JP5932590B2 - Manufacturing method of input device - Google Patents

Manufacturing method of input device Download PDF

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Publication number
JP5932590B2
JP5932590B2 JP2012212338A JP2012212338A JP5932590B2 JP 5932590 B2 JP5932590 B2 JP 5932590B2 JP 2012212338 A JP2012212338 A JP 2012212338A JP 2012212338 A JP2012212338 A JP 2012212338A JP 5932590 B2 JP5932590 B2 JP 5932590B2
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wiring
electrode
portion
part
formed
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JP2014067236A (en
Inventor
光雄 川崎
光雄 川崎
貞夫 川田
貞夫 川田
隆則 中島
隆則 中島
大地 山田
大地 山田
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アルプス電気株式会社
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Description

  The present invention relates to an input device manufacturing method capable of detecting an operation position, and more particularly to an electrode unit and a wiring unit manufacturing method.

  As shown in Patent Document 1, the touch panel is provided with a transparent electrode in a display area (input area). A plurality of transparent electrodes are connected in the display area, and a wiring portion is formed in the peripheral area located around the display area from the end of the connected transparent electrodes.

  In the conventional touch panel manufacturing method, the wiring part and the transparent electrode in the manufacturing process are formed in an integrated state from the beginning, and when static electricity such as peeling or friction occurs in the manufacturing process, it is between adjacent wirings. As a result, there is a problem in that the potential difference becomes large, and as a result, a discharge between the wirings occurs, resulting in a lack of wiring.

  In particular, the above problem is likely to occur when a loop is formed from the connected transparent electrode to the wiring portion. In addition, the above problem has become more prominent as the wiring becomes narrower.

JP 2010-267223 A

  Therefore, the present invention is to solve the above-described conventional problems, and in particular, to provide an input device manufacturing method capable of suppressing the occurrence of wiring chipping based on static electricity during the manufacturing process. And

The present invention relates to a transparent substrate, a plurality of electrode portions made of an ITO layer formed in a display region of the transparent substrate , an ITO layer provided in a peripheral region around the display region, and the ITO A plurality of wiring parts composed of a metal layer laminated on the layer, and a method of manufacturing an input device comprising:
Forming the electrode part and the wiring part separately;
Forming the electrode part and the wiring part separately and then forming a transparent conductive layer over the entire area from the display area to the peripheral area;
In order to electrically connect the electrode part and the wiring part through the transparent connection part in the display area, the conductive layer is removed so as to leave the connection part. One end of which is connected to the ITO layer of the electrode part and the other end is connected only to the ITO layer of the wiring part,
It is characterized by having.

  As described above, in the present invention, the electrode part and the wiring part are not formed integrally, but are formed in a separated state first, and finally, each electrode part and each wiring part are electrically connected. In contrast, the electrode part and the wiring part are not electrically connected during the manufacturing process. Therefore, even when an action that generates static electricity such as peeling or friction is performed during the manufacturing process, the potential difference between adjacent wires can be reduced compared to the conventional case, the discharge between wires can be suppressed, and the occurrence of chipping can be eliminated. Or chipping of the wiring can be reduced as compared with the conventional case.

  In particular, there is an exposure development process for resist in the process of forming each of the electrode part and the wiring part. At that time, the sheet in the manufacturing process is adsorbed on the stage such as an exposure machine and then removed from the stage. However, according to the present invention, it is possible to suppress the inter-wiring discharge and suppress the occurrence of chipping even under such an environment.

In the present invention, the plurality of transparent electrode pieces formed in the display region are connected to each other by a bridge wiring, and at the same time, a portion serving as the connection portion is left, and at the same time, the bridge wiring is formed in the conductive layer. It is preferable to leave the part . Thereby, the manufacturing process can be simplified.

  In the present invention, the present invention can be preferably applied to a configuration in which a plurality of loops extending from each electrode portion to each wiring portion are formed.

