JP6592974B2 - Light source device - Google Patents

Description

  The present invention relates to a light bulb type light source device using, for example, an LED element.

Currently, as an alternative to a halogen bulb, a bulb-type light source device (LED bulb) using an LED element is used from the viewpoint of energy saving and long life.
For example, as shown in FIG. 5 and FIG. 6, Patent Literature 1 discloses a light bulb-type light source device 60 in which a light emitting unit is configured by a light emitting unit 61 in which a plurality of rod-like light emitting devices 65 whose overall shape is long and thin are connected. It is disclosed. The light emitting device 65 is configured by mounting a plurality of light emitting elements 66 on a lead frame type package 67. The light emitting unit 61 in the light source device 60 includes an outer end portion of one lead frame 68 on which the light emitting element 66 in one light emitting device is mounted, and an outer end portion of the other lead frame 69 in another adjacent light emitting device. Are connected so that adjacent light emitting devices are V-shaped. The light emitting unit 61 is connected in series to the pair of power supply leads 63 and 63.

Japanese Patent No. 5463447

Thus, in the light emitting unit 61 having the above-described configuration, as indicated by the white arrow in FIG. 6, the heat generated in the light emitting element 66 is transferred to one lead frame 68 on which the light emitting element 66 is mounted. It is.
However, in the light-emitting device in which one lead frame 68 on which the light-emitting element 66 is mounted is connected to the power supply lead 63, heat can be radiated (exhausted heat) to the outside through the power supply lead 63. The heat generated in the light emitting device cannot be efficiently radiated (heat exhausted). For this reason, there is a structural problem that heat is likely to be accumulated in each light emitting device 60 and the light output efficiency of the light emitting element 66 is adversely affected. Therefore, in the light emitting unit 60 having the above configuration, it is difficult to increase the output of the light emitting element 66 itself.

  The present invention has been made based on the above circumstances, and provides a light source device capable of efficiently exhausting heat generated in a light emitting element and achieving high output. Objective.

The light source device of the present invention is a light source device in which a light emitting unit is configured by connecting a plurality of light emitting modules each including two lead frames separated from each other and a plurality of light emitting elements fixed to one of the lead frames. ,
One end of the heat transfer member is connected to a connection point where one lead frame to which the plurality of light emitting elements are fixed in two adjacent light emitting modules is connected, and the other end of the heat transfer member is a heat radiating portion. It is characterized by being thermally connected to.

  Furthermore, in the light source device of the present invention, it is preferable that the plurality of light emitting modules are supported by the heat transfer member.

  According to the light source device of the present invention, the heat generated in each of the plurality of light emitting modules is transferred to the heat radiating portion via the heat transfer member thermally connected to one lead frame on which the light emitting element is mounted. be able to. For this reason, it is possible to avoid the accumulation of heat in each light emitting module. Therefore, it is possible to increase the input to the light emitting element in each light emitting module and to achieve high output.

It is a fragmentary sectional view which shows the structure in an example of the LED bulb which concerns on the light source device of this invention. It is an enlarged view which shows the circular area | region enclosed with the broken line in FIG. It is sectional drawing of the longitudinal direction which shows the structure of a light emitting module roughly. It is a figure which shows the structure of the light emission part of the light source device shown in FIG. 1 in the state expand | deployed on the plane. It is a front view which shows the structure in an example of the conventional light source device in the state which abbreviate | omitted one part. It is a figure which shows the structural example of the light emission part in the light source device shown in FIG. 5 in the state expand | deployed on the plane.

Hereinafter, embodiments of the present invention will be described in detail.
FIG. 1 is a partial cross-sectional view showing the configuration of an example of an LED bulb according to the light source device of the present invention. FIG. 2 is an enlarged view showing a circular region surrounded by a broken line in FIG.
The LED bulb 10 is formed to have substantially the same appearance as, for example, a halogen bulb so as to be an alternative to the existing general illumination bulb. The specific configuration of the LED bulb 10 will be described. The LED bulb 10 includes, for example, a substantially spherical translucent cover member (glove) 15 and a socket portion 20 to which the translucent cover member 15 is attached. Yes.

  As a material constituting the translucent cover member 15, for example, transparent glass, opaque ground glass, transparent or milky white (ground glass) plastic material, or the like can be used.

  The socket part 20 is supported by the power supply support body 27 inside the heat dissipation member 21, the heat dissipation member 21 having the electrical equipment part arrangement space S therein, the power supply support body 27 fixed to one end of the heat dissipation member 21, and the heat dissipation member 21. And an electrical component (not shown) provided. The electrical component includes, for example, a control board (not shown) that converts a commercial power source into a light source driving power source.

