JP6305447B2 - Bendable carrier platform, device and method for removing carrier substrate - Google Patents

Description

  The present invention provides a flexible carrier stage according to claim 1, a device for peeling the carrier substrate from a product substrate in one removal direction L according to claim 2, and a device according to claim 9. A corresponding method and the use of a flexible carrier platform for attaching the carrier substrate in the peeling of the carrier substrate from the product substrate according to claim 10.

  In the semiconductor industry, often structural wafers or product wafers are temporarily bonded to a carrier wafer or carrier substrate to allow handling of the carrier wafer or carrier substrate. After processing of these product substrates, the product substrates should be removed from the carrier substrate as easily, immediately, economically and cleanly as possible. The most frequently used method for bonding product wafers on carrier wafers is to apply an adhesive layer to one (or both) of these two substrates and make contact under pressure . At the time of peeling, the carrier wafer is peeled off from the product wafer after reducing the adhesive strength of the cement (temperature, UV radiation, etc.), for example, by shifting the wafers parallel to each other. These wafers are held by a negative pressure by a so-called chuck.

  During delamination, several important factors must be considered, the most important of which is to ensure that the fragile product wafer, which is very expensive due to pretreatment, is exposed to the lowest possible stress, The product wafer should not be damaged. On the other hand, the carrier substrate should be stripped economically and immediately with the lowest possible energy consumption. In several known stripping processes, it is necessary to heat the carrier wafer and the stack of structural / product wafers to a temperature specific to the cement, particularly in order to eliminate the adhesive properties of the adhesive layer between the wafers. .

  Accordingly, it is an object of the present invention to develop a general device and method for stripping a carrier substrate so that it can be stripped at the same time while being careful. At the same time, energy consumption is reduced.

  This object is achieved by the features of claims 1, 2, 9 and 10. Advantageous developments of the invention are presented in the dependent claims. Also, any combination of at least two of the features presented in the specification, claims and / or drawings is included within the scope of the present invention. Within a given range, values within the same limit value will also be disclosed as boundary values and will be claimed in any combination.

  The basic concept of the present invention is to design a carrier base for mounting a carrier substrate when peeling the carrier substrate from the product substrate so that the carrier base can bend the carrier substrate. As claimed in the present invention, the carrier stage has sufficient bending rigidity to generate a peeling force for peeling the carrier substrate from the product substrate, particularly by pulling up from the edge of the carrier substrate.

  As claimed in the present invention, in particular <45 °, preferably <40 °, more preferably <30 °, particularly preferably <20 °, even more preferably <10 °, most preferably There should be only a slight warp with a bending angle of <5 °. In this way, the carrier substrate still having a certain bending stiffness similar to the carrier table and all the product substrates described above are protected from damage. Bending produces most of the peel force, particularly at the forefront of the moving peel that moves from the edge of the carrier substrate toward the center.

  Therefore, the center of the present invention is a flexible carrier base for attaching the carrier substrate when the carrier substrate is peeled off from the product substrate, and the peeling means bends the carrier substrate on the carrier base to make the product substrate. Is provided to peel off.

  Thus, as claimed in the present invention, a non-annular variant of a carrier stand blanket made of a polymer having a certain elasticity or bending strength is also envisaged. They have a vacuum passage for fixing and holding the carrier substrate. In this connection, it is possible to electrostatically fix the carrier substrate on the carrier base, in particular in addition to an increase in holding power.

  The carrier platform may also be at least partially constructed from metal, ceramic, or composite material. The materials used need only allow functions as claimed in the present invention.

Furthermore, the independent invention is a device for peeling a carrier substrate from a product substrate in one peeling direction L,
-A carrier base having flexibility in the peeling direction L for attaching the carrier substrate;
-A board base for mounting the product board,
A device comprising a peeling means for peeling the carrier substrate from the product substrate by bending the carrier substrate;

  As claimed in the present invention, the peeling direction L is substantially, in particular strictly, perpendicular to the surface of the carrier substrate and / or the product substrate. One bending axis of the bending of the carrier base and / or the carrier substrate held by the carrier base is perpendicular to the peeling direction L. This bending axis is in particular parallel to the surface of the product substrate and / or the carrier substrate.

  In one advantageous variant, as claimed in the present invention, the device advantageously has a carrier substrate which is secured using negative pressure on the carrier platform, more powerful against this carrier platform. It is possible to provide a pressure chamber that can be exposed to overpressure. The pressure in the chamber can be> 1 bar, preferably> 2 bar, even more preferably> 5 bar, even more preferably> 10 bar, in particular less than 100 bar.

