JP6052599B2 - Vehicle headlamp - Google Patents

Description

  The present invention relates to a vehicle headlamp, and more particularly, to a vehicle headlamp using a semiconductor light emitting element as a light source.

  Conventionally, in the field of vehicle headlamps, vehicle headlamps using semiconductor light emitting elements as light sources have been proposed (see, for example, Patent Document 1).

  FIG. 12 is a perspective view of the vehicle headlamp 200 described in Patent Document 1. As shown in FIG.

  As shown in FIG. 12, the vehicle headlamp 200 described in Patent Document 1 is a so-called direct projection type (also referred to as a direct-light type) vehicle headlamp, and is behind the projection lens 210 and the projection lens 210. And an LED light emitting section 220 that emits light irradiated through the projection lens 210 and forward.

  The LED light emitting unit 220 includes a semiconductor light emitting element (LED chip) and a fluorescent material. The projection lens 210 is a lens that projects the light from the LED light emitting unit 220. A part of the LED light emitting unit 220 is covered with a light shielding member (not shown) disposed in the vicinity of the LED light emitting unit 220. The light shielding member is located ahead of the fluorescent material in the LED lamp irradiation direction. Of the light shielding member, the surface facing the LED light emitting unit 220 is a reflecting member that reflects light from the LED light emitting unit 220 incident on the light shielding member.

  According to the vehicle headlamp 200 having the above-described configuration, the shape of the portion of the LED light emitting unit 220 that is not covered by the light shielding member is enlarged and projected in the irradiation direction by the projection lens 210, so that a predetermined arrangement having a light / dark boundary line is provided. A light pattern P is formed.

Japanese Patent No. 4138586

  However, in Patent Document 1, a part of the light from the LED light emitting unit 220 (semiconductor light emitting element) is reflected by the incident surface of the projection lens 210 and does not enter the projection lens 210, and has a predetermined distribution. As a result of not being used for the formation of the light pattern P, there is a problem that the light use efficiency is lowered.

  The present invention has been made in view of such circumstances, and it is possible to improve the utilization efficiency of light that is reflected from the incident surface of the projection lens and is not incident on the projection lens, out of direct light from the semiconductor light emitting device. An object of the present invention is to provide a vehicular headlamp.

  In order to achieve the above object, the invention according to claim 1 is a lens including a first surface disposed on the vehicle front side and a second surface disposed on the vehicle rear side, and a reference point of the lens. Or a semiconductor light emitting element that is disposed in the vicinity thereof, emits light that is incident on the inside of the lens from the second surface, is emitted from the first surface and is irradiated forward, and is disposed below the semiconductor light emitting element. A reflection surface for the overhead sign light distribution pattern, wherein the second surface reflects a part of the light from the semiconductor light emitting element, and the reflection surface side for the light distribution pattern for the overhead sign The first surface is designed such that light from the semiconductor light emitting element emitted from the first surface and irradiated forward forms a low beam light distribution pattern. It is designed to be characterized by That.

  According to the first aspect of the present invention, a light distribution pattern for overhead sign is formed by using a light beam reflected by the second surface (incident surface) and not entering the lens among direct light from the semiconductor light emitting device. Therefore, it is possible to provide a vehicle headlamp with high light utilization efficiency. That is, it is possible to provide a vehicular headlamp that can improve the light use efficiency without affecting the main light distribution (for example, the low beam light distribution pattern).

  This is because the reflection surface for the overhead sign light distribution pattern is arranged below the semiconductor light emitting element, and the effect is as if the light emitting surface is located away from the reference point of the lens. This is because the light emitted from the first surface (outgoing surface) of the lens faces upward.

  According to the first aspect of the present invention, light that is reflected by the second surface (incident surface) and is not incident on the projection lens 14 out of direct light from the semiconductor light emitting element is used for the overhead sign light distribution pattern. It is possible to efficiently make the light incident on the reflecting surface. This is because the second surface (incident surface) is directed to the reflective surface side for the overhead sign light distribution pattern by collecting the direct light from the semiconductor light emitting element reflected by the second surface (incident surface). It is because it is designed so that.

