JP6166413B1 - Circuit device manufacturing method and circuit device - Google Patents

Circuit device manufacturing method and circuit device Download PDF

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JP6166413B1
JP6166413B1 JP2016068245A JP2016068245A JP6166413B1 JP 6166413 B1 JP6166413 B1 JP 6166413B1 JP 2016068245 A JP2016068245 A JP 2016068245A JP 2016068245 A JP2016068245 A JP 2016068245A JP 6166413 B1 JP6166413 B1 JP 6166413B1
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gate
circuit device
resin
cavity
mold
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JP2017177540A (en
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昌龍 許
昌龍 許
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Keihin Corp
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Keihin Corp
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Priority to JP2016068245A priority Critical patent/JP6166413B1/en
Priority to PCT/JP2017/004931 priority patent/WO2017169173A1/en
Priority to CN201780018585.1A priority patent/CN108778669A/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/26Moulds
    • B29C45/27Sprue channels ; Runner channels or runner nozzles
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56Encapsulations, e.g. encapsulation layers, coatings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

Abstract

【課題】部品点数を低減させ簡易な構造で樹脂の流れを制御でき、回路装置の信頼性を高めることができる技術を提供することを課題とする。【解決手段】下型11と上型12を含んで構成されたトランスファーモールド用の金型10である。下型11と上型12は、互いに型締めされた状態で、溶融した樹脂を成形するキャビティ13と、このキャビティ13へ樹脂を供給するゲート21とを有する金型である。ゲート21は、2つの型が型締めされる分割面14を挟んで両側に形成されている。【効果】ゲートは2つの型が型締めされる分割面を挟んで両側に形成されているので、キャビティの上側及び下側に、樹脂を同時に且つ均等に充填することができる。【選択図】図2An object of the present invention is to provide a technique capable of reducing the number of parts and controlling the flow of resin with a simple structure and improving the reliability of a circuit device. A transfer mold 10 includes a lower mold 11 and an upper mold 12. The lower mold 11 and the upper mold 12 are molds having a cavity 13 for molding a molten resin and a gate 21 for supplying the resin to the cavity 13 while being clamped together. The gates 21 are formed on both sides of the dividing surface 14 on which the two molds are clamped. [Effect] Since the gates are formed on both sides of the dividing surface where the two molds are clamped, the upper and lower sides of the cavity can be filled with resin simultaneously and evenly. [Selection] Figure 2

Description

本発明は、回路装置の基板及び電子部品を樹脂で封止する回路装置の製造方法及び回路装置に関する。
The present invention relates to a substrate and electronic components of the circuit device manufacturing method and circuit arrangement of the circuit device is sealed with resin.

乗用車や自動二輪車に代表される車両には、基板を備える回路装置が搭載されている。回路装置では、基板への水等の浸入を防ぐために、基板の周囲を樹脂で中実になるように覆う技術が実用化されている。このような技術において、加熱ポットから溶融した樹脂を基板が配置されたキャビティに充填する、トランスファーモールド用の金型が知られている(例えば、特許文献1(図2)参照。)。
A vehicle represented by a passenger car or a motorcycle is equipped with a circuit device including a substrate. In the circuit device, in order to prevent water and the like from entering the substrate, a technique for covering the periphery of the substrate so as to be solid with resin has been put into practical use. In such a technique, a mold for transfer molding is known in which a resin melted from a heating pot is filled in a cavity in which a substrate is arranged (see, for example, Patent Document 1 (FIG. 2)).

特許文献1に開示されている技術の基本原理を図4に基づいて説明する。
図4に示すように、下型101及び上型102からなるトランスファーモールド用金型100のキャビティ103に、電子部品104を実装した基板105が配置されている。基板105は、下型102に配置されたヒートシンク106にリードフレーム107及び支持ピン108を介して支持されており、基板105の下方に電子部品104が配置されている。
The basic principle of the technique disclosed in Patent Document 1 will be described with reference to FIG.
As shown in FIG. 4, a substrate 105 on which an electronic component 104 is mounted is disposed in a cavity 103 of a transfer mold 100 made up of a lower mold 101 and an upper mold 102. The substrate 105 is supported by a heat sink 106 disposed on the lower mold 102 via a lead frame 107 and support pins 108, and an electronic component 104 is disposed below the substrate 105.