  According to an advantageous embodiment of the invention, the carrier platform is adapted to be elastically deformable in the peeling direction L. As claimed in the present invention, due to the elasticity of the carrier table, the peeling force concentrates on the forefront of the moving peeling, and the tensile force can be applied only to the outer peripheral portion of the carrier substrate.

  In another advantageous variant of the invention, there is at least one tensile force acting on the outer periphery of the substrate table and at least one counteracting force acting on the outer periphery of the carrier table against the tensile force. Applied by the peeling means so as to generate a peeling moment along one foremost part of the peeling. By doing in this way, the total load especially at the start of peeling can be reduced. In this way, higher protection of the carrier substrate and of the product substrate can be obtained. In particular, these tensile forces result in the resulting tensile force at the center of the substrate table by the uniform application of the tensile force to the outer periphery of the substrate table, so that the opposing force is against one edge of the carrier table. The resulting counter force and a corresponding peel moment for the moving peel front are provided. Accordingly, the carrier table is inclined with respect to the substrate table.

  In order to better protect the product substrate, particularly for highly susceptible or very expensive product substrates, the substrate platform holds the product substrate over its entire surface, as claimed in the present invention. It is designed to be made as a rigid receiver.

According to another advantageous embodiment of the present invention, the carrier base is adapted to be fabricated as a particularly open ring having an adjustable inner diameter D _i. Its bending stiffness can be optimally adjusted with respect to the carrier substrate by the ring shape and by the ring geometry, in particular the ring width B versus the ring diameter D _a and / or the height H of the pair ring. In addition, this ring shape results in a higher degree of freedom of movement of the carrier substrate in the region of the ring opening, thereby reducing the interaction between the bending stiffness of the carrier platform and the bending stiffness of the carrier substrate. Realized. In this case, the bending rigidity of the carrier table is particularly at least equal to or higher than the bending rigidity of the carrier substrate.

As claimed in the present invention, advantageously, the bending stiffness of the carrier stage is 1/20 to 20 times, especially 1/110 to 10 times, preferably 1/5 to 5 times that of the carrier substrate. Even more preferably, it is selected to be in the range of 1/2 to 2 times. The carrier substrate is in particular a silicon wafer having a thickness d of 500 μm to 750 μm, preferably 600 μm. This carrier substrate can have a diameter D _t of 200 mm or 300 mm.

  In this case, it is particularly advantageous to provide a holding means, in particular in the form of an outer shoulder with a bounce, in particular extending over the entire ring periphery. Thus, by using a simple geometric shape that can be economically produced, a peel force can be applied to the carrier substrate, particularly at the entire outer periphery of the carrier substrate, and is particularly important at the forefront of the peel at the beginning of the peel. Initiation can be concentrated at one or more sites on the outer periphery of the carrier substrate.

  In one development, as claimed in the present invention, the carrier platform is essentially completely, in particular up to at least 98% of the outer periphery, preferably up to at least 99%, and even more preferably at least 99.5%. The carrier substrate is manufactured so as to surround the carrier substrate in the lateral direction. By doing in this way, a carrier board is supported to some extent over the whole outer peripheral part. The carrier platform is in particular made as a ring with a closed periphery, preferably at least up to 98% of the outer periphery, even more preferably up to at least 99%, even more preferably up to at least 99.5%. The ring can also be composed of individual sections.

  According to an advantageous embodiment, the stripping means comprises translational drive means for causing a translational movement of at least one peripheral section of the carrier platform in the stripping direction L.

An independent invention is a method for peeling a carrier substrate from a product substrate in one peeling direction L,
-Attaching the product substrate using the substrate table and attaching the carrier substrate using the carrier table having flexibility in the peeling direction L;
-Peeling the carrier substrate from the product substrate by bending the carrier substrate, in particular in the above order.

  In addition, as claimed in the present invention, there is a method of using a flexible carrier platform to attach the carrier substrate when the carrier substrate is peeled from the product substrate.

  In an advantageous embodiment of the invention, the peeling is performed at a temperature of <200 ° C., preferably <100 ° C., even more preferably <50 ° C., ideally at ambient temperature, in particular without using blanket heating means. To be done.

  As claimed in the present invention, it is expected to accelerate the peeling locally at the forefront of the peeling, particularly by the action of the peeling means, particularly by the separating means, at the foremost peeling. This separation means may comprise mechanical separation and / or local heating, preferably a directional hot air stream. In particular, a separation wedge, a separation blade, a separation wire, or a hot compressed air jet, preferably sent to the forefront of separation, may be provided individually or in combination.

