JP6024127B2 - Mold for molding hollow package, hollow package and method for manufacturing the same - Google Patents

Description

  The present invention relates to a mold for molding a hollow package, a hollow package, and a manufacturing method thereof.

  Semiconductor devices (hereinafter referred to as chips) such as wireless devices used in mobile phones, optical devices used in optical communications, and sensing devices represented by infrared sensors are hermetically housed in packages such as resins. Are offered to the market.

  As such a hollow package, Japanese Patent Application Laid-Open No. 2011-1000082 provides a hollow cover portion 103 on a substrate 101 on which a chip 102 as shown in FIG. 11 is mounted. A configuration in which 104 is provided is disclosed.

JP 2011-1000082 A

  However, in the hollow package 100 according to Japanese Patent Application Laid-Open No. 2011-1000082, since the interface between the resin of the cap 103 and the joint 104 is exposed, there is a problem that a leak path is easily formed at this interface.

  That is, the interface between the cap 103 and the joint 104 is the shortest distance between the inside and the outside of the hollow package 100, and it is difficult to keep the inside of the package airtight.

  Accordingly, a main object of the present invention is to provide a hollow package molding die, a hollow package, and a method for manufacturing the same that can maintain the airtightness by making the interface as long as possible when a hollow package is formed from a plurality of resins. Is to provide.

  In order to solve the above-mentioned problems, a hollow package molding die for molding a hollow package that hermetically accommodates a chip mounted on a substrate is inserted into a pin hole and a pin hole so as to freely advance and retract. The cap position adjusting pin, the hole end at a position appropriately retracted from the inner surface of the upper mold, a protrusion hole for forming a protrusion molding space for molding the protrusion, and formed when the upper mold is clamped The resin is injected into the cap molding space and the projection molding space, and the first lower mold for molding the cap having the projection on the head, the substrate is placed, and the first after the cap is molded. A second lower mold exchanged with the lower mold, and an intermediate mold inserted between the upper mold and the second lower mold, and clamping the upper mold and the second lower mold via the intermediate mold The cap position adjustment pin is used to place the cap on the board so that the cap is placed on the board. Projecting side, a space is formed between the cap and the upper mold covers the cap is resin filled in the space, and wherein the molding the mold in close contact with the cap and the substrate.

  Further, in a hollow package in which a chip mounted on a substrate is hermetically sealed, a cap that encloses the chip, a protrusion that is molded integrally with the cap and protrudes from the head of the cap, and a protrusion In the state which the head of the part exposed, the said projection part, a cap, and the mold which covers are provided.

  Furthermore, a method for manufacturing a hollow package in which a chip mounted on a substrate is hermetically sealed includes molding a cap having an internal space in which the chip is accommodated, and forming a protrusion on the head of the cap. It includes a procedure, a cap placing procedure for placing the cap on the substrate, and a mold forming procedure for molding a mold that covers the projection and the cap with the head of the projection exposed.

  According to the present invention, when a hollow package is formed from a plurality of resins, the interface is made as long as possible, so that airtightness can be maintained.

