JP6440878B2 - Exposure apparatus and device manufacturing method using the same - Google Patents

Exposure apparatus and device manufacturing method using the same Download PDF

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JP6440878B2
JP6440878B2 JP2018017801A JP2018017801A JP6440878B2 JP 6440878 B2 JP6440878 B2 JP 6440878B2 JP 2018017801 A JP2018017801 A JP 2018017801A JP 2018017801 A JP2018017801 A JP 2018017801A JP 6440878 B2 JP6440878 B2 JP 6440878B2
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stage
position
substrate
exposure
exposure apparatus
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JP2018097384A (en
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松本 英樹
英樹 松本
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キヤノン株式会社
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Description

  The present invention relates to an exposure apparatus and a device manufacturing method using the exposure apparatus.

  An exposure apparatus exposes a pattern of an original (such as a reticle) onto a photosensitive substrate (such as a wafer having a resist layer formed on the surface) via a projection optical system in a lithography process included in a manufacturing process of a semiconductor device or the like. Device. Furthermore, there is an immersion exposure apparatus using an immersion method as a technique for improving the resolution of a pattern image projected onto a substrate. The immersion exposure apparatus projects a pattern image onto the substrate while filling the space between the final lens of the projection optical system and the substrate with the immersion liquid. On the other hand, there is also an immersion exposure apparatus that includes a plurality of stages for holding a substrate in order to increase the production amount per unit time. In an immersion exposure apparatus having only one substrate stage, a so-called “blank state” occurs in which exposure cannot be performed during substrate replacement or prior measurement. In contrast, in an immersion exposure apparatus including a plurality of (for example, two) substrate stages, while the substrate on one substrate stage is being exposed, the other substrate stage can be replaced. Do. According to this structure, immediately after the exposure with respect to the board | substrate on one board | substrate stage is complete | finished, the exposure to the next board | substrate on the other board | substrate stage can be started. That is, when viewed from the whole immersion exposure apparatus, a “blank state” does not occur, and any substrate is always exposed, so that the production amount per unit time can be increased.

  Here, in an immersion exposure apparatus including a plurality of substrate stages, after the exposure on the substrate on one substrate stage is completed, the other substrate stage is quickly moved to the lower part of the projection optical system to expose the next substrate. In order to start, the immersion liquid is transferred between the substrate stages. For example, a method may be considered in which the supply of the immersion liquid is stopped when the exposure of the previous substrate is completed, and the supply of the immersion liquid is restarted when the next substrate stage moves to the lower part of the projection optical system. However, this method is not practical because it takes time from the start of supplying the immersion liquid until the state of the supplied immersion liquid is stabilized. Therefore, a method has been proposed in which the supplied immersion liquid is transferred as it is from the substrate stage holding the exposed substrate to the substrate stage holding the next exposure target substrate. Patent Document 1 discloses an immersion exposure apparatus in which an immersion liquid delivery position is defined on each substrate stage. This immersion exposure apparatus has a mirror used for measuring the position of each substrate stage in real time during exposure on the side surface of each substrate stage. And the delivery position of the immersion liquid in this case is set to the end of the substrate stage so as not to disturb the measurement using the mirror. On the other hand, Patent Document 2 discloses an immersion exposure apparatus having a plurality of immersion liquid delivery positions on a substrate stage from the viewpoint of shortening delivery time.

JP 2008-124219 A JP 2008-130745 A

  However, in the immersion exposure apparatus shown in Patent Document 1, it is necessary to always pass through a prescribed delivery position when delivering the immersion liquid, and depending on the position of the substrate stage at the start of delivery, the delivery time is wasted. May occur. Further, in the immersion exposure apparatus disclosed in Patent Document 2, it is necessary to widen the operation area of the substrate stage in order to deliver the immersion liquid. As a result, the apparatus size is increased and the cost is increased.

  The present invention has been made in view of such a situation. For example, the present invention provides an immersion-type exposure apparatus that is advantageous for efficiently transferring immersion liquid on the surface between a plurality of substrate stages. The purpose is to do.

