JP6536057B2 - Wiring board and method of manufacturing the same - Google Patents

Wiring board and method of manufacturing the same Download PDF

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JP6536057B2
JP6536057B2 JP2015022152A JP2015022152A JP6536057B2 JP 6536057 B2 JP6536057 B2 JP 6536057B2 JP 2015022152 A JP2015022152 A JP 2015022152A JP 2015022152 A JP2015022152 A JP 2015022152A JP 6536057 B2 JP6536057 B2 JP 6536057B2
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wiring
insulating
portion
conductive portion
formed
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JP2016146391A (en
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良尚 松岡
良尚 松岡
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日本電気株式会社
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Description

  The present invention relates to a wiring board, and more particularly to a technique for reducing noise of a signal transmitted through the wiring board.

  BACKGROUND ART With the development of the information communication society, performance enhancement and miniaturization of information terminal devices and video devices are progressing. In wiring boards such as printed wiring used in information terminal devices and video devices, the number of signal wiring increases, the wiring pattern becomes more complicated, and miniaturization progresses due to high performance and miniaturization, and wiring miniaturization and miniaturization Densification has been carried out. With the increase and complexity of the number of signal lines, it is also important to properly arrange power supply lines and ground lines.

  A multilayer wiring board in which a plurality of wiring layers are stacked has come to be used due to the increase in the number of wiring lines and the complexity of wiring patterns. In a multilayer wiring board, not only miniaturization of wiring of each layer but also vias connecting wirings of each layer are densified. Therefore, in a wiring board such as a printed circuit board, a technique for arranging the wiring and the via at high density is important.

  Further, with the advancement of performance, the speed of signals transmitted on wiring boards has been advanced. With the speeding up of signals transmitted on wiring boards such as printed boards, signal transmission is performed at low voltage. The lower the voltage at which the signal is transmitted, the greater the effect of fluctuations in voltage value. For example, by lowering the voltage of the signal, the influence of the noise of the power supply on the signal is increased. Therefore, techniques for reducing power supply noise in a wiring board such as a printed board are also important.

  From the above background, in wiring boards such as printed boards for transmitting high-speed signals, development of techniques for densifying wiring patterns and reducing power supply noise has been conducted. As a technology for increasing the density of wiring patterns and reducing power supply noise in such a wiring substrate, for example, a technology as disclosed in Patent Document 1 is disclosed.

  Patent Document 1 discloses a wiring board having a multilayer structure in which a capacitor for reducing power supply noise is formed. In the wiring substrate of Patent Document 1, the power supply wiring, the ground wiring, and the interlayer insulating film formed in the upper layer and the lower layer of the interlayer insulating film form a planar capacitor. According to Patent Document 1, with such a configuration, power supply noise can be reduced without separately mounting a capacitor, so that the substrate can be miniaturized.

International Publication No. 2008/102717

  However, the technique of Patent Document 1 is not sufficient in the following points. In the wiring substrate of Patent Document 1, power supply noise is reduced by forming a capacitor between the power supply wiring formed in the upper layer and the lower layer of the interlayer insulating film and the ground wiring. In the wiring board of Patent Document 1, in order to form a planar capacitor, it is necessary to arrange the power supply wiring and the ground wiring so that the horizontal positions of the power supply wiring and the ground wiring overlap. Therefore, in the wiring board of Patent Document 1, an area for arranging a planar capacitor is required. Further, in the wiring substrate of Patent Document 1, design alignment is intensified in order to align the positions of the power supply wiring and the ground wiring so as to have a predetermined area overlap, wiring of wiring becomes complicated, and the area of the wiring pattern is increased. It can be big. As a result, with the wiring board of Patent Document 1, there is a risk that sufficient densification can not be performed. Therefore, the technique of Patent Document 1 is not sufficient as a technique for densifying the wiring substrate while reducing the noise of the power supply.

  An object of the present invention is to obtain a wiring board which can be densified while reducing power supply noise.

  In order to solve the above-mentioned subject, the wiring board of the present invention is provided with the 1st wiring layer, the 2nd wiring layer, the insulating layer, and the via. The first insulating layer is formed with a first wiring to which a power supply voltage is applied. The second insulating layer is provided with a second wiring to which a voltage different from the power supply voltage is applied. The insulating layer insulates between the first wiring layer and the second wiring layer. The via penetrates the insulating layer and is between the first conductive portion connected to the first wire, the second conductive portion connected to the second wire, and the first conductive portion and the second conductive portion And a via insulator filled with an insulator.

  The method for manufacturing a wiring board of the present invention includes a first hole forming step and a press-fitting step. In the first hole forming step, the first wiring layer, the insulating layer, and the second wiring layer are penetrated through the substrate on which the first wiring layer, the insulating layer, and the second wiring layer are stacked. Through holes can be drilled. The first wiring layer is formed with a first wiring to which a power supply voltage is applied. The second wiring layer is formed with a second wiring to which a voltage different from the power supply voltage is applied. In the press-fitting step, the member including the first conductive portion, the insulating portion, and the second conductive portion in the first through hole includes the first conductive portion and the first wiring, and the second conductive portion. The part and the second wiring are press-fit so as to be in contact with each other.

  According to the present invention, it is possible to achieve high density while reducing power supply noise.

