JP6432722B2 - Semiconductor sensor device and manufacturing method thereof - Google Patents

Description

  The present invention relates to a structure of a semiconductor pressure sensor and a manufacturing method thereof, and also to various small sensors or various small devices such as an acceleration sensor, an acoustic transducer, and a pump device, and extremely reduces the size of the sensor and various devices. As a result, various sensors and various devices such as pressure sensors that are cheaper and have higher performance than conventional ones are provided.

  As a semiconductor pressure sensor, there is one in which a part of a semiconductor substrate such as a silicon wafer is thinned and covered with a lid. For example, Patent Document 1 discloses a structure in which a recess is formed in a substrate and the recess is covered with a diaphragm. This semiconductor pressure sensor detects the pressure by utilizing the fact that the diaphragm is deformed by the external pressure and the capacitance inside the recess is changed.

Patent 2918272

In a conventional pressure sensor that creates a space (cavity or recess) in a semiconductor substrate and uses the change in capacitance of the space, the space is formed in the lateral direction (plane direction) of the semiconductor substrate. A large area was occupied in the lateral direction (plane direction) of the substrate. FIG. 36 is a diagram schematically showing a conventional pressure sensor. In FIG. 36A, a space 502 formed on the surface of the chip 501 in the semiconductor substrate is covered with a lid 503. The space 502 is in a vacuum state (or a low pressure state of 1 atm or less). In the space, a lower electrode 504 formed on the substrate 501 and an upper electrode 505 formed on the lid 503 face each other. The interval between the lower electrode 504 and the upper electrode 505 is z. FIG. 36B is a plan view. The lid 503 is omitted. The planar size of the space is a rectangle of horizontal x and vertical y. Reference numeral 507 denotes a pressure sensor defined by x and y.
The capacity C of this space composed of the lower electrode and the upper electrode is represented by C = ε * ε0 * S / z. Here, ε is a relative dielectric constant, ε0 is a vacuum dielectric constant, S is an area in the plane direction of the semiconductor substrate, and S = x * y. Ε is about 1 when the space is air. When pressure P is received from the outside, the lid is deformed and bent downward, and z changes. Due to this change in z, the capacitance C changes, and the pressure can be calculated from the amount of change. The larger the amount of change, the easier it is to detect, so the larger the area S, the better. That is, in order to accurately measure the pressure, it is necessary to increase the area, so it is necessary to increase the planar size of this space, that is, x and y. Therefore, the chip size is increased. Since the wafer area is limited, the number of chips (pressure sensor chips) in the wafer is reduced. As a result, the price of the pressure sensor chip increases.

In the present invention, a plurality of deep grooves or through grooves are formed in the thickness direction of a planar substrate (for example, a disk shape or a rectangular plate shape), and a side wall sandwiched between adjacent through grooves is deformed by a pressure difference between the two sides. The present invention relates to a capacitance type pressure sensor that utilizes the fact that the capacitance changes by doing so. Specifically, the following measures are taken.

(1) The present invention provides a conductive substrate having a thickness of 2.0 mm or less having at least two groove (penetrating groove) spaces penetrating one or both of the upper surface and the lower surface, An insulator substrate (first surface insulator substrate) having a thickness of 1.0 mm or less attached to the upper surface (first surface) and a thickness of 1.0 mm or less attached to the lower surface (second surface) of the conductor substrate. A capacitive pressure sensor comprising an insulating substrate (second surface insulating substrate) having:
One electrode (first side wall capacitor electrode) that separates two adjacent through grooves (first through groove and second through groove) in the lateral direction (substantially perpendicular to the thickness direction of the conductive substrate). )age,
The first side wall capacitor electrode is opposed to one of the adjacent through grooves (first through groove), and the other side wall of the conductor substrate that is not electrically connected to the first side wall capacitor electrode is opposed to the other. An electrode (second sidewall capacitor electrode), and a first through groove space between the first sidewall capacitor electrode and the second sidewall capacitor electrode is defined as a capacitance space, and the first through groove serving as the capacitance space is formed. Due to the pressure difference between the pressure of the space and the pressure of the space of the other through groove (second through groove) sandwiching the first side wall capacitive electrode, the first side wall electrode is displaced, so that the first through groove space The pressure is detected using a change in capacitance, and the first side wall capacitor electrode has an upper surface attached to the first surface insulator substrate and / or a lower surface thereof is a second surface insulator. The adhesion to the substrate and / or the second sidewall capacitance electrode Upper surface attached to the first surface insulating substrate, and / or that the lower surface is adhered to the second surface insulating substrate, and wherein a capacitance-type pressure sensor.

(2) The present invention has a through-groove (third through-groove) facing the first through-groove across the second side wall capacitor electrode, and the pressure of the third through-groove and the pressure of the first through-groove The electrostatic pressure according to (1), wherein the pressure is detected by using a change in capacitance of the first through groove space due to displacement of the second side wall capacitive electrode due to a pressure difference. It is a capacitive pressure sensor.
(3) According to the present invention, the second through groove has a continuous conductor substrate including a first surface insulator substrate on the upper surface, a second surface insulator substrate on the lower surface, and a first sidewall capacitor electrode on the side surface ( (A first continuous conductor substrate), which is a closed space surrounded by the first surface insulator substrate, the second surface insulator substrate, and the first continuous conductor substrate, (1) or The capacitance type pressure sensor according to (2).
(4) In the present invention, the third through-groove has a continuous conductor substrate including a first surface insulator substrate on the upper surface, a second surface insulator substrate on the lower surface, and a second sidewall capacitor electrode on the side surface ( A second continuous conductor substrate), and a closed space surrounded by the first surface insulator substrate, the second surface insulator substrate, and the second continuous conductor substrate, (2) or The capacitance type pressure sensor according to (3).
(5) The present invention relates to a part of the first surface insulating substrate on the upper surface of the first through groove and / or the second through groove and / or the third through groove and / or part of the lower surface of the second surface insulating substrate. The capacitive pressure sensor according to any one of (1) to (4), wherein a pressure transmission hole for introducing pressure is formed.

(6) The present invention has a through groove (fourth through groove) surrounding the conductive substrate surrounding the second through groove and / or the third through groove, and the fourth through groove includes the second through groove and the second through groove. The fourth through groove has the same pressure space as the through groove. The upper surface of the fourth through groove is the first surface insulator substrate, the lower surface is the second surface insulator substrate, and the conductive substrate is continuous with the side surface (third continuous conductor substrate). The fourth through groove is a closed space surrounded by the first surface insulator substrate, the second surface insulator substrate, and the third continuous conductor substrate, (1) to (5) The capacitance type pressure sensor according to any one of the above.
(7) In the present invention, a pressure transmission hole for introducing pressure is formed in a part of the first insulator substrate on the upper surface and / or the second insulator substrate on the lower surface of the fourth through groove including the second through groove. The capacitance type pressure sensor according to (6), characterized in that:

(8) In the present invention, the second through groove is surrounded by a conductor substrate (first continuous conductor substrate) that forms the first sidewall capacitor electrode, and the conductor that forms the first sidewall capacitor electrode. The substrate is surrounded by the first through groove, and the first through groove is surrounded by the conductor substrate forming the second sidewall capacitor electrode, and the conductor forming the second sidewall capacitor electrode. The substrate is surrounded by the third through groove,
The outer surface of the second through-groove (the surface formed by the conductive substrate that forms the second through-groove and the first sidewall capacitor electrode, and is also the inner surface of the conductor substrate that forms the first sidewall capacitor electrode), The planar shape is a polygonal shape (G shape),
The outer surface of the first sidewall capacitor electrode (the surface formed by the first sidewall capacitor electrode and the first through groove and also the inner surface of the first through groove) has a planar shape that is substantially similar to the G shape. A square shape,
The outer surface of the first through groove (the surface formed by the second side wall capacitor electrode and the first through groove and also the inner surface of the second side wall capacitor electrode) has a planar shape that is substantially similar to the G shape. A square shape,
The outer surface of the second side wall capacitor electrode (the surface formed by the second side wall capacitor electrode and the third through groove and also the inner surface of the third through groove) has a planar shape substantially similar to the G shape. A square shape,
further,
The side thicknesses (widths) of the conductors forming the polygonal first side wall capacitive electrodes are substantially equal, and the side widths of the polygonal first through grooves are substantially equal, respectively, and the polygonal second side walls are formed. Each side thickness (width) of the conductor forming the capacitive electrode is substantially equal,
Each side of the conductor forming the polygonal first sidewall capacitor electrode forms a first sidewall capacitor electrode,
The capacitance type according to any one of (1) to (5), wherein each side of the conductor forming the second sidewall capacitor electrode having a polygonal shape forms a second sidewall capacitor electrode. pressure sensor.

(9) In the present invention, the side surface of the second through groove is surrounded by the conductive substrate forming the first side wall capacitive electrode, and the conductive substrate forming the first side wall capacitive electrode is formed by the first through groove. The first through groove is surrounded by a conductive substrate that forms a second sidewall capacitor electrode, and the conductive substrate that forms the second sidewall capacitor electrode is surrounded by a third through groove. Surrounded by the sides,
The outer surface of the second through-groove (the surface formed by the conductive substrate that forms the second through-groove and the first sidewall capacitor electrode, and is also the inner surface of the conductor substrate that forms the first sidewall capacitor electrode), The planar shape is a curved shape (S shape),
The outer surface of the first side wall capacitor electrode (the surface formed by the first side wall capacitor electrode and the first through groove and also the inner surface of the first through groove) has a planar shape that is substantially similar to the S shape. Shape,
The outer surface of the first through groove (the surface formed by the second side wall capacitor electrode and the first through groove and also the inner surface of the second side wall capacitor electrode) has a planar shape substantially similar to the S shape. Shape,
The outer surface of the second side wall capacitor electrode (the surface formed by the second side wall capacitor electrode and the third through groove, which is also the inner surface of the third through groove) has a planar shape that is substantially similar to the S shape. Shape,
further,
The thickness (width) of the conductor forming the curved first sidewall capacitor electrode is substantially constant in each portion, and the width of the curved first through groove is substantially constant in each portion. The thickness (width) of each side of the conductor forming the two side wall capacitive electrode is substantially constant in each part,
The entire conductor that forms the curved first sidewall capacitor electrode is stripped to form the first sidewall capacitor electrode,
The capacitance type pressure sensor according to any one of (1) to (5), wherein the entire conductor forming the curved second sidewall capacitance electrode forms the second sidewall capacitance electrode. .

(10) The present invention further includes a conductor substrate (third continuous conductor substrate) whose side surface surrounding the third through groove is continuous, and the third through groove includes the first surface insulator substrate and the second surface. The capacitive pressure sensor according to (8) or (9), characterized in that it is a closed space surrounded by an insulator substrate and a conductor substrate (third continuous conductor substrate).
(11) The present invention is characterized in that a pressure transmission hole for introducing pressure is formed in a part of the first insulator substrate on the upper surface of the third through groove and / or the second insulator substrate on the lower surface. The capacitance type pressure sensor according to (10).
(12) The present invention is characterized in that a pressure transmission hole for introducing pressure is formed in a part of the first insulator substrate on the upper surface of the third through groove and / or the second insulator substrate on the lower surface. The capacitance type pressure sensor according to (10).
(13) In the present invention, the conductive substrate is a low-resistance N-type silicon substrate having a high-concentration impurity element, a low-resistance P-type silicon substrate having a high-concentration impurity element, a conductive rubber substrate, and a conductive polymer material. The capacitive pressure sensor according to any one of (1) to (12), wherein the capacitive pressure sensor is a substrate selected from a substrate and a metal substrate such as copper or aluminum.
(14) In the present invention, the first surface insulator substrate is a substrate selected from a glass substrate, a quartz substrate, a transparent plastic substrate, a polymer material substrate, and a ceramic substrate. The capacitance type pressure sensor according to any one of the above.
(15) In the present invention, the second surface insulator substrate is a substrate selected from a glass substrate, a quartz substrate, a transparent plastic substrate, a polymer material substrate, and a ceramic substrate. The capacitance type pressure sensor according to any one of items 1).

(16) The present invention provides a second surface (for example, 1.0 mm or less) having a top surface (first surface) and a bottom surface (second surface) (for example, having a thickness of 2.0 mm or less). Producing a composite substrate to which an insulating substrate (thick surface insulating substrate) having a thickness is attached;
Forming a through groove penetrating from the first surface of the conductor substrate to the second surface using the patterned photosensitive film on the first surface side of the conductor substrate and reaching the second surface insulator substrate;
An insulator substrate (first surface insulator substrate) (for example, having a thickness of 1.0 mm or less) is attached to the first surface side of the conductor substrate, and a part or all of the through groove is a closed space. A method for manufacturing a capacitive pressure sensor including a process,
A conductor side wall sandwiched between two adjacent through grooves is used as an electrode of a capacitance element, and the capacitance side wall electrode is deformed by a pressure difference inside the two adjacent through grooves. It is a manufacturing method of a capacitance type pressure sensor using change of electric capacity.

(17) The present invention provides a second surface (for example, 1.0 mm or less) having a front surface (first surface) and a back surface (second surface) (for example, having a thickness of 2.0 mm or less). Producing a composite substrate to which an insulating substrate (thick surface insulating substrate) having a thickness is attached;
Forming a first surface through groove penetrating from the first surface of the conductor substrate to the second surface using the patterned photosensitive film on the first surface side of the conductor substrate and reaching the second surface insulator substrate; ,
An insulator substrate (first surface insulator substrate) (for example, having a thickness of 1.0 mm or less) is attached to the first surface side of the conductor substrate, and a part or all of the first surface through groove is closed. The process of making space,
Using the photosensitive film patterned on the second surface insulator substrate of the composite substrate, the second surface insulator substrate and the second surface of the conductor substrate penetrate from the second surface to the first surface to reach the first surface insulator substrate. Forming a groove (second surface through groove);
A method of manufacturing a capacitive pressure sensor including:
The conductor side wall sandwiched between two adjacent through grooves (first surface through groove and second surface through groove) is used as an electrode of the capacitance element, and the pressure of the first surface through groove and the second surface through groove are This is a method of manufacturing a capacitive pressure sensor using the change in the capacitance of the capacitive element caused by the deformation of the conductor side wall electrode due to the pressure difference.

(18) In the present invention, an insulator substrate (first surface insulator substrate) (for example, having a thickness of 1.0 mm or less) is attached to the first surface side of the conductor substrate, and the first surface through groove The method of manufacturing a capacitive pressure sensor according to (17), further including a step of thinning the second surface insulating substrate after the step of setting a part or all of the closed space.
(19) The present invention provides a first surface insulator substrate and / or a through groove or a first surface through groove attached to an upper surface of the through groove or the first surface through groove and / or the second surface through groove. And / or further comprising a step of forming a pressure transmission hole in the second surface insulator substrate adhering to the lower surface of the second surface through groove, any one of (16) to (18), The method for producing the capacitance type pressure sensor described in 1.
(20) The present invention provides a conductive substrate that is continuous with the electrode of the capacitance element, which is a conductive sidewall sandwiched between two adjacent through grooves (first surface through groove and second surface through groove), and The other electrode of the capacitive element opposite to the first surface insulator substrate attached to the upper surface of the continuous conductor substrate and / or the temporary surface, or a contact hole in a part of the second surface insulator substrate And a step of forming a conductor film in the contact hole and forming an electrode / wiring for connecting to the outside on the first surface insulator substrate and / or the second surface insulator substrate. The method for producing a capacitive pressure sensor according to any one of (16) to (19), wherein:

(21) In the present invention, the conductive substrate is a low-resistance N-type silicon substrate having a high-concentration impurity element, a low-resistance P-type silicon substrate having a high-concentration impurity element, a conductive rubber substrate, and a conductive polymer material. It is a board | substrate selected from metal substrates, such as a board | substrate and copper and aluminum, It is a manufacturing method of the electrostatic capacitance type pressure sensor as described in any one of (16)-(20) characterized by the above-mentioned.
(22) In the present invention, the first surface insulator substrate is a substrate selected from a glass substrate, a quartz substrate, a transparent plastic substrate, a polymer material substrate, and a ceramic substrate. 21) The method for producing a capacitive pressure sensor according to any one of items 21).
(23) The present invention is characterized in that the second surface insulator substrate is a substrate selected from a glass substrate, a quartz substrate, a transparent plastic substrate, a polymer material substrate, and a ceramic substrate. 22) The method for producing a capacitive pressure sensor according to any one of the items 22).

(24) The present invention provides a silicon substrate having a low concentration impurity region on the upper surface (first surface) side and a reverse conductivity type high concentration impurity region reaching the lower surface (second surface) on the lower side. A groove formed from one surface side (first surface groove) that does not reach the second surface and a low concentration impurity region that is formed from the second surface side and reaches the first surface side with respect to the substrate thickness direction. A capacitive pressure sensor having a groove that does not reach (second surface groove),
The silicon substrate side wall (A1) sandwiched between the adjacent first surface groove O1 and second surface groove Q2 is used as an electrode of one capacitance element, and is opposed to the first surface groove O1 with the second surface groove Q2 interposed therebetween. The side wall (A2) of the silicon substrate sandwiched between the first surface groove O2 and the second surface groove Q2 is used as the electrode of the other electrostatic capacitance element, and the pressure of the first surface grooves O1 and O2 and the second surface groove Q2 A capacitance type pressure sensor that performs pressure detection by changing the capacitance of the capacitance element in the second surface groove Q2 by deforming the silicon substrate side walls A1 and A2 due to a pressure difference. Yes,
The first surface grooves O1 and O2 are surrounded by a second surface groove and supported by a silicon substrate having a low-concentration impurity region on the upper surface (first surface) side of the silicon substrate. It is a capacitive pressure sensor.

(25) The present invention provides a silicon substrate having a low concentration impurity region on the upper surface (first surface) side and a reverse conductivity type high concentration impurity region reaching the lower surface (second surface) on the lower side. A through groove (first surface through groove R1) formed from one surface side and reaching the second surface and a low concentration impurity region formed from the second surface side and reaching the first surface side with respect to the substrate thickness direction. A capacitive pressure sensor having a groove (second surface groove) that does not reach
The silicon substrate side wall (A1) sandwiched between the adjacent first surface through groove R1 and second surface groove Q2 is used as an electrode of one capacitance element, and the first surface through groove R1 is sandwiched between the second surface groove Q2. The silicon substrate side wall (A2) sandwiched between the first surface through groove R2 and the second surface groove Q2 facing each other is used as the electrode of the other electrostatic capacitance element, and the pressure in the first surface through grooves R1 and R2 and the second Capacitance characterized in that pressure detection is performed by changing the capacitance of the capacitive element in the second surface groove Q2 by deforming the silicon substrate side walls A1 and A2 due to the pressure difference of the surface groove Q2. Mold pressure sensor,
The first surface through grooves R1 and R2 are surrounded by a second surface groove and supported by a silicon substrate having a low concentration impurity region on the upper surface (first surface) side of the silicon substrate. It is a capacitance type pressure sensor.

(26) The capacitive pressure sensor according to (25), wherein the second surface side of the first surface through grooves R1 and R2 is closed with an insulating substrate attached thereto. is there.
(27) The present invention is a capacitance-type pressure sensor characterized in that a high-concentration impurity diffusion layer having a conductivity type opposite to that of the low-concentration impurity region on the second surface groove Q2 side is not formed. The upper surface of the low-concentration impurity region (B region) at the upper part of the second surface through groove different from the second surface groove Q2 side and the first surface grooves O1 and O2 connected thereto or the first surface through grooves R1 and R2 A high-concentration impurity diffusion layer of the opposite conductivity type is formed in the low-concentration impurity region on the side wall, and electrodes / wirings (C electrodes / wirings) connected to the high-concentration impurity diffusion layer formed on the upper surface in the B region are formed. Silicon that is formed and is a high-concentration impurity (low resistance) region on the first surface groove O1 and first surface groove O2 on the second surface groove Q2 side or on the side wall of the first surface through groove R1 and first surface through groove R2 Semiconductor base And electrically connected to the C electrode / wiring through the silicon semiconductor substrate which is a high concentration impurity (low resistance) region on the side wall of the first surface groove O1 and the first surface groove O2 or the first surface through grooves R1 and R2. The capacitance type pressure sensor according to any one of (24) to (26), wherein

(28) The present invention does not form a high-concentration impurity diffusion layer having a conductivity type opposite to that of the first surface of the low-concentration impurity region in the upper part on the second surface groove Q2 side. The upper surface of the low concentration impurity region (B region) in the upper part of the second surface through groove different from the second surface groove Q2 side and the first surface grooves O1 and O2 connected thereto, or the first surface through groove, which is a pressure sensor A high-concentration impurity diffusion layer having a conductivity type opposite to this is formed in the low-concentration impurity regions on the sidewalls of R1 and R2, and electrodes / wirings (C electrodes) connected to the high-concentration impurity diffusion layer formed on the upper surface in the B region High-concentration impurities (low resistance) on the first surface groove O1 and the first surface groove O2 on the second surface groove Q2 side or the side walls of the first surface through groove R1 and the first surface through groove R2 Silicon that is the region Through the conductor substrate and the silicon semiconductor substrate which is a high concentration impurity (low resistance) region in the side wall of the first surface groove O1 and the first surface groove O2 or the first surface through grooves R1 and R2, the C electrode / wiring is electrically connected The capacitance type pressure sensor according to any one of (24) to (26), wherein the capacitance type pressure sensor is connected to the capacitor.
(29) According to the present invention, in any one of the items (24) to (28), the low concentration impurity region is a region formed by epitaxial growth on a low resistance silicon substrate having a high concentration impurity. It is an electrostatic capacitance type pressure sensor of description.
(30) The present invention is characterized in that the low concentration impurity region is a region formed by bonding a high resistance silicon substrate having a high concentration impurity on a low resistance silicon substrate having a high concentration impurity. 24) A capacitance type pressure sensor according to any one of the items (28).
(31) In the present invention, an impurity diffusion layer having a conductivity type opposite to that of the first surface grooves O1 and O2 or the first surface through-grooves R1 and R2 is formed by a rotary ion implantation method or a pre-deposition method. The capacitance-type pressure sensor according to any one of (24) to (30), wherein the capacitance-type pressure sensor is produced by diffusing by heat treatment from a high-concentration impurity layer introduced by (1).
(32) The invention according to any one of (24) to (31), wherein the present invention is mounted on the same silicon substrate as that on which a semiconductor device such as a transistor is formed. It is a capacitance type pressure sensor.
(33) The present invention provides a semiconductor device in which the capacitive pressure sensor according to any one of (24) to (31) is mounted in the same chip.

(34) The present invention provides a silicon substrate having a low concentration impurity region on the upper surface (first surface) side and a reverse conductivity type high concentration impurity region reaching the lower surface (second surface) on the lower side.
A step of forming a groove (first surface groove) that does not reach the second surface side from the first surface side, and a groove that reaches the low concentration impurity region on the first surface side from the second surface side but does not reach the first surface A method of manufacturing a capacitive pressure sensor, comprising a step of forming (second surface groove),
The silicon substrate side wall (A1) sandwiched between the adjacent first surface groove O1 and second surface groove Q2 is used as an electrode of one capacitance element, and is opposed to the first surface groove O1 with the second surface groove Q2 interposed therebetween. The side wall (A2) of the silicon substrate sandwiched between the first surface groove O2 and the second surface groove Q2 is used as the electrode of the other electrostatic capacitance element, and the pressure of the first surface grooves O1 and O2 and the second surface groove Q2 A capacitance type pressure sensor characterized in that pressure detection is performed by changing the capacitance of the capacitive element in the second surface groove Q2 by deforming the silicon substrate side walls A1 and A2 due to a pressure difference. Manufacturing method,
The first surface grooves O1 and O2 are surrounded by a second surface groove and supported by a silicon substrate having a low-concentration impurity region on the upper surface (first surface) side of the silicon substrate. This is a method of manufacturing a capacitive pressure sensor.

(35) The present invention provides a silicon substrate having a low-concentration impurity region on the upper surface (first surface) side and a reverse-conduction type high-concentration impurity region reaching the lower surface (second surface) on the lower side.
A step of forming a through groove (first surface through groove) reaching the second surface from the first surface side, and a groove reaching the low concentration impurity region on the first surface side from the second surface side but not reaching the first surface A method of manufacturing a capacitive pressure sensor, comprising a step of forming a (second surface groove),
The silicon substrate side wall (A1) sandwiched between the adjacent first surface through groove (first surface through groove R1) and second surface groove (second surface groove Q2) is used as an electrode of one capacitance element. The silicon substrate side wall (A2) sandwiched between the first surface through groove R2 and the second surface groove Q2 facing the first surface through groove R1 with the two surface groove Q2 interposed therebetween is used as an electrode of the other capacitance element. The silicon substrate side walls A1 and A2 are deformed by the pressure difference between the first surface through grooves R1 and R2 and the second surface groove Q2, so that the capacitance of the electrostatic capacitance element in the second surface groove Q2 changes. A method of manufacturing a capacitive pressure sensor, wherein pressure detection is performed by:
The first surface through grooves R1 and R2 are surrounded by a second surface groove and supported by a silicon substrate having a low concentration impurity region on the upper surface (first surface) side of the silicon substrate. This is a method of manufacturing a capacitive pressure sensor.
(36) The present invention further includes a step of attaching an insulating substrate to the second surface side of the first surface through groove after forming the first surface through groove, whereby the second surface through groove second is formed. The method for producing a capacitive pressure sensor according to (35), wherein the surface side is closed.
(37) The present invention further includes a step of introducing an impurity layer having a conductivity type opposite to that of the low concentration substrate surface on the side wall of the first surface through groove by a predeposition method or a rotary ion implantation method. , (34) to (36) The method for producing a capacitive pressure sensor according to any one of the items.

(38) In the present invention, a deep groove or a through hole is formed in the thickness direction of the semiconductor substrate, and a pressure sensor is formed using a capacitance formed between the grooves or the through holes. Further, a piezoresistor is formed on the side surface (side wall) of the groove or the through hole, and a pressure sensor is formed by utilizing a change in piezo resistance due to deformation of the through hole side wall.
(39) The present invention provides a semiconductor device having a plurality of grooves formed in the thickness direction of the semiconductor substrate, and the pressure in the space in one groove (first groove) of the plurality of adjacent grooves and the adjacent one. This is a semiconductor device having a pressure sensor that utilizes the deformation of the side wall (partition wall) between the first groove portion and the second groove portion due to the pressure of the space in the groove portion (second groove portion).
(40) The present invention has a capacitive pressure sensor that detects pressure by changing the capacitance in the first groove and / or the second groove, and the opening of the first groove is made airtight by a cap and is fixed. It is characterized by being held at pressure. Furthermore, a cap provided with one or a plurality of pressure introducing holes is attached to the opening of the first groove, and a cap provided with one or a plurality of pressure introducing holes is attached to the opening of the second groove. To do.

(41) The present invention provides a semiconductor device having a third groove portion (third groove portion) adjacent to the second groove portion and facing the first groove portion with respect to the second groove portion, in the first groove portion and the third groove portion. Is different from the pressure in the second groove portion, and the first electrode is formed on the side wall (partition wall) between the first groove portion and the second groove portion on the first groove portion side wall. A second electrode is formed on the side wall (partition wall) between the groove and the second groove, and a capacitor is formed between the first electrode and the second electrode. And It has two electrodes separated on two opposite side walls of the first groove, and a space capacity in the first groove is formed between these two electrodes.
(42) The present invention has two electrodes separated on two opposing side walls of the second groove portion, and a space capacity in the second groove portion is formed between the two electrodes, and two or more Capacitors are connected in parallel. Alternatively, two or more capacitors are connected in series.
(43) The present invention provides a semiconductor device having a plurality of through holes formed in the thickness direction of the semiconductor substrate and penetrating the first surface and the second surface of the semiconductor substrate. A side wall (between the first through hole and the second through hole) due to the pressure in the space in one through hole (first through hole) and the pressure in the space in the through hole (second through hole) adjacent thereto. A capacitance type pressure sensor that detects pressure by changing the capacitance in the first through hole and / or in the second through hole by utilizing the deformation of the partition wall, and caps the opening of the first through hole It is characterized by being airtight and kept at a constant pressure. In addition, a cap having one or more pressure introduction holes is attached to the opening of the first through hole, and a cap having one or more pressure introduction holes is attached to the opening of the second through hole. Features.

(44) The present invention provides a first through hole in a semiconductor device having a third through hole (third through hole) adjacent to the second through hole and facing the first through hole with respect to the second through hole. The inside pressure and the inside of the third through hole are the same pressure, and this pressure is different from the pressure in the second through hole and differs from the pressure in the side wall (partition) between the first through hole and the second through hole. A first electrode is formed, and a second electrode is formed on the side wall (partition wall) between the third through hole and the second through hole on the side wall of the third through hole. A capacitor is formed between the electrodes. Further, the first through hole has two electrodes separated on two opposing side walls, and a space capacity in the first through hole is formed between the two electrodes.
(45) The present invention has two electrodes separated on two opposing side walls of the second through-hole, and a space capacity in the second through-hole is formed between the two electrodes. The above capacity is connected in parallel. Alternatively, two or more capacitors are connected in series.
(46) The present invention includes a piezoresistive pressure sensor that detects pressure by a change in piezoresistance formed on the side wall (partition wall). Furthermore, the resistance formed in the 2 or more groove part side wall is connected in parallel, It is characterized by the above-mentioned. Alternatively, resistors formed on two or more groove side walls are connected in series. Alternatively, four resistors are connected in an annular series formed on one groove side wall. The opening of the first groove or the first through hole is hermetically sealed with a cap and held at a constant pressure, and the first groove and / or the second groove, or the first through hole and / or the second through hole. A cap provided with one or a plurality of pressure introducing holes is attached to the opening.

(47) According to the present invention, in a substrate composed of a first surface (main surface) and a second surface (back surface), a plurality of adjacent recesses are formed in the substrate, and a substrate side wall sandwiched between the adjacent recesses is formed as a diaphragm. A first conductor film formed on the side wall of the substrate, a piezoelectric film formed on the first conductor film, and a second conductor formed on the piezoelectric film. A potential difference generated when the piezoelectric film is deformed together with the substrate side wall due to different pressure differences in the plurality of adjacent recesses including the body film, using the first conductor film and the second conductor film. Preferably, the substrate side wall is perpendicular or substantially perpendicular to the first surface or the second surface of the substrate (preferably with an inclination of 20 degrees or less with respect to the first surface or the second surface). Is less than 10 degrees, more preferably 5 And the pressure sensor is formed on both sides of the substrate side wall, or one of the adjacent recesses (first recess) is formed from the first surface side of the substrate. The other of the adjacent concave portions (second concave portion) is formed from the second surface side of the substrate, or the first concave portion does not penetrate the second surface side of the substrate, and The two recesses do not penetrate to the second surface side, or the adjacent recesses (first recess and second recess) are both formed from the first surface side of the substrate, or are adjacent to each other. The recesses (the first recess and the second recess) are both formed from the second surface side of the substrate, or the adjacent recesses (the first recess and the second recess) are the second surface from the first surface side. A through-groove penetrating to the side or the adjacent The portion (first recess and second recess) is a through groove penetrating from the second surface side to the first surface side, and further, the first surface side and / or the second surface side of the recess is different from the substrate. A pressure transmission hole for transmitting pressure into the recess is opened in a part of the thin plate covering the recess, and the substrate is a semiconductor substrate or a conductor. An insulating film interposed between the substrate side wall and the first conductor film, and the pressure sensor and the transistor are both mounted in one chip, or the substrate is made of polymer. And the recess is formed in the polymer by using an imprint method.

(48) According to the present invention, in addition to (47), in the pressure sensor formed on both sides of the substrate side wall, the pressure sensor is formed on the first recess side formed on the first surface side of the substrate and opened on the first surface side. Lead electrode pads connected to the first conductor film and the second conductor film are formed on the first surface side of the substrate, and are formed on the second surface side of the substrate and open to the second surface side. (2) Lead electrode pads connected to the first conductor film (third conductor film) and the second conductor film (fourth conductor film) on the recess side are formed on the second surface side of the substrate; In the case where a plurality of pressure sensors are formed in the substrate, the plurality of pressure sensors are connected, and a conductor film and / or an electrode having the same polarity potential is connected to increase the potential. It is characterized by.

(48) The present invention is a pressure sensor having a plurality of recesses formed in an insulator film formed on a semiconductor substrate, and in two adjacent recesses (first recess and second recess). The sandwiched insulator film side wall is a diaphragm, the first conductor film formed on the side surface of the insulator film side wall, the piezoelectric film formed on the first conductor film, and the piezoelectric film A pressure sensor having a formed second conductive film, wherein the insulator film side wall and the piezoelectric film formed thereon are formed by a pressure difference between the two concave portions (first concave portion and second concave portion). Is deformed to measure the potential difference generated on both sides of the piezoelectric film through the first conductor and the second conductor, so that the two recesses (the first recess and the second recess) Detecting the pressure difference between The first conductor film, the piezoelectric film formed on the first conductor film, and the second conductor film formed on the piezoelectric film are formed of the insulator film. Formed on both sides of the side wall, and the insulator film is a polymer or ceramic or a mixture thereof, or the recess in the insulator film is formed by using an imprint method, The insulator film is formed in a recess formed in a semiconductor substrate.

(49) In the present invention, in a substrate composed of a first surface (main surface) and a second surface (back surface), the first concave portion having the opening on the first surface side adjacent to the first surface and the second surface side being the opening. In a pressure sensor having a piezoelectric film formed on the substrate sidewall, the substrate sidewall sandwiched between the second recesses being a diaphragm, the first conductor film is formed on the side of the first recess. The process of
Forming a first piezoelectric film on the first conductive film; forming a second conductive film on the piezoelectric film; and a first thin plate covering the first recess on the first surface. A step of forming a second recess, a step of forming a third conductor film on a side surface of the second recess, a step of forming a second piezoelectric film on the second conductor film, and the second Forming a fourth conductor film on the piezoelectric film, and attaching a second thin plate covering the second recess on the second surface. In addition, the first recess is a through groove penetrating to the second surface side of the substrate, or the second recess is a through groove penetrating to the first surface side of the substrate. Forming a first electrode / wiring to be connected to the body film on the first surface side, a second electrode / wiring to be connected to the second conductor film Forming on the first surface side, forming a third electrode / wiring connected to the third conductor film on the second surface side, and a fourth electrode / wiring connected to the fourth conductor film It includes a step of forming on the second surface side.

(50) According to the present invention, in the substrate composed of the first surface (main surface) and the second surface (back surface), the substrate sidewall sandwiched between the first recess and the second recess having the adjacent first surface side as an opening A pressure sensor having a piezoelectric film formed on the substrate side wall, a step of forming the first recess and the second recess, a step of forming a first conductor film on a side surface of the first recess,
Forming a first piezoelectric film on the first conductive film; forming a second conductive film on the first piezoelectric film; and a first recess and a second on the first surface. A method of manufacturing a pressure sensor, comprising: attaching a first thin plate that covers a recess, and further forming a third conductor film on a side surface of the second recess, the third conductor film A step of forming a second piezoelectric film on the second piezoelectric film; and a step of forming a fourth conductive film on the second piezoelectric film. A through groove penetrating to the second surface side of the substrate, or further, forming a first electrode / wiring to be connected to the first conductor film on the first surface side; connecting to the second conductor film A step of forming a second electrode / wiring on the first surface side, and a third electrode / wiring connected to the third conductor film on the first surface Characterized in that it comprises a step of forming a fourth electrode and wiring on the first surface side connecting step, and a fourth conductive film formed.

(51) In the present invention, in the piezoelectric substrate composed of the first surface (main surface) and the second surface (back surface), a plurality of adjacent recesses are formed in the piezoelectric substrate and sandwiched between the adjacent recesses. A pressure sensor having a diaphragm on a side wall of a piezoelectric substrate, a first conductive film formed on one side surface of the side wall of the piezoelectric substrate, and a second sensor formed on the other side surface of the side wall of the piezoelectric substrate. A potential difference generated when the piezoelectric substrate side wall is deformed by a different pressure difference in the plurality of adjacent recesses including the conductor film is detected using the first conductor film and the second conductor film. The piezoelectric substrate side wall is perpendicular or substantially perpendicular to the first surface or the second surface of the piezoelectric substrate (the inclination is 20 degrees with respect to the first surface or the second surface). Or less, preferably 10 degrees or less, And wherein preferably it is less than 5 degrees) in Innovation,

(51-2) According to the present invention, in addition to (51), one of the adjacent concave portions (first concave portion) is formed from the first surface side of the substrate, and the other of the adjacent concave portions (second concave portion). Is formed from the second surface side of the substrate, and the first concave portion does not penetrate the second surface side of the substrate, and the second concave portion does not penetrate the second surface side. Alternatively, the first recess penetrates the second surface side of the substrate, and / or the second recess penetrates the second surface side, or the adjacent recess (first recess). , The second recess) are both formed from the first surface side of the substrate, or the adjacent recesses (first recess, second recess) are both formed from the second surface side of the substrate. Further, the adjacent concave portion is a through groove penetrating from the first surface side to the second surface side, or Characterized in that the adjacent recesses is a through groove extending through the first surface side from the second surface side. Alternatively, the first surface side and / or the second surface side of the concave portion is covered with a thin plate different from the substrate, and a part of the thin plate covering the concave portion is included in the concave portion. A pressure transmission hole for transmitting pressure is opened, or the piezoelectric substrate is a piezoelectric polymer, and the concave portion is formed in the piezoelectric polymer using an imprint method, or the piezoelectric substrate Is a piezoelectric ceramic, and the concave portion is formed in the piezoelectric ceramic by using an imprint method. Further, when a plurality of pressure sensors are formed in the substrate, the plurality of pressure sensors are connected, and the conductor film and / or the electrode having the same polarity potential are connected to increase the potential. It is characterized by that.

(52) According to the present invention, in the piezoelectric substrate composed of the first surface (main surface) and the second surface (back surface), the first concave portion having the opening on the first surface side adjacent to the first surface and the opening on the second surface side. In the pressure sensor in which the side wall of the piezoelectric substrate sandwiched between the second recesses is a diaphragm, the step of forming the first recess, the step of forming the first conductor film on the side surface of the first recess, the first surface on the first surface A step of attaching a first thin plate covering the first recess, a step of forming the second recess, a step of forming a second conductor film on a side surface of the second recess, and a second step of covering the second recess on the second surface A pressure sensor manufacturing method, wherein the first recess is a through groove penetrating to the second surface side of the substrate, and the second recess Is a through groove penetrating to the first surface side of the substrate.

(53) In the piezoelectric substrate comprising the first surface (main surface) and the second surface (back surface), the present invention is sandwiched between the first recess and the second recess having the adjacent first surface side as an opening. Forming a first recess and a second recess in a pressure sensor having a piezoelectric substrate side wall as a diaphragm;
Forming a first conductor film on a first recess side surface; forming a second conductor film on a second recess side surface; and a first thin plate covering the first recess and the second recess on the first surface The first recess and the second recess are through-grooves penetrating to the second surface side of the substrate.

(54) The present invention is a pressure sensor having a plurality of recesses formed in a piezoelectric film formed on a semiconductor substrate, and sandwiched between two adjacent recesses (a first recess and a second recess). In the pressure sensor using the piezoelectric film side wall as a diaphragm, the piezoelectric film side wall is deformed by a pressure difference between the two concave portions (the first concave portion and the second concave portion), so that both sides of the piezoelectric film side wall are deformed. The pressure sensor detects a pressure difference between the two concave portions (first concave portion and second concave portion) using a potential difference generated on a surface, and the piezoelectric film is a polymer or ceramic. Or a mixture thereof, and the recesses in the piezoelectric film are formed using an imprint method, and the piezoelectric film is formed in a recess formed in the semiconductor substrate, Alternatively, in the case where a plurality of pressure sensors are formed in the piezoelectric film, the plurality of pressure sensors are connected, and the conductor film and / or the electrode having the same polarity potential are connected to each other. And there is a device other than the pressure sensor in the semiconductor substrate, and the pressure sensor and the device other than the pressure sensor are formed on both sides of the piezoelectric film side wall. The body membrane is connected through at least the body membrane.

(55) According to the present invention, in the substrate composed of the first surface (main surface) and the second surface (back surface), a plurality of adjacent recesses (first recess and second recess) are formed in the substrate and are adjacent to each other. A pressure sensor having a substrate side wall sandwiched between recesses as a diaphragm, wherein the substrate side wall is deformed by a pressure difference between a plurality of adjacent recesses (a first recess and a second recess), whereby the substrate side wall is deformed. A pressure sensor that detects a pressure difference between the plurality of adjacent recesses (first recess and second recess) by using a change in resistance of the formed piezoresistor, and The substrate side wall is perpendicular or substantially perpendicular to the first surface or the second surface of the piezoelectric substrate (the inclination is 20 degrees or less, preferably 10 degrees or less, more preferably 5 degrees with respect to the first surface or the second surface). Or In a plurality of adjacent concave portions (first concave portion and second concave portion), the first concave portion is formed from the first surface side with the first surface side of the substrate as an opening, and the second concave portion is formed on the first surface side of the substrate. The second surface side is formed from the second surface side as an opening, or, further, the first recess is a through groove penetrating the second surface side of the substrate, and / or the second recess is It is a penetration groove penetrated to the 1st surface side of the substrate.

(56) In addition to (55), in the present invention, the plurality of adjacent concave portions (first concave portion and second concave portion) are formed from the first surface side with the first surface side of the substrate as an opening. And the plurality of adjacent recesses (first recess and second recess) are through-grooves penetrating to the second surface side of the substrate, or the piezoresistor is a thin film resistor, or The substrate is a semiconductor substrate, and the piezoresistor is a diffusion resistor formed by a pre-deposition method or an ion implantation method, or a thin film resistor, and a transistor is mounted in addition to a pressure sensor in the substrate, An arithmetic circuit for processing a signal from the pressure sensor; or the substrate is made of a polymer, and the recess is formed by an imprint method. Reduction is characterized in that to amplify the change in the piezoresistive detecting features, or even by connecting a plurality of pressure sensors using a bridge circuit formed on the substrate side walls.
(56-2) The present invention is a pressure sensor having a plurality of recesses formed in an insulator film formed on a semiconductor substrate, and is provided in two adjacent recesses (first recess and second recess). The sandwiched insulator film side wall is a diaphragm, and the insulator film side wall is deformed by a pressure difference between a plurality of adjacent recesses (first recess and second recess), and is formed on the insulator film side wall. A pressure difference between the plurality of adjacent recesses (first recess and second recess) is detected using a change in resistance of the piezoresistor, and the insulator film is a polymer, The recess is formed by an imprint method, and the piezoresistor is a thin film resistor.

(57) According to the present invention, in a substrate composed of a first surface (main surface) and a second surface (back surface), a plurality of adjacent recesses (first recess and second recess) are formed in the substrate and are adjacent to each other. A pressure sensor using a substrate side wall sandwiched between recesses as a diaphragm, wherein the substrate side wall is deformed by a pressure difference between a plurality of adjacent recesses (a first recess and a second recess), thereby static electricity in the recess. A pressure sensor for detecting a pressure difference between the plurality of adjacent concave portions (first concave portion and second concave portion) by using a change in capacitance, and the piezoelectric substrate side wall It is perpendicular or substantially perpendicular to the first surface or the second surface of the piezoelectric substrate (the inclination is 20 degrees or less, preferably 10 degrees or less, more preferably 5 degrees or less with respect to the first surface or the second surface). There are or more In the portion (first recess and second recess), the first recess is formed from the first surface side with the first surface side of the substrate as an opening, and the second recess opens from the second surface side of the substrate. And the first recess is a through groove penetrating to the second surface side of the substrate, and / or the second recess is on the first surface side of the substrate. Or a plurality of adjacent recesses (first recess and second recess) are formed from the first surface side with the first surface side of the substrate as an opening. The plurality of adjacent recesses (first recess and second recess) are through-grooves penetrating to the second surface side of the substrate, or the substrate is made of a polymer, and the recess is It is formed by a printing method.

(58) The present invention is a pressure sensor having a plurality of recesses formed in an insulator film formed on a semiconductor substrate, and is sandwiched between two adjacent recesses (first recess and second recess). In the pressure sensor having a counter electrode formed on opposite side surfaces in the recess, the insulator film side wall being a diaphragm, and the insulator due to a pressure difference between the two recesses (first recess and second recess) The pressure difference between the two recesses (the first recess and the second recess) is detected using a change in electrostatic capacitance between the counter electrodes in the recess when the film side wall is deformed. The insulator film is a polymer or ceramic, and the recess is formed by an imprint method, or the insulator film is a recess formed in a semiconductor substrate. Further, the opening of the recess is covered with a thin plate, and a pressure transmission hole for transmitting pressure into the recess is opened in a part of the thin plate covering the recess. Features.

(59) The present invention provides a medium ejection device using a substrate having a plurality of through grooves penetrating from the first surface to the second surface, and passing through at least one through groove among the plurality of adjacent through grooves. The pressure variable through-groove and the medium discharge through-groove are formed by changing the pressure in the pressure variable through-groove as a through-groove (pressure variable through-groove) whose pressure can be changed. The medium is introduced into the medium discharge through groove or the medium in the medium discharge through groove is discharged from the medium discharge through groove using the expansion or contraction of the side wall of the substrate. The first thin plate is attached to the first surface side of the through groove to cover the through groove, and the first thin plate in the pressure variable through groove. Has a pressure transmission hole, a medium introduction hole is opened in the first thin plate in the medium ejection through groove, a second thin plate is attached to the second surface side of the through groove, and the penetration The medium discharge hole covers the groove, and a medium discharge hole is opened in the second thin plate in the medium discharge through groove, and the pressure of the pressure variable through groove is adjacent to the pressure transmission hole of the pressure variable through groove. By reducing the pressure of the medium discharge through groove to be lower than the pressure of the medium discharge through groove, the side wall of the substrate between the pressure variable through groove and the medium discharge through groove is expanded toward the pressure variable through groove, thereby the medium discharge through groove. The medium is introduced into the medium discharge through groove from the medium introduction hole, and the pressure of the pressure variable through groove is increased from the pressure of the adjacent medium discharge through groove through the pressure transmission hole of the pressure variable through groove. about Therefore, by expanding the substrate side wall between the pressure variable through groove and the medium discharge through groove toward the medium discharge through groove, the medium is discharged from the medium discharge hole of the medium discharge through groove. It is characterized by discharging out of the through groove.

(60) In the medium discharge device using the substrate having a plurality of through grooves penetrating from the first surface to the second surface according to the present invention, at least one of the adjacent through grooves passes through at least one through groove. The substrate sidewall between the medium ejection through groove and the through groove adjacent to the medium ejection through groove (substrate sidewall variable penetration groove) is the substrate sidewall variable penetration groove side and / or the medium ejection penetration. A first conductor film formed on the substrate side wall on the groove side; a piezoelectric film on the first conductor film; and a second conductor film on the piezoelectric film. A medium is introduced into the medium ejection through groove by deforming the piezoelectric film by deforming the piezoelectric film by applying a voltage between the film and the second conductor film; or Media ejection through groove A medium discharge device, characterized in that the medium discharged from the medium discharge connection slot.

(61) The present invention provides a medium ejection device using a piezoelectric substrate having a plurality of through grooves penetrating from the first surface to the second surface, and ejects at least one through groove among the plurality of adjacent through grooves. A piezoelectric substrate on the side of the medium discharge through groove on the piezoelectric substrate side wall between the medium discharge through groove and the through groove adjacent to the medium discharge through groove (substrate side wall variable through groove) A first conductor film formed on the side wall; and a second conductor film formed on the piezoelectric substrate side wall on the substrate side wall variable through groove side, wherein the first conductor film and the second conductor are provided. By deforming the piezoelectric substrate side wall by applying a voltage between the films, the medium is introduced into the medium discharge through groove, or the medium in the medium discharge through groove is used as the medium discharge medium. Spout from through groove A medium discharge device which is characterized in that.

(62) In the pump device for moving a medium using a substrate having a plurality of through grooves penetrating from the first surface to the second surface, the present invention provides at least one through groove among the plurality of adjacent through grooves. The discharge through groove, the at least one through groove is a through groove (pressure variable through groove) whose pressure can be changed, and the pressure in the pressure variable through groove is changed to thereby discharge the pressure variable through groove and the medium. A medium is introduced into the medium discharge through groove using the expansion or contraction of the substrate side wall between the medium discharge through groove, or the medium in the medium discharge through groove is transferred to the medium discharge through groove. The plurality of medium discharge through grooves are attached to the first thin plate attached to the first surface of the substrate and / or to the second surface of the substrate covering the medium medium discharge through grooves. Formed on a thin plate Pump devices are connected by the medium flow path, characterized in that the medium moves into one medium discharge connection slot from said medium flow passage through the other medium discharge connection slot.

(63) The present invention provides a pump device for moving a medium using a substrate having a plurality of through grooves penetrating from the first surface to the second surface, wherein at least one of the adjacent through grooves is a medium. A discharge through groove is used, and at least one through groove is a through groove (internal volume variable through groove) whose internal volume can be changed, and the medium discharge at the medium discharge through groove side and / or the internal volume variable through groove side is performed. A first conductor film on a substrate side wall between the through-groove for use and the inner volume variable through-groove, a piezoelectric film on the first conductor film, and a second conductor on the piezoelectric film A medium having a film, wherein the piezoelectric film is deformed by applying a voltage to the first conductive film and the second conductive film, and the side wall of the substrate is expanded or contracted. Before introducing the medium into the discharge through groove or before The medium in the medium discharge through groove is discharged from the medium discharge through groove, and the plurality of medium discharge through grooves are attached to the first surface of the substrate covering the medium medium discharge through groove. The medium is connected by a medium flow passage formed in the thin plate and / or the second thin plate attached to the second surface of the substrate, and the medium passes through the medium flow passage from one medium discharge through groove to the other medium discharge through. It is a pump device characterized by moving to a groove.

(64) The present invention is a heat exchanger including a first recess and a second recess formed in a substrate and having an inlet and an outlet, wherein the opening of the first recess and the second recess is covered with a thin plate. The heat medium enters from the entrance of the first recess and exits from the exit, the heat exchange medium enters from the entrance of the second recess and exits from the exit, the first recess is adjacent to the second recess, and the first recess And a heat exchanger in which the heat of the heat medium in the first recess moves to the heat exchange medium in the second recess through the substrate side wall between the second recess and the first recess and / or The second recess is a through groove, and the upper and lower surfaces of the through groove are covered with a thin plate, or the substrate is a heat good conductor, and the heat good conductor is carbon, aluminum nitride, gold, silver, copper, Characteristic of aluminum or silicon To.

(65) The present invention provides an acceleration sensor including a first substrate having a first recess and a second substrate having a first protrusion having an outer size smaller than the inner size of the first recess. With the structure in which the first substrate and the second substrate are attached in a state where one convex portion is inserted into the first concave portion, and the inner surface of the first concave portion and the outer surface of the first convex portion are spaced apart from each other. An acceleration sensor that detects an acceleration using a change in capacitance between the first convex portion and the first concave portion, wherein the first concave portion has a rectangular shape; The first convex portion has a rectangular shape, the inner surface of the first concave portion faces the outer surface of the first convex portion, or the inner surface of the first concave portion is a polygonal column side surface, The outer surface of one convex portion is a polygonal column side surface, and the inner surface of the first concave portion is the front The outer surface of the first convex portion is opposed to the outer surface, or the outer surface of the first convex portion has a curved surface, and the inner surface of the first concave portion is a curved surface of the outer surface of the first convex portion. Further, the outer surface of the first protrusion and the inner surface of the first recess are cylindrical side surfaces or elliptic cylinder side surfaces.

(66) In addition to (65), in the present invention, a conductor film is formed on at least one outer surface of the four outer surfaces of the first convex portion, and the conductive material on the outer surface of the first convex portion is formed. The body film serves as one electrode of electrostatic capacity, and / or a conductor film is formed on the inner surface of the first recess facing the conductor film on the outer surface of the first protrusion, The conductor film on the inner surface of the first recess is one electrode of electrostatic capacity, or an insulating film is further formed on the conductor film on the outer surface of the first protrusion, and / or An insulating film is formed on the conductor film on the outer surface of the first recess, or a conductor film (first conductor film) is formed on all surfaces of the outer surface of the first protrusion. The first conductor films are all connected and / or the conductor film (second (Electrical film) is formed and all the second conductor films are connected, or a weight larger than the mass of the material of the first convex part is attached to the bottom surface of the first convex part. It is characterized by.

(67) The present invention provides a sound having a first recess having an opening in the first surface and a second recess adjacent to the first recess in a substrate having a first surface (front surface) and a second surface (back surface). It is a transducer, and a substrate side wall sandwiched between the first concave portion and the second concave portion is used as a diaphragm, and the substrate side wall vibrates by a vibration wave introduced into the first concave portion, and is formed on the substrate side wall. A change in potential generated in the piezoelectric element is detected or a voltage is applied to the piezoelectric element formed on the substrate side wall to vibrate the substrate side wall to generate a vibration wave from the first recess. Further, the substrate is a piezoelectric body, and is formed on the first conductor film formed on the substrate sidewall on the first recess side and on the substrate sidewall on the second recess side. A potential difference is detected between the second conductor films, or a first conductor film formed on the substrate side wall on the first recess side and a second conductor film formed on the substrate side wall on the second recess side The substrate sidewall is vibrated by applying a voltage between the first conductor film and the first conductor film formed on the substrate sidewall on the first recess side, or formed on the first conductor film. The substrate includes a first piezoelectric film and a second conductor film formed on the first piezoelectric film, and the substrate side wall vibrates by a vibration wave introduced into the first recess. A potential difference is detected between the first conductor film and the second conductor film by the charge generated in the first piezoelectric film formed on the side wall, or the first conductor film and the second conductor are detected. The substrate side by applying a voltage between the body membranes And a vibration wave is generated from the first recess. Further, a third conductor film formed on the substrate side wall on the second recess side, or formed on the third conductor film. The substrate includes a second piezoelectric film and a fourth conductor film formed on the second piezoelectric film, and the substrate side wall vibrates due to the vibration wave introduced into the first recess. A potential difference is detected between the third conductor film and the fourth conductor film by the charge generated in the second piezoelectric film formed on the side wall, or the third conductor film and the fourth conductor are detected. By applying a voltage between the body films, the side wall of the substrate is vibrated to generate a vibration wave from the first recess.

Since the sensor is formed in the thickness direction of the substrate, the size of the pressure sensor in the plane of the semiconductor substrate can be extremely reduced. Moreover, since it can be formed using LSI technology such as lithography, a very precise sensor can be created. Various other effects are described in the following items.

It is a perspective view for demonstrating the structure of the pressure sensor (capacitance type | mold element) in one Embodiment of this invention. FIG. 2 is a plan view of the pressure sensor shown in the perspective view of FIG. 1. It is a figure explaining the structure of a pressure sensor, and its manufacturing method. It is a figure which shows the structure and manufacturing method of a pressure sensor which formed the penetration groove | channel or the recessed part. It is a figure which shows the structure of the semiconductor pressure sensor which is embodiment of this invention. It is a perspective view of the section in the width direction of the pressure sensor (capacitance type element) in one embodiment of the present invention. It is a figure explaining the method of manufacturing the pressure sensor (capacitance type element) in one Embodiment of this invention shown in FIG. It is the figure which showed typically the projection when the capacitive element (pressure sensor) created by the embodiment shown in FIG. 6 or FIG. 7 and the figure when mounting a capacitive element (pressure sensor) package on a mounting substrate. It is a figure explaining the method to join a 3rd board | substrate to a semiconductor substrate. It is a figure explaining another method of manufacturing the pressure sensor (capacitance type element) in one Embodiment of this invention shown in FIG. It is a variation of embodiment of this invention shown in FIG. It is a variation of embodiment of this invention shown in FIG. It is a variation of embodiment of this invention shown in FIG. It is a figure which shows sectional drawing (in another embodiment) of the vertical type pressure sensor of this invention. It is a figure which shows the manufacturing method of the piezoelectric element (pressure sensor) using the piezoelectric material board | substrate of this invention. FIG. 15 is a diagram showing a method of manufacturing the piezoelectric device of the present invention using the imprint method. FIG. 15 is a diagram showing a method of manufacturing the piezoelectric device of the present invention using the imprint method. It is a figure which shows embodiment which formed the side wall only by the 1st recessed part formed in the 1st surface (surface) side in a board | substrate. It is a figure which shows the manufacturing method of the pressure sensor using the piezoelectric element of this invention shown in FIG. It is a figure which shows the case where the recessed part has penetrated from the 1st surface (front surface) to the 2nd surface (back surface). It is a figure which shows the manufacturing method of the pressure sensor using the imprint method. It is a figure which shows the manufacturing method of the pressure sensor which formed such a recessed part in semiconductor substrates, such as a silicon | silicone, and used the imprint method. It is a figure which shows the structure and manufacturing method of the pressure sensor of this invention which has arrange | positioned the piezoresistor on the side surface of the board | substrate side wall between adjacent recessed parts, and utilized the piezoresistive effect. It is a figure which shows another embodiment which shows the structure and manufacturing method in the case of forming a piezoresistor in a semiconductor substrate. It is a figure which shows one Embodiment which forms a resistor in the side surface of a side wall. It is a figure explaining the method of forming a photosensitive film | membrane in the side surface of a side wall. It is a figure which shows the structure and manufacturing method of an electrostatic capacitance type pressure sensor using the recessed part formed in the board | substrate. It is a figure which shows the example of the package of a pressure sensor. It is a figure which shows the inkjet (pump) device using the vertical type pressure action element of this invention. It is a figure which shows the operation | movement method of the inkjet device (pump) of this invention. It is a figure which shows the ink (liquid) jet device using the piezoelectric element of this invention. It is a figure which shows the Example of a pump device. It is a figure which shows the structure and manufacturing method of the acceleration sensor of this invention. It is a figure which shows the preparation methods of the convex part electrode using the imprint method. It is a figure which shows the structure of a piezoelectric microphone using a recessed part, and a manufacturing method. It is a figure which shows the heat exchanger to which this invention is applied. It is a figure which shows the method of forming the recessed part pattern of this invention using the imprint method. It is a figure which shows the conventional embodiment. FIG. 37 is a view showing a microreactor showing a cross section in the thickness direction of the substrate. FIG. 38 is a view of the cross section of the through hole 2103 (2103-2) in FIG. 37 as viewed from the right. FIG. 39 is a diagram showing an open / close valve installed in the liquid introduction hole and the liquid discharge hole. FIG. 40 is a diagram showing another structure of the on-off valve. FIG. 41 is a diagram illustrating a method for manufacturing a pressure sensor (capacitance element) according to an embodiment of the present invention. FIG. 41 is a diagram illustrating a method for manufacturing a pressure sensor (capacitance element) according to an embodiment of the present invention. FIG. 42 is a diagram illustrating a method for manufacturing a pressure sensor (capacitance element) according to one embodiment of the present invention. FIG. 42 is a diagram illustrating a method for manufacturing a pressure sensor (capacitance element) according to one embodiment of the present invention. FIG. 43 is a diagram for explaining a method of forming an impurity diffusion layer using rotary ion implantation. FIG. 44 is a diagram showing a pressure sensor further provided with a pressure transmission path. FIG. 45 is a diagram showing a first embodiment (first structure) of a microphone according to the present invention. FIG. 46 is a plan view of the microphone of the present invention. FIG. 47 is a diagram showing a structure in which through holes 112-4 and 112-5 constituting a capacity space are provided on the side surface of the through hole 112-2. FIG. 48 is a diagram showing a microphone whose planar shape (cross section parallel to the substrate surface) is circular (cylindrical when viewed three-dimensionally). FIG. 49 is a diagram showing a case where a microphone having a rectangular shape (square or rectangular shape) has two electrodes constituting a capacitor. FIG. 50 is a plan view showing the acceleration sensor of the present invention. FIG. 51 is a schematic diagram showing a deformed state of the substrate side wall due to acceleration. FIG. 52 is a cross-sectional view of the acceleration sensor of the present invention. FIG. 53 is a diagram showing an acceleration sensor having a structure in which capacitor through holes 213, 214, 215, and 216 around a central through hole 211 are connected. FIG. 54 is a view showing an acceleration sensor of the present invention having a through-hole and a substrate side wall whose cross section (a surface parallel to the substrate surface) is circular (three-dimensionally cylindrical). FIG. 55 is a view showing an acceleration sensor of the present invention having a through hole and a substrate side wall having an octagonal cross section. FIG. 56 is a diagram showing a manufacturing process of the microphone device or the acceleration sensor device of the present invention. FIG. 57 is a diagram showing another method of forming the electrode of the capacitor. FIG. 58 is a diagram showing a structure and a manufacturing method when a diffusion layer is used for a capacitor electrode in the sensor of the present invention having an annular structure. FIG. 59 is a diagram showing the structure of the charge storage type sensor of the present invention. FIG. 60 is a diagram showing a method of manufacturing the sensor according to the present invention by an imprint process. FIG. 61 is a diagram showing another embodiment of the acceleration sensor of the present invention. FIG. 62 is a diagram showing another embodiment of an acceleration sensor using a conductor substrate. FIG. 63 is a diagram showing another embodiment of the acceleration sensor of the present invention. FIG. 64 shows a manufacturing method of a process for manufacturing a force sensor of the present invention using a conductor substrate. FIG. 65 is a diagram showing a method for forming a sensor of the present invention using an insulator substrate or a semiconductor substrate. FIG. 66 is a diagram showing a method for manufacturing a sensor of the present invention using a semiconductor substrate such as silicon. FIG. 67 is a diagram showing another embodiment in which a diffusion layer is formed on the inner surface of the through hole and the upper surface of the substrate. FIG. 68 is a diagram showing a conventional microphone using a semiconductor substrate. FIG. 69 is a diagram showing another method for manufacturing the sensor of the present invention. FIG. 70 is a diagram showing another embodiment showing the manufacturing method of the present invention using a conductor substrate as a seed substrate. FIG. 71 is a diagram showing a case where a recess is formed in FIG. FIG. 72 is a diagram showing a case where a similar structure to FIG. 71 is applied to the acceleration sensor. FIG. 73 is a diagram showing a method for manufacturing a sensor using an epi-wafer. FIG. 74 is a diagram showing another embodiment of a method for manufacturing a sensor using an epi-wafer. FIG. 75 is a diagram showing an embodiment of a method for producing a sensor of the present invention. FIG. 76 is a diagram showing another method for manufacturing a sensor using an epi-wafer. FIG. 77 is a diagram showing an embodiment of a sensor using a substrate on which an epi-wafer is bonded and a manufacturing method thereof. FIG. 78 is a diagram showing a sensor using a composite substrate in which a conductor substrate and a semiconductor substrate are bonded, and a manufacturing method thereof. FIG. 79 is a diagram showing a sensor created using the imprint method and a method for manufacturing the sensor. FIG. 80 is a diagram showing another embodiment in which a sensor is manufactured using an imprint mold. FIG. 81 is a diagram showing another embodiment showing a method for producing a sensor of the present invention using an imprint method. FIG. 82 is a diagram showing a sensor in which a recess is formed in an insulating polymer by an imprint molding method, and the mold substrate is used as an insulator substrate on the recess as it is, and a manufacturing method thereof. FIG. 83 is a diagram showing a structure of a pressure sensor of the present invention using an imprint method and a manufacturing method thereof. FIG. 84 is a diagram showing the structure of the electric double layer capacitor. FIG. 85 is a diagram showing the structure of another electric double layer capacitor. FIG. 86 is a diagram showing the structure of still another electric double layer capacitor. FIG. 87 is an example showing a plan view of the structure of the electric double layer capacitor. FIG. 88 is a diagram showing a generator using electric charges generated by vibration of a substrate side wall formed between a through hole or a recess formed in a piezoelectric substrate. FIG. 89 is a diagram showing a micro power generator manufactured by forming recesses in a piezoelectric polymer or the like filled in the recesses formed in the substrate and using the side walls of the piezoelectric polymer substrate between the recesses.

The first embodiment of the pressure sensor of the present invention is applied to one surface (first surface) of a disk-shaped substrate such as a semiconductor wafer or a rectangular (for example, square or rectangular) thin-plate substrate. A groove (first surface groove) that does not penetrate to the other surface (second surface) is formed, and a groove that does not cross the first surface groove and does not penetrate to the second surface (second surface groove) ) And using a partition wall (side wall) that separates the first surface groove and the second surface groove.

FIG. 1 is a perspective view for easily explaining the structure of the pressure sensor of the present invention. The substrate used in the first embodiment of the present invention is basically a conductor substrate. The basic meaning is that a part of the substrate is an insulator or a semiconductor as will be described later, but the majority is a conductor. In addition, the term “conductor” does not necessarily mean a metal or an alloy, but a substance that has a low electrical resistance and easily flows. For example, a low-resistance semiconductor containing a high concentration impurity element such as N + silicon or P + silicon is also included in the conductor in the present invention.

As shown in FIG. 1, grooves (first surface grooves) O (O1, O2, O3) are formed on the first surface side (upper surface side) in the thickness direction of the substrate toward the second surface side (lower surface side). However, it has not reached the second side. That is, the first surface groove does not penetrate the second surface. On the other hand, the groove Q (Q1, Q2, Q3, Q4) is also formed on the second surface, but does not reach the first surface. That is, the second surface groove does not penetrate the first surface. The structure shown in FIG. 1 is shown in the perspective view from the cross section of the structure of the pressure sensor of this invention. The actual first surface groove has a partition also on the cross-sectional side (x-axis direction (+ side and − side) shown in the drawing. In other words, the first surface groove is opened only on the first surface side. On the other hand, the actual second surface groove is formed so as to surround the first surface groove (this detail will be more clearly understood in later figures).

One side wall of the first surface groove O1 (a partition wall between the first surface groove O1 and the second surface groove Q1) is the side wall 1003-1, and the other side wall (the first surface groove O1 and the second surface). A partition wall with the groove Q2) is defined as a side wall 1003-3, and a bottom wall of the first surface groove O1 is defined as 1003-2. One side wall of the first surface groove O2 (a partition wall between the first surface groove O2 and the second surface groove Q2) is the side wall 1004-1, and the other side wall (the first surface groove O2 and the second surface). The partition wall with the groove Q3) is a side wall 1004-3), and the bottom wall of the first surface groove O2 is 1004-2. One side wall of the first surface groove O3 (a partition wall between the first surface groove O3 and the second surface groove Q3) is the side wall 1005-1, and the other side wall (the first surface groove O3 and the second surface). The partition wall with the groove Q4) is a side wall 1005-3), and the bottom wall of the first surface groove O1 is 1005-2. The first surface grooves O (O1 to O3) are surrounded by the grooves on the second surface side, so there are actually two other side walls (+ side and-side in the X direction). However, it is omitted here. (In FIG. 1, as described above, the inside of the groove is cut in a cross-section so that the inside of the groove can be clearly seen and opened in a perspective view, so these two side walls are not drawn, but their existence is easily understood. )

The upper wall on the first surface 1001 side separated by the first surface groove O is defined as a first surface upper wall 1006 (1006-1 to 1006-1). Since the substrate 1000 shown in FIG. 1 is a conductor, the structure shown in FIG. 1 (referred to as a groove pattern) is electrically connected even if the first surface groove O and the second surface groove Q are formed. The capacity cannot be formed as it is. Therefore, the present invention includes an electrically inactive region that reaches the second surface groove from the first surface side on the first surface upper wall. That is, in FIG. 1, a region I1 formed on the first surface upper wall 1006-2 and a region I2 formed on the first surface upper wall 1006-3 are electrically inactive regions. Although these electrically inactive regions I1 and I2 are shown separated in FIG. 1, they are actually connected to each other because they surround the first surface groove O2, and are the same region. The electrically inactive region described here is a region where electricity does not flow. That is, the first surface upper wall 1006-2 is a conductor, but the two regions 1006-2-1 and 1006-2-2 separated by the electrically inactive region I1 are not electrically conductive. Therefore, when a voltage is applied to 1006-2-1 and 1006-2-2, electricity does not flow up to a certain withstand voltage. Similarly, the first surface upper wall 1006-3 is a conductor, but the two regions 1006-3-1 and 1006-3-2 separated by the electrically inactive region I2 are electrically conductive. Therefore, when a voltage is applied to 1006-3-1 and 1006-3-2, electricity does not flow up to a certain withstand voltage.

Wiring and electrodes are provided on the upper wall of each first surface. Here, it is schematically shown as N1 to N6. That is, N1 for 1006-1, N2 for 1006-2-1, N3 for 1006-2-2, N4 for 1006-3-1, N5 for 1006-3-2, and N5 and 1006-4 N6 wiring and electrodes are provided. N1 and N2, N3 and N4, and N5 and N6 are electrically connected, but N2 and N3 are not electrically connected by the electrically inactive region I1. Therefore, when no pressure is applied, the side wall 1003-3 and the side wall 1004-1 are (substantially) parallel to each other, so that the second surface groove Q2 is a space (insulating) region, and the side wall 1003-3 and the side wall 1004-1. A capacitor (capacitor) is formed. If the groove width of the second surface groove Q2 (the separation distance between the side wall 1003-3 and the side wall 1004-1) is d1, and the facing area of the side wall 1003-3 and the side wall 1004-1 is S1, the space between these side wall electrodes is reduced. The resulting capacitance is ε * S1 / d1. Similarly, N4 and N5 are not electrically conducted by the electrically inactive region I2. Accordingly, since the side wall 1004-3 and the side wall 1005-1 are (substantially) parallel, the second surface groove Q3 is used as a space (insulating) region, and the side wall 1004-3 and the side wall 1005-1 have a capacitance (capacitor). Forming. If the groove width of the second surface groove Q3 (separation distance between the side wall 1004-3 and the side wall 1005-1) is d2, and the facing area of the side wall 1004-3 and the side wall 1005-1 is S2, the space between these side wall electrodes The resulting capacitance is ε * S2 / d2. Thus, by providing an electrically inactive area | region, an electrostatic capacitance can be measured using the groove | channel formed in the thickness direction of the conductor board | substrate. (Ε is a dielectric constant, and since the capacitance of the present invention is a space capacitance, ε is close to the dielectric constant of a gas such as air or the vacuum dielectric constant. Since there is no vacuum, it is close to a vacuum even if the pressure is reduced. (No vacuum. If the relative dielectric constant of the material is ε1 and the vacuum dielectric constant is ε0, the dielectric constant εs of the material is εs = ε1 * ε0.)

Although FIG. 1 is described with both sides of the first surface groove open, as described above, this part is a cross-sectional view so that the state of the first surface groove is easy to see. Both sides are closed and a groove is opened only on the upper side (first surface side). Further, as described above, the second surface groove is formed so as to surround the first surface groove. As a result, the first surface groove is supported only by the upper substrate, that is, the upper wall, and the four side surfaces (side walls) of the groove and the bottom surface (bottom wall) of the groove are not in contact with each other, that is, in a floating state. It has become. The space on the first surface side (upper side) and the space on the second surface side (lower side) are completely separated by a substrate 1000 formed in a groove shape. Therefore, even if the pressure (Pu) in the upper space and the pressure (Pb) in the lower space are different, the pressure is transmitted and is not leveled. Therefore, in the case of Pu> Pb, the upper wall, the side wall, and the bottom wall forming the groove swell from the first surface side to the second surface side due to the pressure difference. On the other hand, when Pu <Pb, the upper wall, the side wall, and the bottom wall forming the groove bulge from the second surface side to the first surface side due to the pressure difference. In particular, the side walls (electrodes) 1003-3, 1004-1, 1004-3, 1005-1 and the like constituting the capacitor are formed thinner than the upper wall 1006 and the bottom wall, and thus are easily bent. That is, the side wall constituting the capacitor is like a diaphragm that is deformed by a pressure difference. If the deformation amount of d1 due to the pressure difference Pu−Pb between Pu and Pb is Δd1, the capacity change ΔC1 is ΔC1 = ε * S {1 / (d1−Δd1) −1 / d1}. As for d2, if the deformation amount of d2 due to the pressure difference Pu−Pb between Pu and Pb is Δd2, the capacity change ΔC2 is ΔC2 = ε * S {1 / (d2−Δd2) −1 / d2}. . This amount of deformation also varies depending on the physical quantity (for example, Young's modulus) of the side wall (conductor substrate) that is the material to be deformed and the thickness of the side wall. If a material having a small Young's modulus is used as a conductor or the thickness of the side wall is reduced, the amount of bending increases, so that the capacitance change ΔC can be increased even with the same pressure difference. (Of course, the strength is required so that the diaphragm does not break due to repeated pressure differences.) The side wall (electrode) is pressed by the side wall frame (upper wall, both side surfaces, bottom wall). The amount of deformation around the center of the wall is small or hardly, and the amount of deformation near the center of the side wall away from it is large, resulting in a curved shape. Therefore, it is necessary to consider the above d1, d2, Δd1, Δd2, etc. as average values. (Note that there is a capacitance generated in the electrically inactive region as a capacitance generated between the electrodes and wirings N2 and N3, but this capacitance is almost constant even if a pressure difference occurs. (You don't have to think about the volume change due to pressure difference.)

As described above, various metal materials and alloys can be used as the conductor substrate. Low resistance semiconductor substrates such as N + silicon substrates and P + silicon substrates can also be used. Conductive polymers and conductive rubbers can also be used, and since the Young's modulus of these materials is small, the side wall electrodes fluctuate due to a slight pressure difference, so that minute pressure fluctuations can be detected. Conductive carbon, conductive carbon nanotubes, and conductive graphene can also be used. Furthermore, stainless steel (for example, SUS6300) can also be used. Metallic glass (Ni-based metallic glass: Ni ₅₃ Nb ₂₀ Ti ₁₀ Zr ₈ Co ₆ Cu ₃ (Young's modulus 100 Gpa, tensile strength 1700 Mpa)) and Zr-based metallic glass: Zr ₅₅ A material with lower Young's modulus and higher strength than stainless steel, such as Al ₁₀ Cu ₃₀ Ni ₅ (Young's modulus 140Gpa, tensile strength 2700Mpa), can also be used.

A conductive substrate having a low Young's modulus and a high strength material (hereinafter referred to as a low Y substrate) and a bonded substrate formed by bonding silicon (also referred to as a composite substrate, including an epi wafer) may be used. . On the silicon substrate side, a high-concentration region conductor layer formed in advance in the low-concentration region may be bonded. Furthermore, a substrate in which the first surface grooves and / or the second surface grooves are previously formed on the low Y substrate may be attached to the silicon substrate. In addition, a silicon substrate in which the first surface grooves are formed in advance may be attached to the low Y substrate. The composite substrate is not limited to the above combination, and various conductor substrates may be combined. If a sidewall electrode is made of a low Y substrate and functions as a diaphragm, it can be deformed even with a low pressure difference, and sensitivity can be improved. Moreover, it is easy to produce the electrically inactive region I on the silicon substrate side. For example, a silicon oxide film or the like can be formed as an electrically inactive region.

An etching method (etching apparatus, etching method, etching gas, etc.) that can perform anisotropic etching at high speed when forming the second surface groove from the low Y substrate side for a composite substrate in which a low Y substrate and a silicon substrate are bonded. It is necessary to etch the low Y substrate to the silicon substrate side depending on the etching conditions. The low Y substrate side is quite thick (for example, the thickness of the silicon substrate is about 10 to 100 μm, and the low Y substrate is 200 μm or more). Therefore, the thickness of the silicon substrate must be determined in consideration of the etching amount. However, although the etching rate of the low Y substrate is fast, the amount of overetching on the silicon substrate side can be suppressed by performing an etching method in which the etching of the silicon substrate is slow or hardly etched. In the case of a composite substrate, since it is a different material, there is an advantage that it is easy to select an etching method having such a high selectivity. As the low Y substrate, a conductive substrate such as a metal or an alloy or a material having a smaller Y can be used. For example, if a conductive rubber member or a conductive polymer is used, the thickness of the side wall electrode can be increased, so that the stability of the process is improved. As a substrate to be attached to the low Y substrate, a conductor substrate other than a silicon substrate may be used. However, a substrate on which an electrically inactive layer can be easily formed is preferable.

FIG. 2 is a plan view of the pressure sensor shown in the perspective view of FIG. FIG. 2A is a view (plan view) as seen from the first surface side. 2 (b) is a side view of the cut surface at A1-A2 shown in FIG. 2 (a), and FIG. 2 (c) is a side view of the cut surface at B1-B2 shown in FIG. 2 (a). FIG. 2 shows only a part constituting the capacity, but FIG. 2 can be easily extended to a part included in FIG. 1 and a part not included in FIG. The solid line 1011 (1011-1, 1011-2) indicates the inner frame of the groove O (O1, O2). The groove O is formed downward from the first surface (upper surface), and does not reach the second surface (lower surface) and does not penetrate completely, as shown in FIGS. 2 (b) and (c). It is literally a groove. That is, the groove O1 is opened on the first surface (upper surface) side and is surrounded by the other surfaces (side walls 1003-1, 1003-3, 1003-4, 1003-5, and the bottom wall 1003-2). The groove O2 is also opened on the first surface (upper surface) side and is surrounded by other surfaces (side walls 1004-1, 1004-3, 1004-4, 1004-5, and the bottom wall 1004-2).

A rectangular broken line shown in FIG. 2 (a) indicates a boundary with the groove portion on the second surface side, and this outer side is a second surface groove Q (Q1, Q2, Q3). That is, the second surface groove Q is opened on the second surface side (lower side) and formed toward the first surface side (upper surface side), but does not reach the first surface (upper surface) and is completely formed. It is a literal groove that does not penetrate. As can be seen from FIG. 2, the second surface groove Q surrounds the first surface groove O, but the first surface groove O is isolated from the second surface groove Q by the side wall and the bottom wall. That is, the first surface groove O1 is formed by the side walls 1003-1, 1003-3, 1003-4, 1003-5 and the bottom wall 1003-2, and the first surface groove O2 is formed by the side walls 1004-1, 1004-3, 1004. -4, 1004-5 and the bottom wall 1004-2. As a result, it is possible to apply a pressure different from the pressure (P1) on the first surface side (upper side) and the pressure (P2) on the second surface side (lower side).

As shown in FIG. 2A, the trench O (O1, O2) is surrounded by the electrically inactive layer I (I1, I2, I3, I4, I5). The electrically inactive layer I (I1, I2, I3, I4, I5) not only surrounds the groove O (O1, O2) in a plane but also can be seen from FIGS. 2 (b) and 2 (c). Thus, it is formed in the depth direction of the substrate and reaches the second surface groove Q from the first surface (upper surface). That is, the trench O (O1, O2) is completely isolated by the electrically inactive layer I (I1, I2, I3, I4, I5). The substrate 1000 is a conductor, but the substrate 1000 is completely isolated from 1000-2 and 1000-3 by the electrically inactive layer I (I1, I2, I3, I4, I5). For example, the substrates 1000-1 and 1000-4 surround the substrates 1000-2 and 1000-3, and the substrates 1000-1 and 1000-4 are electrically connected to the substrates 1000-2 and 1000-3. Absent. Until the withstand voltage of the electrically inactive layer I, electricity does not flow between the substrates 1000-1 and 1000-4 and the substrates 1000-2 and 1000-3. Further, since both the substrates 1000-2 and 1000-3 are isolated by the electrically inactive layer I, the substrates 1000-2 and 1000-3 are not electrically connected. No electricity flows between 2 and 1000-3.

As shown in FIG. 2B, the side wall 1003-3 of the first surface groove O1 and the side wall 1004-1 of the first surface groove O2 face each other through the second surface groove Q2. The distance between the side wall 1003-3 and the side wall 1004-1 is d. The pressure P1 on the first surface side is transmitted to the inside of the first surface grooves O1 and O2, and the pressure P2 on the second surface side is transmitted to the inside of the second surface groove Q2. When P1 and P2 are equal, the side walls 1003-3 and 1004-1 of the first surface grooves O1 and O2 are not deformed, and the distance between these side walls at that time is defined as d0. When P1 is larger than P2, the first surface groove O (O1, O2) swells, and the side walls 1003-1, 1003-3, 1004-1, 1004-3 are on the second surface side space Q (Q1, Q2, Q3). Swell toward). That is, d <d0. When P1 is smaller than P2, the first surface grooves O (O1, O2) are recessed, and the side walls 1003-1, 1003-3, 1004-1, 1004-3 are in the space O (O1, O2) on the first surface side. Bulges towards. That is, d> d0. When P1 = P2, since the side wall 1003-3 and the side wall 1004-1 are substantially parallel, d is substantially constant over the entire area of the side wall 1003-3 and the side wall 1004-1.

However, the upper wall 1006 (1006-1, 1006-2, 1006-3) of the first surface is thicker than the side walls 1003-1, 1003-3, 1004-1, 1004-3 (for example, the substrate is made of silicon). In some cases, although depending on the working pressure, the thickness of the upper wall is about 20 μm or more and the thickness of the side wall is about 20 μm or less. Further, since the first surface groove O1 is surrounded by four side walls (1003-1, 1003-3, 1003-4, 1003-5), the direction of the distance that affects the capacitance change (A1- in FIG. 2). In the corners of the side walls (for example, 1003-1 and 1003-4, 1003-1 and 1003-5, 1003-3 and 1003-4, 1003-3 and 1003-5) in the direction A2). The deformation of -3 is small. Further, since the thickness of the bottom wall 1003-2 of the first surface groove O <b> 1 is also thicker than the thickness of the side wall 1003-3 constituting the capacity, the deformation of the bottom wall 1003-2 is smaller than the deformation of the side wall 1003-3. Naturally, the deformation of the side wall 1003-3 is small at the corners of the side wall 1003-3 and the bottom wall 1003-2. Further, the deformation of the side wall 1003-3 at the corner between the upper wall 1006-2 and the side wall 1003-3 is small. That is, when the pressure difference P1-P2 between P1 and P2 occurs, the most deformed portion is in the vicinity of the center portion of the side wall 1003-3, and the amount of deformation decreases as the distance from the portion increases. The same applies to the side wall 1004-1 facing the 1003-3.

Since the capacity change can be increased when the pressure is easily changed by the pressure difference P1-P2 between P1 and P2, the pressure detection sensitivity increases when the side walls 1003-3 and 1004-1 constituting the capacity are smaller. (However, it is necessary to have a thickness that does not cause destruction due to a pressure difference or repeated fatigue failure.) On the other hand, side walls that do not constitute a capacity in the walls (1003-4 and 1003-5 in the first surface groove O1, In the first surface groove O2, the thickness of 1004-4 and 1004-5) should be made larger than the side walls 1003-3 and 1004-1 constituting the capacity. This is because, when the first surface groove O and the second surface groove are formed, the side wall that does not constitute the capacity can increase the process margin and can be more difficult to break than the side wall that constitutes the capacity. Furthermore, if these are difficult to deform, the side walls 1003-3 and 1004-1 that effectively constitute the capacity are easily deformed. The bottom wall and the top wall are also preferably thicker for the above-mentioned reasons, but there is also a reason that it is better to make the etching margin as large as possible when forming by etching. Of course, if it can be formed accurately, it does not need to be so thick.

FIGS. 2D and 2E show the cross-sectional states of A1-A2 when P1> P2 and P1> P2. FIG. 2B is a view similar to FIG. 2 (this is almost the same as the view of P1 = P2). As described above, when P1> P2 (FIG. 2D), the side walls 1003-1, 1003-3, 1004-1, and 1004-3 are on the second surface groove Q (Q1, Q2, Q3). Side walls 1003-1, 1003-3, 1004-1, supported by upper walls 1006 (1006-1, 1006-2, 1006-3) and bottom walls 1003-2, 1004-2, which are not deformed so much. The bulge of the center part of 1004-3 becomes larger than another part. Even in the direction perpendicular to the paper surface, the side walls 1003-3 and 1004-1 are supported by the side walls 1003-4 and 1003-5, and 1004-4 and 1004-5, so the side walls 1003-3 and 1004-1 are also supported. The bulge of the center part of this becomes convex shape larger than other parts. When P1 <P2 (FIG. 2 (e)), the side walls 1003-1, 1003-3, 1004-1, and 1004-3 swell toward the first surface groove O (O1, O2) and do not deform so much. Supported by the wall 1006 (1006-1, 1006-2, 1006-3) and the bottom walls 1003-2, 1004-2, the central portion of the side walls 1003-1, 1003-3, 1004-1, 1004-2. The bulge becomes larger than other parts. Even in the direction perpendicular to the paper surface, the side walls 1003-3 and 1004-1 are supported by the side walls 1003-4 and 1003-5, and 1004-4 and 1004-5, so the side walls 1003-3 and 1004-1 are also supported. The bulge (to the 1st surface groove | channel O side) of the center part becomes a convex shape (to the 1st surface groove | channel O side) larger than another part.

Therefore, when there is a pressure difference between P1 and P2, it is necessary to consider the average distance for the distance d between the side walls 1003-3 and 1004-1 constituting the capacity. That is, the capacity when there is a pressure difference between P1 and P2 is the capacity of a minute portion having a different distance d, and the entire capacity is an integral value thereof. As shown in FIG. 2D, if the average distance when P1> P2 is d1, d1 <d0 and the capacity increases. The first surface grooves O1 and O2 have substantially the same characteristic values (because they are the same material, the Young's modulus E and the Poisson's ratio σ are equal, and the thickness and size of the side wall, bottom wall, top wall, etc. are the same). For example, the first surface grooves O1 and O2 swell by the same amount with the same pressure difference P1-P2. That is, if the side walls 1003-2 and 1004-1 are expanded by Δd1 (this Δd1 is also an average value), d1 = d0−2Δd1. Since the present invention reduces the distance d between the side walls from both sides in this way, there is a double effect. (It is also possible to simplify the structure on only one side. Although O1 is formed, it is sufficient that O2 is only an electrode and the first surface groove O2 is not formed.) As can be readily seen from FIG. Even if the pressure difference is increased, Δd1 cannot be increased to d0 / 2 or more. Therefore, the breaking strength of the side walls 1003-3 and 1004-1 should be larger than the strength due to the pressure difference when Δd1 = d0 / 2. For example, the side walls 1003-3 and 1004-1 are not destroyed. Side walls (1003-1, 1003-4, 1003-5, 1004-3, 1004-4, 1004-5), bottom walls (1003-2, 1004-2), upper walls, etc. that do not constitute a capacity If it is made thicker than the side walls 1003-3 and 1004-1 that constitute it, the breaking strength also increases, so that they can also be prevented from breaking due to an increase in the pressure difference P1-P2. Of course, if a mechanism for preventing the pressure from being applied to the sensor when a pressure difference is generated by setting an upper limit value of the capacity, destruction of the sensor can be surely prevented. Furthermore, this capacity can also be detected using the pressure sensor of the present invention.

Further, as shown in FIG. 2E, when the average distance when P1 <P2 is d2, d2> d0 and the capacity is reduced. The first surface grooves O1 and O2 have substantially the same characteristic values (because they are the same material, the Young's modulus E and the Poisson's ratio σ are equal, and the thickness and size of the side wall, bottom wall, top wall, etc. are the same). For example, the first surface grooves O1 and O2 shrink by the same amount with the same pressure difference P1-P2. That is, if the side walls 1003-3 and 1004-1 shrink by Δd2 (this Δd2 is also an average value), d2 = d0 + 2Δd2. Since the present invention increases the distance d between the side walls from both sides in this way, it has a double effect. (It is also possible to simplify the structure on only one side. Although O1 is formed, it is not necessary to form the first surface groove O2 by using only O2 as the electrode.) As can be readily seen from FIG. Even if the pressure difference is increased, Δd2 cannot be greater than {width of the first surface groove O (O1, O2)} / 2 or more. Therefore, the breaking strength of the side walls 1003-3 and 1004-1 is set to Δd2 = {first surface If the strength by the pressure difference when the width of the groove O (O1, O2)} / 2 is increased, the side wall 1003-3 or 1004-1 will not be broken. Side walls (1003-1, 1003-4, 1003-5, 1004-3, 1004-4, 1004-5), bottom walls (1003-2, 1004-2), upper walls, etc. that do not constitute a capacity If it is made thicker than the side walls 1003-3 and 1004-1 that constitute it, the breaking strength also increases, so that they can also be prevented from breaking due to an increase in the pressure difference P1-P2. Of course, if a mechanism for preventing the pressure from being applied to the sensor when a lower limit value of the capacity is set and a pressure difference is generated more than this is provided, the sensor can be reliably prevented from being destroyed.

FIG.2 (c) is a side view of the cut surface in B1-B2 in Fig.2 (a). The direction of B1-B2 is the vertical direction of the first surface groove O2 (O1 on the back side is omitted). (The direction of A1-A2 is the lateral direction.) The wall 1004 (1004-2, 1004-4, 1004-5) of the first surface groove O2 is a conductor, and the upper wall 1000 (1000 -3), but is not electrically connected to the outer upper wall 1000 (1000-1) by the electrically inactive regions I4 and I5. The length (vertical length) of the first surface groove O (O2) is a, the width (lateral length) is b, the depth (distance from the bottom surface of the top wall to the bottom surface of the groove) is h, and the bottom wall Is the thickness of q3, the thickness of the side wall 1004-4 is q1, and the thickness of 1004-5 is q2. ) Is S = (a + q1 + q2) * (h + q3).
A capacity C constituted by the side walls 1003-3 and 1004-1 is represented by C = ε * S / d. When P2 = P1, the side walls 1003-3 and 1004-1 can be considered to be substantially parallel, so C = ε * S / d0. When P1> P2, C = ε * S / d1, and when P1 <P2, C = ε * S / d2. When measuring the capacitance, as shown in FIG. 2B, electrodes / wirings F1 and F2 connected to the opposing side wall electrodes 1003-3 and 1004-1 are formed. The capacitance generated in F1 and F2 is not only the capacitance generated between the side wall electrodes 1003-3 and 1004-1 but also the capacitance generated in the electrically inactive region I1. (It can be considered that these capacitances are in parallel. That is, the total capacitance is the sum of the individual capacitances.) However, the capacitance generated in this electrically inactive region I1 is constant. Therefore, it is the capacitance generated between the side wall electrodes 1003-3 and 1004-1 that contributes to the capacitance change.

FIG. 1 and FIG. 2 show one embodiment of the capacity used in the pressure sensor of the present invention. Thus, the present invention is a capacitive pressure sensor using grooves formed from the first surface (upper surface) side and the second surface (lower surface) side in the thickness direction of the conductor substrate. A metal, an alloy, or the like can be used as the conductor substrate. In this case, the electrically inactive region can be formed by forming an insulator on a part of the first surface side. Further, as the conductor substrate, a semiconductor substrate such as silicon having low resistance in which an impurity element is dissolved in a high concentration can be used. In this case, the electrically inactive region can be formed by forming an insulator on a part of the first surface side. For example, it can be formed by oxidizing or nitriding a portion to be an electrically inactive region to form an oxide (insulator), nitride (insulator), or oxynitride (insulator). Alternatively, oxygen or nitrogen can be ion-implanted to form an oxide (insulator), nitride (insulator), or oxynitride (insulator). Alternatively, it can be formed by forming a trench groove in a portion to be an electrically inactive region to fill the insulator, or forming an insulator by oxidation or nitridation. Further, a conductive polymer or conductive rubber can be used as the conductive substrate. In this case, the electrically inactive region can be formed by forming an insulator on a part of the first surface side. Since the conductive polymer or conductive rubber contracts or expands by a slight pressure difference, minute pressure fluctuations can be detected.

Further, a substrate obtained by epitaxially growing a semiconductor having a low-concentration impurity, which is an element of a reverse conductor to the high-concentration impurity element, on a low-resistance semiconductor substrate having a high-concentration impurity (for example, a low concentration containing an N-type impurity element at a high concentration An epitaxial layer containing a low-concentration P-type impurity element on a silicon semiconductor substrate (N + substrate) having resistance, or an element having a high-concentration impurity element and a reverse conductor on a low-resistance semiconductor substrate having high-concentration impurities. A composite substrate in which a semiconductor substrate having a low concentration of impurities is bonded can be used. In these cases, a high concentration region having the same conductor element as the high concentration impurity region is formed on the side wall of the first surface groove and a part of the first surface groove connected to the first surface groove, and the two electrodes forming the capacitance are formed. The high concentration regions formed on the first surfaces to be connected are formed apart from each other. In this way, the low concentration impurity region becomes an electrically inactive region between these electrodes. Further, a bonded substrate can be used as the conductor substrate. A substrate on which the electrically inactive region is easily formed on the first surface side, a substrate on which a deep groove portion is easily formed below, a substrate on which a thin sidewall is easily formed, a substrate with a low Young's modulus, and a fracture strength A substrate having a high repetitive fatigue strength can be used.

A method of manufacturing the pressure sensor of the present invention when using a low-resistance silicon semiconductor substrate containing a high concentration impurity as the conductor substrate will be described with reference to FIG. In FIG. 41, the case of having an active region and one first surface groove will be described for simplicity, but a pressure sensor can be created by using this as it is. As shown in FIG. 41A, a silicon semiconductor substrate (N + substrate) 1101 containing an N-type impurity element at a high concentration and having a low resistance is used as the silicon semiconductor substrate. (As described above, a P + silicon substrate can also be used.) An insulating film is formed on both surfaces of the N + substrate 1101. (The insulating film on the first surface side is 1102 and the insulating film on the second surface side is 1103.) This insulating film is a silicon oxide film obtained by oxidizing the N + substrate 1101, a silicon nitride film obtained by nitriding the N + substrate 1101, N + A silicon oxynitride film obtained by oxynitriding the substrate 1101, a silicon oxide film, a silicon nitride film, a silicon oxynitride film, or the like grown by a CVD (chemical vapor deposition) method or a PVD (physical vapor deposition) method. A photoresist 1104 is formed on the insulating film 1102 on the first surface side, and a window for forming an electrically inactive region is opened (this window is referred to as 1105). The opening of the window is performed using a photolithographic method by exposing a photosensitive film such as a photoresist.

Next, as shown in FIG. 41B, the insulating film 1102 existing under the window 1105 is removed. The insulating film 1102 is removed by immersing the insulating film 1102 in an etchable liquid or spraying the liquid. (WET method) For example, if the insulating film 1102 is a silicon oxide film, a solution containing hydrofluoric acid (HF) can be used. Alternatively, the insulating film 1102 can be etched by a dry etching method using a gas that can be etched. For example, if the insulating film 1102 is a silicon oxide film, a CF-based gas (such as CF4), a CCl-based gas (such as CCl4), a CHF-based gas (such as CHF3), a CHCl-based gas (such as CHCl3), or a CBr-based gas (CBr4). Etc.), CHBr gases (CH2Br2, etc.), CI gases (CI4, etc.), CHI gases (CH2I2, etc.), chlorine gases (Cl2, etc.) and other gases and mixed gases of these gases And can be etched. After the insulating film 1102 is etched, the underlying N + silicon substrate 1101 is etched to form a depression (depression) 1106. Etching of the N + silicon substrate 1101 can be performed by dry etching using a gas capable of etching the silicon substrate. For example, CF gas (CF4, etc.), SF gas (SF6), CCl gas (CCl4, etc.), CHF gas (CH3F, etc.), CHCl gas (CHCl3, etc.), CBr gas (CBr4, etc.), CHBr Gases such as CH2 gas (CH2Br2, etc.), CI gas (CI4, etc.), CHI gas (CH2I2, etc.), chlorine gas (Cl2, etc.), and other gases and mixed gases of these gases are made into plasma and etched. be able to. Alternatively, the N + silicon substrate 1101 can be etched by a WET method such as an alkaline etching solution or a hot phosphoric acid solution. Note that the insulating films 1102 and 1103 are not necessarily formed if not necessary. If the electrically inactive region can be selectively formed without using a photoresist or the like, the photoresist may not be used.

Next, as shown in FIG. 41C, ion implantation is performed, and ions such as oxygen are implanted at a high concentration from the window 1105 to form a region 1108 containing oxygen ions and the like at a high concentration. The purpose of this process is to form a deep part on the first surface side of the N + silicon substrate. As described with reference to FIGS. 1 to 3, the electrically inactive region I must be a region where two opposing electrodes constituting the capacitor portion can be electrically separated completely. Since the conductor substrate used here is made of one conductor material called an N + silicon substrate, it is necessary to completely form an insulator in the thickness direction of the upper wall portion using the electrically inactive region I as an insulator. On the other hand, when forming the second surface groove, it is necessary that the second surface groove does not reach the first surface groove. The depth of the first surface groove (“h + thickness of upper wall” in FIG. 2) is desired to be 100 μm (though it may be thinner, the capacity decreases and the deformation d due to pressure decreases, so the pressure Therefore, the second surface groove also needs to be etched by about 100 μm. In addition, since it is better that the upper wall is not deformed by pressure, the thickness of the upper wall is preferably at least about 3 μm thicker than the thickness of the side wall constituting the capacity. If the thickness of the side wall is about 3 to 5 μm, the thickness of the upper wall needs to be about 6 μm or more. That is, it is necessary to form the electrically inactive region I to a region deeper than 6 μm. In consideration of the etching variation of the second surface groove, the electrically inactive region I is preferably formed to a depth of about 10 μm. Forming an insulator up to about 10 μm only by oxidation or nitridation requires a considerable time of oxidation treatment or nitridation treatment, which not only increases the process cost, but also increases the number of defects in the N + silicon substrate. There is a problem with the heat treatment. Therefore, as shown in FIGS. 41B and 41C, a recess 1106 is formed and oxygen ions and nitrogen ions of high concentration are implanted to a deeper region. In order to implant oxygen or nitrogen into a deep region, high voltage ion implantation is performed. Further, since it is necessary to implant oxygen ions or nitrogen ions at a high concentration, high current ion implantation is performed.

Next, as shown in FIG. 41D, the photoresist 1104 is removed, and oxidation treatment, nitridation treatment, or heat treatment is performed to form a thick insulator 1110. The insulator 1110 is silicon oxide, silicon nitride, or silicon oxynitride. When the recesses 1106 and 1105 remain even if the insulator 1110 is formed by oxidation treatment or the like, when the recesses 1106 and 1105 are filled, an insulating film such as SOG (silicon on glass) is applied and then heat-treated. It may be solidified and planarized, and / or an insulating film may be stacked and planarized by a CVD method or a PVD method. This state is shown in FIG. 41 (e), where 1111 is an insulating film. The recess 1106 is further deepened (a so-called trench is formed), and silicon oxide, silicon nitride, silicon oxynitride, or the like is laminated in the trench by a heat treatment method, a CVD method, a PVD method, or the like, or an SOG method. The electrically inactive layer may be formed by flattening.

Next, as shown in FIG. 41 (f), a photosensitive film 1113 such as a photoresist is formed on the first surface, and the photosensitive film 1113 in the region where the first surface groove O is formed is opened. A window portion 1114 is formed, and the insulating films 1111 and 1102 existing under the window portion 1114 are removed by etching. For this etching removal, the aforementioned WET method or dry method can be used. In this manner, the region 1115 where the N + silicon substrate is exposed can be selectively obtained.

Next, as shown in FIG. 41 (g), a first surface groove O is formed using a window portion 1114 (including 1115). The depth of the first surface groove (g = h + upper wall thickness) is about 100 μm or more. The width k of the first surface groove is not so related to the capacity portion and may be relatively large. For example, since k = 100 μm may be used, if g = 300 μm, a groove with an aspect ratio of 3 (g / k) may be formed. A groove with very little side etching can be formed by a dry etching technique such as the Bosch method. When dry etching is performed, not only the exposed N + silicon substrate but also the photosensitive film 1113 such as a photoresist is etched, so that the photosensitive film 1113 and (the photosensitive film 1113 are removed with respect to N + silicon etching. In consideration of the exposure of the insulating films 1111 and 1102), it is necessary to select an etching condition in which the etching selectivity of the insulating films 1111 and 1102 is good. If the first surface groove with less side etching can be formed when k is smaller, such a good k may be selected. However, it is necessary to smoothly transmit the pressure to the inside of the first surface groove O. Therefore, 10 μm is good. If k is too large, the size of the capacitive element increases. Therefore, the size of k should be determined in consideration of the size of the pressure sensor. Since it is necessary that the first surface groove does not reach the second surface, m> g naturally when the thickness of the N + silicon substrate is m. Further, as described above, the bottom wall of the first surface groove does not constitute a capacity, but it is preferable that the fluctuation due to the pressure difference in the bottom wall portion is smaller than the side wall part constituting the capacity. It is better to make it thicker than. In addition, if the etching of the first surface groove cannot be detected by a stopper, it is necessary to perform the time management, so a certain degree of over-etching is required. Considering the above problems and the etching variation in the thickness direction of the first surface groove, the thickness of the bottom wall is preferably about 5% to 10% of the depth g of the first surface groove. Of course, if the etching accuracy is improved, it can be made less than about 5%, and if the etching accuracy is bad, it can be made more than about 10%. Furthermore, if there is no problem with the design value, it can be increased to about 10% or more. For example, if the depth of the first surface groove is 300 μm, the thickness of the bottom wall may be about 15-30 μm, and the thickness of the first N + substrate may be about 315 μm-330 μm. However, when it is desired to float the capacitance portion as will be described later, the thickness of the first N + substrate is preferably thicker than about 315 μm to 330 μm.

Next, as shown in FIG. 41 (h), the photosensitive film 1113 is removed, and cleaning and processing (WET and dry) for removing etching damage and contamination of the first surface groove are performed. The insulating film 1117 is formed by heat-treating the inner wall of the surface groove (treatment such as oxidation, nitridation, or oxynitridation), or using CVD or PVD. This insulating film 1117 protects the inner wall of the first surface groove. The insulating film 1117 may be omitted if not necessary. Alternatively, a conductive film such as a polycrystalline silicon (PolySi) film, a metal or a silicide film may be used instead of the insulating film. If such a conductor film is formed, the resistance of the inner wall of the first surface groove can be further reduced. Alternatively, high concentration impurities may be doped or diffused. Or you may use said process together.

Next, as shown in FIG. 41 (h), patterning is performed for forming a second surface groove on the second surface (lower surface). For example, a photosensitive film 1120 such as a photoresist is formed and patterned to open a region where the second surface groove is to be formed. (Window portion 1121) After that, the insulating film 1103 under the window portion 1121 (the upper portion in the drawing, which is appropriately described in this manner) is removed by etching. Note that the insulating film 1103 does not need to be formed if unnecessary, or may be removed from the second surface before forming the photosensitive film 1120. However, if the patterning property is better when the photosensitive film 1120 is formed on the insulating film 1103 than when the photosensitive film 1120 is directly formed on the N + silicon substrate, the insulating film 1103 is preferably formed. (Alternatively, it may be left.) Alternatively, when the N + silicon substrate is etched to form the second surface groove, there is a possibility that the photosensitive film 1120 existing in a place where the N + silicon substrate is not desired to be etched is lost. In some cases, the insulating film 1103 may be left and used as a stopper. The insulating film 1103 can be etched as appropriate, whether dry or wet.

Next, the N + silicon substrate exposed in the window 1121 is etched (etching of the insulating film and silicon is indicated by an arrow in FIG. 41 (h)), and the second surface as shown in FIG. 41 (i). Groove Q is formed. This etching is also performed by deep RIE, and the side etching is very small, and etching in the depth direction is also performed by dry etching with good system. The second surface groove needs to reach the above-described electrically inactive region I, that is, the thick insulator 1110. However, do not reach the first side. Since it is desirable that the upper wall 1006 has a smaller degree of deformation due to pressure than the side wall constituting the capacitor, and it is necessary to consider etching variation, the upper wall 1006 is thicker by about 3 to 5 μm or more than the thickness of the side wall. Is good. For example, if the thickness of the side wall constituting the capacitor is about 3 to 5 μm, the thickness of the upper wall 1006 is about 6 to 10 μm or more. If the thickness of the side wall constituting the capacitor is about 5 to 10 μm, the thickness of the upper wall 1006 is about 8 to 15 μm or more. If the thickness of the side wall constituting the capacitor is about 10 to 20 μm, the thickness of the upper wall 1006 is about 13 to 25 μm or more. If the thickness of the side wall constituting the capacitor is about 20-30 μm, the thickness of the upper wall 1006 is about 23-35 μm or more. If the depth of the second surface groove is n and the thickness of the upper wall 1006 is p, then n = m−p.

What is most important in the formation of the second surface groove is the thickness y of the side wall (1003-3 in FIG. 41 (i)) and the distance d between the electrodes. If the thickness y is thin, the sensitivity due to the pressure difference is improved. For example, the maximum deflection (the center of the rectangle) of a silicon diaphragm having a thickness (y * a) with a thickness y restricted only at the periphery is approximately given by the following equation.
Wmax = α * z * h ⁴ / (Ey ³ )
(Z is the pressure difference (= P1-P2), E is the Young's modulus of the diaphragm material, and α is a constant that varies depending on the aspect ratio of the silicon diaphragm)
When h = a = 300 μm (square diaphragm), α = 0.0138,
Wmax is about 600 z / y ³ (μm). However, z is shown in Mpa units, and y is shown in μm units. For example, if z is 1 MPa (about 1 atm) and y is 5 μm, then Wmax = about 5 μm. If z is 1 Mpa (about 1 atm) and y is 3 μm, then Wmax = about 22 μm.
When h = a = 400 μm (square diaphragm), Wmax is about 1890 z / y ³ (μm). For example, if z is 1 Mpa (about 1 atm) and y is 5 μm, Wmax = about 15 μm. If z is 1 MPa (about 1 atm) and y is 3 μm, then Wmax = about 70 μm.
When h = 300 μm and a = 600 μm (rectangular diaphragm), α = 0.0277, and Wmax is about 1200 z / y ³ (μm). However, z is shown in Mpa units, and y is shown in μm units. For example, if z is 1 Mpa (about 1 atm) and y is 5 μm, Wmax = about 10 μm. If z is 1 MPa (about 1 atm) and y is 3 μm, then Wmax = about 45 μm.
Since the above formula is a theoretical formula, it can be designed by taking this formula into consideration, taking the data with the completed formula, and bringing the actual value close to the theoretical formula, a precise sensor can be produced.

From the above, for example, the thickness of the N + silicon substrate is 400 μm, the depth of the first surface groove is 300 μm, the length of the first surface groove is 600 μm, the side wall thickness is 3 μm, and the width of the second surface groove (the pressure difference is When the distance between the capacitance electrodes at 0 is 100 μm, a significant capacitance change occurs even with a pressure difference of about 1 MPa, so that the pressure can be detected with high accuracy. The side wall thickness can be 3 μm, and the accuracy of the first and second surface grooves can be adjusted to about 0.5 μm or less without problems with the current technology, and more accurate alignment is possible in the future. It will be. Further, since the width of the second surface groove is 100 μm, the depth of the second surface groove is about 390 μm and the aspect ratio is 3.9 at most, a vertical groove with less side etching can be formed without any problem. Further, even with the current technology, even if the aspect ratio is 20, etching can be performed without any problem, so that the width of the second surface groove can be further reduced. In that case, it is possible to accurately detect a pressure smaller than 1 Mpa. On the contrary, when the pressure is higher than 1 MPa, the sidewall thickness can be made thicker than 3 μm, so that the capacity can be formed with a considerable margin in the process. In the future, a second aspect groove with a higher aspect ratio could be formed. As described above, it is a feature of the present invention that a capacity having an optimum size can be formed by the use pressure.

The most important thing in the formation of the second surface groove is the thickness y of the side wall (1003-3 in FIG. 41 (i)) and the distance d between the electrodes. As described above, the sensitivity due to the difference is improved. As can be seen from FIG. 41 (h), a photosensitive film 1120 having a size larger than the first surface groove is formed on the second surface (lower surface) so as not to etch the portion of the first surface groove. That is, the outside of the photosensitive film 1120 is made larger than the inner surface of the side wall of the first surface groove. If this distance is r, it is necessary that r> 0. If this condition is not satisfied, the first surface groove and the second surface groove overlap when the second surface groove is formed. The side wall of the first surface groove is formed as faithfully as possible to the window 1114 of the photosensitive film 1113. That is, the side etching amount is made as small as possible, and the side wall of the first surface groove is made vertical or as close to vertical as possible. (Alternatively, if the amount of side etching can be accurately controlled, it can be considered on the premise of side etching. However, even if side etching occurs to some extent, a shape that is vertical or nearly vertical is desirable.) By doing this The thickness of the side wall constituting the capacity can be made constant or close to constant. When the difference between the size of the window 1114 of the photosensitive film 1113 and the size of the first surface groove O is Δs, it is desirable that Δs be as small as possible over the entire first surface groove. (Alternatively, it is desirable that Δs is constant and the variation is small. In this case, an optimum groove can be formed by designing the pattern in consideration of Δs.)

Next, in FIG. 41 (i), the pattern of the second surface groove Q is accurately aligned with the first surface groove O. If a double-sided mask (or reticle) aligner or stepper is used, alignment can be performed with very high accuracy.
Further, in the case of the pressure sensor of the present invention, the pattern formed on the first surface (including not only the pattern for alignment but also this pattern) is read from the first surface side, and the information is read on the second surface. In addition to the conventional method of performing pattern matching by using it when forming, a method for further improving the alignment accuracy can be used. That is, it is possible to adopt a method of directly aligning with the first surface groove pattern when performing mask alignment (or reticle alignment) on the second surface with the pattern on the first surface. As one of the methods, since the first surface groove is a considerably deep groove, the thickness of the bottom wall of the first surface groove is considerably thin. Therefore, although the light cannot be transmitted by a thick silicon substrate, the pattern information of the first surface groove can be directly transmitted to the second surface by using light or electromagnetic waves having a wavelength that can be transmitted by the thin silicon substrate. If the photosensitive pattern of the second surface groove is combined using light or electromagnetic wave information, alignment with very high accuracy becomes possible. That is, pattern matching can be performed with the same accuracy as matching on only one side. Moreover, since it can be matched with the actual pattern (first surface groove), the alignment accuracy of the photosensitive patterns of the first surface groove and the second surface groove is further improved. In particular, since alignment can be performed using a stepper, alignment accuracy is greatly improved.

Furthermore, the alignment accuracy can be further improved by using another method. In this method, either before the first surface groove is formed or after the first surface groove is formed, only a part of the second surface is thinned by etching and penetrated through the first surface groove or the first surface groove is formed. In this method, the bottom wall is made very thin. By this method, the groove pattern of the first surface can be read from the second surface through the penetrating portion (or the very thinned portion), and can be directly aligned with the first surface groove pattern. In this case, the first surface groove pattern used for alignment cannot be used as an actual pattern, but alignment by a stepper is also possible by providing it in various places, so alignment is very accurate. Is possible.

Still other methods can be used. In this method, a glass substrate is bonded to the second surface side. In this case, a glass substrate is bonded to the second surface (lower surface) side of the N + silicon substrate. Since it is a glass substrate, anodic bonding is possible and strong bonding can be performed. The N + silicon substrate is completely penetrated in the thickness direction when the first surface groove is formed. Since the N + silicon substrate and the glass substrate are made of different materials, the glass substrate serves as an etching stopper, so that the thickness of the first surface groove in the depth direction can be controlled with very high accuracy. Since the pattern of the first surface groove can be accurately read from the second surface side, the photosensitive pattern of the second surface groove can be directly aligned with the first surface groove. As a result, the first surface groove and the second surface groove can be formed with very high accuracy. In this case, when the second surface groove is formed, it is necessary to first etch the glass substrate vertically to form the photosensitive film pattern as faithfully as possible. Also in this case, since the materials are different, the silicon substrate can be used as a stopper, and the margin of over-etching is large, so that the silicon substrate can be completely exposed at necessary places over the entire area of the wafer. After that, the second surface groove can be formed vertically and accurately with a different etching type (the same etching type may be used depending on the conditions), so the gap between the first surface groove and the second surface groove The thickness of the side wall to be formed can be formed with very high accuracy. In this case, the bottom wall of the first surface groove is a glass substrate. Although the glass substrate is an insulator, since electricity can be transmitted through N + silicon on the side wall, there is no particular problem in the capacity characteristics. Further, as a merit of using the glass substrate, the entire glass substrate can be etched and thinned after forming the first surface groove. As this thinning method, wet etching can be used, dry etching can be used, and further, BG method (back surface polishing method) and CMP method (chemical mechanical polishing method) can also be used. In the case of wet etching, accurate etching can be performed using an HF-based etchant. Also in the case of dry etching, the glass substrate can be etched with high accuracy using the above-described etching gas such as CF. Thus, if the glass substrate is made thin before the formation of the photosensitive pattern of the second surface groove, the thickness of the glass substrate to be etched when forming the second surface groove is reduced. Accordingly, since less over-etching is required, accurate etching can be performed, and the second surface groove can be formed with high accuracy.

After forming the second surface groove Q (Q1, Q2, Q3), the photosensitive film 1120 is removed, and then the etching damage and contaminants of the silicon substrate exposed in the second surface groove are removed. As this method, there is a method of lightly etching silicon exposed on the second surface side by a WET method or a dry method. Further, as shown in FIG. 41 (j), the exposed silicon on the second surface side is lightly oxidized (or nitrided) to form an insulating film 1122 such as an oxide film (or nitride film or oxynitride film). May be. Alternatively, an insulating film 1122 such as an oxide film, a nitride film, or an oxynitride film may be stacked by a CVD method or a PVD method. Thereafter, the thin plate 1126 may be attached to the second surface side via the adhesive layer 1125 to fix the second surface groove Q. As this bonding method, the substrate (wafer) 1101 is lifted from the first surface side, and the adhesive layer 1125 is attached to the bottom wall 1124 on the second surface side and the substrate surface (not shown) not etched on the second surface side. Is applied, dipped or pasted to adhere the substrate 1101 to the thin plate 1126. Alternatively, the substrate 1101 can be bonded by attaching the adhesive layer 1125 to the thin plate side. In this case, the adhesive layer 1125 may be patterned on a desired portion of the thin plate 1126 and then bonded. However, if no problem occurs due to outgassing or the like caused by drying or heat treatment after the bonding, the entire surface of the thin plate 1126 is formed. It is easier in terms of the process to form an adhesive layer on the substrate. Alternatively, the thin plate 1126 is pressed against the substrate 1101 without using the adhesive layer 1125, and the thin plate 1101 is directly bonded to the substrate 1101 by pressure and / or heat. If the insulating film 1103 or the like formed on the second surface of the substrate 1101 is unnecessary, it may be removed and bonded or adhered in advance. The thin plate 1126 may be provided with a pressure transmission hole 1127 for transmitting pressure to the second surface groove. The pressure transmission hole 1127 may be formed before the thin plate 1126 is joined, or may be formed after the thin plate 1126 is attached. Needless to say, when the thin plate 1126 is formed before bonding, it is necessary to align the holes 1127 so that they come to the second surface grooves Q.

In order to form the hole 1127 after the thin plate 1126 is attached, it is natural that the hole 1127 is formed at a location where the second surface groove is present. As a method for forming the holes 1127, there are a method using laser, a method using etching or laser irradiation through a mask, and the like. There is also a method in which a photosensitive film is formed, a window is opened by exposure, and a hole 1127 is formed in the thin plate 1126 through the window by dry etching or WET etching. When the pressure transmission hole 1127 is not formed, the second surface groove Q is completely closed, so that the pressure P3 at the time of closing is maintained as the pressure of the second surface groove, and the second surface groove Q is maintained on the basis of this pressure P3. The pressure P1 on the one surface side is detected. If the thin plate 1126 is completely attached to the second surface side of the substrate 1101 in a very low pressure state (substantially close to a vacuum state), P3 becomes almost 0, and the absolute pressure of P1 can be detected. If the thin plate 1126 is completely attached to the second surface side of the substrate 1101 at 1 atm (about 1 Mpa), P3 is almost 1 atm, so that P1 can be detected as a pressure with respect to 1 atm.

The thin plate 1126 can be used as an insulator substrate, a conductor substrate, or a semiconductor substrate. By attaching the thin plate 1126, it is necessary to prevent the capacitance characteristics from being affected by being electrically connected to the first surface groove Q or the support substrate 1101. When a conductor (eg, a metal plate) or a semiconductor plate (eg, a silicon plate) is used as the thin plate 1126, an insulating film 1103 or an insulating adhesive layer 1125 is interposed between the N + silicon substrate 1101 and the thin plate 1126. It is good to make it. When an insulator (ceramic plate, plastic plate, glass plate, or the like) is used as the thin plate 1126, it is not electrically connected to the N + silicon substrate 1101, and can be directly bonded to the N + silicon substrate.

Further, if a glass plate that is transparent to visible light is used as the thin plate 1126, the second surface groove and the capacitive element can be seen through the glass plate, so that the alignment and the quality of the capacitive element can be observed. Easy. Further, when the glass plate is directly attached to the silicon substrate 1101, it can be strongly bonded by an anodic bonding method. Alternatively, when the glass plate is bonded to the silicon oxide film 1103, it is easy to adhere because it is the same material.

In FIG. 41 (j), the bottom wall 1124 of the first surface groove O is attached to the thin plate 1126. Since this is the same level as the non-etched surface of the second surface (not shown, but the second surface of the semiconductor substrate 1101), it naturally comes into contact with the thin plate 1126 in the process. Here, by securely attaching the bottom wall 1124 of the first surface groove O to the thin plate 1126 via the adhesive layer 1125, the bottom wall can be prevented from fluctuating due to pressure, and only the fluctuation of the side wall constituting the capacity can be prevented. Can be designed with consideration. However, it is also possible to float the first surface groove O. As the method, the bottom wall 1124 in the first surface groove O may be thinned as shown in FIG. Before forming the second surface groove, the bottom wall portion of the first surface groove may be opened on the second surface side and etched to make the bottom wall thinner. At this time, if the window including the region for forming the second surface groove is opened, the region for forming the second surface groove is also etched, so that the etching amount when forming the second surface groove is small. Can be reduced. It should be noted that this region can be made thinner before forming the first surface groove.