  In order to solve the above problems, an exposure apparatus according to an example of the present invention includes a measurement region for measuring a substrate and an exposure region for exposing the substrate through a projection optical system, An exposure apparatus that exposes the substrate in a state where an immersion liquid is supplied between the lens and the substrate in the exposure area, the first stage and the second stage being movable while holding the substrate And a control unit that controls driving of the first stage and the second stage. The control unit sets a transfer position, which is a position of the immersion liquid on the first stage, when the immersion liquid is transferred from the first stage to the second stage, and the substrate on the first stage. An arbitrary position on the first stage is determined based on the exposure end position, and the first stage and the second stage are driven based on the determined delivery position.

  According to the present invention, for example, it is possible to provide an immersion type exposure apparatus that is advantageous for efficiently transferring an immersion liquid on the surface between a plurality of substrate stages.

It is a figure which shows the structure of the exposure apparatus which concerns on 1st Embodiment of this invention. It is a figure which shows the state when delivering immersion liquid between each stage. It is a flowchart which shows the flow of the delivery operation | movement in 1st Embodiment. It is a figure which shows the delivery operation | movement in 1st Embodiment in time series. It is a timing chart of the wafer stage in a 1st embodiment. It is a figure which shows the position measurement sensor etc. which replaced with the laser interferometer. It is a figure which shows the structure which arrange | positions a mirror only in the side which does not deliver immersion liquid. It is a flowchart which shows the flow of the delivery operation | movement in 2nd Embodiment. It is a figure which shows the delivery operation | movement in 2nd Embodiment in time series. It is a figure which shows the delivery operation | movement in 2nd Embodiment in time series. It is a timing chart of the wafer stage in a 2nd embodiment. It is a figure which shows the conventional delivery operation | movement in time series.

  Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings.

(First embodiment)
First, an exposure apparatus according to the first embodiment of the present invention will be described. FIG. 1 is a schematic diagram showing a configuration of an exposure apparatus 100 according to the present embodiment. The exposure apparatus 100 is used in a semiconductor device manufacturing process as an example, and is a projection type exposure that exposes (transfers) a pattern formed on a reticle 15 onto a wafer 14 (substrate) by a step-and-repeat method. A device. The exposure apparatus 100 is an immersion exposure apparatus that uses an immersion method as a technique for improving the resolution of a pattern image projected onto the wafer 14. In FIG. 1, the Z-axis is taken in parallel to the optical axis of the projection optical system 3 (vertical direction in this embodiment), and the X-axis is taken in the scanning direction of the wafer 14 during exposure in a plane perpendicular to the Z-axis. The Y axis is taken in the non-scanning direction orthogonal to the X axis. The exposure apparatus 100 includes an illumination system 1, a reticle stage 2, a projection optical system 3, a wafer stage 5, an immersion liquid supply mechanism 4, an alignment detection system 6, a focus detection system 7, and a control unit 20. Is provided. Among these components, the illumination system 1, the reticle stage 3, the projection optical system 3, and the immersion liquid supply mechanism 4 are installed in an exposure region in the exposure apparatus 100. On the other hand, the alignment detection system 6 and the focus detection system 7 are installed in a measurement region in the exposure apparatus 100. As described above, in the exposure apparatus 100, the exposure area and the measurement area are independent, and as will be described later, a plurality of stages constituting the wafer stage 5 can move the exposure area and the measurement area alternately.

  The illumination system 1 illuminates the reticle 15 by adjusting light emitted from a light source (not shown). The reticle 15 is an original plate made of, for example, quartz glass on which a pattern (for example, a circuit pattern) to be transferred is formed on the wafer 14. The reticle stage 3 is movable in the XY axial directions while holding the reticle 15. The projection optical system 3 projects an image of the pattern on the reticle 15 illuminated with light from the illumination system 1 onto the wafer 14 at a predetermined magnification (for example, 1/2 to 1/5). The wafer 14 is a substrate made of, for example, single crystal silicon and having a resist (photosensitive agent) applied on the surface thereof.

  The wafer stage 5 is a so-called twin stage type stage apparatus having two pairs of a coarse movement stage and a fine movement stage that can move relative to each other on the stage surface plate 21 and can exchange their positions. Hereinafter, one of the two sets is referred to as “first stage 5a”, and the other is referred to as “second stage 5b”. Both the first stage 5a and the second stage 5b are movable (changeable in posture) in the XYZ axial directions while holding the wafer 14. With this configuration, for example, the exposure apparatus 100 performs exposure on the first wafer 14a on the first stage 5a in the exposure area, while the second wafer 14b is in the second stage 5b in the measurement area. Replacement and alignment measurement (preliminary measurement) can be performed. That is, since the exposure apparatus 100 is unlikely to have a blank state in which any wafer 14 is not exposed, and is always in a state in which any one of the wafers 14 is exposed, the production amount per unit time is reduced. It is advantageous to raise. Each stage 5a, 5b has a mirror 22 on its side surface, and the position (stage position) of each stage 5a, 5b on the XY plane is measured by the laser interferometer 23. Is required. In the present embodiment, the wafer stage 5 is described as a twin stage type as an example, but it may have a set of three or more stages.

