JP6000735B2 - Tool management method - Google Patents

Description

  The present invention relates to a method for managing a tool mounted on a processing apparatus such as a grinding apparatus.

  As is well known to those skilled in the art, in a semiconductor device manufacturing process, a semiconductor wafer on which a plurality of devices such as ICs and LSIs are formed is ground by a grinding device on a back surface before being divided into individual chips. It is formed in the thickness. A grinding apparatus for grinding a back surface of a semiconductor wafer includes a chuck table having a holding surface for sucking and holding the wafer, a grinding means including a grinding wheel for grinding the wafer sucked and held by the holding surface of the chuck table, and the grinding Grinding feed means for grinding and feeding the means in a direction perpendicular to the holding surface of the chuck table. (For example, see Patent Document 1)

  The grinding wheel mounted on the above-mentioned grinding apparatus is a rough grinding wheel for rough grinding silicon, a finish grinding wheel for finish grinding silicon, a glass grinding wheel for grinding glass, and grinding sapphire. For this purpose, an optimum one corresponding to the material of the workpiece and the degree of grinding, such as a sapphire grinding wheel, is used.

JP 2002-200545 A

  Thus, when a grinding wheel is mounted on a grinding device, it is difficult to confirm the type of the grinding wheel, and the workpiece may be ground with a grinding wheel of a type that does not correspond to the type of workpiece. There is a problem of lowering the quality. Such a problem may also occur in a cutting apparatus equipped with a cutting blade for cutting a wafer.

  The present invention has been made in view of the above-mentioned fact, and the main technical problem thereof is a tool management method capable of easily confirming the type of tool such as a grinding wheel mounted on a processing apparatus such as a grinding apparatus. It is to provide.

In order to solve the main technical problem, according to the present invention, there is provided a method for managing a tool attached to a processing apparatus,
The tool that is housed in the tool case, or the tool case that houses the tool, a sticker that indicates the type of the tool is detachably attached,
When the tool is mounted on the processing apparatus, the seal is peeled off from the tool or the tool case that houses the tool so that at least the seal and the tool case are separated from each other, and the visible part of the processing apparatus We carry out seal desorption process to stick to
When the tool is removed from the processing device and accommodated in the tool case, the sticker attached to the visible part of the processing device is peeled off, and the sticking back process is performed to attach the tool or the tool case to the tool case. ,
A tool management method is provided.

In the tool management method according to the present invention, when the tool is mounted on the processing apparatus, the seal is peeled off from the tool or the tool case containing the tool so that at least the seal and the tool case are separated. When removing the tool from the processing device and placing it in the tool case, the seal attached to the visible portion of the processing device is peeled off and the tool or Since the sticker sticking back process for sticking back to the tool case that accommodates the tool is performed, the type of the tool mounted on the processing apparatus can always be visually confirmed. Accordingly, it is possible to solve the problem of reducing the quality of the workpiece without processing the workpiece with a tool of a kind that does not correspond to the type of workpiece.

The perspective view of the grinding apparatus as a processing apparatus for enforcing the management method of the tool by this invention. The perspective view which shows the tool case which accommodates the rough grinding wheel and rough grinding wheel with which the grinding apparatus shown in FIG. 1 is mounted | worn. The perspective view which shows the tool case which accommodates the finish grinding wheel and finish grinding wheel with which the grinding apparatus shown in FIG. 1 is mounted | worn.

  Hereinafter, a preferred embodiment of a tool management method according to the present invention will be described in more detail with reference to the accompanying drawings.

FIG. 1 is a perspective view of a grinding apparatus as a processing apparatus for carrying out the tool management method according to the present invention.
The grinding device 1 in the illustrated embodiment includes a device housing 2 having a substantially rectangular parallelepiped shape. A stationary support plate 21 is erected on the upper right end of the device housing 2 in FIG. Two pairs of guide rails 22, 22 and 23, 23 extending in the vertical direction are provided on the inner surface of the stationary support plate 21. A rough grinding unit 3 as rough grinding means is mounted on one guide rail 22, 22 so as to be movable in the vertical direction, and a finish grinding unit 4 as finish grinding means is vertically mounted on the other guide rail 23, 23. It is mounted to move in the direction.