By doing so, as shown in FIG. 41 (l), it is possible to create a floating first surface groove O. In this figure, support substrate portions 1101-1 and 1101-2 of the N + silicon substrate 1101 are also shown. That is, the thin plate 1126 is attached to the support substrate portions 1101-1 and 1101-2 via the adhesive layer 1125, but the bottom wall 1124 of the first surface groove O is not in contact with the thin plate 1126. That is, the first surface groove O is in a floating state, and the vibration of the thin plate 1126 is not directly transmitted to the first surface groove constituting the capacity. Further, since the entire second surface groove can be made the same space, the number of pressure transmission holes 1127 can be reduced.

Further, as shown in FIG. 41 (j), a thin plate 1130 is attached to the first surface side of the substrate 1101. The thin plate 1130 may be attached to the insulating film 1111 through the adhesive layer 1129, or the thin plate 1130 may be attached to the insulating film 1111 only by pressure and / or heat treatment. The method is the same as the method of attaching the thin plate 1126 to the second surface side. That is, after the adhesive layer 1129 is formed on the portion where the thin plate 1130 and the insulating film 1111 are to be attached, the thin plate 1130 is attached to the substrate 1101 side. After the adhesive layer 1129 is formed over the insulating film 1111, the thin plate 1130 can be attached, or the adhesive layer 1129 can be formed on the thin plate 1130 and the thin plate 1130 can be attached to the substrate 1101 side. It is possible to form the adhesive layer 1129 on the entire surface of the thin plate 1130 and attach the thin plate 1130 to the substrate 1101 side as it is, but in particular, the adhesive layer 1129 at the opening portion of the first surface groove faces the inside of the first surface groove O. Therefore, in this case, it is necessary to confirm whether or not a problem occurs because the inside of the first surface groove O is altered by the outgas in the subsequent processing or thermal process. However, even if outgas is generated and exists in the first surface groove O, the outgas can be discharged to the outside through the pressure transmission hole 1131, and therefore the outgas itself can be completely removed. (For example, if the outside is made a vacuum state, the outgas inside the groove can be extracted.) When the thin plate 1130 is bonded to the first surface side of the N + silicon substrate 1101 through the adhesive layer 1129, an appropriate heat treatment or the like is performed. Thus, the thin plate 1130 can be firmly bonded to the first surface side of the N + silicon substrate 1101.

In order to reduce outgas as much as possible, the adhesive layer 1129 is formed only in a necessary portion. For example, a photosensitive type resin is used for the adhesive layer and the adhesive layer is left only on the necessary part, or a photosensitive film is formed on the adhesive layer and the photosensitive film is removed except for the necessary part. Further, it is only necessary to remove the adhesive layer at the opening and then remove the photosensitive film, leaving the adhesive layer only at the necessary portion. When the adhesive layer 1129 is formed on the insulating film 1111 on the first surface side of the N + silicon substrate 1101, when the adhesive layer agent is spin coated with a liquid adhesive, the adhesive enters the inside of the first surface groove O. The adhesive may then not be removed. Therefore, a method of bonding a sheet type adhesive layer on the insulating film 1111 on the first surface side of the N + silicon substrate 1101 can be used. The sheet-type adhesive layer can be prevented from entering the inside of the first surface groove. Alternatively, the adhesive layer in the first surface groove portion can be removed before entering. In the case of a photosensitive adhesive layer agent, the negative type is easy to handle. That is, the adhesive inside the first surface groove can be completely removed during development without applying light to the inside of the first surface groove O in order to take the adhesive that has entered the first surface groove O. .

The pressure transmission hole 1131 is formed in a part of the thin plate corresponding to the opened portion of the first surface groove O. The hole 1131 may be opened in the thin plate 1130 in advance, or may be opened after the thin plate 1130 is attached. The pressure P1 on the first surface side can be transmitted to the first surface groove through the pressure transmission hole 1131. The pressure transmission hole 1131 needs to be sized so that the external pressure P1 is smoothly transmitted to the first surface groove. As the size, a diameter of 10 to 50 μm is sufficient, but the size of the first surface groove is the length of the first surface groove as can be seen from FIG. 2 and the description of the maximum deflection amount Wmax of the diaphragm. The greater the direction a, the better the sensitivity. (However, if it becomes too large, the sensor size becomes large.) That is, if it is 300 μm or more, a considerably good sensitivity can be obtained. Further, as can be seen from FIG. 3 (b), the width k of the first surface groove O should be set so that the side wall cannot be immediately applied when P1 <P2 (if the side wall comes into contact with a small pressure difference, it is more than that. The pressure difference between the pressure sensor element and the size of the pressure sensor element is required to be large to some extent. 100 μm can be secured. (Note that the side wall irrelevant to the capacitance measurement may be thick.) Therefore, in that case, there is no problem in forming the pressure transmission hole 1131 of the size described above. However, if the size is too large, foreign matter may enter from the outside. Therefore, it is preferable to select the size of the pressure transmission hole 1131 in consideration of them comprehensively. There is also an idea that a hole having the same size as the first surface groove O may be used to easily remove the intrusion of foreign matter. The usage environment of the pressure sensor may also be considered.

Next, as shown in FIG. 41 (j), a contact hole 1132 (1132) for establishing electrical continuity with the upper wall 1006-2 (1006-2-1 and 1006-2-2) on the first surface side. -1, 1132-2) and the conductor 1133 (1133-1, 1133-2) is formed in this portion. The size of the contact hole 1132 (in this direction) is determined by the length of the width d of the second surface groove. As described above, when the pressure difference is small or when the thickness of the side wall of the diaphragm is thick, the displacement of the diaphragm is small. Even at that time, it is effective to reduce d in order to increase the capacitance change. However, if the remainder d is reduced, the aspect ratio when the second surface groove Q is formed increases, and deep etching becomes difficult. In the future, it is highly likely that excellent deep etching will be realized, but at present, it is considered that an aspect ratio of about 30 is good, so if the etching amount h of the second surface groove is about 300 μm, d will be about 10 μm. . Even if the width e of the electrically inactive region is quite small, a sufficient withstand voltage of about 5 V can be obtained. However, considering the process limit, the size of the contact hole 1132 is about 1 to 3 μm. On the other hand, the total thickness of the insulating films 1102 and 1111 is sufficient if it is 1000 A in terms of pressure resistance, but about 0.5 μm is necessary in consideration of process stability. Further, the thickness of the adhesive layer 1129 and the thin plate 1130 is preferably about 5 μm from the viewpoint of protecting the capacitive sensor and the stability in the process. Then, the depth of the entire contact hole is about 5.5 μm. It is possible to form the contact hole 1132 having a size of 1 μm and an aspect ratio of 5.5. For example, when the insulators 1102 and 1111 are silicon oxide films and the thin plate 1130 is also a glass plate (or quartz plate), a photosensitive film is formed on the thin plate 1130 to open a contact hole portion, and further The thin plate 1130 and the insulating films 1111 and 1102 may be sequentially etched from the window by a dry etching method (as described above, various gases such as CF-based gas are appropriately selected and an etching apparatus is selected). Alternatively, it is possible to open a window with a laser using a mask (or maskless) without using a photosensitive film. If the contact hole size is further increased, contact hole formation by laser light or dry etching becomes easier, and side etching can be allowed, so contact hole formation by WET etching is also possible.

After the contact hole 1132 is formed, a conductor 1133 (1133-1, 1133-2) is formed in the contact hole 1132. For example, a barrier metal or a seed layer metal can be formed by the PVD method, and the metal can be formed in the contact hole 1132 by a plating method. Alternatively, a metal or silicide film may be stacked by a CVD method or a PVD method. If the contact size is further increased, a conductive paste can be applied and squeezed to insert the conductive paste into the contact hole 1132. When the contact hole is filled with a conductive paste, an appropriate heat treatment is performed to stabilize the conductor. Further, a metal film, a silicide film, or a low-resistance PolySi film is laminated on the thin plate 1130 and patterned to form electrodes / wirings 1134 (1134-1, 1134-2). In this way, the electrode / wiring 1134 electrically connected to the N + silicon substrate 1006-2 (1006-2-1 and 1006-2-2) can be taken out on the thin plate. Even if a voltage of about several volts is applied to the two electrodes / wirings 1134-1 and 1134-2 shown in FIG. 41 (j), the N + silicon substrate 1006 as a conductor is an electrically inactive layer 1110 as an insulator. Therefore, electricity does not flow between the two electrodes / wirings 1134-1 and 1134-2. As described above, a capacitance (capacitor) is formed in this region, and the capacitance C due to the side wall electrode in the space of the second surface groove Q is C = ε * S / d, and the first surface groove O Since the side wall sandwiched between the first surface groove O and the second surface groove is expanded or depressed due to the pressure difference between the pressure P1 of the first surface and the pressure P2 of the second surface groove Q, the capacitance d is changed. Changes. Conversely, it is possible to calculate a pressure difference between P1 and P2 by detecting a change in capacitance. The conductor 1133 and the conductor film of the electrode / wiring 1134 can be combined.

As described above, since the thin plate 1130 includes the contact hole 1132, the in-contact conductor 1133 and the electrode / wiring 1134, the material of the thin plate 1130 is an insulator. For example, a glass plate, a quartz plate, a ceramic plate, a plastic plate, or the like. Further, since the thin plate 1130 has a role of protecting the capacitive element, a certain level of strength is required. If necessary, the electrodes / wirings on the thin plate can be long and connected to other capacitive elements or elements other than capacitors (for example, resistors, inductors, transistors, and in some cases ICs). In that case, wirings and electrodes can be protected by a protective film. Since the thin plates 1130 and 1126 also serve to protect the capacitive element type pressure sensor of the present invention, a certain degree of strength is required. For that purpose, it is made thick to some extent. For example, 50-100 μm. In order to give more strength, it is set to 100 μm to 200 μm, and in order to give further strength, the thickness is set to 200 μm or more. In particular, if the thin plate 1130 is too thick, the aspect ratio of the contact hole 1132 increases. However, various methods such as forming the conductive film 1134 by a method with good coverage or taper the contact hole 1132 of the thin plate 1130 can be used. it can. The conductor film 1133 can also be used as a conductor film for forming the electrode / wiring 1134.

Without using the thin plate 1130, a contact hole is formed in the insulating film 1102, 1111, and a metal film, a silicide film, or a low-resistance PolySi film is laminated on the contact hole, and electrodes / wirings are further formed on the insulating film 1111. You can also. In this case, since a thin plate is not used, the aspect ratio becomes small, so that it is easy to form a conductor film in the contact hole. Furthermore, a protective film (a passivation film such as a silicon oxide film, a silicon nitride film, a silicon oxynitride film, or a polyimide film) is formed on the electrode / wiring, and the pad electrode is drilled to expose only the pad electrode. You can also. In this case, since the electrode / wiring is protected by the protective film, the reliability is improved. However, the use of a thin plate improves the protective characteristics (particularly strength against external force) of the capacitive element.

FIG. 44 is a view showing a pressure sensor further provided with a pressure transmission path. Support layers 1142 and 1144 are formed on the second surface side of the pressure sensor having the structure shown in FIG. 41 (j), and a plate 1146 is adhered thereon. A pressure introducing hole 1147 is opened in the plate 1146, and external pressure P 2 is transmitted to the second surface groove Q through the pressure transmitting hole 1127. A space 1145 between the thin plate 1126 and the plate 1146 is a space formed by the support layers 1142 and 1144, and the whole is connected and the pressure transmission hole 1127 to each second surface groove Q enters. The support layer 1144 is closed in a frame shape, and the outer side and the inner side of the frame are completely separated to keep airtight. Also. The support layer 1142 is columnar or wall-like and only supports the thin plate 1126 and the plate 1146 to form an airtight space, and the pressure is the same on the outside, inside, and surroundings. . As long as the plate 1146 can be supported only by the frame-shaped support layer 1144, the support layer 1142 may be omitted. Since the support layers 1142 and 1144 can be formed simultaneously, there is no process load and process addition. The support layers 1142 and 1144 can be formed by applying a photosensitive adhesive on the thin plate 1126 or pasting a photosensitive adhesive sheet and exposing and developing. A plate 1146 can be attached to the patterned support layers 1142 and 1144 to form an airtight space 1145. If the plate 1146 is made of a material having sufficient strength (if it is better to see the inside, glass or transparent plastic is preferable), the second surface groove Q and the pressure sensor can be protected. If a pressure introducing hole 1147 is provided in an appropriate portion of the plate 1146 (a variety of methods such as a laser method and an etching method can be used), pressure can be introduced from the pressure introducing hole 1147 into the second surface groove Q. The plate 1146 can be provided without using the thin plate 1126. The structure shown in FIG. 41 (l) can be applied as it is. In the case of the structure shown in FIG. 41 (j), the support layers 1142 and 1144 are placed on the bottom wall of the first surface groove (in the drawing). Just below).

Similarly, after forming the electrode / wiring 1134 on the first surface side, the support layers 1148 and 1150 are formed, and the plate 1152 is adhered thereon. A pressure introducing hole 1154 is formed in the plate 1152, and an external pressure P 1 is transmitted from the pressure introducing hole 1154 to the first surface groove O. The support layer 1150 is closed in a frame shape, and the inside is held in an airtight space with respect to the outside of the frame. The support layer 1148 supports the plate 1152 and the thin plate 1130, but is not necessary if it can be supported only by the frame-shaped support layer 1150. The outer side, the inner side, and the periphery of the support layer 1148 have the same pressure. By providing such a plate 1152, the first surface groove O, the electrode / wiring 1134, and the pressure sensor can be protected. Even when the thin plate 1130 is not provided (the insulating film 1102 and the like are omitted in FIG. 44), the support layers 1148 and 1150 can be directly formed and the plate 1152 can be bonded. For the support layers 1148 and 1150, a photosensitive adhesive film (for example, a coating method or a sheet) can be used. The strength of the plate 1152 may be selected according to the use environment. In order to make the inside visible, glass, transparent plastic or the like may be used. A line 1156 indicated by a dotted line is a scribe line, but if a part or all of the first surface groove or the second surface groove is formed, only the plates 1146 and 1152 are cut, so that it is easy to cut. Various methods such as a normal dicing method, a laser dicing method, and an etching dicing method can be used for cutting.

Next, based on FIG. 42, a substrate (composite substrate) in which a low-resistance silicon semiconductor substrate 1201 having a high-concentration impurity element is bonded to a high-resistance silicon semiconductor substrate 1202 having a low-concentration impurity element of a reverse conductor. It is also possible to form a capacitive pressure sensor having good characteristics using 1200. As this composite substrate, a substrate obtained by bonding each semiconductor substrate (bonded substrate) or an epitaxial substrate obtained by epitaxially growing single crystal silicon having a low concentration impurity element of a reverse conductor on a high concentration impurity silicon semiconductor substrate is used. be able to.

When the low-resistance silicon semiconductor substrate 1201 is N-type, the impurity element is a group V element such as arsenic (As), phosphorus (P), antimony (Sb), and the impurity concentration is, for example, about 10 ¹⁹ / Above 3 cm3, the resistivity is about 0.01 Ωcm or less. When the low-resistance silicon semiconductor substrate 1201 is P-type (so-called N + silicon), the impurity element is a group V element such as boron (B), aluminum (Al), and the impurity concentration is, for example, about 10 ¹⁹ / Above 3 cm, the resistivity is below about 0.02 Ωcm. (However, depending on the characteristics of the pressure sensor, it may be possible to use one having a resistivity one to two digits higher than these.)

When the high-resistance silicon semiconductor substrate 1202 is N-type, the impurity concentration is, for example, about 10 ¹⁷ / cm 3 or less (preferably, about 10 ¹⁶ / cm 3 or less), and the resistivity is about 0.1 Ωcm or more. (Preferably about 0.7 Ωcm or more). When the high-resistance silicon semiconductor substrate 1202 is P-type, the impurity concentration is, for example, about 10 ¹⁷ / cm 3 or less (preferably, about 10 ¹⁶ / cm 3 or less), and the resistivity is about 0.3 Ωcm or more. (Preferably about 1 Ωcm or more).

Insulating films 1203 and 1204 are formed on the first surface (upper surface) and / or the second surface (lower surface) of the composite substrate 1200. The first surface of the composite substrate 1200 is a surface on the high resistance substrate 1202 side, and the second surface of the composite substrate 1200 is a surface on the low resistance substrate 1201 side. The insulating films 1203 and 1204 are a silicon oxide film (SiOx film), a silicon nitride film (SiNx film), a silicon oxynitride film (SiOxNy film), etc., which are oxidized, nitrided, CVD method, PVD method, or coating method (+ Heat treatment) or the like. These insulating films 1203 and 1204 are formed in order to protect the surface of the composite substrate during the process and to make it easy to form a photosensitive film. You don't have to.

Next, as shown in FIG. 42A, the photosensitive film 1205 is patterned to open windows 1206 (1206-1 and 1206-2) for forming the first surface grooves. Next, as shown in FIG. 42B, the insulating film 1204 existing under the window 1206 (1206-1, 1206-2) is removed, and the surface (first surface) of the high-resistance semiconductor substrate is removed. Expose. Although the thickness of the insulating film 1204 is about 0.1 μm to 2 μm, it is desirable that the insulating film 1204 be formed with a size faithful to the window 1206 in order to form the first surface groove vertically. Therefore, the insulating film 1204 is preferably removed by a dry etching method or anisotropic etching. (After that, since the deep silicon trench is formed by anisotropic etching, when the photosensitive film 1205 is also etched and the insulating film 1204 comes out, the insulating film 1204 is also etched and the silicon substrate 1200 is exposed. (In order to prevent the silicon substrate 1200 from being exposed, the thickness of the insulating film 1204 may be 2 μm or more.)

Next, as shown in FIG. 42C, the silicon substrates 1202 and 1201 existing under the window 1206 are sequentially etched to form the first surface grooves O (O1, O2). It is desirable to perform etching so that the inner wall surface of the first surface groove O is perpendicular to the first surface of the substrate 1202 (high resistance silicon substrate). In addition, etching is performed in the depth direction of the substrate with the same size as the window 1206. However, the etching is terminated with an appropriate thickness so that the first surface groove does not reach the second surface. In this way, the deep first surface groove O (O1, O2) is formed.

Next, as shown in FIG. 42 (d), the photosensitive film 1205 is removed using a dry method such as an ashing method or a WET method (resist stripping solution such as organic stripping solution or hot concentrated sulfuric acid). To do. Thereafter, the photosensitive film 1208 is patterned again. The photosensitive film 1208 is patterned so that the photosensitive film 1208 does not remain in a region where a high concentration impurity layer is to be formed and the photosensitive film 1208 remains in a region where a high concentration impurity layer is not formed. Basically, since the high concentration impurity layer is formed on the inner wall side surface of the high resistance substrate 1202 in the first surface groove O, the window is opened larger than the first surface groove, and the photosensitive film 1208 is formed as shown in FIG. The size is smaller than the size of the photosensitive film 1205 shown in FIG. In order to remove the photosensitive film present in the first surface groove O with a developer, the photosensitive film is desirably a negative type. The negative photosensitive film is insoluble in the developer when it is exposed to light or an electron beam, and is soluble in the developer where it is not exposed to light or an electron beam. Since there is a high possibility that light does not reach the photosensitive film that has entered the deep portion of the first surface groove, the positive type may leave the photosensitive film in the first surface groove. On the other hand, in the negative type, the photosensitive film that is not exposed to light can be removed with the developer, and therefore the photosensitive film that has entered the deep portion of the first surface groove can also be removed with the developer. In addition, there exist a dry film type and a liquid type as a photosensitive film | membrane. In the dry film type, the film is attached to a substrate or the like for exposure, so there is a high possibility that the film will not enter into a deep groove such as the first surface groove. Therefore, the dry film is easier to use in the present invention. Moreover, since the thick silicon substrate is etched when forming the first surface groove and the second surface groove, the photosensitive film is considerably etched even if a condition with a high selectivity is selected. For example, when the silicon substrate in the groove is etched by 300 μm, a thickness of 6 μm or more is required even if the selection ratio of silicon to the photosensitive film is 50. A dry film is easier to handle to form such a thick photosensitive film. In the case of a liquid type photoresist, besides being difficult to form thickly, the liquid resist penetrates deep inside the first surface groove, so even if it is a negative type, it takes time to completely remove it with a developer. There is a problem that it takes.

Next, as shown in FIG. 42E, the insulating film 1204 is etched using the photosensitive film 1208 as a mask, the insulating film 1204 other than the part where the photosensitive film 1208 exists is removed, and the surface of the semiconductor substrate 1202 is removed. Expose. (In the case of using an ion implantation method to be described later, the photosensitive film 1208 is not removed and the insulating film 1204 may not be removed.) Thereafter, the photosensitive film 1208 is removed, and FIG. As shown in FIG. 5F, high-concentration impurity diffusion is performed on the exposed portion of the silicon substrate without the insulating film 1204 to form high-concentration impurity diffusion layers 1210 (1210-1 and 1210-2). The conductivity type of this impurity element is opposite to that of the low concentration impurity (high resistance) substrate 1202. For example, if the low-concentration impurity (high resistance) substrate 1202 is P-type, N-type high-concentration impurity diffusion is performed. For example, phosphorus (P) diffusion is performed. That is, an N + layer is formed in the P-type high resistance substrate 1202. Since the first surface groove is P-type partway through (thickness of the high resistance substrate 1202), an N + layer is formed on the inner wall of the first surface groove. The deeper side of the first surface groove is an N-type substrate, and since this substrate has a high impurity concentration and is a low resistance substrate, this substrate concentration only becomes higher. As a result, the low resistance substrate 1201 is connected to the N + layer of the high resistance substrate 1202 and can be electrically connected to the surface of the high concentration substrate 1202. If the low-concentration impurity (high resistance) substrate 1202 is N-type, P-type high-concentration impurity diffusion is performed. For example, boron (B) diffusion is performed. That is, a P + layer is formed in the N-type high resistance substrate 1202. Since the first surface groove is N-type until the middle (the thickness of the high resistance substrate 1202), a P + layer is formed on the inner wall of the first surface groove. The deeper one of the first surface grooves is a P-type substrate, and since this substrate is a low-resistance substrate with a high impurity concentration, the substrate concentration only becomes higher. As a result, the low resistance substrate 1201 can be electrically connected to the surface of the high resistance substrate 1202 by connecting to the P + layer of the high resistance substrate 1202.

An impurity diffusion layer is not formed in the portion of the substrate 1202 covered with the insulating film 1204 (1204-1, 1204-2, 1204-3) shown in FIG. Therefore, the impurity diffusion layer 1210 is divided in this portion. As will be described later, since the first surface grooves O1 and O2 are completely separated by the second surface groove in the region of the high-concentration impurity (low resistance) semiconductor substrate 1201, in the completed capacitor element, the diffusion layer 1210 -1 and the diffusion layer 1210-2 are not electrically connected. Note that when the impurity concentration of the high-resistance substrate 1202 is low, the surface of the substrate is likely to be depleted or reversed, and electricity may easily flow even at a low voltage difference. Ions of the same conductivity type may be ion-implanted into the surface of the resistance substrate 1202 to slightly increase the surface impurity concentration. Since this ion implantation can be performed on the entire surface of the substrate 1202, a mask process is not particularly necessary, so that the cost increase and the process load due to the addition of this process are small. However, if the amount of ion implantation is too large, the substrate surface concentration becomes high and the junction breakdown voltage with the diffusion layer 1210 of the reverse conductor type decreases, so it is necessary to carry out at a level that does not cause any problem in practice. Furthermore, if a semiconductor substrate 1202 having a slightly high concentration that is difficult to deplete or invert from the beginning is used instead of a substrate that easily depletes or inverts the substrate surface, the ion implantation step can be eliminated. it can. When only the capacitive element of the present invention is formed, a slightly higher concentration semiconductor substrate 1202 where the substrate surface is difficult to be depleted or inverted from the beginning can be used, but the same applies to other semiconductor elements such as MOS transistors and bipolar transistors. In the case of forming on a substrate, since it is necessary to use a high resistance substrate for control of VTH (threshold voltage), base resistance and the like, an ion implantation process may be required.

For example, impurity diffusion in FIG. 42 (f) is performed as follows. A B or P impurity diffusion source is deposited on the semiconductor substrate (wafer) from an impurity source such as BCl3 or POCl3 (appropriate heat treatment is performed), a PSG film (SiO2 containing P) or After laminating a BSG film (SiO 2 containing B), impurities are diffused from the impurity diffusion source into the substrate in a diffusion furnace. The depth of the impurity (diffusion) layer is determined by the diffusion temperature and time.

The impurity diffusion method shown in FIG. 42 (f) is a method in which a diffusion source is predeposited or a high-concentration impurity layer is formed and diffusion is performed from the layer into the substrate as described above. You can also. This method is shown in FIG. That is, the structure shown in FIG. 43 is the same as the structure shown in FIG. 42E, but high-concentration ion implantation is performed from the first surface side of the semiconductor substrate 1200 having this structure. The ions implanted here are ions opposite to the conductivity type of the high resistance substrate 1202. For example, if the conductivity type of the high-resistance substrate 1202 is P-type, N-type impurity elements (As, P, Sb, etc.) are ion-implanted. If the conductivity type of the high-resistance substrate 1202 is N-type, ion implantation of a P-type impurity element (B. Al, etc.) is performed. The depth of ion implantation into silicon is determined by the ion species and the acceleration voltage (of course, there is also a crystal orientation dependency of the silicon substrate), and the impurity concentration is determined by the amount of ion implantation (dose amount). Further, the concentration and depth of the impurity layer are determined depending on how much diffusion is performed under the heat treatment conditions (for example, temperature and time) after ion implantation.

The acceleration voltage may be appropriately selected depending on the type of ions and the depth of implantation. As for the injection quantity, because the impurity concentration of the formed diffusion layer by heat treatment after the injection (impurity layer) is of the same order as the diffusion layer 1210 shown in FIG. 42, for example, in N-type 10 19 ^/ cm ³ or more If the P-type is 10 ¹⁹ / cm ³ or more, the resistance is considerably low. In order to obtain such a concentration, for example, the ion implantation amount is set to 10 ¹⁴ / cm ² or more, preferably 1 * 10 ¹⁵ / cm ² or more. More preferably, 3 * 10 ¹⁵ / cm ² , and even more preferably 5 * 10 ¹⁵ / cm ² , the resistance of the diffusion layer 1210 can be further reduced.

In the case of B ions (B +), for example, at an acceleration voltage of 100 kev, the peak depth (in silicon) is about 0.3 μm (standard deviation 0.07 μm). In the case of P ions (P +), for example, the peak depth (in silicon) is about 0.12 μm (standard deviation 0.05 μm) at an acceleration voltage of 100 kev. Thereafter, heat treatment is performed to widen the impurity layer.

In the present invention, an impurity layer is also formed on the side wall of the first surface groove O. In the ion implantation method, in order to prevent channeling, ion implantation is generally performed by slightly tilting the semiconductor substrate with respect to the direction of ion implantation (with an ion implantation angle). An area exists. Even if the ion implantation angle is implanted perpendicularly to the substrate surface, the first surface groove O has a side wall substantially perpendicular to the substrate surface (first surface), so that almost no ions are implanted into the inner surface of the vertical side wall. An area exists. The substrate 1201 having the deeper first surface groove is a low-resistance semiconductor substrate having the same conductivity type as the impurity element to be ion-implanted and having a high-concentration impurity element. However, since the high-resistance substrate 1202 bonded thereon is a reverse conductivity type substrate, it is necessary to ion-implant into the inner surface of the side wall of the first surface groove O to form a high-concentration impurity layer. For this purpose, ion implantation is performed using a rotary ion implantation method. That is, the ion implantation 1300 is performed by tilting the ion implantation angle by α ° with respect to the normal line of the substrate surface (first surface) and rotating the substrate. By this rotary ion implantation, ions are implanted into the inner surface (in any direction) of the first groove side wall to form impurity layers 1302 (1302-1, 1302-2, 1302-3, and 1302-4) having a predetermined concentration. Incidentally, since the ion implantation is inclined by α °, the ion implantation also slightly goes around the periphery under the photosensitive film 1208 and the insulating film 1204. However, if the insulating film 1204 has a sufficient width (approximately 5 μm or more depending on the acceleration voltage of ion implantation, ion implantation amount, α °, and subsequent heat treatment conditions), the impurity layers 1210-2 and 1210-3 are formed. There is no connection.

If the thickness of the high resistance substrate 1202 is u and the width of the first surface groove is v, the ion implantation angle α (where α is not 0 degrees) is set so that tan α <v / u. The ion implantation layer 1302 can be formed on the entire high resistance substrate region on the inner surface of the side wall of the first surface groove by ion implantation. For example, when u = 20 μm and v = 100 μm, the rotational ion implantation may be performed at an angle smaller than an angle (approximately 78 degrees) where tan α <5. Heat treatment is performed to activate the impurity layer formed by the rotary ion implantation method. For example, if annealing is performed for 30 minutes or more at a temperature of 900 ° C., it is sufficiently activated. In the case of halogen lamp annealing, annealing may be performed at 1000 ° C. for 30 seconds or longer. The impurity layer may be expanded by diffusing impurities in the impurity layer 1302. The impurity layer 1302 is not formed under the insulating film 1204. If the insulating layer 1204 has a certain width, the impurity diffusion layer 1302 is not connected under the insulating film 1204 even by a subsequent heat treatment. Since the insulating film 1204 surrounds the periphery of the first surface groove O, for example, the impurity (diffusion) layers 1302-2 and 1302-3 are not connected in the region of the high resistance substrate 1202. In other words, the low conductivity (low resistance) semiconductor layer 1202 of the reverse conductivity type exists between the impurity (diffusion) layers 1302-2 and 1302-3, and therefore, electrical conduction is not achieved without the low resistance substrate 1201. (Of course, since the impurity (diffusion) layers 1302-2 and 1302-3 are separated from each other by a certain distance, a voltage higher than the breakdown voltage corresponding to this distance is applied, or the reverse breakdown voltage due to the impurity concentration of the high-resistance semiconductor substrate 1202 If a higher voltage is applied, current flows, but current does not flow when a voltage lower than the withstand voltage is applied.The distance between the impurity (diffusion) layers 1302-2 and 1302-3 is 1 μm or more, (If the impurity concentration is 10 ¹⁷ / cm ³ or less, since there is a breakdown voltage of 10 V or more, there is no problem in practical use of the capacitive element.)

In FIG. 42 (f), in order to form a high concentration impurity layer on the surface of the silicon substrate 1202, the insulating film 1204 where the impurity layer 1210 is to be formed has been removed in advance, but the ion shown in FIG. In the case of the implantation method, this insulating film 1204 may be left. If an acceleration voltage for ion implantation is selected in consideration of the thickness of the insulating film, ions penetrate through the insulating film and enter the silicon substrate. The ion implantation mask at this time is the photosensitive film 1208 1208. Therefore, in the ion implantation method, it is not necessary to remove the photosensitive film 1208 before ion implantation. In particular, in the rotary ion implantation method, there is no shadowed portion by this mask. In FIG. 42F, since the heat treatment is performed when the impurity layer is formed, it is necessary to remove the photosensitive film 1208, the insulating film 1204, and the like in advance. Thus, since the number of steps increases in the method for forming the high concentration impurity layer (predeposition method) in FIG. 42 (f), the steps can be simplified by using the above-described rotary ion implantation method.

As shown in FIG. 42 (f) and FIG. 43, after the impurity diffusion layer 1210 (impurity layer 1302 in FIG. 43) is formed, as shown in FIG. Insulating films 1212 (1212-1 and 1212-2) are formed in order to remove contamination and protect the exposed silicon substrate. The insulating film formed on the first surface groove O1 side is referred to as 1212-1, and the insulating film formed on the first surface groove O2 side is referred to as 1212-2. Although the existing insulating film 1204 may be left behind, in this case, the existing insulating film 1204 also increases in thickness. Alternatively, before the insulating film 1212 is formed, the surface of the exposed silicon surface or the surface of the insulating film 1204 is removed by cleaning or lightly etching the surface of the insulating film 1204 before the insulating film 1212 is formed. May be. Alternatively, the insulating film 1212 can be formed after etching the insulating film 1204 on the surface and / or the insulating film 1203 on the second surface. At this stage, the thickness of the insulating film 1212 is about 1000 A because the purpose is to protect or contaminate the exposed silicon substrate. In the case of an ion implantation method as shown in FIG. 43, an insulating film may be formed on the silicon substrate 1200 to perform ion implantation. If an insulating film already exists, the insulating film is again formed here. There is no need to form. Examples of a method for forming the insulating film 1212 include oxidation, nitridation, oxynitridation, lamination by a CVD method and a PVD method. In addition, the insulating film may be formed in combination with the annealing or diffusion treatment after forming the ion implantation layer or the predeposition layer.

Next, as shown in FIG. 42H, a photosensitive film 1214 (1214-1, 1214-2) is patterned on the second surface. Since this patterning is for forming the second surface groove Q, a window is formed in the region where the second surface groove Q is to be formed. Since the region of the first surface groove O is not usually etched, the region of the first surface groove O1 is a photosensitive film 1214-1 and the region of the first surface groove O2 is photosensitive as shown in FIG. Cover with membrane 1214-2. Next, the insulating film 1203 is etched using the photosensitive film 1214 as a mask. This etching method is a WET method or a DRY method, but in order to suppress side etching and etching variations during the subsequent etching of the second surface groove Q, etching with small side etching, preferably faithful to the photosensitive film 1214. Etching is good. For example, anisotropic etching such as RIE is used. It should be noted that the photosensitive film 1214 can be patterned without problems such as adhesion to the silicon semiconductor substrate 1201, and the insulating film can be omitted because the photosensitive film 1214 does not disappear when the second surface groove Q is etched. For example, the photosensitive film 1214 may be formed after the insulating film 1203 is removed. However, if an insulating film is necessary and the thickness of the insulating film 1203 is insufficient, a photosensitive film 1214 may be formed and patterned after a new insulating film is formed.

Next, as shown in FIG. 42 (i), the silicon substrate 1200 is etched using the photosensitive film pattern 1214 and the insulating film pattern 1203 (1203-1, 1203-2) as a mask to form the second surface groove Q (Q1 , Q2, Q3). In this etching, as explained in FIG. 41, the thickness of the side wall 1216 (1216-1, 1216-2, 1216-3, 1216-4) between the first surface groove O and the second surface groove Q is made as much as possible. It is important to form with less variation. In particular, the thickness of the side walls constituting the capacitors (1216-2, 1216-3) is formed with high accuracy. (Capacitance can also be formed adjacent to each other, so Q1 and Q3 can also create a capacity space in the same way as Q2. In that case, the thickness accuracy of 1216-1 and 1216-4 is also very important. Therefore, first, it is necessary to accurately align the photosensitive film 1214 and the first surface groove O. As described above, there are various methods for increasing the alignment accuracy. Since the bottom wall 1218 (1218-1, 1218-2) of the first surface groove O is very thin, light, electromagnetic waves (X-rays, γ-rays, etc.) and particle beams having a wavelength that can be transmitted through the bottom wall. Positioning is possible by irradiating (electron beam, α ray, etc.) from the first surface side and receiving on the second surface side. In particular, by adjusting the wavelength and intensity of the irradiated light or electromagnetic wave, alignment can be performed without affecting the photosensitivity of the photosensitive film 1214. Furthermore, sound waves can also be used.

Further, side etching of the silicon substrate 1200 is suppressed, and etching variation is reduced. The deeper the depth of the second surface groove, the larger the capacitance value is, so it is desirable that it is deeper. However, the deeper the depth, the larger the variation in etching. Do. Also in the depth direction, the etching method is performed with the etching rate as fast as possible and with little etching variation. Further, the etching is performed by an etching method having a high etching selection ratio between the photosensitive film 1214 serving as an etching mask and the material to be etched (here, silicon). Etching methods that satisfy these conditions include etching by the Bosch method, cryo method, and ULVAC method, and various other etching methods have been developed and applied. In the present invention, these methods can be appropriately selected and used.

The sidewalls 1216 (1216-2, 1216-3, etc.) constituting the capacitor are made very thin by the above-described alignment of the photosensitive film 1214 with high accuracy, an etching method with small side etching, and an etching method with small etching variation. can do. (These serve as capacitive component electrodes.) For example, a very small pressure difference can be detected when the thickness is 10 μm, preferably 7 μm, more preferably 5 μm, more preferably 3 μm, and even more preferably 1 μm. That is, the side wall 1216 (1216-2, 1216-3) is easily deformed even by a small pressure difference. In addition, the distance between electrodes (the width of the second surface groove Q2 and the like) as a capacitive component can be reduced, and a highly sensitive change in capacitance can be detected. (When the distance between the electrodes is reduced, the capacitance change is increased even with a small amount of deformation.) In addition, portions that do not constitute a capacitive component (for example, the side wall 1216-1, the bottom wall 1218-1, and the first surface of the first surface groove O1). The side wall 1216-4 and the bottom wall 1218-2) of the groove O2 can be made thicker. Accordingly, the portion that does not constitute the capacitive component can have patterning tolerance and etching tolerance. (Also, by increasing the thickness of these portions, the strength of the first surface groove can be increased.)

In this embodiment, a particularly important point is that in the etching for forming the second surface groove Q, etching is performed until the low concentration substrate 1202 is reached, and the high concentration silicon substrate 1201 is completely etched in the depth direction. . However, since the bottom QB (QB 1, QB 2, QB 3) of the second surface groove exists in the low concentration substrate 1202, the first surface groove O is supported by the low concentration substrate 1202. Accordingly, the counter electrodes (for example, 1216-2 and 1216-3) constituting the capacitor are completely separated in the high concentration substrate 1201, and the low concentration region is sandwiched between them in the low concentration substrate 1202. (That is, the high-concentration impurity layer 1210 is not formed in the low-concentration region 1202 under the insulating film 1204), so that no electricity flows. Looking at the portion of the second surface groove Q2 constituting the capacitance region, if the thickness of the high concentration substrate 1201 is n1, the thickness of the low concentration substrate 1202 is n2, and the etching amount of the substrate 1200 is n3, then n3> n1. Etching is completed, and when this is satisfied, the etching is terminated and a second surface groove is formed. At this time, n2 + n1> n3 must be satisfied. Since the first surface groove Q is supported by the remaining substrate 1202 after being etched, the first surface groove Q must have a sufficient lifetime and reliability, and thus a certain thickness is required.

This thickness is usually 20 μm or more, but depending on the use environment, it must be made thicker or even thinner. Etching variations in the depth direction must also be minimized. If this variation is Δg% of the etching amount, (n3−n3 * Δg / 100)> n1 and (n3 + n3 * Δg / 100) <(n1 + n2) in order to surely etch a high concentration substrate. In the current etching method, Δg is about 1 to 10%, and this amount needs to be taken into consideration. When Δg is about 5%, if n1 is 200 μm, n3> 211 μm, and if n3 is more than this, n3> 211 μm is better. Therefore, if etching of 215 μm is performed, n1 + n2> 226 μm. If 20 μm or more is required to maintain the strength of the low-concentration substrate, n2> 46 μm. Since the initial substrate thickness also varies, these also need to be considered. From the above, in this example, n2 may be about 50 μm without considering the substrate thickness variation. As a matter of course, if the method with small variation is realized, the thickness of the substrate 1202 can be considerably reduced.

Next, as shown in FIG. 42 (j), after removing the photosensitive film 1214, the inner wall of the second surface groove or the like is removed in order to remove damage or contamination of the inner wall of the second surface groove Q as necessary. In addition to these purposes, an insulating film 1220 (1220-1, 1220-2, 1220-3) may be formed to protect the second surface groove Q. Next, on the first surface side, contact holes 1222 (1222-1, 1222-2) are formed in desired portions of the insulating film 1210, and conductors 1224 (1224-1, 1224-2) are further laminated on the portions. Further, a conductor film connected to the conductor 1224 is attached and patterned to pattern the electrodes / wirings 1226 (1226-1 and 1226-2). These patterning can use a normal photolithography technique and an etching technique. (The conductor films 1224 and 1226 can be used together.) The electrode / wiring 1226 can be extended to another place and connected to other capacitors or other elements (resistors, transistors, ICs, etc.) You may connect with an electrode. Alternatively, a lid or the like may be attached as shown in FIG. 41, or it may be covered with a protective film. The electrode / wiring 1226-1 is connected to the side wall 1216-2 of the first surface groove O1 through the conductor 1224-1 and the high-concentration impurity diffusion layer 1210-1. Since the sidewall is a high-concentration impurity (low resistance) semiconductor substrate 1201 except for its upper portion (a high-concentration impurity diffusion layer is formed on the upper portion of the sidewall), these potentials are the same. On the other hand, the electrode / wiring 1226-2 is connected to the side wall 1216-3 of the first surface groove O2 through 1224-2 and 1210-2. Since the sidewall is a high-concentration impurity (low resistance) semiconductor substrate 1201 except for its upper portion (a high-concentration impurity diffusion layer is formed on the upper portion of the sidewall), these potentials are the same. Since the electrode / wiring 1226-1 and the electrode / wiring 1226-2 do not flow electricity due to the low-concentration impurity substrate 1202, the capacitance space second surface groove Q2 is formed between the side wall electrodes 1216-2 and 1216-3 constituting the capacitance. Can be detected.

As described above, a capacitive element having the second surface groove Q2 as a spatial region (spatial component) can be formed between the electrodes / wirings 1226-1 and 1226-2. A plurality of such capacitive elements may be connected in parallel and / or in series. This connection method may be connected by the impurity diffusion layer 1210 or may be connected by a high concentration impurity substrate. However, there is a limit to this connection method (the connection may not be possible due to the separation of the high concentration substrate 1201 by the second surface groove Q or the low concentration impurity region existing under the insulating film 1204). Sometimes it can be connected by wiring / electrode 1226.

FIG. 3A illustrates the structure of a pressure sensor when using a low-resistance Si substrate containing a high-concentration impurity element (P-type or N-type and having an impurity concentration of 10 ¹⁹ / cm ³ or more) and a method for manufacturing the pressure sensor. FIG. In order to manufacture the isolation region 1110 of the low-resistance Si substrate 1101, an insulating film 1102 such as a SiO 2 film is formed on the Si substrate 1101 by using an oxidation method, a CVD method, or a PVD method (the thickness is preferably 100 nm to 2000 nm, preferably In this case, the formation region of the isolation region 1110 is opened by using a photolithography method, the insulating film 1102 is etched, and a recess is formed in the isolation region 1110 by dry etching or wet etching. After forming the recess, the recess is buried with an insulating film such as SiO 2 or SiON film using an oxidation method, a CVD method, or a PVD method. The isolation region 110 has a width d2 and a depth h3. If planarization is required, a coating insulating film forming method such as the SOG method may be used. Next, the insulating film on the Si substrate may be removed, and an insulating film such as a SiO2 film may be formed on the Si substrate again by a CVD method, an oxidation method, or the like. Next, the region O1 to be one concave portion of the pressure sensor is patterned using a photolithography method or the like, the insulating film 1102 is etched (when the insulating film 1102 is present), and the Si substrate is further deeply etched using the RIE method or the like. Etch vertically. (Etching Depth h2) Since this recess O1 determines the thickness y of the Si substrate side wall (becomes a diaphragm), the vertical pattern is as good as possible. In this etching, the Si substrate 1101 is left behind without being penetrated. (H4)
Next, an insulating film 1103 such as SiO2 is formed on the back surface side of the Si substrate, and the region O2 (the back surface side of the Si substrate) that becomes the other concave portion of the pressure sensor is patterned using photolithography or the like (of course, on the front surface side) A resist or the like is formed in the recess O1 region), the insulating film 1103 is etched (when the insulating film 1103 is present), and the Si substrate is deeply etched and vertically etched using the RIE method or the like. (Etching Depth h1) Since this recess O2 determines the thickness y of the Si substrate side wall (becomes a diaphragm), the vertical pattern is as good as possible. Further, in this etching, the surface of the Si substrate 1101 is left without being penetrated (h5), and reaches the separation region 1110 formed on the surface side, and a part of the separation region 1110 is partially etched in the thickness direction. To do. (That is, only h3-h5 is etched) In order to produce the thickness y of the Si substrate side wall 1101 (1101-3) as accurately as possible, it is necessary to pattern the concave portion O1 on the front side as accurately as possible in the photolithography process. For this purpose, it is desirable to use a double-sided (mask or reticle) aligner (or stepper) and to align the mask using light (electromagnetic waves) transmitted through the Si substrate 1101 in order to detect the concave pattern on the front side.

Furthermore, the alignment accuracy can be further improved by using another method. In this method, the first surface groove (the surface (upper surface) of the Si substrate is used as the first surface and the recess O1 is also referred to as the first surface groove) is formed before or after the first surface groove is formed. In this method, only a part of the surface is thinned by etching and penetrated through the first surface groove, or the thickness of the bottom wall of the first surface groove is made very thin. By this method, the groove pattern of the first surface can be read from the second surface through the penetrating portion (or the very thinned portion), and can be directly aligned with the first surface groove pattern. In this case, the first surface groove pattern used for alignment cannot be used as an actual pattern, but alignment by a stepper is also possible by providing it in various places, so alignment is very accurate. Is possible.

Still other methods can be used. In this method, a glass substrate is bonded to the second surface side. In this case, the glass substrate is bonded to the second surface (lower surface or back surface) side of the silicon substrate. Since it is a glass substrate, anodic bonding is possible and strong bonding can be performed. Alternatively, bonding may be performed by using an adhesive, a heat fusion method, or a room temperature bonding method. The silicon substrate is completely penetrated in the thickness direction when the first surface groove is formed. (Also referred to as a through groove or a through hole.) Since the silicon substrate and the glass substrate are made of different materials, the glass substrate serves as an etching stopper, so that the thickness in the depth direction of the first surface groove can be controlled with very high accuracy. . Since the pattern of the first surface groove can be accurately read from the second surface side, the photosensitive pattern of the second surface groove can be directly aligned with the first surface groove. As a result, the first surface groove and the second surface groove can be formed with very high accuracy. In this case, when the second surface groove is formed, it is necessary to first etch the glass substrate vertically to form the photosensitive film pattern as faithfully as possible. Also in this case, since the materials are different, the silicon substrate can be used as a stopper, and the margin of over-etching is large, so that the silicon substrate can be completely exposed at necessary places over the entire area of the wafer.

After that, the Si substrate can be formed with high accuracy in a vertical direction using another etching species (the same etching species may be used depending on conditions), so that it is formed between the first surface groove and the second surface groove. The thickness of the side wall can be formed with very high accuracy. In this case, the bottom wall of the first surface groove is a glass substrate. Although the glass substrate is an insulator, since electricity can be transmitted through the low-resistance silicon on the side wall, there is no particular problem with the capacitance characteristics. Further, as a merit of using the glass substrate, the entire glass substrate can be etched and thinned after forming the first surface (through) groove. As this thinning method, wet etching can be used, dry etching can be used, and further, BG method (back surface polishing method) and CMP method (chemical mechanical polishing method) can also be used. In the case of wet etching, accurate etching can be performed using an HF-based etchant. Also in the case of dry etching, the glass substrate can be etched with high accuracy using the above-described etching gas such as CF. Thus, if the glass substrate is made thin before the formation of the photosensitive pattern of the second surface groove, the thickness of the glass substrate to be etched when forming the second surface groove is reduced. Accordingly, since less over-etching is required, accurate etching can be performed, and the second surface groove can be formed with high accuracy. In addition to a glass substrate, a quartz substrate, a ceramic substrate, or a plastic substrate can be used. Further, the glass substrate can be bonded (attached) to the Si substrate after the first surface through hole is formed. In this case, the glass substrate is not etched, and the depth of the through hole is the same as the thickness of the Si substrate. Therefore, the first surface through groove having a very accurate depth can be formed.

Next, an insulating film 1104 such as SiO2 is formed on the surface of the Si substrate (or on the insulating film 1102) by an oxidation method, a CVD method, or a PVD method, and the insulating film 1104 (also in the recess O1 (O1-1, 2)). (Also acts as a protective film) is laminated (or oxidized). Furthermore, an insulating film 1105 such as SiO2 is formed on the back surface of the Si substrate (or on the insulating film 1103), and an insulating film 1105 (also acting as a protective film) is laminated in the recess O2 (O2-1, 2, 3). (Or oxidize). In order to improve moisture resistance, a SiON or SiN film may be used. Next, an adhesive or the like is attached to the surface of the Si substrate, an insulating substrate 1130 such as a glass substrate is attached, and the insulating substrate 1130 in the opening portion of the recess O1 and the contact formation region is removed by a photolithography method and an etching method. Alternatively, an insulating substrate 1130 such as a glass substrate having already opened the opening of the recess O1 or the contact formation region may be attached. A contact hole 1132 (1132-1, 2) is formed in the Si substrate 1101 in a flat portion other than the recess O1 in the windowed region of the insulating substrate 1130, and silicide and various metal films (for example, Al, Cu, Ti) are formed. They are stacked and electrically connected to the Si substrate 1101 as a conductor through the contact hole 1132, and the electrodes / wirings 1134 (1134-1, 2) are patterned by photolithography / etching. Adhesive or the like is also attached to the back side of the Si substrate, an insulating substrate 1126 such as a glass substrate is attached, and insulation in the open portion of the recess O2 (O2-1, 2, 3) or the contact formation region is performed by photolithography and etching. The substrate 1126 is removed. Alternatively, an insulating substrate 1126 such as a glass substrate having already opened the opening of the recess O2 and the contact formation region may be attached. Further, a contact hole and an electrode may be provided on the back side, and the overall size can be reduced.

The insulating substrates 1126 and 1130 such as glass substrates have an effect of reinforcing the thinned Si substrate and preventing deformation due to a pressure difference (difference between the pressure P1 on the front side and the pressure P2 on the back side). Further, a pole (support layer) 1142 may be attached to the insulating substrate 1126 on the back surface, and a protect substrate 1146 having a pressure introducing hole 1147 may be attached to the pole 1142. The protect substrate 1146 is a package that serves to smoothly introduce the pressure P2 from the pressure introduction hole 1147 and protect the sensor. The pole 1142 supports the sensor attached to the insulating substrate (support substrate) 1126 with respect to the protect substrate 1146, and also forms a space between the protect substrate 1146 and the insulating substrate (support substrate) 1126 to smoothly apply pressure. And it guide | induces to the recessed part O2 opening part from the pressure introduction hole 1147 promptly. The pole 1142 is formed by attaching a substrate having a predetermined thickness on the insulating substrates 1126 and 1130 using an adhesive or the like, and etching using a photolithographic method or an etching method. When the insulator substrate is glass, the Si substrate can be firmly attached by anodic bonding. Alternatively, the pole may be attached by aligning the protection substrate with the pole attached in advance to the insulating substrate. Although not shown in FIG. 3A, a similar material may be attached to the front side of the Si substrate.

The thickness h0 of the Si substrate is 100 μm to 1000 μm, the width of O1 (O1-1, 2) is 10 μm or more, the width d1 of O2 (02-1) is 10 μm to 100 μm, and the width of O2 (O2-2, 3) is 10 μm or more. H1 is 80 μm to 980 μm, h1 is 80 μm to 980 μm, h3 is 1 μm to 50 μm, h4 is 1 μm to 50 μm, h5 is 1 μm to 50 μm, and y is smaller, but technically, 1 μm to 15 μm. Further, h0≈h1 + h5≈h2 + h4 and h3 ≧ h5. When the thicknesses of h4 and h5 are 10 μm or less, it is desirable to reinforce with insulating substrates 1130 and 1126. It is good to make it adhere before etching. It is the substrate side wall 1101 (1101-3, 4) that contributes to the diaphragm of the pressure sensor, and is deformed by the pressure difference between the pressure P1 of O1 (O1-1, 2) and the pressure P2 of O2-1, and O2 The spatial capacity of −1 changes. The substrate sidewall 1101-3 is electrically connected to the substrate sidewall 1101-2, and the substrate sidewall 1101-4 is electrically connected to the substrate sidewall 1101-5. The substrate sidewall 1101-3 and the substrate sidewall 1101-4 are electrically separated by the separation region 1110. Accordingly, if a constant voltage is applied between the electrodes 1134-1 and 1134-2, the capacitance between the substrate side wall 1101-3 and the substrate side wall 1101-4 can be measured. The width d2 of the separation region 1110 is 1 μm to d1, but a capacitance is generated in the separation region itself. Therefore, in order to reduce the contribution to the capacitance of the sensor, the width d2 is preferably larger. The width of the separation region is determined in consideration of the strength of the separation region. Another insulating film (SiO 2, SiON, SiN, etc.) can be laminated on the insulating film 1102, and electrodes / wirings 1134 are formed, and before or after attaching the insulating substrate 1130, SiO 2 etc. ( An insulating film of SiO2, SiON, SiN, etc.) may be laminated. (The thickness of these insulating films is 100 nm to 2000 nm, preferably 500 nm to 1000 nm in consideration of electrical insulation.) The thickness of the insulating film on the substrate side wall (1101-3, 4) of the concave portion that becomes the diaphragm is If it is too thick, it will affect the capacitance, so 1.0 μm or less, preferably 0.5 μm or less, and more preferably 0.2 μm or less. If there is no need for pollution prevention or protection, an insulating film may be omitted.

The thicknesses of the insulating substrates 1130 and 1126 are 30 μm to 500 μm to 1 mm, and may be determined based on the size, strength, and usage environment of the PKG. The pole thickness is preferably 10 μm to 500 μm, the width is 10 μm to 100 μm, and the thickness of the protect substrate 1146 is preferably 30 μm to 500 μm to 1 mm. In order to increase the sensitivity for detecting the pressure difference, the sensors shown in FIG. 3 (a) may be connected in parallel. Since the sensor of the present invention requires a very small area, a large number of sensors can be connected. Alternatively, the capacity can be controlled by connecting them in series. Moreover, since the wiring can be patterned on the surface of the Si substrate using an LSI process, a large number of sensors can be easily connected in parallel.

In FIG. 3A, O1 (O1-1, 2) and O2 (O2-1) allow pressure to be applied from the outside, but O1 or O2 is closed by an insulating substrate (thin plate, support substrate). The pressure can also be fixed. For example, if you want to fix at the pressure P1 in O1 (O1-1, 2), attach the insulating substrate (thin plate, support substrate) with adhesive, heat fusion, room temperature bonding, or anodic bonding with the pressure P1 applied. Just do it. If a vacuum (P1 = 0) is desired, it may be attached in a vacuum state. At this time, in order to achieve a vacuum state as much as possible by removing the gas in the recess and the outgas due to the adhesive, it is sufficient to put the gas adsorbate in the recess in advance. Thereby, the pressure difference (P2-P1) with respect to the fixed pressure P1 can be detected.

FIG. 3B shows a substrate in which a high-resistance silicon semiconductor substrate 1100-1 having a low-concentration impurity element having a conductor opposite to that of a high-concentration impurity element Si wafer (low-resistance wafer) 1100-2 is bonded. A capacitive pressure sensor having favorable characteristics can also be formed using (also referred to as a composite substrate). As this composite substrate, for example, a substrate (bonded substrate) obtained by bonding respective semiconductor substrates, or an epitaxial substrate obtained by epitaxially growing single crystal silicon having a low-concentration impurity element of a reverse conductor on a high-concentration impurity silicon semiconductor substrate. Can be used. When an epitaxial wafer having a low concentration epitaxial layer (high resistance Si) 1100-1 formed on the substrate surface is used as the substrate 1101 (or the substrate 1101 in which the low concentration substrate 1100-1 and the high concentration substrate 1100-2 are bonded together is used. It is a figure which shows the structure of the pressure sensor of this invention and its manufacturing method in the case of using. Since it is basically similar to the manufacturing method described with reference to FIG. Epi layer 1100-1 has a thickness h7 of, for example, 5 μm to 50 μm. The epi layer 1100-1 has a high resistance (for example, an impurity concentration of 10 ¹³ / cm ³ to 10 ¹⁷ / cm ³ and a resistivity of 0.1 Ωcm or more), and is opposite in conductivity type to the low resistance substrate 1100-2. Even if a conductor film is formed by opening a contact hole as shown in FIG. 3A, the low resistance region (for example, impurity concentration of 10 ¹⁹ / cm ³ or more and resistivity of 0.01 Ωcm or less) 1100-2 is electrically Not conducting.

When the low-resistance silicon semiconductor substrate 1201 is N-type, the impurity element is a group V element such as arsenic (As), phosphorus (P), antimony (Sb), and the impurity concentration is, for example, about 10 ¹⁹ / Above ³ cm, the resistivity is about 0.01 Ωcm or less. When the low-resistance silicon semiconductor substrate 1201 is P-type (so-called N + silicon), the impurity element is a group V element such as boron (B), aluminum (Al), and the impurity concentration is, for example, about 10 ¹⁹ / Above ³ cm, the resistivity is below about 0.02 Ωcm. (However, depending on the characteristics of the pressure sensor, it may be possible to use one having a resistivity one to two digits higher than these.)
When the high-resistance silicon semiconductor substrate 1202 is N-type, the impurity concentration is, for example, about 10 ¹⁷ / cm ³ or less (preferably, about 10 ¹⁶ / cm ³ or less), and the resistivity is about 0.1. 1 Ωcm or more (preferably about 0.7 Ωcm or more). When the high-resistance silicon semiconductor substrate 1202 is P-type, the impurity concentration is, for example, about 10 ¹⁷ / cm ³ or less (preferably, about 10 ¹⁶ / cm ³ or less), and the resistivity is about 0.1. 3 Ωcm or more (preferably about 1 Ωcm or more).

Therefore, after forming the recess O1, a necessary portion is opened using a photolithographic method, and the same impurity element as the conductor type of the low resistance region is reduced from the surface of the epi layer 1100-1 and the upper portion of the opening of the recess O1. After ion implantation to the resistance region portion to form a high concentration ion implantation layer, necessary heat treatment (activation treatment at 900 ° C. or higher) is performed to form low resistance diffusion layers 1108 (1108-1 and 2108). After that, if the contact hole 1132, the conductor film 1133, and the electrode / wiring 1134 are formed, the electrode / wiring 1134 can be electrically connected to the low resistance region 1100-2 through the low resistance diffusion layer 1108 (1108-1, 2), Capacitance can be detected. Since ions may be implanted into the substrate side wall region from the upper part of the opening of the recess O1 to a depth of about 50 μm, the substrate 1101 may be tilted with respect to the ion implantation direction. If the width of the opening is 20 μm, if the angle (relative to the normal of the substrate surface) is made smaller than about 22 degrees (however, since the ions are not implanted into the substrate side at 0 degrees, they are larger than 0 degrees), 50 μm or more. Ions enter to the depth. In particular, if rotary ion implantation is used, ions can be implanted into the entire upper portion of the substrate side wall of the recess O1. When ion implantation is performed through an insulating film or the like, an acceleration voltage for ion implantation is selected in consideration of the thickness of the insulating film. Without using ion implantation, the insulating film 1102 in a region where the low resistance diffusion layer 1108 (1108-1, 2) is to be formed is removed, and a semiconductor substrate (wafer) from a predeposition (for example, an impurity source such as BCl3 or POCl3). Insulating film (P + (P-type high-concentration Si layer) is a BSG film, N + (N-type high-concentration Si layer) by CVD or the like containing a high-concentration impurity) Then, the low resistance diffusion layer 1108 (1108-1, 2108) can be formed by heat treatment after forming the PSG film.

As shown in FIG. 3B, since there is a low resistance region 1100-2 on the back side of the substrate 1101, contact holes 1132 (1132-3, 4) are formed in the insulating film 1103 and the insulating substrate 1126, and The conductive film 1133 (1133-3, 4) is formed in the portion, and further electrodes / wirings 1134 (1134-3, 4) are formed, so that the low resistance region 1100-2 is formed without forming the ion implantation layer. Can be electrically connected. Even in this case, if an ion implantation layer is formed, an epi layer can also be used as a sensor region. In addition, the depth h1 of the recess O2 from the back surface only needs to reach the epi layer 1100-1, the depth h3 of the isolation region may be shallower than the thickness h7 of the epi layer, and a high resistance is formed below the isolation region 1110. An epi layer may be present. (However, a low resistance layer is not present.) In the case of a high resistance substrate (epi layer), the isolation region 1110 may be diffusion isolation or LOCOS isolation in addition to the trench isolation shown in FIG. For example, in the isolation region 1110, diffusion separation can be achieved by forming an inversion prevention layer of the same impurity element as that of the low resistance substrate immediately below the insulating film 1102, or LOCOS may be formed. In this way, a pressure sensor can be fabricated using an epi-wafer, so that the pressure sensor can be mounted in the same chip as the LSI, and the mounting size can be greatly reduced. Can be improved. Since the process can also be used as an LSI process (for example, CMOS, MOS, or bipolar), the manufacturing cost can be reduced.

FIG. 3C is a diagram showing the structure of the pressure sensor of the present invention and the method for manufacturing the same when using a high-resistance (impurity concentration of about 10 ¹⁷ / cm ³ or less) Si substrate used for LSI fabrication. After forming the recesses O1 and O2 from the front side and the back side of the Si substrate 1101, ion implantation of an impurity element having a conductivity type opposite to the conductor type of the Si substrate 1101 is performed on the front side and the back side of the Si substrate 1101. . A region where ion implantation is not desired is masked using photolithography or the like. Recesses O1 and O2 are deep vertical holes, and the angle of inclination of ion implantation is set with respect to the substrate surface in order to implant ions into the side surfaces (surfaces) of the substrate side walls (for example, 1101-2, 3, 4, 5). Tilt the ion implant. Ion implantation is performed with an inclination angle smaller than tanα = d / h, where α is the inclination angle of ion implantation with respect to the normal of the substrate surface, d is the width of the recess, and h is the depth of the recess. (However, α ≠ 0) The ion implantation at the bottom of the recess is vertical ion implantation. If (α = 0) rotary ion implantation is used, ions can be implanted into the entire region on the side wall of the substrate in the recess. Next, the ion implantation layers 1112 (1112-1, 2) and 1113 (1113-1, 2) formed by heat treatment are brought into contact with the substrate side wall, the bottom surface of the recess, or the surface of the substrate. Acceleration energy of ion implantation and heat treatment conditions (temperature, time) are appropriately selected and contacted. You may make the board | substrate thin in the part which should contact. When the substrate is too thick to be contacted, contact holes 1132 (1132-3, 4) are formed from the back side of the substrate as shown in FIG. 3C, and a conductor film 1133 (1133-3, 4) is formed in the contact holes. ), And further, electrodes and wiring 1134 (1134-3, 4) are formed. (In FIGS. 3B and 3C, contact holes and the like are also formed in the insulating substrate (support substrate) 1126. However, if the insulating substrate (support substrate) 1126 in this region is removed, the insulating film A contact hole can be formed in the electrode 1101 and the aspect ratio can be reduced.When the ion implantation layers 1112 and 1113 are connected to each other, the electrodes and wirings 1134-1 and 1134-2 on the surface of the substrate 1101 are connected, or the ion implantation layer is formed. When 1112 and 1113 are not connected, the capacitance of the pressure sensor can be measured through the electrodes / wirings 1134-3 and 1134-4 on the back surface of the substrate 1101.

A method of attaching a semiconductor substrate (A substrate) such as a Si substrate to an adhesion substrate (B substrate) such as a semiconductor substrate, an insulating substrate such as a glass substrate or a ceramic substrate, or a plastic substrate will be described. A support substrate (C substrate) is attached to the B substrate using an adhesive layer (D adhesive layer). Next, the C substrate with the B substrate attached thereto is attached to the A substrate from the B substrate side using an adhesive layer (E adhesive layer). The D adhesive layer is an adhesive layer made of a thermoplastic adhesive resin that adheres firmly at a temperature Td-1 and loses adhesiveness at Td-2 (Td-2> Td-1). The E adhesive layer is a thermoplastic adhesive resin that adheres firmly at a temperature Te-1 (Te-1 <Td-2) and loses its adhesiveness at Te-3 (Td-2 <Te-3), or a temperature Te. -2 (Te-2 <Td-2) is an adhesive layer made of thermosetting resin that adheres firmly. When the E adhesive layer is a thermosetting resin, the temperature is set to Te-2 or higher and Td-2 or lower to attach the B substrate (with C substrate) to the A substrate, and then the temperature is set to Td-2 or higher. The substrate is pulled away from the B substrate. When the E adhesive layer is a thermoplastic resin, the substrate B is attached to the A substrate at a temperature of Te-1 or higher and Td-2 or lower, and then the temperature is Td-2 or higher. Pull the C substrate away from the B substrate at a temperature of 3 or less.

Since there are many such adhesives, they can be selected as appropriate. When there is no pattern on the A substrate, the B substrate can be bonded roughly, but when there is a pattern on the A substrate and the adhesive layer pattern adhered on the B substrate is aligned with the pattern, alignment is necessary. For example, when a through hole is already formed in the A substrate and it is not desired to put an adhesive layer in the through hole. The same applies to the case where a pattern is already formed on the B substrate (for example, there is a region without the substrate). An adhesive layer can be formed by an application method (spray method, spin coating, dip, etc.), screen printing, an adhesive sheet adhesion method, or the like. For patterning of the adhesive layer, a photolithographic method (when the adhesive has photosensitivity), a stamp method, a screen printing method, or the like can be used. Further, in the case of an adhesive layer that can be cured or peeled off by light (electromagnetic wave) irradiation, the B substrate can be attached to the A substrate and the C substrate can be separated without much consideration of the above temperature range. For example, when the D adhesive layer can be peeled off by light irradiation, the C substrate can be separated from the B substrate by light irradiation after attaching the B substrate (with the C substrate) to the A substrate. Further, if the E adhesive layer is a photocurable adhesive layer, the temperature Te-1 or Te-3 need not be taken into consideration, and the heat treatment process is simplified.

When the A substrate is a Si substrate and the B substrate is a glass substrate, anodic bonding or room temperature bonding can be used. In this case, when the bonding temperature is Tp, by using the D adhesive layer such that Tp <Td-2, the C substrate can be separated after the A substrate and the B substrate are bonded to the temperature Td-2 or higher. . If the B substrate and the C substrate are vacuum-adsorbed or electrostatically adsorbed, there is no need to consider the heat treatment temperature of Td-1 or Td-2. When the B substrate is made of various magnetic materials such as ferrite, iron, nickel, cobalt, and composites thereof, an electromagnet substrate can be used as the C substrate, and if energization is stopped after the A and B substrates are attached, The C substrate can be easily separated. In these cases, if a photocurable resin is used as the E adhesive layer, the heat treatment process can be reduced or eliminated at all. Even when the B substrate is thin, it can be attached to the A substrate with high accuracy by using the present invention. When the thickness of the B substrate is 200 μm or less, it becomes difficult to adhere to the A substrate alone. Therefore, after attaching the B substrate to the C substrate, the B substrate is thinned (for example, 100 μm or less, 50 to 5 μm or more by using CMP, dry aging, WET etching, a normal BG (Back Grind) method, etc.) The thin B substrate can be attached to the A substrate.

In FIG. 3, the insulating substrates 1130 and 1126 open the entire recess opening. However, if pressure (P1 or P2) is quickly transmitted to the recess, only a part of the recess opening may be opened. good. If the opening of the recess is narrowed by the insulating substrates 1130 and 1126, entry of contaminants, moisture, foreign matter, etc. into the recess can be prevented. Furthermore, since the entrance of the recess can be regulated by the insulating substrates 1130 and 1126, fluctuations in the upper and lower parts of the recess due to pressure fluctuations can be prevented, so that more accurate capacity changes can be detected and the reliability and life of the pressure sensor are increased. Can do.

FIG. 3D is a plan view (a cross section near the center of the recess) of the cross-sectional structure diagram shown in FIGS. On the other hand, the longitudinal sectional views of A1-A2 in FIG. 3 (d) are FIGS. 3 (a) to 3 (c). The substrate side wall (1011-2, 3, 4, 5, 7, 8, 9, 10 etc.) surrounding the recess O1 and the substrate side wall 1101 (1101-1, 6, 11, 12 etc.) surrounding the recess O2 are Since the upper part of the substrate (for example, 1101-7 in FIG. 3A) and the lower part are connected by the insulating substrate 1126, these are fixed as an integrated object. However, since there is an isolation region 1110 and the like at the upper part of the substrate, the substrate side wall (1011-2, 3, 4, 5, 7, 8, 9, 10 etc.) surrounding the recess O1 and the substrate side wall 1101 (1101- 1, 6, 11, 12, etc.) are completely electrically separated. Accordingly, the recess O2 (O2-1) becomes a capacitive space, and the capacitance can be detected between the substrate side wall 1101-3 and the substrate side wall 1101-4. Further, an isolation region is formed in a part of the substrate side wall 1101 (1101-7, 8, 9, 10) (for example, an insulating film is formed in this region to manufacture diffusion layers having different conductivity types). Accordingly, the recess O1 also becomes a capacitance space, and the capacitance can be measured between the substrate side wall 1101-2 and the substrate side wall 1101-3, and between the substrate side wall 1101-4 and the substrate side wall 1101-5. , Can increase sensitivity.

As can be seen from FIG. 3D, the substrate side wall 1101 (1101-1, 6, 11, 12, etc.) surrounding the recess O1 is the outer outer wall (protective member) of the pressure sensor PKG. Accordingly, the substrate side wall 1101 (1101-1, 6, 11, 12, etc.) has a certain thickness (for example, 50 μm or more, preferably 100 μm or more), or is not deformed by pressure or does not change due to external forces. The upper portion is made stronger by the insulating substrate 1130 (further including the protect substrate), and the lower portion is made stronger by the insulating substrate 1126 (further including the protect substrate 1146). Pressure sensor PKG. Further, the pressure sensor PKG of the present invention is a wafer level PKG, and a PKG having a simple process, inexpensive, ultra-small and highly reliable can be manufactured. The sensitivity can be increased by connecting capacitors in parallel, and the capacitors can be mounted on the same chip as the IC. Since bumps can be formed on the electrodes and wirings, flip chip mounting is also possible. Since electrodes and wiring can be easily formed on both the front and back of the chip, the degree of freedom of chip (PKG) mounting is also increased. The sensor chip shown in FIG. 3 is diced at a thick portion of the substrate. However, dicing is also facilitated by making the substrate thin when forming the concave portion of O1 or O2.

What is most important in the formation of the second surface groove is the thickness y of the side wall (1101-3, 4 in FIG. 3D) and the distance d1 between the electrodes. If the thickness y is thin, the sensitivity due to the pressure difference is improved. For example, a rectangle (h * a) having a thickness y constrained only at the periphery (h≈h1−h4≈h2−h5, where a is the length of the second surface groove O2) is the maximum deflection (center of the rectangle) ) Is given by the following formula.
Wmax = α * z * h ⁴ / (Ey ³ ) → Wmax = α * z * h ² a ² / (Ey ³ )
(Z is the pressure difference (= P1-P2), E is the Young's modulus of the diaphragm material, (α is a constant that varies depending on the aspect ratio of the silicon diaphragm) α = 0.0138 for a square diaphragm, α = 0 for a rectangular diaphragm ) When h = a = 300 μm, Wmax is about 600 z / y ³ (μm) (z is expressed in Mpa units, y is in μm units), z is 1 Mpa (about 1 atm), and y is 3 μm. Then, Wmax = about 22 μm. When h = 300 μm and a = 600 μm, Wmax is about 1200 z / y ³ (μm), z is 1 Mpa (about 1 atm), and y is 3 μm, Wmax = about 45 μm. Since the above formula is a theoretical formula, it can be designed by taking this formula into consideration, taking the data with the completed formula, and bringing the actual value close to the theoretical formula, a precise sensor can be produced. As described above, the substrate side wall (corresponding to a diaphragm) is, for example, an insulating substrate on the upper and lower sides, and in the lateral direction, for example, another substrate side wall connected to the substrate side wall (diaphragm) in the case of a rectangular shape. Therefore, the vicinity of the center of the substrate side wall (diaphragm) becomes the maximum deflection due to the pressure difference, and the surrounding restricting portion is hardly deformed and is curved between them. Therefore, a relationship curve between the pressure difference and the deformation amount can be obtained. (This is the same as the conventional semiconductor diaphragm pressure sensor.)

4A to 4C show a bonded substrate (epi wafer, hereinafter referred to as a composite substrate) in which a low concentration wafer (epitaxial layer) 11202 having a different conductivity type is attached (grown) on a high concentration substrate (wafer) 11201. It is a figure which shows the structure and manufacturing method of the pressure sensor which formed the 1st surface penetration groove | channel and the 2nd surface recessed part in 11200. An insulating film 11204 such as a SiO2 film is laminated on the first (front) surface of the composite substrate 11200, and an insulating film 11203 such as a SiO2 film is laminated on the second (back) surface, and the first (front) surface is formed by ion implantation and heat treatment. An inversion prevention layer 11205 is formed on the surface of the substrate. When the impurity concentration of the low-concentration layer 11202 is low (about 1 to 5 × 10 ¹⁶ / cm ³ or less), a denser diffusion layer (about 1 to 5 × 10 ¹⁶ / cm ³ to about 1-5 × 10 ¹⁶ / cm ³ to prevent the substrate surface from being inverted. 10 ¹⁹ / cm ³ ). Therefore, they are the same conductor type. Next, patterning for forming a first surface through groove (hole) is performed on the first surface by photolithography, and the insulating film 11204 and the composite substrate 11200 are vertically etched, and the first surface is perpendicular to the first surface and the second surface. Through grooves (holes) R (R1, R2) penetrating from the surface to the second surface are formed.

Next, patterning is performed on a region where a low-concentration layer 11202 and a diffusion layer of a reverse conductivity type (the same conductivity type as the high-concentration wood field 11201) are to be formed on the first surface by photolithography. For example, M (M1, M2) which is a region for forming a contact hole connected to a high concentration substrate on the substrate side wall or a region on the side surface of the substrate side wall which is a low concentration wafer region of the first surface through groove is a photosensitive film (photograph). Open a window of a resist film or a photosensitive sheet. (FIG. 4 (a)) In the region where the recess for measuring the capacitance (second surface recess) is formed, the distance between the diffusion layers (between the electrodes) on both sides is much smaller than the distance between the substrate side walls (d1 in FIG. 3). Since it is not desired (the sensitivity of the capacity change becomes worse as it becomes smaller), it is better to set it to the same position as the through hole R. When it is not desired to form a diffusion layer above the first surface through groove R in this region, a photosensitive film ridge H protruding to the through groove R side is produced as shown in FIG. When a photosensitive sheet is used, this wrinkle is easily formed. When using a photoresist such as spin coating or dip, a positive resist is used, and light may be irradiated to a place where the resist should be left (for example, on the first surface through groove). This flange portion H (H1, H2) hangs down on top of the first surface through groove by heat treatment (for example, 100 ° C. to 200 ° C.) and covers the side surface of the substrate side wall.

Next, the insulating film 11204 in the region where the window is opened and there is no photosensitive film is removed. As a result, silicon is exposed in the region M and the upper portion of the first surface through groove, particularly in the low concentration wafer region. Next, the photosensitive film is removed, and a high-concentration diffusion layer (of a low-concentration wafer) is formed on the side surface of the substrate side wall of the M region and the first surface through-groove by predeposition or the like (including a stack of insulating films including impurities) + heat treatment. 11207 is formed. (For example, P + diffusion layer such as B or N + diffusion layer such as P, As, Sb, etc.) The diffusion layer 11207 can also be formed by ion implantation + heat treatment. In that case, the insulating film 11204 may not be removed. (It is sufficient that the film thickness is not more than a certain thickness calculated by ion implantation acceleration energy.) Further, it is sufficient if the high-concentration diffusion layer 11207 can be formed to a depth in contact with the high-concentration substrate region of the first surface through groove. . Next, an insulating film 11208 such as a SiO2 film covering the inner surface of the first surface through groove and covering the exposed surface of the first surface is laminated by a CVD method, a PVD method, or an oxidation method. . A SiON film or a SiN film is preferable for improving the moisture resistance. The thickness of the insulating film is preferably about 500 nm or more on the first surface and about 50 nm or more on the side surface of the first surface through groove. Next, an insulating substrate 11209 such as a glass substrate, a ceramic substrate, or a plastic substrate is attached to the second (back) surface by a method using an adhesive, diffusion bonding, room temperature bonding, or the like. In the case of a glass substrate, the insulating film 11023 on the back surface is removed to expose the Si substrate 11201 and can be firmly bonded by anodic bonding. Note that when the insulating film is a SiN film, anodic bonding with a glass substrate is possible even when the insulating film is a SiO2 film and PolySi is laminated thereon. Next, a photosensitive film pattern 11211 is formed to form a second surface recess. In this patterning, it is important to match the first surface through hole R with high accuracy. In particular, when a pattern such as the first surface through-hole R can be recognized from the back surface such as a glass substrate, the alignment accuracy is improved. Particularly, the patterns 1121-2 and 3 for measuring the capacitance and the through holes R1 and R2 are accurately aligned. (Fig. 4 (b))

Next, the insulating substrate 11209 is etched using the photosensitive mask pattern 11211 (11211-1, 2, 3, 4) as a mask, the insulating film 11203 is further etched, the Si substrate 11200 is further etched, and the second surface Recess Q (Q1, Q2, Q3) is formed. Since the diaphragm (substrate side wall) is formed by these etchings, vertical etching using a deep etching (DRIE) method or the like is desirable. The thickness of the insulating substrate 11209 is 1 μm to 100 μm, but as described in the substrate attachment method, after attaching the thick insulating substrate 11209 to another substrate (support substrate), the thickness is reduced to a desired thickness by CMP or the like. Then, after attaching to the second surface of the composite substrate 11200, the support substrate may be separated. Alternatively, after a thick insulating substrate 11209 is attached to the second surface of the composite substrate 11200, it is thinned to a desired thickness with CMP or the like. Alternatively, there is a method of thinning only the second surface concave portion formation region and the first surface concave portion (through hole) formation region (masking other regions and thinning by dry etching or wet etching). When attached to the second surface of the composite substrate 11200, the insulating substrate 11209 (11209-2, 3) at the bottom of the first surface through hole R does not adhere to the insulating substrate 11212, and the first surface through hole R floats. As a result, the first surface through-grooves (R1, R2) are less susceptible to external impacts and vibrations, and the accuracy of the capacitive element is improved. By thinning the insulating substrate 11209, the etching amount of the insulating substrate 11209 on the second surface recess is reduced when the second surface recess is formed, so that the second surface recess etching can be performed with high accuracy.

All of the high concentration substrate 11201 region is etched and ends in the middle of the low concentration region 11202. Etching with as little variation as possible is better, and it is desirable to stop etching when the low concentration region is reached. However, since a low-concentration substrate is used, even if it partially penetrates the first surface, the insulating substrate adheres to the first surface thereafter, so the pressure on the second surface side leaks to the first surface side. There is nothing. Next, an insulating film 11221 such as a SiO 2 film is laminated on the inner surface of the second recess as a protective film. A SiON film or a SiN film is preferable for improving the moisture resistance. The thickness may be 100 nm or more. Before and after the formation of the insulating film, ion implantation (of the same conductivity type as the low concentration layer) is performed on the bottom surface (upper surface in the drawing) of the recess Q, and heat treatment is performed to form the inversion prevention layer 11210. If an interlayer insulating film is further required on the first surface side, an insulating film is laminated, and an insulating substrate 11216 such as a glass substrate, a ceramic substrate, or a plastic substrate is attached using an adhesive or the like, and necessary windows are opened. (For example, pressure transmission hole 11217 and contact hole forming region to first surface through-hole R) In a region without insulating substrate 11216, contact hole 11214 (11214-1) is formed in insulating films 11208 and 11204 to form a conductor film. The electrodes are stacked to form an electrode / wiring 11215 (11215-1). Alternatively, a contact hole 11214 (11214-2) may be formed from the insulating substrate 11216, and a conductive film may be stacked to form an electrode / wiring 11215 (11215-2). When the thickness of the insulating substrate 11216 is 200 μm, a contact hole having a size of about 20 μm may be formed. Since the aspect ratio is about 10, there are no problems such as etching selectivity and conductor film coverage. There is almost no problem with the increase in the chip size. In order to further reduce the chip size, the diffusion layers 11207-2 and 3207 may be extended in the vicinity of the through hole on the upper side of the formation region of the second recess Q1. Although the sensor sensitivity is slightly reduced, the pressure fluctuation due to this is not a division that increases, so it is sufficient to design in consideration of the decrease.

An insulating substrate insulating substrate 11212 such as a glass substrate, a ceramic substrate, or a plastic substrate is attached to the second surface side using an adhesive or the like to protect and strengthen the second surface side. A pressure transmission hole 11213 is provided so that pressure can be transmitted to the sensor detection recess Q1. However, for absolute pressure measurement, either R or Q is not opened, and the pressure in R or Q is kept constant. In order to detect the capacitance change of the recess Q1 with high accuracy and high sensitivity, it is preferable to make the thicknesses y3 and y4 of the substrate side walls 1120-3 and 11200-4 thin and with small variations. For example, y3 and y4 may be about 3 μm to 20 μm, and the thickness variation may be suppressed to 10% or less, preferably 5% or less. On the other hand, the thicknesses y2 and y5 of the substrate side walls 1120-2 and 11200-5 may be thick and the variation may be larger. For example, since y2 and y5 can be 20 μm or more, the bottom surface of the substrate side wall 11200-2 or 11200-5 is passed through the insulating substrate 11212 and the insulating substrate 11209-2 or 11209-3 on the second surface side (which is a high concentration substrate). It is also possible to form electrodes and wiring by forming contact holes. If the insulating substrate 11212 is opened in the portions of the insulating substrates 11209-2 and 11209-3 and contact holes and electrode wirings are formed on the insulating substrates 11209-2 and 11209-3, the aspect ratio becomes small and small contacts Holes and electrode wiring can be produced.

As a result, the chip size can be made smaller than when the electrode wiring is formed on the first surface side. In this embodiment, since the thickness of the high-concentration substrate 11201 corresponds to the depth of the substrate side wall, the sensor accuracy is very good without depending on the etching variation of the first through hole R and the second recess Q. Since the anti-inversion layer is also formed on the low concentration substrate 11202, electrical separation between the electrodes 11200-3 and 11200-4 is sufficient. The substrate side walls 11200-1 and 11200-6 on both sides serve as protective walls for the sensor chip. In order to reduce the load of dicing, the width of the photosensitive film patterns 11211-1 and 411 is controlled, and the composite substrate 11200 outside the substrate sidewalls 11200-1 and 11200-6 is etched when the second surface recess Q is formed. Keep it thin. The insulating substrates 11216 and 11212 are also opened at the same time. Further, if a contact hole is formed at the same time when the contact hole is formed and the conductor film is removed from this portion, only a part of the low concentration substrate 11202 is obtained at the time of dicing. However, if the strength of the entire wafer cannot be maintained by this alone, for example, only the substrate 11212 can be left. Further, a protective film such as a SiO 2 film may be laminated on the side surfaces of the etched substrate side walls 11200-1 and 11200-6 by a CVD method or the like. In order to improve moisture resistance, a SiON film or a SiN film is preferable.

FIG. 4D is a diagram showing a sensor structure and a manufacturing method thereof when the low-concentration substrate 11202 exists on the upper surface of the high-concentration substrate 11201 and the low-concentration substrate 11230 exists on the lower surface. The same structures as those shown in FIGS. 4A to 4C are given the same numbers. The first surface recesses R (R1, R2) are etched vertically, but a semiconductor substrate 11200 (a substrate with 11202 on the top and 11230 on the bottom and 11230 on the bottom, or a low-concentration epi layer on both sides of the 11201 is grown. (Recessed epitaxial substrate) is a recess (vertical groove) formed by finishing etching when reaching the lower substrate 11230. Therefore, it does not penetrate the lower surface of the semiconductor substrate 11200. As described with reference to FIG. 4C, the inversion prevention layer 11205 and the impurity diffusion layer 11207 are formed on the low concentration substrate 11202 above the semiconductor substrate 11200. The bottom of the first surface recess R is a low-concentration substrate 11230 (conductivity type opposite to that of the high-concentration substrate 11201). However, an impurity diffusion layer may be formed on the bottom of the first surface recess R. There is no problem because it is connected with a high concentration substrate. The impurity concentration of the low-concentration substrate 11230 is preferably high to some extent (for example, 10 ¹⁶ / cm ³ to 10 ¹⁹ / cm ³ ) so as not to be inverted (the active element is not formed therein). Next, the second surface recess Q is formed by aligning the mask with the first surface recess R. Unlike FIGS. 4A to 4C, since the first surface recess R is not a through hole, it is not necessary to attach an insulating substrate. At this time, the photosensitive film may be patterned after an insulating film is formed on the second surface of the composite substrate 11200. After forming the second surface recess Q, it is desirable to form the inversion prevention layer 11210 on the portion exposed to the second surface recess Q side of the low concentration substrate 11202 (may be after the insulating film 11221 is formed). An insulating film 11221 such as a SiO 2 film is laminated as a protective film on the inner surface of the second surface recess Q and the second surface of the composite substrate 11200 by a CVD method, a PVD method, or an oxidation method. Thereafter, the contact hole 11214, the electrode / wiring 11215, and the insulating substrate 11216 are formed on the first surface in the same manner as in FIGS. An insulating substrate 11212 is attached to the second surface side, and necessary window opening 11213 is performed. Note that the insulating film on the second surface of the composite substrate 11200 may be removed, and the glass substrate 11212 may be firmly bonded by anodic bonding. In this embodiment, the depth of the diaphragm is approximately equal to the thickness of the high concentration substrate 11201. In addition, it is not necessary to attach the insulating substrate 11209, it is not necessary to etch the insulating substrate 11209 when forming the second surface recess, and the Si substrate is etched, so that the second surface recess can be accurately formed. Further, since no bonding is used in the sensor drive section (the first surface recess does not penetrate the composite substrate. The insulating substrate 11209 is not used), the reliability increases.

FIG. 6 shows another embodiment of the present invention. FIG. 6 is a perspective view of a cross section in the width direction of the capacitive element of this embodiment. In the present embodiment, the through groove formed in the conductor substrate 2002 is closed from the top and bottom (first surface and second surface) with the insulating substrate to create a sealed space that does not communicate with the outside other than the pressure transmission hole to transmit the pressure. This is a space capacitive element in which the side walls deformed by the pressure from the holes are both side electrodes. Through holes W (W1, W2, W3) and V (V1, V2) are formed in the conductor substrate 2002, the second substrate 2006 is bonded to the upper surface (first surface) of the conductor substrate 2002, and the conductor substrate A third substrate 2004 is bonded to the lower surface (second surface) of 2002. (The conductive substrate is also referred to as a first substrate.) The through-grooves W (W1, W2, W3) and V (V1, V2) formed in the conductive substrate 2002 have side surfaces defined by the side walls of the conductive substrate 2002. The upper portion is formed by the second substrate 2006 (the upper surface (first surface) of the through groove becomes the second substrate 2006), and the lower portion is formed by the third substrate 2004 (the lower surface (the second surface) of the through groove is therefore formed by the second substrate 2006). 3 substrate 2004), which is an enclosed closed space. The side wall 2002-3 that separates the through groove W (W1) and the through groove V1 and the side wall 2002-4 that separates the through groove W (W1) and the through groove V2 have the same pressure in the through grooves W1, V1, and V2. The side wall 2002-3 and the side wall 2002-4 are opposed to each other, and the side wall 2002-3 and the side wall 2002-4 are sandwiched between the side wall 2002-3 and the side wall 2002-4. ) Is a capacitance space. If the distance between the side wall 2002-3 and the side wall 2002-4 of the both side electrodes, that is, the width of the through groove W1, is d and the area of the electrode, that is, the area of the side wall 2002-3 and the side wall 2002-4, is S. The capacitance C due to is C = ε * S / d. (Ε is the dielectric constant, and the capacitance space of the present invention is the space W1, so the substance is a gas such as air and ε is approximately equal to the vacuum dielectric constant.)

A pressure transmission hole T (T1) is formed in the third substrate 2004 bonded to the second surface side in the through groove W1, and the pressure P2 on the second surface side (from the lower side of the third substrate 2004) is applied to the pressure transmission hole T. It is applied to the inside of the through groove W1 through (T1). In the through grooves V1 and V2, a pressure transmission hole S (S1, S2) is formed in the second substrate 2006 bonded to the first surface side, and the pressure P1 on the first surface side (from above the second substrate 2006) is It is applied to the inside of the through grooves V1 and V2 through the pressure transmission holes S (S1, S2). Accordingly, the side walls 2002-3 and 2002-4 are deformed by the pressure difference between the pressure from the through groove W1 and the through grooves V1 and V2. Due to this deformation, the inter-electrode distance d changes, and the capacitance C changes. If T (T1) is not formed, the through groove W1 is completely sealed, so that the internal pressure is constant, and d changes due to the difference between this pressure and the pressure P1 of V1 and V2, and the capacitance also Change. Conversely, if S1 and S2 are not formed, the through-grooves V1 and V2 are completely sealed, so that the internal pressure is constant, and d changes due to the difference between this pressure and the pressure P2 of W1. The capacity also changes. Further, the deformation rate varies depending on the thickness of the side walls 2002-3 and 2002-4 even with the same pressure difference. If the thickness is small, the deformation rate increases. This thickness is obvious, or as will be described later, the etching amount, the alignment accuracy of the photosensitive film, the pattern formation accuracy of the photosensitive film, the etching accuracy of the conductor film (particularly the side etching amount and variations thereof), etc. The thickness that can be reduced depends on the type. When these precisions are improved, the thickness of the side wall can be considerably reduced. If the thickness can be reduced, the amount of deformation can be increased, so that the sensitivity is increased. In terms of the current etching accuracy, photosensitive film alignment accuracy, and photosensitive film formation accuracy, the thinner one is limited to a thickness of about 3 μm (when the etching amount is about 300 μm). Thin sidewalls could be realized. It seems to be possible even at 1 μm or less.

Also, if the thickness is reduced, the breaking strength of the side walls is also reduced, so the pressure to be used needs to be considered. A thick side wall has a small deformation amount and poor sensitivity, so that it is difficult to detect a small pressure difference. Therefore, it is necessary to change the thickness of the side wall depending on the working pressure. Furthermore, in this embodiment, since only the conductor substrate 2002 is deformed, the material of the conductor substrate is also important. In the case of increasing the deformation amount with a small pressure, it is preferable to use a material having a small Young's modulus. The Young's modulus of the high-concentration impurity silicon semiconductor substrate is about 100 GPa to 200 GPa (with crystal orientation dependence), copper and titanium are about 100 GPa to 130 GPa, tungsten is about 400 Pa, aluminum alloy is about 70 GPa, and the conductivity is The polymer is about 0.2-5 GPa and the conductive rubber is about 0.01-0.1 GPa. Carbon nanotubes are about 1000 GPa and steel is about 200 GPa. In this embodiment, a conductor that can be used as an electrode can be used as the conductor substrate 2002. Considering the processing performance, silicon can be processed with high accuracy at present, but other conductor materials may be used. Since the conductive rubber and the conductive polymer have a very small Young's modulus, minute pressure fluctuations can be detected. Carbon nanotubes are suitable for detecting high pressure because of their large Young's modulus. Note that even if a semiconductor or insulator substrate having low conductivity is formed, a conductive film is laminated on the side surface of the through groove after the through groove is formed. If the body film is removed, a pressure sensor can be produced with the structure of this embodiment.

The side wall 2002-3 of the conductor substrate 2002 is an electrode of a capacitor, but is not electrically connected to the opposing electrode 2002-4. The side wall 2002-3 is connected to the other opposite side wall 2002-2 with the through groove V therebetween. Although not clearly understood in the perspective view 6, the through groove V1 has a side wall 2002-3, a side wall connected to the side wall 2002, a side wall connected to the side wall 2002-2, and a side wall existing on the side thereof (this side wall is a sectional side of the perspective view). And the side wall thereof is connected to the side wall 2002-3, and the through groove V1 is surrounded by these side walls. Since all of these side walls are the conductor substrate 2002, they are naturally electrically connected (in short, they are integrated). The outside of these side walls is a space (W1 and W2 are connected and the entire space is W), the conductor substrate is lost, and the upper and lower second substrates 2006 and third substrate 2004 are used. It is supported. The third substrate 2004 and the second substrate 2006 and their side walls are not electrically connected. The second substrate 2006 and the third substrate 2004 are not necessarily insulating substrates, but are not electrically connected to the conductor substrate 2002. That is, when the second substrate 2006 and the third substrate 2004 are conductor substrates or semiconductor substrates, it is necessary to interpose an insulator in a portion to be bonded to the conductor substrate 2002. In order to ensure that the conductor substrate 2002 is not connected to the second substrate 2006 and the third substrate 2004, it is better that the second substrate 2006 and the third substrate 2004 are insulators. For example, if the second substrate 2006 and the third substrate 2004 are transparent glass, quartz, or transparent plastic, they are transparent.

The outer space of the side wall connected to the side walls 2002-3 and 2002-2 is the same as the space of the through grooves W (W1) and W (W2), has the same pressure, and has a pressure transmission hole T (T1). Then, the pressure becomes the same as the pressure P2 on the second surface side. Therefore, like the side wall 2002-3, the other side walls also receive the internal pressures P1 and P2 of the groove V1. Other side walls may be deformed in the same manner as the side wall 2002-3. However, if the deformation is reduced, the strength and reliability of the capacitive element can be improved, and the deformation affects the characteristics of the capacitive element. Should be smaller. Therefore, it is formed so as to be thicker than the side wall constituting the capacitor element. However, if the thickness of the side wall connected to the side of the side wall 2002-3 is too thick, the area of the end portion of the electrode increases. This portion is a portion that is considerably thick when viewed in the thickness direction of the electrode, and is a portion that hardly deforms. Therefore, it is not necessary to increase the area. For example, the thickness of the side wall connected to the side of the side wall 2002-3 is preferably slightly thicker than the side wall 2002-3. In addition, since this portion is a corner portion, defects, distortion, and residual stress at the time of etching are likely to remain. On the other hand, the side wall 2002-2 facing the side wall 2002-3 may be quite thick. The thickness of the side wall 2002-2 (here, it is better to say the width in order to distinguish from the substrate thickness) is increased to increase the adhesive strength between the capacitive element and the second substrate and the third substrate. You can also. However, if the thickness is too large, the size of the sensor increases. Therefore, it is preferable to determine the thickness in consideration of the overall balance.

A contact hole 2008 (2008-1) is formed in the second substrate 2006 bonded to the side wall 2002-2 of the capacitor element, a conductor film 2010 is stacked on the second substrate 2006, and the contact hole 2008-1 is formed. The electrode / wiring 2010 (2010-1) is patterned and formed so as to cover it. This electrode / wiring 2010 (2010-1) is connected to another electrostatic capacitance element or an external element (for example, IC, transistor, resistor, inductor, capacitor, etc.).

The same applies to the side wall electrode 2002-4. The through-groove V2 is surrounded by the side wall on the lateral side connected to the side wall electrode 2002-4 and the side wall 2002-5 connected thereto. Further, since the upper surface (first surface) is closed by the second substrate 2006 and the lower surface (second surface) is closed by the third substrate 2004, the through groove V2 is a completely closed space. However, when the pressure transmission hole S2 is opened in the second substrate 2006, the pressure P1 on the second surface side, that is, the outside of the second substrate 2006 is transmitted from the pressure transmission hole S2 to the inside of the through groove V2. Then, the pressure P1 is applied to the inner wall 2002-4 of the through groove. Accordingly, the side wall 2002-4 is deformed due to the differential pressure between the internal pressure P2 of the through groove W1 and the internal pressure P1 of the through groove V2, and as a result, the inter-electrode distance d between the electrodes 2002-3 and 2002-4 changes, thereby The capacitance due to 2002-3 and 2002-4 changes. Since the side wall electrode 2002-5 and the side wall 2002-4 are integrated, they are electrically connected. A contact hole 2008 (2008-2) is opened in the second substrate 2006 attached to the side wall 2002-5, and an electrode / wiring 2010 (2010-2) is formed there. Capacitance can be detected from these two electrodes 2010-1 and 2010-2. The through groove V2 is isolated by side walls such as the side wall electrode 2002-4 and the side wall 2002-5, and the side wall electrode 2002-4, the side wall 2002-5 and the like surrounding the through groove V2 are not formed on the other conductor substrate 2002. Not connected. That is, the side wall conductor substrate 2002 including the side wall electrode 2002-4, the side wall 2002-5, and the like is surrounded by the space W including the through grooves W1 and W3. Accordingly, the through groove W (W1, W2, W3) is one connected space. In FIG. 6, the pressure transmission holes T (T2, T3) are also formed in W2 and W3. However, if the pressure is quickly transmitted to the through grooves W (W1, W2, W3), the pressure transmission hole is 1 Any one is fine.

The pressure transmission holes T (T1, T2, T3) are only in one part of the third substrate 2004, and most of them are continuous. (It should be noted that the pressure transmission hole T may be made large if there is no problem in terms of contamination and strength.) The pressure transmission hole S (S1, S2) is a very small part of the second substrate 2006. Most of them are continuous. (It should be noted that the pressure transmission hole S may be opened large if there is no problem in terms of contamination and strength.) The conductor substrate 2002 is separated everywhere, but its upper and lower surfaces are Since they are firmly attached to the second substrate 2006 and the third substrate 2004, they are not separated even if a large pressure difference occurs. In the case of the second substrate 2006, since one capacitive element (capacitor) is formed by 2006-1 to 5, it can be considered as a single mounting unit. That is, one capacitance type pressure sensor (detection element). One side wall electrode 2002-3 for detecting the capacitance of the through groove W1, a conductor side wall (such as 2002-2) integrated therewith, and another side wall electrode 2002 for detecting the capacitance of the through groove W1. -4 and the conductor side wall (2002-5 etc.) integrated therewith are surrounded by the through groove W, and this through groove W is surrounded by the outer conductor side wall 2002 (2002-1, 2002-6 etc.). It is. Accordingly, the through groove W is a closed space in which the upper surface is closed by the second substrate 2006 and the lower surface is closed by the third substrate 2004, and is not connected to the external environment other than the pressure transmission holes T (T1 to T3). Yes.

When forming the through grooves (V1 and V2, or W1, W2, and W3) of the conductive substrate 2002, if the through grooves V3 and V4 are formed so as to surround this capacitive element, the conductive substrate 2002 will have 1 of these. Each capacitive element is separated. Even in this case, the conductor substrate 2002 is firmly attached to the second substrate 2006 or the third substrate 2004, so that the process processing can be performed as an integrated (single) substrate without being separated. Is possible. The outer side wall of one capacitive pressure sensor package is 2002-1 or 2002-6 or a conductor side wall connected thereto. (2002-7 and 2002-8 are the outer side walls of the adjacent sensor package.) The inner side of these side walls is a through groove space W, and the actual capacitive element is arranged surrounded by the through groove space W. Yes. The outermost outer side wall can be selected in consideration of the strength of the sensor package, and the thickness of the conductor side wall connected to 2002-1 and 2002-6 can be selected at once in the substrate. Can be created in large quantities. Moreover, since an LSI process or LSI technology can be used, it can be created with high accuracy.

Further, when the pressure transmission holes S (S1, S2) are formed in the second substrate 2006, if the openings S3 and S4 are opened so as to surround each of these capacitive elements, the second substrate 2006 can be used for these. Each capacitive element is separated. Alternatively, when the pressure transmission holes T (T1 to T3) are formed in the third substrate 2004, the third substrate 2004 has openings corresponding to the openings T4 and T5 so as to surround each of the capacitive elements. In the third substrate 2004, each of these capacitive elements is separated. By these processes, the adhered substrates 2002, 2004 and 2006 are in a state where a considerable part of each capacitive element is divided in the thickness direction of the substrate. Therefore, in order to finally form each capacitive element, that is, a pressure sensor (detection element) package, V3 and V4 corresponding to dicing lines in the second substrate 2006 or the third substrate 2004 which are not separated substrates. Dicing or the like may be performed along the line. Therefore, the load on dicing is reduced, and since a considerable portion of the dicing line has already been dug, very accurate dicing can be performed, and the dicing line width can be made narrower than usual. Further, since the thickness of the substrate to be diced is reduced, defects due to chipping, chipping and the like are greatly reduced, and the dicing yield is improved.

A large number of such capacitive elements can be formed in the conductor substrate (wafer) 2002. Moreover, since this capacitive element can be made into a single package (mounting form) by itself, a large number of pressure sensors (detecting elements) can be produced from one conductive substrate (wafer) 2002. Moreover, since the material used is small and the process is very simple and easy, the running cost is very low.

The recesses, through-holes (grooves), or grooves of the present invention described heretofore and hereinafter will be described with reference to the substrate surface (the substrate surface is the upper surface (also referred to as the first surface or the front surface) and / or the lower surface (the second surface, the back surface). The upper surface and the lower surface are usually parallel to each other). Optimally literally vertical. However, since the recesses and the like are formed by a photolithographic method + etching method, imprinting method, or the like, there are cases where they are not completely vertical (90 degrees). In particular, when the side surface is viewed microscopically, there may be fine unevenness (occurred by etching or the like), and in fact, the vertical pattern may not be accurately formed. In the present invention, the term “perpendicular” means that the vertical pattern is intended to be manufactured, and in fact it is regarded as vertical even if it is not a complete vertical pattern. Therefore, the recess, the through hole (groove), or the groove of the present invention has an inclination with respect to the substrate surface of 20 degrees or less, preferably 10 degrees or less, more preferably 5 degrees or less, and even more preferably 1 degree or less. Even more preferably, it is desirable to be 0.5 degrees or less, and optimally 0.1 degrees or less.

Next, an example of the process of this embodiment will be described in detail. FIG. 7 is a process diagram illustrating the manufacturing process of the present embodiment. As shown in FIG. 7A, the third substrate of the composite substrate (or a bonded substrate or a bonded substrate) in which the third substrate 2004 is attached to the conductor substrate 2002 is not attached. An insulating film 2014 is formed on the other surface (referred to as an upper surface or a first surface). The conductor substrate 2002 is better because a low-resistance silicon semiconductor substrate (N + silicon substrate or P + silicon substrate) containing high-concentration impurities is easy to handle and easy to etch, but other conductor substrates may be used. Metal substrates and other conductor substrates can also be used. The third substrate 2004 is better made of a transparent insulating substrate such as a glass substrate, a quartz substrate, or a transparent plastic, but may be an insulating substrate such as a polymer material substrate such as a ceramic substrate or a plastic substrate. (It does not have to be a transparent substrate.) Alternatively, a conductor substrate or a semiconductor substrate covered with an insulating film can be used. In short, the third substrate 2004 may not be directly conductive with the conductor substrate 2002 and may be insulated. The adhesion between the conductor substrate 2002 and the third substrate may be performed using an adhesive layer. Of course, this adhesive layer is an insulator. Otherwise, electrical conduction is established between the conductors separated through the adhesive layer.

If the bonding surfaces of the conductor substrate 2002 and the third substrate are cleaned, the conductor substrate 2002 and the third substrate 2004 can be firmly bonded without using an adhesive layer by using a room temperature bonding method, thermal bonding, or the like. it can. In addition, the conductor substrate 2002 and the third substrate 2004 can be firmly bonded to each other by increasing the temperature to some extent by a diffusion method or a melting method. When the conductive substrate is a silicon substrate (N + substrate or P + substrate) and the third substrate is a glass substrate, the conductive substrate 2002 and the third substrate 2004 can be firmly bonded by an anodic bonding method. it can. When the adhesive layer is used, various insulating adhesives such as an epoxy-based organic adhesive and an inorganic adhesive can be used. In the process of the present invention, various heat treatments are performed, and thermal distortion occurs in order to ensure reliability after the product is completed. Therefore, the thermal expansion coefficients of the conductor substrate 2002 and the third substrate 2004 are approximate. Material is preferred.

The insulating film 2014 is an insulating film such as a silicon oxide film, a silicon nitride film, or an organic film. After the conductor substrate 2002 and the third substrate 2004 are attached, a heat treatment at a too high temperature (about 400 ° C. to 500 ° C. The above method is not preferable in terms of thermal distortion, contamination, and alteration, and therefore, the CVD method, the PVD method, or the coating method is preferable. When using a high-temperature heat treatment such as an oxidation method, it is preferable to perform the heat treatment before attaching the conductor substrate 2002 and the third substrate 2004.

Next, as shown in FIG. 7B, a photosensitive film 2016 is formed on the insulating film 2014 and patterned into a desired shape, and a photosensitive film pattern 2016 (2016-1, 2, 3, 4, 5, , 6). Next, as shown in FIG. 7C, the insulating film 2014 is etched using this pattern, and the conductor substrate 2002 is further etched. The etched portions become through grooves W (W1, W2, W3) and V (V1, V2) shown in the perspective view of FIG. Since the thickness a1 of the conductor substrate is one side of the diaphragm, it is considerably thick and is usually about 100 μm or more. (Although it may be made thinner, the amount of change due to the pressure difference is small.) If it is too thick, the amount of variation in etching and the amount of side etching and overetching become large. It is good to decide. Usually, it is about 2.0 mm or less, preferably about 1.0 mm or less. Since the photosensitive pattern 2016 is also etched to some extent when the insulating film 2014 is etched, it is preferable that the etching selectivity of the photosensitive film 2016 with respect to the insulating film 2014 is high. The insulating film 2014 is used when the adhesion between the photosensitive film 2016 and the conductor film 2002 is not very good, or when the patterning light is greatly reflected from the conductor film and the patterning accuracy is poor. When there is no problem, the photosensitive film 2016 may be formed directly on the conductor film 2002 without forming the insulating film. The thickness a3 of the insulating film 2014 is about 0.5 μm or less for the above purpose. However, when the etching selectivity between the photosensitive film 2016 and the conductor film 2002 is not sufficient, the insulating film 2014 and the conductive film 2014 are electrically conductive. When the etching selectivity with respect to the body substrate 2002 is larger than the etching selectivity between the photosensitive film 2016 and the conductor film 2002, or when the side etching amount is smaller when the insulating film 2014 is interposed, the etching selectivity is about 0.5 μm or more. An insulating film having a thickness may be stacked as appropriate.

In FIG. 7 (c), the purpose is to form a deep through-groove of a conductive substrate with high accuracy in accordance with the photosensitive pattern, and therefore a method meeting this purpose is appropriately selected. If a1 is about 100 μm and the etching selectivity between the photosensitive film 2016 and the conductor substrate 2002 is 20, the thickness a4 of the photosensitive film is made thicker than about 5 μm. If a1 is thinner than this or if the selection ratio is large, a4 may be made thinner. Conversely, if a1 is thicker or the selection ratio is smaller, a4 must be thicker. However, when the insulating film 2014 is formed, the thickness of the insulating film 2014 is also taken into consideration. In order to form the pattern as accurately as possible, the pattern of the photosensitive film 2016 is made as vertical as possible, and the etching of the insulating film 2014 and the conductor substrate 2002 using the pattern is made as vertical as possible. Since the pattern of the photosensitive film 2016 is determined by the pattern of the exposure mask, this accuracy is also important.

As can be seen from the perspective view of FIG. 6, the important point of the present invention is to form the thickness of the side wall electrodes 2002-3 and 2002-4 forming the capacitive element as accurately as possible without variation. This thickness is about 1 μm to about 20 μm. The pattern for forming the side wall electrodes 2002-3 and 2002-4 is the pattern 2016-3 and 2016-4 in FIG. 7C. This pattern width is about 1 μm to about 20 μm. Other portions may be wider and the variation in shape (width) may be larger, so only this portion needs attention and improves patterning accuracy. In order to form a conductive electrode pattern (side wall) having a width (wall thickness) of about 3 μm, the widths of the photosensitive films 2016-3 and 2016-4 are set to about 3 μm and the thickness a4 is set to about 5 μm. Deep through-grooves V and W are formed using very small anisotropic etching (for example, deep etching (DRIE) such as Bosch method).

In this embodiment, the conductor substrate 2002 is completely etched in the depth direction (thickness a1 direction). Since the etching rate varies to some extent both in the substrate depth direction and in the substrate surface, a certain degree of overetching is required to completely etch the conductive substrate 2002 in the depth direction. If the selection ratio of the etching rates of the conductor substrate 2002 and the third substrate 2004 is small, the third substrate 2004 is also etched to some extent depending on the location. However, since the third substrate 2004 is made of a material different from that of the conductor substrate 2002, the third substrate 2004 is almost completely etched if the conductor film 2002 is etched under an etching condition with a large etching selectivity between the conductor film 2002 and the third substrate 2004. The conductor film 2002 can be etched without etching. For example, when an N + silicon substrate having a thickness of 300 μm (a1 = 300 μm) is used as the conductor substrate 2002 and a glass substrate having a thickness of 50 μm (a2 = 50 μm) is used as the third substrate 2004, 1 μm ( a3 = 1 μm) silicon oxide film (SiO 2 film), photosensitive film (photoresist film) is 10 μm thick (a4 = 10 μm), and the width of the photosensitive film is 5 μm patterned to form the Bosch method, cryo method, ULVAC A desired side wall (width of about 5 μm, depth of 300 μm, depth of 600 μm) can be formed by using deep etching (DRIE) such as a method. As the etching gas, fluorine-based gas (CF4, C2F6, C3F8, CHF3, SF6, etc.), chlorine-based gas (CCl4, etc.), or the like is used.

Next, as shown in FIG. 7D, after the photosensitive film 2016 and the insulating film 2014 are removed, the second substrate 2006 is attached to the conductor substrate 2002. Also in this attachment, the second substrate may be directly bonded to the conductor substrate 2002, or may be bonded via an adhesive layer. When the second substrate is a glass substrate, an anodic bonding method can also be used. In addition, the insulating film 2014 may be left if it is not necessary to be removed, or the second substrate may be bonded to the conductor substrate 2002 after a new insulating film is formed. In particular, when there is a possibility that the conductor substrate in the through groove is exposed to cause a malfunction (contamination, deterioration, etc.), an insulating film or the like may be laminated inside the groove as a protective film. In this second substrate bonding step, the through grooves V (V1, V2) and W (W1, W2, W3) are sealed, so that the pressure transmission holes (S, T) must be formed in the subsequent steps. The product is produced in a sealed state and the pressure is maintained. Therefore, the process pressure state in the step of FIG. 7D is maintained. There may be a case where outgas or reaction gas is generated inside the through groove sealed after bonding, and the pressure fluctuates. In order to prevent this, a substance that adsorbs these gases may be placed inside the through groove in advance. After the second substrate 2006 is attached to the conductor substrate 2002, the second substrate can be thinned by an etching method or a polishing method. There is an advantage that it is easier to handle than the process of attaching a thin second substrate from the beginning (attaching a thin second substrate to another substrate to a conductive substrate).

Next, as shown in FIG. 7 (e), contact is made with a portion (2002-2 or 2002-5) to be connected to the conductor substrate 2002 at a portion where the conductor substrate 2002 and the second substrate 2006 are bonded. Holes 2008 (2008-1, 2008-2) are formed. The contact hole can be formed in the conductor substrate 2002-3 or 2002-4, but since the width of this part is narrow, it is preferable to form it in a wider part (2002-2 or 2002-5). . Since this region is a considerably wide region, a contact hole having a sufficient size can be formed. For example, if the depth (length) of the through groove is about 400 μm, the length is about 400 μm and the size in the width direction depends on the size of the pressure sensor. From the balance with the length of the through-groove, at least about 100 μm can be taken (of course, a smaller package can be used, or a smaller package can be used). Although the thickness of the second substrate 2006 is considerably thick (about 50 μm is desired from the strength of the pressure sensor package, of course, it can be made thinner if there is no need to increase the strength so much), but the region of 2002-2 and 2002-5 If the thickness is about 100 μm, the contact size can be made 50 μm or more, so the aspect ratio of the contact hole can be about 1. If the contact is large, wet etching is possible. For example, etching with an HF-based solution such as a buffered hydrofluoric acid aqueous solution (HF solution + NH 4 F solution) or an HF aqueous solution is also possible.

The second substrate 2006 is preferably an insulator. When the contact hole 2008 is formed in the conductor substrate whose surface is covered with the insulating film, the conductor is exposed in the contact hole 2008, so that the insulating film is laminated again and the process becomes complicated. As described above, the thickness of the second substrate 2006 is determined from the strength or the like of the pressure sensor package, and the conductor substrate 2002-2 or 2002 in which the contact hole is arranged based on the adhesion strength between the size of the pressure sensor package and the conductor substrate or the like. The size of −5 is determined, and then the size of the contact hole 2008 is determined. From the viewpoint of easy formation of the conductor films 2009 and 2010 and connection with the conductor substrate, it is preferable that the size of the contact hole is wide. However, it is preferable to determine the size of the contact hole in consideration of the fact that the electrode 2010 is larger than the contact size and that the size is such that no trouble occurs in terms of connection to the outside. In order to improve the coverage (step coverage) of the contact holes 2008 of the conductor films 2009 and 2010, in the case of the PVD method or the CVD method, it is better to taper the contact holes from the viewpoint of step coverage. For this purpose, isotropic etching can be used by dry etching or wet etching. In order to form the taper, the contact formation region needs a certain amount of region, but since the contact formation region 2002-5 in this embodiment is relatively wide, the contact hole can be tapered.

A contact hole 2008 is formed in the second substrate 2006 in advance (a pressure transmission hole can be formed at the same time), and the second substrate 2006 with the contact hole (+ pressure transmission hole) is used as a conductor substrate. It may be attached to 2002. Since the process of forming the second substrate 2006 with the contact hole (+ pressure transmission hole) can be performed in parallel with the capacitor element forming process of the present invention, the work process can be simplified and the work time can be shortened. realizable. Since the step of forming the contact hole (+ pressure transmission hole) in the second substrate 2006 before adhering to the conductor substrate 2002 is performed separately from the conductor substrate 2002 as an actual device, it is a relatively rough step. In addition, it is possible to reduce the cost increase due to the occurrence of defects in that defective products are not brought into the main process when forming contact holes. For example, when the contact hole is wet-etched, it is immersed in an HF-based solution or the like, so when the photosensitive film is poorly adhered, the HF-based solution enters from that portion and affects the entire product. If the process is performed by dividing only two substrates, the damage can be minimized. Since the second substrate 2006 has a pattern of contact holes (+ pressure transmission holes), a certain degree of accurate alignment is required in the adhesion process with the conductor substrate 2002. That is, it is necessary to align the contact hole 2008 in the region of the conductor substrate 2002-5 and the pressure transmission hole S in the region of the through groove V.

Next, as shown in FIG. 7F, a conductor film 2009 (2009-1, 2009-2) is stacked in the contact hole 2008 (2008-1, 2008-2). It is also possible to flatten the contact hole by laminating a conductor film only on the contact hole. For example, a metal film (for example, W) may be selectively grown in the contact hole by a selective CVD method, or only the contact hole may be plated by a plating method. Alternatively, a method of laminating a conductor film on the second substrate 2006 and leaving the conductor film 2009 only in the contact hole 2008 by an etch back method can also be employed. There is also a method in which a conductive paste is coated by a squeegee method or a screen printing method, and the conductive paste is embedded in the contact hole. Alternatively, the mask can be brought into close contact with the second substrate 2006 and the conductive paste can be embedded in the contact hole 2008 by a squeegee method or a screen printing method. A conductive paste (for example, a solder paste) is buried in the contact hole 2008 and formed thick, and the electrode / wiring 2010 can be formed simultaneously by a subsequent heat treatment.

Next, a conductor film 2010 is laminated to cover the contact hole 2008, and a desired wiring is performed to form an electrode / wiring pattern 2010 (2010-1, 2010-2). The conductor films 2009 and 2010 are connected through a contact hole 2008. The conductor film 2010 is made of a metal film such as aluminum (Al), titanium (Ti), chromium (Cr), tungsten (W), copper (Cu), platinum (Pt), tin (Sn), gold (Au), etc. These metal alloy films, silicide films, conductive polycrystalline silicon films, conductive plastics, and various conductor films can be used. Further, a plurality of these conductor films may be appropriately selected and laminated. As a method for forming the conductor film, there are a PVD method such as sputtering and a CVD method. Alternatively, it can be formed by a plating method. Since the contact hole can be made relatively large, the conductor film 2010 can also be directly laminated on the contact hole 2008 without the conductor film 2009 being laminated on the contact hole 2008, so that the electrode / wiring pattern 2010 (2010-1, 2010- 2) may be formed. This can simplify the process. The same applies to the lamination of the conductor film 2009. However, when the conductor film 2010 is laminated directly in the contact hole 2008, an impurity layer (for example, oxide layer) remaining on the conductor substrate 2002 exposed in the contact hole is used. In addition, it is necessary to stack the conductor film 2010 after removing the other foreign matter). For example, before laminating a metal film or the like by PVD or CVD, the impurity layer is removed by pretreatment with an HF-based solution or the like. In the case of a PVD method such as a sputter, a metal film or the like can be laminated after reverse sputtering. In the case of the CVD method, a metal film or the like can be laminated after lightly etching using an etching gas such as CF. When using the copper plating method, the seed layer is formed by laminating refractory metals such as Ti and Ta, conductive nitrides such as TiN and TaN, or laminated films of these as barrier metals by CVD or PVD. A Cu film is laminated and a Cu plating layer is formed by electrolytic plating. Thereafter, electrode / wiring patterns 2010 (2010-1 and 2010-2) are formed while leaving a necessary metal layer. Alternatively, before the electrolytic plating of Cu, cover the part other than the part where the electrode / wiring should be formed with a photosensitive film, etc., form the Cu plating layer only on the part where the electrode / wiring should be formed, and then remove the photosensitive film The seed layer and the barrier metal that are not plated with Cu are etched to form the electrode / wiring pattern 2010 of the Cu plated layer.

Further, bump metal (solder, gold, copper, other metals or alloys) can be formed on this portion. The through-groove V1 is surrounded by the side walls 2002-3 and 2002-2 and the side walls connecting these side walls (not shown, but present on the front side and the rear side with respect to the paper surface). -2 and 2002-3 are continuous bodies. Accordingly, the electrode / wiring 2010-1 is directly connected to the side wall 2002-3. On the other hand, the sidewall conductor substrate 2002-4, which is the other electrode facing the sidewall 2002-3, is also present on both sides of the sidewall conductor substrate (not shown, but on the front and rear sides). ) To the thick sidewall conductor substrate 2002-5, and the electrode / wiring 2010-2 is directly connected to the sidewall 2002-4.

