JP6420561B2 - Printed wiring board and manufacturing method thereof - Google Patents

Printed wiring board and manufacturing method thereof Download PDF

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Publication number
JP6420561B2
JP6420561B2 JP2014073113A JP2014073113A JP6420561B2 JP 6420561 B2 JP6420561 B2 JP 6420561B2 JP 2014073113 A JP2014073113 A JP 2014073113A JP 2014073113 A JP2014073113 A JP 2014073113A JP 6420561 B2 JP6420561 B2 JP 6420561B2
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metal piece
housing
wiring board
printed wiring
accommodating
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JP2015195304A (en
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淳男 川越
淳男 川越
利幸 島
利幸 島
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京セラ株式会社
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Description

  The present invention relates to a printed wiring board configured to dissipate heat from an electronic component such as a mounted semiconductor element, a mounting structure including the printed wiring board and the mounted component, and a method for manufacturing the printed wiring board. .

  For example, when a printed wiring board for heat dissipation requires a thick conductor for a power supply circuit or the like, as disclosed in Patent Documents 1 and 2, a method using a thick copper type core substrate is known. Yes. Patent Document 3 discloses a method in which a wire is welded to a copper foil and the same effect as that of thick copper is imparted only to a necessary portion.

However, in the methods of Patent Documents 1 and 2, since the copper foil surface to be used becomes very thick, it is difficult to form a thin wiring pattern by etching due to the influence of etching tailing. Further, there is a problem that the circuit width accuracy of the heat dissipating thick wiring pattern portion is deteriorated due to the etching skirting.
Patent Document 3 proposes a technique that brings about an effect similar to that of thick copper only at a necessary portion by welding a wire having a thickness of 0.3 mm to 0.4 mm to a copper foil. However, in the method of Patent Document 3, it is necessary to join the copper foil and the wire with high accuracy using a special apparatus.

  Patent Document 4 discloses a printed wiring board for heat dissipation in which a small piece of metal such as copper (heat dissipation block) is accommodated in a through hole formed in a core substrate. In such a printed wiring board, it is not necessary to use thick copper as the core substrate, and the above-described problems are unlikely to occur. However, after the insulating resin layer is laminated on the core substrate, heat is transferred to the heat dissipating block via the via hole, so that there is a problem that the amount of heat transfer is limited to the cross-sectional area of the via hole.

In Patent Document 5, when a via conductor (a small metal piece or the like) is fitted into an opening, a protrusion of the via conductor is coupled and fitted into a protruding groove of the opening. Since the via conductor has a small shape of about 0.2 to 0.5 mm on one side from the area of the opening, a gap is formed, and an adhesive resin or the like for filling the gap is filled. Furthermore, a technique is disclosed in which the via conductor and the ground pattern are integrated so that the via conductor does not fall out of the opening.
However, in Patent Document 5, since the via conductor has a protrusion, it is difficult to form the via conductor, and there is a problem that the yield is low at a high cost. Also, when the via conductor is fitted into the opening of the board, the via conductor protrusion is coupled and fitted into the groove of the opening, so that the via conductor needs to be aligned with high accuracy. Since a considerable force is required, the fitting is difficult without using a special device. Further, this via conductor cannot be fitted into an opening of 0.2 mm or less. Furthermore, in order to prevent the via conductor from falling out of the opening even though it is filled with adhesive resin or the like for filling the gap between the via conductor and the opening, the via conductor and the ground pattern are integrated. Because it is necessary, there is a risk that the via conductor may fall out of the opening during transportation and work from fitting the via conductor to integration of the via conductor and the ground pattern. .

  Further, Patent Document 5 discloses a structure in which one side with a built-in via conductor is plated and integrated. However, since only one side is plated, a circuit cannot be formed on both sides. There are design constraints such as

JP-A-8-293659 JP 2002-077651 A Special table 2008-529263 gazette JP2013-135168A JP 2010-258260 A

The main subject of this invention is providing the printed wiring board excellent in the thermal radiation performance which radiates the heat | fever from the mounted components.
The other subject of this invention is providing the manufacturing method of the printed wiring board which can manufacture efficiently the printed wiring board which has the outstanding heat dissipation.