  The second surface may be a surface designed so that light from the semiconductor light emitting element reflected by the second surface is collected and directed toward the reflecting surface for the overhead sign light distribution pattern. For example, as described in claim 2, the second surface is set such that the first focal point is set at or near the light emitting surface of the semiconductor light emitting element, and the second focal point is at or near the reflecting surface for the overhead sign light distribution pattern. Or a spherical surface whose center is set at or near the light emitting surface of the semiconductor light emitting element, as described in claim 3.

  The reflective surface for the overhead sign light distribution pattern may be a mirror, a high reflectivity member, or other reflecting means as described in claim 4. .

  The invention according to claim 5 is the invention according to any one of claims 1 to 3, wherein the invention is arranged so as to surround the semiconductor light emitting element, and is configured to reflect and extract light from the semiconductor light emitting element. A high-reflectance member, and a light-shielding member that covers a portion of the high-reflectance member other than a portion that functions as a reflection surface for the light distribution pattern for the overhead sign.

  According to the fifth aspect of the present invention, a part of the high reflectance member that is arranged so as to surround the semiconductor light emitting element and is configured to reflect and extract the light from the semiconductor light emitting element is used for an overhead sign. It can function as a reflecting surface for the light distribution pattern. Therefore, a dedicated reflecting surface for the overhead sign light distribution pattern is not required, and the cost can be reduced accordingly.

  The invention according to claim 6 is the invention according to claim 4 or 5, wherein the high reflectance member is a white resin.

  According to invention of Claim 6, it becomes possible to make white resin function as a reflective surface for the light distribution pattern for overhead signs.

  ADVANTAGE OF THE INVENTION According to this invention, the vehicle headlamp which can improve the utilization efficiency of the light which is reflected in the incident surface of a projection lens among the direct light from a semiconductor light-emitting device, and does not enter into a projection lens is provided. It becomes possible.

1 is a perspective view of a vehicle headlamp 10 according to an embodiment of the present invention. It is a front view of the board | substrate 18 with which the semiconductor light-emitting element 12 (12a-12e) and the reflective surface 16 for light distribution patterns for overhead signs were mounted. (A) Top view of vehicle headlamp 10, (b) Front view, (c) Side view. (A) AA sectional view of the vehicle headlamp 10 in FIG. 4 (b), (b) Front view of the vehicle headlamp 10, (c) Vehicle headlamp in FIG. 4 (b). FIG. 4 is a cross-sectional view of the lamp 10 taken along the line BB. It is an example of a low beam light distribution pattern P _Lo and overhead sign light distribution pattern P _OHS formed by the headlamp 10 for a vehicle. It is a perspective view of vehicle headlamp 10A which is a modification. It is a front view of the board | substrate 18 with which the semiconductor light-emitting device 12 (12a-12e), the high reflectance member 22 (for example, white resin) as the reflective surface 16 for light distribution patterns for overhead signs, and the light shielding member 24 were mounted. It is CC sectional drawing in FIG. (A) Top view of vehicle headlamp 10A, (b) Front view, (c) Side view. (A) CC sectional view of the vehicle headlamp 10A in FIG. 10 (b), (b) Front view of the vehicle headlamp 10A, (c) Vehicle headlamp in FIG. 10 (b). 2 is a DD cross-sectional view of the lamp 10. FIG. This is an example of a low beam light distribution pattern P _Lo ′ and an overhead sign light distribution pattern P _OHS ′ formed by the vehicle headlamp 10. 1 is a perspective view of a vehicle headlamp 200 described in Patent Document 1. FIG.

  Hereinafter, a vehicle headlamp according to an embodiment of the present invention will be described with reference to the drawings.

  FIG. 1 is a perspective view of a vehicle headlamp 10 according to an embodiment of the present invention.

  At least one vehicle headlamp 10 according to the present embodiment is disposed on each of the left and right sides of the front surface of a vehicle such as an automobile. A known aiming mechanism (not shown) is connected to the vehicle headlamp 10 so that the optical axis can be adjusted.

  As shown in FIG. 1, the vehicle headlamp 10 of this embodiment includes a semiconductor light emitting element 12, a projection lens 14, a reflecting surface 16 for an overhead sign light distribution pattern, and the like. The semiconductor light emitting element 12 and the reflective surface 16 for the overhead sign light distribution pattern are mounted on the surface of the substrate 18.