Next, as shown in FIG. 7 (g), with respect to the through groove W1 indicating the capacity, a pressure transmission hole T (T1) is formed in the third substrate 2004, and the through grooves V1 and V2 opposed thereto are formed. Forms a pressure transmission hole S (S1, S2) in the second substrate 2006. (These pressure transmission holes may be formed on substrates opposite to each other.) The space of the through groove W (W1) is a conductor side wall substrate (2002-2 and 2002) surrounding the through grooves V1 and V2. 3 or 2002-4 and 2002-5), and the through groove W (W1) is connected to W (W2) and W (W3), so that the pressure transmission hole T (T1) is not necessarily The portion W (W1) may not be present, and the portion W2 or W3 may be employed. If the external pressure is guided through the pressure transmission hole, the side walls 2002-3 and 2002-4 between the through grooves V1, V2, and W1 are deformed by the pressure difference, and the capacitance between these electrodes changes. -1 and 2010-2 can detect capacitance changes.

6, 7, and 8, since the thickness of the conductor substrate 2002 determines one side of the electrode area of the capacitor element, the capacitor element is not affected by variations in the etching amount of the conductor substrate 2002. is there. That is, if the thickness of the conductor substrate 2002 is a1 (described in FIG. 7C) and the length of the depth side through grooves V (V1, V2) is b1 (described in FIG. 8A), The electrode area of the capacitive element is a1 * b1. Since b1 also hardly changes in the vertical etching, the variation in the electrode area of the capacitive element becomes very small. Accordingly, variations in the characteristics of the capacitive elements within the conductor substrate and between the conductor substrates are very stable, and a product with a high yield can be realized.

In the process of FIG. 7C, the conductor patterns formed by the patterns of the photosensitive films 2016-3 and 2016-4 are very long in the lengths of 2002-3 and 2002-4 with respect to the width. (The depth direction perpendicular to the paper surface is long.) For example, a width of about 1 μm to about 20 μm (if the etching accuracy is good, a conductor pattern narrower than 1 μm can be formed, and a conductor with a small Young's modulus can be formed. In case of detecting a pressure having a large pressure difference, a conductor pattern thicker than 20 μm may be used.) About 50 μm to about 500 μm in height (a conductor substrate thinner than about 50 μm is careful in handling the conductor substrate). If the etching method and conditions are optimized, a substrate thicker than about 500 μm can be used.) Therefore, considering the fact that etching is difficult and that there is a risk that the vertically long side walls 2002-3 and 2002-4 will not be deformed during or after etching, the process shown in FIG. 9 can be taken. . (Note that when the pattern width is about 3 μm and the aspect ratio is 50 or more, the above-mentioned problem may occur. Even in this case, a third apparatus is used under a low pressure condition in which wind is not generated using a device with small vibration. If the second substrate 2006 is slowly adhered from the lower side with the substrate 2004 facing up, the above problem can be prevented from occurring.) FIG. 9A shows the process in FIG. Although it is the same, the narrow patterns of the photosensitive patterns 2016-3 and 2016-4 are combined into a thick pattern 2016-7. In this portion, the through groove W1 is formed, but not yet formed at this stage. Since the pattern width of 2016-7 is the width of 2016-3 + the width of 2016-4 + the width of W1, it is quite wide. For example, if the width of 2016-3 is 5 μm, the width of 2016-4 is 5 μm, and the width of W1 is 50 μm, the pattern width of 2016-7 is 60 μm.

Next, as shown in FIG. 9B, the insulating film 2014 and the conductor film 2002 are vertically etched using the pattern of the photosensitive film 2016 as a mask. Since the long and narrow vertical pattern as shown in FIG. 7 (c) disappeared, the above problems were solved. For example, if the width of 2016-3 is 3 μm, the width of 2016-4 is 3 μm, and the width of W1 is 50 μm, the pattern width of the photosensitive film 2016-7 is 56 μm, and the thickness of the conductor substrate is 300 μm. The pattern width of the conductive substrate 202-7 after the etching is about 56 μm (the aspect ratio is about 5.4), and the pattern 2002 (2002-1, 2002-2, 2002-5, 2002-6) of the other conductive substrate is obtained. ) And the above problems have been resolved. Next, the photosensitive film 2016 and the insulating film 2014 are removed. (The insulating film 2014 may be left as long as there is no problem. Alternatively, the photosensitive film 2016 can be patterned directly on the conductor substrate 2002 with good adhesion, and if there is no problem in etching the conductor substrate 2002, the insulating film 2014 is formed. No need.)

Next, as shown in FIG. 9C, the second substrate 2018 is attached to the first surface side of the conductor substrate 2002. The second substrate 2018 is not electrically connected to the conductor substrate 2002. Since the contact hole is also formed, the second substrate 2018 is preferably an insulator. For example, a transparent insulator such as a glass substrate, a quartz substrate, or a transparent plastic can be easily observed inside, but an opaque insulator such as a ceramic or a polymer material may be used. In the case where the conductive substrate 2002 is a silicon substrate and the insulating substrate 2018 is a glass substrate, the conductive substrate 2002 and the insulating substrate 2018 can be firmly bonded using an anodic bonding method. Further, for bonding the conductor substrate 2002 and the insulating substrate 2018, a direct bonding method or an adhesive layer can be used. As these bonding methods, the best method can be selected as appropriate in consideration of the materials, shapes, processes, and the like of the conductor substrate 2002 and the insulating substrate 2018. Since the conductor substrate 2002 by this method does not have an elongated pattern such as 2002-3 and 2002-4 in FIG. 7, it is easy to bond the second substrate 2018 to the conductor substrate 2002. The pattern width becomes narrower, for example, the pattern width of the conductive substrate 202-7 after etching is about 16 μm (when the width of 2016-3 is 3 μm, the width of 2016-4 is 3 μm, and the width of W1 is 10 μm) However, when the thickness a1 of the conductive substrate 2002 is about 300 μm (aspect ratio is about 18.8), the conductive substrate (for example, a silicon substrate) is formed. ) 2002-7 can be attached to the second substrate 2018 without any problem without changing its shape.

Next, as shown in FIG. 9D, a photosensitive film 2020 is formed on the third substrate 2004 (on the second surface side) and patterned, and a window 2022 for forming the through groove W1 is opened. First, the third substrate 2004 is opened vertically from this window. Next, as shown in FIG. 9E, the conductor substrate 2002 is vertically etched from the window 2022 opened in the 2004 and is etched until reaching the second substrate 2018, thereby forming the through groove W1. In the through groove W1, it is desirable to etch completely so as not to leave the conductor material at the bottom. The alignment of the photosensitive film 2002 needs to be accurately performed with the through grooves V1 and V2. If the third substrate 2004 is a transparent substrate, mask alignment can be performed directly from the second surface side, so alignment can be performed with very high accuracy.

If there is a problem with transmission or reflection of light or electromagnetic waves even with a transparent substrate, the third substrate 2004 may be thinned before the photosensitive film 2020 is formed. As a method for thinning the third substrate 2004, there are a polishing method (CMP or BG method), an etching method, and various other methods. If the third substrate 2004 is thinned, light and electromagnetic waves are irradiated from the first surface side, and light and electromagnetic waves transmitted through the thinned third substrate are used to sensitize to the patterns of the through grooves V1 and V2. The pattern of the conductive film 2020 can be accurately performed. By using such a method, for example, the alignment accuracy of the photosensitive film 2020 is about 0.1 μm to about 0.5 μm, or about 0.5 μm to about 1 with respect to the pattern of the through grooves V1 and V2, for example. Since the thickness can be about 0.0 μm to about 2.0 μm, the thickness (width direction) of the sidewalls 2002-3 and 2002-4 of the conductor substrate after etching can be made extremely thin. Even the current method can be about 2 μm, so it can be made thinner in the future. A further advantage of this method is that the conductive substrate 2002 is securely bonded and pressed by the second substrate 2018 and the third substrate 2004 before forming the sidewalls 2002-3 and 2002-4 of the elongated conductive substrate. Even after the etching, there is no risk that the elongated patterns 2002-3 and 2002-4 are deformed, and the worst case is that they fall or be broken. Although the number of mask processes increases by one and the number of etching processes increases, the process stability can be improved.

Next, as shown in FIG. 9F, the photosensitive film 2020 is removed. Although it can be used as a capacitive element (pressure sensor) package as it is, the fourth substrate 2024 may be further bonded on the third substrate 2004. In particular, it is indispensable when it is desired to close the through groove W1, and even when the third substrate is thinned to reduce the strength, the strength can be increased by bonding the fourth substrate 2024. The fourth substrate does not need to be an insulator and can be a semiconductor substrate or a conductor substrate. The through grooves W2 and W3 are formed at the same time as the through grooves V1 and V2 in FIG. 9 because the side walls on both sides thereof are wide, but may be formed at the same time as the through grooves W1. The alignment of W2 and W3 need not be as accurate as the alignment of W1. (However, when a large number of through-grooves such as W1 are formed, it is natural that the adjacent V1 and V2 need to be accurately aligned.) After that, FIG. The same process as the process is performed.

FIGS. 8A to 8C schematically show projection views of one capacitive element (pressure sensor) created according to the embodiment shown in FIGS. 6 and 7. FIG. 8B is the same as FIG. 7G and shows a front view. FIG. 8A is a top view (or plan view). FIG. 8B can be considered as a view of the cross section taken along A1-A2 of the plan view as seen from the front. FIG. 8C can be considered as a view of the cross section taken along B1-B2 of the plan view as viewed from the right side. 8A to 8C, the conductor 2002 surrounds the through groove V (V1, V2), and the through groove W (W1, W2, W3) surrounds the conductor 2002. The body substrate 2002 (2002-2, 2002-3) is connected inside, the conductor substrate 2002 (2002-4, 2002-5) is connected inside, the conductor substrate 2002 (2002-2, 2002-3) and the conductive substrate 2002 (2002-4, 2002-5) are not separated and connected, and the conductive substrate 2002 (2002-1, 2002-6) is connected, and the through groove W ( W1, W2, W3) surrounding one, forming one capacitive element package (pressure sensor package), connected to the through grooves V (V1, V2) and W (W1, W2, W3) Each of the pressure transmission holes S (S1, S2) and T (T1) is on the opposite side of the third substrate 2004 or the second substrate 2006, and if a pressure transmission line is connected to these holes, the holes are penetrated. Capacitance element (pressure sensor) package capable of transmitting pressure to grooves V (V1, V2) and W (W1, W2, W3) or applying pressure P1 from the first surface (upper surface) of the capacitive element (pressure sensor) package When the pressure P2 is applied from the second surface (bottom surface), it can be understood that each pressure is transmitted to the inside of the through groove V (V1, V2) or the through groove W (W1, W2, W3). . (It should be noted that the pressure transmission holes S and T may be formed on the same substrate (2004 or 2006), may be formed on opposite substrates, or may be formed on both substrates. The pressure may be appropriately selected depending on whether the pressure is guided to these holes.)

The counter electrodes constituting the capacitive element are 2002-3 and 2002-4. The conductor side wall electrode 2002-3 as the counter electrode is connected to the side wall 2002-7 and the side wall 2002-8, and further to 2002-2. The width (thickness) of the conductor side wall electrode 2002-3 is selected so that it can be deformed by the pressure difference P1-P2. good. For that purpose, it is formed thicker than the conductor side wall electrode 2002-3. For example, when the width (thickness) of the conductor side wall electrode 2002-3 is 3 μm to 10 μm, the thickness is set to three times or more the thickness of the other side wall 2002 (2002-2, 7, 8). When the width (thickness) of the conductor side wall electrode 2002-3 is 10 μm to 20 μm, it is set to be twice or more the thickness of the other side wall 2002 (2002-2, 7, 8). By doing in this way, the intensity | strength of the side wall 2002 (2002-2, 7, 8) surrounding V1 groove | channel is fully securable. In addition, the conductor side wall electrode 2002-3 can be smoothly deformed by the pressure difference. The same applies to the side wall connected to the conductor side wall electrode 2002-4, which is another counter electrode.

The side wall 2002 (2002-1, 6, 8, 9), which is the outer side wall of the capacitive element package, protects the package, and therefore needs to have sufficient strength. Although the width (thickness) is not drawn so large in FIGS. 8A to 8C, it is necessary to sufficiently increase the width (thickness) to withstand external force. In the case of silicon, it should be 50 μm or more in a normal environment, but it is better to make it thicker depending on the usage environment. The same applies to the second substrate 2006 on the upper surface. However, in the case of a glass substrate, it is usually sufficient to have a thickness of about 50 μm or more. The same applies to the third substrate 2004 on the lower surface, but in the case of a glass substrate, it is usually sufficient to have a thickness of about 50 μm or more. In FIG. 8A, the portion surrounded by the outermost dotted line X represents the planar size of one capacitive element (pressure sensor) package. It can be seen that a capacitive element (pressure sensor) package of a very small size can be realized. For example, the thickness of the conductor substrate is 300 μm, the length of the sidewall electrode is 300 μm, the width d of W1 is 20 μm, the width of the conductor connected to the sidewall electrode 2002-3 (A1-A2 direction) is 100 μm, and the sidewall electrode 2002 4, the width (thickness) of the side wall 2002 (2002-1, 6, 9, 10) surrounding the outside is 100 μm, the width (A1-A2 direction) of the conductor connected to 4 is 100 μm, the width of W (W2, W3) is 50 μm. , X and the outer side wall 2002 (2002-1, 6, 9, 10) is 10 μm, the size of one package (the size of X) is the horizontal direction (A1-A2 direction). 0.54 mm, and the vertical direction (B1-B2 direction) is 0.62 mm.

FIG. 8D is a schematic diagram when a capacitive element (pressure sensor) package is mounted on a mounting substrate. (Various types can also be applied to other embodiments.) After the process shown in FIG. 7, the outer frame legs 2030 (2030-1, 2030-2) and the reinforcing legs 2032 (2032-1, Install 2032-2). When the outer frame leg 2030 is attached to the mounting substrate, the capacitive element (pressure sensor) package is lifted and the periphery is a continuous frame in order to confine the pressure in the frame. Therefore, 2030-1 and 2030-2 are continuous. Moreover, the outer frame legs 2030 are securely attached to the mounting substrate so that the inside can be kept airtight (the pressure space U is formed).
The reinforcing legs 2032 are for preventing the capacitive element (pressure sensor) package from being deformed, and are attached to the mounting substrate together with the outer frame legs 2030 to support the capacitive element (pressure sensor) package. Accordingly, the outer frame legs 2030 (2030-1, 2030-2) and the reinforcing legs 2032 (2032-1, 2032-2) are preferably the same in height and attached to the third substrate 2004 at the same time. it can. If a large number of the outer frame legs 2030 and the reinforcing legs 2032 are attached to a separate board and transferred from the separate board to the third board at once, the large number of outer frame legs 2030 and the reinforcing legs 2032 are collectively attached to the third board. Because it can be glued, it can be created very easily and cheaply and quickly. Note that an adhesive layer may be used when the outer frame legs 2030 (2030-1, 2030-2) and the reinforcing legs 2032 (2032-1, 2032-2) are bonded to the third substrate 2004.

Also on the second substrate side, the frame body 2034 (2034-1, 2034-2) is attached to the second substrate 2006, and a lid 2036 is further mounted on the frame body 2034. The frame body 2034 and the lid 2036 The pressure transmission holes S (S1, S2) on the first surface side are covered, and the space Z surrounded by these is the same pressure space as the through grooves V (V1, V2) through the pressure transmission holes S (S1, S2). It becomes. It is necessary to securely bond these so that pressure does not leak from the space Z. The frame body 2034 is also bonded to the second substrate 2006 after the process shown in FIG. Further, a lid 2036 is adhered thereon. Alternatively, the frame 2034 previously attached with the lid 2036 may be bonded to the second substrate 2006. Since many of these can be bonded to the second substrate at a time, they can be created very simply and inexpensively. An adhesive layer may be used when the lid 2036 is bonded onto the frame body 2034. Note that an adhesive layer may also be used when the frame body 2034 (2034-1, 2034-2) is bonded to the second substrate 2006.

If the capacitive elements (pressure sensors) created on the substrate as described above are divided into pieces by dicing or the like, individual capacitive elements (pressure sensors) packages can be obtained. This package is mounted on a mounting substrate 2040 as shown in FIG. The mounting substrate 2040 and the frame 2030 or 2032 of the capacitive element (pressure sensor) package may be attached via an adhesive. In particular, the space U surrounded by the outer frame legs 2030, the third substrate 2004, and the mounting substrate 2040 is connected to the through grooves W (W1, W2, W3) through the pressure transmission holes T (T1) and becomes the same pressure space. It is necessary to securely bond the frame 2030 of the capacitive element (pressure sensor) package so that there is no pressure leakage.

Electrode / wiring layers 2042 (2042-1, 2042-2) are formed on the mounting substrate, and electrodes / wirings 2010 (2010-1, 2010-2) and wires 2044 (2044) of the capacitive element (pressure sensor) package are formed. -1,2044-2) or the like. The electrode / wiring layer 2042 (2042-1, 2042-2) formed on the mounting substrate is connected to an IC, transistor, or other active element, and the pressure is calculated from the capacitance change detected by the capacitive element (pressure sensor) package. It becomes possible to do. The pressure spaces U and Z are connected to various environments and devices having a pressure to be detected, and pressure is guided to the pressure spaces U and Z therefrom. If necessary, the pressure body U can be further provided with a pressure transmission hole in the frame body 2030 and the mounting substrate, and the pressure space Z can be further provided with a pressure transmission hole in the frame body 2034 and the lid 2036. Even if the outer frame legs and the frame as shown in FIG. 8 (d) are not formed, the capacitive element (pressure sensor) package shown in FIGS. 8 (a) to 8 (c) also depends on the measurement environment and measurement object. Needless to say, the pressure can be measured.

FIGS. 10A to 10C show variations of the embodiment of the present invention. 10A is a plan view, FIG. 10B is a view of the A1-A2 cross section in FIG. 10A viewed from the side, and FIG. 10C is a cross section of the B1-B2 side. It is the figure seen from. Reference numeral 5001 indicates only the unit size of the capacitive element (package) of the present invention, and it can be considered as a scribe line. By repeating this process, a large number of capacitive elements of the present invention can be produced in the substrate (wafer). To do. 5002 is a conductor substrate, 5003 is a through-groove (corresponding to W described so far), 5004 is a through-groove that is not connected to the through-groove 5003 in the conductor (corresponding to V described so far), (through-groove). Since 5003 and 5004 are spaces, they may be referred to as through-groove spaces, and 5007 is a contact hole opened in a plate 5009 for connecting a conductive substrate 5002 and a conductive film (electrode / wiring) 5008, This contact hole contains a conductive film (also 5007) and is connected to the conductive film (electrode / wiring) 5008 and the conductor substrate 5002. The conductive film entering the contact hole 5007 is a conductive film (electrode). -Wiring 5008 may also be used (same) as contact hole 5007 and electrode / wiring 5008 pattern of conductor 5002 (5002-1, 50). Needless to say, the contact holes 5007-1 and the electrodes / wirings 5008-1 are not limited to the positions shown in the figure as long as they can contact 2-2). (However, if the area of 5002-2 is narrow, the contact hole can be formed, but if it is too narrow to place the wiring / electrode, the wiring / electrode is extended to a wide area. Just bring it.

Reference numeral 5009 denotes a plate (also referred to as a substrate) attached to the upper surface (first surface) of the conductive substrate, and basically an insulating substrate is preferable. A transparent insulator such as glass, quartz, transparent plastic, transparent polymer (or a composite thereof) is preferable from the viewpoint of the inside being visible and mask alignment. A material that transmits light at the time of mask alignment (including light other than visible light) may be used. Alternatively, a material that can transmit a necessary amount of light at the time of mask alignment may be used. This means that such a material or a material having such a thickness may be used as long as the light intensity can be increased and the amount of light necessary for mask alignment can be secured even if the light transmittance is low. Such a material may be used as long as the thickness of the plate is reduced before mask alignment and the amount of light necessary for mask alignment can be secured.

Reference numeral 5010 denotes a plate (also referred to as a substrate) attached to the lower surface (second surface) of the conductor substrate, and is preferably an insulating substrate. A transparent insulator such as glass, quartz, or a transparent polymer (or a composite thereof) is preferable from the viewpoint of the inside being visible and mask alignment. (It goes without saying that what has been described above is also included. The same applies to what has been described so far and what has been described thereafter. Further, other expressions and contents are also specifically described in this application document.) Even if it is not described, it is natural that similar expressions or simple descriptions can be applied to other expressions or details described elsewhere (those that can be applied without contradiction). In this embodiment, if the plate 5010 is separated at the scribe line 5001 or the through groove space 5003-1, the electrode / wiring 5008-1 and 5008-2 are not connected, so the plate 5010 may be a conductor. . However, since there is a possibility that a conductive material (including moisture and dust) may enter between the separated plates 5010 after mounting, it is necessary to consider a countermeasure. For example, there is a method of covering with a cover in order to introduce pressure into the through groove space 5003-1. This is also applicable to the plate 5009. That is, if the plate 5009 is separated at the scribe line 5001 or the through groove space 5003-1, the plate 5009 may be a conductor. If the plate 5009 is a conductor, contact holes 5007 (5007-1 and 5007-2) and electrodes / wirings 5008 (5008-1 and 5008-2) are not required, and the plate 5009 which is a conductor substrate is directly connected. Just do it. Therefore, in an environment where such a capacitive element (pressure sensor) can be used, it is possible to create a very low cost device. However, since the conductor substrate 5002 must be fixed by the plate 5009 or 5010, neither of them can be a conductor substrate. (There is a method to coat a conductive substrate with an insulator)

In the embodiment shown in FIGS. 10A to 10C, the conductor substrate 5002-2 is a thin diaphragm, and this conductor substrate 5002-2 serves as one electrode of the capacitor. The other counter electrode of the capacitor element is 5002-1, which is a thick electrode and does not serve as a diaphragm. When the pressure P1 of the through groove space 5004 and the pressure P2 of the through groove space 5003-1 are the same, the electrodes 5002-1 and 5002-2 of this capacitive element are parallel plate type capacitive elements having a distance c1. Since the diaphragm is only 5002-2 on one side, the amount of deformation of c1 is smaller than when there are diaphragms on both sides. By adjusting the thickness c2 of the conductor substrate 5002-2 in the width direction, the deformation amount can be adjusted even with the same pressure difference.

In the pressure sensor of the present embodiment, the through-groove spaces 5004 and 5003 are open to the outside (the through-groove space 5004 is open to the left of the page), so that P1 and P2 are the same even if mounted in this state. Because of the pressure, it is necessary to separate the through-groove spaces 5004 and 5003 (particularly 5003-1) at the mounting stage. Of the conductor substrates 5002-2, 5002-3, and 5002-4 surrounding the through-groove 5004, the characteristics of the capacitive element are more stable if the 5002-3 and 5002-4 are not deformed by a pressure difference. Therefore, the thickness in the width direction of the conductor substrates 5002-3 and 5002-4 is made larger than that of the conductor substrate 5002-2. As a result, only 5002-2 is greatly deformed due to the pressure difference.

When the length of the side wall electrode 5002-2 is c3 and the thickness of the conductor substrate is c4, the area of the side wall electrode 5002-2 (diaphragm area) is c3 * c4. The side wall electrode 5002-2 has a rectangular (square or rectangular) shape, and the upper surface is fixed by a plate 5009, the lower surface is fixed by a plate 5010, and the side surfaces are fixed by 5002-3 and 5002-4. In this embodiment, if the through groove 5004 is formed, it can be formed only by dicing. For example, the entire through groove 5003 is not formed (with the conductor substrates 5002-1 and 5002-2 being connected), and the through groove of 5003-1 is formed by dicing (thereby, the conductor substrate 5002- 1 and 5002-2 are separated). When dicing from the upper surface side plate 5009, if the lower surface side plate 5010 side is completely cut, it cannot be used as a capacity. Therefore, only a part of the lower surface side plate 5010 is diced in the depth direction (ideally, the conductive substrate 5002). Only the bottom plate 5010 is not cut). The conductor substrate 5002 is completely diced in the depth direction. Next, the plate 5009, the conductive substrate 5002 below it, and the plate 5010 below it are diced along a line 5001 indicated by a dotted line. Thereby, a capacitive element type pressure sensor can be formed. In this case, the inter-electrode distance c1 (groove width of the through groove 5003-1) is a dicing width at the time of dicing. The width c2 of the diaphragm side wall electrode also depends on the dicing alignment accuracy.

A laser can be used instead of dicing using a cutting blade or a cutting wire. In particular, since the laser can be adjusted to the through groove 5004 with high accuracy in forming the through groove 5003, the thickness c2 of the diaphragm portion can be made with high accuracy. For example, when the conductor substrate 5002 is a silicon substrate, laser dicing can be performed with high accuracy using an Nd: YVO4 laser, a CO2 laser, or the like.

Further, if a laser capable of cutting the conductive substrate 5002 and a laser that cannot cut the plate 5010 is used, the conductive substrate 5002 can be completely separated without substantially removing the plate 5010. For example, when the plate 5009 and the plate 5010 are transparent glass substrates and the conductor substrate 5002 is a silicon substrate (N + or P +), the YAG laser (wavelength λ = 1.064 μm) can transmit the glass and cut silicon efficiently. Can be used to cut the conductor substrate 5002. The alignment with the through groove 5004 may be performed by reading the position information of the through groove 5004 from the plate 5009 or 5010 which is a transparent substrate and scanning with the laser beam based on the position of the through groove 5004. Alternatively, mask alignment may be performed and laser light may be irradiated from a pattern formed on the mask. If the plate on the laser beam irradiation side is removed in advance (this is also possible with a laser, such as an excimer laser or an ultraviolet laser), the substance removed by the laser irradiation can be excluded from there. If it is desired to leave the plate 5009 and / or 5010 above the through-groove 5002-2, the plate 5009 along the dicing line 5001 is removed with a laser (this portion of the plate will eventually be removed and removed). Further, if the conductor substrate 5002 is also removed with a laser beam, a substance (such as silicon gas) cut from the space along the scribe line can be eliminated. When the conductor substrate 5002 along the scribe line is removed, if the plate 5010 is left, it will not be separated into pieces. In addition, the through-groove 5003-1 may be formed by a dry etching method (DRIE method). As described above, this embodiment can produce a pressure sensor by a very simple process.

10 (d) to 10 (e) show a further modified embodiment of what is shown in FIGS. 10 (a) to 10 (c). 10D is a plan view, FIG. 10E is a cross-sectional view taken along A1-A2 in FIG. 10D, and FIG. 10F is a cross-sectional view taken along B1-B2 in FIG. 10D. . As can be seen from FIG. 10D and FIG. 10E, the through groove 5004 is surrounded by the conductor substrate 5002. Accordingly, the through groove space 5004 is a closed space in which the upper side is the plate 5009, the lower side is the plate 5010, and the side surface is surrounded by the conductor substrate 5002 (5002-2, 5002-3, 5002-4, 5002-5). (The embodiment of FIGS. 10A to 10C is opened without the side wall 5002-5 of the conductor substrate.) The pressure when the plate 5009 or the plate 5010 is attached to the conductor substrate 5002 It is trapped at a pressure determined by If a gas adsorbing substance is placed in the through groove, the pressure in the through groove can be reduced to a low pressure close to vacuum.

Alternatively, if a gas generating substance is inserted, the plate 5009 and the plate 5010 are attached to the conductor substrate 5002 and completely sealed, and then a desired pressure can be obtained by discharging the gas from the gas generating substance. For example, when the operating temperature of this pressure sensor is between T1 and T2 (T1 <T2), the solidification temperature (or melting point or solid-liquid phase transition point) of the gas generating substance is T3, the gas generating substance When the boiling point (or liquid phase-gas phase transition point) of T4 is T4 and the sublimation temperature of the gas generating material (sublimation point or solid phase-gas phase transition point) is T5, the solid of T4 <T1 The material is sealed in the through channel in the solid state. Therefore, the temperature (T6) at the time of sealing is T6 <T3. Alternatively, a liquid substance of T4 <T1 is put in a through groove in a liquid state and sealed. Therefore, the temperature (T6) at the time of sealing is T6 <T4. Alternatively, a solid material of T5 <T1 is put in a through groove in a solid state and sealed. Therefore, the temperature (T6) at the time of sealing is T6 <T5. However, it is important that this substance does not react with the substance inside the through groove (in the above example, glass or silicon) particularly in a gaseous state. Since the amount of gas in the solid substance or the liquid substance and the volume of the through groove are known, the pressure inside the through groove can be calculated at a temperature of T1 to T2. Therefore, since the pressure in the through groove can be known, the pressure of the through groove 5003-1 can be known using the pressure. Needless to say, this is applicable to all embodiments of the present invention.

If it is not desired to seal the through groove 5004, that is, when an external pressure is introduced, the pressure transmission hole 5012 may be formed in the plate 5009. The through groove 5012 can be formed simultaneously with the patterning of the pressure transmission hole 5012 when the contact hole 5007 is formed. After that, since a conductive film is formed, it is necessary to consider entering into the pressure transmission hole 5004 and the through groove. Further, when the pressure transmission hole 5012 is formed, the etching gas, the etching solution, and the substance after etching (gas, liquid, or solid) also enter the through groove. Further, there is a risk that a photosensitive film for forming contact holes and pressure transmission holes, a residual film thereof, a developing solution, and the like may enter. If they can cause problems during subsequent processing or use, measures should be taken to remove those materials. For example, if it is a liquid, it may be washed with water and dried. If it is solid, a substance (liquid or gas) that etches it may be added, then washed with water and dried. However, in order not to cause such a problem, there is a method in which the pressure transmission hole 5012 is opened with a laser after forming the electrode / wiring 5008 (5008-1, 5008-2) (after forming a protective film). is there.

Alternatively, a plate 5009 in which the pressure transmission hole 5012 and the contact hole 5007 are formed from the beginning may be attached to the conductor substrate 5002. Even if an adhesive layer is used, the adhesive layer remaining in the pressure transmission hole 5012 and the contact hole 5007 may be removed. In this way, it is only necessary to perform a separate process for making contact holes and pressure transmission holes in the plate, so the process is shortened and the product creation time is shortened. The alignment of the contact hole and the pressure transmission hole does not require much precision, and therefore does not affect the alignment of the conductor substrate 5002 and the plate 5009.

In the embodiment shown in FIGS. 10D to 10F, in the case where the pressure transmission hole 5012 is not manufactured, the pressure conduction hole 5012 is electrically conductive by the differential pressure between the pressure P1 of the through groove 5004 and the pressure P2 of the through groove 5003-1 connected to the outside. The diaphragm 5002-2 on the side wall of the body substrate is deformed. If there is a problem that the periphery of the through groove is exposed on the conductor substrate, it may be protected by laminating a protective film. As the protective film, a material and a thickness may be appropriately selected depending on the environment in which the conductor film is in contact. A silicon nitride film or a silicon oxynitride film is preferable for improving the moisture resistance. 10D to 10F, the pressure transmission hole is formed in the plate 5009, but may be formed in the plate 5010. Contact holes and electrodes / wirings may also be formed in the plate 5010. The plates 5009 and 5010 may be made of the same material. In this case, the plates 5009 and 5010 can be considered upside down.

Note that, in the capacitive element shown in FIGS. 10D to 10F, the through-groove 5003 can be formed by dicing as in the case described with reference to FIGS. 10A to 10C. The groove width c1 of the through groove 5003-1 is determined by dicing. Either plate 5009 or 5010 needs to be left undiced. When dicing only the through-groove 5003 with both of them remaining, it is preferable to dice using a laser having an appropriate wavelength and intensity.

11 (a) to 11 (c) show a conductor substrate side wall 5002-2 having a through groove 5004 inside the conductor 5002 shown in FIGS. A capacitor element facing each other across the through groove 5003-1 is shown. The through-groove 5004 (5004-1) is surrounded by a conductor substrate 5002 (5002-2-1, 5002-3-1, 5002-4-1, 5002-5-1), and the upper surface and the lower surface are respectively It is covered with plates 5009 and 5010 and is a closed space. Further, a pressure transmission hole 5012 (5012-1) is also formed. A mirror symmetric one is arranged with a through groove 5003-1 therebetween. That is, the through groove 5004 (5004-2) is surrounded by the conductor substrate 5002 (5002-2-2, 5002-3-2, 5002-4-2, 5002-5-2), and the upper surface and the lower surface. Are covered with plates 5009 and 5010, respectively, and are closed spaces. Further, a pressure transmission hole 5012 (5012-2) is also formed. The conductive substrate side wall 5002-2-2 faces the conductive substrate side wall 5002-2-1, and the conductive substrate side wall 5002-2-1 and the conductive substrate side wall 5002-2-2 are used as counter electrodes of the capacitive element. Thus, the through groove 5003-1 is a capacity space.

These interelectrode distances c8 are the widths of the through grooves. The conductor substrate side wall 5002-2-1 is deformed by the pressure difference between the pressure P1 of the through groove space 5004-1 and the pressure P2 of the through groove 5003-1. Further, the conductor substrate side wall 5002-2-2 is deformed by the pressure difference between the pressure in the through groove space 5004-2 and the pressure P2 in the through groove 5003-1. If the pressure in the through groove space 5004-1 and the pressure in the through groove space 5004-2 are the same, (for example, the pressure transmission holes 5012 (5012-1 and 5012-2) are opened and then connected to the same pressure environment) Or, if the process is closed at the same time, the pressure in these spaces will be the same. If the pressure in the two through-groove spaces 5004-1 and 5004-2 is P1, when P1> P2, the side walls 5002-2-1 and 5002-2-2 both bulge toward the through-groove 5003-1, and c8 Make it smaller. As a result, the capacity increases. When P1 <P2, the side walls 5002-2-1 and 5002-2-2 are both recessed, so that c8 increases. As a result, the capacity is reduced. Thus, the sensitivity due to the pressure change is improved as compared with the capacitive element on one side as shown in FIG. Note that the side view of the A1-A2 cross section is FIG. 11 (b), and the side view of the B1-B2 cross section is FIG. 11 (c). Contact holes 5007 (5007-1, 5007-2) and electrodes / wirings 5008 (5008-1, 5008-2) are also formed.

11D and 11E are development systems of the embodiment shown in FIGS. 11A to 11C, and a pair of facing capacitive elements shown in FIGS. 11A to 11C are shown. Further, it is surrounded by a closed space (also a through groove) 5003-6 (5003-6-1, 5003-6-2, 5003-6-3, 5003-6-4), and this closed space 5003-6 is electrically conductive. The side surface side is surrounded by the body substrate side wall 5002-6 (5002-6-1, 5002-6-2, 5002-6-3, 5002-6-4). Further, the upper surface of the closed space 5003-6 is closed by a plate 5009, and the lower surface of the closed space 5003-6 is closed by a plate 5010. (The conductor substrate 5002 is attached to the plates 5009 and 5010.) When the pressure in the through groove 5003-6 is controlled from the outside, a pressure transmission hole 5016 is formed. Although it is formed on the plate 5010 in FIGS. 11D and 11E, it can also be formed on the plate 5009. When the pressure P1 is introduced from the pressure transmission hole 5012 (5012-1, 5012-2) formed in the through groove 5004 (5004-1, 5004-2) on the capacitor element side, and the pressure P2 is introduced from the pressure through hole 5016, The diaphragms 5002-2-1 and 5002-3-1 of the capacitive element are deformed, and the pressure difference P1-P2 can be detected. Since the through grooves 5003-6 (5003-6-1, 5003-6-2, 5003-6-3, 5003-6-4) and 5003-1 of the present invention are isolated from the external environment, FIG. Unlike the capacitive elements as shown in a) to (c), the through-groove 5003-6 (5003-6-1, 5003-6-2, 5003-6-3, 5003-6) is different from the external environment. 4) and 5003-1. (Of course, if the capacitive element shown in FIGS. 11A to 11C is put in a pressure vessel or the like, it can be in a state different from the pressure on the outside thereof.) Further, the capacitive element is a conductor substrate 5002-6 (5002). -6-1, 5002-6-2, 5002-6-3, and 5002-6-4), the capacitive element can be isolated from the external environment, so that the reliability can be improved. In addition, FIG.11 (e) is a side view of the cross section along A1-A2 of FIG. (D). Contact holes 5007 (5007-1, 5007-2) and electrodes / wirings 5008 (5008-1, 5008-2) are also formed. The inter-electrode distance c8 of the through groove 5003-1 changes due to the deformation of the conductor electrode side walls 5002-2-1 and 5002-2-2 on both sides thereof.

12 (a) and 12 (b) show an embodiment of the present invention that is a further development of FIGS. 11 (d) and 11 (e). In this embodiment, the capacitive element has a quadrangular shape (refers to the shape of a plan view, which is a three-dimensional prism), and may be a triangular shape, a pentagonal shape, or any other polygonal shape. In this embodiment, all the side surfaces of the conductive substrate forming the rectangular shape function as a diaphragm, that is, the through groove 5022-1 existing at the center. Is surrounded by a conductor substrate side wall 5020-1 (each side wall is 5020-1-1, 5020-1-2, 5020-1-3, 5020-1-4). 2-1, 5022-2-2, 5022-2-3, 5022-2-4), and the through-groove is surrounded by a conductor substrate side wall 5020-2 (each side wall is 5020-2-1, 5020-2). -2, 5020-2 3, 5020-2-4) which surrounds by a through groove 5023-2 (5023-2-1, 5023-2-2, 5023-2-3, 5023-2-4). The conductor substrate side wall 5020-3 (each side wall is 5020-3-1, 5020-3-2, 5020-3-3, 5020-3-4) is surrounded by the groove. The side wall of the conductor substrate is deformed, for example, each side wall of 5020-1 is deformed by the pressure difference between the through groove 5022-1 and the through groove 5022-2. Each side wall of 5020-2 is deformed by the pressure difference of the groove 5022-3.

Accordingly, a capacitive element is formed in which the conductive substrate side wall 5020-1 is one electrode, the conductive substrate side wall 5020-2 is the other electrode, and the through groove 5022-2 is a capacitive space. Since the entire periphery is a capacity, a large capacity can be made with a small area. (Note that the case of only one surface is shown in FIGS. 11 (d) and 11 (e), the capacitance can be made only on two surfaces, and the capacitance can be made only on three surfaces. Capacitance refers to the capacity at which the capacity changes due to the pressure difference.) The thickness of each side wall (the thickness of the deforming side wall, e2 and e3 in the figure) is the pressure used and the size of the diaphragm. The selection may be made according to the material characteristics. You may change suitably the side wall thickness of 4 surfaces. (If the thickness is the same, the amount of side wall deformation will be substantially the same.) In the through groove width, j2 shown in the figure affects the capacity characteristics, so it must be formed with high accuracy. The through groove width can also be changed on each of the four surfaces. (If it is the same, if the thickness of the side wall electrodes on both sides is also the same, the capacitance change will be the same.) Further, a through groove is provided around the capacitive element shown in FIGS. A large number of capacitor elements can be formed by repeating the surrounding with the conductor substrate. The thickness of the outermost conductive substrate (thickness e1 of 5020-3 in FIGS. 12A and 12B) is made thicker than other deforming side walls so as not to be deformed by a pressure difference. desirable. 5020-3 plays a role of securing the strength and reliability as a pressure sensor and protecting the internal capacitive element. The width j1 of the through groove 5022-3 may not be managed so accurately, but the conductor side wall 5020-2 should not be in contact with the outermost conductor side wall 5020-3 within the measurement pressure. In addition, instead of the through groove at the center, a rectangular conductive substrate 5020 can be arranged and surrounded by a through groove and the periphery as a side wall electrode of the conductive substrate. In this case, the conductor substrate 5020 at the center is not deformed but can be used as an electrode.

FIG. 12B is a side view of the A1-A2 cross section of FIG. A plate 5009 is attached to the upper surface of the conductor substrate 5020, and a plate 5010 is attached to the lower surface to make the through groove a closed space. Pressure transmission holes 5024 (5024-1, 5024-2) are formed in the plate 5009 in the through grooves 5022-3 (5022-3-1, 5022-3-3). Since the through grooves 5022-3-1 and 5022-3-3 are connected, one pressure transmission hole 5024 (5024-1, 5024-2) may be provided. A pressure transmission hole 5023 is formed in the plate 5009 also in the central through groove 5022-1. Further, pressure transmission holes 5025 (5025-1 and 5025-2) are formed in the plate 5010 in the through grooves 5022-2 (5022-2-1 and 5022-2-3). Since the through-grooves 5022-2-1 and 5022-2-3 are connected, one pressure transmission hole 5025 (5024-1, 5024-2) may be provided. The pressure of the through groove 5022-1 and the pressure of the through groove 5022-3 may be different, but in that case, the pressure of the portion connected to the pressure transmission hole is also different. Here, it is assumed that the same pressure P1 is introduced. Assuming that the pressure of the through groove 5022-2 is P2, due to the pressure difference between P1 and P2, the conductor substrate side wall 5020-2 (5020-2-1, 5020-2-2, 5020-2) surrounding the through groove 5022-2. -3, 5020-2-4) and 5020-1 (5020-1-1, 5020-1-2, 5020-1-3, 5020-1-4) are deformed. The capacity of the capacitive space 5022-2 (5022-2-1, 5022-2-2, 5022-2-3, 5022-2-4) sandwiched between these electrodes changes. By detecting this change in capacitance, the pressure difference can be determined. It can be considered that the rectangular (tetragonal) capacitor elements shown in FIGS. 12A and 12B are hardly deformed at the corners and the side wall electrodes on the side surfaces thereof are deformed. As a result, the side wall is simply deformed, so that it is easy to handle as a diaphragm. Accordingly, the change in capacity can be calculated based on the above-described formula, and the pressure difference can be calculated from the change in capacity. For example, if the capacitance of the through groove 5022-2, which is a capacitance space, is C1 to C4 for each side wall electrode, the capacitance C generated on the conductor side walls 5020-1 and 5020-2 is C1 to C4. Since it can be considered as parallel connection, C = C1 + C2 + C3 + C4. Accordingly, the capacitance is about four times as large as the capacitance generated between one opposing side wall electrodes, and the amount of change is also about four times.

As a further development of FIGS. 12 (a) and 12 (b), if the polygonal shape of the polygonal shape is increased, the shape will ultimately be circular or elliptical. The case of a circular shape is shown in FIGS. 12 (c) and 12 (d). FIG. 12C shows a plan view thereof. A through-groove 5032-1 in the center, a circular electrode substrate sidewall electrode 5030-1 around it, a through-groove 5032-2 around it, and a circular conductor substrate sidewall electrode 5030-2 around it, There are through-grooves 5032-3 around the periphery, and there are circular conductor substrates 5030-3 around them. A plurality of capacitive elements may be formed by surrounding the periphery with a through groove and surrounding the periphery with a conductor substrate. These capacitive elements can be connected in parallel or in series or other elements by forming contact holes and electrical lines / wirings in the plates 5009 and 5010. The capacitive element shown in FIGS. 12C and 12D is a circular element, but considering the thickness direction, it is a cylindrical (or column) capacitive element. The outermost conductor substrate can also be used as an electrode, but it cannot be made very thin, so that it is usually an electrode whose side wall is not deformed. However, if the outermost electrode is exposed and used as an electrode, the characteristics of the capacitive element may be deteriorated due to the influence of moisture, contamination, or the like. Therefore, it is better to form a protective film or a protective resin. Normally, the outermost conductive substrate is not used as an electrode, but is preferably used as a protective substrate for the capacitive element package. It is better to increase the thickness in consideration of strength and environmental resistance. Further, the outermost side does not need to be circular, and can have any shape, for example, a quadrangular shape or a rectangular shape (in a three-dimensional view, a quadrangular prism shape or a rectangular column shape).

FIG.12 (d) shows the side view of A1-A2 cross section of FIG.12 (d). A plate 5009 is attached to the upper surface of the conductor substrate 5030, and a plate 5010 is attached to the lower surface of the conductor substrate 5030 to make the through groove a closed space. In the through groove 5032-1, a pressure transmission hole 5033 is formed in the plate 5009, and in the through groove 5032-2, a pressure transmission hole 5035 (5035-1, 5035-2) is formed in the plate 5010, and the through groove 5032-3 is formed. The plate 5009 is formed with pressure transmission holes 5034 (5034-1, 5034-2). In this embodiment, the through-groove is formed in a circular shape (cylindrical or cylindrical) (also the through-groove 5032-2), and the side wall electrodes 5030-1 and 5030 of the conductor substrate sandwiching the through-groove (through groove 5032-2). -2 is also formed in a circular (cylindrical or cylindrical) shape, and by forming it concentrically, the width (distance between electrodes) r (j2) of the through-groove 5032-2 serving as a capacity space is constant everywhere. . If the side wall electrodes and the through-grooves sandwiched between them are also formed concentrically, the deformation amount of the side wall electrode 503-1 becomes almost constant everywhere, and the deformation amount of the side wall electrode 5030-2 becomes almost constant everywhere. Accordingly, the capacitance generated in the through groove 5032-2 between the side wall electrodes 5030-1 and 5030-2 and the capacitance change due to the pressure difference are almost constant everywhere. It is possible to know the pressure difference from this change in capacity. Since r changes depending on the pressure difference using the pressure transmission holes 5034, 5033, and 5035, the capacity changes, and this can be used to know the pressure difference.

Although FIGS. 12C and 12D are circular shapes, the width (distance between electrodes) of the entire through groove serving as the capacitor space can be made constant by using an elliptical shape or other closed curve shape. Furthermore, these curved and polygonal capacitative elements can be combined. Since only the outermost shape can be made into a shape that is easy to handle (for example, a square shape or a rectangular shape), it can be freely combined depending on the pressure.

FIG. 5 shows the structure of a semiconductor pressure sensor according to some embodiments of the present invention. 5A, deep grooves 16, 17, 18, 19, and 20 exist on the surface of the semiconductor substrate 11 in the thickness direction of the semiconductor substrate. This groove has a rectangular parallelepiped shape, and has a rectangular shape when viewed from above the surface of the semiconductor substrate. Insulating films 12 exist in these trenches and the semiconductor substrate surface. The conductive film 13 is present on the front and bottom surfaces of the grooves 16, 18, and 20 and on a desired portion of the semiconductor substrate. The conductive film 13 does not exist in the groove 17 existing between the grooves 16 and 18. Further, the conductive film 13 does not exist in the groove 19 existing between the grooves 18 and 20. The grooves 17 and 19 are covered with a cap 14, and the interiors of the grooves 17 and 19 are airtight spaces 15 and 25. On the other hand, the groove | channels of 16, 18, and 20 are open | released, and are the same pressure as external environment (place which should measure a pressure). The internal pressure of the airtight spaces 15 and 25 is normally in a low pressure state close to vacuum. However, depending on the pressure of the external environment, there may be a reduced pressure state close to atmospheric pressure, or a pressure higher than atmospheric pressure. Alternatively, another pressure may be applied by providing a pressure transmission hole in the lid. The thickness of the semiconductor substrate 21 between the grooves 16 and 17, the thickness of the semiconductor substrate 22 between the grooves 18 and 17, the thickness of the semiconductor substrate 23 between the grooves 18 and 19, and the gap between the grooves 19 and 20. The thickness of the semiconductor substrate 24 is thin, and the semiconductor substrates 21 to 24 can be deformed by pressure. These thicknesses may not be the same, but pressure calculation is easier when the thicknesses are the same.

The electrostatic capacitance between the electrode A and the electrode B in FIG. 5A is the series connection of the insulating film 12 -the semiconductor substrate 21 -the insulating film 12 -the space 15 -the insulating film 12 -the semiconductor substrate 22 -the insulating film 12. It has become. Due to the pressure difference between the grooves 16 and 18 and the pressure between the grooves 17, the semiconductor substrate side walls 21 and 22 are deformed, and the capacitance of the space 15 changes. Therefore, since the electrostatic capacitance between the electrode A and the electrode B also changes, the pressure difference can be calculated. Similarly, since the capacitance between the electrode B and the electrode C also changes, the pressure difference can be calculated. Although the pressure can be calculated even with one capacitance measuring unit structure, if a large number of these capacitance measuring structures are arranged, the amount of change in capacitance due to the pressure difference increases, so the accuracy of pressure detection increases.

A region where grooves 16 to 20 are formed on the first surface of a semiconductor substrate 11 such as Si (or an insulating substrate such as glass, ceramic, plastic, etc.) is opened with a photosensitive film by an exposure method, and the semiconductor substrate Are etched to form recesses (grooves) 16 to 20 perpendicular to the substrate surface. Next, an insulating film 12 such as a SiO2 film is formed on the inner surface and the first surface of the recess, and further a conductor film 13 such as a PolySi film, an Al film, or a copper film is laminated, and necessary patterning is performed. In this patterning, the conductor film 13 in the recesses 17 and 25 is removed, and the conductor film 13 in the recesses 16 and 19 is not removed. Patterning in the recess is not necessary, and patterning on the first surface of the semiconductor substrate 11 can be performed by a normal photolithography method. This conductor film 13 can also be used as wiring and electrodes. A cap substrate 14 is attached to the first surface of the semiconductor substrate 11 using an adhesive or the like, and a desired location is removed. For example, the recesses 17 and 25 are covered with the cap substrate 14, and the recesses 16, 18, and 20 are opened. The cap substrate 14 already having holes may be attached by mask alignment. When the substrate is Si, the insulating film 12 can be removed and the glass substrate can be anodically bonded. Alternatively, the recesses 16, 18, and 20 may be covered and only a part of the pressure transmission holes may be opened. When pressure is transmitted also to the recesses 17 and 25, a pressure transmission hole is formed in the lid 14. A protective film such as a SiN film can be formed on the conductor film 13 before and after the cap substrate 14 is attached, and necessary windows can be opened (pad portions). The substrate side walls 21, 22, 23, and 24 are deformed by a pressure difference, but the substrate side walls 21, 22, 23, and 24 are more easily deformed as the thickness t is thinner. In the Si semiconductor substrate, although it depends on the pressure difference, it is about 1 μm to 30 μm, preferably about 1 μm to 15 μm. If a material having a low Young's modulus (plastic or rubber) is used as the substrate, this t can be made thicker. The production method is also simplified by using the imprint method. The capacitance increases by increasing the groove depth h and the groove length (depth), so the sensitivity is improved, and the sensitivity is improved to about 50 μm or more, preferably about 100 μm or more, more preferably about 500 μm or more. And Further, the width of the grooves 17 and 25 also contributes to the capacitance, so it is preferable that the width is small. The width of the grooves 16, 18, and 20 does not affect the characteristics, but it is desirable that the pressure can be transmitted smoothly and an insulating film or a conductor film can be stacked inside the groove, and is preferably about 5 μm to 10 μm or more. The cap 57 is an insulating substrate such as glass, ceramic, or polymer material.

FIG. 5B is a modification of FIG. 5A, and the counter electrode 13 (13-1, 2, 3, 4) is formed on the substrate side walls of the grooves 17 and 19 that become the capacity spaces 15 and 25. As a result, the capacitance change due to the pressure difference is generated between the two electrodes 13-1 and 2 or 13-3 and 4, so that the sensitivity is increased. After the conductor film 13 is stacked in the recesses 17 and 19, the conductor film on the bottom surface of the recess and the opposite side surface on the depth side of the recess is removed by etching after patterning the photosensitive film. In addition, the cap substrate 14 is airtightly adhered to the conductor film 13 (13-1, 2, 3, 4) with an adhesive or the like. An insulating film such as SiO 2 may be formed on the conductor film 13.

Next, another embodiment of the present invention will be described with reference to FIG. 5C, there are grooves (through holes) 71 to 74 penetrating from the first surface (front surface) of the semiconductor substrate 61 to the second surface (back surface) of the semiconductor substrate 61 which is the back surface thereof. An insulating film 62 is provided on the inner wall of through-holes 71 to 74 and necessary portions of the front and back surfaces of the semiconductor substrate, and a conductor layer is provided on the inner wall of through-holes 71 to 74 and necessary portions of the front and back surfaces of the semiconductor substrate. 63 is formed. Further, an insulating film 64 is formed on the conductor layer 63 on the front and back surfaces of the semiconductor substrate 61 and, if necessary, on the conductor layer 63 inside the grooves 71 to 74. The insulating film 62 exists for the purpose of insulating the semiconductor substrate surface (front surface, back surface, groove inner wall) and the conductor layer 63. However, the insulating film 62 in a portion requiring connection is removed before the conductor film 63 is formed. The through holes 71 to 74 are rectangular (horizontal (width) m, vertical n) in plan view, and the depth is h (in this case, since it penetrates the semiconductor substrate 61, it is equal to the thickness of the semiconductor substrate). Therefore, the shape of the through holes 71 to 74 is a rectangular parallelepiped. The purpose of the insulating film 64 is to protect the conductor layer and ensure insulation. Thereafter, the cap substrate 65 (semiconductor surface side) and the cap substrate 66 are bonded onto the insulating film 64. If there is no problem, the cap wafers 65 and 66 may be bonded directly on the conductor film 63.

The through holes 71 to 74 have pressure conduction holes 67 (front surface side) and 68 (rear surface side) that are alternately connected to the external environment on the front surface side or the back surface side of the semiconductor substrate. That is, the through hole 71 has a pressure conduction hole 68 on the back surface side, and the through hole 72 adjacent to the through hole 71 has a pressure conduction hole 67 on the surface side. The through hole 73 adjacent to the through hole 72 has a pressure conduction hole 68 on the back surface side, and the through hole 74 adjacent to the through hole 73 has a pressure conduction hole 67 on the surface side. The pressure conduction holes 67 and 68 may be opened before the cap substrates 65 and 66 are bonded, or may be opened after the cap substrates 65 and 66 are bonded. The through hole 71 formed in this way has no place to conduct to the external environment other than the pressure conduction hole 68 and is airtight. The through hole 72 is airtight without any place other than the pressure conduction hole 67 and conducting to the external environment. The same applies to the through holes 73 and 74. In this embodiment, since all the through holes 71 to 74 can be utilized as a capacity space, the efficiency is very good. That is, the substrate side wall 61-1 is deformed by the pressure difference P1-P2, the space capacitance of the through hole 71 is changed, and the capacitance between the electrodes 63-1 and 63-2 is changed. Further, the substrate side walls 61-1 and 63-4 are deformed by the pressure difference P1-P2, the space capacity of the through hole 72 is changed, and the capacitance between the electrodes 63-3 and 63-4 is changed. . Others are the same. In this method, since the conductor film 63 is formed on the side wall of the substrate, the present invention can be applied to a semiconductor or an insulator substrate even if the substrate is not a conductor. Here, m is the width of the through hole, and v is the distance between the electrodes. If many of these are arranged side by side and connected in parallel, the capacity increases and the sensitivity increases. If m = 20 μm and t = 10 μm, even if 10 are arranged in the width direction, it is about 300 μm, and a very small sensor can be manufactured.

In the embodiment of FIG. 5D, the groove portions 91 and 92 and the groove portions 93 and 94 are formed from both surfaces (the front surface and the back surface) of the semiconductor substrate 81, and the groove portions do not reach the opposite surface without being completely penetrated. To. A capacitance is formed by utilizing the overlapping portion of the groove. Insulating films 82 and 83 and conductor films 84 and 85 are formed inside the groove and on the front and back surfaces of the semiconductor substrate. The conductor film 84 inside the groove is removed at the bottom and side portions (in the direction perpendicular to the paper surface), and is opposed to each other to serve as an electrode to form a capacitor. The groove is covered with caps 86 and 87 to form pressure conduction holes 88 and 89. Pressure is transmitted from the pressure conduction hole. For example, P1 pressure is applied from the pressure conduction holes 89 of the grooves 93 and 94 on the front surface side of the semiconductor substrate, and P2 pressure is applied from the pressure conduction holes 88 of the groove portions 91 and 92 on the back surface side of the semiconductor substrate. Due to the pressure difference between P1 and P2, the semiconductor substrate side wall 81 (81-1) between the groove portions 91 and 94 and the semiconductor substrate side wall 81 (81-2) between the groove portions 92 and 94 become the groove portions 92 and 93. The semiconductor substrate side wall 81 (81-3) between them is deformed (curved). Due to these deformations, the groove widths of the groove portions 91 to 94 change, and the capacitance generated in the counter electrode formed on the side wall of the groove portion changes. This change can be used to form a pressure sensor.

The present invention can also create a pressure sensor using piezoresistance. For example, a piezoresistor is formed in a groove or a through-hole side wall (which becomes a diaphragm). Since this side wall (partition wall) is deformed by pressure fluctuation, the resistance of the piezoresistor also changes. The pressure can be detected using this variation. Conventionally, the piezoresistor is also formed in a plane with respect to the semiconductor substrate. However, the present invention provides a side wall (partition) of a groove or a through-hole (they form a diaphragm as in the case of a capacitor). Therefore, the area in the semiconductor substrate can be made very small.

An object of the present invention is to reduce the size of the semiconductor pressure sensor and increase the pressure detection sensitivity. As described above, deep grooves are formed in the thickness direction of the semiconductor substrate. When a part of the groove is made airtight and a pressure is applied to the groove adjacent to the groove, a partition wall (corresponding to a diaphragm) between the grooves is curved to change the capacity of the airtight space or the groove part. By detecting this amount of change, the pressure can be detected. By increasing the depth of the groove, the capacity increases, so a sensor with a smaller area can be created. Moreover, since the amount of deformation of the partition can be increased by making the partition thinner, the sensitivity of the sensor is also increased.

Furthermore, since the present invention forms the diaphragm portion and the space in the thickness direction of the semiconductor substrate as described above, the pressure sensor chip can be made very small. Therefore, the number of pressure sensor chips that can be taken from the semiconductor substrate (wafer) can be increased. Furthermore, since the capacity can be increased easily, the sensitivity of the capacitive pressure sensor can be increased. Furthermore, since LSI process such as photolitho method is used, the groove and sidewalls (partition walls) that will be the space and diaphragm part can be created precisely and accurately, so that a very thin diaphragm and narrow space can be formed, which also makes the sensitivity of the pressure sensor Can be increased.

Various crystal planes can be selected for the side wall surface of the present invention. For example, when the crystal plane (surface) of the silicon substrate 9001 is the (100) plane, the side wall surface 9101 is a (0xx) plane. (X is an arbitrary number) Furthermore, the resistor 9111 can be formed in various orientations with respect to the side wall surface. For example, if the side wall surface is a (010) plane, forming the resistor 9111 in the <110> direction maximizes the piezoresistance effect, so that the resistance change can also be increased.

Fig.13 (a) is a figure which shows sectional drawing (in another embodiment) of the vertical pressure sensor of this invention. The pressure sensor of the present invention is a substrate composed of a first surface (main surface) and a second surface (back surface), and a second surface adjacent to the concave portion (first concave portion) formed on the first surface and the first concave portion. A pressure sensor having a side wall of the substrate sandwiched between recesses (second recesses) formed in a diaphragm, the first conductor film formed on the substrate of the first recesses, the first conductor The first piezoelectric film formed on the film, the second conductive film formed on the first piezoelectric film, and / or the third conductive film formed on the substrate of the second recess , A pressure sensor including a second piezoelectric film formed on the third conductive film and a fourth conductive film formed on the second piezoelectric film.

In FIG. 13A, first recesses 126 and 127 are groove-shaped recesses formed from the first surface (upper surface in FIG. 13A) side of the substrate 111. The second recesses 128, 129, and 130 are groove-shaped recesses formed from the second surface (lower surface in FIG. 13A) side of the substrate 111. In this specification, the groove or recess formed in the substrate is formed from the main surface (first surface) of the substrate or the back surface (second surface) of the substrate, and the main surface (first surface) of the substrate or the substrate. A groove or recess having a back surface (second surface) as an opening and a side surface (also referred to as a side wall) perpendicular (substantially perpendicular) to the main surface (first surface) of the substrate or the back surface (second surface) of the substrate It is. This groove or recess is formed by anisotropic dry etching, and the side surface is ideally perpendicular to the main surface (first surface) of the substrate or the back surface (second surface) of the substrate. There may be a curved surface due to etching variation (fluctuation) or the like, or a slight inclination (preferably 10 degrees or less, more preferably 5 degrees or less) with respect to the vertical. (Substantially perpendicular means generally preferably 10 degrees or less, more preferably 5 degrees or less with respect to the vertical direction. Also, this angle (shown below or shown heretofore) means the average For example, the depth of the side surface of the recess has a distance (for example, 1 μm to 2000 μm, which may be 2 mm or more depending on the thickness of the substrate). Some of the sides may exceed this angle, but the average of all the angles is taken to represent this angle.) The bottom of the groove or recess may be present in the substrate or may penetrate the substrate. May not exist in the substrate. When the bottom surface of the groove or the recess exists in the substrate, that is, when the groove or the recess does not penetrate the substrate, the bottom surface is ideally parallel to the main surface (first surface) or the back surface (second surface) of the substrate. If the surface is a curved surface due to variation (variation) in anisotropic dry etching, or inclined slightly (preferably 10 degrees or less, more preferably 5 degrees or less) with respect to parallelism There is also. In some cases, this inclination angle is larger, but in this case, it means an average angle. When the groove or the recess penetrates the substrate, that is, when the main surface (first surface) of the substrate or the back surface (second surface) of the substrate has an opening, the groove or the recess is formed as a through groove (through hole). ) And of course there is no bottom surface in the substrate. However, even in the case of the through groove, the main surface (first surface) or the back surface (second surface) side of the substrate is covered with another substrate (sometimes referred to as a thin plate). Is sometimes called the bottom surface of the through groove.

The first recess 126 is adjacent to the second recess 128, the (substrate) side wall 132 of the substrate 111 exists between the first recess 126 and the second recess 128, and the first recess 126 and the second recess 128 are formed on the substrate 111. It is separated by a side wall 132. The first recess 127 is adjacent to the second recess 128, the side wall 133 of the substrate 111 exists between the first recess 127 and the second recess 128, and the first recess 127 and the second recess 128 are formed by the side wall 133 of the substrate 111. It is separated. The first recess 126 and another second recess 129 adjacent to the first recess 126 are separated by the side wall 131 of the substrate 111 facing the side wall 132 with the first recess 126 interposed therebetween. Similarly, the first recess 127 and another second recess 130 adjacent to the first recess 127 are separated by the side wall 134 of the substrate 111 facing the side wall 133 with the first recess 127 interposed therebetween.

The first recesses 126 and 127 have a groove shape (substantially rectangular parallelepiped shape) formed substantially perpendicular to the first surface of the substrate 111, and the bottom 135 of the substrate 111 exists at the bottom of the first recess 126. The bottom 136 of the substrate 111 is present at the bottom of the first recess 127. On the other hand, the second recesses 128, 129, and 130 have a groove shape (cuboid shape) formed substantially perpendicular to the second surface of the substrate 111, and the bottom of the second recess 128 (FIG. The upper portion 140 of the substrate 111 exists in the upper portion. The first recesses 126 and 127 have side walls in a direction perpendicular to the paper surface, and are separated from the second recesses formed from the second surface side of the substrate 111.

On the first surface side of the substrate 111, an insulating film 112 is formed on the substrate 111, a conductor film 114 (becomes a lower electrode) thereon, a piezoelectric film 116 is formed thereon, and a conductor film 118 (upper portion is formed thereon). An insulating film 120 is formed thereon. Of course, the inside of the first recesses 126 and 127 has the same film structure. On the second surface side of the substrate 111, an insulating film 113 is formed on the substrate 111, and a conductor is formed on the insulating film 113 (referred to as an upper portion in FIG. 13A. A film 115 (to be a lower electrode), a piezoelectric film 117 thereon, a conductor film 119 (to be an upper electrode) thereon, and an insulator film 121 are formed thereon. Of course, the inside of the second recesses 128, 129, and 130 has a similar film structure. The reason why the insulating film 112 is sandwiched between the substrate 111 and the conductor film 114 is to prevent a low electrical connection between the conductor film 114 and the substrate 111. In the case where the substrate 111 is an insulator such as glass, plastic, or ceramic, the insulating film 112 is not necessary. However, in order to prevent electrical contact with other elements or conductor films, if there are other elements or conductor films. In some cases, an insulating film 112 is provided. Further, the insulating film 112 may be provided for the purpose of improving the adhesion between the substrate 111 and the conductor film 114.

A thin plate (first thin plate) 122 is attached to the upper surface of the substrate 111. The first thin plate 122 is attached to the insulating film 120 and covers the first recesses 126 and 127. When the first thin plate 122 completely covers the first recesses 126 and 127, the recess spaces of the first recesses 126 and 127 become airtight spaces, and the pressure is kept constant. When the pressure in the concave space of the first concave portions 126 and 127 is varied, the pressure introduction holes 137 and 138 are formed in the first thin plate 122 so that the pressure P1 can be introduced from the outside.

On the other hand, a thin plate (second thin plate) 123 is attached to the lower surface of the substrate 111. The second thin plate 123 is attached to the insulating film 121 and covers the second recesses 128, 129 and 130. When the second thin plate 123 completely covers the second recesses 128, 129 and 130, the recess spaces of the second recesses 128, 129 and 130 become airtight spaces, and the pressure is kept constant. When the pressure in the concave spaces of the second concave portions 128, 129 and 130 is varied, the pressure introducing hole 139 and the like are formed in the second thin plate 123 so that the pressure P2 can be introduced from the outside.

The contact hole 151 is formed through the insulating film 120 and the piezoelectric film 116 in order to make an electrical connection to the conductor film (lower electrode) 114. In FIG. 13A, the conductor film 118 in the region where the contact hole 151 is formed is removed in advance. A conductor film 152 is stacked in the contact hole 151. When the piezoelectric film 116 has conductivity (including a case where insulation is low), the conductor film 152 is formed after forming the insulating film on the sidewall. An electrode / wiring (conductor film) 153 is formed on the conductor film 152. Thereby, electrical connection can be made from the conductor film (lower electrode / wiring) 114 to the electrode / wiring (conductor film) 153 through the conductor film 152 in the contact hole 151. The contact hole 154 is formed through the insulating film 120 for electrical connection to the conductor film (upper electrode) 118. A conductor film 155 is formed in the contact hole 154. An electrode / wiring (conductor film) 156 is formed on the conductor film 155. As a result, electrical connection can be made from the conductor film (upper electrode / wiring) 118 to the electrode / wiring (conductor film) 156 through the conductor film 155 in the contact hole 154. If the first thin plate 122 is present in the region where the contact holes 151 and 154 are to be formed, the first thin plate 122 in this region should be removed in advance (before the first thin plate 122 is attached). good. Alternatively, the conductor film may be formed after forming the contact hole in the first thin plate without removing the first thin plate 122. In this case, when the first thin plate is a conductor (including a case where the insulating property is low), an insulating film is formed on the side wall of the contact hole before the conductor film is formed. One thin plate 122 may not be contacted.

Since there are conductor films (electrodes / wirings) 115 and 119 also on the back side of the substrate 111, it is necessary to take out the electrodes / wirings outward from these. Similarly to the above, a contact hole may be formed and taken out from the front side of the substrate 111. In this case, it is necessary to form contact holes in the substrate 111 as well. In the case where the substrate 111 is a conductor (including a case where the insulating property is low), the conductor film is formed after forming the insulating film on the sidewall of the contact hole so that the conductor film does not contact the substrate 111. To. Alternatively, as shown below, electrodes / wirings may be taken out from the back side (second surface side) of the substrate 111 to the outside. This method may be performed by reversing the method of taking out the electrodes / wiring from the front side (first surface side) of the substrate 111 described above. (Names are contact hole 160, conductor film (lower electrode) 115, insulating film 161, conductor film 162, conductor film 182, electrode / wiring (conductor film) 163, electrode / wiring (conductor film) 163 , Contact hole 157, conductor film (lower electrode) 119, conductor film 158, electrode / wiring (conductor film) 159)

FIG. 13B is a diagram schematically showing the structure of the vertical pressure sensor of the present invention when pressure is applied. The laminated structure of the thin film in FIG. 13B is the same as the structure in FIG. That is, the substrate side wall 21 in FIG. 13B is considered as the substrate side wall 132 in FIG. 13A, and the substrate side wall 41 in FIG. 13B is considered as the substrate side wall 133 in FIG. An insulating film 27 is formed on the outside of the substrate side wall 21, a conductive film 28 is formed thereon, a piezoelectric film 29 is formed thereon, a conductive film 30 is formed thereon, and an insulating film 31 is formed thereon. An insulating film 22 is formed on the inner side of the substrate side wall 21, a conductive film 23 is formed thereon, a piezoelectric film 24 is formed thereon, a conductive film 25 is formed thereon, and an insulating film 26 is formed thereon. Further, an insulating film 47 is formed on the outside of the substrate side wall 41 facing, a conductive film 48 is formed thereon, a piezoelectric film 49 is formed thereon, a conductive film 50 is formed thereon, and an insulating film 51 is formed thereon. ing. An insulating film 42 is formed on the inner side of the substrate side wall 41, a conductive film 43 is formed thereon, a piezoelectric film 44 is formed thereon, a conductive film 45 is formed thereon, and an insulating film 46 is formed thereon.
Substrates (bottom or top, 135, 136, 140, etc. in FIG. 13A) also exist at the top and bottom of the substrate side walls 21 and 41, but are omitted in FIG. Only shows. The thin plate (first thin plate) 32 and the thin plate (second thin plate) 33 correspond to the thin plates 122 and 123 in FIG. However, in FIG. 13A, the upper portion of the first recess is the first thin plate 122, the lower portion of the first recess is closed by the substrate 111, the upper portion of the second recess is the substrate 111, and the lower portion of the second recess. Is closed by a second thin plate 123.

A pressure introduction hole 34 is provided in the second thin plate 33 in a space 37 surrounded by the substrate side walls 21 and 41 and the thin plates 32 and 33, and a pressure P2 can be applied from the outside. A pressure introduction hole 35 is provided in the second thin plate 33 in the space 38 outside the substrate side wall 21, and the pressure P1 can be applied from the outside. In the space 39 outside the substrate side wall 41, a pressure introducing hole 36 is provided in the second thin plate 33, and a pressure P3 can be applied from the outside. For example, it can be considered that the first recesses 126 and 127 in FIG. 13A correspond to the spaces 38 and 39, and the second recess 128 in FIG. 13A corresponds to the space 37. These pressure introducing holes 34, 35, and 36 can be provided in the first thin plate 32, and may be appropriately selected so that external pressure can be smoothly introduced. Alternatively, it is possible not to provide a pressure introducing hole. In this case, the internal space becomes an airtight space, and the pressure is maintained almost constant. Therefore, the pressure can be detected as a differential pressure with respect to the pressure in the internal space. It becomes possible. For example, without opening the pressure introduction hole 34, the internal space 37 is hermetically sealed and the internal pressure P2 is constant, and P1 and P3 correspond to the deformation amount due to the pressure difference of the substrates 21 and 41 with respect to the pressure P2. The pressure can be detected.

In the case of P2> P1, the internal space 37 pushes the substrate side wall 21 and the thin film laminated thereon to the internal space 38 side by the pressure difference P2-P1, and the substrate side wall 21 is deformed outward, that is, toward the space 38. To do. The substrate side wall 21 and the like (including other various films) and the substrate side wall 41 and the like (including other various films) are suppressed from being deformed by the upper and lower first thin plates and the second thin plate. Since the other portions such as the substrate side wall 21 and the substrate side wall 41 are not restricted, they are deformed by the force due to the pressure difference, and in particular, the vicinity of the central portion is most deformed. (Inflates toward the concave portion 38 or 39.) The upper portion of the space 38 is an upper substrate (not shown in FIG. 13B, but the upper portion 140 of the substrate in FIG. 13A), a thin film laminated thereon, Deformation is suppressed by the first thin plate 32 (the first thin plate 122 in FIG. 13A) adhering to the top. The lower part of the space 38 is not the bottom of the substrate (not shown in FIG. 13 (b), but the substrate bottom 135 in FIG. 13 (a)), the thin film stacked thereon, and the second thin plate 33 (on the top). The deformation is suppressed by the second thin plate 123) in FIG. As a result, the vicinity of the center of the substrate side wall 21 is most deformed and the periphery of the substrate side wall is hardly deformed, and the substrate side wall 21 is deformed into a curved shape as shown in FIG.

The thin film laminated on the substrate side wall 21 is similarly deformed into a curved shape. Accordingly, electric charges are polarized on both sides of the piezoelectric film 24 distorted in a curved shape, and a voltage difference V 1 is generated between the conductor films 23 and 25 stacked on both sides of the piezoelectric film 24. Similarly, charges are polarized on both sides of the piezoelectric film 29 distorted in a curved shape, and a voltage difference V 2 is generated between the conductor films 28 and 30 stacked on both sides of the piezoelectric film 29. That is, if the conductor wiring B3 is connected to the conductor film 23 and the conductor wiring B4 is connected to the conductor film 25, the charge can be taken out. If the conductor wiring B1 is connected to the conductor film 30 and the conductor wiring B2 is connected to the conductor film 28, the potential difference therebetween becomes V2, and the charge can be taken out.

If the piezoelectric film 24 and the piezoelectric film 29 are made of the same material and have the same thickness and the same conditions (for example, when sputtering is performed, the sputtering conditions are the same, and the subsequent heat treatment conditions are also the same). The piezoelectric film 24 and the piezoelectric film 29 are deformed to the same extent almost in accordance with the deformation of the side wall 21, so that the generated potential difference (charge) is the same. (| V1 | ≈ = | V2 |) The displacement direction is convex or concave on the B1 side and B3 side, and deforms in the same direction. On the other hand, both the B2 side and B4 side deform in the opposite direction. Therefore, if B1 and B3 and B2 and B4 are connected, both charges can be added, and a potential difference (2 | V1 |) of about twice can be obtained.

The above is the description on the left substrate side wall 21 in FIG. 13B, but the same applies to the right substrate side wall 41 in FIG. 13B. In the case of P2> P3, the internal space 37 pushes the substrate side wall 41 and the thin film laminated thereon to the internal space 39 side by the pressure difference P2-P3, and the substrate side wall 41 is deformed outward, that is, toward the space 39. To do. The upper portion of the space 39 is not shown in the upper substrate (not shown in FIG. 13B, but the upper portion 140 of the substrate in FIG. 13A), the thin film laminated thereon, and the first thin plate 32 (see FIG. 13A). The deformation is suppressed by the first thin plate 122) in FIG. The lower part of the space 39 is the bottom of the substrate (not shown in FIG. 13 (b), but the substrate bottom 136 in FIG. 13 (a)), the thin film stacked thereon, and the second thin plate 33 ( The deformation is suppressed by the second thin plate 123) in FIG. As a result, the vicinity of the center of the substrate side wall 41 is most deformed, and the periphery of the substrate side wall is hardly deformed. As shown in FIG. 13B, the substrate side wall 41 is deformed into a curved shape.

The thin film laminated on the substrate side wall 41 is similarly deformed into a curved shape. Accordingly, electric charges are polarized on both sides of the piezoelectric film 44 distorted in a curved shape, and a voltage difference V 3 is generated between the conductor films 43 and 45 stacked on both sides of the piezoelectric film 44. Similarly, charges are polarized on both sides of the piezoelectric film 49 distorted in a curved shape, and a voltage difference V 4 is generated between the conductor films 48 and 50 stacked on both sides of the piezoelectric film 49. That is, if the conductor wiring B 6 is connected to the conductor film 43 and the conductor wiring B 5 is connected to the conductor film 45, the potential difference therebetween becomes V 3, and the conductor wiring B 8 is conductive to the conductor film 50 and the conductor film 48 is conductive If the body wiring B7 is connected, the potential difference therebetween becomes V4.

If the piezoelectric film 44 and the piezoelectric film 49 are made of the same material with the same thickness and the same conditions (for example, when sputtering is performed, the sputtering conditions are the same, and the subsequent heat treatment conditions are also the same). The piezoelectric film 44 and the piezoelectric film 49 are deformed to the same extent almost in accordance with the deformation of the side wall 41, so that the generated potential difference is the same. (| V3 | ≈ = | V4 |) The direction of displacement is convex in the B6 side and the B8 side and deformed in the same direction, whereas the B5 side and B7 side are both deformed in opposite directions. , B6 and B8, and B5 and B7 can be connected to each other, so that a potential difference (2 | V3 |) of about twice can be obtained.

As described above, the substrate side wall 21 is deformed by the pressure difference P2-P1, and the piezoelectric bodies 24 and 29 are also deformed accordingly. As a result, a voltage V1 is generated between B1 and B2, and a potential V2 is generated between B3 and B4. The piezoelectric bodies 24 and 29 are deformed by the pressure difference P2-P1, and the deformation amounts of the piezoelectric bodies 24 and 29 increase as the pressure difference P2-P1 increases. Since V1 and V2 increase as the amount of deformation increases, if the relationship between the pressure difference P2-P1 amount and V1 or V2 is determined in advance, the pressure difference is determined from the measured V1 or V2 value. P2-P1 can be determined. If wiring is performed so that V1 and V2 are added, a potential difference of about twice can be obtained when | V1 | ≈ | V2 |, so that the sensitivity can be increased about twice, and the pressure difference P2-P1 can be increased. Accuracy can be increased. Furthermore, if either P1 or P2 is known, the other pressure can be determined.

Similarly, the substrate side wall 41 is deformed by the pressure difference P2-P3, and the piezoelectric bodies 44 and 49 are also deformed accordingly. As a result, a voltage V3 is generated between B8 and B7, and a potential V4 is generated between B6 and B5. The piezoelectric bodies 44 and 49 are deformed by the pressure difference P2-P3, and the amount of deformation of the piezoelectric bodies 44 and 49 increases as the pressure difference P2-P3 increases. Since V3 and V4 increase as the amount of deformation increases, if the relationship between the pressure difference P2-P3 amount and V3 or V4 is obtained in advance, the pressure difference is determined from the measured V3 or V4 value. P2-P3 can be determined. If the wiring is connected so as to add V3 and V4, a potential difference of about twice can be obtained when | V3 | ≈ | V4 |, so that the sensitivity can be increased about twice, and the pressure difference P2-P3 can be increased. Accuracy can be increased. Furthermore, if either P2 or P3 is known, the other pressure can be determined.

If the side wall thicknesses of the substrate side walls 21 and 41 are set to be approximately the same, the deformation amounts of the substrate side walls 21 and 41 are also approximately the same when P1 = P3, and the materials, thicknesses, and preparation conditions of the piezoelectric bodies 24, 29, 44, and 49 are determined. V1, V2, V3, and V4 can be set to the same level (the material, thickness, and preparation conditions of the insulating film and the conductor film are set to the same level). Therefore, if these voltages are connected so that they can be added, | V1 | + | V2 | + | V3 | + | V4 | = 4 | V1 | It becomes possible to detect with the sensitivity. Furthermore, if a piezoelectric film or the like is repeatedly laminated on the substrate side walls 21 and 41, the output voltage can be further increased, and the pressure detection accuracy can be further increased. And / or if a plurality of pressure sensors having the structure shown in FIG. 13 (a) or FIG. 13 (b) are created and connected so that the output voltages can be added, a larger output voltage can be obtained. The detection accuracy can be further increased.

From the above, if the conductor films with the same direction of deformation of the piezoelectric material are connected to each other and the conductor films with the opposite direction of deformation of the piezoelectric material are connected, the potential difference between them It can be seen that the pressure can be detected with high accuracy. That is, if the electrode / wiring inside the piezoelectric film formed on one side of the substrate side wall 21 is connected to the electrode / wiring outside the piezoelectric film formed on the opposite side of the substrate side wall 21. good. Therefore, as shown in FIG. 13 (a), all the first recesses (the pressure is P1) are deformed in the same direction (the first recesses are either inflated or recessed at the same time). The conductor films 114 and 118 on the first recess need not be cut and may be connected as they are. Of course, necessary wiring patterning may be performed at a place other than the first recess. Similarly, the second recess (denoted by pressure P2) is also deformed in the same direction (the first recesses are either inflated or recessed at the same time, and are deformed opposite to the first recess). The conductor films 115 and 119 on the recesses need not be cut and may be connected as they are. Of course, necessary wiring patterning may be performed at a place other than the second recess. Further, if these conductor films 114, 115, 118, and 119 are patterned and manufactured and / or the lead electrodes / wirings 153, 156, 159, and 163 are connected to each other with the same polarity, a large output can be obtained. Charge and potential can be obtained.

The insulating films 22, 27, 42, 47 are formed so that current from the conductor films 28, 23, 43, 48 does not leak to the substrate side walls 21, 41. When it is a body, it does not have to be formed. However, when the conductive films 28, 23, 43, 48 and the substrate side walls 21, 41 have poor adhesion, the insulating films 22, 27, 42, 47 may be formed as adhesion improving films. (This is naturally the same as that shown in FIG. 13A.) In addition, the insulating films 26, 31, 46, 51 are intended to prevent current from leaking from the conductor films 25, 30, 45, 50. In addition, it also serves to protect the conductor films 25, 30, 45 and 50. Of course, it is not necessary to form it when current leakage or protection is not necessary. (This is naturally the same as that shown in FIG. 13A.)

The recess has a rectangular parallelepiped shape, and a thin substrate side wall sandwiched between the first recess and the second recess is deformed by a pressure difference. In a rectangular parallelepiped-shaped recess, when the length in the longitudinal direction (side wall length) is a, the depth of the recess (side wall depth) is h, and the side wall thickness (side wall width) is y, the maximum side wall of the substrate The deflection Wmax is given by the following equation.
Wmax = α * z * h ² a ² / (Ey ³ )
Here, z is the pressure difference, α is a constant determined by the shape of the side wall, and E is the Young's modulus of the substrate side wall. As can be seen from this equation, the amount of deformation increases when a material having a low Young's modulus is used, the amount of deformation increases when the substrate side wall is thinned, and the amount of deformation increases when the area of the substrate side wall is increased. In addition, even if the side wall is deformed, if the polarizability that causes a voltage difference of the piezoelectric material is small, the potential difference is small and the pressure difference is difficult to detect. If a material having a large charge generated in the body is used, it is easy to detect the pressure difference. Therefore, it is necessary to design a pressure sensor having an optimum condition by optimizing all these values.

The pressure sensor of the present invention using a piezoelectric film or a piezoelectric substrate utilizes deformation of the substrate side wall due to a pressure difference. Therefore, if the area of the substrate side wall deformed by the pressure P1 and the pressure P2 is increased, a larger charge can be taken out and the sensitivity of pressure detection is increased. For example, in FIG. 13A, when the first recesses 126 and 127 (pressure P1) are rectangular (cuboid), the area of the pressure P2 is surrounded around the substrate side wall, but the four substrate side walls can be deformed. If they are formed with a small thickness, the four substrate side walls are deformed in the same manner, so that charges are generated from the side walls. Further, in order to obtain a large amount of charge with the same area (substrate surface reference), the length (width) W1 of the short side of the first recess is reduced, and a large number of the first sides of the rectangular first recess are arranged in parallel. In addition, the interval W2 between the first recesses (which is also the width of the second recess 128, etc.) may be reduced. If the width of the substrate side wall is W0, W3 / (W1 + W2 + W0) first recesses are arranged in parallel between the width W3. The second recessed portion surrounds the entire first recessed portion except that the second recessed portion exists between the first recessed portions. Therefore, the first recesses are independent, but the second recesses are connected. Furthermore, if the bottom surface of the first recess can also be deformed by a pressure difference, the degree of piezoelectric element can be further increased. In addition to a rectangular parallelepiped (rectangular in plan) or square (planar is square, three-dimensionally rectangular parallelepiped or cube) shaped recesses and polygonal columns (planar polygonal), Cylinder) shape, elliptical columnar shape (bottom surface is elliptical) shape and generally curved columnar shape (curved surface shape in plan), etc. It ’s fine.
In addition, since the pressure sensor of the present invention described above can use a semiconductor substrate such as silicon, gallium arsenide, or silicon carbide (SiC), other elements (IC, transistor, resistor, capacitor, coil, various sensors, etc.) can be used together. Can be installed. For example, if it is mounted together with a transistor, an IC, etc., the pressure sensor of the present invention and a device for controlling and processing it can be put in one chip. Therefore, compared to a two-chip or multiple-chip configuration of a pressure sensor and an IC, the entire mounting board can be reduced in size and external wiring can be reduced, so that the reliability of the entire device can be greatly increased. .

Next, the first concave portion on the first surface side of the substrate shown in FIGS. 13A and 13B, the second concave portion on the second surface side of the substrate, and the side wall sandwiched between the first concave portion and the second concave portion are diaphragms. An example of a method of manufacturing a pressure sensor having a piezoelectric film on the diaphragm and a conductive film that is formed on both surfaces across the piezoelectric film and transmits charges generated in the piezoelectric film will be described below. . The substrate 111 is a semiconductor substrate, an insulator substrate, or a conductor substrate, and the thickness thereof can be determined by, for example, the substrate material strength, and the substrate material strength can also be determined by the elastic coefficient and Poisson's ratio of the substrate material. Various substrate sizes can be selected. For example, a circular substrate having a radius of 1 inch or more (a disc substrate in consideration of thickness), a square substrate having a side of 1 inch or more, or a rectangular substrate (a cuboid substrate in consideration of thickness). In the case where the substrate 111 is a silicon semiconductor substrate or a glass substrate, for example, a circular substrate having a diameter of 6 inches (about 150 mm diameter) and a thickness of 200 μm to 700 μm (this is also referred to as a wafer. Some are even thinner). In the case of a semiconductor substrate, active elements such as transistors and passive elements such as resistors, capacitors and coils can be fabricated on the substrate together with the pressure sensor of the present invention, and these elements and pressure sensors can be integrated into one chip. . Semiconductor substrates include single element semiconductors such as silicon, germanium, and carbon, binary semiconductors such as gallium arsenide, gallium nitride, and indium phosphide, ternary semiconductors such as InGaAs and GaInNAs, quaternary semiconductors, and multiple semiconductors. There is. A material having a small Young's modulus is easily bent with a smaller pressure difference, and can generate a large diaphragm deformation. Therefore, the sensitivity of the pressure sensor can be increased. For example, there are various plastic substrates having a thickness of 200 μm to 2 mm to 5 mm to 10 mm, and various rubber substrates.

An insulating film is formed on the first surface of the substrate 111, a photosensitive film such as a photoresist is formed thereon, and regions for forming the first recesses 126 and 127 are opened by an exposure method. The photosensitive film may be a coating film such as a photoresist or a photosensitive dry film. The insulating film is, for example, a silicon oxide film (SiOx), a silicon nitride film (SiNy), a silicon oxynitride film (SiOxNy), or the like. These insulating films can be laminated by a PVD method such as CVD or sputtering. Alternatively, a silicon oxide film formed by an SOG (Spin On Glass) film may be used. In the case of a silicon semiconductor substrate, a silicon oxide film (SiO2) formed by an oxidation method may be used. This insulating film is used for satisfactorily patterning the photosensitive film, forming the first recesses well, and / or serving as an etching stopper when forming the recesses. For example, a photosensitive film can be formed directly on the first surface of the substrate 111 without forming an insulating film on the first surface of the substrate 111. The thickness of the insulating film may be about 100 nm or more for good patterning of the photosensitive film, but for the etching stopper, it is determined in consideration of the etching selectivity between the substrate, the photoresist, and the insulating film. For example, when the photoresist is completely etched during the recess etching and the recess needs to be etched, and the selectivity of the etching rate between the insulating film and the substrate is 10 (the substrate is fast), the remaining substrate is etched. When the depth is X, if the thickness of the insulating film is not more than X / 10, the insulating film disappears during the recess etching, the underlying substrate is exposed, and this portion of the substrate is also etched. In addition, it is necessary to make the thickness of the insulating film such that the size of the recess does not change as much as possible. Thus, if the thickness of the insulating film is investigated in advance, the etching selectivity and the thickness of the insulating film having the smallest amount of size change can be determined. Regarding the thickness of the photosensitive film, the thickness is determined so that the photosensitive film does not disappear during the recess etching. The etching selectivity between the photosensitive film and the concave portion is f, the etching amount of the concave portion is X, the thickness of the photosensitive film is required to be X / f or more, and various variations (for example, the etching variation of the concave portion, the initial photosensitivity) The thickness of the photosensitive film may be determined in consideration of the film variation. For example, if the etching amount of the recess is 300 μm and the etching selectivity between the photosensitive film and the substrate is 20, the thickness of the photosensitive film needs to be at least 15 μm, and if the total variation is 30%, 20 μm It may be the thickness of. Further, the final thickness of the photosensitive film is set in consideration of the thickness required for the vertical etching of the concave portion. Here, the thickness of the photosensitive film is not the thickness before exposure but the thickness before patterning and etching. Therefore, after a heat treatment such as pre-baking before exposure of the photosensitive film, baking after exposure of the photosensitive film and after development, and the subsequent scum treatment, the thickness after the scum treatment is obtained. In the case of patterning by the imprint method, the thickness of the imprint film after imprinting and after removing the imprint film at the bottom of the pattern recess (for example, after O2 plasma treatment) is obtained.

The patterning shape of the photosensitive film is desirably a vertical pattern as much as possible in order to form the side surface of the first recess according to the pattern. Next, the insulating film exposed at the opening of the photosensitive film is removed by etching. The etching shape of the insulating film is desirably a vertical pattern with less side etching as closely as possible to the patterning shape and dimensions of the photosensitive film. After the insulating film 111 is removed by etching, the photosensitive film and the substrate 111 exposed at the opening of the insulating film are etched. Since the substrate side wall sandwiched between the first recess and the second recess becomes a diaphragm, it is desirable that the thickness (substrate side wall thickness) is uniform within the surface of the substrate side wall. Therefore, the first recess is preferably a vertical pattern that is faithful to the pattern of the photosensitive film and has little side etching. Since the amount of deformation with respect to pressure increases as the size of the substrate side wall serving as a diaphragm increases, the depth of the first recess is preferably deeper. For example, the depth is 50% to 90% with respect to the substrate thickness. When the substrate thickness is 500 μm, the depth of the first recess is 250 μm to 450 μm. When the substrate 111 is a silicon substrate, a recess close to the pattern dimension of the photosensitive film can be formed by a deep RIE (DEEP RIE = DRIE) method. The DRIE method includes various methods such as a Bosch process, a low temperature cooling etching, and a magnetic neutral loop discharge (NLD) method.

After forming the first recesses 126 and 127 having a desired depth, a deposition film such as an organic film deposited in the recesses, a patterned photosensitive film, or the like is removed. The insulating film formed on the first surface of the substrate 111 may also be removed or may be left if necessary. However, if the insulating film is formed in a bowl shape with the first recess, the subsequent conductor film may be disconnected at this portion, so the insulating film must be removed. desirable. In the case where the substrate 111 is a semiconductor substrate or a conductor substrate, an insulating film 112 is next laminated on the first surface side of the substrate 111. In the case where the substrate 111 is an insulating substrate such as glass, ceramic, plastic, or rubber, the insulating film 112 may not be stacked. The purpose of the insulating film 112 is to prevent electrical connection between the conductor film 114 and the like laminated thereon and the substrate 111. For example, the insulating film is a silicon oxide film (SiOx), a silicon nitride film (SiNy), a silicon oxynitride film (SiOxNy), or the like. These insulating films can be laminated by a PVD method such as CVD or sputtering. Alternatively, a silicon oxide film formed by an SOG (Spin On Glass) film may be used. In the case of a silicon semiconductor substrate, a silicon oxide film (SiO2) formed by an oxidation method may be used. The thickness of the insulating film 112 is, for example, 50 nm to 1000 nm. The insulating film 112 is naturally laminated on the side surface and the bottom surface of the first recess.

Next, a conductor film (first conductor film) 114 is laminated on the insulating film 112. The conductive film is, for example, a doped polycrystalline silicon film, various silicide films, a transparent conductive film such as an ITO film, a nitride of a metal film (conductive nitride), an oxide of a metal film (conductive oxide) A metal film or an alloy film. The metal film is aluminum, gold, silver, platinum, palladium, titanium, molybdenum, tungsten, copper, chromium, zinc, iron, nickel, and the like, and is an alloy of these metals. These conductor films can be laminated by a CVD method or a PVD method such as sputtering or vapor deposition. The thickness of the first conductor film is about 100 nm to 2000 nm. In order to improve the adhesion with the piezoelectric film, the first conductive film may be a conductive film having two or more layers. For example, the first layer is a three-layer film of platinum film (Pt), titanium (Ti) thereon, and titanium nitride (TiN) thereon. Next, after performing necessary patterning of the conductor film 114, the piezoelectric film 116 is laminated on the conductor film 114. Piezoelectric films are PZT (lead zirconate titanate), barium titanate, lead titanate, potassium niobate, lithium niobate, lithium tantalate, sodium tungstate, zinc oxide, lithium tetraborate, calcium titanate, phosphoric acid Examples thereof include piezoelectric polymers such as aluminum, quartz, potassium sodium tartrate, and polyvinylidene fluoride (PVDF), aluminum nitride, gallium phosphate, and gallium arsenide. These piezoelectric films can be stacked by sputtering, CVD, or the like. The thickness of the piezoelectric film is about 100 nm to 5000 nm. A heat treatment necessary for improving the piezoelectricity of the piezoelectric film may be performed after the piezoelectric film is laminated. If the first conductor film 114 is not patterned, and the first conductor film is a sputter film and the piezoelectric film is also laminated by the sputtering method, a vacuum state can be secured by laminating with the same sputtering apparatus. However, the piezoelectric film can be continuously laminated on the first conductor film.

Next, after removing unnecessary regions of the piezoelectric film 116, a conductive film (second conductive film) 118 is stacked. The conductive film is, for example, a doped polycrystalline silicon film, various silicide films, a transparent conductive film such as an ITO film, a nitride of a metal film (conductive nitride), an oxide of a metal film (conductive oxide) A metal film or an alloy film. The metal film is made of aluminum, gold, silver, platinum, titanium, molybdenum, copper, chromium, zinc, or the like, and is an alloy of these metals. These conductor films can be laminated by a CVD method or a PVD method such as sputtering or vapor deposition. The thickness of the second conductor film is about 100 nm to 2000 nm. In order to improve the adhesion with the piezoelectric film, the second conductive film may be a conductive film having two or more layers. For example, the first layer is a three-layer film of titanium nitride (TiN), titanium (Ti), and platinum film (Pt). Next, after performing necessary patterning of the conductor film 114, the piezoelectric film 116 is laminated on the conductor film 114. When the substrate side walls 131, 132, 133, 134 are deformed, the piezoelectric film 116 is also deformed and charges are generated on both surfaces (upper surface, lower surface) of the piezoelectric film 116. Since the first conductor film 114 is in contact with the lower surface of the piezoelectric film 116, charges generated on the lower surface of the piezoelectric film 116 can be drawn out to the first conductor film 114. Since the second conductor film 118 is in contact with the upper surface of the piezoelectric film 116, charges generated on the upper surface of the piezoelectric film 116 can be drawn out to the second conductor film 118.

Next, after removing unnecessary portions of the conductor film 118 by a photolithography method, an etching method, or the like, the insulating film 120 is stacked. The insulating film 120 is, for example, a silicon oxide film (SiOx), a silicon nitride film (SiNy), a silicon oxynitride film (SiOxNy), or the like. These insulating films can be laminated by a PVD method such as CVD or sputtering. Alternatively, an organic insulating film such as a polyimide film may be used. The insulating film 120 serves to protect the pressure sensor including the first conductor film, the piezoelectric film 116, and the second conductor film 118. The thickness of the insulating film may be 500 nm or more. Next, a thin plate (first thin plate) 122 is attached to the first surface side of the substrate 111. The thin plate 122 covers and protects the first recesses 126 and 127. The thin plate 122 is an insulating substrate, for example, a transparent insulating substrate such as glass, quartz, or plastic, or an opaque insulating substrate such as ceramic. In the case of a transparent insulating substrate, the lower pattern can be directly observed, so that pattern matching can be easily performed and alignment accuracy can be improved. In particular, in the case of having a pattern in which unnecessary portions of the thin plate 122 are removed (for example, in the case of forming a pattern in which the electrodes 153 and 156 are formed or the pressure transmission holes 137 and 138 are removed in advance) When a pattern other than the pressure sensor region, for example, a region where a transistor or the like is formed is formed), the thin plate 122 needs to be attached to the first surface of the substrate 111 with high accuracy. Further, a semiconductor substrate or a conductor substrate may be used as long as it does not come into contact with electrodes or the like.

After applying or laminating an adhesive to a region where the thin plate 122 adheres to the substrate 111, the thin plate 122 is attached to the substrate 111. If necessary, heat treatment is performed and the thin plate 122 is fixed so as not to be detached from the substrate 111. The thickness of the thin plate is about 50 μm to 1000 μm, but it may be made thinner. Or it may be thicker. In order to make the pressure sensor as thin as possible, it is necessary to make the thin plate 122 thin. However, attaching the thin thin plate 122 in a thin state may cause the thin plate 122 to be deformed in the attaching process. If there is such a possibility, a thin plate 122 is attached to another substrate via a thermosoftening adhesive (softening temperature Ts), and a desired pattern is formed on the thin plate 122 in this state (for example, the above-described thin plate 122). Then, a thermosetting adhesive (curing temperature Th) is applied to a predetermined portion of the thin plate 122, and another substrate (the thin plate 122 side) is attached to the substrate 111. If Th <Ts, the thin plate 122 can be firmly attached to the substrate 111 by performing heat treatment between Th and Ts. Thereafter, when the temperature is set to Ts or higher, the thermosoftening adhesive is softened and the separate substrate can be separated from the thin plate 122. As a result, even a very thin (100 μm or less or 50 μm or less) thin plate can be deposited on the first surface of the substrate 111.

As a method of attaching a thin thin plate to another substrate 111, a method of attaching a thin plate to another substrate and then thinning the thin plate by CMP or BG method, or after forming a thermosoftening adhesive on another substrate, There is a method of forming a thin plate material by a coating method, a CVD method or a PVD method. After attaching the thin plate 122, an unnecessary portion of the thin plate may be removed by a photolithography method and an etching method. The thin plate 122 may be attached to the first surface of the substrate 111 by using the thin plate 122 on the first surface of the substrate 111 without applying an adhesive and applying pressure to perform normal temperature bonding or high temperature bonding. good. Thereafter, a photosensitive film is formed and patterning for forming the contact hole 151 is performed. After the insulating film 120 is etched, the piezoelectric film 116 is etched to expose the first conductive film 112 in the contact hole 151. Since the second conductor film 118 has already been removed in this region, it is not necessary to remove the second conductor film 118 when forming the contact hole. Next, after removing the photosensitive film, a photosensitive film is formed and patterning for forming the contact hole 154 is performed, and the insulating film 120 is etched to expose the second conductor film 118 in the contact hole 154. If the piezoelectric film 118 is also removed from this region in advance, it is not necessary to remove the piezoelectric film 118 at this point, and only the etching of the insulating film 120 is required, so that the contact hole 154 can be formed at the same time. Next, after removing the photosensitive film, conductive films 152 and 155 are laminated, and electrode wirings 153 and 156 are further formed.

This contact hole and conductor film / electrode formation can be performed before the thin plate 122 is attached, or after the second recess is formed and the second thin plate is attached. After the thin plate 122 is attached to the substrate 111, a second recess or the like is formed on the second surface side of the substrate 111. Method of forming second recesses 129, 128, 130, insulating film 113, conductor film (lower electrode film) 115, piezoelectric film 117, conductor film (upper electrode) 119, insulating film 121, contact holes 157, 160 The formation methods and materials of the conductive films 158 and 162, the electrodes / wirings 159 and 163, and the thin plate (second thin plate) 123 are the same as those on the first surface side.

Since the substrate side walls 131, 132, 133, 134 sandwiched between the first recess and the second recess serve as a diaphragm of the pressure sensor, it is necessary to form the thickness as uniform as possible. For this purpose, it is necessary to accurately form the pattern of the photosensitive film for forming the second recess with respect to the first recess. When the substrate 111 is made of a transparent material such as glass, quartz, or transparent plastic, the first concave portion can be seen from the second surface side, so that the alignment can be performed with considerably high accuracy. The alignment accuracy can be improved by using light having a wavelength that can be transmitted through an opaque substrate such as a silicon substrate. In addition, since the first surface side is fixed by the thin plate 122 after the first recess is formed, the deformation of the substrate 111 can be reduced during the process, so that the accuracy of pattern formation can be improved. Further, since the first surface side of the substrate 111 is fixed and reinforced by the thin plate 122 even after the second recess is formed, the substrate 111 is not deformed during the process. Further, after the second thin plate 123 is attached to the second surface side, both the first surface and the second surface of the substrate 111 are strengthened, so that the substrate is considerably sturdy.

In the previous embodiments, the substrate constituting the first recess and the second recess was not a piezoelectric body, but in the next embodiment, the substrate constituting the first recess and the second recess is a piezoelectric body. is there. FIG. 14 (f) is a diagram showing an embodiment (structure) of a structure in which the first concave portion and the second concave portion are formed in the piezoelectric substrate. First recesses 226 and 227 and second recesses 228, 229 and 230 are formed in the piezoelectric substrate 211. Side wall 231 separating first recess 226 and second recess 229, side wall 232 separating first recess 226 and second recess 228, side wall 233 separating first recess 227 and second recess 228, first The side wall 234 separating the concave portion 227 and the second concave portion 230 is a piezoelectric substrate, and these side walls become a diaphragm that is deformed by the pressure difference between the pressure P1 of the first concave portion and the pressure P2 of the second concave portion. An adhesion layer 212, a conductor film 214, and an insulating film 216 are laminated on the side walls and the surface side of the piezoelectric substrate 211 (that is, the first recess side). The adhesion layer 212 is used when the adhesion between the piezoelectric substrate 211 and the conductor film 214 is not good. Even if it is an adhesion layer, it is a conductor film through which electricity flows. For example, a conductive adhesive or a barrier metal ( A conductive film for improving adhesion). Since it is for adhesion improvement, it is not necessary if the piezoelectric substrate 211 and the conductor film 214 have good adhesion. An adhesion layer 213, a conductor film 215, and an insulating film 217 are laminated on the side walls and the back surface side of the piezoelectric substrate 211 (that is, the second recess side). The adhesion layer 213 is not necessary if the piezoelectric substrate 211 and the conductor film 215 have good adhesion.

A first thin plate 218 is attached to the surface side of the piezoelectric substrate 211. The first thin plate 218 protects the piezoelectric device and has a pressure introduction hole to the first recess (a pressure introduction hole 237 to the first recess 226 and a pressure introduction hole 238 to the first recess 227). Thus, smooth pressure transmission to the first recess can be performed. A second thin plate 219 is attached to the back side of the piezoelectric substrate 211. The second thin plate 219 protects the piezoelectric device, and pressure introduction holes to the second recesses (the pressure introduction holes 239 to the second recesses 222 and the pressure introduction holes to the second recesses 229 and 230 are not shown. The pressure is smoothly transmitted to the second recess. When it is desired to fix the pressure, the pressure hole may be eliminated.

The conductor films 214 on the front side of the piezoelectric substrate 211 are connected together. That is, the conductor film 214 on the first recess side may be continuous. This is because, in the first recess, all the side walls swell or are recessed toward the second recess, so that the same potential (that is, all positive side or all negative side) is generated (same side). Polarized). Therefore, the conductive films 214 on the side walls may be connected, and the potential is amplified, so that sensitivity is increased. Similarly, the conductor films 215 on the back side of the piezoelectric substrate 211 are connected together. That is, the conductor film 215 on the second recess side may be continuous. This is because, in the second recess, all the side walls swell or dent toward the first recess, so that the same-polarity potential (that is, all positive side or all negative side) is generated. Therefore, the conductive films 215 on the side walls may be connected, and the potential is amplified, so that sensitivity is increased. As described above, the conductor film 214 on the first recess side and the conductor film 215 on the second recess side do not need to be patterned in the recess region, and can be simply stacked, so that the photolithography process can be eliminated. (However, it is necessary to form a wiring pattern in a region other than the concave portion. In particular, since the concave portion has a steep step shape, it is necessary to pattern by a special method such as an electroformed resist method or an oblique exposure method described later. However, the patterning of the recesses is time-consuming, but there is a great merit that these are unnecessary.) The piezoelectric substrate 235 at the bottom of the first recess 226 and the piezoelectric substrate 236 at the bottom of the first recess 227 Since the thin plate 219 adheres and is fixed to the second thin plate 219, it hardly deforms even when the pressure P1 fluctuates, so that almost no charge is generated in this region. Similarly, since the piezoelectric substrate 240 at the bottom of the second recess 228 is also adhered and fixed to the first thin plate 218, it hardly deforms even when the pressure P2 fluctuates. Almost no.

FIG. 13C is a schematic diagram showing the structure shown in FIG. 14F, that is, the case where the piezoelectric substrate is used as the side wall substrate and the side wall substrate is deformed by the pressure change of the recess. FIG. 13C shows a cross-sectional structure similarly to FIG. In FIG. 13C, conductor films 54 and 56 are formed on both sides of the piezoelectric substrate side wall 53, and insulating films 55 and 57 are formed thereon. Conductor films 59 and 61 are formed on both sides of the other piezoelectric substrate side wall 58 of the recess 68, and insulating films 60 and 62 are formed thereon. A first thin plate 63 is attached to the upper part of the piezoelectric substrate side walls 53 and 58, and a second thin plate 64 is attached to the lower part of the piezoelectric substrate side walls 53 and 58. The recess 68 is a closed space surrounded by the side walls and the thin plate, and a pressure P1 is applied from the pressure introducing hole 65 provided in the first thin plate 63. A pressure introducing hole 66 to the concave portion 69 on the left side of the piezoelectric substrate side wall 53 is formed in the second thin plate 64, and a pressure P2 is applied. A pressure introducing hole 67 to the concave portion 70 on the right side of the piezoelectric substrate side wall 58 is formed in the second thin plate 64, and pressure P3 is applied. When P2, P3 <P1, the piezoelectric substrate side wall 53 and the piezoelectric substrate side wall 58 bulge and deform outward (to the concave portion 69 and the concave portion 70 side) as shown in FIG. If the thickness of the piezoelectric substrate side walls 53 and 58 is constant with respect to the height direction of the side walls and is regulated by the upper and lower first thin plates 63 and the second thin plates 64 (that is, the piezoelectric substrate side walls 53 and 58 and the first thin plate 63 and the second thin plate 64 do not move), the vicinity of the center of the piezoelectric substrate side walls 53 and 58 is most deformed. With this deformation, charges are generated (polarized) on the convex surface of the piezoelectric substrate side wall 53, and charges opposite to the convex side are generated (polarized) on the concave surface of the piezoelectric substrate side wall 53. There is a potential difference between the two. That is, a potential difference is generated between the electrode terminal C1 drawn from the conductor film 54 and the electrode terminal C2 drawn from the conductor film 56. On the other hand, a charge is generated (polarized) on the convex surface of the piezoelectric substrate side wall 58, and a charge opposite to the convex side is generated (polarized) on the concave surface of the piezoelectric substrate side wall 58. Occurs. That is, a potential difference is generated between the electrode terminal C4 drawn from the conductor film 59 and the electrode terminal C3 drawn from the conductor film 61. Since C1 and C4 have the same polarity potential, and C2 and C3 have the same polarity potential, combining them (C1 and C4 connected, C2 and C3 connected) increases the potential and increases the sensitivity.

Next, a method for manufacturing a piezoelectric element using the piezoelectric substrate 211 of the present invention shown in FIG. As shown in FIG. 14A, an insulating film 271 is formed on the first surface (front surface) of the piezoelectric substrate 211, a photoresist 272 is further formed thereon, and a window 273 for forming a first recess is formed. Open. The piezoelectric substrate is a substrate of a substance exhibiting a piezoelectric effect, and is also called, for example, lead zirconate titanate {Zirconate / lead titanate (Pb (Zr _X Ti _1-X ) O ₃ 0 <x <1). , So-called PZT}, barium titanate, lead titanate, potassium niobate, lithium niobate, lithium tantalate, sodium tungstate, zinc oxide, lithium tetraborate and other ceramics having a perovskite structure and a tungsten-bronze structure, Or quartz, quartz, Rochelle salt, topaz, tourmaline, berlinite (aluminum phosphate), aluminum nitride, gallium phosphate, gallium arsenide, etc., or a piezoelectric polymer {eg, polyvinylidene fluoride (PVDF)} Or a material mainly composed of these.

The insulating film 271 is for protecting the surface of the piezoelectric substrate 211 and for improving the adhesion between the piezoelectric substrate 211 and the photoresist 272. However, the insulating film 271 does not have to be formed if unnecessary. . The insulating film 271 is, for example, a silicon oxide film (SiOx), a silicon nitride film (SiNy), or a silicon oxynitride film (SiOxNy) formed by a CVD method or a PVD method. The thickness of the piezoelectric substrate 211 depends on the size of the piezoelectric element, but is about 1 μm to 2000 μm. When the piezoelectric substrate is thin and difficult to handle, it can be attached to another substrate for processing. The present invention can be applied even if the concave portion can be formed with high accuracy even if it is thicker than 2000 μm. The thickness of the insulating film 271 is about 0.1 μm to 1 μm for the purpose of improving adhesion, but when the piezoelectric substrate 211 is etched, the photoresist 272 is also etched, but all the photoresist 272 is etched. In this case, since the insulating film 271 serves as a mask, it is necessary to leave the insulating film 271 when etching of the piezoelectric substrate 211 is completed. Considering these, the thickness is approximately 0.1 μm to 3 μm. The thickness of the photoresist 272 depends on the thickness of the piezoelectric substrate to be etched and at the same time depends on the etching selectivity between the photoresist film and the piezoelectric substrate at the time of etching. When the selection ratio is high (the piezoelectric substrate has a higher etching rate), the thickness of the photoresist 272 can be reduced. For example, when the thickness of the piezoelectric substrate is 300 μm and the etching selectivity is 10, the thickness of the photoresist may be 30 μm or more. (It may be about 40 μm to 50 μm in consideration of etching variation.) When the photoresist becomes thick, an exposure method having a deep focal depth and a corresponding photoresist film are selected. Since the first recess is as faithful as possible to the photoresist pattern and as vertical as possible, the shape of the opening 273 of the photoresist is preferably as vertical as possible.

Next, using the photoresist pattern 272 as a mask, the insulating film 271 is removed by etching by dry etching or wet etching in the opening 273. When the insulating film 271 is a silicon oxide film (SiOx), a hydrofluoric acid aqueous solution such as a BHF liquid (buffered hydrofluoric acid liquid) is used in the wet etching. In the case of dry etching, the silicon oxide film (SiOx) is etched using a dry etching apparatus with an etching gas such as CF4, C2F6, C3F8 or the like. The etching shape is preferably as close to the mask pattern as possible and a vertical pattern. Therefore, anisotropic etching is desirable. If the insulating film 271 is not provided, the insulating film 271 need not be etched. Next, the piezoelectric substrate 211 exposed in the opening 273 is etched using the photoresist 272 and the etched insulating film 271 as a mask. The etching shape of the piezoelectric substrate 211 is preferably as faithful as possible to the mask pattern and a vertical pattern. For example, when the piezoelectric substrate is PZT, the vertical pattern can be formed by anisotropic etching using a dry etching apparatus with C3F8, SF6, Cl2, or the like as an etching gas. In this way, the first recesses 226 and 227 are formed in the piezoelectric substrate 211. After forming the first recesses 226 and 227, the photoresist pattern 272 is removed. This resist removal is performed using ashing with oxygen plasma, a nitric acid-based remover, or an organic resist remover. If there is no problem, the insulating film 271 may be left or removed.

The thickness of the substrate is Hs, the depth of the first recess is Hc1, and the width of the first recess is Wc1. As described above, Hs is 10 μm to 2000 μm, and Hc1 is naturally smaller than Hs. However, as Hc1 is larger, the deformation of the side wall of the piezoelectric substrate 211 becomes larger, so that more charges are generated, but considering etching variations, In consideration of the strength of the bottom 274 of the first recess, it is desirable to leave about 10% of Hs. For example, if the substrate thickness is 500 μm, it is desirable to leave about 50 μm. However, as will be described later, since the second thin plate adheres to this portion, there is no problem in practical strength even if it is made thinner. Since the adhesion layer, the conductor film, and the insulating film are stacked after this, the width Wc1 of the first recess needs to be wide enough to be stacked up to the inside of the first recess. This naturally depends on the method of laminating these films. With the current technology, these films can be formed if the aspect ratio (Hc1 / Wc1) is about 20 in the case of the CVD method. In the case of the PVD method, it is about 10. For example, when Hc1 is 300 μm, Wc1 is 30 μm, the aspect ratio is 10), it is possible to stack a sputtered conductive film inside the first recess. The smaller the Wcl is, the smaller the planar size of the piezoelectric element in the piezoelectric substrate can be. When the side wall of the piezoelectric substrate is formed also in the Wc1 direction (diaphragm determined by Wc1 and Hc1), Wc1 needs to have a certain size, which is an advantageous direction for the above film formation. In this case, a diaphragm can be formed on the four surfaces of the side wall of the rectangular parallelepiped first recess.

For example, the depth (longitudinal direction) of the first concave portion is Lc1 (the length of the remaining one side of the rectangular parallelepiped first concave portion other than Hc1 and Wc1, and is shown obliquely in FIG. 14 (a). Since this figure is a cross-sectional structure, Lc1 is actually perpendicular to the paper surface), and Lc1 and Hc1 are preferably the same size (preferably), so Wc1 when four surfaces are diaphragms Also, it is (preferably) about the same size as Hc1. When Hc1 is 300 μm (assuming the minimum width Wc1 of the first recess is 30 μm, the minimum width Wc2 of the second recess is 30 μm, and the width of the piezoelectric side wall is 10 μm), the four side walls of the first recess When a diaphragm is formed, a size of 380 μm is required, but if a combination of the first concave portion and the second concave portion is arranged in one direction (for example, lateral direction), 70 μm is required for one combination, so about five sets The diaphragm assembly enters the size of 380 μm. Therefore, in the case of the present invention, the diaphragm arranged in one direction can be made smaller than the diaphragm which forms four surfaces around one first recess. In the case of the present invention, if a conductor film or the like is formed in the first recess, it is not necessary to pattern these films in the first recess region. It is better to line up. The 30 μm mentioned above can be further reduced by further improvement of the thin film forming technology, and thus will become more advantageous in the future. Therefore, it is advantageous about 10 times compared with the conventional planar diaphragm, and if the area is the same, it means that the present invention is about 10 times more sensitive than the conventional method. Naturally, in the future, even with a larger aspect ratio, it becomes possible to form a film inside the first recess without any problem.

After removing foreign substances in the first recesses 226 and 227 and cleaning, an adhesion layer 212 and a conductor film 214 are laminated on the first surface (front surface) of the piezoelectric substrate 211 as shown in FIG. The conductor film 214 is a conductive thin film, such as platinum (Pt), copper (Cu), gold (Au), aluminum (Al), or an alloy thereof. The adhesion layer 212 is also a conductor film, but is a conductor film that improves the adhesion between the conductor film 214 and the piezoelectric substrate 211. The adhesion layer 212 is also a conductor film, such as titanium (Ti), titanium nitride (TiN), tantalum (Ta), or tantalum nitride (TaN). The adhesion layer 212 does not need to be laminated when it is not necessary. For example, the thickness of the adhesion layer 212 is 0 to 100 nm, and the thickness of the conductor film 214 is 10 nm to 2000 nm. When force is applied to the piezoelectric substrate 211 and polarized, the charge can be extracted through the adhesion layer 212 and the conductor film 214. As described above, since the charges generated in the first recess have the same polarity, the conductor film 214 (including the adhesion layer 212) does not need to be etched and patterned in the first recess. However, when forming a pattern for connecting the conductive layers 214 (including the adhesion layer 212) in different first recesses, unnecessary conductive layers 214 (including the adhesion layer 212) other than the regions of the first recesses must be removed. Therefore, a photolithographic method and etching of the conductive layer 214 (including the adhesion layer 212) are performed for pattern formation therefor. At this time, the regions of the first recesses 226 and 227 are covered with a photoresist. Next, after removing the photoresist, an insulating film 216 is stacked. This insulating film 216 protects the first recess and the conductor film 214, and is a silicon oxide film, a silicon oxynitride film, a silicon nitride film, or the like, and is laminated by a CVD method or a PVD method.

Next, as shown in FIG. 14C, a support substrate (first thin plate) 276 is attached to the first surface (front surface) of the piezoelectric substrate 211. The support substrate 276 protects elements such as the first recess formed on the first surface (front surface) of the piezoelectric substrate 211 such as the first recess, and the strength of the piezoelectric substrate 211 is reduced when the second recess is formed. The purpose is to prevent damage to the piezoelectric substrate 211 and to prevent distortion of the piezoelectric substrate due to deformation during the process. Therefore, it is not necessary when no problem occurs. For example, if the proportion of the recesses in the piezoelectric substrate 211 is small, the substrate is less distorted. The support substrate may be a glass substrate, a quartz substrate, a ceramic substrate, an insulating substrate such as a plastic substrate, a conductor substrate such as a metal plate, or a semiconductor substrate. What is necessary is just to select suitably according to intensity | strength and process conditions. When the support substrate is used also as the first thin plate, it is necessary to use a highly reliable material in consideration of the use environment of the piezoelectric element, and the material including the thickness may be appropriately selected.

As a method of attaching the support substrate 276 to the piezoelectric substrate 211, there are a method of bonding at room temperature, a method of vacuum pressing, a method of high temperature bonding, diffusion bonding, and a method of attaching using an adhesive. In the case of using an adhesive, in order to prevent the adhesive from entering the first recess as much as possible, the adhesive is coated only on a necessary portion of the support substrate 276 (a portion where the piezoelectric substrate 211 and the support substrate adhere). Then, the support substrate 276 is attached to the piezoelectric substrate 211 by aligning the pattern. For example, an adhesive is coated on a necessary portion of the support substrate 276 using a mask (screen printing is possible), and then the support substrate 276 is attached to the piezoelectric substrate 211. When the adhesive is used, a predetermined heat treatment or the like is performed to securely fix the support substrate 276 to the piezoelectric substrate 211. In addition, for the adhesive, a material and a bonding condition are selected so that the adhesive force does not decrease in the subsequent process.