As a result of intensive studies to solve the above problems, the present inventors have found a solution means having the following configuration, and have completed the present invention.
(1) A core substrate having a wiring pattern formed on at least one surface of an insulating plate, an insulating resin layer laminated on the surface of the core substrate, an accommodating portion penetrating the core substrate and the insulating resin layer, and accommodating A small piece of metal housed in a portion, and when one surface of the housing portion is an upper surface, the small piece of metal housed in the housing portion is prevented from falling from the other surface from the one surface. A printed wiring board having a conductor for supporting a small metal piece on the other surface side of the portion.
(2) The printed wiring board according to (1), wherein a metal piece is fixed by filling an insulating metal piece fixing resin in a gap portion between the inner peripheral surface of the housing portion and the metal piece.
(3) The printed wiring board according to (1) or (2), wherein the metal piece is a copper piece.
(4) The accommodating portion is an inverted frustum shape whose size is reduced from one surface of the printed wiring board to the other surface, or a columnar through-hole having a constant size, (1) to (3) A printed wiring board according to any one of the above.
(5) The printed wiring board according to any one of (1) to (4), wherein the surface of the metal piece is substantially flush with the surface of the insulating resin layer.
(6) The printed wiring board according to any one of (1) to (5), wherein a wiring conductor layer is provided on a surface of the metal piece on the upper surface side.
(7) A mounting structure in which a component is directly mounted at a position where the metal piece is accommodated on at least one surface of the printed wiring board according to any one of (1) to (6).
(8) The component is mounted on a printed wiring board face-down or face-up, and a lower part of the component is adhered to a wiring conductor layer on a metal piece with a heat conductive resin or a low melting point metal (7) Mounting structure described in 1.
(9) A step of obtaining a core substrate by forming a wiring pattern on at least one surface of the insulating plate, a step of laminating an insulating resin layer on the surface of the core substrate, and a housing penetrating the core substrate and the insulating resin layer Including a step of forming a portion, a step of housing a metal piece in the housing portion, and a step of forming a wiring conductor layer on a surface of the metal piece, wherein one surface of the housing portion is an upper surface. Before the metal piece is accommodated, a conductor for supporting the metal piece is provided on the other surface side of the accommodation portion so that the metal piece accommodated in the accommodation portion from the other surface does not fall from the other surface. A method for manufacturing a wiring board.
(10) The method for manufacturing a printed wiring board according to claim 9, including a step of forming a via hole in the insulating plate before the step of obtaining the core substrate.
(11) The method for manufacturing a printed wiring board according to claim 9 or 10, wherein the step of forming the housing portion is performed by laser processing or mold processing.
(12) After the step of housing the metal piece in the housing portion, the method further includes a step of filling and hardening an insulating metal piece fixing resin in a gap between the housing portion and the metal piece. 11. A method for producing a printed wiring board according to any one of 11 above.

According to the printed wiring board of the present invention, the thickness of the metal piece accommodated in the accommodating portion and the substrate thickness (the total thickness of the core substrate and the insulating resin layer) can be adjusted to be the same. Since there is no step, it is easy to form a fine circuit. Moreover, since the metal piece accommodated in the accommodation portion from one surface of the accommodation portion is supported so as not to fall by the conductor provided on the other surface side of the accommodation portion, the metal piece can be accommodated in the accommodation portion. It becomes easy.
Since the small metal piece accommodated in the accommodating portion and the mounted component are in contact via the wiring conductor layer without via holes, high heat radiation performance can be stably obtained. Moreover, since the said conductor is excellent also in heat conductivity, the thermal radiation performance of a metal piece can be improved more. Furthermore, since a small metal piece is not press-fitted into the accommodating portion, there is an effect that a general-purpose component mounter can be used without requiring a special device.

  According to the method for manufacturing a printed wiring board according to the present invention, a printed wiring board having excellent heat dissipation performance can be efficiently manufactured.

(A) is a top view which shows one embodiment of the printed wiring board based on this invention, (b) is the A-A 'line side sectional drawing of (a). (A)-(f) is process drawing which shows embodiment in the manufacturing method of the printed wiring board based on this invention. (G)-(j) is process drawing which shows embodiment in the manufacturing method of the printed wiring board based on this invention. (K)-(o) is process drawing which shows embodiment in the manufacturing method of the printed wiring board based on this invention. It is a side view which shows one Embodiment of the structure by which components were mounted in the printed wiring board which concerns on this invention. It is a side view which shows another embodiment of the structure by which components were mounted in the printed wiring board which concerns on this invention. It is a sectional side view which shows another form of the printed wiring board which concerns on this invention.