  The rough grinding unit 3 is attached to a unit housing 31, a rough grinding wheel 33 attached to a wheel mount 32 rotatably attached to a lower end of the unit housing 31 by a mounting bolt 321, and an upper end of the unit housing 31. A servo motor 34 that rotates the wheel mount 32 in a direction indicated by an arrow 32 a and a moving base 35 on which the unit housing 31 is mounted via a support member 310 are provided. The rough grinding wheel 33 will be described later in detail.

  The movable base 35 is provided with guided rails 351 and 351, and the guided rails 351 and 351 are movably fitted to the guide rails 22 and 22 provided on the stationary support plate 21. The rough grinding unit 3 is supported so as to be movable in the vertical direction. The rough grinding unit 3 in the illustrated form includes rough grinding feed means 36 for moving the moving base 35 along the guide rails 22 and 22 and grinding and feeding the rough grinding wheel 33. The rough grinding feed means 36 includes a male screw rod 361 that is disposed on the stationary support plate 21 in the vertical direction parallel to the guide rails 22 and 22 and is rotatably supported, and a pulse motor for driving the male screw rod 361 to rotate. 362 and a female screw block (not shown) that is mounted on the moving base 35 and is screwed with the male screw rod 361. By driving the male screw rod 361 forward and backward by a pulse motor 362, the rough grinding unit 3 is It is moved in the vertical direction (direction perpendicular to the holding surface of the chuck table described later).

  The finish grinding unit 4 is also configured in the same manner as the rough grinding unit 3, and a finish grinding wheel mounted by a mounting bolt 421 on a unit housing 41 and a wheel mount 42 rotatably mounted on the lower end of the unit housing 41. 43, a servo motor 44 mounted on the upper end of the unit housing 41 and rotating the wheel mount 42 in the direction indicated by the arrow 42a, and a moving base 45 on which the unit housing 41 is mounted via a support member 410. doing. The finish grinding wheel 43 will be described later in detail.

  Guided rails 451 and 451 are provided on the moving base 45, and the guided rails 451 and 451 are movably fitted to the guide rails 23 and 23 provided on the stationary support plate 21. The finish grinding unit 4 is supported so as to be movable in the vertical direction. The finish grinding unit 4 in the illustrated form includes finish grinding feed means 46 for moving the moving base 45 along the guide rails 23 and 23 and grinding and feeding the finish grinding wheel 43. The finish grinding feed means 46 includes a male screw rod 461 that is disposed on the stationary support plate 21 in the vertical direction in parallel with the guide rails 23 and 23 and is rotatably supported, and a pulse motor for rotationally driving the male screw rod 461. 462 and a female screw block (not shown) that is mounted on the moving base 45 and screwed with the male screw rod 461. By driving the male screw rod 461 forward and backward by a pulse motor 462, the finish grinding unit 4 is It is moved in the vertical direction (direction perpendicular to the holding surface of the chuck table described later).

  The grinding apparatus in the illustrated embodiment includes a turntable 5 disposed so as to be substantially flush with the upper surface of the apparatus housing 2 on the front side of the stationary support plate 21. The turntable 5 is formed in a relatively large-diameter disk shape, and is appropriately rotated in a direction indicated by an arrow 5a by a rotation driving mechanism (not shown). In the illustrated embodiment, three chuck tables 6 are arranged on the turntable 5 so as to be rotatable in a horizontal plane at an equal angle of 120 degrees. The chuck table 6 includes a disk-shaped base 61 and a suction holding chuck 62 formed in a disk shape by a porous ceramic material, and a work piece placed on the suction holding chuck 62 (holding surface). Is sucked and held by operating a suction means (not shown). The chuck table 6 configured in this way is rotated in the direction indicated by the arrow 6a by a servo motor (not shown). The three chuck tables 6 arranged on the turntable 5 have a workpiece loading / unloading zone A, a rough grinding zone B, a finish grinding zone C, and a workpiece by appropriately rotating the turntable 5. It is sequentially moved to the loading / unloading area A.