  The semiconductor light emitting element 12 (12a to 12e) is a light source that enters the projection lens 14 from the incident surface 14b of the projection lens 14 and emits direct light emitted from the emission surface 14a of the projection lens 14 and irradiated forward. The projection lens 14 is arranged behind the projection lens 14 and at a reference point F (or its vicinity) in the optical design of the projection lens 14.

  FIG. 2 is a front view of the substrate 18 on which the semiconductor light emitting element 12 (12a to 12e) and the reflective surface 16 for the overhead sign light distribution pattern are mounted.

  As shown in FIG. 2, the semiconductor light emitting elements 12 (12 a to 12 e) are, for example, LED chips × 5 including a 1 mm square light emitting surface, and are mounted in a row on the surface of a ceramic (or metal) substrate 18. A horizontally long rectangular light emitting surface 20 is formed. The number of semiconductor light emitting elements 12 (12a to 12e) is not limited to five, and may be one to four or six or more.

  In the semiconductor light emitting device 12 (12a to 12e), the long side of the horizontally long rectangular light emitting surface 20 is horizontal, and the semiconductor light emitting device 12 (the horizontally long rectangular light emitting surface 20) faces forward (the incident surface 14b of the projection lens 14). In this state, the projection lens 14 is disposed at the reference point F (or in the vicinity thereof).

  The optical axis AX extending in the vehicle front-rear direction passes through the horizontally elongated light emitting surface 20 and extends in the normal direction of the light emitting surface 20.

  The reference point F in the optical design of the projection lens 14 is set at or near the semiconductor light emitting element 12 (12a to 12e) (for example, near the center of the lower end edge of the horizontally elongated light emitting surface 20 extending in the horizontal direction). .

  The reference point F of the projection lens 14 corresponds to the focal point (or optical center) of a general projection lens, and the surface shape of the exit surface 14a of the projection lens 14 is designed based on the reference point F.

  The semiconductor light emitting element 12 (12a to 12e) may be any element that emits white light that satisfies the white range on the CIE chromaticity diagram stipulated by laws and regulations, and the light emitting color is a blue LED chip (or laser diode). May be a semiconductor light emitting device having a structure in which a yellow fluorescent material (for example, YAG phosphor) covering the same is combined, or a semiconductor light emitting device having a structure in which RGB three-color LED chips (or laser diodes) are combined. It may be an element or a semiconductor light emitting element having another structure.

  3A is a top view of the vehicle headlamp 10, FIG. 3B is a front view, and FIG. 3C is a side view.

  As shown in FIGS. 1 and 3 (a) to 3 (c), the projection lens 14 is disposed on the vehicle front side, an emission surface 14a (corresponding to the first surface of the present invention), and on the vehicle rear side. Incident surface 14b (corresponding to the second surface of the present invention), a flange portion 14c disposed on the outer periphery, and the like. The projection lens 14 is supported by a support portion (not shown) such as a lens holder whose flange portion 14c is fixed to a housing or the like, so that the exit surface 14a is disposed on the vehicle front side, and the entrance surface 14b is the vehicle. It is arranged on the rear side.

  The projection lens 14 is integrally formed by injecting a transparent resin (such as acrylic or polycarbonate) into a mold, and cooling and solidifying. The material of the projection lens 14 may be, for example, glass other than transparent resin (such as acrylic or polycarbonate).

  4A is a cross-sectional view taken along line AA of the vehicle headlamp 10 in FIG. 4B, FIG. 4B is a front view of the vehicle headlamp 10, and FIG. 4C is FIG. It is BB sectional drawing of the vehicle headlamp 10 in (b).

  The incident surface 14b is a surface on which direct light from the semiconductor light emitting element 12 (12a to 12e) is incident (see FIGS. 4A and 4C). On the incident surface 14b, direct light from the semiconductor light emitting element 12 (12a to 12e) reflected by the incident surface 14b (Fresnel reflection) is collected, and below the semiconductor light emitting element 12 (12a to 12e), that is, As shown in FIG. 4C, for example, as shown in FIG. 4C, the first focal point F1 is the surface of the semiconductor light emitting element 12 (12a). ˜12e) is set to the light emitting surface 20 or the vicinity thereof, and the second focal point F2 is a spheroidal surface set to the reflecting surface 16 for the overhead sign light distribution pattern or the vicinity thereof. In this way, it is possible to efficiently make the light reflected by the incident surface 14b out of the direct light from the semiconductor light emitting element 12 (12a to 12e) incident on the reflecting surface 16 for the overhead sign light distribution pattern. It becomes.

