JP6339665B2 - 高周波動作のための光電子装置のマルチビームアレイ用マイクロレンズ - Google Patents
高周波動作のための光電子装置のマルチビームアレイ用マイクロレンズ Download PDFInfo
- Publication number
- JP6339665B2 JP6339665B2 JP2016510662A JP2016510662A JP6339665B2 JP 6339665 B2 JP6339665 B2 JP 6339665B2 JP 2016510662 A JP2016510662 A JP 2016510662A JP 2016510662 A JP2016510662 A JP 2016510662A JP 6339665 B2 JP6339665 B2 JP 6339665B2
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- JP
- Japan
- Prior art keywords
- array
- vcsel
- receiver
- optical
- transmitter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/42—Arrays of surface emitting lasers
- H01S5/423—Arrays of surface emitting lasers having a vertical cavity
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
- H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
- H01S5/18386—Details of the emission surface for influencing the near- or far-field, e.g. a grating on the surface
- H01S5/18388—Lenses
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/11—Arrangements specific to free-space transmission, i.e. transmission through air or vacuum
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/10—Controlling the intensity of the light
- H05B45/14—Controlling the intensity of the light using electrical feedback from LEDs or from LED modules
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/40—Details of LED load circuits
- H05B45/44—Details of LED load circuits with an active control inside an LED matrix
- H05B45/46—Details of LED load circuits with an active control inside an LED matrix having LEDs disposed in parallel lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S2301/00—Functional characteristics
- H01S2301/16—Semiconductor lasers with special structural design to influence the modes, e.g. specific multimode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
- H01S5/042—Electrical excitation ; Circuits therefor
- H01S5/0425—Electrodes, e.g. characterised by the structure
- H01S5/04252—Electrodes, e.g. characterised by the structure characterised by the material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
- H01S5/062—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium by varying the potential of the electrodes
- H01S5/06226—Modulation at ultra-high frequencies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
- H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
- H01S5/18305—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL] with emission through the substrate, i.e. bottom emission
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4012—Beam combining, e.g. by the use of fibres, gratings, polarisers, prisms
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Semiconductor Lasers (AREA)
- Optical Communication System (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/868,034 US9232592B2 (en) | 2012-04-20 | 2013-04-22 | Addressable illuminator with eye-safety circuitry |
| US13/868,034 | 2013-04-22 | ||
| US13/902,555 | 2013-05-24 | ||
| US13/902,555 US8995493B2 (en) | 2009-02-17 | 2013-05-24 | Microlenses for multibeam arrays of optoelectronic devices for high frequency operation |
| PCT/US2013/042767 WO2014175901A1 (en) | 2013-04-22 | 2013-05-24 | Microlenses for multibeam arrays of optoelectronic devices for high frequency operation |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018091469A Division JP6759274B2 (ja) | 2013-04-22 | 2018-05-10 | 高周波動作のための光電子装置のマルチビームアレイ用マイクロレンズ |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016519436A JP2016519436A (ja) | 2016-06-30 |
| JP2016519436A5 JP2016519436A5 (https=) | 2016-08-12 |
| JP6339665B2 true JP6339665B2 (ja) | 2018-06-06 |
Family
ID=51792283
