JP6192023B2 - インプリント法によるポリイミドの微細パターン形成方法 - Google Patents
インプリント法によるポリイミドの微細パターン形成方法 Download PDFInfo
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- 229920001721 polyimide Polymers 0.000 title claims description 102
- 238000000034 method Methods 0.000 title claims description 73
- 239000004642 Polyimide Substances 0.000 title claims description 67
- 238000010438 heat treatment Methods 0.000 claims description 39
- 239000000203 mixture Substances 0.000 claims description 25
- 238000000465 moulding Methods 0.000 claims description 24
- 239000009719 polyimide resin Substances 0.000 claims description 21
- 230000009477 glass transition Effects 0.000 claims description 18
- 238000001816 cooling Methods 0.000 claims description 9
- 229920001187 thermosetting polymer Polymers 0.000 claims description 8
- 206010034972 Photosensitivity reaction Diseases 0.000 claims description 7
- 230000036211 photosensitivity Effects 0.000 claims description 7
- 230000007261 regionalization Effects 0.000 claims description 5
- 230000001678 irradiating effect Effects 0.000 claims description 4
- 229920001400 block copolymer Polymers 0.000 claims description 2
- 238000003825 pressing Methods 0.000 claims description 2
- 230000008569 process Effects 0.000 description 23
- 239000000758 substrate Substances 0.000 description 17
- 239000011347 resin Substances 0.000 description 12
- 229920005989 resin Polymers 0.000 description 12
- 239000002904 solvent Substances 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 7
- 238000000206 photolithography Methods 0.000 description 7
- 238000005530 etching Methods 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 5
- 239000002243 precursor Substances 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 230000018109 developmental process Effects 0.000 description 4
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- 150000004985 diamines Chemical class 0.000 description 3
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- 239000003504 photosensitizing agent Substances 0.000 description 3
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 230000009466 transformation Effects 0.000 description 3
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- QPJVMBTYPHYUOC-UHFFFAOYSA-N methyl benzoate Chemical compound COC(=O)C1=CC=CC=C1 QPJVMBTYPHYUOC-UHFFFAOYSA-N 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 229920005575 poly(amic acid) Polymers 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- NRZZLYODXDSLEK-UHFFFAOYSA-N (6-ethoxy-6-oxohexyl) 3,5-diacetamido-2,4,6-triiodobenzoate Chemical compound CCOC(=O)CCCCCOC(=O)C1=C(I)C(NC(C)=O)=C(I)C(NC(C)=O)=C1I NRZZLYODXDSLEK-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
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- 229940095102 methyl benzoate Drugs 0.000 description 1
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- 238000003856 thermoforming Methods 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
- B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/02—Polyamines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0387—Polyamides or polyimides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
- B29C2035/0827—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using UV radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
- B29C2043/023—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface having a plurality of grooves
- B29C2043/025—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface having a plurality of grooves forming a microstructure, i.e. fine patterning
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
- B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
- B29C2059/023—Microembossing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/52—Heating or cooling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2079/00—Use of polymers having nitrogen, with or without oxygen or carbon only, in the main chain, not provided for in groups B29K2061/00 - B29K2077/00, as moulding material