It is a figure showing an outline of composition of a 1st embodiment of the present invention. It is a figure which shows the outline | summary of a structure of the 2nd Embodiment of this invention. It is a top view of the wiring board of a 2nd embodiment of the present invention. It is a top view of the wiring board of a 2nd embodiment of the present invention. It is sectional drawing in the manufacture step of the wiring board of the 2nd Embodiment of this invention. It is sectional drawing in the manufacture step of the wiring board of the 2nd Embodiment of this invention. It is sectional drawing in the manufacture step of the wiring board of the 2nd Embodiment of this invention. It is sectional drawing in the manufacture step of the wiring board of the 2nd Embodiment of this invention. It is sectional drawing in the manufacture step of the wiring board of the 2nd Embodiment of this invention. It is sectional drawing in the manufacture step of the wiring board of the 2nd Embodiment of this invention. It is sectional drawing in the manufacture step of the wiring board of the 2nd Embodiment of this invention. It is sectional drawing in the manufacture step of the wiring board of the 2nd Embodiment of this invention. It is sectional drawing in the manufacture step of the wiring board of the 2nd Embodiment of this invention. It is sectional drawing in the manufacture step of the wiring board of the 2nd Embodiment of this invention. It is sectional drawing in the manufacture step of the wiring board of the 2nd Embodiment of this invention. It is sectional drawing in the manufacture step of the wiring board of the 2nd Embodiment of this invention. It is a figure which shows the outline | summary of a structure of the 3rd Embodiment of this invention. It is a top view of the wiring board of a 3rd embodiment of the present invention. It is a top view of the wiring board of a 3rd embodiment of the present invention. It is sectional drawing in the manufacture step of the wiring board of the 3rd Embodiment of this invention. It is a top view in the manufacture stage of the wiring board of a 3rd embodiment of the present invention. It is a top view in the manufacture stage of the wiring board of a 3rd embodiment of the present invention. It is sectional drawing in the manufacture step of the wiring board of the 3rd Embodiment of this invention. It is a top view in the manufacture stage of the wiring board of a 3rd embodiment of the present invention. It is sectional drawing in the manufacture step of the wiring board of the 3rd Embodiment of this invention. It is a top view in the manufacture stage of the wiring board of a 3rd embodiment of the present invention. It is sectional drawing in the manufacture step of the wiring board of the 3rd Embodiment of this invention. It is a top view in the manufacture stage of the wiring board of a 3rd embodiment of the present invention. It is a top view in the manufacture stage of the wiring board of a 3rd embodiment of the present invention.

First Embodiment
A first embodiment of the present invention will be described in detail with reference to the drawings. FIG. 1 shows an outline of the configuration of the wiring board of the present embodiment. The wiring board of the present embodiment includes a first wiring layer 1, a second wiring layer 2, an insulating layer 3 and a via 4. The first wiring layer 1 is formed with a first wiring 5 to which a power supply voltage is applied. The second wiring layer 2 is formed with a second wiring 6 to which a voltage different from the power supply voltage is applied. The insulating layer 3 insulates between the first wiring layer 1 and the second wiring layer 2. The via 4 penetrates the insulating layer 3, and the first conductive portion 7 connected to the first wiring 5, the second conductive portion 8 connected to the second wiring 6, and the first conductive portion 7. And an insulating portion 9 filled with an insulating material between the second conductive portions 8.

In the via 4 formed in the insulating layer 3 of the wiring substrate of the present embodiment, the first conductive portion 7 connected to the first wiring 5 of the power supply voltage of the first wiring layer 1 and the second wiring layer 2 An insulating portion 9 is formed between the second conductive portion 8 connected to the second wiring 6 having a voltage different from the power supply voltage. That is, the insulating portion 9 is in a state of being sandwiched between the first conductive portion 7 to which the power supply voltage is applied and the second conductive portion 8 to which a voltage different from the power supply voltage is applied in one via 4. . Therefore, the insulating portion 9 has a function as a capacitor using the first conductive portion 7 and the second conductive portion 8 as electrodes. Further, in the via 4, the first conductive portion 7 to which the power supply voltage is applied and the second conductive portion 8 to which a voltage different from the power supply voltage is applied are close to each other. A large decoupling capacitance can be obtained by the capacitor. Since a large decoupling capacitance can be obtained, the influence of power supply noise can be suppressed in the wiring board of the present embodiment. Further, since the capacitor is formed in one via 4 in the vertical direction of the substrate, the area of the wiring substrate does not increase. As a result, in the wiring substrate of the present embodiment, it is possible to reduce the power supply noise while increasing the density (second embodiment)
A second embodiment of the present invention will be described in detail with reference to the drawings. FIG. 2 shows an outline of the configuration of the wiring board of the present embodiment. FIG. 2 is a cross-sectional view of the wiring board of the present embodiment.

  The wiring board of the present embodiment is a printed board of a multilayer structure including a ground wiring layer in which a ground wiring is formed and a power supply wiring in which a power supply wiring layer is formed. Further, in the wiring substrate of the present embodiment, the conductive part connecting the ground wiring layers, the conductive part connected to the power supply wiring, and the via insulating part formed of the high dielectric constant material are formed in one via. . That is, in the wiring substrate of the present embodiment, the conductive portion connected to the ground wiring and the conductive portion connected to the power supply wiring are formed in one via, with the insulating unit having a high dielectric constant interposed therebetween. Therefore, the insulating part of the high dielectric constant material in the via functions as a capacitor having a high capacitance value sandwiched between the electrode to which the ground voltage is applied and the electrode to which the power supply voltage is applied. That is, in the wiring substrate of the present embodiment, a bypass capacitor is formed in one via, using a high dielectric constant material as a dielectric and an electrode to which a power supply voltage is applied and an electrode to which a ground voltage is applied. In the wiring board of the present embodiment, the value of the decoupling capacitance between the ground and the power supply can be increased, so that the fluctuation of the voltage in the signal wiring can be suppressed and the power supply noise can be reduced.

  As shown in FIG. 2, the wiring substrate of the present embodiment includes a first ground wiring layer 11, a power supply wiring layer 12, a second ground wiring layer 13, a first insulating layer 14, and a second insulation. A layer 15, a through hole 16 and an insulating portion 17 are provided. Further, the wiring board of the present embodiment is provided with the first conductive portion 21, the second conductive portion 22, and the via insulating portion 23 in the through hole 16.

  The first ground wiring layer 11 includes ground wiring. The first ground wiring layer 11 of the present embodiment is formed using copper. The signal wiring may be formed in the same layer as the first ground wiring layer 11. The first ground wiring layer 11 is electrically connected to the ground wiring of the second ground wiring layer 12 through the first conductive portion 21 formed in the through hole 16. The ground wiring of the first ground wiring layer 11 is insulated from the wiring portion connected to the second conductive portion 22 by a semicircular insulating portion 17 filled with an insulating material. Further, a ground voltage is applied to the first ground wiring layer 11. A voltage value other than the ground voltage may be applied to the first ground wiring layer 11.

  The first ground wiring layer 11 of the present embodiment corresponds to the second wiring layer 2 of the first embodiment. The ground wiring corresponds to the second wiring 6 to which a voltage different from the power supply voltage of the first embodiment is applied.

  The power supply wiring layer 12 includes power supply wiring. The power supply wiring is connected to the power supply. The power supply wiring layer 12 of the present embodiment is formed using copper. The signal wiring may be formed in the same layer as the power supply wiring layer 12. The power supply wiring layer 12 is electrically connected to the second conductive portion 22. The power supply wiring of the power supply wiring layer 12 is insulated from the first conductive unit 21 by the insulating unit 17 filled with an insulating material.