When the support substrate 276 is used as the first thin plate, it is not necessary to remove the support substrate 276 from the piezoelectric substrate 211 after being attached, but when the support substrate 276 is not used as the first thin plate, the piezoelectric substrate 211 is used. Since it is necessary to remove the substrate 211 after the back surface processing is completed, an adhesive that can be removed is selected. For example, by using an adhesive that does not soften at the temperature (T2) of the second recess formation process with a heat softening adhesive, but softens at a temperature higher than that, a temperature higher than T2 after the end of the second recess process. The support substrate 276 is removed from the piezoelectric substrate 211. When the support substrate 276 is used as the first thin plate, the adhesive may be a thermosoftening adhesive that does not soften at T2 or a thermosetting adhesive. In the case where the support substrate 276 is used as the first thin plate and the pressure introduction port is not provided in the first recess, the pressure confined in the first recess when the support substrate 276 is attached to the piezoelectric substrate 211 (this is Then, the pressure in the first recess is determined. When it is desired to make P0 close to vacuum (P0 is approximately 0 atm), the support substrate 276 is attached to the piezoelectric substrate 211 under the pressure of P0. When it is desired to set P0 to 1 atm, the support substrate 276 may be attached to the piezoelectric substrate 211 under atmospheric pressure.

Next, a second recess is formed on the back surface of the piezoelectric substrate 211. An insulating film 277 is formed on the second surface (back surface) of the piezoelectric substrate 211. The purpose and formation method of the insulating film 277 are the same as those of the insulating film 271. A photoresist pattern 278 for forming a second recess is formed on the insulating film 277 by using a photolithography method. The photoresist opening 279 is an opening for forming the second recess. The photoresist pattern 278 and the photoresist opening 279 are formed in alignment with the pattern of the first surface (front surface) of the piezoelectric substrate 211, particularly the first recesses 226 and 227. If the piezoelectric substrate 211 is transparent or easily transmits a certain amount of light (specific), if light having a wavelength that can be transmitted through the piezoelectric substrate 211 is irradiated from the front surface to the back surface, the light is received. Therefore, since the photoresist patterns 278 and 279 on the back surface can be aligned (aligned) directly with the pattern on the first surface (front surface) of the piezoelectric substrate 211, alignment with high accuracy can be performed. For example, the alignment accuracy can be 0.3 μm to 0.1 μm or less. When the piezoelectric substrate is PZT, the light transmittance is 50% or more in the wavelength range of 500 nm to 800 nm (visible light range). Therefore, visible light is irradiated from the substrate surface to form a pattern (mask) on the back surface of the substrate. Can be aligned. Further, the photoresist 278 is patterned slightly larger than the first recess. That is, the thickness of the side wall of the piezoelectric substrate 211 is larger on one side than the width Wc1 of the first recess.

Next, as shown in FIG. 14D, the insulating film 277 exposed at the opening 279 of the photoresist pattern is removed by etching. The etching of the insulating film 277 is similar to the etching of the insulating film 271. Next, the piezoelectric substrate 211 exposed at the opening 279 of the photoresist pattern is removed by etching. Since the etching pattern shape needs to be formed as faithfully as possible to the photoresist pattern 278, a vertical pattern is desirable. Further, it is desirable that the thickness of the piezoelectric side wall sandwiched between the first recess and the second recess is as equal as possible. That is, in FIG. 14D, it is desirable that Wsc-1 = Wsc-2 = Wsc-3 = Wsc-4. Accordingly, if the width of the photoresist pattern 278 is Wr278 and the pattern width etched by this photoresist pattern is Wc2, Wc2 = Wr278 is preferable, and Wc2 = Wc1 + Wsc-1 + Wsc-2 is preferable. Accordingly, it is desirable to form the second concave portions 228, 229, and 230 having a vertical shape with as little side etching as possible.

Further, the second recess is prevented from penetrating the first surface, and a part of the piezoelectric substrate 211 is left at the bottom 240 of the second recess. This etching method may be the same as the method for forming the first recess. The thickness of the bottom 240 of the second recess is preferably 5% to 15% of the piezoelectric substrate 211. For example, when the thickness of the piezoelectric substrate is 500 μm, it is desirable to leave 25 μm to 75 μm. If it is 5% or less, there is a possibility that a portion of the piezoelectric substrate 211 disappears in the substrate (wafer) due to etching variation or the like, and if it is more than 15%, the piezoelectric substrate is not used effectively. . However, there is no problem in the characteristics of the present invention as long as the piezoelectric body is present at the bottom 240 of the second concave portion even if it is extremely thin. That is, since the piezoelectric substrate bottom portion 240 of the second recess is already attached to the support substrate 276, there is no particular problem because it is already strongly reinforced in strength. However, in the process from removing the support substrate 276 and attaching the first thin plate, it is necessary to pay close attention so that this portion is not damaged. By forming the second recesses 228, 229, 230, the side walls 231, 232, 233, 234 of the piezoelectric substrate are formed between the first recesses 226, 227, and these side walls serve as diaphragms. Deformation is caused by the difference between the internal pressure and the internal pressure of the second recess, and correspondingly, this portion is polarized by the piezoelectric effect, and opposite charges are generated on both side surfaces of the piezoelectric substrate 211.

Next, the photoresist 278 is removed. This removal method is the same as the removal of the photoresist 272. Since the elements (first recesses and conductor film) on the first surface side of the piezoelectric substrate 211 are protected by the support substrate 276, no damage or the like is introduced during the removal. Since the thickness of the bottoms 235 and 236 of the first recess is about 10% of the thickness of the piezoelectric substrate 211, there is no problem. Further, since the thick piezoelectric substrate is present and supported on the depth side, it is not deformed by this photo-registry move or subsequent processes. If there is no problem, the insulating film 277 may be left. In the case of etching, an aqueous solution for etching the insulating film (for example, a hydrofluoric acid-based etching solution if the insulating film is a silicon oxide film) or a dry etching method may be used. However, since the piezoelectric substrate 211 is exposed, it is necessary to set a material and conditions that do not etch the piezoelectric substrate 211 as much as possible.

Next, as shown in FIG. 14E, an adhesion layer 213, a conductor film 215, and an insulating film 217 are stacked on the second surface side. The adhesion layer 213 may have the same purpose and the same material and conditions as the adhesion layer 212. The conductor film 215 is similar to the conductor film 214, and the insulating film 217 is similar to the insulating film 216. Since the first concave portion and the second concave portion are formed, the piezoelectric substrate 211 seems to be considerably etched and weakened in FIG. 14E, but actually, the direction perpendicular to the paper surface of FIG. In addition, since there are many regions where a thick substrate without a concave portion remains, the strength of the substrate 211 during the process is sufficient. Furthermore, since the support substrate 276 covers and supports the entire piezoelectric substrate 211, the strength of the piezoelectric substrate 211 is not a problem. In addition, since the adhesion layer 213 and the conductor layer 215 can be stacked in the same apparatus, they can be stacked continuously. For example, using a sputtering device, argon sputter etching is first performed to lightly remove the insulating film on the surface of the piezoelectric substrate (also referred to as reverse sputtering), then titanium is sputtered, and platinum is continuously added. Etc. can be laminated. As with the first surface (front surface) side, the conductor film 215 does not need to be etched or the like in the region having the second recess, and therefore, if these films can be laminated inside the second recess, the piezoelectric element of the present invention can be manufactured. . When the conductor film is etched by patterning with a photoresist on a flat surface, the second recessed region may be covered with a photoresist or the like so as not to be etched. For example, if a portion other than the second recessed region is exposed and patterned using a positive resist, a fine pattern can be formed. If the second recessed region is not exposed, the resist is not dissolved by development. It can be left in the recessed area.

Next, as shown in FIG. 14 (f), a second thin plate 219 is attached to the second surface (back surface) of the piezoelectric substrate 211. The means and method for attaching are the same as those for attaching the support substrate 276. The thin plate 219 is for protecting the piezoelectric element of the present invention (particularly, the second concave portion or the wiring facing the second surface side) and may be considered as a kind of package and can be used as it is. . The thin plate 219 is, for example, an insulating substrate such as a glass substrate, a quartz substrate, a ceramic substrate, or a plastic substrate. Alternatively, a conductive substrate such as metal may be used. In the case of a conductor substrate, care must be taken so as not to short-circuit between electrodes, but it can be characterized by being resistant to static electricity. Alternatively, a semiconductor substrate may be used. The thickness of the thin plate 219 is 20 μm to 2000 μm (may be thicker), and may be appropriately selected depending on the use environment, thickness limitation (in the case of a thin package, the thickness is naturally reduced), strength, and the like. In order to confine the pressure of the second recess, the pressure during the process for attaching the second thin plate 219 may be adjusted to the pressure and completely sealed under the pressure. Further, a gas adsorbent that lowers the internal pressure by adsorbing outgas generated during the process in the second recess may be placed in the second recess. The same applies to the first recess. As the gas adsorbent, for example, if a zirconia-based one is inserted, at least a part or all of moisture, oxygen, hydrogen, carbon dioxide, nitrogen and the like can be adsorbed.

After the second thin plate 219 is attached to the back surface (second surface) of the piezoelectric substrate 211, the support substrate 276 may be removed and the first thin plate may be attached. The method for attaching the first thin plate is the same as the method for attaching the second thin plate. Alternatively, the first thin plate can be replaced by the support substrate 276. If it substitutes, it is not necessary to remove the support substrate 276, and the process can be simplified. When the support substrate 276, the second thin plate 219, and the first thin plate are thinned, they may be thinned by etching or polishing after being attached. If the CMP method (chemical polishing method) is used, the support substrate and the thin plate can be thinned with high accuracy. It can also be thinned to about 10 μm to 200 μm. As described above, a thin thin plate or a support substrate attached to another substrate may be attached to the front or back surface of the piezoelectric substrate, and then the other substrate may be removed.

Next, pressure introduction holes, lead electrodes and wirings are formed. First, pressure introducing holes 237 and 238 are formed in the support substrate 276 (or the first thin plate 218) attached to the first surface side of the piezoelectric substrate 211. For this purpose, a portion other than the place where the pressure introducing holes 237 and 238 are to be formed is covered with a photoresist by using a photolithography method. As the photoresist, a coating method or a dry film can be used. Alternatively, patterning can be performed using an imprint method. Since the introduction hole does not need to be fine, it may be formed by wet etching. When the support substrate 276 (or the first thin plate 218) is a glass substrate, etching is performed with a hydrofluoric acid-based wet etching solution such as BHF. Of course, it may be formed by dry etching. In the case where the support substrate 276 (or the first thin plate 218) is a glass substrate, the glass substrate is etched with a fluorine-based gas such as CFx or SFx using a dry etching apparatus. When the support substrate 276 is etched, the support substrate 276 in this region 281 is also etched away at the same time in order to draw electrodes / wiring from the conductor films 214 and 215 through the contact hole wiring. When the support substrate 276 is removed, the insulating film 216 is exposed. If the etching rate of the insulating film 216 is made slower than the etching rate of the support substrate 276 (if the etching selectivity is increased), the support substrate 276 can be removed without etching the insulating film 216 much. If the support substrate 276 is a glass substrate and a silicon nitride film in which the insulating film 216 is laminated by the plasma CVD method, and the support substrate 276 is etched with a hydrofluoric acid aqueous solution such as BHF, the underlying insulating film 216 is hardly etched.

After the photoresist is removed, a photolithography process for forming the contact hole 254 is performed, a window is formed in a portion where the contact hole 254 is formed, and the insulating film 216 is etched from the opened portion to form the contact hole 254. Form. When the insulating film 216 is a silicon nitride film (SiNy), a silicon oxide film (SiOx), or a silicon oxynitride film (SiOxNy), the insulating film 216 is made of a fluorine-based gas such as CF4, C2F6, or C4F8 using a dry etching apparatus. Is etched to expose the conductor film 214 in the contact hole 254. Thereafter, the resist is removed, and a conductor film 255 is stacked in the contact hole 254. The conductor film 255 may be laminated only on the contact hole 254 by using a selective CVD method or a plating method.

For example, a tungsten (W) film can be selectively grown only in the contact hole 254 (only the portion where the conductor film 214 is exposed) by selective CVD using WF6 gas. Alternatively, for example, a copper (Cu) film can be laminated on the conductor film 216 by a plating method. Alternatively, the conductor film 255 can be laminated also on the contact hole 254 by laminating the conductor film on the entire first surface of the piezoelectric substrate 211. In this case, the electrode / wiring 256 can also be used as a conductor film, and the electrode / wiring 256 is formed by photolithography and etching of the conductor film after the conductor film is laminated. At this time, since the conductor film 255 formed in the contact hole is always covered with the electrode / wiring, the contact wiring 255 is also formed at the same time. The conductor film formed here is, for example, a metal film such as aluminum, copper film, Ti, Cr, W, Mo, or a gold film, or various silicide films, and has adhesiveness to the conductor film 214 and the insulating film 216. In order to improve and improve the contact property with the conductor film 214, the aluminum is formed after the barrier metal is formed. Examples of the barrier metal include titanium, titanium nitride (TiNx), chromium (Cr), tantalum (Ta), and tantalum nitride (TaNx). The thickness of the barrier metal is, for example, 10 nm to 100 nm, and the thickness of the conductor film 256 is, for example, 500 nm to 2000 nm. Conductor films such as barrier metal and aluminum can be continuously formed by sputtering, vapor deposition, or CVD. If the first thin plate 218 (or support substrate 276) in the region 281 where the lead electrode (including the contact hole) is to be formed is removed in advance and then attached to the piezoelectric substrate 211, the thin plate 218 (or support substrate 276). ) Removal is not necessary.

Next, a process for forming the extraction electrode / wiring 253 from the conductor film 215 on the first surface (front surface) side will be described. In this case, the contact hole 250 is formed through the conductor film 212, the adhesion layer 212, the piezoelectric substrate 211, and the adhesion layer 213 as compared with the contact hole 254. That is, all these films are etched in order. First, a resist window is opened in the contact hole 250 by using a photolithography method. The insulating film 216, the conductor film 214, the adhesion layer 212, the piezoelectric substrate 211, and the adhesion layer 213 are etched from this window. (The adhesion layer 213 may be left because it is a conductor film.) Since it is easy to carry out in a single process, etching is performed sequentially while changing the etching gas and etching conditions for each film quality to be etched by a dry etching apparatus. Is desirable. If it is difficult to carry out with one dry etching device. Etching may be performed by changing the apparatus for each film quality. After the contact hole 250 is formed, the resist is removed. At this time, since the conductor film 214 and the adhesion layer 212 are also exposed to the contact hole 250, the insulating film 251 is formed on the side wall of the contact hole when the insulating film 251 is laminated in order to cover this portion with the insulating film. . The insulating film 251 is, for example, a silicon oxide film, a silicon oxynitride film, or a silicon nitride film. Since the insulating film 251 is also laminated on the conductor film 215 at the bottom of the contact hole, the entire surface of the insulating film 251 (anisotropic etching) is performed from the first surface side of the piezoelectric substrate 211. By this anisotropic etching, the insulating film 251 at the bottom of the contact hole 250 is completely etched and the conductor film 215 is exposed, but the sidewall insulating film 251 of the contact hole 250 is considerably thick in the depth direction. The insulating film 251 on the side wall of the contact hole 250 is hardly etched. Thereafter, the conductor films 252 and 253 are laminated, and the electrode / wiring 253 is formed by using a photolithography method and a conductor film etching method. The conductor 252 may be formed by a selective CVD method or a plating method. The formation method, the formation means, and the lamination of the barrier metal and the like are the same as in the case of forming the electrode / wiring 256. However, since the contact hole 250 is deeper than the contact hole 254, it is desirable that the selective CVD method or the plating method be performed under conditions that allow the contact hole 250 to be covered. The conductor 252 may also be used as the electrode / wiring conductor film 253, but it is important that the conductor 252 is stacked on the contact hole 250 under conditions of good coverage. As described above, the lead electrodes / wirings 256 and 253 from the conductive films 214 and 215 can be formed on the first surface (front surface) of the piezoelectric substrate 211 as shown in FIG.

Next, a method for forming electrodes on the back surface side (second surface side) of the substrate 211 will be described. Although this method and means are the same as those on the first surface side, a method of taking out electrodes / wirings on the second thin plate 219 will be described. When extracting the electrode / wiring 259 from the conductor film 215, as shown in FIG. 14 (f), a photoresist window for forming the contact hole 257 is opened in the second thin plate 219 using a photolithography method. Next, the second thin plate 219 is etched from the place where the window is opened. If the second thin plate is a glass substrate, for example, if wet etching, the second thin plate is removed by etching with a hydrofluoric acid-based etchant such as BHF. In the case of dry etching, the second thin plate is removed by etching using CF4 or CHF3 fluorine gas. Thereafter, the insulating film 217 is etched to expose the conductor film 215. Thereafter, the resist or the like is removed, the barrier metal and the conductor film are laminated, and the in-contact conductor film 258 and the conductor / wiring 259 are formed by photolithography and etching. The conductor film 258 may be formed by selective CVD or plating.

As a method of extracting the electrode / wiring 263 from the conductor film 214, in addition to the case of forming the electrode / wiring 253, a method of first removing the second thin plate 219 by etching is added. After the contact hole 260 is formed, a sidewall insulating film 261 is formed to cover the conductor film 215 and the adhesion layer 213. Thereafter, a contact conductor film 262 and electrodes / wirings 263 are formed. In the above description, the extraction electrodes from the conductor films 214 and 215 are formed on both the first surface side and the second surface side, but only one of them is sufficient. For example, the deep contact holes 250 and 260 are not formed by pulling out the lead electrode of the conductor film 214 from the first surface side and the lead electrode of the conductor film 214 from the second surface side, so that the process is simple. Moreover, reliability can be improved. Furthermore, as can be seen from the above, since the aspect ratio increases when a contact hole is also formed in the piezoelectric substrate 211 and the thin plate 218 (219), the lead electrode from the conductor film 214 is more preferably provided on the first surface side. It is preferable that the lead electrode formed on the insulating film 216 is formed on the insulating film 217 from the second surface side (in the above description, a contact hole is also formed in the second thin plate. The second thin plate 219 is removed in advance). Note that the second thin plate 219 is also formed with a pressure transmission hole (for example, 239) to the second recesses 228, 229, 230, and the like. The method for forming the pressure transmission hole is the same as that for forming the first thin plate 218 and the support substrate 276. When the contact hole is formed, the pressure transmission hole can be formed together or separately. May be. Alternatively, the second thin plate 219 in the region where the contact holes 257 and 260 are to be formed (second thin plate 219) may be attached to the second surface (back surface) of the piezoelectric substrate 211. Since the aspect ratio of the contact holes 257 and 260 is reduced, it is easy to form a conductor film in the contact holes. Further, a second thin plate 219 in which a pressure transmission hole is previously prepared may be attached. Furthermore, if the thin plate or the support substrate is thinned by a polishing method or etching before the contact hole is formed in the pressure transmission hole, the thin plate, or the support substrate, the pressure transmission hole or the contact hole can be easily formed. Further, since the aspect ratio of the contact hole is reduced, the coverage (step coverage) of the conductor film / wiring is also improved. However, when the thin plate or the support substrate is used as a protective material for the package body, it is necessary to determine the thickness thereof in consideration of reliability and strength.
By the above manufacturing method, a piezoelectric element having a diaphragm on the side wall of the piezoelectric substrate sandwiched between the first recess and the second recess formed in the piezoelectric substrate can be formed. Piezoelectric elements can be remarkably improved in sensitivity by connecting as many diaphragms as necessary, and even smaller pressure differences can be detected. Therefore, a very good piezoelectric element (pressure sensor) can be realized. For example, if the thickness of the piezoelectric substrate is 300 μm and the thicknesses of the first thin plate and the second thin plate are 100 μm, the pressure sensor can be a very thin pressure sensor having a package thickness of about 500 μm (0.5 mm). If either one of the pressure introduction holes (first side (front) side or second side (back side)) is closed (if not opened), absolute pressure can be detected, and By simply placing the pressure sensor package of the invention, the pressure of the environment can be detected.

Alternatively, if a voltage is applied to the extraction electrode, the substrate side wall (diaphragm) can be freely deformed, and the gas or liquid contained in the recess can be arbitrarily discharged, and the gas or liquid from the outside is recessed. Can also be incorporated. That is, it can serve as a pump. For example, if the electrodes of the recesses are arranged on the matrix, the corresponding recesses can be moved freely. If the pressure transmission holes are connected, gas or liquid can be transferred from one recess to another. Since the amount of deformation of the substrate side wall can be controlled by the magnitude of the voltage, the volume in the recess can be freely controlled, and the amount of gas or liquid entering the recess through the pressure transmission hole can also be controlled. These can also be applied to inkjet devices. Furthermore, if an open / close valve is also attached to the pressure transmission hole, a pump and gas / liquid transport system capable of complicated movement can be constructed by arbitrarily controlling the open / close valve control and the side wall control. Furthermore, according to the present invention, power generation is also possible by changing the pressures of P1 and P2 to deform and vibrate the piezoelectric substrate. For example, in the case of a pulsating liquid, the pressure of the second recess is fixed and the liquid enters and exits the first recess. When the liquid enters the first recess, the first recess expands, and when the liquid comes out of the first recess, the first recess becomes depressed. As a result, power can be generated by extracting charges from the polarization generated in the piezoelectric film or the piezoelectric substrate. (The structure shown in FIG. 13 is also the same.) Since the device of the present invention is very small and can be inserted into the human body, when an organ operation chip such as a pacemaker is embedded in the human body, Electricity can be generated using fluctuations in flow and breath. Furthermore, it is possible to generate electricity using an air flow generated by vibrations walking into the shoe sole. Moreover, since this invention can also enlarge, it can be used similarly for floor power generation. Furthermore, it can be applied to sea waves to generate electricity.

FIG. 15 is a diagram showing a method of manufacturing the piezoelectric device of the present invention using the imprint method. The piezoelectric polymer 4011 is applied or dropped onto the substrate 4009 or a sheet (film) -like piezoelectric polymer 4011 is attached. The piezoelectric polymer 4011 is thermoplastic (thermosoftening) and has a glass transition point of Tg4011. The temperature of the piezoelectric polymer 4011 is raised to Tg4011 or higher to soften or make the piezoelectric polymer liquid, and then the mold 4008 is pressed. Alternatively, when the piezoelectric polymer 4011 is a coating film, a dripping film, or a gel film, the mold 4008 may be pressed in a liquid or gel state, and then the temperature of the piezoelectric polymer 4011 may be raised to Tg 4011 or higher. (FIG. 15A) Thereafter, the temperature is lowered to Tg4011 or lower to cure the piezoelectric polymer 4011, and the mold 4011 is released. The convex portion 4007 of the mold 4008 forms a concave portion 4015 of the piezoelectric polymer 4011, and the concave portion 4005 of the mold 4008 forms a convex portion 4004 of the piezoelectric polymer 4011.

Next, a conductive polymer 4013 is applied or dropped onto a piezoelectric polymer 4011 substrate having a convex portion 4004 or a sheet (film) -like piezoelectric polymer 4011 is attached. The conductive polymer 4013 is thermosetting, and the curing temperature Tg4013 is selected to be lower than Tg4011. (Tg4013 <Tg4011) The liquid or gel conductive polymer 4013 also enters the recess 4015 of the piezoelectric polymer 4011 substrate. (FIG. 15B) A mold 4012 having a convex pattern 4012-c is pressed against the liquid or gel-like conductive polymer 4013. (FIG. 15C) The temperature on the piezoelectric polymer 4011 side is raised to around Tg4013 (T10), and the temperature on the conductive polymer 4013 side is kept lower than Tg4013. Tg is preferably Tg4013−5 ° C. <T10 <T10 + 10 ° C, more preferably Tg4013-1 ° C <T10 <T10 + 5 ° C. Thereafter, when the mold 4012 is separated from the conductive polymer 4013, a thin film of the conductive polymer 4013 adheres to the uneven pattern of the piezoelectric polymer 4011. The temperature on the piezoelectric polymer 4011 side is maintained between Tg4013 and Tg4011, and the conductive polymer 4013 is completely cured. As a result, a thin film of the conductive polymer 4013 is formed on the concavo-convex pattern of the piezoelectric polymer 4011. {FIG. 15 (d)}

Next, a wiring pattern of the conductive polymer film 4013 is formed by using a photolithography method, an imprint method, or an etching method. Here, if the conductive polymer film 4013 does not need to be provided with a wiring pattern, it may be omitted. As described above, it is not necessary to pattern the conductive polymer film 4013 in the concave portion of the piezoelectric polymer substrate 4011. It is only necessary to pattern the wiring pattern when forming the wiring pattern on the piezoelectric polymer substrate 4011, and the process is simple. is there. Next, an insulating polymer 4017 is applied or dropped on the conductive polymer film 4013 of the piezoelectric polymer substrate 4011 or a sheet (film) -like piezoelectric polymer 4011 is attached. The insulating polymer 4017 is thermosetting, and a curing temperature Tg4017 is selected that is lower than Tg4011. The liquid or gel-like insulating polymer 4017 also enters the concave portion of the piezoelectric polymer substrate 4011. {FIG. 15 (d)} A mold 4016 having a protruding pattern 4016-c is pressed against a liquid or gel insulating polymer 4017. The protruding pattern 4016-c of the mold 4016 enters the recess 4015 of the piezoelectric polymer substrate 4011. {FIG. 15 (e)} The temperature on the piezoelectric polymer 4011 side is raised to around Tg4017 (T11), and the temperature on the insulating polymer 4017 side is kept lower than Tg4017. T11 is preferably Tg4017−5 ° C. <T11 <T11 + 10 ° C, more preferably Tg4017-1 ° C <T11 <T11 + 5 ° C. Thereafter, when the mold 4016 is separated from the insulating polymer 4017, a thin film of the insulating polymer 4017 adheres to the conductive polymer 4013 attached to the uneven pattern of the piezoelectric polymer 4011. The temperature on the piezoelectric polymer 4011 side is maintained between Tg4017 and Tg4011, and the insulating polymer 4017 is completely cured. As a result, a thin film of the insulating polymer 4013 is formed on the conductive polymer 4013 attached on the uneven pattern of the piezoelectric polymer 4011. {FIG. 15 (f)}

In FIGS. 15B to 15E, the substrate 4009 on the piezoelectric polymer 4011 side is not shown, but the substrate 4009 is also a support substrate for the piezoelectric polymer 4011 substrate. It is better to process by adhering to. Next, the second thin plate 4023 is attached to the side having the concavo-convex pattern on the piezoelectric polymer 4011 side. You may make it adhere via the adhesive 4024 between the convex part of the uneven | corrugated pattern by the side of the piezoelectric polymer 4011, and the 2nd thin plate 4023. FIG. The adhesive 4024 is a thermosetting resin, and when the curing temperature is Tg4024, the Tg4024 is selected to be lower than Tg4011. The temperature is maintained between Tg4024 and Tg4011, the adhesive 4024 is completely cured, and the second thin plate 4023 is fixed to the concavo-convex pattern side on the piezoelectric polymer 4011 side. At this time, the concave portion 4015 of the concave / convex pattern on the piezoelectric polymer 4011 side is closed between the second thin plate 4023 and the piezoelectric polymer 4011. {FIG. 15 (f)}

Next, the substrate 4009 is separated from the piezoelectric polymer 4011. For example, since the piezoelectric polymer 4011 is softened by setting the temperature higher than Tg 4011, the substrate 4009 can be separated from the piezoelectric polymer 4011. Next, when the temperature of the piezoelectric polymer 4011 (attached to the second thin plate 4023) is maintained at Tg 4011 or higher, the piezoelectric polymer 4011 is softened. In a state where the piezoelectric polymer 4011 is softened, the mold 4018 is pressed into the piezoelectric polymer 4011, and the convex portion of the mold 4018 is put into the portion 4019 to be the concave region of the piezoelectric polymer 4011. The piezoelectric polymer 4011 is aligned and pressed as precisely as possible so that the thickness of the piezoelectric polymer 4011 becomes a predetermined thickness. Next, after the temperature is lowered to a temperature lower than Tg 4011 and the piezoelectric polymer 4011 is cured, when the mold 4018 is separated from the piezoelectric polymer 4011, a recess 4019 of the piezoelectric polymer 4011 is formed. In the recess 4019, the thickness of the piezoelectric polymer 4011, in particular, the side surface thickness W4011 is made with high accuracy. {FIG. 15 (g), (h), (j)}

Although the depression 4015 may be deformed by mold pressing, it is necessary to control with a pressure that does not cause deformation, or a pressure transmission hole is formed in the second thin plate 4023 in a region where the depression 4015 is present. By applying a pressure (for example, air pressure, nitrogen pressure or liquid pressure) that can resist the pressing of the mold to the recess 4015 from the pressure transmission hole, the recess 4015 can be prevented from being deformed. Alternatively, before the second thin plate 4023 is attached, the recess 4015 is filled with a thermoplastic polymer and cured, and after this (Tg is lower than Tg4011), the pressure plate is opened from the pressure transmission hole formed in the second thin plate 4023. There is also a way to let it flow. Alternatively, after filling with a thermoplastic polymer and covering with another substrate, the conductive film 4021 and the insulating film 4025 are formed, then the other substrate is removed, and the polymer in the recess 4015 is taken out.

Next, a conductive polymer 4021 is applied, dropped, or a sheet (film) -like piezoelectric polymer 4011 is attached. In particular, the concave portion 4019 of the piezoelectric polymer 4011 is filled (or sufficiently filled). The conductive polymer 4021 is a thermosetting resin or a photocurable resin. When the conductive polymer 4021 is a thermosetting resin, a resin having a curing temperature Tg4021 lower than Tg4011 is selected. {FIG. 15 (j)} Next, the mold 4022 is pressed against the liquid or gel-like conductive polymer 4021. The convex part of the mold 4022 enters the concave part 4019 of the piezoelectric polymer 4011. At this time, the depression 4015 may be deformed by pressing, but it is necessary to control with a pressure that does not cause deformation, or a pressure transmission hole is formed in the second thin plate 4023 in a region where the depression 4015 is present. By applying a pressure (for example, air pressure, nitrogen pressure or liquid pressure) that can resist the pressing of the mold to the recess 4015 from the pressure transmission hole, the recess 4015 can be prevented from being deformed. Alternatively, before the second thin plate 4023 is attached, the recess 4015 is filled with a thermoplastic polymer and cured, and after this (Tg is lower than Tg4021), the pressure plate is opened from the pressure transmission hole formed in the second thin plate 4023. There is also a way to let it flow. Alternatively, after filling with a thermoplastic polymer and covering with another substrate, the conductive film 4021 and the insulating film 4025 are formed, then the other substrate is removed, and the polymer in the recess 4015 is taken out. Note that in the case where the conductive polymer 4021 is a photocurable resin, the mold 4022 is pressed against the conductive polymer 4021 and then irradiated with curing light. Therefore, it is desirable that the mold 4022 or the second thin plate 4023 be formed of a material that transmits this light, for example, glass or quartz. {FIG. 15 (k), (m)}

Next, when the entire temperature is maintained between Tg4021 and Tg4011 to cure the conductive polymer 4021 and release the mold 4022, a thin film of the conductive polymer 4021 is formed on the piezoelectric polymer 4011. {FIG. 15 (l)} Next, necessary wiring patterning is performed on the conductive polymer 4021. Since the conductive polymer 4021 in the recess 4019 does not need to be patterned, it can be easily processed by a normal photolithography + etching process. Thereafter, the insulating polymer 4025 is applied, dropped, or a sheet (film) -like piezoelectric polymer 4011 is attached. In particular, the concave portion 4019 of the piezoelectric polymer 4011 is filled (or sufficiently filled). This insulating polymer 4025 is a thermosetting resin or a photocurable resin. When the insulating polymer 4025 is a thermosetting resin, a resin having a curing temperature Tg4025 lower than Tg4011 is selected. {Figure 15 (m)}

Next, the mold 4026 is pressed against the liquid or gel insulating polymer 4025. The convex part of the mold enters the concave part 4019 of the piezoelectric polymer 4011. At this time, the depression 4015 may be deformed by pressing, but it is necessary to control with a pressure that does not deform, or a pressure transmission hole is formed in the second thin plate 2023 in a region where the depression 4015 is present. By applying a pressure (for example, air pressure, nitrogen pressure or liquid pressure) that can resist the pressing of the mold to the recess 4015 from the pressure transmission hole, the recess 4015 can be prevented from being deformed. Alternatively, before the second thin plate 4023 is attached, the recess 4015 is filled with a thermoplastic polymer and cured, and after this (Tg is lower than Tg4025), the pressure plate is opened from the pressure transmission hole formed in the second thin plate 4023. There is also a way to let it flow. Alternatively, after filling with a thermoplastic polymer and covering with another substrate, the conductive film 4021 and the insulating film 4025 are formed, then the other substrate is removed, and the polymer in the recess 4015 is taken out. {FIG. 15 (p)}
Next, if the whole temperature is maintained between Tg4025 and Tg4011, the insulating polymer 4025 is cured, and the mold 4026 is released, a thin film of the insulating polymer 4025 is formed on the conductive polymer 4021 on the piezoelectric polymer 4011. Is formed. {FIG. 15 (o)} The insulating polymer 4025 serves as a protective film for the conductive polymer. Next, the first thin plate 4027 is attached to the insulating polymer 4025 through an adhesive or the like. {FIG. 15 (p)} The first thin plate in the region for the pressure transmission hole and the extraction electrode is removed in the concave portion 4019. Thereafter, lead electrode wirings and the like are formed, and a piezoelectric element device is manufactured. Note that the extraction electrode and the like (and the contact hole therefor) may be formed before the first thin plate 4027 is attached. (The same applies to the second thin plate 4023.) Further, a thin plate from which pressure transmission holes and lead electrode regions have been previously removed may be attached.

As described above, a highly accurate piezoelectric element device can be manufactured by a very simple process and a low temperature process. The piezoelectric element device shown in FIG. 15 is deformed by the pressure difference between the concave portion 4019 and the concave portion 4021, and the piezoelectric body 4011 on the side wall sandwiched between these concave portions is deformed, and the charges generated on the piezoelectric body surface on the side wall by these deformations are It is possible to detect the pressure difference between the recess 4019 and the recess 4021 based on the potential difference between the conductor wires 4017 and 4025 which are in close contact with each other. Alternatively, if a liquid container such as ink is connected to the pressure transmission hole, a voltage is applied to these conductor wirings to deform the piezoelectric film (diaphragm film) on the side wall, so that the ink or the like is transferred from the pressure transmission hole. Can be used as an inkjet device, for example. Furthermore, since the gas in the recess can be discharged precisely, it can be used as a highly accurate pump device.

In addition, although the above process was described centering on the imprint method, other methods may be combined. For example, although 4011 has been described as a piezoelectric polymer, it may be a piezoelectric ceramic. In the case of this piezoelectric ceramic, for example, PZT or the like {Pb (Zr, Ti) O _3, Pb (Zn _1/3 Nb _2/3 ) O ₃ (97 wt%)-Bi ₂ O ₃ (2 wt%)-ZnO ( 1 wt%)} is applied to a paste or slurry obtained by adding a solvent such as ethyl cellulose resin binder and diethylene glycol monobutyl ether by a screen printing method or the like, and a mold 4008 is pressed against this coating film, dried and fired in this state. The mold 4008 is released after these piezoelectric ceramics are cured. In the case of a piezoelectric ceramic, the mold 4018 cannot be used, as shown in FIGS. 15 (i) and 15 (j), since it does not melt or soften unless the temperature is considerably increased. Therefore, in this process, the resist 40 is patterned by photolithography, imprinting, or the like, and the recess 4019 is formed by etching.

Alternatively, the conductor films 4013 and 4021 and the insulating films 4017 and 4025 may be formed by a CVD method or a PVD method. As a process, the CVD method and the PVD method are easier for these films. Since the wiring in the recess shown in FIG. 15 may be connected as it is, it is not necessary to perform tricky wiring patterning in the recess or in the recess tube. In particular, with respect to the conductor film, various metal films and silicide films formed by CVD or PVD methods have higher conductivity than conductive polymers, so that generated charges can be transported smoothly (with less resistance).

FIG. 15 shows the structure and manufacturing method when the piezoelectric substrate 4011 is used as the substrate side wall, but the piezoelectric device shown in FIG. 13A can also be manufactured by using the imprint method. That is, the piezoelectric substrate 4011 shown in FIG. 15 may be considered as an ordinary insulator such as polymer or rubber. Subsequent steps for forming the first recess and the second recess can be performed by a similar process. The difference is that a conductor film to be a lower electrode is formed in each of the first recess and the second recess, a piezoelectric film is formed thereon, and a conductor film to be an upper electrode is further formed. . Thereafter, the process can proceed in the same manner as described above.

Alternatively, the piezoelectric substrate 4011 may be considered as ceramic or glass. In the case of glass, the mold is imprinted at a temperature higher than the Tg of the glass, and then cured at a temperature lower than the Tg. In the case of ceramic, after imprinting the mold into a ceramic paste or ceramic gel state containing ceramic fine particles, the ceramic is solidified by heating above the solidification temperature. Alternatively, the piezoelectric substrate 4011 may be considered as a conductor such as metal. After imprinting the mold on the metal melt, the temperature may be lowered to the melting point (Tm) or lower to solidify the metal. Thereafter, if necessary, an insulating film is formed, a conductor film serving as a lower electrode is laminated thereon, and necessary patterning is performed, and then a piezoelectric film is laminated. A conductor film to be an upper electrode is laminated thereon and necessary patterning is performed. Further, an insulating film is laminated, a thin plate is attached, and the recess is covered.

FIG. 16 is a view showing an embodiment in which the side wall is formed only by the first concave portion formed on the first surface (front surface) side in the substrate. The substrate 311 is a semiconductor substrate such as silicon, germanium, gallium arsenide (GaAs), gallium nitride, carbon, various compound semiconductors, or an insulating substrate such as glass, quartz, ceramic, polymer, rubber elastic body, iron, copper, aluminum, etc. Metal substrates such as various metals and various alloys. The following is described as a silicon substrate. First recesses 301 and 302 are formed adjacent to each other in the silicon substrate 311. FIG. 16B is a plan view (a cross-sectional view in a plane parallel to the substrate surface) of the embodiment of the present invention. This is seen from the first surface side (front surface side) of the silicon substrate 311. As can be seen from this figure, the adjacent first recesses are rectangular and have a rectangular parallelepiped shape when viewed three-dimensionally. The rectangular parallelepiped side surfaces are adjacent to each other and the first recesses are arranged. A silicon substrate side wall 323 sandwiched between the first recesses 301 and 302 becomes a diaphragm. The side surfaces of the first recesses 301 and 302 shown in FIG. 16 are preferably formed to be perpendicular to or close to the substrate surface, so-called substantially perpendicular. Moreover, the depth of the first recess is formed so as not to reach the second surface (back surface). The thickness of the silicon substrate 315 remaining at the bottom of the first recess is formed to be about 5 to 15% of the thickness of the silicon substrate. In the case of 5% or less, since the first concave portion varies in the substrate when the first concave portion is formed by etching, the strength of the bottom portion of the first concave portion decreases due to thinning or penetration depending on the location in the substrate. Although 15% or more may be left, in that case, since the silicon substrate can be made thin, a thin silicon substrate can be used from the beginning. The thickness of the silicon substrate side wall 323 serving as a diaphragm is 1 μm to 100 μm, and is determined by the pressure used, the accuracy of photolithography, and the manufacturing accuracy during etching. However, in addition to the advantage that the photolithographic process, the etching process, the film forming process, and the like are reduced by almost half compared to the method of forming the second recess from the back surface, it is not necessary to align the first recess and the second recess. In addition, there is a merit that the interaction between the first concave portion and the second concave portion and the mutual relationship become unnecessary with respect to variations in the photolithography process and the etching process. However, since the deformation of the adjacent concave portion is reversed, it is necessary to cut the wiring (preferably at the flat portion of the substrate).

An insulating film 312 on the silicon substrate of the first recess, a first conductor film (lower electrode / wiring) 313, a piezoelectric film 314, and a second conductor film (upper electrode / wiring) 316 thereon. An insulating film 320 is formed. The first conductor film 313 is disconnected between the first recess 301 and the first recess 302 at 317 and is not conductive (the conductor film in the recess may be connected, so patterning in the recess is unnecessary) .) A piezoelectric film 314 is formed in the cut portion (the piezoelectric film 314 is formed after cutting the first conductive film 313 in this portion). The cut portion is on the upper surface of the silicon substrate side wall 323. Since this part is not deformed, it hardly contributes to charge generation. Further, the second conductor film 316 is cut off at 318 between the first recess 301 and the first recess 302 and is not conductive (the conductor film in the recess may be connected, so that the patterning in the recess is performed). Is unnecessary.) An insulating film 320 is formed in the cut portion (the insulating film 320 is formed after cutting the second conductor film 316 in this portion). The cut portion is on the upper surface of the silicon substrate side wall 323. Since this part is not deformed, it hardly contributes to charge generation. The pressure P1 in the first recess 301 is different from the pressure P2 in the adjacent first recess 302, and the silicon substrate side wall 323 is deformed as a diaphragm by this pressure difference. With this deformation, the piezoelectric films 314 (314-2) and 314 (314-3) attached to the silicon substrate side wall 323 are deformed. The piezoelectric film 314 (314-2) attached to the silicon substrate side wall 323 is a side wall piezoelectric film on the first recess 301 side, and the piezoelectric film 314 (314-3) attached to the silicon substrate side wall 323 is the first recess. This is a side wall piezoelectric film on the 302 side. Electric charges are polarized by deformation on both surfaces of the piezoelectric films 314 (314-2) and 314 (314-3).

At this time, the deformation direction on the upper side of the piezoelectric film 314 (314-2) and the deformation direction on the upper side of the piezoelectric film 314 (314-3) are different (one is swollen and the other is recessed). The charge generated on the upper surface of the body film 314 (314-2) and the charge generated on the upper surface of the piezoelectric film 314 (314-3) are reversed. Therefore, if the second conductor film 316 is connected, it is canceled out, and the second conductor film 316 needs to be cut at 318. The second conductor film 316 on the first recess 301 side is denoted by 316-1, and the second conductor film 316 on the first recess 302 side is denoted by 316-2. Further, the charge generated on the lower surface of the piezoelectric film 314 (314-2) and the charge generated on the lower surface of the piezoelectric film 314 (314-3) are reversed. Therefore, if the first conductor film 313 is connected, it is canceled out, and the first conductor film 313 needs to be cut at 317. The first conductor film 313 on the first recess 301 side is denoted by 313-1, and the first conductor film 313 on the first recess 302 side is denoted by 313-2.

A first thin plate 319 that covers the first recesses 301 and 302 is attached to the first surface (front surface) of the silicon substrate 311. The first thin plate 319 covers the first recesses 301 and 302 to protect the first recess. The thin plate 319 covering the first recess 301 is provided with a pressure introducing hole 321 so that the pressure P1 can be introduced. The thin plate 319 covering the first recess 302 is also provided with a pressure introduction hole 322 so that the pressure P2 can be introduced. A region 338 for forming an extraction electrode of the first conductor film 313 (313-1) and the second conductor film 316 (316-1), the first conductor film 313 (313-2), and the second In the regions 338 and 339 where the extraction electrode of the conductor film 316 (316-2) is formed, the first thin plate 319 is removed.

In the region 338 without the thin plate 319, a contact hole 341 is formed in the piezoelectric film 314 on the first conductor film 313 (313-1) and the insulating film 320 laminated thereon, A conductor film 342 is formed in the contact hole 341, and an electrode / wiring 343 is further formed on the conductor film 342, and the piezoelectric film 314 (314-2) is deformed on the lower surface of the piezoelectric film 314 (314-2). The generated charges are drawn out to the electrode / wiring 343 through the conductor film 313-1 and further through the conductor film 342 in the contact hole 341. When the insulation property of the piezoelectric film 314 is not so good, an insulating film is formed in advance on the side wall of the contact hole 341 so that the conductor film 342 and the piezoelectric film 314 in the contact hole 341 do not contact each other. Alternatively, it is desirable to previously remove the piezoelectric film 314 in the region where the contact hole 341 is to be formed. The conductor film 316 (316-1) in the region where the contact hole 341 is to be formed is removed by etching in advance.

Further, in the region 338 without the thin plate 319, a contact hole 344 is formed in the insulating film 320 over the second conductor film 316 (316-1), and the conductor film 345 is formed in the contact hole 344. Then, an electrode / wiring 346 is formed thereon, and the electric charge generated on the upper surface of the piezoelectric film 314 (314-2) due to the deformation of the piezoelectric film 314 (314-2) is generated by the conductor film 316-1. Further, it is drawn out to the electrode / wiring 346 through the conductor film 345 in the contact hole 344. In this way, charges having opposite potentials generated on the upper and lower surfaces of the piezoelectric film 314 (314-2) due to the deformation of the piezoelectric film 314 (314-2) are drawn out to the electrodes / wirings 343 and 346.

In the region 339 without the thin plate 319, the contact hole 331 is formed in the piezoelectric film 314 on the first conductor film 313 (313-2) and the insulating film 320 laminated thereon, A conductor film 332 is formed in the contact hole 331, and further, an electrode / wiring 333 is formed thereon, and is generated on the lower surface of the piezoelectric film 314 (314-3) by deformation of the piezoelectric film 314 (314-3). The charged electric charges are extracted to the electrode / wiring 333 through the conductor film 313-2 and further through the conductor film 332 in the contact hole 331. When the insulation property of the piezoelectric film 314 is not so good, an insulating film is formed in advance on the side wall of the contact hole 331 so that the conductor film 332 and the piezoelectric film 314 in the contact hole 331 do not contact each other. Alternatively, it is desirable that the piezoelectric film 314 in the region where the contact hole 331 is formed is removed by etching in advance. The conductor film 316 (316-2) in the region where the contact hole 331 is to be formed is removed by etching in advance.

Further, a contact hole 334 is formed in the insulating film 320 over the second conductor film 316 (316-2) in the region 339 without the thin plate 319, and the conductor film 335 is formed in the contact hole 334. In addition, an electrode / wiring 336 is formed thereon, and electric charges generated on the upper surface of the piezoelectric film 314 (314-3) due to the deformation of the piezoelectric film 314 (314-3) Further, it is drawn out to the electrode / wiring 336 through the conductor film 335 in the contact hole 334. In this way, charges having opposite potentials generated on the upper and lower surfaces of the piezoelectric film 314 (314-3) due to the deformation of the piezoelectric film 314 (314-3) are drawn out to the electrodes / wirings 333 and 336.

Collecting those with the same polarity among the extracted charges gives a large potential, and the pressure difference P2-P1 in the adjacent first recess can be known from the magnitude of this potential. It can determine the pressure and functions as a pressure sensor. When the substrate is a silicon substrate, an IC can be fabricated in the same silicon substrate, so that it can be integrated into one chip together with a pressure sensor and a calculation IC for performing pressure calculation.

As described above, according to the present invention, a pressure sensor using a piezoelectric element can be manufactured even if the recess is formed only on the first surface of the substrate. This advantage is that there is no need to provide a second recess on the back side (the process becomes complicated), that there is no need to align the pattern between the front and back surfaces, and that alignment between adjacent recesses is necessary. Therefore, the distance between adjacent recesses can be narrowed, that is, the substrate side wall between adjacent recesses can be made thin, so that the substrate side wall can be deformed with a smaller pressure difference, and the sensitivity of pressure detection is improved. It is to improve.

FIG. 16B is a plan view (a cross-sectional view in a plane parallel to the substrate surface) of the embodiment of the present invention. If the first recesses are arranged in parallel, the potentials from a large number of diaphragm portions can be collected. In this way, the potential becomes a large potential with a small area, and the sensitivity as a pressure sensor can be increased. The advantage of the present invention is that it is not necessary to pattern the wiring or the like in the recessed area, so that a large number of recessed parts can be arranged (the wiring is cut off on the flat portion of the first surface (front surface)). The width of the first recess is Wc-3, the width (thickness) of the side wall is Ws, the length of the first recess is Lc-3, and the depth of the first recess is Hc-3. The size of the conventional planar diaphragm is set to 300 μm × 300 μm, and it is estimated whether the piezoelectric element (diaphragm) of the present invention is included in this size. When Hc−3 = 300 μm, Lc−3 = 300 μm, Ws = 5 μm, and Wc−3 are 30 μm, the diaphragm structure of the present invention has 300 μm / 35 μm≈8 pieces in a planar size of 300 μm × 300 μm. Since there are two diaphragms per piece, there are 16 diaphragms, so that the sensitivity is 16 times that of the prior art, and a pressure sensor with significantly improved sensitivity can be produced.

FIG. 16C is a diagram schematically showing the operation of the pressure sensor using the piezoelectric element of the present invention. First recesses 356 and 357 are formed on both sides across the silicon substrate side wall 323. On the first concave portion 357 side of the silicon substrate side wall 323, the insulating film 312 is formed on the silicon substrate side wall 323, the first conductive film 313 (313-2) is formed thereon, the piezoelectric film 314 is formed thereon, and the second film is formed thereon. The conductor film 316 (316-2) and the insulating film 320 are stacked thereon. On the first recess 356 side of the silicon substrate side wall 323, the insulating film 312 is formed on the silicon substrate side wall 323, the first conductor film 313 (313-1) and the piezoelectric film 314 are formed thereon, and the second film is formed thereon. The conductive film 316 (316-1) and the insulating film 320 are stacked thereon. The upper part of the silicon substrate side wall 323 is regulated by a thin plate 351. The lower part of the silicon substrate side wall 323 is regulated by a thin plate 352. In relation to FIG. 16A, the thin plate 351 corresponds to the first thin plate 319 and the thin plate 352 corresponds to the silicon substrate bottom 315.

The pressure P1 is applied from the pressure introduction hole 354 of the thin plate 351, and the pressure P2 is introduced from the pressure introduction hole 353. When P2 <P1, as shown in FIG. 16C, the silicon substrate side wall 323 swells toward the first recess 356, and the piezoelectric film 314 attached thereto swells toward the first recess 356. As a result, electric charges generated on the upper surface of the piezoelectric film 314 (314-2) are polarized on the upper surface and the lower surface of the piezoelectric film 314 (314-2) and the piezoelectric film 314 (314-2). The charge generated on the lower surface has a reverse potential. For example, if the charge generated on the upper surface of the piezoelectric film 314 (314-2) is positive, the charge generated on the lower surface is negative. The second conductor film 316 (316-1) is attached to the upper surface of the piezoelectric film 314 (314-2), and the first conductor film 313 ( Since 313-1) is attached, the gap between the electrode C1 connected to the second conductor film 316 (316-1) and the electrode C2 connected to the first conductor film 313 (313-1) There is a potential difference between the two.

In the same way, the electric charges generated on the upper surface of the piezoelectric film 314 (314-3) and the piezoelectric film 314 (314-3) are polarized on the upper and lower surfaces of the piezoelectric film 314 (314-3). The charge generated on the lower surface of) has a reverse potential. The piezoelectric film 314 (314-2) swells to the upper surface side, but the piezoelectric film 314 (314-3) swells to the lower surface side, so the polarity of the generated charge is the piezoelectric film 314 ( 314-2) and the piezoelectric film 314 (314-3) are reversed. In accordance with the above parable, the charge generated on the upper surface of the piezoelectric film 314 (314-3) is negative, and the charge generated on the lower surface is positive. The second conductor film 316 (316-2) is attached to the upper surface of the piezoelectric film 314 (314-3), and the first surface is attached to the lower surface of the piezoelectric film 314 (314-3). Since the conductor film 313 (313-2) is attached, the electrode C4 connected to the second conductor film 316 (316-2) and the first conductor film 313 (313-2) are connected. A potential difference is generated between the electrode C3. Therefore, it can be seen that if the same polarity is connected, that is, if C1 and C3 are connected, and if C2 and C4 are connected, the potential difference between them is doubled, the pressure sensitivity is increased. If such a structure is connected more and more, the sensitivity will become higher.

FIG. 17 is a diagram showing a method of manufacturing a pressure sensor using the piezoelectric element of the present invention shown in FIG. The board | substrate is shown with sectional drawing of the thickness direction. In addition, regarding what has been described so far and what will be described below (not limited to FIG. 17), the contents described so far and the contents shown in another embodiment are duplicated, and there are portions that are not described. Needless to say, a place that can be applied without contradiction in the contents described in other embodiments can be applied even if not specifically described in the embodiment.

As shown in FIG. 17A, an insulating film 361 such as a silicon oxide film is formed on the first surface (front side) of a substrate 311 such as a silicon substrate. A photoresist pattern 362 for forming the first recess is formed thereon using a photolithography method. The opening 363 of the photoresist is a region where the first recess is formed. As the photoresist, a resist by a coating method or a sheet-like photosensitive dry film can also be used. Alternatively, an imprint method can also be used. The thickness of the photoresist is determined in consideration of the amount that is reduced when the first recess is formed thereafter. For example, if a photoresist pattern is directly formed on the silicon substrate 311 without using the insulating film 361, the thickness of the silicon substrate 311 is 500 μm, the depth of the first recess is 400 μm, and the resist and the silicon substrate are etched when the silicon substrate is etched. Assuming that the etching selectivity is 10 and 5% overetching is performed, the resist thickness may be 50 μm.

Next, as shown in FIG. 17B, using the photoresist pattern 362 as a mask, the insulating film 361 exposed in the opening 363 is removed by etching. This etching is preferably anisotropic etching. Further, after the insulating film 361 in the opening 363 is removed, the silicon substrate is etched to form first recesses 301 and 302. It is desirable to perform this etching as faithfully as possible to the photoresist pattern. The substrate 311 is etched using a so-called deep etching (DRIE) method. Alternatively, for example, deep recesses having vertical sidewalls can be formed by magnetic neutron beam discharge etching or cluster etching using ClF 3 gas. In the present embodiment, the first recess is prevented from reaching (penetrating) to the second surface (back surface) of the substrate 311. The depth (Hc1) of the first recess is about 95% to 80% of the substrate thickness (Hsub). If it exceeds 95%, the thickness of the substrate 315 at the bottom of the first recess becomes too thin due to etching variation or the like, and the strength becomes too small. In some cases, the substrate may penetrate to the second surface. In addition, since the depth of the first recess is determined by the characteristics of the diaphragm, it may be less than 80%. However, in the sense that the substrate 311 is used as much as possible, the depth of the first recess is 80% or more. good. The pressure sensor of the present invention can occupy a very small area and can increase the sensitivity by connecting elements one by one. Therefore, the depth of the first recess is less than 80% and the conductor is not too deep. There is also a method of improving the coverage of the film or the piezoelectric film and improving the sensitivity of pressure detection side by side.

Furthermore, this has the advantage that the first recess can be easily formed as a substantially vertical pattern, and the strength of the substrate side wall 323 between the first recesses 301 and 302 can be improved. The thickness Hsub of the substrate 311 is 10 to 2000 μm, the depth Hc1 of the first recess is 1 to 1500 μm, the width Wc1 of the first recess is 1 to 200 μm, and the width Ws of the substrate side wall between the first recesses serving as a diaphragm is 0.1 μm. ˜100 μm, the length of the first recess (the width in the direction perpendicular to the paper surface and substantially equal to the length of the substrate side wall) Ls is 1-1500 μm, but basically the characteristics of the substrate material and piezoelectric film material used It is determined as appropriate according to the applied pressure. If the technical problem is cleared, a smaller lower limit value or a larger upper limit value may be used. Since the width Ws of the substrate side wall 323 determines the characteristics of the diaphragm, it is necessary to manufacture the substrate sidewall 323 with particularly high precision, and it is desirable that the width Ws of the substrate side wall 323 be as close to perpendicular as possible to the resist mask {362 (362-2)}. When the substrate 311 is thin (for example, a thickness of 100 μm or less), a support substrate may be attached to the second surface (back surface) of the substrate 311 so as not to be deformed during the process.

The maximum deflection Wmax of the substrate side wall 323 can be estimated as follows.
Wmax = α * z * h ² a ² / (Ey ³ )
Here, z is the pressure difference (z = P2-P1), h is the depth of the recess (h = Hc1), a is the length of the recess (a = Ls), E is the Young's modulus, and y is the substrate sidewall width ( y = Ws), α is a constant determined by the shape of the diaphragm. The Young's modulus of silicon is E = 100 GPa to 200 GPa (with crystal orientation dependence). For h = a = 30 μm (square diaphragm), α = 0.0138, and Wmax is about 60 z / y ³ (μm). If y = 3 μm, then z = 1 atm and Wmax is about 2.2 μm. When h = 30 μm and a = 60 μm (rectangular diagram), α = 0.0277 and Wmax is about 120 z / y ³ (μm). If y = 3 μm, then z = 1 atm and Wmax is about 4.4 μm. If a polymer or rubber having a smaller Young's modulus is used, the amount of deformation is further increased.

Next, as shown in FIG. 17C, after removing the photoresist pattern 362 and the insulating film 361 (the insulating film 361 may be left if necessary), the insulating film 312 and the first electrode to be the lower electrode are formed. The first conductive film 313, the piezoelectric film 314, and the second conductive film 316 to be the upper electrode are stacked. The insulating film 312 is formed for the purpose of preventing leakage between the substrate and the first conductor film 313, and is a silicon oxide film (SiOx), a silicon oxynitride film (SiOxNy), a silicon nitride film (SiNy), or the like. It is formed by the method, PVD method, thermal oxidation method. The thickness is 100 nm to 2000 nm. The insulating film 312 may not be formed when the substrate is an insulator such as glass, quartz, ceramic, polymer, or rubber. (When the adhesion between the first conductor film and the substrate is poor, an insulating film is formed to improve adhesion and the like.) The first conductor film 313 includes tungsten, molybdenum, aluminum, copper, Various metals such as gold, nickel, platinum, iridium oxide, iridium, and chromium, alloys thereof, various silicides, conductive polycrystalline (amorphous) silicon, conductive polymers, etc. Before forming the body film, titanium, titanium nitride, chromium, tantalum, tantalum nitride, or the like may be formed. The thickness of the first conductor film is, for example, 100 nm to 2000 nm, preferably 500 nm to 1500 nm.

After laminating the first conductor film 313, the first conductor film 313-1 on the first recess 301 side and the first conductor film 313-2 on the first recess 302 side are separated. For example, the upper surface 317 of the substrate side wall 323 sandwiched between the first recesses 301 and 302 is opened by photolithography, and the conductor film 313 is etched. When the width Ws of the substrate side wall 323 is 5 μm or less, the opening of the window is also 1 to 2 μm, but this level is possible by wet etching as well as dry etching. Further, when it is necessary to form a wiring pattern of the first conductor film 313 in another region, pattern formation by photolithography and etching of the first conductor film 313 are necessary for that purpose. For example, when the conductor film is platinum, examples of the wet etching solution include a cyan aqueous solution, diluted aqua regia, a mixed solution of hydrochloric acid and hydrogen peroxide solution, and the like. In the case of dry etching, for example, platinum using chlorine gas (such as Cl ₂ , S ₂ Cl ₂ , SiCl ₄ , BCl ₃ , CCl _4, etc.) is optimized by adding Ar, CO, or O ₂ to these gases. Can be etched.

After patterning the conductor film 313, a piezoelectric film 314 is formed. Piezoelectric film, for example, lead zirconate titanate (also known as zirconium acid titanate _{(Pb (Zr X Ti 1-} X) O 3 0 <x <1), so-called _{PZT), PLT (PbLa X Ti} 1 _{-X O 3), PLZT, SrTiO} 3, BaTiO 3, BST (Ba X Sr 1-X TiO 3), SBT (SrBi 2 Ta 2 O 9), KNN (K 0.5 Na 0.5 NbO 3) Ya , KN (KNbO ₃ ), NN (NaNbO ₃ ), KNN-based materials such as KNN added with impurities (for example, Li, Nb, Ta, Sb, Cu, etc.), BLT (bismuth-lanthanum-tantalum), titanium Barium oxide, lead titanate, potassium niobate, lithium niobate, lithium tantalate, sodium tungstate, zinc oxide, gallium nitride, lithium tetraborate, etc. Ceramics with a bskite structure or tungsten-bronze structure, or quartz, crystal, Rochelle salt, topaz, tourmaline, tourlinite (aluminum phosphate), aluminum nitride, gallium phosphate, gallium arsenide, etc. Piezoelectric polymer {for example, polyvinylidene fluoride (PVDF)}.

As a method of laminating a piezoelectric film, sputtering, vapor deposition, CVD, MOCVD (Metal
Organic chemical vapor deposition (PLD) method, laser ablation method (PLAD), coating method, screen printing method, sol-gel method (for example, dielectric material such as PZT is dissolved in organic solvent) The applied solution is applied by spin coating to a thickness of about 50 nm per layer, and this is temporarily fired on a hot plate at about 350 ° C. After repeating this operation 3 to 4 times, using a rapid heating furnace (Sintering rapidly at about 700 ° C.), aerosol deposition method, chemical solution deposition (CSD) method, etc., and improving the piezoelectricity and reliability by performing an appropriate heat treatment after the piezoelectric film is laminated You can also. The thickness of the piezoelectric film is 0.1 μm to 100 μm, and preferably 0.5 μm to 20 μm for improving the film quality and reducing the amount of warpage. It is desirable to stack on the substantially vertical side wall in the first recess with as much uniformity as possible (thickness variation is small). In the sputtering method, the vapor deposition method, the CVD method, and the MOCVD method, the layers can be stacked in a state that is close to the substantially vertical side wall in the first recess. When a liquid polymer or gel-like substance is applied, it thickens in the first recess, and therefore it can be formed in a state close to a substantially vertical side wall using an imprint method or the like.

Since the piezoelectric film 314 is not necessary except for the first concave portion, it may be removed by etching from an unnecessary portion (for example, the electrode extraction region 364 in FIG. 17C). If the piezoelectric film is laminated by screen printing or sputtering using a mask, this etching removal step becomes unnecessary. When patterning a resist using a photolithographic method, it is not necessary to form a fine pattern, so the process is simple. For example, in the case of PZT, etching may be performed with HF and HNO ₃ based etchants. In the case of dry etching, fluorine gas or chlorine gas is preferably used. The second conductor film is formed on this, but it is desirable to perform taper etching so that the step coverage of the conductor film does not deteriorate due to the step removed by etching of the piezoelectric film. Alternatively, there is also a method of patterning the second conductor film 316 so that the second conductor film 316 does not cross the step portion of the piezoelectric film 314. Alternatively, when the piezoelectric film 314 is an insulator, there is no need to worry about leakage, so it can be left as it is. However, it is desirable to remove the piezoelectric film 314 from the portion of the first conductor film 313 where the extraction electrode is to be formed. If the contact hole is formed while the piezoelectric film 314 is left, the depth of the contact hole is increased by the thickness of the piezoelectric film 314. As a result, the contact hole formation time becomes longer, and different layers (insulating film and piezoelectric film) are successively etched, so that the etching conditions become complicated. Furthermore, when the contact hole becomes deeper, the covering property of the conductor film formed in the contact hole becomes a problem, and the condition for forming the conductor film to solve this becomes complicated, and the contact size is increased or the contact is tapered. The process of turning on is also necessary.

After forming the piezoelectric film 314, a second conductor film 316 is formed. The second conductor film 316 is made of various metals such as tungsten, molybdenum, aluminum, copper, gold, nickel, platinum, iridium oxide, iridium, and chromium, alloys thereof, various silicides, conductive polycrystalline (amorphous) silicon, Although it is a conductive polymer or the like, titanium, titanium nitride, chromium, tantalum, tantalum nitride, or the like may be formed before forming these conductor films in order to improve adhesion. The thickness of the second conductor film is, for example, 100 nm to 2000 nm, preferably 500 nm to 1500 nm.

After the second conductor film 316 is stacked, the second conductor film 316-1 on the first recess 301 side and the first conductor film 316-2 on the first recess 302 side are separated. For example, the upper surface 318 of the substrate side wall 323 sandwiched between the first recesses 301 and 302 is opened by a photolithographic method, and the conductor film 313 is etched. When the width Ws of the substrate side wall 323 is 5 μm or less, this window opening is also 1 to 2 μm wide, but this level is possible even by wet etching. It is also desirable to remove the second conductor film 316 from the region 364 where the lead electrode is formed from the first conductor film 313. This is because the second conductor film 316 is exposed in the lead-out contact hole from the first conductor film 313. Further, when it is necessary to form a wiring pattern of the second conductor film 316 in another region, pattern formation by photolithography and etching of the second conductor film 316 are necessary for that purpose.

For example, when the conductor film is platinum, examples of the wet etching solution include a cyan aqueous solution, diluted aqua regia, a mixed solution of hydrochloric acid and hydrogen peroxide solution, and the like. In the case of dry etching, for example, platinum using chlorine gas (such as Cl ₂ , S ₂ Cl ₂ , SiCl ₄ , BCl ₃ , CCl _4, etc.) is optimized by adding Ar, CO, or O ₂ to these gases. Can be etched. When the second conductor film is aluminum, mixed acid water (nitric acid, acetic acid, phosphoric acid, water) is used as a wet etching solution, and Cl ₂ , S ₂ Cl ₂ , SiCl ₄ , BCl ₃ , CCl are used as dry etching gases. _{4 and the} like (optimized by adding Ar, CO, or O ₂ to these gases).

Next, as shown in FIG. 17D, after patterning the second conductor film 316 and performing an appropriate heat treatment or the like, the insulating film 320 is stacked. The insulating film 320 is a film that protects the piezoelectric element and the conductor film 316. The insulating film 320 is, for example, a silicon oxide film (SiOx), a silicon nitride film (SiNy), or a silicon oxynitride film (SiOxNy), and is laminated by a CVD method, a PVD method, a coating method, or the like. Alternatively, the insulating film 320 may be an organic film such as polyimide. In particular, in the case of a photosensitive organic film (for example, photosensitive polyimide), it is not necessary to use a resist or the like thereafter, and this photosensitive organic film can be directly exposed and patterned. When the coating method is used, the deposit is also thickly deposited in the recess, so that the insulating film in the recess can be formed as faithfully as possible in a substantially vertical sidewall pattern by using, for example, an imprint method.

Next, a thin plate 319 that covers the first recesses 301 and 302 is attached. Next, a portion where there is no thin plate, such as a pressure introduction hole 321 for applying pressure to the first recess 301, a pressure transmission hole 322 for applying pressure to the first recess 302, and the contact regions 338 and 339 (or a portion without a thin plate). The thin plate 319 in the good part) is removed. Alternatively, before attaching the thin plate 319, there is a method of aligning the thin plate having these portions opened and attaching the thin plate to the first surface of the substrate 311. If a thin plate having a separate opening is prepared using a thin plate having no pattern in another step using a photolithographic method and etching of the thin plate, the manufacturing process steps and time of the pressure sensor of the present invention are not affected.

In FIG. 17D, the pressure introduction hole 321 is formed in the first recess 301 and the pressure introduction hole 322 is formed in both the first recess 302. However, when only one is formed, there is no pressure introduction hole. Since the first concave portion (for example, the first concave portion 302) is always maintained at the same pressure (this is referred to as pressure P0), the pressure P1 of the other adjacent first concave portion (for example, the first concave portion 301). The side wall 323 of the substrate is deformed by the pressure difference between P0 and P0. Since P0 is almost equal to the pressure when the thin plate 319 is attached, if the thin plate 319 is attached in a low pressure state close to vacuum, P0 becomes almost 0 atm, and if the thin plate 319 is attached at atmospheric pressure, P0 is almost 1 atm. Therefore, a pressure sensor that detects a pressure relative to a reference pressure can be manufactured. After the thin plate 319 is attached and the first recess is closed and sealed, a heat treatment is performed to ensure the thin plate adherence, or a heat treatment is performed in a subsequent process, and the adhesion used for the thin plate attachment. An outgas such as a solvent is generated from the agent, and the pressure P0 in the airtight first recess may change. Therefore, an adhesion method that does not use an adhesive (for example, a room temperature bonding method) may be used, or an adsorbent that adsorbs outgas may be placed in the first recess.

Next, electrodes / wirings are formed in regions 338 and 339 where there is no thin plate 319. In the region 338, a contact hole 341 is formed in the insulating film 320 on the first conductive film 313 by photolithography and etching of the insulating film 320 in a region where the second conductive film 316 and the piezoelectric film 314 are not present. A conductor film 342 is laminated in the contact hole 341, a conductor film 343 for electrode wiring is further laminated, and an electrode / wiring pattern 343 is formed by photolithography and etching of the conductor film 343. The conductor films 342 and 343 can also be used together. Further, a contact hole 344 is formed in the insulating film 320 over the second conductor film 316 by photolithography and etching of the insulating film 320. A conductor film 345 is laminated in the contact hole 344, a conductor film 346 for electrode wiring is further laminated, and an electrode / wiring pattern 346 is formed by photolithography and etching of the conductor film 346. The conductor films 345 and 346 can also be used together. These processes can also be performed simultaneously.

A region 339 shows a state where the piezoelectric film 314 is left on the first conductor film 313. When the piezoelectric film 314 remains, the contact hole 331 to the first conductor film 313 is formed by photolithography and etching the insulating film 320 and the piezoelectric film 314. Next, a conductor film 332 is stacked in the contact hole 331, a conductor film 333 for electrode wiring is further stacked, and an electrode / wiring pattern 333 is formed by photolithography and etching of the conductor film 333. The conductor films 332 and 333 can also be used together. Further, a contact hole 334 is formed in the insulating film 320 on the second conductor film 316 by photolithography and etching of the insulating film 320. A conductor film 335 is laminated in the contact hole 334, a conductor film 336 for electrode wiring is further laminated, and an electrode / wiring pattern 336 is formed by photolithography and etching of the conductor film 336. The conductor films 335 and 336 can also be used together. Although these processes can be performed simultaneously, it is necessary to set process conditions in consideration of etching of the piezoelectric film 314. Thus, since the process of forming the contact hole and the conductor film becomes complicated if the piezoelectric film 314 is left, the piezoelectric film 314 may be preferably removed. Of course, the contact holes and electrode wiring patterns in the regions 338 and 339 can be formed in the same process.

Through the above manufacturing process, the concave portion is formed only on the first surface side of the substrate, the piezoelectric film sandwiched between the conductive film is formed on the substrate side wall between the adjacent concave portions, and deformed by the pressure difference between the adjacent concave portions. The piezoelectric film is deformed together with the substrate side wall to generate electric charges on the surface of the piezoelectric film, and a potential is generated between the conductive films above and below the piezoelectric film. If the relationship between the pressure difference between the recesses and the potential between the upper and lower electrodes / wirings of the piezoelectric film is obtained in advance, the pressure difference between the recesses can be calculated from the generated potential. Alternatively, when an electric field is applied between the upper and lower conductor films (electrodes / wirings) of the piezoelectric film, the piezoelectric film is deformed, and the substrate side wall to which the piezoelectric film is attached is similarly deformed. This change in the substrate side wall can cause a pressure difference between the adjacent recesses.

FIG. 18A is similar to the embodiment shown in FIGS. 16 and 17, but in this embodiment, the recess penetrates from the first surface (front surface) to the second surface (back surface). The substrate 411 adheres to the support substrate 400, and the first recesses 401, 402, and 403 penetrate from the first surface to the second surface side. That is, the bottom of the first recesses 401, 402, 403 is the support substrate 400. An insulating film 412, a first conductor film 413, a piezoelectric film 414, a second conductor film 416, and an insulating film 420 are stacked on the first surface side. These laminated film structures are the same as those in the embodiment shown in FIGS. A thin plate 419 is attached on the insulating film 420 on the first surface side to cover and protect the first recesses 401, 402, and 403. The thin plate 419 above the first recess 401 has a pressure introduction hole 425, the thin plate 419 above the first recess 402 has a pressure introduction hole 426, and the thin plate 419 above the first recess 401 has a pressure introduction hole 427. ,is open. Further, the thin plates 419 in the regions 438 and 439 where the electrodes / wirings are to be formed are removed. In the region 438, a conductor film 442 is formed in a contact hole 441 connected to the first conductor film 413 (413-1), and an electrode / wiring 443 is formed thereon. In addition, a conductor film 445 is formed in the contact hole 444 connected to the second conductor film 416 (416-1), and an electrode / wiring 446 is formed thereon. In the region 439, a conductor film 432 is formed in a contact hole 431 connected to the first conductor film 413 (413-3), and an electrode / wiring 433 is formed thereon. In addition, a conductor film 435 is formed in the contact hole 434 connected to the second conductor film 416 (416-3), and an electrode / wiring 436 is formed thereon.

The piezoelectric bodies on both sides of the first recess 401 are 414-1 and 414-2, the piezoelectric bodies on both sides of the first recess 402 are 414-3 and 414-4, the piezoelectric bodies on both sides of the first recess 403 are 414-5, 414-6. The substrate side wall 423 is deformed by a difference P1−P2 between the pressure P1 of the first recess 401 and the pressure P2 of the first recess 402. When P2> P1, the substrate side wall 423 swells toward the first recess 401 side. Along with this deformation, the piezoelectric film 414 (414-2) also swells toward the first concave portion 401, and is polarized on the front surface side and the back surface side of the piezoelectric film 414 (414-2), and reverse charges are generated respectively. Electric charges generated on the back surface side of the piezoelectric film 414 (414-2) can be drawn out to the electrode / wiring 443 through the first conductor layer 413 (413-1) and the conductor layer 442 in the contact hole. Electric charges generated on the surface side of the piezoelectric film 414 (414-2) can be drawn to the electrode / wiring 446 through the second conductor layer 416 (416-1) and the contact hole conductor layer 445.

When P2> P1, the piezoelectric film 414 (414-3) also bulges toward the first recess 401 (depresses on the first recess 402 side), and is polarized on the front surface side and the back surface side of the piezoelectric film 414 (414-3). Thus, a reverse charge is generated in each. Pulling out the charge generated on the back side of the piezoelectric film 414 (414-3) to the outer electrode / wiring (not shown in FIG. 18A) through the first conductor layer 413 (413-2). Can do. The electric charge generated on the surface side of the piezoelectric film 414 (414-3) is drawn out to the outer electrode / wiring (not shown in FIG. 18A) through the second conductor layer 416 (416-2). Can do. The piezoelectric film 414 (414-2) and the piezoelectric film 414 (414-3) are deformed to the same side. However, when viewed from the first conductor film 413 and the second conductor film 416, the deformation is opposite. Therefore, the first conductor layer 413 (413-1) and the second conductor layer 416 (416-2) have the same polarity, and the second conductor layer 416 (416-1) and the second conductor layer 416 (416-1) 1 conductor layer 413 (413-2) has the same polarity. Accordingly, the first conductor film 413 is cut at the upper part 417 (417-1) of the substrate side wall 423, and the second conductor film 416 is cut at the upper part 418 (418-1) of the substrate side wall 423.

Assuming that the pressure of the first recess 403 is P3, the substrate side wall 424 swells toward the first recess 403 when P2> P3. With this deformation, the piezoelectric film 414 (414-5) also swells toward the first concave portion 403, and is polarized on the front surface side and the back surface side of the piezoelectric film 414 (414-5), thereby generating reverse charges respectively. Electric charges generated on the back surface side of the piezoelectric film 414 (414-5) can be drawn out to the electrode / wiring 433 through the first conductor layer 413 (413-3) and the conductor layer 432 in the contact hole. Electric charges generated on the surface side of the piezoelectric film 414 (414-5) can be drawn out to the electrode / wiring 436 through the second conductor layer 416 (416-3) and the contact hole conductor layer 435.

When P2> P3, the piezoelectric film 414 (414-4) also swells toward the first concave portion 403 (dented on the first concave portion 402 side), and is polarized on the front surface side and the back surface side of the piezoelectric film 414 (414-4). Thus, a reverse charge is generated in each. Pulling out the charge generated on the back side of the piezoelectric film 414 (414-4) to the outer electrode / wiring (not shown in FIG. 18A) through the first conductor layer 413 (413-2). Can do. The electric charge generated on the surface side of the piezoelectric film 414 (414-4) is drawn out to the outer electrode / wiring (not shown in FIG. 18A) through the second conductor layer 416 (416-2). Can do. The piezoelectric film 414 (414-5) and the piezoelectric film 414 (414-4) are deformed to the same side. However, when viewed from the first conductor film 413 and the second conductor film 416, the opposite deformation occurs. Therefore, the first conductor layer 413 (413-3) and the second conductor layer 416 (416-2) have the same polarity, and the second conductor layer 416 (416-3) and the second conductor layer 416 (416-3) have the same polarity. 1 conductor layer 413 (413-2) has the same polarity. Accordingly, the first conductor film 413 is cut at the upper portion 417 (417-2) of the substrate side wall 423, and the second conductor film 416 is cut at the upper portion 418 (418-2) of the substrate side wall 423.

The piezoelectric film 414 (414-3) and the piezoelectric film 414 (414-4) are deformed in opposite directions, but when viewed from the first conductor film 413 and the second conductor film 416, they are deformed in the same direction. Therefore, the conductor film facing the piezoelectric film 414 (414-3) and the conductor film facing the piezoelectric film 414 (414-4) may be connected. That is, 413 (413-2) and 416 (416-2) are continuous between the piezoelectric film 414 (414-3) and the piezoelectric film 414 (414-4). Accordingly, there is no complicated process as a process because there is no need to perform a photolithographic process or etching for cutting the conductor film in the recess. For example, when the conductor films 413 and 416 are etched, a photoresist is applied on these conductor films. The liquid photoresist enters the recesses (4101, 402, 403) and becomes thicker in the recesses. Alternatively, in the case where the photoresist is a film-like sheet type, if a photosensitive dry film is attached and softened on the conductor film on the first surface side of the substrate, the recess area becomes thick because it enters the recess. The portion where the photoresist is opened is the upper surface of the substrate side wall or the flat portion of the first surface, and the thickness of the photoresist is not thick. When the photoresist is a positive resist, it is only necessary to expose the opening portion, so that the thin photoresist can be completely exposed. Therefore, the resist can be removed from the portion where the conductor film is removed. Since the other portions are not irradiated with light, the resist is covered without being removed. Therefore, a necessary portion of the conductor film can be removed without any problem. When the photoresist is a positive resist, the portion where the conductor film is not removed is exposed, but the exposure may be performed with an intensity that allows light to pass to the depth of the thick resist in the recess. Alternatively, if only the upper portion of the resist in the recess is exposed, the developer does not enter the recess during development, so that the recess region is eventually covered with the resist. Since the resist is thin in the portion where the conductor film is to be removed, the light is sneak in and the resolution is deteriorated. Therefore, a necessary portion of the conductor film can be removed without any problem.

Thus, the pressure sensor using the piezoelectric element of the present invention can be applied even if the recess penetrates from the first surface to the second surface. The pressure sensor having this recessed portion has an advantage that it is not necessary to consider end point detection when etching the recessed portion. In the method of stopping the etching of the first recess in the substrate shown in FIGS. 16 and 17, it is necessary to perform etching by time management, and therefore the depth differs depending on the location. That is, the depth of the first recess differs depending on the location due to the variation accuracy of deep etching. On the other hand, in the present embodiment, the through hole has the same depth as the substrate thickness. Even if the penetration of the recess is completed at all locations in the substrate by performing the substrate etching under the condition that the selective ratio between the etching rate of the substrate by the deep etching and the etching rate of the support substrate 400 is large, Even if the over-etching is greatly increased, the support substrate 400 can be hardly etched. When the etching selectivity is 10 and the substrate thickness is 500 μm and the deep etching is performed with 10% overetching (the etching variation is usually about 5%, the 10% overetching causes Recesses penetrating in all regions can be produced.) The support substrate 400 is etched only 5 μm at the maximum. When the substrate 411 is made of silicon and the support substrate is made of glass, the etching selectivity 10 can be achieved without any problem. Thus, an accurate diaphragm structure can be manufactured by using the recessed part which penetrated.

The above is a case where the support substrate is used as it is as the second thin plate. However, after forming the recessed portion penetrating, if the support substrate is removed and a new second thin plate is attached to the rear surface of the substrate 411, the second thin plate is used. Since the thin plate is not etched at all, a highly accurate recess can be produced.
Further, as a method for improving the etching accuracy, a concave portion penetrating as it is without forming a support substrate may be formed. At this time, even if a large amount of over-etching is taken, the support substrate is not scraped because there is only a recessed portion that penetrates. What is necessary is just to attach a 2nd thin plate after forming a penetration recessed part.

When using an adhesive, do not use an adhesive whose ability is deteriorated or deteriorated in the subsequent process, or an object that generates outgas. Therefore, a thermosetting adhesive is desirable. However, thermosoftening adhesives can also be used. For example, an adhesive that softens at a temperature higher than the maximum temperature of the subsequent process temperature and adheres securely at a temperature lower than the maximum temperature is used. By using this adhesive, after the pressure sensor element is completed, the support substrate 400 can be removed from the substrate 411 at a temperature higher than the maximum temperature and replaced with another support substrate. As the support substrate 400, a conductive substrate such as copper, iron, nickel, various alloys, various silicides, and a conductive polymer can be used. These have good thermal conductivity and are effective against static electricity. The method described above can also be used as a method for attaching these conductive substrates. In the case of a conductive substrate, a large etching selectivity with respect to the substrate 411 can be obtained, so that a recessed portion penetrating the substrate 411 can be formed without almost etching the support substrate.

The thickness of the support substrate 400 is the process of adhering to the substrate 411, the condition that the substrate 411 penetrates when forming the first recess, but the support substrate does not penetrate, and the first recess that penetrates the substrate 411 is formed. The thickness is determined so that it will not be damaged or destroyed in the subsequent process, the thickness that will not cause problems even if the finished product is handled after being singulated, and the thickness that will not deform the support substrate due to external pressure. It is done. Therefore, the thickness of the support substrate 400 is normally 100 μm to 2000 μm. When making the thickness further thinner, the thickness is selected so as not to be deformed or damaged during the process in consideration of the entire process conditions. It is also necessary to select a thickness so that warpage does not increase.

As in the case shown in FIG. 13A, the lead electrode from the first conductor film can be taken out from the back side. For example, the support substrate 400 may be removed from a part of the recess, a contact hole may be formed in the insulating film 412, and the first conductor film 413 may be exposed to connect the electrode / wiring. If the support substrate 400 from which the contact hole is opened is removed and attached to the back surface, the process of removing the support substrate 400 after attaching the support substrate 400 is not necessary, and the process becomes simple. Thus, if the lead electrode from the first conductor film is taken from the back side, the piezoelectric film 414 need not be removed by etching. When the etching of the piezoelectric film 414 is difficult or when the thickness of the piezoelectric film 414 is thick, such an extraction electrode from the back surface is also advantageous.

FIG. 18B is a view showing a pressure sensor having a recess penetrating the piezoelectric substrate body. Concave portions 516 (516-1, 516-2, 516-3, 516-4, 516-5) penetrating from the first surface (front surface) to the second surface (back surface) are formed in the piezoelectric substrate 511. A support substrate 513 is attached to the back surface of the piezoelectric substrate 511. When the support substrate 513 is attached to the piezoelectric substrate 511 before the recess 516 is formed, the recess 516 portion of the support substrate 513 is also etched when the recess 516 is formed. Is it possible to reduce the etching amount of the support substrate 513 by selecting the conditions with a low etching rate and forming the recesses 516? Almost no etching (recesses are not formed) can be achieved. In any case, the recess in the support substrate 513 does not penetrate the back surface of the support substrate 513 (the surface attached to the piezoelectric substrate 511 is the front surface). When the support substrate 513 is attached to the piezoelectric substrate 511 after the recess 516 is formed, no recess is formed in the support substrate 513.

The recess 516 is formed in the substrate 511 in a substantially rectangular parallelepiped shape. A piezoelectric substrate sandwiched between adjacent recesses 516 serves as a substrate side wall, and the piezoelectric substrate side wall is deformed by a pressure difference in the substrate 516 adjacent to the piezoelectric substrate side wall. The so-called piezoelectric substrate side wall serves as a diaphragm. This deformation polarizes charges on the surface of the piezoelectric substrate side wall. When one of the piezoelectric substrate side walls is viewed, if one side is deformed into a convex shape, the opposite side is deformed into a concave shape. Therefore, the charge generated on one deformation surface of the piezoelectric substrate side wall is opposite to the charge generated on the other deformation surface. become. Therefore, a potential difference is generated between these electrodes by taking out the electric charges generated on both surfaces to the external electrodes.

The substrate side wall 511-2 is formed by the recesses 516-1 and 516-2. The substrate side wall 511-3 is formed by the recesses 516-2 and 516-3. The substrate side wall 511-4 is formed by the recesses 516-3 and 516-4. The substrate side wall 511-5 is formed by the recesses 516-4 and 516-5. One side of the substrate 511-1 is a recess 516-1, but the recess 516 is not formed on the opposite side. Moreover, although the one surface of the board | substrate 511-6 is the recessed part 516-5, the recessed part 516 is not formed in the other side. Or since the adjacent recessed part 516 is separated considerably, it does not deform | transform by a pressure difference.

A conductor film 521 is formed in the recesses 516 and on the first surface of the piezoelectric substrate 511. The conductor film 521 is in direct contact with the substrate side walls 511-2 to 5-5 in the recess 516. Usually, the adjacent recesses 516 have different pressures, so the substrate side wall is deformed. For example, since the pressures of the recess 516-1 and the recess 516-2 are different, the substrate side wall 511-2 therebetween is deformed. For example, the pressure in the recess 516-1 is P1, the pressure in the recess 516-2 is P2, and when P1 <P2, the substrate side wall 511-2 is convex toward the recess 516-1 and the recess 516-2 side. Becomes concave. Therefore, when the conductor film 521 is connected between them, the generated charges are canceled out and almost no charges can be extracted to the outside. Therefore, the conductor film 521 formed by connecting recesses having different pressures in the recesses is removed between them so as not to be connected. For example, the conductor film 521 is removed by etching at the portion 522-2 on the upper surface of the substrate side wall 511-2. As a result, the conductor film 521-1 on the recess 516-1 side is not connected to the conductor film 521-2 on the recess 516-2 side. Similarly, the conductor film 521 is removed by etching at a portion 522-3 on the upper surface of the substrate side wall 511-3. As a result, the conductor film 521-2 on the recess 516-2 side is not connected to the conductor film 521-3 on the recess 516-3 side. Similarly, the conductor film 521 is removed by etching at a portion 522-4 on the upper surface of the substrate side wall 511-4. Thus, the conductor film 521-3 on the recess 516-3 side is not connected to the conductor film 521-4 on the recess 516-4 side. Similarly, the conductor film 521 is removed by etching at a portion 522-5 on the upper surface of the substrate side wall 511-5. As a result, the conductor film 521-4 on the recess 516-4 side is not connected to the conductor film 521-5 on the recess 516-5 side. When the pressure in the recesses 516 is the same, the substrate side walls in these recesses 516 are deformed in the same shape, and the generated charges have the same polarity. Therefore, the conductor film 521 formed in these recesses is connected. You may do it. Also when the conductor film 521 is used as a wiring, the conductor film 521 is also removed from unnecessary portions, for example, the flat first surface (surface) 522-1 and 522-6 of the piezoelectric substrate 511.

An insulating film 525 is formed over the conductor film 521. This insulating film 525 protects the pressure sensor and the conductor film 521. In particular, since outside air may enter the recess 516, the conductor film 521 in the recess is prevented from being altered by moisture or corrosive gas in the outside air. A thin plate 523 is attached on the insulating film 525 on the first surface (front surface) of the substrate 511. The thin plate 523 is formed with pressure introducing holes 526 (526-1, 2, 3, 4, 5). Appropriate pressure is introduced from the pressure introduction hole into each recess. Further, the thin plate 523 in the region 527 (527-1, 2) for forming the extraction electrode from the conductor film 521 is also removed. Alternatively, a patterned thin plate 523 from which portions corresponding to these regions are removed before the thin plate 523 is attached onto the insulating film 525 may be attached onto the insulating film 525. Contact holes 528 (528-1, 2) are formed in regions where there is no thin plate 527, a conductor film is formed in these holes, and connection electrodes 529 (529-1, 2) to the outside are further formed.

As described above, a pressure sensor having a recess penetrating from the first surface (front surface) to the second surface (back surface) in the piezoelectric substrate 511 can be obtained. The recess 516 becomes an airtight space surrounded by the support substrate 513, the piezoelectric substrate 511, and the thin plate 523. However, when the pressure introduction hole 526 is formed, pressure can be applied from there. The charges generated on the surface of the substrate side wall 511-2 on the recess 516-1 side due to the deformation of the substrate side wall 511-2 are taken to the external electrode 529-1 through the conductor film 521-1-3 formed thereon. It will be. Since the substrate 511-1 is not deformed, almost no charge is generated due to the deformation, so that no charge moves to the conductor film 521-1-1 thereon. This conductor film 521-1-1 is used as a wiring. Electric charges generated on the side opposite to the substrate side wall 511-2 (recessed portion 516-2 side) pass through the conductive film 521-2-1 to external electrodes / wiring (not shown. Also, internal wiring is connected to another wiring. In some cases, the same applies hereinafter.

The charges generated on the surface of the substrate side wall 511-3 on the recess 516-2 side due to the deformation of the substrate side wall 511-3 pass through the conductor film 521-2-3 formed on the surface of the substrate side wall 511-3. Not taken out.) It is drawn out to an external electrode / wiring (not shown) through the charge conductor film 521-3-1 generated on the opposite side (the recess 516-3 side) of the substrate side wall 511-3. The charges generated on the surface of the substrate side wall 511-4 on the recess 516-3 side due to the deformation of the substrate side wall 511-4 pass through the conductor film 521-3-3 formed on the surface of the substrate side wall 511-4. Not taken out.) It is drawn out to the external electrode / wiring (not shown) through the charge conductor film 521-4-1 generated on the opposite side (the recess 516-4 side) of the substrate side wall 511-4.

The charges generated on the surface of the substrate side wall 511-5 on the concave portion 516-4 side due to the deformation of the substrate side wall 511-5 pass through the conductor film 521-4-3 formed on the surface of the substrate side wall 511-5. Not taken out.) It is drawn out to the external electrode / wiring 529-2 through the charge conductor film 521-5-1 generated on the side opposite to the substrate side wall 511-5 (the recess 516-5 side). Since the substrate 511-6 hardly deforms, no charge is generated on the surface thereof. Therefore, since the electric charge from the substrate 511-6 hardly moves to the conductor film 521-5-3 formed on the substrate 511-6, it is used as a wiring.

Conductor films 521 (521-1-2, 5212-2, 521-3-2, 521-4-2, 521-5-2) are also formed at the bottom of the recess 526. The conductor film 521 (5211-1-2, 5212-2, 521-3-2, 521-4-2, 521-5-2) is connected to the conductor film in the other recess, Since the support substrate 513 is also connected, the support substrate 513 needs to be an insulator. If the support substrate 513 is an insulator, there is no problem because the charge generated on the substrate side wall does not move to the support substrate 513. However, even when the support substrate 513 is not an insulating substrate, the conductive film 521 is formed on the bottom of the recess 516 by forming an insulating film on the support substrate 513 and then attaching it to the substrate 511 (or after forming the recess). Even so, the charge generated on the substrate side wall can be prevented from moving to the support substrate 513.
In FIG. 18B, the through hole is formed in the piezoelectric substrate, but the piezoelectric element can be manufactured by the same process even when the through hole is not a recess.

Next, a method for producing a pressure sensor having a recess according to the present invention by using an imprint method will be described. FIG. 19 is a diagram illustrating a manufacturing method of a pressure sensor using an imprint method. A polymer 615 is formed on a substrate 611 as shown in FIG. Since the substrate 611 is a substrate on which the pressure sensor is mounted, an optimum substrate is selected. For example, the substrate 611 is a silicon substrate. When a silicon substrate is used, a pressure sensor using this imprint method can be formed on the same substrate together with an active element such as an IC or a passive element such as a resistor. Can be calculated with an IC or the like to calculate a pressure value or the like. Alternatively, the substrate 611 is an insulating substrate such as a glass substrate, a quartz substrate, or a ceramic substrate. In the case of an insulating substrate, there is no need to worry about the charge generated by the piezoelectric element leaking into the substrate. Alternatively, the substrate 611 is a conductor substrate such as a metal or an alloy. In the case of a conductive substrate, even if static electricity or the like is generated, the static electricity can be quickly discharged to the outside. Further, in the case of a conductor substrate, particularly a substrate made of metal, alloy, etc., it is also a good heat conductor, so that the generated heat can be released to the outside. Alternatively, the substrate 611 is a semiconductor substrate such as silicon, carbon, gallium arsenide, or gallium nitride. In the case of a conductor substrate or a semiconductor substrate, there is a possibility that charges generated in the piezoelectric element may leak into the substrate. Therefore, after forming the insulating film 613 on the substrate 611, as shown in FIG. A polymer 615 is formed on the insulating film 613. The insulating film 613 is an insulating film such as a silicon oxide film, a silicon oxynitride film, or a silicon nitride film formed by an oxidation method, a CVD method, a PVD method, or the like. The insulating film may have a thickness of 100 nm or more in order to ensure insulation.

Polymer 615 is a fluororesin film, polyethylene film, PMMA (polymethyl methacrylate), polycarbonate, polystyrene, acrylic resin, ABS resin, vinyl chloride, liquid crystal polymer, polyvinyl alcohol (PVA), polypropylene (PP), polyethylene (PE), N-methyl-2-pyrrolidone (NMP), acrylic resin (PMMA), polydimethylsiloxane (PDMS), polyimide resin, polylactic acid, various rubbers (natural rubber and synthetic rubber), or polyvinylidene fluoride (PVDF), fluoride Highly polar such as vinylidene-trifluoroethylene (VDF / TrFE) copolymer, ferroelectric polymer such as vinylidene fluoride tetrafluoroethylene (VDF-TeFE), vinylidene cyanide-vinyl acetate copolymer, nylon-11, etc. Piezoelectric polymer child such a variety of polymeric materials such as. A solution in which these materials are dissolved with a solvent or the like is applied and dropped to form a polymer film layer. If necessary, after prebaking or the like, a mold is pushed into the polymer film layer. Then, if it is a photocurable resin, it is irradiated with light such as ultraviolet rays to cure the polymer. If there is, the polymer is softened once at the softening temperature or higher, and then the polymer is cured by lowering the temperature below the softening temperature. Alternatively, in the case of a heat-softening resin sheet, the polymer is softened at a softening temperature or higher, and then the polymer is hardened at a softening temperature or lower after the mold is pressed.

That is, as shown in FIG. 19B, a mold 617 in which a mold pattern 619 for forming a recess is formed is pressed onto a polymer 615 formed on a substrate 611. For example, the polymer 615 is a thermoplastic resin (glass transition temperature Tg) and is pushed into the polymer 615 at a temperature higher than Tg. The entire mold 617 may be put into the polymer 615 and pushed in, or may be put into the polymer 615 with a slight gap as shown in FIG. In the case of opening a gap, the volume of the polymer 615 changes after curing, and therefore the gap interval is selected in consideration of the volume change. Specific examples of thermoplastic resins include polycarbonate (PC), acrylic (PMMA), polylactic acid (PLA), polyethylene terephthalate (PET), polystyrene (PS), liquid crystal polymer (LCP), polyvinyl chloride (PVC), and polyacetal. (PCM), polypropylene (PP), various rubbers (natural rubber and synthetic rubber), and the like, but are not limited thereto. The polymer 615 may be a thermosetting resin such as a phenol resin, an epoxy resin, a melamine resin, or a polyimide, but it should be noted that once it is cured, it cannot be softened even when heat is applied. In the case of a thermoplastic resin, it can be softened any number of times. For example, even if pattern collapse occurs, it may be softened again and the molding may be pushed in.

After the pattern 619 of the mold 617 is pushed into the polymer 615, the polymer 615 is cured when cooled and lower than Tg. Thereafter, when the mold 617 is pulled up, as shown in FIG. 19C, the pattern 619 of the mold 617 is transferred into the polymer 615 to form the recesses 621 (621-1, 2, 3, 4). If a mold release agent is applied to the mold surface before inserting the mold into the polymer, it becomes easy to separate the mold from the cured polymer after the polymer is cured. FIG. 19 is a schematic view (cross-sectional view) of the cross-sectional structure of the substrate 611. When viewed in plan, the concave portions are rectangular and the long sides are parallel and arranged in a large number. Three-dimensionally, the concave portions are in a rectangular parallelepiped shape, and a large number of side surfaces on the long side are parallel.

The side walls 615-1, 615-2, and 615-3 of the polymer 615 between the adjacent recesses become a diaphragm that is deformed by a pressure difference in the recess. The advantage of the imprint method is that the process is simple and the pattern can be formed accurately. That is, the size, depth Hc1, width Wc1, length Lc1, and distance between adjacent recesses 621 (polymer sidewall thickness) Ws formed by imprinting are formed with little variation. The Since these values are extremely important for the pressure sensor of the present invention, it is necessary that the values be produced as much as possible without variation. Therefore, the imprint method is a very excellent method for the present invention. Since the depth Hc1, the length Lc1, and the substrate side wall thickness Ws are the size of the diaphragm, if these values are made to have a small variation and almost constant, the variation in the amount of deformation caused by the pressure P1 or P2 will also be small. The generated charge is also almost constant, resulting in a very accurate piezoelectric device (pressure sensor). A mold release agent may be applied to the surfaces of the molds 617 and 619 before the molds 617 and 619 are put into the polymer 615 so that the polymer 615 does not adhere to the molds 617 and 619 and pattern collapse occurs. Alternatively, the surfaces of the molds 617 and 619 may be coated with a fluororesin or the like.

In the above, the thermal printing method, that is, the heat treatment at a temperature higher than normal temperature is performed to soften and cure the polymer 615. However, if the UV printing method is used, the polymer 615 can be cured even at normal temperature. A UV polymer 615 that cures when irradiated with ultraviolet light is used to push the molds 617 and 619 into the polymer 615 and then cure the polymer 615 through the molds 617 and 619 and / or through the substrate 611 and the insulating film 613. Irradiate light. The light of this wavelength is mostly ultraviolet rays, γ rays, X rays and the like. Therefore, the molds 617 and 619, the substrate 611, and the insulating film 613 are made of materials that can transmit these lights. For example, it is made of glass or quartz. After the polymer 615 is cured by ultraviolet irradiation, when the molds 617 and 619 are pulled out, the recess 621 is formed. A mold release agent may be applied to the surfaces of the molds 617 and 619 before the molds 617 and 619 are put into the polymer 615 so that the polymer 615 does not adhere to the molds 617 and 619 and pattern collapse occurs. Alternatively, the surfaces of the molds 617 and 619 may be coated with a fluororesin or the like. Thereafter, heat treatment may be performed to further ensure the curing.

Thereafter, the polymer 615B formed on the bottom may be removed. For example, anisotropic etching using oxygen plasma may be performed on the entire surface of the substrate (the entire surface from the upper surface of the polymer 615). Since the etching is performed on the entire surface, not only the polymer 615B at the bottom of the recess but also the top surface of the polymer 615 is etched, so that the thickness of the entire polymer 615 is reduced. ) Is maintained. However, over-etching is required to remove the polymer 615B at the bottom of the recess throughout the substrate. When the polymer 615B is etched first, the underlying insulating film 613 (the substrate 611 in the absence of the insulating film 613) is exposed. It is not etched and is not so etched even in the silicon nitride film system. On the other hand, since the upper surface of the polymer is etched, if the over-etching is performed excessively, the recess depth Hc1 decreases. Therefore, in order to reduce the over-etching amount, it is necessary to reduce the variation in the anisotropic etching amount of the polymer caused by oxygen plasma and at the same time reduce the thickness of the polymer 615B at the bottom of the recess as much as possible. The variation in the depth of the mold pattern 619 is reduced, the variation in the flatness of the mold body 617 is also reduced, and the mold pressing pressure is made uniform over the entire substrate. In order to make the press pressure of the mold uniform over the entire substrate, the mold pattern 619 is preferably disposed uniformly over the entire substrate. Further, when the polymer 615B at the bottom of the concave portion is etched and the base begins to be exposed, reactive species such as CO are reduced, and the end point can be determined by sensing the amount thereof.

Next, the first conductor film {first electrode / wiring (lower electrode)} 623, the piezoelectric film 625, the second conductor film {second electrode / wiring (on the cured polymer 615) Upper electrode)} 627 and insulating film 629 are formed. The formation method, conditions, and the like are the same as described above. (For example, FIG. 13 (a), FIG. 14, FIG. 15, FIG. 17, FIG. 18) The first conductive film 623 should not be connected at 637 (637-1, 2, 3) on the upper surface of the substrate side wall. Similarly, the second conductor film 627 is not connected to the upper surface 639 (639-1, 2, 3) of the substrate side wall. Next, a thin plate 631 is attached, and a pressure introducing hole 633 is formed in each concave portion 621 (621-1, 2, 3, 4). The same applies to the removal of the thin plate 631 in the region where the extraction electrode from the first conductor film 623 and the second conductor film 627 is to be formed. Thereafter, contact holes for forming these lead electrodes, conductor films in the contacts, and conductor films for electrodes and wirings are formed.

As described above, a pressure sensor in which the polymer 615 was used as the substrate side wall on the substrate 611 and the piezoelectric film was formed thereon was formed. When the polymer 615 is not an insulator, an insulating film (for example, a silicon oxide film by a CVD method or a PVD method) is formed on the first conductor film 623 before forming the first conductor film 623. . The first recess has, for example, a width Wc1 of 1 μm to 500 μm, a depth Hc1 of 1 μm to 500 μm, a length Lc1 of 1 μm to 2000 μm, and a substrate sidewall thickness Ws of 0.5 μm to 100 μm. By using this method, it is possible to form very accurate recesses and substrate side walls. If the nanoimprint method is used among the imprint methods, it is possible to form a deep recess with a very fine pattern.

For example, when PET (Tg = 430 ° C.) is used as the polymer, a PET sheet (thickness about 50 μm) is pasted on a silicon oxide film (1 μm thickness) on a silicon substrate (thickness 400 μm, 4 inches), and about 450 ° C. Soften at the above temperature. A mold (made of silicon) is pressed against this softened PET, and then the temperature is lowered to Tg or lower and the mold pattern is transferred into the PET. (Depth Hc1 = 30 μm, length Lc1 = 60 μm, width Wc1 = 30 μm, substrate side wall thickness Ws = 5 μm) 1 μm of platinum (Pt) (first conductor film) is laminated on the recess made of this PET, Platinum is dry-etched with a chlorine-based gas to form a wiring pattern. Thereafter, 2 μm (side wall thickness) of PZT is laminated by sputtering, and further, a platinum film (second conductor film) is laminated by 1 μm. Next, platinum is dry-etched with a chlorine-based gas to form a wiring pattern. Next, after depositing 2 μm of silicon oxynitride film by CVD, a glass plate (thickness: 200 μm) with a lead electrode portion opened is attached and fixed with an adhesive (thermosetting resin), and then a lead electrode is manufactured. did. Furthermore, a pressure transmission hole was formed in the glass in the recessed area. After the mold pattern was transferred, all process temperatures were performed at a temperature below Tg of PET (about 400 ° C.). As described above, a piezoelectric device (pressure sensor) having the structure shown in FIG.

In addition, an adhesive layer such as titanium (Ti) may be thinly laminated (about 10 nm to 100 nm) before platinum is laminated on PET. In addition, in order to enhance the piezoelectricity such as PZT, the PZT film may be sputtered after sputtering platinum having a preferred orientation (111) plane orientation, in this case, PZT oriented in the preferred orientation (111) plane of platinum. A film can be obtained, and the piezoelectricity of the PZT film can be improved.

In the case shown in FIG. 19, since the polymer is applied or dropped or a sheet is attached to the flat surface of the first surface of the substrate 611, the thickness of the polymer film is thicker than the flat surface of the first surface of the substrate 611. turn into. In the case of only a piezoelectric device (pressure sensor), a conductor film or the like may be laminated on this thick polymer film. Therefore, the coverage (step coverage) at the step portion of the conductor film or the like or the step portion There are few problems such as disconnection of the conductor film, but these problems become serious when other devices (IC, resistor, capacitor, coil, etc.) are mounted on the substrate 611 together. This is particularly problematic when wiring such as an IC mounted on the substrate 611 is connected to wiring of a piezoelectric device. Further, when the piezoelectric device is mounted together with other devices, the thickness of the polymer film is increased even when the piezoelectric device is used alone, so that the demand for reducing the thickness cannot be satisfied. Therefore, as shown in FIGS. 20A to 20D, the substrate 611 is removed by etching in a region where the piezoelectric device is to be formed, and is thinned. 20A to 20D are diagrams showing a method of forming a piezoelectric device in a recess formed in a semiconductor substrate such as a silicon semiconductor substrate.

That is, as shown in FIG. 20A, a recess 614 is formed in a region 611 in the substrate where a piezoelectric device is to be formed. A resist pattern is formed by using a photolithography method or an imprint method, and the concave portion 614 is formed by wet etching or dry etching. A slope 616 may be formed in the recess to facilitate polymer entry into the recess 614. For example, when the substrate 611 is a (100) silicon substrate, an inclined slope {(111) plane} can be obtained by etching with a KOH solution. Alternatively, isotropic etching is possible with a hydrofluoric acid-based etching solution, and isotropic etching is also possible by dry etching.

20E to 20G are views for explaining a method of forming such a recess in a semiconductor substrate such as silicon. As shown in FIG. 20E, an insulating film 612 is formed on the first surface of the silicon substrate 611. The insulating film 612 is, for example, a silicon oxide film, a silicon nitride film, or a silicon oxynitride film, and is formed by a coating method such as a CVD method, a PVD method, or an SOG method, a thermal oxidation method, a thermal nitridation method, or the like. Next, a photosensitive film 620 is formed on the insulating film 612 by a coating method or a sheet attaching method (a sheet-like or film-like photosensitive film is attached to a silicon substrate), and an opening is formed using an exposure method. A portion 622 is formed. Next, as shown in FIG. 20F, the insulating film 612 is removed by etching using the opening 622 pattern. In the case where the insulating film 622 is a silicon oxide film, if dry etching is used, CF-based gas (for example, CF4), CHF-based gas (for example, CHF), or the like, or a mixture in which oxygen, CO-based gas, hydrogen, or the like is mixed. Plasma etching is performed using a gas. If wet etching is performed, wet etching is performed using a buffered hydrofluoric acid (BHF) -based etching solution or a hydrofluoric acid-based etching solution.

Next, the silicon substrate exposed to the opening pattern 622 after etching the insulating film 612 is etched to form a recess 614. As described above, when the substrate 611 is a (100) silicon substrate, the inclined surface 616 with respect to the first surface which is the (100) surface is etched by etching the silicon substrate using a KOH solution, a hydrazine solution, or the like. A recessed portion 614 having the shape can be formed. Alternatively, isotropic plasma etching using SF-based gas (for example, SF6), CF-based gas (for example, C4F8), chlorine-based gas (for example, Cl2, BCl2, SiCl4), or a mixed gas in which oxygen or the like is mixed with these gases. By performing the above, a recess 614 having a tapered surface 616 can be formed. Alternatively, the concave portion 614 having the inclined surface 616 with respect to the first surface which is the (100) surface can be formed using a hydrofluoric acid-based solution (for example, HF + HNO 3 or HF + HNO 3 + CH 3 COOH). Note that the insulating film 612 is formed to improve the adhesion with the photosensitive film 620. However, if there is no problem in the adhesion between the silicon substrate 611 and the photosensitive film 620, the photosensitive film 620 is formed on the silicon substrate 611. It may be formed directly. Alternatively, a transistor or the like is formed in another region of the silicon substrate 611, and an insulating film or the like is already formed in the region 622. If there is no problem in adhesion between the insulating film and the photosensitive film 620, the insulating film or the like is used. A photosensitive film may be formed directly on the substrate, or if there is a problem in the adhesion between the insulating film or the like and the photosensitive film 620, the adhesive film is subjected to an adhesion improving process by a hydrophilic process or the like. Alternatively, the insulating film 612 may be formed after the insulating film in the region including the region 622 is removed. (Fig. 20 (g))

Next, polymer 615 is applied and thickly laminated on the concave portion 614 and then softened, and the convex pattern 619 of the mold 617 is pressed against the polymer 614 as shown in FIG. When the mold 615 is pulled out after the polymer 615 is cured, a recess 621 is formed in the thickly laminated polymer 615 in the recess region 614 in the substrate 611. {FIG. 20 (c)} Thus, by forming the recess 614 in the substrate 611 and forming the recess 621 in the polymer 615 applied to this portion, the total thickness (thickness of the substrate 611 + in the flat portion) The thickness of the polymer 618 can be reduced. The imprinted polymer 618 remains on the flat portion 618 of the first surface of the substrate 611. The thickness of this portion depends on the pressing force of the imprint mold 617, the strength of the substrate 611, the initial thickness of the polymer, the repulsive force of the polymer, etc. Is approximately 0.1 μm to 20 μm. In order to make this value as small as possible, it is necessary to optimize the conditions. If optimized, 0.1 μm to 2 μm can be realized. As a result, as shown in FIG. 20D, the level of the conductor films 625 and 629 approaches the level of the first surface of the substrate, and a flatter pattern can be realized, and the coverage of the conductor films 625 and 629 can be improved. The covering properties of the insulating films 623 and 629 are also improved, and disconnection of the conductor film or the like is eliminated. Moreover, since the thickness of the piezoelectric element (pressure sensor) is also reduced, it can be applied to thin devices.

In the case where the polymer 615 is a piezoelectric body, for example, a polymer ferroelectric such as polyvinylidene fluoride (PVDF) (for example, as in FIG. 19), the side wall (615-1, 2, 3) of the polymer 615 is further layered. A conductor film may be formed. That is, after FIG. 19C, as shown in FIG. 19E, a conductor film 641 is formed, and the conductor film 641 is removed by etching on the upper surfaces of the polymer side walls 615-1, 2, 3. The conductor film 641 in the recesses having different pressures is not connected. Next, an insulating film 643 is formed, and further a thin plate 645 is attached thereon, and the concave portion is hermetically closed. Next, a pressure introduction hole 647 is formed in the recess 621 (621-1, 2, 3, 4), and the thin plate 645 is not necessary in the region 649, for example, a region where a lead electrode is formed from the conductor film 641. The thin plate 645 is removed. Alternatively, the pressure introducing hole 647 or a thin plate 645 in which an unnecessary region is opened in advance may be prepared, and the thin plate 645 in which the window is opened may be attached on the insulating film 643. Thereafter, lead-out contact holes from the conductor film 641, contact conductor film formation, and electrode / wiring formation are performed.

As described above, the pressure sensor can be formed by forming the recess and the sidewall polymer in the piezoelectric polymer by the imprint method. In addition, since only one conductor film is required (two layers if the extraction electrode / wiring layer is included), the process becomes very simple. Further, when a semiconductor substrate such as a silicon substrate is used as the substrate 611, a pressure sensor and an IC having various functions can be mounted together with a pressure sensor in the same substrate or chip. it can. Therefore, since the mounting area can be reduced, the mounting size can be reduced, and further, the number of connection wirings can be reduced, thereby improving the reliability and the yield.

In the conventional planar piezoelectric element, a large area in the substrate is required. However, when the present invention is used, the planar size of the substrate can be reduced. For example, a square one side W1, the distance between the concave recesses of the depth H1 in Ws, if one side is arranged in the area of the square L, ² pieces {L / (W1 + Ws) } in this Since the area of approximately {L ² + 4H1 × W1x {L / (W1 + Ws)} ² } is subjected to pressure, approximately {1 + 4 (H1 × W1x) / (W1 + Ws)} compared to the conventional method ² } times the sensitivity. For example, if H1 = 300 μm, W1 = 25 μm, and Ws = 5 μm, the sensitivity is 9.3 times. In addition, since the recessed part which receives the same pressure does not deform | transform even if the space | interval of recessed parts is narrowed, Ws can be made small to the limit of recessed part formation. Also, the planar size W1 of the recess can be reduced to the limit at which the recess can be formed and various films can be formed in the recess. Since the current level can be made smaller than the above value, the sensitivity can be further increased. It is not necessary to attach the thin plate 658 to the upper surface of the substrate 651 in the region receiving the same pressure (that is, the upper surface of the side wall between the recesses), so that only the outermost region of the region receiving the same pressure is attached to the substrate 611. Just do it. By doing so, the pressure can be applied also to the upper surface of the side wall between the recesses, and the sensitivity is further improved.

FIG. 21 is a view showing a structure and a manufacturing method of a pressure sensor using a piezoresistive effect by arranging a piezoresistor on the side surface of the substrate side wall between adjacent recesses of the present invention. FIGS. 21D and 21E are diagrams showing an example of a piezoresistive pattern on the side surface of the substrate side wall. In FIGS. 21D and 21E, four piezoresistors 5014 (5014-1, 2, 3, 4 or 5, 6, 7, 8) are formed on the side surface 5021 of the substrate side wall 5011 having a square or rectangular shape. Has been placed. The position of 5022 indicated by the solid line on the side surface 5021 of the substrate side wall is the boundary of the diaphragm portion. That is, the side surface 5021 of the substrate side wall is a diaphragm portion, and its center position O is most bulged or depressed due to a pressure difference between adjacent concave portions. The piezoresistors shown in FIGS. 21A to 21E are arranged so as to form a bridge circuit (so-called Wheatstone bridge circuit) including four piezoresistors shown in FIG. In FIG. 21 (d), the four piezoresistors are arranged around the substrate side wall 5021, the piezoresistors 5014-2 and 5014-4 are arranged in the same direction, and the piezoresistors 5014-1 and 5014-3 are They are arranged in the same direction. Accordingly, the deformation of the diaphragm (substrate sidewall) causes the piezoresistors 5014-2 and 5014-4 to change with the same resistance value (assuming the same resistance size), while the piezoresistors 5014-1 and 5014-3 change with the same resistance value. However, the degree of change is reversed. In FIG. 21 (e), the piezoresistors 5014-5, 6, 7, and 8 are arranged in the same direction, but the piezoresistors 5014-5 and 8 are arranged in the periphery, and the piezoresistors 5014-6 and 7 are in the center. Arranged in the direction. Accordingly, the piezoresistors 5014-5 and 8 change with the same resistance value, while the piezoresistors 5014-6 and 5014-7 change with the same resistance value, and the degree of change is different. Accordingly, since the change amount of the resistance value can be known from the measurement of the bridge circuit, the pressure can be calculated from the change amount of the resistance value. Although only the piezoresistors are shown in FIGS. 21 (d) and 21 (e), a wiring pattern for applying a voltage to the piezoresistors to flow a current is also formed on the side wall of the substrate.

As shown in FIG. 21A, recesses 5012 (5012-1, 2, 3) are formed in the substrate 5011. An insulating film 5013 is formed in the recess 5012 and on the first surface of the substrate 5011, and a thin film resistor 5014 for piezoresistor is further laminated. Further, a resist pattern 5015 for patterning this thin film resistor is formed. This resist is formed by an electrodeposition method or the like, and a resist pattern is also formed on a side surface which is a vertical surface of the substrate side wall by an exposure method (oblique). In a normal coating method (for example, dip, dripping, spin coating, screen coating), a thick photoresist is accumulated in the recess 5012. Therefore, in order to pattern the inside of the recess, a strong exposure method (a method having a large depth of focus, for example, X-ray exposure and SOR (synchrotron radiation) method) must be used. Therefore, for example, the photosensitive film (photosensitive resist) 689 can be laminated faithfully to the step in the recess by electrodeposition. Here, the electrodeposition method is a method in which a photosensitive polymer dispersed in a solution is deposited on a conductive film as a coating film by electrophoresis. In addition to the electrodeposition method, a pattern can be formed in the recess by a method using a sheet-like dry film or a method using a photosensitive resist formed by a plasma polymerization method. A part of the resist pattern on the side surface of the substrate side wall becomes a piezoresistor. The thin film resistor is, for example, a chromium silicon (SiCrx) film, another silicide film, or a polycrystalline silicon film. In the case of a polycrystalline silicon film, the resistance of the polycrystalline silicon film may be changed by changing the doping amount, or the resistance may be changed by an ion implantation method. For example, in FIG. 21A, a polycrystalline silicon film 5014 is formed, and before the resist film 5015 is formed, ion implantation is performed on the entire surface to implant a concentration corresponding to a thin film resistor. At this time, in order to implant ions into the side surface of the substrate in the recess 5012, it is preferable to perform oblique rotation ion implantation. In the case of a rectangular recess with only oblique ion implantation, four oblique ion implantations are required. However, if rotational oblique ion implantation is used, only one ion implantation is necessary. Further, a resist pattern is formed in a portion that becomes a piezoresistor, and high concentration ion implantation for wiring is performed. As a result, a predetermined ion implantation amount is applied to the piezoresistive portion, and high concentration ion implantation is performed to the portion that becomes the wiring pattern.

Next, the thin film resistor is etched using the resist pattern 5015 as a mask to pattern the thin film resistor portion and the wiring portion, and the resist 5015 is removed. (FIG. 21B) Next, an insulating film 5020 is laminated. This insulating film 5020 protects the thin film resistor 5014. The thin film resistor 5014 can be a piezoresistor or used as a wiring. Next, a thin plate 5016 is attached on the insulating film 5020, and the concave portions 5012 (5012-1, 2, 3) are covered. Thereafter, pressure transmission holes 5012 (5012-1, 2, 3) are opened in the thin plate 5016. Further, the thin plate 5016 in the contact region 5018 that takes the lead electrode from the thin film resistance wiring 5014 is removed. Next, a contact hole 5019 is formed, and a voltage applied to the thin film resistance wiring 5014 is applied so that a current can flow. Wiring / electrodes may be further provided in this contact portion.