  The immersion liquid supply mechanism 4 is a liquid that fills a fixed space region between the final lens of the projection optical system 3 and the wafer 14 on the wafer stage 5 (second stage 5b in FIG. 1) with the immersion liquid 13. The immersion liquid 13 is supplied and then recovered. The immersion liquid supply mechanism 4 includes a supply nozzle 11 that supplies the immersion liquid 13 and a recovery nozzle 12 that recovers the immersion liquid 13 once supplied. The exposure apparatus 100 is advantageous in transferring a finer pattern by projecting the pattern image onto the wafer 14 while filling the immersion liquid 13 having a refractive index higher than that of air in this region.

  The alignment detection system 6 includes a projection system that projects detection light onto a reference mark on the wafer 14 or the wafer stage 5 and a light receiving system that receives reflected light from the reference mark. The alignment detection system 6 detects the alignment position of the wafer 14 and the alignment position between the wafer 14 and the reticle 15. The alignment detection system 6 can be an off-axis alignment detection system that can optically detect the reference mark without using the projection optical system 3. The focus detection system 7 is a focal plane detection device, and includes a projection system 7 a that projects detection light toward the surface of the wafer 14, and a light receiving system 7 b that receives the reflected light, and is in the Z-axis direction of the wafer 14. The position (surface position) is detected. The projection system 7a and the light receiving system 7b are provided diagonally upward with respect to the reference mark for the alignment detection system 6, respectively.

  The control unit 20 can control the operation and adjustment of each component of the exposure apparatus 100. In particular, in the present embodiment, the control unit 20 controls the movement operation of the wafer stage 5 (the first stage 5a and the second stage 5b) during the delivery of the immersion liquid 13 described in detail below. The control unit 20 is configured by a computer, for example, and is connected to each component of the exposure apparatus 100 via a line, and can control each component according to a program or the like. The control unit 20 may be configured integrally with other parts of the exposure apparatus 100 (in a common casing), or separate from the other parts of the exposure apparatus 100 (in a separate casing). It may be configured.

  Next, the delivery operation of the immersion liquid 13 between the first stage 5a and the second stage 5b in the present embodiment will be described. Here, the “delivery operation” means that after the exposure on the first wafer 14 on one stage is completed, the other stage moves to the lower part of the projection optical system 3 and starts the exposure on the next wafer 14. The operation of transferring the immersion liquid 13 between the stages 5a and 5b. First, a basic delivery operation will be described with reference to FIG. FIG. 2 is a schematic cross-sectional view showing the state when the immersion liquid 13 is delivered from the first stage 5a to the second stage 5b as an example in time series. In FIG. 2A, the first wafer 14a is exposed on the first stage 5a located at the lower part (exposure position) of the projection optical system 3, and the second wafer 14b to be exposed next is held. It is a figure which shows the state which 2 stage 5b has approached. It is desirable that the distance d when the stages 5a and 5b are closest to each other is as narrow as possible without touching each other. Next, FIG. 2B is a diagram showing a state in which the immersion liquid 13 is being delivered. By reducing the distance d between the stages 5a and 5b as much as possible and keeping the water repellency of the portion in contact with the immersion liquid 13 high on each stage 5a and 5b, the space area of the distance d is immersed in the liquid. The liquid 13 is difficult to enter. FIG. 2C shows a state in which the delivery of the immersion liquid 13 has been completed. In this state, the first stage 5a side starts a recovery operation for the exposed first wafer 14a, while the second stage 5b side starts exposure to the second wafer 14b.

