JP5997666B2 - Laser heat treatment equipment - Google Patents

Description

  The present invention relates to a laser processing apparatus that performs various processing on a workpiece by irradiating the workpiece with laser light.

  2. Description of the Related Art Conventionally, there has been known a laser quenching apparatus that performs a quenching process by irradiating a surface of a workpiece such as carbon steel with a laser beam to heat a portion irradiated with the laser beam to an austenite state. In this case, the rapid cooling of the part heated to the austenite state in the work piece is performed by heat diffusion and heat conduction into and around the work piece after the laser beam passes. For example, in Patent Document 1 below, the efficiency is obtained by translating these laser light spots by the pitch of each laser light spot in a state where a plurality of elliptical laser light spots are formed at equal intervals on the workpiece. A laser hardening apparatus is disclosed in which a quenching process is performed.

JP 2007-63606 A

  However, in the laser hardening apparatus disclosed in Patent Document 1, since the laser beam is irradiated only once on the portion to be processed, the workable workpiece is optimally heated by the single laser beam irradiation. There was a problem that it was limited to the material and the shape of being made.

  The present invention has been made to address the above problems, and an object of the present invention is to provide a laser processing apparatus capable of processing a workpiece having a wide range of materials and shapes with a laser beam.

In order to achieve the above object, a feature of the present invention is that, in a laser processing apparatus that forms a light spot by a laser beam on the surface of a workpiece and processes the workpiece, the light spot is applied to the workpiece. Light spot scanning means for relative displacement, laser light emitting means for emitting a plurality of laser beams for forming a plurality of light spots in a state of being aligned along the relative displacement direction of the light spot on the workpiece, and a plurality of lights and a light spot position changing means for changing the position of the relative displacement direction of the light spot in the spot, the light spot scanning means is in shall successively passed through a plurality of light spots relative to the working target portion in the workpiece The laser beam emitting means has a plurality of laser light sources along a direction orthogonal to the relative displacement direction of the light spot, and also controls the output intensity between the plurality of laser light sources. Airu is in Rukoto are arranged by shifting the laser light source among the laser beam emitting unit adjacent to each other in the relative displacement direction of the light spot so that uniform. In this case, the processing using the laser beam performed by the laser processing apparatus includes surface modification treatment on the workpiece such as laser quenching, tempering, annealing or normalization, and different or similar types on the workpiece. There are laser welding for bringing materials into close contact and laser welding for connecting two workpieces to each other.

  According to the feature of the present invention configured as described above, the laser processing apparatus allows a plurality of light spots formed by the laser light emitting means to pass through the workpiece to be processed sequentially, thereby passing the workpiece to the workpiece. Since the amount, time, and method of applying heat can be freely set, it is possible to perform processing on workpieces of various types of materials and shapes as compared with the case where laser light is irradiated only once. Further, according to the feature of the present invention, in the case of performing a heat treatment such as a quenching process on a workpiece, the laser processing apparatus is a part that has been quenched by a preceding laser beam like the laser quenching apparatus in the prior art. Can be prevented from being re-heated and tempered by the subsequent laser light, and thus uniform and accurate heat treatment can be performed while suppressing unevenness.

According to another feature of the present invention configured as described above, the laser processing apparatus has a plurality of exits for emitting laser light along a direction orthogonal to the relative displacement direction of the light spot and the relative displacement of the light spot. The emission ports are arranged so as to be shifted between the laser beam emission means adjacent to each other in the direction. As a result, the laser processing apparatus can form a long light spot extending in a direction orthogonal to the relative displacement direction of the light spot, and light between the laser light emitting means adjacent to each other in the relative displacement direction of the light spot. It is possible to make the light intensity of the irradiated laser light uniform while suppressing unevenness of the light intensity in the direction in which the spot extends.

Another feature of the present invention is that in the laser processing apparatus, the laser beam emitting means is provided in a number corresponding to the plurality of light spots, and the laser beam emitting means emits the light spot position changing means. The laser light emitting means is supported in a state where at least one of the position and direction of the laser light can be changed.