The printed wiring board of this invention is demonstrated based on FIG. Fig.1 (a) shows the top view which shows one embodiment of the printed wiring board based on this invention, FIG.1 (b) shows the sectional view on the AA 'line side of Fig.1 (a).
As shown in FIG. 1A, the printed wiring board of the present invention includes a housing portion 11 that houses a metal piece 40 and a wiring board portion 12. More specifically, as shown in FIG. 1B, the printed wiring board of the present invention is laminated on the surface of the core substrate 2, the core substrate 2 having the wiring pattern 4 formed on the surface of the insulating plate 1. An insulating resin layer 21a, a metal piece 40 accommodated in the accommodating portion 11 formed through the core substrate 2 and the insulating resin layer 21a, and a wiring conductor layer 22 formed on the surface of the metal piece 40 are provided. . Furthermore, via holes 3 are formed in the insulating plate 1 in order to electrically connect the upper and lower surfaces of the core substrate 2.

  The insulating plate 1 is not particularly limited as long as it is made of an insulating material. Examples of such an insulating material include organic resins such as epoxy resin, bismaleimide-triazine resin, polyimide resin, and polyphenylene ether (PPE) resin. These organic resins may be used in combination of two or more. When using an organic resin as the insulating plate 1, it is preferable to mix and use a reinforcing material in the organic resin. Examples of the reinforcing material include glass fiber, glass nonwoven fabric, aramid nonwoven fabric, aramid fiber, and polyester fiber. Two or more of these reinforcing materials may be used in combination. The insulating plate 1 is preferably formed from an organic resin containing a glass material such as glass fiber or glass nonwoven fabric. Furthermore, the insulating plate 1 may contain inorganic fillers such as silica, barium sulfate, talc, clay, glass, calcium carbonate, and titanium oxide. The thickness of the insulating plate 1 is not particularly limited, but preferably 0.02 to 10 mm.

  As in the printed wiring board shown in FIG. 1, the wiring pattern 4 is preferably formed on both surfaces of the insulating plate 1. That is, the wiring pattern 4 exists on the upper and lower surfaces of the core substrate 2. In this case, via holes 3 are formed in the insulating plate 1 in order to electrically connect the upper and lower surfaces of the core substrate 2.

  An insulating resin layer 21 a is laminated on the surface of the core substrate 2. Examples of the resin forming the insulating resin layer 21a include epoxy resin, bismaleimide-triazine resin, polyimide resin, polyphenylene ether (PPE) resin, phenol resin, polytetrafluoroethylene (PTFE) resin, silicon resin, polybutadiene resin, Examples thereof include polyester resin, melamine resin, urea resin, polyphenylene sulfide (PPS) resin, polyphenylene oxide (PPO) resin, and the like. Two or more of these resins may be mixed. The resin forming the insulating resin layer 21a may contain the above-described reinforcing material, inorganic filler, and organic filler made of phenol resin or methacrylic resin.

  The wiring conductor layer 22 formed on both surfaces of the metal piece 40 is formed by etching or the like. Details of the method of forming the wiring conductor layer 22 will be described later.

  In the printed wiring board shown in FIG. 1, the insulating resin layer 21 a and the wiring conductor layer 22 are respectively laminated on the upper and lower surfaces of the printed wiring board, but are not limited to one layer. For example, the insulating resin layers 21a and the wiring conductor layers 22 may be alternately stacked to form a multilayer buildup layer. In this case, the via hole 23 is formed in the insulating resin layer 21a.

In the printed wiring board of the present invention, the metal piece 40 is accommodated in the accommodating portion 11 formed on the insulating plate 1. Examples of the metal constituting the metal piece 40 include copper, gold, iron, and aluminum. Among these metals, copper is preferable. When the metal piece 40 is a copper piece, for example, it is obtained by the following method.
(I) A copper plate or a copper foil is processed into copper pieces by etching.
(II) A copper plate, a copper foil or a copper wire is punched with a mold and processed into a copper piece.
(III) A copper plate or a copper foil is cut into pieces by cutting with a dicing.
Moreover, since the thickness of the metal piece 40 is built in a printed wiring board, it is preferable that the total thickness of the core substrate 2 and the insulating resin layer 21a is about ± 25 μm.