As described above, the piezoresistor and the bridge circuit wiring could be formed on the inner surface in the recess, that is, the side surface of the substrate side wall 5011 (5011-1 and 5011). If the pressure of the concave portion 5012-2 is P2, the pressure of the concave portion 5012-1 across the substrate side wall 5011-1 is P1, and P2> P1, the substrate side wall 5011-1 swells (deforms) toward the concave portion 5012-1. ). At this time, the change in the piezoresistance value composed of the thin film resistor 5014 can be measured by the bridge circuit. As can be seen from FIG. 21 (c), since the bridge circuit can be formed on both sides of the side wall of the substrate side wall 5011-1, the sensitivity is doubled. The same applies to the resistance formed on both surfaces of the substrate side wall 5011-2 with the pressure of the recess 5012-2 being P2.

Thus, the bridge circuit of the present invention can be configured with a small planar area. For example, when the size of the diaphragm is 300 μm × 300 μm, if the width of the recess is 25 μm and the width of the substrate side wall is 5 μm, the size of the pressure sensor of the present invention is 60 μm × 300 μm, which is 1 in comparison with a planar conventional diaphragm. Since the area is / 5 and two bridge circuits can be assembled, the sensitivity is doubled. Further, if the same planar area is occupied, nine diaphragms can be formed and bridge circuits can be assembled on both sides thereof, so the sensitivity is 18 times.

As described above, the substrate of the present invention can use a polymer, rubber or the like, and can also use a recess or a thin film resistor in a polymer or rubber on a semiconductor substrate such as silicon by using an imprint method. . In addition, the Young's modulus of polymers and rubbers is considerably smaller than that of silicon (Young's modulus of silicon is about 130 GPa, polymer is about 0.1 to 5 GPa, and rubber is about 0.01 to 0.1 GPa), so even a diaphragm that is an order of magnitude smaller will have the same deformation. The quantity can be obtained. For example, the thickness of the polymer or rubber is set to about 50 μm, and the recess and the substrate side wall are formed by imprinting or photolithography + etching, and the size of the substrate side wall (diaphragm) is 30 μm (depth direction) × 30 μm (length). Direction), a large amount of deformation can be obtained even if the thickness of the substrate side wall is 5 to 10 μm. Therefore, a piezoresistive pattern is formed on the side surface of the side wall, which is similar to a conventional silicon substrate diaphragm (300 μm × 300 μm, thickness 5 to 10 μm). A change in piezoresistance can be obtained. If there are not enough two recesses, it is sufficient to create and connect as many recesses as necessary, and the area is still quite small. In this way, after an IC is fabricated on a silicon semiconductor substrate, a piezoresistive pressure sensor can be fabricated by applying a polymer or rubber to the gap portion of the IC. Therefore, the pressure sensor + IC can be integrated into one chip, and the area of the IC can be hardly changed.

In addition, as described above, a recess having the same thickness as that of the polymer or rubber layer is formed on a semiconductor substrate such as silicon, and the polymer or rubber layer is embedded in the recess to make the portion a substrate. Since the level difference between the semiconductor substrate and the like can be reduced, problems such as disconnection of the wiring connecting the pressure sensor portion made of a polymer or rubber layer and the semiconductor substrate side can be solved. Furthermore, the piezoresistive pressure sensor can also be used in a through groove type that penetrates the substrate from the first surface to the second surface. It can also be formed on the side surface of the substrate side wall sandwiched between the first recess formed from the first surface side and the second recess formed from the second surface side.

FIG. 22 is a diagram showing another embodiment showing a structure and a manufacturing method when a piezoresistor is formed in a semiconductor substrate such as silicon. After forming the recesses 5032 (5032-1, 3, and 3) in the semiconductor substrate 5031, a thin insulating film 5037 is formed on the first surface. Thereafter, a conductor film 5033 is stacked. The insulating film 5037 is stacked when there is a problem in forming the conductor film 5033 directly on the semiconductor substrate 5031. For example, the purpose is to improve adhesion, and the purpose is to prevent damage from entering the semiconductor substrate 5031 when the conductor film 5033 is removed. The insulating film 5037 may be a thermal oxide film or a laminated film formed by CVD, PVD, or the like. The conductor film 5033 is formed for the purpose of forming a photosensitive electrodeposition resist film. Further, the film thickness (in combination with the film thickness of the insulating film 5037) is set to a thickness at which impurity ions can enter the semiconductor substrate during ion implantation. Therefore, the thinner the electrodeposition resist film, the better. For example, the insulating film 5037 has a thickness of 5 nm to 100 nm, and the conductor film has a thickness of 10 nm to 200 nm. The conductor film 5033 is a conductive film capable of electrodeposition resist, and may be, for example, a doped silicon film, a metal film such as aluminum, titanium, or chromium, an alloy film, a conductive carbon film, or a conductive polymer.

Next, a photosensitive electrodeposition film 5034 is laminated by an electrodeposition method, and exposure is performed by oblique exposure (inclined laser light to expose the inside of the recess. In the case of a rectangular recess, each side surface is exposed 4. Although it is necessary to perform the exposure twice, each side surface can be exposed by one exposure by rotating the substrate or the exposure to perform exposure, and the necessary patterning 5034 is performed. In particular, areas that are to be piezoresistive and portions that are to be wiring are opened. Next, ion implantation is performed, and ions are implanted into the piezoresistor and wiring region inside the semiconductor substrate from the place where the window is opened. In order to perform ion implantation also on the side surface of the substrate side wall perpendicular to the first surface of the substrate, oblique ion implantation is performed. When the concave portion is rectangular, it is desirable to irradiate the surface of the concave portion from the vertical direction. Therefore, ion implantation needs to be performed four times in order to implant ions into all the side surfaces. However, in the case of rotary ion implantation, the substrate may be rotated once. Since the conductor film 5034 and the insulating film 5033 exist in the portion opened by the electrodeposition resist film, the ion implantation acceleration energy is determined in consideration of the thickness and material thereof. Of course, it is also necessary to consider the thickness of the electrodeposition resist film serving as a mask. Alternatively, after the electrodeposition film is opened, the conductive film 5034 in the opened portion may be removed by etching and then ion implantation may be performed. The insulating film 5037 also serves as an etching stopper for the conductor film 5034.

After the ion implantation, the electrodeposition resist film is removed, and the conductor film 5034 is further removed. The insulating film 5037 may also be removed or left. Thereafter, a heat treatment for activating the ion-implanted ions is performed to form an ion-implanted layer 5036. An ion implantation layer 5036 serving as a piezoresistive region and an ion implantation layer 5036 serving as a wiring layer are formed on a substrate side wall 5031 (5031-1 and 2) serving as a diaphragm. Since this insulating film 5037 is thin, an insulating film 5038 is formed next, and a conductor film 5039 is further formed. This conductive film is intended to form an electrodeposition resist film 5040 on the conductive film. However, when a pattern is not formed in the recess 5032 (5032-1 and 5032), the pattern is formed only on the upper surface of the substrate 5031. Therefore, a photosensitive resist can be formed directly without forming the conductor film 5039. Next, an opening 5041 and an opening 5041 are formed on the first surface of the substrate 5031 in the recess by oblique exposure. (FIG. 22C) Since this conductor film 5039 is for the purpose of forming the electrodeposition film 5040, the thinner the electrodeposition film 5040, the better.

Next, the conductor film 5039 is removed by etching from the openings 5041 and 5042, and the insulating film 5038 in the openings is further etched to expose the ion implantation layer 5036 in the substrate 5031. {FIG. 22D} Next, the electrodeposition resist film 5040 is removed, and further the conductor film 5039 is removed. However, the conductor film 5039 can be left as long as there is no problem. Next, as shown in FIG. 22E, a conductor film 5045 is stacked. The conductor film 5045 is also stacked on the contact region 5043 (a flat portion on the substrate 5031) and the contact region 5044 (in the recess) to be in contact with the ion implantation layer 5036. As the conductor film 5045, a metal silicide film, a doped polycrystalline silicon film, various metal films, a conductive polymer, or the like may be appropriately selected. The conductor film 5039 may be left, and a conductor film 5045 such as a plating metal may be laminated on the conductor film 5039 and the contact region by a plating method or a selective CVD method. Examples of the plating metal include Cu, Ni, and Cr, and examples of the selective CVD metal include W.

Next, the conductor film 5045 is patterned, and the conductor film 5045 is removed by etching to form necessary wiring. Next, an insulating film 5046 is formed, and a thin plate 5047 is attached to cover the recesses 5032 (5032-1, 2, 3). Then, the pressure transmission hole 5048 (5048-1, 3) is opened. Further, the thin plate 5047 in the region where the lead electrode is to be formed from the conductor film 5045 is removed. These thin plate openings may be attached to the substrate 5031 by aligning the thin plate 5047 previously removed. Next, a connection hole (contact hole) 5051 with the conductor film 5045 is formed, and an extraction electrode 5052 is formed.

As described above, the piezoresistive layer can be formed on the side surfaces of the substrate side walls 5031-1 and 5031-2. The substrate side wall 5031 which arises from the pressure difference by the pressure P1, P2, P3 applied to the recessed part 5032 (5032-1, 3) from the pressure transmission hole 5048 (5048-1, 2, 3) is assembled using the bridge circuit. The applied pressure difference can be obtained based on the amount of change in piezoresistance that changes due to the deformation of (5031-1, 2). Note that a diffusion layer 5036 can be formed instead of the ion implantation layer 5036. For example, in FIG. 22A, after the conductor film 5033 is etched by the electrodeposition resist pattern and the insulating film 5037 therebelow is etched, the electrodeposition resist is removed, and the conductor film 5033 is further removed. Thus, an opening of the insulating film 5037 is obtained. A diffusion layer 5036 can be obtained from the opening of the insulating film 5037 by predeposition + diffusion with a desired concentration. In this case, since the insulating film 5037 serves as a pre-deposition and diffusion mask, it is desirable to stack the insulating film 5037 thicker than in the case of the ion implantation method. Further, in order to increase the concentration of the ion implantation layer (diffusion layer) wiring layer in the substrate 5031, an ion implantation layer or a predepot + diffusion layer can be further formed by the same method as described above. When a piezoresistive layer is manufactured in the semiconductor substrate 5031, the piezoresistive layer is the semiconductor substrate itself, and thus has an advantage of high reliability and quality.

Although patterning can be performed on the plate recess by the electrodeposition resist pattern, patterning can also be performed on the sidewall recess using a normal resist. FIG. 23 is a diagram showing an embodiment in which a resistor is formed on the side surface of the side wall. In FIG. 23A, through-grooves 8099 (8099-1 to 5) are formed in a silicon substrate 9001, and a support substrate 9021 is attached to the lower surface (second surface) of the silicon substrate 9001. An insulating film 8991 is stacked on the side surfaces of the sidewalls 9001 (9001-1 to 61-1) and the upper surface (first surface) of the 9001. A photosensitive sheet (also referred to as a sheet-like photosensitive film) 9201 is attached to the surface (upper surface, first surface) of the silicon semiconductor substrate 9001 where the through groove 8999 is open. When the photosensitive sheet 9201 is attached, it may be attached in a vacuum (or in a low pressure state). In the opening portion 9203 of the through groove 8999, the photosensitive sheet 9201 is slightly depressed because there is no portion that supports the photosensitive sheet 9201.
Next, as shown in FIG. 23B, when pre-baking is performed to soften the photosensitive sheet 9202, the photosensitive sheet 9202 enters the through groove 8999 and moves to the side surface of the side wall 9001 (9001-1 to 61-1) and the bottom of the through groove 8999. Adhere to. If pre-baking is performed by applying a pressure higher than the pressure at which the photosensitive sheet 9201 is adhered, the photosensitive sheet 9201 enters the inside of the through groove 8999 by the pressure difference. In particular, since the inside of the through groove 8999 is vacuum (or low pressure) and there is almost no gas, the photosensitive sheet 9201 smoothly hangs down inside the through groove 8999, and the side surface of the side wall 9001 (9001-1 to 5) and It adheres firmly to the bottom of the through groove (that is, the opening surface of the support substrate 9021) without a gap. If the (average) film thickness of the photosensitive sheet 9201 in the through groove 8999 is t21, the width in the through groove 8999 is d21, the depth is h21, and the depth is w21, the volume in the through groove 8999 of the photosensitive sheet 9201 is It is about d21 * h21 * w21 * t21. Assuming that the thickness of the photosensitive sheet immediately after adhesion is te, and the photosensitive film at the opening of the through groove 8999 has completely entered the through groove 8999 (actually, outside the opening of the through groove 8999, that is, on the silicon substrate 9001). Part of the photosensitive sheet is softened and enters the through groove 8999).
Since d21 * h21 * w21 * t21 = d21 * w21 * te holds, te = h21 * t21.
If the implantation depth of ion implantation is set to max 0.3 μm, if h 21 = 300 μm, t 21 may be 0.3 μm or more. Therefore, a photosensitive sheet 9201 having a thickness of 90 μm may be used. Thus, the approximate thickness of the photosensitive sheet 9201 to be used may be determined from the implantation depth of ion implantation using this relational expression.

After pre-baking, the photosensitive film 9201 attached to the side surface of the side wall 9001 (9001-1 to 61-1) and the bottom of the through groove 8999 is irradiated with light EX12 and exposed using a mask. The irradiation angle of the light EX12 is set to an angle β22 with respect to the surface of the silicon substrate 9101 and the side surface of the side wall 9001 is irradiated. This state will be described based on the schematic diagram of FIG. The light EX12 passes through the pattern 9207 of the mask 9205 and is irradiated onto the photosensitive film 9201 attached to the side surface of the side wall 9001. In order for the light EX12 to irradiate and pattern the photosensitive film 9201 attached to the side surface of the side wall 9001, it is necessary to irradiate the light EX12 at an angle (β22) with respect to the surface of the silicon substrate 9101. . The pattern width d22 of the pattern 9207 of the mask 9205 is a width of d22 / tan β22 on the photosensitive film 9201 on the side surface of the side wall 9001. After the exposure, the photosensitive film is removed where it is desired to form a resistor (in FIG. 23 (c), x22 portion). Therefore, in the example shown in FIG. 23C, the photosensitive film 9201 is a negative type. In the case of the positive type photosensitive film 9201, the vacant part of the mask is reversed from the case of the negative type so that the part where the resistor is formed is not irradiated with light. The irradiation direction of the exposure is the same as the ion implantation described with reference to FIG. That is, in FIG. 23B, when pattern formation is desired on the right side surface of the side wall, irradiation is performed from the right side (EX12 in FIG. 23B), and when pattern formation is desired on the left side surface of the side wall, irradiation is performed from the left side. (EX11 in FIG. 23 (b)).

As described above, the portion 9209 where the resistor is to be formed is opened as shown in FIG. After the photosensitive film 9201 is baked to cure the photosensitive film, ion implantation (II24, II25) is performed on the side surface of the side wall 9201 (9001-1 to 61-1), and the side wall of the opened portion 8209 is formed. An ion implantation layer 9211 is formed on the side silicon substrate. The acceleration energy of ion implantation is determined depending on the depth at which the ion implantation layer 9211 is formed in consideration of the thickness of the insulating film 8991. If the acceleration energy of ion implantation is to be lowered, the insulating film 8991 in the portion 9209 having the window opened may be removed. As this removal method, the insulating film is immersed in a wet etching solution or isotropic dry etching is performed. In addition, as described with reference to FIG. 34, the ion implantation (II24, II25) is performed at a predetermined angle (α24, α25) to inject ions into the side surfaces of the side walls 9201 (9001-1 to 9001). The ion implantation is performed in the same direction as the ion implantation described with reference to FIG. 23D, when the window opening 9209 is formed on the right side surface of the side wall, ions are implanted from the right side (II25 in FIG. 23D), and the window opening 9209 is formed on the left side surface of the side wall. If formed, ions are implanted from the left side (II24 in FIG. 23 (d)). The ion implantation amount is determined by the concentration (resistance) of the resistor. Note that in the case of ion implantation, the insulating film 8991 may be omitted. The resistor can be formed not by ion implantation but by a diffusion method. In that case, diffusion may be performed after the insulating film 9209 in the portion 9209 having the window opened is etched and the photosensitive film 9201 is removed.

Next, it is necessary to form a diffusion wiring layer for connecting the resistor to the wiring layer on the side surface of the side wall 9201 (9001-1 to 9001-1). This formation can also be performed by the same method as that described with reference to FIGS. After the ion implantation layer 9211 as a resistor is formed, the photosensitive film 9201 is removed (removed). This removal is performed by wet stripping method such as organic resist stripping solution or concentrated nitric acid, or ashing using oxygen plasma or the like. Next, as in the method shown in FIGS. 23A and 23B, the photosensitive sheet is attached to the first surface side of the silicon substrate 9001 in a vacuum. This is preferably performed in a vacuum or at a low pressure of 1 atmosphere or less. Thereafter, pre-baking is performed to attach the photosensitive sheet to the side wall side or bottom of the through groove. Next, the photosensitive sheet is patterned by exposure so that it can be connected to the resistor 9211 already formed. This exposure is similarly inclined to allow patterning on the side wall of the side wall. Also, patterning is performed so that the side surface pattern is connected to the wiring on the first surface. After the patterning is completed, ion implantation is performed on the opened portion. This ion implantation has a higher concentration than the ion implantation in which the resistor is formed, and it is necessary to lower the wiring resistance. Therefore, the patterning width is increased so that the resistance of the ion implantation layer is lowered. The high-concentration ion implantation layer is connected to the resistor ion-implantation layer 9211, but the overlap is at both ends of the resistor 9211 so that the main body of the resistor 9211 is not subjected to high-concentration ion implantation. In addition, the main body of the resistor 9211 needs to be covered with a photosensitive film. (The resistor and high-concentration ion-implanted layer (diffusion wiring layer) must be connected, so the overlap is essential.) Since high-concentration ion-implantation is used, a high-current ion implanter should be used. Is desirable. As can be easily understood, the step of forming the ion implantation layer of the high concentration layer and the step of forming the resistor by ion implantation may be reversed. A high-concentration diffusion layer (wiring layer) can also be formed by a diffusion method (predeposition). As described above, the resistor and the low resistance diffusion wiring layer connected to the resistor can be formed on the side wall of the sidewall. The impurity concentration of the resistor is about 10 ¹⁷ / cm ³ to 10 ²⁰ / cm ³ , and the impurity concentration of the diffusion wiring layer (low resistance) is larger than the impurity concentration of the resistor and is about 10 ¹⁹ / cm ³ to 10 ²⁰ / cm ³ to 10 ²² / cm ³ . Further, when the sidewall is N-type silicon, the impurity is P-type, and when the sidewall is P-type silicon, the impurity is N-type. (If the entire sidewall is a resistor, the same impurity type may be used.) Furthermore, since the piezoresistive effect is the P-type, if the resistor has a P-type impurity concentration, the sidewall The resistance change rate of the resistor with respect to the change rate increases, and the sensitivity increases.

In FIG. 23, the method using a photosensitive sheet as the photosensitive film has been described. In addition to this, there is a method of forming a photosensitive film on the side surface of the side wall. FIG. 24 is a diagram illustrating a method for forming a photosensitive film on the side surface of the side wall. As shown in FIG. 24A, a liquid type photosensitive film (ordinary resist) is applied on a silicon substrate 9001 in which through grooves 8999 (8999-1 to 5999) are formed. A liquid photosensitive film also enters the inside of the through groove 8999. When this application is preferably performed under a lower pressure than in the atmospheric pressure, preferably in a vacuum (under an ultra-low pressure), the photosensitive film is filled without bubbles entering the bottom of the through groove 8999. However, it is not necessary to embed most of the through grooves 8999. Next, as shown in FIG. 24B, an insertion mask 9223 is prepared. The insertion type mask 9223 includes a support plate 9224 that supports a columnar pattern 9225 that enters the through groove 8999. The shape of the columnar pattern 9225 is slightly smaller than the size of the through groove 8999, and the shape is substantially the same. That is, assuming that the width of the through groove 8999 is d21, the depth (perpendicular to the paper surface) is w21, the width of the columnar pattern 9225 is d31, and the depth (perpendicular to the paper surface) is w31, d21> d31, w21. > W31. Further, the length h31 of the columnar pattern 9225 is made larger than the depth h21 of the through groove.

The insertion type mask 9223 is aligned with the silicon substrate 9001 having the through groove 8999 and gradually approached, and the columnar pattern 9225 is inserted into the through groove 8999 as shown in FIG. The photosensitive film 9221 contained in the through groove 8999 is pushed out to the columnar pattern 9225. Once inserted to a reasonable depth, stop moving. If the distance between the columnar pattern 9225 and the side wall at this time is e1 (distance to the left side) and e2 (distance to the right side), d21 = d31 + e1 + e2. The distance from the bottom of the columnar pattern 9225 to the support substrate is f31. In order for the columnar pattern 9225 to be inserted into the through groove without contacting the side walls 9001-1 to 900-1, the alignment between the insertion mask 9223 and the silicon substrate 9001 is very important. In order to perform this alignment accurately, the support plate 9224 is preferably made of a transparent material. In addition, in order to manufacture the insertion type mask 9223 with high accuracy, the insertion type mask 9223 is formed by etching, for example, a quartz substrate or the like using deep pit type anisotropic etching (Deep RIE). Note that exposure and development are possible even if the photosensitive film on the side surface is relatively thick. For example, since the thickness may be 5 to 10 μm, d31 = d21 + 10 to 20 μm may be used. Of course, since the alignment accuracy will be improved in the future, the thickness of the photosensitive film on the side surface can be further reduced.
After the insertion type mask 9223 is stopped and pre-baked to effect a half effect, the insertion type mask 9223 is pulled out. As a result, as shown in FIG. 24D, a photosensitive film 9221 having a constant thickness can be conformally formed on the side wall of the side wall. In order to prevent the photosensitive film 9221 from being dragged together when the insertion type mask 9223 is pulled out, the insertion type mask 9223 is applied to the surface of the columnar pattern 9225 in advance while applying ultrasonic vibration or the like. Just pull it out. In this way, a photosensitive film having a thickness of approximately e1 or e2 can be formed on the side wall of the side wall. Thereafter, exposure may be performed to perform desired patterning. This technique can be applied not only to pressure sensors, but also to all pattern formations that form resist patterns on the side walls. If a pattern is further formed on the insertion type mask 9223 so that light can pass through the columnar pattern 9225 and light is irradiated from the inside, it is not necessary to use an exposure apparatus such as a normal stepper or aligner. . After pre-baking, a desired photosensitive film pattern can be formed by irradiating light from the columnar pattern 9225, then pulling out the insertion type mask 9223, and then developing.

Various crystal planes can be selected for the substrate side wall surface of the present invention. For example, when the crystal plane (surface) of the silicon substrate is a (100) plane, the side wall surface 9101 is a (0xx) plane. (X is an arbitrary number) Furthermore, the (piezo) resistor can be formed in various orientations with respect to the side wall surface. For example, if the side wall surface is the (010) plane, the resistance change can be increased because the piezoresistance effect is maximized when the resistor is formed in the <110> direction. The larger the deformation rate, the greater the difference in measured values and the better the sensitivity. Therefore, the resistor is disposed at the end of the side surface having a large deformation rate (strain). Further, on the crystal plane having the largest piezoresistance effect, the longitudinal direction of the resistor is arranged in the direction of the crystal axis having the largest piezoresistance effect, and the short side of the resistor is arranged in the direction of the crystal axis having the largest piezoresistance effect. It is desirable to arrange the direction. For example, when the surface orientation of the side wall of the substrate is (100), the longitudinal direction of the resistor is arranged in the <110> direction and the short side direction of the resistor is arranged in the <110> direction. (Since the dependence on crystal orientation contributes to the deformation of the substrate side wall, the same can be said for the capacitive pressure sensor.)

As described above, by forming (piezo) resistors on the side surfaces (through grooves) sandwiched between the through grooves of the present invention (including the case where the entire side walls are resistors), both side surfaces of the side walls are formed. The pressure difference (P1−P2) can be detected by using the deformation of the side wall due to the pressure difference (P1−P2). Not only the Wheatstone bridge circuit but also other resistance measurement circuits can be used to measure the change of the piezoresistor due to the pressure difference and detect the pressure from the measured value. Further, since the same silicon substrate used in the LSI (for example, the same impurity concentration and crystal plane orientation) can be used, the pressure sensor of the present invention and the LSI can be mounted on the same chip. Moreover, since the area of the pressure sensor can be made very small compared to the conventional flat diaphragm, the chip size of the LSI is not increased. Specifically, the area of the pressure sensor is sufficient if the conventional planar diaphragm has a size of 500 μm * 500 μm, and the size of 500 μm * 200 μm in the case of four side walls. For one side wall, a size of 500 μm * 100 μm is sufficient, and a size of 500 μm * 50 μm or less is possible if the process conditions are optimized.

FIGS. 25A to 25C are views showing a structure of a capacitance type pressure sensor using a recess formed in a substrate and a manufacturing method thereof. After the recesses 5112 (5112-1, 2 and 3) are formed in the substrate 5111, an insulating film 5113 is formed, and a conductor film 5114 is further formed. Next, a photosensitive film 5115 is formed, and a necessary pattern is formed. The substrate 5111 may be a semiconductor substrate such as silicon or a compound semiconductor, an insulating substrate such as glass, quartz, polymer, or ceramic, or a conductive substrate such as metal, alloy, or conductive polymer. Alternatively, a substrate obtained by bonding these substrates may be used. Alternatively, a liquid film such as a polymer, rubber, or paste (insulating or conductive) or a gel film formed on the substrate or the like may be formed, and the recess may be formed using an imprint method. Further, in FIGS. 25A to 25C, the recess opens to the first surface (front surface) and does not penetrate the second surface (back surface), but may be a through groove penetrating the second surface. good. When the substrate 5111 is an insulator, the insulating film 5113 is not necessarily formed. However, when the adhesion between the conductor film 5114 and the substrate 5111 is not so good, an insulating film may be stacked. In the case of forming a pattern in the recess 5112, it is desirable that the photosensitive film 5115 be formed as faithfully as possible inside the recess 5112. For example, an electrodeposition resist film is formed. In addition, a method using a sheet-like dry film or a method using a photosensitive resist formed by a plasma polymerization method may be used. When a pattern is not formed in the recess 5112, a method of forming a resist by a normal coating method, a dip method, or the like may be used. Next, the photosensitive film 5115 is patterned by an exposure method (a photolithography method). For example, the bottom 5116 (5116-1, 2, 3) of the recess 5112 (5112-1, 2, 3) is opened. And / or the upper part 5117 (5117-1, 2, 3) of the substrate side wall 5111 (5111-1, 3, 3) between the recesses 5112 (5112-1, 2, 3) is opened. In some cases, the inner surface of the recess is opened. {FIG. 25 (a)}

Next, the conductor film 5114 is etched using the patterned photosensitive film 5115 as a mask. When etching the conductor film 5114 formed on the inner surface of the recess, wet etching or isotropic dry etching is preferable. Thereby, the conductor film 5114 is cut at the substrate side wall upper surface 5119 (5119-1, 2) and / or at the recess bottom 5118 (5118-1, 2, 3) and / or at the side surface of the recess (side surface of the substrate side wall). Is done. Further, necessary wiring is formed on the first surface of the substrate 5111. When the conductor film is a polycrystalline silicon film, a silicide film, or a transparent conductor film (ITO, ATO, ZnO, etc.), it can be etched by, for example, dry etching using a hydrofluoric acid-based etchant or a halogen-based gas. When the conductive film is a transparent conductive film (ITO, ATO, ZnO, etc.), it can be etched by, for example, dry etching using a hydrofluoric acid-based etchant or a halogen-based gas. When the conductor film is aluminum, it can be etched by, for example, dry etching using a phosphoric acid-based etchant or a halogen-based gas. For other materials, a good etching method may be selected as appropriate. By this etching, the conductor film 5114 is divided into 5114-1, 2, 3, 4, 5, 6 and the like. (However, necessary portions may be connected between them.) Next, an insulating film 5120 is stacked. This insulating film 5120 protects the conductor film 5114 and is also an insulating film that interposes the thin film and the conductor film 5114 to be attached thereafter. {FIG. 25 (b)}

Next, a thin plate 5121 is attached and the concave portion 5112 is covered. This bonding method includes a method using an adhesive and a room temperature bonding method. Pressure transmission holes 5122 (5122-1, 2, 3) are formed in the recesses 5112 (5112-1, 2, 3) of the thin plate 5121. It is also desirable to remove the thin plate 5121 in the region 5123 where the contact hole 5124 and the extraction electrode 5125 are to be formed. Further, the thin plate 5121 is removed from a portion where the other thin plate 5121 is unnecessary. Alternatively, a thin plate 5121 from which a portion unnecessary for the thin plate 5121 has been removed may be attached on the substrate 5111 in advance. Next, in order to form an extraction electrode from the conductor film 5114, a contact hole 5124 is formed in the insulating film 5120 by using a photolithography method and an etching method, and a conductor film is formed in the contact hole 5124 to form an extraction electrode 5125. To do. {FIG. 25 (c)} It is also possible to attach the thin plate after forming the extraction electrode or the like first.

FIG. 25 (d) shows a plan view of the pressure sensor shown in FIGS. 25 (a) to 25 (c). The concave portion 5112 (5112-1, 2, 3, 4) and the conductor film 5114 (5114-1, 2, 3, 4, 5, 6, 7, 8) are shown. The rectangular parallelepiped concave portions 5112 (5112-1, 2, 3, 4) are arranged in parallel, and the side walls 5111 (5111-1, 2, 3, 4) are arranged between the concave portions 5112 (5112-1, 2, 3, 4). 4) is formed. Also. A conductor film 5114 (51114-1, 2, 3, 4, 5, 6, 7, 8) is formed on the side surface of the side wall 5111 (5111-1, 2, 3, 4), including the inside of the recess. The conductor film 5114 (5114-1, 2, 3, 4, 5, 6, 7, 8) is separated. As can be seen from FIG. 25 (d), when the conductor film 5114 is formed on the inner surface of the recess and the recess space therebetween is a capacitance space (for example, the recess 5112-2), the conductor serving as one electrode The film 5114-3 is formed on the inner surface of the concave portion 5112-2 of the substrate side wall 5111-1, and the conductor film 5114-4 serving as the other electrode is formed on the inner side surface of the concave portion 5112-2 of the substrate side wall 51111-2. Between these electrodes, the conductor film is etched away on the bottom surface of the recess and on the side surface of the recess (in this case, the short side of the recess). As a result, a capacitive element can be formed in which the inside of the concave portion is a capacitive space and the substrate side wall sides 5114-3 and 4 on both sides are electrodes.

When resist patterning in the recess 5112 is difficult, all of the conductor film 5114 (conductor film in the recess 5112-2 including 5114-3 and 5114-4) in one recess (for example, 5112-2) is etched. Remove. Let the electrode formed in the recessed part (5112-1 or 5112-3) adjacent to this recessed part be an electrode of a capacitor | condenser. However, the capacity component at this time is the space capacity of the recess, and the substrate side walls 5111-1 and 51111-2 also form a capacity. Since the conductor film 5114 in the recesses 51112-1 and 5112-3 is left as it is, the conductor films 5114-1 and 5114-2 and the conductor films 5114-5 and 5114-6 are connected. In this way, resist patterning is not required in the recess 5112. Since the resist patterning is a flat portion on the first surface of the substrate 5111, the conductor film 5114 can be removed by a normal photolithography method and etching method. . As a result, the space in the concave portion 5112 (5112-1, 2, 3, 4) is defined as the capacitance, and the conductive films on both sides thereof are formed as electrodes 5114 (51114-1, 2, 3, 4, 5, 6, 7). , 8) The capacitor is completed. When the capacitances of these capacitors are C1, C2, C3, and C4, the capacitances of the capacitors can be increased or decreased by appropriately connecting these capacitors in parallel and / or in series.

FIG. 25 (f) is a diagram showing the operation and principle of the capacitive pressure sensor shown in FIGS. 25 (a) to 25 (d). The structure shown in FIG. 25F is slightly different from FIGS. 25A to 25C, but is essentially the same structure. In FIG. 25 (f), the recess 5112 (5112-1, 2, 3, 4) is a through groove penetrating from the first surface to the second surface in the substrate 5111. The method of forming the through groove 5112 (5112-1, 2, 3, 4) has been described. For example, a thin plate 5126 is attached to the second surface of the substrate 5111, and a through groove reaching the second surface is formed using a resist pattern or the like formed on the first surface of the substrate 5111 as a mask using vertical etching or imprinting. To do. Thereafter, the thin plate 5121 is attached to the first surface side with the thin plate 5126 attached. Thereafter, the thin plate 5126 may be replaced with another thin plate. Alternatively, for example, without attaching the thin plate 5126 to the second surface of the substrate 5111, the resist pattern or the like formed on the first surface of the substrate 5111 is used as a mask to reach the second surface using vertical etching or imprinting. A through groove is formed. Then, it can also be produced by attaching thin plates to the first surface side and the second surface side.

When the pressures P1, P2, P3, and P4 are introduced from the pressure transmission holes 5122 (5122-1, 2, 3, 4) into the recesses 5112 (5112-1, 2, 3, 4), the substrate side walls between these recesses 5111 (5111-1, 2, 3) is deformed by the pressure difference in the recess. For example, when P1 <P2, as shown in FIG. 25 (f), the substrate side wall 5111-1 swells toward the concave portion 5112-1. When P2> P3, as shown in FIG. 25 (f), the substrate side wall 51111-2 swells toward the concave portion 5112-3. When there is no pressure difference, the concave width (distance between electrodes) of the concave portion 5112-2 is d1, the deformation amount of the substrate side wall 5111-1 at P1 <P2, d2, and the deformation amount of the substrate side wall 511-2 at P2> P3. Let d3. d2 and d3 vary depending on the depth of the concave portion 5112 and become the largest near the center thereof. However, when d2 and d3 are considered as the average amount, the capacity C2 = εS / d1 when there is no pressure difference is affected by the pressure difference. C2 ′ = εS / (d1 + d2 + d3) (in this case, decrease). (Ε is dielectric constant, S is electrode area) If the thicknesses of the substrate side walls 5111-1 and 51111-2 are the same and P1 = P3, it may be considered that d2 = d3. If the relationship between the capacitance change and the pressure is obtained in advance, the pressure difference can be obtained from the change in the capacitance when the deformation is caused by an unknown pressure difference.

Looking at the recess 5112-3, when P2> P3, the substrate sidewall 51111-2 is recessed toward the recess 5112-3 (deformation amount d5), and when P4> P3, the substrate sidewall 5111-3 is recessed toward the recess 5112-3. (Deformation amount d6). If the recess width (distance between electrodes) of the recess 5112-3 when there is no pressure difference is d4, d5 and d6 differ depending on the depth of the recess 5112 and become the largest near the center, but d5 and d6 are Considering the average amount, the capacity C2 = εS / d4 when there is no pressure difference changes to C2 ′ = εS / (d4-d4-d5) (in this case, increases) in response to the pressure difference. (Ε is dielectric constant, S is electrode area) If the thicknesses of the substrate side walls 511-2 and 5111-3 are the same, and P2 = P4, it may be considered that d5 = d6. If the relationship between the capacitance change and the pressure is obtained in advance, the pressure difference can be obtained from the change in the capacitance when the deformation is caused by an unknown pressure difference.

In the embodiment shown in FIGS. 25A to 25C, the substrates 5111-4 and 5111-5 are hardly deformed, so that the capacitance changes of the recesses 5112-1 and 5112-4 are only on one side. It becomes a deformation. As described above, the recesses (or through grooves) of the present invention are manufactured, and the capacitance changes when the substrate side wall between these recesses is deformed by the pressure difference between the recesses. Can be sought. If a large number of these recesses are arranged and the electrodes in the recesses having the same pressure are connected in parallel, the overall capacity becomes the sum of the individual capacities, so even if the amount of change is small, the overall is large. Since the capacitance changes, the sensitivity can be increased. Further, if the width of the recess is made smaller than the limit amount of change of the substrate side wall, the substrate side wall will not be deformed beyond (half of) the width of the recess, so that toothing and damage of the substrate can be prevented. In addition, since the pressure transmission hole and the electrode can be produced also on the second surface side, it is easy to design (especially any of the cases shown in FIGS. 25A to 25C).

As described above, the capacitance type pressure sensor of the present invention can also be produced by the imprint method. However, if a polymer or rubber having a low Young's modulus is used, the capacitance changes greatly even if the size is small. It becomes possible to make it. As described above, a recess having a depth of 10 to 500 μm and a length and width of approximately 1000 μm or less is formed in the substrate, and various polymers and rubber are applied or dipped in the recess to fill the recess. A concave portion is formed in the liquid or gel state by an imprint method. Alternatively, the concave portions are formed by photolithography and etching after the polymer or rubber is cured. Next, when these polymers and rubbers are insulators, a conductor film is laminated. After patterning the conductor film, an insulating film is laminated, and these recesses are covered with a thin plate to form a lead electrode. When these polymers and rubbers are not insulators, the conductor film is laminated after forming the insulating film. After patterning the conductor film, an insulating film is laminated, and these recesses are covered with a thin plate to form a lead electrode. Thus, for example, the embedded pressure sensor can be formed in a semiconductor substrate such as a silicon substrate.

The conductor film of the pressure sensor can also be used as a conductor film used for a device such as an IC if the upper surface of the buried sidewall of the substrate is substantially equal to the height of the IC or various devices formed in the semiconductor substrate. In particular, the curing temperature of the polymer or rubber can be set lower than about 300 ° C. to 500 ° C., which is the final temperature of the semiconductor process (final protective film formation temperature). Can be mounted in a chip. In this case, after forming a final protective film such as an IC, a pressure sensor may be formed by forming a recess in the semiconductor substrate. What is necessary is just to carry out wiring connection to pads, such as IC, at the time of formation of the conductor film of a pressure sensor. Alternatively, if the curing temperature of the polymer or rubber is higher than the final temperature of the semiconductor process, a recess is formed in the semiconductor substrate before forming the final conductor film used in the semiconductor process, and the polymer or the like is inserted into the recess. After the depression for the pressure sensor is formed by the printing method or the photolithography method, the pressure sensor conductor film can be used as the final conductor film used in the semiconductor process. After patterning these conductor films, a final protective film (insulating film) may be formed, and the pressure sensor recess may be covered with a thin plate. Needless to say, the method described above can be applied to all the piezoelectric sensors of the present invention (including those described hereinafter).

FIGS. 26A and 26B are views showing an example of a pressure sensor package. FIG. 26 (a) is a plan view thereof, and FIG. 26 (b) is a side sectional view thereof. As shown in FIGS. 26 (a) and 26 (b), the outside of the pressure sensor (piezoelectric element) is , Substrate 5131 (5131-1). A recess (or through groove) 5132-2 surrounds the substrate side wall 5131-2 on the inner side. There is a recess (or through groove) 5131-1 on the innermost side. A conductor film 5133 (5133-1, 2, 3, 4) is laminated on the substrate side wall 5131-2 on the inner side surface of the recess 5131-1. Unnecessary films are not described in the explanation. The substrate side wall 5131-2 between the inner recess 513-1 and the outer recess 513-2 is deformed by a pressure difference between these recesses. In FIG. 26A, there are four substrate side walls, and each substrate side wall is deformed by being recessed inward or bulging outward in accordance with a pressure difference. In response to this deformation, in the case of a capacitive pressure sensor, a change in capacitance between these opposing electrodes (for example, 5133-1 and 5133-3, 5133-2 and 5133-4) is detected. Further, when a piezoelectric film is used on the substrate side wall, the film structure as described above is configured to detect the amount of charge drawn to the electrodes formed on both sides of the piezoelectric film. When the piezoelectric film formed on the side wall of the substrate is used, the film structure as described above is configured to detect the amount of charge drawn to the electrodes formed on both sides of the piezoelectric film. As shown in FIGS. 26 (c) and (d) (FIG. 26 (c) is a plan sectional view, FIG. 26 (d) is a side sectional view, and the film structure has already been described. In the case of a piezoelectric substrate or a piezoelectric film, the electrodes 5133-2 on the inner side surface of the recess 5132-1 may all be connected, so that the substrate side wall Piezoelectric films and electrodes can also be produced outside of 5131-2, and these electrodes 5133-1 can be connected. Since there is no need to pattern inside the recess, the process is also simple.

Since a piezoresistive pressure sensor in which a piezoresistive element is formed on the side surface of the substrate side wall to form a bridge circuit can also be fabricated on each surface of the substrate side wall and the front and back surfaces, the detection sensitivity is increased. The thickness of the outer wall 5131-1 of the mounting package shown in FIG. 26 is not deformed by the pressure used. Although FIG. 26 does not show the pressure transmission hole and the extraction electrode, they may be appropriately formed at a necessary place. Such a mounting package can be formed extremely small, can be applied to a semiconductor process, and the process is very simple. Therefore, a large number can be formed from one substrate. For example, a mounting package of 0.5 mm * 0.5 mm * 0.5 mm can be realized, and if it is a 6-inch wafer, about 65,000 can be formed, and an extremely cheap pressure sensor can be realized.

Although the sensor device of the present invention has been described as being fabricated on a substrate having a thickness of 2 mm or less, it can be readily understood from the structure that it can be applied to a thicker substrate. As a method of forming a vertical recess in a substrate having a thickness of 2 mm or more, there is a method of manufacturing by an imprint method. A thick resin can be applied and a recess can be produced by imprinting using a mold of an appropriate size. Alternatively, the through hole can be produced by punching the substrate with a punching die having an appropriate size. The conductor film on the inner surface of the recess or the through-hole is laminated with a desired thickness by a CVD method, a PVD method, a plating method, or the like. A piezoelectric film and an insulator film are also laminated by a CVD method, a PVD method, or the like. Other methods may be adopted as described above. The large sensor device can be used for floor power generation, for example.

FIG. 27 is a diagram showing an ink jet device using the vertical pressure operating element of the present invention. The substrate has a plurality of recesses penetrating from the first surface (front surface) to the second surface, the side surfaces being surrounded by the substrate side wall, the first thin plate is attached to the upper surface of the substrate side wall, and the lower surface of the substrate side wall A second thin plate is adhered to the upper portion of the concave portion, and the upper portion of the concave portion is covered with the first thin plate, and the lower portion of the concave portion is covered with the second thin plate. The upper portion is the first thin plate, the lower portion is the second thin plate, and the side wall is surrounded by the substrate side wall, and a part of the concave portion (ink reservoir concave portion) is partially outside. Ink is introduced into the concave portion from above the first thin plate through the through hole (ink introduction hole), and ink is usually contained in the ink reservoir concave portion. Further, a part of the second thin plate covering the lower part of the concave part penetrates the outside, and ink can be ejected from the concave part through the through hole (ink ejection hole). A recess (adjacent recess) adjacent to at least a part of the side wall constituting the side surface of the recess into which ink is introduced is a recess whose side surface is surrounded by the substrate side wall, and the upper portion of the adjacent recess is the first It is covered with a thin plate, and the lower part of the adjacent concave portion is covered with a second thin plate. A part of the thin plate covering the upper portion of the adjacent recess penetrates the outside, and the pressure of the adjacent recess can be increased or decreased through the through hole (pressure transmission hole). When the pressure in the adjacent concave portion is made lower than a certain pressure (for example, 1 atm) through the pressure transmission hole, the side wall of the substrate separating the adjacent concave portion and the ink reservoir concave portion swells toward the adjacent concave portion, and as a result, the ink introduction hole from the external ink liquid container Ink flows into the ink reservoir recess. When ink has accumulated in a certain amount of ink reservoir recess, if the pressure of the adjacent recess is made higher than a certain pressure (for example, 1 atm) through the pressure transmission hole opened in the thin plate covering the upper portion of the adjacent recess, the adjacent recess and the ink reservoir recess The side wall of the substrate separating the ink swells toward the ink reservoir recess, and the ink in the ink reservoir recess is ejected outside through the ink discharge hole.

As described above, the structure of the ink jet element using the substrate in which the concave portion of the present invention is formed is the same as that of the pressure sensor described so far. The outline of the manufacturing method will be described below. As shown in FIG. 27A, the second thin plate 2015 is attached to the second surface (back surface) of the substrate 2011. The substrate 2011 can be variously applied to a semiconductor substrate such as a silicon substrate, an insulating substrate such as a glass substrate or a plastic substrate, a conductor substrate such as iron, copper, an alloy, or a metal. (Alternatively, the imprint method may be used for a polymer or ceramic formed on the second thin plate.) The second thin plate 2015 is also a semiconductor substrate such as a silicon substrate, an insulating substrate such as a glass substrate or a plastic substrate, Various conductive substrates such as iron, copper, alloys and metals can be applied. The substrate 2011 and the second thin plate 2015 can be attached using an adhesive (including metal, low-melting glass, or the like), or can be attached using room temperature bonding, diffusion fusion, high temperature bonding, or anodic bonding. For example, the silicon substrate and the glass substrate can be firmly attached by anodic bonding with an electric field opened.

Thereafter, a thick resist pattern is formed on the first surface of the substrate 2011 by photolithography or imprinting. A resist pattern may be formed after an insulating film is formed over the substrate 2011. Since the substrate 2011 is etched thereafter, the thickness of the resist is set such that the pattern shape can be maintained without disappearing during the etching. By using this photoresist pattern, the substrate 2011 is anisotropically etched (dry etching). In order to form the concave portion of the substrate 2011 as faithfully as possible to the photoresist pattern, it is desirable to etch the concave portion as close as possible to the substrate surface (first surface) according to the pattern dimension. The substrate 2011 is etched until it penetrates the second surface. Since the second thin plate 2015 is attached to the second surface, the second thin plate is etched using the second thin plate as an etching stopper. For example, if the substrate 2011 is etched under an etching condition such that the etching rate of the second thin plate 2015 is slower than the etching rate of the substrate 2011, the second thin plate 2015 is excessively etched during overetching after the substrate 2011 is etched. Instead, a concave portion (in this case, better referred to as a through groove) through which the substrate 2011 passes can be formed in the concave portion of the entire substrate. Further, when the etching species (ion species generated by etching) are monitored and the concave portion 2017 of the substrate 2011 penetrates, the generation of specific etching species decreases. By using this as an end point, the amount of overetching can be reduced. it can.

Next, the resist and deposits generated in the recesses 2017 during etching (residues generated by etching, etc.) are removed, and the first thin plate 2013 is attached to the first surface. This adhesion can also be performed using an adhesive (including metal, low melting point glass, etc.), room temperature bonding, diffusion fusion, high temperature bonding, and anodic bonding. When the substrate 2011 is silicon and the first thin plate 2013 is glass (or vice versa), these substrates can be firmly attached to each other using anodic bonding. When an adhesive is used, the first surface of the substrate 2011 is faced down, the first surface is brought into contact with the adhesive liquid, and the adhesive is adhered only to the upper surface of the side wall between the recesses. Good to do. Or after apply | coating an adhesive agent to the adhesion surface side of a 1st thin plate, it is good to adhere the 1st surface of a board | substrate from the 1st thin plate 2013 below. Alternatively, there is a method in which an adhesive is applied only to a necessary portion of the first thin plate using a mask in screen printing.

Since the bottom surface of the concave portion 2017 is etched by etching, the second thin plate may be removed and replaced with another thin plate if there is a problem. In the case of replacement, for example, a thermoplastic (thermosoftening) adhesive may be used for adhesion between the second thin plate 2015 and the substrate 2011. When the glass transition temperature is Tg, the process is performed at a temperature equal to or lower than Tg until the second thin plate 2015 and the substrate 2011 are attached and then removed. In particular, the temperature at which the first thin plate 2013 is attached needs to be equal to or lower than this Tg. Furthermore, when the second thin plate 2015 and the substrate 2011 are separated from each other, the temperature needs to be equal to or higher than Tg. Therefore, it is necessary to prevent the adhesiveness between the first thin plate 2013 and the substrate 2011 from being deteriorated at this temperature. . Alternatively, a low melting point metal or a low melting point alloy may be used as the adhesive. However, the subsequent process must be performed at a temperature equal to or lower than the melting point or softening temperature Tm.

As described above, the substrate 2011 having a large number of recesses (penetrating grooves) penetrating from the first surface to the second surface was produced. The first thin plate 2013 is closed on the first surface side (upper part or front surface side) of the recessed portion that penetrates. The second thin plate 2015 is closed on the second surface side (lower part or back surface side) of the penetrating recess. The recess includes a recess 2017 (2017-2, 5) in which ink enters and a recess 2017 (pressure applying recess) (2017-1, 3, 5) for applying pressure. Substrate sidewalls 2011 (2011-2, 3, 5, 6) between the recesses (ink container recesses) 2017 (2017-2, 5) for containing ink and the recesses 2017 (2017-1, 3, 5) for applying pressure. ) Can be deformed by a change in pressure, and the thickness is such that the ink can be ejected to the outside from the recessed portion 2017 (2017-2, 5) containing the ink by the applied pressure.

Next, a pressure transmission hole and an ink introduction hole are formed in the first thin plate 2013. A resist pattern for forming the pressure transmission hole and the ink introduction hole is formed on the first thin plate 2013 by using a photolithography method or an imprint method. By using this resist pattern, the first thin plate 2013 is removed by etching to form pressure transmission holes 2019 (2019-1, 3, 4) and ink introduction holes 2019 (2019-2, 5). When the thickness of the first thin plate 2013 is thick, it may be thinned before resist patterning using a polishing method, a full surface wet etching method, or a full surface dry etching method. Alternatively, there is a method in which only high-speed etching (wet or dry) is first performed after resist patterning to thin only this region. Or since the width | variety of a recessed part can also be 10 micrometers or more, there are also the method of opening with a drill, the method of opening with a laser beam, or the method of opening with a high-pressure water flow.

In the case of opening with laser light, the laser is irradiated from above the first thin plate 2013. Since there is a possibility that the second thin plate 2015 on the lower side also has a hole, the first thin plate is used to prevent this. By changing the material of the thin plate 2013 and the second thin plate 2015, the first thin plate 2013 can be perforated by laser light, but the second thin plate 2015 cannot be perforated by the same laser light. You can do it. Alternatively, in the ink jet device of the present invention, the ink container recess 2019 (2019-2, 5) always has both the ink introduction hole and the ink discharge hole {2023 (2023-1, 2) on the second thin plate 2015 side}. Therefore, if laser irradiation is performed from the lower surface side of the second thin plate 2015, the holes of the first thin plate 2013 and the second thin plate 2015 can be formed simultaneously, and the number of processes (steps) is reduced. When high mask alignment accuracy is not required in the hole formation (the alignment error may be 1 to 3 μm), a mask made of metal or the like may be used when the hole is formed by laser light or high-pressure water flow. Further, if dry etching with strong anisotropy is used, an external mask such as a metal mask may be used without using the photolithography method or the imprint method, and the process becomes simple.

Next, ink discharge holes 2023 (2023-1, 202) for discharging ink are formed in the second thin plate 2015. This ink discharge hole is not opened in the pressure application recess 2017 (2017-1, 3, 4). The method for forming the ink discharge hole 2023 may be the same as the method for forming the ink introduction hole described above. After forming holes in the first thin plate 2013 and the second thin plate 2015, a means for smoothing the shape of the holes is taken if necessary. For example, when the first thin plate 2013 and the second thin plate 2015 are glass, light hydrofluoric acid treatment may be performed. Next, an ink passage tube or an ink reservoir container 2021 (2021-1, 2) is connected to the ink introduction hole 2019 (2019-2, 5), or the pressure transmission hole 2019 (2019-1, 3, 4) is connected. Necessary members are also connected to the pressure introduction pipes and the pressure discharge holes 2023 (2023-1 and 2023).

FIGS. 27B and 27C are plan views showing the inkjet device of the present invention. FIG. 27B is an example of this, and rectangular parallelepiped recesses 2017 (2017-1, 2, 3) are adjacently arranged in parallel. FIG. 27C is an example of this, and the pressure application recess 2017 (2017-1, 3) surrounds the square (or rectangular parallelepiped) ink container recess 2017-2 via the substrate side wall 2011-2. . In FIG. 27B, the width (thickness) of the side wall 2011-2 between the ink container recess 2017-2 and the pressure application recess 2017-1 is Wc (= y), the length is Lc (= a), and the depth. When the thickness (equal to the substrate thickness) is Hsub (= Hc = h), the substrate side wall 2011-2 may be considered as a diaphragm. When the substrate side wall is bent by the pressure difference z between the recesses on both sides, The maximum deflection of the side wall 2011-2 is approximately given by the following calculation formula.
Wmax = α * z * h ² a ² / (Ey ³ )

When the substrate 2011 is a silicon substrate, the Young's modulus E is 100 GPa to 200 GPa (with crystal orientation dependency). When h = a = 300 μm (square diaphragm), α = 0.0138, and Wmax is about 600 z / y ³ (μm). However, z is shown in Mpa units, and y is shown in μm units. For example, if z is 1 MPa (about 1 atm) and y is 5 μm, then Wmax = about 5 μm. If z is 1 Mpa (about 1 atm) and y is 3 μm, then Wmax = about 22 μm. When h = a = 400 μm (square diaphragm), Wmax is about 1890 z / y ³ (μm). For example, if z is 1 Mpa (about 1 atm) and y is 5 μm, Wmax = about 15 μm. If z is 1 MPa (about 1 atm) and y is 3 μm, then Wmax = about 70 μm. When h = 300 μm and a = 600 μm (rectangular diaphragm), α = 0.0277, and Wmax is about 1200 z / y ³ (μm). However, z is shown in Mpa units, and y is shown in μm units. For example, if z is 1 Mpa (about 1 atm) and y is 5 μm, Wmax = about 10 μm. If z is 1 MPa (about 1 atm) and y is 3 μm, then Wmax = about 45 μm. When the pressure difference is applied as described above, the ink container recess 2017-2 is recessed or swelled, so that ink can be sucked into the ink container recess 2017-2 and ink inside the ink container recess 2017-2 can be discharged to the outside. . Since the above formula is a theoretical formula, a precise inkjet device can be manufactured by taking into consideration the formula and the like, taking data with the completed formula, and bringing the actual value close to the theoretical formula.

Although the above-described deflection is when the substrate is silicon, a highly accurate inkjet device can be manufactured by variously changing this material. For example, since the Young's modulus of polycarbonate is 2.2 GPa, when the diaphragm has a square shape of 300 μm * 300 μm, Wmax≈5 × 10 ⁴ * (z / y ³ ). Therefore, when the substrate side wall thickness is 10 μm, the pressure difference is 1 It is a large deformation of about 50 μm at atmospheric pressure. Further, in the case of rubber, the Young's modulus is 0.01 to 0.1 GPa. For example, when 0.022 GPa, when the diaphragm has a square shape of 300 μm * 300 μm, Wmax≈5 × 10 ⁶ * (z / y ³ ) Therefore, if the thickness of the substrate side wall is 30 μm, a large deformation of about 20 μm occurs even at a pressure difference of 0.1 atm.

As described above, in the case of rubber, plastic, or the like, the Young's modulus is much smaller than that of silicon or the like, so that a highly accurate inkjet device can be manufactured without manufacturing a very fine device. Moreover, in the case of rubber, plastic, etc., a minute and highly accurate size can be produced by using the imprint method. The method for producing the ink jet device of the present invention using the imprint method is the same as that described in FIG. In the inkjet device of the present invention, the substrate 611 corresponds to the second thin plate 2015. The insulating film 633 is not necessarily formed. After the recess is formed by the imprint method, a film remains at the bottom of the recess (615B in FIG. 19). Therefore, in order to penetrate the recess to the substrate (second thin plate) side, the remaining film is removed by etching. If necessary, the second thin plate and the first thin plate are thinned to a desired thickness by a polishing method, an etching method, or the like. Furthermore, the ink jet device of the present invention does not need to form an insulating film after forming a recess (through recess) (although it may be formed as a protective film), and does not form a conductor film. Therefore, elastic rubber can also be used. Examples of rubber include various rubbers (natural rubber and synthetic rubber), such as silicone rubber, fluorine rubber, nitrile rubber, butyl rubber, styrene rubber, butadiene rubber, synthetic natural rubber, isoprene rubber, chloroprene rubber, polysulfide rubber, urethane rubber. Natural rubber, acrylic rubber, and ethylene propylene rubber can be used.

In the case of the structure shown in FIG. 27B, the ink container recess 2017 receives pressure (from two directions) from the pressure application recesses 2017-1 and 2017-3 on both sides of the substrate side walls 2011-2 and 2011-3. Ink is discharged into or discharged from the ink container recess 2017. On the other hand, in the case of the structure shown in FIG. 27 (c), the ink container recess 2017 is surrounded by four directions of pressure application recesses 2017-1 and 2017-3 across the substrate side walls 2011-2 and 2011-3. Therefore, ink is sucked into and discharged from the ink container recess 2017 under pressure from four directions. If the depth Hsub, the length Lc, and the substrate side wall width Wc of the recess 2017 are the same in FIGS. 27B and 102B, the ink container recess shown in FIG. Ink can be sucked and discharged with about twice the force of the ink container recess shown in b). In other words, if the suction amount and the discharge amount are the same, the ink container recess shown in FIG. 27C has a smaller force (pressure difference) than the ink container recess shown in FIG. Can be done. Further, as an embodiment similar to FIG. 27C, when the shape of the ink container recess 2017-2 is cylindrical, the force is equally received from the pressure application recess 2017 surrounding the periphery, so that the force due to the pressure difference Ink can be evenly distributed and efficiently discharged and discharged.

FIGS. 28A and 28B are diagrams showing an operation method of the inkjet device of the present invention. The ink reservoir container 2021 (2021-1, 2) is connected to the ink container recess 2017 (2017-2, 5) through the ink introduction hole 2019 (2019-2, 5) (which may be through an ink passage tube here). Further, the ink is discharged to the outside through the ink discharge holes 2023 (2023-1 and 2023). The pressure may be air or other gas (such as nitrogen) or liquid via a pressure conduit or the like with a pressure generator (not shown, for example, a high pressure gas container, gas compressor, liquid compressor, etc.) The generated pressures P1, P2, and P3 are transmitted to the pressure application recess 2017 (1, 3, 4) through the pressure transmission hole 2019 (2019-1, 3, 4). When the pressure in the ink container recess 2017 is Pq, if Pq> P1, the substrate side wall 2011-2 between the ink container recess 2017-2 and the pressure application recess 2017-1 moves toward the pressure application recess 2017-1. Deformation (bulging) {FIG. 28 (a)}, if Pq <P1, the substrate side wall 2011-2 is deformed toward the ink container recess 2017-2 (swells, that is, the ink container recess 2017-2 is dented). FIG. 28 (b)}.

Accordingly, when Pq> P1, ink is sucked from the ink reservoir container 2021-1 into the ink container recess 2017. Thereafter, when Pq <P1, the ink in the ink container recess 2017-2 is discharged to the outside through the ink discharge hole 2023-1 and the inkjet droplet 2025 (2025-1). The ink introduction hole 2019-2 or the ink passage pipe is provided with an opening / closing valve. When the ink is introduced into the ink container recess 2017-2, the opening / closing valve is opened so that the ink in the ink container recess 2017-2 is moved outward. When the ink is discharged, the opening / closing valve may be closed, and in this way, ink can be put into and out of the ink container recess 2017-2 efficiently. In addition, when the ink discharge hole 2023-1 or the ink discharge pipe (not shown, a discharge passage leading to the outside from the ink discharge hole 2023) is provided with an open / close valve, the ink is introduced into the ink container recess 2017-2. It is also possible to close the open / close valve and open the open / close valve when the ink in the ink container recess 2017-2 is discharged to the outside. In this way, the ink in and out of the ink container recess 2017-2 can be opened and closed. It can be performed efficiently.

When the concave portion 2017-3 is a space separate from the concave portion 2017-1 (for example, as shown in FIG. 27B), the pressure P2 of the pressure applying concave portion 2017-3 is the pressure P1 of the pressure applying concave portion 2017-1. Therefore, the amount of ink flowing into and out of the ink container recess 2017-2 can be controlled. Further, the ink flow into and out of another ink container recess 2017-5 can also be controlled separately from the other pressures P1 and P2 by controlling the pressure P3 of the pressure application recess 2017-4. In the case where the pressure is controlled separately, for example, even if the pressure fluctuates by increasing the width of the substrate side wall 2011-4 between the pressure application recess 2017-3 and the pressure application recess 2017-4, it does not deform much. By doing so, P2 and P3 can be controlled without being affected by each other. In the case of FIGS. 28A and 28B, since the pressure of P3 is the same as the pressure in the ink container recess 2017-5, the substrate side wall 2011-5 between these recesses is not deformed. At this time, if an open / close valve provided in the passage leading to the ink introduction hole 2019-5 or the ink discharge hole 2023-2 is interlocked (closed at this time), the ink is not discharged to the outside. That can be done reliably.

When color printing is performed, it is necessary to mix inks to create various colors. By applying the present invention, for example, an ink container recess containing three primary colors (red, blue, yellow) and black ink. 2017 (2017-11, 12, 13, 14) can be arranged as shown in FIG. An ink jet apparatus is manufactured by arranging an appropriate number of these arrays. One array shown in FIG. 28C can be considered as 1 dot. By controlling the pressure of the pressure application recess 2017 (2017-15, 16, 17, 18) outside the ink container recess 2017 (2017-11, 12, 13, 14), each ink container recess 2017 (2017-11, 2017, Various inks are ejected from 12, 13, 14). The ink suction and discharge valves and pressure are controlled to discharge various color inks corresponding to the colors to form colors. When the size of the ink container recess 2017 is Lc1 * Lc2, the size of the pressure application recess 2017 is Lc3 * Lc2, and the distance between the recesses is Wc, the size of 1 dot is {2 (Lc1 + Lc3) + 4Wc} * {2Lc2 + 2Wc}. When Lc1 = 10 μm, Lc2 = 20 μm, Lc3 = 10 μm, and Wc = 5 μm, the size of 1 dot is 60 μm * 50 μm. Therefore, the resolution is 423 dpi * 508 dpi, which is a considerably good printing resolution. If only black, the size of 1 dot is (Lc1 + Lc3 + 2 Wc) * (Lc2 + Wc). In the case of the above value, the size of 1 dot is 30 μm * 25 μm, so the resolution is 846 * 1016 dpi. Very good print resolution. Since the ink jet device of the present invention can be further miniaturized, it is possible to realize even better resolution.

FIG. 29A is a view showing an ink jet device using a diaphragm type actuator. Here, the substrate 2011 is a piezoelectric body. The piezoelectric substrate is a substrate of a substance exhibiting a piezoelectric effect, and is also called, for example, lead zirconate titanate (zirconate / lead titanate (Pb (Zr _X Ti _1-X ) O ₃ 0 <x <1)). , So-called PZT), barium titanate, lead titanate, potassium niobate, lithium niobate, lithium tantalate, sodium tungstate, zinc oxide, lithium tetraborate and other ceramics having a perovskite structure and a tungsten-bronze structure, Or quartz, quartz, Rochelle salt, topaz, tourmaline, berlinite (aluminum phosphate), aluminum nitride, gallium phosphate, gallium arsenide, etc., or a piezoelectric polymer {eg, polyvinylidene fluoride (PVDF)} Etc. The method for forming the recesses 2017 (2017-1, 2, 3, 4, 5) from these substrates is the same as the method described so far.

After forming the recesses 2017 (2017-1, 2, 3, 4, 5) in the piezoelectric substrate 2011, a conductor film 2031 is laminated. The conductor film 2031 generates an electric field on the surface of each substrate side wall to generate a substrate side wall (particularly, the substrate side wall 2011-2 between the ink container recess 2017-2 and the pressure application recess 2017-1, the ink container recess 2017). -2 and the substrate side wall 2011-3 between the pressure application recess 2017-3 and the substrate side wall 2011-5 between the ink container recess 2017-5 and the pressure application recess 2017-4). . Next, the conductor film 2031 is etched on the upper surface of the substrate side wall 2011 (2011-1, 2, 3, 4, 5, 6) by using a photolithography method, an imprint method, an etching method, or the like, and is about to be deformed. The conductor films in the recesses (particularly the ink container recess and the pressure application recess) present on both sides of the substrate side wall are not connected. That is, the conductor film 2031 is cut by 2032 (2032-1, 2, 3, 4, 5, 6). Next, an insulating film 2034 is stacked to protect the conductor film 2031. Naturally, the insulating film 2034 is also laminated on the portion 2032 (2032-1, 2, 3, 4, 5, 6) where the conductor film 2031 is cut.

Next, a first thin plate 2013 or the like is attached on the piezoelectric substrate 2011, and pressure transmission holes 2019 (2019-1, 3, 4) and ink introduction holes 2019 (2019-2, 5) are opened. Next, the ink discharge holes 2023 (2023-1, 2023-2) are opened in the second thin plate 2015, and the ink reservoirs 2021 (2021-1, 2) are connected to the ink introduction holes 2019 (2019-2, 5). To do. Here, when the ink discharge hole 2023 (2023-1, 2023-2) is opened, the conductor film 2031 is exposed on the bottom surface of the ink container recess. {For example, 2033 (2033-1, 2)} When the conductor film 2031 comes into contact with the ink and corrodes or reacts to cause a problem, the ink is further removed when the electric field is changed over the conductor film 2031. In the case of causing a problem by contact, an insulating film 2033 may be laminated on this portion after opening the ink discharge hole 2023 (2023-1, 2023-2). If a CVD method or a PVD method is used, an insulating film can be stacked on the exposed conductor film 2031. After laminating the conductor film 2031 or patterning the conductor film 2031, ink discharge holes 2023 (2021-1, 2023-2) are opened in the second thin plate 2015, and then the insulating film 2034 is laminated. Since the insulating film 2033 can also be used, the number of processes is not increased. Alternatively, a portion of the conductor film where the ink discharge hole 2023 (2023-1, 2023-2) is opened when patterning the conductor film 2031 is removed, and the ink discharge hole 2023 (2023-1, 2023-2) is removed. It is sufficient that the conductor film is not exposed even if the gap is opened. Alternatively, after the through groove 2017 is formed and before the conductor film 2031 is formed, if the conductor film is laminated with the second thin plate 2015 removed, the conductor film is not laminated on the second thin plate 2015. . After that, the second thin plate 2015 may be attached to open the ink discharge holes 2023 (2023-1, 2023-2). Alternatively, a second thin plate having an ink discharge hole 2023 (2023-1, 2023-2) may be attached in advance, and the conductor film 2031 is also applied to the ink discharge hole 2023 (2023-1, 2023-2). However, no problem occurs because the insulating film 2034 is covered.

Next, or when a pressure transmission hole or an ink introduction hole is formed in the first thin plate 2013, the electrode 2031 (2031-1, 2, 3, 4, 5, 6, 7) of the conductor film 2031 is pulled out. The first thin plate 2013 in the region where the electrode / wiring is to be formed is removed, and then a contact hole is formed in the insulating film 2034 to expose the conductor film 2031 and the lead electrode is taken out from this portion. For example, a conductor film is newly formed in the contact hole to form an electrode / wiring, or wire bonding is performed on this portion to form a lead electrode / wiring.

If the electrodes are formed on both sides of the piezoelectric substrate side walls 2011-2, 3, 5, etc. in this way, the substrate side walls 2011-2, 3, 5 etc. are deformed when an electric field is applied to the electrodes on both sides. Depending on the orientation of the electrode (depending on the polarity of the electrode), the ink container recesses swell or dent. For example, an electric field is applied between the electrodes 2031-2 and 2-31-3 to swell the ink container recess 2017-2, and from the ink reservoir container 2021-1 to the ink container recess 2017-2 through the ink introduction hole 2019-2. Inhale ink. At this time, since the pressure application recess 2017-1 is recessed, the gas in the pressure application recess 2017-1 goes out through the pressure transmission hole 2019-1. Next, the ink container recess 2017-2 is recessed by applying a reverse electric field to the electrodes on both sides, and the ink in the ink container recess 2017-2 is discharged to the outside through the ink discharge hole 2023-1. At this time, since the pressure application recess 2017-1 is recessed, gas enters from the outside into the pressure application recess 2017-1 through the pressure transmission hole 2019-1. Furthermore, if an open / close valve is provided in the ink passage connected to the ink introduction hole 2019-2 and the ink discharge hole 2023-1 and interlocked with the electric field application to the conductor film electrode, the ink can be sucked and discharged more accurately. be able to.

In FIG. 29B, the piezoelectric film 2039 is formed in the shape of the substrate side wall 2011 (2011-1, 2, 3, 4, 5, 6), and the conductive film 2031 and the conductive film 2035 formed above and below the piezoelectric film 2039 are formed. As the electrodes, an electric field is applied to these electrodes to deform the piezoelectric film 2039, so that the substrate side walls (particularly, the substrate side walls 2011-2 and 2011-3 on both sides of the ink container recess 2017-2 and the ink container recess 2017-5 are formed. By deforming the substrate side wall 2011-5 together, the ink is sucked into the ink container recess 2017-2 or 2017-5, and the ink is discharged from the ink container recess 2017-2 or 2017-5. The structure and the manufacturing method are the same as those shown in FIG. 27 to FIG. 29A, and are different in that no ink is used or no pressure is applied. Also, the operation is reversed, and the operation is different in that the substrate side walls are moved by applying a potential to the conductive films 2031 and 2035 above and below the piezoelectric film 2039.

A pressure application recess 2017 (2017-1, 3, 4) and an ink container recess 2017 (2017-2, 5) are formed in the substrate 2011 to which the second thin plate 2015 is attached, and the substrate side wall 2011 ( 2011-1, 2, 3, 4, 5, 6). Next, the conductor film 2031 is formed, and the conductor film 2031 which does not have the same polarity is cut at 2032 (2032-1, 2, 3, 4, 5, 6) on the upper surface of the substrate side wall. Wiring necessary for the conductor film 2031 is formed also in other places. Next, the piezoelectric film 2039 is formed, and further the conductive film 2035 is formed. The conductive film 2031 which does not have the same polarity is formed on the upper surface 2037 (2037-1, 2, 3, 4, 5, 6) of the substrate side wall. Disconnect with. Wiring necessary for the conductor film 2035 is formed also in other places. Next, an insulating film 2036 for protecting the conductor film 2035 is formed. Thereafter, the first thin plate 2013 is attached on the substrate 2011, and drawn out from the pressure introduction holes 2019 (2019-1, 3, 4), the ink introduction holes 2019 (2019-2, 5), and the conductor films 2031 and 2035. The first thin plate 2013 is removed by etching in a region where an electrode is formed. The ink discharge holes 2023 (2023-1 and 2023) are also formed on the second thin plate. Since the conductor films 2031 and 2035 are exposed when the ink discharge holes 2023 are formed, insulating films 2033 (2033-1, 2) and 2038 (2038-1, 2) that cover the exposed portions are formed. However, if the second thin plate ink discharge hole 2023 (2023-1, 2023) is formed after the conductor 2035 is patterned, and then the insulating film 2036 is formed, the conductor films 2031 and 2035 are exposed. Therefore, it is not necessary to form new insulating films 2033 and 2038. Thereafter, necessary members such as an ink reservoir are formed or connected.

In the inkjet device shown in FIG. 29B, the conductor film 2031 (lower electrode), the piezoelectric film 2039, and the conductor film 2035 (upper electrode) formed on both sides of the substrate side walls 2011-2, 2011-3, and 2011-5. ), The piezoelectric film 2035 is deformed when an electric field is applied between the upper electrode and the lower electrode. In response to this deformation, the substrate side wall is deformed, and the ink container recesses 2017-2 and 2017-5 are expanded or recessed, so that the ink is sucked into the ink container recesses 2017-2 and 2017-5. Ink in the ink container recesses 2017-2 and 2017-5 is discharged to the outside. Open / close valves are attached to the ink passages connected to the ink introduction holes 2019-2 and 2019-5 and the ink discharge holes 2023-1 and 2023-2 connected to the ink container recesses 2017-2 and 2017-5. If the voltage application to the upper and lower electrodes is linked, ink can be put in and out more accurately. Although the above has been described with respect to ink, it can also be applied to various liquids containing ink. Therefore, these ink jet devices are also liquid ejection devices. Furthermore, since it can be applied not only to a liquid but also to a gas, it can be said to be a gas ejection device, or a medium ejection device that collectively includes a liquid and a gas.

As can be seen from the description of the ink jet device described above, the recess or the through groove of the present invention can produce a pump device. FIG. 30A is a diagram showing an example of the pump device. Through grooves (or through recesses) 2042 (2042-1, 2, 3, 4) penetrating from the first surface to the second surface are formed in the piezoelectric substrate 2041, and these through grooves 2042 (2042-1, 204-1, 2) are formed. 3, 4), substrate side walls 2041 (2041-2, 3, 4) are formed. In FIG. 30A, the substrate sidewall facing the substrate sidewall 2041-2 in the through groove 2042-1 is designated as 2041-1, and the substrate sidewall facing the substrate sidewall 2041-4 in the through groove 2042-4 is designated as 2041-5. To do. A conductor film 2043 (2043-1, 2, 3,..., 8) is laminated on the inner side surface of the through groove 2042 (2042-1, 2, 3, 4), that is, the side surface of the substrate side wall, and further thereon. An insulating film 2044 (2044-1, 2, 3,..., 8) is laminated. A first thin plate 2047 is attached to the first surface (upper surface or surface) of the piezoelectric substrate 2041. A second thin plate 2048 is attached to the second surface (lower surface or back surface) of the piezoelectric substrate 2041. A passage 2046 (2046-1) that communicates with the outside (or another through groove) (not shown) is formed inside the first thin plate and is connected to the through groove 2042 (2042-1). Further, a passage 2046 (2046-2) is formed in the first thin plate so as to communicate from the through groove 2042 (2042-2) to the through groove 2042 (2042-3). Furthermore, a passage 2046 (2046-3) is formed in the first thin plate from the through groove 2042 (2042-4) to the outside (not shown) (or another through groove). These passages 2046 (2046-1, 2, 3) may be provided with opening / closing valves 2049 (2049-1, 3, 5).

Inside the second thin plate 2048, a passage 2045 (2045-1) that leads from the through groove 2042 (2042-1) to the through groove 2042 (2042-2) is formed. Furthermore, a passage 2045 (2045-2) that leads from the through groove 2042 (2042-3) to the through groove 2042 (2042-4) is formed inside the second thin plate 2048. An opening / closing valve 2049 (2049-2, 4) may be provided in these passages 2045 (2045-1, 2). The conductor films 2043 (2043-1, 2, 3,..., 8) formed on the side surface of the substrate side wall 2041 are respectively provided with lead-out wirings / electrodes so that a voltage can be applied individually. ing. When a voltage is applied to these conductor films 2043 (2043-1, 2, 3,..., 8), the piezoelectric substrate side wall 2041 (2041-1, 2, 3, 4, 5) Can be deformed outward. Accordingly, when the direction in which the piezoelectric substrate side wall 2041 (2041-1, 2, 3, 4, 5) is moved coincides with the magnitude and polarity (plus or minus) of voltage application, the lead wiring / electrode is connected. be able to. Usually, since the conductor films in the same through groove have the same size and the same polarity, the operation of one through groove is performed by alternately switching between positive and negative voltages (ie, alternating current application). When applied to the conductor film, the substrate side wall dents or swells inside the through groove.

First, when the on-off valve 2049 (2049-2) is closed, the on-off valve 2049 (2049-1) is opened, voltage is applied to the conductor films 2043-1 and 2043-2, and the through groove 2042-1 is expanded. The liquid or gas can be sucked into the through groove 2042-1 from the outside (or another through groove) through the passage 2046-1. Next, the opening / closing valve 2049 (2049-2) is opened, the opening / closing valve 2049 (2049-3) is closed, and a voltage is applied to the conductor films 2043-3 and 2043-4 to expand the through groove 2042-2. The On the other hand, a voltage is applied to the conductor films 2043-1 and 2043-2 to dent the through groove 2042-1. At this time, there is no problem because the movement of the substrate side wall 2041-2 matches. As a result, the gas or liquid contained in the through groove 2042-1 enters the through groove 2042-2 through the passage 2045-1. Next, the opening / closing valve 2049-2 is closed, the opening / closing valve 2049-3 is opened, the opening / closing valve 2049-4 is closed, and a voltage is applied to the conductor films 2043-3 and 2043-4. Then, a voltage is applied to the conductor films 2043-5 and 2043-6 to expand the through groove 2042-3. As a result, the gas or liquid that has entered the through groove 2042-2 is guided to the through groove 2042-3. There is no problem because the movement of the substrate side wall 2041-3 is in the same direction by applying a voltage to these conductor films.

Next, the on-off valve 2049-3 is closed, the on-off valve 2049-4 is opened, the on-off valve 2049-5 is closed, and a voltage is applied to the conductor films 2043-5 and 2043-6, so that the through groove 2042-3 And a voltage is applied to the conductor films 2043-7 and 2043-8 to expand the through grooves 2042-5. As a result, the gas or liquid that has entered the through groove 2042-3 is guided to the through groove 2042-4. There is no problem because the movement of the substrate side wall 2041-4 is in the same direction by applying a voltage to these conductor films. Next, when the opening / closing valve 2049-4 is closed, the opening / closing valve 2049-5 is opened, and a voltage is applied to the conductor films 2043-7 and 2043-8 to recess the through-groove 2042-4, the through-groove 2042 is opened. The gas or liquid contained in -4 goes out to the outside (or another through groove) through the passage 2046-3.

In this way, adjacent through grooves are connected by a passage, an open / close valve is provided between them, a voltage is applied to the electrode on the side wall of the substrate side wall, and the open / close valve is operated so as to interlock with the through groove. Since the liquid and gas inside can be moved, a very small pump can be made. Even if an open / close valve is not provided, the operation of adjacent through grooves can be reversed only by applying a voltage to the side electrode on the side wall of the substrate (that is, if one is recessed, the other can be inflated). (And vice versa), the liquid or gas can be continuously moved in one direction. As for the passage in the thin plate, a thin plate on which the passage has been prepared in advance may be attached to the substrate. The passage in the thin plate can be opened with a laser, or the passage can be formed on the surface of one thin plate (A thin plate) and the other thin plate (B thin plate) can be bonded together. Or if a laser beam is used, a desired channel | path can also be formed in a thin plate. The on-off valve may be disposed on the A thin plate and then the B thin plate may be attached thereto, or electrically controlled by wiring into the thin plate. The open / close valve may be formed of a piezoelectric element.

FIG. 30B is a diagram showing another embodiment of the pump device. Components having the same functions as those in FIG. 30 (a) are given the same reference numerals, and when they are difficult to see in the figure, the reference numerals are omitted, so please also refer to FIG. 30 (a). Through grooves (or through recesses) 2042 (2042-1, 2, 3, 4, 5, 6, 7) penetrating from the first surface to the second surface are formed in the piezoelectric substrate 2041, and these through grooves 2042 are formed. Substrate sidewalls 2041 (2041-6, 7, 8, 9, 10, 11) are formed between (2042-1, 2, 3, 4, 5, 6, 7). In FIG. 30B, the substrate side wall facing the substrate side wall 2041-6 in the through groove 2042-1 is designated 2041-1, and the substrate side wall facing the substrate side wall 2041-1 in the through groove 2042-4 is designated 2041-5. To do. A conductor film 2043 (2043-9, 10, 11,..., 21) is formed on the inner side surface of the through groove 2042 (2042-1, 2, 3, 4, 5, 6, 7), that is, the side surface of the substrate side wall. In addition, an insulating film 2044 is further stacked thereon (this insulating film is omitted in FIG. 30B). A first thin plate 2047 is attached to the first surface (upper surface or surface) of the piezoelectric substrate 2041. A second thin plate 2048 is attached to the second surface (lower surface or back surface) of the piezoelectric substrate 2041. A passage 2046 (2046-1) that communicates with the outside (or another through groove) (not shown) is formed inside the first thin plate and is connected to the through groove 2042 (2042-1). Further, a passage 2046 (2046-2) is formed in the first thin plate so as to communicate from the through groove 2042 (2042-2) to the through groove 2042 (2042-3). Furthermore, a passage 2046 (2046-3) is formed in the first thin plate from the through groove 2042 (2042-4) to the outside (not shown) (or another through groove). These passages 2046 (2046-1, 2, 3) may be provided with opening / closing valves 2049 (2049-1, 3, 5).

Inside the second thin plate 2048, a passage 2045 (2045-1) that leads from the through groove 2042 (2042-1) to the through groove 2042 (2042-2) is formed. Furthermore, a passage 2045 (2045-2) that leads from the through groove 2042 (2042-3) to the through groove 2042 (2042-4) is formed inside the second thin plate 2048. An opening / closing valve 2049 (2049-2, 4) may be provided in these passages 2045 (2045-1, 2). The conductor films 2043 (2043-9, 10, 11,..., 21) formed on the side surface of the substrate side wall 2041 are respectively provided with lead-out wirings / electrodes so that voltages can be individually applied. ing. When a voltage is applied to these conductor films 2043 (2043-9, 10, 11,..., 21), the piezoelectric substrate side wall 2041 (2041-1, 5, 6, 7, 8, 9, 10, 11) Can be deformed inside or outside the through groove. Therefore, when the direction in which the piezoelectric substrate side wall 2041 (2041-1, 5, 6, 7, 8, 9, 10, 11) is moved coincides with the magnitude and polarity (plus or minus) and timing of voltage application. Lead wires and electrodes can be connected. Usually, since the conductor films in the same through groove have the same size and the same polarity, the operation of one through groove is performed by alternately switching between positive and negative voltages (ie, alternating current application). When applied to the conductor film, the substrate side wall dents or swells inside the through groove.

First, the on-off valve 2049 (2049-2) is closed, the on-off valve 2049 (2049-1) is opened, and a voltage is applied to the conductor films 2043-1 and 2043-10, 11 to inflate the through groove 2042-1. Then, the medium (liquid or gas) can be sucked into the through groove 2042-1 from the outside (or another through groove) through the passage 2046-1. At this time, the through groove 2042-5 between the through grooves 2042-1 and 2042-2 fluctuates in volume, but the variation is communicated with outside air 2040 (2040) opened in the first thin plate 2047. -1), since there is no pressure fluctuation in the through groove 2042-5, the above change of the piezoelectric substrate side wall 2041 (2041-6) is not affected. Accordingly, the piezoelectric substrate side wall 2041 (2041-6) is deformed substantially in accordance with the voltage applied to the conductor film on the piezoelectric substrate side wall 2041 (2041-6).

Next, the on-off valve 2049 (2049-2) is opened, the on-off valve 2049 (2049-1, 3) is closed, and a voltage is applied to the conductor films 2043-12, 13 and 2043-14, 15 to penetrate. Groove 2042-2 is inflated. On the other hand, a voltage is applied to the conductor films 2043-1 and 2043-10, 11 to dent the through groove 2042-1. At this time, the through groove 2042-5 between the through grooves 2042-1 and 2042-2 fluctuates in volume, but the variation is communicated with outside air 2040 (2040) opened in the first thin plate 2047. -1), since there is no pressure fluctuation in the through groove 2042-5, the above change of the piezoelectric substrate side wall 2041 (2041-6, 7) is not affected. Accordingly, the piezoelectric substrate side wall 2041 (2041-6, 7) is deformed substantially in accordance with the voltage applied to the conductor film on the piezoelectric substrate side wall 2041 (2041-6, 7). Further, although the volume of the through groove 2042-6 between the through grooves 2042-2 and 2042-3 fluctuates, the amount of the fluctuation is a communication hole 2040 (2040-) with outside air opened in the second thin plate 2048. 2) Since it goes in and out through, there is no pressure fluctuation in the through groove 2042-6, so the above change of the piezoelectric substrate side wall 2041 (2041-8) is not affected. Therefore, the piezoelectric substrate side wall 2041 (2041-8) is deformed substantially in accordance with the voltage applied to the conductor film on the piezoelectric substrate side wall 2041 (2041-8). As a result, the gas or liquid contained in the through groove 2042-1 enters the through groove 2042-2 through the passage 2045-1.

Next, the on-off valve 2049-2 is closed, the on-off valve 2049-3 is opened, the on-off valve 2049-4 is closed, and a voltage is applied to the conductor films 2043-12, 13 and 2043-14, 15 to penetrate. The groove 2042-2 is recessed, and a voltage is applied to the conductor films 2043-16, 17 and 2043-18, 19 to expand the through groove 2042-3. At this time, the through groove 2042-5 between the through grooves 2042-1 and 2042-2 fluctuates in volume, but the amount of the fluctuation is a communication hole 2040 (2040) with outside air opened in the first thin plate 2047. -1), since there is no pressure fluctuation in the through groove 2042-5, the change in the piezoelectric substrate side wall 2041 (2041-7) is not affected. Accordingly, the piezoelectric substrate side wall 2041 (2041-7) is deformed substantially in accordance with the voltage applied to the conductor film on the piezoelectric substrate side wall 2041 (2041-7). Further, although the volume of the through groove 2042-6 between the through grooves 2042-2 and 2042-3 fluctuates, the amount of the fluctuation is a communication hole 2040 (2040-) with outside air opened in the second thin plate 2048. 2) Since it goes in and out through, there is no pressure fluctuation of the through groove 2042-6, so it does not affect the change of the piezoelectric substrate side wall 2041 (2041-8, 9). Therefore, the piezoelectric substrate side wall 2041 (2041-8, 9) is deformed substantially in accordance with the voltage applied to the conductor film on the piezoelectric substrate side wall 2041 (2041-8, 9). Further, the through-groove 2042-7 between the through-grooves 2042-3 and 2042-4 varies in volume, but the variation is in communication holes 2040 (2040-3 with the outside air opened in the first thin plate 2047). ), The pressure in the through groove 2042-7 does not change, and the change in the piezoelectric substrate side wall 2041 (2041-10) is not affected. Accordingly, the piezoelectric substrate side wall 2041 (2041-10) is deformed substantially in accordance with the voltage applied to the conductor film on the piezoelectric substrate side wall 2041 (2041-10). As a result, the gas or liquid that has entered the through groove 2042-2 is guided to the through groove 2042-3.

Next, the on-off valve 2049-3 is closed, the on-off valve 2049-4 is opened, the on-off valve 2049-5 is closed, and a voltage is applied to the conductor films 2043-16, 17 and 2043-18, 19 to penetrate. The groove 2042-3 is depressed, and a voltage is further applied to the conductor films 2043-20, 21 and 2043-22 to expand the through groove 2042-4. At this time, the through groove 2042-6 between the through grooves 2042-2 and 2042-3 fluctuates in volume, but the fluctuation amount is a communication hole 2040 (2040) with the outside air opened in the second thin plate 2048. -2), since there is no pressure fluctuation in the through groove 2042-6, the change in the piezoelectric substrate side wall 2041 (2041-9) is not affected. Accordingly, the piezoelectric substrate side wall 2041 (2041-9) is deformed substantially in accordance with the voltage applied to the conductor film on the piezoelectric substrate side wall 2041 (2041-9). Further, the through-groove 2042-7 between the through-grooves 2042-3 and 2042-4 varies in volume, but the variation is in communication holes 2040 (2040-) with the outside air opened in the first thin plate 2047. 3) Since it goes in and out through, there is no pressure fluctuation of the through groove 2042-7, so it does not affect the change of the piezoelectric substrate side wall 2041 (2041-10, 11). Therefore, the piezoelectric substrate side wall 2041 (2041-10, 11) is deformed substantially in accordance with the voltage applied to the conductor film on the piezoelectric substrate side wall 2041 (2041-10, 11). Further, the through-groove 2042-7 between the through-grooves 2042-4 and 2042-5 varies in volume, but the variation is communicated with the outside air opened in the first thin plate 2047 (2040-3). ), The pressure in the through groove 2042-7 does not change, and the change in the piezoelectric substrate side wall 2041 (2041-11) is not affected. Accordingly, the piezoelectric substrate side wall 2041 (2041-11) is deformed substantially in accordance with the voltage applied to the conductor film on the piezoelectric substrate side wall 2041 (2041-11). As a result, the gas or liquid that has entered the through groove 2042-3 is guided to the through groove 2042-4.

Next, the on-off valve 2049-4 is closed, the on-off valve 2049-5 is opened, voltage is applied to the conductor films 2043-20, 21 and 2043-22, and the through groove 2042-4 is depressed, The gas or liquid that has entered the groove 2042-4 passes through the passage 2046-3 to the outside (or another through groove). At this time, the through-groove 2042-7 between the through-grooves 2042-3 and 2042-4 varies in volume, but the variation is communicated with the outside air opened in the first thin plate 2047 (2040). -3), since there is no pressure fluctuation in the through groove 2042-7, the change in the piezoelectric substrate side wall 2041 (2041-11) is not affected.

In this way, adjacent through grooves are connected by a passage, an open / close valve is provided between them, a voltage is applied to the electrode on the side wall of the substrate side wall, and the open / close valve is operated so as to interlock with the through groove. Since the liquid and gas inside can be moved, a very small pump can be made. Even if an open / close valve is not provided, the operation of adjacent through grooves can be reversed only by applying a voltage to the side electrode on the side wall of the substrate (that is, if one is recessed, the other can be inflated). (And vice versa), the liquid or gas can be continuously moved in one direction. As for the passage in the thin plate, a thin plate on which the passage has been prepared in advance may be attached to the substrate. The passage in the thin plate can be opened with a laser, or the passage can be formed on the surface of one thin plate (A thin plate) and the other thin plate (B thin plate) can be bonded together. Or if a laser beam is used, a desired channel | path can also be formed in a thin plate. The on-off valve may be disposed on the A thin plate and then the B thin plate may be attached thereto, or electrically controlled by wiring into the thin plate. The open / close valve may be formed of a piezoelectric element.

Further, the passages connecting the through grooves shown in FIG. 30A and FIG. 30B are alternately connected to the first thin plate and the second thin plate. A medium such as a liquid or a gas can be moved by providing a passage and a flat valve only in (or the second thin plate). (Refer to FIG. 34) Accordingly, the through-grooves may not be the through-grooves as shown in FIGS. 30 (a) and 30 (b).
Further, although the piezoelectric substrate is used in FIGS. 30A and 30B, the present invention can be used for a substrate that is not a piezoelectric substrate. That is, as described in various places so far, a plurality of recesses (including through grooves) are formed in the substrate, the first conductor film is formed on the substrate side wall between the adjacent recesses, and the piezoelectric film is formed thereon. The pump device of the present invention can be produced by forming a body film and a second conductor film thereon.

Alternatively, the pump device of the present invention can be manufactured only by pressure fluctuation without using a piezoelectric substrate or a piezoelectric film. For example, a pump device using pressure fluctuation can be realized with a structure similar to the structure shown in FIG. In this case, the conductor film shown in FIG. (An insulating film (as a protective film) may be provided on the side wall of the substrate) First, the opening / closing valve 2049-1 is opened and the opening / closing valve 2049-2 is closed, and the pressure is released from the pressure transmission hole 2040-1 to penetrate the through groove 2042-. 5 is made lower (than the pressure of the through groove 2042-1), the substrate side wall 2041-6 is deformed to the through groove 2042-5 side, and the through groove 2042-1 is inflated. The medium (liquid or gas) is introduced into the through groove 2042-1.

Next, the on-off valve 2049-1 is closed and the on-off valve 2049-2 is opened, and pressure is applied from the pressure transmission hole 2040-1 to increase the pressure in the pressure fluctuation through groove 2042-5 (through groove 2042-1). The substrate side wall 2041-6 is deformed to the side of the through groove 2042-1 to make the through groove 2042-1 concave, and the pressure is released from the pressure transmission hole 2040-2 to reduce the pressure in the through groove 2042-6. If the substrate side wall 2041-8 is deformed to the through groove 2042-6 side (lower than the pressure of the through groove 2042-2) at a lower level, the substrate side wall 2041-7 is deformed to the through groove 2042-2 side. The volume of the through-groove 2042-2 is not much changed by almost canceling both. As a result, the medium in the through groove 2042-1 moves to the through groove 2042-2. By repeating this, the medium can be moved. In addition, by providing the two pressure fluctuation through grooves between the through grooves in which the medium moves, the through groove for pushing out the medium can be recessed and the through groove for introducing the medium can be expanded at the same time. For example, two pressure fluctuation through grooves 2042-5 (2042-5-1, 2) may be provided between the through groove 2042-1 and the through groove 2042-2 so that pressure can be applied separately.

In the pump shown in FIG. 30A, the substrate 2041 is a piezoelectric substrate. However, as described above, the piezoelectric substrate may be a piezoelectric film. Alternatively, the substrate 2041 may be a substrate other than a piezoelectric body or a thick film, and in that case, a conductive film and a piezoelectric film may be formed on the side surface of the substrate side wall as described above. Or you may produce the pump of the structure shown to Fig.30 (a) using the pressure difference as shown in FIG. For example, the ink introduction holes 2019-2 and 2019-5 shown in FIG. 27A may be connected and the ink discharge holes 2023-1 and 2023-2 may be connected. Thus, the pump of the present invention can be manufactured using a piezoelectric substrate, can be manufactured using a piezoelectric film, or can be manufactured using a pressure difference.

FIG. 30 (c) is a diagram showing an embodiment of a minute liquid mixing container or gas mixing container using a recess or a through groove of the present invention, and is a plan view parallel to the first surface of the substrate. This embodiment is an application of the embodiment shown in FIG. FIG. 30 (c) shows a set of micro liquid (gas) mixing containers, but a large number of mixing containers can be formed side by side in the substrate. In one set of micro liquid (gas) mixing containers, a cylindrical through groove 2052 (2052-5) is formed at the center, and a cylindrical through groove 2052 (2052-4) surrounds the circumference. A cylindrical substrate side wall 2051 (2051-5) surrounds the through groove 2052 (2052-4). Around the substrate side wall 2051 (2051-5), four sets of through grooves 2052 (2052-1, 2, 3), 2052 (2052-6, 7, 8), 2052 (2052-9, 10, 11), 2052 (2052-12, 13, 14) surrounds. These four sets of through grooves 2052 (2052-1, 2, 3), 2052 (2052-6, 7, 8), 2052 (2052-9, 10, 11), 2052 (2052-12, 13, 14) Are separated by substrate side walls 2051-3, 4, 5, 6. These four sets of through grooves 2052 (2052-1, 2, 3), 2052 (2052-6, 7, 8), 2052 (2052-9, 10, 11), 2052 (2052-12, 13, 14) ) Is surrounded by the substrate side wall 2051 (2051-1). The substrate side wall 2051 (2051-1) is an outer frame of the micro liquid (gas) mixing container of the present invention.

In one set of through grooves 2052 (2052-1, 2, 3), other through grooves 2052 (2052-2, 3) are disposed on both sides of the through grooves 2052 (2052-1). A substrate side wall 2051 (2051-4, 5) is formed between the through groove 2052 (2052-1) and the other through groove 2052 (2052-2, 3), and this substrate side wall 2051 (2051-4, 5) is deformed. The other three sets of through grooves 2052 (2052-6, 7, 8), 2052 (2052-9, 10, 11), and 2052 (2052-12, 13, 14) have the same structure. A first thin plate adheres to the first surface of these substrates 2051 as in the cross-sectional view of FIG. 30A, and a second thin plate adheres to the second surface of the substrate 2051. ing. In the first thin plate or the second thin plate, a liquid or gas passage 2053 (2053-1, 2) and a passage 2055 run in the same manner as shown in the sectional view of FIG. . Each of the passages 2053 (2053-1, 2) and the passage 2055 may be provided with opening / closing valves 2054 (2054-1, 2) and 2056. The other three sets of through grooves 2052 (2052-6, 7, 8), 2052 (2052-9, 10, 11), and 2052 (2052-12, 13, 14) are also within the first thin plate or the second In the thin plate, a liquid or gas passage 2053 runs in the same manner as shown in the sectional view of FIG. These passages 2053 may be provided with opening / closing valves.

One of the passages 2053 (2053-1) is connected to the outside or another through groove or the like. A desired liquid or gas can be introduced. The other of the passage 2053 (2053-1) communicates with the through groove 2052 (2052-1). The passage 2053 (2053-2) enters the central cylindrical through groove 2052 (2052-5) from the through groove 2052 (2052-1). The substrate side wall 2051 (2051-4, 5) can be recessed or expanded as described with reference to FIG. Through the operation of the through groove 2052 (2052-1) and the operation of the on-off valve 2054 (2054-1, 2) combined therewith, liquid or gas is passed through the passage 2053 (2053-1) from the outside or the like through the through groove 2052. Then, liquid or gas is introduced into the cylindrical through groove 2052 (2052-5) from the through groove 2052 (2052-1) through the passage 2053 (2053-2). Various liquids and gases are introduced into the cylindrical through groove 2052 (2052-5) through the passage 2053 from the other three sets of through grooves. The cylindrical through groove 2052 (2052-5) serves as a mixing container for these liquids and gases, and various liquids and gases can be mixed to produce various liquid mixtures and reaction liquids. Since the substrate side wall 2051 (2051-6) surrounding the cylindrical through groove 2052 (2052-5) can be deformed, when introducing liquid or the like into the cylindrical through groove 2052 (2052-5), the substrate side wall 2051 (2051-6) is inflated. At this time, it is effective to operate the on-off valve 2054-2. The mixed solution and reaction solution in the cylindrical through groove 2052 (2052-5) are recessed in the substrate side wall 2051 (2051-6) and discharged to the outside (or another through groove) through the passage 2055. At this time, it is effective to operate the on-off valve 2056.

When the minute liquid mixing container or gas mixing container shown in FIG. 30C is operated by a pressure difference, for example, the pressure is varied in the through grooves 2052 (2052-2, 3), and the through grooves 2052 (2052-). 1) can be recessed or recessed. When a piezoelectric substrate is used, the substrate 2051 becomes a piezoelectric substrate, and a conductor is formed on the side surface of the deformable substrate side wall 2051 (2051-4, 5) or the like, or the deformable substrate side wall 2051 (2051-6) in the central portion. A film is formed, and an electric field is applied to the conductor films on both sides to deform the piezoelectric substrate side wall. Furthermore, even when a normal substrate is used and a piezoelectric film is used, a piezoelectric film having electrodes / wirings on both sides of the substrate side wall is laminated, and an electric field is applied to the electrodes on both sides. The substrate side wall is deformed (only one side is acceptable).

Four sets of through grooves 2052 (2052-1, 2, 3), 2052 (2052-6, 7, 8), 2052 (2052-9) surrounding the cylindrical substrate side wall 2051 (2051-5). 10, 11) and 2052 (2052-12, 13, 14) are places where the liquid and gas before mixing are primarily stored, and from here through the passage 2053 (2053-2) The amount of liquid charged into a certain cylindrical through groove 2052 (2052-5) is adjusted. As a method of adjustment, the pressure may be adjusted or the voltage applied to the conductor film may be adjusted. If the opening / closing valve 2054 (2054-2) is used, the liquid or gas can be introduced from each location by adjusting the deformation amount of the cylindrical through groove 2052 (2052-5). 2051-5) can be omitted. In that case, further miniaturization of the minute liquid mixing container or gas mixing container of the present invention can be realized.

Estimate how small these small liquid mixing containers or gas mixing containers can be. Of course, it is determined by how much liquid or gas is required, but it is estimated from the size that can be realized at present. For example, the central cylindrical through groove 2052 (2052-5) has a diameter of 20 μm and is OK. The width of the surrounding substrate side wall 2051 (2051-6) can be 1 μm, but is 5 μm. The width of the cylindrical through groove 2052 (2052-4) around it is 10 μm, and the cylindrical substrate side wall 2051 (2051-5) surrounding the cylindrical through groove 2052 (2052-4) is 10 μm so as not to be deformed. The size so far is 70 μm in diameter. The size of the outer rectangle is 25 μm on one side, and the substrate side wall on the outer wall is the package of this container, so it is 25 μm on one side. Therefore, the overall square shape is 170 μm. A white paste is cut in the substrate to form a 200 μm square shape. In the case of a 6-inch substrate (150 mm diameter), about 400,000 mixing containers can be produced. A very inexpensive mixing vessel or reaction vessel is made. Moreover, if the material and thickness can be optimized, the size can be further reduced. Note that the thickness of the substrate 2051 can be appropriately adjusted to 10 μm to 2000 μm, preferably 30 μm to 1000 μm, and more preferably 50 μm to 500 μm. If necessary, you can make it thinner or thicker.

The medium discharge device and the pump device of the present invention can also be mounted on a semiconductor substrate. If the substrate or chip on which the above-described medium ejection device or pump device is formed is attached to the semiconductor substrate or chip and necessary wiring is performed, the medium ejection device or pump device using an IC or transistor separately formed on the semiconductor substrate is used. Can be activated. Alternatively, the medium discharge device and the pump device can be manufactured by the process described above by attaching the substrate to the semiconductor substrate. Alternatively, if the medium discharge device or pump device is formed directly on the semiconductor substrate, the medium discharge device or pump device can be operated by connecting the IC or transistor separately formed on the semiconductor substrate to the medium discharge device or pump device. Can do. Alternatively, a polymer or ceramic can be laminated on a semiconductor substrate, and a medium discharge device or a pump device can be manufactured in these polymers or ceramics. An IC or transistor and a medium discharge device separately formed on the semiconductor substrate In connection with the pump device, the medium discharge device and the pump device can be operated. At this time, a concave portion or a through groove in the polymer or ceramic can be formed by using an imprint method, so that a medium discharge device or a pump device can be manufactured in the polymer or ceramic. An IC formed separately on a semiconductor substrate The transistor can be connected to the medium discharge device or the pump device to operate the medium discharge device or the pump device. At this time, if a polymer or ceramic is formed in the recess after forming the recess in the semiconductor substrate, the step of connection between the manufactured medium discharge device or pump device and the IC or transistor separately formed on the semiconductor substrate is reduced. The size can be reduced, and problems such as disconnection of the connection wiring of the connection portion can be prevented.

As a method of using such a container, for example, various tests using human blood can be performed simply and quickly. Blood is put into one through-groove (for example, a finger is slightly pointed and inhaled a little), and a test reagent is put into the other through-groove. Blood is introduced into the central reaction vessel (this amount can be controlled very precisely), and various reagents are introduced into the central reaction vessel from another through groove. These can be mixed and reacted to see the results. In particular, if a transparent thin plate is used, it can be determined by microscopic observation (which will no longer be visible with the naked eye). Or you can apply the light to know the result. It is an advantage of the present invention that the degree of freedom is high that a larger number of outer through grooves can be produced. In FIG. 30C, a cylindrical through groove is provided in the center, but a rectangular through groove may be used as a mixing container, or any other arbitrary shape may be selected as appropriate. Further, the order of arrangement does not require the mixing container to be arranged in the center. However, it goes without saying that in one mounting form, a rectangular shape (rectangle or square) as shown in FIG. 30C is easy to form on the wafer and to be cut (diced).

Such a container can be used as a microreactor, a liquid or gas (liquid or gas) mixer or a reactor (reactor). For example, in FIG. 30 (c), a plurality of types of liquids (fluids) are stored in (storage) through holes 2052 (2052-1, 7, 10, 13) from a plurality of passages, and then stored. When mixing, introducing an appropriate amount of each fluid from through holes 2052 (2052-1, 7, 10, 13) to through holes (which may be referred to as reactors or reactors or mixers) 2052-5, If the tip is vibrated, fluid mixing and reaction can be performed smoothly. Alternatively, when vibration pressure is applied to the through-hole 2052-4, the substrate side wall 2051-6 is deformed by vibration, so that the fluid in the reactor 2052-5 is also vibrated and stirred, and fluid mixing and reaction are performed smoothly. Alternatively, when the substrate side wall 2051-6 is a piezoelectric film, the substrate side wall 2051-6 is attached to the both sides or one side and an AC voltage is applied to the conductor film so that the substrate side wall 2051-6 Can be deformed by vibration. Alternatively, even if the substrate side wall 2051-6 is a semiconductor such as silicon, an insulator such as silicon, or a conductor, a piezoelectric film is attached to both sides or one side thereof, and an AC voltage is applied to both sides. Accordingly, the substrate side wall 2051-6 can be deformed by vibration. The fluid after mixing or reacting in the reactor 2052-5 can be discharged to the outside through the passage 2056, and then a detailed analysis of the discharged material is possible. , And in-situ observation / analysis of the fluid in the reactor 2052-5 is also possible. Reactor 2052-5 (The heater 2052-5 can be heated by attaching a heater film to the substrate side wall and the upper and lower thin plates. If a temperature sensor is installed in the reactor 2052-5, the temperature in the reactor 2052-5 is measured. Alternatively, the reactor 2052-5 can be heated by irradiating an electromagnetic wave from the outside of the chip, or the temperature can be measured by measuring the electromagnetic wave emitted from the reactor 2052-5. The entire chip can be warmed or cooled.

Although the present invention can be used as a microreactor as described above, it will be described in detail with reference to FIG. FIG. 37 is a view showing a microreactor showing a cross section in the thickness direction of the substrate. In the substrate 2101, through holes 2103 (2103-1, 2, 3) are formed in the thickness direction. An upper surface thin plate 2102 is attached to the upper surface of the substrate 2101, and a lower surface thin plate 2103 is attached to the lower surface of the substrate 2101. As described above, the substrate 2101 is a conductor substrate, a semiconductor substrate, or an insulator substrate. The thickness of the substrate can be arbitrarily set according to the size of the reactor (through hole). For example, it can be 100 μm or less, 100 μm to 500 μm, 500 μm to 1 mm, 1 mm to 2 mm, or 2 mm or more. The through holes 2103-1 and 2103-2 are separated by the substrate side wall 2101 (2101-2), and the through holes 2103-2 and 2103-3 are separated by the substrate side wall 2101 (2101-3). As described above, the thickness of the substrate sidewall varies depending on the substrate material, the applied pressure, and / or the area of the substrate sidewall, and the substrate sidewall is deformable by the applied pressure. The through holes 2103-1 and 2103-3 are through holes to which pressure is applied, and the through hole 2103-2 sandwiched between them is a through hole into which liquid or gas is introduced.

The upper surface thin plate 2102 is formed with pressure introduction holes 2107 (2107-1, 3), and through these pressure introduction holes 2107 (2107-1, 3), the through hole 2103 (2103-1, 3) has a pressure P1 or P2 is applied. The pressure can be applied as a gas or liquid. The pressure introduction hole 2107 (2107-1, 3) is provided with an opening / closing valve 2109 (2109-1, 3), and the pressure can be confined. However, when the pressure can be controlled by providing an open / close valve outside, these open / close valves 2109 (2109-1 and 3) are not necessarily required. In addition, a liquid or gas introduction hole 2107 (2107-2) is formed in the upper thin plate 2102, and the liquid or gas is introduced into the through hole 2103 (2103-2) through the pressure introduction hole 2107 (2107-2). Yes (flow is indicated by L1). The liquid or gas introduction hole 2107 (2107-2) is provided with an opening / closing valve 2109 (2109-2), and can also confine liquid or gas. However, it is also possible to control the introduction of liquid or gas by providing an open / close valve outside. For example, the opening / closing valve 2109 (2109-2) may be closed when a certain amount of liquid or gas enters the through-hole 2103-2. When one kind of liquid or gas is introduced, one liquid or gas introduction hole 2107 (2107-2) is sufficient. However, when a plurality of liquids or gases are introduced, a plurality of liquids or gases corresponding to the number of liquids or gases are sufficient. If the introduction hole 2107 (2107-2) is provided, a plurality of liquids or gases can be introduced into the through-hole 2103-2 through them. Even if one liquid or gas introduction hole 2107 (2107-2) is introduced by changing the type of liquid or gas introduced from the outside, a plurality of liquids or gases can be mixed in the through-hole 2103-2. It takes time and is difficult to handle when it reacts (changes) immediately after mixing. In the through hole 2103-2, liquid or gas is mixed and reacts depending on the case. Therefore, the through hole 2103-2 may be called a reactor (reaction vessel) (part).

The lower surface thin plate 2103 is formed with a discharge port 2108 for mixed liquid (including gas) or reaction liquid (including gas) at a portion of the through hole 2103-2, and the mixed liquid or reaction liquid or reaction liquid is formed through the discharge port 2108. Etc. can be discharged (flow is indicated by L2). The discharge port 2108 is also provided with an open / close valve 2110, and the amount of the mixed liquid or reaction liquid discharged can be controlled. When introducing liquid or gas (liquid or the like) into the through-hole 2103-2, if the introduced liquid or the like is difficult to enter due to gas (for example, air or nitrogen) existing in the through-hole 2103-2, the outlet 2108 If the open / close valve 2110 is opened, the gas present in the through hole 2103-2 will escape through the discharge port 2108, so that the introduced liquid and the like can smoothly enter the through hole 2103-2. Alternatively, if the gas in the through-hole 2103-2 is sucked out from the liquid introduction hole 2107-2 and / or the liquid discharge port 2108 in advance and the inside of the through-hole 2103-2 is in a reduced pressure state, the introduced liquid or the like is passed through 2103-2 can enter smoothly. The reduced pressure state in the through hole 2103-2 can be maintained by closing the on-off valve 2109-2 and the on-off valve 2110. Alternatively, the opening / closing valve 2110 may be opened and sucked from the discharge port 2108, and introduced liquid or the like may be put into the through hole 2103-2 through the liquid or the like introduction hole 2107-2. The amount of the introduced liquid or the like may be controlled from the outside, or may be controlled by the volume of the liquid or the like introduction hole 2107. A plurality of opening and closing valves are provided in the liquid or the like introduction hole 2107, and these opening and closing valves are provided. It can also be controlled by the amount of liquid in between. Alternatively, the amount of liquid in the through-hole 2103-2 can be detected and controlled with an optical sensor from the outside of the upper thin plate 2102 or the lower thin plate 2103.

Alternatively, the pressure in the through hole 2103 (2103-1, 3) adjacent to the through hole 2103-2 is changed to deform the substrate side wall 2101 (2101-2, 3) so that the introduced liquid or the like is passed through the through hole 2103-2. It can also be introduced and discharged. For example, when the pressures P1 and P2 of the through holes 2103 (2103-1 and 3) are reduced (by the pressure of the through holes 2103-2), the substrate side wall 2101 (2101-2 and 3) is inserted into the through holes 2103 (2103-1). 3) Since it is deformed into the liquid, a liquid or the like can be introduced into the through hole 2103-2. (At this time, the on-off valve 2110 is closed.) In addition, when the pressures P1 and P2 of the through holes 2103 (2103-1, 3) are set to a pressurized state (from the pressure of the through holes 2103-2), the substrate side wall 2101 is obtained. Since (2101-2, 3) is deformed into the through hole 2103-2, the mixed liquid, the reaction liquid, etc. existing in the through hole 2103-2 are discharged from the discharge port 2108. (At this time, the on-off valve 2109-2 is closed.)

Since various liquids and the like enter and mix or react in the through-hole 2103-2, it is necessary to prevent the inside of the through-hole 2103-2 from reacting with these liquids and the like. For example, when the substrate 2101 is silicon, silicon is easily dissolved in a hydrofluoric acid (HF + HNO 3) or alkaline liquid, and therefore the inside of the through hole 2103-2 may be coated with a film that does not dissolve in them. In the case of an alkaline liquid system, a silicon oxide film, a silicon nitride film, or the like is preferably laminated on the substrate side wall 2101 (2101-2, 3). It is also effective to laminate a polymer resin such as a fluororesin.

The reactor of the present invention is equipped with a heater and can be temperature controlled. For example, as shown in FIG. 37, the heating resistive thin film 2105 is formed in the through holes 2103 (2103-1, 2, 3) formed in the substrate 2101. In the case where the substrate 2101 is a semiconductor substrate such as silicon, after forming the through holes 2103 (2103-1, 2, 3), insulation such as a SiO2 film or a SiN film on the substrate side wall 2101 (2101-2, 3). After the film 2104 is stacked, the heating resistance thin film 2105 is stacked on the insulating film 2104. A Ni—Cr film, an Au film, or the like can be used as the heating resistance thin film (thin film heater). When the adhesion between the insulating film and the heating resistance thin film is poor, a thin film material with good adhesion may be interposed between them. For example, when the heating resistance thin film is an Au film, a W film, Cr, TiN, Ti, Ta film or the like can be interposed as an adhesion layer. A heating resistance thin film forms a wiring pattern as needed. For the pattern formation, an electrodeposition method or the like can be used as described above. For example, the thickness of the W film is 50 nm or more, and the thickness of the Au film is 100 to 500 nm. Since the Au film has a low resistivity and a large temperature coefficient of electrical resistance, a thin film heater that also serves as a temperature sensor can be formed. Further, an insulating film 2106 such as a SiO 2, SiON, or SiN film is formed as a protective film for the heating resistance thin film 2105. The heating resistance thin film (thin film heater) can be formed using a sputtering method, a vapor deposition method, a CVD method, or the like. In FIG. 37, the insulating films 2104 and 2106 and the heating resistance thin film (thin film heater) 2105 are shown only on both sides of the substrate side wall 2101 (2101-2 and 3), but other substrate side walls 2101 (2101) are naturally shown. -1, 4). However, since the pressure chamber through-hole 2103 (2103-1, 3) does not need to be heated, the heating resistance thin film (thin film heater) may be removed by etching. Note that the protective insulating films 2104 and / or 2106 may be left.

The heating resistance thin film (thin film heater) 2105 is connected to the take-out electrode 2112 formed on the upper surface thin plate 2102 through the conductor film 2111 in the contact hole formed on the upper surface thin plate 2102. In FIG. 37, the conductor film 2111 is formed on the upper surface of the substrate side wall 2101 (2101-2, 3), but the heating resistance thin film (thin film heater) 2105 is extended to a wider area (on the upper surface of the substrate 2101). A contact hole may be formed, and the conductor film 2111 may be formed in the contact hole. Since the heating resistance thin film is a conductor film, the heating resistance thin film itself can be used as an electrode. In this case, if the upper thin plate 2102 is opened in the heating resistance thin film electrode portion, it can be connected to the outside by, for example, wire bonding. The electrodes 2112 are formed at two locations in the heating resistance thin film wiring, and the heating resistance thin film wiring is heated by passing a current between these electrodes, and the inside of the reactor 2103-2 is heated by the heat. As described above, when the heating resistance thin film wiring itself also serves as a temperature sensor, the resistance of the heating resistance thin film wiring itself indicates the temperature. Alternatively, if a wiring resistance different from the heating resistance thin film wiring is formed, electrodes are provided at both ends, a voltage is applied between the electrodes, and the resistance is measured, the temperature can be measured from the resistance value. Since it indicates not the temperature of the heating resistance thin film wiring (heater) itself but the temperature around it, it is closer to the temperature in the reactor 2103-2. In this case, the temperature sensor resistance wiring film and the heating resistance thin film wiring may be made of the same material or different conductor films. If they are the same, the process is simple. It is also possible to create a thermocouple in which different metals are joined as a temperature sensor and measure the temperature from the thermoelectromotive force. The temperature sensor and the heating resistance thin film wiring may be formed on the lower surface of the upper thin plate 2102 or the upper surface of the lower thin plate 2103 facing the reactor 2103-2. In this case, if the upper surface thin plate 2102 and the lower surface thin plate 2103 are formed before adhering to the substrate 2101, the process is simple. As a method of heating the reactor 2103-2, there is also a method of heating the whole by putting a chip in an oven or the like set to a predetermined temperature. Alternatively, there is a method of heating by irradiating infrared rays from the upper thin plate and / or the lower thin plate. It is also possible to know the temperature from the electromagnetic waves emitted from the liquid in the heated reactor.

FIG. 38 is a view of the cross section of the through hole 2103 (2103-2) in FIG. 37 as viewed from the right. That is, it is seen from the direction perpendicular to the paper surface of FIG. The through hole 2103-2 has a rectangular parallelepiped shape, and the substrates 2101 (2101-5, 6) exist on both sides. In this case, the substrate side wall 2101 (2101-5, 6) is thick, and the substrate side wall 2101 (2101-5, 6) is not deformed even if there are through holes for applying pressure on the outside thereof. Accordingly, the through-hole 2103-2 is swollen or recessed due to the deformation of the substrate side wall 2101 (2101-2, 3) shown in FIG. 37, but the through-hole 2103-2 does not change in the direction shown in FIG. Naturally, if the substrate side wall 2101 (2101-5, 6) has the same thickness as the substrate side wall 2101 (2101-2, 3) and a through-hole for applying pressure is provided on the outer side, the direction shown in FIG. Further, the through-hole 2103-2 swells or becomes concave due to the deformation of the substrate side wall 2101 (2101-5, 6).

As shown in FIG. 38, the upper thin plate 2102 is provided with two introduction holes (2115, 2116) such as liquid. The first liquid introduction hole 2115 is connected from 2115-1 to 2115-2, and further to 2115-3. The second liquid introduction hole 2116 is connected from 2116-1 to 2116-2 and further to 2116-3. The liquid introduction holes 2115 and 2116 shown in FIG. 38 correspond to the liquid introduction holes 2107-2 shown in FIG. Liquid or the like is introduced into the reactor 2103-2 through the liquid introduction holes 2115 and 2116. The size of the liquid introduction holes 2115-1 and 21116-1 depends on the size of the reactor 2103-2, but cannot be too large. For example, it is 10 μm to 50 μm, or 50 μm to 100 μm. Supply of liquid or the like is performed from an external device, but it is quite difficult to connect the external device and supply liquid or the like according to this size. That is, it is difficult to match the connection port of liquid or the like of the external device to this size. Therefore, by creating a passage as shown in FIG. 38, the size of the connection ports 2115-3 and 2116-3 with the outside of the liquid introduction hole can be freely changed according to the connection port of the external device. For example, when the size of 21115-1 is 50 μm × 50 μm, the size of 2115-2 connected to it is 100 μm wide, 100 μm high, and 500 μm long, and the size of the lower connection port of 2115-3 connected to this is 100 μm The upper connection port size of 2115-3 connected to an external device can be increased to 500 μm to 1 mm × 500 μm to 1 mm. (However, it is limited by the entire chip size.) Thus, since the connection port size of 2115-3 can be made large, it is easy to connect with an external device and supply liquid or the like. If liquid or the like is extruded from an external device, it smoothly enters the liquid introduction hole 2115-3, from which liquid or the like is further pushed out and enters the liquid or the like introduction hole 2115-2, from which liquid or the like is further pushed out. Thus, a predetermined amount of liquid or the like can be introduced into the reactor 2103-2 from the liquid introduction hole 2115-3. The same applies to the liquid introduction hole 2116.