According to another feature of the present invention configured as described above, the laser processing apparatus includes a plurality of laser beam emitting means, and the laser beam emitting means has at least one of the position and the direction of the emitted laser light. Since it is supported at the time of change, it is possible to make it easier to adjust the output of each laser beam as compared with the method of splitting the laser beam emitted from one laser beam emitting means.

Another feature of the present invention is that in the laser processing apparatus, the light spot position changing means changes at least one of the plurality of light spots in a direction intersecting a relative displacement direction by the light spot scanning means. is there. In this case, the light spot position changing means may change the light spot in a direction orthogonal to the relative displacement direction of the light spot by the light spot scanning means.

According to another feature of the present invention configured as described above, in the laser processing apparatus, the light spot position changing unit can change the light spot in a direction intersecting the relative displacement direction of the light spot by the light spot scanning unit. Therefore, the amount, time, and method of applying heat to the workpiece can be freely set according to the material, shape or processing range of the workpiece.

Another feature of the present invention is that in the laser processing apparatus, the laser light emitting means forms a plurality of light spots on the workpiece in a state of being aligned along a direction perpendicular to the relative displacement direction of the light spot. It is to emit a plurality of laser beams.

According to another aspect of the invention configured as described above, the laser processing apparatus forms a plurality of light spots on a workpiece in a state of being aligned along a direction perpendicular to the relative displacement direction of the light spot. The width of the processing range can be widened and processing can be performed efficiently.

  Another feature of the present invention is that, in the laser processing apparatus, the laser light emitting means forms a rectangular light spot extending in a direction perpendicular to the relative displacement direction of the light spot on the workpiece. is there.

It is the block diagram which showed typically the structure of the laser processing apparatus which concerns on one Embodiment of this invention. It is a front view which shows typically the internal structure of the laser emission unit which comprises the laser processing apparatus shown in FIG. It is a top view which shows typically the arrangement configuration of the laser emission unit group which comprises the laser processing apparatus shown in FIG. It is a top view which shows typically the light spot formed on a to-be-processed object. It is the graph which showed a mode that a workpiece was heated by four laser beams which are displaced, the vertical axis | shaft has shown the temperature on a workpiece and the horizontal axis has shown the position on a workpiece. It is a top view which shows typically the light spot formed on the to-be-processed object which concerns on the modification of this invention. It is a top view which shows typically the light spot formed on the to-be-processed object which concerns on the other modification of this invention. It is a top view which shows typically the arrangement configuration of the laser emission unit group which comprises the laser processing apparatus which concerns on the other modification of this invention. (A)-(B) are the graphs which showed the light intensity of one light spot formed in the to-be-processed object, (A) is a vertical axis | shaft showing light intensity and a horizontal axis is an X-axis direction. (B) is a diagram in which the vertical axis indicates the light intensity, the horizontal axis indicates the Y-axis direction, and (C) is an enlarged view of the portion indicated by the broken-line circle in (B). is there.

(Configuration of laser processing apparatus 100)
Hereinafter, an embodiment of a laser processing apparatus according to the present invention will be described with reference to the drawings. FIG. 1 is a block diagram schematically showing the configuration of a laser processing apparatus 100 according to the present invention. Note that the drawings referred to in this specification are schematically shown by exaggerating some of the components in order to facilitate understanding of the present invention. For this reason, the dimension, ratio, etc. between each component may differ. This laser processing apparatus 100 is a laser heat treatment apparatus that irradiates a laser beam onto a workpiece WK made of carbon steel and performs a quenching process on a surface layer by computer control (NC control).

  The laser processing apparatus 100 includes a table 101. The table 101 is a plate-like mounting table that detachably holds the workpiece WK, and is supported by the feeding device 102. The feed device 102 is a mechanical device for displacing the table 101 in two axial directions, the illustrated X-axis direction and the illustrated Y-axis direction, which are orthogonal to each other within the same plane, and includes a feed screw mechanism. . In this case, in the feed screw mechanism, male screws are formed and feed screw shafts (not shown) extending in the X-axis direction and Y-axis direction shown in the drawing, and female screws meshing with these male screws are formed on the table 101, respectively. And nut portions (not shown) that are directly or indirectly connected to each other. In FIG. 1, the X-axis direction is the left-right direction, and the Y-axis direction is the depth direction of the page.