The heat radiating member 21 has a small-diameter cylindrical portion 22 positioned inside the translucent cover member 15 and a large-diameter cylindrical portion 25 that extends continuously in one end of the small-diameter cylindrical portion 22 in the axial direction. The small diameter cylindrical portion 22 is integrally provided with an end wall 23 that closes the other end side opening of the small diameter cylindrical portion 22 at a position on the inner side in the axial direction from the opening end surface on the other end side. A heat radiation substrate holding portion 24 is formed by a space surrounded by the protruding portion 22 a protruding in the axial direction from the outer surface of the end wall 23 in the small diameter cylindrical portion 22 and the end wall 23.
Examples of the material constituting the heat radiating member 21 include metal materials such as aluminum and copper.

  The power supply support 27 is made of, for example, a resin material and has a function of supporting the electrical component, and electrically connects the base (power supply terminal) 28 and the heat dissipation member 21 provided at one end of the power supply support 27. Has a function of insulating.

The heat dissipation substrate holding part 24 in the heat dissipation member 21 receives and holds the heat dissipation substrate 30 constituting the heat sink.
An electrical insulating layer 31 is provided on one surface (the upper surface in FIG. 2) of the heat dissipation substrate 30, and a power feeding pattern circuit 32 made of, for example, copper is formed on the one surface of the electrical insulating layer 31. Reference numeral 33 denotes a resist.
One end of the power supply line 35 is connected to the pattern circuit 32 by, for example, solder, and the other end of the pair of power supply leads 42a and 42b is connected by, for example, solder. The other end portion of the power supply line 35 is led out to the electrical equipment arrangement space S inside the heat dissipation member 21 through a through hole formed in the end wall 23 of the heat dissipation member 21 and connected to the control board.
As a material constituting the heat dissipation substrate 30, for example, aluminum, ceramics, or the like can be used.
The thickness of the heat dissipation substrate 30 is, for example, 1 mm.

  Inside the translucent cover member 15, a light emitting unit 40 configured by connecting a plurality of light emitting modules 45 is disposed and supported by a pair of power supply leads 42 a and 42 b.

As shown in FIG. 3, the light emitting module 45 includes a bar-shaped resin package 46 that is elongated in one direction and has a cavity (concave portion) 46 a that opens on one surface. The cavity 46a has a flat bottom surface and has a shape that is inclined so that both sides in one direction (longitudinal direction) expand in the opening direction as it goes outward.
The resin material constituting the resin package 46 is preferably a light transmissive material. As such a resin material, for example, a transparent resin material with high heat resistance in which a glass component is contained in nylon can be exemplified.

Two plate-like lead frames 47a and 47b separated from each other are provided in the cavity 46a of the resin package 46 so that the outer end portions extend outward from both ends of the resin package 46, respectively. .
As a material constituting the lead frames 47a and 47b, for example, an iron-based or copper-based metal material can be used.

A plurality of light emitting elements 50 are mounted in one direction on one surface of one lead frame 47a in the cavity 46a.
The light emitting element 50 in this example is composed of, for example, a chip-like LED element in which both positive and negative electrodes are positioned on the surface of the element, and the back surface is fixed to one surface of one lead frame 47a by, for example, an adhesive material. ing. As the light emitting element 50, for example, an LED element that emits light having a peak wavelength at 445 nm to 460 nm can be used.

  Each light emitting element 50 is electrically connected by a bonding wire 49. The light emitting elements positioned at both ends are electrically connected to one lead frame 47a or the other lead frame 47b by bonding wires 49, respectively. With such a configuration, one lead frame 47a accommodated in one cavity 46a and the other lead frame 47b are electrically connected via the bonding wire 49 and the light emitting element 50. The

The cavity 46 a is filled with a sealing agent 48 that seals each light emitting element 50, the two lead frames 47 a and 47 b, and the bonding wire 49.
As the sealant 48, for example, a light transmissive silicon resin or epoxy resin can be used. The sealant 48 may contain a fluorescent material (not shown) that converts the wavelength of the light emitted from the light emitting element 50 and outputs it.

