JP6147351B2 - Materials for electrical contact members - Google Patents
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- JP6147351B2 JP6147351B2 JP2015535984A JP2015535984A JP6147351B2 JP 6147351 B2 JP6147351 B2 JP 6147351B2 JP 2015535984 A JP2015535984 A JP 2015535984A JP 2015535984 A JP2015535984 A JP 2015535984A JP 6147351 B2 JP6147351 B2 JP 6147351B2
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- 239000000463 material Substances 0.000 title claims description 40
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 76
- 229910052751 metal Inorganic materials 0.000 claims description 27
- 239000002184 metal Substances 0.000 claims description 27
- 229910052759 nickel Inorganic materials 0.000 claims description 25
- 239000010949 copper Substances 0.000 claims description 19
- 238000004519 manufacturing process Methods 0.000 claims description 19
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 15
- 229910052710 silicon Inorganic materials 0.000 claims description 15
- 239000010703 silicon Substances 0.000 claims description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 14
- 239000011651 chromium Substances 0.000 claims description 14
- 229910017052 cobalt Inorganic materials 0.000 claims description 14
- 239000010941 cobalt Substances 0.000 claims description 14
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 14
- 229910052802 copper Inorganic materials 0.000 claims description 14
- 239000011777 magnesium Substances 0.000 claims description 14
- 239000011572 manganese Substances 0.000 claims description 14
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 11
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 claims description 10
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 8
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 8
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 8
- 229910045601 alloy Inorganic materials 0.000 claims description 8
- 239000000956 alloy Substances 0.000 claims description 8
- 229910052782 aluminium Inorganic materials 0.000 claims description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052698 phosphorus Inorganic materials 0.000 claims description 8
- 239000011574 phosphorus Substances 0.000 claims description 8
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 7
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 claims description 7
- 229910052804 chromium Inorganic materials 0.000 claims description 7
- 229910052749 magnesium Inorganic materials 0.000 claims description 7
- 229910052748 manganese Inorganic materials 0.000 claims description 7
- VSZWPYCFIRKVQL-UHFFFAOYSA-N selanylidenegallium;selenium Chemical compound [Se].[Se]=[Ga].[Se]=[Ga] VSZWPYCFIRKVQL-UHFFFAOYSA-N 0.000 claims description 7
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 6
- 229910052785 arsenic Inorganic materials 0.000 claims description 6
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 claims description 6
- 229910052796 boron Inorganic materials 0.000 claims description 6
- QCEUXSAXTBNJGO-UHFFFAOYSA-N [Ag].[Sn] Chemical compound [Ag].[Sn] QCEUXSAXTBNJGO-UHFFFAOYSA-N 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 239000012535 impurity Substances 0.000 claims description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- 229910001369 Brass Inorganic materials 0.000 description 3
- 238000005275 alloying Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000010951 brass Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 229940123973 Oxygen scavenger Drugs 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 238000004881 precipitation hardening Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000006104 solid solution Substances 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 229910002535 CuZn Inorganic materials 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910007637 SnAg Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004870 electrical engineering Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- VAKIVKMUBMZANL-UHFFFAOYSA-N iron phosphide Chemical compound P.[Fe].[Fe].[Fe] VAKIVKMUBMZANL-UHFFFAOYSA-N 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/04—Alloys based on copper with zinc as the next major constituent
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Contacts (AREA)
- Conductive Materials (AREA)
Description
本発明は、請求項1の前提部の特徴に従う電気コンタクト部材の製造のための金属ストリップ用の材料、並びに請求項5の特徴に従う電気コンタクト部材の製造のための、このような電導性金属ストリップ用の材料の使用に関する。 The invention relates to a material for a metal strip for the manufacture of an electrical contact member according to the features of the preamble of claim 1 as well as such an electrically conductive metal strip for the manufacture of an electrical contact member according to the feature of claim 5 Related to the use of materials.
