JP6287570B2 - Optical device inspection apparatus and optical device inspection method - Google Patents

Description

  The present invention relates to an optical device inspection apparatus and an optical device inspection method, and more particularly to an optical device inspection apparatus and an optical device inspection method for performing a plurality of inspections at a speed that matches a manufacturing process speed.

  In the manufacture of optical devices such as organic electroluminescent elements and liquid crystal display panels, various inspections relating to light emission and display of devices using inspection apparatuses are performed. For these inspections, an inspection apparatus including an energization unit for energizing an optical device and a light receiving detector is used.

  As an example of such an inspection apparatus, a plurality of contacts pressed against the electrodes of the display substrate received by the substrate receiver, a transport device that transports and delivers the display substrate to the substrate receiver, and a substrate receiver On the other hand, a video camera provided with a video camera corresponding to each has been proposed (for example, see Patent Document 1 below).

  As another example of the inspection apparatus, a line sensor arranged in parallel with the display panel received by the stage, a moving mechanism for moving the line sensor, an area sensor, and a driving mechanism for moving the area sensor relative to the display panel Have been proposed (for example, see Patent Document 2 below).

JP 2003-15543 A JP 2004-333663 A

  By the way, the inspection of the optical device performed using the inspection apparatus as described above is, for example, a light-emitting device such as an organic electroluminescent element, an inspection related to light emission characteristics such as luminance and chromaticity, and a dark spot. There are a wide variety of inspections, such as inspections related to light-emitting defects, and inspections related to leakage current. For this reason, these inspection processes are performed in an off-line process deviating from the manufacturing process, which takes a considerable amount of time, which has been a factor of reducing the manufacturing speed of the optical device.

  Therefore, an object of the present invention is to provide an optical device inspection apparatus and an optical device inspection method capable of increasing the inspection speed while performing a plurality of inspections.

  In order to achieve such an object, an optical device inspection apparatus according to the present invention holds an optical device having a light extraction surface, and includes a holding member having a connection wiring connected to the optical device, and the holding member. A stage having a placement surface to be placed, a power feeding unit that is mounted on the stage and that feeds the connection wiring of the holding member placed on the stage, a transport unit that transports the stage, and the holding member And a light detection unit disposed at a position facing the optical device placed on the stage in a state where the light detection device is held on the stage.

  In the optical device inspection apparatus as described above, the power supply unit is mounted on the stage on which the optical device holding member is placed, so that the optical device can be transported while power is supplied to the optical device. For this reason, by providing the light detection units arranged on the light extraction surface side of the optical device in the transport direction, various inspections can be sequentially performed in the transport process.

  Further, the optical device inspection method of the present invention transports the optical device in a direction along the light extraction surface while maintaining the state where the light is extracted from the light extraction surface of the optical device, and in the process of conveying the optical device, In this method, the light extracted from the optical device is detected and inspected. Such an inspection method is performed using the above-described inspection apparatus.

  As described above, according to the optical device inspection apparatus and the optical device inspection method of the present invention, since various inspections can be performed sequentially along the optical device transport process, inspection is performed while performing a plurality of inspections. The speed can be increased. As a result, the optical device can be inspected according to the manufacturing speed, and the production efficiency of the optical device can be improved.

It is a top view which shows an example of the optical device used as a test object. It is sectional drawing which shows an example of the optical device used as a test object, and is AA sectional drawing of FIG. It is a top view of the optical device inspection apparatus of an embodiment. It is a side view of the optical device inspection apparatus of an embodiment. It is a front view of the optical device inspection apparatus of an embodiment. It is a top view of the arrangement | positioning part of the holding member in the optical device inspection apparatus of embodiment. It is sectional drawing of the arrangement | positioning part of the holding member in the optical device inspection apparatus of embodiment, and is a figure corresponding to the AA cross section of FIG. It is sectional drawing of the arrangement | positioning part of the holding member in the optical device inspection apparatus of embodiment, and is a figure corresponding to the BB cross section of FIG. It is sectional drawing of the arrangement | positioning part of the holding member in the optical device inspection apparatus of embodiment, and is a figure corresponding to CC cross section of FIG. It is a side process figure (the 1) explaining the optical device inspection method using the optical device inspection device of an embodiment. It is a side process figure (the 2) explaining the optical device inspection method using the optical device inspection apparatus of embodiment.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Here, an optical device inspection apparatus and an optical device inspection method when an organic electroluminescence element is used as an optical device to be inspected will be described. However, the present invention is not limited to this, and as long as it is a flat optical device, the present invention is widely applied to inspection of an optical device such as a self-luminous optical device and a liquid crystal display device using a backlight.