The shape of the metal piece 40 in this embodiment is a rectangular parallelepiped shape. And the accommodating part 11 which accommodates this metal piece 40 is a through-hole which penetrates a core board | substrate and an insulating resin layer, and has the same rectangular parallelepiped shape as the metal piece 40. FIG.
Further, when one surface of the printed wiring board is the upper surface, the metal piece 40 is held on the other surface side of the printed wiring board so that the metal piece 40 accommodated from the one surface is not dropped from the other surface. A metal piece supporting conductor 27 is provided.
Specifically, a wall surface formed by penetrating the core substrate and the insulating resin layer is a side surface, and a cavity is formed with the metal piece supporting conductor 27 being a bottom surface. This cavity refers to a concave space.

  The size of the metal piece 40 is appropriately set according to the thickness of the insulating plate 1 and the like. For example, the long side of the lower surface of the metal piece 40 is about 0.1 to 50 mm, and the height (thickness) from the upper surface to the lower surface of the metal piece 40 is about 0.02 to 10 mm.

  An insulating metal piece fixing resin 13 is filled in a gap portion between the inner peripheral surface of the housing portion 11 and the metal piece 40, thereby fixing the metal piece 40 in the housing portion 11.

  Examples of the metal piece fixing resin 13 include epoxy resin, acrylic resin, polyimide resin, polyphenylene ether (PPE) resin, and the like. Among these, epoxy resins or mixed resins of epoxy resins and other resins are preferable. The metal piece fixing resin 13 may further contain a filler such as silica, barium sulfate, talc, clay, glass, calcium carbonate, and titanium oxide.

Next, a method for manufacturing a printed wiring board according to the present invention will be described. The method for manufacturing a printed wiring board according to the present invention includes the following steps (i) to (vi).
(I) A core substrate obtained by forming a wiring pattern on both surfaces of an insulating plate, laminating an insulating resin layer on both surfaces of the core substrate, and laminating a thin copper foil on the surface of the insulating resin layer; The process of obtaining a laminated body (henceforth a laminated body) with an insulating resin layer.
(Ii) removing the thin copper foil immediately above the accommodating portion of the laminate by etching or the like, penetrating only the core substrate and the insulating resin layer of the laminate, and forming the accommodating portion leaving the thin copper foil immediately below; The process of accommodating a metal piece from the upper surface.
(Iii) A step of filling a metal piece fixing resin into a gap portion between the inner peripheral surface of the housing portion and the metal piece.
(Iv) A step of polishing the metal piece fixing resin after curing the surface so that the surface of the printed wiring board and the surface of the metal piece are substantially flush with each other.
(V) A step of forming a via hole in a portion of the printed wiring board where no metal piece is incorporated.
(Vi) A step of plating the both sides of the printed wiring board, adjusting the thickness of the conductor by etching, etc., forming a wiring conductor layer, printing a solder resist, and performing gold plating.

  The manufacturing method of the printed wiring board which concerns on this invention is demonstrated based on FIGS. First, as shown in FIG. 2A, a double-sided copper-clad substrate 2b in which thin copper foils 2a are formed on both surfaces of an insulating plate 1 is prepared. The thin copper foil 2a preferably has a thickness of about 1 to 12 μm. The insulating plate 1 is as described above, and a description thereof is omitted.

  As shown in FIG. 2B, via hole prepared holes 3a are formed at predetermined positions on the double-sided copper-clad substrate 2b. The via hole prepared hole 3 a is a hole for forming the via hole 3 that electrically connects the upper and lower surfaces of the insulating plate 1. The via hole prepared hole 3a is formed by, for example, laser processing. Examples of the laser light include a CO2 laser and a UV-YAG laser. Simultaneously with the formation of the via hole prepared hole 3a, the thin copper foil 2a immediately above the via hole prepared hole 3a may be opened.

  When the via hole prepared hole 3a is formed by laser processing, a thin resin film may remain at the bottom of the via hole prepared hole 3a. In this case, desmear processing is performed. In the desmear treatment, the resin is swollen with strong alkali, and then the resin is decomposed and removed using an oxidizing agent (for example, chromic acid, permanganate aqueous solution, etc.). Alternatively, the resin film may be removed by wet blasting or plasma treatment with an abrasive. Further, the inner wall surface of the via hole prepared hole 3a may be roughened. Examples of the surface roughening treatment include a wet process using an oxidizing agent (for example, chromic acid, a permanganate aqueous solution, etc.), and a dry process such as a plasma treatment or an ashing treatment.