コンタクト部材は、電気工学並びに電子工学の分野において様々な可能な用途がある。機械的に互いに接合可能で並びに分離可能な複合体要素として、それの主たる課題は、電導性コンタクトの製造にある。電流回路の接続の他に、電子構成部材との直接的な結合も実現可能である。 Contact members have various possible applications in the fields of electrical engineering and electronics. As a composite element that can be mechanically joined to each other as well as separable, its main challenge is in the production of conductive contacts. In addition to the connection of the current circuit, a direct coupling with the electronic component is also possible.
各々の形態は、国ごとの規格ばかりでなく、使用分野において満たすべき要件に合わせられる。それ故、特に手で外すことができるプラグコンタクトの形態では、機械的負荷能力に対する高められた要求も課せられる。 Each form is tailored to the requirements to be met in the field of use as well as national standards. Therefore, particularly in the form of plug contacts that can be removed by hand, there is also an increased demand for mechanical load capacity.
価値の高いプラグコンタクトは、安定した接触抵抗を示し、この際、低い境界抵抗の維持が重要である。接触抵抗の変化は、大概は、腐食または汚染層の電気的破壊の原因となる。このようなコンタクト部材のためにできるたけ維持が可能な接触表面を得るために、これらは、しばしば、スズもしくはクロムコーティングから銀もしくは金コーティングに至るまでのコーティングを有する。 A high-value plug contact exhibits a stable contact resistance, and it is important to maintain a low boundary resistance. Changes in contact resistance generally cause corrosion or electrical breakdown of the contaminated layer. In order to obtain a contact surface that can be maintained as much as possible for such contact members, they often have coatings ranging from tin or chrome coatings to silver or gold coatings.
このようなプラグコンタクトの製造のためには、大概は、銅合金でできた金属ストリップが使用され、これから、個々の形態が打ち抜かれる。合金化パートナーである亜鉛またスズの使用量に応じて、これは、黄銅または延性のある青銅、例えばCuSn4乃至CuSn8のいずれかである。後者の材料は、中程度の強度において優れた曲げ性を有する。しかし、ここでこの材料は固溶体−及び冷間硬化された材料であるので、緩和に対するそれの耐性は比較的低い。加えて、曲げ性は、>R700(Rm≧700MPa、DIN EN 1173/95)の高い強度状態(Festigkeitszustaenden)では明らかに低下し、これは、より強い亀裂形成を伴うより大きな曲げ半径として現れる。 For the manufacture of such plug contacts, metal strips made of copper alloys are generally used, from which individual forms are stamped. Depending on the amount of alloying partner zinc or tin used, this is either brass or ductile bronze, for example CuSn4 to CuSn8. The latter material has excellent bendability at moderate strength. However, since this material is now a solid solution- and cold-cured material, its resistance to relaxation is relatively low. In addition, bendability is clearly reduced in the high strength state (Festigkeitszustaenden)> R700 (R m ≧ 700 MPa, DIN EN 1173/95), which appears as a larger bend radius with stronger crack formation.
電気コンタクト部材は大量生産品であるため、各々の原材料の原価は非常に重要である。決定的なのは、合金内での銅の各々の含有率である。それ故、黄銅中の高い亜鉛の割合の故に、銅の割合が高い銅合金は、それに対し約20%高い価格を有する。 Since the electrical contact members are mass-produced products, the cost of each raw material is very important. What is decisive is the content of each of the copper in the alloy. Therefore, because of the high zinc percentage in brass, copper alloys with a high copper percentage have a price about 20% higher than that.
特開2008−208466号公報(特許文献1)からは、亜鉛(Zn)の割合が、重量%で23%〜28%である、プラグコンタクトのための銅合金が知られている。他の以下の成分が少なくとも0.01%で存在し、その際、ケイ素(Si)は最大で3%に達し、他方でニッケル(Ni)は、5%までの割合を占める。 JP-A-2008-208466 (Patent Document 1) discloses a copper alloy for plug contacts in which the ratio of zinc (Zn) is 23% to 28% by weight. The following other components are present in at least 0.01%, with silicon (Si) reaching a maximum of 3%, while nickel (Ni) accounting for up to 5%.