  First, prior to describing the embodiments of the optical device inspection apparatus and the optical device inspection method of the present invention, the configuration of the optical device to be inspected will be described, and then the optical device inspection apparatus and the optical device inspection method will be described in this order. Do.

≪Optical device≫
FIG. 1 is a plan view for explaining an example of an optical device to be inspected. FIG. 2 is a cross-sectional view for explaining an example of the optical device, and is a cross-sectional view taken along the line AA in FIG. The optical device EL shown in these drawings has a flat plate shape, and is, for example, a bottom emission type organic electroluminescent element, and is provided on one main surface side of the flexible substrate s1. In the illustrated example, the element substrate S is configured by providing three optical devices EL on one main surface of the flexible substrate s1.

  From each optical device EL, two terminals (hereinafter referred to as device terminals p) are drawn out in two directions toward the edge of the flexible substrate s1, in this case, in two directions toward the edge in the longitudinal direction. One of the two device terminals p is used as an anode, and the other is used as a cathode, and light emission occurs in the optical device EL when a voltage is applied from these device terminals p. The light h generated by each optical device EL is extracted through, for example, the flexible substrate s1. In this case, in the flexible substrate s1, the other main surface opposite to the surface on which the optical device EL is provided is the light extraction surface a of the optical device EL.

≪Optical device inspection equipment≫
3 is a top view of the optical device inspection apparatus of the embodiment, FIG. 4 is a side view of the optical device inspection apparatus of the embodiment, and FIG. 5 is a front view of the optical device inspection apparatus of the embodiment. The optical device inspection apparatus 1 shown in these drawings is an inspection apparatus for inspecting the light emission characteristics and light emission defects of the optical device EL described above.

  The optical device inspection apparatus 1 shown in these drawings includes a holding member 2 that holds an element substrate S provided with an optical device EL, a stage 3 on which the holding member 2 is placed, and a power feeding unit 4 that is mounted on the stage 3. I have. The optical device inspection apparatus 1 includes a transport unit 5 that transports the stage 3 and a light detection unit 6 that is disposed above the stage 3.

  Hereinafter, the details of each of these components constituting the optical device inspection apparatus 1 will be described using the enlarged views of FIGS. 6 to 9 as necessary. FIG. 6 is an enlarged plan view of the arrangement of the holding member 2. 7 to 9 are cross-sectional views of the arrangement portion of the holding member 2, FIG. 7 corresponds to the AA cross section of FIG. 6, FIG. 8 corresponds to the BB cross section of FIG. This corresponds to the CC cross section of FIG.

<Holding member 2>
First, the holding member 2 is for holding the optical device EL, and is configured as, for example, a printed wiring board in which connection wiring is provided on both surfaces. One main surface side of such a holding member 2 is the holding surface 2a of the element substrate S on which the optical device EL is provided. On the other hand, the other main surface side of the holding member 2 is a surface disposed opposite to the stage 3 and is a terminal surface 2b on which a terminal for inspection is provided.

  The element substrate S on which the optical device EL is formed is placed on the holding surface 2a. In this case, the element substrate S is held on the holding surface 2a with the light extraction surface a exposed upward and the formation surface of the optical device EL on the element substrate S facing the holding surface 2a. Although illustration is omitted here, the holding member 2 and the element substrate S are provided with positioning members, respectively, and the element substrate S is attached to the holding member 2 in a state in which these positioning members are fitted. By holding, the element substrate S is held in a predetermined state with respect to the holding surface 2a. In the state where the element substrate S is held on the holding surface 2a, the light extraction surface a in the element substrate S is kept flat.

  At least two electrode pads 201 are provided on the holding surface 2a of the holding member 2 as described above. These electrode pads 201 are individually connected to the anode and the cathode among the device terminals p of the optical device EL in a state where the element substrate S is held on the holding surface 2a.