It is sectional drawing of the hollow package concerning the 1st Embodiment of this invention. It is a flowchart which shows the manufacturing procedure of the hollow package concerning 1st Embodiment. FIG. 6 is a process diagram of molding a cap with the mold according to the first embodiment, where (a) is a sectional view of the mold when the upper mold and the first lower mold are clamped, and (b) is when the cap is molded. Sectional drawing of this metal mold | die, (c) is sectional drawing of a metal mold | die at the time of mold-opening an upper mold | type and a 1st lower mold | type. FIG. 6 is a process diagram of molding a mold with the mold according to the first embodiment, wherein (a) is a cross-sectional view of the mold when an intermediate mold is inserted between the upper mold and the second lower mold, (b). Is a sectional view of the mold when the upper mold and the second lower mold are clamped with the intermediate mold interposed therebetween, and (c) is a sectional view of the mold when the mold is molded. It is process drawing which shape | molds a cap with the metal mold | die concerning 2nd Embodiment, (a) is sectional drawing of the metal mold | die when the upper mold and the 1st lower mold are clamped, (b) is the time of cap molding Sectional drawing of this metal mold | die, (c) is sectional drawing of a metal mold | die at the time of mold-opening an upper mold | type and a 1st lower mold | type. FIG. 6A is a process diagram of molding a mold with a mold according to the second embodiment, and FIG. 5A is a cross-sectional view of the mold when the upper mold and the second lower mold are clamped with the intermediate mold interposed therebetween, and FIG. Is a sectional view of the mold when the cap is placed on the substrate, and (c) is a sectional view of the mold when the mold is molded. It is process drawing which shape | molds a cap with the metal mold | die concerning the 3rd Embodiment of this invention, (a) is sectional drawing of a metal mold | die at the time of clamp | tightening an upper mold | type and a 1st lower mold | type, (b) is a cap. Sectional drawing of the metal mold | die at the time of shaping | molding, (c) is sectional drawing of a metal mold | die when the upper mold and the 1st lower mold are opened. FIG. 10 is a process diagram of molding a mold with a mold according to the third embodiment, wherein (a) is a cross-sectional view of the mold when an intermediate mold is inserted between the upper mold and the second lower mold, (b). Is a sectional view of the mold when the upper mold and the second lower mold are clamped with the intermediate mold interposed therebetween, and (c) is a sectional view of the mold when the mold is molded. It is process drawing which shape | molds a cap with the metal mold | die concerning the 4th Embodiment of this invention, (a) is sectional drawing of a metal mold | die at the time of clamp | tightening an upper mold | type and a 1st lower mold | type, (b) is a cap. Sectional drawing of the metal mold | die at the time of shaping | molding, (c) is sectional drawing of a metal mold | die when the upper mold and the 1st lower mold are opened. FIG. 6A is a process diagram of molding a mold with a mold according to a fourth embodiment, where FIG. 5A is a sectional view of the mold when the upper mold and the second lower mold are opened, and FIG. Sectional view of the mold when the mold is clamped to the second lower mold, (c) is a sectional view of the mold when the mold is molded. It is sectional drawing of the hollow package concerning related technology.

<First Embodiment>
Next, an embodiment of the present invention will be described. FIG. 1 is a cross-sectional view of a hollow package 2 according to the present embodiment.

  In the hollow package 2, a cap 5 having a hollow structure is placed around a chip 4 mounted on a substrate 3, and a mold 6 is molded around the cap 5.

  The tip of the protrusion 5a of the cap 5 has the same surface as the upper surface 6a of the mold 6 or a structure protruding from the upper surface 6a by an appropriate amount. An epoxy resin is used as the material of the resin used for the cap 5 and the mold 6. However, this embodiment is not limited to an epoxy resin, and may be a thermosetting resin.

  Next, a method for manufacturing such a hollow package 2 will be described. FIG. 2 is a flowchart showing the manufacturing process, and FIGS. 3 and 4 are sectional views of the mold in each process.

  3A is a sectional view of the mold when the upper mold and the first lower mold are clamped, FIG. 3B is a sectional view of the mold when the cap is molded, and FIG. 3C. FIG. 5 is a cross-sectional view of the mold when the upper mold and the first lower mold are opened. 4A is a sectional view of the mold when the intermediate mold is inserted between the upper mold and the second lower mold, and FIG. 4B is the upper mold and the second lower mold with the intermediate mold interposed therebetween. A sectional view of the mold when the mold is clamped, and FIG. 4C is a sectional view of the mold when the mold is molded.

  For the manufacture of the hollow package 2, the upper mold 10, the first lower mold 20, the second lower mold 30, and the intermediate mold 40 are used. A pin hole 12 is formed in the upper mold 10, and a cap position adjusting pin 11 is inserted into the pin hole 12. Further, the first lower mold 20 is provided with a hollow convex portion 21 for forming a hollow portion (FIG. 3A).

  On the other hand, the substrate 3 is placed on the second lower mold 30 as shown in FIG. The intermediate mold 40 is a mold that forms a frame, and is disposed between the upper mold 10 and the second lower mold 30 (FIG. 4A).

  A method for manufacturing the hollow package 2 using such a mold will be described.

  Steps S1 and S2: The upper mold 10 and the first lower mold 20 are used, and these are clamped (FIG. 3A). At this time, the tip 11 a of the cap position adjusting pin 11 is a position retracted from the inner surface 10 a of the upper mold 10.

  That is, the pin hole 12 between the tip 11a of the cap position adjusting pin 11 and the inner surface 10a of the upper mold 10 forms a space K1. This space K1 is a space in which the protrusion 5a is molded. Hereinafter, the region of the pin hole 12 that forms the space K1 is referred to as a projection hole, and the space K1 is referred to as a projection molding space.