特開2009−013499号公報(特許文献2)も同様に、亜鉛(Zn)の割合が重量%で20%〜41%の、プラグコンタクトのための銅材料を開示している。この際、ニッケル(Ni)の割合は、0.1%〜5.0%に達し、他方で錫(Sn)の割合は0.5%〜5.0%である。 Similarly, Japanese Unexamined Patent Application Publication No. 2009-013499 (Patent Document 2) discloses a copper material for plug contacts in which the proportion of zinc (Zn) is 20% to 41% by weight. At this time, the proportion of nickel (Ni) reaches 0.1% to 5.0%, while the proportion of tin (Sn) is 0.5% to 5.0%.
DE10308779B3(特許文献3)は、鉛不含の銅合金並びにそれの使用を記載している。重量%でのそれの構成成分は、銅(Cu)に関しては少なくとも60%から最大で70%であるため、かなり多い。それに対して、0.01%〜0.5%のニッケル(Ni)の割合が提案されており、他方、錫(Sn)の割合は0.5%〜3.5%で変動する。ケイ素(Si)の可能な割合は、0.01%〜0.5%に達することができる。 DE 103088779 B3 describes a lead-free copper alloy and its use. Its constituents in% by weight are quite abundant since it is at least 60% up to 70% for copper (Cu). In contrast, a proportion of nickel (Ni) of 0.01% to 0.5% has been proposed, while the proportion of tin (Sn) varies from 0.5% to 3.5%. The possible proportion of silicon (Si) can reach 0.01% to 0.5%.
特に、銅の高い割合は、原材料のためのかなり高い原価を伴う。更に、他の合金化パートナーの割合も、向上された材料特性に関して、なおも改善の余地を提供する。 In particular, a high proportion of copper involves a fairly high cost for raw materials. Furthermore, the proportion of other alloying partners still offers room for improvement with regard to improved material properties.
それ故、本発明は、電気コンタクト部材の製造のための金属ストリップ用材料を、それの個々の合金化パートナーの低廉な割合にもかかわらず、電気コンタクト部材の製造のための電導性材料用に使用するために必要な性質を満たすように改善するという課題に基づくものである。 Therefore, the present invention provides a metal strip material for the manufacture of electrical contact members for conductive materials for the manufacture of electrical contact members, despite the low proportion of its individual alloying partners. It is based on the problem of improving to meet the properties required for use.
上記課題の解決策は、本発明に従い、請求項1の特徴に従う電気コンタクト部材の製造のための金属ストリップ用の材料にある。 The solution to the above problem lies in the material for a metal strip for the manufacture of an electrical contact member according to the features of claim 1 according to the invention.
それによれば、次の成分を重量%で、
亜鉛(Zn) 25.0%〜33.0%、
錫(Sn) 0.5%〜1.2%、
ニッケル(Ni) 0.8%〜2.5%、及び
ケイ素(Si) 0.1%〜0.6%
を有する析出硬化可能な合金からなる、電気コンタクト部材、特にプラグコンタクトの製造のための金属ストリップ用材料が提案される。
According to it, the following ingredients in wt%,
Zinc (Zn) 25.0% to 33.0%,
Tin (Sn) 0.5% -1.2%,
Nickel (Ni) 0.8% -2.5% and Silicon (Si) 0.1% -0.6%
A metal strip material for the manufacture of electrical contact members, in particular plug contacts, is proposed which consists of a precipitation hardenable alloy with
加えて、前記材料は、任意選択的に、次の群からの少なくとも一種の元素を含み得る:リン(P)、ホウ素(B)、銀(Ag)、マンガン(Mn)、クロム(Cr)、アルミニウム(Al)、マグネシウム(Mg)、鉄(Fe)、ジルコニウム(Zr)またはヒ素(As)。 In addition, the material may optionally contain at least one element from the following group: phosphorus (P), boron (B), silver (Ag), manganese (Mn), chromium (Cr), Aluminum (Al), magnesium (Mg), iron (Fe), zirconium (Zr) or arsenic (As).