  The incident surface 14b is configured so that direct light from the semiconductor light emitting elements 12 (12a to 12e) reflected by the incident surface 14b is collected and directed toward the reflecting surface 16 for the overhead sign light distribution pattern. It is sufficient that the surface shape is a designed surface, and it is not limited to the spheroid. For example, the incident surface 14b may be a spherical surface whose center is set at or near the light emitting surface 20 of the semiconductor light emitting element 12 (12a to 12e), or other surface-shaped surface (for example, the semiconductor light emitting element 12). A concave surface). This also makes it possible to efficiently make the light reflected by the incident surface 14b out of the direct light from the semiconductor light emitting element 12 (12a to 12e) incident on the reflecting surface 16 for the overhead sign light distribution pattern. .

The lower part of FIG. 5 is an example of a low beam light distribution pattern P _Lo formed by the vehicle headlamp 10.

As shown in FIG. 5, the low beam light distribution pattern P _Lo includes a cut-off line CL extending in the horizontal direction, and is disposed at a horizontal light distribution pattern (for example, 0.57 degrees or less below the H line). ).

The low beam light distribution pattern P _Lo having the above configuration is realized by configuring the exit surface 14a of the projection lens 14 as follows.

The exit surface 14a enters the projection lens 14 from the entrance surface 14b, and is emitted directly from the semiconductor light emitting element 12 (12a to 12e) emitted from the exit surface 14a and irradiated forward (a light source image of the semiconductor light emitting element 12). However, as shown in FIG. 5, the surface shape is designed so as to form a low beam light distribution pattern _PLo .

  Specifically, as shown in FIG. 4A, the emission surface 14a has a horizontal cross-sectional shape such that direct light Ray1 emitted from the semiconductor light emitting element 12 (12a to 12e) emitted from the emission surface 14a is diffused in the horizontal direction. As shown in FIG. 4C, the vertical cross-sectional shape is such that the direct light Ray1 from the semiconductor light emitting element 12 (12a to 12e) emitted from the emission surface 14a irradiates a downward direction with respect to the horizontal plane. The shape is to

The upper part in FIG. 5 is an example of the overhead sign light distribution pattern _POHS formed by the vehicle headlamp 10.

The overhead sign light distribution pattern _POHS is a light distribution pattern for illuminating a road guide plate or road sign in the upper front, and the reflecting surface 16 for the overhead sign light distribution pattern is configured as follows. It is realized with.

  The reflection surface 16 for the overhead sign light distribution pattern is a reflection surface that reflects light reflected from the incident surface 14b out of direct light from the semiconductor light emitting device 12 (12a to 12e), and the semiconductor light emitting device 12 (12a to 12a). 12e).

  As shown in FIG. 2, the reflecting surface 16 for the overhead sign light distribution pattern is a rectangular mirror (for example, a thin plate-like flat mirror or curved mirror) that is long in the horizontal direction when the lamp is viewed from the front. The substrate 18 on which the light emitting elements 12 (12a to 12e) are mounted is fixed below the semiconductor light emitting elements 12 (12a to 12e) by known means such as adhesion, and below the semiconductor light emitting elements 12 (12a to 12e). Is arranged. The reflective surface 16 for the overhead sign light distribution pattern may be configured as a member different from the semiconductor light emitting element 12 (12a to 12e) and may be mounted on the substrate 18, or may be semiconductor light emitting. The element 12 (12a to 12e) may be combined (for example, packaged), configured as one member, and mounted on the substrate 18.

Usually, the direct light Ray1 from the semiconductor light emitting element 12 (12a to 12e) is incident on the inside of the projection lens 14 from the incident surface 14b as shown by the solid line in FIGS. As shown in FIG. 5, on a virtual vertical screen (disposed approximately 25 m ahead from the front of the vehicle) that is refracted and emitted from 14a and irradiated forward, facing the front of the vehicle (exit surface 14a), A low-beam light distribution pattern P _Lo is formed.

  However, some of the direct light from the semiconductor light emitting element 12 (12a to 12e) is reflected by the incident surface 14b and travels downward from the semiconductor light emitting element 12 (12a to 12e).