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016510662A Active JP6339665B2 (ja) | 2013-04-22 | 2013-05-24 | 高周波動作のための光電子装置のマルチビームアレイ用マイクロレンズ |
| JP2018091469A Active JP6759274B2 (ja) | 2013-04-22 | 2018-05-10 | 高周波動作のための光電子装置のマルチビームアレイ用マイクロレンズ |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018091469A Active JP6759274B2 (ja) | 2013-04-22 | 2018-05-10 | 高周波動作のための光電子装置のマルチビームアレイ用マイクロレンズ |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP3000157B1 (https=) |
| JP (2) | JP6339665B2 (https=) |
| CA (1) | CA2910202C (https=) |
| WO (1) | WO2014175901A1 (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102857533B1 (ko) * | 2023-03-24 | 2025-09-10 | 옵티시스 주식회사 | 다수의 발광 소자를 포함하는 발광 유닛 |
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| US9660418B2 (en) * | 2014-08-27 | 2017-05-23 | Align Technology, Inc. | VCSEL based low coherence emitter for confocal 3D scanner |
| AU2016298390B2 (en) | 2015-07-30 | 2021-09-02 | Optipulse Inc. | Rigid high power and high speed lasing grid structures |
| US9927558B2 (en) | 2016-04-19 | 2018-03-27 | Trilumina Corp. | Semiconductor lens optimization of fabrication |
| JP7027033B2 (ja) * | 2016-09-28 | 2022-03-01 | スタンレー電気株式会社 | 照明用の垂直共振器型発光素子モジュール |
| JP7027032B2 (ja) * | 2016-09-28 | 2022-03-01 | スタンレー電気株式会社 | 照明用の垂直共振器型発光素子モジュール |
| US10243324B2 (en) * | 2016-10-17 | 2019-03-26 | Trilumina Corp. | Matching drive device for multi-beam optoelectronic arrays |
| KR102722845B1 (ko) * | 2017-01-25 | 2024-10-29 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 반도체 소자 및 그 제조방법, 반도체 소자 패키지, 객체 검출 장치 |
| EP3576166A4 (en) * | 2017-01-25 | 2020-12-16 | LG Innotek Co., Ltd. | SEMICONDUCTOR DEVICE |
| EP3382828A1 (en) * | 2017-03-31 | 2018-10-03 | Koninklijke Philips N.V. | Inherently safe laser arrangement comprising a vertical cavity surface emitting laser |
| EP3633807B1 (en) * | 2017-05-31 | 2021-12-29 | Sony Group Corporation | Light-emitting element and light-emitting element manufacturing method |
| CN107315982A (zh) * | 2017-06-13 | 2017-11-03 | 深圳市华周测控技术有限公司 | 一种微距小视野高分辨率的扫码器 |
| DE112018003684T5 (de) * | 2017-07-18 | 2020-05-14 | Sony Corporation | Lichtemittierendes element und array aus lichtemittierenden elementen |
| US10530128B2 (en) * | 2017-07-25 | 2020-01-07 | Trilumina Corp. | Single-chip series connected VCSEL array |
| US11482835B2 (en) | 2017-07-25 | 2022-10-25 | Lumentum Operations Llc | VCSEL device with multiple stacked active regions |
| US10958350B2 (en) | 2017-08-11 | 2021-03-23 | Optipulse Inc. | Laser grid structures for wireless high speed data transfers |
| EP3665753A4 (en) * | 2017-08-11 | 2021-04-21 | Optipulse Inc. | HIGH PERFORMANCE LASER GRILLE STRUCTURE |
| WO2019036383A1 (en) * | 2017-08-14 | 2019-02-21 | Trilumina Corp. | A surface-mount compatible vcsel array |
| US10374705B2 (en) | 2017-09-06 | 2019-08-06 | Optipulse Inc. | Method and apparatus for alignment of a line-of-sight communications link |
| JP7128433B2 (ja) * | 2017-10-11 | 2022-08-31 | ウシオ電機株式会社 | 光照射装置 |
| US11042004B1 (en) | 2017-10-23 | 2021-06-22 | Waymo Llc | System and method for alignment of optical beams |
| CN111868487B (zh) * | 2018-03-20 | 2024-08-30 | 维克萨股份有限公司 | 对眼睛安全的光学模块 |
| JP7180145B2 (ja) * | 2018-06-28 | 2022-11-30 | 富士フイルムビジネスイノベーション株式会社 | 発光素子アレイ、及び光計測システム |
| KR102739949B1 (ko) * | 2018-07-05 | 2024-12-06 | 삼성전자주식회사 | 광센싱 시스템 및 이를 포함하는 전자 기기 |
| EP3598591A1 (en) * | 2018-07-17 | 2020-01-22 | Koninklijke Philips N.V. | Laser arrangement with reduced building height |
| JP7247615B2 (ja) * | 2019-01-31 | 2023-03-29 | 株式会社リコー | 面発光レーザモジュール、光学装置及び面発光レーザ基板 |
| JP2022547389A (ja) * | 2019-07-31 | 2022-11-14 | オプシス テック リミテッド | 高分解能ソリッドステートlidar透過機 |