  A feed motor (not shown) is connected to each of the feed screw shafts extending in the illustrated X-axis direction and the illustrated Y-axis direction in the feed mechanism. Each of these feed motors is an electric motor (servo motor in the present embodiment) that rotates each feed screw shaft in the forward rotation direction and the reverse rotation direction, and the operation is controlled by the control unit 120 described later. .

  A laser emission unit 110 is provided above the table 101. As shown in FIGS. 2 and 3, the laser emission unit 110 is an apparatus for emitting laser light L to the workpiece WK held on the table 101, and is provided in the metal casing 110a. The laser light source 111 and the condensing optical system 113 are mainly provided. The laser light source 111 is an optical element that emits a laser beam L for heating the workpiece WK, and includes a plurality of semiconductor laser chips arranged in a line. In the present embodiment, the laser light source 111 is configured by arranging 32 semiconductor laser chips having a wavelength of 800 nm and an output of 2 W in a line at intervals of 200 μm in the Y-axis direction in the drawing. 2 and 3, the number of laser light sources 111 is less than 32.

The operation of each of these laser light sources 111 is controlled by a laser power source 112. The laser power source unit 112 is a switching power source that functions as a driver for controlling the operation of the laser light source 111 by supplying power supplied from an external power source (not shown) to the laser light source 111 according to the operation control of the control unit 120. is there. In this case, the laser power source unit 112 controls whether the laser beam L is emitted and the output intensity of the laser beam L independently for each laser emitting unit 110 by the operation control of the control unit 120, and the laser beam from the laser light source 111 L is continuously oscillated.

  The condensing optical system 113 is composed of an assembly of optical lenses such as a cylindrical lens that condenses each laser light L emitted from the 32 laser light sources 111 onto the workpiece WK. In the present embodiment, the condensing optical system 113 condenses each laser light L emitted from each of the 32 laser light sources 111 into a rectangular shape extending in the Y-axis direction in the figure on the workpiece WK. Form.

  In the laser emission unit 110, four laser emission units 110 arranged in the X-axis direction in the figure constitute a set of laser emission unit groups 114, and this set of laser emission unit groups 114 is shown in the Y-axis in the figure. Two rows are provided in the direction. Each laser emission unit 110 constituting these two sets of laser emission unit groups 114 is supported by a support frame 117 via a support unit 115.

The support unit 115 is a device that supports the laser emission unit 110 in a state in which the position of the light spot SP emitted from the laser emission unit 110 and formed on the workpiece WK on the XY plane in the figure can be changed. is there. Specifically, the support unit 115 includes a known four-axis stage (a stage in which a known gonio (tilt) stage is combined with a known XY stage), and the laser emission unit 110 is illustrated in the X-axis direction shown in the figure. In the illustrated Y axis direction, in the θ _X rotation direction around the X axis shown in the drawing, and in the θ _Y rotation direction around the Y axis shown in the drawing, they are supported in a linearly displaceable and rotationally displaceable state.

  In this case, the support unit 115 displaces the laser emission unit 110 for each axis by rotational driving of a drive motor (not shown) provided for each axis. In this case, the drive motor that drives each axis is constituted by, for example, a servo motor, and is rotationally driven by operation control by the motor drive unit 116. The motor drive unit 116 is a driver circuit that independently controls the rotational drive of the drive motor that drives each axis in the support unit 114 by the operation control of the control unit 120.

  The support frame 117 is a metal frame-like component that supports the eight laser emitting units 110 in a state where they are suspended through the support unit 115. The support frame 117 is supported in a state displaceable in the Z-axis direction in the drawing by a feed mechanism (not shown) whose operation is controlled by the control unit 120.