溶融した樹脂をゲート108からキャビティ103内に注入することで、キャビティ103に樹脂が充填される。ゲート108から流入した溶融樹脂は、基板105の下方と上方に分かれて流動する。   By injecting molten resin into the cavity 103 from the gate 108, the cavity 103 is filled with resin. The molten resin flowing from the gate 108 flows separately below and above the substrate 105.

回路装置の信頼性を高めるには、樹脂による封止品質の向上が求められる。これには、ゲート108から流入した樹脂が、基板105の下方と上方を均等に流れてガスベント(分割面)109の近傍で合流することで、キャビティ103内の空気がガスベント(分割面)109から抜けることが好ましい。   In order to increase the reliability of the circuit device, it is required to improve the sealing quality with resin. For this purpose, the resin flowing in from the gate 108 flows evenly below and above the substrate 105 and joins in the vicinity of the gas vent (divided surface) 109, so that the air in the cavity 103 flows from the gas vent (divided surface) 109. It is preferable to exit.

溶融樹脂は広い流路の方を流れ易いため、特許文献1の技術は、基板105の下方と上方に分かれた樹脂を均等に流すために、広い流路である基板105の上側に障害部材110を設けることで樹脂の流れを制御している。
しかし、基板105に障害部材110を設けることで不要な部品点数が多くなる上、回路装置が大型になる。そのため、部品点数を低減させ簡易な構造で樹脂の流れを制御でき、回路装置の信頼性を高めることができる技術が求められている。
Since the molten resin tends to flow through the wide flow path, the technique of Patent Document 1 uses the obstruction member 110 on the upper side of the substrate 105, which is a wide flow path, in order to allow the resin divided below and above the substrate 105 to flow evenly. The flow of resin is controlled by providing.
However, providing the obstruction member 110 on the substrate 105 increases the number of unnecessary parts and increases the size of the circuit device. Therefore, there is a demand for a technique that can reduce the number of components, control the resin flow with a simple structure, and increase the reliability of the circuit device.

特開2011−199146号公報JP 2011-1991146 A

本発明は、部品点数を低減させ簡易な構造で樹脂の流れを制御でき、回路装置の信頼性を高めることができる技術を提供することを課題とする。   An object of the present invention is to provide a technique capable of reducing the number of parts, controlling the flow of resin with a simple structure, and improving the reliability of a circuit device.

請求項1に係る発明は、2つの型を含んで構成され、これらの2つの型、互いに型締めされた状態で、溶融した樹脂を成形するキャビティと、このキャビティへ樹脂を供給するゲートとを有する金型を用いた回路装置の製造方法であって、ゲートは、2つの型が型締めされる分割面を挟んで両側に形成し、2つの型におけるキャビティを挟んでゲートの反対側にのみ形成された基板挟持部が、キャビティに配置されて両面にそれぞれ複数の電子部品が実装された基板の端部を挟持するように、2つの型を互いに型締めし、ゲートからキャビティへ樹脂を供給して、基板と複数の電子部品とを封止することを特徴とする。
The inventions according to claim 1, is configured to include two types, these two types, in a state of being mold clamped together, a gate supplied with a cavity for molding the molten resin, the resin to the cavity a method of manufacturing a circuit device using a mold having the door, gate, formed on both sides of the dividing plane of the two types are clamping, opposite side of the gate across the cavity in the two types The two molds are clamped together and the resin from the gate to the cavity so that the substrate sandwiching part formed only on the substrate is placed in the cavity and sandwiches the end of the board on which a plurality of electronic components are mounted on both sides. And the substrate and the plurality of electronic components are sealed .

