JP6092450B1 - Electronic component manufacturing method - Google Patents

Electronic component manufacturing method Download PDF

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JP6092450B1
JP6092450B1 JP2016138983A JP2016138983A JP6092450B1 JP 6092450 B1 JP6092450 B1 JP 6092450B1 JP 2016138983 A JP2016138983 A JP 2016138983A JP 2016138983 A JP2016138983 A JP 2016138983A JP 6092450 B1 JP6092450 B1 JP 6092450B1
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circuit pattern
film layer
reinforcing portion
water
electronic component
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JP2018010971A (en
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善久 内田
善久 内田
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株式会社国際気象コンサルタント
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Abstract

An electronic component manufacturing method that facilitates the formation of a circuit pattern and is applicable to substrates of various shapes and dimensions. An electronic component manufacturing method disclosed in the present application includes a water-insoluble insulating reinforcing portion extending in a planar direction and having insulating properties, and a water-soluble film layer laminated on the insulating reinforcing portion and extending in the planar direction. An arrangement step of arranging a circuit pattern formed of a water-insoluble conductive material in a film layer of a sheet-like member comprising: and a film layer in which the circuit pattern is arranged by the arrangement step are dissolved in a liquid, A dissolving step of leaving the insulating reinforcing portion and the circuit pattern, and a step of taking out the circuit pattern from the liquid together with the insulating reinforcing portion after the film layer is dissolved by the dissolving step. [Selection] Figure 1

Description

  The present invention relates to a method for manufacturing an electronic component. In more detail, it is related with an electronic component provided with a circuit pattern.

  Conventionally, various manufacturing methods are known for an electronic component having a circuit pattern (for example, Patent Document 1). As an example, an electronic component such as a printed circuit board having a circuit pattern can be manufactured by forming a circuit pattern on a substrate by an etching process using a subtractive method. In addition, the subtractive method includes a method in which a metal substrate is cut to remove unnecessary portions and the remaining portions are used as circuit patterns. Furthermore, an additive method is also known in which a conductive material is deposited and fixed only on a required conductive pattern portion to form a conductor. In addition, there is a method in which an electronic component having a circuit pattern is manufactured by printing a circuit pattern on the substrate by applying an adhesive to the substrate and supplying conductive metal particles thereon.

JP 2010-219242 A

  However, the subtractive method for etching requires an etching process, which complicates the circuit pattern formation process and requires dedicated chemicals and tools. Further, in the method of cutting the metal substrate to remove unnecessary portions and using the remaining portions as circuit patterns, it takes time to cut the metal substrate, resulting in low productivity. Further, in the additive method, a plating resist is formed in a portion where a circuit pattern is not desired to be formed, and a circuit pattern is formed by performing electrolytic or electroless plating on a portion where no plating resist is present. Therefore, the process for forming the circuit pattern becomes complicated.

  In addition, in the method of printing a circuit pattern on a base material by applying an adhesive on a substrate and supplying conductive metal particles thereon, a dedicated adhesive coating and conductive metal particle supply is performed. A device is required. Furthermore, the substrate on which the circuit pattern can be printed is limited to a substrate having a shape and size suitable for the dedicated device.

  The present invention has been made in order to solve such problems, and provides a method of manufacturing an electronic component that can easily form a circuit pattern and can be applied to substrates of various shapes and dimensions. Objective.

  An electronic component manufacturing method disclosed in the present application includes a water-insoluble insulating reinforcing portion extending in a planar direction and having insulating properties, and a water-soluble film layer stacked on the insulating reinforcing portion and extending in the planar direction. An arrangement step of arranging a circuit pattern formed of a water-insoluble conductive material on a film layer of a water-like member, and an insulating reinforcing portion by dissolving the film layer on which the circuit pattern is arranged by the arrangement step in a liquid And a dissolving step of leaving the circuit pattern, and a step of taking out the circuit pattern from the liquid together with the insulating reinforcement after the film layer is dissolved by the dissolving step.

  According to the electronic component manufacturing method disclosed in the present application, a circuit pattern can be easily formed, and an electronic component manufacturing method applicable to substrates having various shapes and dimensions can be provided.

It is a flowchart which shows the process of the electronic component manufacturing method which concerns on 1st Embodiment. (A) It is a top view of the sheet-like member concerning a 1st embodiment. (B) It is the elements on larger scale of the AA 'line cross section of Fig.2 (a). (A) It is a partial enlarged plan view of the insulating reinforcement part which concerns on 1st Embodiment. (B) It is a cross-section part enlarged view of the sheet-like member in the BB 'line position of Fig.3 (a). It is a cross-sectional partial enlarged view which shows the process of the electronic component manufacturing method which concerns on 1st Embodiment. (D1) It is a cross-sectional partial enlarged view which shows an example of the base material attachment process which concerns on 1st Embodiment. (D2) It is a partial fragmentary enlarged view which shows the other example of the base-material attachment process which concerns on 1st Embodiment. (D3) It is a partial fragmentary enlarged view which shows the further another example of the base material attachment process which concerns on 1st Embodiment. (A) It is a cross-sectional partial enlarged view of the sheet-like member used in the electronic component manufacturing method which concerns on 2nd Embodiment. (B) It is a cross-section part enlarged view of the sheet-like member used in the electronic component manufacturing method which concerns on 3rd Embodiment. (C) It is a cross-sectional partial enlarged view of the sheet-like member used in the electronic component manufacturing method which concerns on 4th Embodiment. (A) It is a partial enlarged plan view of the insulation reinforcement part which concerns on other embodiment. (B) It is a partial enlarged plan view of the insulating reinforcement part which concerns on other embodiment. (C) It is a partial enlarged plan view of the insulating reinforcement part which concerns on other embodiment.

[First Embodiment]
Embodiments of the present invention will be described below with reference to the accompanying drawings. In addition, words indicating directions such as “front”, “back”, “top”, “bottom”, “vertical”, “horizontal”, “width direction”, “length direction”, “thickness direction”, etc. This is for convenience based on the state of the drawing, and the actual direction is not limited to this.
FIG. 1 shows each step of the electronic component manufacturing method according to the first embodiment. The placement process (step S1), which is the first process, is a process of placing a circuit pattern on the film layer of the sheet-like member. In the present embodiment, the circuit pattern is arranged on the film layer by printing the circuit pattern on the film layer of the sheet-like member. Here, the sheet-like member used for printing is demonstrated.

  FIG. 2 shows a plan view and a cross-sectional view of the sheet-like member 1 according to the first embodiment. The sheet-like member 1 extends in the planar direction (the width direction X and the length direction Y). As shown in FIG. 2B, the sheet-like member 1 includes a film layer 2 and an insulating reinforcing portion 5. The film layer 2 extends in the planar direction. In the present embodiment, the film layer 2 continuously extends between both edge portions 1a in the width direction X of the sheet-like member 1 and continuously extends between both edge portions 1b in the length direction Y. That is, when the sheet-like member 1 is viewed in plan, the film layer 2 is provided over the entire surface of the sheet-like member 1.

The film layer 2 is made of a water-soluble material. In this embodiment, the film layer 2 is constituted by a material obtained by gelatinizing starch and drying it. Therefore, the aqueous solution in which the film layer 2 is dissolved becomes a non-electrolyte. The film layer 2 may be composed of a vegetable polysaccharide water-soluble film such as wafer.
One main surface 2 a of the film layer 2 is exposed and constitutes the surface of the sheet-like member 1. One main surface 2a of the film layer 2 is a flat surface without irregularities.