  The power supply wiring layer 12 of the present embodiment corresponds to the first wiring layer 1 of the first embodiment. The power supply wiring corresponds to the first wiring 5 of the first embodiment.

  The second ground wiring layer 13 is provided with a ground wiring similarly to the first ground wiring layer 11. The second ground wiring layer 13 of the present embodiment is formed using copper. The signal wiring may be formed in the same layer as the second ground wiring layer 13. The second ground wiring layer 13 is electrically connected to the ground wiring of the first ground wiring layer 11 via the first conductive portion 21. A ground voltage is applied to the second ground wiring layer 13. The ground wiring of the second ground wiring layer 13 is insulated from the second conductive portion 22 by the semicircular insulating portion 17 filled with an insulating material.

  The first insulating layer 14 has a function of insulating between the first ground wiring layer 11 and the power supply wiring layer 12. The first insulating layer 14 also has a function as a core material for maintaining the structure and mechanical strength of the wiring substrate. The first insulating layer 14 of the present embodiment corresponds to the insulating layer 3 of the first embodiment.

  The second insulating layer 15 has a function of insulating between the power supply wiring layer 12 and the second ground wiring layer 13. Further, the second insulating layer 15 has a function as a core material for maintaining the structure and mechanical strength of the wiring substrate, as the first insulating layer 14 does. Either the first insulating layer 14 or the second insulating layer 15 may be formed of a prepreg material.

  For the first insulating layer 14 and the second insulating layer 15, a material having a small dielectric loss tangent value is used to reduce parasitic capacitance between the ground wiring and the power supply wiring. When the decoupling capacitance between the ground wiring layer and the power supply wiring layer is increased, a material having a high relative dielectric constant is used for the insulating layer. That is, a material having a high relative dielectric constant and a small value of dielectric loss tangent is used. For the first insulating layer 14 and the second insulating layer 15, an insulating material having a low relative dielectric constant may be used.

  The through holes 16 are formed to penetrate the wiring board. The through hole 16 penetrates the wiring substrate from the side of the surface of the second ground wiring layer 13 of the second insulating layer 15 to the side of the surface of the first ground wiring layer 11 of the first insulating layer 14. There is. The through hole 16 includes a first conductive portion 21, a second conductive portion 22, and a via insulating portion 23. In the wiring substrate of this embodiment, the first conductive portion 21, the second conductive portion 22, and the via insulating portion 23 formed in the through hole 16 have a function as a via for electrically connecting the respective layers. .

  The first conductive portion 21 and the second conductive portion 22 electrically connect the wirings formed in different layers. The first conductive portion 21 electrically connects the first ground wiring layer 11 and the second ground wiring layer 13, that is, ground wirings formed in different layers. Although only one power supply wiring layer 12 is shown in FIG. 2, when there are a plurality of power supply wiring layers, the second conductive portion 22 electrically connects power supply wirings formed in different layers. In the present embodiment, the first conductive portion 21 and the second conductive portion 22 are formed using copper.

  The via insulating portion 23 has a function of insulating between the first conductive portion 21 and the second conductive portion 22. Also, the via insulating portion 23 forms a capacitor with the first conductive portion 21 and the second conductive portion 22 as electrodes. For the via insulating portion 23, a high dielectric constant material, that is, an insulating material having a high relative dielectric constant is used.

  For example, an insulating resin in which a high dielectric constant filler is dispersed can be used as the high dielectric constant material for filling the via insulating portion 23. As the high dielectric constant filler, for example, inorganic materials such as titanium dioxide, barium titanate, strontium titanate, calcium titanate and lead titanate can be used. The high dielectric filler may be used as a mixture of two or more. As the insulating resin, for example, epoxy resin, polyimide resin, polyphenylene ether or the like can be used. By using a resin that can be thermally cured or photocured by ultraviolet light as the insulating resin, the effect can be achieved after filling. By using these high dielectric constant materials, for example, it is possible to form a high dielectric constant via insulator 23 having a relative dielectric constant of about 8 to 20 at a frequency of 1 GHz.

  The diameter of the through hole 16 in this embodiment can be, for example, 200 micrometers. Further, the thickness in the horizontal direction of the via insulating portion 23 of the present embodiment can be, for example, 50 micrometers. The diameter of the through hole 16 and the horizontal thickness of the via insulator 23 may be set to other values. The thickness in the horizontal direction of the via insulating portion 23 is set to have a predetermined capacitance value as a capacitor. At this time, the size and design of vias may be performed so that the sum of a plurality of vias does not have a capacitance value of one via but a predetermined capacitance value.

  The through hole 16, the first conductive portion 21, the second conductive portion 22 and the via insulating portion 23 of the present embodiment are the via 4, the first conductive portion 7, and the second conductive portion 8 of the first embodiment. And the via insulators 9 respectively.

  The insulating portion 17 has a function of insulating between the ground wiring of the first ground wiring layer 11 and the second ground wiring layer 13 and the second conductive portion 22. In addition, the insulating unit 17 has a function of insulating between the power supply wiring of the power supply wiring layer 12 and the first conductive unit 21. The insulating portion 17 is formed in the same layer as the first ground wiring layer 11, the power supply wiring layer 12, and the second ground wiring layer 13. The insulating portion 17 is filled with an insulating material. The same insulating material as the via insulating portion 23 can be used for the insulating portion 17. The insulators of the insulator 17 and the via insulator 23 may be different. Further, the insulating material of the insulating portion 17 may be different for each layer. By arranging the insulating portion 17 to have a predetermined area, a decoupling capacitance may be obtained between the power supply wiring and the ground wiring by using the insulating portion 17 as a capacitor.

  FIG. 3 is a plan view of the second ground wiring layer 13. In FIG. 3, the ground wiring 24 is formed on substantially the entire surface of the second ground wiring layer 13 shown, and the insulating portion 17, the first conductive portion 21, the second conductive portion 22 and the via insulating portion 23 are further provided. Is formed. Since the ground wire 24 and the first conductive portion 21 are electrically connected, a ground voltage is applied to the first conductive portion 21. Further, since the second conductive portion 22 is connected to the power source wiring by the power source wiring layer 12, a power source voltage is applied to the second conductive portion 22. Further, the second conductive portion 22 is insulated from the ground wiring 24 and the first conductive portion 21 by the insulating portion 17 and the via insulating portion 23 filled with an insulating material.