  Further, the holding member 2 is provided with a plurality of via wirings 203 penetrating from the holding surface 2a to the terminal surface 2b. These via wirings 203 are provided in a state of being connected to the electrode pads 201 (see FIG. 7).

  On the other hand, on the terminal surface 2 b of the holding member 2, a lead-out wiring 205 is laid from the via wiring 203 toward the periphery of the terminal surface 2 b. Further, an inspection pad 207 in which the end portion of the lead-out wiring 205 is widened is provided on the periphery of the terminal surface 2b.

  Thus, the device terminal p of the optical device EL connected to the electrode pad 201 on the holding surface 2a side reaches the inspection pad 207 provided on the peripheral edge of the terminal surface 2b through the via wiring 203 and the lead wiring 205. It is configured to be pulled out. The electrode pad 201, the via wiring 203, the lead-out wiring 205, and the inspection pad 207 constitute a connection wiring connected to the device terminal p of the optical device EL.

  When the element substrate S is configured using the flexible substrate s1, the element substrate S is held on the frame member (not shown) and the rigidity is maintained by holding the element substrate S on the frame member. S may be configured to be held by the holding member 2. In this case, the frame member is configured to expose the light extraction surface a in the element substrate S. Further, the frame member has a terminal that is pulled out from the device terminal p provided on the element substrate S and connected to the electrode pad 201 of the holding member 2.

  The holding member 2 may be configured to hold the element substrate S in a state where the device terminal p of the optical device EL is pulled out to the terminal surface 2b side without blocking the light extraction surface a of the optical device EL. The configuration is not limited.

<Stage 3>
The stage 3 has a placement surface 3a on which the holding member 2 is placed. On the mounting surface 3a, the holding member 2 is mounted in a state where the terminal surface 2b of the holding member 2 is opposed. Although illustration is omitted here, the holding member 2 and the stage 3 are each provided with a positioning member, and the holding member 2 is placed on the mounting surface 3a of the stage 3 in a state in which these positioning members are fitted. By being placed on, the holding member 2 is held in a predetermined state with respect to the placement surface 3a.

  The stage 3 has a mounting surface 3a having a large area so that the light extraction surface a of the element substrate S held by the holding member 2 is flatly supported in a state where the holding member 2 is mounted. Such a mounting surface 3 a is configured as a chuck surface for fixing the holding member 2. The chuck mechanism for fixing the holding member 2 is, for example, a bolus chuck or an electrostatic chuck.

  Further, the stage 3 has a storage portion 301 for storing the power feeding portion 4 below the placement surface 3a. The storage portion 301 is provided at a position that does not overlap the placement surface 3a.

  The above stage 3 is transported in a predetermined direction by the transport unit 5 (see FIGS. 3 to 5) described below, and is supported by the nut 303 and the transport unit 5 as shown in FIG. One leg 305 is provided. Among these, the nut 303 is provided at the center of the stage 3 on the lower surface side opposite to the placement surface 3 a of the stage 3. The two legs 305 are provided on both sides of the nut 303 on the lower surface side opposite to the mounting surface 3a of the stage 3, and are provided in parallel so as to extend in the conveying direction of the stage 3. .

<Power supply unit 4>
As shown in FIGS. 8 and 9, the power feeding unit 4 is mounted on the stage 3 and abuts on the inspection pad 207 of the holding member 2 mounted on the mounting surface 3 a of the stage 3, Power is supplied to the optical device EL through this. Such a power supply unit 4 includes a probe-shaped power supply terminal 401, a frame 403 that supports the power supply terminal 401, a power supply terminal 401, and a control unit 405 connected to the frame 403, and is stored in the storage unit 301 of the stage 3. It is mounted in the state. Further, it is assumed that the current measuring means 407 is connected to the power supply terminal 401.

  Among these, the power supply terminal 401 is supported by the gantry 403 in a state where the probe-like tip is brought into contact with the inspection pad 207 of the holding member 2. On the gantry 403, at least two power supply terminals 401 are provided. One power supply terminal 401 is used as a cathode and the other power supply terminal 401 is used as an anode. In the illustrated example, the same number of power supply terminals 401 as the inspection pads 207 are fixed to the gantry 403 and each power supply terminal 401 is brought into contact with the inspection pad 207 of the holding member 2 individually. .