The reflected light Ray2 from the incident surface 14b (see the dotted line in FIG. 4C) is reflected by the reflective surface 16 for the overhead sign light distribution pattern, and enters the projection lens 14 from the incident surface 14b. The light is refracted and emitted from the emission surface 14a, and is irradiated forward and upward at a predetermined angle with respect to the horizontal plane. As a result, an overhead sign light distribution pattern P _OHS is formed on the virtual vertical screen and above the low beam light distribution pattern P _Lo as shown in FIG. This is because the reflective surface 16 for the overhead sign light distribution pattern is arranged below the semiconductor light emitting element 12 (12a to 12e), so that light is emitted as if it is located at a position away from the reference point F of the projection lens 14. This is because the effect is as if the surface is located, and the ray Ray2 emitted from the emission surface 14a of the projection lens 14 is directed upward.

Horizontal dimension and vertical dimension of the overhead sign light distribution pattern P _OHS, by adjusting the horizontal dimension and the vertical dimension of the reflection surface 16 of the light distribution pattern for overhead sign, it can be adjusted . The vertical position (position on the virtual vertical screen) where the overhead sign light distribution pattern _POHS is formed is a distance L between the semiconductor light emitting element 12 and the reflection surface 16 for the overhead sign light distribution pattern. It can be adjusted by adjusting (see FIG. 2).

Therefore, the horizontal dimension and the vertical dimension of the reflective surface 16 for the overhead sign light distribution pattern and the distance L between the semiconductor light emitting element 12 and the reflective surface 16 for the overhead sign light distribution pattern are adjusted. Thus, for example, it is possible to form an overhead sign light distribution pattern _POHS that illuminates a range of 2 to 4 degrees above the horizontal line HH and an appropriate angle to the left and right with respect to the vertical line VV.

The vehicle headlamp 10 is optically adjusted by a known aiming mechanism (not shown) so that each light distribution pattern P _Lo , P _OHS irradiates an appropriate range on the virtual vertical screen.

As described above, according to the vehicle headlamp 10 of the present embodiment, light rays that are reflected by the incident surface 14b and do not enter the projection lens 14 out of direct light from the semiconductor light emitting elements 12 (12a to 12e). Ray2 utilizing, capable of forming an overhead sign light distribution pattern P _OHS, it is possible to provide a high vehicle headlamp light utilization efficiency. That is, it is possible to provide a vehicular headlamp that can improve the light use efficiency without affecting the main light distribution (for example, the low beam light distribution pattern P _Lo ).

  This is because the reflective surface 16 for the overhead sign light distribution pattern is arranged below the semiconductor light emitting element 12 (12a to 12e), so that light is emitted as if it is located at a position away from the reference point F of the projection lens 14. This is because the effect is as if the surface is located, and the ray Ray2 emitted from the emission surface 14a of the projection lens 14 is directed upward.

  Further, according to the vehicle headlamp 10 of the present embodiment, the light that is reflected by the incident surface 14b and does not enter the projection lens 14 out of direct light from the semiconductor light emitting elements 12 (12a to 12e) is overhead sign. Therefore, the light can be efficiently incident on the reflection surface 16 for the light distribution pattern. This is because the incident surface 14 b is focused on the direct light from the semiconductor light emitting elements 12 (12 a to 12 e) reflected by the incident surface 14 b toward the reflecting surface 16 for the overhead sign light distribution pattern. It is because it is designed.

  Next, as a modified example of the vehicle headlamp 10, a vehicle headlamp 10A using a high reflectance member 22 (for example, white resin) as the reflecting surface 16 for the overhead sign light distribution pattern will be described.

  The vehicle headlamp 10A according to the present modification uses a high reflectance member 22 (for example, white resin) as the reflective surface 16 for the overhead sign light distribution pattern, as compared with the vehicle headlamp 10 of the above embodiment. The difference is that the light shielding member 24 is added. Other than that, it is the structure similar to the vehicle headlamp 10 of the said embodiment. Hereinafter, the difference from the vehicle headlamp 10 of the above embodiment will be mainly described, and the same components as those of the vehicle headlamp 10 of the above embodiment will be denoted by the same reference numerals and description thereof will be omitted. .

