JP5835673B2 - Electroplating method and metallized long resin film manufacturing method - Google Patents

Description

  The present invention relates to a method for electroplating a surface of a long conductive substrate in a roll-to-roll manner, and a method for producing a metallized resin film using this electroplating method.

Resin films have flexibility and are easy to process. Therefore, a metal film or an oxide film is formed on the surface of the resin film and is widely used in the industry for electronic parts, optical parts, packaging materials, and the like. For example, flexible wiring boards having flexibility are used in small electronic devices such as mobile phones.
By the way, the flexible wiring board is manufactured by a subtractive method or the like from a three-layer copper polyimide substrate in which an adhesive is used between a polyimide film, which is a kind of resin film, and a copper foil, and the both are laminated.

In recent years, as electronic components have become lighter, thinner and shorter, there has been an increasing demand for narrow pitch wiring. Therefore, a type of metallized resin film substrate that does not use an adhesive from the conventionally used three-layer copper polyimide substrate. There is a demand for a metallized polyimide substrate. By not using this adhesive, it is possible to reduce the wiring pitch by utilizing the inherent stability of polyimide without being affected by the properties of the adhesive.
Such a metallized polyimide substrate is employed as a COF (Chip on Film) in a driver circuit of a liquid crystal display.

  As a method for producing this metallized polyimide substrate, a method is known in which a metal film is laminated on the surface of a polyimide film by sputtering or vapor deposition, and then a metal layer is thickened by electroplating (for example, patents). See reference 1.) Further, a roll-to-roll electroplating apparatus for a metal-coated polyimide substrate (plating method two-layer circuit base material) is disclosed in Patent Document 2 and manufactured by continuous electroplating of a long object.

By the way, even if a polyimide film long material is used as the base material of the copper clad laminated substrate, its length is limited, and there is an end portion of the polyimide film. The end treatment, that is, the connection treatment between polyimide films is necessary, and the soundness of the connection portion becomes a problem from the viewpoint of productivity and reliability.
That is, the edge processing method for maintaining the quality of the copper clad laminate is required not only for the production of the copper clad laminate but also for the surface treatment of a long copper foil or the like.

JP 2002-252257 A JP 2009-026990 A

  In the present invention, a conductive long substrate is conveyed by a roll-to-roll method, repeatedly immersed in an electroplating bath filled with an electroplating solution, and a conductive layer is applied to the surface of the conductive long substrate by electroplating. In the electroplating method for long substrates, the conductive long substrate is introduced into the electroplating tank and the treatment of the end of the conductive long substrate is regulated, thereby providing a conductive surface with a sound plating layer. It aims at providing the electroplating method from which a elongate board | substrate is obtained.

In view of such a situation, the first invention of the present invention is a conductive long substrate by electroplating while transporting the conductive long substrate in the longitudinal direction by a roll-to-roll method and repeating immersion in the electroplating solution. In the electroplating method in which a plating layer is provided on a substrate, the conductive long substrate has a nonconductive long substrate connected via a connecting portion at the front end in the transport direction, and the nonconductive long substrate The substrate is transported to the top and subjected to electroplating, and the connecting portion has an overlapping portion in which the end portion of the conductive long substrate and the end portion of the nonconductive long substrate are connected using a connecting means. The conductive metal foil tape has a structure in which the step on the conductive long substrate side of the overlapped portion is covered with a conductive metal foil tape. In the longitudinal cross-sectional shape of the conductive metal foil tape, the conductive adhesive layer Parts are electroplated and wherein the a is a cross-sectional shape that covers the metal foil.
Further, the electroplating solution is a copper electroplating solution.

  According to a second aspect of the present invention, there is provided a metallized resin film in which a base metal layer is formed on at least one surface of a long resin film without using an adhesive, and a copper coating layer is formed on the surface of the base metal layer. In the manufacturing method, the copper coating layer is formed by the electroplating method of the first invention using a conductive long substrate, and the conductive long substrate is bonded to at least one surface of the long resin film. A metallized resin film manufacturing method, characterized in that it is a long resin film with a metal thin film in which a copper thin film layer is formed on the surface of the base metal layer and the surface of the base metal layer without any interposition.

  Further, the base metal layer and the copper thin film layer are formed using a dry plating method, and the long resin film is made of a polyimide film, a polyamide film, a polyethylene naphthalate film, a polyester film, a polytetra It is one of a fluoroethylene film, a liquid crystal polymer film, a polyether sulfone film, a polyether ether ketone film, and a polyphenylene ether film.

  According to the present invention, there is provided a highly reliable electroplating film that has no defects in appearance and in particular has no recess in the electroplating film in the production of long objects by a continuous processing apparatus such as a roll-to-roll type continuous electroplating apparatus. To do.

It is the schematic which shows an example of the plating apparatus used with the plating method of this invention. It is the schematic of the junction part of a long film with a metal film. It is a longitudinal cross-sectional view of an electroconductive metal foil tape, (a) The electroconductive metal foil tape used for the connection part which concerns on this invention, (b) The electroconductive metal foil tape used for the conventional connection part. It is the schematic of the punch type | mold and die type | mold used in the case of a press cut.