  The control unit 120 is configured by a microcomputer including a CPU, a ROM, a RAM, and the like. The control unit 120 comprehensively controls the entire operation of the laser processing apparatus 100 and a machining program (not shown) (not shown) prepared by an operator. The thermal processing of the workpiece WK is controlled by relatively displacing the table 101 and the laser emitting unit 110 while emitting the laser light L from the laser emitting unit 110 according to the (Numerical Control) program). In addition, the control unit 120 includes an operation panel 121 including a group of operation switches for receiving an operation from the worker with respect to the control unit 120, and a liquid crystal display for displaying an operation status of the control unit 120 to the worker. Each display device 122 is provided.

(Operation of laser processing apparatus 100)
Next, the operation of the laser processing apparatus 100 configured as described above will be described. First, an operator who performs heat treatment on the workpiece WK sets the formation position of the light spot SP after setting the workpiece WK on the table 101. The formation positions of the light spots SP are set as the formation positions on the workpiece WK of the four light spots SP formed by the four laser emission units 110 constituting the two sets of laser emission unit groups 114, respectively. To do.

Specifically, the operator instructs the control unit 120 to emit weak laser beams L from the eight laser emission units 110 via the operation panel 121, and controls the control unit via the operation panel 121. rotation angle and the rotation angle in the illustrated theta _Y direction of rotation shown theta _X direction of rotation instructs a position on the eight illustrated X-Y axis plane of the laser emitting unit 110 with respect to 120, i.e., the inclination of the laser beam emission unit 110 Specify the angle.

In response to this instruction, the control unit 120 controls the operation of the laser power source unit 112 to emit the weak laser beam L from each laser emitting unit 110 to form the light spot SP as shown in FIG. By controlling the operation of the motor drive unit 116 in this state, the respective positions of the laser emitting unit 110 supported by the support unit 115 in the illustrated X axis, the illustrated Y axis, the illustrated θ _X rotation direction, and the illustrated θ _Y rotation direction are positioned. Thus, the operator can adjust and set the position on the XY axis plane in the drawing while confirming the position of the light spot SP formed on the workpiece WK.

  In the present embodiment, the operator arranges four light spots SP side by side at the same position on the Y axis in the figure for each laser emission unit group 114 and positions the four light spots SP on the X axis in the figure. That is, the interval Δ between the adjacent light spots SP is set to 2 mm. In this case, the operator adjusts so that the ends of the two light spots SP adjacent to each other in the Y-axis direction shown in FIG. Thereby, a strip-shaped light spot SP having a length corresponding to approximately two light spots SP is formed in the Y-axis direction in the figure on the workpiece WK.

  Next, the operator performs laser output setting. This laser output setting is for setting the output intensity of the laser beam L output from each of the eight laser emitting units 110. Specifically, the operator sets the intensity of the laser light L emitted from each of the eight laser emission units 110 to the control unit 120 via the operation panel 121. In the present embodiment, if the output intensity of the laser emitting unit 110 that is the head in the traveling direction of the laser emitting unit group 114 for each laser emitting unit group 114 (left side in the X-axis direction in the drawing) is “1”, the last The output intensity is set so as to sequentially decrease toward “0.48”, “0.42”, and “0.31” toward the laser emitting unit 110 serving as the tail.

  Next, the worker performs a heat treatment on the workpiece WK. Specifically, the operator controls a processing program that defines the path for displacing the table 101 and the emission timing of the laser beam L with respect to the two sets of laser emission units (eight laser emission units 110). After storing in 120, the control unit 120 is instructed to execute the machining program. In response to this instruction, the control unit 120 starts heat treatment of the workpiece WK according to the machining program.

  Specifically, the control unit 120 controls the operation of the feeding device 102 to displace the table 101 so that the processing target location on the workpiece WK is directly below the laser emission unit group 114, more specifically, In the laser emission unit group 114, positioning is performed immediately below the laser emission unit 110 that is the head of displacement. Next, the control unit 120 controls the operation of the laser power supply unit 112 to control the operation of the feeding device 102 in a state where the laser beam L is emitted from the laser emission unit group 114, so that each laser emission unit 110 is controlled. The workpiece WK is relatively displaced. In the present embodiment, the control unit 120 linearly displaces the workpiece WK toward the right side in the X-axis direction in the figure with respect to the laser emission unit group 114, as indicated by a broken line arrow in FIG.