  The first ground wiring layer 11 includes a ground wiring of the first ground wiring layer 11, a conductive portion connected to the first conductive portion 21, and a conductive portion connected to the second conductive portion 22, respectively. Therefore, the configuration is substantially the same as that of FIG.

  FIG. 4 is a plan view of the power supply wiring layer 12. In FIG. 4, the power supply wiring 25 is formed on almost the entire surface of the power supply wiring layer 12 shown, and further, the insulating portion 17, the first conductive portion 21, the second conductive portion 22 and the via insulating portion 23 are formed. ing. Since the power supply wiring 25 and the second conductive portion 22 are electrically connected, a power supply voltage is applied to the second conductive portion 22. Further, since the first conductive portion 21 is connected to the ground wiring by the first ground wiring layer 11 and the second ground wiring layer 13, a ground voltage is applied to the first conductive portion 21. In addition, the first conductive portion 21 is insulated from the power supply wiring 25 and the second conductive portion 22 by the insulating portion 17 and the via insulating portion 23 filled with an insulating material.

  The operation of the wiring board of the present embodiment will be described. In the wiring substrate of the present embodiment, a ground voltage is applied to the ground wiring of the first ground wiring layer 11 and the ground wiring of the first conductive portion 21 of the through hole 16 which is a via and the second ground wiring layer 13 . Further, a power supply voltage is applied to the power supply wiring of the power supply wiring layer 12 and the second conductive portion 22. Since the via insulating portion 23 of the through hole 16 is sandwiched between the first conductive portion 21 to which the ground voltage is applied and the second conductive portion 22 to which the power supply voltage is applied, the ground voltage is applied to the via insulating portion 23 The charge corresponding to the voltage difference between the power supply voltage and the power supply voltage is accumulated. As a result, the via insulating unit 23 shown in FIGS. 2 to 4 functions as a capacitor using the first insulating unit 21 and the second conductive unit 22 as electrodes.

  The first conductive portion 21 to which the ground voltage is applied and the via insulating portion 23 formed of a high dielectric constant material sandwiched between the second conductive portions 22 to which the power source voltage is applied are capacitors having large capacitance values and Become. Therefore, in the wiring substrate of the present embodiment, the decoupling capacitance value between the power supply wiring and the ground wiring can be increased. Since the decoupling capacitance value between the power supply wiring and the ground wiring can be increased, in the wiring substrate of the present embodiment, the fluctuation of the voltage can be suppressed. Further, in the wiring substrate of the present embodiment, a large decoupling capacitance can be obtained by the power supply wiring and the ground wiring which are close in one via, so that the effect of suppressing the power supply noise can be increased.

  A method of manufacturing the wiring board of the present embodiment will be described with reference to FIGS. 5 to 15. 5 to 15 are cross-sectional views showing the structure of the wiring substrate in each step of the manufacturing process of the wiring substrate of the present embodiment.

  From the state in which the first insulating layer 14 and the first ground wiring layer 11 are formed as shown in FIG. 5, the description of the method for manufacturing the wiring board of the present embodiment will be started. In FIG. 5, the insulating portion 17 is already formed in the first ground wiring layer 11. The insulating portion of the first ground wiring layer 11 may be formed in another process. In the first ground wiring layer 11, a wiring pattern of a ground wiring or another signal wiring may be formed.

  First, as shown in FIG. 6, holes 31 for forming vias are formed in the first insulating layer 11 from the surface opposite to the first ground wiring layer 11. In the present embodiment the holes 31 are drilled using a laser. The hole 31 is formed such that the ground wiring of the first ground wiring layer 11 is exposed as viewed from the opening of the hole 31.

  When the holes 31 are formed, the metal film 32 is formed as shown in FIG. In the present embodiment, copper is deposited as the metal film 32 by plating. The film thickness of the metal film 32 is set such that the film thickness of the metal film 32 on the first insulating layer 14 becomes the wiring film thickness according to the electrical characteristics required for the power supply wiring.

  When the metal film 32 is formed, the hole 33 and the etching portion 34 are formed as shown in FIG. The holes 33 are drilled by a laser. The etching unit 34 is formed by photolithography. The holes 33 may be formed using a fine drill. The etching portion 34 is formed by forming a pattern in which a portion corresponding to the etching portion 34 is opened with a resist mask, and etching copper by wet etching. When forming the etching part 34, patterning of the wiring of a power supply wiring layer may be performed simultaneously.

  FIG. 9 shows a portion corresponding to the first conductive portion 21 and the second conductive portion 22 in the metal film 32 inside the via after the formation of the hole 33 and the etching portion 34 as the first conductive portion 21 and the second conductive portion 22. Is shown as the conductive portion 22 of FIG. Further, in FIG. 9, of the metal film 32 on the first insulating layer 14, a portion corresponding to the power supply wiring layer 12 is used as the power supply wiring layer 12.

  When the hole 33 and the etching portion 34 are formed, as shown in FIG. 10, the hole 33 and the etching portion 34 are respectively filled with a high dielectric constant material, and the via insulating portion 23 and the insulating portion 17 are formed. Filling of the hole 33 with a high dielectric constant material is performed by injecting a resin from one end of the hole 33 using a fine nozzle. Alternatively, a high dielectric constant material may be injected into the holes 33 by an inkjet method. For example, an insulating resin in which a high dielectric constant filler is dispersed can be used as the high dielectric constant material to be filled in the holes 33 and the etching portion 34.

  The insulating resin in which the high dielectric constant filler is dispersed is filled in the holes 33 and the etching portion 34 in a fluid state. After the insulating resin is filled in the holes 33 and the etching portion 34, respectively, the via insulating portion 23 and the insulating portion 17 are formed by curing by thermosetting, ultraviolet curing, or a combination thereof. The etching unit 34 may be filled with the insulating material of the insulating layer 17 when the insulating film 35 is formed.

  When the holes 33 and the etching portion 34 are filled with a high dielectric constant material, the insulating film 35 for the second insulating layer 15 is formed as shown in FIG. For the insulating film 35, the same material as that of the first insulating layer 14 can be used.

  When the insulating film 35 is formed, holes 36 for forming vias are opened as shown in FIG. The holes 36 are formed by a laser. In FIG. 12, the insulating layer 35 in which the holes 36 are opened is shown as the second insulating layer 15.

