JP5915813B2 - 積層セラミック電子部品 - Google Patents
積層セラミック電子部品 Download PDFInfo
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- JP5915813B2 JP5915813B2 JP2015506550A JP2015506550A JP5915813B2 JP 5915813 B2 JP5915813 B2 JP 5915813B2 JP 2015506550 A JP2015506550 A JP 2015506550A JP 2015506550 A JP2015506550 A JP 2015506550A JP 5915813 B2 JP5915813 B2 JP 5915813B2
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- multilayer ceramic
- phosphor
- multilayer
- electronic component
- internal electrode
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- 239000000919 ceramic Substances 0.000 title claims description 70
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 44
- 229910052760 oxygen Inorganic materials 0.000 claims description 7
- 239000010953 base metal Substances 0.000 claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 5
- 239000001301 oxygen Substances 0.000 claims description 5
- 229910052684 Cerium Inorganic materials 0.000 claims description 3
- 229910052692 Dysprosium Inorganic materials 0.000 claims description 3
- 229910052691 Erbium Inorganic materials 0.000 claims description 3
- 229910052693 Europium Inorganic materials 0.000 claims description 3
- 229910052688 Gadolinium Inorganic materials 0.000 claims description 3
- 229910052689 Holmium Inorganic materials 0.000 claims description 3
- 229910052779 Neodymium Inorganic materials 0.000 claims description 3
- 229910052777 Praseodymium Inorganic materials 0.000 claims description 3
- 229910052772 Samarium Inorganic materials 0.000 claims description 3
- 229910052771 Terbium Inorganic materials 0.000 claims description 3
- 229910052775 Thulium Inorganic materials 0.000 claims description 3
- 229910052769 Ytterbium Inorganic materials 0.000 claims description 3
- 239000000654 additive Substances 0.000 claims description 3
- 230000000996 additive effect Effects 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 229910052788 barium Inorganic materials 0.000 claims description 3
- 229910052735 hafnium Inorganic materials 0.000 claims description 3
- 229910052718 tin Inorganic materials 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- 229910052727 yttrium Inorganic materials 0.000 claims description 3
- 229910052726 zirconium Inorganic materials 0.000 claims description 3
- 239000003985 ceramic capacitor Substances 0.000 description 34
- 239000000463 material Substances 0.000 description 22
- 239000000843 powder Substances 0.000 description 8
- 239000007858 starting material Substances 0.000 description 8
- 239000011230 binding agent Substances 0.000 description 7
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 6
- 238000010304 firing Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 238000003860 storage Methods 0.000 description 6
- 229910052748 manganese Inorganic materials 0.000 description 5
- 238000012856 packing Methods 0.000 description 5
- 238000003475 lamination Methods 0.000 description 4
- 239000012299 nitrogen atmosphere Substances 0.000 description 4
- 239000003960 organic solvent Substances 0.000 description 4
- 229910005191 Ga 2 O 3 Inorganic materials 0.000 description 3
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 3
- 229910002113 barium titanate Inorganic materials 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 239000002002 slurry Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 229910052725 zinc Inorganic materials 0.000 description 3
- 229910003564 SiAlON Inorganic materials 0.000 description 2
- 229910010413 TiO 2 Inorganic materials 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910005793 GeO 2 Inorganic materials 0.000 description 1