  The separation wedge is preferably defined as a tool having a V-shaped profile. A separating blade is defined as a tool with extremely sharp edges. The separation wire is a very thin, preferably high-strength wire that is moved in the direction of the intermediate layer in the direction of the intermediate layer in the pulled state by a corresponding device. This separation wire is made in particular as a heated wire and can therefore be heated.

  Further, as claimed in the present invention, in one embodiment, the foremost part of the peeling advances in a spiral shape toward the center in the inner direction when peeling along the outer peripheral part of the product substrate. Is expected. This is realized by raising the peeling force acting on the outer peripheral portion so as to advance around the outer peripheral portion.

  The features already described apply equally to the device as claimed in the present invention, the method as claimed in the present invention, and the use as claimed in the present invention.

  Other advantages, features, and details of the present invention will become apparent from the following description of preferred exemplary embodiments and through the use of the drawings.

FIG. 2 is a plan view of one carrier platform as claimed in the present invention having a cutting line A-A. FIG. 2 is a cross-sectional view of a carrier table taken along a cutting line AA in FIG. FIG. 2 is a bottom view of the carrier table according to FIG. FIG. 3 is a detailed view of detail E in FIG. It is a side view of the stack comprised from a carrier substrate, an interconnection layer, and a product substrate. It is a top view of the stack comprised from a carrier substrate, an interconnection layer, and a product substrate. FIG. 5 is a detailed view similar to FIG. 4 for the first embodiment of the carrier platform. FIG. 5 is a detailed view similar to FIG. 4 for a second embodiment of the carrier platform. FIG. 4 shows a stack fixed on a membrane frame. FIG. 2 shows a first embodiment of the device claimed in the present invention, relating to one of the four method steps claimed in the present invention. FIG. 2 shows a first embodiment of the device claimed in the present invention, relating to one of the four method steps claimed in the present invention. FIG. 2 shows a first embodiment of the device claimed in the present invention, relating to one of the four method steps claimed in the present invention. FIG. 2 shows a first embodiment of the device claimed in the present invention, relating to one of the four method steps claimed in the present invention. FIG. 7 shows a second embodiment of the device claimed in the present invention for one of the four method steps. FIG. 7 shows a second embodiment of the device claimed in the present invention for one of the four method steps. FIG. 7 shows a second embodiment of the device claimed in the present invention for one of the four method steps. FIG. 7 shows a second embodiment of the device claimed in the present invention for one of the four method steps.

  The same components or components having the same function are identified by the same reference numerals in these drawings.

  FIG. 1 shows a carrier stage 1 that can be used semi-automatically and that manually holds a carrier substrate 13. The carrier table 1 is used for peeling the carrier substrate 13 from the product substrate 11 connected to the carrier substrate 13 by the interconnection layer 12.

The carrier base 1 includes a holding handle 2 disposed on one outer peripheral section 26 and a ring 3 opened on the opposite side of the holding handle 2. In the open part 3o of the ring 3, there is a separating means 25 for adjusting the distance A between the end parts 24, 24 'on the opposite end parts 24, 24' of the ring 3. The inner diameter D _i and the outer diameter D _a of the ring 3 can be adjusted by adjusting the distance A. The spacing means 25 in this exemplary embodiment is composed of levers 4 and 5, the lever 4 is mounted on the end 24 and the lever 5 is mounted on the end 24 ′. The levers 4 and 5 are here penetrated by positioning elements 14 which can be operated manually. As claimed in the present invention, automatic repositioning of the above-described manual kinematic effects is anticipated.

The holding handle 2 is attached to the ring 3 by means of fixing elements 10, in particular screws. As claimed in the present invention, the material of ring 3 for _a given geometry (ring height H, ring width B, outer diameter D _a , inner diameter D _i ) is the force generated by ring 3 due to its bending stiffness. Should be selected such that it can be elastically bent by the spacing means 25 that opposes.