  When the holes 36 are formed, a metal film 37 to be used as the second ground wiring layer 13 is formed as shown in FIG. In the present embodiment, copper is used for the metal film 37. Other metals or alloys may be used for the metal film 37. The metal film 37 of the present embodiment is formed by plating in the same manner as the metal film 32. The film thickness of the metal film 37 is set such that the film thickness of the metal film 37 on the second insulating layer 13 becomes a wiring film thickness corresponding to the electrical characteristics required for the ground wiring.

  When the metal film 37 is formed, the holes 38 and the etching portion 39 are formed as shown in FIG. The holes 37 are formed by a laser. Further, the etching portion 39 is formed by etching the metal film 37 by the photolithography method as in the etching portion 34.

  FIG. 15 shows a portion corresponding to the first conductive portion 21 and the second conductive portion 22 in the metal film 37 inside the via after the formation of the hole 38 and the etching portion 39, the first conductive portion 21 and the second conductive portion 22. They are shown as two conductive parts 22 respectively. Further, in FIG. 15, a portion corresponding to the second ground wiring layer 13 in the metal film 37 on the second insulating layer 15 is used as the second ground wiring layer 13.

  When the hole 38 and the etching portion 39 are formed, as shown in FIG. 16, the hole 38 and the etching portion 39 are filled with a high dielectric constant material, and the via insulating portion 23 and the insulating portion 17 are generated. As the high dielectric constant material, the same insulating material as used for filling the holes 33 and the etching portion 34 can be used. Also, the filling of the high dielectric constant material can be performed by the same method as filling the holes 33 and the etching portion 34. When the high dielectric constant material is filled, the wiring board as shown in FIG. 2 is completed. Furthermore, when manufacturing a multilayer wiring board, it can manufacture by repeating said flow. This is the end of the description of the method of manufacturing a wiring board according to the present embodiment.

  In the wiring substrate of the present embodiment, the first conductive portion 21 connected to the ground wiring in the via formed in the through hole 16, the via insulating portion 23 filled with the high dielectric constant material, and the power supply wiring A connected second conductive portion 22 is formed. Since the first conductive portion 21, the high dielectric constant via insulating portion 23, and the second conductive portion 22 are formed in one via, the via formed in the through hole 16 is the first conductive. It functions as a capacitor with a large capacitance value using the portion 21 and the second conductive portion 22 as electrodes. Further, due to the capacitor having a large capacitance value formed between the power supply and the ground, the via formed in the through hole 16 can provide a large decoupling capacitance between the power supply and the ground. Therefore, power supply noise can be suppressed by the vias formed in the through holes 16. Therefore, in the wiring board of the present embodiment, the influence of the power supply noise can be suppressed even if the voltage of the signal to be transmitted for high-speed transmission of the signal is lowered.

  In the wiring substrate of the present embodiment, in the first ground wiring layer 11 and the second ground wiring 13, the insulating portion 17 is formed between the second conductive portion 22 and the ground wiring. Further, in the power supply wiring layer 12, the insulating part 17 is formed between the first conductive part 21 and the power supply wiring. Therefore, since the ground wiring and the first conductive portion 21 and the power supply wiring and the second conductive portion 22 are separated, there is no short circuit between the power supply and the ground. Further, since the capacitor is formed in one via formed in the through hole 16, it is not necessary to enlarge the circuit scale in order to increase the decoupling capacitance between the power supply and the ground. Therefore, high density can be achieved in the wiring board of the present embodiment. As described above, in the wiring board of the present embodiment, when transmitting a signal at a low voltage and at a high speed, it is possible to reduce the power supply noise of the signal while increasing the density.

Third Embodiment
A third embodiment of the present invention will be described in detail with reference to the drawings. FIG. 17, FIG. 18 and FIG. 19 show an outline of the configuration of the wiring board of this embodiment. FIG. 17 is a cross-sectional view of the wiring board of the present embodiment. 18 and 19 are plan views of respective layers of the wiring board of the present embodiment.

  In the second embodiment, the respective insulating layers and the wiring layer are formed one by one, and the vias connecting the layers are formed one by one. The present embodiment is characterized in that a multilayer structure in which each layer constituting the wiring substrate is stacked is formed first, and via portions connecting the respective layers are collectively formed as through holes.

  As shown in FIG. 17, the wiring board of this embodiment includes a first ground wiring layer 41, a power supply wiring layer 42, a second ground wiring layer 43, a first insulating layer 44, and a second insulation. A layer 45, a through hole 46, and an insulating portion 47 are provided. Further, in the wiring substrate of the present embodiment, the first conductive portion 51, the second conductive portion 52, the via insulating portion 53, the first interlayer connection portion 54, and the second conductive portion 51 are formed in the through holes 46. An interlayer connection 55 is provided. In addition, as shown in FIGS. 18 and 19, insulating portions 56 are provided at both ends of the via insulating portion 53. FIG. 18 is a plan view of the second ground wiring layer 43. As shown in FIG. FIG. 19 is a plan view of the power supply wiring layer 42. As shown in FIG. The first conductive portion 51, the second conductive portion 52, and the via insulating portion 53 of the present embodiment are formed as a pin 50 which is an integral member.

  The configuration and functions of the first ground wiring layer 41, the power supply wiring layer 42, the second ground wiring layer 43, the first insulating layer 44, and the second insulating layer 45 are the same as those of the second embodiment.

  The first conductive portion 51 has a function of electrically connecting ground wirings of different layers. Since the first conductive portion 51 is connected to the ground wiring of each layer, a ground voltage is applied to the first conductive portion 51. Since the first conductive portion 51 is in contact with the first interlayer connection portion 54, the first conductive portion 51 and the first interlayer connection portion 54 can be regarded as one conductive portion. By electrically connecting the ground interconnections of different layers by the first conductive portion 51 and the first interlayer connection portion 54, it is possible to form the via portion more than in the case of connecting different layers by only the first interlayer connection portion 54. Variations in resistance can be reduced. The variation of the resistance of the via portion can be reduced because the influence of the variation of the film thickness of the first interlayer connection 54 can be suppressed. The first conductive portion 51 of the present embodiment is formed of copper. For the first conductive portion 51, metal or alloy other than copper may be used.