  When the upper mold 10 and the first lower mold 20 are clamped, a space K corresponding to the cap 5 is formed between them. Hereinafter, the space K is described as a cap molding space.

  Step S3: Therefore, the resin is injected into the cap molding space K (FIG. 3B). At this time, since the resin is also injected into the projection molding space K1, the cap 5 has a projection 5a at the head.

  Steps S4 to S6: When the molding of the cap 5 is completed, the mold is opened (FIG. 3C), and the first lower mold 20 is replaced with the second lower mold 30. The intermediate mold 40 is inserted between the upper mold 10 and the second lower mold 30. The substrate 3 on which the chip 4 is mounted is set on the second lower mold 30 (FIG. 4A).

  Steps S7 and S8: The upper mold 10 and the second lower mold 30 are clamped with the intermediate mold 40 interposed therebetween. Then, the cap position adjustment pin 11 is moved in the direction of the second lower mold 30 (FIG. 4B). The cap position adjustment pin 11 projects the cap 5 until the cap 5 contacts the substrate 3. As a result, the cap 5 is placed on the substrate 3 with the chip 4 included.

  At this time, the protruding portion 5a comes out of the pin hole 12. However, when the protrusion 5a is completely removed from the pin hole 12, the cap 5 is not supported. Therefore, since the protrusion 5a may be a very small amount, it is preferably fitted in the pin hole 12. Or the state in which the cap position adjustment pin 11 is pressing down the protrusion part 5a is preferable.

  Steps S9 and S10: When the cap 5 is moved by the cap position adjusting pin 11, a space K2 is formed between the cap 5 and the upper mold 10. This space K2 is a space corresponding to the mold 6. Hereinafter, this space K2 is referred to as a molding space.

  Resin is injected into the molding space K2. As a result, the mold 6 in close contact with the cap 5 containing the chip 4 and the substrate 3 is formed (FIG. 4C). Thereafter, the molded product (hollow package 2) is taken out and the molding process ends.

As described above, since the mold is overlaid on the cap containing the chip, the path length becomes long even in the situation where the interface between the cap and the mold becomes a leak path. It becomes possible to maintain airtightness.
<Second Embodiment>
A second embodiment of the present invention will be described. Note that description of the same configuration as that of the first embodiment is omitted as appropriate.

  In the first embodiment, in order to form a protrusion, the tip of the cap position adjustment pin is set to be retracted from the inner surface of the upper mold, and a molding space is formed using a part of the pin hole as a protrusion hole. did. In contrast, in the present embodiment, a protrusion hole for forming a protrusion space is separately provided.

  5 and 6, the method for manufacturing the hollow package according to this embodiment will be described. The upper mold 10 is provided with a protrusion hole 10b for forming a protrusion space K3 (FIG. 5A). The upper mold 10 is clamped with respect to the first lower mold 20, and the resin is injected into the formed cap molding space K (FIG. 5B). Thereby, the cap 5 provided with the protrusion 5a is molded. Thereafter, the mold is opened (FIG. 5C).

  Then, the first lower mold 20 is replaced with the second lower mold 30, and the intermediate mold 40 is inserted and clamped (FIG. 6A).

  Thereafter, the cap position adjusting pin 11 is moved to bring the cap 5 into contact with the substrate 3 (FIG. 6B). When the cap 5 comes into contact with the substrate 3, the cap position adjusting pin 11 is returned to the original position. Thereby, the front end surface of the cap position adjusting pin 11 coincides with the inner surface of the upper mold 10.

  Further, when the cap 5 comes into contact with the substrate 3, the protruding portion 5a is substantially removed from the protruding space K3. However, as shown in the enlarged view of FIG. The portion remains in the projection hole 10b. Thereby, the cap 5 is supported by the upper mold 10. A molding space K <b> 2 is formed between the upper mold 10 and the cap 5.

  Therefore, resin is injected into the molding space K2 (FIG. 6C). Thereby, the mold 6 is molded on the cap 5.

  Since a part of the protrusion 5a remains in the protrusion hole 10b, it is possible to prevent the resin from entering the protrusion hole 10b when the resin for molding the mold 6 is injected onto the cap 5. .

  That is, from the viewpoint of shortening the leak path, it is preferable that the protrusion is thin. In such a case, if the protrusion is pushed and the cap is placed on the substrate, it is assumed that the thin protrusion is deformed and the protrusion is completely removed from the protrusion hole 10b. In such a situation, when resin for molding is injected, this resin is also filled in the projection holes 10b, and defective products are generated.