上記群からの全ての元素が存在する場合には、これらは、最大で材料の4.55%の総割合を構成する。基本的に、上記群からの元素はいずれも、それらが存在する場合には、合金全体中で0.8%を越える割合は示さない。 If all elements from the above group are present, they constitute a total proportion of up to 4.55% of the material. Basically, any element from the above group does not show a proportion of over 0.8% in the overall alloy when they are present.
材料の残部は、銅(Cu)並びに融解起因の不純物から形成される。更に、ニッケル(Ni)の割合は、少なくとも部分的にコバルト(Co)で置き換えてもよい。それ故、ニッケル(Ni)は、100%まで、それ故完全にコバルト(Co)で置き換えることもできる。ニッケル(Ni)及び/またはコバルト(Co)の割合と元素ケイ素(Si)との比率は、3.5:1〜7.5:1である。 The balance of the material is formed from copper (Cu) as well as impurities due to melting. Furthermore, the proportion of nickel (Ni) may be at least partially replaced by cobalt (Co). Therefore, nickel (Ni) can be replaced by up to 100% and hence completely cobalt (Co). The ratio of nickel (Ni) and / or cobalt (Co) to elemental silicon (Si) is 3.5: 1 to 7.5: 1.
電気コンタクト部材の製造のための金属ストリップは、析出硬化可能な合金CuZn30Sn1Ni1Si0.2からなる。 The metal strip for the production of electrical contact members consists of the precipitation hardenable alloy CuZn 30 Sn 1 Ni 1 Si 0.2 .
格別な利点が、亜鉛(Zn)の高含有率、それに伴う有利な製造コストの他に、材料の高められた強度にある。銅に対し、この高められた強度は固溶体形成に基づく。こうして達成される硬化は、他の点では比較的軟質な金属から硬質な材料を得るための、可能な強度増強プロセスのうちの一つである。 A special advantage lies in the increased strength of the material, in addition to the high zinc (Zn) content and the associated advantageous manufacturing costs. For copper, this increased strength is based on solid solution formation. The cure thus achieved is one of the possible strength enhancement processes to obtain a hard material from an otherwise relatively soft metal.
更に、ニッケル(Ni)−ケイ化物の析出硬化によって、明らかにより高い強度が、良好な伸張性、それ故高められた曲げ性を持って達成され得る。これは、特に、純粋な固溶体硬化及び冷間硬化された高力黄銅、例えばCuZn25Sn1と比べてそうである。このようにして、高い強度状態、例えばR780(Rm≧780MPa)でも、>3%の破断伸びA50を達成できる(DIN50125)。この際、緩和特性(Relaxationsbestaendigkeit)は、CuSn4及びCuZn25Sn1よりも明らかに良好である。 Furthermore, by virtue of precipitation hardening of nickel (Ni) -silicide, a clearly higher strength can be achieved with good extensibility and hence increased bendability. This is especially true compared to pure solid solution hardened and cold hardened high strength brass such as CuZn25Sn1. In this way, even at high strength conditions, for example R780 (R m ≧ 780 MPa), an elongation at break A 50 of> 3% can be achieved (DIN 50125). At this time, the relaxation properties are clearly better than CuSn4 and CuZn25Sn1.
基本的な本発明思想の有利な発展形態は、従属請求項2〜7に記載の発明である。 Advantageous developments of the basic inventive idea are the inventions according to the dependent claims 2 to 7.
それによれば、重量%で表して好ましい割合は、
亜鉛(Zn) 27.0%〜31.0%、
錫(Sn) 0.5%〜1.2%、並びに
ニッケル(Ni) 0.8〜2.0%、及び
ケイ素(Si) 0.1%〜0.6%
であることができる。
According to it, the preferred ratio expressed in weight% is
Zinc (Zn) 27.0% to 31.0%,
Tin (Sn) 0.5% to 1.2%, and Nickel (Ni) 0.8 to 2.0%, and Silicon (Si) 0.1% to 0.6%
Can be.