  The gantry 403 is a liftable type, and as shown by a two-dot chain line in the figure, the tip of the supported power supply terminal 401 is located at a height similar to that of the mounting surface 3 a from below the mounting surface 3 a of the stage 3. Raise it to the height. Thus, the tip of the power supply terminal 401 is brought into contact with the inspection pad 207 of the holding member 2 held on the placement surface 3 a of the stage 3. Further, by lowering the gantry 403, the tip of the power supply terminal 401 is separated from the inspection pad 207 of the holding member 2 held on the mounting surface 3 a of the stage 3.

  The control unit 405 controls raising and lowering of the gantry 403 and also controls power feeding from the power feeding terminal 401. Details of the control of the raising and lowering of the gantry 403 and the power supply from the power supply terminal 401 by the control unit 405 will be described in detail in the optical device inspection method hereinafter.

  The current measuring means 407 is for measuring the current value flowing through the optical device EL, and is an ammeter provided between the power supply terminals 401 connected to the anode and the cathode of the device terminal p of the optical device EL. It's okay.

<Conveying unit 5>
The transport unit 5 shown in FIGS. 3 to 5 is for transporting the stage 3. Such a conveyance unit 5 includes, for example, a motor 501, a screw screw 503 that is rotated by the motor, a bearing 505 that supports the screw screw 503, two guide rails 507, and a conveyance control unit 509.

  Among these, the motor 501 has a rotating shaft that rotates in one direction or in both directions. This motor 501 is assumed to be a pulsed stepping motor, for example.

  The screw screw 503 is erected on the rotating shaft of the motor 501. The screw screw 503 is fitted to the nut 303 of the stage 3, and the end opposite to the end fixed to the motor 501 is supported to be rotatable with respect to the bearing 505.

  The two guide rails 507 are arranged in parallel with the screw screw 503 so as to receive the two leg portions 305 provided on the stage 3 respectively. Thereby, by rotating the screw screw 503 by driving the motor 501, the stage 3 having the nut 303 fitted to the screw screw 503 is conveyed in one or both directions in the extending direction of the screw screw 503. The conveyance direction of the stage 3 is, for example, a horizontal direction, and the placement surface 3a of the stage 3 is kept horizontal by the two guide rails 507, but is not limited thereto.

  These guide rails 507 are configured as roller conveyors in which a plurality of rollers 507 a are arranged on the surface that receives the leg portion 305 of the stage 3, and the stage 3 smoothly travels in the direction in which the screw screw 503 is laid.

  The conveyance control unit 509 controls the conveyance direction and conveyance speed of the stage 3 by controlling the rotation direction and rotation speed of the motor 501. Details of the control of the transport direction and transport speed of the stage 3 by the transport control unit 509 will be described in detail in the subsequent optical device inspection method.

<Photodetection unit 6>
3 to 5 is disposed on the light extraction surface a side of the optical device EL, and is disposed at a position facing the mounting surface 3a of the stage 3 here. Such a light detection unit 6 includes a monochrome line sensor 601, a color line sensor 603, a two-dimensional luminance chromaticity meter 605, an inspection processing unit 607, and an output unit 609.

  Among these, the monochrome line sensor 601 is an image pickup apparatus having a CCD or CMOS configuration in which monochrome photoelectric conversion elements having high photosensitivity are arranged in one direction. In such a monochrome line sensor 601, the photoelectric conversion elements are arranged in a direction perpendicular to the transport direction of the stage 3 and in a direction parallel to the placement surface 3 a of the stage 3 and the light extraction surface a of the optical device EL. Is installed above the stage 3.

  In the monochrome line sensor 601 as described above, the photoelectric conversion elements are arranged over the width direction (width direction perpendicular to the transport direction) of the element substrate S placed on the stage 3 via the holding member 2, and the light extraction surface. It is assumed that light emission from a is detected without gaps in the width direction. In the example shown in FIGS. 3 and 5, a configuration in which six monochrome line sensors 601 in which a plurality of photoelectric conversion elements are arranged in one direction is arranged across the width direction of the element substrate S is illustrated.