  On the near side of the apparatus housing 2, a first cassette mounting portion 11a, a second cassette mounting portion 12a, a temporary placement portion 13a, and a cleaning portion 14a are provided. A first cassette 11 that accommodates a wafer before grinding is placed on the first cassette placement portion 11a, and a second cassette 12 that accommodates a wafer after grinding is placed on the second cassette placement portion 12a. It is supposed to be placed. The temporary placement unit 13a is provided with temporary placement means 13 for temporarily placing the unground wafer unloaded from the first cassette 11 placed on the first cassette placement unit 11a. The cleaning unit 14a is provided with cleaning means 14 for cleaning the ground wafer.

  A conveying means 15 is disposed between the first cassette placing portion 11a and the second cassette placing portion 12a, and the conveying means 15 is placed on the first cassette placing portion 11a. The unground wafer stored in the first cassette 11 is carried out to the temporary placing means 13 and the ground wafer cleaned by the cleaning means 14 is placed on the second cassette placing portion 12a. 2 to the second cassette 12. A carry-in means 16 is disposed between the temporary placement portion 13a and the workpiece loading / unloading area A, and this carry-in means 16 works the wafer before grinding placed on the temporary placement means 13 to be machined. It is transported onto the chuck table 6 positioned in the material loading / unloading area A. An unloading means 17 is disposed between the workpiece loading / unloading area A and the cleaning unit 14a. The unloading means 17 is placed on the chuck table 6 positioned in the workpiece loading / unloading area A. The mounted wafer after grinding is transported to the cleaning means 14.

Next, the rough grinding wheel 33 and the finish grinding wheel 43 will be described with reference to FIGS.
FIG. 2A shows a perspective view of a rough grinding wheel 33 as a rough grinding tool, and FIG. 2B shows a perspective view of a tool case 7 for housing the rough grinding wheel 33. FIG. 2C is a perspective view showing a state in which the rough grinding wheel 33 is accommodated in the tool case 7. A rough grinding wheel 33 shown in FIG. 2A is composed of an annular grindstone base 331 and a plurality of segments comprising a rough grinding grindstone 332 mounted on the lower surface of the grindstone base 331. A female screw hole 331a is formed in the grindstone base 331, and a wheel mount 321 (see FIG. 1) is inserted into the female screw hole 331a and the wheel mount 32 is inserted into the wheel mount 331a. 32. In the illustrated embodiment, the coarse grinding wheel 332 is formed by bonding # 300 diamond abrasive grains with metal bonds to an outer diameter of 450 mm. The rough grinding wheel 33 configured as described above is set for rough grinding of a silicon wafer having a diameter of 300 mm.

  A tool case 7 shown in FIG. 2B includes a storage portion 71 and a lid portion 73 connected to the storage portion 71 through a hinge 72 so as to be openable and closable, and is integrally formed of an appropriate synthetic resin. . In addition, as a synthetic resin which integrally molds the tool case 7, recyclable polypropylene is desirable. The storage portion 71 has a bottom wall 711 and a side wall 712 formed upright from the outer peripheral edge of the bottom wall 711. At the center of the upper surface of the bottom wall 711, a restricting portion 711a for fitting and restricting the position of the annular grindstone base 331 of the rough grinding wheel 33 is provided so as to protrude. The lid portion 73 has a top wall 731 and a side wall 732 formed to hang from the outer peripheral edge of the top wall 731. The storage portion 71 and the lid portion 73 described above are connected so that the side wall 712 and the side wall 732 can be opened and closed via the hinge 72. The storage portion 71 and the lid portion 73 configured as described above are provided with a lock unit 74 that maintains a closed state when the lid portion 73 is closed to the storage portion 71. The locking means 74 includes a locking projection 741 provided on the side wall 712 of the storage portion 71 and an engagement piece 742 provided on the side wall 732 of the lid portion 73. The closing means shown in FIG. The engaging piece 742 is configured to engage with the locking protrusion 741 in the state. The annular rough grinding wheel 33 is fitted and accommodated in the restricting portion 711 a of the storage portion 71 in the tool case 7 configured as described above, and the engagement piece 742 of the lid portion 73 is engaged with the locking protrusion 741 of the storage portion 71. Engage and close.