  However, the cap position adjusting pin 11 according to the present embodiment can be set regardless of the diameter of the protrusion 5a and does not directly apply force to the protrusion 5a. The inconvenience that the resin is filled in the projection holes can be prevented.

As described above, since the mold is overlaid on the cap containing the chip, the path length becomes long even in the situation where the interface between the cap and the mold becomes a leak path. It becomes possible to maintain airtightness.
<Third Embodiment>
A third embodiment of the present invention will be described. Note that description of the same configuration as that of the first embodiment is omitted as appropriate. 7 and 8 are views showing a manufacturing process of the hollow package according to the present embodiment.

  The upper mold 10 according to this embodiment is provided with a protruding pin 13 in addition to a cap position adjusting pin (support pin) 11 (FIG. 7A). With the upper mold 10 and the first lower mold 20 clamped, the resin is injected into the cap molding space K (FIG. 7B). Thereby, the cap 5 is formed, and then the mold is opened (FIG. 7C).

  In the state where the upper mold 10 and the first lower mold 20 are clamped, the tip 12a of the cap position adjusting pin 11 is retracted from the inner surface 10a of the upper mold 10 as shown in FIG. It has become. That is, the pin hole 12 between the tip 12a of the cap position adjusting pin 11 and the inner surface 10a of the upper mold 10 is a projection molding space K1. Therefore, at the same time as the cap 5 is molded, the protrusion 5 a is molded on the head of the cap 5.

  After the cap 5 is molded, the mold is opened to replace the first lower mold 20 with the second lower mold 30, and the intermediate mold 40 is inserted between the upper mold 10 and the second lower mold 30 (FIG. 8 (a)). At this time, the substrate 3 on which the chip 4 is mounted is placed on the second lower mold 30.

  Next, the upper mold 10 and the second lower mold 30 are clamped via the intermediate mold 40, and the protruding pin 13 is moved in the direction of the second lower mold 30 to bring the cap 5 into contact with the substrate 3 (see FIG. 8 (b)). At this time, the tip 12 a of the cap position adjusting pin 11 is flush with the inner surface 10 a of the upper mold 10.

  Then, the protruding pin 13 is returned to the original position. When the projecting pin 13 is returned to the original position, the cap 5 is not supported. Therefore, the cap 5 is supported by moving the cap position adjusting pin 11 and pressing the protruding portion 5a.

  When the cap 5 is placed on the substrate 3, a molding space K <b> 2 is formed between the upper mold 10 and the cap 5. Therefore, a mold 6 is formed by injecting a resin into the molding space K2 (FIG. 8C).

  Note that when the molded cap 5 is pressed against the substrate 3, the cap position adjusting pin 11 can be driven and pressed. However, when the diameter of the protrusion 5a is thin, the protrusion 5a may be deformed by the force of the cap position adjustment pin 11. When the protrusion 5a is shortened due to this deformation, the molding space K2 and the pin hole 12 communicate with each other, and there arises a problem that the resin for forming the mold 6 flows into the pin hole 12.

Therefore, in the present embodiment, when the cap 5 is moved, the cap 5 is moved by the protruding pin 13 having a diameter larger than that of the cap position adjusting pin 11.
<Fourth Embodiment>
A fourth embodiment of the present invention will be described. Note that description of the same configuration as that of the first embodiment is omitted as appropriate.
In each embodiment described so far, the intermediate mold is configured to be inserted separately. In contrast, the intermediate mold according to the present embodiment is slidably provided on the upper mold.

  FIG. 9 is a diagram showing a process of molding the cap 5 using the upper mold 10 and the first lower mold each having such a slide-type intermediate mold 41. FIG. 10 is a view showing a process of forming the mold 6 by moving the slide type intermediate die 41.

  The slide type intermediate die 41 is provided so as to wrap around the outer periphery of the upper die 10 and is provided so as to be movable in the direction of the first lower die. In the manufacture of the cap 5, the parting surface of the intermediate die 41 is the same surface as the parting surface of the upper die 10 or a position that is appropriately retracted.

  Then, the upper mold 10 and the first lower mold 20 are clamped to form a cap molding space K (FIG. 9A). Therefore, the cap 5 is molded by injecting resin into the cap molding space K (FIG. 9B), and the mold is opened (FIG. 9C).