請求項2に係る発明では、ゲートは、分割面を挟んで面対称に形成されていることを特徴とする。   The invention according to claim 2 is characterized in that the gate is formed symmetrically with respect to the dividing surface.

請求項3に係る発明は金型内に形成され、ゲートに至る流路を、樹脂の流れに沿って上流部、下流部と区分したときに、上流部は、2つの型の一方のみに形成されるとともに、分割面に露出していることを特徴とする。
Inventions is according to claim 3, formed in the mold, the flow path leading to the gate, the upstream portion along the flow of resin, when classified with the downstream portion, the upstream portion, only one of the two types And is exposed on the dividing surface.

請求項4に係る発明は金型内に形成され、ゲートに至る流路を、樹脂の流れに沿って上流部、下流部と区分したときに、下流部がゲートにつながっているときに、下流部は、流路の上面が流路の下面に平行であることを特徴とする。
Inventions is related to claim 4, being formed in the mold, the flow path leading to the gate, the upstream portion along the flow of resin, when classified with the downstream portion, when the downstream portion is connected to the gate The downstream portion is characterized in that the upper surface of the channel is parallel to the lower surface of the channel.

請求項5に係る発明は請求項1記載の回路装置の製造方法により製造された回路装置であって、分割面の位置にバリが残っていることを特徴とする。
Inventions described in claim 5 is a circuit device manufactured by the manufacturing method of the circuit device according to claim 1, characterized in that there remain burrs in the position of the dividing surface.

請求項1に係る発明では、2つの型を含んで構成され、これらの2つの型、互いに型締めされた状態で、溶融した樹脂を成形するキャビティと、このキャビティへ樹脂を供給するゲートとを有する金型を用いた回路装置の製造方法であって、ゲートは、2つの型が型締めされる分割面を挟んで両側に形成し、2つの型におけるキャビティを挟んでゲートの反対側にのみ形成された基板挟持部が、キャビティに配置されて両面にそれぞれ複数の電子部品が実装された基板の端部を挟持するように、2つの型を互いに型締めし、ゲートからキャビティへ樹脂を供給して、基板と複数の電子部品とを封止する。ゲートは2つの型が型締めされる分割面を挟んで両側に形成されているので、キャビティの上側及び下側に、樹脂を同時に且つ均等に充填することができる。
The invention according to claim 1 is configured to include two molds, and these two molds are clamped together, and a cavity for molding the molten resin, and a gate for supplying the resin to the cavity a method of manufacturing a circuit device using a mold having a gate, formed on both sides of the dividing plane of the two types are mold clamping, on the opposite side of the gate across the cavity in the two types The two molds are clamped together so that the substrate sandwiching portion formed only in the cavity is sandwiched between the ends of the substrate on which the plurality of electronic components are mounted on both sides, and the resin is fed from the gate to the cavity. Then, the substrate and the plurality of electronic components are sealed. Since the gate is formed on both sides across the split surface where the two molds are clamped, the upper and lower sides of the cavity can be filled with resin simultaneously and evenly.

さらに、ゲートの開口サイズを調整することで、基板の上側及び下側への溶融樹脂の流入量を容易に調整できるので、キャビティ内にゲートの延び方向に沿って基板を配置しても、基板の上側及び下側に樹脂を同時に且つ均等に充填することができる。電子部品が設けられた基板のように、複雑な形状物をキャビティ内に配置しても、ゲートの開口サイズを調整することで、複雑な形状部の上側及び下側にバランス良く樹脂を充填することができる。このように、基板に不要な部品を設けることなく、部品点数を低減させ簡易な構造で樹脂の流れを制御でき、回路装置の信頼性を高めることができる技術を提供することができる。   Furthermore, since the amount of molten resin flowing into the upper and lower sides of the substrate can be easily adjusted by adjusting the opening size of the gate, even if the substrate is arranged in the cavity along the extending direction of the gate, The upper and lower sides of the resin can be filled simultaneously and evenly. Even if a complex shaped object is placed in the cavity, such as a substrate with electronic components, the upper and lower sides of the complicated shaped part are filled with resin in a balanced manner by adjusting the opening size of the gate. be able to. As described above, it is possible to provide a technique capable of reducing the number of components and controlling the flow of the resin with a simple structure without increasing unnecessary components on the substrate, and improving the reliability of the circuit device.