  FIG. 6 is a perspective view of a vehicle headlamp 10A which is a modified example.

  FIG. 7 is a front view of the substrate 18 on which the semiconductor light emitting element 12 (12a to 12e), the high reflectance member 22 (for example, white resin) and the light shielding member 24 as the reflective surface 16 for the overhead sign light distribution pattern are mounted. 8 is a cross-sectional view taken along the line CC in FIG. 9A is a top view of the vehicle headlamp 10A, FIG. 9B is a front view, and FIG. 9C is a side view.

  As shown in FIGS. 6 and 9 (a) to 9 (c), the vehicle headlamp 10A according to the present modification is used for the overhead sign light distribution pattern in addition to the semiconductor light emitting element 12 and the projection lens 14. A high reflectance member 22 (for example, white resin) that functions as the reflecting surface 16 and a light shielding member 24 are provided.

  As shown in FIGS. 7 and 8, conventionally, the semiconductor light emitting device 12 (12 a to 12 e) is disposed so as to surround the semiconductor light emitting device 12, and the semiconductor light emitting device 12 (12 a to 12 e) mainly reflects the light emitted sideways. A high reflectance member 22 (for example, white resin) configured to be efficiently taken out is known. The high reflectivity member 22 includes a reflection surface 22b (see FIG. 8) for reflecting light emitted from the semiconductor light emitting element 12 (12a to 12e) mainly to the side toward the front. In FIG. 8, the member indicated by reference numeral 12A is an LED chip constituting the semiconductor light emitting element 12, the member indicated by reference numeral 12B is a phosphor constituting the semiconductor light emitting element 12, and the member indicated by reference numeral 12C is a glass plate. .

  The high reflectance member 22 is disposed below at least one side (lower end edge) of the semiconductor light emitting element 12 (12a to 12e) (see FIG. 7).

  As shown in FIGS. 6 and 9A, the light shielding member 24 includes a front surface 24 a that is curved along the focal plane of the projection lens 14, and a rear surface 24 b on the opposite side. As shown in FIG. 7, the light-shielding member 24 has a portion 22a of the high-reflectance member 22 through an opening 24c (for example, a rectangular opening 24c that is long in the horizontal direction when viewed from the front of the lamp) penetrating from the front surface 24a to the rear surface 24b. It is exposed and covers the other portions of the high reflectivity member 22. By forming the opening 24c of the light shielding member 24 at an appropriate location, a part 22a of the high reflectance member 22 exposed from the opening 24c can function as the reflecting surface 16 for the overhead sign light distribution pattern. It becomes. As described above, the portion other than the portion 22a of the high reflectance member 22 (for example, white resin) that functions as the reflection surface 16 for the overhead sign light distribution pattern is covered with the light shielding member 24.

  10A is a cross-sectional view taken along the line C-C of the vehicle headlamp 10A in FIG. 10B, FIG. 10B is a front view of the vehicle headlamp 10A, and FIG. It is DD sectional drawing of the vehicle headlamp 10 in (b).

  The incident surface 14b is a surface on which direct light from the semiconductor light emitting element 12 (12a to 12e) is incident (see FIGS. 10A and 10C). On the incident surface 14b, direct light from the semiconductor light emitting element 12 (12a to 12e) reflected by the incident surface 14b (Fresnel reflection) is collected, and below the semiconductor light emitting element 12 (12a to 12e), that is, A surface whose surface shape is designed so as to face the part 22a side of the high reflectance member 22 that functions as the reflecting surface 16 for the overhead sign light distribution pattern, for example, as shown in FIG. The first focal point F1 is set at or near the light emitting surface 20 of the semiconductor light emitting element 12 (12a to 12e), and the second focal point F2 functions as the reflecting surface 16 for the overhead sign light distribution pattern. Is a spheroidal surface set in a part 22a or in the vicinity thereof (for example, in the opening 24c of the light shielding member 24). If it does in this way, the high reflectance member 22 which functions the light reflected by the entrance plane 14b among the direct light from the semiconductor light-emitting device 12 (12a-12e) as the reflective surface 16 for the overhead sign light distribution pattern. It becomes possible to make it efficiently inject into part 22a.