  As shown in FIG. 2C, a seal 70 indicating the type of the coarse grinding wheel 33 is detachably attached to the surface of the lid portion 73 constituting the tool case 7 described above. This seal 70 has a product number, a type of rough grinding wheel 332 (# 300 diamond abrasive grains are bonded to each other with a metal bond and formed to an outer diameter of 450 mm), and a use (rough grinding of a silicon wafer having a diameter of 300 mm). For). The seal 70 indicating the type of the coarse grinding wheel 33 may be attached to the upper surface of the grindstone base 331 constituting the coarse grinding wheel 33.

Next, the finish grinding wheel 43 will be described with reference to FIG.
3A shows a perspective view of a finish grinding wheel 43 as a finish grinding tool, and FIG. 3B shows a perspective view of a tool case 8 for housing the finish grinding wheel 43. As shown in FIG. FIG. 3C is a perspective view of the finish grinding wheel 43 accommodated in the tool case 8. The finish grinding wheel 43 shown in FIG. 3A is composed of an annular grindstone base 431 and a plurality of segments comprising a grinding grindstone 432 mounted on the lower surface of the grindstone base 431. A female screw hole 431a is formed in the grindstone base 431, and a mounting bolt 421 (see FIG. 1) disposed through the wheel mount 42 is screwed into the female screw hole 431a. 42 is attached. In the illustrated embodiment, the finish grinding wheel 432 is formed by bonding # 2000 diamond abrasive grains with a resin bond to an outer diameter of 450 mm. The finish grinding wheel 43 configured as described above is set for finish grinding of a silicon wafer having a diameter of 300 mm.

  A tool case 8 shown in FIG. 3 (b) has a storage part 81, a storage part 81, and a hinge that are configured substantially the same as the tool case 7 that stores the rough grinding wheel 33 shown in FIG. The lid portion 83 is connected to be openable and closable via 82, and is integrally formed of an appropriate synthetic resin. The storage part 81 has a bottom wall 811 and a side wall 812 formed upright from the outer peripheral edge of the bottom wall 811. At the center of the upper surface of the bottom wall 811, a restricting portion 811 a for fitting and restricting the position of the annular grindstone base 431 of the finish grinding wheel 43 is provided so as to protrude. The lid portion 83 includes a top wall 831 and a side wall 832 formed to hang from the outer peripheral edge of the top wall 831. The storage portion 81 and the lid portion 83 described above are connected so that the side wall 812 and the side wall 832 can be opened and closed via the hinge 82. The storage portion 81 and the lid portion 83 configured as described above are provided with a lock unit 84 that maintains a closed state when the lid portion 83 is closed to the storage portion 81. The locking means 84 includes a locking projection 841 provided on the side wall 812 of the storage portion 81 and an engagement piece 842 provided on the side wall 832 of the lid portion 83. The locking means 84 is shown in FIG. The engaging piece 842 is configured to engage with the locking protrusion 841 in the state. In the tool case 8 configured in this manner, the annular finishing grinding wheel 43 is fitted and accommodated in the restricting portion 811a of the accommodating portion 81, and the engaging piece 842 of the lid portion 83 is engaged with the locking protrusion 841 of the accommodating portion 81. Engage and close.