A reinforcing layer 3 is provided along the film layer 2 on the other main surface 2 b side of the film layer 2. That is, the film layer 2 is laminated on one main surface 3 a of the reinforcing layer 3. The reinforcing layer 3 includes a water-soluble reinforcing portion 4 and an insulating reinforcing portion 5.
The insulating reinforcing portion 5 extends in the plane direction along the film layer 2 on the other main surface 2 b side of the film layer 2. That is, the film layer 2 is laminated on the insulating reinforcing portion 5. Therefore, the film layer 2 is reinforced by the insulating reinforcing portion 5.
The insulating reinforcing part 5 is made of a water-insoluble material. Moreover, the insulating reinforcement part 5 has insulation. In this embodiment, the insulation reinforcement part 5 is comprised with the glass fiber.
The insulating reinforcing part 5 is embedded in the water-soluble reinforcing part 4 extending in the planar direction. In the thickness direction D, the insulating reinforcing portion 5 is located at the central portion of the water-soluble reinforcing portion 4. The insulating reinforcing portion 5 is covered with the water-soluble reinforcing portion 4 and is not exposed on the one main surface 3a side and the other main surface 3b side of the reinforcing layer 3.

As shown in FIG. 3A, the insulating reinforcing portion 5 is formed in a net shape, and includes a thread portion 8 that intersects vertically and horizontally, and a large number of mesh portions 9 formed between the thread portions 8. Yes. In the present embodiment, the yarn portion 8 is plain woven, and a plurality of warp yarn portions 8a extending linearly and a plurality of weft yarn portions 8b extending linearly intersect at an angle of 90 degrees. The warp portion 8 a extends along the length direction Y of the sheet-like member 1, and the weft portion 8 b extends along the width direction X. The insulating reinforcing part 5 is formed without knots. “No-nodule” means no nodule, that is, no knot. A knot means a portion where a plurality of yarns are tied to each other, and means a portion that protrudes in the thickness direction D from other portions due to the yarn being tied.
In the present embodiment, no knot that protrudes in the thickness direction D is formed at the intersection of the warp portion 8a and the weft portion 8b.

The AA ′ line in FIG. 2A corresponds to the AA ′ line in FIG. FIG. 2B shows a cross section of the insulating reinforcing portion 5 at the portion where the weft portion 8b exists, as indicated by the line AA ′ in FIG. Therefore, in the example of FIG. 2B, the mesh portion 9 exists on the near side and the far side of the weft portion 8b.
FIG.3 (b) has shown the cross section of the sheet-like member 1 in the part in which the weft part 8b does not exist, as shown by the BB 'line of Fig.3 (a). As shown in FIG. 3B, the mesh portion 9 is located between the adjacent warp yarn portions 8a. The mesh portion 9 is a space surrounded by the warp yarn portion 8 a and the weft yarn portion 8 b, and this space is filled with the water-soluble reinforcing portion 4.
In the case where the water-soluble reinforcing portion 4 is transparent, the weft portion 8b shown in FIG. 2B may appear on the back side in the cross section shown in FIG. 3B. Therefore, the description of the weft portion 8b is omitted.
2 (b) and 3 (b) show a cross-section in the width direction (cross-section in the width direction X) of the sheet-like member 1, but a cross-section in the length direction (a cross-section longitudinally in the length direction Y). ) Is the same as that in FIGS. 2B and 3B.

  The insulating reinforcing portion 5 continuously extends between both edge portions 1a in the width direction X of the sheet-like member 1 and continuously extends between both edge portions 1b in the length direction Y. That is, the insulating reinforcing portion 5 is provided over the entire surface of the sheet-like member 1 on the other main surface 2 b side of the film layer 2.

The water-soluble reinforcing part 4 is made of a water-soluble material. In this embodiment, the water-soluble reinforcement part 4 is formed of starch that has been gelatinized and dried. Therefore, the material constituting the water-soluble reinforcing portion 4 is the same as the material constituting the film layer 2. The water-soluble reinforcing portion 4 extends in the plane direction along the film layer 2. For the sake of explanation, the portion of the water-soluble reinforcing portion 4 that extends in the planar direction and is provided between the upper end 8 c of the yarn portion 8 and the film layer 2 is referred to as a first coating portion 6. The upper surface 6 a of the first coating portion 6 constitutes one main surface 3 a of the reinforcing layer 3.
In addition, the upper end 8c of the thread part 8 has shown the part where the height position (position in the thickness direction D) is the highest in the warp part 8a and the weft part 8b. In the example shown in FIG. 2B, the height positions of the upper end 8c of the warp portion 8a and the upper end 8c of the weft portion 8b are the same.

For the sake of explanation, a portion of the water-soluble reinforcing portion 4 that extends in the planar direction and is provided on the lower end 8d side of the yarn portion 8 is referred to as a second coating portion 7. The lower surface 7 a of the second coating portion 7 constitutes the other main surface 3 b of the reinforcing layer 3. The lower surface 7 a is a flat surface and constitutes the back surface of the sheet-like member 1.
Note that the lower end 8d of the yarn portion 8 indicates the lowest height position (position in the thickness direction D) of the warp yarn portion 8a and the weft yarn portion 8b. In the example shown in FIG. 2B, the height positions of the lower end 8d of the warp portion 8a and the lower end 8d of the weft portion 8b are the same.

  The first coating portion 6 and the second coating portion 7 are constituted by a material obtained by gelatinizing and drying starch, and the water-soluble reinforcing portion 4 filled in the mesh portion 9 (FIG. 2) is also provided. Similarly, it is comprised by what gelatinized starch and dried. The first coating portion 6, the second coating portion 7, and the filling portion of the mesh portion 9 are integrally formed to constitute the water-soluble reinforcing portion 4.

  The water-soluble reinforcing portion 4 continuously extends between both edge portions 1a in the width direction X of the sheet-like member 1 and continuously extends between both edge portions 1b in the length direction Y. That is, the water-soluble reinforcing portion 4 is provided over the entire surface of the sheet-like member 1 on the other main surface 2 b side of the film layer 2.

In the present embodiment, the thickness dimension (dimension in the thickness direction D) d1 of the sheet-like member 1 is 0.2 mm. The thickness d1 of the sheet-like member 1 is desirably any numerical value within a range of 0.1 mm to 0.3 mm. In the present embodiment, the thickness d1 of the sheet-like member 1 is uniform. In the present embodiment, the thickness d4 of the insulating reinforcing portion 5 (thickness dimension from the upper end 8c to the lower end 8d of the yarn portion 8) is any numerical value within a range of 0.035 mm to 0.18 mm. The thickness d4 of the insulating reinforcing portion 5 is uniform.
The thickness dimension d2 of the film layer 2 is thinner than the thickness dimension d4 of the insulating reinforcing portion 5. Therefore, the thickness dimension d2 of the film layer 2 is thinner than the thickness dimension of the reinforcing layer 3. The thickness d2 of the film layer 2 is desirably 0.02 mm or more.

  The thickness dimension d3 of the first coating portion 6 is thinner than the thickness dimension d4 of the insulating reinforcing portion 5. The thickness dimension d3 of the first coating portion 6 is desirably 0.02 mm or more. The thickness dimension d5 of the second coating portion 7 is thinner than the thickness dimension d4 of the insulating reinforcing portion 5. The thickness dimension d5 of the second coating part 7 is desirably 0.02 mm or more, like the first coating part 6.

  In the arranging step (FIG. 1, step S1), a circuit pattern is printed on one main surface 2a of the film layer 2 with a water-insoluble conductive material. The conductive material is a conductive material such as a conductive ink or a conductive toner, and may be any material as long as it has conductivity. In the present embodiment, the sheet-like member 1 is formed in a general paper size such as A1, A2, A3, A4, and B5. In addition, as a printing device used for printing on the sheet-like member 1, a general printing device such as an ink jet printer, a laser printer, a copier, or a plotter is used.