  The incident surface 14b is a high reflectivity member that functions as the reflecting surface 16 for the overhead sign light distribution pattern by collecting direct light from the semiconductor light emitting elements 12 (12a to 12e) reflected by the incident surface 14b. Any surface may be used as long as the surface shape is designed so as to face the part 22a side of the member 22 and is not limited to the spheroid surface. For example, the incident surface 14b may be a spherical surface whose center is set at or near the light emitting surface 20 of the semiconductor light emitting element 12 (12a to 12e), or other surface-shaped surface (for example, the semiconductor light emitting element 12). A concave surface). Also by this, the light reflected by the incident surface 14b out of the direct light from the semiconductor light emitting element 12 (12a to 12e) is one of the high reflectance members 22 that function as the reflective surface 16 for the overhead sign light distribution pattern. It is possible to efficiently enter the portion 22a.

The lower part of FIG. 11 is an example of a low beam light distribution pattern P _Lo ′ formed by the vehicle headlamp 10A.

As shown in FIG. 11, the light distribution pattern _{P Lo} 'is for low beam, connecting a pair of horizontal cut-off line _CL L extending in the left-right stepped horizontally, CL _R and the pair of horizontal line _CL L, the end point of the CL _R It is formed as a light distribution pattern including the oblique cutoff line CL _S.

As shown in FIG. 7, the semiconductor light emitting element 12 (the horizontally long light emitting surface 20) has a diagonal line L _S extending in the diagonally right direction of the light shielding member 24 (for example, the rear surface 24 b) and the horizontal direction. This is because it is covered with a portion including a horizontal line L _L extending in the direction.

  In the present modification, as shown in FIG. 10A, the emission surface 14a has a horizontal cross-sectional shape in which the direct light Ray1 from the semiconductor light emitting element 12 (12a to 12e) emitted from the emission surface 14a is in the horizontal direction. As shown in FIG. 10C, the vertical cross-sectional shape is such that the direct light Ray1 from the semiconductor light emitting element 12 (12a to 12e) emitted from the emission surface 14a is in a horizontal plane. On the other hand, it is set as the shape which irradiates a downward direction.

The upper part in FIG. 11 is an example of the overhead sign light distribution pattern P _OHS ′ formed by the vehicle headlamp 10A.

  A part 22a of the high reflectance member 22 that functions as the reflecting surface 16 for the overhead sign light distribution pattern reflects light reflected by the incident surface 14b out of direct light from the semiconductor light emitting element 12 (12a to 12e). The reflective surface is arranged below the semiconductor light emitting element 12 (12a to 12e).

Usually, the direct light Ray1 from the semiconductor light emitting element 12 (12a to 12e) is incident on the inside of the projection lens 14 from the incident surface 14b as shown by the solid line in FIG. 10A and FIG. As shown in FIG. 11, on a virtual vertical screen (arranged about 25 m ahead from the front of the vehicle) that is refracted and emitted from 14a and irradiated forward, facing the front of the vehicle (exit surface 14a), A low beam light distribution pattern P _Lo ′ is formed.

  However, some of the direct light from the semiconductor light emitting element 12 (12a to 12e) is reflected by the incident surface 14b and travels downward from the semiconductor light emitting element 12 (12a to 12e).

The reflected light Ray2 from the incident surface 14b (see the dotted line in FIG. 10C) is reflected by a part 22a of the high reflectance member 22 that functions as the reflective surface 16 for the overhead sign light distribution pattern. The light enters the projection lens 14 from the incident surface 14b, is refracted and emitted from the output surface 14a, and is irradiated forward and upward by a predetermined angle with respect to the horizontal plane. As a result, an overhead sign light distribution pattern P _OHS ′ is formed on the virtual vertical screen and above the low beam light distribution pattern P _Lo as shown in FIG. This is because the part 22a of the high reflectivity member 22 that functions as the reflective surface 16 for the overhead sign light distribution pattern is disposed below the semiconductor light emitting element 12 (12a to 12e), thereby providing a reference for the projection lens 14. This is because the effect is as if the light emitting surface is located at a position away from the point F, and the light ray Ray2 emitted from the emission surface 14a of the projection lens 14 is directed upward.