  The ring 3 includes an outer peripheral shoulder 7 that protrudes away from the ring shoulder 6 and a step 9. Step 9 extends in a Z-shape with an internal angle of 45 ° <I <90 °, in particular <80 °, preferably <70 °, in the direction of the middle part of the ring, and thus the sharp inner edge 8 In particular, a wall slope 17 extending in the outer circumferential direction is formed. The inner edge 8 is simultaneously a component of the facing surface 7 s of the outer shoulder 7, and the facing surface 7 s extends parallel to the ring shoulder 6. The facing surface 7s is equidistant from the ring shoulder 6 with a distance M. As claimed in the present invention, this distance M is at most a little larger than one thickness d of the carrier substrate 13 (see FIG. 7), in particular at the maximum of the interconnect layer 12. The thickness is selected so as to be further increased by the thickness. Preferably, the distance M is selected to be smaller than the thickness d of the carrier substrate 13, as shown in FIG. Preferably, the distance M is at least half the thickness d of the carrier substrate 13.

The diameter D _k between the inner diameter D _i and the outer diameter D _a for holding the carrier substrate 13 and formed by the inner edge 8 is the carrier substrate 13 formed by the inner edge 8 It can be expanded by the spacing means 25 until it can be inserted through the opening (diameter D _k ) to the ring shoulder 6. The diameter D _k can then be reduced again by the separating means 25 until one outer peripheral edge 13u of the carrier substrate 13 contacts and is fixed by the inclined surface 17 of the outer peripheral shoulder 7. Therefore, the carrier substrate 13 is held by the flexible carrier base 1. This attachment is to some extent by clamping and / or by a molded fit. In order to clamp the carrier substrate 13 on the bevel 17, there can be force gauge means for controlling the clamping, especially on the positioning means 14.

  The product substrate 11 is only attached to the carrier table via the interconnection layer 12. There is no direct contact between the carrier base 1 and the product substrate 11. By avoiding contact between the carrier platform 1 and the product substrate 11, the product substrate 11 is protected to the maximum and contamination or damage is substantially eliminated.

  A product substrate 11 having an interconnect layer 12 and a carrier substrate 13 forms a stack 19 (carrier substrate-product substrate combination). Similarly, the present invention is suitable for a combination of a carrier substrate and a product substrate without intervening interconnect layers, and particularly for so-called pre-bonding in which wafers are bonded to each other by van der Waals force. .

  In the embodiment shown in FIG. 7, when the stack 19 is fixed on the carrier base 1, the acute angle inner edge 8 also serves as a separating means, that is, the inner edge 8 on the outer peripheral edge of the interconnection layer 12. It is also used to initiate penetration of the tip into the interconnect layer 12.

  The carrier base 1 substantially completely surrounds the carrier substrate 13 except for the ring opening 3o.

  FIG. 8 shows the stack 19 on the membrane frame 23. The product substrate 11 is connected to the membrane 21 bonded to the membrane frame 23. The stack 19, the membrane frame 23, and the membrane 21 form a membrane frame combination 20.

  The carrier substrate 13 can be pulled away from the product substrate 11 by the holding handle 2 and by fixing the product substrate 11 or the membrane frame 23. A tensile force is applied laterally to the carrier substrate 13 and thus to the outer peripheral section 26 by the holding handle 2 in one side configuration. When initiated by the penetration of the inner edge 8 into the interconnect layer 12, the carrier substrate 13 is slowly peeled off due to the deformation of the carrier substrate 13 and of the ring 3 (against its forces caused by bending stiffness). This proceeds from the outer circumferential section 26 to the opposite side. In this case, the forefront part of the peeling moves from the outer peripheral section 26 to the opposite side of the carrier substrate 13 by the interconnection layer 12. Therefore, a prescribed torque acts along the forefront part of the peeling according to the distance of the foremost part from the holding handle 2 and the peeling force applied to the holding handle 2.

  This is shown in an automated form in the first embodiment of FIGS. 9a-9d and in the second embodiment of FIGS. 10a-10d. Next, these will be described.

  The use of the carrier platform 1 described above for mounting the carrier substrate 13 in a form suitable for automation is common in these two embodiments.

  An important aspect of the present invention provides for particularly careful handling at the beginning of peeling, and thus when peeling is initiated, especially by performing mechanical peeling of the interconnect layer on the periphery or on its edges. Consists of.

  9 and 10 are each one base 27 and other configurations described below of a device mounted on base 27 to provide a stable base structure and as claimed in the present invention. One rack 22 is shown for mounting elements. On the frame 22 or the base 27, in particular between the cover 22d of the rack 22 and the bottom 27b formed by the base 27, translational movement (especially driven) of the carrier base 1 or of the outer peripheral section of the carrier base 1 Drive means 15 ′ and drive means 15 for translational movement (particularly driven) of the substrate base 18 (receiver) holding the stack 19 or membrane frame combination 20. The driving means 15 ′ can have a mechanism that is formed by a movable bearing and is movable in the translational direction.

