JP6105258B2 - 半導体受光素子、光受光装置 - Google Patents
半導体受光素子、光受光装置 Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 title claims description 359
- 230000031700 light absorption Effects 0.000 claims description 133
- 239000000758 substrate Substances 0.000 claims description 79
- 229910000530 Gallium indium arsenide Inorganic materials 0.000 claims description 30
- 238000011144 upstream manufacturing Methods 0.000 claims description 27
- 230000003287 optical effect Effects 0.000 claims description 16
- 230000005684 electric field Effects 0.000 description 59
- 239000002019 doping agent Substances 0.000 description 19
- 230000004048 modification Effects 0.000 description 17
- 238000012986 modification Methods 0.000 description 17
- 230000006798 recombination Effects 0.000 description 15
- 238000005215 recombination Methods 0.000 description 15
- 230000004044 response Effects 0.000 description 9
- 230000007423 decrease Effects 0.000 description 8
- 230000006866 deterioration Effects 0.000 description 8
- 239000000969 carrier Substances 0.000 description 7
- 239000010936 titanium Substances 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 238000010521 absorption reaction Methods 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 5
- 230000008859 change Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000003486 chemical etching Methods 0.000 description 3
- 230000003247 decreasing effect Effects 0.000 description 3
- 238000001312 dry etching Methods 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 229910000980 Aluminium gallium arsenide Inorganic materials 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 150000002222 fluorine compounds Chemical class 0.000 description 1
- 125000005842 heteroatom Chemical group 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- -1 oxides Chemical class 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 230000004043 responsiveness Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
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Description
図3の(a)部は、実施例1のフォトダイオードの構造を示す図面である。図4は、図3の(a)部に示されたフォロダイオード内部のドーパントプロアイル、電界強度のプロファイル及びキャロア濃度のプロファイルを示す図面である。半絶縁性InP基板101に以下の層構造を順に積層する。
n型(例えば、ND1:Siドープ濃度1e18/cm3)のInP層102(例えば、厚さ0.5μm)。
p型(例えば、NA2:Znドープ濃度1e15/cm3)のInGaAs層103(例えば、1μm)。
p型InP層104(例えば、NA1:Znドープ濃度1e18/cm3)。
基板101の裏面に、信号光を効率的に受光領域に結合させる集光レンズ110をドライエッチングにより形成する。レンズ110の表面には反射防止膜を形成してもよい。この反射防止膜は、例えばSiN膜を用いることができる。
図6は、実施例2のフォトダイオードの構造を示す図面である。図7は、図6に示されたフォロダイオード内部のドーパントプロアイル、電界強度のプロファイル及びキャロア濃度のプロファイルを示す図面である。