  Next, as shown in FIG. 2C, copper plating is applied to the inner wall surface of the via hole prepared hole 3 a and the surface of the insulating plate 1 to form the conductor 2 c and the via hole 3. The copper plating may be electroless copper plating or electrolytic copper plating. For thickening the plating, electrolytic copper plating is preferable. For example, copper plating having a thickness of about 1 to 30 μm is formed. Further, not only the inner wall surface of the via hole pilot hole 3a but also the via hole 3 may be formed by filling the via hole pilot hole 3a with filled plating.

  Next, as shown in FIG. 2D, a wiring pattern 4 is formed on the surface of the insulating plate 1. A photosensitive resist (for example, a dry film etching resist) is applied by roll lamination, and exposed and developed to expose portions other than the circuit pattern. The exposed copper is removed by etching. Examples of the etching solution include an aqueous ferric chloride solution. The wiring film 4 is formed by removing the etching resist of the dry film. In this way, the core substrate 2 having the wiring pattern 4 formed on the surface of the insulating plate 1 is obtained.

Next, as shown in FIGS. 2E and 2F, the prepreg 21 and the thin copper foil 22a are laminated on the surface of the core substrate 2, and the prepreg 21 is cured by thermocompression bonding using a laminating press, thereby insulating resin layer 21a. (Curing resin layer) is formed. In addition, as the prepreg 21, the resin described in the above-described insulating resin layer 21a (reinforcing material and filler as necessary) is used.
The laminate 20 (hereinafter, laminate 20) of the core substrate 2 and the insulating resin layer 21a obtained in this way is not limited to a multilayer buildup substrate, and a double-sided substrate or a multilayer substrate may be used. .

Next, as shown in FIGS. 3G and 3H, the accommodating portion 11 for accommodating the metal piece 40 is formed in the laminate 20.
First, as shown in FIG. 3 (g), a photosensitive resist such as a dry film is used in a portion where the metal piece of the copper-clad substrate 20 is to be incorporated, and the upper portion of the laminate 20 is formed by a known etching method. The copper foil 22a is removed to create a copper foil opening 26. The copper foil opening 26 is made slightly larger than the size of the metal piece 40, preferably about 25 μm on one side. At the same time, a metal piece supporting conductor 27 is formed in the lower part. The metal piece support conductor 27 has a copper plating connection hole 28.

Next, as shown in FIG. 3 (h), the core substrate and the insulation are formed at a location where the insulating resin layer 21a is exposed by the copper foil opening 26 by laser processing such as a CO2 laser and a UV-YAG laser. The accommodating part 11 which penetrates only the resin layer is formed.
When the accommodating portion 11 is formed by laser processing, a thin resin film may remain on the metal piece supporting conductor 27. In this case, the aforementioned desmear process may be performed as necessary.

Next, as shown in FIG. 3 (i), the metal piece 40 is accommodated in the accommodating portion 11 using a mounting machine such as a mounter.
At this time, the presence of the metal piece support conductor 27 can prevent the metal piece 40 from dropping from the inside of the accommodating portion 11. The copper plating connection hole 28 in the metal piece support conductor 27 also serves as an air vent hole when the metal piece 40 is accommodated in the accommodation portion 11, and does not form an air reservoir below the metal piece 40. Can be easily accommodated.

  Next, as shown in FIG. 3 (j), an insulating metal piece fixing resin 13 is filled in a gap portion between the peripheral portion of the metal piece 40 accommodated in the accommodation portion 11 and the inner peripheral surface of the accommodation portion 11, The metal piece fixing resin 13 is cured.

  As a method of filling the metal piece fixing resin 13, for example, screen printing, spraying, a dispenser, or the like is used. After filling, if it is a thermosetting resin, it is cured in a high-temperature tank, and if it is an ultraviolet curable resin, it is cured by ultraviolet irradiation. The copper plating connection hole 28 in the metal piece supporting conductor 27 also serves as an air vent when the metal piece fixing resin 13 spreads, and there is no bubble between the metal piece 40 and the metal piece supporting conductor 27. 13 is effective.

