JP5947704B2 - 積層体の検査方法、積層体検査装置および積層体製造装置 - Google Patents

積層体の検査方法、積層体検査装置および積層体製造装置 Download PDF

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Publication number
JP5947704B2
JP5947704B2 JP2012258504A JP2012258504A JP5947704B2 JP 5947704 B2 JP5947704 B2 JP 5947704B2 JP 2012258504 A JP2012258504 A JP 2012258504A JP 2012258504 A JP2012258504 A JP 2012258504A JP 5947704 B2 JP5947704 B2 JP 5947704B2
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Japan
Prior art keywords
light
laminate
light intensity
shadow
inspection apparatus
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Application number
JP2012258504A
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English (en)
Japanese (ja)
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JP2014106078A (ja
Inventor
皆瀬　十三夫
十三夫 皆瀬
俊英 高木
俊英 高木
和昭 木内
和昭 木内
小相澤　久
久 小相澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Totoku Electric Co Ltd
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Totoku Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Totoku Electric Co Ltd filed Critical Totoku Electric Co Ltd
Priority to JP2012258504A priority Critical patent/JP5947704B2/ja
Priority to PCT/JP2013/080629 priority patent/WO2014084043A1/ja
Priority to CN201320746658.8U priority patent/CN203949629U/zh
Publication of JP2014106078A publication Critical patent/JP2014106078A/ja
Priority to PH12015501064A priority patent/PH12015501064A1/en
Application granted granted Critical
Publication of JP5947704B2 publication Critical patent/JP5947704B2/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
    • G01R31/58—Testing of lines, cables or conductors
    • G01R31/59—Testing of lines, cables or conductors while the cable continuously passes the testing apparatus, e.g. during manufacture
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
JP2012258504A 2012-11-27 2012-11-27 積層体の検査方法、積層体検査装置および積層体製造装置 Active JP5947704B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2012258504A JP5947704B2 (ja) 2012-11-27 2012-11-27 積層体の検査方法、積層体検査装置および積層体製造装置
PCT/JP2013/080629 WO2014084043A1 (ja) 2012-11-27 2013-11-13 積層体の検査方法、積層体検査装置および積層体製造装置
CN201320746658.8U CN203949629U (zh) 2012-11-27 2013-11-22 层叠体检查装置
PH12015501064A PH12015501064A1 (en) 2012-11-27 2015-05-14 Method for inspecting layered body, device for inspecting layered body, and device for manufacturing layered body.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012258504A JP5947704B2 (ja) 2012-11-27 2012-11-27 積層体の検査方法、積層体検査装置および積層体製造装置

Publications (2)

Publication Number Publication Date
JP2014106078A JP2014106078A (ja) 2014-06-09
JP5947704B2 true JP5947704B2 (ja) 2016-07-06

Family

ID=50827689

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012258504A Active JP5947704B2 (ja) 2012-11-27 2012-11-27 積層体の検査方法、積層体検査装置および積層体製造装置

Country Status (4)

Country Link
JP (1) JP5947704B2 (zh)
CN (1) CN203949629U (zh)
PH (1) PH12015501064A1 (zh)
WO (1) WO2014084043A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019168315A (ja) * 2018-03-23 2019-10-03 三菱電機株式会社 測定装置、回路基板、表示装置、および測定方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6464945A (en) * 1987-09-07 1989-03-10 Olympus Optical Co Sheet position detecting device
DE3934933A1 (de) * 1989-10-20 1991-04-25 Pfaff Ag G M Anordnung und verfahren zum detektieren einer werkstueckkante
JPH08304032A (ja) * 1994-06-27 1996-11-22 Honshu Paper Co Ltd コンデンサ用金属化フィルムのマージン部幅および金属蒸着膜厚さ測定方法
JPH08122022A (ja) * 1994-10-24 1996-05-17 Furukawa Electric Co Ltd:The フラットケーブルの寸法測定装置

Also Published As

Publication number Publication date
WO2014084043A1 (ja) 2014-06-05
PH12015501064A1 (en) 2015-07-27
CN203949629U (zh) 2014-11-19
JP2014106078A (ja) 2014-06-09

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