  FIG. 4A shows a cross-sectional view along the thickness direction D of the sheet-like member 1 in a state where the circuit pattern 40 is printed. As shown in FIG. 4A, the circuit pattern 40 is printed on one main surface 2a of the film layer 2 in the arrangement step (step S1).

  Next, in the cutting step (step S2), unnecessary portions on the sheet-like member 1 where the circuit pattern 40 is not printed are cut and removed. For example, the unnecessary portion is cut off by cutting means such as scissors and a cutter, and the portion where the circuit pattern 40 is printed and the periphery thereof are left. This is because the amount of liquid used for dissolution is reduced by reducing the portion to be dissolved in the next dissolution step (step S3), and the film layer 2 is easily dissolved to shorten the time required for dissolution.

After cutting the unnecessary part of the sheet-like member 1, in the melting step (step S3), the film layer 2 on which the circuit pattern 40 is printed by the placing step (step S1) is dissolved in a liquid, and an insulating reinforcing portion 5 and the circuit pattern 40 are left.
In this embodiment, the film layer 2 is dissolved with water. Moreover, in this embodiment, the film layer 2 is dissolved by immersing the sheet-like member 1 in water. At this time, the sheet-like member 1 is placed in water so that the film layer 2 is positioned above the insulating reinforcing portion 5 and the insulating reinforcing portion 5 extends parallel or substantially parallel to the water surface.

  As described above, in the sheet-like member 1, the water-soluble reinforcing part 4 in which the insulating reinforcing part 5 is embedded is water-soluble. Therefore, when the film layer 2 is dissolved in water in the dissolving step (step S3), the water-soluble reinforcing portion 4 is also dissolved together with the film layer 2. Thereby, as shown in FIG.4 (b), the insulating reinforcement part 5 is exposed.

  In FIGS. 4B and 4C and FIGS. 5D1 to 5D3, the weft portion 8b is indicated by a two-dot chain line for the purpose of explanation. In the cross section along the thickness direction D of the sheet-like member 1, the weft portion 8 b is exposed together with the warp portion 8 a at a location where the weft portion 8 b exists. A mesh portion 9 is formed at a location where the weft portion 8b does not exist. Since the water-soluble reinforcing portion 4 filled in the mesh portion 9 is also dissolved, the mesh portion 9 is opened. Further, the film layer 2 and the first coating portion 6 that are located between the circuit pattern 40 and the insulating reinforcing portion 5 in the thickness direction D are removed.

  Next, in the extraction step (step S4), the circuit pattern 40 is extracted from the water together with the insulating reinforcing portion 5. In the present embodiment, the circuit pattern 40 is taken out of the water together with the insulating reinforcing portion 5 in a state where the circuit pattern 40 is positioned above the insulating reinforcing portion 5. At this time, the insulating reinforcing portion 5 is grasped and the insulating reinforcing portion 5 is translated upward. Thereby, the circuit pattern 40 located on the upper side of the insulating reinforcing portion 5 is also taken out of the water together with the insulating reinforcing portion 5.

  As shown in FIG. 4C, when the insulating reinforcing portion 5 is pulled up from the water, the circuit pattern 40 is placed on the insulating reinforcing portion 5 by the pulling force and its own weight. That is, the upper end 8c of the yarn portion 8 and the circuit pattern 40 are in contact with each other, and the circuit pattern 40 is supported by the warp yarn portion 8a and the weft yarn portion 8b. Therefore, the circuit pattern 40 is taken out from the water while being supported by the insulating reinforcing portion 5.

  Next, in the drying process (step S5), the circuit pattern 40 taken out from the water is dried. At this time, the circuit pattern 40 is dried together with the insulating reinforcing portion 5 while the circuit pattern 40 is placed on the insulating reinforcing portion 5. The dried circuit pattern 40 is the circuit pattern 40 manufactured by the electronic component manufacturing method according to the present embodiment.

The circuit pattern 40 formed through the above steps (steps S1 to S5) can be attached to various base materials.
Below, in the base material attachment process (step S6), the method to attach the circuit pattern 40 formed through above-mentioned step S1-S5 to a base material is demonstrated.
Regarding the substrate attachment step (step S6), three patterns of methods are illustrated in (d1) to (d3) of FIG.

  First, an example shown in FIG. 5 (d1) will be described. A plate-like base material is prepared as the substrate body 51. The substrate body 51 includes a base 52 and an adhesive layer 53. Both the base 52 and the adhesive layer 53 extend in the planar direction. The base 52 and the adhesive layer 53 are formed of an insulating material such as an epoxy resin. The adhesive layer 53 has an adhesive surface 53a having an adhesive force, and the adhesive surface 53a extends in the planar direction.

  The adhesive surface 53a of the adhesive layer is brought close to the circuit pattern 40 dried in the drying process (step S5). At this time, the circuit pattern 40 remains mounted on the insulating reinforcing portion 5. The substrate main body 51 is held so that the adhesive surface 53a is parallel to the insulating reinforcing portion 5 and the circuit pattern 40, and the adhesive surface 53a is placed on the circuit pattern 40 until the adhesive surface 53a contacts the circuit pattern 40. Move closer to. When the bonding surface 53a comes into contact with the circuit pattern 40, the circuit pattern 40 is bonded to the bonding surface 53a.

Next, the substrate body 51 is moved away from the insulating reinforcing portion 5 with the circuit pattern 40 adhered. Since the circuit pattern 40 is not bonded to the insulating reinforcing portion 5, the circuit pattern 40 is peeled off from the insulating reinforcing portion 5 and bonded to the substrate body 51. Thereby, a circuit board provided with the said circuit pattern 40 can be formed.
In the example shown in FIG. 5D1, the circuit board including the circuit pattern 40 is an electronic component manufactured by the electronic component manufacturing method according to the present embodiment.

Next, an example shown in FIG. 5 (d2) will be described. The example shown in FIG. 5 (d2) is a method of attaching the circuit pattern 40 to the substrate by embedding the circuit pattern 40 together with the insulating reinforcing portion 5 in the substrate. Here, the circuit pattern 40 and the insulating reinforcing portion 5 are embedded in the base material by resin-sealing the circuit pattern 40 placed on the insulating reinforcing portion 5 together with the insulating reinforcing portion 5.
First, a predetermined mold for molding the resin is prepared. In a state where the circuit pattern 40 is placed on the insulating reinforcing portion 5, the circuit pattern 40 and the insulating reinforcing portion 5 are arranged inside the mold, and an insulating material 61 such as an epoxy resin is placed inside the mold. Pour into. When the insulating material 61 poured into the mold is solidified and the mold is removed, the substrate body 62 including the circuit pattern 40 is formed as shown in FIG. 5 (d2).

In the example shown in FIG. 5 (d2), the circuit board 63 including the circuit pattern 40 and the board body 62 is an electronic component manufactured by the electronic component manufacturing method according to the present embodiment.
Note that another electronic component may be mounted on the circuit pattern 40 before the insulating material 61 is poured. Further, only a part of the circuit pattern 40 may be resin-sealed, or a connection part for connecting the circuit pattern 40 and another electronic component may be formed, and a part other than the connection part may be resin-sealed. You may comprise so that it may stop.

  Next, an example shown in FIG. 5 (d3) will be described. A substrate having a curved surface such as a columnar shape is prepared as the substrate body 71. The substrate main body 71 includes a base 72 and an adhesive layer 73. The base 72 and the adhesive layer 73 are made of an insulating material such as an epoxy resin. The adhesive layer 73 has an adhesive surface 73a having an adhesive force. The base 72 includes a base curved surface 72a, and the adhesive layer 73a is formed with a uniform thickness along the base curved surface 72a. Therefore, the adhesive surface 73a of the adhesive layer 73a is a curved surface.