請求項2に係る発明では、ゲートは、分割面を挟んで面対称に形成されているので、キャビティの上側及び下側にバランス良く樹脂を充填することができ、ガスベント(分割面)への空気の排出を円滑に行うことができる。   In the invention according to claim 2, since the gate is formed symmetrically with respect to the dividing surface, the upper and lower sides of the cavity can be filled with resin in a well-balanced manner, and the air to the gas vent (dividing surface) Can be discharged smoothly.

請求項3に係る発明では、金型内に形成され、ゲートに至る流路を、樹脂の流れに沿って上流部、下流部と区分したときに、上流部は、2つの型の一方のみに形成されるとともに、分割面に露出しているので、一方の型の分割面のみを加工するだけで流路の上流部を形成することができる。
In the invention according to claim 3, when the flow path formed in the mold and reaching the gate is divided into the upstream portion and the downstream portion along the flow of the resin, the upstream portion is only one of the two molds. Since it is formed and exposed to the dividing surface, the upstream portion of the flow path can be formed by processing only one type of dividing surface.

請求項4に係る発明では、金型内に形成され、ゲートに至る流路を、樹脂の流れに沿って上流部、下流部と区分したときに、下流部がゲートにつながっているときに、下流部は、流路の上面が流路の下面に平行であるので、ゲートの先端にポケット部を形成でき、このポケット部により、溶融樹脂の乱流を緩和でき、ボイドをより低減することができる。
In the invention according to claim 4, when the flow path leading to the gate formed in the mold is divided from the upstream portion and the downstream portion along the flow of the resin, when the downstream portion is connected to the gate, In the downstream part , since the upper surface of the flow path is parallel to the lower surface of the flow path, a pocket portion can be formed at the tip of the gate, and this pocket portion can alleviate the turbulent flow of the molten resin and further reduce voids. it can.

請求項5に係る発明では、請求項1記載の回路装置の製造方法により製造された回路装置であって、分割面の位置にバリが残っているので、回路装置の製造方法により製造された回路装置であることを判別することができる。
The invention according to claim 5 is a circuit device manufactured by the method for manufacturing a circuit device according to claim 1, wherein burrs remain at the position of the dividing surface, so that the circuit manufactured by the method for manufacturing a circuit device is provided. it can be determined that a device.

本発明の実施例における金型の断面図である。It is sectional drawing of the metal mold | die in the Example of this invention. 図1の要部拡大図である。It is a principal part enlarged view of FIG. 比較例の金型と実施例の金型の作用図及び回路装置の部分断面図である。It is an operation | movement figure of the metal mold | die of a comparative example, and the metal mold | die of an Example, and the fragmentary sectional view of a circuit apparatus. 従来技術の基本構成を説明する図である。It is a figure explaining the basic composition of a prior art.

本発明の実施の形態を添付図に基づいて以下に説明する。   Embodiments of the present invention will be described below with reference to the accompanying drawings.

まず、本発明の実施例を図面に基づいて説明する。
図1(a)に示すように、トランスファーモールド用の金型10は、固定型としての下型11と、可動型としての上型12の2つの型を含んで構成されている。これらの2つの下型11及び上型12は、互いに型締めされた状態で、溶融した樹脂を成形するキャビティ13と、このキャビティ13へ溶融樹脂を供給するゲート21と、キャビティ13に配置される基板41の端部を挟持する基板挟持部31を有する。
First, an embodiment of the present invention will be described with reference to the drawings.
As shown in FIG. 1 (a), a transfer mold 10 includes a lower mold 11 as a fixed mold and an upper mold 12 as a movable mold. The two lower molds 11 and the upper mold 12 are arranged in a cavity 13 for molding a molten resin, a gate 21 for supplying the molten resin to the cavity 13, and the cavity 13 while being clamped to each other. A substrate clamping portion 31 that clamps the end portion of the substrate 41 is provided.