  According to the method for manufacturing an input device of the present invention, the electrode portion and the wiring portion are not formed integrally, but are first formed in a separated state, and finally, each electrode portion and each wiring portion are electrically connected. Therefore, unlike the conventional case, the electrode part and the wiring part are not electrically connected during the manufacturing process. Therefore, even when an action that generates static electricity such as peeling or friction is performed during the manufacturing process, the potential difference between adjacent wires can be reduced compared to the conventional case, the discharge between wires can be suppressed, and the occurrence of chipping can be eliminated. Or chipping of the wiring can be reduced as compared with the conventional case.

FIG. 1 is a plan view showing each electrode part and each wiring part formed on the surface of a transparent substrate constituting the touch panel (input device) in the present embodiment. 2 (a) is an enlarged plan view of the input device shown in FIG. 1, and FIG. 2 (b) is a portion of the input device as seen from the direction of the arrow when FIG. 2 (a) is cut along AA. FIG. 2C is an enlarged longitudinal sectional view, and FIG. 2C is a partially enlarged longitudinal sectional view of an input device that is partially different from FIG. FIG. 3A to FIG. 3D are partially enlarged plan views for explaining the configuration of the connecting portion in the present embodiment. FIG. 4A to FIG. 4C are partially enlarged longitudinal sectional views for explaining the configuration of the connecting portion in the present embodiment. FIG. 5A is a process diagram (partially enlarged longitudinal sectional view) for explaining a manufacturing method of the touch panel (input device) in the present embodiment. FIG. 5B is a process diagram (partially enlarged longitudinal sectional view) performed in the next process of FIG. FIG. 5C is a process diagram (partially enlarged longitudinal sectional view) performed in the next process of FIG. FIG.5 (d) is one process drawing performed in the process following the FIG.5 (c) (partial expansion longitudinal cross-sectional view). FIG. 5E is a process diagram (partial enlarged longitudinal sectional view) performed in the next process of FIG. FIG. 5F is a process diagram (partially enlarged longitudinal sectional view) performed in the next process of FIG. FIG. 5G is a process diagram (partial enlarged longitudinal sectional view) performed in the next process of FIG. FIG. 5H is a process diagram (partially enlarged longitudinal sectional view) performed in the next process of FIG. FIG. 5I is a process diagram (partial enlarged longitudinal sectional view) performed in the next process of FIG. 5H. FIG. 6 is a process diagram (plan view) showing a manufacturing process of the touch panel (input device) in the present embodiment. FIG. 7 is a process diagram (partially enlarged longitudinal sectional view) for explaining a manufacturing method of a touch panel (input device) of a comparative example. FIG. 8 is a process diagram (plan view) showing a manufacturing process of a conventional touch panel (input device). FIG. 9A is a schematic diagram during a manufacturing process for explaining the problems of the conventional method for manufacturing an input device, and FIG. 9B shows the input device according to the present embodiment that has solved the conventional problems. It is a schematic diagram during the manufacturing process.

  FIG. 1 is a plan view showing each electrode part and each wiring part formed on the surface of a transparent substrate constituting the touch panel (input device) in this embodiment, and FIG. 2 (a) is shown in FIG. 2B is an enlarged plan view of the input device, and FIG. 2B is a partially enlarged longitudinal sectional view of the input device as seen from the direction of the arrow cut along FIG. ) Is a partially enlarged longitudinal sectional view of an input device that is partially different from FIG.

  In this specification, “transparent” and “translucent” refer to a state where the visible light transmittance is 50% or more (preferably 80% or more). Further, it is preferable that the haze value is 6 or less.

  In FIG. 1, the electrode portions 8, 12 c to 12 h and the wiring portions 6 a to 6 f formed on the surface (first surface) 2 a of the transparent substrate 2 constituting the touch panel 1 are illustrated. As shown in FIG. 2B, a transparent panel 3 is provided on the surface side of the transparent substrate 2, and a decorative layer is present at the positions of the wiring portions 6a to 6f. It cannot be seen from the front side. In addition, although the electrode parts 8 and 12c-12h cannot be visually recognized since it is transparent, FIG. 1 shows the external shape of each electrode part.

  The transparent substrate 2 is formed in a film shape such as polyethylene terephthalate (PET).