  As shown in FIG. 3C, a seal 80 for indicating the type of the finish grinding wheel 43 is detachably attached to the surface of the lid portion 83 constituting the tool case 8 described above. This seal 80 has a product number, type of finish grinding wheel 432 (bonded with # 2000 diamond abrasive grains by resin bond to form an outer diameter of 450 mm), application (finish grinding of silicon wafer with a diameter of 300 mm) For). The seal 80 indicating the type of the finish grinding wheel 43 may be attached to the upper surface of the grindstone base 431 constituting the finish grinding wheel 43.

  In order to attach the rough grinding wheel 33 and the finish grinding wheel 43 to the grinding apparatus 1 shown in FIG. 1, the lid portion 73 of the tool case 7 and the lid portion 83 of the tool case 8 are opened to store the tool case 7. The coarse grinding wheel 33 and the finish grinding wheel 43 are taken out from the storage part 71 of the tool case 8 and the tool case 8 and mounted on the wheel mount 32 of the coarse grinding unit 3 and the wheel mount 42 of the finish grinding unit 4 as described above. And the seal | sticker 70 and the seal | sticker 80 which are stuck to the cover part 73 of the tool case 7 and the cover part 83 of the tool case 8 so that removal | desorption is possible are peeled, and it is a site | part which can be visually observed of the grinding apparatus 1 shown in FIG. Adhering to the front upper surfaces D1a and D1b of the device housing 2 (seal desorption process). In addition, the site | part which sticks the seal | sticker 70 and the seal | sticker 80 can confirm visually the rough grinding wheel 33 and the finish grinding wheel 43 with which the wheel mount 32 of the rough grinding unit 3 and the wheel mount 42 of the finish grinding unit 4 were mounted | worn. For example, D2a and D2b which are side surfaces of the support member 310 that supports the unit housing 31 of the rough grinding unit 3 and the support member 410 that supports the unit housing 41 of the finish grinding unit 4 are also effective. In this way, the seal 70 and the seal 80 that display the types of the rough grinding wheel 33 and the finish grinding wheel 43 mounted on the wheel mount 32 of the rough grinding unit 3 and the wheel mount 42 of the finish grinding unit 4 are visually checked by the grinding device 1. Since it sticks to the possible part, the kind of rough grinding wheel 33 and finish grinding wheel 43 with which grinding device 1 is equipped can always be checked visually.

The grinding apparatus 1 in the illustrated embodiment is configured as described above, and the operation thereof will be briefly described below with reference mainly to FIG.
In addition, the wafer W as a workpiece accommodated in the first cassette 11 is made of a silicon wafer having a diameter of 300 mm in the illustrated embodiment, and a protective tape T is attached to the surface. In this way, a plurality of wafers W having the protective tape T attached to the front surface are accommodated in the first cassette 11 with the back surface facing up.

  As described above, the pre-grinding wafer W accommodated in the first cassette 11 is transported to the temporary placement means 13 by the vertical movement and forward / backward movement of the transport means 15, and is centered here. Next, the loading means 16 is actuated to place the wafer W centered in the temporary placing means 13 on the chuck table 6 positioned in the workpiece loading / unloading area A. Thus, the wafer W placed on the chuck table 6 positioned in the work carry-in / out area A is sucked and held on the chuck table 6 via the protective tape T by operating a suction means (not shown). Is done. Therefore, the back surface of the wafer W sucked and held on the chuck table 6 via the protective tape T is the upper side. Next, the turntable 5 is rotated 120 degrees in the direction indicated by the arrow 5a by a rotation driving mechanism (not shown), and the chuck table 6 that sucks and holds the wafer W is positioned in the rough grinding region B.

  If the chuck table 6 holding the wafer W is positioned in the rough grinding region B, the chuck table 6 is rotated at a rotational speed of, for example, 300 rpm in the direction indicated by the arrow 6a by a rotary drive mechanism (not shown). On the other hand, the grinding wheel 33 of the rough grinding unit 3 is roughly ground and fed at a predetermined grinding feed speed by the rough grinding feed means 36 while rotating at a rotational speed of 6000 rpm, for example, in the direction indicated by the arrow 32a. As a result, the rear surface (surface to be ground) of the wafer W on the chuck table 6 is subjected to rough grinding (rough grinding step).