  The second conductive portion 52 has a function as an electrode for applying a power supply voltage to the via insulating portion 53. Since the second conductive portion 52 is connected to the power supply wiring, a power supply voltage is applied to the second conductive portion 53. Since the second conductive portion 52 is in contact with the second interlayer connection portion 55, the second conductive portion 52 and the second interlayer connection portion 55 can be regarded as one conductive portion. The second conductive portion 52 of the present embodiment is formed of copper. For the second conductive portion 52, a metal or an alloy other than copper may be used.

  The via insulating portion 53 has a function of insulating the first conductive portion 51 and the second conductive portion 52. In addition, the via insulating portion 53 has a function as a capacitor in which the first conductive portion 51 is a ground electrode and the second conductive portion 52 is a power supply electrode. The via insulating portion 53 is formed of a high dielectric constant material. Therefore, the via insulating portion 53 has a high capacitance value. The via insulating portion 53 can be formed of, for example, a high dielectric constant material similar to the via insulating portion of the second embodiment. In addition, for the via insulating portion 53, a high dielectric constant material made of an inorganic material may be used. As the inorganic material, for example, titanium dioxide, barium titanate, strontium titanate, calcium titanate, lead titanate and the like can be used. The thickness of the via insulating portion 53 of the present embodiment is the same as that of the second embodiment.

  The first interlayer connection portion 54 has a function of electrically connecting grant wirings formed in different layers. The first interlayer connection portion 54 is formed on the side surface of the through hole 46.

  The second interlayer connection portion 55 has a function of electrically connecting the power supply wiring and the second conductive portion 52. The second interlayer connection 55 is formed on the side surface of the through hole 46. The first interlayer connection 54 and the second interlayer connection 55 of the present embodiment are formed using copper. The first interlayer connection 54 and the second interlayer connection 55 may be formed using a metal or an alloy other than copper.

  The planar structure of the second ground wiring layer 43 shown in FIG. 18 will be described. In FIG. 18, the ground wiring 58 is formed on almost the entire surface of the second ground wiring layer 43 shown. Further, in FIG. 18, the insulating portion 47, the first conductive portion 51, the second conductive portion 52, the via insulating portion 53, the first interlayer connection portion 54, the second interlayer connection portion 55, and the insulating portion 56. Is formed. Since the ground wire 58 and the first conductive portion 51 are electrically connected via the first interlayer connection portion 54, a ground voltage is applied to the first conductive portion 51. Further, since the second conductive portion 52 is connected to the power source wiring by the power source wiring layer 42 via the second interlayer connection portion 53, a power source voltage is applied to the second conductive portion 52. Second conductive portion 52 and second interlayer connection portion 55 are insulated from ground wiring 57 and first conductive portion 51 by insulating portion 47 filled with an insulating material, via insulating portion 53 and insulating portion 56. ing.

  The first ground wiring layer 41 has the same structure as the second ground wiring layer 43 shown in FIG.

  The planar structure of the power supply wiring layer 42 shown in FIG. 19 will be described. In FIG. 19, the power supply wiring 58 is formed on almost the entire surface of the power supply wiring layer 42 shown. In FIG. 19, the insulating portion 47, the first conductive portion 51, the second conductive portion 52, the via insulating portion 53, the first interlayer connection portion 54, the second interlayer connection portion 55, and the insulating portion 56 are further formed. It is done. Since the power supply wiring 58 and the second conductive portion 52 are electrically connected via the second interlayer connection portion 55, a power supply voltage is applied to the second conductive portion 52. Further, since the first conductive portion 51 is connected to the ground wiring by the first ground wiring layer 51 and the second ground wiring layer 53, a ground voltage is applied to the first conductive portion 51. . Further, the first conductive portion 51 is insulated from the power supply wiring 58 and the second conductive portion 52 by the insulating portion 57 filled with an insulating material, the via insulating portion 53 and the insulating portion 56.

  The wiring board of the present embodiment operates in the same manner as the wiring board of the second embodiment. That is, the via insulating portion 53 sandwiched between the first conductive portion 51 and the second conductive portion 52 shown in FIGS. 17 to 19 has a function as a capacitor. The first conductive portion 51 to which the ground voltage is applied and the via insulating portion 25 formed of a high dielectric constant material sandwiched between the second conductive portions 52 to which the power source voltage is applied are capacitors having large capacitance values and Become. Therefore, also in the wiring substrate of the present embodiment, the decoupling capacitance value between the power supply wiring and the ground wiring can be increased as in the second embodiment.

  A method of manufacturing the wiring substrate of the present embodiment will be described with reference to FIGS. FIG. 20, FIG. 23, FIG. 25 and FIG. 27 are cross-sectional views showing the structure of the wiring board in each process of the manufacturing stage of the wiring board of the present embodiment. FIGS. 21, 22, 24, 26, 28, and 29 are plan views showing the structure of the wiring board in each step of the manufacturing process of the wiring board of the present embodiment.

  As shown in FIG. 20, the first ground wiring layer 41, the first insulating layer 44, the power supply wiring layer 42, the second insulating layer 45, and the second ground wiring layer 43 are stacked to form a half of each wiring layer. From the state where the circular insulating portion 47 is formed, the description of the manufacturing method will be started.

  In the state of FIG. 20, in the second ground wiring layer 43, the ground wiring 57 and the semicircular insulating portion 47 are formed as shown in FIG. The insulating portion 47 is filled with an insulating material. The first ground wiring layer 41 also has the same structure as that shown in FIG. 21. The first ground wiring layer 41 is located just below the insulating portion 47 of the second ground wiring layer 43, that is, in the same horizontal position. An insulating portion 47 is formed.

  In the state of FIG. 20, the power supply wiring 58 and the semicircular insulating portion 47 are formed in the power supply wiring layer 42 as shown in FIG. The insulating portion 47 is filled with an insulating material. The insulating portion 47 of the power supply wiring layer 42 is formed at a position symmetrical to, ie, facing the insulating portion 47 of the ground wiring layer. In the case where a plurality of power supply wiring layers are provided, the insulating portions 47 of each layer of the power supply wiring layer are formed such that the positions in the horizontal direction coincide with each other. The through holes 61 can be collectively formed by matching the horizontal flat positions of the insulating portions 47 with the power supply wiring layer and the ground wiring layer. As a result, the manufacturing process can be simplified to form a via.