ニッケル(Ni)の割合は、少なくとも部分的にコバルト(Co)で置き換えてよい。 The proportion of nickel (Ni) may be at least partially replaced by cobalt (Co).
最適な析出硬化のためには、3.5:1〜7.5:1のニッケル(Ni)及び/またはコバルト(Co)とケイ素(Si)との比率を維持するべきである。好ましくは、この比率は4.0:1〜5.0:1であることができる。 For optimum precipitation hardening, a ratio of nickel (Ni) and / or cobalt (Co) to silicon (Si) of 3.5: 1 to 7.5: 1 should be maintained. Preferably, this ratio can be 4.0: 1 to 5.0: 1.
重量%の割合での上記の群からの個々の元素の任意選択的な存在は、それらが存在する場合において、好ましくは、
リン(P) 0.001%〜0.05%、
ホウ素(B) 0.02%〜0.5%、
銀(Ag) 0.02%〜0.5%、
マンガン(Mn) 0.03%〜0.8%、
クロム(Cr) 0.01%〜0.7%、
アルミニウム(Al) 0.02%〜0.5%、
マグネシウム(Mg) 0.01%〜0.4%、
鉄(Fe) 0.01%〜0.6%、並びに
ジルコニウム(Zr) 0.01%〜0.4%、及び
ヒ素(As) 0.001%〜0.1%、
である。
The optional presence of individual elements from the above group in proportions by weight is preferably, where they are present,
Phosphorus (P) 0.001% to 0.05%,
Boron (B) 0.02% to 0.5%,
Silver (Ag) 0.02% to 0.5%,
Manganese (Mn) 0.03% to 0.8%,
Chromium (Cr) 0.01% to 0.7%,
Aluminum (Al) 0.02% to 0.5%,
Magnesium (Mg) 0.01% to 0.4%,
Iron (Fe) 0.01% to 0.6%, and zirconium (Zr) 0.01% to 0.4%, and arsenic (As) 0.001% to 0.1%,
It is.
上記の群に含まれる元素は、任意選択的に、本発明の材料中に存在することができる。例えば、リン(P)及び/またはホウ素(B)は、上記の量で加えることができ、この際これらは脱酸素剤として役に立つ。それらの存在により、溶融物中に溶解したフリーの酸素(O)が結合される。このようにして、気泡の形成並びに合金成分の酸化が防止されることによって、水素脆性が抑えられる。 The elements included in the above group can optionally be present in the material of the invention. For example, phosphorus (P) and / or boron (B) can be added in the above amounts, where they serve as oxygen scavengers. Their presence binds free oxygen (O) dissolved in the melt. In this manner, hydrogen embrittlement is suppressed by preventing the formation of bubbles and the oxidation of the alloy components.
更に、リン(P)は、鋳造の時の本発明の銅合金の流動性を改善する働きをする。 Furthermore, phosphorus (P) serves to improve the fluidity of the copper alloy of the present invention during casting.
マンガン(Mn)を添加する時は、主に、銅合金に対するその硬化特性が利用される。同時に、マンガン(Mn)は同様に脱酸素剤として働く。 When adding manganese (Mn), its hardening properties for copper alloys are mainly utilized. At the same time, manganese (Mn) likewise acts as an oxygen scavenger.
アルミニウム(Al)の添加によって、材料の硬度並びにその耐力が向上する。この際、上記の有利な向上は、材料の靱性の低下を伴うことなく現れる。全体として、アルミニウム(Al)の添加には、高温下での合金の強度、加工性並びに耐摩耗性及び耐酸化性を改善する働きがある。 Addition of aluminum (Al) improves the hardness and proof stress of the material. In this case, the above-mentioned advantageous improvement appears without a reduction in the toughness of the material. Overall, the addition of aluminum (Al) serves to improve the strength, workability, wear resistance and oxidation resistance of the alloy at high temperatures.
