JP6304419B2 - Resin composition, and resin sheet, prepreg, laminate, metal substrate, printed wiring board and power semiconductor device using the same - Google Patents

Resin composition, and resin sheet, prepreg, laminate, metal substrate, printed wiring board and power semiconductor device using the same Download PDF

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Publication number
JP6304419B2
JP6304419B2 JP2017039538A JP2017039538A JP6304419B2 JP 6304419 B2 JP6304419 B2 JP 6304419B2 JP 2017039538 A JP2017039538 A JP 2017039538A JP 2017039538 A JP2017039538 A JP 2017039538A JP 6304419 B2 JP6304419 B2 JP 6304419B2
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Prior art keywords
resin composition
filler
resin
cured
cured resin
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JP2017039538A
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Japanese (ja)
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JP2017101257A (en
Inventor
優香 吉田
優香 吉田
竹澤 由高
由高 竹澤
靖夫 宮崎
靖夫 宮崎
高橋 裕之
裕之 高橋
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日立化成株式会社
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Priority to PCT/JP2011/075345 priority Critical patent/WO2013065159A1/en
Priority to JPPCT/JP2011/075345 priority
Priority to JP2012090473 priority
Priority to JP2012090473 priority
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Publication of JP2017101257A publication Critical patent/JP2017101257A/en
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Publication of JP6304419B2 publication Critical patent/JP6304419B2/en
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