Different liquids and the like can be introduced from these two liquid introduction holes 2115 and 2116, mixed in the reactor 2103-2, and reacted. If other liquids are to be introduced, other introduction holes may be provided. The (micro) reactor of the present invention can be provided with introduction holes for a large number of liquids, and a large number of liquids can be mixed and reacted in the reactor 2103-2. Two thin plates 2102-1 and 22-1 are attached to the upper surface thin plate 2102. After the liquid introduction holes 2115-1 and 21116-1 are formed in the upper thin plate 2102-1, the liquid introduction holes (which are better described as grooves or passages) 2115-2 and 2116-2 are formed. The liquid introduction holes 21115-1 and 21116-1 are through holes completely penetrating the thin plate 2102-1, but the liquid introduction holes 2115-2 and 2116-2 are etched halfway and formed in a groove shape. . These holes and grooves can be formed by using a photolithography method, an etching method, or a laser method. Another thin plate (upper upper surface thin plate) 2102-2 is attached to the thin plate (lower upper surface thin plate) 2102-1 in which the liquid introducing holes 2115-1, 2 and 2116-1, 2 are formed. 3 and 2116-3 are formed. Further, a resin elastic body 2117 such as a silicone resin or an elastomer is attached to the upper surface thin plate 2102 other than the opened liquid introduction holes 2115-3 and 2116-3. Alternatively, after the resin elastic body 2117 is formed on the upper upper surface thin plate 2102-2, the resin elastic body 2117 at the portion to be the opening is removed by etching, and the upper upper surface thin plate 2102-2 is further removed to introduce the liquid introduction hole 2115. -3 may be formed. A through-hole 2103, further insulating films 2104 and 2106, and a heating resistance thin film (temperature sensor) 2105 are formed on the upper surface thin plate 2102 (with 2102-1 and 2102-2 attached) in which liquid introduction holes 2115 and 2116 are formed. It may be attached to the substrate 2101. Alternatively, after the lower upper surface thin plate 2102-1 is attached to the substrate 2101 on which the through-hole 2103, further insulating films 2104 and 2106 and the heating resistance thin film (temperature sensor) 2105 are formed, the liquid introduction holes 2115-1, 2116, and 2116 are provided. -1 and 2 are formed, and then the upper upper surface thin plate 2102-2 is attached, then the liquid introduction holes 2115-3 and 2116-3 are formed, and then the resin elastic body 2117 is formed. Also good. By attaching the resin elastic body 2117 to the upper surface thin plate 2102, when connecting an external device for supplying liquid or the like, the external device can be appropriately pressed against the upper surface thin plate 2102 to maintain airtightness. Can be prevented from leaking outside.

As shown in FIG. 38, the liquid outlet 2118 (2118-1, 2, 3) can be formed in the lower surface thin plate 2103 as well. The liquid or the like placed in the reactor 2103-2 is discharged from the liquid etc. discharge port 21118-1, and passes through the next liquid etc. discharge port (passage) 21118-2 to be connected to an external device 2118 or the like. Connect to. The liquid discharge port 21118-1 cannot be made too large (if it is large, if a valve is not provided, liquid or the like will also enter the liquid discharge port 21118-1. If it is large, if a valve is provided, The size of the discharge port 21118-1, for example, is 10 μm to 50 μm, or 50 μm to 100 μm, depending on the size of the reactor 2103-2. The size of the liquid outlet 2118-2 is, for example, 100 μm to 200 μm, 200 μm to 500 μm, and depends on the chip size. The liquid outlet 2118-3 is connected to an external device, and the liquid or the like that is reacted or mixed in the reactor 2103-2 flows to the external device. Alternatively, the liquid or the like may be moved to the next reactor without providing the liquid or the like discharge port 2118-3. In the case where the liquid outlet 2118-3 is connected to an external device, the size needs to be matched to the connection port of the external device. For example, if the size is 500 μm × 500 μm or more, it is easy to match with the connection port of the external device. Further, the resin elastic body 2119 is attached to the lower lower surface thin plate 2103-2 so that liquid or the like does not leak. By pressing the peripheral portion of the connection port of the external device against the resin elastic body 2119, airtightness can be maintained. If liquid or the like is sucked out by an external device, the liquid or the like in the reactor can be discharged through the liquid outlet 2118. Alternatively, as shown in FIG. 37, the pressure in the through holes 2103-1 and 2103-3 is increased to deform the substrate side walls 2101-2 and 2101-3, and the reactor 2103-2 is recessed to form the reactor 2103- The liquid in 2 may be extruded. The open / close valve can be provided at the liquid outlet 21118-1 or the liquid outlet (passage) 2118-2. The liquid outlet 2118 (2118-1, 2, 3) is formed by separating the lower surface thin plate 2103 into the upper lower surface thin plate 2103-1 and the lower lower surface thin plate 2103-2, as in the case of the upper surface thin plate. It's easy to do.

As can be seen from FIGS. 37 and 38, the microreactor can be formed even if only the reactor 2103-2 is formed without forming the pressure through-hole 2103 (2103-1, 3). When the pressure through-hole 2103 (2103-1, 3) is formed, the substrate side wall 2101 (2101-2, 3) is depressed or expanded by pressure, and a liquid or the like (both fluid) is formed in the reactor 2103-2. Can be introduced, and the fluid in the reactor 2103-2 can be discharged. When the pressure through-hole 2103 (2103-1, 3) is not formed, the fluid is extruded from the fluid supply external device connected to the fluid introduction holes 2107, 2115, 2116, and the fluid is put into the reactor 2103-2. At this time, if the fluid is sucked by an external device for sucking (discharging) fluid connected to the fluid discharge ports 2108 and 2118, the inside of the reactor 2103-2 is in a reduced pressure state, so that the fluid can be easily put into the reactor 2103-2. When the fluid in the reactor 2103-2 is discharged, it may be sucked by an external device for sucking out (discharging) the fluid connected to the fluid discharge port 2108 or 2118 side. At this time, it is easy to discharge the fluid in the reactor 2103-2 by extruding with a gas such as air from an external device for supplying fluid connected to the fluid introduction holes 2107, 2115, and 2116. If the provided opening / closing valves 2109 and 2110 are used in combination, fluid can be introduced and discharged more efficiently.

FIG. 39 is a diagram showing an open / close valve installed in the liquid introduction hole and the liquid discharge hole. A fluid passage 2122 is formed between the lower thin plate 2123 (2123-1) and the upper thin plate 2123 (2123-2). In the middle of the fluid passage 2122, a cavity 2131 is formed in the upper thin plate 2123-2. A pressure introduction hole 2132 is formed in the cavity 2131, and pressure can be applied from the outside. A diaphragm film 2128 is formed covering the cavity 2131. The lower surface of the diaphragm 2128 faces the fluid passage 2122 side. Since the diaphragm membrane 2128 covers the entire cavity 2131, the cavity 2131 is not connected to the fluid passage 2122. The diaphragm film 2128 can also be formed of the same material as the upper thin plate 2123-2. For example, glass, quartz, and silicon. Alternatively, the diaphragm film 2128 can be formed on the upper thin plate 2123-2 by adhesion or lamination. For example, a PolySi film, a silicide film, a metal film, a polymer film, an elastic film such as a silicone resin or an elastomer.

Also in the lower thin plate 2123-1, a cavity 2127 is formed in the lower thin plate 2123-2 in the middle of the fluid passage 2122, and a pressure introduction hole (not shown in the lower thin plate 2123-2 is formed in the cavity 2127). The pressure introduction passage is formed in the upper thin plate 2123-2 and connected to the pressure introduction passage in the upper thin plate 2123-2), and pressure can be applied from the outside. A diaphragm film 2124 is formed so as to cover the cavity 2127. The upper surface of the diaphragm 2124 faces the fluid passage 2122 side. Since the diaphragm membrane 2124 covers the entire cavity 2127, the cavity 2127 is not connected to the fluid passage 2122. The diaphragm film 2124 can also be formed of the same material as the lower thin plate 2123-1. For example, glass, quartz, and silicon. Alternatively, the diaphragm film 2124 can be formed on the lower thin plate 2113-1 by adhesion or lamination. For example, a PolySi film, a silicide film, a metal film, a polymer film, an elastic film such as a silicone resin or an elastomer.

In the upper thin plate 2123-2, when no pressure is applied, the diaphragm 2128 is not deformed, and the fluid L smoothly flows in the fluid passage 2122. However, when the pressure P is applied from the pressure introduction hole 2132 into the cavity 2131, the diaphragm 2128 swells toward the fluid passage 2122 and narrows the fluid passage 2122 (see FIG. 39A). (FIG. 39 (b)) Even in the lower thin plate 2113-1, when no pressure is applied, the diaphragm 2124 is not deformed and the fluid L flows smoothly in the fluid passage 2122. However, when pressure is applied from the pressure introducing hole into the cavity 2127, the diaphragm 2124 expands toward the fluid passage 2122 and narrows the fluid passage 2122. (FIG. 39 (b)) When pressure is simultaneously applied on the upper thin plate 21123-2 side and the lower thin plate 2123-1 side, the fluid passage 2122 is blocked and the fluid does not flow through the fluid passage 2122. (FIG. 39 (b)) By using the diaphragm in this way, an on-off valve can be manufactured.

When the diaphragm is formed of the same material as that of the thin plate, the thin plate may be removed by etching under time control to leave the thickness corresponding to the diaphragm. When the diaphragm is formed of a material different from that of the thin plate, for example, the cavity may be formed by attaching or laminating the diaphragm to the thin plate and etching only the thin plate without etching the diaphragm. If there is a problem if the diaphragm is exposed in the fluid passage, the diaphragm may be covered (by lamination) with another film, for example, an insulating film such as a SiO film, a SiON film, or a SiN film.

It is also possible to form the diaphragm with a piezoelectric film and deform the diaphragm by applying a voltage. For example, as shown in FIG. 39, in the upper thin plate 2123-2, the diaphragm 2128 is a piezoelectric film, and the conductor film 2129 and the conductor film 2130 are attached (laminated) to the upper surface and / or the lower surface of the diaphragm 2128, A contact hole is formed in the thin plate 2123-2 to form a conductor film 2133, and an electrode 2134 is further formed. By applying a voltage from the electrode 2134 to the contact hole conductor film wiring 2133 to the conductor films 2129 and 2130 formed on the upper surface and / or the lower surface of the piezoelectric film 2128, as shown in FIG. In this case, the piezoelectric film 2128 can be deformed toward the fluid passage 2122 to narrow the fluid passage 2122. Therefore, the pressure introducing hole 2132 is not required, and pressure application is not required. In order to adjust the deformation level of the piezoelectric film 2128, the conductor films 2129 and 2130 may be patterned. For example, as described above, a ring shape can also be used.

As shown in FIG. 39, in the lower thin plate 2213-1, the diaphragm 2124 is a piezoelectric film, and the conductor film 2126 and the conductor film 2125 are attached (laminated) to the upper surface and / or the lower surface of the diaphragm 2124. The conductor films 2125 and 2126 can be extended as wirings, contact holes can be formed in the thin plate 2123-2, the conductor film 2133 can be formed, and an electrode 2134 can be further formed. By applying a voltage from the electrode 2134 to the contact hole conductor film wiring 2133 to the conductor films 2125 and 2126 formed on the upper surface and / or the lower surface of the piezoelectric film 2124, as shown in FIG. In this case, the piezoelectric film 2124 can be deformed toward the fluid passage 2122 and the fluid passage 2122 can be narrowed. Therefore, no pressure introduction hole is required, and no pressure application is required. Further, in order to adjust the deformation level of the piezoelectric film 2124, the conductor films 2125 and 2126 may be patterned. For example, as described above, a ring shape can also be used. As described above, in the fluid passage 2122, by applying voltage, the piezoelectric films 2128 and 2124 can be deformed from both sides to close the fluid passage 2122 as shown in FIG. Therefore, an open / close valve can be installed in the fluid passage 2122.

As a manufacturing method, a conductor film 2129 is deposited (laminated) on the upper thin plate 2123-2 and patterned. Next, a piezoelectric film 2128 is attached (laminated) and patterned. Next, a conductor film 2130 is deposited (laminated) and patterned. When the pressure control is performed without using the piezoelectric film, the conductive film is not attached (laminated), but a normal diaphragm 2128 is attached (laminated) and patterned. Next, the upper thin plate 2123-2 is patterned to form contact holes to be connected to the conductor films 2128 and 2130, and conductor film wiring 2133 is performed. Patterning for the cavity 2131 is also performed to form the cavity 2131. Further, when pressure is applied, a pressure introduction hole 2132 is formed. In some cases, a thin plate on which the pressure introducing hole 2132 is formed may be attached. The contact hole, cavity and pressure introducing hole can be formed simultaneously. Contact holes, cavities, and pressure introduction holes can be formed by etching the upper thin plate 2123-2, but it has good selectivity with the underlying conductor films 2129 and 2130 or the diaphragm film (piezoelectric film) 2128. By using the etching conditions, contact holes, cavities, and pressure introducing holes can be formed by removing only the upper thin plate 2123-2 and hardly etching the base. The conductor films 2125 and 2126, the diaphragm film (piezoelectric film) 2124, and the cavity 2127 can be formed by the same method with respect to the lower thin plate 223-1. However, since the contact hole, the pressure introduction hole, and the electrode cannot be formed on the lower thin plate 2123-1 side (the substrate is attached to the lower surface of the lower thin plate 21123-1, the contact hole, the pressure introduction hole, and the electrode are the upper thin plate 2123. -2 side. As another manufacturing method, the structure shown in FIG. 39 can be manufactured by attaching a film having a pattern such as a conductor film or a piezoelectric film to a thin plate. In this case, since film production can be performed in parallel with reactor production, the process time of reactor production can be shortened. Further, in FIG. 39, the opening / closing valves are provided on both the upper thin plate 2123-2 and the lower portion 22123-1, but when either one is sufficient, either one may be omitted.

FIG. 40 is a diagram showing another structure of the on-off valve. The same name as (number) is attached to the same thing as FIG. This on-off valve is a valve attached to the liquid introduction hole 2135 connected to the reactor. The lower thin plate 2213-1 adheres to the reactor, and a passage for introducing liquid or the like into the reactor is a liquid or the like introduction hole 2135. When no pressure is applied, the fluid L is introduced from the fluid passage 2122 into the reactor through the liquid introduction hole 2135. (FIG. 40 (a)) When the pressure P is applied, the diaphragm 2128 swells to the fluid passage side and narrows the passage to the liquid introduction hole 2135, so that the flow rate to the reactor can be adjusted (reduced). Furthermore, the liquid introduction hole 2135 can be completely blocked by applying pressure. That is, the planar shape (cross-sectional shape viewed from above) of the liquid introduction hole 2135 is a circle, square, rectangle, or polygon, and is covered with a cavity 2131 larger than this size (viewed in plan). Then, since the size of the diaphragm 2128 whose both surfaces are open is larger than the planar shape of the liquid introduction hole 2135, the opening of the liquid introduction hole 2135 is completely blocked by the deformation (bulging) of the diaphragm 2128. be able to. If a taper as shown by a broken line 2136 is provided at the opening entrance of the liquid introduction hole 2135, the deformed diaphragm 2128 enters the taper part and enters a surface contact state, so that the liquid introduction hole 2135 is further blocked. Become complete. Also in the case of using the piezoelectric film 2128 as a diaphragm, the voltage applied to the conductor films 2129 and 2130 formed on the upper and lower surfaces of the piezoelectric film 2128 deforms the piezoelectric film 2128 in the cavity 2131 portion, thereby introducing a liquid introduction hole. It can be used as an open / close valve of 2135. In this case, the pressure introduction hole 2132 becomes unnecessary. (It may be installed to form the cavity, but no pressure is required.)

Since a conventional microreactor moves fluid in a direction parallel to the substrate surface (for example, Japanese Patent Application Laid-Open No. 2011-020044), the chip size of the microreactor chip increases. Moreover, since there are many mixing and reaction using a fluid path, the static equilibrium state is not implement | achieved, Therefore A reaction system becomes complicated. On the other hand, since the microreactor of the present invention uses the thickness direction of the substrate, the entire substrate is effectively used, the planar size of the reactor can be reduced, and fluid passages are provided above and below the reactor. The chip size can be reduced. Since the fluid reaction and mixing are performed in a fixed reactor, a static reaction closer to equilibrium can be realized. Reactor temperature control and pressure control are easy, and reaction and mixing conditions can be observed in-situ. Since a large number of fluids can be individually guided and mixed and reacted at once in the reactor, complicated mixing and reaction can be easily realized. Since dangerous fluids, bacteria, viruses, etc. can be handled in a sealed container, safe experiments and research are possible. Since it is easy to install an on-off valve, precise flow rate control is possible. Since a large number of microreactor chips can be fabricated on a single substrate using a semiconductor process, the chip cost can be greatly reduced.

Next, an acceleration sensor using a recess formed in the substrate or thick film material of the present invention will be described. FIG. 31 is a diagram showing the structure and manufacturing method of the acceleration sensor of the present invention. The acceleration sensor of the present invention includes a concave portion side electrode portion 3001 having concave portions and a convex portion side electrode 3002 having convex portions as shown in FIGS. First, the structure and manufacturing method of the recess-side electrode unit 3001 will be described.
As shown in FIG. 31A, an insulating film 3012 is formed on a substrate 3011 such as a semiconductor, metal, or insulator. Next, a thick film 3013 is formed. The substrate 3011 includes a semiconductor substrate (eg, a silicon substrate, a gallium nitride substrate (GaN), gallium arsenide (GaAs), etc.), a carbon substrate, an insulating substrate (eg, aluminum nitride (AlN), glass, quartz, ceramic, etc.), The insulating film 3012 is, for example, a silicon oxide film (SiOx), a silicon oxynitride film (SiOxNy), a silicon nitride film (SiNy), such as a polymer, resin, metal (for example, copper, aluminum, iron, nickel, various alloys). In the case where the thick film 3013 is an insulating film, and when the adhesion between the substrate 3011 and the thick film 3013 is good and the thick film 3013 can be easily formed on the substrate 3011, it may not be formed.

The thick film 3013 is preferably made of a material capable of forming a recess and having a small deformation of the formed recess in a normal use environment. For example, polymers (PMMA (Polymethyl metacrylate), PC (Polycarbonate), PDMA (Polydimethylsiloxane), ...), insulators such as glass and ceramics, semiconductors such as silicon, carbon, gallium arsenide, gallium arsenide, or metals But it ’s okay. A photosensitive film such as a photoresist is formed on the thick film 3013, the photosensitive film is patterned, and the thick film 3013 is etched using the patterned photosensitive film as a mask, so-called photolithography method and etching method are performed. In this way, a recess 3017 (3017-1, 2, 3, 4) is formed in the thick film 3013. An imprint method can also be used as a resist pattern forming method. For example, a resist forming mold is pressed against a resist film formed by applying a resist (not necessarily photosensitive) or adhering a sheet-like resist (not necessarily photosensitive). Form a pattern. (Remaining film remaining at the bottom of the recess is removed by, for example, anisotropic whole surface etching of oxygen plasma) Using this patterned resist film as a mask, the thick film 3013 is etched to form a recess having a desired depth in the thick film 3013. 3017 is formed. Since the side surface of the recess 3017 serves as one electrode of the capacitance element, it is formed as vertically as possible according to the resist mask pattern. The shape of the side surface of the recess 3017 is usually a flat surface, but it may be a curved surface. When the shape of the side surface of the recess 3017 is a flat surface, a rectangular shape is easily formed. The maximum value of the depth of the recess 3017 (perpendicular to the substrate surface) is determined by the thickness of the thick film (substrate) 3013, but it is desirable to optimize it according to the characteristics of the acceleration sensor element and ease of formation. . For example, the depth can be 1 μm. Further, if the thickness of the thick film (substrate) 3013 is increased, a deeper recess can be formed. For example, with a thick film (substrate) 3013 having a thickness of 500 μm, a depth of 500 μm (in this case, penetrating) is possible. With a thick film (substrate) 3013 of 1000 μm, a depth of 1000 μm (in this case, penetration) is possible.

Various substrates may be used as the thick film 3013. (In this case, it is better to refer to a substrate rather than a thick film.) Various substrates are semiconductor substrates such as silicon, carbon, gallium arsenide, and gallium arsenide, or insulators such as glass, ceramic, and plastic. A substrate, or a metal substrate such as a metal or an alloy. These substrates 3013 may be attached directly to the substrate 3011 or may be attached via an insulating film 3012. As a bonding method, a method using an adhesive, a room temperature bonding method, a high temperature fusion method, a diffusion bonding method, or an electrolytic bonding (anodic bonding) method may be used. The silicon substrate and the glass substrate (including the quartz substrate) can be bonded firmly by an anodic bonding method. The method of forming the recess in the substrate can be formed by the same method as described above.

However, in order to simplify the process, the concave portion 3017 may be formed directly on the substrate 3011 without attaching the substrate 3013 to the substrate 3011. In this case, the concave portion can be formed by the method described above. Further, the thick film 3013 can be formed by the following method, and the concave portion 3017 can be formed in the thick film 3013.

As the thick film 3013, the polymer can be formed thick on the insulating film 3012 over the substrate 3011. As a method for forming the polymer 3013, there are a method of forming a coating film by a dropping method, a spin coating method, a screen printing method, or the like (coating method), and a method of attaching a polymer sheet material on the insulating film 3012 on the substrate 3011. . When the polymer is a thermoplastic polymer, a mold (mold) in which a pattern for forming a recess is formed in the coating film is pressed against the polymer 3013 with a certain pressure and heated to make the polymer soft. Alternatively, the sheet material or the coating film is heated to soften the polymer, and a mold (mold) on which a recess forming pattern is formed is pressed against the softened polymer 3013 with a certain pressure. Next, when the polymer 3013 is pressed and the temperature is lowered (Tg or less) to cure the polymer 3013 and then the mold is peeled off, a recess 3017 (3017-1, 2, 3, 4) is formed in the polymer 3013. . In this way, the recess 3017 can be formed in the polymer thick film 3013 using the imprint method.

When the polymer is a thermosetting polymer, a mold (die) on which a pattern for forming recesses is formed is pressed against the polymer 3013 as a coating film with a certain pressure, and then the polymer 3013 is heated in a pressed state. Heat and hold above the curing temperature of the thermosetting polymer. When the mold is peeled after the polymer 3013 is cured, recesses 3017 (3017-1, 2, 3, 4) are formed in the polymer 3013.

When the polymer is a photocurable polymer, a mold (mold) in which a pattern for forming recesses is formed on the coating film is pressed against the polymer 3013 with a certain pressure, and light such as ultraviolet rays is applied to the mold die or the back side of the substrate 3011 The polymer 3013 is cured by irradiating the polymer 3013 with light through a mold or substrate 3011. When the mold is peeled after the polymer 3013 is cured, recesses 3017 (3017-1, 2, 3, 4) are formed in the polymer 3013.

The concave portion 3017 in the thick film 3013 can also be formed using ceramic or the like as the thick film 3013. For example, ceramic fine particles (for example, alumina (Al 2 O 3) fine particles, aluminum nitride (AlN) fine particles, and silica (SiO 2) fine particles) are applied on the insulating film 3012 on the substrate 3011 in a paste or gel form in a solvent. Application is possible using a screen printing method, and if a mask is used, application can be made only at a desired location. A mold (mold) on which a pattern for forming a recess is formed is pressed against the paste-like or gel-like coating film with a constant pressure. Next, when the paste-like or gel-like coating film is heated abnormally and the mold is peeled after the coating film is solidified, a recess 3017 (3017-1, 2, 3, 4) is formed in the polymer 3013. The In this way, the recess 3017 is formed in the ceramic thick film 3013 using the imprint method.

The concave portion 3017 in the thick film 3013 can also be formed using glass as the thick film 3013. For example, a thin glass plate is bonded onto the insulating film 3012 on the substrate 3011 in the region where the thick film 3013 is to be formed, and is softened by heating to a temperature equal to or higher than the glass transition temperature (Tg). Alternatively, molten glass is attached to the insulating film 3012 over the substrate 3011. A mold (mold) on which a pattern for forming a recess is formed is pressed with a certain pressure into the softened glass or the melted glass. Thereafter, the temperature is lowered to Tg or lower to solidify the glass, and then the mold (mold) is peeled off.

The concave portion 3017 in the thick film 3013 can also be formed using a metal as the thick film 3013. For example, a thin metal plate is bonded onto the insulating film 3012 on the substrate 3011 in the region where the thick film 3013 is to be formed, and is heated or softened or melted at a temperature near or above the melting point (Tm) of the metal. Alternatively, the molten metal is attached to the insulating film 3012 over the substrate 3011. A mold (mold) in which a pattern for forming a recess is formed is pressed into the softened metal or molten metal with a constant pressure. Thereafter, the temperature is lowered to Tm or less to solidify the metal, and then the mold is removed. (The above-described method can be produced in the same manner for the concave portions of the conventional pressure sensor, pump device, and the like.)

Next, an insulating film 3014 such as a silicon oxide film (SiOx) and a conductor film 3015 such as aluminum, copper, and silicide are formed on the pattern of the thick film 3013 in which the recesses 3017 are formed. This insulating film 3014 prevents current from flowing from the conductive film 3015 to the thick film 3013 when the thick film 3013 is not a perfect insulator. Even if the insulating property of the thick film 3013 is perfect (the current does not flow from the conductor film 3015 to the thick film 3013), it is formed for the purpose of improving the adhesion when the adhesion between the thick film 3013 and the conductor film 3015 is not good. To do. Therefore, when the insulating property of the thick film 3013 is perfect and the adhesiveness between the thick film 3013 and the conductor film 3015 is good, the insulating film 3014 need not be formed. The insulating film 3014 is, for example, a silicon oxide film (SiOx), a silicon oxynitride film (SiOxNy), a silicon nitride film (SiNy), or the like, and is laminated by a CVD method, a PVD method, or the like. The thickness of the insulating film 3014 is set such that 100 nm to 500 nm can be secured in the recess.

The conductor film 3015 serves as one electrode / wiring of the acceleration sensor. The conductor film 3015 is, for example, a metal film such as aluminum, copper, titanium, molybdenum, tungsten, platinum, gold, or nickel, or an alloy film thereof, or a metal silicide film, a conductive polycrystalline silicon film, or the like. It is formed by CVD or PVD. An insulating film 3014 (if not present, a thick film 3013) and an adhesion improving film for improving the adhesion of the conductor film 3015 (which is also a conductor film) are stacked, and then the conductor film 3015 is formed. Also good. For example, when the conductor film 3015 is copper, gold, or platinum, titanium or titanium nitride (TiN) can be used as the adhesion improving film. The thickness of the conductor film 3015 can ensure 100 nm to 500 nm in the recess.

Next, the conductor film 3015 is patterned, and the unnecessary conductor film 3015 is removed by etching. This patterning is performed by applying a photoresist using a normal photolithography method or attaching a photosensitive sheet, leaving a photosensitive film in a necessary portion, and removing the conductive film 3015 in a portion where the photosensitive film is removed by etching. To do. The conductor film 3015 in the recess 3017 is also etched as necessary. The method of patterning the inside of the recess can be performed by the method described so far, and for example, an electrodeposition resist, a method using a sheet-like photosensitive film, an imprint method (see FIG. 24), and the like can be used.

Next, an insulating film 3016 such as a silicon oxide film (SiOx) is stacked on the conductor film 3015. The insulating film 3016 is a protective film for the conductor film 3015 and at the same time prevents a short circuit when the other electrode comes into contact. The insulating film 3016 is, for example, a silicon oxide film (SiOx), a silicon oxynitride film (SiOxNy), a silicon nitride film (SiNy), or the like, and is laminated by a CVD method, a PVD method, or the like. The thickness of the insulating film 3016 is sufficient if it is 100 nm to 500 nm in the recess, but if the possibility of contact is high, the thickness is determined in consideration of the frequency. Furthermore, since it is a part in contact with the convex part side electrode part 3002 in the flat part, the film thickness is determined in consideration of this. Therefore, the thickness of the flat portion is usually 500 nm or more. Since the insulating film 3016 is also laminated on the portions 3031 and 3032 where the conductor film 3015 is removed by etching, the side electrode 3015 is not short-circuited.

Next, the structure and manufacturing method of the convex part side electrode part will be described. The structure of the convex part side electrode part 3002 has a convex part 3024 (3024-1, 2, 3, 4) that enters the concave part 3017 (3017-1, 3, 3, 4) of the concave part side electrode part 3001, When the concave portion side electrode portion 3001 and the convex portion side electrode portion 3002 are combined, the flat portion 3025 is combined with the flat portion (upper flat portion) of the concave portion side electrode portion 3001. Further, the substrate and film configuration of the convex portion side electrode portion 3002 are basically the same as those of the concave portion side electrode portion 3001. An insulating film is formed on the convex side substrate 3021 and a thick film 3022 is formed thereon. 31A and 31B, the insulating film on the convex portion side substrate 3021 is not described.

Next, convex portions 3024 (3024-1, 2, 3, 4) that enter the concave portions 3017 (3017-1, 3, 3, 4) when combined with the concave-side electrode portion 3001 are formed in the thick film 3022. . As a method for forming the convex portion 3024, the same method as the method for forming the concave portion 3017 of the concave portion side electrode portion 3001 can be used. However, the convex part 3024 of the convex part side electrode part 3002 has a smaller area than the convex part of the concave part side electrode part 3001. For example, the convex portion 3024 is formed by using a photolithography method (including a method of producing a resist pattern by an imprint method) and an etching method, or various imprint methods. Alternatively, the thick film 3022 may be various substrates, and various substrates may be attached on the substrate 3021 of the convex electrode portion 3002 or through an insulating film in the same manner as described in the concave electrode portion 3001. The convex portion 3024 is manufactured using a photolithographic method (including a method of manufacturing a resist pattern by an imprint method) and an etching method. Alternatively, the convex portion 3024 may be formed directly on the substrate 3021 of the convex portion side electrode portion 3002.

Next, an insulating film 3028 (described in FIGS. 31D and 31E) is formed on the thick film 3022 of the convex portion 3024 and the concave portion 3026 (3026-1, 2, 3, 4, 5). A conductor film 3023 is formed. The conductor film 3023 serves as the counter electrode / wiring of the electrode / wiring 3015 of the recess-side electrode portion 3001. Next, necessary patterning of the conductor film 3023 is performed. The necessary patterning of the conductor film 3023 is patterning of electrodes / wirings so that a capacitor element for manufacturing an acceleration sensor is formed. In one capacitive element, the convex portion 3024 deforms and changes in capacitance when subjected to acceleration, but the capacitance increases because the distance between the electrodes decreases on one side, but the capacitance increases because the distance between the electrodes increases on the other side. Therefore, if the connection is maintained as it is, the change in capacitance is canceled out. Therefore, it is necessary not to connect the conductor film 3023 on the two side surfaces which become the capacitor electrode of the recess 3026. Therefore, as shown in FIGS. 31A and 31B, a part of the conductor film 3023 is removed by etching at the tip portion of the convex portion 3024 and the two side surfaces in the direction perpendicular to the paper surface. That is, a region 3029 (3029-1, 2, 3, 4) from which the conductor film 3023 is removed by etching is formed. Needless to say, part of the conductor film 3023 is removed by etching so as not to be connected even in a flat portion. Also, when there are two or more capacitive elements, electrodes that exhibit similar capacitance changes may be connected, but electrodes that exhibit different capacitance changes need not be connected.

Next, in order to protect the conductor film 3023, an insulating film 3027 such as SiOx is formed. In FIGS. 31A and 31B, the insulating film 3027 is not shown but is shown in FIGS. 31D and 31E. This insulating film 3027 also serves to prevent a short circuit due to contact with the conductor film 3015 which is a counter electrode. In the case where the insulating film 3016 has already been formed as the protective film for the conductor film 3015 and the short-circuit prevention film in the recess-side electrode portion 3001, this insulating film 3027 may be omitted when there is no need for short-circuiting or protection. . Even if the insulating film 3027 is omitted, the flat portion 3018 and the convex portion side electrode portion of the concave portion side electrode portion 3001 which becomes a coupling portion when the concave portion side electrode portion 3001 and the convex portion side electrode portion 3002 are combined. Since an adhesive or the like is interposed between the flat portions 3025 of 3002, if a protective film or a material for preventing a short circuit (such as an insulating adhesive) is used for the adhesive or the like, the conductor film 3023 can be protected. Short circuit prevention can be performed. The film configuration of the convex portion side electrode portion 3002 is substantially the same as that of the concave portion side electrode portion 3001 (some of the insulating films may be omitted as described above), and may be formed under the same generation conditions. Since it is good, the process cost can be greatly reduced. For example, a single wafer processing apparatus can process continuously, and a batch process can process together. The convex part 3024 of the convex part side electrode part 3002 has a shape smaller than that of the concave part 3017, and the side surface of the convex part 3024 is preferably parallel to the side surface of the concave part 3017. Therefore, if the concave portion 3017 has a rectangular shape, it is preferable that the convex portion 3024 also enters the concave portion 3017 so that the side surfaces are parallel (substantially parallel).

The concave portion has a rectangular shape (rectangular column shape, which has a flat side surface), that is, the inner side surface of the concave portion has a rectangular column shape side surface and can have various shapes, and is opposed to this. The convex portion can be inserted into the concave portion while being spaced apart and can have various shapes other than the side surface of the rectangular column shape. (The inner surface of the concave portion and the outer surface of the convex portion inserted therein face in parallel.) For example, the concave portion has a polygonal shape (polygonal column shape, which has a flat side surface), that is, the concave portion. The inner side surface of the can be a polygonal columnar side surface, and the convex portion facing it is inserted into the concave portion at a distance, and the polygonal shape (polygonal columnar shape), that is, the polygonal shape (polygonal shape) The side of the column shape may be used. Or, for example, the concave portion may have a curved surface shape (curved column shape, which has a curved side surface), that is, the inner side surface of the concave portion may be a curved columnar side surface, and the convex portion that faces the concave portion is also spaced apart in the concave portion. In addition, the concave portion may have a curved surface shape (curved column shape, which has a curved side surface), that is, a curved surface (curved column shape) side surface. For example, the curved surface is a cylinder side surface or an elliptic cylinder side surface. (The inner surface of the concave portion and the outer surface of the convex portion inserted therein face in parallel.)

Next, as shown in FIG. 31B, the concave portion side electrode portion 3001 and the convex portion side electrode portion 3002 are coupled. The number of concave portions 3017 of the concave portion side electrode portion 3001 is larger than the size of the convex portions 3024 of the convex portion side electrode portion 3002, and the number of concave portions 3017 of the concave portion side electrode portion 3001 is equal to or greater than the number of convex portions 3024 of the convex portion side electrode portion 3002. When the concave portion side electrode portion 3001 and the convex portion side electrode portion 3002 are combined, all the convex portions 3024 of the convex portion side electrode portion 3002 have a positional relationship such that they enter the concave portion 3017 of the concave portion side electrode portion 3001. It has become. The concave portion side electrode portion 3001 and the convex portion side electrode portion 3002 are aligned so that the convex portion 3024 of the convex portion side electrode portion 3002 is disposed at a predetermined position of the concave portion 3017 of the concave portion side electrode portion 3001. For example, the concave portion side electrode portion 3001 and the convex portion side electrode portion 3002 are aligned while matching the alignment mark (may be a concave portion pattern) of the concave portion side electrode portion 3001 with the alignment mark (may be a convex portion pattern) of the convex portion side electrode portion 3002. The convex portion 3024 (3024-1, 2, 3, 4) of the convex portion side electrode portion 3002 is put in the concave portion 3017 (3017-1, 3, 3, 4) of the concave portion side electrode portion 3001, The flat part 3025 of the convex part side electrode part 3002 and the flat part 3018 of the concave part side electrode part 3001 are attached.

The alignment of the alignment marks can be performed with very high accuracy by alignment with, for example, transmitted light passing through the concave portion side electrode portion 3001 and / or the convex portion side electrode portion 3002. (Since the alignment accuracy can be reduced to 0.3 μm or less, this acceleration sensor has no problem.) Therefore, when such direct alignment is performed, the substrate 3011 and the substrate 3021 are transmitted to perform this alignment. Select a material with high light transmittance. For example, a glass substrate, a quartz substrate, or a plastic substrate may be used as the substrate 3011 or the substrate 3021. Furthermore, since the conductor films 3015 and 3023 generally have low light transmittance, a dummy concave pattern (the concave part side electrode part 3001 side) or convex part pattern (the convex part side electrode part 3002 side) is formed, The conductor film around these patterns may be removed at the same time during the conductor film etching process, and alignment may be performed by transmitting light using this region. When transmitted light cannot be used for alignment, indirect alignment (for example, storing the pattern of the concave side electrode part 3002 and aligning the convex side electrode part 3002 based on the information) or performing reflected wave It is only necessary to perform alignment using them.

These flat portions can be attached via an adhesive 3026 as shown in FIG. For example, an adhesive is applied to the flat portion 3018 of the concave-side electrode portion 3001 (or the flat portion 3025 of the convex-side electrode portion 3002), and a screen printing method (a method of applying an adhesive only to a predetermined portion using a mask) A dipping method (a method of dipping the flat portion 3018 of the concave portion side electrode portion 3001 in an adhesive solution, with the flat portion 3018 of the concave portion side electrode portion 3001 on the lower side, and an adhesive on the necessary portion of the flat portion 3018. And a method of attaching the adhesive sheet {adhesive sheet from which the concave region has been removed in advance is applied only to a predetermined portion of the flat portion 3018 of the concave portion side electrode portion 3001 (or the flat portion 3025 of the convex portion side electrode portion 3002). The method of making it adhere, the adhesive sheet is made to adhere, and the recessed part area | region (or area | region of the convex part 3024 of the convex part side electrode part 3002) of the recessed part side electrode part 3001 is included A method in which a predetermined portion of the part side electrode part 3001 (or the convex part side electrode part 3002) is removed and an adhesive sheet is formed only on a part to be bonded to the concave part side electrode part 3001 (or the convex part side electrode part 3002). } To attach these flat portions 3018 and 3025. In order to increase the adhesive strength of the adhesive, a heat treatment is performed thereafter. Alternatively, as another bonding method, these flat portions can be attached by a room temperature bonding method or a high temperature pressure bonding method.

31 (d) and 31 (e) are enlarged views of a part of the acceleration sensor of the present invention shown in FIGS. 31 (a) and 31 (b). The basic structure of the acceleration sensor of the present invention is configured by the structure shown in FIGS. 31 (d) and 31 (e). 31A and 31B do not show the insulating film having the film structure of the convex portion side electrode portion 3002, but FIGS. 31D and 31E show these insulating films 3027 and 3028. As shown in FIG. 31D, the acceleration sensor of the present invention has a structure in which the convex portion 3024 of the convex portion side electrode portion 3002 enters the concave portion 3017 of the concave portion side electrode portion 3001, and the concave portion of the concave portion side electrode portion 3001. Since the upper surface of the side wall 3013 around 3017 is attached to the bottom surface around the convex portion 3024 of the convex portion side electrode portion 3002 by the adhesive 3026 or the like, the space of the concave portion 3017 is sealed. In this airtight space, the atmosphere space when the concave portion side electrode portion 3001 and the convex portion side electrode portion 3002 are coupled is substantially maintained. For example, if the bonding is performed in a vacuum (in an ultra-low pressure), this hermetic space is almost in a vacuum state. If combined in atmospheric pressure, this airtight space is approximately 1 atm. Or if it is in inert gas (in nitrogen, argon, etc.), this airtight space will become inert gas atmosphere.

FIG. 31C is a plan view of the states of FIGS. 31B, 31D, and 31E. The convex portion 3024 has a rectangular parallelepiped shape (long side direction Ly, short side direction Wx, height Hz) and enters a rectangular parallelepiped concave portion 3017. When no force is applied, the long side of the rectangular parallelepiped shape is a concave portion. It is substantially parallel to the long side of 3017 and is separated by a distance x1 (left side) and x2 (right side). Further, the short side of the rectangular parallelepiped shape is substantially parallel to the short side of the recess 3017 and is separated by distances y1 (upper side) and y2 (lower side). Further, the bottom surface side of the rectangular parallelepiped shape is substantially parallel to the bottom surface side of the recess 3017, and is separated by a distance z1 (lower side).

Consider the case where the conductor film 3015 is continuous (connected) in the recess 3017 and between the recesses 3017, and the case where the conductor film 3023 is continuous (connected) between the convex portion 3024 and the convex portion 3024. In other words, this is a case where there are no etched portions 3029, 3030, 3031 and 3032 of the conductor film. At this time, the conductive film 3015 formed on the thick film 3013 on the side wall side and the bottom surface side of the concave portion 3017 is used as one electrode, and the conductive film 3023 formed on the side surface and the bottom surface of the convex portion 3024 is used as the other electrode. As a result, a capacitor 30 is formed with a space 3017 sandwiched between these electrodes as a capacitor space.

When a capacitive space separated by a distance x1 (= dx1) is 3041, and a capacitance between them is Cx1, Cx1 = εSx1 / dx1 {ε is a dielectric constant, Sx1 is an electrode area of the capacitive space 3041 (Sx1 = Ly * Hz) }. Assuming that the capacitance space separated by the distance x2 (= dx2) is 3042, and the capacitance between them is Cx2, Cx2 = εSx2 / dx2 {ε is the dielectric constant, Sx2 is the electrode area of the capacitance space 3042 (Sx2 = Ly * Hz) }. Assuming that the capacitive space separated by the distance y1 (= dy1) is 3044 and the capacitance between them is Cy1, Cy1 = εSy1 / dy1 {ε is the dielectric constant, Sy1 is the electrode area of the capacitive space 3044 (Sy1 = Wx * Hz) }. Assuming that the capacity space separated by the distance y2 (= dy2) is 3045 and the capacity between them is Cy2, Cy2 = εSy2 / dy2 {ε is the dielectric constant, Sy2 is the electrode area of the capacity space 3045 (Sy2 = Wx * Hz) }. Assuming that the capacitive space separated by the distance z1 (= dz1) is 3043 and the capacitance between them is Cz1, Cz1 = εSz1 / dz1 {ε is the dielectric constant, Sz1 is the electrode area of the capacitive space 3043 (Sz1 = Wx * Ly) }. Since these capacitors are connected in parallel, the space capacitance C3017 between the electrode 3015 formed on the side wall and bottom of the concave portion 3017 and the electrode 3023 formed on the side surface and bottom surface of the convex portion 3024 is C3017 = Cx1 + Cx2 + Cy1 + Cy2 + Cz1 It becomes.

The acceleration sensor of the present invention is detected by this change in capacitance. When the convex portion 3024 receives a force in the x direction (short side direction), the convex portion 3024 changes in the x direction (thickness of the convex portion 3024, that is, the thickness direction of the cantilever), but in the y direction (long side direction). Does not change. Further, when the convex portion 3024 receives a force in the y direction (long side direction), the convex portion 3024 hardly changes in the y direction. That is, since the convex portion 3024 hardly changes in the long side direction (the width of the convex portion 3024, that is, the width direction of the cantilever), the convex portion 3024 has an acceleration (force) depending on the amount of change in the x direction (short side direction). The size can be determined. In the acceleration sensor according to the present invention, the change in capacitance of the recess 3017 is detected to measure the magnitude of acceleration. That is, when the cantilever of the convex portion 3024 receives a force, the convex portion 3024 is displaced in the x direction, so that Cx1 and Cx2 change, and other capacitances Cy1, Cy2, and Cz1 hardly change. That is, it can be considered that C3017 = Cx1 + Cx2 + C0 (C0 is a constant). When the convex portion 3024 is not receiving force, that is, when the convex portion 3024 is stationary vertically downward, C3017 is the smallest, and when it is displaced to the left and right (in FIG. 31C), the capacitance C3017 increases. From this increase in capacity, the force or displacement can be known. Even if the change in capacitance is small, if a large number of single rectangular parallelepiped acceleration sensors shown in FIGS. 31 (d) and 31 (e) are arranged, the change in capacitance becomes large and can be detected accurately. However, when the amount of displacement of the convex portion 3024 is small, the amount of change of Cx1 (ΔCx1) and the amount of change of Cx2 (ΔCx1) are of the same magnitude and opposite in sign (increase and decrease). Almost no change.

In addition, the acceleration sensor of the present invention is excellent in that there is no need to pattern a thin film, particularly a conductor film (3015 or 3024) in this region, and it is sufficient that all layers are laminated as they are. The contacts and lead electrodes shown in FIG. 31 (c) may be formed on a flat portion (may be outside this region), so that a difficult problem in the process does not occur. In the case of the conventional method, it is difficult to pull out the lower electrode, and the process becomes complicated. Therefore, the process becomes much simpler than the conventional method. Further, in the present invention, the concave portion side electrode portion 3001 and the convex portion side electrode portion 3002 can be separately formed in parallel, and at the same time, since the substrate and the thin film (including thick film) configuration can be made the same, the process speed can be increased. However, since the process is fast and simple, the process cost can be greatly reduced.

As described above, when the conductor film 3015 is continuous (connected) in the concave portion 3017 and between the concave portions 3017, and when the conductive film 3023 is continuous (connected) by the convex portion 3024 and the convex portion 3024 winding That is, in the case where there are no etched portions 3029, 3030, 3031, and 3032 of the conductor film, patterning at the concave portions and the convex portions is not necessary, and the process becomes simple. However, since C3017 hardly changes when the amount of displacement of the convex portion 3024 is small, it is difficult to detect when the acceleration is small. There is also a problem that the direction of acceleration (positive side or negative side in the x direction) cannot be detected. Therefore, when the conductor film 3015 is separated in the recess 3017 and between the recesses 3017, and when the conductor film 3023 is separated by the protrusion 3024 and the protrusion 3024, that is, the conductivity shown in FIG. Etching removed portions 3029, 3030, 3031 and 3032 of the body film are provided. In FIG. 31 (c), the conductor films on the side capacitor space 3044 side and 3045 side in the y direction are removed, and the conductor film in the bottom capacitor space 3043 is also removed, so that it can be detected as a capacitor. Are only the capacitances Cx1 and Cx2 of the side capacitance spaces 3041 and 3042 in the x direction. These capacitors Cx1 and Cx2 have the reverse relationship that when one increases, the other decreases. Since these are not connected, the capacity can be detected individually. The increase in Cx1 and the decrease in Cx2 means that a force (acceleration) is exerted on the convex portion 3024 on the minus side in the X direction (left side in FIGS. 31D and 31E). On the contrary, when Cx1 decreases and Cx2 increases, the force (acceleration) is acting on the convex portion 3024 on the positive side in the X direction (right side in FIGS. 31D and 31E). . Thus, if the increase / decrease of Cx1 and the increase / decrease of Cx2 are detected, the direction of acceleration can also be known. Also. Even if the acceleration is small (even if the displacement of the convex portion 3024 is small), Cx1 or Cx2 changes, so that even a small acceleration can be detected. Even if the change amount of Cx1 is small, if a large number of Cx1s are connected, a large change amount is obtained. Similarly, even if the change amount of Cx2 is small, if a large number of Cx2s are connected, a large change amount is obtained. .

If the acceleration sensors of the present invention are arranged in the same direction, sensitivity to acceleration in that direction (x direction in FIGS. 31 (c) to (d)) increases, but in another direction, particularly in a right angle direction (FIG. 31 ( In c) to (d), the acceleration in the y direction) cannot be measured. Therefore, the accelerometer of the present invention whose orientation is changed by 90 degrees, tilted by 45 degrees, or tilted by a certain angle is also placed together, or the concave and convex portions are not polygonal but polygonal. The acceleration can be detected with respect to various directions by manufacturing the section and measuring the change in capacitance on each facing surface independently (wiring the electrodes independently).

As shown in FIG. 31E, a weight 3051 or 3052 having a specific gravity larger than that of the convex portion 3024 is attached to the tip portion (bottom surface portion) of the convex portion 3024 so that the convex portion 3024 serving as a cantilever increases sensitivity to acceleration. Just do it. The weight 3051 is attached to the tip of the convex portion 3024 of the thick film 3022, and the weight 3052 is attached to the insulating film 3027 stacked on the tip of the convex portion 3024 of the thick film 3051. These weights 3051 and 3052 are formed by forming a convex portion 3024 on the thick film 3022 by imprint method, photolithography method + etching method, etc., and then attaching a weight substrate of the weight 3051 to the convex portion 3024 using an adhesive or the like. To do. For example, the adhesive is previously applied to the weight substrate or an adhesive sheet material is pasted, and the convex portion 3024 of the thick film 3022 of the convex portion side electrode portion 3002 is attached to the weight substrate, and then the adhesive is applied. There is a method in which the weight substrate and the convex portion 3024 are firmly bonded by curing. Alternatively, the tip of the convex portion 3024 of the thick film 3022 of the convex portion side electrode portion 3002 is attached to the adhesive liquid, or a sheet material is attached, and the weight substrate is bonded via the adhesive or the adhesive sheet material attached only to the tip portion. Then, there is a method in which the adhesive is cured and the weight substrate and the convex portion 3024 are firmly bonded. Next, the weight substrate in the region other than the weight 3051 attached to the tip of the convex portion 3024 is etched by a photolitho method and an etching method.

Alternatively, the convex part electrode part 3002 on which the thick film 3022 on which the convex part 3024 is formed is aligned with the convex part 3024 formed on the substrate having the adhesive layer 3054 sandwiched in advance. A weight 3051 is attached to the tip of 3024. At this time, an adhesive is applied to the tip of the convex part 3024 or the upper part of the weight part 3051 to attach the weight 3051 to the tip part of the convex part 3024. Thereafter, the weight 3051 can be formed at the tip of the convex portion 3024 by removing the adhesion between the adhesive layer and the weight portion 3051. For example, the adhesive between the weight part 3051 and the convex part 3024 is a thermosetting adhesive, and its curing temperature is T1. The adhesive layer is a thermoplastic adhesive, and the softening temperature thereof, that is, the glass transition point Tg is higher than T1 (T1 <Tg). When heat treatment is performed between T1 and Tg, the weight portion 3051 and the convex portion 3024 are completely fixed. Thereafter, when the heat treatment is performed at Tg or more, the adhesive layer is softened, so that the weight portion 3051 is separated from the adhesive layer. After that, an insulating film 3028, a conductor film 3023, and the like may be formed.

Alternatively, the tip of the projection 3024 is dipped in a molten metal liquid (for example, solder) and attached, or the tip of the projection 3024 is immersed in a plating solution (for example, a plating solution for silver, solder, or copper). Then, a method of plating metal may be used. Further, when the weight 3052 is attached to the insulating film 3027 at the tip of the convex portion 3024, the same method as described above can be used. These weights 3051 and 305302 may be any material having a specific gravity heavier than that of the thick film 3022 serving as a cantilever. If it is a metal such as iron (specific gravity 7.9), platinum (specific gravity 21.4), etc., it will be a sufficient weight. Thereafter, extraction electrodes on the convex side and the concave side are prepared.

The lead electrode of the recess-side electrode portion 3001 is exposed to the underlying conductor film 3015 if the insulating film 3016 is removed using, for example, a photolithography method and an etching method of the insulating film 3016 in the region where the recess is not formed. An electrode / wiring may be formed thereon. In order to etch the insulating film 3016, the convex portion side electrode portion 3002 is attached to the concave portion side electrode portion 3001, and then the substrate 3021 and the thick film 3022 of the convex portion side electrode portion 3002 and various films thereon are removed. May be. (In this case, it is desirable to remove the conductor film 3015 on the thick film 3022 in this region during patterning of the conductor film 3015.) Alternatively, the convex part electrode part 3002 is attached to the concave part electrode part 3001. Prior to this, the substrate 3021 and the thick film 3022 in this region and various films thereon may be removed.

The lead electrode of the convex portion side electrode portion 3002 can be formed in the same manner as the lead electrode of the concave portion side electrode portion 3001. However, it should be noted that in this case, the lead-out electrode and the convex-side lead-out electrode of the concave-side electrode portion 3002 are formed on opposite sides. In order to form the extraction electrode only on one side, for example, the following is performed. After the convex portion side electrode portion 3002 is attached to the concave portion side electrode portion 3001 and the acceleration sensor is formed (that is, the convex portion 3024 is put in the concave portion 3017 and the concave portion or the convex portion is in close contact to make the concave space airtight. After that, the substrate 3021 is removed by wet etching or dry etching in the electrode portion formation region. Next, the thick film 3022 is removed. Further, the insulating film 3028 stacked thereon is removed (if any). Next, the conductor film 3023 stacked thereon is removed by etching, and the insulating film 3027 and the adhesive layer 3026 thereon are also removed (if any). Next, when the insulating film 3016 is removed by using a photolithography method and an etching method of the insulating film 3016, a contact hole is formed and the conductor film 3015 is exposed. This can be used as a pad region for wire bonding, and an electrode / wiring layer can be further formed in the contact hole. Note that the photolithographic method for forming the contact pattern may be performed after the conductor film 3023 is removed. Further, if the conductor film 3023 has already been removed by etching when forming the convex portion side electrode portion 3002, patterning for forming a contact hole can be performed before the substrate 3021 is etched. This is possible even before the film 3022 is etched.

On the other hand, the lead electrode from the conductor film 3023 of the convex portion side electrode portion 3002 first removes the substrate 3021 in this region by wet etching or dry etching. Next, the thick film 3022 is removed. After that, when the insulating film 3028 is removed using a photolithography method and an etching method of the insulating film 3028, a contact hole is formed and the conductor film 3023 is exposed. This can be used as a pad region for wire bonding, and an electrode / wiring layer can be further formed in the contact hole. Note that patterning for forming a contact hole can be performed before the substrate 3021 is etched, and can be performed before the subsequent thick film 3022 is etched. As described above, both lead-out electrodes can be formed on the convex portion side electrode portion 3002 side. Similarly, both extraction electrodes can be formed on the concave electrode portion 3001 side.

Next, a method for producing a convex electrode using an imprint method will be described. As shown in FIG. 32A, a mold 3131 having a concave portion 3132 for forming a convex electrode pattern and a substrate 3141 to which a weight material 3133 is attached are prepared. A convex pattern 3142 that can enter the concave portion 3122 of the mold 3131 is formed on the substrate 3141, and a weight material 3133 is attached to the tip of the convex pattern 3142 via an adhesive layer 3143. The weight material is a material as described above having a specific gravity larger than that of the material constituting the convex electrode portion, but a material having a lower melting point (or softening point) than the material of the mold 3131 is desirable. For example, the mold material is quartz (melting point about 1600 ° C.) or silicon (melting point about 1410 ° C.), and the weight material is lead (melting point about 330 ° C.), aluminum (melting point about 660 ° C.), silver (about 962 ° C.), zinc ( About 420 ° C.), tin (about 232 ° C.), various solders and various alloys. The substrate 3142 and the convex pattern 3142 are quartz, a silicon substrate, stainless steel, and various metal materials. Alternatively, a polymer material or a ceramic material may be used. The adhesive layer 3143 may be various adhesives, but is preferably a heat softening adhesive. The softening point of the thermosoftening adhesive is preferably lower than the substrate 3141 and the convex member 3142. A lower softening point is better from the viewpoint of energy and workability. Alternatively, the weight material 3133 may be melted without using the adhesive layer 3143 and directly attached to the upper surface of the convex pattern 3142. Alternatively, in the case where the weight material 3133 is a magnetic material, the substrate 3141 or the convex member 3142 may be provided with an electromagnet to attach the weight material 3133. Alternatively, the weight material 3133 may be electrostatically adsorbed by generating static electricity at the tip of the convex pattern 3142. Alternatively, the weight material 3133 may be vacuum-sucked by providing a vacuum line at the tip of the convex pattern 3142.

Next, the weight material 3133 adhering to the upper surface of the convex pattern 3142 is inserted into the recess 3132 of the mold 3131, the adhesiveness of the adhesive layer 3143 is lost, and the weight material 3133 is placed in the recess 3132 of the mold 3131. Therefore, the size of the weight material 3133 must be smaller than the recess 3132. The alignment of the concave portion 3132 and the convex member 3142 of the mold 3131 and the weight material 3133 attached thereto is accurate if the mold 3131 or the substrate 3141 is a material that transmits alignment light, and is aligned through the mold 3131 or the substrate 3141. Good alignment is possible. In addition, as a method for eliminating the adhesiveness of the adhesive layer 3143, when the adhesive layer 3143 is a heat softening adhesive, the temperature may be made higher than the softening point to weaken the adhesiveness. The weight material 3133 may be melted and dropped into the recess 3132. After the weight material 3133 is disposed in the recess 3132, the weight material 3133 is melted at a temperature equal to or higher than the melting point of the weight, and the weight material is attached to the bottom of the recess 3132. {FIG. 32 (c)}

Next, the mold 3131 is pressed against the liquid film or gel film of the thick film 3112 formed on the substrate 3111. {FIG. 32 (c), (d)} When the thick film 3112 is a thermosetting material, the thick film 3112 is cured by raising the temperature to a temperature at which the thick film 3112 is cured. Alternatively, in the case where the thick film 3112 is a thermoplastic material, after the temperature is increased to a temperature at which the thick film 3112 is softened (softening point) or higher, the mold 3131 may be pressed in this state. The thick film 3112 is cured. Alternatively, in the case where the thick film 3112 is a photocurable material, light to be cured (for example, ultraviolet rays or X-rays) is irradiated. (At this time, the mold substrate 3131 or the substrate 3111 needs to be formed of a material that transmits the light to be cured.) After the thick film 3112 is cured, the mold 3131 is pulled away, as shown in FIG. The weight material 3133 adheres to the upper surface of the thick film convex portion 3112 (3112-1, 2). Here, the lower part of the thick film convex part 3112 (3112-1, 2) can be side-etched to be easily deformed by acceleration. Alternatively, as shown in FIG. 32F, the remaining film of the thick film 3112 is removed by etching by anisotropic whole surface etching using oxygen plasma. Next, the substrate 3111 under the thick film convex portion 3112 (3112-1, 2) can be side-etched to be easily deformed by acceleration. As described above, the convex portion 3112 (3112-1, 2) to which the weight material 3133 is attached can be manufactured by a very simple process.

FIG. 33A is a diagram showing a structure of a piezoelectric microphone using a recess and a manufacturing method thereof. A recess 4062 is formed in the piezoelectric substrate 4061 by a photolithography method, an etching method, an imprint method, or the like. A conductor film 4063 is formed on the substrate 4061 and on the inner surface of the recess 4062, and necessary conductor film 4063 is patterned. One of the recesses 4062 (4062-2) is a recess that can receive external vibration (also referred to as a vibration passive recess) and is adjacent to the recess 4062 (4062-2). 4062-3) is arranged. The substrate side wall 4061 (4061-1, 2) sandwiched between the recess 4062 (4062-1, 3) and the vibration passive recess 4062 (4062-2) enters the vibration passive recess 4062 (4062-2). It plays the role of a diaphragm that vibrates due to vibration waves. The conductor film 4063 has a part 4064 (4064-1, 2) removed by etching on the upper surface of the substrate side wall 4061 (4061-1, 2), and the conductor on the vibration passive recess 4062 (4062-2) side. The film 4063 (4063-2) is not connected to the conductor film 4063 (4063-1, 3) on the adjacent recess 4062 (4062-1, 3) side. In the other portion of the first surface (upper surface) of the substrate 4061, the conductor film 4063 is formed with necessary wiring and electrodes. An insulating film 4064 is formed over the conductor film 4063. An insulating film 4064 is also formed on 4064 (4064-1, 2) on the substrate side wall 4061 (4061-1, 2) from which the conductor film 4063 has been removed by etching. This insulating film 4064 protects the conductor film 4063 and the recess 4062.

A thin plate 4066 is attached on the insulating film 4064 on the first surface (upper surface) of the substrate 4061, and portions other than the necessary portions are removed. The thin plate 4066 may be removed after the thin plate 4066 is attached to the substrate 4061, or the thin plate 4066 removed in advance may be attached to the substrate 4061. The vibration passive recess 4062 (4062-2) does not cover the thin plate 4066 so that a vibration wave enters from the outside. (However, if a vibration wave enters, it is OK, so there may be a part that covers only a part. For example, the vibration passive recess 4062 (4062-2) is also covered with a thin plate 4066, and only a part of the vibration wave The recess 4062 (4062-1, 3) adjacent to the vibration recess 4062 (4062-2) is covered with a thin plate 4066 (40661-2). This serves to prevent vibration waves from entering from the outside. Therefore, if vibration waves do not enter from the outside, it is not necessary to cover with the thin plate 4066, and a vent hole with the outside can be provided in part. Thereafter, in order to take out the potential change from the conductor film 4063, a contact hole is formed in the insulating film 4064 at a necessary portion to provide an electrode pad, or a conductor film is further formed in the contact hole to form a necessary electrode / Wiring can also be formed. Here, potential change extraction terminals from the conductor film 4063 (4063-1, 2, 3) are a, b, and c as shown in FIG.

The substrate side wall 4061 (4061-1, 2) is vibrated by air vibration (other gas vibration or liquid vibration) that has entered the vibration passive recess 4062 (4062-2). (Substrate sidewall 4061 (4061-1, 2) is thin (depending on the substrate material, about 1 μm to 100 μm), and both sides thereof are space recesses 4062 (4062-1, 2, 3). (4061-1 and 2 are diaphragms.) When the substrate side wall 4061 (4061-1 and 2) vibrates, the substrate side wall 4061 (4061-1 and 2) is a piezoelectric body. Charge is polarized on the side (surface). Therefore, the conductor films 4063 (4063-1) and 4063 (4063-2), or the conductor films 4063 (4063-3) and 4063 (4063) formed on the side surfaces of the substrate side wall 4061 (4061-1, 2). -2). The potential difference is taken out by terminal a and terminal b, and / or the potential difference is taken out by terminal a and terminal. This potential difference changes depending on the magnitude of vibration, and the sign of the potential difference changes depending on the direction of vibration. That is, a device using a recess formed in a direction perpendicular to the substrate surface of the present invention can convert a vibration wave into an electric signal, and a so-called piezoelectric microphone can be manufactured.

33 (c) to 33 (e) are plan views showing a cross-sectional view of the piezoelectric microphone shown in FIG. 33 (a). In FIG. 33 (c), rectangular recesses are arranged in parallel. That is, when viewed three-dimensionally, the rectangular parallelepiped concave portions are arranged in parallel. A substrate side wall 4061 (4061-1, 2) between the concave portions 4062 (4062-1, 2, 3) is a diaphragm. These substrate side walls 4061 (4061-1, 2) have a rectangular parallelepiped shape. A conductor film 4063 is stacked in the recesses 4062 (4062-1, 2 and 3) and on the upper surface of the substrate 4061. It is patterned above and divided into conductor films 4063 (4063-1, 2 and 3), and terminals a, b and c are connected to each other. The substrate side wall 4061 (4061-1, 2) is formed with the same width and the same depth, and the concave portion 4062 (4062-1, 3) is held at the same pressure. It vibrates in the same way with the introduced vibration wave. Therefore, since the generated charges are the same, the terminals a and c may be connected. As can be seen from FIG. 33 (c), since the conductive film 4063 is not patterned in the recess, the process can be performed by a normal photolithography method and etching method.

FIG. 33 (e) is a diagram showing another planar shape. A cylindrical substrate side wall 4061 (4061-1) surrounds a cylindrical vibration passive recess 4062 (4062-2), and these are further cylindrically shaped. The concave portion 4062 (4062-1) is surrounded. The conductor film 4063 (4063-1) covers the cylindrical recess 4062 (4062-1), and the conductor film 4063 (4063-2) covers the cylindrical recess 4062 (4062-2). These conductor films 4063 (4063-1, 2) are cut at the upper part of the substrate side wall 4061 (4061-1) sandwiched between the recesses 4062-1 and 4062-2 and are not connected. Terminals a and b are connected to these conductor films 4063 (4063-1 and 2). The recess 4062-1 is covered with a thin plate, but the recess 4062-2 is not covered with a thin plate. In this embodiment, when the vibration wave enters the vibration passive recess 4062 (4062-2), the entire cylindrical substrate side wall 4061-1 vibrates, and the conductor film electrode 4063 on both side surfaces of the substrate side wall 4061-1. A potential difference is generated between 1 and 4063-2 (between terminals a and b), and this potential difference changes corresponding to the vibration waveform. In this way, a microphone with a cylindrical recess (that is, a device that converts vibration waves into potential changes) deforms the entire side wall of the substrate uniformly, so it is very efficient and produces a microphone element with a small area. it can. As a similar embodiment, a microphone having an elliptical recess is a microphone element having similar characteristics. Further, a microphone element having a concave portion and a substrate side wall having an arbitrary curved surface, particularly a curved surface capable of faithfully transmitting a vibration wave to the vibration of the substrate side wall may be used.

FIG. 33 (d) is a diagram showing a microphone element having another shape. That is, the vibration passive concave portion 4062 (4062-2) having a rectangular shape (square or rectangular) is further surrounded by a rectangular shape (square or rectangular) concave portion 4062 (4062-1). There are four side walls 4061 4061 (4061-1, 2, 3, 4). These four substrate side walls 4061 (4061-1, 2, 3, 4) serve as diaphragms. A conductor film 4063 (4063-2) is formed on the side surface of the substrate recess 4062 (4062-2), that is, the side surface of the substrate side wall 4061 (4061-1, 2, 3, 4) on the substrate recess 4062 (4062-2) side. It is formed continuously. On the other hand, the conductor film 4063 (4063-1) is formed on the side surface of the substrate recess 4062 (4062-1) and the side surface of the substrate side wall 4061 (4061-1, 2, 3, 4) on the substrate recess 4062 (4062-1) side. Are formed continuously. These conductor films 4063 (4063-1, 2) are put on top of the substrate side wall 4061 (4061-1, 2, 3, 4), and the conductor films 4063 (4063-1) and 4063 (4063-2). ) Is not connected. Terminals a and b are connected to the conductor films 4063 (4063-1) and 4063 (4063-2), respectively. When a vibration wave enters the vibration passive recess 4062 (4062-2), the substrate side walls 4061 (4061-1, 2, 3, 4) vibrate in the same manner, and corresponding to this vibration, between the terminals a and b. A potential difference is generated in this, and this potential difference changes. In the embodiment shown in FIG. 33 (d), since all of the rectangular side walls of the substrate are used, an efficient and small microphone element can be manufactured. In addition to the shapes described in FIGS. 33 (c) to 33 (e), the microphone element of the present invention can also be manufactured in a polygonal shape or the like.

FIG. 33B is a diagram showing a structure and a manufacturing method of a microphone element in which a piezoelectric film is formed using a substrate that is not a piezoelectric substrate. Concave portions 4072 (4072-1, 2, 3) are formed in a substrate 4071 that is not a piezoelectric substrate. The recess 4072 (4072-2) is a vibration passive recess. Substrate side walls 4071 (4071-1, 2) are formed between the recesses 4072 (4072-1, 3) and the vibration passive recesses 4072 (4072-2). When a vibration wave enters the vibration passive recess 4072 (4072-2), the substrate side wall 4071 (4071-1, 2) vibrates. Next, an insulating film 4073 is formed on the surface (first surface) of the substrate 4071 (including the inner surface of the recess 4072). When the substrate 4071 is an insulator, this insulating film is not necessarily formed. Next, a conductor film 4074 is formed over the insulating film 4073, and the conductor film 4074 is cut at 4075 (4075-1, 2) on the substrate side wall 4071 (4071-1, 2). At this time, necessary wiring patterning can be performed even on a flat portion (a portion other than the concave portion 4072) of the first surface of the substrate 4071. The conductor film 4074 can be cut by ordinary photolithography and etching of the conductor film because there is no patterning in the recesses. When patterning in the recess, the electrodeposition resist method, the photosensitive film plasma polymerization method, the photosensitive dry film method, the photosensitive film sputtering method, and other methods can be used. Note that the conductor film 4074 can be cut by a laser.

Next, a piezoelectric film 4076 is formed on the conductor film 4074. The piezoelectric film 4076 is also formed on the portion from which the conductor film 4074 is removed, but there is no particular problem because the piezoelectric film 4076 basically has insulating properties. The materials, manufacturing methods, manufacturing conditions, and the like of the insulating film 4073, the conductor film 4074, and the piezoelectric film 4076 are as described above. For example, the conductor film 4074 includes platinum (Pt), titanium (Ti), copper (Cu), gold (Au), nickel (Ni), chromium (Cr), iron (Fe), aluminum (Al), cobalt ( Co), palladium (Pd), tin (Sn), zinc (Zn), silver (Ag), and other metal films, alloys thereof, or oxide conductor films (ZnOx, InxOy, SnOx, GaxOy, CuAlxOy, CuGaxOy, CuInxOy, CuFexOy, NiOx, IrOx, SbSnxOy, InSnxOy, etc.), carbon-based conductive films such as graphene conductive films and carbon-based nanotube conductive films, conductive polymers, conductive polycrystalline silicon, conductive amorphous silicon, and the like. The piezoelectric film 4076, for example PZT, LiTaO3, LiNbO3, La3Ga5SiO14, Li2B4O7, ZnO, GaPO4, PbPO3, BaTiO3, GaTiO3, KNbO3, LiTaO3, NaxWO3, BaNaNb5O5, Pb2KNb5O15, GaPO4, La3Ga5SiO14, Al 2 SiO 4 (F, OH ) ₂ , AlPO ₄ , KNaC ₄ H ₄ O ₆ , Al ₂ SiO ₄ (F, OH) ₂ , oxide-based piezoelectric films such as apatite, and piezoelectric polymers such as AlN, GaAs, and PVDF (polyvinylidene fluoride) There is.

A conductor film 4077 is formed over the piezoelectric body 4076, and necessary portions are removed by etching. For example, etching is removed at 4078 (4078-1, 2) on the substrate side wall 4071 (4071-1, 2) or a flat portion (a portion other than the recess 4072) of the first surface of the substrate 4071. The conductor film 4074 can be cut by a laser. Thus, the patterning of the conductor film 4071 does not have to be performed in the recess, and can be performed by a normal photolithography method and an etching method. When patterning of the conductor film 4071 is performed in the recess, it can be performed by an electrodeposition resist method, a photosensitive film plasma polymerization method, a photosensitive dry film method, a photosensitive film sputtering method, or other methods. Next, an insulating film 4079 is formed. Thereafter, the thin plate 4081 is attached on the first surface of the substrate 4071. After removing unnecessary portions of the thin plate 4081, contact holes for extracting voltage from the conductor film 4074 and the conductor film 4077 are formed, and if necessary, electrode / wiring layers are formed. The conductor film 4074 (4074-1, 2, 3) serves as a lower electrode of the piezoelectric film 4076, and the conductor film 4077 (40777-1, 2, 3) serves as an upper electrode of the piezoelectric film 4076.

Since a vibration wave is introduced into the vibration passive recess 4072 (4072-2), it is not covered with the thin plate 4081. (Of course, if a vibration wave enters, there is no problem in covering a part of the vibration passive recess 4072 (4072-2) with the thin plate 4081. For example, a case where a vibration introducing passage is provided in the thin plate). -1, 3) is covered with a thin plate 4081 (4081-1, 408). Since the concave portion 4072 (4072-1, 3) is a reference for the vibration passive concave portion 4072 (4072-2), in order to prevent the vibration wave from entering the concave portion 4072 (4072-1, 3), The thin plate 4081 (4081-1, 2) covers the recess 4072 (4072-1, 3). Therefore, if the vibration wave does not enter the recess 4072 (4072-1, 3), the thin plate 4081 (4081-1, 2) may be partially open, or the thin plate 4081 (4081-1, 2). ) May not cover the recesses 4072 (4072-1, 3). That is, the pressure in the concave portion 4072 (4072-1, 3) is changed as little as possible by the pressure in the vibration passive concave portion 4072 (4072-2).

When a vibration wave enters the vibration passive recess 4072 (4072-2), the pressure in the vibration passive recess 4072 (4072-2) (or the liquid pressure when the liquid is in the vibration passive recess 4072 (4072-2)). ) Varies, the substrate side wall 4071 (4071-1, 3) is displaced. When the substrate side wall 4071 (4071-1, 3) is displaced, the piezoelectric film 4076 formed on the substrate side wall 4071 (4071-1, 3) is also displaced. When the piezoelectric film 4076 is displaced, charges are polarized on the surface of the piezoelectric film 4076. As a result, a potential difference (voltage) is generated between the conductor film 4074 (lower electrode) and the conductor film 4077 (upper electrode) formed on both sides of the piezoelectric film 4076. For example, between the terminal a1 connected to the conductor film 4074 (4074-1) and the terminal a2 connected to the conductor film 4077 (4077-1), or the conductor film 4074 (4074-2). Between the terminal b1 connected to the terminal b2 and the terminal b2 connected to the conductor film 4077 (4077-2) or the end c1 connected to the conductor film 4074 (4074-3) and the conductor film A potential difference (voltage) is generated between the terminal c2 connected to 4077 (4077-3). The directions of the generated charges are the same in a1, b2, and c1, and a2, b1, and b2 are in the same direction. Therefore, the potential difference (voltage) that combines them can be detected, so that the detection sensitivity can be improved.

Thus, a microphone device can be manufactured by using various substrates and forming a piezoelectric film on the substrate without using a piezoelectric substrate. For example, when the substrate is a silicon substrate, it can be mounted together with elements such as an IC, a transistor, a resistor, and a capacitor. As a result, for example, the microphone device of the present invention and a calculation IC for calculating the potential generated by the microphone device into a waveform or converting it into sound can be mounted in one chip. Therefore, in the past, those devices that had to be mounted on two separate chips can be mounted on one chip, so the mounting area is greatly reduced, and it is not necessary to connect the two chips by wire bonding, A great advantage can be obtained, for example, that the conductor film used for the IC and the conductor film used for the microphone element can be used together, or that the connection is facilitated, and that the reliability is improved by wiring connection within one chip. Also, in this case, various shapes as shown in FIGS. 33C to 33E can be used as the planar shape.

As described above, the vibration passive recess shown in FIG. 33 can be formed on the back surface (second surface), and the recess surrounding the periphery can be formed on the front surface (first surface). In this case, if the vibration wave can be introduced only on the second surface side and the vibration wave cannot be introduced on the first surface side, there is no need to provide a thin plate, and a conductor is provided between the recess and the vibration passive recess. Since there is no need to cut the film, patterning becomes very simple. In addition, as described above, the microphone device shown in FIG. 33 can also be manufactured using a recess (that is, a through groove) penetrating from the first surface of the substrate to the second surface. For example, a second thin plate is attached to the back surface of the substrate, a through groove is formed, and then a microphone element is manufactured by the process shown in FIG. Alternatively, after the through groove is formed on the substrate, the second thin plate is attached, and then the microphone element is manufactured by the process shown in FIG. In addition, a microphone can be manufactured by forming a polymer on a substrate and forming a recess (or a through groove) in the polymer. This method is useful when, for example, as described above, another device and the microphone element of the present invention are manufactured on the same substrate. In this case, the microphone element can be manufactured by softening the polymer or forming a recess using an imprint method in a liquid or gel state. In this case, if the concave portion for arranging the microphone element is formed in the substrate, and the concave portion for the microphone element is formed in the concave portion by embedding with the polymer, the level of the surface of the microphone element and the surface of the substrate can be substantially the same. Therefore, the conductor film used for the microphone element can be used also as the conductor film in the other substrate, and connection is facilitated even when not used (the step of the connection wiring is reduced or the connection is made by wire bonding). In this case, the step becomes smaller).

The microphone device shown above uses a substrate sidewall sandwiched by a recess formed from the first surface of the substrate toward the second surface side or a through groove penetrating from the first surface of the substrate to the second surface side, Although it converts external vibration waves into electrical signals, it can also function as a speaker if viewed in reverse. For example, if an electrical signal is applied to the upper and lower electrodes (conductor film) sandwiching the piezoelectric film, or the upper and lower electrodes (conductor film) sandwiching the piezoelectric substrate, the piezoelectric film vibrates and the substrate sidewalls accordingly. Vibrates, or the piezoelectric substrate generates vibration waves such as a vibrator and sound in the vibration passive recess. If this vibration wave is emitted outside, it becomes a speaker. Therefore, the present invention can function as an acoustic transducer that can be a microphone or a speaker. Moreover, it can be used as a sound generating element and a sound buzzer in addition to the speaker. In particular, it is very small and can be manufactured inexpensively.

FIG. 34 is a diagram showing a heat exchanger to which the present invention is applied. FIG. 34A is a plan view parallel to the substrate surface of the substrate 4083. As shown in FIG. 34A, a heat medium flow path 4088 (4088-1, 4088-2) is formed in the substrate 4083, and heat exchange is performed with the substrate side wall 4083 (40883-2, 3, 4, 5) interposed therebetween. A medium flow path 4086 (4086-1, 4086-2, 4086-3) is arranged. The heat medium 4095 enters from the medium port 4091 (4091-1, 4091-3) which is the entrance of the heat medium flow path 4088 (4088-1, 4088-2), and the heat medium flow path 4088 (4088-1, 4088-2). ) Exits from the medium port 4091 (4091-4, 4091-6) which is the exit of the above. On the other hand, in the heat exchange medium 4096, the entrance of the medium port 4091 (4091-2, 4086-1 and 4086-3) which is the entrance of the heat exchange medium flow path 4086 (4086-1, 4086-2, 4086-3) should not be described. Medium inlet 4091 (the inlets of 4091-5, 4086-1 and 4086-3 are not shown) which is the outlet of the heat exchange medium flow path 4086 (4086-1, 4086-2, 4086-3) Go out from.

FIG. 34B is a cross-sectional view perpendicular to the substrate surface at A1-A2 in the plan view 34A. A first recess (or first through groove) 4088 (4088-1, 2) and a second recess (or second through groove) 4086 (4086-1, 2, 3) in the substrate 4083 in a direction perpendicular to the substrate surface. ) Is formed. A substrate sidewall 4083 (2, 3, 4, 5) is formed between the first recess 4088 and the second recess 4086, and separates the first recess 4088 and the second recess 4086. The first recess 4088 is a heat medium flow path, and the second recess 4086 is a heat exchange medium flow path 4086. A thin plate 4084 is attached to the first surface of the substrate 4083, which is the opening side of the first recess 4088 and the second recess 4086, and covers the openings of the first recess 4088 and the second recess 4086. When the first recess 4088 and the second recess 4086 penetrate through the second surface of the substrate 4083, the thin plate 4084 adheres to the second surface of the substrate 4083, and the through holes of the first recess 4088 and the second recess 4086 pass through. It is blocking.

Since the substrate side wall 4083 (2, 3, 4, 5) separating the heat medium flow path 4088 and the heat exchange medium flow path 4086 is very thin (1 μm to 100 μm), the heat medium flowing through the heat medium flow path 4088 The heat of 4095 is quickly transferred to the heat exchange medium 4096 flowing (entering) through the heat exchange medium flow path 4086 through the substrate side wall 4083 (2, 3, 4, 5). As can be seen from FIG. 34 (a), the heat medium flow path 4088 flows in a thin and winding manner, the heat exchange medium 4096 surrounds the heat medium flow path 4088, and the contact area between the heat medium flow path 4088 and the heat exchange medium flow path 4086. Is very large, the heat of the heat medium 4095 is transferred to the heat exchange medium 4096 particularly quickly. When the substrate 4083 is a good thermal conductor, heat moves more quickly. For example, the substrate 4083 is carbon (including carbon nanotubes, fullerenes, and the like), aluminum nitride (AlN), metal (for example, silver, gold, copper, and aluminum), and a semiconductor substrate (for example, silicon).

The heat medium 4095 enters the heat medium flow path 4088 from the conduits 4089-1 and 4089-2 connected to the inlets (medium ports) 4091-1 and 4091-3 opened to the thin plate 4084, and after the heat exchange, the outlet (medium port) 4091-4 and 4091-6 are exited, heat is exchanged outside the exchanger, and then returned to the conduits 4089-1 and 4089-2 for circulation. (There is also a case of one-way without circulation.) The heat exchange medium 4096 enters the heat exchange medium flow path 4086 from the conduit 4087 connected to the inlet 4091-2 opened in the thin plate 4084, and after the heat exchange, the outlet 4091-5 The heat is exchanged outside the exchanger, and heat is exchanged outside the exchanger to be returned to the conduit 4087 for circulation. (There is a case of one-way without circulation.) The heat medium 4095 is a gas, liquid, or a coexistence medium of gas and liquid. For example, the medium evaporates from an external heat source such as a heat pipe to become a gas. A series of phase changes in which the gas enters the heat medium flow path 4088, exchanges heat, condenses, becomes a liquid, and exits from the outlet can be continuously generated, so that heat transfer can be performed quickly. The heat exchange medium 4096 is also a gas, liquid, or a coexistence medium of gas and liquid, which can also adopt the heat pipe method, enters the heat exchange medium flow path 4086 with the cooled liquid, and enters the heat exchange medium flow path 4086 with the heat medium. A series of phase changes in which heat is evaporated from 4095 to evaporate into a gas and exit from the outlet to the outside can be continuously generated, so that heat transfer can be performed quickly. As described above, since the present invention can be applied to a semiconductor process, a very fine capillary-like flow path can be formed, and a free curved flow path can be formed, so that highly efficient heat transfer can be performed. . For example, it is possible to maintain the body temperature at a constant temperature by circulating the blood of a patient whose body temperature is difficult to control using this system. In addition, this heat exchange system can be manufactured by a very simple process and can be manufactured by a very small chip, so that it can be manufactured in large quantities and at a low cost. The manufacturing method is the same as before.

FIG. 35 is a diagram showing a method of forming a concave pattern of the present invention using an imprint method. The part which overlaps with description so far is abbreviate | omitted as much as possible. As shown in FIG. 35A, a polymer layer 712 is formed on the first substrate 711. The polymer in this embodiment is heat softening (thermoplastic). The polymer layer 712 is formed by dropping a solution in which a polymer is dissolved in a solvent onto the first substrate 711 (drop method) or by spin-coating a solution in which the polymer is dissolved in a solvent on the first substrate ( It is formed on the first substrate 711 by a coating method such as a spin coating method. Thereafter, as shown in FIG. 35 (b), a mold 713 having a concave (second concave) pattern is inserted into the polymer layer 712, and then heat-treated at a temperature higher than the softening temperature to completely evaporate the solvent. Softens or melts. Prior to inserting the mold 713 into the polymer layer 712, the polymer layer 712 may be pre-baked. When the polymer is a thermoplastic polymer, the solvent may be completely evaporated, and the mold 713 may be inserted after the polymer layer is softened or melted by heat treatment at a softening temperature or higher. When the polymer is pasty, the polymer layer 712 may be formed on the first substrate 711 by a screen printing method, and the mold 713 may be inserted into the pasty polymer layer 712. Alternatively, a polymer sheet is attached on the first substrate 711 and heat-treated at a softening temperature or higher to soften or melt the polymer layer to form the polymer layer 712 on the first substrate 711, and the softened or melted polymer layer 712 A mold 713 may be inserted into the.

After the mold 713 is inserted into the polymer layer 712, the first substrate 711 is separated from the polymer layer 712 by performing a heat treatment at a temperature higher than the softening temperature to soften or melt the polymer layer. Alternatively, after the polymer layer is softened or melted, the polymer layer 712 is solidified at a temperature equal to or lower than the softening temperature, and then the first substrate 711 is separated. Next, heat treatment is performed at a temperature equal to or higher than the softening temperature of the polymer layer 712, the polymer layer 712 adhering to the mold 713 is softened or melted, and the mold 715 for forming the first recess is moved downward from above {FIG. )}, The mold 715 is inserted into the polymer layer 712. At this time, as shown in FIG. 35 (d), the convex portions 715 (715-1, 2) of the mold 715 are inserted into the concave portions 714 (714-1, 2) of the mold 713, and the concave portions 716 ( The convex part 713 (713-1, 2) of the mold 713 is inserted into 716-1, 2). The molds 713 and 716 are fixed at predetermined positions and held below the softening temperature to solidify the polymer 712 and determine the shape of the polymer 612. Thereafter, since the molds 713 and 715 are separated from the polymer layer 712, the convex portions 715-1 and 715-2 of the mold 715 are concave portions (first concave portions) on the main surface (first surface, surface) side of the polymer layer 712. Thus, the convex portions 713-1 and 713-2 of the mold 713 become concave portions (second concave portions) on the sub-surface (second surface, back surface) side of the polymer layer 712.

Therefore. Since the substrate side walls 712-S1, 712-S2, 712-S3 between the convex portions 713 (713-1, 2) of the mold 713 and the convex portions 715 (715-1, 2) of the mold 715 are diaphragms, Side wall thickness (distance between convex part of mold 713 and convex part of mold 715) s1, s2, etc. Depth (length) of substrate side wall (over-depth direction of convex part of mold 713 and convex part of mold 715) It is desirable to make the width of the wrap portion h1 and the substrate side wall (not shown in the overlapping portion of the convex portion 713 of the mold 713 and the convex portion 715 of the mold 715 in the direction perpendicular to the paper surface) as constant as possible. That is, it is necessary to insert the pattern of the mold 715 as accurately as possible with respect to the pattern of the mold 713. It is desirable to align using light that is transmitted through the polymer layer 712 and mold 715. It is also important to align so that s1 = S2. Further, in order to make h1 constant, the distance t1 between the convex portion (for example, 713-1) of the mold 713 and the concave portion (for example, 716-1) of the mold 715 or the convex portion (for example, 715-1) of the mold 715. Since the distance b1 between the recesses (for example, 714-1) of the mold 713 needs to be as constant as possible, the insertion depth of the mold 715 is made constant with respect to the mold 713. In addition, as for the current alignment accuracy, the accuracy of s1 and s2 is 50 nm to 300 nm with a variation 3σ, and the accuracy of t1 and b1 is 3σ 100 nm to 500 nm with a variation, so a highly accurate diaphragm can be manufactured. (The thickness of the polymer layer is about 1 μm to 2000 μm, and the width of the recess is about 1 μm to 3000 μm. The thickness and width may be larger.)

After the polymer layer 712 is solidified, the mold 715 is separated from the polymer layer 712. A mold release agent may be applied to the surface of the mold 715 so that the mold 715 can be easily separated from the polymer layer 712. Even when the mold 715 is separated, the polymer layer 712 is supported by the mold 713 and thus does not deform. Thereafter, various films can be laminated using various processes described so far, and a desired laminated film structure can be obtained by etching. For example, again, when the polymer layer 712 is a piezoelectric body, the first concave portion 720 (720-1, 2) that is the trace of the convex portion 715 (715-1, 2) of the mold 715 is formed. A conductor film 717 is laminated on the polymer layer 712, and the desired patterning of the conductor film 717 is performed. Then, an insulating film 718 is laminated to protect the conductor film 717, and further, a desired film of the insulating film 717 is formed. Patterning is performed. Thereafter, a first thin plate 719 is attached. The shape of the first recesses 720-1 and 720-2 can be fixed by the thin plate 719. (Fig. 35 (e))

Thereafter, the mold 713 is separated. In order to smoothly separate the mold 713, a mold release agent may be applied to the surface of the mold 713 before the mold 713 is inserted into the polymer layer 712. Even when the mold 713 is separated, the polymer layer 712 is supported by the first thin plate 719 and thus does not deform. Thereafter, a conductor film 721 is laminated on the polymer layer 712 on which the first recesses 724 (724-1, 2), which are traces of the projections 713 (713-1, 2) of the mold 713, are formed. The desired patterning of the body film 721 is performed, and then the insulating film 722 is stacked to protect the conductor film 721, and further the desired patterning of the insulating film 722 is performed. Thereafter, a second thin plate 725 is attached. The shape of the second recesses 724-1 and 724-2 can be fixed by the thin plate 725. (FIG. 35 (f)) Although not described in FIG. 35, an extraction electrode, a pressure transmission hole, and the like from the conductor film can be produced as described elsewhere. As described above, a pressure sensor using a polymer as a substrate side wall can be manufactured from both sides of a polymer layer by a simple process and can be miniaturized. As a result, a large number of sensors can be manufactured in the substrate, so that a sensor with a very low cost can be realized.

In FIG. 35, the substrate has been described as the piezoelectric substrate for FIG. 35 (e) and thereafter, but as described in various places so far, even in the case of a polymer other than the piezoelectric polymer, the first recess and / or the first substrate is used. (2) A pressure sensor can be produced by laminating a first conductor film on a polymer on the concave side, a piezoelectric film thereon, and a second conductor film thereon. Further, as shown in FIG. 35G, the counter electrode conductor film 717 is formed on the side wall of the first recess 720 (720-1, 2) and / or the second recess 724 (724-1, 2) in the polymer 712. (717-1, 2, 3), 721 (721-1, 2, 3) can be formed to produce a capacitive pressure sensor. That is, a capacitive pressure sensor having the first recess 720-1 as a capacitive space and 717-1 and 717-2 as its counter electrode, and the first recess 720-2 as a capacitive space, 717-2 and 717- 3 is a capacitive pressure sensor using the counter electrode as a counter electrode, and the second concave portion 724-1 is a capacitive space, and the capacitive pressure sensor 721-1 and 721-2 is the counter electrode thereof. -2 is a capacitive space, and a capacitive pressure sensor having 721-2 and 721-3 as its counter electrode can be produced. Furthermore, using such an imprint method, in addition to the pressure sensor, the acoustic transducer, pump device, ink jet device, acceleration sensor, piezoelectric microphone, and the like described so far can be manufactured.

In FIG. 35, the first substrate 711 which is a flat substrate is used as a starting substrate, but a mold may be used as the starting substrate. That is, it can start from the state shown in FIG. A solution polymer 712 may be coated on a mold 713 having a concavo-convex pattern by a dipping method, a dropping method, a coating method, a spin coating method, or the like, and a mold 715 having a concavo-convex pattern may be inserted there. When the polymer does not enter the concave portion of the mold 713, the solution polymer 712 can be coated in a vacuum state. In this state, heat treatment is performed at a temperature equal to or higher than the softening temperature of the polymer to evaporate the solvent and soften or melt the polymer to form the polymer on the mold 713, and then the mold 715 can be inserted. If the polymer sheet is placed on a mold having a concavo-convex pattern and heat treatment is performed at a temperature higher than the softening temperature of the polymer, the polymer sheet softens or melts and enters the concave portion on the mold by gravity and fills the mold and flattenes. Formed close to. If a mold 715 having a concavo-convex pattern is inserted after becoming flat, a polymer side wall can be formed. Alternatively, even when the mold 715 is inserted while the polymer sheet is softened or melted, the polymer side wall can be similarly formed. As described above, since the polymer pattern can be formed using only the molds 713 and 715 without using the first substrate 711, the process is further simplified.

Thermoplastic polymers are fluororesin film, polyethylene film, PMMA (polymethyl methacrylate), polycarbonate, polystyrene, acrylic resin, ABS resin, vinyl chloride, liquid crystal polymer, polyvinyl alcohol (PVA), polypropylene (PP), polyethylene (PE) , N-methyl-2-pyrrolidone (NMP), acrylic resin (PMMA), polyvinyl acetate, polydimethylsiloxane (PDMS), polylactic acid, various rubbers (natural rubber and synthetic rubber), or polyvinylidene fluoride (PVDF), Various types such as ferroelectric polymers such as vinylidene fluoride-trifluoroethylene (VDF / TrFE) copolymer, piezoelectric polymers such as vinylidene cyanide-vinyl acetate copolymer, polar polymer such as nylon-11, etc. It is a polymer material. Further, a mixture of a plurality of these thermoplastic polymers may be used. In addition to the above polymers, piezoelectric thermoplastic polymers include piezoelectric ceramics (eg, PZT, barium titanate (BaTiO3), lithium niobate (LiNO3), quartz, lead metaniobate (PbNb2O6), zinc oxide, and the like. A mixture of these fine particles of these thermoplastic polymers can also be used.

The microphone device and the capacitive force sensor will be described in more detail. In addition, when the same number as the name number used in the previous figures (FIGS. 1-44) and the name numbers used in the following figures (FIGS. 45-89) is used, Please note that the name is correct.
FIG. 68 shows a conventional microphone using a semiconductor substrate. A conventional microphone 100 shown in FIG. 68 forms a recess 102 in a silicon substrate 101 to form a diaphragm 102, a gap 109, and a back plate 103, and an acoustic hole 104, a lower wiring 105, an upper wiring 106, and a lower pad are formed in the back plate 102. 107, an upper pad 108, and a grounding pad 110 are disposed. As can be seen from FIG. 68, since the diaphragm 102 of the conventional microphone 100 is formed substantially parallel to the substrate surface, the area of the microphone 100 is very large. For example, an area of about 2 mm square is required. (Patent Publication 2002-095093)

Although the present invention is repeated, the side walls sandwiched between adjacent through grooves by forming a plurality of deep grooves (recesses) or through grooves in the thickness direction of a planar substrate (for example, a disk shape or a rectangular plate shape). The present invention relates to a capacitance type sensor that utilizes the fact that the capacitance changes due to deformation due to the pressure difference between the two sides. Specifically, the following measures are taken.

(1) The present invention attaches to a conductor substrate having at least two groove (penetrating groove) spaces penetrating one or both of the upper surface and the lower surface, and the upper surface (first surface) of the conductor substrate. And an insulating substrate (second surface insulating substrate) attached to a lower surface (second surface) of the conductive substrate. Type microphone or force (acceleration, angular velocity, pressure, etc.) sensor,
The conductive substrate that separates two adjacent through grooves (first through groove and second through groove) in the lateral direction (substantially perpendicular to the thickness direction of the conductive substrate) is one electrode (first substrate side wall capacitance). Electrode),
The first substrate side wall capacitor electrode is opposed to one of the adjacent through grooves (first through groove), and the other side wall of the conductive substrate that is not electrically connected to the first substrate side wall capacitor electrode is the other side. Counter electrode (second substrate side wall capacitor electrode), and the first through groove space between the first substrate side wall capacitor electrode and the second substrate side wall capacitor electrode is set as a capacitance space (in the second through groove, the sound wave Alternatively, force (acceleration, angular velocity, pressure, etc.) is introduced) and the first substrate side wall capacitive electrode vibrates and displaces due to the sound wave or force (acceleration, angular velocity, pressure, etc.). It is characterized by detecting sound waves or force (acceleration, angular velocity, pressure, etc.) using a change in capacitance of space, and the upper surface of the first substrate side wall capacitor electrode is a first surface insulator substrate. Adhere to and / or The lower surface of the second substrate side wall capacitor electrode is attached to the second surface insulator substrate and / or the upper surface of the second substrate side wall capacitor electrode is adhered to the first surface insulator substrate, and / or the lower surface thereof is the second surface insulator. A capacitive microphone or a force (acceleration, angular velocity, pressure, etc.) sensor characterized by being attached to a substrate.

(2) The present invention provides a main substrate having at least two groove (penetrating groove) spaces penetrating one or both of the upper surface and the lower surface, and a thin plate attached to the upper surface (first surface) of the main substrate. Capacitance type microphone or force quantity (acceleration, angular velocity, and the like), characterized by comprising a substrate (first surface thin plate) and a thin substrate (second surface thin plate) attached to the lower surface (second surface) of the main substrate Or pressure etc.) sensor,
Conductivity formed on the main substrate side wall (first substrate side wall) that separates two adjacent through grooves (first through groove and second through groove) in the lateral direction (substantially perpendicular to the thickness direction of the main substrate). The body film is one electrode (first substrate side wall capacitor electrode),
A main substrate side wall (second substrate side wall) that faces the first side wall capacitor electrode across one of the adjacent through grooves (first through groove) and is not electrically connected to the first side wall capacitor electrode. The conductive film formed above is used as the other counter electrode (second substrate side wall capacitor electrode), and the first through-groove space between these first substrate side wall capacitor electrode and second substrate side wall capacitor electrode is the capacitance space. age,
The first substrate side wall capacitive electrode is oscillated and displaced by sound waves or force (acceleration, angular velocity, pressure, etc.) to change the capacitance of the first through-groove space, thereby using sound waves or force (acceleration, The first substrate side wall capacitor electrode has an upper surface attached to the first surface insulator substrate and / or a lower surface attached to the second surface insulator substrate. And / or the second substrate side wall capacitor electrode has an upper surface attached to the first surface insulator substrate and / or a lower surface attached to the second surface insulator substrate. A capacitive microphone or a force (acceleration, angular velocity, pressure, etc.) sensor.

(3) In the present invention, in addition to (1) or (2), the thickness of the conductor substrate or the main substrate is 2.0 mm or less, preferably 1.0 mm or less. Alternatively, the thickness of the first surface thin plate is 1.0 mm or less, preferably 0.5 mm or less, and the thickness of the second surface insulator substrate or the second surface thin plate is 1.0 mm or less. .

(4) In addition to (2) or (3), the present invention is characterized in that the main substrate is a semiconductor substrate or an insulator substrate, and the first surface thin plate and / or the second surface thin plate is an insulator substrate. It is characterized by being.

(5) In addition to the above, in the present invention, the second through groove has a substantially rectangular column shape in cross section, and four through grooves adjacent to the four side surfaces of the second through groove are arranged. The two through grooves have a substantially rectangular column shape in cross section, and one of the four through grooves is the first through groove, and the remaining through grooves are the third through groove, the fourth through groove, and the first through groove. 5 through-grooves
The conductive substrate separating the third through-groove and the second through-groove is used as one electrode (3-1 substrate side wall capacitor electrode), and is opposed to the 3-1 substrate side wall capacitor electrode with the third through groove interposed therebetween, The side wall of the conductive substrate that is not electrically connected to the 3-1 substrate side wall capacitor electrode is used as the other counter electrode (third-2 substrate side wall capacitor electrode). The third through groove space between the two substrate side wall capacitor electrodes is defined as a capacitance space,
The conductor substrate that separates the fourth through-groove and the second through-groove is used as one electrode (4-1 substrate side wall capacitor electrode), and is opposed to the 4-1 substrate side wall capacitor electrode across the fourth through groove, The side wall of the conductor substrate that is not electrically connected to the 4-1 substrate side wall capacitor electrode is used as the other counter electrode (4-2 substrate side wall capacitor electrode). The fourth through groove space between the two substrate side wall capacitor electrodes is defined as a capacitance space,
The conductor substrate that separates the fifth through-groove and the second through-groove is used as one electrode (5-1 substrate side wall capacitor electrode), and is opposed to the 5-1 substrate side wall capacitor electrode across the fifth through groove, The side wall of the conductor substrate that is not electrically connected to the 5-1 substrate side wall capacitor electrode is used as the other counter electrode (5-2 substrate side wall capacitor electrode). The fourth through groove space between the two substrate side wall capacitor electrodes is defined as a capacitance space,
(Sound wave or force (acceleration, angular velocity, pressure, etc.) is introduced into the second through groove) The 3-1 substrate side wall capacitor electrode, the 4-1 substrate side wall capacitor electrode, and the 5-1 substrate side wall Capacitance of the third through-groove space, the fourth through-groove space, and the fifth through-groove space when the capacitive electrode is vibrated and displaced by the sound wave or force (acceleration, angular velocity, or pressure). Is used to detect a sound wave or an amount of force (acceleration, angular velocity, pressure, etc.), and further, a 3-1 substrate side wall capacitive electrode, a 4-1 substrate side wall capacitive electrode, and a fifth The one-substrate side wall capacitor electrode has an upper surface attached to the first surface insulator substrate and / or a lower surface attached to the second surface insulator substrate, and / or a third to second substrate side wall capacitor electrode, 4-2 Substrate side wall capacitance electricity And the 5-2 substrate side wall capacitive electrode has an upper surface attached to the first surface insulator substrate and / or a lower surface attached to the second surface insulator substrate. Capacitive microphone or force (acceleration, angular velocity, pressure, etc.) sensor.

(6) In the present invention, in (5), the first through groove, the third through groove, the fourth through groove, and the fifth through groove are connected, and the first substrate side wall capacitor electrode and the 3-1 substrate The sidewall capacitor electrode, the 4-1 substrate sidewall capacitor electrode, and the 5-1 substrate sidewall capacitor electrode are connected, and further the second substrate sidewall capacitor electrode, the 3-2 substrate sidewall capacitor electrode, and the 4-2 substrate. The sidewall capacitor electrode and the 5-2 substrate sidewall capacitor electrode are connected.

(7) In addition to the above, according to the present invention, in the case where the second through groove is covered by the first insulator substrate or the second insulator substrate, the first insulator substrate and / or the second insulator substrate is subjected to sound waves. Or, there must be a sound wave or force (such as acceleration, angular velocity, or pressure) introduction hole and / or a sound wave or force (acceleration, angular velocity, or pressure) introduction hole for introduction of force (acceleration, angular velocity, or pressure). Features.

(8) In addition to the above, the present invention provides an electrode / wiring and a first substrate formed on the first surface insulator substrate through contact holes formed in the first surface insulator substrate attached to the upper surface of the first substrate side wall. The electrode / wiring formed on the first surface insulator substrate through the contact hole formed in the first surface insulator substrate attached to the upper surface of the second substrate side wall and the second substrate side wall are electrically connected to the side wall. It is electrically connected and has a through groove (second through groove) surrounded by the first substrate side wall, and the outer cross-sectional shape of the first substrate side wall is an n-square shape, where n is 3 The plurality of second substrate side walls corresponding to each side surface, and the plurality of second substrate side walls are not electrically connected to each other, and sound waves or force (acceleration, Angular velocity, pressure, etc.) or by the first substrate sidewall. It has an enclosed through groove (second through groove), and at least a part of the outer cross-sectional shape of the first substrate side wall is a curved shape, and the inner cross-sectional shape of the second substrate side wall is the outer cross section of the first substrate side wall. Or a through groove (second through groove) surrounded by the first substrate side wall, and the outer cross-sectional shape of the first substrate side wall is a circular shape or an elliptical shape. The inner cross-sectional shape of the first substrate is similar to the outer cross-sectional shape of the first substrate side wall.

(9) The present invention has a third substrate sidewall that surrounds the first substrate sidewall and the second substrate sidewall, the upper surface of the third substrate sidewall is attached to the first surface insulator substrate, and the lower surface of the third substrate sidewall is The third substrate side wall adheres to the second surface insulator substrate, and the third substrate side wall is not electrically connected to one or both of the first substrate side wall and the second substrate side wall, and the third substrate side wall is a capacitive microphone. Alternatively, force (acceleration, angular velocity, pressure, etc.) is the outer side surface of the sensor device chip package, and the first insulating substrate is a capacitive microphone or force (acceleration, angular velocity, pressure, etc.) sensor device chip package. The upper surface or the lower surface, and the second surface insulator substrate is the lower surface or the upper surface of the capacitive microphone or the chip package of the force sensor (acceleration, angular velocity, pressure, etc.). And wherein the are.

(10) The present invention provides a main substrate having at least two grooves (through grooves or through holes) penetrating the upper surface and the lower surface, and a thin plate substrate (first surface thin plate) attached to the upper surface (first surface) of the main substrate. ) And a thin plate substrate (second surface thin plate) attached to the lower surface (second surface) of the main substrate, and a capacitance type microphone or a force (acceleration, angular velocity, pressure, etc.) sensor There,
On the main substrate side wall (first substrate side wall) (side surface) that separates two adjacent through grooves (first through groove and second through groove) in the lateral direction (substantially perpendicular to the thickness direction of the main substrate) The conductive film formed on the electrode is one electrode (first substrate side wall capacitor electrode),
A main substrate side wall (second substrate) that faces the first substrate side wall capacitor electrode across one of the adjacent through grooves (first through groove) and is not electrically connected to the first substrate side wall capacitor electrode. The conductive film formed on the side surface of the side wall is used as the other counter electrode (second substrate side wall capacitor electrode), and a first through groove space between the first substrate side wall capacitor electrode and the second substrate side wall capacitor electrode is formed. Capacitance space,
The first substrate side wall capacitive electrode is oscillated and displaced by sound waves or force (acceleration, angular velocity, pressure, etc.) to change the capacitance of the first through-groove space, thereby using sound waves or force (acceleration, The first substrate side wall is attached to the first surface thin plate, the lower surface is attached to the second surface thin plate, and / or the second substrate side wall. The substrate side wall has an upper surface attached to the first surface thin plate, and a lower surface attached to the second surface thin plate,
A capacitive microphone or a force (acceleration, angular velocity, pressure, etc.) sensor.

(11) In the present invention, in addition to the above, the main substrate is a conductor substrate, a semiconductor substrate, an insulator substrate, or a composite substrate thereof, and further, the first thin plate is an insulator substrate, and / or Alternatively, the second surface thin plate is an insulator substrate, and the thickness of the main substrate is 2.0 mm or less, preferably 1.0 mm or less, and the thickness of the first surface first surface thin plate is 1.0 mm or less. Preferably, it is 0.5 mm or less, the thickness of the second thin plate is 1.0 mm or less, and further through a contact hole formed in the first surface insulator substrate attached to the upper surface of the first substrate side wall. Electrically connecting electrodes / wirings formed on the first surface insulator substrate and the first substrate side wall;
The electrode / wiring formed on the first surface insulator substrate is electrically connected to the second substrate side wall through a contact hole formed in the first surface insulator substrate attached to the upper surface of the second substrate side wall. To do.

(12) In addition to the above, the present invention has a through groove (second through groove) surrounded by the first substrate side wall, and the outer cross-sectional shape of the first substrate side wall is an n-square shape, where n Is an integer of 3 or more, and has a plurality of second substrate side walls corresponding to each side surface, the plurality of second substrate side walls are not electrically connected to each other, and a sound wave or force ( Acceleration, angular velocity, pressure, etc.), or has a through groove (second through groove) surrounded by the first substrate side wall, and the outer cross-sectional shape of the first substrate side wall is at least one part. Is a curved shape, and the inner cross-sectional shape of the second substrate side wall is similar to the outer cross-sectional shape of the first substrate side wall, or has a through groove (second through groove) surrounded by the first substrate side wall. The outer cross-sectional shape of the first substrate side wall is circular or elliptical. There, the inner cross-sectional shape of the second substrate sidewall is characterized by a shape similar to the outer cross-sectional shape of the first substrate sidewall.

(13) In addition to the above, the present invention has a third substrate side wall surrounding the first substrate side wall and the second substrate side wall, and the upper surface of the third substrate side wall adheres to the first surface insulator substrate, The lower surface of the substrate side wall is attached to the second surface insulator substrate, the third substrate side wall is not electrically connected to one or both of the first substrate side wall and the second substrate side wall, and the third substrate side wall is Capacitance microphone or force (acceleration, angular velocity, pressure, etc.) sensor device becomes the outer side surface of the chip package, and the first insulating substrate is a capacitance microphone or force (acceleration, angular velocity, pressure, etc.) sensor It becomes the upper or lower surface of the chip package of the device, and the second surface insulating substrate is a capacitive microphone or force (acceleration, angular velocity, pressure, etc.) under the chip package of the sensor device Or characterized in that it is the upper surface.

(14) The present invention provides at least two adjacent recesses (first recesses) that open on the first surface (front surface or top surface) of the main substrate and do not open on the second surface (back surface or bottom surface) opposite to the first surface. A capacitive microphone having a thin plate substrate attached to the upper surface (first surface) of the main substrate, or a force (acceleration, angular velocity, pressure, etc.) sensor,
A conductive film formed on the side wall of the main substrate (side surface of the first substrate) that separates two adjacent concave portions in the horizontal direction (substantially perpendicular to the thickness direction of the main substrate) is formed on one electrode (first side). 1 substrate side wall capacitive electrode)
A main substrate side wall (second substrate side wall) that faces the first substrate side wall capacitor electrode across one of the adjacent recesses (first recess) and is not electrically connected to the first substrate side wall capacitor electrode. The conductive film formed on the side surface of the first electrode is used as the other counter electrode (second substrate side wall capacitor electrode), and the first recess space between the first substrate side wall capacitor electrode and the second substrate side wall capacitor electrode is electrostatic capacitance. Space,
The first substrate side wall capacitive electrode vibrates and displaces due to sound waves or force (acceleration, angular velocity, pressure, etc.), and changes in the capacitance of the first recess space make use of sound waves or force (acceleration, angular velocity). , Or pressure, etc.)
Further, the upper surface of the first substrate side wall is attached to the thin plate substrate, and / or the upper surface of the second substrate side wall is attached to the thin plate substrate,
A capacitive microphone or a force (acceleration, angular velocity, pressure, etc.) sensor.

(15) In the present invention, in addition to the above, the main substrate is a conductor substrate, a semiconductor substrate, an insulator substrate, or a composite substrate thereof, and the thickness of the main substrate is 2.0 mm or less, which is preferable. Is 1.0 mm or less, the thickness of the first surface thin plate is 1.0 mm or less, preferably 0.5 mm or less, and the thickness of the second surface thin plate is 1.0 mm or less, Furthermore, the electrode / wiring formed on the first surface insulator substrate is electrically connected to the first substrate side wall through a contact hole formed in the first surface insulator substrate attached to the upper surface of the first substrate sidewall,
The electrode / wiring formed on the first surface insulator substrate is electrically connected to the second substrate side wall through a contact hole formed in the first surface insulator substrate attached to the upper surface of the second substrate side wall. To do.

(16) In addition to the above, the present invention has a through groove (second through groove) surrounded by the first substrate side wall, and the outer cross-sectional shape of the first substrate side wall is an n-square shape, where n Is an integer of 3 or more, and has a plurality of second substrate side walls corresponding to each side surface, the plurality of second substrate side walls are not electrically connected to each other, and a sound wave or force ( Acceleration, angular velocity, pressure, etc.) or a through groove (second through groove) surrounded by the first substrate side wall, and the outer cross-sectional shape of the first substrate side wall is at least one part. Is a curved shape, and the inner cross-sectional shape of the second substrate side wall is similar to the outer cross-sectional shape of the first substrate side wall, or a through groove (second through-hole) surrounded by the first substrate side wall The outer cross-sectional shape of the first substrate side wall is circular or An elliptical shape, the inner cross-sectional shape of the second substrate sidewall is characterized by a shape similar to the outer cross-sectional shape of the first substrate sidewall.

(17) In addition to the above, the present invention includes a third substrate side wall surrounding the first substrate side wall and the second substrate side wall, and the upper surface of the third substrate side wall is attached to the first surface insulator substrate, The lower surface of the substrate side wall is attached to the second surface insulator substrate, the third substrate side wall is not electrically connected to one or both of the first substrate side wall and the second substrate side wall, and the third substrate side wall is Capacitance microphone or force (acceleration, angular velocity, pressure, etc.) sensor device becomes the outer side surface of the chip package, and the first insulating substrate is a capacitance microphone or force (acceleration, angular velocity, pressure, etc.) sensor It becomes the upper or lower surface of the chip package of the device, and the second surface insulating substrate is a capacitive microphone or force (acceleration, angular velocity, pressure, etc.) under the chip package of the sensor device Or characterized in that it is the upper surface.

(18) The present invention provides a thin plate substrate having at least two adjacent recesses (first recess and second recess) opened on the upper surface of an insulating polymer formed on the main substrate, and attached to the upper surface of the main substrate. A capacitive microphone or a force (acceleration, angular velocity, pressure, etc.) sensor having
A conductor film formed on the substrate side wall (side surface of the first substrate) of the insulating polymer that separates two adjacent concave portions in the lateral direction (substantially perpendicular to the thickness direction of the insulating polymer) Electrode (first substrate side wall capacitor electrode),
An insulating polymer substrate sidewall (second) that faces the first substrate sidewall capacitor electrode across one of the adjacent recesses (first recess) and is not electrically connected to the first substrate sidewall capacitor electrode. The conductive film formed on the side surface of the substrate side wall is used as the other counter electrode (second substrate side wall capacitor electrode), and the first recess space between the first substrate side wall capacitor electrode and the second substrate side wall capacitor electrode is defined as Capacitance space,
The first substrate side wall capacitive electrode vibrates and displaces due to sound waves or force (acceleration, angular velocity, pressure, etc.), and changes in the capacitance of the first recess space make use of sound waves or force (acceleration, angular velocity). , Or pressure, etc.)
Further, the upper surface of the first substrate side wall is attached to the thin plate substrate, and / or the upper surface of the second substrate side wall is attached to the thin plate substrate,
A capacitive microphone or a force (acceleration, angular velocity, pressure, etc.) sensor.

(19) In the present invention, in addition to the above, the main substrate is a conductor substrate, a semiconductor substrate, an insulator substrate, or a composite substrate thereof, and further, the thin plate substrate is a conductor substrate, a semiconductor substrate, or an insulator. A substrate or a composite substrate thereof, and the thickness of the main substrate is 2.0 mm or less, preferably 1.0 mm or less, and the thickness of the thin plate substrate is 1.0 mm or less, preferably 0. Further, the thickness of the insulating polymer is 1.0 mm or less, and preferably 0.5 mm or less.

(20) In addition to the above, according to the present invention, the electrodes / wirings formed on the thin plate substrate through the contact holes formed in the thin plate substrate attached to the upper surface of the first substrate side wall and the first surface formed on the upper surface of the first substrate side wall. Connected to the upper surface conductor film wiring, and further, the first upper surface conductor film wiring is electrically connected to the first substrate side wall capacitor electrode,
The electrode / wiring formed on the thin plate substrate and the second upper surface conductor film wiring formed on the upper surface of the second substrate side wall are connected through contact holes formed on the thin plate substrate attached to the upper surface of the second substrate side wall, and The second upper surface conductive film wiring is electrically connected to the second substrate sidewall capacitor electrode, and further has a recess (second recess) surrounded by the first substrate sidewall, The outer cross-sectional shape of this is an n-square shape, where n is an integer greater than or equal to 3, has a plurality of second substrate side walls corresponding to each side surface, and the plurality of second substrate side walls are electrically connected to each other. And is characterized by introducing sound waves or force (acceleration, angular velocity, pressure, etc.) into the second recess, or having a recess (second recess) surrounded by the first substrate side wall, The outer cross-sectional shape of one substrate side wall is at least 1 Is a curved shape, the inner cross-sectional shape of the second substrate side wall is similar to the outer cross-sectional shape of the first substrate side wall, and a sound wave or force (acceleration, angular velocity, pressure, etc.) is introduced into the second recess. Or a through groove (second through groove) surrounded by the first substrate side wall, and the outer cross-sectional shape of the first substrate side wall is a circular shape or an elliptical shape.

(21) In addition to the above, the present invention has a third substrate side wall surrounding the first substrate side wall and the second substrate side wall, the upper surface of the third substrate side wall adheres to the thin plate substrate, and the third substrate side wall The third substrate side wall is not electrically connected to one or both of the first substrate side wall and the second substrate side wall, and the third substrate side wall is a capacitive microphone or a force package (acceleration, angular velocity, pressure, etc.) sensor device chip package The thin plate substrate is the upper surface or the lower surface of the capacitive microphone or the chip package of the force sensor (acceleration, angular velocity, pressure, etc.) sensor device, and the main substrate is a semiconductor substrate. In addition, an insulating polymer is formed in a recess (main recess) formed in the main substrate, and the recess is formed by an imprint method. .

(22) The present invention provides a thin plate substrate having at least two adjacent concave portions (first concave portion and second concave portion) opened on the upper surface of the conductive polymer formed on the main substrate, and attached to the upper surface of the main substrate. A capacitive microphone or force (acceleration, angular velocity, pressure, etc.) sensor having
A conductive polymer substrate side wall (first substrate side wall) (side surface thereof) separating two adjacent concave portions in the lateral direction (a direction substantially perpendicular to the thickness direction of the conductive polymer) is one electrode (first substrate side wall). Capacitive electrode)
A substrate side wall (second layer) of a conductive polymer that faces the first substrate side wall capacitor electrode across one of the adjacent recesses (first recess) and is not electrically conductive with the first substrate side wall capacitor electrode. (Side wall of the substrate) is used as the other counter electrode (second substrate side wall capacitor electrode), and the first recess space between the first substrate side wall capacitor electrode and the second substrate side wall capacitor electrode is used as the capacitance space. ,
The first substrate side wall capacitive electrode vibrates and displaces due to sound waves or force (acceleration, angular velocity, pressure, etc.), and changes in the capacitance of the first recess space make use of sound waves or force (acceleration, angular velocity). , Or pressure, etc.)
Further, the upper surface of the first substrate side wall is attached to the thin plate substrate, and / or the upper surface of the second substrate side wall is attached to the thin plate substrate,
A capacitive microphone or a force (acceleration, angular velocity, pressure, etc.) sensor.

(23) In addition to the above, in the present invention, the main substrate is a conductor substrate, a semiconductor substrate, an insulator substrate, or a composite substrate thereof, and further, the thin plate substrate is a conductor substrate, a semiconductor substrate, or an insulator. A substrate or a composite substrate thereof, the thickness of the main substrate is 2.0 mm or less, preferably 1.0 mm or less, and the thickness of the thin plate substrate is 1.0 mm or less, preferably 0.5 mm Further, the thickness of the conductive polymer is 1.0 mm or less, preferably 0.5 mm or less.

(24) In addition to the above, the present invention connects the electrode / wiring formed on the thin substrate through the contact hole formed on the thin substrate attached to the upper surface of the first substrate sidewall and the upper surface of the first substrate sidewall,
The electrode / wiring formed on the thin plate substrate is connected to the upper surface of the second substrate side wall through a contact hole formed on the thin plate substrate attached to the upper surface of the second substrate side wall, and the recess is surrounded by the first substrate side wall (Second concave portion), the outer cross-sectional shape of the first substrate side wall is an n-gonal shape, where n is an integer of 3 or more, and has a plurality of second substrate side walls corresponding to each side surface, The plurality of second substrate side walls are not electrically connected to each other, and a sound wave or force (acceleration, angular velocity, pressure, etc.) is introduced into the second recess, or is surrounded by the first substrate side walls. And at least one part of the outer cross-sectional shape of the first substrate side wall is curved, and the inner cross-sectional shape of the second substrate side wall is similar to the outer cross-sectional shape of the first substrate side wall. Shape, and the sound wave or Introducing force (acceleration, angular velocity, pressure, etc.), having a through groove (second through groove) surrounded by the first substrate side wall, and the outer cross-sectional shape of the first substrate side wall is circular or It has an elliptical shape.