- 101100513612 Microdochium nivale MnCO gene Proteins 0.000 description 1
- 101100476480 Mus musculus S100a8 gene Proteins 0.000 description 1
- 229910004283 SiO 4 Inorganic materials 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000010191 image analysis Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000012916 structural analysis Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/62—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
- G01N21/63—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light optically excited
- G01N21/64—Fluorescence; Phosphorescence
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/8422—Investigating thin films, e.g. matrix isolation method
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/04—Arrangements of distinguishing marks, e.g. colour coding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/24—Distinguishing marks, e.g. colour coding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/012—Form of non-self-supporting electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/224—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/236—Terminals leading through the housing, i.e. lead-through
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/8422—Investigating thin films, e.g. matrix isolation method
- G01N2021/8438—Mutilayers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2201/00—Features of devices classified in G01N21/00
- G01N2201/06—Illumination; Optics
- G01N2201/061—Sources
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Ceramic Engineering (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Mathematical Physics (AREA)
- Inorganic Chemistry (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
積層体の外表面の一部に外表面より突出して蛍光体が配置されることにより、紫外線等を照射すると、蛍光体が発光する。したがって、積層セラミック電子部品に紫外線等を照射して、カメラで撮像すれば、画像判断によって蛍光体が配置されている積層体の表面を判別することができ、蛍光体と一定の関係にある内部電極の方向性を判断することができる。
さらに、外部電極は卑金属を含むことができる。
表1に示す実施例1〜実施例14については、合成された蛍光体を含む蛍光体ペーストを焼成前のマザー積層体の1表面に塗布し、切断した後、焼成した。例えば、実施例3の場合、蛍光体の出発原料として1モル部のCaCO3粉末と1モル部のGa2O3粉末と0.5モル部のMnCO3粉末が秤量されて、ボールミルによって湿式混合される。これを乾燥後、1400℃で熱処理することで蛍光体が合成される。このようにして得られた蛍光体材料にポリビニルブチラール系バインダと有機溶剤としてのエタノールを添加し、蛍光体ペーストを作製した。実施例1、2、4〜14についても、同様にして蛍光体を合成し、蛍光体ペーストを作製した。
また、実施例15〜実施例19については、マザー積層体の1表面に蛍光体の出発原料を含む蛍光体出発原料ペーストを塗布し、切断した後、積層体の焼成と同時に蛍光体を合成した。例えば、実施例15の場合、蛍光体の出発原料として1モル部のCaCO3粉末と1モル部のTiO2粉末と0.001モル部のPr2O3粉末が秤量されて、ボールミルによって湿式混合される。これを乾燥後、ポリビニルブチラール系バインダと有機溶剤としてのエタノールを添加し、蛍光体出発原料ペーストを作製した。実施例16〜19についても、同様にして蛍光体出発原料ペーストを作製し、積層体の焼成と同時に蛍光体を合成した。
さらに、比較例1として、蛍光体が形成されていない積層セラミックコンデンサを準備した。
12 積層体
14 誘電体セラミック層
16a 第1の内部電極
16b 第2の内部電極
18 外部電極
20 蛍光体
Claims (4)
- 積層された複数のセラミック層と、前記セラミック層間の界面に沿って形成される内部電極とを有する積層体、および
前記積層体の外表面に形成される外部電極を含む積層セラミック電子部品であって、
前記外部電極が形成されていない前記積層体の外表面の一部に当該外表面より突出して蛍光体が配置され、
前記蛍光体は、ABO3で表されるペロブスカイト型化合物を主成分とし、添加成分としてRを含むものであり、AはBa、Sr、Caの中の少なくとも1種を含み、BはTi、Zr、Hf、Al、Snの中の少なくとも1種を含み、Oは酸素を表し、RはCe、Pr、Nd、Sm、Eu、Gd、Tb、Dy、Ho、Er、Tm、YbおよびYの中の少なくとも1種を含む、積層セラミック電子部品。 - 前記セラミック層は誘電体セラミック層である、請求項1に記載の積層セラミック電子部品。
- 前記内部電極は卑金属を含む、請求項1または請求項2に記載の積層セラミック電子部品。
- 前記外部部品は卑金属を含む、請求項1ないし請求項3のいずれかに記載の積層セラミック電子部品。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013056668 | 2013-03-19 | ||
JP2013056668 | 2013-03-19 | ||
PCT/JP2013/082797 WO2014147898A1 (ja) | 2013-03-19 | 2013-12-06 | 積層セラミック電子部品 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP5915813B2 true JP5915813B2 (ja) | 2016-05-11 |
JPWO2014147898A1 JPWO2014147898A1 (ja) | 2017-02-16 |
Family
ID=51579609
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015506550A Active JP5915813B2 (ja) | 2013-03-19 | 2013-12-06 | 積層セラミック電子部品 |
Country Status (3)
Country | Link |
---|---|
US (1) | US10060852B2 (ja) |
JP (1) | JP5915813B2 (ja) |
