JP6096994B1 - パワー半導体モジュールの端子接続構造 - Google Patents

パワー半導体モジュールの端子接続構造 Download PDF

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Publication number
JP6096994B1
JP6096994B1 JP2016549583A JP2016549583A JP6096994B1 JP 6096994 B1 JP6096994 B1 JP 6096994B1 JP 2016549583 A JP2016549583 A JP 2016549583A JP 2016549583 A JP2016549583 A JP 2016549583A JP 6096994 B1 JP6096994 B1 JP 6096994B1
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JP
Japan
Prior art keywords
terminal
semiconductor module
power semiconductor
connection
pin output
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2016549583A
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English (en)
Japanese (ja)
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JPWO2016204306A1 (ja
Inventor
潤一郎 土屋
潤一郎 土屋
優一 加藤
優一 加藤
昭彦 宗田
昭彦 宗田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Komatsu Ltd
Original Assignee
Komatsu Ltd
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Filing date
Publication date
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Publication of JP6096994B1 publication Critical patent/JP6096994B1/ja
Publication of JPWO2016204306A1 publication Critical patent/JPWO2016204306A1/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/03—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the relationship between the connecting locations
    • H01R11/05—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the relationship between the connecting locations the connecting locations having different types of direct connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
    • H01R13/405—Securing in non-demountable manner, e.g. moulding, riveting
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M3/00—Conversion of dc power input into dc power output
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/42—Conversion of dc power input into ac power output without possibility of reversal
    • H02M7/44—Conversion of dc power input into ac power output without possibility of reversal by static converters
    • H02M7/48—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H05K7/1432—Housings specially adapted for power drive units or power converters
    • H05K7/14329—Housings specially adapted for power drive units or power converters specially adapted for the configuration of power bus bars
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/115—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/28—Clamped connections, spring connections
    • H01R4/30—Clamped connections, spring connections utilising a screw or nut clamping member
    • H01R4/34—Conductive members located under head of screw
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
    • Y02T10/00—Road transport of goods or passengers
    • Y02T10/60—Other road transportation technologies with climate change mitigation effect
    • Y02T10/62—Hybrid vehicles

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inverter Devices (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
  • Connections By Means Of Piercing Elements, Nuts, Or Screws (AREA)
JP2016549583A 2016-07-28 2016-07-28 パワー半導体モジュールの端子接続構造 Active JP6096994B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2016/072164 WO2016204306A1 (ja) 2016-07-28 2016-07-28 パワー半導体モジュールの端子接続構造

Publications (2)

Publication Number Publication Date
JP6096994B1 true JP6096994B1 (ja) 2017-03-15
JPWO2016204306A1 JPWO2016204306A1 (ja) 2017-06-29

Family

ID=57546021

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016549583A Active JP6096994B1 (ja) 2016-07-28 2016-07-28 パワー半導体モジュールの端子接続構造

Country Status (4)

Country Link
JP (1) JP6096994B1 (de)
CN (1) CN106463876A (de)
DE (1) DE112016000036T5 (de)
WO (1) WO2016204306A1 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6866824B2 (ja) * 2017-10-31 2021-04-28 住友電装株式会社 コネクタ
US11908773B2 (en) 2019-07-30 2024-02-20 Toshiba Mitsubishi-Electric Industrial Systems Corporation Element module

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5482353U (de) * 1977-11-24 1979-06-11
JPS60121665U (ja) * 1984-01-27 1985-08-16 三菱電機株式会社 印刷配線板
JPH0621161U (ja) * 1992-08-25 1994-03-18 光洋電子工業株式会社 プリント基板と端子盤との接続構造
JP2005183644A (ja) * 2003-12-19 2005-07-07 Hitachi Ltd 電気回路モジュール
JP2009289734A (ja) * 2008-04-30 2009-12-10 Daikin Ind Ltd 電気回路の接続部材
JP2011198817A (ja) * 2010-03-17 2011-10-06 Keihin Corp 半導体装置
JP2012227038A (ja) * 2011-04-21 2012-11-15 Mitsubishi Electric Corp バスバー端子台構造
JP2013235757A (ja) * 2012-05-10 2013-11-21 Mitsubishi Electric Corp 基板装置
JP2014078564A (ja) * 2012-10-09 2014-05-01 Toyota Industries Corp 電極の接続構造

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4423462B2 (ja) * 2003-12-22 2010-03-03 富士電機システムズ株式会社 半導体パワーモジュール
JP5002568B2 (ja) * 2008-10-29 2012-08-15 日立オートモティブシステムズ株式会社 電力変換装置
JP2012005301A (ja) * 2010-06-18 2012-01-05 Fuji Electric Co Ltd パワー半導体モジュール
CN103779348A (zh) * 2014-01-24 2014-05-07 嘉兴斯达微电子有限公司 一种平板式功率半导体模块

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5482353U (de) * 1977-11-24 1979-06-11
JPS60121665U (ja) * 1984-01-27 1985-08-16 三菱電機株式会社 印刷配線板
JPH0621161U (ja) * 1992-08-25 1994-03-18 光洋電子工業株式会社 プリント基板と端子盤との接続構造
JP2005183644A (ja) * 2003-12-19 2005-07-07 Hitachi Ltd 電気回路モジュール
JP2009289734A (ja) * 2008-04-30 2009-12-10 Daikin Ind Ltd 電気回路の接続部材
JP2011198817A (ja) * 2010-03-17 2011-10-06 Keihin Corp 半導体装置
JP2012227038A (ja) * 2011-04-21 2012-11-15 Mitsubishi Electric Corp バスバー端子台構造
JP2013235757A (ja) * 2012-05-10 2013-11-21 Mitsubishi Electric Corp 基板装置
JP2014078564A (ja) * 2012-10-09 2014-05-01 Toyota Industries Corp 電極の接続構造

Also Published As

Publication number Publication date
DE112016000036T5 (de) 2018-03-15
WO2016204306A1 (ja) 2016-12-22
CN106463876A (zh) 2017-02-22
JPWO2016204306A1 (ja) 2017-06-29

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