| EP4024629A4 (en) | 2019-10-15 | 2022-10-12 | Sony Semiconductor Solutions Corporation | LIGHTING DEVICE AND RANGING DEVICE |
| EP4020724A4 (en) * | 2019-11-06 | 2023-09-13 | Sony Semiconductor Solutions Corporation | SURFACE EMITTING LASER DEVICE |
| JP7476519B2 (ja) | 2019-11-15 | 2024-05-01 | 株式会社リコー | 光源装置、検出装置及び電子機器 |
| US20210159373A1 (en) * | 2019-11-22 | 2021-05-27 | Facebook Technologies, Llc | Light extraction for micro-leds |
| DE102020214458A1 (de) | 2020-11-18 | 2022-05-19 | Robert Bosch Gesellschaft mit beschränkter Haftung | Scanvorrichtung zum Aussenden von Lichtstrahlen einer Lichtquelle und/oder zum Abbilden von Lichtstrahlen auf einen Detektor, LiDAR-Sensor und Verfahren zur Ansteuerung einer Scanvorrichtung |
| JP7750063B2 (ja) * | 2021-07-27 | 2025-10-07 | 富士フイルムビジネスイノベーション株式会社 | 発光素子アレイ、光学装置、光計測装置および発光素子アレイの製造方法 |
| JP7750062B2 (ja) * | 2021-07-27 | 2025-10-07 | 富士フイルムビジネスイノベーション株式会社 | 発光素子アレイ、光学装置、光計測装置および発光素子アレイの製造方法 |
| WO2023032307A1 (ja) * | 2021-08-30 | 2023-03-09 | ソニーセミコンダクタソリューションズ株式会社 | 発光素子アレイおよび発光素子アレイの製造方法 |
| US20230213618A1 (en) * | 2021-12-31 | 2023-07-06 | Velodyne Lidar Usa, Inc. | Lidar system having a linear focal plane, and related methods and apparatus |
| DE102022112920A1 (de) * | 2022-05-23 | 2023-11-23 | Dspace Gmbh | Optische Einheit, Testsystem und Verfahren zum Herstellen einer optischen Einheit |
| NL2033042B1 (en) * | 2022-09-15 | 2024-03-22 | Univ Eindhoven Tech | An Optical Wireless Communication, OWC, detector arranged for ensuring sufficient optical power at the receiver while taking into account the field of view, as well as a related optical communication device and a method for manufacturing an OWC detector. |
| JP2025174884A (ja) * | 2024-05-15 | 2025-11-28 | キヤノン株式会社 | 発光装置及び測距装置 |
| WO2025239381A1 (ja) * | 2024-05-15 | 2025-11-20 | キヤノン株式会社 | 発光装置及び測距装置 |
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| JP2560507B2 (ja) * | 1990-02-16 | 1996-12-04 | 日本電気株式会社 | 接続装置 |
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| US6353502B1 (en) * | 2000-06-13 | 2002-03-05 | Eastman Kodak Company | VCSEL field correction |
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| DE10111871A1 (de) * | 2001-03-13 | 2002-09-19 | Heidelberger Druckmasch Ag | Bebilderungseinrichtung für eine Druckform mit einem Array von VCSEL-Lichtquellen |
| US20030091084A1 (en) * | 2001-11-13 | 2003-05-15 | Decai Sun | Integration of VCSEL array and microlens for optical scanning |
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| JP2008221658A (ja) * | 2007-03-13 | 2008-09-25 | Seiko Epson Corp | ラインヘッドおよび画像形成装置 |
| US7949024B2 (en) * | 2009-02-17 | 2011-05-24 | Trilumina Corporation | Multibeam arrays of optoelectronic devices for high frequency operation |
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-
2013
- 2013-05-24 JP JP2016510662A patent/JP6339665B2/ja active Active
- 2013-05-24 EP EP13882974.2A patent/EP3000157B1/en active Active
- 2013-05-24 CA CA2910202A patent/CA2910202C/en not_active Expired - Fee Related
- 2013-05-24 WO PCT/US2013/042767 patent/WO2014175901A1/en not_active Ceased
-
2018
- 2018-05-10 JP JP2018091469A patent/JP6759274B2/ja active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102857533B1 (ko) * | 2023-03-24 | 2025-09-10 | 옵티시스 주식회사 | 다수의 발광 소자를 포함하는 발광 유닛 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2016519436A (ja) | 2016-06-30 |
| CA2910202C (en) | 2019-09-17 |
| EP3000157A4 (en) | 2016-11-02 |
| EP3000157A1 (en) | 2016-03-30 |
| CA2910202A1 (en) | 2014-10-30 |
| JP6759274B2 (ja) | 2020-09-23 |
| WO2014175901A1 (en) | 2014-10-30 |
| EP3000157B1 (en) | 2018-12-12 |
| JP2018164089A (ja) | 2018-10-18 |
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