クロム(Cr)及びマグネシウム(Mg)の添加は、高温下での耐酸化性の向上のために役立つ。この際、クロム(Cr)及びマグネシウム(Mg)をアルミニウム(Al)と混合することによって、より良好な結果を達成できる。 Addition of chromium (Cr) and magnesium (Mg) serves to improve oxidation resistance at high temperatures. At this time, better results can be achieved by mixing chromium (Cr) and magnesium (Mg) with aluminum (Al).
上記に示した量での鉄(Fe)の添加は、結晶粒微細化の働きをし、全体的には硬化作用を持つ。リン(P)と化合して、リン化鉄が生ずる。 Addition of iron (Fe) in the amount shown above serves to refine crystal grains and has a hardening effect as a whole. Combines with phosphorus (P) to form iron phosphide.
ジルコニウム(Zr)の添加によって、材料の熱間変形性が向上する。 Addition of zirconium (Zr) improves the hot deformability of the material.
更に、ヒ素(As)の添加は、脱亜鉛化傾向を低下させる。 Furthermore, the addition of arsenic (As) reduces the tendency to dezincification.
結果として、その低い銅の割合の故に、電気コンタクト部材の製造のための低廉な方法を可能とする銅材料が提示される。銅(Cu)の割合が少ないにもかかわらず、電気コンタクト部材の製造用の電導性材料として使用するための必要な性質は満たされる。こうして生成された銅材料は、金属ストリップの形で使用でき、これは、電気コンタクト部材の製造に役立つ。 As a result, a copper material is presented that allows an inexpensive method for the manufacture of electrical contact members because of its low copper percentage. Despite the low proportion of copper (Cu), the necessary properties for use as a conductive material for the manufacture of electrical contact members are met. The copper material thus produced can be used in the form of a metal strip, which is useful for the production of electrical contact members.
更に、本発明は、電導性金属ストリップのための該銅材料の使用も提供する。この金属ストリップは、電気コンタクト部材、特にプラグコンタクトの製造のために役立つ。 Furthermore, the present invention also provides the use of the copper material for conductive metal strips. This metal strip is useful for the manufacture of electrical contact members, in particular plug contacts.
要求に応じて、こうして使用される金属ストリップは、表面に錫メッキを施すことができる。 If desired, the metal strips used in this way can be tinned on the surface.
代替的な態様の一つでは、使用される金属ストリップは、錫−銀層(SnAg)を有することができる。
本願は特許請求の範囲に記載の発明に係るものであるが、本願の開示は以下も包含する:
1. 電気コンタクト部材、特にプラグコンタクトを製造するための金属ストリップ用の材料であって、重量%で表して以下の合金成分:
亜鉛(Zn) 19.0%〜40.0%、
錫(Sn) 0.1%〜1.5%、
ニッケル(Ni) 0.6%〜3.0%、及び
ケイ素(Si) 0.1%〜0.9%、並びに
任意選択的に、リン(P)、ホウ素(B)、銀(Ag)、マンガン(Mn)、クロム(Cr)、アルミニウム(Al)、マグネシウム(Mg)、鉄(Fe)、ジルコニウム(Zr)またはヒ素(As)の群からの少なくとも一種の元素、
を有する析出硬化可能な銅合金からなり、
ここで、上記群からの個々元素の割合が最大で0.8%であり、及び上記群からの全ての元素の割合が最大で4.55%であり、残部は銅(Cu)並びに融解起因の不純物であり、及びニッケル(Ni)は、少なくとも部分的にコバルト(Co)で置き換え可能であり、及びニッケル(Ni)及び/またはコバルト(Co)とケイ素(Si)の比率は3.5:1〜7.5:1である、前記材料。
2. 重量%で表した割合が、
亜鉛(Zn) 25.0%〜33.0%、
錫(Sn) 0.5%〜1.2%、
ニッケル(Ni) 0.8%〜2.5%、
ケイ素(Si) 0.1%〜0.6%、
であり、ここで、ニッケル(Ni)は、少なくとも部分的にコバルト(Co)と置き換え可能である、