The adhesive surface 73a of the adhesive layer is brought close to the circuit pattern 40. At this time, the circuit pattern 40 remains mounted on the insulating reinforcing portion 5. When the bonding surface 73a comes into contact with the circuit pattern 40, the circuit pattern 40 is bonded to the bonding surface 73a at the contact point. When the substrate main body 71 is moved in the width direction X while rotating, the bonding surface 73a sequentially contacts the circuit pattern 40 according to the rotation, and the circuit pattern 40 sequentially contacts the curved bonding surface 73a. It will be glued. Since the circuit pattern 40 is not bonded to the insulating reinforcing portion 5, the circuit pattern 40 is peeled off from the insulating reinforcing portion 5 and is sequentially bonded to the substrate body portion 71. Thereby, a circuit board provided with the said circuit pattern 40 can be formed.
In the example shown in FIG. 5 (d3), the circuit board including the circuit pattern 40 is an electronic component manufactured by the electronic component manufacturing method according to the present embodiment.

  As described above, in the electronic component manufacturing method according to the first embodiment, the water-insoluble insulating reinforcing portion 5 extending in the planar direction and having insulating properties, and the insulating reinforcing portion 5 are stacked to extend in the planar direction. An arrangement process (step S1) for arranging a circuit pattern 40 formed of a water-insoluble conductive material on the film layer 2 of the sheet-like member 1 including the water-soluble film layer 2 and an arrangement process (step S1) The film layer 2 on which the circuit pattern 40 is arranged is dissolved in a liquid to dissolve the insulating reinforcing portion 5 and the circuit pattern 40 (step S3), and the film layer 2 is formed by the dissolving process (step S3). A step (step S4) of taking out the circuit pattern 40 from the liquid together with the insulating reinforcing portion 5 after dissolution is included.

  Therefore, according to the electronic component manufacturing method according to the first embodiment, the circuit pattern 40 is manufactured by dissolving the film layer 2 after disposing the circuit pattern formed of the conductive material on the film layer 2. be able to. Therefore, complicated or time-consuming processes such as etching process, plating process, and metal plate cutting are not required. Therefore, according to the electronic component manufacturing method according to the first embodiment, the circuit pattern 40 can be easily formed.

  In the above electronic component manufacturing method, the circuit pattern 40 itself is formed by printing the circuit pattern 40 on the water-soluble film layer 2 instead of directly printing the circuit pattern 40 on the base material to be the substrate. ing. And as above-mentioned, this circuit pattern 40 can be attached to a base material in various shapes and dimensions. Therefore, in the arrangement process of the circuit pattern 40, the shape and dimensions of the base material are not limited by the printing device.

  For example, as described above with reference to FIG. 5 (d1), a circuit board can be formed by attaching the circuit pattern 40 to a plate-like base material (substrate body 51), or FIG. 5 (d3) can be formed. As described above with reference to the circuit board 40, the circuit pattern 40 can be attached to the curved surface 73a of the curved substrate (substrate body 71). Further, as described above with reference to FIG. 5 (d 2), the circuit pattern 40 is placed on the base material (substrate body) together with the insulating reinforcing portion 5 while the circuit pattern 40 is placed on the insulating reinforcing portion 5. By embedding in the part 62), the circuit pattern 40 can also be attached to the substrate (substrate body part 62).

  As described above, according to the electronic component manufacturing method according to the first embodiment, it is easy to form the circuit pattern 40 and to provide an electronic component manufacturing method applicable to substrates having various shapes and dimensions. Can do.

  In addition, according to the electronic component manufacturing method according to the first embodiment, the circuit pattern 40 can be easily formed, so that an electronic component such as a circuit board or a printed board including the circuit pattern 40 can be easily created. .

Moreover, the said electronic component manufacturing method includes the taking-out process (step S4) which takes out the circuit pattern 40 from the liquid with the insulating reinforcement part 5 after the film layer 2 melt | dissolves. Therefore, in the take-out process (step S4), as described above, the circuit pattern 40 placed on the insulating reinforcing portion 5 is taken out by holding the insulating reinforcing portion 5 and taking it out of the water. . Therefore, according to the electronic component manufacturing method, the circuit pattern 40 can be easily taken out from a liquid such as water.
Further, since it is not necessary to directly grip and take out the circuit pattern 40 itself, the possibility that the circuit pattern 40 is deformed or torn can be reduced.

  In addition, in the extraction step (step S4), the circuit pattern 40 can be supported by the insulating reinforcing portion 5 as described above. Therefore, the possibility that the circuit pattern 40 is deformed or broken due to the weight of water or the like can be reduced.

Moreover, in the said electronic component manufacturing method, in the extraction process (step S4), the circuit pattern 40 is taken out from water with the insulating reinforcement part 5 in the state where the circuit pattern 40 is located above the insulating reinforcement part 5. ing.
Therefore, in the extraction step (step S4), the circuit pattern 40 is stably placed by the insulating reinforcing portion 5, so that the circuit pattern 40 can be extracted in a more stable state.

  Further, since the insulating reinforcing portion 5 has insulating properties, the circuit pattern 40 is placed on another substrate together with the insulating reinforcing portion 5 while the circuit pattern 40 is placed on the insulating reinforcing portion 5. Can be attached. Further, as described above with reference to FIG. 5 (d2), the circuit pattern 40 can be sealed with the insulating material 61 together with the insulating reinforcing portion 5 to form a circuit board. As described above, since the electronic component such as the circuit board can be created while the circuit pattern 40 is supported by the insulating reinforcing portion 5, the strength of the circuit pattern 40 is increased. The possibility of the circuit pattern 40 being deformed or damaged can be reduced.

  The insulating reinforcing part 5 is formed in a net shape. As described above, when the film layer 2 is dissolved in water, the water-soluble reinforcing portion 4 is also dissolved. Thereby, the insulating reinforcement part 5 is exposed and the mesh part 9 is also opened. Therefore, when the circuit pattern 40 is taken out of the water together with the insulating reinforcing portion 5, the water falls from the mesh portion 9, and the water drainage can be improved.

  Moreover, since the insulation reinforcement part 5 is formed in net shape, the expansion and contraction of the sheet-like member 1 can be prevented. For example, when the fine circuit pattern 40 is printed, it is desirable that the printing position and the size of the printing object do not shift. By preventing the expansion and contraction of the sheet-like member 1 by the insulating reinforcing portion 5, it is possible to cope with printing that requires more accuracy.

  In addition, the insulating reinforcing portion 5 is configured without knots. Therefore, the nodule protruding in the thickness direction D does not appear on the film layer 2. Therefore, since one main surface 2a of the film layer 2 can be formed smoothly, the circuit pattern 40 can be arranged smoothly.

  In the present embodiment, the circuit pattern 40 is arranged on the film layer 2 by printing the circuit pattern 40 on the film layer 2 using a water-insoluble conductive material in the arrangement step (step S1). Therefore, formation of the circuit pattern 40 is further facilitated, and it is possible to cope with arrangement of fine patterns.

  As described above, the electronic component manufacturing method according to the first embodiment includes the base material attaching step (step S6) for attaching the circuit pattern 40 extracted by the extracting step (step S4) to the base material. Therefore, an electronic component in which the circuit pattern 40 is attached to the base material can be manufactured.