  As shown in FIG. 1, a plurality of first electrode portions 8 and a plurality of second electrodes are provided in a display area 11 (a display screen that can be operated with an operating body such as a finger and is opposed to a display display). Portions 12c to 12h are formed. In the following description, the configuration from the second electrode portion to the wiring portion will be mainly described. Therefore, the plurality of first electrode portions are denoted by a common reference numeral 8 and are not denoted by individual reference numerals.

  Each of the first electrode portions 8 has a form in which a plurality of first transparent electrode pieces 4 arranged at intervals in the X1-X2 direction are integrated via a connecting portion 7. The first electrode portions 8 formed long along the X1-X2 direction are arranged at intervals in the Y1-Y2 direction (see FIGS. 1 and 2A). 1 and 2, the first transparent electrode piece 4 has a rhombus (square), but the shape is not limited. Each first transparent electrode piece 4 and each connecting portion 7 are integrated with each other by being formed into a film by sputtering or vapor deposition with a transparent conductive material such as ITO (Indium Tin Oxide).

  Each of the second electrode portions 12c to 12h has a configuration in which a plurality of second transparent electrode pieces 5 arranged at intervals in the Y1-Y2 direction are electrically connected via the bridge wiring 10. In each of the second electrode portions 12c to 12h, each second electrode portion 12 formed long along the Y1-Y2 direction is arranged with an interval in the X1-X2 direction (see FIGS. 1 and 2). a)). 1 and 2, the second transparent electrode piece 5 has a rhombus (square), but the shape is not limited. Each second transparent electrode piece 5 is formed by sputtering or vapor deposition with a transparent conductive material such as ITO (Indium Tin Oxide). The bridge wiring 10 may be a single layer film of ITO or a laminated structure of ITO / Au, ITO / Au / ITO, or the like.

  As shown in FIGS. 2A and 2B, an insulating layer 20 is formed on the surface of the connecting portion 7 that connects the first transparent electrode pieces 4. As shown in FIG. 2 (b), the insulating layer 20 fills the space between the connecting portion 7 and the second transparent electrode piece 5, and rides on the surface of the second transparent electrode piece 5 to some extent. Yes.

  2A and 2B, the bridge wiring 10 extends from the surface 20a of the insulating layer 20 to the surface of each second transparent electrode piece 5 located on both sides of the insulating layer 20 in the Y1-Y2 direction. Is formed. The bridge wiring 10 electrically connects the second transparent electrode pieces 5.

  The connecting portion 7, the insulating layer 20, and the bridge wiring 10 are all located in the display area 11 and are configured to be transparent and translucent like the transparent electrode pieces 4 and 5.

  In FIG. 1 and FIG. 2, the first transparent electrode pieces 4 are connected by the connecting portion 7 and the second transparent electrode pieces 5 are connected by the bridge wiring 10, but the first transparent electrode pieces 4 are connected. A configuration in which the second transparent electrode pieces 5 are connected by the connecting portion 7 may be used.

  As shown in FIG. 1, the periphery of the display area 11 is a frame-shaped peripheral area (non-display area) 25. The display area 11 is transparent and translucent, but the peripheral area 25 is provided with a decorative layer (not shown), and the peripheral area 25 is opaque and non-translucent. Therefore, each wiring part 6a-6f provided in the peripheral region 25 and each external connection part 27 cannot be seen from the surface of the touch panel 1 (the surface of the panel 3). Each external connection portion 27 is a portion that is electrically connected to a flexible printed circuit board (not shown).

  As shown in FIG. 1, in the peripheral region 25, a plurality of wiring portions 6a to 6f led out from the second electrode portions 12c to 12h are formed. Each wiring part 6a-6f has a metal layer, such as Cu, Cu alloy, CuNi alloy, Ni, Ag, Au, and is formed. Thus, wiring resistance can be made small by having the metal layer and forming the wiring portions 6a to 6f. Further, the wiring portions 6a to 6f having the colored metal layer are hidden from the surface side of the peripheral region 25 by the decorative portion of the panel and cannot be seen in the state of the mobile phone.