  The substrate stage 18 in the two embodiments as shown in FIGS. 9 and 10 can be moved up and down in the translation direction in one peeling direction L and thus in the plane of the drawings. Accordingly, the driving means 15 for driving the substrate base 18 are moved in particular synchronously and can be driven by a motor, in particular a step motor, preferably controlled by a central control device.

  In the embodiment as shown in FIG. 9, there is only one driving means 15 ′ on the side of the carrier table 1 on the opposite side of the outer circumferential section 26 with respect to the carrier table 1, while on the outer circumferential section 26. There is one rocker bearing 16 which allows the carrier platform to be pivoted about the rocker bearing 16 but fixed in the peel direction L. Therefore, the order of the method is as follows.

  In the method step shown in FIG. 9a, the carrier base 1 suitable for the carrier substrate 13 is mounted on the membrane frame combination 20 on the upper drive means 15 ′ and the rocker support 16. At the same time, in advance or afterwards, the membrane frame combination 20 is fixed on the substrate table 18, in particular by applying a vacuum. The substrate table 18 can be moved in the peeling direction L by the driving means 15.

  As claimed in the present invention, alternatively, on the outer periphery of the carrier platform 1, a plurality, in particular two drive means 15 ′ are on one side and a plurality, in particular two rocker bearings 16. Is expected to be on the opposite side.

  The carrier base 1 can be fixed by the holding means 28 arranged on the outer periphery 3u of the ring on the drive means 15 ′ and the rocker support 16. The substrate table 18 can be fixed by holding means 29 on the driving means 15.

  Next, the substrate table 18 is moved to the position illustrated in FIG.9b by the drive means 15 performing synchronous translation of the substrate table 18 until the top surface 13o of the carrier substrate 13 contacts the ring shoulder 6. Therefore, it is moved in the direction of the carrier table 1 in the peeling direction L. Control is performed via a central control device, and the detection that the carrier substrate 13 has collided with the ring shoulder 6 can be performed in particular by means of a force transducer integrated with the substrate base 18. Preferably, n force transducers are distributed at an angular distance of 360 ° / n on the outer periphery of the substrate base 18.

In order for the carrier substrate 13 to be held in the carrier platform 1, the diameter D _k must be matched to the inner edge 8 of the ring 3 in advance accordingly. Thus, the outer contour of the carrier substrate 13 (especially circular with a diameter D _t) becomes to be received in the carrier table 1. When the carrier substrate 13 is received, the internal diameter D _i, as not to carrier substrate 13 slips, smaller than the diameter D _t of the carrier substrate 13. As soon as the position shown in FIG. 9b is reached, the inner diameter D _i can be reduced until the carrier substrate 13 is fixed in the carrier base 1 (see FIGS. 6 and 7) and thus contacts the wall ramp 17.

  As soon as it reaches the position illustrated in FIG. 9b, the upper flexible drive means 15 ′ is released so as to have a degree of freedom in the peeling direction L, and is on the side of the carrier base 1 attached to the drive means 15 ′. The part can freely move in the peeling direction L. In this embodiment, the driving means 15 ′ does not have a driving device. However, in this case, as claimed in the present invention, the motion control by the central device is such that the drive means 15 'is active rather than passive (as in the preferred embodiment). It is also expected to do.

Next, in the two driving means 15 provided on both sides of the board base 18, one driving force F ₁ (tensile force) directed away from the carrier base ₁ is equal to the driving force F ₁ in particular. A certain driving force F ₂ (tensile force) is applied particularly synchronously to the substrate base 18 in order to peel the carrier substrate 13 fixed on the carrier base 1 from the product substrate 11.

Against the driving force F ₁ and F _2, particularly acting parallel to these driving forces F ₁ and F _2, counter force G (or, more counter when multiple rocker bearing 16 is present A force G) is applied to the rocker bearing 16.

By doing so, the peeling process started from the inner edge 8 is continued, the bending of the carrier base 1 and the carrier substrate 13 is increased, and the foremost part of the peeling is from the rocker bearing 16 to the opposite side of the carrier base 1 Proceed to In the equilibrium state of the driving forces F ₁ and F ₂ and the counter force G (generated by the interconnecting force of the interconnecting layer 12), the separation moment K _{1 to} Kn _{where the} torque is minimally distributed along the forefront of the separation Acting along the forefront of the peeling.

  In the position shown in FIG.9c, the carrier substrate 13 is more than half the peel caused by deformation of both the carrier substrate 13 and further the carrier base 1 (against the bending strength of the carrier base 1 and of the carrier base 13). Only peeled off.