  Thereafter, the first lower mold 20 is replaced with the second lower mold 30. The substrate 3 on which the chip 4 is mounted is placed on the second lower mold 30 (FIG. 10A). Then, the intermediate die 41 and the cap position adjusting pin 11 are moved toward the second lower die 30 to bring the cap 5 into contact with the substrate 3 (FIG. 10B).

  As a result, a molding space K2 is formed between the upper mold 10 and the cap 5, so that resin is injected into the molding space K2 to form the mold 6 (FIG. 10C).

  As described above, since the mold is overlaid on the cap containing the chip, the path length becomes long even in the situation where the interface between the cap and the mold becomes a leak path. It becomes possible to maintain airtightness.

2 hollow package 3 substrate 4 chip 5 cap 5a projection 6 mold 10b projection hole 10a inner surface 10 upper mold 11 cap position adjustment pin (support pin)
12 pin hole 13 protruding pin 20 first lower mold 21 hollow convex part 30 second lower mold 40 intermediate mold 41 intermediate mold

Claims (10)

A mold for hollow package molding for molding a hollow package for hermetically containing a chip mounted on a substrate,
An upper mold having pin holes;
A cap position adjusting pin inserted in the pin hole so as to freely advance and retract;
A protrusion hole having a hole end at a position appropriately retracted from the inner surface of the upper mold and forming a protrusion molding space for molding the protrusion; and
A first lower mold for injecting resin into the cap molding space formed when the upper mold is clamped and the projection molding space, and molding a cap having the projection on the head;
A second lower mold that is placed on the substrate and replaced with the first lower mold after the cap is molded;
An intermediate mold inserted between the upper mold and the second lower mold,
When the upper mold and the second lower mold are clamped via the intermediate mold, the cap position adjusting pin projects the cap toward the substrate so that the cap is placed on the substrate, Forming a space between a cap and the upper mold, filling the space with a resin to cover the cap, and molding a mold that adheres closely to the cap and the substrate, for forming a hollow package Mold. The mold according to claim 1, wherein
The mold for hollow package molding, wherein the projection hole is a hole formed between an end surface of the cap position adjusting pin and an inner surface of the upper mold. The mold according to claim 1, wherein
A mold for forming a hollow package, wherein the projection hole is a hole formed in parallel with the pin hole by a predetermined amount from the inner surface of the upper mold. The mold according to claim 3, wherein
The length of the projection hole is appropriately longer than the amount of movement of the cap position adjustment pin, and when the cap is projected by the cap position adjustment pin, the projection portion molded into the projection hole is A mold for forming a hollow package, wherein a predetermined amount remains in the projection hole. The mold according to claim 1, wherein
The upper mold is provided with a projecting pin that projects a molded product and a support pin that presses and supports the cap against the substrate,
The hollow package molding, wherein the protruding pin is used as the cap position adjusting pin, and the support pin presses the cap against the substrate after the cap is placed on the substrate. Mold. The mold according to any one of claims 1 to 5,
The intermediate mold is provided on the outer peripheral portion of the upper mold so as to be able to advance and retract. When the cap is molded, the intermediate mold is retracted, and when the mold is molded, the intermediate mold is advanced to move to the second lower mold. A mold for hollow package molding characterized by being clamped to the mold. A hollow package in which a chip mounted on a substrate is hermetically sealed,
A cap containing the chip;
A protrusion formed integrally with the cap and protruding from the head of the cap;
A hollow package comprising: a mold that covers the projection and the cap in a state where the head of the projection is exposed. A method of manufacturing a hollow package in which a chip mounted on a substrate is hermetically sealed,
A cap molding procedure for forming a cap having an internal space in which the chip is accommodated and forming a protrusion on the head of the cap;
A cap placement procedure for placing the cap on the substrate;
A method of manufacturing a hollow package, comprising: a molding procedure for molding a mold that covers the projection and the cap with the head of the projection exposed. It is a manufacturing method of the hollow package according to claim 8,
The said cap placing procedure, when mounting the cap on the substrate, the molded the cap projecting from the upper mold of a hollow package, characterized in that it comprises a cap projecting procedure for placing the said substrate Production method. It is a manufacturing method of the hollow package according to claim 9,
The method for producing a hollow package, wherein the molding procedure includes a cap holding procedure for holding the cap projected by the cap projecting procedure with respect to the substrate.

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