  Moreover, in this embodiment, the circuit pattern 40 currently mounted in the insulation reinforcement part 5 is attached to the base material in the base material attachment process (step S6). Therefore, since the circuit pattern 40 can be attached to the base material from the state in which the circuit pattern 40 is supported by the insulating reinforcing portion 5, the circuit pattern 40 can be attached to the base material in a more stable state. Furthermore, since it is not necessary to directly hold the circuit pattern 40 and attach it to the substrate, the possibility that the circuit pattern 40 is deformed or torn can be reduced.

In addition, in the example shown in FIG. 5 (d2), the circuit pattern 40 is insulatively reinforced in a state where the circuit pattern 40 is placed on the insulative reinforcing part 5 in the base material attaching step (step S6). The circuit pattern 40 is attached to the base material (substrate body 62) by being embedded in the base material (substrate body 62) together with the part 5. Therefore, since the circuit pattern 40 can be embedded in the substrate while the circuit pattern 40 is supported by the insulating reinforcing portion 5, the circuit pattern 40 is embedded in the substrate in a more stable state. Can do.
Furthermore, for example, when a base material is formed by pouring an insulating material around the circuit pattern 40, the circuit pattern 40 is supported by the insulating reinforcing portion 5. The possibility of deformation or tearing can be reduced.

  In this embodiment, the film layer 2 is dissolved with water. Therefore, the film layer 2 can be easily dissolved without using a special chemical solution.

In the electronic component manufacturing method, the sheet-like member 1 further includes a water-soluble reinforcing portion 4 extending in the plane direction, and the insulating reinforcing portion 5 is embedded in the water-soluble reinforcing portion 4. Therefore, the unevenness of the insulating reinforcing portion 5 can be prevented from appearing on the front and back surfaces of the sheet-like member 1. Therefore, the circuit pattern 40 can be more smoothly arranged in the arrangement step (step S1).
Moreover, the water-soluble reinforcement part 4 is dissolved with the film layer 2 in the melt | dissolution process (step S3). Therefore, even if the sheet-like member 1 includes the water-soluble reinforcing portion 4, the circuit pattern 40 can be taken out in the taking-out step (step S4) without increasing the number of processing steps.

  In addition, in the above electronic component manufacturing method, it is not necessary to perform a plating process, and it is not necessary to use a chemical solution such as an etching corrosive solution, so that an environmental load can be reduced.

[Second Embodiment]
In the electronic component manufacturing method according to the second embodiment, a sheet-like member 100 having a configuration different from that of the sheet-like member 1 used in the first embodiment is used. First, the configuration of the sheet-like member 100 will be described below.

  FIG. 6A shows a cross-section along the thickness direction D in the sheet-like member 100 according to the second embodiment, and shows a cross-sectional view corresponding to the position shown in FIG. The planar shape of the sheet-like member 100 is the same as the planar shape of the sheet-like member 1 shown in FIG. Here, the points different from the sheet-like member 1 according to the first embodiment described above will be mainly described. In FIG. 6A, the same components as those of the sheet-like member 1 according to the first embodiment are denoted by the same reference numerals.

  The sheet-like member 100 has a configuration in which another film layer 102 is provided on the back side of the sheet-like member 1 described above. Here, the above-mentioned film layer 2 is called the front surface side film layer 2, and the other film layer 102 is called the back surface side film layer 102. The structure of the surface side film layer 2 and the reinforcement layer 3 is the same as the structure of the film layer 2 and the reinforcement layer 3 in 1st Embodiment.

  The back film layer 102 is provided on the other main surface 3 b side of the reinforcing layer 3. Accordingly, the insulating reinforcing portion 5 is located between the front surface side film layer 2 and the back surface side film layer 102. The back film layer 102 extends in the planar direction along the front film layer 2 and the reinforcing layer 3. In this embodiment, the back surface side film layer 102 extends over the entire surface of the sheet-like member 100 when viewed in a plane, similarly to the front surface side film layer 2.

  Moreover, the back surface side film layer 102 is comprised by what gelatinized starch and dried similarly to the surface side film layer 2. FIG. The back surface side film layer 102 may be constituted by a vegetable polysaccharide water-soluble film such as wafer. One main surface 102a of the back-side film layer 102 is located on the other main surface 3b side of the reinforcing layer 3 and is in contact with the other main surface 3b. The other main surface 102b of the back surface side film layer 102 is a flat surface without unevenness.

  Processing in each step of the electronic component manufacturing method according to the second embodiment is basically the same as that of the electronic component manufacturing method according to the first embodiment described above. The difference from the first embodiment is that the other film layer (back side film layer) 102 is dissolved together with the film layer (front side film layer) 2 in the above-described dissolution step (step S3).

  The electronic component manufacturing method according to the second embodiment has the following advantages in addition to the advantages described in the electronic component manufacturing method according to the first embodiment. In the electronic component manufacturing method according to the second embodiment, both surfaces 2a and 102b of the sheet-like member 100 can be used as a circuit pattern arrangement surface (for example, a printing surface). Therefore, it is possible to save the trouble of confirming the front and back of the sheet-like member 100 in the arranging step (step S1).

[Third Embodiment]
In the electronic component manufacturing method according to the third embodiment, a sheet-like member 200 having a configuration different from that of the sheet-like member 1 used in the electronic component manufacturing method according to the first embodiment is used. First, the configuration of the sheet-like member 200 will be described below.

  FIG. 6B is a cross-sectional view along the thickness direction D of the sheet-like member 200 according to the third embodiment, and shows a cross-sectional view corresponding to the position shown in FIG. The planar shape of the sheet-like member 200 is the same as the planar shape of the sheet-like member 1 shown in FIG. Here, the points different from the sheet-like member 1 according to the first embodiment described above will be mainly described. In FIG.6 (b), the same code | symbol is attached | subjected to the component similar to the sheet-like member 1 which concerns on 1st Embodiment.

  In the sheet-like member 200, the configuration of the film layer 2 is the same as that of the sheet-like member 1 according to the first embodiment, and there are some differences in the configuration of the reinforcing layer 203. The reinforcing layer 203 includes the insulating reinforcing portion 5 and the water-soluble reinforcing portion 204. The configuration of the insulating reinforcing portion 5 is the same as that in the first embodiment.

In the first embodiment, the material constituting the water-soluble reinforcing portion 4 is obtained by gelatinizing and drying starch, and is the same as the material constituting the film layer 2. However, in the sheet-like member 200 according to the third embodiment, the material constituting the water-soluble reinforcing portion 204 is obtained by gelatinizing starch mixed with water-soluble fibers and drying it. In the present embodiment, the mixed fiber is a water-soluble cellulose fiber.
Therefore, the mesh portion 9 of the insulating reinforcing portion 5 is filled with a starch in which fibers are mixed and dried by gelatinization. On the upper side and the lower side of the insulating reinforcing portion 5, A product obtained by gelatinizing and drying a starch mixed with fibers extends in the plane direction.

For the sake of explanation, a portion of the water-soluble reinforcing portion 204 that extends in the planar direction and is provided between the upper end 8 c of the yarn portion 8 and the film layer 2 is referred to as a first fiber coating portion 206. The upper surface 206a of the first fiber coating portion 206 constitutes one main surface 203a of the reinforcing layer 203, and the film layer 2 is laminated thereon.
For the sake of explanation, a portion of the water-soluble reinforcing portion 204 that extends in the planar direction and is provided on the lower end 8d side of the yarn portion 8 is referred to as a second fiber coating portion 207. The lower surface 207 a of the second fiber coating portion 207 constitutes the other main surface 203 b of the reinforcing layer 203. The lower surface 207a is a flat surface and constitutes the back surface of the sheet-like member 200.