  The color line sensor 603 is a CCD or CMOS imaging device in which photoelectric conversion elements capable of imaging in full color are arranged in one direction, and preferably capable of color imaging by prism spectroscopy. Such a color line sensor 603 is arranged separately from the monochrome line sensor 601 in the transport direction of the stage 3, is in a direction orthogonal to the transport direction of the stage 3, and the mounting surface 3 a of the stage 3 and the optical device EL. It is installed above the stage 3 so that the photoelectric conversion elements are arranged in a direction parallel to the light extraction surface a.

  Similarly to the monochrome line sensor 601, the color line sensor 603 applies photoelectric conversion elements over the width direction (width direction perpendicular to the transport direction) of the element substrate S placed on the stage 3 via the holding member 2. It is the arranged configuration. These photoelectric conversion elements are provided so that light emission from the light extraction surface a can be detected without gaps in the width direction. In the example shown in FIGS. 3 and 5, a configuration in which six color line sensors 603 in which a plurality of photoelectric conversion elements are arranged in one direction is arranged in the width direction of the element substrate S is illustrated.

  In particular, the color line sensor 603 is provided with photoelectric conversion elements at intervals at which the light extraction surface a can be imaged without being greatly affected by the chromaticity displacement depending on the viewing angle. Such a color line sensor 603 is preferably arranged at a position higher than the monochrome line sensor 601 with respect to the stage 3.

  The two-dimensional luminance chromaticity meter 605 is a device that measures the luminance and chromaticity of the light extraction surface a in the element substrate S in two dimensions, and is installed above the stage 3. In such a two-dimensional luminance chromaticity meter 605, the detection area a3 on the light extraction surface a of the optical device EL is higher than the detection area a1 of the monochrome line sensor 601 and the detection area a2 of the color line sensor 603. They are arranged at positions separated in the transport direction. Further, the two-dimensional luminance chromaticity meter 605 is disposed at a height position where the entire light extraction surface a in the element substrate S can be measured.

  The inspection processing unit 607 is connected to the monochrome line sensor 601, the color line sensor 603, and the two-dimensional luminance chromaticity meter 605, and an image conversion unit that performs data conversion processing based on the measurement values obtained by these The calibration unit performs calibration of measured values.

  The image conversion process performed by the inspection processing unit 607 is a process of converting the RGB value obtained by the color line sensor 603 into another color space such as the color space XYZ or the color space xy. In the inspection processing unit 607, a Y value for luminance inspection is further calculated from the color space obtained by such image conversion processing, and an xy value for chromaticity inspection is calculated. Further, the inspection processing unit 607 calculates position information of dark spots and bright spots from the high-definition luminance information obtained by the monochrome line sensor 601.

  In addition, the calibration of the measurement value performed by the inspection processing unit 607 is based on the luminance and chromaticity measurement values measured by the two-dimensional luminance chromaticity meter 605, and the luminance obtained from the imaging result of the color line sensor 603. Calibrate values and chromaticity values.

  The output unit 609 is provided in connection with the inspection processing unit 607, and each measurement value measured by the monochrome line sensor 601, the color line sensor 603, and the two-dimensional luminance / colorimeter 605, and the inspection processing unit 607. The conversion value and calibration value obtained in step 1 are output. Note that the output unit 609 is a display monitor, for example.

≪Optical device inspection method≫
10 and 11 are side surface process diagrams for explaining an optical device inspection method using the optical device inspection apparatus of the embodiment. Hereinafter, an embodiment of the optical device inspection method will be described with reference to FIGS. 1 to 9 and FIGS.

<Fixing of optical device EL>
First, as shown in FIG. 4, the stage 3 is transported to a position deviated from the detection areas a <b> 1 to a <b> 3 of the light detection unit 6 by the transport unit 5. In this state, the holding member 2 holding the element substrate S in a predetermined state is placed and fixed on the placement surface 3a of the stage 3 in a predetermined state. Next, the power supply terminal 401 of the power supply unit 4 is raised, the power supply terminal 401 is brought into contact with the inspection pad 207 of the holding member 2, and the power supply terminal 401 and the optical device EL on the element substrate S are connected.

  Next, by supplying power from the power supply terminal 401, a forward drive voltage is applied to the optical device EL, and light is extracted from the light extraction surface a of the optical device EL.