The horizontal dimension and the vertical dimension of the overhead sign light distribution pattern P _OHS ′ are the horizontal dimension of the portion 22a (that is, the opening 24c) of the high reflectance member 22 that functions as the reflective surface 16 for the overhead sign light distribution pattern. It can be adjusted by adjusting the directional dimension and the vertical dimension. Further, the vertical position (position on the virtual vertical screen) where the overhead sign light distribution pattern P _OHS ′ is formed is a high reflection functioning as the semiconductor light emitting element 12 and the reflecting surface 16 for the overhead sign light distribution pattern. Adjustment is possible by adjusting the distance L (see FIG. 7) between the portion 22a of the rate member 22 (that is, the opening 24c).

Accordingly, the horizontal dimension and the vertical dimension of the part 22a (that is, the opening 24c) of the high reflectance member 22 functioning as the reflecting surface 16 for the overhead sign light distribution pattern, and the semiconductor light emitting element 12 and the overhead sign. By adjusting the distance L between the portion 22a (that is, the opening) of the high reflectance member 22 functioning as the reflection surface 16 for the light distribution pattern, for example, 2 to 4 degrees above the horizontal line H-H and It is possible to form the overhead sign light distribution pattern P _OHS ′ that illuminates a range of an appropriate angle to the left and right with respect to the vertical line VV.

The vehicle headlamp 10A is optically adjusted by a known aiming mechanism (not shown) so that each light distribution pattern P _Lo ', P _OHS ' irradiates an appropriate range on the virtual vertical screen. .

  According to this modification, in addition to the effects described in the above embodiment, the semiconductor light emitting device 12 (12a to 12e) is configured to reflect light emitted mainly laterally and efficiently extract the light. A part 22a of the member 22 (for example, white resin) can function as the reflecting surface 16 for the overhead sign light distribution pattern. This eliminates the need for the reflecting surface 16 dedicated to the overhead sign light distribution pattern, and accordingly reduces the cost.

  The above embodiment is merely an example in all respects. The present invention is not construed as being limited to these descriptions. The present invention can be implemented in various other forms without departing from the spirit or main features thereof.

DESCRIPTION OF SYMBOLS 10, 10A ... Vehicle headlamp, 12 ... Semiconductor light emitting element, 14 ... Projection lens, 14a ... Outgoing surface, 14b ... Incident surface, 14c ... Flange part, 16 ... Reflective surface for light distribution pattern for overhead signs, 18 DESCRIPTION OF SYMBOLS ... Board | substrate, 20 ... Light-emitting surface, 22 ... High reflectance member, 22a ... Part (part), 22b ... Reflective surface, 24 ... Light shielding member, 24a ... Front surface, 24b ... Rear surface, 24c ... Opening

Claims (5)

A lens including a first surface disposed on the vehicle front side and a second surface disposed on the vehicle rear side;
A semiconductor light-emitting element that is disposed at or near the reference point of the lens, emits light that enters the lens from the second surface, exits from the first surface, and is irradiated forward;
A reflective surface for a light distribution pattern for an overhead sign disposed below the semiconductor light emitting element,
The second surface is designed to reflect a part of the light from the semiconductor light emitting element and condense toward the reflective surface side for the overhead sign light distribution pattern,
The first surface is designed such that light from the semiconductor light emitting element emitted from the first surface and irradiated forward forms a low beam light distribution pattern ;
A high reflectivity member disposed to surround the semiconductor light emitting element and configured to reflect and extract light from the semiconductor light emitting element;
A light shielding member that covers a portion other than a portion that functions as a reflective surface for the overhead sign light distribution pattern of the high reflectance member;
The vehicle headlamp further comprising: The vehicle headlamp according to claim 1 , wherein the high reflectance member is a white resin. The second surface is a spheroid having a first focal point set at or near the light emitting surface of the semiconductor light emitting element, and a second focal point set at or near the reflecting surface for the overhead sign light distribution pattern. the vehicle headlamp according to claim 1 or 2, characterized in that. The second surface, the vehicle headlamp according to claim 1 or 2, wherein the center is a light emitting surface or set spherical in the vicinity of the semiconductor light emitting element. The light shielding member includes a front surface curved along the focal plane of the lens, a rear surface opposite to the front surface, and an opening penetrating from the front surface to the rear surface, and the light distribution pattern for the overhead sign from the opening. The vehicular headlamp according to any one of claims 1 to 4, wherein the reflecting surface is exposed.

Images