  Thereby, the processing target location in the workpiece WK is heated to the austenite state by sequentially irradiating the four light spots SP, and then rapidly cooled naturally after the four light spots SP have passed. Quenching is performed. In this case, as shown in FIG. 5, the laser processing apparatus 100 sequentially irradiates four processing spots on the workpiece WK with four light spots SP, so that the laser processing apparatus 100 is heated by one light spot SP. Therefore, the depth of the hardened layer can be increased and an intermediate stage structure layer can be formed below the hardened layer with respect to the base material. This intermediate stage structure layer is an intermediate structure between the base material structure and the hardened layer structure, and has the property of suppressing cracking of the hardened layer (so-called burning cracking) and peeling of the hardened layer from the base material. .

  As can be understood from the above description of the operation, according to the above embodiment, the laser processing apparatus 100 sequentially passes the plurality of light spots SP formed by the laser emission unit 110 with respect to the processing target portion in the workpiece WK. Since the amount, time, and method of applying heat to the workpiece WK can be freely set, the workpiece WK of various kinds of materials and shapes can be compared with the case where the laser beam L is irradiated only once. On the other hand, processing can be performed. Further, according to the feature of the present invention, the laser processing apparatus 100 is tempered by re-heating the part that has been quenched by the preceding laser beam L as in the prior art laser quenching apparatus by the subsequent laser beam. Since this can be prevented, unevenness can be suppressed and uniform and accurate heat treatment can be performed.

  Furthermore, in carrying out the present invention, the present invention is not limited to the above embodiment, and various modifications can be made without departing from the object of the present invention. In the following description of each modified example and the drawings to be referred to, the same components as those in the above embodiment are denoted by the same reference numerals, and the description thereof is omitted.

  For example, in the above embodiment, the intervals Δ between the four light spots SP formed on the workpiece WK along the X-axis direction in the drawing are made equal. However, each interval Δ between the four light spots SP is determined by the material of the workpiece WK, the shape of the portion where laser processing (heat treatment in the above embodiment) is performed, and laser processing (heat treatment in the above embodiment). It is appropriately determined according to the specification, and is not limited to the above embodiment. For example, as shown in FIG. 6, each interval Δ between four light spots SP is set so that the interval Δ gradually increases from the front side to the rear side in the traveling direction, thereby slowing the cooling rate of the portion to be processed. Thus, the hardness can be adjusted low. In addition, as shown in FIG. 7, each interval Δ between the four light spots SP is set so that the interval Δ gradually decreases from the front side to the rear side in the traveling direction, thereby overheating the surface of the workpiece WK. It is possible to input heat deep into the base material while suppressing That is, the light spot SP can heat the workpiece WK early by closing the interval Δ, and can slowly heat the workpiece WK by separating the interval Δ.

  In the above embodiment, the laser emitting unit 110 includes the laser light source 111 including a plurality of semiconductor laser chips. However, the laser emitting unit 110 is not necessarily limited to the above embodiment as long as a plurality of light spots SP can be formed on the workpiece WK. That is, the laser emission unit 110 corresponds to the laser beam emission means according to the present invention. Therefore, the laser emitting unit 110 can be configured to include a laser light source 111 other than the semiconductor laser chip, specifically, a solid-state laser or a gas laser. Further, the laser emission unit 110 may be configured to guide laser light through an optical fiber from a laser light source 111 provided separately from the laser emission unit 110.

  Further, even when the laser emission unit 110 is configured to include a laser light source 111 composed of a plurality of semiconductor laser chips, the number and arrangement of the laser light sources 111 are appropriately selected according to the processing specifications for the workpiece WK. Just do it. Further, the laser emitting unit 110 does not necessarily require the plurality of laser emitting units 110 even when forming the plurality of light spots SP, and the laser light L emitted from one laser emitting unit 110 is a beam. It is also possible to form a plurality of light spots SP by performing spectroscopy using an optical element such as a splitter.