ことを特徴とする、上記1に記載の材料。
3. 重量%で表した割合が、
亜鉛(Zn) 27.0%〜31.0%、
錫(Sn) 0.5%〜1.2%、
ニッケル(Ni) 0.8%〜2.0%、
ケイ素(Si) 0.1%〜0.6%、
であり、ここで、ニッケル(Ni)は、少なくとも部分的にコバルト(Co)と置き換え可能である、
ことを特徴とする、上記1または2に記載の材料。
4. ニッケル(Ni)及び/またはコバルト(Co)とケイ素(Si)との比率が4.0:1〜5.0:1であることを特徴とする上記1〜3のいずれか一つに記載の材料。
5. 上記群中の任意選択的な元素が、それらが存在する場合に、重量%で表して次の割合:
リン(P) 0.001%〜0.05%、
ホウ素(B) 0.02%〜0.5%、
銀(Ag) 0.02%〜0.5%、
マンガン(Mn) 0.03%〜0.8%、
クロム(Cr) 0.01%〜0.7%、
アルミニウム(Al) 0.02%〜0.5%、
マグネシウム(Mg) 0.01%〜0.4%、
鉄(Fe) 0.01%〜0.6%、
ジルコニウム(Zr) 0.01%〜0.4%、
ヒ素(As) 0.001%〜0.1%、
に相当することを特徴とする、上記1〜4のいずれか一つに記載の材料。
6. 電気コンタクト部材、特にプラグコンタクトの製造用の電導性金属ストリップのための、上記1〜5のいずれか一つに記載の材料の使用。
7. 金属ストリップが錫メッキされていることを特徴とする、上記6に記載の電導性金属ストリップのための材料の使用。
8. 金属ストリップが、錫−銀層を有することを特徴とする、上記6または7に記載の電導性金属ストリップのための材料の使用。
In one alternative embodiment, the metal strip used can have a tin-silver layer (SnAg).
This application is directed to the claimed invention, but the disclosure of this application also includes:
1. A material for metal strips for producing electrical contact members, in particular plug contacts, and the following alloy components expressed in weight%:
Zinc (Zn) 19.0% to 40.0%,
Tin (Sn) 0.1% -1.5%,
Nickel (Ni) 0.6% to 3.0%, and
Silicon (Si) 0.1% to 0.9%, and
Optionally, phosphorus (P), boron (B), silver (Ag), manganese (Mn), chromium (Cr), aluminum (Al), magnesium (Mg), iron (Fe), zirconium (Zr) or At least one element from the group of arsenic (As),
Consisting of a precipitation-hardenable copper alloy having
Here, the proportion of individual elements from the group is 0.8% at maximum, and the proportion of all elements from the group is 4.55% at maximum, with the balance being copper (Cu) and melting And nickel (Ni) can be at least partially replaced by cobalt (Co) and the ratio of nickel (Ni) and / or cobalt (Co) to silicon (Si) is 3.5: Said material, which is 1-7.5: 1.
2. The percentage expressed in weight percent
Zinc (Zn) 25.0% to 33.0%,
Tin (Sn) 0.5% -1.2%,
Nickel (Ni) 0.8% -2.5%,
Silicon (Si) 0.1% to 0.6%,
Where nickel (Ni) is at least partially replaceable by cobalt (Co),
2. The material according to 1 above, wherein
3. The percentage expressed in weight percent
Zinc (Zn) 27.0% to 31.0%,
Tin (Sn) 0.5% -1.2%,
Nickel (Ni) 0.8% to 2.0%,
Silicon (Si) 0.1% to 0.6%,
Where nickel (Ni) is at least partially replaceable by cobalt (Co),
3. The material according to 1 or 2 above, wherein
4). The ratio of nickel (Ni) and / or cobalt (Co) to silicon (Si) is 4.0: 1 to 5.0: 1, according to any one of the above 1 to 3, material.