  Although not shown in FIG. 1, a plurality of wiring portions led out from the first electrode portions 8 are also formed to extend to the peripheral region 25.

  As shown in FIG. 1, in each of the second electrode portions 12c to 12h, the wiring portions 6a to 6f are drawn out from both sides (the end portion 12a on the Y1 side and the end portion 12b on the Y2 side) to the peripheral region 25b. These are electrically connected via the external connection portions 27. That is, loops 28 to 33 extending from the second electrodes 12c to 12h to the wiring portions 6a to 6f are formed.

  There are six loops 28-33 as shown in FIG. Of these, the three left loops 28 to 30 are provided in the area on the left side (X1 side) of the center line O of the display area 11, and the remaining three right loops 31 to 33 are the right side (X2 side) of the center line O in the figure. ).

  In the left loops 28 to 30, the wiring portions 6 a to 6 c pass through the Y1 side region 25 a, the X1 side region 25 b, and the Y2 side region 25 c in the peripheral region 25. In the right loops 31 to 33, the wiring portions 6d to 6f pass through the Y1 side region 25a, the X2 side region 25d, and the Y2 side region 25c in the peripheral region 25.

  Thus, by forming the path from the second electrode portions 12c to 12h to the wiring portions 6a to 6f in a loop shape, the electrical resistance can be reduced, the charge time of charge can be shortened, and the responsiveness can be increased. Can improve.

  As shown in FIG. 2 (b), the surface 2 a side of the transparent substrate 2 and the panel 3 are joined via an optical transparent adhesive layer (OCA) 36. The panel 3 is not particularly limited in material, but a glass substrate or a plastic substrate is preferably applied. The optical transparent adhesive layer (OCA) 36 is an acrylic adhesive, a double-sided adhesive tape, or the like.

  In the capacitive touch panel 1 shown in FIG. 1, when it is brought into contact with the operation surface 3 a of the panel 3 as shown in FIG. 2B, the finger F and the first transparent electrode piece 4 close to the finger F A capacitance is generated between the second transparent electrode piece 5 and the second transparent electrode piece 5. Based on the capacitance change at this time, the contact position of the finger F can be calculated. The position of the finger F detects the X coordinate based on the capacitance change between the first electrode unit 8 and the Y coordinate based on the capacitance change between the second electrode units 12c to 12h. Is detected (self-capacitance detection type). Further, a drive voltage is applied to one row of the first electrode portion 8 and the first electrode portion of one of the second electrodes 12c to 12h, and the capacitance between the finger F by the other second electrode portion. It may be a mutual capacitance detection type in which a change in the position is detected, the Y position is detected by the second electrode portion, and the X position is detected by the first electrode portion.

  In this embodiment, as shown in FIG. 2B, the electrode portions 8, 12c to 12h, the insulating layer 20, and the bridge wiring 10 are provided on the surface 2a side of the transparent substrate 2, but FIG. ), The electrode portions 8, 12 c to 12 h, the insulating layer 20, and the bridge wiring 10 may be provided on the back surface 2 b side of the transparent substrate 2. In FIG. 2C, an optical transparent adhesive layer (OCA) 35 that is a bonding material between the back surface 2 b of the transparent substrate 2 and another transparent substrate 26 is in contact with the bridge wiring 10.

  As shown in FIG. 1, the second electrode portions 12c to 12h and the wiring portions 6a to 6f are electrically connected by connecting portions 34 each made of a conductive layer. Here, the same material as that of the bridge wiring 10 can be used for the connecting portion 34. That is, the connection part 34 can be formed in the same process as the bridge wiring 10. The bridge wiring 10 is, for example, a transparent conductive layer having a laminated structure of Au / ITO or ITO / Au / ITO. Therefore, the connection part 34 can also be formed by a laminated structure of Au / ITO and ITO / Au / ITO.

  FIG. 3 shows the position where the connecting portion 34 is formed. In FIG. 3, the wiring portion is denoted by reference numeral 6 and the second electrode portion is denoted by reference numeral 12 in the sense that the wiring paths are not distinguished.