  In the position shown in FIG. 9d, the carrier substrate 13 is completely peeled from the product substrate 11. The interconnect layer 12 in this figure adheres to the product substrate 11 but can also partially or fully adhere to the carrier substrate 13.

  During peeling, the carrier platform 1 and the carrier substrate 13 are bent at an angle of 1 ° <W <45 °, in particular W <35 °, in this case approximately 6 ° (average, in particular product substrate 11 to carrier substrate 13 Is bent by the bending angle (measured at the time when the half peeled).

  In a second embodiment as illustrated in FIGS. 10a to 10d, instead of the drive means 15 ′, a rocker bearing 16 is present on the carrier platform 1, so that the outer section 26 and the opposite side The carrier table 1 on the outer circumferential section 26 '(and thus the rocker bearing 16 is mounted to the holding means 28 of the carrier table 1) is fixed in the peeling direction L (as claimed in the present invention, There may be a plurality of rocker supports 16 on the outer periphery of the carrier base 1). In the section between the outer peripheral sections 26, the carrier base 1 is movable within a range having flexibility with respect to bending rigidity. Therefore, when a driving force is applied in the method step according to 10c, the foremost part of the peeling advances from the outer peripheral part of the interconnect layer 12 substantially (ripple) concentrically to the intermediate part of the interconnect layer 12. In this case, the start by the inner edge 8 of the carrier platform plays an important role in overcoming the initial interconnection force of the interconnection layer 12.

Figure 10a~ In embodiments as illustrated in Figure 10d, the breakaway torque K ₁ ~K _n is as peeling foremost progresses, each priority for one (ripples) circular sections along the peeling forefront Act on. The bending angle W according to FIG. 9c is measured with respect to the opposite side edge of the rocker bearing, but the bending angle W ′ is from the center to the edge of the carrier substrate 13 and from all sides to the outer periphery. As long as the material of the carrier base 1 and the material of the carrier substrate 13 and their dimensions are normally the same, the bending angle W ′ is measured in this case by the distance By becoming shorter, correspondingly smaller. By reducing the ring width B and / or the ring height H, the bending rigidity of the ring 3 can be lowered so that the bending angle W ′ is expanded.

1 Carrier stand
2 Holding handle
3 rings
3o opening
3u ring outer periphery
4 Lever
5 Lever
6 Ring shoulder
7 Outer shoulder
7s facing surface
8 Inner edge
9 steps
10 Fixing means
11 Product board
12 Interconnection layer
13 Carrier board
13o top
13u outer edge
14 Positioning elements
15,15 'drive means
16 Rocker support
17 slope
18 Board base
19 Stack
20 Membrane frame combination
21 foil
22 racks
22d cover
23 Membrane frame
24,24 'end
25 Separation means
26 Peripheral section
27 base
27b bottom
28 Holding means
29 Holding means
A interval
B Ring width
D _i inner diameter
_Da outer diameter
D _k diameter
H ring height
M distance
L Peel direction
I Interior angle
d thickness
F ₁ , F ₂ , F _n Driving force (tensile force)
G resistance
K ₁ , K ₂ , K _n peeling moment
W, W 'bending angle

Claims (5)

A device for peeling a carrier substrate from a product substrate,
The product substrate is temporarily connected to the carrier substrate by an interconnection layer to form a stack,
The device is
Means for supporting the stack;
Peeling means for bending the carrier substrate and peeling it from the product substrate;
Separating means for initiating separation of the carrier substrate from the product substrate;
With
The separating means includes
A first member having a surface parallel to the surface of the carrier substrate;
An outer circumferential shoulder extending from the surface of the first member, the outer shoulder including a surface configured to contact an outer peripheral edge of the carrier substrate, and an inner edge;
With
The inner edge penetrates into the interconnect layer when the peeling means applies a force to the carrier substrate so as to bend the carrier substrate, separating the carrier substrate from the product substrate. Start the device. Wherein the first member is elastically deformable, according to claim 1, wherein the device. 3. A device according to claim 1 or 2 , wherein the separating means comprises driving means for moving the outer shoulder for applying a force to the carrier substrate in order to bend and separate the carrier substrate from the product substrate. It said separating means further comprising a holding means for holding a product substrate, according to any one of claims 1 to 3 devices. 5. A device according to claim 4 , wherein the separating means comprises second driving means for moving the holding means so as to separate the product substrate from the carrier substrate.

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