The light emitting unit 40 in this example is configured by a light emitting unit 41 in which a plurality of light emitting modules 45 are connected.
The light emitting unit 41 in this example includes four elements 41a, 41b, 41c, and 41d as shown in FIG. Each element 41a, 41b, 41c, 41d has two light emitting modules having the same configuration (hereinafter, for convenience, two light emitting modules constituting one element are denoted by reference numerals “45a”, “45b”, respectively). The outer end portions of the other lead frame 47b are joined together by welding, for example, to form a V shape.
An outer end portion of one lead frame 47a in the other light emitting module 45b of the first element 41a and an outer end portion of one lead frame 47a in the one light emitting module 45a of the second element 41b are, for example, Joined by welding. The outer end portion of one lead frame 47a in the other light emitting module 45b of the second element 41b and the outer end portion of one lead frame 47a in the one light emitting module 45a of the third element 41c are welded, for example. Are joined by. The same applies to the third element 41c and the fourth element 41d. Accordingly, the plurality of light emitting modules 45 are connected in series in a zigzag manner.

  The light emitting unit 41 is supported by the pair of power supply leads 42a and 42b in a state where one lead frame 47a of each of the light emitting modules 45a and 45b is positioned on the socket part 20 side inside the translucent cover member 15. Has been placed. That is, the other end of one lead frame 47a in one light emitting module 45a of the first element 41a is electrically connected to one end of one power supply lead 42a, and the other light emitting module of the fourth element 41d. The other end of one lead frame 47a in 45b is electrically connected to one end of the other power lead 42b.

  Thus, in the LED bulb 10 described above, the heat transfer member 43 for transferring the heat generated from each light emitting element 50 in the light emitting unit 41 to the heat radiating portion is provided. In FIG. 4, the heat transfer member 43 is hatched for convenience. Here, the “heat dissipating part” is constituted by a constituent member made of a material having high thermal conductivity. Specifically, the heat dissipation part in this example includes a heat dissipation substrate 30 and a heat dissipation member 21. The power leads 42a and 42b also function as heat transfer members for transferring heat generated from the light emitting elements 50 in the light emitting unit 41 to the heat radiating portion.

One end of the heat transfer member 43 is connected to a connection point between the elements 41a, 41b, 41c, 41d, that is, a connection point where one lead frame 47a of two adjacent light emitting modules is electrically connected. . Further, as shown in FIG. 2, the other end of the heat transfer member 43 is connected to the power feeding pattern circuit 32 by soldering, for example. Thus, the heat transfer member 43 is thermally connected to the heat dissipation member 21 via the heat dissipation substrate 30. Further, the heat transfer member 43 has a function of supporting the light emitting unit 41, and thus the light emitting unit 41 is supported in an appropriate posture by the pair of power supply leads 42 a and 42 b and the heat transfer member 43.
As the material constituting the heat transfer member 43, those exemplified as the material constituting the lead frames 47a and 47b in the light emitting module 45 can be used. Even if the material is the same as the lead frames 47a and 47b, different materials are used. It may be.

As an example of the dimensions of the light emitting module 45, the total length including the lead frames 47a and 47b is 16 mm, and the vertical dimension in FIG. 3 is 1.2 mm. The dimensions of the cavity 46a in the resin package 46 are an opening portion of 10.7 mm × 0.7 mm and a depth of 0.6 mm. The light emitting element 50 has an output of 20 mW, a size of 0.24 mm × 0.48 mm, and a thickness of 0.09 mm. The arrangement interval of the light emitting elements 50 is 2 mm, and the number of the light emitting elements 50 is three. The lead frame 47a, 47b has a width dimension of 0.5 mm and a thickness of 0.2 mm.
In addition, when one configuration example of the light emitting unit 41 is shown, the number of the light emitting modules 45 is eight. The material of the heat transfer member 43 is copper, and the surface is nickel-plated. The shape of the heat transfer member 43 is a cylindrical shape having an outer diameter of φ1 mm. The power leads 42a and 42b are made of copper and have a wire diameter of 0.7 mm.

Thus, in the LED bulb 10 described above, the light emitting unit 41 is configured by connecting the outer ends of one lead frame 47a on which the light emitting element 50 of the four elements 41a, 41b, 41c, 41d is mounted. One end of the heat transfer member 43 is connected to the connection point of each element 41a, 41b, 41c, 41d. Therefore, as indicated by the white arrows in FIG. 4, the heat generated in each of the plurality of light emitting modules 45a and 45b is transferred to the heat transfer member 43 through one lead frame 47a. The heat generated in one light emitting module 45a in the first element 41a and the heat generated in the other light emitting module 45b in the fourth element 41d are transferred to the power leads 42a and 42b. Since the heat transfer member 43 and the power supply leads 42a and 42b are thermally connected to the heat dissipation member 21 via the heat dissipation substrate 30, heat is transferred to the heat transfer member 43 and the power supply leads 42a and 42b. Heat is radiated from the outer peripheral surface of the heat radiating member 21 to the outside. Therefore, according to the LED bulb 10 described above, the heat generated in each light emitting element 50 can be efficiently exhausted and can be avoided from being accumulated in each light emitting module 45a, 45b. Thereby, the input with respect to the light emitting element 50 in each light emitting module 45a, 45b can be enlarged, and high output of LED bulb 10 itself can be achieved.
Specifically, according to the LED bulb 10, the input to the light emitting element 50 is 200% compared to an LED bulb having the same configuration as the LED bulb except that it does not have a heat transfer member. It can be made larger.