(25) In addition to the above, the present invention has a third substrate side wall surrounding the first substrate side wall and the second substrate side wall, the upper surface of the third substrate side wall is attached to the thin plate substrate, and the third substrate side wall is the first side wall. The third substrate side wall is not electrically connected to one or both of the first substrate side wall and the second substrate side wall, and the third substrate side wall is a capacitive microphone or a force package (acceleration, angular velocity, pressure, etc.) sensor device chip package The thin plate substrate is the upper surface or lower surface of the capacitive microphone or the chip package of the force sensor (acceleration, angular velocity, pressure, etc.) sensor device, and the recess is imprinted It is formed.

(26) The present invention provides a bonded substrate in which a conductor substrate and a low concentration substrate are bonded, and the bonded substrate has at least two adjacent recesses (first recess and second recess) opened on the surface on the conductor substrate side. Have
The recess is formed in a direction substantially perpendicular to the surface of the bonding substrate (± 10 degrees or less, preferably ± 5 degrees or less, optimally ± 1 degree or less with respect to the direction perpendicular to the surface),
The bottom of the recess exists on the low concentration substrate side beyond the junction of the conductor substrate and the low concentration substrate,
A capacitive microphone having a thin plate attached to the upper surface of the bonding substrate or a force (acceleration, angular velocity, pressure, etc.) sensor,
A bonding substrate side wall (first substrate side wall) (side surface thereof) separating two adjacent concave portions in the lateral direction (substantially perpendicular to the thickness direction of the bonding substrate) is defined as one electrode (first substrate side wall capacitor electrode). ,
A junction substrate side wall (second substrate side wall) that faces the first substrate side wall capacitor electrode across one of the adjacent recesses (first recess) and is not electrically connected to the first substrate side wall capacitor electrode. (Side surface) is the other counter electrode (second substrate sidewall capacitor electrode), and the first recess space between the first substrate sidewall capacitor electrode and the second substrate sidewall capacitor electrode is the capacitance space,
The first substrate side wall capacitive electrode vibrates and displaces due to sound waves or force (acceleration, angular velocity, pressure, etc.), and changes in the capacitance of the first recess space make use of sound waves or force (acceleration, angular velocity). , Or pressure, etc.)
Furthermore, the upper surface of the first substrate side wall is attached to the thin plate substrate, and / or the upper surface of the second substrate side wall is attached to the thin plate substrate,
A capacitive microphone or a force (acceleration, angular velocity, pressure, etc.) sensor.

(27) In the present invention, in addition to the above, the conductor substrate is a high concentration silicon semiconductor substrate (impurity concentration is 10 ¹⁹ / cm ³ or more), and the low concentration semiconductor substrate is a low concentration silicon semiconductor substrate (impurity concentration). 10 ¹⁷ / cm ³ or less), the conductor type of the high-concentration silicon semiconductor substrate and the conductor type of the low-concentration silicon semiconductor substrate are opposite, and the junction substrate is an epitaxial substrate, The silicon semiconductor substrate is an epitaxial layer formed by epitaxial growth on a high concentration silicon semiconductor substrate.

(28) According to the present invention, in the bonded substrate in which the bonded conductor substrate and the low concentration substrate are bonded, an insulator film is interposed between the conductive substrate and the low concentration substrate, and the bonded substrate is on the conductor substrate side. Having at least two adjacent recesses (first recess and second recess) opened on the surface of
The recess is formed in a direction substantially perpendicular to the surface of the bonding substrate (± 10 degrees or less, preferably ± 5 degrees or less, optimally ± 1 degree or less with respect to the direction perpendicular to the surface),
The bottom of the recess exists on the insulator film or low concentration substrate side beyond the conductor substrate,
A capacitive microphone having a thin plate attached to the upper surface of the bonding substrate or a force (acceleration, angular velocity, pressure, etc.) sensor,
A bonding substrate side wall (first substrate side wall) that separates two adjacent concave portions in the lateral direction (substantially perpendicular to the thickness direction of the bonding substrate) is defined as one electrode (first substrate side wall capacitor electrode). ,
A junction substrate side wall (second substrate side wall) that faces the first substrate side wall capacitor electrode across one of the adjacent recesses (first recess) and is not electrically connected to the first substrate side wall capacitor electrode. (Side surface) is the other counter electrode (second substrate sidewall capacitor electrode), and the first recess space between the first substrate sidewall capacitor electrode and the second substrate sidewall capacitor electrode is the capacitance space,
The first substrate side wall capacitive electrode vibrates and displaces due to sound waves or force (acceleration, angular velocity, pressure, etc.), and changes in the capacitance of the first recess space make use of sound waves or force (acceleration, angular velocity). , Or pressure, etc.)
Furthermore, the upper surface of the first substrate side wall is attached to the thin plate substrate, and / or the upper surface of the second substrate side wall is attached to the thin plate substrate,
A capacitive microphone or a force (acceleration, angular velocity, pressure, etc.) sensor.

(29) In addition to the above, in the present invention, the thickness of the bonding substrate is 2.0 mm or less, preferably 1.0 mm or less, and the thickness of the thin plate substrate is 1.0 mm or less, preferably 0. The thickness of the conductor substrate is 1.0 mm or less, and preferably 0.5 mm or less, and the thin plate is formed through the contact hole formed in the thin plate substrate attached to the upper surface of the first substrate side wall. Connect the electrode / wiring formed on the substrate and the upper surface of the first substrate side wall,
The electrode / wiring formed on the thin plate substrate is connected to the upper surface of the second substrate side wall through contact holes formed in the thin plate substrate attached to the upper surface of the second substrate side wall.

(30) In addition to the above, the present invention has a recess (second recess) surrounded by the first substrate side wall, and the outer cross-sectional shape of the first substrate side wall is an n-gonal shape, where n is 3 The plurality of second substrate side walls corresponding to the respective side surfaces are provided, the plurality of second substrate side walls are not electrically connected to each other, and sound waves or force (acceleration, angular velocity) are supplied to the second recess. Or a pressure or the like, or has a concave portion (second concave portion) surrounded by the first substrate side wall, and at least one part of the outer cross-sectional shape of the first substrate side wall is a curved shape. The inner cross-sectional shape of the second substrate side wall is similar to the outer cross-sectional shape of the first substrate side wall, and a sound wave or force (acceleration, angular velocity, pressure, etc.) is introduced into the second recess, or A through-groove surrounded by the first substrate side wall A second recess), the outer cross-sectional shape of the first substrate sidewall is characterized by a circular shape or an elliptical shape.
(31) In addition to the above, the present invention has a third substrate side wall surrounding the first substrate side wall and the second substrate side wall, the upper surface of the third substrate side wall is attached to the thin plate substrate, and the third substrate side wall is the first side wall. The third substrate side wall is not electrically connected to one or both of the first substrate side wall and the second substrate side wall, and the third substrate side wall is a capacitive microphone or a chip package of a force sensor (acceleration, angular velocity, pressure, etc.) The thin plate substrate is an upper surface or a lower surface of a capacitive microphone or a chip package of a force sensor (acceleration, angular velocity, pressure, etc.) sensor device.

(32) The present invention provides a recess or a through-hole formed from the first surface (front surface) to the second surface (back surface) of the substrate and substantially perpendicular to the substrate surface (first surface and second surface). It is an electric double layer capacitor characterized in that two opposing side surfaces of the recess or the through hole are electrodes (counter electrodes), and an electrolyte is provided in the recess or the through hole between the counter electrodes. An electric double layer capacitor characterized by using a recess or a through hole formed from the first surface (front surface) to the second surface (back surface) of the substrate. An electric double layer capacitor comprising a protruding counter electrode inserted into the recess or the through hole and an electrolyte between the counter electrode in the inserted recess or the through hole, and a substrate The first of An electric double layer capacitor using a recess or a through-hole formed from a (front surface) to a second surface (back surface) and substantially perpendicular to a substrate surface (first surface and second surface). An electric double layer capacitor having a substrate side wall formed between adjacent recesses and another substrate side wall opposite to the substrate side wall in at least one of the recesses or through holes as a counter electrode. An electric double layer capacitor having an electrolyte in the recess or through hole between the opposing substrate side wall electrodes.
(33) According to the present invention, a recess or a through hole is formed substantially perpendicular to the substrate surface (first surface and second surface) from the first surface (front surface) to the second surface (back surface) of the piezoelectric substrate. A micro-generator using holes, wherein two electrodes are conductive film / electrodes formed on both side surfaces of a substrate side wall formed by adjacent recesses, and the substrate side wall is deformed to deform the substrate Electricity generated on both side surfaces of the side wall is collected by the conductive film / electrode to generate electric power, or the substrate surface (first surface) is directed from the first surface (front surface) to the second surface (back surface). A micro-generator using a recess or a through-hole formed substantially perpendicular to the first and second surfaces), wherein the first conductor film is formed on the side surface of the substrate side wall formed by the adjacent recess. Form a piezoelectric film on it and a second conductor film on it The electric charges generated on both surfaces of the piezoelectric film due to the deformation of the substrate side wall are collected by the first conductor film and / or the second conductor film to generate electric power, or formed in the substrate. A micro-generator using recesses (inside polymer recesses) formed in a piezoelectric polymer filled in the recesses, on both sides of a polymer substrate side wall formed by adjacent recesses in the polymer The formed conductive film / electrode is two electrodes, and the electric charges generated on both side surfaces of the polymer substrate side wall due to deformation of the polymer substrate side wall are collected by the conductive film / electrode to generate electric power, or , A micro-generator using a recess formed in a polymer filled in a recess formed in a substrate (inside polymer recess), and adjacent polymer A first conductor film is formed on both side surfaces of the polymer substrate side wall formed by the recess, a piezoelectric film is formed thereon, and a second conductor film is formed thereon, and the polymer substrate side wall is deformed to deform the piezoelectric film. The micro-generator is characterized in that the electric charges generated on both sides are collected by the first conductor film and / or the second conductor film to generate electric power.

In the present invention, deep grooves are formed in the thickness direction of a substrate such as a semiconductor substrate. A thin plate is attached to the upper surface and / or the lower surface of the substrate side wall (partition wall) between adjacent grooves. In the present invention having the above-described features, since the sensor is formed in the thickness direction of the substrate, a microphone (acoustic transducer), a force sensor (acceleration sensor, angular velocity sensor, pressure sensor, etc.) and micro power generation in the plane of the semiconductor substrate. The size of the machine can be made extremely small. Moreover, since it can be formed by using LSI technology such as lithography or imprint method, an extremely precise and inexpensive sensor can be created. Further, when a force such as pressure, acceleration, angular velocity, or sound wave is applied to the substrate side wall (partition wall), the substrate side wall (partition wall) (corresponding to the diaphragm) between the grooves is curved, and the capacity of the groove portion changes. By detecting this amount of change, it is possible to detect the amount of force such as pressure, acceleration, angular velocity, and sound waves. Since the capacity is increased by deepening the groove, a sensor with a smaller area can be created. Further, since the deformation amount of the substrate side wall (partition wall) can be increased by making the substrate side wall (partition wall) thinner, the sensitivity of the sensor also increases.

FIG. 45 is a diagram showing a first embodiment (first structure) of an acoustic transducer according to the present invention (for example, a microphone, a speaker, an earphone, etc., hereinafter referred to as a microphone). Shown in cross section. The insulating film 113 is formed on the side surface of the recess (through-hole in FIG. 45) 112 (112-1, 112-2, 112-3) formed from the first surface 111-S1 to the second surface 111-S2 of the semiconductor substrate 111. Is formed. The semiconductor substrate 111 is a single element semiconductor substrate such as silicon (Si), carbon (C), germanium (Ge), or the like, or gallium arsenide (GaAs), indium phosphide (InP), gallium nitride (GaN), silicon carbide ( A two-element semiconductor substrate such as SiC) or a multi-element semiconductor substrate. Alternatively, instead of a semiconductor substrate, an insulating substrate or a conductor substrate may be used. For example, the insulator substrate is an insulator substrate such as a polymer such as glass or plastic, ceramic, or rubber. In the case of an insulating substrate, the insulating film 113 may not be formed. For example, copper (Cu), aluminum (Al), iron (Fe), nickel (Ni), titanium (Ti), zinc (Zn), various alloys (stainless steel, etc.), conductive rubber, conductive It is plastic. In the following description, description will be made mainly on a semiconductor substrate.

The recess 112 is formed substantially perpendicular to the first surface 111-S1 and / or the second surface 111-S2 of the semiconductor substrate 111, and completely penetrates the first surface 111-S1 and the second surface 111-S2. It may be a through hole. In FIG. 45, description will be made as a through hole. The thin plate 110 is attached to the second surface 111-S2 side of the semiconductor substrate 111, and the through holes 112 (112-1, 2, 3) are closed by the second surface 111-S2 of the semiconductor substrate 111. The thin plate 110 may be attached before the through hole 112 is formed, or may be attached after the through hole 112 is formed. In the case where the thin plate 110 is attached after the through-hole 112 is formed, the thin plate 110 can be attached after the insulating film 113 is formed or in a subsequent process.

Conductor films 115 (115-1, 2, 3, 4) are formed on the side surfaces of the through holes 112 (112-1, 3). In the through hole 112-1, the conductor films 115-1 and 115-2 face each other and are not connected. That is, the conductor films 115-1 and 115-2 are not connected in the direction perpendicular to the paper surface. Further, since the conductor films 115-1 and 115-2 are not connected in the region other than the through hole 112-1, the conductor films 115-1 and 115-2 are connected to the through hole 112 in the through hole 112-1. -1 is a counter electrode of a capacitor having the internal space as a capacitive component.
Further, in the through hole 112-3, the conductor films 115-3 and 115-4 face each other and are not connected. That is, the conductor films 115-3 and 115-4 are not connected in the direction perpendicular to the paper surface. Further, since the conductor films 115-3 and 115-4 are not connected in the region other than the through hole 112-3, the conductor films 115-3 and 115-4 are connected to the through hole 112 in the through hole 112-1. -1 is a counter electrode of a capacitor having the internal space as a capacitive component.

The through hole 112-2 is a part that receives and introduces sound waves from the outside, and is sandwiched between the through hole 112-1 and the through hole 112-2, and the through hole 112-3 and the through hole 112-2 by the sound wave. The substrate (referred to as a substrate side wall) 111 (111-1, 111-2) vibrates. In other words, these substrate side walls 111 (111-1, 111-2) serve as diaphragms. This diaphragm corresponds to a diaphragm.
If a constant voltage V is applied between the conductor films 115-1 and 115-2, the opposing conductor film (in the through hole 112 (112-1)) (by the vibration of the substrate side wall 111 (111-1)) ( The capacitance between 115-1 and 115-2 is changed because it is also an electrode of the capacitor (sometimes called an electrode). Also, if a constant voltage V is applied between the conductor films 115-3 and 115-4, the opposing conductor film (capacitor electrode in the through hole 112 (112-3) is also called an electrode. The capacitance between 115-3 and 115-4 may change. The sound pressure level of the sound wave can be obtained by converting the amount of change in capacitance into a change in voltage.

The thin plate 110 is attached to the second surface 111-S2 side of the semiconductor substrate 111, but the thin plate 119 may be attached to the first surface 111-S1 side. Since the front and back surfaces of the through-holes 112 (112-1, 2, 3) are covered with the thin plates 110 and 119, the microphone of the present invention is resistant to mechanical shock and is also resistant to changes in the external environment (environment resistance). strong. As shown in FIG. 45, the thin plate 119 that covers the through-hole 112 (112-2) that receives the sound wave 127 from the sound source 126 is provided with one or a plurality of sound wave introduction holes (openings) 122 that introduce the sound wave 127. The sound wave 127 is efficiently introduced into the through hole 112 (112-2). Alternatively, only one sonic wave introduction hole (opening) 122 is opened on the first surface 111-S1 side of the through hole 112 (112-2), or the sonic wave introduction hole (opening) 122 is opened in the entire through hole. May be.

In order to prevent the sound wave introduced into the through-hole 112 (112-2) from staying in the through-hole, the through-hole 112 (in the thin plate 110 covering the second surface 111-S2 side of the semiconductor substrate 111). A sound wave hole 127 may be provided in a part of the portion 112-2). Since sound waves are vibrations of air, air vibrations quickly escape from the sound wave holes 127. Of course, the sound wave introduced into the through-hole 112 (112-2) also escapes from the sound wave introduction hole (opening) 122. Therefore, the sound wave introduction hole 127 of the thin plate 110 covering the second surface 111-S2 side of the semiconductor substrate 111 can be used as a sound wave introduction hole. In this case, the second surface 111-S2 of the semiconductor substrate 111 is used. Sound from the side can also be detected.

The substrate side wall 111 (111-1, 111-2) vibrates in response to the sound wave, and the electrostatic capacity of the capacitance space 112 (112-1, 112-2) changes due to the vibration. At this time, a gas such as air is contained in the through holes 112 (112-1, 112-2) which are the capacity spaces, and the through holes 112 (112-1, 112-2) are sealed with the thin plates 110 and 119. If it is, the pressure in the through-hole 112 (112-1, 112-2) will change. Since this pressure change may affect the vibration of the substrate side wall 111 (111-1, 111-2), in order to prevent the pressure in the through hole 112 (112-1, 112-2) from changing. In addition, the gas vent holes 128 (128-1, 128-2) are opened in the thin plate 110 covering the through holes 112 (112-1, 112-2). This may be opened on the thin plate 119 side, or may be opened on both sides. However, it is necessary to prevent sound waves from entering from the gas vent holes 128 (128-1, 128-2). This is because when sound waves enter from the gas vent holes 128 (128-1, 128-2), the side walls 111 (111-1, 111-2) also vibrate from here. In addition, if the inside of the through-hole 112 (112-1, 112-2) is sealed in a vacuum (close to) state, there is no pressure fluctuation.

An insulating film 117 is formed and protected on the electrode / wiring (conductor film) 115 (115-1, 2, 3, 4) of the through hole 112 (112-1, 112-2). The insulating film 113, the conductor film 115, and the insulating film 117 are formed not only in the through hole but also on the first surface 111-S1 (or the second surface 111-S2) of the semiconductor substrate 111. As can be seen from FIG. 45, the conductor film 115 is patterned so as to be the electrode / wiring of the capacitor in the through hole 112 (112-1, 112-2), and the first surface 111-S1 (or the semiconductor substrate 111) (or The second surface 111-S2 may be used). A contact hole 123 is opened in the insulating film 117 at a predetermined portion on the first surface 111 -S 1 of the semiconductor substrate 111, and a voltage V is supplied from the contact hole 123. Also in the thin plate 119, the contact hole 123 is opened in the power supply part region (power supply opening part) 121.

FIG. 46 is a plan view of the microphone of the present invention. Rectangular through holes 112 (112-1, 112-2, 112-3) are arranged in parallel. There is a substrate side wall 111-1 between the through holes 112-1 and 112-2, and a substrate side wall 111-2 between the through holes 112-2 and 112-3, and these substrate side walls 111-1 and 111-2 are It becomes a diaphragm and vibrates by the sound wave introduced into the through hole 112-2. As can be seen from FIGS. 45 and 46, the substrate side walls 111-1 and 111-2 have a rectangular shape (rectangular shape), which is a rectangular parallelepiped shape in three dimensions. If the thickness of the substrate sidewalls 111-1 and 111-2 is a, the width is b, and the depth is h, the size (volume) of the substrate sidewall is abh. When the width of the through hole 112-1 is e, the width of the through hole 112-2 is d, and the width of the through hole 112-3 is f, the size (volume) of the through hole 112-1 is bhe, and the through hole 112- The size (volume) of 2 is bhd, and the size (volume) of the through hole 112-3 is bhf. Normally, since the through hole 112-1 and the through hole 112-3 have the same size, e = f. In the case of a through hole, h is approximately equal to the thickness of the substrate 111. In the case of a recess, h is smaller than the thickness of the substrate 111.

In FIG. 46, only a part of the thin film is shown so that the state of the thin film formed on the substrate 111 can be understood, but the structure of the thin film is the same as that in FIG. In the through holes 112-1 and 112-3 serving as the capacitor space, the insulating film 113 is formed on the side surface of the through hole, and the conductor film 115 is formed thereon. The conductor film 115 is subjected to necessary patterning. In the through-hole 112-1, the conductor films 115-1 and 115-2 are not conductive because they are electrodes / wirings facing each other. Since the size (area) of them (side electrodes of the conductor films 115-1 and 115-2) is substantially the same as the side surface of the through hole 112-1, it is bh. The distance between the side electrodes of the conductor films 115-1 and 115-2 is e (strictly, it is necessary to consider the thickness of the insulating film 113 and the conductor film 115). The capacitance C1 generated between the side electrodes 115-2 is C1 = ε · ε0 · e / bh. Here, ε0 is a dielectric constant in vacuum, and ε is a dielectric coefficient.
In the through-hole 112-3, the conductor films 115-3 and 115-4 become electrodes / wirings facing each other and are not conductive. Since the size (area) of these (side electrodes of the conductor films 115-3 and 115-4) is substantially the same as the side surface of the through hole 112-3, it is bh. Since the distance between the side electrodes of the conductor films 115-3 and 115-4 is f (strictly, it is necessary to consider the thickness of the insulating film 113 and the conductor film 115), the conductor films 115-3 and 115-4 The capacitance C2 generated between the side electrodes 115-4 is C1 = ε · ε0 · f / bh.

When the substrate side walls 111-1 and 111-2 vibrate, e and f change, so that the capacitances C1 and C2 change. If this change is detected, a capacitance change signal corresponding to the sound wave (a voltage change corresponding thereto) can be obtained, so that it can be returned to the sound wave again. An insulating film 117 is formed on the patterned conductor film 115. Although not shown in FIG. 46, insulating films 113 and 117 are formed on the substrate 111, and the conductor film 117 is patterned for electrode / wiring extraction. In the through hole 112-2, the conductor film 115 is not necessary and is preferably removed by etching, but may be left if there is no problem in receiving the sound wave. Therefore, in the through hole 112-2, the insulating films 113 and 117 are laminated. Although not shown in FIG. 46, the thin plate 110 is present at the bottom of the through holes 112-1, 112-2, 112-3 as can be seen from FIG. 45, but the insulating film 113 is formed after the through holes are formed. Etc., these films may be left. However, it is a matter of course that the conductor film 115 needs to be removed in the through holes 112-1 and 112-3 constituting the capacitance space. (Prevent the capacitor electrode from conducting.)
In FIGS. 45 and 46, the through holes 112-1 and 112-3 constituting the capacity space are formed on both sides of the sound wave introducing through hole 112-3, but it is also possible to form the through hole only on one side. Capacitance change due to sound waves can be detected. By forming the through-holes on both sides, the amount of change in capacitance is about twice that in the case of only one side, so that the detection sensitivity can be increased.

FIG. 47 is a diagram showing a structure in which through holes 112-4 and 112-5 constituting a capacity space are further provided on the side surface of the through hole 112-2. Accordingly, since the through holes constituting the capacitive space are formed on all four side surfaces of the rectangular sound wave introducing through hole 112-2, the four substrate side walls 111-1 and 111 are formed between these through holes. -2, 111-3, and 111-4. These four substrate side walls 111-1, 111-2, 111-3, 111-4 vibrate by the sound wave introduced into the sound wave introducing through hole 112-2, and accordingly, the through holes 112-1, 112- Since the capacitances at 3, 112-4, and 112-5 change, sound waves can be detected, and the change amount of the capacitance is amplified, so that the detection sensitivity of the sound waves increases. In FIG. 47, only a part of the thin film is shown so that the state of the thin film formed on the substrate 111 can be seen, but the structure of the thin film is the same as that in FIG.
If the width of the substrate side wall 111-3 is j and the width of the through hole 112-4 is g, the size of the through hole 112-4 is dhg. If the width of the substrate side wall 111-4 is k and the width of the through hole 112-5 is m, the size of the through hole 112-5 is dhm. If the plane shape of the sound wave introducing through hole 112-2 is formed in a square shape (that is, b = d) and the widths of the substrate side walls 111-1, 111-2, 111-3, 111-4 are made the same. (That is, a = j = k), the vibration modes of the substrate side walls 111-1, 111-2, 111-3, and 111-4 are the same. (When the semiconductor substrate is a single crystal substrate of silicon, each surface of the substrate sidewalls 111-1, 111-2, 111-3, 111-4 is perpendicular to the substrate surface and perpendicular to each other. And the through-hole through-holes 112-1, 112-3, 112-4, and 112-5 have the same size (ie, e = f = j = m). The capacitance changes of the capacitors in the through holes 112-1, 112-3, 112-4, and 112-5 are the same. By doing so, the amount of change in capacitance is amplified about four times, and the detection sensitivity of sound waves increases.

FIG. 48 is a diagram showing a microphone whose planar shape (cross section parallel to the substrate surface) is circular (cylindrical when viewed three-dimensionally). The through hole 132 (132-1) for introducing a sound wave has a circular shape with a radius r1, and a substrate side wall 131 (131-1) with a radius r2 and a width (thickness) r2-r1 surrounds the periphery. Further, a through-hole 132 (132-2) serving as a capacity space having a radius r3 and a width r3-r2 is surrounded by the periphery. That is, the through hole 132 (132-2) has a donut shape. Moreover, the through-hole 132 (132-1), the board | substrate side wall 131 (131-1), and the through-hole 132 (132-2) are concentric. In FIG. 48, although an insulating film or the like is not shown, the cross-sectional structure is actually the same as that in FIG. 45, and the configurations of the insulating film and the conductor film are also the same as those in FIGS. In FIG. 48, only a part of the thin film is shown so that the state of the thin film formed on the substrate 111 can be understood, but the structure of the thin film is the same as that in FIG.

A conductor film 135 (135-1) is laminated on the outer periphery of the substrate side wall 131 (131-1), and the conductor film 135 (135-2) is also formed on the outer periphery of the through hole through hole 132 (132-2). Are stacked. The conductor film 135 (135-1) and the conductor film 135 (135-2) do not conduct and constitute an electrode of a capacitor having a distance r3-r2. (In actuality, it is necessary to consider the thickness of the conductor film and the thickness of other insulating films.) When sound waves are introduced into the through holes 132 (132-1), the substrate sidewall 131 (131-1) Vibrates according to the vibration of the sound wave. Since the electrostatic capacitance between the conductor film 135 (135-1) and the conductor film 135 (135-2) changes in accordance with the vibration of the substrate side wall 131 (131-1), a constant voltage is applied between these electrodes. If V is applied, a change in capacitance can be detected. That is, a sound wave signal can be detected.

In the concentric microphone as shown in FIG. 48, the number of electrodes constituting the capacitor is two, which is smaller than that of FIGS. 46 and 47, and the area of the counter electrode constituting the capacitor can be increased (unit area). Therefore, the sensitivity of the microphone can be increased, and a highly efficient microphone device can be manufactured. The circular shape shown in FIG. 48 is isotropic on the substrate surface, which is suitable for detecting a sound wave signal. FIG. 49 is a diagram showing a case where a microphone having a rectangular shape (square or rectangular shape) has two electrodes constituting a capacitor. The electrodes may be divided as shown in FIG. 46 and FIG. 47, but the number of electrodes / wirings can be reduced by connecting the capacitor to two counter electrodes as shown in FIG. The area can be reduced, and the overall capacitance can be increased. Therefore, the detection sensitivity per unit area can be increased. In FIG. 50, only a part of the thin film is shown so that the state of the thin film formed on the substrate 111 can be understood, but the configuration of the thin film is the same as that in FIG.

As can be seen from FIGS. 45 to 49, the planar shape (cross section parallel to the substrate surface) may be other shapes. For example, it may be triangular, pentagonal or more polygonal, or elliptical. In the case of a polygon more than a triangle, a regular polygon is desirable because the deformation due to vibration in each face is the same or similar. 46 to 49, the electrode outlet is not shown. However, as shown in the cross-sectional shape of FIG. Also, the laminated conductor film is exposed to form an electrode outlet. The conductor film laminated on the upper surface of the substrate side wall is a thin film continuous with the conductor film (for example, 135-1 and 135-2 in FIG. 48) laminated on the side surface of the substrate side wall. Further, necessary patterning is performed on the conductor film laminated on the side surface, top surface, and bottom of the through hole of the substrate side wall.

FIG. 50 is a plan view showing the acceleration sensor of the present invention. A cross-sectional view parallel to the substrate surface or a view of the upper surface or the lower surface may be considered. The thin film structure is the same as in FIG. 45, but only the necessary thin films are shown. As shown in FIG. 50, the substrate side wall 201 (201-1, 201-2, 201-is parallel to each of the four side surfaces of the rectangular parallelepiped, with the through-hole 211 having a substantially rectangular shape (three-dimensionally substantially rectangular parallelepiped shape) as the center. 3, 201-4), four through holes 213, 214, 215, 216 are arranged. These four through holes 213, 214, 215, and 216 are substantially rectangular parallelepiped spaces having a width of p, a length of q, and a depth of s, and the central through hole 211 is a square having a length of q. A space having a substantially rectangular parallelepiped shape with a depth of s. Further, the width (thickness) of the substrate side wall 201 (201-1, 201-2, 201-3, 201-4) is t. p, q, s, and t may be changed for each through-hole and each substrate side wall. In that case, a conversion comparison circuit is used by using a capacitance conversion circuit in order to compare the magnitude of acceleration detected by each through-hole. Since it is necessary to provide each through-hole (except for the central through-hole 211) and each substrate side wall, it is better to have the same size, and it is desirable that p, q, s, and t have the same value.

In the capacitor through-hole 213 serving as a capacitor space, the conductor film 221 formed on the side wall of the substrate is one electrode of the capacitor 213, and the conductor film 222, which is the other electrode opposite to the electrode, is the capacitor through-hole 213. Is formed on the other inner surface of the. Since the distance between these two electrodes is p (actually, it is necessary to consider the thickness of the insulating film, conductor film, etc. formed in the through hole 213). The electrostatic capacity C of C = ε · ε0 · p / (qs).

Similarly, in the capacitor through-hole 214 serving as a capacitor space, the conductor film 223 formed on the side wall of the substrate serves as one electrode of the capacitor 214, and the conductor film 224, which is the other electrode opposite to the capacitor 214, serves as a capacitor. It is formed on the other inner surface of the through hole 214. Since the distance between these two electrodes is p (actually, it is necessary to consider the thickness of the insulating film, conductor film, etc. formed in the through-hole 214). The electrostatic capacity C of C = ε · ε0 · p / (qs).

Similarly, in the capacitor through-hole 215 serving as a capacitor space, the conductor film 225 formed on the side wall of the substrate serves as one electrode of the capacitor 215, and the conductor film 226, which is the other electrode facing the capacitor film 225, serves as a capacitor. It is formed on the other inner surface of the through hole 215. Since the distance between these two electrodes is p (actually, it is necessary to consider the thickness of the insulating film, conductor film, etc. formed in the through hole 215). The electrostatic capacity C of C = ε · ε0 · p / (qs).

Similarly, in the capacitor through-hole 216 serving as a capacitor space, the conductor film 218 formed on the side wall of the substrate becomes one electrode of the capacitor 216, and the conductor film 219, which is the other electrode facing the capacitor film 216, is used for the capacitor. It is formed on the other inner surface of the through hole 216. Since the distance between these two electrodes is p (actually, it is necessary to consider the thickness of the insulating film, conductor film, etc. formed in the through hole 216). The electrostatic capacity C of C = ε · ε0 · p / (qs).

FIG. 51 is a schematic diagram showing a deformed state of the substrate side wall due to acceleration. Assume that the horizontal direction is X, the vertical direction is Y, and the acceleration α works in the Y direction. A force F (= mα, m is the mass of the substrate) due to the acceleration α acts on the substrate side wall 201-4. The deformation of the substrate side wall 201-4 is restricted at the periphery, but the inside thereof is not restricted. Therefore, the substrate side wall 201-4 is deformed into a curved shape swelled inside the through hole 216. Since the force F caused by the acceleration α acts uniformly in the Y direction on the side surface of the substrate substrate side wall 201-4, the vicinity of the center portion of the substrate side wall 201-4 is most curved. If the displacement of the substrate side wall 201-4 in the X direction is y, x = 0, q and y = 0, and x = q / 2 and y = y0 (maximum value). y0 is approximately obtained by the following relational expression.
y0 = β * F * s ⁴ / (Et ³ )
(E is the Young's modulus of the substrate side wall (diaphragm), β is a constant that varies depending on the aspect ratio of the diaphragm)

Accordingly, since the interelectrode distance between the electrodes 218 and 219 of the through hole 216 changes, the capacitance between the electrodes 218 and 219 changes (the capacitance increases). Conversely, by measuring this capacitance, the distance between the electrodes can be obtained, the force due to the acceleration can be obtained, and the acceleration can be calculated.

The substrate sidewall 201-2 opposite to the substrate sidewall 201-4 is also subjected to the force F due to the acceleration α, and the substrate sidewall 201-2 is also deformed in the same direction as the substrate sidewall 201-4. That is, the substrate side wall 201-2 is deformed to the inner side of the central through hole 211 and is deformed to the outer side of the through hole 214. Accordingly, since the interelectrode distance between the electrodes 223 and 224 of the through hole 214 changes, the capacitance between the electrodes 223 and 224 changes (the capacitance decreases). Conversely, by measuring this capacitance, the distance between the electrodes can be obtained, the force due to the acceleration can be obtained, and the acceleration can be calculated. It can also be seen that when the capacitance decreases in the through-hole 214 and increases in the through-hole 216, the acceleration is in the Y direction (from the lower side to the upper side in FIG. 51). That is, the direction of acceleration is also known.

Since the substrate side walls 201-1 and 201-3 are not deformed with respect to the acceleration in the Y direction, there is no change in capacitance in the through holes 213 and 215. Since the substrate side walls 201-1 and 201-3 are deformed with respect to the acceleration in the X direction, the capacitance of the through holes 213 and 215 changes, and the magnitude and direction of the acceleration in the X direction can be known. .

All of the four substrate side walls 201-1, 201-2, 201-3, 201-4 are deformed with respect to acceleration having an angle in a certain direction with respect to the X direction and the Y direction. The capacitances 214, 215, and 216 change. The acceleration (size, direction) can be detected by detecting the capacitance change of only two adjacent through holes. For example, the capacitances in the through holes 213 and 214 may be detected. The capacitances in the other two through holes 215 and 216 may be used to increase detection accuracy.

FIG. 52 is a cross-sectional view of the acceleration sensor of the present invention. Since the thin film structure is the same as that of FIG. 45, a part of it is omitted. FIG. 52 is a cross-sectional view taken along CD in FIG. 50, for example. There is a substrate side wall 201-1 or 201-3 that separates the through hole 211 perpendicular to the first surface 201-S2 and the second surface 201-S2 of the substrate 201 and the adjacent through hole 213 or 215, and the substrate side wall 201-1 or 201-3 is deformed by a force due to acceleration. A conductor film 221 is formed in the through hole 213 on the substrate side wall 201-1. The through hole 213 is a capacity space, and the conductor film 221 is one electrode of the capacitor. The conductor film 222 which is the other electrode of the capacitor facing this conductor film 221 is formed on the inner surface of the substrate 211 facing the substrate side wall 201-1 in the through hole 213. The substrate 201-5 on which the conductor film 222 is formed is hardly deformed by a force due to acceleration.

The through hole 215 serves as a capacity space, and the conductor film 225 serves as one electrode of the capacitor. The conductor film 226 which is the other electrode of the capacitor facing this conductor film 225 is formed on the inner surface of the substrate 211 facing the substrate side wall 201-3 in the through hole 215. The substrate 201-7 on which the conductor film 226 is formed is hardly deformed by a force due to acceleration. A thin plate 232 is attached on the first surface 201-S1 of the substrate 201, and a thin plate 231 is attached on the second surface 201-S2 of the substrate 201, covering the through holes 211, 213, and 215. . The through holes 211, 213, and 215 may be completely sealed, or vent holes 234, 235, 236-1, and 236-2 with the outside may be provided. In the case of complete sealing, the inside of the through hole may be evacuated or filled with air, nitrogen or the like. In the case of complete sealing, the change inside the through hole is smaller due to the change in the external environment. The vent holes 234, 235, 236-1 and 236-2 can be formed in the thin plates 231 and 232.

Now, the substrate side walls 201-1, 201-2, 201-3, 201-4 are deformed by the force due to acceleration, and the force is the mass of the substrate side walls 201-1, 201-2, 201-3, 201-4. Depends on. (F = mα) Since the substrate side walls 201-1, 201-2, 201-3, 201-4 cannot be made too thick, the mass cannot be increased. Thus, the liquid 229 can be put into the through-hole 211, and the substrate side walls 201-1, 201-2, 201-3, 201-4 can be greatly deformed by using the force due to the acceleration applied to the liquid. That is, the substrate side walls 201-1, 201-2, 201-3, 201-4 can be greatly deformed without making them heavy. The substrate side walls 201-1, 201-2, 201-3 and 201-4 are made as thin as possible to be easily deformed, and the force due to acceleration is generated by the liquid 229 placed in the through hole 211. Since the liquid pushes the substrate side wall arranged in the acceleration direction by the acceleration by the acceleration force applied to the liquid, the substrate side wall is deformed correspondingly, and the capacitance in the through hole due to this deformation changes. The substrate side wall is subjected to a force by the liquid in addition to the acceleration force applied to the substrate side wall itself.

As the mass of the liquid increases, an acceleration force is generated. For example, mercury (Hg) has a specific gravity of about 13.8 and is an optimal liquid for the present invention. In addition, sodium polytungsten (specific gravity is about 3 to 5), acetylene tetrabromide (specific gravity is about 3), etc. can be used. Although the specific gravity is not so large, various liquids such as water and heavy oil can be used. The liquid 229 can be put into the through hole 211 by opening a plurality of holes 236-1 and 236-2 in the thin plate 232 of the through hole 211 and putting it in from one hole 236-1 and exiting from the other hole 236-2. . If the holes 236-1 and 236-2 are closed after the liquid 229 is added, there is no fear that the liquid 229 leaks. The liquid 229 may be put into the through-hole 211 before the thin plate 232 is attached on the substrate 201-S1. In this case, the ventilation holes 236-1 and 236-2 of the through hole 211 may not be provided. The liquid 229 may be filled in the entire through-hole 211 or only a part thereof. What is necessary is just to adjust the amount put into the through-hole 211 according to the amount of deformation of the substrate side wall and the magnitude of the acceleration force.

FIG. 53 is a diagram showing an acceleration sensor having a structure in which capacitor through holes 213, 214, 215, and 216 around a central through hole 211 are connected. The substrate side walls 201-1, 201-2, 201-3, 201-4 are surrounded around the central rectangular through-hole 211, and 217 (through-holes 213, 214, 215, 216 are formed as capacity spaces around the periphery. The connected capacity space is denoted by 217). The inner side surface and the outer side surface of the capacity space 217 are separated by a distance p on each side of the rectangle. (The thickness of the substrate side wall is t.) Conductor films 218, 221, 223, and 225 and 216, 222, 224, and 226 serving as electrodes are laminated on the inner side surface and the outer side surface of the capacitor space 217, and the capacitor is formed. Forming. Thus, by connecting the through holes serving as the capacity spaces, the planar area can be reduced. Furthermore, either the conductor film (218, 221, 223, 225) on the inner side surface of the through hole or the conductor film (216, 222, 224, 226) on the outer side surface of the through hole can be connected. Therefore, patterning is not necessary and electrode wiring can be reduced. That is, the process can be simplified.

In FIG. 53, when the substrate is a silicon wafer and the substrate surface is the (100) plane, if the X direction is the <01-1> direction, the Y direction is the <011> direction. ˜4 is the (011) plane and the crystal axes are equivalent. Therefore, if the thickness is the same, the deformation amount of each substrate side wall is the same for the same acceleration, so that the comparison can be easily made without conversion by calculation. Since the outside of the through-hole 217 is surrounded by thick substrates 201 (201-5 to 8), these substrates hardly change due to acceleration, so that the static capacity of each capacitance space (213, 214, 215, 216) can be reduced. It can be considered that the capacitance change is caused by the deformation of the substrate side walls 201-1 to 201-4. 53 does not show an insulating film or the like, the structure is the same as that shown in FIG.

FIG. 54 is a view showing an acceleration sensor of the present invention having a through-hole and a substrate side wall whose cross section (a surface parallel to the substrate surface) is circular (three-dimensionally cylindrical). A circular (three-dimensionally cylindrical) through-hole 311 (radius r5) is provided in the center of the substrate 301, and a circular substrate sidewall 301 (301-2) having a radius r6 surrounds the through hole 311. Further, a circular through hole 313 having a radius r7 surrounds the periphery. The through hole 313 is surrounded by the substrate 301 (301-1). Accordingly, the substrate side wall 301 (301-2) has a donut shape with a thickness of r6-r5. The through hole 313 is also a donut-shaped cavity having a width r7-r6. The through hole 311, the substrate side wall 301-2, and the through hole 313 are arranged concentrically.

A conductor film 315 is laminated on the inner side surface of the through hole 313 serving as a capacity space (that is, the outer surface of the substrate side wall 301 (301-2)), and the outer side surface of the through hole 213 (that is, the inner side of the substrate 301 (301-1)). A conductor film 317 is laminated on the side surface. (The thin film structure is the same as that shown in FIG. 45 and the like, and an insulating film and the like are also laminated, but are omitted in FIG.

The conductor film 317 is divided into substantially equal lengths on the circumference. For example, if it is divided into n pieces by the distance u2 between the electrode having a length u1 on the circumference, n (u1 + u2) = 2πr7 holds. One electrode of the conductive film 317 is 317-1, an electrode next to it (the direction around the clock) is 317-2, and an electrode next to it (the direction around the clock) is 317-3. A capacitor is formed between the conductor film 315 and the conductor film 317. That is, the capacitance can be measured between the electrodes 317-1 and 317-2 and the conductor film 315. When there is no acceleration, the distance w between these electrodes is the same for any capacitor, and w = r7−r6 = w0 (in fact, it is necessary to consider the thickness of the conductor film), and the capacitance is the same for any capacitor. (This capacity is C0). Assume that the substrate side wall 301-2 is deformed due to the acceleration. If the acceleration direction is the direction of the electrode 317-2, the substrate side wall 301-2 facing the electrode 317-2 is deformed, and the distance between the electrode 317-2 and the conductor film 317 is smaller than w0. Therefore, the capacity becomes larger than C0. The capacitance of the electrodes 317-1 and 317-3 adjacent to the electrode 317-2 is also smaller than C0, but the capacitance of the electrode 317-2 is the largest. The magnitude of acceleration can be calculated from the amount of change in capacitance. That is, looking at the capacitance of each of the n electrodes 317 (317-1 to n), the direction of the electrode having the largest capacitance is the direction of acceleration, and the magnitude of acceleration is determined from the amount of change in the capacitance. Can be calculated.

By increasing the number of divided conductive films 317, the direction of acceleration and the magnitude of acceleration can be detected with higher accuracy. Even if the conductor film 315 on the inner side surface of the through hole 313 is divided and the conductor film 317 is not divided, the direction and magnitude of acceleration can be measured in the same manner. Alternatively, both conductor films 315 and 317 may be divided. Furthermore, the amount of deformation of the substrate side wall 301-2 may be increased by putting a liquid in the through hole 311.

FIG. 55 is a view showing an acceleration sensor of the present invention having a through-hole having a octagonal cross section and a substrate side wall. An octagonal (three-dimensionally hexagonal columnar) substrate side wall 331-2 surrounds a through hole 333 having a central octagonal cavity, and an octagonal cavity serving as a capacity space is surrounded by the substrate sidewall 331-2. The through-hole 334 which has has, and the circumference | surroundings surround the thick board | substrate 331-1. The substrate side wall 331-2 is deformed by a force due to acceleration. A conductor film 336 is formed on each side (surface) of the substrate side wall 331-2 and patterned into one electrode (for example, 336-1, 2). A tooth conductor film 338 is formed on the outer side surface of the through-hole 334 serving as a capacity space, and is patterned on the other electrode (for example, 338-1, 2).

In the through hole 334, a capacitor is formed between the electrode on the inner side surface and the electrode on the outer side surface, and the capacitance can be measured. For example, the capacitance can be measured by the electrode 336-1 and the electrode 338-1 facing the electrode 336-1. Even if either electrode 336 or 338 is connected, the capacitance in each region (corresponding to each side (surface)) can be measured. In order to directly compare the deformation at each side, the octagonal shape is preferably a regular octagonal shape. However, if the substrate is not isotropic in each direction, the magnitude of the deformation on each side differs depending on the magnitude of the force due to acceleration, so it is necessary to correct the difference and calculate the magnitude of acceleration. There is. For example, when the substrate is single crystal silicon (silicon wafer), the substrate surface is the (100) surface, and one side (surface) of the substrate side wall 331-2 (for example, 331-2-1) is the {110} surface. When it is a system, the adjacent surfaces are {111} plane systems and have different Young's moduli, so that the amount of deformation differs even when the same force is applied. Accordingly, it is necessary to take this crystal orientation into consideration when obtaining the deformation amount from the capacitance change of the capacitor and further calculating the magnitude of the force from the deformation amount.

If an acceleration sensor having a substrate side wall and a through hole having such an octagonal shape is used, eight acceleration directions can be accurately detected. That is, if a capacitor having the largest deformation amount (large capacitance) is detected (this is extremely simple), the direction of the substrate becomes the direction of acceleration. Furthermore, the direction can be detected more finely by precisely analyzing the deformation amount of each capacitor. However, in order to obtain the direction of acceleration more accurately, the number of sides may be increased. According to the present invention, various polygonal through holes and substrate side walls can be formed by changing a mask when forming the through holes 333 and 334. A regular polygon can be easily produced. For example, one side of a regular icosahedron whose radius of the circumscribed circle of the through hole 333 is 100 μm is about 6, 3 μm, so that patterning can be performed without any problem. Therefore, the direction of acceleration can be accurately detected at intervals of 3.6 ° with respect to all 360 ° directions. Furthermore, a finer direction can be calculated by comparing the acceleration amounts of the other sides (surfaces). The same applies to the circular acceleration sensor shown in FIG. In addition, the amount of deformation due to the acceleration of the substrate side wall can be increased by putting a liquid in the central through hole 333.

Next, a manufacturing process of the microphone device or the acceleration sensor device of the present invention will be described. Since the basic structures of the microphone device and the acceleration sensor device of the present invention are similar as described above, they will be described together.

FIG. 56 is a diagram showing a manufacturing process of the microphone device or the acceleration sensor device of the present invention. As shown in FIG. 56A, an insulating film 402 is formed on a first surface (also referred to as a front surface or a main surface) 401-S1 of a substrate 401. The substrate 401 is a single element semiconductor substrate such as silicon (Si), germanium, or carbon (or diamond), or two elements such as silicon carbide (SiC), gallium arsenide (GaAs), gallium nitride (GaN), or indium phosphide (InP). Insulating substrates such as semiconductor substrates, multi-component semiconductor substrates of ternary or higher, glass, ceramic, (insulating) plastic, (insulating) combs, (insulating) polymer resins, or metals (iron, copper, Zinc, titanium, tungsten, molybdenum, nickel, chromium, aluminum, various alloys), conductive plastics, conductive rubber, conductive polymer resins, and other conductive substrates. Alternatively, a substrate in which these substrates are stacked, for example, a bonded substrate may be used. An SOI (Silicon On Insulator) substrate may be used.

The substrate has a circular shape, a rectangular shape, etc. If the circular shape is 1 inch diameter or more, if the rectangular shape is 1 inch □ or more, it is practical, but the larger the number, the larger the number of chips (chips). . In addition, if the substrate is the same as that of other devices such as ICs and LSIs, the substrate is a semiconductor substrate. The thickness of the substrate is easy to handle in the range of about 0.1 mm to 1.0 mm, but is not particularly limited, and may be a substrate thinner than 0.1 mm or a substrate thicker than 1.0 mm.

A photosensitive film 404 is formed on the insulating film 402 and necessary windows are opened using an exposure method. The insulating film 402 has a purpose of facilitating opening of the window of the photosensitive film 404, a purpose of becoming a mask when the substrate 401 is etched thereafter, or a purpose of protecting the substrate 401. However, the insulating film 402 is not provided. However, it may not be formed if these purposes can be realized. The insulating film is a silicon oxide film (SiOx), a silicon nitride film (SiNy), a silicon oxynitride film (SiOxNy) or the like that is laminated by CVD, PVD, or the like. When the substrate is silicon, a thermal oxide film or a thermal nitride film may be used. The thickness of the insulating film 402 is about 0.1 μm to 2 μm, although it varies depending on the purpose. Of course, it may be thinner or thicker as long as the above object can be achieved. Note that the insulating film 403 may be stacked over a second surface (also referred to as a back surface or a sub surface) 401 -S 2 of the substrate 401. In particular, in order to prevent the substrate 401 from warping, an insulating film having the same degree as that of the first surface is preferably formed.

The photosensitive film 404 is, for example, a photoresist film or a photosensitive sheet. The thickness of the photosensitive film 404 refers to the depth to which the substrate 401 is etched, and the etching selectivity when etching the substrate 401 (that is, the ratio of the etching rate of the substrate 401 to the etching rate of the photosensitive film 404). ), Determined by variations in etching rate, and the like. For example, the etching amount of the substrate 401 (the depth of the through-hole or the depth of the concave portion (not the through-hole but when stopped in the middle), which corresponds to the thickness of the substrate in the case of the through-hole) is 400 μm, When the etching selectivity of the photosensitive film 404 is 50, the thickness of the insulating film 402 is 1 μm, and the etching selectivity of the insulating film 402 and the photosensitive film 404 is 10, the first photosensitive film is photosensitive when the insulating film 1 μm is completely etched. The film 404 is etched by about 0.1 μm, and the photosensitive film 404 is etched by about 8 μm when the substrate is etched by 400 μm. If the variation is 10%, the photosensitive film 404 may have a thickness of about 10 μm. From the above, it is important to increase the etching selectivity between the substrate 401 and the photosensitive film 404.

Opening of the photosensitive film 404 removes the photosensitive film in the region where the central through hole (through hole for sound wave introduction in the microphone device) 405-1 and the through holes 405-2 and 405-3 for the capacitor are formed. . When the photosensitive film is a positive type, light is applied to this region, and light is not applied to a portion where the photosensitive film is left. The opposite is true when the photosensitive film is negative. Exposure is performed using a mask or reticle for this purpose. Light refers to electromagnetic waves such as X-rays and γ-rays, ultraviolet rays, visible light, and the like. It also includes electron beams. After the photosensitive film is exposed, the photosensitive film 404 is patterned by leaving a necessary part with a developer and removing an unnecessary part. The shape of the photosensitive film is desirably a vertical shape in order to perform etching of the base as faithfully as possible to the pattern of the photosensitive film.

Next, as shown in FIG. 56B, the insulating film 402 is etched in the regions 405-1, 2, 3, etc. opened by using the photosensitive film 404 as a mask. It is desirable to etch the insulating film as faithfully as possible to the photosensitive film 404 as well. For example, when etching a silicon oxide film (SiOx), anisotropic etching close to a vertical pattern can be performed by RIE (reactive dry etching) using CHF3 gas, C2F6 + H2 gas, or the like.

After the insulating film 402 is etched, the exposed substrate 401 is etched in the openings 405-1, 2, 3 and the like of the photosensitive film 404, and the through holes 406 (406-1, 406-2, 406-3) are formed. Make it. The through holes 406 (406-1, 406-2, 406-3) and the substrate side walls 401-1, 401-2 need to be formed as accurately as possible, and can be formed faithfully to the substantially vertical photosensitive film pattern. desirable. (In the case of side etching, it is desirable to control the amount of side etching as accurately as possible.) When the substrate is single crystal silicon (so-called silicon wafer), the width w1 of the substrate side walls 401-1 and 401-2 is: Since about 1 μm to 20 μm and the depth of the through hole (or recess) is about 50 μm to 1000 μm, vertical etching with as little side etching as possible is desirable.

An example of such etching is deep RIE (DEEP RIE). For example, there are a method of etching by using high-density plasma, cooling to a low temperature, and a Bosch process method. Various other methods can also be employed in this process. When the through-hole is formed by etching all of the substrate 401, the over-etching is performed about 10%, so that the insulating film 403 is also likely to be removed. (It remains in FIG. 56B.) Therefore, when forming the through hole, a process of completely etching including the insulating film 403 is desirable. In this case, since sufficient over-etching can be performed, a through-hole that completely penetrates to the second surface 401-S2 of the substrate 401 can be formed.

When the through holes are formed, the substrate sidewalls 404-2 and 404-3 have a large aspect ratio and may become unstable. Therefore, the thin plate 410 can be attached to the second surface side in advance. The thin plate 410 is preferably an insulating substrate made of glass, ceramic, plastic, polymer material or the like, but can also be used as a conductive substrate or a semiconductor substrate if the structure or process is devised. The thin plate 410 may be attached after the insulating film 403 is formed on the second surface 401 -S 2 of the substrate 401. When deep etching is performed on the substrate 401, if the conditions for increasing the etching selectivity between the substrate 401 and the thin plate 410 are used, the amount of etching the thin plate 410 can be reduced, so that a through-hole is also opened in the thin plate 410. There is nothing.

As a method for attaching the thin plate 410 to the substrate 401, for example, various methods such as a method using an adhesive, a room temperature bonding, a high temperature fusion method, or an electrostatic bonding can be used. For example, when the substrate is a silicon substrate, electrostatic bonding can be performed by an anodic bonding method using a glass substrate as the thin plate 410. It is desirable that the photosensitive film 404 is not lost when the substrate 401 is etched. However, if the insulating film 402 is formed, the substrate 401 is not damaged.

Next, the photosensitive film 404 is removed using ashing, a photosensitive film peeling solution, or the like. Thereafter, an insulating film 407 is formed. This insulating film is a silicon oxide film (SiOx), a silicon nitride film (SiNy), a silicon oxynitride film (SiOxNy), or the like, and is laminated by a CVD method or a PVD method. A thermal oxidation method may be used. The insulating film 407 is also laminated inside the through hole 406 (406-1, 2, 3). Next, a conductor film 408 is stacked. The insulating film 407 protects the insides of the through holes 406 (406-1, 2, 3), the substrate side walls 401 (401-1, 2) and the surface of the substrate 401, and electrically connects the conductor film 408 and the substrate 401. Laminated for the purpose of preventing contact. The film thickness of the insulating film 407 is about 0.1 to 2.0 μm. If the above purpose can be achieved, there is no need to laminate. For example, when the substrate 401 is an insulating substrate, the conductor film 408 can be stacked without forming the insulating film 407 after forming the through holes 406 (406-1, 2, 3). The thickness of the conductor film is about 0.1 μm to 2.0 μm. Since it is necessary to laminate the inside of the through hole 406, it is necessary to laminate the surface of the substrate 401 to be thick to some extent.

The conductor film 408 is made of a metal or alloy such as aluminum, copper, tungsten, nickel, titanium, chromium, gold, silver, zinc, lead, tin, or titanium nitride, tantalum nitride, conductive polycrystalline silicon film, conductive amorphous A silicon film, a conductive polymer, a conductive rubber, or the like. Since it is necessary to laminate also inside the through-hole 406 (406-1, 2, 3), it can laminate | stack by CVD, PVD, ion plating, plating, etc. Next, a photosensitive film 409 is formed and necessary windows are opened. In the through hole 406 (406-2, 3) serving as a capacitor space, the conductor film on the substrate side wall 401 (401-1, 2) side becomes one electrode of the capacitor, and the substrate side wall 401 (401-1, 2) and Since the conductive film on the substrate 401 side that surrounds the opposing through-holes 406 (406-2 and 3) serves as the other electrode of the capacitor, it is necessary to separate these electrodes. The photosensitive film 409 formed on the bottom portions 406-2B and 406-3B of the through holes 406 (406-2 and 3) is removed. In addition, when there is a substrate 401 that connects the substrate side wall 401 (401-1, 2) side and the substrate 401 opposite to the substrate 401, the conductive film 408 is also laminated on this portion. The film 409 is removed. The photosensitive film of the part which becomes the electrode of the capacitor, the wiring part for drawing out the electrode, and the part where other necessary wiring is formed is left. The thickness of the photosensitive film 409 is about 0.1 μm to 3 μm, but the bottom of the through hole may be thicker than these values. It only needs to have a thickness that allows exposure light to enter.

Further, the conductor film 408 in the central through-hole 406-1 is not necessary in this device, so it may be left or removed. When the conductor film 408 in the central through-hole 406-1 is left, the capacitor characteristics are not affected. In the case of an acceleration sensor device, it is better to make the substrate side walls 401-1 and 401-2 heavy, so that they may be left so as not to affect the characteristics of the capacitor. In order to form the photosensitive film 408 so as to be patterned inside the through hole, for example, an electrodeposition method is used. Alternatively, the dry film can be attached to the substrate surface to soften the dry film and put into the through hole. Or a photosensitive film | membrane can also be laminated | stacked by CVD method or PVD method, and can also be formed in the board | substrate side surface inside a through-hole.

After the formation of the photosensitive film, necessary heat treatment or environmental treatment is performed to increase the sensitivity of the photosensitivity, and then exposure is performed. Since it is only necessary to remove the photosensitive film on the bottom of the through hole and the side surface of the through hole (if there is a side surface, there is no side surface if the through hole is connected around), for example, if the photosensitive film is a negative type, Light is irradiated to the photosensitive film formed on the substrate side walls 401-1 and 401-2 and the photosensitive film formed on the side of the substrate 401 facing the substrate side walls 401-1 and 401-2. Light is applied to other areas where the photosensitive film is to be left. If development processing is performed thereafter, the photosensitive film in the portion irradiated with light can be left. The opposite is true for the positive type. Bake necessary after development. The exposure can be performed by an oblique exposure method. (FIG. 56C) Next, the patterned photosensitive film is baked.

Next, the conductor film 408 is etched using the patterned photosensitive film 409 as a mask. Etching is wet or dry etching. FIG. 56D is a view showing a state after the conductive film 408 is etched and the photosensitive film 409 is removed. In the through hole 406-2, 408-1 serving as one electrode of the capacitor and 408-2 serving as the other electrode are formed. In addition, in the through hole 406-3, 408-3 serving as one electrode of the capacitor and 408-4 serving as the other electrode are formed. Further, the conductor film in the central through hole 406-1 is removed. Necessary wiring is connected to each conductor film electrode.

Next, as shown in FIG. 56E, an insulating film 411 is stacked on the conductor film 408. The insulating film 411 functions to protect the conductor film 408 and prevent a short circuit between the conductor films separated by moisture or the like. The insulating film 411 is, for example, a silicon oxide film (SiOx), a silicon nitride film (SiNy), a silicon oxynitride film (SiOxNy), etc., and is laminated by a CVD method or a PVD method. The thickness of the insulating film 411 is about 0.5 μm to 2 μm.

Next, as shown in FIG. 56F, a thin plate 413 is attached on the substrate 401 so as to close the through hole 406. This adhesion is performed by, for example, an adhesive or normal temperature bonding. In particular, the upper sides of the substrate side walls 401-1 and 401-2 are restricted by the thin plate 413. As a result, the substrate side walls 401-1 and 401-2 become diaphragms whose surroundings are restricted, and the diaphragm is deformed by sound wave vibration and acceleration. The thin plate 413 is preferably an insulating substrate, but a conductive film or a semiconductor substrate can also be used. If, for example, a glass substrate is used as the insulating substrate, the inside of the through hole can be observed. The thickness of the insulating substrate is about 100 μm to 1000 μm, and may be further reduced by polishing or etching. After the bonded substrate is attached as the thin plate 413, the bonded thick substrate may be removed to leave a thin substrate. In this case, it can be made thinner than the above 100 μm, and can be about 10 μm. The thin plate 413 also serves to protect the through hole.

A necessary portion of the thin plate 413 is removed. For example, vent holes 415 (415-1, 2) are formed in the thin plate 413 covering the through hole 406-1. The purpose of these vent holes 415 is to prevent the internal pressure from fluctuating. Alternatively, liquid can be put inside through the vent hole 415. The size of the vent hole 415 is about 1 μm to 10 μm, but the size of the through hole 406-1, the optimum liquid inlet size, the optimum sound wave inlet size, and the optimum vent size may be used. Liquid can be easily put into the through-hole 406-1 by putting liquid from another vent 415-2 while removing air or the like in the through-hole 406-1 from one vent 415-1. After filling the necessary amount of liquid, if the vent hole 415 is closed, then the liquid will not leak outside. Moreover, what is necessary is just to select the optimal magnitude | size of a vent hole also when introduce | transducing a sound wave into the through-hole 406-1.

It is desirable that vent holes 416 (416-1, 2) are also opened in the thin plate 413 covering the through holes 406-2, 406-3. With these vents, the atmospheric pressure in the through holes 406-2 and 3 can be kept constant by the deformation of the substrate side walls 401-1 and 401-2. The size of the vent 416 (416-1, 2) is about 1 μm to 10 μm, but may be appropriately selected according to the size of the through holes 406-2, 3.

Further, the thin plate 413 in the electrode extraction region 417 (417-1, 2) to the outside is also removed. Thereafter, necessary portions of the insulating film 411 are removed, and contact portions 418 (418-1, 2) of the conductor film 408 are formed. Necessary wiring can be connected to the contact 418, wire bonding, or bumps can be connected. The removed portions 415, 416, and 417 of the thin plate 413 are attached to the thin plate 413 and then patterned using a photolithographic method to etch (dry or wet) necessary portions of the thin plate 413, remove the laser, or remove the liquid jet. It can be removed by etc. Alternatively, a thin plate 413 in which necessary windows are opened in advance may be attached. Alternatively, a vent hole or the like can be provided in the thin plate 410.

As can be easily understood from the above-described device process of the present invention, when the substrate 401 is a semiconductor substrate such as a silicon substrate, it can be mounted together with an IC, a transistor, or the like. Therefore, acceleration and sound waves can be easily detected by directly connecting the device of the present invention to an IC having an acceleration detection circuit, a sound wave detection circuit, and the like. In addition, since the above-described insulating film and conductor film can also be used for those used in ICs and transistors, the same process can be employed, and the load on the process can be reduced, so that an inexpensive sensor can be manufactured. Furthermore, if the concave portion provided in the silicon substrate is used instead of the through hole, the thin plate 410 attached to the second surface 401-S2 is not necessary.

FIG. 57 is a diagram showing another method of forming the electrode of the capacitor. In the embodiment shown in FIG. 57, the substrate is a semiconductor substrate such as silicon. The sensor structure shown in FIG. 57 has a through-hole 431-1 having a rectangular shape (square in cross section, three-dimensionally rectangular parallelepiped) in the center, and substrate side walls 421-1, 2, 3, 4 sandwiched around it. It has a structure in which four through holes 431-2, 3, 4, and 5 are arranged. After the through holes 431 (431-1 to 5-1) are formed in the substrate 421, an insulating film 432 is formed on the substrate 421. Thereafter, a photosensitive film 433 is formed on the insulating film, and the photosensitive film 433 is exposed, developed, and patterned. FIG. 57 shows this state. Thereafter, the insulating film 432 in the opened portion using the patterned photosensitive film 433 as a mask is removed by etching, the substrate 421 is exposed, and a diffusion layer is formed from the exposed portion.

The opening of the photosensitive film 433 is a portion around the through-hole 431 (431-2 to 5) serving as a capacity space and a necessary diffusion layer. FIG. 57 is a plan view (viewed from above parallel to the substrate surface). In the through hole 431-5, the side surface 431-5-1 of the substrate side wall 421-4, the side surface 431-5-2 of the substrate 421 facing this, the side surfaces 431-5-3, 431-5 orthogonal to these side surfaces. There are four substrate sides of -4. Although these side surfaces are covered with an insulating film, the photosensitive film in this portion is opened in order to etch away the insulating films on the side surfaces 431-5-1 and 431-5-2 serving as electrodes. The remaining two substrate side surfaces 431-5-3 and 431-5-4 are not removed by etching, and are therefore covered with photosensitive films 433 (433-5-1 and 433-5-2). There is no substrate 421 at the bottom 431-5-5 of the through hole 431-5.

When the thin plate is adhered, the thin plate exists and the insulating film 432 is formed thereon. In the case where the thin plate is an insulator, even if the insulating film 432 is eliminated, there is no particular problem because the diffusion layer is not conductive even if it is formed. When the thin plate is a semiconductor, the capacitor electrode does not conduct when an insulating film is sandwiched between the thin plate and the substrate 421. When the substrate is not a through-hole but a recess, the substrate 421 is a semiconductor substrate. Therefore, when the insulating film 432 is removed and a diffusion layer is formed, conduction between the electrodes of the capacitor is established, so the bottom 431-5 of the recess 431-5 It is necessary to leave the insulating film 432 on −5. Therefore, a photosensitive film is also formed on the bottom 431-5-5 of the recess 431-5.

On the surface of the substrate 421, the flat surface 421-4-1 on the side surface side of the through hole 431-5 in the substrate side wall 421-4, and the flat surface 421-8 on the side surface side of the through hole 431-5 in the substrate 421-8 opposite thereto. The portion -1 is opened as shown in FIG. Further, the photosensitive film 433 is also opened in the portions 435 and 436 that are connected to these and become wiring regions. The same applies to the through holes 431-2 to 431-4.

Next, using the photosensitive film 433 as a mask, the insulating film 432 in the portion where the photosensitive film 433 is not present is removed by etching. The insulating film 432 is etched by wet etching or isotropic dry etching. When the insulating film 432 is a silicon oxide film (SiOx), wet etching such as buffered hydrofluoric acid solution (BHF) or diluted hydrofluoric acid solution, or plasma etching using CF4, C2F6 gas, or the like is used. By this etching, a semiconductor substrate (for example, a silicon substrate) is exposed in a portion where the photosensitive film 433 is not present.

Next, the photosensitive film 433 is removed, and an impurity element having a conductivity type opposite to that of the semiconductor substrate is diffused. For example, when the silicon substrate is P-type, N-type phosphorus, antimony, arsenic, etc. are diffused. When the silicon substrate is N-type, P-type boron (B) or the like is diffused. As these diffusion methods, first, after pre-deposition, a diffusion heat treatment is performed, an insulating film containing an impurity element (for example, PSG or BSG) is stacked, a diffusion heat treatment is performed, or ions are implanted and activated. And a method of performing diffusion heat treatment. In the region where the substrate without the insulating film 432 is exposed by the diffusion treatment of these impurity elements (in the case of the ion implantation diffusion method, the insulating film 432 may be left entirely or to some extent). It is formed.

The impurity concentration of this impurity diffusion layer is about 10 × 10 ¹⁹ / cm 3 to 10 × 10 ²² / cm 3 and the resistivity is as small as about 0.02 Ωcm or less, so that it can be used as a wiring or an electrode. As a result, even if no conductor film is formed, in the through holes 431 (431-2 to 5), the side surfaces of the substrate side walls 421 (421-1 to 4) and the side surfaces of the substrate facing these serve as electrodes to form capacitors. it can. For example, the capacitance can be measured by forming capacitors in the side holes 421-4-1 and 421-8-1 in the through hole 431-5 and applying a voltage to the diffusion wiring layers 435 and 436. In the structure shown in FIG. 57, it is not necessary to stack a conductor film as a capacitor electrode.

FIG. 58 is a diagram showing a structure and a manufacturing method when a diffusion layer is used for a capacitor electrode in the sensor of the present invention having an annular structure. This sensor has a central circular through-hole 452-1, a substrate side wall 451-1 surrounding the circular through-hole 452-1, an annular through-hole 452-2 surrounding it, and a thick substrate surrounding it. After the through hole 452 is formed, an insulating film 455 is formed, and a photosensitive film 457 is formed on the insulating film 455. The insulating film 455 is stacked over the entire surface such as the surface of the substrate 451 and the inside of the through hole 452. The photosensitive film 457 is subjected to necessary patterning.

In the present embodiment, the photosensitive film 457 is not formed on the substrate side wall 451-1. (Developed and removed.) (There is also a method of patterning the substrate side wall 451-1 with the photosensitive film 457.) The side surface of the substrate 451-2 surrounding the outside of the through hole 452-2 In the insulating film 455 formed on the surface, the photosensitive film 457 is patterned. That is, since it is necessary to divide and form an electrode in this part, the photosensitive film 457 corresponding to it is patterned. The photosensitive film 457 is also patterned on the surface of the substrate 451 in order to form wirings and the like. The photosensitive film 457 is removed from the side surface of the substrate outside the through-hole 452-2 and the surface portions 451-2-1, 2, 3,. Pattern 457-1, 2, 3, 4,... 451-2, 1, 2, 3,. This is because this portion becomes an electrode of each capacitor.

After patterning the photosensitive film 457, the insulating film 455 is removed by etching. In the embodiment shown in FIG. 58, the insulating film formed on the substrate side wall 451-1 is also removed by etching. 58, the substrate is a semiconductor (for example, silicon), and the thin plate attached to the back surface of the substrate 451 is an insulator such as a glass substrate or a ceramic substrate. Therefore, the insulating film 455 is removed from the bottom of the through hole 452. There is no particular problem. (Note that this process can also be performed without attaching a thin plate.) The insulating film in the portion where the photosensitive film 457 is not present is removed, and the semiconductor substrate is exposed. In the subsequent impurity diffusion process, an impurity diffusion layer is formed in a portion where the photosensitive film 457 is absent. Note that when the impurity element is introduced into the semiconductor substrate by ion implantation, part or all of the insulating film may be left. For example, an impurity diffusion layer is formed in 451-2-1, 2, 3,..., And these serve as one electrode of the capacitor. These individual electrodes / wirings are patterned so as not to be connected to each other. The other electrode of the capacitor is the substrate side wall 451-1. A polygonal sensor or the like can also use the impurity diffusion layer as an electrode / wiring with the same structure and method.

FIG. 59 is a diagram showing the structure of the charge storage type sensor of the present invention. This charge storage type sensor can be used for a microphone, for example. The substrate side wall 501 (501-1, 501-2) is surrounded around the central through hole 511 (511-1). Further, a through hole 511 (511-2, 511-3) surrounds the periphery. A thick substrate 501 (501-3, 4) surrounds the through hole. The through holes 511 (511-2, 3) form a capacitor serving as a capacity space, and the electrode is a diffusion layer formed in the substrate 501 shown in FIGS. For example, in the through hole 511 (511-2), the diffusion layer 503 (503-1) formed on the substrate 501 (501-3) and the diffusion layer 503 formed on the substrate side wall 501 (501-1) are two electrodes. Become. In addition, in the through hole 511 (511-3), the diffusion layer 503 (503-2) formed on the substrate 501 (501-4) and the diffusion layer 503 formed on the substrate side wall 501 (501-2) include two electrodes. Become.

Two insulating films 513 and 515 are formed on the diffusion layer 503. The insulating film 513 is a silicon oxide film (SiOx), and the insulating film 515 is a silicon nitride film (SiNx) or a silicon oxynitride film (SiNyOx). Further, a silicon oxide film or a silicon oxynitride film (SiNyOx) may be laminated on the silicon nitride (SiNy) film. By forming a two-layer film or a three-layer film in this way, charges (minus or plus) can be trapped in these films (indicated by 520), and the voltage applied between the capacitors can be lowered. For example, when the change amount of the substrate side wall 501 (501-1, 2) due to the sound wave is small, it is difficult to detect because the capacitance change of the capacitor is small. However, a minute change amount is detected by increasing the voltage level. It becomes possible. However, it is difficult to supply a high voltage from the outside. However, if charges are accumulated in the dielectric film (electret), it is not necessary to supply a high voltage from the outside. The inventive microphone device can be operated.

The voltage is supplied to the diffusion layer 503, which is a capacitor electrode, by pulling out the diffusion layer wiring shown in FIG. 59 to the substrate surface and forming a contact hole 517 in the insulating films 513 and 515 to form a conductor such as an aluminum film or polysilicon film Connect with membrane 518. Thereafter, as described above, an insulating film serving as a protective film is laminated, and a thin plate is covered on the through hole 511. As a method of trapping charges in dielectric films (insulator films) 513 and 515 such as a silicon oxide film and a silicon nitride film, an X-ray irradiation method or a corona discharge is used in a process after the formation of the silicon oxide film or the silicon nitride film. There is a method using a method. It is to be noted that charge storage is possible even when the insulating film 513 is a silicon nitride film (SiNx) or a silicon oxynitride film (SiNyOx) and the insulating film 515 is a silicon oxide film (SiOx). These insulating films can be formed by thermal oxidation or thermal nitridation, or can be stacked by a CVD method or a PVD method. The thicknesses of these insulating films are preferably 50 nm to 1000 nm for silicon oxide films (SiOx) and 10 nm to 1000 nm for silicon nitride films (SiNx) and silicon oxynitride films (SiNyOx).

The sensor of the present invention can be mounted on a substrate together with an IC and a transistor by using a semiconductor substrate such as silicon as a substrate. Further, the insulating film and conductor film forming process other than the through hole forming process and the thin plate attaching process can be performed simultaneously with the IC and transistor manufacturing process. The through hole forming process and the thin plate attaching process can also be used for the IC. Therefore, the characteristics of the sensor of the present invention (capacitance characteristics of the capacitor) can be directly connected to the arithmetic processing circuit of the IC to calculate a sound wave signal and acceleration. This can greatly reduce the overall cost as compared with the conventional means in which the sensor and the IC are separately manufactured, mounted on the mounting substrate, and the respective electrodes are connected by wire bonding or the like. . For example, the cost of manufacturing each chip can be reduced, the mounting area can be greatly reduced, and two good products can be determined together, and the yield can be greatly improved.

The sensor of the present invention can be manufactured using an imprint process. FIG. 60 is a diagram showing a manufacturing method of the sensor according to the present invention by an imprint process. The sensor of the present invention described so far uses a semiconductor substrate such as a silicon substrate as a substrate side wall when manufactured in a substrate together with an active device such as an IC or a transistor. In contrast, in this embodiment, a recess is formed in the semiconductor substrate, the recess is filled with a polymer, and a recess (second recess) is formed in the polymer by an imprint method. This second recess corresponds to the through hole (recess) of the acceleration sensor or microphone device described so far.

In FIG. 60A, a region for manufacturing an active device such as an IC in the semiconductor substrate 611 is A, and a region for manufacturing the sensor of the present invention is B. In the region B, the substrate 611 is etched and thinned in the region where the sensor is to be formed. The purpose of this is to make the sensor region and the A region of the present invention at the same level and to easily form a thick polymer.

As shown in FIG. 60A, a recess 614 is formed in B of a region 611 in the substrate where a piezoelectric device is to be formed. A resist pattern is formed by using a photolithography method or an imprint method, and the concave portion 614 is formed by wet etching or dry etching. An inclined surface 616 (shown by a broken line) may be formed in the concave portion so that the polymer can easily enter the concave portion 614. For example, when the substrate 611 is a (100) silicon substrate, an inclined slope {(111) plane} can be obtained by etching with a KOH solution. Alternatively, isotropic etching is possible with a hydrofluoric acid-based etching solution, and isotropic etching is also possible by dry etching.

Next, as shown in FIG. 60B, a polymer 615 is applied and the like is thickly laminated in the recess 614. An insulating film may be formed over the substrate 611 before the polymer 615 is applied. Thereafter, heat treatment is performed to soften, and the convex pattern 619 of the mold 617 is pressed against the polymer 615 as shown in FIG. When the mold 617 is pulled out after the polymer 615 is cured, a recess 621 is formed in the thickly laminated polymer 615 in the recess region 614 in the substrate 611. {FIG. 61 (e)} In this way, a recess (first recess) 614 is formed in the substrate 611, and a recess (second recess) 621 is formed in the polymer 615 applied to this portion, thereby providing a semiconductor substrate. A sensor can be formed in 611.

In FIG. 60B, an insulating film may be formed before polymer application to improve adhesion with the polymer 615 and the like. The polymer 615 may be softened by attaching a sheet-like polymer, and the polymer may be put into the recess 614 in the substrate 611. The depth of the recess (first recess) 614 is determined by the depth of the sensor capacitive space (second recess) or the depth of the central cavity (second recess). When the depth of these second recesses is H1, the depth H0 of the first recess is preferably about 1 to 50 μm deeper than H1. (Strictly speaking, the thickness from the substrate surface is added to H1.)
The polymer 615 is a thermoplastic resin, a thermosetting resin, or an ultraviolet curable resin if classified from the curing system. For example, fluororesin film, polyethylene film, PMMA (polymethyl methacrylate), polycarbonate, polystyrene, acrylic resin, ABS resin, vinyl chloride, liquid crystal polymer, polyvinyl alcohol (PVA), polypropylene (PP), polyethylene (PE), N- Methyl-2-pyrrolidone (NMP), acrylic resin (PMMA), polydimethylsiloxane (PDMS), polyimide resin, polylactic acid, various rubbers (natural rubber and synthetic rubber), or polyvinylidene fluoride (PVDF), vinylidene fluoride Ferroelectric polymers such as trifluoroethylene (VDF / TrFE) copolymer, vinylidene fluoride tetrafluoroethylene (VDF-TeFE), vinylidene cyanide-vinyl acetate copolymer, polar polymers such as nylon-11, etc. of A variety of polymeric materials such as conductive polymers.

A solution in which these materials are dissolved with a solvent or the like is applied and dropped to form a polymer film layer. If necessary, after prebaking or the like, the mold is pushed into the polymer film layer 615. Then, if it is a photocurable resin, it is irradiated with light such as ultraviolet rays to cure the polymer. If there is, the polymer is softened once at the softening temperature or higher, and then the polymer is cured by lowering the temperature below the softening temperature. Alternatively, in the case of a heat-softening resin sheet, the polymer is softened at a softening temperature or higher, and then the polymer is hardened at a softening temperature or lower after the mold is pressed.

That is, as shown in FIG. 60C, a mold 617 in which a mold pattern 619 for forming a recess is formed is pressed onto a polymer 615 formed in a recess 614 of a substrate 611. For example, the polymer 615 is a thermoplastic resin (glass transition temperature Tg) and is pushed into the polymer 615 at a temperature higher than Tg. The entire mold 617 may be put into the polymer 615 and pushed in, or may be put into the polymer 615 with a slight gap. In the case of opening a gap, the volume of the polymer 615 changes after curing, and therefore the gap interval is selected in consideration of the volume change. Specific examples of thermoplastic resins include polycarbonate (PC), acrylic (PMMA), polylactic acid (PLA), polyethylene terephthalate (PET), polystyrene (PS), liquid crystal polymer (LCP), polyvinyl chloride (PVC), and polyacetal. (PCM), polypropylene (PP), various rubbers (natural rubber and synthetic rubber), and the like, but are not limited thereto. The polymer 615 may be a thermosetting resin such as a phenol resin, an epoxy resin, a melamine resin, or a polyimide, but it should be noted that once it is cured, it cannot be softened even when heat is applied. In the case of a thermoplastic resin, it can be softened any number of times. For example, even if pattern collapse occurs, it may be softened again and the molding may be pushed in.

After the pattern 619 of the mold 617 is pushed into the polymer 615, the polymer 615 is cured when cooled and lower than Tg. Thereafter, when the mold 617 is pulled up, as shown in FIG. 60E, the pattern 619 of the mold 617 is transferred into the polymer 615 to form the recesses 621 (621-1, 2, 3). If a mold release agent is applied to the mold surface before inserting the mold into the polymer, it becomes easy to separate the mold from the cured polymer after the polymer is cured.

If an ultraviolet curable polymer is used, the polymer 615 can be cured even at room temperature. A UV polymer 615 that cures when irradiated with ultraviolet light is used to push the molds 617 and 619 into the polymer 615 and then cure the polymer 615 through the molds 617 and 619 and / or through the substrate 611 and the insulating film 613. Irradiate light. The light of this wavelength is mostly ultraviolet rays, γ rays, X rays and the like. Therefore, the molds 617 and 619, the substrate 611, and the insulating film 613 are made of materials that can transmit these lights. For example, it is made of glass or quartz. After the polymer 615 is cured by ultraviolet irradiation, when the molds 617 and 619 are pulled out, the recess 621 is formed. A mold release agent may be applied to the surfaces of the molds 617 and 619 before the molds 617 and 619 are put into the polymer 615 so that the polymer 615 does not adhere to the molds 617 and 619 and pattern collapse occurs. Alternatively, the surfaces of the molds 617 and 619 may be coated with a fluororesin or the like. Thereafter, heat treatment may be performed to further ensure the curing.

Thereafter, the polymer 615S formed on the surface of the substrate 611 or the polymer 615B formed on the bottom of the recess 615 may be removed. For example, anisotropic etching using oxygen plasma may be performed on the entire surface of the substrate (the entire surface from the upper surface of the polymer 615). Since the entire surface is anisotropic etching, not only the polymer 615B at the bottom of the recess but also the polymer 615S is etched, so that the overall thickness of the polymer 615 is reduced. However, the shape of the recess 621 and the polymer side wall 615 (615-1 to 615-1) are reduced. The shape of 3) is maintained. However, over-etching is required to remove the polymer 615B at the bottom of the recess throughout the substrate. When the polymer 615B is etched first, the underlying insulating film 613 (the substrate 611 in the absence of the insulating film 613) is exposed. It is not etched and is not so etched even in the silicon nitride film system. On the other hand, since the upper surface of the polymer is etched, if the over-etching is performed excessively, the recess depth H1 decreases. Therefore, in order to reduce the over-etching amount, it is necessary to reduce the variation in the anisotropic etching amount of the polymer caused by oxygen plasma and at the same time reduce the thickness of the polymer 615B at the bottom of the recess as much as possible. The variation in the depth of the mold pattern 619 is reduced, the variation in the flatness of the mold body 617 is also reduced, and the mold pressing pressure is made uniform over the entire substrate. In order to make the press pressure of the mold uniform over the entire substrate, the mold pattern 619 is preferably disposed uniformly over the entire substrate. Further, when the polymer 615B at the bottom of the concave portion is etched and the base begins to be exposed, reactive species such as CO are reduced, and the end point can be determined by sensing the amount thereof.

The concave portion 621-1 formed in the center is for introducing sound waves if it is a microphone, and is a portion that receives acceleration or a portion that contains liquid if it is an acceleration sensor. The polymer substrate side walls 615-1 and 615-2 are disposed so as to surround the central recess 621-1. The polymer substrate side walls 615-1 and 615-2 become diaphragms that are deformed by sound waves or acceleration. There are recesses 621-2 and 621-3 serving as capacity spaces on the outside, and polymer substrates 615-3 and 615-4 exist surrounding the capacity space. Since these polymer substrates 615-3 and 615-4 are regulated by the semiconductor substrate 611, they are hardly deformed even by acceleration or sound waves. Thus, the sensor of the present invention using the recess (second recess) formed in the polymer formed in the substrate recess (first recess) has the through holes and recesses formed in the substrate described above. The structure of the sensor of the present invention using the same is the same. In addition, although the recessed part in a polymer was formed by the imprint method, it cannot be overemphasized that it can also form with the normal photolitho method and an etching method.

The subsequent process is the same as the sensor manufacturing process of the present invention described so far. That is, as shown in FIG. 60F, the insulating film 623 is formed over the recess 621 and the substrate. This insulating film is formed of a silicon oxide film, a silicon nitride film, a silicon oxynitride film or the like by a CVD method or a PVD method. The thickness of the insulating film is about 0.1 μm to 1.0 μm. Next, a conductor film 625 is laminated and subjected to desired patterning to form electrodes / wirings 625 (625-1, 2, 3, 4). The conductor film 625 is made of metal such as aluminum, copper, iron, zinc, gold, platinum, titanium, tungsten, molybdenum, chromium, tantalum, lead, tin, or an alloy thereof, other various alloys, or a conductive polymer. It is formed by PVD method, CVD method, ion plating method, plating method or the like. The insulating film 623 is for the purpose of improving the adhesion with the conductor film 625 and ensuring the insulating property. However, since the polymer 615 is an insulator, the insulating film 623 is unnecessary if these purposes can be achieved. The thickness of the conductor film is about 0.1 μm to 2.0 μm. As described above, the patterning of the conductor film can be performed by an electrodeposition method, a method using a photosensitive sheet, a method of forming a photosensitive film by a CVD method or a PVD method, or a normal coating method. it can.

In the recess 621-2, a capacitor is formed by the electrodes / wirings 625-1 and 625-2. In the recess 621-3, a capacitor is formed by the electrodes / wirings 625-3 and 625-4. Next, an insulating film 627 is stacked. This insulating film is used to protect the conductor film 625, and is deposited by a CVD method or a PVD method using a silicon oxide film, a silicon nitride film, a silicon oxynitride film, or the like. The insulating film has a thickness of about 0.1 μm to 2 μm. Next, a thin plate 629 is attached to cover the recess 621. Necessary openings and vent holes 631 and 632 are formed. A thin plate 629 in which openings and vent holes 631 and 632 are formed in advance may be attached. The thickness of the thin plate is preferably about 0.05 mm to 1 mm before adhesion, but can be further reduced by polishing or a method using a bonded substrate after adhesion.

In the region of the thin plate opening 632 on the surface of the substrate 611, if necessary, a window is opened in the insulating film 627 to form a contact hole 633. Rewiring may be performed in the contact hole, or a wire bond or bump may be formed to connect to another device. The conductor film 625 can also be used with other devices (transistors, ICs, resistors, etc.) fabricated on a semiconductor substrate, so that the sensor electrode / wiring of the present invention can be directly connected to the wiring of these devices. is there.

In the capacitor of the present invention formed in a polymer, the (polymer) substrate sidewalls 615-1 and 615-2 are a polymer, and therefore the Young's modulus is very small compared to a semiconductor substrate such as silicon. (Young's modulus of silicon is about 130 GPa, polymer is about 0.1 to 5 GPa, rubber is about 0.01 to 0.1 GPa) As can be seen from the above-described formula {y0 = β * F * s ⁴ / (Et ³ )}, the substrate Since the amount of deformation of the side wall is inversely proportional to the Young's modulus, the amount of change in the capacitor capacity can be increased by using a material having a small Young's modulus. Alternatively, the size can be reduced to achieve the same amount of change. For example, since the Young's modulus of PET is about 3 GPa, it is 1/40 of the Young's modulus of silicon (about 130 GPa).

It goes without saying that the sensor manufacturing method of the present invention using the imprint method shown in FIG. 60 can be used not only for the polymer in the recess made in the substrate but also for the polymer made on the substrate.

FIG. 61 is a diagram showing another embodiment of the acceleration sensor of the present invention. In this embodiment, a conductive substrate is used as a substrate, a through hole is formed in the conductive substrate, and the through hole is covered with upper and lower insulator substrates (thin plates). As shown in FIG. 61A, which is a plan view parallel to the conductor substrate 711, the substrate side wall 711 (711-2) of the conductor substrate and the substrate side wall 711 (711-3) of the conductor substrate are arranged in parallel. The through-holes 712 (712-1) between the substrate side walls serve as a capacitance space, and the substrate side walls 711 (711-2) and 711 (711-3) opposed to each other across the space serve as electrodes to form a capacitor. To do.

FIG. 61B is a diagram showing a cross-sectional view in a direction 717 perpendicular to the substrate side walls 711 (711-2) and 711 (711-3) in FIG. An insulating substrate 713 is attached to the lower surface of the substrate side walls 711 (711-2) and 711 (711-3), and an insulating substrate 714 is attached to the upper surface. Insulator substrate 714 has contact holes 716 and 718 formed in part of the region adhering to each of substrate side walls 711 (711-2) and 711 (711-3), and in and on the contact holes, respectively. Conductor films 717 and 719 are formed to form electrodes and wirings. (In FIG. 61 (a), the contact hole 7 and the conductor film are indicated by broken lines.) Each of the substrate side walls 711 (711-2) and 711 (711-3) has a sensor package (sensor PKG) with the through hole 712 interposed therebetween. Frame substrate 711 (711-1).

As can be seen from FIG. 61, the substrate side walls 711 (711-2), 711 (711-3), and the frame substrate 711 (711-1) are completely separated in the substrate 711, and the upper and lower surfaces are insulator substrates. 714 and 713 are attached. Therefore, these board | substrate side walls 711 (711-2), 711 (711-3), and the frame board | substrate 711 (711-1) are not electrically connected. When no acceleration is applied, since the opposing surfaces of the substrate side wall 711 (711-2) and the substrate side wall 711 (711-3) are parallel, the substrate side wall 711 (711-2) and the substrate side wall 711 (711-3). ) Is a parallel plate type capacitor electrode having an inter-electrode distance d of d1. The substrate side wall 711 (711-2) serving as one electrode is connected to the conductor film electrode / wiring 717 through the contact hole 716, and the substrate side wall 711 (711-3) serving as the other electrode is connected to the conductor film through the contact hole 718. Since the electrode / wiring 718 is connected, the capacitance C can be measured by applying a constant voltage to the conductor film electrode / wiring 717 and the conductor film electrode / wiring 718. The capacitance C0 when the inter-electrode distance d is d1 is C0 = ε · ε0 · S0 / d, where the electrode area is S0. (If the length of the substrate side wall is k, S0 = ke.)

When a force is applied to the substrate side wall 711 (711-2) by receiving acceleration in a direction perpendicular to the side surface of the substrate side wall 711 (711-2) (direction 717), only the upper and lower surfaces of the substrate side wall 711 (711-2) are applied. Restricted by the insulating substrates 714 and 713 (there are no other restrictions), and the thickness (width) n (n1) of the substrate side wall 711 (711-2) is thin (thinner than the substrate thickness e). Is a silicon substrate, and when e = 500 μm, about 100 μm or less), the substrate side wall 711 (711-2) is curved. The thickness (width) m (m1) of the substrate sidewall 711 (711-3) facing the substrate sidewall 711 (711-2) is thick (thick with respect to the substrate thickness e. For example, the substrate is a silicon substrate, e = 100 μm or more when 500 μm), there is almost no change with respect to the deformation amount of the substrate side wall 711 (711-2). Therefore, the inter-electrode distance d changes from d1, and for example, in FIG. 61, if the acceleration is to the left, d <d1 is satisfied, so that the capacitor capacity is large, and if the acceleration is to the right, d> d1 is satisfied. Become. (Note that since the substrate side wall 711 (711-2) is curved, d is not constant, and the capacitance is calculated by integrating and calculating the acceleration magnitude from the actual measurement value.)

The conductor substrate 711 is, for example, a silicon substrate having a high impurity concentration. In an N-type silicon substrate, when the impurity concentration is 10 ¹⁹ / cm 3 or more, the resistivity becomes 0.01 Ωcm or less, so that it can be considered as a conductor substrate. In addition, when the impurity concentration is 2 × 10 ¹⁹ / cm 3 or more in the P-type silicon substrate, the resistivity becomes 0.01 Ωcm or less, so that it can be considered as a conductor substrate. Alternatively, other semiconductor substrates having low resistivity can be used. Alternatively, the conductor substrate 711 is a metal or alloy such as copper, aluminum, iron, titanium, nickel, zinc, lead, tin, silver, gold, tungsten, molybdenum, tantalum, or cobalt. Alternatively, the conductive substrate 711 can be made of conductive polymer, graphene, carbon nanotube, or the like. Even when the substrate is not a conductor substrate, a pressure sensor having a similar structure can be manufactured by forming a through groove and then laminating a conductor film around the through groove.

The acceleration sensor shown in FIG. 61 can detect only acceleration in one direction. However, if a sensor having such a structure is formed in various directions, acceleration in various directions can be detected. For example, if the capacitors on the substrate side walls 711-2 and 711-3 are arranged in a variety of directions as a set and surrounded by a frame such as the frame substrate 711-1, the capacitors in various directions are arranged. An acceleration sensor PKG that detects acceleration can be manufactured. In addition, if the vent hole 721 is opened as shown in FIG. 61 (b), the pressure difference from the outside can be eliminated. For example, the internal atmospheric pressure may change due to acceleration, but these changes can be reduced. However, when the intrusion of moisture or the like is expected, a completely sealed through-hole space 712 can be produced without opening such a vent hole 721, so that an acceleration sensor PKG having excellent environmental resistance can be realized. In order to eliminate the internal pressure change, the through-hole space 712 may be completely sealed in a vacuum. This can be realized by performing a process (attachment step) in a vacuum when the thin plates 713 and 714 are attached to the substrate 711 and sealed.

Reference numeral 715 shown by a broken line denotes a scribe line. For example, a number of acceleration sensors PKG of the present invention are connected to a silicon wafer (the pattern shown in FIG. It should be.

FIG. 62 is a diagram showing another embodiment of an acceleration sensor using a conductor substrate. Although this embodiment is similar to the embodiment described with reference to FIG. 53, a conductor film need not be formed on the substrate side wall because a conductor substrate is used. Therefore, the process is very simple as in the case described in FIG. As shown in FIG. 62, there is a prismatic through hole 732 (732-1) having a rectangular cross section (preferably a square cross section) at the center, and around the through hole 732 (732-1). A substrate side wall 731 (731-2) having a similar shape is surrounded, and a through hole 732 is surrounded around the substrate side wall 731 (731-2). A thick substrate sidewall 731 (with a through hole 732 sandwiched between each of the four surfaces 731-2 (731-2-1, 2, 3, 4) of the substrate sidewall 731 (731-2) having a rectangular cross section. 3, 4, 5, 6) are arranged. These substrate side walls 731-2 (731-2-1, 2, 3, 4) and thick substrate side walls 731 (3, 4, 5, 6) serve as counter electrodes, and through holes 732 (732-2, 3, 4). 5) is formed.

Since the substrate side wall 731-2 (731-2-1, 2, 3, 4) has a small thickness (width), the substrate side wall 731-2 (731-2-1, 2) is deformed by a force accompanying acceleration. 3, 4) and the substrate side wall 731 (731-3, 5, 4, 6) opposed to each other have a large thickness (width) and are hardly deformed by a force accompanying acceleration, so that the capacitances of these capacitors change. Insulator substrates (thin plates) 739 and 738 are attached to the top and bottom of the substrate 731, and contact holes opened in the insulating substrate (thin plates) 739 attached on the substrate side walls 731 (731-3, 5, 4, and 6). 736 (736-2, 3 etc.) laminated and patterned conductor film / electrode / wiring 737 (737-2, 3 etc.) and insulating substrate (thin plate) 739 attached on the substrate side wall 731-2. When a constant voltage is applied between the conductive film / electrode / wiring 737 (737-1) stacked and patterned in the contact hole 736 (736-1), the individual capacitance changes of these capacitors are measured. it can.

Since four capacitors shown in FIG. 62 are arranged at intervals of 90 degrees, acceleration can be reliably detected in these four directions. In other directions, the direction of acceleration can be accurately detected to some extent by comparing the capacitances of the capacitors. In order to obtain the orientation more accurately, the polygonal shape may be used instead of the rectangular shape. In order to prevent the substrate side wall 731 (731-3, 4, 5, 6) having a thick side wall from being deformed as much as possible by acceleration, as shown in FIG. For example, it is preferable to increase the adhesion area between the substrate side wall and the insulating substrates 738 and 739 by expanding the region to the region shown by a broken line. The frame substrate 731 (731-1) surrounds the through hole 732 outside the substrate side wall 731 (731-3, 4, 5, 6) having these thick side walls. If necessary, vent holes 741 and 742 can be formed in the through holes as shown in FIG. (FIG. 62 (b) is a cross-sectional view taken along the alternate long and short dash line 735 in FIG. 62 (a). However, in FIG. Not.)

By putting a heavy liquid in the central through-hole 732-1, the acceleration detection sensitivity can be increased as described above. Since the substrate side wall 731-2 (731-2-1, 2, 3, 4) is entirely at the same potential, there is no problem even if the liquid has conductivity. Since the force (F = mα) against the weight of the liquid acts on the substrate side wall 731-2 (731-2-1, 2, 3, 4), the amount of deformation due to acceleration increases.
In FIG. 62, four thick substrate side walls are used, but it is natural that acceleration can be detected by one, two, or three of them.

The structure shown in FIG. 62 can be used for a microphone device by adopting a structure similar to that shown in FIG. That is, by introducing a sound wave into the central through hole 732, the substrate side wall 731-2 (731-2-1, 2, 3, 4) is vibrated, and the substrate side wall 731-2 (731-2) is accompanied by the vibration. The capacitance of the capacitor changes between −1, 2, 3, 4) and the substrate side wall 731-3, 5, 4, 6) facing this. Sound waves can be detected by measuring this signal change. That is, it becomes a microphone device. An opening for introducing a sound wave is provided in part or all of the insulating substrate 738 or 739 covering the central through hole 732-1 so that the sound wave is effectively introduced into the through hole 732-1. In addition, it is desirable to provide an air vent hole in the through hole 732 (732-2, 3, 4, 5, 6) outside the substrate side wall 732 so that the oscillated air can easily escape. However, when the through-hole 732 (732-2, 3, 4, 5, 6) is vacuum, there is no air vibration, so (naturally) such a hole is not necessary. In the case of the microphone device, the thick substrate side wall 731 (3, 4, 5, 6) may be one, two, or three. Further, even when these substrate side walls are connected, sound wave detection is possible. Further, the frame substrate 731-1 may be connected to these substrate side walls. In addition, since the acceleration force is not applied to the microphone ohon device, it is not necessary to make it too thick, so that the substrate side wall and the frame substrate can be made small.

FIG. 63 is a diagram showing another embodiment of the acceleration sensor of the present invention. In the present embodiment, the central through hole has a cylindrical shape with a circular cross section, and its radius is r1. A substrate side wall 751 (751-2) having a circular cylindrical shape with a radius r2 in cross section surrounds the periphery. Therefore, the thickness (width) of the substrate side wall 751 (751-2) is r2-r1. A through hole 752 (752-2) having a circular cylindrical shape with a radius r3 in cross section surrounds the periphery. The through hole 752 has a cylindrical shape with a circular cross section on the inner surface, and is surrounded by a thick substrate side wall 751 (751-3, 4, 5, 6, 7, 8, 9, 10) divided into several parts. It is out. A through-hole 752 surrounds these substrate side walls 751 (751-3, 4, 5, 6, 7, 8, 9, 10), and a frame substrate 751 (751-1) surrounds them. Is a planar structure, but the cross-sectional structure is the same as that of Fig. 61 and Fig. 62. The substrate 751 is a conductive substrate and has one annular electrode 751-2 and a circular side surface having a radius r3 facing the electrode 751-2. The substrate side wall 751 (751-3, 4, 5, 6, 7, 8, 9, 10) which is an electrode forms a capacitor having a capacitance space of 752-2.

When there is no acceleration, the substrate side wall 751-2 is not deformed, and the distance between the capacitor electrodes is r3-r2. When the acceleration is received, the annular substrate side wall 751-2 is deformed. Since the deformation of the substrate side wall 751-2 in the acceleration direction becomes large, of the thick substrate side walls 751 (751-3, 4, 5, 6, 7, 8, 9, 10) facing the large deformation portion. The capacitance of one of the capacitors changes greatly. This direction of change is the direction of acceleration, and the magnitude of acceleration can be found from the amount of change in the capacitance of the capacitor. However, with this alone, the direction of acceleration is one of the divided substrate side walls 751 (751-3, 4, 5, 6, 7, 8, 9, 10), and has a certain width. Therefore, in order to know a more accurate direction, it is possible to obtain the capacitance by comparing the capacitance of the adjacent substrate side wall electrodes. In order to know more accurately, the outer electrode facing the annular electrode 751-2 may be divided more finely. In FIG. 63, it is divided into eight. Further, as described above, if a heavy liquid is put in the central through hole, the deformation amount of the substrate side wall 751-2 becomes large, so that the detection sensitivity to acceleration can be increased.

If r1 = 100 μm, r2 = 20 μm, r3 = 150 μm, and the overall package size (frame substrate size) is 0.5 mm × 0.5 mm × 0.4 mm (thickness), about 60,000 acceleration sensors A chip package can be obtained.
The structure shown in FIG. 63 can also be used for a microphone device. That is, the cylindrical through hole 752-1 may be a sound wave introduction hole. The outer counter electrode may not be divided. Furthermore, since it can be connected to a frame substrate and there is no need to consider deformation due to acceleration, the outer counter electrode can be made smaller, so that the size of the frame substrate, that is, the chip PKG can be further reduced.

Next, a process for producing a force sensor of the present invention using a conductive substrate will be described. FIG. 64 shows a manufacturing method of a process for manufacturing a force sensor of the present invention using a conductor substrate. As shown in FIG. 64A, the conductor substrate 811 has an upper surface (first surface) 811-S and a lower surface (second surface) 811-B. An insulator substrate 813 is attached to the lower surface 811 -B of the conductor substrate 811. In the case where it is not possible to adhere directly to the conductor substrate 811 (for example, when the adhesiveness between the adhesive and the substrate is insufficient), the insulator substrate 813 is attached after the insulating film 812 is laminated, for example. This adhesion method includes a method using an adhesive, a room temperature bonding method, a high temperature (fusion) bonding method, or an electrostatic bonding (anodic bonding). The thickness of the conductor substrate 811 is determined by the characteristics of the force sensor (the amount of deformation of the substrate side wall) and the like, for example, a thickness of 0.1 mm to 2.0 mm. The insulating film 812 is a silicon oxide film, a silicon nitride film, a silicon oxynitride film, or the like.

The insulator substrate 813 serves to hold the substrate side wall when the through hole is formed. It also serves as an etching stopper when the through hole is formed by etching. Next, a photosensitive film 815 for forming a through hole is patterned on the upper surface 811-S of the conductor substrate 811. A photosensitive film 815 is formed on the conductor substrate 811 and a region for forming a through hole is opened by a photolithography method. The photosensitive film is left in the region where the substrate side wall is formed. When the photosensitive film 815 cannot be directly formed on the conductor substrate 811 (for example, when the adhesion between the photosensitive film 815 and the conductor substrate 811 is poor, or when the photosensitive film 815 is not etched when the through-hole is formed, the pattern shape An insulating film 814 may be formed over the conductor substrate 811. The thickness of the photosensitive film 815 is also determined by the etching selection ratio between the conductive substrate 811 and the photosensitive film 815 at the time of forming the through hole. However, when the etching selection ratio is m, the thickness of the conductive substrate 811 is 1 / m. The above thickness is required. For example, when the thickness of the conductor substrate 811 is 500 μm and m = 50, the thickness of the photosensitive film (the thickness of the photosensitive film 815 after the heat treatment after patterning, that is, the thickness immediately before etching) needs to be 10 μm or more.

After the photosensitive film 815 is patterned and heat-treated to cure the photosensitive film 815, the conductor substrate 811 in the opening without the photosensitive film 815 is etched. This etching is desirably anisotropic etching and is formed according to the pattern of the first photosensitive film 815. The pattern of the photosensitive film 815 is also desirably vertical or nearly vertical, and the conductor substrate 811 is etched to be vertical or nearly vertical. When the insulator film 814 exists, the insulator film 814 is also preferably etched into a vertical pattern shape. When the conductor substrate 811 is a silicon substrate (low resistance), a Bosch method, an inductively coupled plasma RIE method (ICP-RIE), an electron cyclotron resonance RIE (ECR-RIE) method, or the like can be used. FIG. 64B is a schematic cross-sectional view after etching.

When the conductor substrate 811 is completely etched in the depth direction (perpendicular to the substrate surface), the insulator substrate 813 is exposed. (When the insulating film 812 is interposed, the insulating film 812 is exposed, and when the insulating film 812 is etched in the depth direction by over-etching, the insulating substrate 813 is exposed.) The conductive substrate 811 and the insulating substrate Since 813 (or the insulating film 812) is a different material, if the conditions such as the etching gas are appropriately selected, the etching selection ratio between the conductor substrate 811 and the insulator substrate 813 (this is n) is sufficiently large. I can take it. Usually, to completely form through holes (all through holes in the substrate), 5% to 20% of the substrate thickness is necessary as overetching. For example, if the substrate thickness is 500 μm, the thickness is 25 μm to 100 μm. It is calculated that the substrate 811 is etched. If n = 50, it is calculated that the insulating substrate is etched by 0.5 μm to 2 μm by over-etching. Since the thickness of the insulator substrate 813 is 10 μm to 500 μm, preferably 50 μm to 200 μm, no hole is opened in the insulator substrate. In the case where the insulating film 812 is provided, the thickness of the insulating film 812 is approximately 0.1 μm to 2 μm, and thus the insulating film 812 may be entirely etched.

Through holes 816 (816-1, 2, 3, 4) are formed by etching the conductive substrate 811. These through holes 816 (816-1, 2, 3, 4) correspond to, for example, the through holes 732 (732-1, 2, 3) and 732 in FIG. Further, the substrate side walls 811 (831-1, 2, 3, 4) correspond to, for example, the substrate side walls 731-2, 731-3, 731-5, 731-1 in FIG. After the through hole 816 is formed, the photosensitive film 815 is removed, and the insulating film 814 is etched if necessary. Thereafter, as shown in FIG. 64 (c), an insulating film 818 is laminated to protect the surface of the conductor substrate 811 (including the exposed substrate surface in the through hole), if necessary, and the insulator substrate 821 Is attached to the upper surface of the substrate 811. This attachment method can also be performed in the same manner as the attachment method of the insulator substrate 813. The thickness of the insulating film 818 is about 0.1 μm to 2.0 μm. The insulating film 814 may be removed by etching, and the insulating substrate 818 may be directly attached to the conductor substrate 811 without stacking the insulating film 818. For example, when the conductor substrate 811 is a silicon substrate and the insulator substrate is a glass substrate, it can be firmly attached by anodic bonding.

Next, as shown in FIG. 64D, contact holes 823 (823-1, 2) are opened in the insulating substrate 821 and the insulating films 818, 814, and the upper surface of the conductive substrate 811 is exposed. A conductor film is laminated in these contact holes 823 to form a conductor film / electrode / wiring pattern 824 (824-1, 2). A capacitor having a capacitance space as a through hole 816 (816-2) is formed between these two conductor films / electrodes / wiring patterns 824 (824-1, 2). In addition, vent holes 822 (822-1, 2) to the through holes 816 can be formed in the insulator substrate. As a method for forming a contact hole or a vent hole in the insulator substrate 821, there is a method of forming by dry etching or wet etching using a photolithography method. When the insulator substrate 821 is a glass substrate, dry etching includes plasma etching using a gas such as CF4 or C2F6. In wet etching, etching can be performed using an HF-based etchant. Alternatively, there is a method of opening a window on the insulator substrate using a laser or high-pressure water flow. An insulator substrate in which contact holes and vent holes are formed in advance may be attached. According to this method, the process of forming the contact hole and the vent hole in the insulator substrate is a separate process, so there is an advantage that the process time can be shortened. Further, the air hole 825 can be formed in the insulator substrate 813.
A sensor (for example, an acceleration sensor or a microphone device) using the conductor substrate of the present invention can be manufactured by the process as described above. Since this process is very short, the process cost is also very low.

FIG. 65 is a diagram showing a method for forming a sensor of the present invention using an insulator substrate or a semiconductor substrate. The difference from FIG. 64 is that a process of forming a conductor film to be a capacitor electrode / wiring is used, but the process is very simple. Since there are many processes similar to FIG. 64, a detailed description of the process is omitted, but can be easily inferred from the contents described in FIG. As shown in FIG. 65A, a support substrate 913 is attached to the lower surface 911-B of the substrate 911. If necessary, an insulating film 912 is interposed. A photosensitive film 915 is formed on the lower surface 911-S of the substrate 911, and patterning for forming a through hole is performed by a photolithography method. If necessary, an insulating film 914 is interposed. The photosensitive film 914 is formed by attaching a photosensitive sheet film (dry film) or applying a photosensitive film and then heat-treating (pre-baking). The substrate 911 is an insulator substrate or a semiconductor substrate. (A conductor substrate may be used, but in the case of a conductor substrate, it can be processed by the method illustrated in FIG. 64.) As an insulator substrate, for example, a glass substrate, a quartz substrate, a ceramic substrate, a polymer resin substrate, a plastic substrate, rubber Such as a substrate. As a semiconductor substrate, for example, a silicon substrate, a germanium substrate, a single element substrate such as a carbon (including diamond, graphene, carbon nanotube, etc.) substrate, silicon carbide (SiC), silicon germanium (SiGe), gallium arsenide (GaAs), indium Binary element substrates such as phosphorus (InP) and gallium nitride (GaN), and other ternary or higher multi-element substrates.

Next, as shown in FIG. 65B, the substrate 911 is etched to form through holes 916 (916-1, 2, 3, 4). Thereby, the substrate side walls 911 (911-1, 2, 3, 4) can be formed. Next, after removing the photosensitive film 915, an insulating film 918 is laminated on the substrate 911 as shown in FIG. The insulating film 914 may be removed or may be left. The insulating film 918 is a silicon oxide film, a silicon oxynitride film, a silicon nitride film, or the like, and is formed by a CVD method, a PVD method, a thermal oxidation method, or a thermal nitridation method. In the case where the substrate 911 is an insulator substrate and adhesion with a conductor film to be formed later is good, this insulating film 918 may not be formed. The thickness of the insulating film 918 is 100 nm to 2000 nm. An insulating film is also formed in the through hole 916. Next, a conductor film 919 is stacked. The conductor film 919 is made of, for example, low resistance polycrystalline silicon (PolySi), various silicide films, various metal films, various alloy films, conductive polymers, conductive rubber, conductive carbon (including conductive carbon nanotubes and graphene). Yes, by CVD, PVD, ion plating, plating, etc. The thickness of the conductor film 919 is 100 nm to 2000 nm. The conductor film 919 is also laminated inside the through hole 916, but it is desirable to be laminated on the entire side surface of the through hole 916.

The conductor film 919 is also stacked on the bottom portion 932 of the through hole 916, but the conductor film 919 in this portion needs to be removed by etching. As the method, a photosensitive film 930 is formed as shown in FIG. 65C, and the photosensitive film is patterned so that the photosensitive film 930 does not exist in the through hole 916 portion. As this method, for example, a photosensitive dry film 930 is attached on the conductor film 918 on the substrate 911 so that the photosensitive film 930 does not exist in the through hole 916 portion by photolithography. In the case where the photosensitive dry film 930 is a negative type, light may be irradiated to the portion where the photosensitive film 930 is left, that is, the upper surface of the substrate side wall (the upper surface of the substrate). In the case where the photosensitive dry film 930 is a positive type, light may be irradiated to a portion where the photosensitive film 930 is removed, that is, the photosensitive film 930 covering the upper portion of the through hole. In the case of a dry film, the film thickness does not become too thick even at the upper part of the through hole, and does not enter the through hole so much even if prebaked (heat treatment performed before exposing the photosensitive film).

In the case where the photosensitive film 930 is a coating film or a dip film, the photosensitive film also enters the through hole 916 and is thick at the through hole 916. Therefore, the negative type photosensitive film (resist) is good, and it is only necessary to expose the upper surface of the substrate having a stable thickness, and it is not necessary to expose the through hole 916 having the thick photosensitive film. A desired pattern can be formed. Since the conductor film 919 needs to be patterned as an electrode and wiring on the upper surface of the substrate, a pattern for that purpose is also formed. In the case of a positive type photosensitive film (resist), it is necessary to expose the thick resist in the through hole 916, so that the photosensitive film in the through hole is removed by irradiating light with a large depth of focus. can do.

Next, as shown in FIG. 65 (d), heat treatment for dripping the edge of the photosensitive film 930 is performed. By this heat treatment, the photosensitive film 930 that covers the upper surface of the substrate side wall 911 (911-1, 2, 3, 4) or the like is softened, and the edge of the photosensitive film 930 hangs down to pass through holes 916 (916-1, 2). 3, 4) to cover the conductive film 919 stacked on the inner surface side (indicated by a hanging photosensitive film 931). The softening temperature of the resist is, for example, 150 ° C. to 200 ° C., and the edge of the photosensitive film 930 can be dripped by heat treatment at a temperature higher than this temperature. Thereafter, the conductive film is anisotropically etched perpendicularly to the substrate surface from the upper surface side of the substrate 911. For example, when the conductor film is aluminum, vertical etching (anisotropic etching) can be performed with a salt taeba base gas (for example, Cl 2 or BCl 3) using a reactive ion etching (RIE) apparatus. For example, when the conductor film is tungsten silicide or low resistance PolySi, vertical etching (anisotropic etching) can be performed by using a reactive ion etching (RIE) apparatus, for example, with a halogen-based gas (for example, Cl2, SF6, HBr).

By this vertical etching of the conductive film, the conductive film 919 stacked on the bottom 932 in the through hole 916 is removed by etching. Of course, the portion of the conductor film covered by the photosensitive film 930 is not etched. The conductor film laminated on the inner surface of the through-hole 916 is not coated with a photosensitive film, but is perpendicular to the substrate surface, so it is not etched from the lateral direction. It remains without being. The conductive film 919 existing on the inner side surface of the through hole is naturally etched if there is no photosensitive film. Since this is covered with the photosensitive film 919, this portion is not etched either. Even if etching ion species enter the through-hole 916 in the vertical direction, the drooped portion 931 serves as a mask, and the conductor film 919 covering the side surface of the through-hole 916 is not etched. If the photosensitive film pattern formed on the upper surface of the substrate side wall 911 is formed slightly larger, the wrinkle region on the inner side surface of the through hole 916 increases. After all it becomes difficult to be etched. Also in this case, if the heat treatment for dripping the photosensitive film is performed, the conductive film 919 on the upper inner surface of the through hole 916 can be reliably covered with the photosensitive film.

Even if it is not a conductor substrate, the planar pattern is the same as the shape shown in FIGS. 61 (a), 62 (a), and 63. Therefore, after laminating the conductor film 919, the substrate sidewall (capacitor electrode) For example, the conductor film 919 on 911-1 and 911-3) is connected only at the bottom of the through hole 916. Therefore, since the conductive film 919 at the bottom of the through hole 916 is removed by the anisotropic etching of the conductive film described above, the conductive material on the substrate side walls (for example, 911-1 and 911-3) to be the capacitor electrodes The membrane 919 separates.

Thereafter, the photosensitive film 930 is removed, and the insulator film 920 is stacked. (If a conductor film is laminated by selective CVD or plating before forming the insulating film 920, a small gap in the conductor film received during etching can be filled with the conductor film. The damage received by the film can be recovered (a conductive film formed by selective CVD or plating is not laminated in a large gap so that a non-conductive pattern does not conduct). SiOxNy, SiNy, which are laminated by CVD or PVD, have a film thickness of 0.1 μm to 2 μm, and protect the conductor film 919 chemically, physically and environmentally. (FIG. 65 (e)), necessary contact holes 924 (924-1, 2), conductor films / electrodes / wirings 923 (923-1, 2), and vent holes 922 are formed. The sensor UNA structure is fabricated a number in the substrate 911, if chip the dicer (dicing), can be prepared a number of sensor chips PKG. (FIG. 65 (f))

By using this process as described above, the sensor of the present invention can be manufactured by a simple process even if an insulator substrate or a semiconductor substrate is used. Since a semiconductor substrate such as silicon is used in this process, the sensor can be manufactured by a process together with an IC and a transistor.

FIG. 66 is a diagram showing a method for manufacturing a sensor of the present invention using a semiconductor substrate such as silicon. In the following description, it is assumed that the semiconductor substrate is a silicon substrate. As shown in FIG. 66A, diffusion layers 952 are formed on both sides of the silicon substrate 951. When the silicon substrate is a P-type wafer, the diffusion layer may be either N-type or P-type, and when the silicon substrate is an N-type wafer, the diffusion layer may be either P-type or N-type. The impurity concentration of the diffusion layer 952 is desirably 10 ¹⁹ / cm ³ or more. The diffusion layer 952 can be formed by, for example, a method of performing heat treatment after ion implantation or a method of performing diffusion heat treatment by pre-deposition. Note that the diffusion layer 952 on the back surface is not particularly necessary and may not be formed.

Next, as shown in FIG. 66B, a support substrate 954 is attached to the back surface of the silicon substrate 951. If necessary, an insulating film 953 may be interposed. A photosensitive film 956 is formed on the upper surface of the silicon substrate 951, and a window for forming a through hole is opened. If necessary, an insulating film 955 may be interposed. Through holes 965 (965-1, 2, 3) are formed by the pattern of the photosensitive film 956. FIG. 66C shows a cross-sectional view after the photosensitive film 956 is removed after the through-hole 965 is formed. A diffusion layer 952 is exposed above the through hole 965. Next, the insulating film 955 is removed by etching. As a result, the entire diffusion layer 952 is exposed on the upper surface of the silicon substrate 951 and the upper portion of the through hole 956. A conductor film 957 is laminated in this exposed state. The conductor film 957 is laminated on the upper surface of the silicon substrate and inside the through hole, and comes into contact with the diffusion layer 952 exposed on the upper surface of the silicon substrate 951 and the upper portion of the through hole 956.

Next, in order to form the conductor film 957 in a desired pattern, the photosensitive film 958 is patterned, and the conductor film 957 is etched according to this pattern 958. {FIG. 66 (e)} In FIG. 65, the photosensitive film is patterned so as to cover the upper surface of the substrate side wall and cover the upper part of the side surface of the through-hole. Such patterning may not be performed. That is, patterning may be performed within the region of the diffusion layer 952 on the upper surface of the silicon substrate 951, and severe mask alignment is necessary (in FIG. 65, alignment of the edge of the through hole and the edge of the photosensitive film is necessary). However, severe mask alignment is not necessary in this embodiment. When the conductive film 952 is etched according to the photosensitive film 958 pattern, as shown in FIG. 66E, the conductive film 957 is etched in the region A where the photosensitive film 958 does not exist on the upper surface of the silicon substrate, and the diffusion layer 952 is formed. Exposed. Since the etching of the conductor film 957 is anisotropic (vertical) etching, the conductor film 957 laminated on the side surface of the through hole 965 is thick in the vertical direction (relative to the surface of the silicon substrate 951). In the upper C region, the conductive film 957 remains without being etched. That is, the conductor film is in contact with the diffusion layer 952 exposed on the side surface of the through hole 965. Further, since the vertical etching is performed, the conductor film 957 existing in the bottom B region of the through hole 965 is removed by etching.

