-th holder portion is the first holder portion 40. This corresponds to the event shown in FIG.

・ "About the first holder"
The thickness of the case 20 in the width direction W before the injection molding is not limited to a constant member. For example, a structure in which the thickness of the case 20 in the width direction W before the injection molding becomes thinner toward the second holder may be tapered. In this case, when the pressure is applied by the resin material 80, the first holder portion is more easily inclined inward.

  It is not limited to one formed by injection molding. In the case where injection molding is not performed, before the case 20 is subjected to insert molding, the first holder side wall 44 can be easily formed to be inclined inward from the beginning instead of having a shape extending in a direction perpendicular to the first holder main surface 42a. Becomes In that case, the first holder side wall 44 and the second holder portion 50 can more reliably prevent the resin from entering the substrate 62 side.

  In the above embodiment, the material of the first holder portion 40 is the same as the material of the case 20, but is not limited to this. For example, the material of the first holder portion 40 may have a melting point higher than the melting point of the material of the case 20.

・ "About the second holder"
The thickness of the case 20 in the width direction W before the injection molding is not limited to a constant member. For example, a structure in which the thickness of the case 20 in the width direction W before the injection molding becomes thinner toward the first holder may be tapered. In this case, when the pressure is applied by the resin material 80, the second holder portion is more easily inclined inward.

  It is not limited to one formed by injection molding. In the case other than the injection molding, before the case 20 is subjected to the insert molding, the second holder side wall 56 can be easily formed to be inclined inward from the beginning instead of having a shape extending in a direction perpendicular to the second holder main surface 54a. Becomes In that case, in the second embodiment, the second holder side wall 56 and the concave portion 46 can more reliably prevent the resin from entering the substrate 62 side.

  In the above-described embodiment, the material of the second holder portion 50 is the same as the material of the case 20, but is not limited thereto. For example, the material of the second holder 50 may have a melting point higher than the melting point of the material of the case 20.

・ "Labyrinth structure by first holder side wall and second holder side wall"
In the second embodiment, the pair of second holder side walls 56 are located on the inner side in the width direction W of the substrate 62 than the pair of first holder side walls 44. However, the present invention is not limited to this. For example, the pair of second holder side walls 56 may be located outside the pair of first holder side walls 44 in the width direction W. Further, for example, one of the pair of second holder side walls 56 is located on the inner side in the width direction W than one of the pair of first holder side walls 44, and the other of the pair of second holder side walls 56 is connected to the first pair of first holder side walls 56. The holder side wall 44 may be located outside the width direction W from the other side.

  In the third embodiment, the second holder side walls 56 of the harness storage portion HH are partially arranged at two places in the direction in which the substrate 62 projects from the holder HR, but the present invention is not limited to this. For example, the board 62 may be provided on the entire harness housing portion HH along the direction in which the board 62 protrudes from the holder HR. In this case, it is not essential that the pair of second holder side walls 56 be located outside the pair of first holder side walls 44 in the width direction W of the substrate 62 in the harness storage portion HH. For example, the pair of second holder side walls 56 may be located on the inner side in the width direction W than the pair of first holder side walls 44. In the third embodiment as well, it is not essential to provide the second holder side wall 56 in the harness accommodation portion HH.

For example, in FIG. 7A, the structure may be such that the first holder side wall 44 is further inclined inward and comes into contact with the second holder side wall 56.
・ "About harness"
In the third embodiment, the thread 34 is filled in the cover 36, but is not limited to this. For example, a gel, a resin, or the like may be used. In short, a member that is more easily deformed than the cover 36 may be filled.

・ "About the magnetic sensor circuit"
The present invention is not limited to two integrated circuits 64 each having a Hall element. For example, one may be provided, or three or more may be provided.

  It is not limited to the one provided with the substrate. For example, an integrated circuit having a Hall element and a conductor to which pins of the integrated circuit are welded may be provided, and this conductor may be connected to the harness 30. In this case, the main surface of the conductor portion in the magnetic sensor circuit may be used as the circuit main surface, and at least a part of the conductor portion may be accommodated in the Hall sensor.

・ "About magnetic sensing element"
The present invention is not limited to the one provided with the Hall sensor, and may be, for example, a TMR (Tunnel Magnetoresistive) element.

・ "Flux output device"
The number of the teeth 13a and 13b and the number of the north pole and the south pole of the permanent magnet 18 are not limited to those illustrated in FIG.

  DESCRIPTION OF SYMBOLS 10 ... Magnetic flux output device, 12a, 12b ... Magnetic yoke, 13a, 13b ... Teeth, 14a, 14b ... Magnetic collecting ring, 16a, 16b ... Magnetic collecting part, 18 ... Permanent magnet, 20 ... Case, 22 ... Body part, 24 ... Flange part, 26 ... Hole, 30 ... Harness, 40 ... First holder part, 42 ... First holder base, 42a ... First holder main surface, 44 ... First holder side wall, 44a ... First holder side wall outer surface, 46 .., Concave portion, 50... Second holder portion, 52... Large base portion, 53... Step portion, 54... Small base portion, 54 a, second holder main surface, 54 b, end surface, 56, second holder side wall, 56 a. Outer surface, 60: magnetic sensor circuit, 62: substrate, 62b: main surface, 64: integrated circuit, 70: mold, 80: resin material.