半絶縁性InP基板101に以下の層構造を順に積層する。
n型(例えば、ND1:Siドープ濃度1e18/cm3)のInP層102(例えば、厚さ0.5μm)。
InGaAs層103(例えば、1μm)。
p+型(例えば、NA3:Znドープ濃度1e16/cm3)のInGaAs層103−1(例えば、0.1μm)。
アンドープ又はp型(例えば、NA2:Znドープ濃度1e14/cm3)のInGaAs層103−2(例えば、0.9μm)。
p型InP層104(例えば、NA1:Znドープ濃度1e18/cm3)。
図8の(a)部は、実施例3のフォトダイオードの構造を示す図面である。図9は、図8の(a)部に示されたフォロダイオード内部のドーパントプロファイル、電界強度のプロファイル及びキャロア濃度のプロファイルを示す図面である。
n型(例えば、ND1:Siドープ濃度1e18/cm3)のInP層102(例えば、厚さ0.1μm)。
InGaAs層103(例えば、1μm)。
p+型(例えば、NA3:Znドープ濃度1e17/cm3)のInGaAs層103−1(例えば、0.001μm)。
アンドープ又はp型(例えば、NA2:Znドープ濃度1e14/cm3)のInGaAs層103−2(例えば、0.1μm)。
InGaAs層103−1及びInGaAs層103−2を周期的に(InGaAs層103−2:InGaAs層103−1=100:1、例えば0.001μm)に配置している。
p型InP層104(例えば、NA1:Znドープ濃度1e18/cm3)。
NA31=NA32=・・・・・・=NA3(n-1)=NA3n=NA3。
W31=W32=・・・・・・=W3(n-1)=W3n。
(W31+W32+・・・・・・+WA(n-1)+W3n=W3×n)。
NA01=N02=・・・・・・=N0(n-1)=N0n =NA0 or NA2。
W01=W02=・・・・・・=W0(n-1)。
(W01+W02+・・・・・・+W0(n-1)=W0 x n)。
NA31=NA32=・・・・・・=NA3(n-1)=NA3n=NA3。
W31>W32>・・・・・・>W3(n-1)>W3n。
(W31+W32+・・・・・・+WA(n-1)+W3n=W3× n) 。
NA01=N02=・・・・・・=N0(n-1)=N0n =NA0 or NA2。
W01=W02=・・・・・・=W0(n-1) 。
(W01+W02+・・・・・・+W0(n-1)=W0×n) 。
NA31=NA32=・・・・・・=NA3(n-1)=NA3n=NA3。
W31=W32=・・・・・・=W3(n-1)=W3n。
(W31+W32+・・・・・・+WA(n-1)+W3n=W3×n) 。
NA01=N02=・・・・・・=N0(n-1)=N0n =NA0 or NA2。
W01<W02<・・・・・・<W0(n-1)。
(W01+W02+・・・・・・+W0(n-1)=W0×n) 。
NA31=NA32=・・・・・・=NA3(n-1)=NA3n=NA3。
W31>W32>・・・・・・>W3(n-1)>W3n。
(W31+W32+・・・・・・+WA(n-1)+W3n=W3×n) 。
NA01=N02=・・・・・・=N0(n-1) =NA0 or NA2。
W01<W02<・・・・・・<W0(n-1)。
(W01+W02+・・・・・・+W0(n-1)=W0×n) 。
NA31>NA32>・・・・・・>NA3(n-1)>NA3n。
W31=W32=・・・・・・=W3(n-1)=W3n。
(W31+W32+・・・・・・+WA(n-1)+W3n=W3×n)。
(NA31×W31+NA32×W32+・・・・・・+NA3(n-1)×W3(n-1)+NA3n×W3n=NA3×W3×n)。
NA01=N02=・・・・・・=N0(n-1)=NA0 or NA2。
W01=W02=・・・・・・=W0(n-1) 。
(W01+W02+・・・・・・+W0(n-1)=W0×n) 。
NA31>NA32>・・・・・・>NA3(n-1)>NA3n。
W31>W32>・・・・・・>W3(n-1)>W3n。
(W31+W32+・・・・・・+WA(n-1)+W3n=W3×n) 。
(NA31×W31+NA32×W32+・・・・・・+NA3(n-1)×W3(n-1)+NA3n×W3n=NA3×W3×n) 。
NA01=N02=・・・・・・=N0(n-1)=NA0 or NA2。
W01=W02=・・・・・・=W0(n-1)。
(W01+W02+・・・・・・+W0(n-1)=W0×n) 。
NA31>NA32>・・・・・・>NA3(n-1)>NA3n。
W31=W32=・・・・・・=W3(n-1)=W3n。
(W31+W32+・・・・・・+WA(n-1)+W3n=W3×n) 。
(NA31×W31+NA32×W32+・・・・・・+NA3(n-1)×W3(n-1)+NA3n×W3n=NA3×W3×n) 。
NA01=N02=・・・・・・=N0(n-1)=N0n =NA0 or NA2。
W01<W02<・・・・・・<W0(n-1)。
(W01+W02+・・・・・・+W0(n-1)=W0×n) 。
NA31>NA32>・・・・・・>NA3(n-1)>NA3n。
W31>W32>・・・・・・>W3(n-1)>W3n。
(W31+W32+・・・・・・+WA(n-1)+W3n=W3 x n) 。
(NA31×W31+NA32×W32+・・・・・・+NA3(n-1)×W3(n-1)+NA3n×W3n=NA3×W3×n) 。
NA01=N02=・・・・・・=N0(n-1)=N0n =NA0 or NA2。
W01<W02<・・・・・・<W0(n-1)。
(W01+W02+・・・・・・+W0(n-1)=W0×n) 。