  In the above embodiment, the laser processing apparatus 100 is configured by arranging two sets of laser emission unit groups 114 in parallel in the Y-axis direction in the figure. Thereby, in the laser processing apparatus 100 in the said embodiment, laser processing (heat processing) can be performed in a wide range in the Y-axis direction in the drawing. However, the laser processing apparatus 100 only needs to include at least one set of laser emission unit groups 114. Further, the laser processing apparatus 100 can be configured to include three or more sets of laser emission units 114. In this case, the three or more sets of laser emission units 114 may be arranged adjacent to each other in the Y-axis direction shown in the figure. However, as shown in FIG. Since the units 114 can be arranged in the Y-axis direction in the figure, the laser processing apparatus 100 can be made compact.

  In the above embodiment, the laser processing apparatus 100 is configured to displace the table 101 with respect to the laser emission unit 110. That is, the feeding device 102 corresponds to the light spot scanning unit according to the present invention. However, the light spot scanning unit is not necessarily limited to the above embodiment as long as the light spot SP can be displaced relative to the workpiece WK. Therefore, for example, the laser processing apparatus 100 can be configured to displace the laser emission unit 110 with respect to the table 101.

  In the above-described embodiment, the laser processing apparatus 100 supports the laser emitting unit 110 by the support unit 115 so that the position and orientation of the laser processing unit 110 can be changed, whereby the illustrated X of the light spot SP formed on the workpiece WK. -The position on the Y-axis plane can be changed. That is, the support unit 115 corresponds to the light spot position changing means according to the present invention. However, the light spot position changing means can change the formation position of at least one light spot SP in the plurality of light spots SP along the displacement direction of the light spot SP (X-axis direction in the above embodiment). What is necessary is just to be comprised, and it is not necessarily limited to the said embodiment.

Therefore, the light spot position changing means uses the optical element such as a reflection mirror to position the light spot SP on the XY axis plane shown in the drawing using the laser beam L emitted from the laser emission unit 110 fixedly supported. Can be configured to change. Even when the support unit 115 in the above embodiment is used as the light spot position changing means, the support unit 115 only needs to be configured to be able to change the four light spots SP along the X-axis direction in the drawing. It does not necessarily have to be displaced and tiltably constituting the laser emission unit 110 in the Y-axis direction and shown theta _X direction of rotation.

In addition, the support unit 115 can improve the intensity of the light spot SP by configuring the support unit 115 so that at least one of the four light spots SP can be superimposed on the other light spot SP. In addition, the support unit 115 is configured so that at least one of the four light spots SP can be shifted in the Y-axis direction in the drawing as in the above-described embodiment, so that the laser beam irradiated to the processing target portion is formed. The total amount of L can be reduced. Further, the support unit 115 allows the operator to change the displacement of the laser emitting unit 110 in the illustrated X axis direction, the illustrated Y axis direction, the illustrated θ _X rotation direction, and the illustrated θ _Y rotation direction regardless of the drive motor and the motor drive unit 116. It can also be configured to be displaced by manual operation.

  In the above embodiment, the output intensities of the four laser emission units 110 constituting the set of laser emission unit groups 114 are different from each other. However, the output intensities of the four laser emitting units 110 are the material of the workpiece WK, the shape of the portion where laser processing (heat treatment in the above embodiment) is performed, and the specifications of laser processing (heat treatment in the above embodiment). However, the present invention is not limited to the above embodiment. Accordingly, the output intensities of the four laser emitting units 110 may all be the same, or may be set so as to gradually increase from the front side to the rear side in the traveling direction of the light spot SP.

  Moreover, in the said embodiment, it comprised with the four laser emission units 110 which comprise the 1 set of laser emission unit group 114. FIG. However, the number of the laser emission units 110 constituting the laser emission unit group 114, in other words, the number of the laser emission units 110 connected in the traveling direction of the light spot SP depends on the material of the workpiece WK, the laser processing (the above embodiment). Is appropriately determined according to the shape of the portion to be subjected to heat treatment and the specifications of laser processing (heat treatment in the above embodiment), and is not limited to the above embodiment. Therefore, the number of laser emission units 110 constituting the set of laser emission unit groups 114 may be at least two.