Claims (7)

In a sensor assembly that constitutes a torque sensor including a magnetic flux output device that outputs a magnetic flux according to the torsion at both ends of the torsion bar,
The sensor assembly includes a magnetic sensor circuit that outputs a magnetic flux output from the magnetic flux output device as a detection value of a torque applied to the torsion bar, a holder that holds the magnetic sensor circuit, and a case that houses the holder. To provide,
The holder includes a first A holder portion having a first A holder main surfaces one opposed to the one of the pair of circuit main surface of the magnetic sensor circuit, the B facing the other of said pair of circuit main surface The magnetic sensor is provided in a space defined by a B-th holder portion having a holder main surface and an A- holder side wall protruding toward the B- holder portion side with respect to the A- holder main surface in the A-th holder portion. By holding a part of the circuit, the magnetic sensor circuit is held,
The A-th holder side wall is inclined to the inside of the holder and is in contact with the B-th holder portion,
The case is made of resin, a sensor assembly, characterized in that in contact with the first A holder sidewall outer surface is the outer surface of the first A holder sidewall. The A-th holder side wall includes a pair of side walls extending from each of the mutually opposing sides of the A-th holder main surface,
The B-th holder portion includes a B- holder side wall that is a side wall protruding toward the A- holder portion side with respect to the B-th holder main surface,
The B-th holder side wall includes a pair of side walls extending from respective opposing sides of the B-th holder main surface,
One of the pair of the first A holder sidewall, than one of the pair of the first B holder sidewall disposed adjacent to the outer or inner, the other of the pair of the first A holder sidewalls, a pair of the first B holder sidewall Is disposed adjacent to the outside or inside of the other,
Wherein the A holder sidewalls are and are inclined inwardly in contact with the first B holder portion and the second A holder sidewall outer surface of at least Yusuke that claim 1, wherein the structure you are in contact with the resin constituting the case Sensor assembly. A harness in which a plurality of wires connected to the magnetic sensor circuit are bundled;
The holder includes a harness receiving portion, and an end of the harness is formed by a portion of the A-th holder portion that forms the harness receiving portion and a portion of the B-th holder portion that receives the harness. Contains
The harness includes the plurality of wires, a cover that covers the plurality of wires and forms an outer periphery of the harness, and a member that is filled in the cover together with the plurality of wires and is easier to deform than the cover. The sensor assembly according to claim 1, further comprising: In a method of manufacturing a sensor assembly constituting a torque sensor including a magnetic flux output device that outputs a magnetic flux according to the torsion of both ends of the torsion bar,
The sensor assembly includes a magnetic sensor circuit that outputs a magnetic flux output from the magnetic flux output device as a detection value of a torque applied to the torsion bar, a holder that holds the magnetic sensor circuit, and a case that houses the holder. To provide,
The holder includes a first A holder portion having a first A holder main surfaces one opposed to the one of the pair of circuit main surface of the magnetic sensor circuit, the B facing the other of said pair of circuit main surface The magnetic sensor is provided in a space defined by a B holder portion having a holder main surface and an A holder side wall protruding toward the B holder portion side with respect to the A holder main surface in the A holder portion. By holding a part of the circuit, the magnetic sensor circuit is held,
An accommodation step of accommodating a part of the magnetic sensor circuit in the holder,
A molding step of injection molding the case by disposing a holder containing a part of the magnetic sensor circuit in a mold that partitions the case and pouring a resin material having fluidity into the mold, Has,
In the forming step, by the resin material applies pressure to push the first A holder sidewall inward to the first A holder sidewall, said first A holder sidewall contacts the second B holder portion inclined inwardly A method for manufacturing a sensor assembly characterized by the following. The A-th holder side wall includes a pair of side walls extending from each of the mutually opposing sides of the A-th holder main surface,
The B-th holder portion includes a B- holder side wall that is a side wall protruding toward the A- holder portion side with respect to the B-th holder main surface,
The B-th holder side wall includes a pair of side walls extending from respective opposing sides of the B-th holder main surface,
In the accommodating step, one of the pair of A- side holder side walls is disposed adjacent to the outside or inside of one of the pair of B-th holder side walls, and the other of the pair of A- side holder side walls is formed of a pair of the A- side holder side walls. Placed adjacent to the outside or inside of the other side of the B-th holder side wall,
In the forming step, elephants that the resin material you contact with the first B holder portion and the second A holder sidewall inclined inwardly by applying pressure to press the first A holder sidewall inward to the first A holder sidewall There at least occurs Ru請 Motomeko 4 manufacturing method of a sensor assembly according. The magnetic sensor circuit is an integrated circuit having a magnetic sensing element is soldered to a substrate,
The method according to claim 4, wherein the circuit main surface is a main surface of the substrate. A harness in which a plurality of wires connected to the magnetic sensor circuit are bundled,
The holder includes a harness receiving portion, and an end of the harness is formed by a portion of the A-th holder portion that forms the harness receiving portion and a portion of the B-th holder portion that receives the harness. Contains
The harness includes the plurality of wirings, a cover that covers the plurality of wirings and forms an outer periphery of the harness, and a member that is filled in the cover together with the plurality of wirings and is easier to deform than the cover. Prepared,
In the housing step, a part of the harness is housed in the holder,
In the molding step, when the holder housing a part of the magnetic sensor circuit and a part of the harness is arranged in a mold that partitions the case, and a resin material having fluidity is poured into the mold, claim adding said first a holder portion and the pressure of the second direction B holder portion are opposed to each other in each of said first B holder unit-a constituting the holder part and the harness accommodating portion constituting the harness receiving portion A method for manufacturing the sensor assembly according to any one of claims 4 to 6.

Images