  In FIG. 3A, the second electrode portion 12 and the wiring portion 6 are electrically connected by the connection portion 34 in the display region 11. In FIG. 3A, the connection portion 34 appears in the display region 11, but the connection portion 34 can be formed of the same transparent conductive material as that of the bridge wiring 10 (see FIG. 2A). There is no problem even if 34 is located in the display area 11. Alternatively, as shown in FIG. 3B, the second electrode part 12 is electrically connected to the wiring part 6 via the connection part 34 at a place slightly within the peripheral region 25 from the Y1 side end part 12a. It can also be configured.

  FIGS. 3C and 3D are partial enlarged plan views of the respective wiring portions 6a to 6c arranged in the X1 side region 25b of the left loops 28 to 30 shown in FIG. As shown in FIG. 3C, the wiring parts 6a to 6c (12) integrally connected to the second electrode parts 12 and the wiring parts 6a to 6a integrally connected to the external connection parts 27 are provided. 6c (27) is connected by the connecting part 34. In FIG. 3C, the connecting portions 34 are formed at the same position in the X1-X2 direction. However, in FIG. 3D, the connecting portions 34 are shifted in the Y1-Y2 direction. 3A, 3B, and 3C, the width of the connecting portion 34 is smaller than the width of the wiring portion 6. In FIG. 3D, the width of the connecting portion 34 is changed to the wiring portion 6. It was formed larger than the width dimension. As shown in FIG. 3D, by arranging the connecting portions 34 so as to be shifted in the extending direction of the wiring portions 6a to 6c, the width dimensions of the connecting portions 34 are determined from the width dimensions of the wiring portions 6a to 6c. Even if it is formed large, the connection part 34 is not easily in contact with the adjacent wiring parts 6a to 6c, and the connection part 34 can be formed large in this way, so that the wiring parts 6a to 6c are electrically connected appropriately and easily. it can. In order to promote narrow wiring, as shown in FIGS. 3A to 3C, it is preferable that the width of each connection portion 34 is narrower than that of each wiring portion 6a to 6c.

  Further, it is more space to form the connection portion 34 in the display area 11 and connect the electrode portion and the wiring portion as shown in FIG. 3A than to form the connection portion 34 at a position where the wiring portions are adjacent to each other. This is suitable because it has a sufficient margin.

  3 (c) and 3 (d) are cut in the middle of the wiring portion. However, such a configuration is also electrically connected between the second electrode portion 12 and the wiring portion 6 by the connecting portion 34. FIG. Corresponds to the configuration connected to.

  FIG. 4 shows a cross-sectional structure of the connecting portion 34. In FIG. 3, the wiring portion is denoted by reference numeral 6 and the second electrode portion is denoted by reference numeral 12 in the sense that the wiring paths are not distinguished.

  As shown in FIG. 4A, the second electrode portion 12 is formed of an ITO layer 40, and the wiring portion 6 has a configuration in which a metal layer 41 is laminated on the ITO layer 40. The metal layer 41 is formed of a Cu layer, for example.

  In FIG. 4A, the connection part 34 made of a conductive layer is buried between the ITO layers 40 and 40, and thereby the second electrode part 12 and the wiring part 6 are electrically connected by the connection part 34. doing.

  In FIG. 4B, the ITO layer 40 that constitutes the second electrode portion 12 and the metal layer 41 that constitutes the wiring portion 6 are electrically connected by the connecting portion 34. In FIG. 4C, the separated metal layers 41 are electrically connected by the connecting portion 34. Which connection cross section is used depends on which plane position the connection portion 34 is provided as shown in FIG.

  The manufacturing method of the touch panel (input device) in this embodiment is demonstrated using Fig.5 (a)-FIG.5 (i).