  First, through holes 61 as shown in FIG. 23 are formed in the wiring substrate in the state of FIG. 20 using a drill. The through hole 61 is formed to penetrate the wiring board from one side to the other side. FIG. 24 is a plan view showing the structure of the second ground wiring layer 43 when the through holes 61 are formed. As shown in FIG. 24, the through hole 61 is formed to pass through the center of the semicircle of the insulating portion 47. Also in the first ground wiring layer 41 and the power supply wiring layer 42, the through holes 61 are opened to pass through the centers of the semicircles of the insulating portions 47, respectively.

  When the through hole 61 is formed, the metal film 62 is formed on the side wall of the through hole 61 of the wiring substrate. In the present embodiment, copper is deposited as the metal film 62 by plating. When the metal film 62 is formed, the wirings of different layers are electrically connected by the metal film 62. FIG. 26 is a plan view showing the structure of the second ground wiring layer 43 when the metal film 62 is formed. Since the metal film 46 is continuously formed in the circumferential direction of the through hole 61 as shown in FIG. 26, the ground wiring and the power supply wiring are electrically connected via the metal film 46.

  When the metal film 62 is formed, the pins 50 are press-fit into the through holes 61 so as to have the structure shown in FIGS. As shown in FIG. 28, the pin 50 is press-fit into the through hole 61 so that the direction of the long side of the via insulating portion 53 with the pin 50 coincides with the direction of the center line of the semicircle of the insulating portion 47.

  When the pin 50 is pressed into the through hole 61, two through holes 63 are formed using a drill as shown in FIG. The through holes 63 are formed to penetrate the wiring board. In the wiring board of the present embodiment, the through holes 63 penetrate from the second ground wiring layer 43 to the first ground wiring layer 41. By forming the through holes 63, the metal film 62 can be divided into two, the first interlayer connection 54 and the second interlayer connection 55. That is, in the through hole 63, the metal film 62 in a portion corresponding to the first interlayer connection portion 54 and the metal film 62 in a portion corresponding to the second interlayer connection portion 55 are electrically separated.

  When the through holes 63 are formed, the through holes 63 are filled with an insulating material. The filling of the insulating material is performed in the same manner using the same insulating material as that of the high dielectric constant material in the second embodiment. When the through holes 63 are filled with the insulating material, the wiring board of the present embodiment as shown in FIG. 17 is formed.

  In this embodiment, after forming the through holes 61 in the wiring substrate and forming the metal film 62 corresponding to the first interlayer connection portion 54 and the second interlayer connection portion 55 on the side walls of the through holes 61, the pins 50 are formed. Was pressed in. Instead of such a configuration, the pin 50 may be press-fit into the through hole 61 without forming the metal film 62 in the through hole 61. Even when the pin 50 is press-fitted without forming the metal film 62, the pin 50 is press-fitted into the through hole 61 so that the center line of the semicircle of the insulating portion 47 and the insulating portion 56 of the pin 50 become parallel. The first conductive portion 51 of the pin 50 and the ground wiring conduct when the ground wiring exposed to the side wall portion of the through hole 61 contacts the first conductive portion 51. Similarly, the second conductive portion 52 and the power supply wire are electrically connected by contacting the second conductive portion 52 with the power supply wire exposed at the side wall portion of the through hole 61.

  When the pin 50 is pressed into the through hole 61 without forming the metal film 62 in the through hole 61, a conductive resin may be injected into the through hole 61 at the time of press-in or before the press-in. In addition, metal particles can also be dispersed in the conductive resin. By injecting the conductive resin, the conductivity between the ground wiring or the power supply wiring and the conductive portion can be improved. In addition, the conductive resin may be applied to the periphery of the pin 50 and then pressed in instead of being injected into the through hole 61.

  In the case of using a conductive resin, the conductive resin may have adhesiveness. In this case, by forming the through hole 61 larger, it is possible to fix the pin 50 while easily inserting the pin 50 into the through hole 61.

  In the wiring substrate of the present embodiment, the first conductive portion 51 and the first interlayer connection portion 54 connected to the ground wiring in the via, the via insulating portion 53 filled with the high dielectric constant material, and the power supply wiring A second conductive portion 52 and a second interlayer connection portion 55 connected to each other are formed. As in the second embodiment, the first conductive portion 51 to which the ground voltage is applied, the high dielectric constant via insulating portion 53, and the second conductive portion 52 are formed in one via. The via functions as a capacitor with a large capacitance value. In addition, since the capacitor having a large capacitance value formed between the power supply and the ground, a large decoupling capacitance can be obtained between the power supply and the ground without increasing the substrate area also in the wiring substrate of the present embodiment. Therefore, in the wiring board of the present embodiment, even if the voltage is lowered, the density can be increased while suppressing the influence of the power supply noise.

  Further, in the present embodiment, when forming the vias, the vias of a plurality of layers are collectively formed using the pins 50. Therefore, it is not necessary to provide a via formation step for each layer, and a wiring board can be manufactured without complicating the process. In particular, when the number of stacked wiring boards is increased, the effect of simplifying the manufacturing process by forming the vias collectively is increased.

  In the second embodiment and the third embodiment, the example of the wiring substrate provided with the two ground wiring layers and the single-layer power wiring has been described. The wiring substrate can also have a multilayer structure. For example, the ground wiring layer can be a wiring board with three or more layers. The power supply wiring layer may be a wiring board of two or more layers. In addition, a wiring layer provided with only signal wiring may be formed. In the case of providing the wiring layer including only the signal wiring, the signal wiring is insulated from the via formed by the conductive portion for the power supply and the ground.

  In addition, in the case of forming a wiring board having a multilayer structure more than the second embodiment and the third embodiment, the horizontal positions of the insulating portions of the ground wiring layers are made to coincide with each other. That is, when the respective insulating portions are vertically projected on any one of the ground wiring layers, the respective insulating portions are formed such that the shadows overlap on the projection plane. Further, the insulating portions in the power supply wiring layer are also formed so that the positions in the horizontal direction coincide with each other.