Processing in each step of the electronic component manufacturing method according to the third embodiment is the same as that of the electronic component manufacturing method according to the first embodiment described above.
The electronic component manufacturing method according to the third embodiment has the following advantages in addition to the advantages described in the electronic component manufacturing method according to the first embodiment. In the electronic component manufacturing method according to the third embodiment, in the sheet-like member 200, the water-soluble reinforcing portion 204 includes water-soluble fibers.
Therefore, according to the sheet-like member 200, the strength of the sheet-like member 200 can be further increased. Therefore, in the arrangement process (step S1), the possibility that the sheet-like member 200 is torn or partially remains inside the printing apparatus can be further reduced.

[Fourth Embodiment]
In the electronic component manufacturing method according to the fourth embodiment, a sheet-like member 300 having a configuration different from that of the sheet-like member 1 used in the electronic component manufacturing method according to the first embodiment is used. First, the structure of the sheet-like member 300 will be described below.

  FIG. 6C is a cross-section along the thickness direction D of the sheet-like member 300 according to the fourth embodiment, and shows a cross-sectional view corresponding to the position shown in FIG. The planar shape of the sheet-like member 300 is the same as the planar shape of the sheet-like member 1 shown in FIG. Here, differences from the above-described sheet-like member 200 according to the third embodiment will be mainly described. In FIG.6 (c), the same code | symbol is attached | subjected to the component similar to the sheet-like member 1 which concerns on 1st Embodiment, and the sheet-like member 200 which concerns on 3rd Embodiment.

  The sheet-like member 300 has a configuration in which another film layer 302 is provided on the back side of the sheet-like member 200 described above. Here, the film layer 2 located on the front surface side of the sheet-like member 1 described in the first embodiment is referred to as the front surface side film layer 2, and the other film layer 302 is referred to as the back surface side film layer 302. The configurations of the surface-side film layer 2 and the reinforcing layer 203 are the same as the configurations of the film layer 2 in the first embodiment and the reinforcing layer 203 in the third embodiment.

  The back film layer 302 is provided on the other main surface 203 b side of the reinforcing layer 203. Accordingly, the insulating reinforcing portion 5 is located between the front surface side film layer 2 and the back surface side film layer 302. The back side film layer 302 extends in the planar direction along the front side film layer 2 and the reinforcing layer 203. In the present embodiment, the back-side film layer 302 extends over the entire surface of the sheet-like member 300, similarly to the front-side film layer 2.

  Moreover, the back surface side film layer 302 is comprised by what gelatinized starch and dried similarly to the surface side film layer 2. FIG. The back surface side film layer 302 may be composed of a vegetable polysaccharide water-soluble film such as wafer. One main surface 302a of the back film layer 302 is located on the other main surface 203b side of the reinforcing layer 203 and is in contact with the other main surface 203b. The other main surface 302b of the back surface side film layer 302 is a flat surface without unevenness.

  The processing in each step of the electronic component manufacturing method according to the fourth embodiment is basically the same as the electronic component manufacturing method according to the first embodiment described above. A different point from 1st Embodiment is a point which dissolves the other film layer (back surface side film layer) 302 with the film layer (surface side film layer) 2 in the above-mentioned melt | dissolution process (step S3).

  According to the electronic component manufacturing method according to the fourth embodiment, in addition to the advantages described in the electronic component manufacturing method according to the first embodiment and the electronic component manufacturing method according to the third embodiment, There are such advantages. In the electronic component manufacturing method according to the fourth embodiment, both surfaces 2a and 302b of the sheet-like member 200 can be used as a circuit pattern arrangement surface (for example, a printing surface). Therefore, the trouble of confirming the front and back of the sheet-like member 300 can be saved in the arranging step (step S1).

[Other Embodiments]
As mentioned above, although embodiment of this invention was described, this invention is not limited to above-mentioned embodiment, Various deformation | transformation and change are possible.
For example, although the said 1st Embodiment is equipped with the base material attachment process (step S6), it is not necessary to provide a base material attachment process (step S6). In this case, the circuit pattern 40 may be an electronic component manufactured by the electronic component manufacturing method disclosed in the present application. The circuit pattern 40 is an electronic component itself and can be attached to another substrate.
As described above, according to the electronic component manufacturing method, there is no limitation on the shape and dimensions of the base material. Therefore, the circuit pattern 40 which is an electronic component can be attached to objects of various shapes and dimensions, such as walls of buildings and rooms, window glass, walls of large equipment, daily necessaries such as vases and bags.
Moreover, you may use independently, without attaching the circuit pattern 40 which is an electronic component to another base material or an object.

As described above, the circuit pattern 40 manufactured by the electronic component manufacturing method can be attached to various substrates by various methods.
For example, in a state where the circuit pattern 40 is placed on the insulating reinforcing portion 5, the insulating reinforcing portion 5 is impregnated with an adhesive such as an epoxy resin to bond the circuit pattern 40 and the insulating reinforcing portion 5. May be. Thereby, the circuit pattern 40 can be fixed. Alternatively, after fixing the circuit pattern 40 by bonding the circuit pattern 40 and the insulating reinforcing portion 5, the fixed circuit pattern 40 may be affixed to the substrate. At this time, the insulating reinforcing portion 5 in a portion where the circuit pattern 40 is not formed may be cut and removed.
As another example, an adhesive may be applied to the circuit pattern 40 and the circuit pattern 40 may be attached to the substrate.

In the first embodiment, the circuit pattern 40 is arranged on the film layer 2 by printing the circuit pattern 40 on the film layer 2 of the sheet-like member 1, but the circuit pattern 40 is obtained by a method other than printing. May be arranged in the film layer 2.
For example, in the arrangement step (step S1), the circuit pattern 40 is arranged on the film layer 2 by handwriting the circuit pattern 40 on the film layer 2 using a water-insoluble conductive material. In this case, for example, the circuit pattern 40 may be directly drawn on the film layer 2 using a conductive ink pen or the like. In the above-described sheet-like member 1,200, the circuit pattern 40 may be handwritten on one main surface 2a of the film layer 2. Further, in the sheet-like members 100 and 300 described above, the circuit pattern 40 is formed on one main surface 2a of the film layer 2 or the other main surfaces 102b and 302b of the other film layers (back surface side film layers) 102 and 302. May be handwritten. By handwriting the circuit pattern 40, the circuit pattern 40 can be easily arranged.

In the above-described dissolution step (step S3), the film layer 2 is dissolved with water, but the liquid for dissolving the film layer 2 may be any liquid, and the means for dissolving the film layer 2 is Any means may be used. For example, the film layer 2 may be dissolved by an acidic solution or the like.
Further, in the dissolving step (step S3), the film layer 2 may be dissolved by performing hydrolysis using an enzyme or a high-temperature acidic solution. For example, the sheet-like member 1 may be immersed in water to which vinegar has been added, and hydrolysis may be performed by heating the water in that state. By performing the hydrolysis, it is possible to reduce the possibility that the debris of the film layer 2 floats or precipitates in the solution after the film layer 2 is dissolved. Therefore, the used solution can be easily drained.

In the dissolution process (step S3), the temperature of the liquid used for dissolving the film layer 2 may be any number of times.
In the above-described embodiment, the film layer 2 is dissolved by immersing the sheet-like member in water in the dissolving step (step S3). However, the present invention is not limited to this. For example, the film layer 2 may be dissolved by spraying a mist-like liquid on the sheet-like member, or the film layer 2 may be dissolved by pouring the liquid over the sheet-like member.

  For example, in the dissolving step (step S3), the film layer 2 may be dissolved by spraying water vapor onto the film layer 2. In this case, the water vapor in contact with the film layer 2 is liquefied to become water, and the film layer 2 is dissolved by the liquefied water.