  In FIG. 5A, the IM layer 45 and the ITO layer 40 are formed on the surface 2 a of the transparent substrate 2. The IM layer 45 is an optical adjustment layer for making it difficult to see the ITO wiring. Further, a metal layer 41 is formed on the ITO layer 40. For example, the metal layer 41 is formed of a Cu layer. In FIG. 5A, the transparent substrate 2 has a laminated structure of the support film 46 and the PET layer 47, but the structure of the transparent substrate 2 is not limited. A transparent conductive material layer other than the ITO layer 40 may be used. Further, the metal layer 41 can be formed in a single layer structure, and the metal material is not limited.

  5B, a resist layer 48 is applied to the surface of the metal layer 41, and the resist layer 48 is patterned by exposure and development as shown in FIG. 5B. Each drawing of FIG. 5 shows a longitudinal sectional view of the touch panel (input device) in the manufacturing process cut in the Y1-Y2 direction, and the resist layer 48a shown in FIG. 5B is the second layer shown in FIG. A plane pattern of the electrode portion 12 (here, a reference numeral 12 is used to indicate which second electrode portion is not distinguished) is provided. Further, the resist layers 48b and 48c have a planar pattern of the wiring part 6 (in this case, the reference numeral 6 is used to distinguish which wiring part is formed) extending in the peripheral region 25. As shown in FIG. 5B, a resist layer 48a and a resist layer 48c are formed in succession. On the other hand, the resist layer 48a and the resist layer 48b are separated. After FIG. 5B, the boundary between the resist layer 48a and the resist layer 48c is indicated by a dotted line.

  In the step of FIG. 5C, the metal layer 41 not covered with the resist layers 48a to 48c is removed by etching. At this time, an etching solution that removes the metal layer 41 but does not remove the ITO layer 40 is used.

  In FIG. 5D, the portion of the ITO layer 40 not covered with the resist layer 48 is removed by etching.

  Subsequently, multiple exposure / development processing is performed to remove the resist layer 48a located in the display area 11 (see FIG. 5E). As a result, the resist layers 48b and 48c on the wiring portion 6 are left.

  Next, in FIG. 5F, the metal layer 41 in the display region 11 is removed by etching. At this time, an etching solution that etches the metal layer 41 but does not etch ITO is used. As a result, the ITO layer 40 is exposed in the display area 11.

  In FIG. 5G, the resist layers 48b and 48c are peeled off. As shown in FIG. 5G, in the peripheral region 25, the wiring portion 6 having a laminated structure of the ITO layer 40 / metal layer 41 is formed. As shown in FIG. 5G, the second electrode portion 12 made of the ITO layer 40 formed in the display region 11 and the wiring portion 6 are separated.

  In the step of FIG. 5H, the conductive layer 50 is formed by sputtering or the like from the display area 11 to the entire peripheral area 25. Thereafter, a resist layer (not shown) is applied and the resist layer is exposed and developed, and the conductive layer 50 not covered with the resist layer is removed by etching. Then, as shown in FIG. 5I, the conductive layer 50 is left between the separated wiring portion 6 and the second electrode portion 12, and the conductive portion 50 is electrically connected between the wiring portion 6 and the second electrode portion 12. Electrical connection is made by connection 34 by layer 50.

  FIG. 6 shows a plan view after the process of FIG. As shown in FIG. 6, not only the connection portion 34 but also the bridge wiring 10 (see FIG. 2A) is not formed at the time of the process of FIG. Therefore, the connecting portion 34 and the bridge wiring 10 can be formed in the same process by the processes of FIGS. FIG. 5I shows that the connection portion 34 and the bridge wiring 10 are formed at the same time. Thereby, the connection part 34 and the bridge | bridging wiring 10 are formed in the conductive layer 50 of the same material.

  FIG. 7 is a process diagram showing a manufacturing method in a conventional input device, and shows a process at the same timing as the process of FIG.

  FIG. 7 shows a state in which the resist layer 60 is subjected to multiple exposure and developed to remove the resist layer in the display region 11. Next to FIG. 7, as in FIG. 5F, the metal layer 41 in the display region 11 is removed, and the remaining resist layer 60 is removed.