  Further, since the heat transfer member 43 also functions as a support mechanism for the light emitting unit 41, the light emitting unit 41 can be prevented from being deformed or damaged, and the light emitting unit 41 can be arranged in an appropriate posture. Further, since the heat transfer member 43 is connected to the connection point on the lower end side of the adjacent light emitting module in the light emitting unit 41, it is possible to avoid blocking light from the light emitting module. Therefore, according to the LED bulb 10 described above, a desired light distribution can be reliably obtained.

Furthermore, according to said LED light bulb 10, the following effects are acquired.
In the LED bulb 10, as described above, the outer ends of one lead frame 47a of the two adjacent light emitting modules 45a and 45b constituting different elements are joined to each other. Thus, the light emitting unit 41 is configured by connecting the plurality of light emitting modules 45a and 45b in a zigzag manner. For this reason, according to said LED bulb 10, the light emission form similar to the metal filament in a general halogen bulb can be taken. Further, since the resin package 46 in each of the light emitting modules 45a and 45b is made of a light transmissive resin, not only the front and back surfaces of the lead frames 47a and 47b but also the extending direction of the lead frames 47a and 47b can be used. Can be taken out. Therefore, according to said LED bulb 10, light can be radiated | emitted in a wide range.

As mentioned above, although embodiment of this invention was described, this invention is not limited to said embodiment, A various change can be added.
For example, in the light emitting unit, it is not necessary that all the light emitting modules are arranged such that one lead frame on which the light emitting element is mounted is positioned on the socket side. For example, like the light emitting unit 61 in the conventional LED bulb shown in FIG. 6, one lead frame of one light emitting module may be connected to the other lead frame of another adjacent light emitting module. . In the thing of such a structure, the end of a heat-transfer member should just be thermally connected to each connection point of a light emitting module.
Further, in the light emitting unit, the adjacent light emitting modules do not need to have the lead frames joined together, and may be configured to be electrically and thermally connected via an appropriate conductive member.

In addition, the number of light emitting modules constituting the light emitting unit, the number of light emitting elements in each light emitting module, and other specific configurations can be changed as appropriate according to the purpose. Further, the light emitting element is not limited to a chip shape.
Furthermore, when the light emitted from the light emitting element is wavelength-converted and output, the phosphor on the inner surface of the translucent cover member can be used even if the sealant in the light emitting module is configured to contain a fluorescent material. Either a structure having a film formed may be used.

10 LED bulb 15 Translucent cover member (globe)
20 Socket part 21 Heat radiating member 22 Small diameter cylindrical part 22a Protruding part 23 End wall 24 Heat radiating board holding part 25 Large diameter cylindrical part 27 Power supply support 28 Base 30 Heat radiating board (heat sink)
31 Electrical insulating layer 32 Pattern circuit 33 Resist 35 Feed line 40 Light emitting part 41 Light emitting unit 41a 1st element 41b 2nd element 41c 3rd element 41d 4th element 42a, 42b Power supply lead 43 Heat transfer member 45, 45a, 45b Light emitting module 46 Resin package 46a Cavity (recess)
47a One lead frame 47b The other lead frame 48 Sealant 49 Bonding wire 50 Light emitting element 60 Light source device 61 Light emitting unit 63 Power supply lead 65 Light emitting device 66 Light emitting element 67 Package 68 One lead frame 69 The other lead frame S Electrical equipment Division layout space

Claims (2)

In a light source device in which a plurality of light emitting modules each including two lead frames separated from each other and a plurality of light emitting elements fixed to one of the lead frames is connected to form a light emitting unit.
One end of the heat transfer member is connected to a connection point where one lead frame to which the plurality of light emitting elements are fixed in two adjacent light emitting modules is connected, and the other end of the heat transfer member is a heat radiating portion. A light source device characterized by being thermally connected to the light source. The light source device according to claim 1, wherein the plurality of light emitting modules are supported by the heat transfer member .

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