  Next, as shown in FIG. 4 (k), the metal piece fixing resin 13 adhered and hardened to the extra portion and the metal piece 40 protruding from the printed wiring board are subjected to physical polishing such as buffing or chemical polishing such as etching. To make it flush with the surface.

  Next, as shown in FIG. 4L, a via hole pilot hole 23a for interlayer connection of the inner layer circuit is formed in the insulating resin layer 21a at the location of the laminated body 20 in which the small metal piece 40 is not incorporated. The metal piece fixing resin 13 in the plating connection hole 28 is removed. Removal of the small metal piece fixing resin 13 in the via hole prepared hole 23a and the copper plating connection hole 28 is performed by laser processing or the like, and desmear processing or roughening processing is performed as necessary.

  Next, as shown in FIG. 4 (m), a copper plating 60 is formed on the surface layer of the printed wiring board, the via hole prepared hole 23a is filled with the copper plating 60 to obtain the via hole 23, and the inside of the copper plating connection hole 28 is plated with copper. 60, the heat conduction between the copper plating 60 and the metal piece 40 is enhanced, and the copper plating 60 is also formed on the metal piece 40 and the metal piece fixing resin 13 (FIG. 4 (n)).

After the copper plating process, a chemical roughening process such as a soft etching process using a mixed solution of sulfuric acid and hydrogen peroxide, or a mechanical roughening process such as a buff is performed, and the process is performed to an arbitrary conductor thickness.
Next, using a known method, a photosensitive resist, for example, a dry film etching resist is applied with a roll laminate, exposed and developed to expose portions other than the circuit pattern, and the exposed copper plating 60 is etched. Remove. As this etching solution, a ferric chloride aqueous solution or the like can be used.

  Next, when the etching resist of the dry film is peeled off, the wiring conductor layer 22 can be formed on the surfaces of the insulating resin layer 21a and the metal piece 40 as shown in FIG. The wiring conductor layer 22 can be formed by the same method as the wiring pattern 4 described above.

  The size of the wiring conductor layer 22 formed on the surface of the metal piece 40 is larger by 15 to 25 μm on one side than the thin copper foil opening 26 formed in FIG. This is to prevent the metal piece 40 from being etched by the etching solution soaking into the metal piece fixing resin 13 if the wiring conductor layer 22 is smaller than the opening 26 of the thin copper foil.

  Finally, as shown in FIG. 4 (o), a solder resist 30 is formed at a predetermined position on the surface of the insulating resin layer 21a. The solder resist 30 is formed by first using a spray coating, roll coating, curtain coating, screen method, etc., and applying and drying a photosensitive liquid solder resist with a thickness of about 20 μm, or a photosensitive dry film / solder resist. Affix with roll laminate. Thereafter, exposure and development are performed to open the pad portion and heat cure.

  Before forming the solder resist 30, the surface to be formed may be subjected to a copper roughening treatment such as a CZ treatment. An electroless nickel plating with a thickness of 3 μm or more is formed in the opening of the solder resist 30, and an electroless gold plating is 0.03 μm or more (preferably 0.06 μm or more, 0.3 μm for wire bonding). You may form with the thickness of the above. As shown in FIG. 4 (o), such a plating layer 31 is formed in the wiring conductor layer 22 and the via hole 23, and a solder precoat may be applied thereon. You may form by electroplating instead of electroless plating. Instead of plating, a water-soluble rust-proof organic film (for example, Toughace manufactured by Shikoku Kasei Kogyo Co., Ltd.) may be formed. The printed circuit board according to the present invention is obtained by performing an outer shape process.

For example, a component such as a semiconductor element is mounted on the printed wiring board of the present invention and processed into a mounting structure. For example, FIG. 5 shows a mounting structure in which a component 70 is wire-bonded (face-up) mounted on a printed wiring board according to the present invention, and FIG. 6 flips a component 71 onto the printed wiring board according to the present invention. A mounting structure mounted on a chip (face-down) is shown.
The components 70 and 71 and the wiring conductor layer 22 on the upper surface of the metal piece 40 are connected via a heat transfer material such as the heat conductive resin 80, and the solder balls 81 of the component 71 are connected to the via hole 23 in FIG. 6.
The heat transfer material is not limited to the heat conductive resin, and may be a low melting point metal such as solder. For example, a metal having a composition such as Sn3.0Ag0.5Cu.
Since the metal piece 40 and the surface-mounted components 70 and 71 are in contact with each other without via holes as in the prior art, heat dissipation from the mounted components is improved.