  As shown in FIG. 7, conventionally, the electrode portions 12 c to 12 h provided in the display region 11 and the wiring portions 6 a to 6 f provided in the peripheral region 25 are in an integrated state. That is, at the time of the multiple exposure in FIG. 7, as shown in FIG. 8, a plurality of continuous loops 61 to 66 from the second electrode portions 12c to 12h to the wiring portions 6a to 6f are formed. In such a state, when static electricity occurs due to peeling, friction, etc. during the manufacturing process, the potential difference between adjacent wirings becomes large, resulting in inter-wiring discharge, and chipping in the wiring part. There was a problem.

This will be specifically described below.
FIG. 9A shows a state in which the touch panel sheet 68 in the manufacturing process is adsorbed on the stage 69 and the touch panel sheet 68 is removed from the stage 69 after performing the multiple exposure and development described in FIG. .

  At this time, by lifting the flexible touch panel sheet 68 upward from the end 68 a, the end 68 a portion of the touch panel sheet 68 is separated from the surface of the stage 69, and the other portions are in close contact with the stage 69.

  Each wiring part 6a-6f is connected to each 2nd electrode part 12c-12h, and becomes loop shape, and each wiring part 6a-6f is X1 side area | region 25b and X2 side area | region 25d among the peripheral areas 25. In addition, it extends to the Y1 side region 25a and the Y2 side region 25c (see FIG. 8). For example, FIG. 9A schematically shows a cross-sectional structure cut at the position of line BB shown in FIG.

  As shown in FIG. 9, each wiring part 6a-6c has appeared on both the X1 side and the X2 side. The wiring parts 6a to 6c appearing on the X1 side shown in FIG. 9 are wiring parts extending to the X1 side region 25b of FIG. 8, and the wiring parts 6a to 6c appearing on the X2 side are the Y1 side of FIG. This is a wiring portion extending to the region 25a.

  Now, when the end 68a of the touch panel sheet 68 is lifted as shown in FIG. 9A, the portion of the wiring portion 6a located on the X1 side is separated from the stage 69, but the X2 side ( The portion of the wiring portion 6 a located on the center side remains in close contact with the stage 69. At this time, since the wiring portion 6a is integrated with the first electrode portion 12c to form the loop 61, the entire loop 61 is at the same potential.

  At this time, as shown in FIG. 9A, a potential difference is generated between the wiring portion 6a and the adjacent wiring portion 6f (wiring portion constituting the loop 66 shown in FIG. 8). The potential (voltage) V is represented by (Q · d) / (ε · S). Here, Q is an electric charge (amount of electricity) (C), d is a distance from the stage (see FIG. 9A), ε is a dielectric constant, and S is an area of a flat plate (stage area). It is. Therefore, the potential (voltage) V increases as the distance d increases, that is, as the touch panel sheet 68 moves away from the stage 69.

  Since the potential increases in proportion to the distance from the stage 69, there is no significant potential difference between the wiring portions 6a and 6b. However, the wiring portion 6a adjacent to the wiring portion 6f located at the center is connected to the end 68a of the sheet. Since the potential is the same as that of the wiring portion 6a, a large potential difference is generated between the wiring portions 6a and 6f. As a result, an inter-wiring discharge is generated.

  On the other hand, according to this embodiment, each electrode part 12c-12h and each wiring part 6a-6f are not formed integrally, but each is formed in the separated state, and finally each electrode part 12c-12h. And the wiring portions 6a to 6f are electrically connected to each other through the connection portion 34. Unlike the conventional case, the electrode portions 12c to 12h and the wiring portions 6a to 6f are electrically connected during the manufacturing process. It is not connected to. Therefore, in the process of forming each of the electrode parts 12c to 12f and the wiring parts 6a to 6f, there is an exposure development process (FIG. 5 (e) and the like) for the resist. As shown in the drawing, after the touch panel sheet 70 in the manufacturing process is adsorbed on the stage 69, even if the act of removing it from the stage 69 is performed, the wiring part 6 a located on the X1 side away from the stage 69 and the X2 side (center side) The wiring portion 6a is not at the same potential as that of the wiring portion 6a, and therefore, a large potential difference does not occur between the wiring portion 6a and the adjacent wiring portion 6f. As described above, the inter-wiring discharge can be suppressed as compared with the prior art, and the wiring portions 6a to 6f can be appropriately formed with no wiring missing or at least the wiring missing suppressed as compared with the prior art.