  Next, how the stages 5a and 5b are moved on the XY plane in the transfer operation of the immersion liquid 13 in the present embodiment will be described. First, in order to clarify the characteristics of the delivery operation in the present embodiment, a conventional delivery operation will be described as a comparative example. FIG. 3 is a flowchart showing a basic sequence of the delivery operation corresponding to both the conventional and the present embodiment. FIG. 12 is a schematic plan view showing the conventional delivery operation in time series. In particular, here, as an example, the exposure of the measurement position on the second stage 5b or the first pattern formation region set on the second wafer 14b after the exposure of the first wafer 14a on the first stage 5a is completed. The state up to when it is located is shown. In addition, the same code | symbol as the thing corresponding to the component of this embodiment is attached | subjected to each component shown in FIG. 12 from a viewpoint of the ease of comparison. In addition, the arrows in the figure indicate the movement trajectories of the respective stages 5a and 5b.

  First, after the exposure of the first wafer 14a on the first stage 5a is completed, the control unit 20 moves the first stage 5a to the delivery position for the immersion liquid 13 (step S101). FIG. 12A is a diagram showing a state of each stage 5a, 5b when the exposure on the first stage 5a is completed. On the other hand, FIG. 12B is a diagram showing a state when the first stage 5a is moved to the delivery position from the state shown in FIG. In the conventional wafer stage 5, for example, the delivery position is defined at a position that avoids the position measurement mirror on the side surface of the stage, so that the first stage 5 is positioned at any position on the first wafer 14a at the final pattern formation region. It moves to its delivery position regardless of whether or not there is. Next, the control unit 20 moves the second stage 5b so that the delivery position (in this case, the receiving position) of the second stage 5b matches the delivery position of the first stage 5a (step S102). Next, the control unit 20 moves the immersion liquid 13 to the delivery position of the second stage 5b by moving the stages 5a and 5b in parallel after the delivery positions of the stages 5a and 5b are matched (Step S5). S103). FIG. 12C is a diagram showing a state when the immersion liquid 13 is moved onto the second stage 5b after the second stage 5b has moved from the state shown in FIG. 12B to the delivery position. . Then, after the first stage 5a is retracted (moved to the next specific position), the control unit 20 moves the second stage 5b so that the first pattern formation region on the second wafer 14b is positioned at the exposure position. Move (step S104). FIG. 12D is a diagram showing a state when the second stage 5b is moved so as to be positioned at the measurement position. As described above, in the operation of the wafer stage 5 at the time of the conventional delivery, since the delivery position is defined in advance, depending on the exposure order to the pattern formation region set on the wafer 14, in particular, step S102 and It may take time to move in S104.

  In contrast, in the present embodiment, the control unit 20 moves the stages 5a and 5b as follows in accordance with the sequence shown in FIG. FIG. 4 is a schematic plan view showing the delivery operation in the present embodiment in time series. 4A to 4D correspond to the states shown in FIGS. 12A to 12D showing the conventional delivery operation. The delivery operation in this embodiment is different from the conventional one in that the delivery position of the immersion liquid 13 is not defined in advance in each stage 5a, 5b. For example, in the operation of step S101 of FIG. 3 in the present embodiment, the control unit 20 sets the transfer position of the immersion liquid 13 on the first stage 5a as the exposure end position, that is, the final pattern formation on the first wafer 14a. It is determined based on the position where the exposure is completed in the area. The exposure end position in this case is a position where the immersion liquid 13 shown in FIG. Note that the control unit 20 sets the exposure end position to a layout including a pattern formation region set on the first wafer 14a, a recipe including data such as an exposure order for the layout, and the like. Can be recognized before exposure. Next, the control unit 20 keeps the first stage 5a from the state at the exposure end position shown in FIG. 4A until the immersion liquid 13 is positioned at the stage end shown in FIG. 4B. Move linearly in a predetermined direction. And the position where the immersion liquid 13 shown in FIG.4 (b) is waiting is a delivery position of the immersion liquid 13 said by this embodiment. The term “linear movement” as used herein refers to a direction in which linear movement is possible only with a drive unit for one direction (here, the X-axis direction) in terms of the configuration and control of the drive device that moves each stage 5a, 5b. Say. On the other hand, in the conventional movement to the delivery position shown in FIG. 12B, “tilt movement”, that is, at least two drive units for the X-axis direction and the Y-axis direction are driven, and FIG. As shown on the XY plane shown in FIG.