WO (1) | WO2014147898A1 (ja) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20160098780A (ko) * | 2015-02-11 | 2016-08-19 | 삼성전기주식회사 | 전자부품 및 전자부품의 실장 기판 |
KR20170112381A (ko) * | 2016-03-31 | 2017-10-12 | 삼성전기주식회사 | 세라믹 조성물 및 이를 포함하는 적층형 커패시터 |
KR101825696B1 (ko) * | 2016-07-01 | 2018-02-05 | 주식회사 모다이노칩 | 칩 부품 및 그 제조 방법 |
KR102267242B1 (ko) * | 2017-05-15 | 2021-06-21 | 가부시키가이샤 무라타 세이사쿠쇼 | 적층형 전자부품 및 적층형 전자부품의 제조 방법 |
US11145458B2 (en) | 2018-02-22 | 2021-10-12 | Taiyo Yuden Co., Ltd. | Multi-layer ceramic electronic component |
US10497161B1 (en) | 2018-06-08 | 2019-12-03 | Curious Company, LLC | Information display by overlay on an object |
US10818088B2 (en) | 2018-07-10 | 2020-10-27 | Curious Company, LLC | Virtual barrier objects |
US10902678B2 (en) | 2018-09-06 | 2021-01-26 | Curious Company, LLC | Display of hidden information |
US11055913B2 (en) | 2018-12-04 | 2021-07-06 | Curious Company, LLC | Directional instructions in an hybrid reality system |
US10970935B2 (en) | 2018-12-21 | 2021-04-06 | Curious Company, LLC | Body pose message system |
US10872584B2 (en) | 2019-03-14 | 2020-12-22 | Curious Company, LLC | Providing positional information using beacon devices |
KR20190116181A (ko) * | 2019-09-20 | 2019-10-14 | 삼성전기주식회사 | 적층형 전자 부품 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60143619A (ja) * | 1983-12-29 | 1985-07-29 | 松下電器産業株式会社 | 電子部品 |
JPS6359301U (ja) * | 1986-10-06 | 1988-04-20 | ||
JPH11135301A (ja) * | 1997-10-30 | 1999-05-21 | Kyocera Corp | 電子部品 |
JP2000340458A (ja) * | 1999-05-31 | 2000-12-08 | Nec Kofu Ltd | 極性表示方法、基板実装確認方法及びタンタルコンデンサ |
JP2006152089A (ja) * | 2004-11-26 | 2006-06-15 | National Institute Of Advanced Industrial & Technology | 発光材料、圧電体、電歪体、強誘電体、電場発光体、応力発光体、及びこれらの製造方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61217317A (ja) | 1985-03-18 | 1986-09-26 | 株式会社村田製作所 | テ−ピング電子部品の製造方法 |
US7745869B2 (en) * | 2003-01-21 | 2010-06-29 | Tdk Corporation | Thin film capacitance element composition, high permittivity insulation film, thin film capacitance element, thin film multilayer capacitor and production method of thin film capacitance element |
JP2004303947A (ja) * | 2003-03-31 | 2004-10-28 | Matsushita Electric Ind Co Ltd | 複合電子部品 |
JP4240074B2 (ja) * | 2006-07-11 | 2009-03-18 | 株式会社村田製作所 | 積層型電子部品及び積層型アレイ電子部品 |
US8894882B2 (en) * | 2009-09-21 | 2014-11-25 | University Of Georgia Research Foundation, Inc. | Near infrared doped phosphors having an alkaline gallate matrix |
KR101474065B1 (ko) * | 2012-09-27 | 2014-12-17 | 삼성전기주식회사 | 적층 칩 전자부품, 그 실장 기판 및 포장체 |
JP5790817B2 (ja) * | 2013-11-05 | 2015-10-07 | 株式会社村田製作所 | コンデンサ、コンデンサの実装構造体及びテーピング電子部品連 |
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2013
- 2013-12-06 JP JP2015506550A patent/JP5915813B2/ja active Active
- 2013-12-06 WO PCT/JP2013/082797 patent/WO2014147898A1/ja active Application Filing
-
2015
- 2015-09-11 US US14/851,323 patent/US10060852B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60143619A (ja) * | 1983-12-29 | 1985-07-29 | 松下電器産業株式会社 | 電子部品 |
JPS6359301U (ja) * | 1986-10-06 | 1988-04-20 | ||
JPH11135301A (ja) * | 1997-10-30 | 1999-05-21 | Kyocera Corp | 電子部品 |
JP2000340458A (ja) * | 1999-05-31 | 2000-12-08 | Nec Kofu Ltd | 極性表示方法、基板実装確認方法及びタンタルコンデンサ |
JP2006152089A (ja) * | 2004-11-26 | 2006-06-15 | National Institute Of Advanced Industrial & Technology | 発光材料、圧電体、電歪体、強誘電体、電場発光体、応力発光体、及びこれらの製造方法 |
Also Published As
Publication number | Publication date |
---|---|
US20160003737A1 (en) | 2016-01-07 |
US10060852B2 (en) | 2018-08-28 |
JPWO2014147898A1 (ja) | 2017-02-16 |
WO2014147898A1 (ja) | 2014-09-25 |
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