  During this time, the wafer W before grinding is placed on the next chuck table 6 positioned in the workpiece loading / unloading area A as described above. The wafer W is sucked and held on the chuck table 6 by operating a suction means (not shown). Next, the turntable 5 is rotated 120 degrees in the direction shown by the arrow 5a, the chuck table 6 holding the roughly ground wafer W is positioned in the finish grinding area C, and the wafer W before grinding is processed. Is positioned in the rough grinding region B. In this way, the rough grinding unit 3 performs the above-described rough grinding on the back surface of the wafer W before the rough grinding held on the chuck table 6 positioned in the rough grinding region B (rough grinding). Process).

  On the other hand, the back surface of the roughly ground wafer W held on the chuck table 6 positioned in the finish grinding region C is subjected to finish grinding by the finish grinding unit 4 (finish grinding step). That is, the chuck table 6 holding the roughly ground wafer W is rotated at a rotational speed of, for example, 300 rpm in the direction indicated by the arrow 6a by a rotation driving mechanism (not shown). On the other hand, the finish grinding wheel 43 of the finish grinding unit 4 is finish ground and fed at a predetermined finish grinding feed speed by the finish grinding feed means 46 while rotating at a rotational speed of 6000 rpm, for example, in the direction indicated by the arrow 42a. As a result, the back surface (surface to be ground) of the wafer W on the chuck table 6 is subjected to finish machining (finish grinding process).

  As described above, the rough grinding process is performed on the back surface of the wafer W before the rough grinding process held on the chuck table 6 positioned in the rough grinding process area B, and the chuck table is positioned in the finish grinding process area C. If finish grinding is performed on the back surface of the wafer W held on 6 and roughly ground, the turntable 5 is rotated 120 degrees in the direction indicated by the arrow 5a to hold the wafer W subjected to finish grinding. The chuck table 6 is positioned in the workpiece loading / unloading area A. The chuck table 6 holding the wafer W subjected to rough grinding in the rough grinding zone B is held in the finish grinding zone C, and the chuck table 6 holding the wafer W before grinding in the workpiece loading / unloading zone A. Are moved to the rough grinding zone B, respectively.

  The chuck table 6 that has returned to the workpiece loading / unloading zone A via the rough grinding zone B and the finish grinding zone C releases the suction holding of the wafer W that has been ground here. Then, the finish-ground wafer W on the chuck table 6 positioned in the workpiece loading / unloading area A is unloaded to the cleaning unit 14 by the unloading unit 17. The wafer W conveyed to the cleaning means 14 is spin-dried while the grinding debris adhering to the back surface (grind surface) and the side surface is cleaned and removed. The wafer W thus cleaned and spin-dried is transported and stored in the second cassette 12 by the transport means 15.

  The rough grinding process and the finish grinding process described above are performed on all the pre-grinding wafers W accommodated in the first cassette 11. When grinding a workpiece of a type different from the wafer W, the rough grinding wheel 33 and the finish grinding wheel 43 mounted on the wheel mount 32 of the rough grinding unit 3 and the wheel mount 42 of the finish grinding unit 4 are used. It needs to be replaced. When the rough grinding wheel 33 and the finish grinding wheel 43 are removed in order to replace the rough grinding wheel 33 and the finish grinding wheel 43, the above-mentioned D1a and D1b or D2a and D2b, etc., which are visible portions of the processing apparatus 1 are used. The adhered seal 70 and the seal 80 are peeled off, and the peeled seal 70 and the seal 80 are respectively separated from the surface of the lid portion 73 constituting the tool case 7 and the surface of the lid portion 83 constituting the tool case 8 or rough. Affixing back to the upper surface of the grindstone base 331 constituting the grinding wheel 33 and the upper surface of the grindstone base 431 constituting the finish grinding wheel 43 (seal pasting step). The rough grinding wheel 33 and the finish grinding wheel 43 removed from the wheel mount 32 of the rough grinding unit 3 and the wheel mount 42 of the finish grinding unit 4 are the tool case 7 and the tool case 8 to which the seal 70 and the seal 80 are attached. Housed in each.