  Further, for example, as an operation after step S102 in FIG. 3 in the present embodiment, the control unit 20 determines the delivery position (reception position) of the immersion liquid 13 in the second stage 5b as follows. That is, the transfer position is a measurement position or an exposure start position (a position where exposure is started in the first pattern formation region on the second wafer 14b) in one direction (here, the X-axis direction) of the transfer position in the first stage 5a. ). In this case, the measurement position or exposure start position (hereinafter collectively referred to as “processing position”) is a position where the immersion liquid 13 shown in FIG. Then, the control unit 20 moves the second stage 5b from the transfer position shown in FIG. 4 (c) to the pattern forming region where the immersion liquid 13 is first exposed as shown in FIG. 4 (d). Until it is done, it is moved straight in a predetermined direction.

  Thus, in the exposure apparatus 100, when the immersion liquid 13 is delivered, the delivery position of each stage 5a, 5b is determined based on the exposure end position or the initial processing position, thereby moving the stages 5a, 5b. Time can be shortened compared with the past. Further, by making the movement of each stage 5a, 5b at this time a linear movement, it can be advantageous in terms of movement accuracy and power efficiency peculiar to the driving device. Here, the movement of each stage 5a, 5b has been described with reference to the X axis, but the same applies to the Y axis as a reference.

  FIG. 5 is a timing chart (horizontal axis is time) compared with the case of a conventional exposure apparatus in order to clarify the effect of shortening the moving time of each stage 5a, 5b in the present embodiment. Among these, FIG. 5A is a timing chart according to the exposure sequence in the conventional exposure apparatus, and FIG. 5B is a timing chart according to the exposure sequence in the exposure apparatus 100 according to the present embodiment. . 5A and 5B, the upper stage corresponds to the first stage 5a and the lower stage corresponds to the second stage 5b. First, as operations of the first stage 5a, "exposure", "move to immersion liquid delivery position", "immersion liquid delivery", "movement + wafer recovery / supply", "exposure preparation (measurement)" It continues with. In accordance with this, the operations of the second stage 5b include “exposure preparation (measurement)”, “move to immersion liquid delivery position”, “immersion liquid delivery”, “move to measurement position”, “measurement” ”,“ Move to exposure position ”, and“ Exposure ”. Here, when FIG. 5A is compared with FIG. 5B, the time required for “moving to the immersion liquid delivery position” of each stage 5a, 5b by the delivery operation as described above, and the second The time required for “moving to the measurement position” of the stage 5b is shortened. Therefore, it can be seen that the processing time is shortened as compared with the conventional exposure apparatus even in the entire exposure sequence. Shortening the processing time is advantageous for improving the productivity of the exposure apparatus.

  Next, position measurement of each stage 5a, 5b, which is a premise for implementing the exposure apparatus 100 according to the present embodiment, will be described. As described above, the position of each stage 5a, 5b in the XY plane is measured using the laser interferometer 23. For this purpose, the mirror 22 is installed on each side surface of each stage 5a, 5b. Here, in the immersion exposure apparatus shown in Patent Document 1 as a conventional technique, a mirror equivalent to this is installed, and a unique delivery position is installed to avoid the installation position of this mirror. On the other hand, in the present embodiment, the delivery method described so far can be carried out even if such a mirror 22 is installed. That is, depending on the delivery position, the liquid immersion method can be performed across the side surface of the mirror 22. The liquid 13 can be delivered (moved). This is because it is determined that the current level of technology related to the configuration and control of the wafer stage 5 is improved, so that it can withstand actual apparatus operation. However, as in the prior art, it may be undesirable for the immersion liquid 13 to move along the side surface of the mirror 22. Therefore, in this case, it is possible to deliver the immersion liquid 13 in the present embodiment by measuring the positions of the stages 5a and 5b as follows.

  FIG. 6 is a schematic diagram showing a position measurement sensor (position measurement device) 9 arranged on each stage 5 a and 5 b and a reference plate 10 as a measurement target of the position measurement sensor 9 in place of the laser interferometer 23. It is. 6A is a perspective view, and FIG. 6B is a cross-sectional view of the position measurement sensor 9 at the installation position. Each stage 5a, 5b is provided with a water leakage sensor 24, an illuminance sensor 17, an aberrometer 18 and the like in addition to the reference mark 16 to be measured in alignment measurement. In the present embodiment, a plurality of position measurement sensors 9 are installed on the surfaces of the stages 5a and 5b after avoiding the installation positions of these sensors and the like. And the position measurement of each stage 5a, 5b in XY plane can be performed by detecting the reference | standard in the reference | standard board 10 using the position measurement sensor 9. FIG. As a result, the laser interferometer 23 is not used, and as a result, it is not necessary to install the mirror 22 on the side surface of each stage 5a, 5b. Delivery as in the embodiment is possible. On the other hand, FIG. 7 is a schematic plan view showing a configuration in which the mirror 22 is arranged only on the side where the immersion liquid 13 is not delivered among the side surfaces of the stages 5a and 5b. Such a configuration also enables delivery as in the present embodiment.