<Inspection of dark spots, brightness, and chromaticity>
Thereafter, as shown in FIG. 10, the stage 3 is transported below the light detection unit 6 by the transport unit 5 while maintaining a state in which a forward drive voltage is applied to the optical device EL. At this time, the stage 3 is conveyed at a predetermined constant speed that matches the imaging speed of the monochrome line sensor 601 and the color line sensor 603, and the entire surface of the light extraction surface a in the optical device EL is covered by the monochrome line sensor 601 and the color line sensor 603. Take an image.

  The inspection processing unit 607 of the light detection unit 6 detects a dark spot (DS) and a bright spot from high-precision luminance information of the light extraction surface a detected by the monochrome line sensor 601. The RGB value of the light extraction surface a detected by the color line sensor 603 is converted into another color space such as the color space XYZ or the color space xy. Then, the luminance is detected from the Y value obtained by this conversion, and the chromaticity is detected from the xy value. The detected result is output to the output unit 609, and the inspection of the dark spot / bright spot, luminance, and chromaticity by the monochrome line sensor 601 and the color line sensor 603 is finished.

<Leak inspection>
After the above-described imaging with the monochrome line sensor 601 and the color line sensor 603 is completed, as shown in FIG. 11, the entire surface of the light extraction surface a is at a position where it becomes a detection region a3 on the two-dimensional luminance chromaticity meter 605. Stage 3 is paused.

  In this state, the supply current from the power supply terminal 401 is reduced, and a weak forward current is supplied to the optical device EL. The weak current supplied here is sufficiently weaker than the current supplied when the stage 3 is transported at a predetermined constant speed.

  Then, the luminance of the entire surface of the light extraction surface a in the optical device EL is measured by the two-dimensional luminance chromaticity meter 605. The inspection processing unit 607 detects the presence or absence of a leak from this measurement result. The detected result is output to the output unit 609, and the leak inspection by the two-dimensional luminance chromaticity meter 605 is terminated.

  Note that the detection of the presence or absence of leakage based on the measurement value by the two-dimensional luminance chromaticity meter 605 may be changed to a method of measuring the current by supplying reverse bias to the optical device EL. In this case, the leak test can also be performed by measuring the leak current value flowing between the anode and the cathode of the optical device EL by the current measuring means 407. The leak current value measured by the current measuring unit 407 may be output to the output unit 609.

  In addition to the above weak current application or reverse bias application, a normal drive voltage is applied in the forward direction from the power supply terminal 401 to the optical device EL, and the two-dimensional luminance chromaticity meter 605 The chromaticity of the entire surface of the light extraction surface a in the device EL is measured. The inspection processing unit 607 calibrates the chromaticity obtained by converting the RGB value of the light extraction surface a previously detected by the color line sensor 603 based on the measurement result, and outputs the calibrated chromaticity to the output unit. To 609.

  If it is not necessary to calibrate the chromaticity, the two-dimensional luminance chromaticity meter 605 may be a two-dimensional luminance meter that measures only the luminance, and the procedure for measuring the chromaticity is omitted. It ’s okay.

  After the measurement with the two-dimensional luminance chromaticity meter 605 as described above is completed, the optical device EL that has been measured by transporting the stage 3 is moved outside the measurement region of the two-dimensional luminance chromaticity meter 605.

  At this time, for example, as shown in FIG. 4, the stage 3 is transported in the reverse feeding direction. Then, the element substrate S provided with the optical device EL that has been measured is removed from the stage 3, and the element substrate S provided with the optical device EL to be inspected next is fixed on the stage 3 in a predetermined state. The procedure described above is repeated.

  As another procedure, the stage 3 may be transported in only one direction, and the optical device EL that has been measured may be moved outside the detection area a3 of the two-dimensional luminance / colorimeter 605. At this time, the optical device EL to be inspected next is fixed to the second stage 3 in advance. Then, the stage 3 is conveyed at a predetermined speed that matches the imaging speed of the monochrome line sensor 601 and the color line sensor 603. At this time, the monochrome line sensor 601 and the color line sensor 603 image the entire surface of the light extraction surface a in the optical device EL to be inspected next, and then perform measurement with the two-dimensional luminance chromaticity meter 605. Just do it.