  In the present embodiment, when forming the connection portion 34, first, as shown in FIG. 5H, the conductive layer 50 is formed from the display region 11 to the entire peripheral region 25, and then the resist layer is formed on the conductive layer 50. The resist layer is exposed and developed. At this time, after the touch panel sheet 70 in the manufacturing process is adsorbed on the stage 69 and the above-described exposure development is performed, the touch panel sheet 68 in the manufacturing process is separated from the stage 69 (see FIG. 9B). At this time, in this embodiment, since the conductive layer 50 is formed on the entire surface from the display region 11 to the peripheral region 25, a discharge phenomenon due to generation of static electricity does not occur. Therefore, as shown in FIG. 5 (i), the electrode portion 12 and the wiring portion 6 can be appropriately connected by the connecting portion 34.

  In the present embodiment, as shown in FIG. 1, a plurality of loops 28 to 33 are formed from the respective electrode portions 12c to 12h to the respective wiring portions 6a to 6f, and this embodiment is preferably applied to such a configuration. Applicable. However, the present embodiment can be applied to a configuration that is not in a loop shape. Moreover, although the structure which electrically connects between each 2nd electrode part 12c-12h and each wiring part 6a-6f by the connection part 34 as mentioned above was demonstrated, each 1st electrode part 8 and each The wiring portion (see FIG. 1; however, the wiring portion connected to the first electrode portion 8 is not shown in FIG. 1) may be electrically connected by the connecting portion.

DESCRIPTION OF SYMBOLS 1 Touch panel 2 Transparent base material 3 Panel 4, 5 Transparent electrode piece 6, 6a-6f Wiring part 8 1st electrode part 10 Bridge wiring 11 Display area 12a-12h 2nd electrode part 25 Peripheral area 28-33, 61- 66 Loop 34 Connection 35, 36 Optical transparent adhesive layer (OCA)
40 ITO layer 41 Metal layers 48, 48a to 48c, 60, 60a, 60b Resist layer 50 Conductive layer 68 Touch panel sheet 70 Stage

Claims (3)

  1. A transparent substrate, a plurality of electrode portions formed of an ITO layer formed in a display region of the transparent substrate , an ITO layer provided in a peripheral region around the display region, and the ITO layer; A plurality of wiring portions made of laminated metal layers, and a method of manufacturing an input device comprising:
    Forming the electrode part and the wiring part separately;
    Forming the electrode part and the wiring part separately and then forming a transparent conductive layer over the entire area from the display area to the peripheral area;
    In order to electrically connect the electrode part and the wiring part through the transparent connection part in the display region, the conductive layer is removed so as to leave the connection part, and each connection part One end of which is connected to the ITO layer of the electrode part and the other end is connected only to the ITO layer of the wiring part,
    A method for manufacturing an input device.
  2. The portion of the conductive layer that remains as the bridge wiring is left at the same time that the portion serving as the connection portion is left so as to connect the plurality of transparent electrode pieces formed in the display region with a bridge wiring. A method for manufacturing the input device according to 1 .
  3. The method for manufacturing an input device according to claim 1 , wherein a plurality of loops extending from each electrode portion to each wiring portion are formed.
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JP6270656B2 (en) * 2014-07-29 2018-01-31 アルプス電気株式会社 Input device and manufacturing method thereof
JP6185946B2 (en) 2015-02-26 2017-08-23 アルプス電気株式会社 Input device

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JP2012008910A (en) * 2010-06-28 2012-01-12 Casio Comput Co Ltd Position input device
TW201234247A (en) * 2010-12-28 2012-08-16 Sharp Kk Touch panel, display device provided with same, as well as manufacturing method for touch panel
JP2012155514A (en) * 2011-01-26 2012-08-16 Alps Electric Co Ltd Touch pad and manufacturing method therefor
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