キャビティ13は、回路装置40(図3(c)参照)の樹脂部43の外形形状を呈している。なお、実施例では、樹脂部43を略直方体とし、キャビティ13の形状を断面視で矩形としたがこれに限定されず、樹脂部43の形状は角部を円弧状に形成したり、取付用のフランジを形成する等、樹脂部43の形状に応じてキャビティ13の形状を適宜変更しても差し支えない。   The cavity 13 has the outer shape of the resin portion 43 of the circuit device 40 (see FIG. 3C). In the embodiment, the resin portion 43 is a substantially rectangular parallelepiped, and the shape of the cavity 13 is rectangular in cross-sectional view. However, the shape is not limited to this, and the shape of the resin portion 43 is formed by forming a corner in an arc shape or for mounting. The shape of the cavity 13 may be appropriately changed according to the shape of the resin portion 43, such as forming a flange.

基板挟持部31は、下型11と上型12が型締めされ接触する分割面14の一部を窪ませることで形成されている。基板挟持部31は、キャビティ13を挟んでゲート21の反対側に配置されている。型締めされた際の下型11と上型12との間、すなわち分割面14にガスベントが形成されている。   The substrate clamping unit 31 is formed by recessing a part of the dividing surface 14 where the lower mold 11 and the upper mold 12 are clamped and contacted. The substrate clamping unit 31 is disposed on the opposite side of the gate 21 with the cavity 13 interposed therebetween. A gas vent is formed between the lower mold 11 and the upper mold 12 when the mold is clamped, that is, on the dividing surface 14.

基板41の上面41a及び下面41bには、電子部品42が実装されている。基板41は平板状であり、断面視にて分割面14に沿って配置されている。基板41のうち基板挟持部31の反対側の端部は、ゲート21の前方に位置している。   Electronic components 42 are mounted on the upper surface 41 a and the lower surface 41 b of the substrate 41. The substrate 41 has a flat plate shape and is disposed along the dividing surface 14 in a sectional view. An end of the substrate 41 opposite to the substrate clamping unit 31 is located in front of the gate 21.

図1(b)に示すように、ゲート21は、分割面14を挟んで両側に形成されており、ゲート21の正面視にて矩形状に形成されている。ゲート21の幅方向端部22は、キャビティ13の幅方向端部15から離れている。   As shown in FIG. 1B, the gates 21 are formed on both sides of the dividing surface 14 and are formed in a rectangular shape when the gate 21 is viewed from the front. The width direction end 22 of the gate 21 is separated from the width direction end 15 of the cavity 13.

図2に示すように、ゲート21は、分割面14を挟んで両側に形成されており、分割面14より上側のゲート上部21aと、分割面14より下側のゲート下部21bとを有する。ゲート上部21aの上面を構成するゲート天井面23aは、ゲート21の開口に向かって下方に傾斜しており、ゲート天井面23aと分割面14とのなす角はθ1である。   As shown in FIG. 2, the gate 21 is formed on both sides of the dividing surface 14, and has a gate upper portion 21 a above the dividing surface 14 and a gate lower portion 21 b below the dividing surface 14. The gate ceiling surface 23a constituting the upper surface of the gate upper portion 21a is inclined downward toward the opening of the gate 21, and the angle formed by the gate ceiling surface 23a and the dividing surface 14 is θ1.