  As described above, the rough grinding wheel 33 and the finish grinding wheel 43 attached to the wheel mount 32 of the rough grinding unit 3 and the wheel mount 42 of the finish grinding unit 4 are removed and accommodated in the tool case 7 and the tool case 8 and sealed. If the returning process is performed, the grinding wheel of the type corresponding to the workpiece to be ground next is mounted on the wheel mount 32 of the rough grinding unit 3 and the wheel mount 42 of the finish grinding unit 4, and the above-described seal demounting process. To implement.

  As described above, in the tool management method in the illustrated embodiment, when the rough grinding wheel 33 and the finish grinding wheel 43 are mounted on the grinding apparatus 1, the tool that accommodates the rough grinding wheel 33 and the finish grinding wheel 43. The seal 70 and the seal 80 that indicate the type of grinding wheel that is detachably attached to the lid 73 of the case 7 and the lid 83 of the tool case 8 are peeled off, and each is attached to a visible part of the grinding apparatus 1. When the coarse grinding wheel 33 and the finish grinding wheel 43 are removed and accommodated in the tool case 7 and the tool case 8 in order to replace the coarse grinding wheel 33 and the finish grinding wheel 43, the grinding device 1 is visible. The seal 70 and the seal 80 attached to the part are peeled off, and the peeled seal 70 and the seal 80 are removed. The surface of the lid portion 73 constituting the tool case 7 and the surface of the lid portion 83 constituting the tool case 8, or the upper surface of the grindstone base 331 constituting the rough grinding wheel 33 and the grindstone base 431 constituting the finish grinding wheel 43. Therefore, the types of the rough grinding wheel 33 and the finish grinding wheel 43 attached to the grinding apparatus can be always visually confirmed. Therefore, it is possible to eliminate the problem of reducing the quality of the workpiece without grinding the workpiece with a type of grinding wheel that does not correspond to the type of workpiece.

  Although the present invention has been described based on the illustrated embodiment, the present invention is not limited to the embodiment, and various modifications are possible within the scope of the gist of the present invention. For example, in the above-described embodiment, an example in which the present invention is applied to a grinding apparatus has been shown. However, the present invention can be widely applied to other processing apparatuses such as a cutting apparatus to which a cutting blade is attached.

2: Equipment housing 3: Coarse grinding unit 33: Coarse grinding wheel 331: Grinding wheel base 332: Coarse grinding wheel 36: Coarse grinding feed means 4: Finish grinding unit 43: Finish grinding wheel 431: Grinding wheel base 432: Finish grinding wheel 46: Finish grinding feed means 5: Turntable 6: Chuck table 7, 8: Tool case 70, 80: Seal 11: First cassette 12: Second cassette 13: Temporary placing means 14: Cleaning means 15: Conveying means 16: Loading means 17: Unloading means
W: Wafer

Claims (1)

A method for managing a tool mounted on a processing apparatus,
The tool that is housed in the tool case, or the tool case that houses the tool, a sticker that indicates the type of the tool is detachably attached,
When the tool is mounted on the processing apparatus, the seal is peeled off from the tool or the tool case that houses the tool so that at least the seal and the tool case are separated from each other, and the visible part of the processing apparatus We carry out seal desorption process to stick to
When the tool is removed from the processing device and accommodated in the tool case, the sticker attached to the visible part of the processing device is peeled off, and the sticking back process is performed to attach the tool or the tool case to the tool case. ,
Tool management method characterized by the above.

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