Thereafter, the photosensitive film 958 is removed and heat treatment is performed, so that an ohmic contact with the conductor film 957 and the diffusion layer 952 can be obtained. For example, when the conductor film 957 is aluminum, heat treatment (alloy) is performed at about 350 ° C. to 450 ° C. Thereafter, an insulating film 959 is stacked. This insulating film 959 protects the conductor film 957 and the through hole 965 and further ensures insulation. Next, a thin plate 960 is attached. If a transparent substrate such as a glass substrate is used for the thin plate 960, light passes through, so that mask alignment is easy, and quality inspection such as pattern abnormality is facilitated. Contact holes 961 (961-1, 2) are formed in the thin plate 960, and a conductor film is laminated to form electrodes / wirings 962 (962-1, 2). Thereby, 962-1 and 962-2 become two electrodes which oppose, and the capacitor | condenser which makes the through-hole 965-2 capacitive space is comprised. A ventilation hole 963 may be formed in the thin plate 960 so that the atmospheric pressure in the through hole 965 can be kept constant.
By forming the diffusion layer in the silicon substrate in this way, the sensor of the present invention can be manufactured at a low cost by a simple process.

FIG. 67 is a diagram showing another embodiment in which a diffusion layer is formed on the inner surface of the through hole and the upper surface of the substrate. A description of processes overlapping with the processes described so far will be omitted. FIG. 67A shows a state where a support substrate 973 is attached to the lower surface of the silicon substrate 971 and through holes 974 (974-1, 2) are formed in the substrate 971. FIG. If necessary, an insulating film 972 is interposed. The inner surface of the through hole 974, the upper surface of the substrate, and the upper surfaces of the substrate side walls 971 (971-1, 2, 3) are exposed. Next, as shown in FIG. 67B, a diffusion layer 975 is formed on the side surface of the substrate side wall (the inner surface of the through hole) and the portion of the upper surface of the substrate where the silicon substrate is exposed. This diffusion layer 975 can be manufactured by performing diffusion heat treatment after ion implantation, for example. Alternatively, for example, it can be manufactured by performing diffusion heat treatment after pre-deposition. This diffusion layer may be either P-type or N-type high concentration region. Since the bottom of the through hole 974 (974-1, 2) is the insulating film 972 or the support substrate 973 which is an insulator, the diffusion layer is not formed. That is, since there is no connection between the diffusion layers 975 formed on the side walls of adjacent substrates, even if contact holes and electrodes / wirings are formed in these diffusion layers 975 after that, there is no gap between these electrodes / wirings. Not electrically conductive.

Next, an insulating film 976 is stacked on the upper surface of the substrate, the inner side surface of the through hole, and the bottom of the through hole. Next, a thin plate 977 is attached to the upper surface of the substrate. Then, after forming a contact hole 977, a conductor film is laminated, and electrodes / wirings 978 are patterned in and on the contact hole. Thereafter, the electrode / wiring 978 and the diffusion layer 975 are connected (ohmic contact) by performing an appropriate heat treatment. As a result, the electrode / wiring 978 is connected to the diffusion layer 975 on the inner surface of the through hole. As a result, a capacitor is formed using the through hole 974 as a capacitance space and two opposing diffusion layers 975 in the through hole as electrodes.

FIG. 69 is a diagram showing another method for manufacturing the sensor of the present invention. When a material with a high Young's modulus is used for the substrate, the thickness of the substrate sidewall (direction parallel to the substrate surface, that is, the width is easier to understand) is reduced (decreased) so that it deforms with respect to acceleration and sound waves. Since the amount increases, the amount of change in the capacitor capacitance also increases, and the sensitivity increases. For example, in the case of a silicon substrate, the thickness (width) of the substrate side wall may be 50 μm or less, and in some cases, 20 μm or less or 10 μm or less. If the thickness of the substrate is 500 μm to 1000 μm, the output ratio (thickness ratio between the substrate sidewall and the substrate) of the substrate sidewall after forming the through hole may be 50 or more. Forming the substrate sidewalls in one time forms such an elongated building and can be deformed with a slight force during the process. Therefore, in the present manufacturing method, when forming such a high-aspect-ratio substrate sidewall, it is formed in a state where the upper and lower surfaces of the substrate sidewall are pressed by a support substrate (thin plate or insulator substrate).

As shown in FIG. 69A, the first support substrate 1013 is attached to the first surface of the substrate 1011. An insulating film 1012 may be interposed. Next, a photosensitive film 1015 is formed on the second surface of the substrate 1011 to open a window for forming a through hole. At this time, an insulating film 1014 may be interposed. The opening of the through-hole forming window does not form a photosensitive film pattern that forms a thin substrate side wall. That is, among the resulting through holes, adjacent patterns for forming through holes are not formed. For example, the space between the openings of the pattern (this portion becomes the substrate side wall) should not have an aspect ratio of 10 or more. For example, when the thickness of the substrate 1011 is 500 μm, a space of 50 μm or less is avoided. For example, in the sensor described in FIG. 62, the central through hole 732-1 is opened, and the surrounding through holes 732-2, 3, 4, and 5 are not opened here. In the sensor shown in FIG. 61, 712-1 is opened and 712-2 is not opened here. In the sensor shown in FIG. 63, 752-1 is opened, and the surrounding 752-2 is not opened here. Next, the substrate side wall 1011 exposed at the opening 1016 of the photosensitive film 1015 is vertically etched to form a through groove (through hole) 1017 penetrating the second surface of the substrate 1011. When the insulating film 1014 exists on the first surface of the substrate 1011, this insulating film is also anisotropically etched, and then the substrate 1011 is anisotropically etched.

Next, after removing the photosensitive film 1015, a second support substrate 1021 is attached on the first surface of the (main) substrate 1011. This deposition method is the same as the method described so far. The second support substrate 1021 is also preferably an insulator substrate like the first support substrate 1013. In the case where the second support substrate 1021 or the first support substrate 1013 is a substrate other than an insulator substrate, an insulating film is stacked on the surface. Alternatively, when the main substrate 1011 is an insulator substrate, it can be directly attached. The second support substrate 1021 can be directly attached to the main substrate 1011. In that case, if the insulating film 1014 is interposed, it is removed. For example, when the main substrate 1011 is a silicon substrate, if the second support substrate 1021 is a glass substrate (insulator substrate), it can be firmly bonded using an electrostatic bonding method (anodic bonding method). Since the second support substrate 1021 is the outer lower surface of the sensor package, the thickness is preferably 50 μm or more, and preferably 100 μm or more. Select according to the environment. In some cases, the thickness may be 50 μm or less.

Next, the first support substrate 1013 attached to the second surface side of the main substrate 1011 is thinned to have a thickness of 50 μm or less, preferably 30 μm or less, more preferably 20 μm or less, and even more preferably 10 μm or less. As a thinning method, there are a method using a CMP (Chemical Mechanical Polishing) method, a dry etching method, a wet etching method and the like. Alternatively, there is a method in which a bonded substrate with a thin insulating substrate is used as a first support substrate, and the bonded substrate is removed to leave only the thin insulating substrate. Thereafter, as shown in FIG. 69C, a photosensitive film 1022 is formed on the first support substrate 1013, and desired patterning is performed. This patterning is performed by pressing the first support substrate 1013 from the second surface side of the substrate side wall having a thin thickness (width) sandwiched between adjacent through holes (the first surface side is pressed by the second support substrate 1021). An object of the present invention is to obtain a substrate having a desired thickness by minimizing the deformation of the substrate side wall.

The pattern edge comes to the second surface side of the region that becomes the substrate side wall having a small thickness (width), and the region on the second surface side of the substrate side wall that has a thin thickness (width) after the etching becomes the first support substrate 1013. Pattern so as to adhere. For example, the edge after the etching of the first support substrate 1013 comes on the second surface side of the region where the edge position after the etching of the first support substrate 1013 is a dotted line, that is, the substrate sidewall having a small thickness (width). Like that. The mask alignment at the time of exposure of the photosensitive film 1022 can be performed with very precise mask alignment by matching with the pattern when the first through-hole 1017 is formed. If the first support substrate 1013 is a glass substrate, the light beam at the time of alignment is transmitted, so that more accurate mask alignment can be performed. The first support substrate 1013 is etched from the opening 1023 having a window without a photosensitive film. When the first support substrate 1013 is a glass substrate, etching is performed by dry etching using CF4 gas or C2F6 gas, wet etching using an HF-based aqueous solution, or the like. If the base is an insulating film 1012 such as a silicon oxide film, it may be etched together. As shown by the dotted line, it is desirable that the etching shape has a tapered edge because the step coverage of the insulating film or conductor film to be formed later is improved, but if the coverage of these films is good (photosensitive film pattern) Vertical etching may be used. (FIG. 70 (c))

After the first support substrate 1013 is etched, the photosensitive film 1022 is removed, and then a photosensitive film 1025 is formed to form a second through hole, and desired patterning is performed using a photolithography method. If the mask alignment at this time is also matched with the pattern of the first through hole 1017, the thin thickness (width) of the substrate side wall can be accurately controlled. Since the pattern of the first through-hole 1017 is under the first support substrate 1013, mask alignment with higher accuracy can be performed by using light having a wavelength that transmits the first support substrate 1013. The already patterned first support substrate 1013 is covered with an insulating film 1025. The main substrate 1011 is vertically etched from the opening 1026 of the patterned photosensitive film 1025 to form a through hole (second through hole) 1027. The second through hole 1027 is etched to the first surface side of the main substrate 1011. When the insulating film 1012 exists, the main substrate 1011 is etched after the insulating film is first etched (preferably vertical etching).

When the second through hole 1027 is formed, the thickness (width) of the substrate side wall 1011 (1011-1, 2) between the first through hole and the second through hole is very thin (3 μm to 50 μm), and the aspect ratio However, as shown in FIG. 69 (d), the first surface side is regulated (pressed) by the second support substrate 1021 and the second surface side is regulated (pressed) by the first support substrate 1013. The deformation of (1011-1, 2) is very small. Note that the first support substrate 1013 may be etched and the second through hole 1027 may be formed by using the photosensitive film 1022 in the same manner as the second through hole forming pattern. In this case, the photosensitive film 1025 may not be formed.

Next, after the photosensitive film 1025 is removed, an insulating film 1031 is formed. This insulating film is formed by a CVD method or a PVD method, and is also laminated inside the through hole 1027. This insulating film 1027 covers and protects the exposed substrate 1011 inside the through hole, ensures the adhesion of the conductor film to be formed later, and further ensures the insulation between the substrate and the conductor film. Therefore, it is necessary when the main substrate 1011 is a conductor film or a semiconductor substrate, but may not be necessary when the main substrate 1011 is an insulator substrate. After the insulating film 1031 is formed, the conductor film 1032 is formed by a CVD method, a PVD method, an ion plating method, a plating method, or a combination thereof.

The conductor films 1032 facing each other formed in the through hole 1027 serve as electrodes of the capacitor. Therefore, it is necessary to remove the conductor film 1032 formed on the bottom B of the through hole. For this purpose, a photosensitive film 1033 is formed and patterned according to the through hole 1027. That is, the upper portion of the conductor film 1032 formed in the through hole 1027 is covered, and at the same time, the opening 1034 of the through hole 1027 is formed. A photosensitive dry film is preferable as the photosensitive film 1033. Alternatively, in the case of a photosensitive film for coating or dipping, as described above, a negative photoresist in which an exposed portion is cured and an unexposed portion is developed is preferable. Further, in the case where the conductor film 1032 is used as a wiring pattern on the second surface side of the main substrate 1011, necessary patterning is performed to form the opening 1035. (Fig. 69 (e))

Next, the conductive film 1032 is anisotropically etched by the patterned photosensitive film 1033. The conductor film 1032 in the portions 1034 and 1035 where the photosensitive film 1033 is opened is etched. Etching species vertically incident from the opening 1034 of the through hole 1027 etch away the conductor film 1032 stacked on the bottom B of the through hole. As a result, the opposing conductor films 1032 (1032-1 and 2, and 1032-3 and 4) stacked on the side surface of the substrate side wall on the outer side surface of the through hole 1027 are separated. When the edge of the first support substrate 1013 is tapered, the step coverage of the insulating film 1013 and the conductor film 1032 is improved at the level difference at the edge.

Next, after removing the photosensitive film 1033, a protective film 1036 that is an insulating film is stacked over the conductor film 1032. Next, a third support substrate 1037 is attached onto the protective film 1036. At this time, the adhesive can be applied with high accuracy while being applied to the conductive film 1032 and the through holes 1032 and 1017 on the main substrate 1011 while coating the mask after coating only necessary portions on the support substrate. The third support substrate is preferably an insulator substrate. Since the third support substrate serves as an outer member on the upper surface or the lower surface of the sensor package, it is desirable that the substrate thickness is 100 μm or more. It may be thinner depending on the usage environment. Alternatively, it may be necessary to increase the thickness to 500 μm or more. Next, a contact hole 1038 is formed in the third support substrate, and a conductor film is stacked in the contact hole, and conductor film electrodes / wirings 1039 (1039-1, 2, 3, 4) are formed on the third support substrate. Pattern. Further, with respect to the first through hole 1017, a vent hole 1043 is formed in the third support substrate 1037 and the first support substrate 1013, or a vent hole 1041 is formed in the second support substrate 1021. In addition, with respect to the second through hole 1027, a vent hole 1044 is formed in the third support substrate 1037, or a vent hole 1042 is formed in the second support substrate 1021.

By using the manufacturing process of the present invention described with reference to FIG. 69, it is possible to reliably suppress the deformation of the substrate sidewall having a small thickness (width) during the process, and the substrate sidewall may be deformed. No need to take special care about. Moreover, since the process is very simple, the process load and cost increase are small. The process shown in FIG. 69 can be used for various substrates (a conductor substrate, an insulator substrate, or a semiconductor substrate), but the process is further simplified with a conductor substrate.

FIG. 70 is a diagram showing another embodiment showing the manufacturing method of the present invention using a conductor substrate as a seed substrate. 70, the main substrate 1011 is a conductive substrate, and the process up to the process shown in FIG. 70B is the same as the process shown in FIG. 69B. Description of parts that are the same or similar are omitted or briefly described, but the contents described in FIG. 69 can be applied. As shown in FIG. 69C, after the first support substrate 1013 is thinned, a photosensitive film 1025 is formed, and patterning for forming a second through hole is performed by a photolithography method. Thereafter, the first support substrate 1013 exposed in the opening 1026 of the photosensitive film 1025 is etched. This etching is desirably vertical etching (anisotropic etching) that faithfully etches the pattern of the photosensitive film 1025. The first support substrate 1013 may be side-etched and taper-etched, but in this case, care is taken not to connect to the first through hole. After side etching, the lower side of the edge of the photosensitive film 1025 becomes wrinkles, and if there is a possibility that the etching species of the main substrate may enter, rebaking may be performed to cover the wrinkles with the photosensitive film. .

When the insulating film 1012 is interposed under the first support substrate 1013, it is desirable that this insulating film is also vertically etched. After the conductor film 1011 is exposed, vertical etching (anisotropic etching) of the conductor film 1011 is performed to form the second through hole 1027. (FIG. 70 (d)) Next, the photosensitive film 1025 is removed (removed), and then the insulating film 1050 is laminated by a CVD method or a PVD method. The insulating film 1050 protects the inside of the second through hole 1027, that is, the side surface of the substrate side wall. It is also laminated on the first support substrate. The insulator film is a silicon oxide film, a silicon nitride film, a silicon oxynitride film, or the like, and has a film thickness of 100 nm to 2000 nm. Since the second through hole 1027 is covered with the third support substrate 1051 thereafter, the insulating film 1050 can be omitted. Next, the third support substrate 1051 is attached to the upper surface (in FIG. 70E) side of the substrate 1011, on the insulating film 1050 (or on the first support substrate 1013). Thereafter, contact holes 1052 are formed, and conductor films are stacked to form electrodes / wirings 1053 (1053-1, 2, 3, 4). The formation of the contact holes requires etching of the insulating films 1050 and 1012 as well as the etching of the first support substrate 1013 in addition to the etching of the third support substrate 1051.

Further, vent holes 1056 and 1057 can be formed in the third support substrate. These vent holes can be formed simultaneously with the formation of the contact holes. In addition, a vent hole 1054 can be formed in the second support substrate 1021. The contact holes and vent holes of the third support substrate 1051 can also be formed before the third support substrate 1051 is attached to the upper surface of the substrate 1011. If formed in advance, the process time can be shortened. In this process, it is not necessary to laminate the conductor film 1032 as described with reference to FIG. 69, and therefore, the patterning is not necessary, so that the process becomes very simple. That is, if the through hole (through groove) 1027 is formed, the conductive substrate 1011 (for example, the substrate side walls 1011-1 and 1011-2, or the substrate side walls 1011-3 and 1011-4) is separated so as not to be electrically connected. Is done. As a result, the substrate side walls 1011-1 and 1011-2 serve as counter electrodes of the capacitor having the through hole 1027 (1027-1) as a capacity space, and if a voltage is applied to the conductor electrodes 1053-1 and 1053-2, Capacitance can be measured. Similarly, the substrate side walls 1011-3 and 1011-4 serve as counter electrodes of a capacitor having a through hole 1027 (1027-2) as a capacitance space, and if a voltage is applied to the conductor electrodes 1053-3 and 1053-4, Capacitance can be measured.

Except for the present invention described with reference to FIG. 60, openings have been made in through holes or through grooves, that is, both the substrate surface, the first surface (may be referred to as the front surface) and the second surface (may be referred to as the back surface). And a hole or groove formed in a direction perpendicular to the substrate surface, and the side surface of the substrate (side wall) surrounding (defining) the through hole (through groove) is perpendicular to the substrate surface. Although it has been handled, what has been described so far is also applicable to a vertical recess (hereinafter simply referred to as a recess) that is open to only one side. When the recess is used, it is not necessary to attach a support substrate (or a thin plate or an insulator substrate) to the substrate surface near the bottom of the recess unless the bottom of the recess becomes extremely thin. So the process becomes simple. Moreover, a semiconductor substrate has the advantage that the sensor of the present invention can be mounted on the same substrate together with ICs, transistors and other elements.

FIG. 71 is a diagram showing a case where a recess is formed in FIG. The same reference numerals are used for the same films. The recess 116 (116-1, 2, 3) is not a through hole (through groove) but a recess. That is, it is formed by etching vertically from the first surface (front surface) 111-S1 of the substrate 111 toward the second surface (back surface) 111-S2 of the substrate 111, but the second surface (back surface) of the substrate 111. Etching is stopped in the middle of the substrate 111 before penetrating without reaching 111-S2 to form a so-called recess. A lower portion 111-B of the substrate 111 exists below the concave portion 116 (116-1, 2, 3). When the depth of the recess 116 is h and the thickness of the substrate 111 is h0, h0> h. (In the case of a through-hole, h0 ≦ h.) When the substrate 111 is a conductor film or a semiconductor substrate, an insulating film 113 is laminated and laminated inside the recess, and the conductor film 115 laminated thereon The substrate 111 is prevented from conducting. When the substrate 111 is an insulator, the insulating film 113 may not be necessary. For the purpose of improving the adhesion with the conductor film 115, the insulating film 113 may be stacked.

After the insulating film 113 is stacked, the conductor film 115 is stacked. Since the conductor film 115 is also laminated on the bottom area B of the recess, the conductor film 115 in this portion is removed by etching. For this etching, the conductive film may be anisotropically etched with the opening at the top of the recess opened with a photosensitive film. Note that the conductive film 115 on the other region, that is, the first surface (front surface or upper surface) 111-S1 side of the substrate 111 can also be patterned. As a result, in the concave portion 116-1, the conductive film / electrodes 115-1 and 115-2 formed on the side surface of the substrate side wall sandwiching the through hole 116-1 with the concave portion 116-1 as the capacitive space are Forming a capacitor. Further, in the concave portion 116-3, the conductive film / electrodes 115-3 and 115-4 formed on the side surface of the substrate side wall sandwiching the through hole 116-3 with the concave portion 116-3 serving as a capacitor space serve as counter electrodes. A capacitor is formed.

The sound wave is introduced into the second recess 116-2, and the substrate side wall 111-1 sandwiched between the recess 116-2 and the recess 116-1 vibrates. In addition, the substrate side wall 111-2 sandwiched between the recess 116-2 and the recess 116-3 vibrates. A microphone can be formed by forming a recess in this way. By using the substrate 111 as a semiconductor substrate, a microphone can be manufactured together with an active element such as an IC or a transistor, and a change in the capacitance of the capacitor can be converted into a sound wave by connecting to an IC having a conversion circuit. .

The structure shown in FIG. 71 can also be used as an acceleration sensor as described in FIG. FIG. 72 is a diagram showing a case where a similar structure to FIG. 71 is applied to the acceleration sensor. That is, in this embodiment, the concave portion and the deformation of the substrate side wall sandwiched between the concave portions are used as the acceleration line sensor. The explanation is the same as the figure. In other words, when the substrate side wall 111-1 and / or 111-2 is deformed by acceleration, the center capacitance is increased in order to increase the amount of change in the capacitance of the concave portion 116-1 and / or 116-3. A heavy liquid 118 such as mercury is put into the recessed portion that is a space. Since the liquid pushes the substrate side wall due to the acceleration, the deformation amount of the substrate side wall increases, and the change amount of the capacitor capacitance also increases. If the liquid enters from the vent 122 and exits from the vent 127, the recess 116-2 can be filled, or the volume of X% of the inner space of the recess 116-2 can be filled. X may be adjusted between 0 and 100% and determined in accordance with the acceleration detection sensitivity.

FIG. 73 is a diagram showing a method for manufacturing a sensor using an epi-wafer. This epi wafer (epitaxial wafer) 1100 is a wafer in which an epi layer 1102 of a low concentration impurity layer is formed on a high concentration silicon substrate 1101. The impurity concentration of the high-concentration silicon substrate 1101 is an N-type or P-type impurity element concentration of about 10 ¹⁹ / cm ³ or more. The impurity concentration of the epilayer 1102 of the low-concentration impurity layer depends on the characteristics of the device formed in the epilayer, but the N-type or P-type impurity element concentration is about 10 ¹³ / cm ³ to 10 ¹⁷ / cm ^3. It is. The epi-wafer size is preferably 4 inches (diameter: 100 mmφ) or more, although it depends on the size of the processing apparatus and the size and number of IC chips including the sensor chip and sensor. Generally, 6 inches (150 mmφ), 8 inches (200 mmφ), 250 mm (250 mmφ), 300 mm (300 mmφ), and the like are used. The thickness of the high-concentration silicon substrate 1101 is about 100 μm or more, and the thickness of the epi layer 1102 is about 5 μm or more, although it depends on the mounted device, device characteristics, and device fabrication process.

The epi-wafer 1100 includes a region 1108 for mounting the sensor of the present invention and a region (device mounting region) 1107 for forming devices such as ICs and transistors. The photosensitive film 1103 is patterned to open a portion to be the sensor mounting region 1108, the low concentration impurity layer 1102 in the opened region is removed, and the high concentration impurity layer 1101 is exposed. Etching of the low-concentration impurity layer 1102 includes wet etching, anisotropic etching such as KOH and EDP (EthyleneDiamine + Pyrocatechol + water), isotropic etching such as hydrofluoric acid (HF + NHNO3 + CH3COOH (or water)), and dry etching is CF4, Plasma etching such as CHF3 and C2F6. The etching surface 1105 may be inclined (or tapered), or may be vertical etching. If taper is used, coverage during wiring formation can be improved. Inclined etching may be performed by dry or wet etching. Even in anisotropic etching such as KOH, when the substrate surface is (100), the etching surface is (111), and the tilt angle is about 54.7 °. It is also possible to stack a silicon oxide film, a silicon nitride film, and a silicon oxynitride film between the photosensitive film 1103 and the epi wafer 1102 and to etch the epi layer 1102 using these as a mask.

As described above, the sensor mounting region 1108 becomes the recess 1104, and the high concentration substrate 1101 is exposed. Since the subsequent process is the same as the sensor formation process described so far, the detailed description of the overlapping parts is omitted. Basically, through holes and substrate side walls are formed in a high-concentration substrate, and an insulating substrate is attached to the upper and lower surfaces of the through holes and substrate side walls to make the through holes a capacitive space. To form a capacitor. As shown in FIG. 73B, an insulating substrate is attached to the second surface of the epi-wafer 1100 (the surface without the epi layer 1102 and the back surface where the high-concentration substrate surface is exposed). If necessary, an insulating film such as a silicon oxide film may be interposed. Next, a photosensitive film 1111 is formed on the surface, and an opening 1112 for forming a through hole is patterned. If necessary, a silicon oxide film or the like may be interposed. The high-concentration silicon substrate 1101 exposed in the opening 1112 is vertically etched to form through holes 1114 (1114-1, 2, 3). The through hole 1114 completely penetrates from the first surface (front surface) side to the second surface (back surface) side of the high-concentration silicon substrate 1101, and the bottom of the through hole 1114 becomes the insulating substrate 1110.
The insulating substrate 1110 is made of glass, stone, ceramic, plastic, polymer resin, or the like. The thickness of the insulating substrate 1110 may be about 50 μm, but it may be made thinner depending on the use condition of the sensor and the etching condition. In order to increase the strength of the sensor, it may be thicker than this. By forming the through holes 1114, substrate side walls 1101 (1101-1, 2, 3, 4) are formed. Substrate sidewalls 1101-1 and 1101-2 that face each other with the capacitance space 1114-2 interposed therebetween are separated so as not to be electrically connected. Similarly, the substrate side walls 1101-13 and 1101-4 that face each other with the capacitor space 1114-3 interposed therebetween are separated so as not to be electrically connected. (FIG. 73 (c))

Next, the photosensitive film 1111 is removed and an insulating film 1116 is laminated (may not be formed in some cases), and the insulating substrate 1117 is placed on the upper surface of the substrate side wall 1101 (1101-1, 2, 3, 4). Adhere. Since the sensor mounting area is a recess 1104, it is lower in the epi-wafer 1100. Since the insulating substrate 1117 is attached only to this region, for example, an insulating substrate 1117 of a size that can be attached to the substrate side wall 1101 (1101-1, 2, 3, 4) in the recess 1104 is attached to another substrate in advance. In addition, the insulating substrate 1117 is attached to this region by aligning the mask. As a result, the substrate side walls 1101-2 and 1101-3 serving as diaphragms are restricted to the insulating substrate 1117 on the upper surface and to the insulating substrate 1110 on the lower surface. (FIG. 73D) The insulating substrate 1110 is made of glass, stone, ceramic, plastic, polymer resin, or the like. The insulating substrate 1117 is made slightly thicker than the depth of the recess 1104 because the insulating substrate 1117 attached to the substrate is aligned, transferred, and placed in the recess 1104 of the epi-wafer.

Next, a contact hole 1118 is formed in the insulating substrate 1117 to form a conductor film 1119, and a conductor film / electrode / wiring 1119 is formed. As a result, the electrode / wiring 1119 is connected to the substrate side wall 1101 (1101-1, 2, 3, 4) which is a conductor substrate. If necessary, an opening (vent hole) 1121 may be formed in the insulating substrate 1117 and an opening (vent hole) 1122 may be formed in the insulating substrate 1110. The contact holes 1118 and the openings 1121 and 1122 may be formed in advance on the insulating substrate, and then the insulating substrate may be attached to the epiwafer.

As described above, the sensor can be formed in a partial region in the epi-wafer by a very simple process. Since devices such as ICs and transistors can be formed in the device mounting area other than the sensor mounting area, for example, a circuit for processing sensor signals and an arithmetic circuit can be included in one chip. In addition, since the insulating film and the conductor film can be used in combination with the process for manufacturing the device, the process cost can be reduced.

Using a high-energy / high-current ion implantation system, a high-concentration region is produced in a low-concentration epilayer of an epi-wafer, and a sensor is produced in that portion, thereby providing a sensor on a chip together with an active device such as an IC or transistor. Can be produced. FIG. 74 is a diagram showing another embodiment of a sensor manufacturing method using an epi-wafer. In an epi-wafer 1130 having a high-concentration substrate 1131 and a low-concentration epi (epitaxial) layer 1132, a photosensitive film 1136 is formed, a region to be a sensor mounting region 1134 is opened, and a region to be a device mounting region is photosensitive. Covering with a film 1136, ion implantation is performed on the entire wafer surface. The ions of the ion implantation 1137 are preferably the same as the conductor type of the high concentration substrate 1131. The acceleration energy and dose of ion implantation are selected so that the total concentration of the epi layer is 10 ¹⁹ / cm ³ or more in the heat treatment after ion implantation. In addition, a photosensitive film having a sufficient thickness is formed so that ions are not implanted into the epi layer 1132 in the device mounting region 1133 during this ion implantation.

After ion implantation, activation and diffusion heat treatment of the ion implantation layer are performed, and a high concentration ion implantation layer 1141 is formed in the epi layer 1132. This high concentration ion implantation layer 1141 is connected to the high concentration substrate 1131 and becomes electrically completely conductive. Note that the high-concentration ion implantation layer 1141 may be formed by predeposition or the like. Thereafter, the photosensitive film 1143 is patterned to open a window for forming a through hole. This through-hole forming window is opened in the sensor mounting area. An insulating film such as a silicon oxide film may be interposed between the photosensitive film 1143 and the epitaxial wafer 1130. (Fig. 74 (b))

Next, a through hole 1145 is formed, and a substrate side wall 1146 is formed. Next, the photosensitive film 1143 is removed, and if necessary, an insulating film 1147 is laminated to protect the epitaxial wafer 1130 exposed through the through holes 1145 and the like. Thereafter, an insulating substrate 1148 is attached to the upper surface of the epi-wafer 1130 to form a contact hole 1149 and a conductor film / electrode / wiring 1150. As a result, the conductor film / electrode / wiring 1150 is connected to the high concentration layer 1141 of the epi layer 1132 through the conductor film in the contact hole 1149 and further to the substrate sidewall 1146 having a high concentration. As a result, a capacitor of the counter electrode 1146 is produced with the through-hole 1145 as a space capacitance and sandwiching it. In this embodiment, since the epitaxial layer 1132 in the device mounting region 1133 is not affected, a normal IC, transistor, or the like can be formed. (Fig. 74 (c))

A high concentration diffusion layer is formed on a normal silicon semiconductor substrate, and the sensor of the present invention can be formed there. FIG. 75 is a diagram showing an embodiment of a method for producing a sensor of the present invention. A photosensitive film 1162 is formed on a low-concentration silicon wafer 1161 having an impurity concentration of 10 ¹⁷ / cm ³ or less, a region 1164 serving as a sensor mounting region is opened, and the device mounting region 1163 is covered with the photosensitive film. An insulating film may be formed between the silicon wafer 1161 and the photosensitive film. High dose ion implantation 1165 is performed using a high energy ion implantation apparatus so that the concentration of the ion implanted layer after the heat treatment is 10 ¹⁹ / cm ³ or more. The ion to be implanted is a conductor opposite to the conductivity type of the silicon wafer 1161. The thickness of the photosensitive film 1162 is adjusted so that ions are not implanted into the device mounting region 1163 during ion implantation. (Fig. 75 (a))

After removing the photosensitive film 1162, heat treatment is performed to activate the ion-implanted ion-implanted layer and diffuse the impurity layer to form an ion-implanted diffused layer 1167. The impurity concentration of the ion implantation diffusion layer 1167 is preferably 10 ¹⁹ / cm ³ or more. This ion implantation diffusion layer 1167 corresponds to the sensor mounting region. Next, a photosensitive film 1168 is formed, and an opening for forming a recess is formed in the region of the ion implantation diffusion layer 1167. (FIG. 75B) An insulating film may be formed between the photosensitive film 1168 and the silicon wafer 1161.

Next, the silicon wafer 1161 is vertically etched from the opening of the photosensitive film 1168 to form concave portions 1169 (1169-1, 2, 3). The depth h12 of the recess 1169 is made deeper than the depth h11 of the ion implantation diffusion layer 1167. That is, h12> h11. (Fig. 75 (c))

Next, the photosensitive film 1168 is removed, and if necessary, an insulating film 1170 is formed to protect the silicon substrate exposed to the recess 1169, and the insulating substrate 1171 is formed on the upper surface of the ion implantation diffusion layer 1167 of the silicon wafer 1161. Adhere to. Next, a contact hole 1172 is formed in the insulating substrate 1171, and a conductor film 1173 is laminated in the contact hole 1172 and on the insulating substrate 1171 to form a conductor film / electrode / wiring 1173. Since the recess 1169 (1169-1, 2, 3) is deeper than the ion implantation diffusion layer 1167, the substrate side walls 1167-1 and 1167-2 are not electrically connected. (The silicon wafer 1161 and the ion implantation diffusion layer 1167 have opposite conductivity types.) Accordingly, the concave portions 1169-2 are used as space capacitors, and the counter electrodes 1167-1 and 1167-2 are counter electrodes of the capacitor. . The lower side of the substrate side wall 1167-2 is connected to the silicon wafer 1161, and the upper surface of the substrate side wall 1167-2 is attached to the insulator substrate 1171. For example, when acceleration is applied or sound waves enter the recess 1169-1, the substrate side wall 1167-2 1167-2 is deformed, and the capacity of the through hole 1169-2 is changed. Similarly, the substrate side walls 1167-3 and 1167-4 are not electrically connected. (The silicon wafer 1161 and the ion implantation diffusion layer 1167 have opposite conductivity types.) Therefore, with the recess 1169-3 as the space capacitance, 1167-3 and 1167-4 serving as counter electrodes are counter electrodes of the capacitor. . The lower side of the substrate side wall 1167-3 is connected to the silicon wafer 1161, and the upper side of the substrate side wall 1167-3 is attached to the insulator substrate 1171. For example, when acceleration is applied or sound waves enter the recess 1169-1, the substrate side wall 1167-3 1167-3 is deformed, and the capacity of the through hole 1169-3 is changed. (Fig. 75 (d))

FIG. 76 is a diagram showing another method for manufacturing a sensor using an epi-wafer. In the present embodiment, a recess is formed on the high concentration substrate side of the epi-wafer 1200. In addition, the conductivity type of the high-concentration substrate 1201 and the conductivity type of the low-concentration layer epilayer 1202 are reversed. (Alternatively, such a reverse conductor type wafer may be bonded.) A photosensitive film 1205 is formed on the high-concentration substrate 1201 side of the back surface of the epi-wafer 1200 to form an opening for forming a recess. An insulating film 1203 may be formed on the surface side (low concentration region side) of the epi wafer 1200 to protect the surface side. Further, an insulating film such as a silicon oxide film may be formed between the photosensitive film 1205 and the back surface of the epi wafer 1200. Next, the recess 1206 (1206-1, 2, 3, 4, 5) is formed by vertical etching based on the pattern of the photosensitive film 1205. When the thickness of the high concentration substrate 1201 of the epi wafer 1200 is h13 and the depth of the recess is h14, the depth of the recess 1206 is deeper than the thickness of the high concentration substrate 1201, and the bottom of the recess is the low concentration region 1202 of the epi wafer 1200. Etch to come in. That is, h14> h13. However, the etching amount is controlled so that the recess 1206 does not become a through hole. (Fig. 76 (a))

Next, the photosensitive film 1205 is removed, and a protective insulating film 1208 is laminated when the insulating film 1208 is required on the back side and the concave side of the epi-wafer 1200. Next, an insulating substrate 1209 is attached to the back side of the epi-wafer 1200. Thereafter, an insulating film 1211 is formed, and the conductor film 1212 is laminated in the contact hole 1212 and on the insulating substrate 1209 and patterned to form a conductor film / electrode / wiring 1212. The conductor film / electrode / wiring 1212 is connected to the substrate side wall 1207 (1207-1, 2, 3, 4, 5, 6) of the high concentration substrate 1201. As a result, a capacitor is formed in which, for example, the recess 1206-2 is used as a space capacity, and the counter electrodes 1207-2 and 1207-3 in the recess serve as capacitor electrodes. Accordingly, when the substrate side wall 1207-3 is deformed, the space capacity (capacitor capacity) of the recess 1206-2 changes.

In this embodiment, a device such as an IC or a transistor can be freely manufactured in the low concentration region 1202 on the front side of the epi wafer or the bonded wafer 1200. Accordingly, not only can an IC chip mounted with a sensor be produced, but also the size of the sensor mounted IC chip can be greatly reduced. If through wiring is used, electrodes and pads can be collected on one surface (front surface or back surface). Alternatively, the contact hole 1214 is formed from the surface side of the epi-wafer 1200, the insulating film 1213 is formed on the side wall thereof, the conductor film 1215 is laminated on the contact hole 1214 and the surface side, and patterned to form a conductor film / electrode / A wiring 1215 is produced. As a result, the substrate can be connected to the substrate side wall electrode 1207 of the high concentration substrate 1201, and the sensor can be moved from the device on the surface side of the epi-wafer 1200. In the present embodiment, the electrode length in the depth direction of the capacitor is determined not by the depth h14 of the recess 1206 but by the substrate thickness of the high-concentration substrate 1201, and thus is not affected by variations in etching.

FIG. 77 is a diagram showing an embodiment of a sensor using a substrate on which an epi-wafer is bonded and a manufacturing method thereof. An epi-wafer 1230 comprising a low-concentration epi layer 1232 having a thickness h21 and a high-concentration substrate 1231 having a thickness h22, and an epi-wafer 1240 comprising a low-concentration epi-layer 1242 having a thickness h23 and a high-concentration substrate 1241 having a thickness h24 are combined with the high-concentration substrates 1231 and 1241. Paste together. (Lamination surface 1245) The conductivity type of the high-concentration substrates 1231 and 1241 is the same type, and is different from the conductivity type of the epi layers 1232 and 1242.

This bonding is performed using normal temperature bonding, high temperature bonding, or an adhesive. When an adhesive is used, a conductive adhesive is used so that the high concentration substrates 1231 and 1241 are electrically connected. A photosensitive film 1235 is formed on one surface of the bonded substrate 1249 on the side of the epi layer 1232, the sensor mounting area 1233 is opened, and the device mounting area 1234 is covered with the photosensitive film 1235. An ion implantation 1236 is performed at a high energy and a high dose using a high energy ion implantation apparatus into the opening of the photosensitive film 1235, and the concentration of the ion implantation diffusion layer 1237 becomes 10 ¹⁹ / cm ³ or more after heat treatment, It can be electrically connected to the concentration substrate 1231. Therefore, the ion conductivity type of the ion implantation is the same as that of the high concentration substrates 1231 and 1241. An insulating film 1243 may be formed to protect the epi layer 1242 before bonding or ion implantation. Similarly, an insulating film may be formed between the epi layer 1232 and the photosensitive film 1235. (Fig. 77 (a))

After the photosensitive film 1235 is removed, the ion implantation layer is activated and diffusion heat treatment is performed to form an ion implantation diffusion layer 1237. This ion implantation diffusion layer 1237 is electrically connected to the high concentration substrate 1231. Next, a photosensitive film 1238 is formed, and a window for forming a recess is formed in the sensor mounting region 1233. If necessary, an insulating film may be formed between the epi layer 1232 and the photosensitive film 1238. The epitaxial layer 1232 (1237), the high-concentration substrate 1231, and the high-concentration substrate 1241 are completely vertically etched from the opened portion to form the recesses 1239 (1239-1, 2, 3) so as to reach the epi layer 1242. . The concave portion 1239 does not penetrate the epi layer 1242. If the thickness of the recess is h25, h21 + h22 + h24 + h23> h25> h21 + h22 + h24. (However, the thickness of the adhesive is ignored.)

As a result, the bonded substrate sidewalls 1240-1 and 1240-2 or the bonded substrate sidewalls 1240-3 and 1240-4 are not electrically connected. Then, the recess 1239-2 becomes a space capacity, and the bonded substrate side walls 1240-1 and 1240-2 become opposing capacitor electrodes. Similarly, the concave portion 1239-3 serves as a space capacity, and the bonded substrate side walls 1240-3 and 1240-4 serve as opposing capacitor electrodes. The length of the capacitor in the depth direction of the capacitor is h21 + h22 + h24, and does not depend on the depth h25 of the recess 1239. The subsequent processes are the same as those in FIG. 76, and an insulating substrate, contact holes, electrodes, and the like are formed. As described above, the sensor of the present invention can be formed using the bonded substrate of the epi wafer, and in this case, devices such as ICs and transistors can be formed on the low concentration epi layers 1232 and 1242 of the epi wafer. A sensor-mounted IC (transistor) can be manufactured. It should be noted that the sensor can be manufactured using this embodiment even by a method in which the epi layer 1232 is etched and the high concentration substrate 1231 is exposed as in FIG. 73 without performing ion implantation.

In addition, the concave portion can be formed even when the substrate to be bonded is not a high concentration substrate but a low concentration substrate. In this case, in FIG. 77, the epi wafer 1240 composed of the epi layer 1242 and the high concentration substrate 1241 may be considered as a low concentration substrate (low concentration silicon wafer). h24 and h23 may be thrown together, forming a recess until reaching the low-concentration silicon wafer, and etching the recess so that h25> h21 + h22. In this case as well, devices can be formed on both the epi layer 1232 side and the low concentration silicon wafer side. Further, if the epi-wafer 1230 is entirely a high-concentration substrate, the high-concentration substrate and the low-concentration substrate are bonded together to form a concave portion from the high-concentration substrate side, and the bottom of the concave portion is made the low-concentration substrate side, the sensor of the present invention A device such as an IC can be formed on the surface on the low concentration substrate side on the surface on the substrate side. An insulating film or an insulator may be sandwiched between the low concentration silicon wafer and the high concentration substrate. In this case, the bottom of the recess may be stopped by an insulating film or an insulator. In this case, the conductivity type of the low concentration silicon wafer and the high concentration substrate may be the same. (In the case of direct bonding, different conductive types are used so that they are not electrically connected), or the recess may enter the low concentration region side. In any case, since the length of the concave portion on the depth side of the capacitor is determined by the thickness of the high concentration substrate, there is an advantage that etching variation is not related.

FIG. 78 is a diagram showing a sensor using a composite substrate in which a conductor substrate and a semiconductor substrate are bonded, and a manufacturing method thereof. The conductor substrate is, for example, a conductor substrate such as a high concentration silicon semiconductor substrate, a conductor substrate such as a metal or an alloy, a conductor substrate such as a conductive polymer, a conductive plastic, or a conductive rubber. Hereinafter, the conductor substrate is described as a high-concentration silicon semiconductor substrate. The semiconductor substrate is a single element semiconductor substrate such as silicon, germanium, or carbon (diamond), a binary semiconductor substrate such as gallium arsenide, silicon carbide, or gallium nitride, or a multi-element semiconductor substrate higher than that. Hereinafter, the semiconductor substrate will be described as a silicon semiconductor substrate. A photosensitive film 1255 is formed on the conductor substrate 1250 side of the composite substrate 1250 to which the conductor substrate 1251 and the semiconductor substrate 1252 are bonded, and patterning for forming a recess is performed. An insulating film 1254 may be interposed between the conductor substrate 1251 and the semiconductor substrate 1252. The insulating film 1254 is a silicon oxide film (SiOx) or the like, and is formed by CVD, PVD, coating + heat treatment, oxidation, nitridation, or the like. Examples of the bonding method include a method using an adhesive, a room temperature bonding method, an electrostatic bonding method, anodic bonding, diffusion bonding, and anodic bonding. An insulating film may be interposed between the conductor substrate 1251 and the photosensitive film 1255. In addition, an insulating film 1253 may be formed to protect the surface on the semiconductor substrate side. (FIG. 78 (a))

Based on the opening pattern of the photosensitive film 1255, the conductor substrate 1251 is vertically etched (shown by a broken line) to form recesses 1256 (1256-1, 2, 3, 4). Etching is performed so that the depth of the recess is deeper than the thickness of the substrate. When the insulating film 1254 is present, the recess 1256 can be formed into a predetermined vertical hole by using the insulating film 1254 as an etching stopper. When the insulating film 1254 is present, the conductivity type of the conductor substrate 1251 and the conductivity type of the semiconductor substrate 1252 may be the same or different and are not electrically connected to each other. Even if the recess 1256 etches the entire insulating film 1254 and reaches the semiconductor substrate 1252, the insulating film 1254 is present, so that it does not conduct. (If there is a risk of electrical conduction, an insulating film may be laminated on the inner surface of the recess after this.) When the insulating substrate 1254 is not present and the conductive substrate 1251 and the semiconductor substrate 1252 are directly attached, the conductive film The conductivity types of the body substrate 1251 and the semiconductor substrate 1252 are reversed.

The recess 1256 is preferably a vertical pattern in which the conductor substrate 1251 is completely etched in the depth direction, and reaches the middle of the insulating film 1254 or the semiconductor substrate 1252. However, when a device is formed in the semiconductor substrate 1252, the concave portion 1256 is formed with a depth that does not affect the device. Substrate sidewalls 1257 (1257-1, 2, 3, 4, 5) are formed by forming the recesses 1256 (1256-1, 2, 3, 4). By doing so, it is possible to prevent the substrate side walls (for example, the counter electrodes 1257-2 and 1257-3 sandwiching the capacitor space 1256-2 from being electrically connected) between adjacent conductor substrates.

Next, the photosensitive film 1255 is removed, and if necessary, an insulating film is formed to protect the inner surface of the recess 1256 and the surface of the conductor substrate. After that, the insulating substrate 1258 is attached to the surface side of the conductor substrate 1251, and the upper surface of the substrate side wall 1257 (1257-1, 2, 3, 4, 5) is attached and fixed to the insulating substrate 1258. A contact hole 1261 is formed in the insulating substrate 1258, a conductor film is laminated in the contact hole 1261 and on the insulator substrate 1258, and conductor film electrodes / wirings 1259 (1259-1, 2, 3, 4, 5) are formed. Form. And / or contact holes 1262 are formed in the surface on the semiconductor substrate 1252 side up to the conductor substrate 1251 side, laminated in the contact holes 1262 and on the surface side of the semiconductor substrate 1252, and conductor film electrodes / wirings 1264 (1264-1, 2, 3).

Since the semiconductor substrate 1252 is exposed on the inner surface of the contact hole 1262 when the contact hole 1262 is formed, an insulating film 1263 is formed on the inner surface of the contact hole 1262, and the conductor film formed in the semiconductor substrate 1252 and the contact hole 1262. To prevent electrical continuity with. As a method of forming the insulating film 1263 on the inner surface of the contact hole 1262, the insulating substrate 1263 is stacked after the contact hole 1262 is formed, and the entire surface (or only a neighboring region including the contact hole) is anisotropically etched. The insulating film 1263 stacked on the 1251 is etched away, and the insulating film 1263 remains on the inner surface of the contact hole 1262. After that, if a conductor film is stacked, it is electrically connected to the conductor substrate 1251.

The insulating substrate 1258 covers the recess 1256, but if necessary, an opening 1265 (may be referred to as a vent) may be provided in the recess 1256. The opening 1265 may be formed together with the contact hole 1261. An opening (which may be referred to as a vent) 1266 may be provided on the semiconductor substrate 1252 side. The opening 1266 may be formed together with the contact hole 1262.

By the recess 1256 formed as described above, the substrate side wall 1257 (1257-1, 2, 3, 4, 5) of the conductor substrate 1251 can be formed so as not to be electrically connected. For example, the recess 1256-2 is used as a space capacity, and the counter electrodes 1257-2 and 1257-3 serve as the counter electrodes of the capacitor with the space therebetween. The conductive film / electrode / wiring 1259-2 is connected to the substrate sidewall 1257-2 of the conductor substrate 1251, and the conductive film / electrode / wiring 1259-3 is connected to the substrate sidewall 1257-3 of the conductor substrate 1251. The conductor film / electrode / wiring 1264-2 on the semiconductor substrate 1252 side is connected to the substrate side wall 1257-2 of the conductor substrate 1251, and the conductor film / electrode / wiring 1264-3 on the semiconductor substrate 1252 side is conductive. It connects to the substrate side wall 1257-3 of the body substrate 1251.

In the embodiment shown in FIG. 78, a sensor in which a device such as a transistor or IC is formed on the semiconductor substrate 1252 side and a recess is formed on the lower conductor substrate 1251 side can be manufactured. In addition, the IC chip can be made smaller. Since electrodes can be formed on both sides of the composite substrate 1250, control can be performed from either side. Alternatively, the electrodes can be formed only on one substrate surface. (For example, electrode 1259-1 is conducted to electrode 1264-1 through substrate side wall 1257-1 of conductor substrate 1251.)
FIG. 79 is a diagram showing a sensor created using the imprint method and a method for manufacturing the sensor. An insulating film 1613 is formed over a substrate 1611 including a recess 1614 having a depth H0 formed in a substrate 1611 such as a semiconductor substrate. When a chip on which a sensor is mounted together with a transistor, an IC, or the like is manufactured, the substrate is a semiconductor substrate such as silicon. The depth H0 of the recess 1614 depends on the material constituting the sensor and the characteristics of the sensor, but is approximately 10 μm or more. The insulating film 1613 is a silicon oxide film, a silicon nitride film, or a silicon oxynitride film, and has a thickness of about 100 nm to 2000 nm. This insulating film 1613 is intended to be electrically and physically separated from the substrate 1611 and the conductive polymer formed in the recess. In addition, it also serves as an etching stopper when etching the recess formed inside the conductive polymer. Next, the conductive polymer 1615 is filled into the recess 1614. Liquid or gel-like conductive polymer 1615 is coated by a coating method, dipping method, screen printing method, or the like, or a sheet-like conductive polymer is attached to substrate 1611 to melt and soften the conductive polymer sheet in the recess. Conductive polymer 1615 is placed in {FIG. 79 (a)} The conductive polymer may be various conductive polymers such as polyacetylene, polythiophene, polyanilene, polypyrrole, etc., or a polymer in which conductive fine particles such as metal are mixed to provide conductivity. good. Or the rubber | gum which mixed electroconductive fine particles, such as a metal, in conductive rubber or rubber | gum, and gave conductivity may be used. {FIG. 79 (a)}

Next, a mold 1617 having a sensor-forming recess-forming pattern 1619 formed in the polymer is inserted into the liquid or gel-like conductive polymer 1615 in the recess 1614 and cured by heat treatment or UV irradiation. 1617 and the mold pattern 1619 are pulled out from the polymer 1615 to form recesses 1621 (1621-1, 2, 3) in the polymer 1615. Since the polymer 1615B exists at the bottom of the recess 1621 (1621-1, 2, 3), the polymer substrate side wall 1615 (1, 2, 3, 4) is connected at the polymer bottom 1615B in this state. Therefore, the polymer 1615 is anisotropically etched to remove the polymer 1615B. If the etching selection ratio between the polymer 1615 and the insulating film 1613 is large, the insulating film 1613 serves as an etching stopper even if the polymer 1615 is over-etched considerably or the insulating film 1613 is not thickened. The insulating film 1613 (1613-B) can be left. In this way, recesses 1621 (1621-1, 2, 3) are formed, whereby polymer substrate side walls 1615 (1615-1, 2, 3, 4) are formed, and polymer substrate side walls 1615-1, 1615- 2 is not electrically connected. The polymer substrate side walls 1615-2 and 1615-3 are not electrically connected. (FIGS. 79 (b), (c), (d), (e))

Next, if necessary, an insulating film 1622 is stacked in order to protect the surface (1615S) of the conductive polymer 1615 and the inner surface of the recess 1621. Next, an insulating substrate 1623 is attached, a contact hole 1624 is formed, and a conductor film is further laminated in the contact hole and on the surface of the insulating waterfall substrate 1623, and conductor films / electrodes / wirings 1625 (1625-1, 3, 4) is produced. In this way, a capacitor is formed with the concave portion 1621-2 as the capacitor space and the polymer electrode substrate side walls 1615-1 and 1615-3 facing each other on both sides thereof as capacitor electrodes. The polymer electrode substrate side wall 1615-1 is deformed by the sound wave, acceleration, or angular velocity introduced into the recess 1621-1, and the capacitor capacity of the recess 1621-2 changes. Since the conductor film / electrode / wiring 1625 is electrically connected to the substrate side wall (1615-1, 3), a change in the capacitor capacity can be detected. Similarly, a capacitor is formed using the concave portion 1621-3 as a capacitor space and the opposing polymer electrode substrate side walls 1615-2 and 1615-4 on both sides thereof as capacitor electrodes. The polymer electrode substrate side wall 1615-2 is deformed by the sound wave, acceleration or angular velocity introduced into the recess 1621-1, and the capacitor capacity of the recess 1621-3 changes. Since the conductor film / electrode / wiring 1625 is electrically connected to the substrate side wall (1615-2, 4), a change in the capacitor capacity can be detected. (Fig. 79 (f))

When necessary (for example, when venting into the concave portion 1621, introducing a sound wave, or putting a heavy liquid into the concave portion), the opening 1626 is formed in the insulating substrate 1623. The contact hole 1624 and the opening hole 1626 can be formed by the same process, or an insulating substrate 1623 on which these are formed in advance may be attached to the surface 1615S of the polymer 1615 or the upper surface of the polymer substrate 1615. In the present embodiment, a contact hole 1627 to the side wall of the polymer substrate can also be formed on the surface 1611B side opposite to the surface 1611S on which the recess 1614 of the substrate 1611 is formed. A photosensitive film is formed on the surface 1611B (if an insulating film 1630 or the like is formed thereon) of the substrate 1611, a necessary pattern is formed, the insulating film 1630 or the like is etched, ) The substrate 1611 is etched, and the insulating film 1613 is further etched to form a contact hole 1627 connected to the polymer substrate side wall 1615. When the substrate 1611 is a semiconductor substrate or a conductor substrate, an insulating film 1628 is stacked on the side surface of the substrate 1611 exposed through the contact hole 1627. Thereafter, a conductor film is laminated in the contact hole 1627 and on the substrate 1611B (on the upper insulating film 1613) to form a conductor film / electrode / wiring 1629. As a result, a conductor film / electrode / wiring 1629 connected to the polymer electrode 1515 can be obtained also on the substrate 1611B side. This means that it can be controlled from both sides (1611S, 1611B) or one side of the substrate 1611. If necessary, the opening 1631 can be provided on the substrate surface 1611B side.
As described above, a concave portion (first concave portion) is formed on the substrate surface of the substrate 1611, a conductive polymer is formed thereon, and the concave portion (second concave portion) is formed in the concave portion (first concave portion) in the substrate using the imprint method. A capacitor having a concave portion), a second concave portion as a capacitance space, and a conductive polymer substrate side wall as a capacitor electrode can be formed, and using this, a microphone sensor, an acceleration sensor, each speed sensor, and other sensors (pressure) Sensor). If the substrate 1611 is a semiconductor substrate such as silicon, a sensor can be manufactured together with a device such as a transistor or an IC. When a device such as an IC is manufactured on the same substrate surface (1611S side) as the first recess of the sensor, a device such as an IC can be manufactured in a region without the first recess. When a device such as an IC is fabricated on the substrate surface (1611B side) opposite to the first recess of the sensor, a device such as an IC can also be fabricated in the lower region of the first recess. An IC with a sensor can be manufactured.

When the pattern depth of the mold pattern 1619 is H10, the depth H11 of the side wall of the polymer substrate is substantially the same as H10 before the bottom of the second recess 1621 is etched (FIG. 79D), = H10) The depth H12 of the second recess 1621 after etching the bottom of the second recess 1621 is slightly smaller than H11 because the etching rate of the insulating film 1613 at the bottom of the second recess 1621 is slower than the etching rate of the polymer 1615. Become. (H12 <H11) The depth of the capacitor electrode is the same as the depth H13 of the polymer substrate side wall (1615-1, 2, 3, 4), but this H13 is slightly smaller than H12. Therefore, it is important to control the etching variation and the etching amount of the bottom of the second recess 1621.
79. In the embodiment shown in FIG. 79, a conductive polymer is formed on a flat substrate surface (with an insulating film formed if necessary) without forming the recess 1614 in the substrate 1611, and the imprint method is used as in FIG. A simple sensor structure (there is no first recess 1614).

FIG. 80 is a diagram showing another embodiment in which a sensor is manufactured using an imprint mold. An insulating polymer 1302 is formed over the substrate 1301, and a conductive polymer 1303 is formed thereover. As this manufacturing method, for example, there are a method of producing a liquid insulating polymer 1302 by a coating method or a dip method, a method of applying a gel-like or paste-like insulating polymer 1302, or a polymer sheet adhesion method. Next, a liquid insulating polymer, a gel-like or paste-like insulating polymer, or a liquid conductive polymer 1303 is formed on the polymer sheet 1302 by a coating method or a dipping method, or a gel-like or paste-like one is formed. A conductive polymer 1303 is applied or a conductive polymer sheet 1303 is attached. (FIG. 80 (a))
Next, a mold 1305 having a recess forming pattern 1306 is inserted into the polymers 1303 and 1302. When the insulating polymer 1302 and the conductive polymer 1303 are liquid, gel, or paste, they can be pushed in as they are. When either the insulating polymer 1302 or the conductive polymer 1303 is solid, for example, imprinting is performed as follows. When the insulating polymer 1302 is solid, when the conductive polymer 1303 is liquid, gel, or paste, the molds 1305 and 1306 are first pushed into the conductive polymer 1303. The molds 1305 and 1306 are pushed into the softened insulating polymer 1302 at a temperature equal to or higher than the temperature at which the insulating polymer 1302 softens when the tip of the mold pattern 1306 approaches the insulating polymer 1302. Thereafter, the temperature is lowered below the softening temperature (TM1302) of the insulating polymer 1302, and the insulating polymer 1302 is cured. By using a material (TM1303 <TM1302) in which the softening temperature of the conductive polymer 1303 (TM1303) is lower than the softening temperature of the insulating polymer 1302, the temperature is further lowered to cure the conductive polymer 1303. After the insulating polymer 1302 and the conductive polymer 1303 are cured, the molds 1305 and 1306 are pulled out to form a recess 1307.

When the insulating polymer 1302 and the conductive polymer 1303 are solid, for example, a material (TM1302> TM1303) in which the softening temperature (TM1302) of the insulating polymer 1302 is higher than the softening temperature (TM1303) of the conductive polymer 1303 is used. The substrate 1301 on which the insulating polymer 1302 and the conductive polymer 1303 are formed is held between TM1302 and TM1303, and the molds 1305 and 1306 are inserted into the conductive polymer 1303. Next, when the tips of the molds 1305 and 1306 approach the insulating polymer 1302, the molds 1305 and 1306 are inserted into the insulating polymer 1302 which has been softened by increasing the temperature of the substrate 1301 to TM1302. When the molds 1305 and 1306 are pushed in place, the insulating polymer 1302 is cured by setting the temperature of the substrate 1301 between TM1302 and TM1303, and then the conductive polymer 1303 is cured by setting the temperature to TM1303 or lower. When the molds 1305 and 1306 are drawn after both the insulating polymer 1302 and the conductive polymer 1303 are cured, a recess 1307 is formed in the polymer. Since the bottom of the recess 1307 is an insulating polymer, the conductive polymer substrate sidewalls 1303 (for example, 1303-1 and 1303-3, or 1303-3 and 1303-4) are not electrically connected. Thereafter, the sensor can be manufactured by a process similar to the method shown in FIG. (FIGS. 80 (a), (b), (c), (d))
As described above, the thicknesses of the insulating polymer and the conductive polymer are adjusted so that the tip portion of the mold pattern 1306 that forms the bottom of the concave portion enters the insulating polymer. In the embodiment shown in FIG. 80, since the bottom of the recess made by imprint molding is an insulating polymer (insulating film), the etching removal process of the conductive polymer at the bottom of the recess shown in FIG. 79 is unnecessary. Simplify the process. In addition, since there is no etching process, the thickness of the conductive polymer is the same as the depth of the electrode of the capacitor, so that a very accurate capacitor can be formed.

FIG. 81 is a diagram showing another embodiment showing a method for producing a sensor of the present invention using an imprint method. In FIG. 81, the mold (or part thereof) used in the imprint method is used as it is as part of the sensor. A mold 1305 having a mold pattern 1306 for forming a recess is pushed into the substrate 1301 on which the insulating polymer 1302 and the conductive polymer are formed, so that the tip of the mold pattern 1306 for forming the recess enters the insulating polymer. The mold 1305 is a substrate on which a mold pattern 1306 for forming a recess is attached and supported, and is a substrate that supports the substrate side wall of the sensor in the future. Although it is easy to handle the mold 1305 as an insulating substrate in the process, a semiconductor substrate or a conductor substrate may be used as long as the electrodes are electrically separated. The following description will be made assuming that the mold 1305 is an insulating substrate.

Since the mold substrate 1305 that supports the mold pattern is left as a part of the sensor, a mold support substrate that further supports the mold substrate 1305 may be attached to the mold substrate 1305 if it cannot be made too thick. This adhesive is used or attached electrostatically, but it may be attached by other methods. For example, the mold substrate 1305 is an insulating substrate having magnetism such as ferrite, and an electromagnet is provided on the mold support substrate side to attach the mold substrate 1305. Since the mold substrate 1305 is left on the sensor side, the mold substrate 1305 can be separated from the mold support substrate if the function of the electromagnet is lost. The thickness of the mold substrate 1305 is about 10 μm to 1000 μm. If there is no problem in characteristics, it may be thicker or thinner.

A mold pattern 1306 for forming a recess is formed on the mold substrate 1305. The mold pattern 1306 can be formed as follows, for example. A polymer (resin) having a softening temperature T1306 is applied on the mold substrate 1305, and formed by dipping, spraying, or screen printing. This polymer 1306 is preferably a thermoplastic resin. Next, a mold having a pattern capable of forming a mold pattern is pressed to form a mold pattern 1306 by an imprint method or the like. It is cured by heat treatment at an appropriate temperature. Alternatively, it may be cured by UV irradiation.

Next, an insulating polymer (resin) having a curing temperature T1302 and a conductive polymer (resin) having a curing temperature T1303 are applied on the mold substrate 1301, and formed by dipping, spraying, or screen printing. These polymers are preferably thermosetting polymers. A mold 1305 having a mold pattern 1306 is inserted into the polymer and pressed so that the tip of the mold pattern 1306 becomes an insulating polymer. Next, the temperature is raised and the insulating polymer 1302 and the conductive polymer 1303 are cured. Therefore, T1302 <T1303 <T1306 is preferable. That is, first, the insulating polymer 1302 is cured at a temperature between T1302 and T1303, and then the conductive polymer 1303 is cured at a temperature between T1303 and T1306.

An opening 1310 is opened in part or all of the upper surface of the mold pattern 1306 of the mold substrate 1305. If there is no problem in the process, the opening 1310 may be open. However, if there is a problem in pressure transmission when the mold pattern 1306 is inserted into the polymers 1303 and 1302, the opening 1310 may be made of polymer (resin), rubber, metal, or the like. It may be filled. For example, the same material as the mold pattern 1306 may be used. Preferably, the material is a material that melts above a certain temperature (T1310). There is a relationship of T1302 <T1303 <T1310, and T1310 is preferably closer to T1306. After the insulating polymer 1302 and the conductive polymer 1303 are cured, the polymer 1310 and the material 1306 are melted at a temperature equal to or higher than T1310 or T1306. (The softening temperature of the mold substrate is equal to or higher than this temperature.) The melted material is allowed to flow outside through the opening 1310, thereby forming a recess 1307. If it is difficult to flow out of the opening, it is better to suck out the outside with a low pressure. Alternatively, the material of the mold pattern 1306 may be a material having a sublimation property, a material having a low boiling point (a material having a boiling point slightly higher than the melting point or softening point) or a volatile material, and may be vaporized and taken out. Alternatively, the polymer may be decomposed and the gas discharged to the outside. Examples of the polymer having sublimability include melamine and oil-soluble dyes.

Next, contact holes 1311 are formed in the insulating substrate 1305 to contact the conductive polymer substrate sidewalls 1303 (1303-1, 2, 3) (for example, when the insulating substrate 1305 is a glass substrate, a photosensitive film is formed). Then, a window is formed by dry etching (CF4 gas or the like) or wet etching (hydrofluoric acid-based etchant), or the mold substrate 1305 can be provided in advance as in 1310.) Are stacked on the contact hole 1311 and the insulating substrate 1305 and patterned to form conductor films / electrodes / wirings 1312 (1312-1, 2, 3, 4). As a result, a capacitor is formed in which the space capacity is the recess 1307-2 and the conductive polymer substrate sidewalls 1303-1 and 1303-2 sandwiching the space capacitor are used as counter electrodes. For example, the substrate sidewall 1303-2 is accelerated and the recess 1307 is formed. When the sound wave introduced into -1 is deformed, the space capacity of the recess 1307-2 changes, and the change in the capacitor capacity can be detected. Similarly, a capacitor is formed in which the space capacity is the recess 1307-3 and the conductive polymer substrate side walls 1303-3 and 1303-4 sandwiching the space capacitor are used as counter electrodes. For example, the substrate side wall 1303-3 has acceleration or recess 1307. When it is deformed by the sound wave introduced to -1, the space capacity of the recess 1307-3 changes, and a change in the capacitor capacity can be detected.

In this way, the recess 1307 (the trace of the mold pattern 1306) can be formed without pulling out the mold substrate 1305 and the mold pattern 1306, and the mold substrate 1305 becomes an insulator substrate as it is, so that the process is simple. In addition, it is technically easy because it does not adhere (already adhered) to the substrate side wall (for example, 1303-2 or 1303-3) of a thin polymer (thickness). In the present embodiment, a recess can be formed in a semiconductor substrate or the like, and a sensor can be formed in the recess. Therefore, an IC with a sensor can be manufactured with one chip.

FIG. 82 is a diagram showing a sensor in which a recess is formed in an insulating polymer by an imprint molding method, and the mold substrate is used as an insulator substrate on the recess as it is, and a manufacturing method thereof. First, the structure of the mold will be described. The mold of this embodiment includes a mold substrate 1405 that becomes an insulating substrate attached to the upper surface of the substrate side wall of the sensor, and a mold pattern 1406 (1406-1, 2, 3) that forms a recess of the sensor. The mold substrate 1405 is preferably an insulator substrate, but a semiconductor substrate or a conductor substrate can also be used. Although the thickness depends on the thickness of the sensor, it is 10 μm to 1000 μm, but it may be thinner or thicker. However, in the case of a semiconductor substrate or a conductor substrate, an insulating region is formed between regions in contact with each electrode so that the capacitor electrodes facing each other are electrically separated. Hereinafter, the mold substrate 1405 will be described as an insulator substrate. Examples of the insulating substrate include a glass substrate, a quartz substrate, a ceramic substrate, an insulating plastic substrate, various polymer insulating substrates, and insulating rubber.

A mold pattern 1406 for forming a sensor recess is attached to the mold substrate 1405. The mold pattern material is, for example, a polymer or rubber, and is a mold material that can be imprinted into the liquid or gel polymer 1402, and reacts with the liquid or gel polymer 1402 during the process and during use. It is desirable that the material is a material that does not change, and the volume change (variation) of the concave portion is small. As shown in FIG. 82A, the pattern of the conductor film 1407 (1407-1, 2, 3, 4) is formed on the mold pattern 1406 (1406-1, 2, 3). An opening 1410 is formed in a part or all of the region of the mold substrate 1405 where the mold pattern 1406 (1406-1, 2, 3) for forming the recesses is formed. The opening 1410 has a filling material. And is flat at the same level as the substrate surface of the mold substrate 1405. This filling material is, for example, a thermoplastic polymer having a softening point (or melting point) T1410. Alternatively, a metal or an inorganic material having a melting point T1410 may be used.

Further, contact holes 1408 (1408-1, 2, 3) for making contact with the conductor film 1407 are formed in the mold substrate 1405. This contact hole 1408 is also filled with a filling material, and is flat at the same level as the substrate surface of the mold substrate 1405. This filling material is, for example, a thermoplastic polymer having a softening point (or melting point) T1408. Alternatively, a metal or an inorganic material having a melting point T1408 may be used.

The material constituting the mold pattern 1406 is, for example, a thermoplastic polymer having a softening point (or melting point) T1406. Alternatively, for example, a metal or an inorganic material having a melting point T1406 may be used. The mold pattern 1406 is formed by forming a thermoplastic polymer 1406 on the mold substrate 1405 by a coating method, a dipping method, a screen printing method, or the like. The mold pattern 1406 may be formed by an imprint molding method or may be patterned by a screen printing method. The depth H31 of the mold pattern 1406 is determined by the depth of the recess.

After forming the mold pattern 1406, a conductor film 1407 is stacked on the mold pattern 1406. Further, a photosensitive film is stacked on the conductor film 1407, and necessary patterning of the photosensitive film is performed to perform necessary wiring of the conductor film 1407. The region A serving as the polymer substrate side wall is narrow, but in the case of an acceleration sensor or a microphone, patterning of the conductor film 407 is unnecessary in the portion A (conductor film 1407-2 or 1407-3). If the film is a positive type, there is no problem in patterning since the photosensitive film remains after development in the unexposed part. On the other hand, since the portion B of the mold substrate 1405 having a large substrate surface side (conductor films 1407-1 and 1407-4) is a wide region, the thickness of the positive resist does not become too thick (in the case of a coating method or a dip method). However, when a photosensitive dry film is used, it is possible to suppress the increase in thickness.) The photosensitive film can be sufficiently exposed and exposed with a deep focal depth. Thus, the conductive film can be sufficiently patterned, and the conductive film can be etched based on the pattern. Also, as shown in FIG. 82A, the conductive film 1407 is removed by etching at the tip of the mold pattern 1406. Since the tip of the mold pattern 1406 is a region where the photosensitive film is thin, the positive type photosensitive film can be sufficiently exposed and can be easily removed. Therefore, the conductive film 1407 at the tip of the mold pattern 1406 is removed by etching. Is easy.

Since the mold substrate 1405 remains on the sensor side, the mold substrate 1405 is attached to the mold support substrate 1414 for supporting and pressing the mold substrate 1405 with a press using, for example, an adhesive layer 1412. The adhesive layer 1412 is a thermoplastic resin having a softening temperature (melting point) T1412. Alternatively, if the mold substrate 1405 is an insulating substrate such as magnetic ferrite, the mold support substrate 1414 can be provided with an electromagnet, and the mold substrate 1405 can be attached to the mold support substrate 1414 with an electromagnet. Since the agent 1412 is not strong, the process is simplified.

On the other hand, on the substrate side on which the sensor is formed, the insulating polymer 1402 is formed on the substrate 1401 using a coating method, a dipping method, a screen printing method, a dry film adhesion method, or a melting method. The insulating polymer 1402 is a thermosetting polymer, and its curing temperature is T1402. A mold substrate 1405 having a mold pattern 1406 is pushed into an insulating polymer 1402 in a liquid state, a softened state, or a molten state, the mold substrate 1405 and the polymer 1402 are brought into contact with each other, and the polymer 1402 is pressed by the mold substrate 1405. The temperature of the polymer 1402 is held at T1402 or higher (holding temperature T39-1), and the polymer 1402 is cured. At this time, the mold pattern 1406, the filling material 1408, the filling material 1410, and the adhesive 1412 are not softened. That is, T1402 <T39-1 <T1406, T1408, T1410, and T1412. (Fig. 82 (b))

After the polymer 1402 is cured, the temperature is further raised (this temperature is T39-2), and the mold pattern 1406, the filling material 1408, the filling material 1410, and the adhesive 1412 are softened (or melted). That is, T39-2> T1406, T1408, T1410, T1412. First, the adhesive 1412 is melted and the mold support substrate 1414 is removed. Next, the molten filling material 1410 is removed, and the melted mold pattern 1406 is removed from the opening 1410. (Indicated by the arrow in FIG. 82 (c)) Further, the contact hole 1408 (1408-1, 2, 3, 4) connected to the conductor film 1407 (1407-1, 2, 3, 4) is filled. The material being melted is removed. Note that if the filling material of the contact hole 1408 is a conductor material, it does not need to be removed, and thus it does not need to be melted. That is, in this case, T1408> T39-2 may be satisfied. As a result, recesses 1416 (1416-1, 2, 3) are formed, and the conductor film 1407 (1407-1, 2, 3, 4) is the inner surface of the recess 1416 (1416-1, 2, 3), that is, The insulating polymer 1402 automatically remains on the vertical side wall side of the substrate side wall 1402 (1402-1, 2, 3, 4) and the upper surface of the substrate side wall 1402 (1402-1, 2, 3, 4), and the wiring pattern 1407 (1407-1, 2, 3) is formed.

Next, a conductor film is laminated and patterned to form a conductor film / electrode / wiring 1412 (1412-1, 2, 3, 4) on the insulator substrate 1405. When the filling material filled in the contact hole 1408 is not a conductor material, this portion is opened. Therefore, a conductor film can also be laminated on the contact hole 1408 and connected to the conductor film wiring 1407. Note that the conductive film is stacked by a CVD method or a PVD method. The conductor films 1407, 1408, and 1412 are made of aluminum, copper, titanium, nickel, platinum, chrome, tungsten, molybdenum, or an alloy thereof. Although it is also laminated in the concave portion 1416 (1416-1, 2, 3), it is very thin. If the photosensitive film in the opening 1410 is removed and opened, the etching can be easily removed. In particular, the conductor film (1412) formed in the recess is easily etched by putting an isotropic etching process in the etching process. After this, the opening to the recess can be further increased, or a process for closing the opening can be added. (Fig. 82 (d))

As described above, the sensor can be manufactured by a very simple process by the structure and process of the sensor shown in FIG. In addition, since the substrate side wall 1402 (1402-2, 3) having a narrow width is formed after the upper surface is fixed by the mold substrate 1405, it is formed by an extremely safe process. As a result, the upper surface of the substrate side wall 1402 (1402-1, 2, 3, 4) is fixed by the mold (insulator) substrate 1405, and the lower surface is fixed by the insulating polymer 1402.
The opening 1410 and the contact hole 1408 are formed in the mold substrate 1405 in advance. However, after the polymer 1402 is cured and the mold support substrate 1414 is removed, a photosensitive film is formed and the photosensitive film is patterned to form the opening. 1410 and contact holes 1408 can also be formed. After the opening 1410 is formed, the mold pattern 1406 can be melted and removed. In this case, it is not necessary to fill the opening 1410 and the contact hole 1408 with a filling material in advance, and it is not necessary to melt and remove them.

In addition, if the material of the mold pattern 1406, the filling materials 1408 and 1410, and the adhesive material 1412 are sublimable materials or materials whose boiling points are close to the melting point, these materials can be vaporized and removed, so that the removal process can be performed. It becomes easy. Needless to say, the melting point of the conductor film 1407 is higher than the process temperature so as not to be melted or deformed during the process. Further, the sensor shown in FIG. 82 can be mounted in the same chip as the transistor or IC by forming a recess in the semiconductor substrate. In addition, if the sensor is formed on the surface opposite to the surface on which the IC or the like is formed, the size of the sensor-mounted IC chip can be reduced.

The sensor of the present invention can also be applied to a gyro sensor (angular velocity sensor). An object of mass m receives a force of mrω ^{2 due to} the angular velocity ω. For example, when a rotational force (angular velocity ω) is applied to the sensor having the structure shown in FIG. 54, the capacitance change of each capacitor is different, and therefore the rotation center direction can be determined from the capacitor having the largest capacitance change. If the rotation center is not located at the center of the circle shown in FIG. 54, the position of the capacitor having a large capacitance change changes, so that the rotation center can be obtained from the rotation center direction after time t seconds. If a plurality of sensors are arranged, the center of rotation can be immediately recognized and the accuracy can be improved. Also, the angular velocity ω can be determined from the magnitude of the force. Furthermore, the moving speed v is also known. If the number of divided electrodes is increased, the accuracy of the angular velocity ω, the moving velocity v, and the rotation center can be increased. A plurality of three-dimensional arrangements (arranged in various directions) can be used as a three-dimensional angular velocity sensor.

The sensor structure of the present invention can be used not only for acceleration sensors, microphones and angular velocity sensors, but also for various other sensors. For example, the present inventor has shown various sensor inventions including a pressure sensor in Japanese Patent Application No. 2012-016017, but it goes without saying that the present invention can also be applied to various sensors shown in Japanese Patent Application No. 2012-016017. . As an example, FIG. 83 shows an example in which the sensor structure and the manufacturing method shown in FIG. 82 are applied to the structure of the pressure sensor and the manufacturing method thereof.

FIG. 83 is a diagram showing a structure of a pressure sensor of the present invention using an imprint method and a manufacturing method thereof. Elements similar or identical to those in FIG. 82 use the same reference numerals. The mold substrate 1405 has a mold pattern 1406 (1406-1, 2, 3, 4) for forming a concave portion in the polymer using an imprint method. A conductor film 1407 is patterned on the mold pattern 1406 (1406-1, 2, 3, 4) and the mold substrate 1405. The mold pattern 1406 is formed by imprinting or photolithography. The mold pattern 1406 is, for example, a polymer material (polymer) having a softening temperature or a melting point T1406, and is preferably a thermoplastic resin. Conductor films are polycrystalline silicon films, amorphous silicon films, silicide films such as WSix, MoSix, TiSix, etc., various metal films, various alloy films, conductive nanotubes, conductive films, etc., laminated by CVD, PVD, ion plating, etc. Graphene, conductive polymer, and the like. Since it is a laminated film by a CVD method, a PVD method, an ion plating method, etc., it is laminated not only on the upper surface of the mold pattern 1406 but also on the side surface and the bottom thereof.

As shown in FIG. 83 (a), the conductor formed on the convex patterns 1406-2 and 1406-3 (side surface and upper surface) of the mold pattern forming the concave portions 1416-2 and 1416-3 serving as the capacitive spaces. Of the film 1407, the conductor film on the ceiling (shown by arrow C) of the convex patterns 1406-2 and 1406-3 is removed. As a method for removing the conductor film, for example, a positive photosensitive film is coated by a coating method or a spray method, and then the photosensitive film on the ceiling portions (indicated by arrow C) of the convex patterns 1406-2 and 1406-3. Can be easily exposed, and the photosensitive film in this portion can be removed. It is necessary to pattern the conductor film at the bottom of the mold pattern 1406, that is, the portion B on the mold substrate 1405. Since this region can be made wider than the other region (A region), the photosensitive film is also relatively thin. In addition, since patterning with high accuracy is unnecessary, patterning at the B portion is not a problem. (Because the exposure time can be taken sufficiently long, exposure is possible even if the photosensitive film is thick.) Also, the concave part of the mold pattern (A region, this part is a narrow substrate side wall (diaphragm) and the photosensitive film is thick. Since the photosensitive film becomes thicker, the exposure becomes insufficient. However, since it is not necessary to remove the photosensitive film in the area A, there is no problem if it is a positive photosensitive film. In the case where the photosensitive film is a dry film, the bottom of the mold pattern 1406 does not become so thick that the photosensitive film can be patterned without any problem. Furthermore, if an electrodeposition resist method is used, there is no problem in patterning.

In the mold substrate 1405, a part or the whole of the region where the mold pattern 1406 is formed may be opened to form the opening 1410, and the part may be filled with a filling material. Further, contact holes 1408 (1408-1, 2, 3, 4, 5) for making contact with the conductor film 1407 may be formed and filled therewith. If a conductor film is used as the filling material of the contact hole 1408, it can be used as a connection material with the conductor film 1407 in the contact hole 1408 as it is. The contact hole 1408 may be filled with a polymer or the like and removed later. The opening 1410 and the contact hole 1408 can be formed by irradiating the mold substrate 1405 with a laser, or can be formed by dry etching or wet etching after forming and patterning a photosensitive film. If the filling material 1408 or 1410 is made of the same material as the mold pattern 1406 (for example, a thermoplastic polymer), the mold pattern 1406 can be formed simultaneously with the formation, and the process can be simplified.

When pressing is not possible only with the mold substrate 1405 with the mold pattern 1406, the mold substrate 1405 with the mold pattern 1406 is attached to the mold support substrate 1414 with an adhesive 1412 or the like, and the mold support substrate 1414 is set in a press device. It may be pushed into the polymer 1402 formed in the above. As described above, when a ferrite substrate which is a magnetic material is used as the mold substrate 1405, the mold substrate 1405 can be directly attached to the mold support substrate 1414 by using an electromagnet without using the adhesive 1412.

Next, the mold substrate 1405 and the like are imprinted in the insulating polymer 1402 to cure the insulating polymer 1402. (FIG. 83 (b)) The insulating polymer 1402 is a liquid polymer deposited on the substrate 1401 by dropping, spraying, spin coating, dipping, etc., and then pre-baked to make it soft or gelled if necessary. Then, the mold substrate 1405 with the mold pattern 1406 is pressed (imprinted) into the insulating polymer 1402. Alternatively, an insulating polymer film is attached onto the substrate 1401 and baked to be softened or melted to push the mold substrate 1405 with the mold pattern 1406 into the insulating polymer (imprint). The insulating polymer 1402 is preferably a thermosetting resin or a photocurable resin. When the curing temperature of the insulating polymer 1402 is T1402, a material that lowers the softening temperature T1406 of the polymer or the like constituting the mold pattern 1406 is selected as T1402. The mold substrate 1405 with the mold pattern 1406 is pressed into the insulating polymer 1402 (the mold substrate 1405 is in contact with the insulating polymer 1402 and further pressed (pressed). The insulating polymer 1402 is pressed at a temperature between T1402 and T1406. Harden.
Insulating polymers include, for example, fluororesin film, polyethylene film, PMMA (polymethyl methacrylate), polycarbonate, polystyrene, acrylic resin, ABS resin, vinyl chloride, liquid crystal polymer, polyvinyl alcohol (PVA), polypropylene (PP), polyethylene ( PE), N-methyl-2-pyrrolidone (NMP), acrylic resin (PMMA), polydimethylsiloxane (PDMS), polyimide resin, polylactic acid, various rubbers (natural rubber and synthetic rubber), or polyvinylidene fluoride (PVDF) , Ferroelectric polymers such as vinylidene fluoride-trifluoroethylene (VDF / TrFE) copolymer, vinylidene fluoride tetrafluoroethylene (VDF-TeFE), vinylidene cyanide-vinyl acetate copolymer, nylon-11 A variety of polymeric materials such as piezoelectric polymer such as a polar polymer.
Alternatively, the insulating polymer may be an organic or inorganic silicate glass, in which case it is imprinted into a liquid or gel silicate glass, and then the silicate glass is cured (solidified). In the case of a polymer, a method of using electromagnetic waves such as ultraviolet rays may be used as a method of curing.

After the insulating polymer 1402 is cured, the mold support substrate 1414 is removed. In the case of the magnetic body 1405, the adhesive layer 1412 is not provided and can be easily separated if the electromagnet function is lost. In the case where the adhesive layer 1412 is used, the mold support substrate 1414 can be easily detached from the mold substrate 1405 if the adhesive layer 1412 is made of a thermoplastic resin and has a temperature higher than its softening (melting) temperature T1412. Next, the process temperature is maintained at a temperature equal to or higher than T1406, and the mold pattern 1406 is melted (softened). At this time, the filling material of the opening 1410 is also softened and melted. The melted / softened polymer 1406 is taken out from the opening 1410. If the outside is decompressed and sucked out, the polymer 1406 can be easily taken out. If a material higher than the process temperature is used as the melting point T1407 of the conductor film 1407, the conductor film 1407 will not melt.

As a result, as shown in FIG. 83 (c), recesses 1416 (1416-1, 2, 3, 4) can be formed in the insulating polymer substrate 1402, and the substrate sidewalls 1402 (1402-1, 1402,. 2, 3, 4, 5), and the upper and side surfaces of these substrate side walls 1402 (1402-1, 2, 3, 4, 5) (also the inner surface of the recess 1416) and the bottom of the recess 1416 The conductor film / wiring 1407 (1407-1, 2, 3) is formed. The conductor film / wiring 1407 (1407-1, 2, 3) adhering to the outer surface and upper (bottom) surface of the mold pattern 1406 and the mold substrate is insulative when the insulating polymer 1402 is cured. The surface of the polymer 1402 (after adhering to the inner surfaces of the substrate side walls 1402-1, 2, 3, 4, 5 and the top and bottom surfaces of the insulating polymer 1402 is softened and melted and taken out to the outside) Also remains.

Thereafter, a conductor film 1412 is laminated on the mold substrate and patterned as a desired conductive film / electrode / wiring 1412 (1412-1, 2, 3, 4, 5). When the contact hole 1408 is already formed in the insulator substrate 1405 and the contact hole 1408 is filled with the conductor film, the conductor film 1412 may be laminated thereon. When the contact hole 1408 is filled with a polymer or the like, the polymer or the like may be softened and melted and taken out. Thereafter, a conductor film is stacked in the contact hole 1408 and connected to the conductor film / electrode / wiring 1407. When the opening 1410 and the contact hole 1408 are not formed in the mold substrate 1405 in advance, a photosensitive film is formed on the insulating substrate 1405 and patterned. After that, the insulating substrate 1405 is etched (wet or dry) to form an opening 1410 and a contact hole 1408.

As described above, a capacitance-type pressure sensor can be manufactured. Insulating polymer substrate side wall 1402 (1402-2, 3, 4) becomes a diaphragm sandwiched by recesses 1416 (1416-1, 2, 3, 4) on both sides, and due to the pressure difference between these adjacent recesses 1416 The substrate side wall 1402 of the insulating polymer that is a diaphragm is deformed. That is, the upper surface of the substrate side wall 1402 is regulated by the insulator (mold) substrate 1405 and the lower surface of the substrate side wall 1402 is regulated by the bottom portion (1402B) of the insulating polymer 1402, but the other portions are not regulated. The insulating polymer substrate side wall 1402 is deformed. For example, the substrate side wall 1402-2 can apply the pressure P2 of the recess 1416-1 (the pressure P2 can be applied through the opening 1410) and the pressure P1 of the recess 1416-2 (the pressure P1 through the opening 1410). Deformation due to pressure difference with The substrate side wall 1402-3 is not deformed because the pressure in the concave portions 1416 (1416-2 and 1416-3) on both sides is the same as P1, but the distance between the electrodes of the concave portion 1416-2 (the width W1 of the concave portion 1416-2) changes. Therefore, since the capacitor capacity measured by the opposing electrodes 1407-1 and 1407-2 changes, the pressure difference P2-P1 can be calculated.

Similarly, the substrate side wall 1402-4 can apply the pressure P2 of the recess 1416-4 (the pressure P2 can be applied through the opening 1410) and the pressure P1 of the recess 1416-3 (the pressure P1 through the opening 1410). Deformation) due to the pressure difference. The substrate side wall 1402-4 is not deformed because the pressure in the concave portions 1416 (1416-2 and 1416-3) on both sides is the same as P1, but the distance between the electrodes of the concave portion 1416-3 (the width W2 of the concave portion 1416-3) changes. Therefore, since the capacitor capacity measured by the opposing electrodes 1407-3 and 1407-4 changes, the pressure difference P2-P1 can be calculated.

Or if the recessed parts 1416-1 and 1416-3 are made into the pressure P2, the board | substrate side wall 1402-2 and 1402-3 will change to a mutually reverse direction. For example, when P1> P2, the substrate side walls 1402-2 and 1402-3 are deformed in the direction in which the concave portion 1416-2 is expanded, and when P1 <P2, the substrate side walls 1402-2 and 1402-3 are the concave portion 1416-. It is deformed in the direction in which 2 is depressed. Therefore, since the capacitor capacity measured by the opposing electrodes 1407-1 and 1407-2 changes more greatly than the above, the pressure difference P2-P1 can be calculated and the sensitivity is increased.

Thus, if the structure of this invention is used, it can be applied also to a pressure sensor. If a resistor is formed on the side wall of the substrate, a pressure sensor using a piezoresistor can be manufactured. Further, if one of the openings 1410 to which P1 or P2 shown in FIG. 83 (d) is applied is closed (for example, a glass substrate is attached to the opening), the pressure of P1 or P2 can be confined in the recess. Therefore, an absolute pressure sensor can also be produced. Note that the pressure sensor shown in FIG. 83 can be fabricated in a recess if a recess is formed in the semiconductor substrate and the insulating polymer described in FIG. 83 is formed in the recess. Needless to say, the contents (structure, process, etc.) described so far in the specification can also be applied to the pressure sensor.

When forming recesses or through-holes (through-grooves) in a polymer by imprint molding, not only can the capacitance change of the capacitor be detected by using a piezoelectric polymer for the polymer, but also the deformation of the substrate sidewall as a diaphragm. It is possible to measure the voltage change due to the polarization of the electric charge. Therefore, it is possible to detect the magnitude and direction of sound waves and force (acceleration, angular acceleration, pressure) from both of them. For example, in FIG. 60, the polymer 615 may be considered to be a piezoelectric polymer. At this time, in the substrate side wall 615-1, the electrode forms only one side 625-2, but is also formed on the side surface of the substrate side wall 615-1 on the recess 621-1 side (this electrode is referred to as 625-6). ). 625-2 and 625-6 are electrodes formed on the side surface of the substrate side wall 625-2 which is a piezoelectric film, and are not connected to each other. A potential difference is generated between the conductor film electrodes 625-2 and 625-6 due to the electric charge generated on the side surface of the piezoelectric film 625-2 due to the deformation of the substrate side wall 625-2. And the magnitude and direction of force (acceleration, angular acceleration, pressure) can be detected. The substrate side wall 615-2 is also formed on the side surface of the substrate side wall 615-2 on the recess 621-1 side. As described above, not only the capacitance change of the capacitor having the concave portions 621-2 and 621-3 as the capacity space, but also the potential difference between the piezoelectric film substrate side wall 615-1 and 615-2, the change in the sound wave and Since the magnitude and direction of force (acceleration, angular acceleration, pressure) can be detected, sensitivity and accuracy can be increased.
Examples of the piezoelectric polymer include various piezoelectric polymers such as polyvinylidene fluoride (PVDF), polyamino acid, chiral polymer-based piezoelectric polymer, and ferroelectric liquid crystal. By making the polymer shown in FIG. 79 to FIG. 83 and the other specifications shown as a piezoelectric polymer into a piezoelectric polymer, the effects of piezoelectricity as described above can be used to generate sound waves and force (acceleration, angular acceleration). ), Pressure) can be detected and the sensitivity and accuracy can be increased. If a piezoelectric polymer is used, the device of the present invention can be used as a speaker.

As described above, the force sensor (acceleration sensor, angular velocity sensor, pressure sensor, etc.) or microphone using the deformation of the side wall of the substrate formed between the substrate and the through-hole or recess of the present invention is used. The size of the speaker can be made very small as compared with a speaker produced in parallel with the conventional substrate surface. For example, if a 300 μm × 300 μm diaphragm is required, conventionally, a chip size of at least 0.5 mm × 0.5 mm was required. In the case of the present invention in which the diaphragm is manufactured in the thickness direction of the substrate, When the substrate is viewed in plan, two 300 μm × 10 μm diaphragms are arranged, the size of the central through hole is 30 μm, and the through hole width of the capacity space is 20 μm × 2, which is about 0.4 mm × 0.1 mm It becomes. Accordingly, the area occupied by the substrate plane is about 1/6. If the same substrate is used, the number is 6 times, so the manufacturing cost is about 1/6. In addition, since the chip size is reduced, the mounting cost is also reduced. Since the area is also small, the chip size of the IC does not become too large even if it is incorporated in the IC, so the loss cost is also reduced. In addition, when a semiconductor substrate such as a silicon substrate is used as the substrate 611, it is possible to mount a pressure sensor and an IC having various functions on the same substrate or chip together with a function for controlling or calculating the pressure sensor. it can. Furthermore, compared to the conventional method, the mounting area can be reduced, the mounting size can be reduced, and the number of connection wirings can be reduced. This simplifies the process, greatly reduces manufacturing costs, improves reliability, and improves yield. Can be realized.

The present invention can also be used for an electric double layer capacitor. FIG. 84 is a diagram showing the structure of the electric double layer capacitor. Through holes or recesses 2014 (2014-1, 2, 3, 4, 5) are formed in the substrate 2011, and substrate side walls 2011 (2011-1, 2, 3, 4, 5, 6) are formed therebetween. The When the substrate 2011 is a conductor substrate, adjacent substrate sidewalls are prevented from conducting as through holes penetrating from the first surface (front surface) to the second surface (back surface) of the substrate 2011. When the substrate 2011 is an insulator substrate, a conductor film is formed on the side surface of the substrate side wall 2011 (2011-1, 2, 3, 4, 5, 6), and a through hole or a recess 2014 (2014-1, 2). The conductive films on the side surfaces facing each other in 3, 4, 5) are patterned so as not to conduct. In the case of the through hole, thin plates (insulating substrates) 2012 and 2013 are attached to both surfaces (first surface and second surface) of the substrate 2011. In the case of a recess, a thin plate (insulating substrate) (for example, 2013) is attached to the surface side where the recess opens. An electrolytic solution or an electrolyte gel is put into the through-hole or the recess 2014 (2014-1, 2, 3, 4, 5) or sealed with a solid electrolyte. In the case of putting an electrolytic solution or an electrolyte gel, for example, a thin plate (insulating substrate) adheres to both surfaces (first surface and second surface) of the substrate 2011 while being immersed in the electrolytic solution or the electrolyte gel. Alternatively, after attaching a thin plate (insulating substrate) to both surfaces (first surface and second surface) of the substrate 2011, a thin plate (insulating) covering each through hole or recess 2014 (2014-1, 2, 3, 4, 5). A hole is made in the substrate), an electrolytic solution or an electrolyte gel is put through the opening hole, and each through hole or recess 2014 (2014-1, 2, 3, 4, 5) is filled with the electrolytic solution. If the plug is closed, the electrolyte and electrolyte gel will not leak.
The solid electrolyte is, for example, a polymer (polymer) solid electrolyte. After forming the through-hole or recess 2014 (2014-1, 2, 3, 4, 5), the softened polymer or melted polymer is applied, dipped, dispensed, screen-printed, etc., and the through-hole or recess 2014 (2014- 1, 2, 3, 4, 5) are filled with a polymer and heat-treated to solidify the polymer. Thereafter, a thin plate (insulating substrate) is attached to both sides or one side of the substrate 2011. As a result, adjacent side walls of the substrate constitute a capacitor (capacitor) and become an electric double layer capacitor. Capacitance can be increased by electrically connecting every other substrate sidewall. For example, in FIG. 84, the substrate side walls 2011-2 and 2011-4 are connected to be combined with the electrode A, and the counter electrode side is connected to 2011-3 and 2011-5 to be combined with the electrode B. The electric double layer capacitor as shown in FIG. 84 can realize an ultra-small capacitor.

FIG. 85 is a diagram showing the structure of another electric double layer capacitor. In FIG. 85, a recess 2022 is formed in a semiconductor substrate 2021 such as a silicon substrate, and the recess 2022 is filled with a polymer 2021. A recess 2024 (2024-1, 2, 3) is formed in the polymer 2021, and a conductor film electrode 2025 is formed on the inner surface of the recess 2024 (2024-1, 2, 3). For example, conductor film / electrodes 2025-1-1 and 2025-1-2 are formed on the inner surfaces facing each other in the recess 2024-1. An electrolytic solution, an electrolyte gel, or a solid electrolyte 2027 is formed in the recess, and a thin plate (insulating substrate) 2028 is attached to the first surface (front surface) of the semiconductor substrate 2021 to close the recess 2022. As a result, an electric double layer capacitor is configured by the facing inner surface electrodes 2025-1-1 and 2025-1-2 and the electrolyte 2027 in the recess 2022-1. Since a large number of recesses 2024 are formed, the capacitance of the capacitor can be increased by connecting the opposing electrodes together into the electrodes A and B. In addition, when forming a recessed part in a polymer, a recessed part can also be formed using the imprint method. Since the electric double layer capacitor shown in FIG. 85 can be formed in a semiconductor substrate, an IC or a transistor formed in the semiconductor substrate can be moved using a discharge voltage from the electric double layer capacitor, and the ultra-small size can be achieved. Self-standing devices (devices that operate with only one chip) can be manufactured.

FIG. 86 is a diagram showing the structure of still another electric double layer capacitor. In FIG. 86, a recess 2032 is formed in a semiconductor substrate 2031 such as a silicon substrate, and an electrolyte 2033 is filled in the recess 2032. In the recess 2032, an electrode pattern 2036 (2036-1, 2, 3, 4, 5, 6) is formed on another substrate (insulator substrate) 2035, and the other substrate (insulator substrate) 2035 is inserted. To do. Since a large number of recesses 2032 are formed in the semiconductor substrate 2031, another substrate (insulator substrate) 2035 on which a large number of electrode patterns 2036 are formed is inserted while aligning with the respective recesses. Another substrate (insulator substrate) 2035 is attached to the semiconductor substrate 2031 as it is. Therefore, the length of the electrode pattern 2036 (2036-1, 2, 3, 4, 5, 6) needs to be shorter than the depth of the recess. If the distal end side of the electrode pattern 2036 (2036-1, 2, 3, 4, 5, 6) is a free end and may be deformed when inserted into the recess 2032, the electrode pattern 2036 (2036-1, 2, 3) 4, 5, 6), the insulator substrate 2037 may also be attached. In that case, when the electrolyte 2033 is difficult to enter between the electrode patterns 2036 (2036-1, 2, 3, 4, 5, 6), an appropriate opening may be provided in the insulator substrate 2037. When the electrolyte 2033 is used as it is in an electrolytic solution or an electrolyte gel, it may be left as it is. However, when a solid electrolyte is used as the electrolyte, a polymer (polymer) material is used as the electrolyte, and when the electrolyte 2033 is filled, the electrolyte 2033 is liquid. Then, another substrate (insulator substrate) 2035 is inserted and then heat treated to solidify the electrolyte 2033. As a result, the adjacent electrodes 2036 form an electric double layer capacitor in which an electrolyte enters between them. Since the electric double layer capacitor shown in FIG. 86 can be formed in a semiconductor substrate, an IC or a transistor formed in the semiconductor substrate can be moved using a discharge voltage from the electric double layer capacitor, and an ultra-small size can be obtained. Self-standing devices (devices that operate with only one chip) can be manufactured. The double layer capacitor shown in FIG. 86 can also be used as a single electric double layer capacitor if an insulating substrate is used as the substrate 2031.

The electrolytic solution or the electrolyte gel is, for example, an inorganic brine electrolysis such as lithium salt such as lithium hexafluorophosphate (LiPF ₆ ), sulfuric acid, potassium hydroxide solution, acetonitrile, propylene carbonate, tetrafluoroammonium borate, Quaternary such as tetraethylammonium tetrafluoroborate (Et ₄ NBF ₄ ), tetramethylammonium tetrafluoroborate, tetrapropylammonium tetrafluoroborate, tetrabutylammonium tetrafluoroborate, trimethylethylammonium tetrafluoroborate (Et ₃ MeNBF ₄ ) Ammonium salt, triethylmethylammonium tetrafluoroborate, diethyldimethylammonium tetrafluoroborate, N-ethyl-N-methylpyrrolidinium tetrafluoroborate , Ammonium tetrafluoroborate such as N, N-tetramethylenepyrrolidinium tetrafluoroborate, 1-ethyl-3-methylimidazolium tetrafluoroborate, tetraethylammonium perchlorate, tetramethylammonium perchlorate, tetrapropyl Ammonium perchlorate, tetrabutylammonium perchlorate, trimethylethyl perchlorate, triethylmethylammonium perchlorate, diethyldimethylammonium perchlorate, N-ethyl-N-methylpyrrolidinium perchlorate, N, N-tetramethylenepyrrolidinium park Lorate, ammonium perchlorates such as 1-ethyl-3-methylimidazolium perchlorate, tetraethylammonium hexaf Like phosphonium salts like lophosphate, tetramethylammonium hexafluorophosphate, tetrapropylammonium hexafluorophosphate, tetrabutylammonium hexafluorophosphate, trimethylethylhexafluorophosphate, triethylmethylammonium hexafluorophosphate, diethyldimethylammonium hexafluorophosphate Organic electrolytes such as ammonium hexafluorophosphates, lithium hexafluorophosphate, and lithium tetrafluoroborate.

These organic electrolyte solvents include, for example, aprotic organic solvents such as chain carbonates such as dimethyl carbonate and diethyl carbonate, cyclic carbonates such as ethylene carbonate and propylene carbonate, acetonitrile and propionitrile. Nitriles, γ-butyrolactone, α-methyl-γ-butyrolactone, lactones such as β-methyl-γ-butyrolactone, γ-valerolactone, 3-methyl-γ-valerolactone, dimethyl sulfoxide, diethyl sulfoxide Sulfoxides such as dimethylformamide, amides such as diethylformamide, cyclic ethers such as tetrahydrofuran, dimethoxyethane and dioxolane, dimethylsulfolane, sulfolane, and one or two It can also be used as a mixed solvent described above.

The solid electrolyte is, for example, a polymer solid electrolyte in which a polyethylene oxide polymer and an alkali metal salt are combined, a polymer solid electrolyte in which an electrolyte solution composed of a metal salt and an aprotic solvent is impregnated in a crosslinked network of polyethylene oxide, Ion-conducting polymer solid electrolyte, or lithium phosphate (Li _x PO _y ), lithium iron phosphate, using a composite comprising a polymer obtained from a (meth) acrylate prepolymer containing an oxyalkylene group and an electrolyte _{(Li x Fe y (PO 4} ) z), lithium manganese phosphate _{(Li x Mn y (PO 4} ) z), nickel phosphate lithium _{(Li x Ni y (PO 4} ) z), chromic lithium phosphate (Li _{x Cr y (PO 4) z} ) lithium oxide or phosphate, such as, and phosphorus sulfide lithium ( i x _{PS y)} can be used as the inorganic solid electrolyte such as phosphorus sulfide compounds, such as.

A known material can be used for the electrode, for example, a metal such as aluminum, gold, platinum, copper, iron, chromium, zinc, tungsten, molybdenum, titanium, tantalum, nickel, or an alloy thereof, a compound of metal and silicon. Various silicides, carbon, carbon nanotubes, graphene, low-resistance silicon, conductive polymer (conductive polymers are, for example, polyaniline, polyacetylene and derivatives thereof, polyparaphenylene and derivatives thereof, polypyrrole and derivatives thereof, polythienylene and derivatives thereof , Polypyridinediyl and derivatives thereof, polyisothianaphthenylene and derivatives thereof, polyfurylene and derivatives thereof, polyselenophene and derivatives thereof, polyparaphenylene vinylene, polythienylene vinylene, polyfurylene vinylene, polynaphthenile Vinylene, polyselenophene vinylene, polyarylene vinylene and derivatives thereof, such as poly pyridinediyl vinylene) can be used.

FIG. 87 is an example showing a plan view of the structure of the electric double layer capacitor. A large number of parallel plate capacitors may be connected by forming contact holes in an insulating substrate (thin plate). As shown in FIG. 87, if the counter electrodes 2042 and 2043 constituting the capacitor are formed in parallel and spiral. There are only two contacts, A and B. Between the spiral-shaped counter electrodes 2042 and 2043, there are electrolytes such as an electrolytic solution, a gel electrolyte, and a solid electrolyte, and these constitute an electric double layer capacitor. Because of the spiral shape, a very high density capacitor can be produced. The spiral shape can also be made into a rectangular shape as shown in FIG. 87, a circular shape, an elliptical shape, various curved shapes, or a polygonal shape of an appropriate triangle or more according to the chip 2041. Unlike conventional electric double layer capacitors, there is no need to fabricate electrode layers and electrolytes, and the distance between the electrodes (positive and negative electrodes) is almost constant, so there is no risk of short circuiting and high reliability. A double layer capacitor is fabricated. Therefore, it is not necessary to arrange a separator, so that ions can be moved smoothly. In the case of a solid electrolyte as well as an electrolytic solution and a gel electrolyte, the electrolyte covers the electrode without any gap, so that an electric double layer is efficiently formed around the electrode. As described above, by using the present invention, an ultra-small electric double layer capacitor can be manufactured by a very simple process. Furthermore, the present invention can be used for a secondary battery with the same structure as such an electric double layer capacitor.

FIG. 88 is a diagram showing a generator using electric charges generated by vibration of a substrate side wall formed between a through hole or a recess formed in a piezoelectric substrate. Through holes or recesses 2115 (2115-1, 2, 3) are formed in the piezoelectric substrate 2111. Substrate sidewalls 2111 (2111-2, 3) are formed between the through holes or recesses 2115 (2115-1, 2, 3), and further, a conductor film / film is formed on the side surface of the substrate sidewall 2111 (21111-2, 3). Electrodes 2116 (2116-1, 2, 3, 4) are formed. Thin plates (insulator substrates) 2112 and 2113 are attached to the first surface (front surface, upper surface) and the second surface (back surface and lower surface) of the substrate 2111, and the upper and lower surfaces of the substrate side wall 2111 (2111-2 and 3) are these. Are regulated by thin plates (insulator substrates) 2112 and 2113. The thin plate (insulator substrate) 2112 and 2113 covering the through-holes or the recesses 2115 (2115-1, 2, 3) has openings 2114 (2114-1) for introducing and deriving vibration waves and the like as necessary. 2, 3) and an opening 2118 are formed. In the case of the concave portion, the thin plate 2113 is attached to the opening side, but the thin plate 2112 is not necessarily attached because there is a substrate on the opposite side. When the vibration wave Wa enters the through-hole or the recess 2115 (2115-1, 2, 3), the piezoelectric substrate side wall 2111 (21111-2, 3) vibrates, and deformation due to this vibration causes the piezoelectric substrate side wall 2111 (2111- Charge is polarized on both sides (both sides) of (2, 3). This electric charge is taken out by the conductor film / electrodes 2116 (2116-1, 2, 3, 4) formed on both surfaces (both sides) of the piezoelectric substrate side wall 2111 (2111-2, 3) (terminals A, B), Electric power can be generated by storing in a capacitor or the like. Even when the substrate 2111 is a substrate that is not a piezoelectric substrate, for example, a semiconductor substrate such as silicon, an insulating film, a first conductor film / electrode, a piezoelectric film, and a second conductor film / electrode are formed on the substrate side wall. By laminating and patterning in this order (if necessary), the piezoelectric film polarizes charges on both surfaces (both sides) by vibration, so that the charges are converted into the first conductor film / electrode and the second conductor film.・ Take out with electrodes. As a result, power can be generated by storing in a capacitor or the like. Since the piezoelectric substrate and the substrate vibrate not only due to vibration but also due to acceleration, angular velocity, wind and pressure change, it is possible to generate electric power. In the case of acceleration or angular velocity, as described above, for example, by putting a heavy liquid into the recess 2115-2, the power generation efficiency can be increased. When using a semiconductor substrate, an IC with a generator can be manufactured, so there is a merit that electricity supply is not required from the outside. Furthermore, the power generation status can be monitored by the IC, and more efficient power generation can be performed. Is possible.

The piezoelectric substrate is, for example, PZT (lead zirconate titanate), barium titanate, lead titanate, potassium niobate, lithium niobate, lithium tantalate, sodium tungstate, zinc oxide, lithium tetraborate, calcium titanate. , Piezoelectric polymers such as aluminum phosphate, quartz, potassium sodium tartrate, polyvinylidene fluoride (PVDF), aluminum nitride, gallium phosphate, gallium arsenide, and the like. The piezoelectric film is a film in which the above material is formed by a PVD method or a CVD method. The recesses and through holes of the piezoelectric substrate and other substrates can be formed by using a photolithographic method + etching method or an imprint method. For example, a mold pattern for forming recesses or through-holes is pressed against a liquid or gel-like substance containing liquid or gel-like piezoelectric polymer or fine particles of the above-mentioned piezoelectric material and then solidified, and then the mold is released or extinguished. As a result, a recess or a through hole pattern is formed in the piezoelectric substrate. Thereafter, a conductive film is stacked and necessary patterning is performed, and then an insulating film as a protective film is stacked if necessary, and a thin plate (insulator substrate) is attached.

FIG. 89 is a diagram showing a micro power generator manufactured by forming recesses in a piezoelectric polymer or the like filled in the recesses formed in the substrate and using the side walls of the piezoelectric polymer substrate between the recesses. A recess 2132 is formed in the substrate 2131. The substrate is a semiconductor substrate such as silicon, an insulator substrate such as a glass substrate, or a conductor substrate such as a metal substrate such as a low resistance silicon substrate or an aluminum substrate. The recess 2132 is filled with a piezoelectric polymer 2133 or the like. This filling can be formed by applying a piezoelectric polymer, screen printing, dipping, spraying, or the like. Next, concave portions 2134 (2134-1, 2, 3) perpendicular to the substrate surface (substantially perpendicular) are formed by photolithography method + etching method or imprint method. The polymer substrate side wall 2135 (2135-1, 2, 3, 4) is formed by the recess 2134 (2134-1, 2, 3). Next, a conductive film is laminated and necessary patterning is performed to form a conductive film / electrode 2136 (2136-1, 2, 3, 4) on the side surface of the polymer substrate side wall 2135 (2135-2, 3). The conductor film / wiring is drawn out from these conductor films / electrodes 2136 (2136-1, 2, 3, 4) with the same wiring pattern. Next, a thin plate 2137 is attached to the upper surface of the polymer substrate 2133 (terminals are indicated by A and B). In addition, a protective film (insulating film) may be laminated between them to protect the conductor film / electrode 2136. Since the thin plate (insulator substrate) 2137 is also attached to the upper surface of the polymer substrate sidewall 2135 (2135-2, 3), the upper surface of the polymer substrate sidewall 2135 (2135-2, 3) is thin plate (insulator substrate) 2137. Thus, the lower side of the polymer substrate side wall 2135 (2135-2, 3) is regulated by the polymer substrate 2133 (the substrate 2131 when the polymer 2133 at the bottom of the recess 2134 is completely removed). In the thin plate 2137 covering the concave portion 2134 (2134-1, 2, 3), an opening 2138 may be provided for the purpose of introducing and deriving a vibration wave. The piezoelectric polymer substrate side wall 2136 (2136-2, 3) vibrates due to vibration, acceleration, each speed, pressure fluctuation, and the like, and the piezoelectric polymer substrate side wall 2136 (2136-2, 3) deforms to cause the piezoelectric body. Since charges are polarized on both side surfaces of the polymer substrate side wall 2136 (2136-2, 3), the charges are taken out by the conductive film / electrode 2136 (2136-1, 2, 3, 4) (guided to the terminals A and B). ), It can generate electricity by storing electric charge in a capacitor. Although the material filled in the recess has been described as a piezoelectric polymer, the recess may be filled in a liquid or gel form in which a piezoelectric material is made into fine particles and a binder and a solvent are mixed. In the case of the imprint method, a recess can be formed by inserting a mold therein.

Even if the polymer 2133 is not a piezoelectric polymer, the first conductor film / electrode, piezoelectric film is formed on the substrate side wall 2136 (insulating film if necessary) after forming the recess 2134 and the substrate side wall 2136 as described above. By stacking the second conductor film / electrode in this order and patterning (if necessary), the piezoelectric film polarizes charges on both sides (both sides) by vibration, so that the charges are transferred to the first conductive film. The body film / electrode and the second conductor film / electrode are taken out. As a result, power can be generated by storing in a capacitor or the like. Further, in the contents described in FIG. 88 and FIG. 89, even when the substrate or the polymer is a piezoelectric material, the piezoelectric film or the like is further laminated as described above, and the charge is taken out from both to improve the efficiency. You can also.

Next, a method for simply forming the concave pattern of the present invention using an imprint method on a polymer will be described. A mold for forming recesses is inserted into a liquid or gel polymer, and heat treatment is performed to solidify the polymer. The mold material is etched and the mold is etched away using a solution or etching gas that does not etch the polymer. The remaining part becomes a recess. Thereafter, necessary thin film formation and thin plate adhesion are performed. For example, if the polymer is polytetrafluoroethylene, the mold material is glass, and a hydrofluoric acid solution is used, only the mold material can be etched. In addition, if a conductive film is attached to the mold pattern, or a conductive film wiring pattern is attached and the conductive film is not etched, a solution or etching gas for etching the mold is used, so that the inside of the recess is automatically A conductor film or wiring pattern can be attached to the substrate. For example, the conductor film may be a gold film. Here, instead of the polymer, a liquid material or a gel material in which a particulate piezoelectric material is mixed with a binder and / or a solvent may be used.

For example, the thickness of the substrate 2131 is about 0.1 mm to 2 mm, the depth of the recess 2132 is about 0.01 mm to 1.5 mm, the depth of the in-polymer recess 2134 is about 0.005 mm to 1.4 mm, and the thickness of the thin plate is Since it is about 0.05 mm to 2 mm, a very small generator (device) can be produced. Further, if the substrate 2131 is a semiconductor substrate such as silicon, it can be mounted on a chip together with an IC and a transistor, and the IC and the transistor can be moved without supplying electricity, so that a very small mounting component can be manufactured. For example, when applied to a cardiac pacemaker, the pacemaker can be moved while generating power by vibrations of the heart, blood, and other organs, so that a patient can be realized without burden. In the present invention, a vibration wave can also be created (with the reverse operation of the microphone), so that the functions as a pacemaker can be integrated into one chip, and an extremely small (for example, 1 mm or less) pacemaker can be realized. It becomes possible. As described above, the present invention can produce a micro-generator using a simple structure, process and material.

In the description of the embodiments of the present invention, it is needless to say that what has been described in other parts can be applied to other parts as long as they do not contradict each other.

  The present invention relates to semiconductor pressure sensors, ultra-small pressure sensors, various sensors and devices such as acceleration sensors, acoustic transducers, ink jet devices, and pump devices, battery devices such as secondary batteries, fuel cells, and electric double layers, It can be used to reduce the size of generators and their sensors and devices. Furthermore, it can be applied to a power generation element.

DESCRIPTION OF SYMBOLS 11 ... Semiconductor substrate, 12 ... Insulating film, 13 ... Conductive film, 14 ... Cap,
15 ... Airtight space, 16, 17, 18, 19, 20 ... groove,
21, 22, 23, 24 ... semiconductor substrate, 25 ... hermetic space 2002 ... conductor substrate, 2004 ... third substrate, 2006 ... third substrate,
2008 ... Contact hole, 2009 ... Conductor film, 2010 ... Conductor film

Claims (7)

Using a recess or a through hole formed from the first surface (front surface) of the piezoelectric substrate to the second surface (back surface) and substantially perpendicular to the substrate surface (first surface and second surface). a small generator that, the adjacent concave portions or through holes of both sides two conductive film electrode formed on the substrate side walls formed by the electrodes, at least one adjacent the recess or through hole wherein Connected to the outside of the substrate through the opening, and the electric waves generated on both sides of the substrate sidewall due to the deformation of the substrate sidewall due to the vibration wave introduced from the opening are collected by the conductor film / electrode to generate electric power. A micro-generator characterized by that.
A micro-generator using a recess (inner polymer recess) formed in a piezoelectric polymer filled in a recess disposed in a substrate, wherein the polymer substrate is formed by an adjacent in-polymer recess Conductor films / electrodes formed on both side surfaces of the side wall are two electrodes, and at least one of the adjacent concave portions in the polymer is connected to the outside of the substrate through the opening, and by the vibration wave introduced from the opening, A micro-generator that collects electric charges generated on both side surfaces of the polymer substrate side wall by deformation of the polymer substrate side wall by the conductive film / electrode to generate electric power.
A micro-generator using a recess (intra-polymer recess) formed in a polymer filled in a recess disposed in a substrate, wherein the side wall of the polymer substrate formed by the adjacent in-polymer recess is formed. Forming a first conductive film on both side surfaces, a piezoelectric film on the first conductive film, and a second conductive film on the first conductive film, and connecting at least one of the adjacent recesses in the polymer to the outside of the substrate through an opening; Electric charges generated on both surfaces of the piezoelectric film due to deformation of the polymer substrate side wall by the vibration wave introduced from the opening are collected by the first conductor film and / or the second conductor film to generate electric power. A featured micro-generator.
An electric double layer capacitor using recesses (polymer recesses) formed in a polymer filled in recesses formed in a semiconductor substrate, on two opposing side surfaces of the polymer recesses An electric double layer capacitor comprising: a conductive film disposed as an electrode (counter electrode); and an electrolyte in the recess in the polymer between the counter electrodes.
5. The electric double layer capacitor according to claim 4, further comprising an integrated circuit (IC) that is driven by using electric charges generated by the double layer capacitor in a semiconductor substrate.
Using a recess or a through-hole formed from the first surface (front surface) to the second surface (back surface) of the substrate and substantially perpendicular to the substrate surfaces (first surface and second surface). A capacitive acoustic transducer having a substrate side wall between adjacent recesses or through-holes (first recess or first through-hole and second recess or second through-hole), the adjacent recess or One of the through holes (first recess or first through hole) is connected to the outside of the substrate through the opening,
The substrate side wall is deformed by the vibration wave (sound wave) introduced from the opening, and the capacitance of the other of the adjacent recesses or through holes (second recess or second through hole) changes. Capacitive acoustic transducer using this.
An acoustic transducer using a recess (polymer recess) formed in a polymer filled in a recess disposed in a semiconductor substrate, wherein the acoustic transducer has an adjacent polymer recess (polymer first recess and polymer recess). A polymer inner substrate sidewall between the second polymer inner recesses, and one of the adjacent polymer inner recesses (the first polymer inner recess) is connected to the outside of the substrate through the opening of the first polymer inner recess. And
The side wall of the inner substrate of the polymer is deformed by the vibration wave (sound wave) introduced from the opening of the first concave portion in the polymer, and the other of the adjacent concave portions in the polymer (second concave portion in the polymer) is electrostatic. An acoustic transducer using changing capacity.