  In the above-described extraction process (step S4), the circuit pattern 40 immersed in the liquid is extracted from the liquid, but the present invention is not limited to this. There are various modes for the process of taking out. For example, in the extraction step (step S4), the extraction includes separating the circuit pattern 40 from the region where the liquid exists, drying the liquid to separate the liquid and the circuit pattern 40, and the like.

  For example, when the sheet-like member 1 on which the circuit pattern 40 is arranged is moved to a liquid spraying area installed at a predetermined place and the film layer 2 is dissolved by the sprayed liquid, the remaining circuit pattern 40 and The circuit pattern 40 may be taken out of the liquid by moving the insulating reinforcing portion 5 away from the spray area.

  Further, for example, in the dissolving step (step S3), when the amount of the solution remaining after the dissolution is small, the remaining circuit pattern 40 and the insulating reinforcing portion 5 can be taken out by drying the solution. Good. In this case, the circuit pattern 40 is taken out of the solution together with the insulating reinforcing portion 5 by drying the solution.

Although the electronic component manufacturing method according to the above-described embodiment includes the cutting process (step S2), this process may not be included. For example, after the arrangement process (step S1), the process may proceed to the dissolution process (step S3) as it is. In this case, the sheet-like member 1 on which the circuit pattern 40 is printed may be immersed in water as it is without cutting.
Moreover, although the electronic component manufacturing method according to the above-described embodiment includes the drying step (step S5), this step may not be included.
In the above-described arrangement step (step S1), when it is desired to increase the thickness of the circuit pattern 40, for example, the circuit pattern 40 may be printed multiple times.

  In the above-described embodiment, in the extraction step (step S4), the insulating reinforcing portion 5 is gripped and extracted from the water, but may be extracted by other methods. For example, the insulating reinforcing portion 5 may be pulled up using a lifting device that includes a plate-like mounting portion extending in the horizontal direction and that moves up and down. In this case, a plate-like mounting portion is inserted into the lower surface side of the insulating reinforcing portion 5, and the insulating reinforcing portion 5 is mounted on the upper surface of the plate-like mounting portion, and the above-described mounting portion is raised. Thereby, the insulation reinforcement part 5 mounted in the plate-shaped mounting part raises with the said mounting part, and is taken out from water. Further, the circuit pattern 40 located above the insulating reinforcing portion 5 is also taken out of the water together with the insulating reinforcing portion 5 as described above.

Further, when the insulating reinforcing portion 5 is gripped and taken out from the water, the insulating reinforcing portion 5 may be gripped by any means. For example, a plurality of clip portions that sandwich the insulating reinforcing portion 5 from above and below may be provided, and the insulating reinforcing portion 5 may be pulled up using a lifting device that moves the clip portion up and down. In this case, the end portions of the insulating reinforcing portions 5 are gripped by the plurality of clip portions so that the insulating reinforcing portions 5 are held horizontally or substantially horizontally, and the plurality of clip portions are moved upward in parallel. Thereby, the insulation reinforcement part 5 is hold | maintained in a horizontal or substantially horizontal state, raises with the said clip part, and is taken out from water. Further, the circuit pattern 40 located above the insulating reinforcing portion 5 is also taken out of the water together with the insulating reinforcing portion 5 as described above.
Note that the insulating reinforcing portion 5 may be taken out of the water by holding the end portion of the insulating reinforcing portion 5 by hand.

The above-described insulating reinforcing portion 5 is formed in a knotless net shape, but is not limited to this and may have any shape.
Further, when the insulating reinforcing portion 5 is formed in a net shape, it may have any shape such as a cloth or a mesh. An example is shown in FIG. The insulating reinforcing part 105 shown in FIG. 7A includes a thread part 108 and a mesh part 109, and the thread part 108 includes a first thread part 108a and a second thread part 108b. The first yarn portion 108a and the second yarn portion 108b are orthogonal to each other, and the first yarn portion 108a and the second yarn portion 108b are inclined with respect to the width direction X and the length direction Y of the sheet-like member. It extends. The insulating reinforcing portion 205 shown in FIG. 7B includes a yarn portion 208 and a mesh portion 209, and the yarn portion 208 includes a plurality of wavy yarn portions 208a extending in a wave shape along the length direction Y. The wavy yarn portion 208a intersects the adjacent wavy yarn portion 208a at the wavy protruding portion 208b that protrudes in the width direction X.

The insulating reinforcing portion 305 shown in FIG. 7C includes a thread portion 308 and a mesh portion 309, and the thread portion 308 is parallel to the plurality of first thread portions 308a extending in parallel to each other at equal intervals. And a plurality of second thread portions 308b extending in the direction. The first yarn portion 308a and the second yarn portion 308b intersect each other. Here, the first yarn portion 308a and the second yarn portion 308b are orthogonal to each other. The first yarn portion 308a and the second yarn portion 308b are each configured as a set of a plurality of thin yarns 310. The thin yarn 310 extends linearly along the extending direction of the first yarn portion 308a or the second yarn portion 308b.
Therefore, according to the insulating reinforcing portion 305, the strength of the yarn portion 308 can be increased without narrowing the space region of the mesh portion 9. Therefore, the strength of the insulating reinforcing portion 5 and the reinforcing force by the insulating reinforcing portion 5 can be increased without reducing the above-mentioned water draining effect.

The insulating reinforcing portions 105, 205, and 305 described with reference to FIGS. 7A to 7C have no knots and are formed in a knotless net shape.
The shape and size of the yarn portions 8, 108, 208, and 308 and the mesh portions 9, 109, 209, and 309 constituting the insulating reinforcing portions 5, 105, 205, and 305 are any shapes and sizes. Good. Further, in the insulating reinforcing portion 5, the warp portion 8a and the weft portion 8b are orthogonal to each other, but the warp portion 8a and the weft portion 8b may intersect at any angle. Similarly, in the insulating reinforcing portions 105 and 305, the first yarn portions 108a and 308a and the second yarn portions 108b and 308b are orthogonal to each other, but the first yarn portions 108a and 308a and the second yarn are the same. The portions 108b and 308b may intersect at any angle.

In the insulating reinforcing portion 5 according to the first embodiment, the yarn portion 8 is plain woven, and the warp portion 8a and the weft portion 8b overlap each other at the intersection of the warp portion 8a and the weft portion 8b. The warp yarn portion 8a and the weft yarn portion 8b are integrally formed so that the warp yarn portion 8a and the weft yarn portion 8b are joined on the same plane at the intersecting portion, and the warp yarn portion 8a and the weft yarn portion 8b are arranged on the same plane. May be.
Further, in the above-mentioned insulating reinforcing portion 5, a single warp portion 8a is formed by bundling a plurality of thin yarns, and a single weft portion 8b is formed by bundling a plurality of thin yarns. May be.

  Although the sheet-like member 1 described above includes the water-soluble reinforcing portion 4, the sheet-like member 1 that does not include the water-soluble reinforcing portion 4 may be used in the arranging step (step S <b> 1). For example, the sheet-like member 1 in which the film layer 2 is directly laminated on the insulating reinforcing portion 5 may be used. Alternatively, the sheet-like member 1 in which the insulating reinforcing portion 5 is not embedded in the water-soluble reinforcing portion 4 may be used. For example, the sheet-like member 1 in which the lower end 8d of the thread portion 8 of the insulating reinforcing portion 5 is exposed on the back surface of the sheet-like member 1 may be used, or the insulating reinforcing portion 5 may be made of a water-insoluble material. The covered sheet-like member 1 may be used.