5. Optional elements in the above groups, when present, expressed as a percentage by weight:
Phosphorus (P) 0.001% to 0.05%,
Boron (B) 0.02% to 0.5%,
Silver (Ag) 0.02% to 0.5%,
Manganese (Mn) 0.03% to 0.8%,
Chromium (Cr) 0.01% to 0.7%,
Aluminum (Al) 0.02% to 0.5%,
Magnesium (Mg) 0.01% to 0.4%,
Iron (Fe) 0.01% to 0.6%,
Zirconium (Zr) 0.01% to 0.4%,
Arsenic (As) 0.001% to 0.1%,
The material according to any one of 1 to 4 above, which corresponds to:
6). Use of a material according to any one of the preceding claims for an electrically conductive metal strip for the manufacture of electrical contact members, in particular plug contacts.
7). Use of a material for an electrically conductive metal strip according to claim 6, characterized in that the metal strip is tinned.
8). 8. Use of a material for an electrically conductive metal strip according to claim 6 or 7, characterized in that the metal strip has a tin-silver layer.
Claims (8)
亜鉛(Zn) 25.0%〜33.0%、
錫(Sn) 0.5%〜1.2%、
ニッケル(Ni) 0.8%〜2.5%、
ケイ素(Si) 0.1%〜0.6%、
ジルコニウム(Zr) 0.01〜0.4%、及び
任意選択的に、
リン(P) 0.001%〜0.05%、
ホウ素(B) 0.02%〜0.5%、
マンガン(Mn) 0.03%〜0.8%、
クロム(Cr) 0.01%〜0.7%、
アルミニウム(Al) 0.02%〜0.5%、
マグネシウム(Mg) 0.01%〜0.4%、
ヒ素(As) 0.001%〜0.1%、
の群からの少なくとも一種の元素、
を有する析出硬化可能な銅合金からなり、
ここで、上記群からの全ての元素の割合が最大で4.55%であり、残部は銅(Cu)並びに融解起因の不純物であり、及びニッケル(Ni)は、部分的にコバルト(Co)で置き換え可能であり、及びニッケル(Ni)及び/またはコバルト(Co)とケイ素(Si)の比率は3.5:1〜7.5:1である、前記材料。 A material for a metal strip for manufacturing an electrical contact member, the following alloy components in weight percent:
Zinc (Zn) 25.0% to 33.0%,
Tin (Sn) 0.5% -1.2%,
Nickel (Ni) 0.8% -2.5%,
Silicon (Si) 0.1% to 0.6%,
Zirconium (Zr) 0.01-0.4%, and optionally,
Phosphorus (P) 0.001% to 0.05%,
Boron (B) 0.02% to 0.5%,
Manganese (Mn) 0.03% to 0.8%,
Chromium (Cr) 0.01% to 0.7%,
Aluminum (Al) 0.02% to 0.5%,
Magnesium (Mg) 0.01% to 0.4%,
Arsenic (As) 0.001% to 0.1%,
At least one element from the group of
Consisting of a precipitation-hardenable copper alloy having
Here is 4.55 percentage of all elements at the maximum from the top SL group, and the remainder is copper (Cu) and melting-induced impurities, and nickel (Ni) is part component to cobalt ( Co) and the ratio of nickel (Ni) and / or cobalt (Co) to silicon (Si) is 3.5: 1 to 7.5: 1.
亜鉛(Zn) 27.0%〜31.0%、
錫(Sn) 0.5%〜1.2%、
ニッケル(Ni) 0.8%〜2.0%、
ケイ素(Si) 0.1%〜0.6%、
ジルコニウム(Zr) 0.01〜0.4%、
であり、ここで、ニッケル(Ni)は、部分的にコバルト(Co)と置き換え可能である、
ことを特徴とする、請求項1に記載の材料。 The percentage expressed in weight percent
Zinc (Zn) 27.0% to 31.0%,
Tin (Sn) 0.5% -1.2%,
Nickel (Ni) 0.8% to 2.0%,
Silicon (Si) 0.1% to 0.6%,
Zirconium (Zr) 0.01-0.4%,
, And the wherein the nickel (Ni) is a part partial feasible replaced with cobalt (Co),
The material according to claim 1, wherein:
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