  In the above embodiment, the case has been described in which both the metal piece and the accommodating portion have a rectangular parallelepiped shape. However, the accommodating portion may be an inverted cone such as an inverted truncated cone shape, an inverted elliptical truncated cone shape, or an inverted polygonal truncated cone shape. It may be trapezoidal. In addition to the inverted quadrangular frustum shape, the inverted polygonal frustum shape includes, for example, an inverted triangular frustum shape, an inverted pentagonal frustum shape, an inverted hexagonal frustum shape, an inverted heptagonal frustum shape, and an inverted octagonal frustum shape. It is done.

Further, the metal piece may be, for example, a frustum shape (conical frustum shape, elliptic frustum shape, polygonal frustum shape, etc.), columnar shape (columnar shape, elliptical columnar shape, polygonal columnar shape, etc.). Examples of the polygonal frustum shape include a triangular frustum shape, a pentagonal frustum shape, a hexagonal frustum shape, a heptagonal frustum shape, and an octagonal frustum shape in addition to the quadrangular frustum shape. In addition to the quadrangular column shape, the polygonal column shape includes a triangular column shape, a pentagonal column shape, a hexagonal column shape, a heptagonal column shape, an octagonal column shape, and the like.
It is preferable that the metal piece and the accommodating portion have the same number of angles (shape) such as a quadrangular frustum shape and an inverted quadrangular frustum shape.

FIG. 7 shows an example in which the accommodating portion 11 ′ has an inverted frustum shape. The small metal piece 40 ′ accommodated in the accommodating portion 11 ′ has a rectangular parallelepiped shape, and the lower end portion is held by the lower edge portion of the accommodating portion 11 ′. The other parts are the same as those of the wiring board shown in FIGS.
When the accommodating portion 11 ′ is shaped like an inverted frustum, the upper portion of the accommodating portion 11 ′ is wide, so that it becomes easy to accommodate the metal piece 40 ′, and the metal piece at the lower edge of the accommodating portion 11 ′. 40 'can be held stably.

DESCRIPTION OF SYMBOLS 1 Insulation board 2 Core board | substrate 2a Thin copper foil 2b Double-sided copper clad board 2c Conductor 3 Via hole 3a Via hole pilot hole 4 Wiring pattern 11, 11 'accommodating part 12 Wiring board part 13 Metal small piece fixed resin 20 Laminate 21 Prepreg 21a Insulating resin layer 22 Wiring conductor layer 22a Thin copper foil 23 Via hole 23a Via hole pilot hole 26 Thin copper foil opening 27 Metal small piece support conductor 28 Copper plating connection hole 30 Solder resist 31 Plating layer 40, 40 'Metal small piece 60 Copper plating 70, 71 Parts 80 Thermal conductive resin 81 Solder balls

Claims (8)

