JP6484823B2 - 部品移載機構及び部品搭載装置 - Google Patents

部品移載機構及び部品搭載装置 Download PDF

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Publication number
JP6484823B2
JP6484823B2 JP2016171369A JP2016171369A JP6484823B2 JP 6484823 B2 JP6484823 B2 JP 6484823B2 JP 2016171369 A JP2016171369 A JP 2016171369A JP 2016171369 A JP2016171369 A JP 2016171369A JP 6484823 B2 JP6484823 B2 JP 6484823B2
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Prior art keywords
component
nozzle
transfer mechanism
moves
swing
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JP2016171369A
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Japanese (ja)
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JP2018037596A (ja
Inventor
向島　仁
仁 向島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Intellectual Property Management Co Ltd
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Panasonic Intellectual Property Management Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Panasonic Intellectual Property Management Co Ltd filed Critical Panasonic Intellectual Property Management Co Ltd
Priority to JP2016171369A priority Critical patent/JP6484823B2/ja
Priority to CN201710649662.5A priority patent/CN107801370B/zh
Publication of JP2018037596A publication Critical patent/JP2018037596A/ja
Application granted granted Critical
Publication of JP6484823B2 publication Critical patent/JP6484823B2/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2016171369A 2016-09-02 2016-09-02 部品移載機構及び部品搭載装置 Active JP6484823B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2016171369A JP6484823B2 (ja) 2016-09-02 2016-09-02 部品移載機構及び部品搭載装置
CN201710649662.5A CN107801370B (zh) 2016-09-02 2017-08-01 部件移载机构以及部件搭载装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016171369A JP6484823B2 (ja) 2016-09-02 2016-09-02 部品移載機構及び部品搭載装置

Publications (2)

Publication Number Publication Date
JP2018037596A JP2018037596A (ja) 2018-03-08
JP6484823B2 true JP6484823B2 (ja) 2019-03-20

Family

ID=61531511

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016171369A Active JP6484823B2 (ja) 2016-09-02 2016-09-02 部品移載機構及び部品搭載装置

Country Status (2)

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JP (1) JP6484823B2 (zh)
CN (1) CN107801370B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7147475B2 (ja) * 2018-10-31 2022-10-05 株式会社ダイフク 物品移載設備
JP7300674B2 (ja) * 2019-10-11 2023-06-30 パナソニックＩｐマネジメント株式会社 部品供給装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4041768B2 (ja) * 2002-09-12 2008-01-30 松下電器産業株式会社 部品装着ヘッド
JP3879680B2 (ja) * 2003-02-25 2007-02-14 松下電器産業株式会社 電子部品搭載装置および電子部品搭載方法
JP4421991B2 (ja) * 2004-10-04 2010-02-24 ヤマハ発動機株式会社 移載装置、表面実装機、誤差テーブルの作成方法、プログラムおよび記憶媒体
JP2009105357A (ja) * 2007-10-23 2009-05-14 M Tec Kk チップの搬送方法及び装置
KR20090044125A (ko) * 2007-10-31 2009-05-07 삼성테크윈 주식회사 노즐세척장치를 구비한 부품실장기
KR101555623B1 (ko) * 2012-01-25 2015-10-06 시마쯔 코포레이션 기판 이송 시스템 및 기판 이송 방법

Also Published As

Publication number Publication date
CN107801370A (zh) 2018-03-13
JP2018037596A (ja) 2018-03-08
CN107801370B (zh) 2020-08-04

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