実施例1〜3では光吸収層がInGaAs層であるけれども、これに制限されない。例えば、光吸収層は、信号光波長より長いバンドギャップ波長の組成を有するInGaAsP、AlGaInAs等からなることができる。例えば、基板から入射した信号光が光吸収層で光電変換された発生及び再結合キャリア密度プロファイルを平均化するように、基板から光吸収層への方向(以下「入射方向」と記す)に、多段もしくは連続的な傾斜構成により信号光波長と光吸収層のバンドギャップ波長との差(吸収係数)を大きくしても良い。
Claims (11)
- 半導体受光素子であって、
当該半導体受光素子への入射光を受ける入射面と、該入射面に対して反対側の主面とを有する基板と、
カソード半導体領域であり、前記基板の前記主面上に設けられる上流側半導体層と、
前記上流側半導体層上に設けられた光吸収領域と、
アノード半導体領域であり、前記光吸収領域に接合を成す下流側半導体層と、
を備え、
前記光吸収領域は、前記上流側半導体層の導電性と逆導電型の半導体層を含み、
前記半導体層は、p導電性を有する第1部分及び第2部分を含み、
前記第1部分は、前記カソード半導体領域にpn接合を成し、
前記第2部分は、前記第1部分と前記アノード半導体領域との間に位置し、
前記半導体層の前記第1部分のアクセプタ濃度は、前記半導体層の前記第2部分のアクセプタ濃度より大きく、
前記第2部分のアクセプタ濃度は、1×10 14 cm −3 〜1×10 15 cm −3 の範囲にある、半導体受光素子。 - 前記pn接合における前記半導体層のアクセプタ濃度は前記pn接合における前記カソード半導体領域のドナー濃度より小さく、
前記カソード半導体領域及び前記アノード半導体領域のバンドギャップは、前記光吸収領域のバンドギャップより大きい、請求項1に記載された半導体受光素子。 - 前記カソード半導体領域に接続されたカソード電極を更に備え、
前記カソード半導体領域の主面は、第1エリアと前記第1エリアを囲む第2エリアとを含み、
前記カソード半導体領域の前記第1エリアは半導体メサを搭載し、
前記半導体メサは前記カソード半導体領域及び前記アノード半導体領域を含み、
前記カソード電極は、前記カソード半導体領域の前記第2エリアに接合を成す、請求項1又は請求項2に記載された半導体受光素子。 - 前記アノード半導体領域の上面に接続されたアノード電極を更に備え、
前記基板はInPからなり、
前記カソード半導体領域はn型InPからなり、
前記光吸収領域は、InGaAsからなり、
前記アノード半導体領域はp型InPからなる、請求項1〜請求項3のいずれか一項に記載された半導体受光素子。 - 前記光吸収領域の全体にわたってアクセプタが添加されている、請求項1〜請求項4のいずれか一項に記載された半導体受光素子。
- 半導体受光素子であって、
当該半導体受光素子への入射光を受ける入射面と、該入射面に対して反対側の主面とを有する基板と、
カソード半導体領域であり、前記基板の前記主面上に設けられる上流側半導体層と、
前記上流側半導体層上に設けられた光吸収領域と、
アノード半導体領域であり、前記光吸収領域に接合を成す下流側半導体層と、
を備え、
前記光吸収領域は、複数のp+型半導体層を含み、
前記光吸収領域は、複数の別のp型半導体層を含み、
前記p+型半導体層及び前記別のp型半導体層は、前記カソード半導体領域から前記アノード半導体領域への方向に交互に配列されて、前記p+型半導体層は、互いに離間されている、半導体受光素子。 - 前記p+型半導体層の濃度は、1×10 17 cm −3 であり、
前記p+型半導体層の厚さは、1nmである、請求項6に記載された半導体受光素子。 - 前記p+型半導体層の厚さは前記別のp型半導体層の厚さより薄い、請求項6又は請求項7に記載された半導体受光素子。
- 前記基板は、半導体からなり、
前記基板の前記入射面はモノリシックレンズ構造を有する、請求項1〜請求項8のいずれか一項に記載された半導体受光素子。 - 半導体受光素子であって、
当該半導体受光素子への入射光を受ける入射面と、該入射面に対して反対側の半導体面とを有する半導体構造体を備え、
前記半導体構造体は、基板と、前記基板の主面に設けられた半導体積層とを含み、
前記半導体積層は、カソード半導体領域である上流側半導体層と、光吸収領域と、アノード半導体領域である下流側半導体層とを含み、
前記上流側半導体層、前記光吸収領域、及び前記下流側半導体層は、前記半導体構造体の前記入射面から前記半導体面への入射方向軸に沿って順に配置されており、
前記基板及び前記半導体積層は前記入射方向軸に沿って順に配置されており、
前記光吸収領域は前記上流側半導体層と前記下流側半導体層との間に設けられ、
前記光吸収領域は、前記上流側半導体層の導電性と逆導電型の半導体層を含み、
前記半導体層は、p導電性を有する第1部分及び第2部分を含み、
前記第1部分は、前記カソード半導体領域にpn接合を成し、
前記第2部分は、前記第1部分と前記アノード半導体領域との間に位置し、
前記半導体層の前記第1部分のアクセプタ濃度は、前記半導体層の前記第2部分のアクセプタ濃度より大きく、
前記第2部分のアクセプタ濃度は、1×10 14 cm −3 〜1×10 15 cm −3 の範囲にある、半導体受光素子。 - 請求項1〜請求項10のいずれか一項に記載された半導体受光素子と、
前記半導体受光素子の前記入射面に光学的に結合された光導波路と、
電源電圧2ボルト以下の電源に接続されると共に前記半導体受光素子に接続された電源ラインを有し、前記半導体受光素子を搭載する支持体と、
を備える、光受光装置。
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