DESCRIPTION OF SYMBOLS 1 1st wiring layer 2 2nd wiring layer 3 insulating layer 4 via 5 1st wiring 6 2nd wiring 7 1st conductive part 8 2nd conductive part 9 via insulation part 11 1st ground wiring layer 12 power wiring layer 13 second ground wiring layer 14 first insulating layer 15 second insulating layer 16 through hole 17 insulating portion 21 first conductive portion 22 second conductive portion 23 via insulating portion 24 ground wiring 25 power source Wiring 31 hole 32 metal film 33 hole 34 etching portion 35 insulating film 36 hole 37 metal film 38 hole 39 etching portion 41 first ground wiring layer 42 power supply wiring layer 43 second ground wiring layer 44 first insulating layer 45 first insulating layer Second insulating layer 46 through hole 47 insulating portion 50 pin 51 first conductive portion 52 second conductive portion 53 via insulating portion 54 first interlayer connecting portion 55 second interlayer connecting portion 56 insulating portion 57 De wire 58 power supply wiring 61 through hole 62 a metal film 63 through hole

Claims (10)

  1. A first wiring layer in which a first wiring to which a power supply voltage is applied is formed;
    A second wiring layer formed with a second wiring to which a voltage different from the power supply voltage is applied;
    A third wiring layer in which a third wiring to which the same voltage as the second wiring is applied is formed;
    A first insulating layer which insulates between the first wiring layer and the second wiring layer;
    A second insulating layer for insulating between the first wiring layer and the third wiring layer, the first insulating layer, and the second insulating layer are penetrated and connected to the first wiring . Via filling the space between the first conductive portion, the second conductive portion connected to the second wiring and the third wiring, and the first conductive portion and the second conductive portion with an insulating material A via having an insulator;
    A first insulating portion formed in the first wiring layer to insulate between the first wiring and the second conductive portion;
    A second insulating portion formed in the second wiring layer and insulating between the second wiring and the first conductive portion;
    And a third insulating portion formed in the third wiring layer to insulate between the second wiring and a conductive portion connected to the second conductive portion .
    In the via, the first conductive portion, the via insulating portion, and the second conductive portion are continuously formed from the second wiring layer to the third wiring layer, and the first conductive portion is formed. The second conductive portion and the second conductive portion are formed to face each other through the via insulating portion;
    A wiring board characterized in that the second insulating portion and the third insulating portion are formed on the same side centering on the via insulating portion .
  2. The first insulating portion and the second insulating portion have a semicircular shape,
    The wiring substrate according to claim 1, wherein the first insulating portion and the second insulating portion are formed to face each other centering on the via insulating portion of the via.
  3. An insulating layer,
    A first wiring layer formed on the insulating layer and having a first wiring to which a power supply voltage is applied;
    A second wiring layer formed on the side opposite to the first wiring layer of the insulating layer and on which a second wiring to which a voltage different from the power supply voltage is applied is formed;
      A first through hole penetrating the first wiring layer, the insulating layer, and the second wiring layer;
    A first conductive portion inserted in the first through hole, a via insulating portion formed of an insulating material, and a second conductive portion facing the first conductive portion via the via insulating portion; A member in which the first conductive portion, the via insulating portion, and the second conductive portion are continuously formed from one opening side of the first through hole to the other opening side;
    Equipped with
    The member is inserted into the first through hole such that the first conductive portion and the first wire, and the second conductive portion and the second wire are in contact with each other. Wiring board.
  4. A first insulating portion formed in the first wiring layer to insulate between the first wiring and the second conductive portion;
    A second insulating portion formed in the second wiring layer to insulate between the second wiring and the first conductive portion;
    The wiring board according to claim 3, comprising:
  5. A conductive film formed on the side wall of the first through hole;
    Second through holes formed on both sides of the via insulator;
    A second via insulator in which the second through hole is filled with an insulator;
    The wiring board according to claim 4, further comprising:
  6. A first wiring layer in which a first wiring to which a power supply voltage is applied is formed, an insulating layer, and a second wiring layer in which a second wiring to which a voltage different from the power supply voltage is applied is formed Forming a first through hole through the first wiring layer, the insulating layer, and the second wiring layer in a substrate on which the first and second wiring layers are stacked;
    The first through hole includes a first conductive portion, a via insulating portion formed of an insulating material, and a second conductive portion facing the first conductive portion via the via insulating portion. A member in which the first conductive portion, the via insulating portion and the second conductive portion are continuously formed from one opening side of the first through hole to the other opening side ; A method of manufacturing a wiring substrate, comprising: a press-fitting step of press-fitting the first conductive portion and the first wiring, and the second conductive portion and the second wiring so as to be in contact with each other.
  7.   7. The wiring substrate according to claim 6, further comprising a conductive portion forming step of forming a conductive film on the side wall of the first through hole between the first hole forming step and the press-in step. Manufacturing method.
  8. A second hole forming step of forming a second through hole on both sides of the via insulating portion after the press-in step;
    The method according to claim 7, further comprising: a filling step of filling the second through hole with an insulating material.
  9. A first hole forming step of forming a first hole in the insulating layer of the second wiring layer on which the second wiring to which a voltage different from the power supply voltage is applied is formed and the insulating layer; When,
    A power supply layer forming step of filling the first hole with a conductive material and forming a first wiring layer used as a first wiring to which the power supply voltage is applied on the insulating layer;
    A second hole is formed in the conductive material filled in the first hole, and a second conductive portion connected to the second wire and a first conductive connected to the first wire Via division process divided into parts;
    An insulating material filling step of filling the second hole with an insulating material ;
    An insulating layer forming step of forming a second insulating layer on the first wiring layer;
    Forming a third hole in the second insulating layer;
    A wiring layer forming step of filling the third hole with a conductive material and forming a third wiring layer used as a third wiring;
    A fourth hole is formed in the conductive material filled in the third hole, and a third conductive portion connected to the third wire and the second conductive portion, the first wire, and A second via dividing step of dividing into a fourth conductive portion connected to the first conductive portion;
    And a second insulating material filling step of filling the fourth hole with an insulating material .
  10.   10. The wiring substrate according to claim 9, further comprising an insulating portion forming step of forming an insulating portion so that the second conductive portion and the first wiring do not contact the first wiring layer. Production method.
JP2015022152A 2015-02-06 2015-02-06 Wiring board and method of manufacturing the same Active JP6536057B2 (en)

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JP2001251058A (en) * 2000-03-03 2001-09-14 Hitachi Information Technology Co Ltd Printed wiring board
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JP2005209672A (en) * 2004-01-20 2005-08-04 Hitachi Cable Ltd Substrate with built-in capacitor and its manufacturing method
KR100632554B1 (en) * 2004-12-30 2006-10-11 삼성전기주식회사 Embedded capacitor printed circuit board and method for fabricating the same
JP2007005431A (en) * 2005-06-22 2007-01-11 Shinko Electric Ind Co Ltd Capacitor-embedded substrate and its manufacturing method
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