<< Effects of Embodiment >>
In the optical device inspection apparatus 1 and the optical device inspection method using the same as described above, the optical device EL is transported while supplying power to the optical device EL by mounting the power supply unit 4 on the stage 3. Can do. A monochrome line sensor 601, a color line sensor 603, and a two-dimensional luminance chromaticity meter 605 are sequentially arranged on the light extraction surface s side of the optical device EL along the transport direction of the optical device EL. . Accordingly, a plurality of various inspections such as dark spots, luminance, chromaticity, and leak can be sequentially performed along the transport process of the optical device EL. In addition, since the positions of the monochrome line sensor 601, the color line sensor 603, and the two-dimensional luminance chromaticity meter 605 are fixed, the detection accuracy by these light detection devices can be kept high.

  As described above, according to the optical device inspection apparatus 1 and the optical device inspection method using the same described in the embodiment, the inspection speed of the optical device can be increased by sequentially performing a plurality of inspections on the optical device in the transport process. The speed can be increased. As a result, the optical device can be inspected according to the manufacturing speed, and the production efficiency of the optical device can be improved.

<< Modification 1 >>
As a first modification of the embodiment described above, a configuration in which a leak inspection is performed without using the two-dimensional luminance chromaticity meter 605 is exemplified. In this case, after the imaging with the monochrome line sensor 601 and the color line sensor 603 for inspecting the dark spot, luminance, and chromaticity described above is completed, the supply current from the power supply terminal 401 is reduced to the optical device EL. Supply a weak current in the forward direction. Alternatively, reverse bias power is supplied to the optical device EL.

  In this state, the stage 3 is conveyed in the reverse direction, and the entire surface of the light extraction surface a in the optical device EL is imaged by the monochrome line sensor 601 or the color line sensor 603.

  The inspection processing unit 607 of the light detection unit 6 detects the presence or absence of leakage from the luminance information of the light extraction surface a detected by the monochrome line sensor 601 or the color line sensor 603. The detected result is output to the output unit 609 and the leak inspection is terminated. If reverse bias power is supplied to the optical device EL, the leakage current value flowing between the anode and cathode of the optical device EL without using the monochrome line sensor 601 and the color line sensor 603 is A leak test can also be performed by measuring with the current measuring means 407. The leak current value measured by the current measuring unit 407 may be output to the output unit 609.

  Even with the configuration of Modification 1 as described above, the same effects as in the embodiment can be obtained.

<< Modification 2 >>
As a second modification of the embodiment described above, a configuration in which a line sensor for leak inspection is arranged instead of the two-dimensional luminance chromaticity meter 605 is exemplified. In this case, the line sensor for leak inspection is, for example, an imaging device having a CCD or CMOS configuration in which monochrome photoelectric conversion elements with high photosensitivity are arranged in one direction. Such a leak inspection line sensor is arranged in parallel with the monochrome line sensor 601 and the color line sensor 603 in the same arrangement state. However, the line sensor for the leak inspection is a position separated from the monochrome line sensor 601 and the color line sensor 603 so that the imaging at the position that does not affect the imaging of the light extraction surface a of the optical device EL is performed. Placed in.

  In this case, after the imaging with the monochrome line sensor 601 and the color line sensor 603 for inspecting the dark spot, luminance, and chromaticity described above is completed, the supply current from the power supply terminal 401 is reduced to the optical device EL. On the other hand, a weak current in the forward direction is supplied.

  In this state, the stage 3 is further conveyed in the same direction, and the entire surface of the light extraction surface a in the optical device EL is imaged by a line sensor for leak inspection.

  The inspection processing unit 607 of the light detection unit 6 detects the presence or absence of leakage from the luminance information of the light extraction surface a detected by the leak inspection line sensor. The detected result is output to the output unit 609 and the leak inspection is terminated.

  Even with the configuration of Modification 2 as described above, the same effects as in the embodiment can be obtained.

<< Modification 3 >>
As a third modification of the embodiment described above, a configuration in which a dark spot inspection is performed using the color line sensor 603 without providing the monochrome line sensor 601 is exemplified. In this case, a color line sensor 603 having a sufficiently high resolution is used. Then, the imaging by the color line sensor 603 is performed by the same procedure as described in the embodiment.

  In the inspection processing unit 607, the highly accurate RGB value of the light extraction surface detected by the color line sensor 603 is converted into another color space such as the color space XYZ or the color space xy. The inspection processing unit 607 further calculates a Y value for the dark spot inspection from the color space obtained by such image conversion processing, and calculates an xy value for the chromaticity inspection, thereby obtaining the color. A dark spot (DS) and a bright spot are detected from highly accurate information on the light extraction surface a detected by the line sensor 603. The detected result is output to the output unit 609 together with the inspection result of the brightness and chromaticity detected in the same procedure as in the embodiment.