- B29K2079/08—PI, i.e. polyimides or derivatives thereof
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- Health & Medical Sciences (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Engineering & Computer Science (AREA)
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- Oral & Maxillofacial Surgery (AREA)
- Toxicology (AREA)
- Electromagnetism (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Materials For Photolithography (AREA)
Description
感光性を有する、ガラス転移温度以下での成形が可能な溶剤可溶性ポリイミド樹脂組成物を用いるとともに、モールド離型後であって、熱硬化の前に、紫外線を照射することを特徴とするポリイミドの微細パターン形成方法。
Siなどの基板上に、本発明の溶剤可溶性ポリイミド樹脂組成物を塗布する(図1(a)参照)。塗布法及び塗布膜の厚さは、特に限定されないが、回転塗布法により25μm程度の膜を形成することが好ましい。
その後、凹凸が形成されたモールドを用いた熱インプリント成形によるパターン形成(転写)を行う(図1(b)参照)。すなわち、前工程で得られたポリイミド膜を有する基板を所定温度に加熱した後、凹凸パターンが形成されたモールドを用いて加圧成形する。
インプリント成形後には、ポリイミドとモールドをガラス転移温度以下より低い温度、例えば、60℃まで冷却し、離型する(図1(c)参照)。
離型した後、露光を行う(図1(d)参照)。
最終工程は、熱処理である(図1(e))。
(1)200℃に加熱したホットプレートを用いて20分間加熱
(2)加熱速度20℃/分で室温から200℃まで加熱
(3)加熱速度5℃/分で室温から200℃まで加熱
(4)用いた感光性ポリイミド樹脂組成物のポストエクスポージャーベーク温度(100℃)で一定時間保持して、加熱速度5℃/分で室温から200℃まで加熱
本実施例では、市販の有機溶剤可溶性ポリイミド樹脂組成物(Q-RP-X1149-X,PI R&D Co.,Ltd)を用いた。
本実施例においては、厚み500μm、直径4インチのSi基板を用い、加圧時間を3分としたこと以外は実施例1と同様にして、深さ188nm、線幅150nm,200nm,及び300nmの3種の凹凸パターンを作製したモールドを用いた。
Claims (4)
- ポリイミド膜の表面に微細な凹凸パターンを形成するポリイミドの微細パターン形成方法であって、
感光性を有する、ガラス転移温度以下での成形が可能な溶剤可溶性ポリイミド樹脂組成物からなるポリイミド膜を形成する成膜工程と、
前記ポリイミド膜をガラス転移温度以下の温度で加熱し、凹凸が形成されたモールドを押し当てて加圧成形する熱インプリント工程と、
前記ポリイミド膜と前記モールドを冷却して前記ポリイミド膜から前記モールドを離型させる冷却離型工程と、
前記ポリイミド膜に紫外線を照射して露光を行う露光工程と、
前記ポリイミド膜を加熱して熱硬化させる熱処理工程と、
を含むことを特徴とするポリイミドの微細パターン形成方法。 - 前記熱処理工程では、前記熱硬化を、室温から熱処理温度まで昇温させる途中で前記の溶剤可溶性ポリイミド樹脂組成物のポストエクスポージャーベーク温度に一定時間保持する2段加熱により行うことを特徴とする請求項1に記載の、ポリイミドの微細パターン形成方法。
- 前記微細な凹凸パターンが、矩形断面を有するサブマイクロメートルパターンであることを特徴とする請求項1又は2に記載の、ポリイミドの微細パターン形成方法。
- 前記ポリイミドが、ブロック共重合ポリイミドであることを特徴とする請求項1〜3のいずれか一項に記載の、ポリイミドの微細パターン形成方法。
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JP2013217645 | 2013-10-18 | ||
JP2013217645 | 2013-10-18 | ||
PCT/JP2014/072804 WO2015056487A1 (ja) | 2013-10-18 | 2014-08-29 | インプリント法によるポリイミドの微細パターン形成方法 |
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JPWO2015056487A1 JPWO2015056487A1 (ja) | 2017-03-09 |
JP6192023B2 true JP6192023B2 (ja) | 2017-09-06 |
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US (1) | US10189203B2 (ja) |
JP (1) | JP6192023B2 (ja) |
KR (1) | KR101770809B1 (ja) |
CN (1) | CN105658413B (ja) |
TW (1) | TWI659819B (ja) |
WO (1) | WO2015056487A1 (ja) |
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JP6507061B2 (ja) * | 2015-08-04 | 2019-04-24 | 東芝メモリ株式会社 | 基板処理方法 |
JP6733163B2 (ja) * | 2015-12-03 | 2020-07-29 | 大日本印刷株式会社 | インプリントモールド及びその製造方法、並びにインプリント方法 |
US11104601B2 (en) | 2016-03-17 | 2021-08-31 | Corning Incorporated | Bendable electronic device modules, articles and bonding methods of making the same |
JP6957281B2 (ja) * | 2017-09-12 | 2021-11-02 | キオクシア株式会社 | テンプレートの作製方法、および半導体装置の製造方法 |
US11281094B2 (en) * | 2018-11-15 | 2022-03-22 | Applied Materials, Inc. | Method for via formation by micro-imprinting |
WO2020112740A1 (en) * | 2018-11-29 | 2020-06-04 | Sharklet Technologies, Inc. | Soluble templates and methods of manufacture thereof |
CN109817827B (zh) * | 2019-01-22 | 2021-01-01 | 深圳市华星光电半导体显示技术有限公司 | Oled显示面板的制作设备及制作方法 |
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CN110619818B (zh) * | 2019-08-27 | 2021-04-27 | 武汉华星光电半导体显示技术有限公司 | 一种显示面板及其制作方法 |
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JP2011206938A (ja) * | 2010-03-29 | 2011-10-20 | Kanagawa Acad Of Sci & Technol | 熱インプリント用モールドおよびその製造方法並びにそのモールドを用いた樹脂材の製造方法 |
JP6008628B2 (ja) * | 2011-07-19 | 2016-10-19 | 株式会社トクヤマ | 光硬化性ナノインプリント用組成物を用いたパターンの製造方法 |
JP2013154637A (ja) * | 2012-01-06 | 2013-08-15 | Nippon Shokubai Co Ltd | 樹脂製ナノ構造体の製造方法 |
JP6379458B2 (ja) * | 2012-09-13 | 2018-08-29 | 日立化成株式会社 | パターンを有する樹脂層を製造する方法、及びそれに用いられる樹脂組成物 |
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