  Further, in the above-described embodiment, the four laser emission units 110 constituting the set of laser emission unit groups 114 are arranged such that the positions of the laser light sources 111 in the Y-axis direction in the figure match between the laser emission units 110. It was configured to be supported by the support unit 115. However, the plurality of laser light sources 111 included in the laser emission unit 110 are arranged at a predetermined interval, and there are variations in output intensity between the laser light sources 111. Therefore, the intensity profile of the light spot SP formed on the workpiece WK has irregularities along the arrangement direction of the laser light sources 111 as shown in FIGS.

  Therefore, between the plurality of laser emission units 110 constituting the set of laser emission unit groups 114, the laser light source 111 in the laser emission units 110 adjacent to each other, that is, the emission port that emits the laser light L, travels the light spot SP. By arranging the light spot SP so as to be shifted in a direction intersecting the direction (for example, the Y-axis direction in the drawing), the intensity of the light spot SP can be suppressed from unevenness in the profile, that is, the light intensity in the arrangement direction of the laser light sources 111 can be made uniform. .

  Further, in the above embodiment, the laser emitting unit 110 uses the condensing optical system 113 to form the rectangular light spot SP on the workpiece WK in plan view. However, the laser emitting unit 110 can also be configured to form the light spot SP in a shape other than a rectangular shape, for example, a circular shape or an elliptical shape.

Moreover, in the said embodiment, the laser processing apparatus 100 was comprised with the laser heat processing apparatus which performs the hardening process and the tempering process to the surface layer of the to-be-processed object WK. However, the laser processing apparatus 100 according to the present invention performs processing other than surface modification processing such as heat treatment on the workpiece WK, for example,
The present invention can be applied to various kinds of mechanical devices that perform laser overlaying that adheres different or similar materials on a workpiece, laser welding that connects two workpieces to each other, and the like.

WK ... Workpiece, L ... Laser light, SP ... Light spot 100 ... Laser processing apparatus,
101 ... Table, 102 ... Feeding device,
DESCRIPTION OF SYMBOLS 110 ... Laser emission unit, 110a ... Housing | casing, 111 ... Laser light source, 112 ... Laser power supply part, 113 ... Condensing optical system, 114 ... Laser emission unit group, 115 ... Support unit, 116 ... Motor drive part, 117 ... Support flame,
120... Control unit, 121.

Claims (5)

In a laser processing apparatus for processing a workpiece by forming a light spot by a laser beam on the surface of the workpiece,
A light spot scanning means for relatively displacing the light spot with respect to the workpiece;
Laser beam emitting means for emitting a plurality of laser beams forming the plurality of light spots in a state of being aligned along the relative displacement direction of the light spot on the workpiece;
A light spot position changing means for changing a position on the relative displacement direction of the light spot in the plurality of light spots,
The light spot scanning means includes
Wherein a shall successively passed through the plurality of light spots relative to the working target portion in the workpiece,
The laser beam emitting means is
The light spot has a plurality of laser light sources along a direction orthogonal to the relative displacement direction of the light spot, and the relative displacement direction of the light spot so that the output intensity profile is uniform between the plurality of laser light sources. The laser beam processing apparatus is characterized in that the laser light source is shifted between the laser beam emitting means adjacent to each other . The laser processing apparatus according to claim 1,
The laser beam emitting means is
The number corresponding to the plurality of light spots is provided,
The light spot position changing means includes
A laser processing apparatus that supports the laser light emitting means in a state in which at least one of the position and direction of the laser light emitted by the laser light emitting means can be changed. In the laser processing apparatus according to claim 1 or 2,
The light spot position changing means includes
A laser processing apparatus, wherein at least one of the plurality of light spots is changed in a direction intersecting a relative displacement direction by the light spot scanning unit. In the laser processing apparatus according to any one of claims 1 to 3,
The laser beam emitting means is
A laser processing apparatus for emitting a plurality of laser beams for forming a plurality of light spots in a state of being arranged along a direction orthogonal to a relative displacement direction of the light spots on the workpiece. In the laser processing apparatus according to any one of claims 1 to 4,
The laser beam emitting means is
The laser processing apparatus characterized that you form a rectangular light spot extending in a direction orthogonal to the relative displacement direction of the light spot at the work piece.

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