ゲート下部21bの下面を構成するゲート底面23bは、ゲート21の開口に向かって上方に傾斜しており、ゲート底面23bと分割面のなす角はθ2である。ゲート21は、分割面14を挟んで面対称に形成されており、角θ1は角θ2に等しい。このため、キャビティ13の上側及び下側にバランス良く樹脂を充填することができ、ガスベント(分割面)14への空気の排出を円滑に行うことができる。   The gate bottom surface 23b constituting the lower surface of the gate lower portion 21b is inclined upward toward the opening of the gate 21, and the angle formed between the gate bottom surface 23b and the dividing surface is θ2. The gate 21 is formed symmetrically with respect to the dividing surface 14, and the angle θ1 is equal to the angle θ2. For this reason, resin can be filled with good balance on the upper side and the lower side of the cavity 13, and air can be smoothly discharged to the gas vent (split surface) 14.

なお、実施例では、ゲート21は、分割面14を挟んで面対称に形成したが、これに限定されず、ゲート上部21aの開口の流路面積とゲート下部21bの開口の流路面積を異なるように設定しても差し支えない。この場合、ゲート21の開口サイズを調整することで、基板41の上側及び下側への溶融樹脂の流入量を容易に調整できるので、キャビティ13内にゲート21の延び方向に沿って基板41を配置しても、基板41の上側及び下側に樹脂を同時に且つ均等に充填することができる。   In the embodiment, the gate 21 is formed symmetrically with the dividing surface 14 in between. However, the present invention is not limited to this, and the flow area of the opening of the gate upper portion 21a is different from the flow area of the opening of the gate lower portion 21b. It can be set as such. In this case, by adjusting the opening size of the gate 21, the amount of molten resin flowing into the upper side and the lower side of the substrate 41 can be easily adjusted, so that the substrate 41 is placed in the cavity 13 along the extending direction of the gate 21. Even if it arrange | positions, resin can be filled into the upper side and lower side of the board | substrate 41 simultaneously and equally.

加熱ポット(不図示)からゲート21に至る溶融樹脂の流路24の上流部25は、下型11のみに形成されるとともに、分割面14に露出している。このため、下型11の分割面14のみを加工するだけで流路24の上流部25を形成することができる。
The upstream portion 25 of the molten resin flow path 24 from the heating pot (not shown) to the gate 21 is formed only in the lower mold 11 and exposed to the dividing surface 14. For this reason, the upstream portion 25 of the flow path 24 can be formed by processing only the dividing surface 14 of the lower mold 11.

また、ゲート21の直前に位置する流路24の下流部26は、流路の上面26aが流路の下面26bに平行である。このため、溶融樹脂の流れを安定させボイドを低減することができる。さらに、ゲート21の直前の位置で流路の上面26aを流路の下面26bに平行とすることで、ゲート21の先端にポケット部27を形成でき、このポケット部27により、溶融樹脂の乱流を緩和でき、ボイドをより低減することができる。   Further, in the downstream portion 26 of the flow channel 24 located immediately before the gate 21, the upper surface 26a of the flow channel is parallel to the lower surface 26b of the flow channel. For this reason, the flow of a molten resin can be stabilized and a void can be reduced. Further, by making the upper surface 26a of the flow path parallel to the lower surface 26b of the flow path at a position immediately before the gate 21, a pocket portion 27 can be formed at the tip of the gate 21, and the turbulent flow of the molten resin by the pocket portion 27. Can be relaxed and voids can be further reduced.

次に、以上に述べた金型10の作用を比較例と較べて説明する。
図3(a)は比較例における金型200の断面図であり、金型200は下型201と上型202の分割面203に形成した基板保持部204に、電子部品205を備えた基板206を挟持している。
Next, the effect | action of the metal mold | die 10 described above is demonstrated compared with a comparative example.
FIG. 3A is a cross-sectional view of a mold 200 in a comparative example. The mold 200 is a substrate 206 provided with an electronic component 205 on a substrate holding portion 204 formed on a divided surface 203 of a lower mold 201 and an upper mold 202. Is pinched.