  Even with the configuration of Modification 3 as described above, the same effects as in the embodiment can be obtained.

  DESCRIPTION OF SYMBOLS 1 ... Optical device inspection apparatus, 2 ... Holding member, 201 ... Electrode pad (connection wiring), 203 ... Via wiring (connection wiring), 205 ... Lead-out wiring (connection wiring), 207 ... Inspection pad (connection wiring), 3 DESCRIPTION OF SYMBOLS Stage, 3a ... Placement surface, 4 ... Feeding unit, 401 ... Feeding terminal, 403 ... Base, 405 ... Control unit, 507 ... Current measuring means, 5 ... Conveying unit, 501 ... Motor, 503 ... Screw screw, 505 ... Bearings, 507 ... guide rails, 509 ... conveyance control unit, 6 ... light detection unit, 601 ... monochrome line sensor, 603 ... color line sensor, 605 ... two-dimensional luminance and colorimeter, 607 ... inspection processing unit (image conversion unit, Calibration unit), a ... light extraction surface, a1, a2, a3 ... detection region, EL ... optical device

Claims (11)

A holding member that holds an optical device having a light extraction surface and has a connection wiring connected to the optical device;
A stage having a mounting surface for mounting the holding member;
A power supply unit mounted on the stage, for supplying power to the connection wiring of the holding member mounted on the stage,
A transport unit for transporting the stage;
An optical device inspection apparatus comprising: a light detection unit disposed at a position facing the optical device placed on the stage while being held by the holding member. The optical device inspection apparatus according to claim 1, wherein a plurality of the light detection units are arranged along a conveyance direction of the stage. As the light detection unit, it has a line sensor in which photoelectric conversion elements are arranged in a direction perpendicular to the transport direction of the stage by the transport unit,
The optical device inspection apparatus according to claim 1, wherein the transport unit transports the stage at a speed corresponding to an imaging speed of the line sensor. The optical device inspection apparatus according to claim 1, wherein a monochromatic line sensor and a color line sensor are sequentially provided in the transport direction of the stage as the light detection unit. As the light detection unit, it has a color line sensor,
An RGB value obtained by the color line sensor is provided with an image conversion unit that converts the RGB value into another color space.
The optical device inspection apparatus according to claim 1. As the light detection unit, a detection area on the light extraction surface of the optical device has a two-dimensional luminance meter at a position separated from the line sensor in the transport direction of the stage,
The optical device inspection apparatus according to claim 3, wherein the conveyance unit temporarily stops conveyance of the stage at a position facing the two-dimensional luminance meter. The line sensor is a color line sensor,
The two-dimensional luminance meter is a two-dimensional luminance chromaticity meter,
The optical device inspection apparatus according to claim 6, further comprising a calibration unit that calibrates a value obtained from the color line sensor based on a measurement value obtained by the two-dimensional luminance / colorimeter. The optical device inspection apparatus according to claim 1, further comprising a current measuring unit for an optical device placed on the stage in a state of being held by the holding member. While maintaining the state where light is extracted from the light extraction surface in the optical device, the optical device is conveyed in a direction along the light extraction surface,
In the optical device inspection method for performing light detection from the optical device in the process of transporting the optical device,
Before or after the light detection in the process of transporting the optical device, the transport of the optical device is temporarily stopped, and a weaker current is supplied to the optical device than in the process of transporting the optical device. Or an optical device inspection method for detecting light from the optical device in a state in which reverse bias feeding is performed . While maintaining the state where light is extracted from the light extraction surface in the optical device, the optical device is conveyed in a direction along the light extraction surface,
In the optical device inspection method for performing light detection from the optical device in the process of transporting the optical device,
An optical device inspection method for measuring a current value flowing through the optical device in a state where reverse bias power is supplied to the optical device before or after the light detection in the process of transporting the optical device. The optical device inspection method according to claim 9 or 10 , wherein in the process of transporting the optical device, a plurality of inspections are performed by sequentially detecting light along a transport direction of the optical device.

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