  As described above, according to the present embodiment, it is possible to provide an immersion type exposure apparatus that is advantageous for efficiently transferring the immersion liquid on the surface between a plurality of stages of the wafer stage.

(Second Embodiment)
Next, an exposure apparatus according to the second embodiment of the present invention will be described. In the first embodiment described above, when the immersion liquid 13 is delivered, the stages 5a and 5b only move in parallel in one direction (X-axis direction in the above example). On the other hand, the exposure apparatus according to the present embodiment is characterized in that, when the immersion liquid 13 is delivered, each stage 5a, 5b is not only in the direction in which the immersion liquid 13 is delivered, but also in other directions (Y-axis direction). ) Also moves. FIG. 8 is a flowchart showing a basic sequence of the delivery operation in the present embodiment. 9 and 10 are schematic plan views showing the delivery operation in the present embodiment in time series. Here, as in FIG. 4 in the first embodiment, the first pattern formation set on the second wafer 14b on the second stage 5b after the exposure of the first wafer 14a on the first stage 5a is completed. The state until the area is located at the exposure position is shown.

  First, after the exposure of the first wafer 14a on the first stage 5a is completed, the control unit 20 moves the first stage 5a to the delivery position for the immersion liquid 13 (step S201). FIG. 9A is a diagram illustrating a state of each stage 5a and 5b when the exposure on the first stage 5a is completed. On the other hand, FIG. 9B is a diagram showing a state when the first stage 5a is moved to the delivery position directly from the state shown in FIG. 9A. Here, the movement of the first stage 5a means that the second stage 5b moves to the Y axis direction + side (the side where the first stage 5a is present) in the next step, and therefore avoids collision between the stages 5a and 5b. There is also. Next, the control unit 20 moves the second stage 5b to the Y axis direction + side while moving the first stage 5a to the Y axis direction − side (step S202). FIG. 9C is a diagram showing a state in which each stage 5a, 5b starts moving. At this time, the control unit 20 moves the second stage 5b to a position in the X-axis direction that matches the initial processing position. FIG. 9D is a diagram illustrating a state in which the second stage 5b has moved to the position in the X-axis direction (the delivery position in the substantial X-axis direction). Next, the control unit 20 moves the first stage 5a in an oblique direction (Y-axis direction-side and X-axis direction-side) while moving the second stage 5b in a lateral direction (X-axis direction-side). By doing so, the immersion liquid 13 is moved to the delivery position of the second stage 5b (step S203). FIG. 10A shows the state of each stage 5a, 5b immediately before the start of step S203. FIG. 10B is a diagram illustrating a state after the immersion liquid 13 is transferred to the second stage 5b side. Then, the controller 20 retracts the first stage 5a as it is in the Y-axis direction minus side (moves to the next specific position), and then moves the second stage 5b so as to be positioned at the first processing position ( Step S205). FIG. 10C is a diagram showing a state in which the first stage 5a is moved to the Y axis direction minus side while the second stage 5b is moved to the measurement position.

  Thus, according to the present embodiment, the delivery position of the second stage 5b is determined based on the initial processing position (measurement position or exposure start position), particularly for the delivery operation of the second stage 5b. Thereby, the movement time of the 2nd stage 5b can be shortened rather than before. Further, in the present embodiment, the first stage 5a on the side of delivering the immersion liquid 13 continues to move in the Y-axis direction during a series of delivery operations. Thereby, time until the 1st stage 5a arrives at the following specific position (in this case, for example, wafer conveyance part 8 (refer to Drawing 1)) can be shortened.