ゲート209は、下型201のみに形成されており、ゲート209の上面は分割面203で構成され、ゲート209の下面207はゲート209の開口に向かって上方に傾斜している。加熱ポットからの溶融樹脂は、傾斜した下面207によって矢印(1)のように基板206の上側へ多く流れ、矢印(2)のように基板206の下側へ少なく流れる。このため、キャビティ208内の空気がガスベントとしての分割面203から効率よく排出できず、ボイドが発生し易くなる。結果、樹脂による基板及び電子部品の封止が良好になり難い。
The gate 209 is formed only in the lower mold 201, the upper surface of the gate 209 is constituted by the dividing surface 203, and the lower surface 207 of the gate 209 is inclined upward toward the opening of the gate 209. A large amount of molten resin from the heating pot flows to the upper side of the substrate 206 as indicated by the arrow (1) by the inclined lower surface 207, and flows less to the lower side of the substrate 206 as indicated by the arrow (2). For this reason, the air in the cavity 208 cannot be efficiently discharged from the dividing surface 203 as a gas vent, and voids are easily generated. As a result, it is difficult for the substrate and the electronic component to be well sealed with the resin.

図3(b)は実施例における金型10の断面図であり、ゲート21が分割面14を挟んで両側に形成されているので、加熱ポットからの溶融樹脂が、矢印(3)(4)のように、基板41の上側と基板41の下側に均等に流れる。そして、溶融樹脂は基板挟持部31の近傍で合流し、キャビティ13内の空気がガスベントとしての分割面14から良好に排出される。結果、樹脂による基板41及び電子部品42の封止を良好に行うことができる。 FIG. 3B is a cross-sectional view of the mold 10 in the embodiment. Since the gates 21 are formed on both sides of the dividing surface 14, the molten resin from the heating pot is indicated by the arrows (3) and (4). As described above, the liquid flows evenly on the upper side of the substrate 41 and on the lower side of the substrate 41. Then, the molten resin joins in the vicinity of the substrate sandwiching portion 31, and the air in the cavity 13 is discharged well from the dividing surface 14 as a gas vent. As a result, the substrate 41 and the electronic component 42 can be favorably sealed with resin.

図3(c)は実施例における回路装置40であり、回路装置40は、基板41、電子部品42及びこれらを封止する樹脂部43から構成されている。樹脂部40には、ゲート21の位置にゲート跡44があり、分割面14の位置にバリ45が残っている。なお、バリ45は、除去された後のバリ跡であってもよい。ゲート21は分割面14を挟んで形成されているので、ゲート跡44の上下中間位置にバリ45が形成されている。これにより、本発明の金型10によって成形された回路装置40であることを判別することを容易にできる。   FIG. 3C illustrates a circuit device 40 according to the embodiment, and the circuit device 40 includes a substrate 41, an electronic component 42, and a resin portion 43 that seals them. In the resin portion 40, there is a gate mark 44 at the position of the gate 21 and a burr 45 remains at the position of the dividing surface 14. The burrs 45 may be burrs after being removed. Since the gate 21 is formed with the dividing surface 14 in between, a burr 45 is formed at an upper and lower intermediate position of the gate mark 44. Thereby, it can be easily determined that the circuit device 40 is molded by the mold 10 of the present invention.

なお、大きさの異なる電子部品42が複数設けられた基板41のように、複雑な形状物をキャビティ13内に配置しても、ゲート21の開口サイズを調整することで、複雑な形状部の上側及び下側にバランス良く樹脂を充填することができる。このように、従来技術のように基板41に不要な部品を設けることなく、本発明では部品点数を低減させ簡易な構造で樹脂の流れを制御でき、回路装置10の信頼性を高めることができる。   Even if a complicated shape is arranged in the cavity 13, such as the substrate 41 provided with a plurality of electronic components 42 of different sizes, the opening of the gate 21 can be adjusted to adjust the shape of the complicated shape portion. Resin can be filled in a balanced manner on the upper and lower sides. Thus, without providing unnecessary parts on the substrate 41 as in the prior art, in the present invention, the number of parts can be reduced, the flow of resin can be controlled with a simple structure, and the reliability of the circuit device 10 can be improved. .