  For example, the shape of the sheet-like members 1, 100, 200, 300 may be any size and any shape. As described above, it may be a standard paper size such as A1, A2, A3, A4, B5, or may be a planar shape such as a circle, a triangle, or a polygon. Moreover, a long sheet-like member may be rolled and stored or transported.

In the sheet-like members 1, 100, 200, and 300, grids, diagonal lines, auxiliary lines according to the purpose of use, designs, predetermined patterns, etc. Further, it may be printed in advance with a water-soluble material such as water-soluble ink. In this case, in the cutting process (step S2), unnecessary portions can be cut off along the grids, diagonal lines, and the like, so that the cutting process can be easily performed.
The dimensions of each part are all examples and are not limited to the numerical values described above.

In addition to the above embodiment, the following additional notes will be made.
(Appendix 1)
The film layer of the sheet-like member comprising: a water-insoluble insulating reinforcing portion extending in the planar direction and having insulating properties; and a water-soluble film layer laminated on the insulating reinforcing portion and extending in the planar direction. An arrangement step of arranging a circuit pattern formed of a water-soluble conductive material;
Dissolving the film layer in which the circuit pattern is arranged in the arranging step in a liquid, and leaving the insulating reinforcing portion and the circuit pattern;
An electronic component manufacturing method comprising: a step of taking out the circuit pattern from the liquid together with the insulating reinforcing portion after the film layer is melted by the melting step.

(Appendix 2)
The electronic component manufacturing method according to supplementary note 1, wherein the insulating reinforcing portion is formed in a knotless network.

(Appendix 3)
In the dissolving step, the film layer is dissolved by immersing the film layer in a liquid,
The electronic component manufacturing method according to appendix 1 or appendix 2, wherein the circuit pattern is taken out from the liquid together with the insulating reinforcing portion in the state in which the circuit pattern is positioned above the insulating reinforcing portion in the extracting step. .

(Appendix 4)
The electron according to any one of appendix 1 to appendix 3, wherein in the arranging step, the circuit pattern is printed on the film layer by printing the circuit pattern on the film layer with the water-insoluble conductive material. Parts manufacturing method.

(Appendix 5)
The electron according to any one of appendix 1 to appendix 3, wherein in the arranging step, the circuit pattern is arranged on the film layer by handwriting on the film layer with the water-insoluble conductive material. Parts manufacturing method.

(Appendix 6)
The electronic component manufacturing method according to any one of appendix 1 to appendix 5, further including a substrate attaching step of attaching the circuit pattern taken out by the taking out step to the substrate.

(Appendix 7)
The electronic component manufacturing method according to appendix 6, wherein, in the base material attaching step, the circuit pattern placed on the insulating reinforcing portion is attached to the base material.

(Appendix 8)
In the base material attaching step, the circuit pattern is embedded in the base material together with the insulating reinforcing portion while the circuit pattern is placed on the insulating reinforcing portion. The electronic component manufacturing method according to appendix 6 or appendix 7, which is attached to the material.

(Appendix 9)
The electronic component manufacturing method according to claim 1, wherein the liquid is water.

(Appendix 10)
The sheet-like member further includes another water-soluble film layer extending in the planar direction, and the insulating reinforcing portion is provided between the film layer and the other film layer,
The electronic component manufacturing method according to any one of appendix 1 to appendix 9, wherein the other film layer is melted together with the film layer in the melting step.

(Appendix 11)
The sheet-like member further includes a water-soluble reinforcing portion extending in the planar direction, and the insulating reinforcing portion is embedded in the water-soluble reinforcing portion,
The electronic component manufacturing method according to any one of appendix 1 to appendix 10, wherein the water-soluble reinforcing portion is melted together with the film layer in the melting step.

(Appendix 12)
The electronic component manufacturing method according to appendix 11, wherein the water-soluble reinforcing portion includes water-soluble fibers.

DESCRIPTION OF SYMBOLS 1,100,200,300 Sheet-like member 2 Film layer 3 Reinforcement layer 4,204 Water-soluble reinforcement part 5 Insulation reinforcement part 6 1st film part 7 2nd film part 8 Yarn part 9 Mesh part 102,302 Back surface Side film layer (other film layers)

Claims (11)

  1. The film layer of the sheet-like member comprising: a water-insoluble insulating reinforcing portion extending in the planar direction and having insulating properties; and a water-soluble film layer laminated on the insulating reinforcing portion and extending in the planar direction. An arrangement step of arranging a circuit pattern formed of a water-soluble conductive material;
    Dissolving the film layer in which the circuit pattern is arranged in the arranging step in a liquid, and leaving the insulating reinforcing portion and the circuit pattern;
    Together with the dissolution step wherein the circuit pattern insulation reinforcing portion after the film layer is dissolved by viewing including the extraction step of taking out from the liquid,
    The method of manufacturing an electronic component , wherein the insulating reinforcing portion is formed in a knotless network .
  2. In the dissolving step, the film layer is dissolved by immersing the film layer in a liquid,
    In the extraction step, the state in which the circuit pattern on the upper side of the insulating reinforcing portion is located, with the insulating reinforcement section, the electronic component manufacturing method according to claim 1 Symbol placement retrieving the circuit pattern from the liquid.
  3. In the disposing step, the film layer, by printing a circuit pattern by the conductive material of the water-insoluble, electronic component manufacturing method according to claim 1 or claim 2, wherein placing the circuit pattern on the film layer .
  4. In the disposing step, the film layer, by handwriting a circuit pattern by the conductive material of the water-insoluble, electronic component manufacturing method according to claim 1 or claim 2, wherein placing the circuit pattern on the film layer .
  5. The extraction process any one electronic component manufacturing method according to claims 1 to 4, further comprising a substrate mounting step of mounting the circuit pattern on a substrate taken out by.
  6. The electronic component manufacturing method according to claim 5 , wherein, in the base material attaching step, the circuit pattern placed on the insulating reinforcing portion is attached to the base material.
  7. In the base material attaching step, the circuit pattern is embedded in the base material together with the insulating reinforcing portion while the circuit pattern is placed on the insulating reinforcing portion. The electronic component manufacturing method according to claim 5 or 6 , wherein the electronic component is attached to a material.
  8. The liquid, electronic component manufacturing method according to any one of claims 1 to 7 is water.
  9. The sheet-like member further includes another water-soluble film layer extending in the planar direction, and the insulating reinforcing portion is provided between the film layer and the other film layer,
    In the dissolving step, the together with the film layer, the electronic component manufacturing method according to any one of claims 1 to 8 to dissolve the other film layers.
  10. The sheet-like member further includes a water-soluble reinforcing portion extending in the planar direction, and the insulating reinforcing portion is embedded in the water-soluble reinforcing portion,
    In the dissolving step, the together with the film layer, the electronic component manufacturing method according to any one of claims 1 to 9 for dissolving the water-soluble reinforcing portion.
  11. The electronic component manufacturing method according to claim 10 , wherein the water-soluble reinforcing portion includes water-soluble fibers.
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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4946166A (en) * 1972-09-11 1974-05-02
JP2004130657A (en) * 2002-10-10 2004-04-30 Honda Motor Co Ltd Manufacturing method of printing film and manufacturing method of resin molded body
JP2005012116A (en) * 2003-06-20 2005-01-13 Toyota Motor Corp Electronic-circuit forming method, and electronic circuit

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4946166A (en) * 1972-09-11 1974-05-02
JP2004130657A (en) * 2002-10-10 2004-04-30 Honda Motor Co Ltd Manufacturing method of printing film and manufacturing method of resin molded body
JP2005012116A (en) * 2003-06-20 2005-01-13 Toyota Motor Corp Electronic-circuit forming method, and electronic circuit

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