  FIG. 11 is a timing chart in the present embodiment. FIG. 11 corresponds to FIG. 5 used in the description of the first embodiment. Here, when FIG. 5A showing the conventional case is compared with FIG. 11, the time required for “movement + wafer recovery / supply” of the first stage 5a is shortened by the above-described delivery operation. You can see that Further, for example, during the transfer of the immersion liquid 13 shown in FIGS. 10A to 10B, the second stage 5b is moved to the Y axis direction along with the movement of the first stage 5a in the Y axis direction minus side. If it is moved in the direction + side, the time required for “moving to the immersion liquid delivery position” can be shortened. Therefore, also in the present embodiment, it can be seen that the processing time is shortened as compared with the conventional exposure apparatus as a whole exposure sequence.

(Device manufacturing method)
Next, a method for manufacturing a device (semiconductor device, liquid crystal display device, etc.) according to an embodiment of the present invention will be described. A semiconductor device is manufactured through a pre-process for producing an integrated circuit on a wafer and a post-process for completing an integrated circuit chip on the wafer produced in the pre-process as a product. The pre-process includes a step of exposing a wafer coated with a photosensitive agent using the above-described exposure apparatus, and a step of developing the wafer. The post-process includes an assembly process (dicing and bonding) and a packaging process (encapsulation). A liquid crystal display device is manufactured through a process of forming a transparent electrode. The step of forming the transparent electrode includes a step of applying a photosensitive agent to a glass substrate on which a transparent conductive film is deposited, a step of exposing the glass substrate on which the photosensitive agent is applied using the above-described exposure apparatus, and a glass substrate. The process of developing is included. According to the device manufacturing method of the present embodiment, it is possible to manufacture a higher quality device than before.

  As mentioned above, although preferable embodiment of this invention was described, this invention is not limited to these embodiment, A various deformation | transformation and change are possible within the range of the summary.

DESCRIPTION OF SYMBOLS 3 Projection optical system 5a 1st stage 5b 2nd stage 13 Immersion liquid 14a 1st wafer 14b 2nd wafer 20 Control part 100 Exposure apparatus

Claims (8)

  1. An immersion liquid is provided between the final lens of the projection optical system and the substrate in the exposure area, which has a measurement area for measuring the substrate and an exposure area for exposing the substrate via the projection optical system. An exposure apparatus that exposes the substrate in a state where
    A first stage and a second stage that are movable while holding the substrate;
    A controller that controls driving of the first stage and the second stage,
    The control unit sets a transfer position, which is a position of the immersion liquid on the first stage, when the immersion liquid is transferred from the first stage to the second stage, and the substrate on the first stage. An exposure apparatus that determines an arbitrary position on the first stage based on the exposure end position and drives the first stage and the second stage based on the determined delivery position.
  2.   The exposure apparatus according to claim 1, wherein the exposure end position is a position determined based on a recipe relating to an exposure order of the substrates on the first stage.
  3. An immersion liquid is provided between the final lens of the projection optical system and the substrate in the exposure area, which has a measurement area for measuring the substrate and an exposure area for exposing the substrate via the projection optical system. An exposure apparatus that exposes the substrate in a state where
    A first stage and a second stage that are movable while holding the substrate;
    A control unit that controls driving of the first stage and the second stage, and the control unit is configured so that when the immersion liquid is transferred from the first stage to the second stage, the second stage A receiving position, which is a position for receiving the immersion liquid, is determined as an arbitrary position on the second stage based on an initial processing position on the substrate performed on the second stage, and the determined receiving position An exposure apparatus that drives the first stage and the second stage based on the above.
  4.   4. The exposure apparatus according to claim 3, wherein the first processing position is a measurement position in the exposure area or an exposure start position.
  5.   The controller determines the position of the immersion liquid on the first stage when the immersion liquid is transferred from the first stage to the second stage, and completes exposure of the substrate on the first stage. The exposure apparatus according to claim 3, wherein the exposure apparatus is made different depending on the position.
  6.   6. A position measuring device for measuring a stage position by irradiating light to a reference plate installed at a position facing each of the first stage and the second stage. The exposure apparatus according to any one of the above.
  7. Positions of the first stage and the second stage by irradiating the mirrors provided on the respective side surfaces of the first stage and the second stage with light and receiving the reflected light of the light from the mirror Equipped with an interferometer to measure
    The exposure apparatus according to claim 1, wherein the mirror is not installed on a side surface on a side where the immersion liquid is delivered or received.
  8. A step of exposing a substrate using the exposure apparatus according to any one of claims 1 to 7, and a step of developing the substrate exposed in the exposure step,
    A device manufacturing method comprising manufacturing a device from the substrate developed in the developing step.
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