尚、本発明は上記実施形態に限定されるものではなく、その要旨を逸脱しない範囲で種々の設計変更が可能である。   In addition, this invention is not limited to the said embodiment, A various design change is possible in the range which does not deviate from the summary.

本発明は、基板及び電子部品を樹脂で封止するトランスファーモールド用の金型に好適である。   The present invention is suitable for transfer molds for sealing substrates and electronic components with resin.

10...金型、11...下型、12...上型、13...キャビティ、14...分割面(ガスベント)、21...ゲート、24...流路、25...上流部、26...下流部、40...回路装置、41...基板、45...バリ(バリ跡)。   10 ... Mold, 11 ... Lower mold, 12 ... Upper mold, 13 ... Cavity, 14 ... Dividing surface (gas vent), 21 ... Gate, 24 ... Flow path, 25 ... upstream part, 26 ... downstream part, 40 ... circuit device, 41 ... substrate, 45 ... burr (burr trace).

Claims (5)

2つの型を含んで構成され、
これらの2つの型、互いに型締めされた状態で、溶融した樹脂を成形するキャビティと、このキャビティへ樹脂を供給するゲートとを有する金型を用いた回路装置の製造方法であって、
前記ゲートは、前記2つの型が型締めされる分割面を挟んで両側に形成し、
前記2つの型における前記キャビティを挟んで前記ゲートの反対側にのみ形成された基板挟持部が、前記キャビティに配置されて両面にそれぞれ複数の電子部品が実装された基板の端部を挟持するように、前記2つの型を互いに型締めし、
前記ゲートから前記キャビティへ前記樹脂を供給して、前記基板と複数の電子部品とを封止する、
ことを特徴とする回路装置の製造方法。
Composed of two molds,
A circuit device manufacturing method using a mold having a cavity for molding molten resin and a gate for supplying resin to the cavity in a state where these two molds are clamped together,
The gate is formed on both sides across a split surface on which the two molds are clamped ,
A substrate holding part formed only on the opposite side of the gate across the cavity in the two molds is arranged in the cavity so as to hold the end of the substrate on which a plurality of electronic components are mounted on both sides. And clamping the two molds together,
Supplying the resin from the gate to the cavity to seal the substrate and a plurality of electronic components;
A method for manufacturing a circuit device.
前記ゲートは、前記分割面を挟んで面対称に形成されていることを特徴とする請求項1記載の回路装置の製造方法。 2. The method for manufacturing a circuit device according to claim 1, wherein the gate is formed symmetrically with respect to the dividing surface . 前記金型内に形成され、前記ゲートに至る流路を、前記樹脂の流れに沿って上流部、下流部と区分したときに、前記上流部は、前記2つの型の一方のみに形成されるとともに、前記分割面に露出していることを特徴とする請求項1又は請求項2記載の回路装置の製造方法。 When the flow path formed in the mold and leading to the gate is divided into the upstream portion and the downstream portion along the flow of the resin, the upstream portion is formed only in one of the two molds. The circuit device manufacturing method according to claim 1, wherein the circuit device is exposed to the dividing surface . 前記金型内に形成され、前記ゲートに至る流路を、前記樹脂の流れに沿って上流部、下流部と区分したときに、前記下流部が前記ゲートにつながっているときに、前記下流部は、前記流路の上面が前記流路の下面に平行であることを特徴とする請求項1〜3いずれか1項記載の回路装置の製造方法。 When the flow path leading to the gate formed in the mold is divided into an upstream portion and a downstream portion along the flow of the resin, the downstream portion is connected to the gate. The method for manufacturing a circuit device according to claim 1, wherein an upper surface of the flow path is parallel to a lower surface of the flow path . 請求項1記載の回路装置の製造方法により製造された回路装置であって、
前記分割面の位置にバリが残っていることを特徴とする回路装置。
A circuit device manufactured by the method for manufacturing a circuit device according to claim 1 ,
A circuit device, wherein burrs remain at the position of the dividing surface.
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