  1. A core substrate having a wiring pattern formed on at least one surface of the insulating plate;
    An insulating resin layer laminated on the surface of the core substrate;
    An accommodating portion penetrating the core substrate and the insulating resin layer;
    A metal piece housed in the housing portion,
    Further, when one surface of the housing portion is an upper surface, the metal piece supported on the other surface side of the housing portion is supported so that the metal piece housed in the housing portion does not fall from the other surface from the one surface. A conductor
    The conductor supporting the metal piece has a copper plating connection hole filled with copper plating connected to the metal piece,
    The gap between the inner peripheral surface of the housing part and the metal piece is filled with an insulating metal piece fixing resin to fix the metal piece,
    The surface of the metal piece is substantially flush with the surface of the insulating resin layer,
    The surface of the metal piece on the upper surface side includes a wiring conductor layer that covers the housing portion and extends from the periphery of the housing portion to the surface of the insulating resin layer, and the metal piece and the conductor that supports the metal piece are the copper plating It is also connected by copper plating filling the connection hole,
    The accommodating portion is an inverted frustum-shaped through-hole whose size decreases from one surface to the other surface of the printed wiring board, and the frustum-shaped metal piece is accommodated in the inverted frustum-shaped accommodating portion, A printed wiring board , wherein an upper end portion of the metal piece forms a gap with the housing portion, and a lower end portion of the metal piece is held by a lower edge portion of the housing portion .
  2.   The printed wiring board according to claim 1, wherein the metal piece is a copper piece.
  3. Wherein the metal pieces are truncated polygonal pyramid shape, a conical frustum or truncated elliptical cone shape, the receiving portion is reversed truncated polygonal pyramid shape, an inverted frustoconical or an inverted truncated elliptical cone-shaped through-hole, according to claim 1 or 2 Printed wiring board according to 1.
  4. Mounting structure characterized by being directly mounted components to the position where the metal pieces is accommodated in at least one surface of the printed wiring board according to any one of claims 1-3.
  5. 5. The component according to claim 4 , wherein the component is mounted on a printed wiring board face-down or face-up, and a lower part of the component is adhered to a wiring conductor layer on a metal piece with a heat conductive resin or a low melting point metal. Mounting structure.
  6. Forming a wiring pattern on at least one surface of the insulating plate to obtain a core substrate;
    Laminating an insulating resin layer and a thin copper foil on the surface of the core substrate;
    Removing a portion of the thin copper foil to form a thin copper foil opening; and
    Within the range of the thin copper foil opening, forming a housing portion that penetrates the core substrate and the insulating resin layer;
    A step of accommodating the metal piece in the accommodating portion;
    After the step of housing the metal piece in the housing portion, filling the insulating metal piece fixing resin in the gap between the housing portion and the metal piece and curing it;
    Making the surface of the metal piece substantially flush with the surface of the insulating resin layer;
    Forming a wiring conductor layer extending from the periphery of the thin copper foil opening to the surface of the insulating resin layer on the surface of the metal piece,
    When one surface of the housing portion is an upper surface, the metal piece housed in the housing portion from this one surface is placed on the other surface side of the housing portion before housing the metal piece so that the metal piece does not fall from the other surface. Provide a conductor to support the metal piece ,
    In the conductor, a copper plating connection hole filled with copper plating connected to a metal piece is formed,
    The accommodating portion is an inverted frustum-shaped through-hole whose size decreases from the one surface to the other surface of the insulating plate, and the upper end portion of the frustum-shaped metal piece is in the inverted frustum-shaped accommodating portion. forming a gap between said housing portion, and a lower end portion of the metal piece is housed so as to be held at the bottom edge of the inverse frustum shaped housing portion of the printed wiring board, wherein Rukoto Production method.
  7. The manufacturing method of the printed wiring board of Claim 6 including the process of forming a via hole in an insulating board before the process of obtaining the said core board | substrate.
  8. The manufacturing method of the printed wiring board of Claim 6 or 7 with which the process of forming the said accommodating part is performed by laser processing or metal mold | die processing.
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JP6516023B2 (en) * 2016-01-07 2019-05-22 株式会社村田製作所 Multilayer substrate, electronic device, and method of manufacturing multilayer substrate
KR20180013669A (en) * 2016-07-29 2018-02-07 오태헌 Method For Manufacturing Hybrid PCB and Hybrid PCB Manufactured Using the Same

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JP2660295B2 (en) * 1988-08-24 1997-10-08 イビデン株式会社 Substrate for mounting electronic components
JP2784523B2 (en) * 1990-09-17 1998-08-06 イビデン株式会社 Substrate for mounting electronic components
JP3174393B2 (en) * 1992-04-24 2001-06-11 シチズン時計株式会社 Manufacturing method of electronic component mounting board
JP4159861B2 (en) * 2002-11-26 2008-10-01 新日本無線株式会社 Method for manufacturing heat dissipation structure of printed circuit board
JP2006332449A (en) * 2005-05-27 2006-12-07 Cmk Corp Multilayer printed wiring board and method for manufacturing the same
JP2008091714A (en) * 2006-10-03 2008-04-17 Rohm Co Ltd Semiconductor device
KR100965339B1 (en) * 2008-06-04 2010-06-22 삼성전기주식회사 Printed circuit board with electronic components embedded therein and method for fabricating the same
JP2010258260A (en) * 2009-04-27 2010-11-11 Eito Kogyo:Kk Heat radiation printed board
JP2013098185A (en) * 2011-10-27 2013-05-20 Ain:Kk Wiring board with heat sink and method for manufacturing the same
JP5955023B2 (en) * 2012-02-23 2016-07-20 京セラ株式会社 Printed wiring board with built-in component and manufacturing method thereof

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