In the present invention, a metal-coated long film produced by forming a nickel-chromium alloy base metal layer on the surface of a polyimide film by sputtering, and forming a copper layer on the surface of the base metal layer by sputtering. This is a suitable method when using a plating apparatus for performing copper plating on the long resin film.
Then, in description of this invention, the plating apparatus used for evaluation of the connection part of the long films which concern on this invention first is demonstrated with reference to FIG.

FIG. 1 is a schematic view showing an example of a plating apparatus for continuously electroplating a long film on its surface.
The plating apparatus 10 is disposed inside an unwinding roll 12 for unwinding a long resin film F with a metal film, which is a long film, a plating solution tank 11 filled with an electroplating solution L, and a plating solution tank 11. Anode (anode) 14a, 14b, 14c, 14d, 14e, 14f, 14g, 14h, and a feeding roll of a feeder that is outside the plating solution tank 11 and feeds power to the long resin film F with metal film ( 16a, 16b, 16c, 16d, 16e, which is an example of a power feeding body according to the present invention, and a winding roll 15 for winding up a metallized long resin film substrate S obtained by electroplating a long resin film with a metal film. And.
The unwinding roll 12, the roll 13 inside the plating solution tank 11, the power supply roll 16, and the take-up roll 15 constitute a conveying means for the long resin film F with the metal film, and the long resin film with the metal film. F is immersed in the plating solution L while being transported in the longitudinal direction while keeping its width direction horizontal.

  Each power supply roll 16a, 16b, 16c, 16d, 16e and each power supply provided for each anode are connected by a power line. Each power source is a DC power source. Each power supply roll 16a, 16b, 16c, 16d, 16e and the anode 14a, 14b, 14c, 14d, 14e, 14f, 14g, 14h are paired, and each receives power from an independent power source. The maximum value of the potential difference is controlled by current control.

In addition, since the power supply rolls 16a, 16b, 16c, 16d, and 16e and the anodes 14a, 14b, 14c, 14d, 14e, 14f, 14g, and 14h are provided with power sources, the power supply rolls 16a, 16b, 16c, 16d, The pair of 16e and the anodes 14a, 14b, 14c, 14d, 14e, 14f, 14g, and 14h are electrically independent. Even if a plurality of anodes 14a, 14b, 14c, 14d, 14e, 14f, 14g, and 14h are provided in the same plating tank 11, the power supply rolls 16a, 16b, 16c, 16d, and 16e and the anodes 14a, 14b, and 14c are provided. , 14d, 14e, 14f, 14g, and 14h are electrically independent from each other.
Furthermore, as the anodes 14a, 14b, 14c, 14d, 14e, 14f, 14g, and 14h, a copper anode that dissolves as a copper source for electroplating or an insoluble anode can be used.

The plating solution tank 11 was filled with a copper plating solution.
As the copper plating solution, a known copper plating solution, for example, a known copper sulfate plating bath (bright bath) can be used. This copper sulfate plating bath can be composed of copper sulfate, sulfuric acid, a small amount of chlorine ions, known additives, and the like, and the composition thereof can be appropriately selected.

  By the way, the resin film F with a long metal film supplied to the plating apparatus as shown in FIG. 1 has a leading end in the transport direction, and when transporting the resin film F with a long metal thin film through the plating apparatus, The handling of the tip becomes a problem. This problem is not limited to a resin film with a long metal thin film, but is common to conductive long substrates.

  This problem will be described in detail. Normally, before the plating apparatus 10 is operated, a conductive long substrate is previously set on the transfer path and the operation is started. The conductive long substrate disposed downstream from the upstream (the anode on the carry-in side: the unwinding roll 12 side) cannot form a copper plating layer in a desired film thickness, resulting in product loss. The problem arises that the yield and economy are impaired.

Furthermore, a problem is that in the above-described state, discoloration of the copper plating layer or a seizure defect between the power supply roll and the long conductive substrate occurs.
Usually, the film thickness of the conductive layer of the long conductive substrate used (in the case of a long polyimide film with a metal thin film, a copper thin film layer) is 50 nm to 1000 nm, and the resistance value per unit area is 10 ^{−. 1} Ω.

  Since the continuous plating apparatus 10 is controlled by each anode and each power supply roll so that the current increases as it goes downstream (the carry-out side: the take-up roll 15 side), the conductive long substrate is preliminarily attached to the plating apparatus 10. Depending on the position of the power supply roll, etc., a large excess current may flow through the copper thin film layer, which may cause discoloration of the copper plating layer. And a problem of seizure between the long conductive substrate and the long conductive substrate.

  In order to prevent these problems, a non-conductive long substrate (so-called insulating dummy substrate) such as a PET film is connected to the tip of the substrate when the conductive long substrate is carried into the plating apparatus 10. Then, the electroplating is started by setting so that the conductive long substrate is placed at a position where it does not contact the first power supply roll 16a. In addition, the thickness of the PET film can be appropriately selected within a range in which no trouble occurs in the conveyance of the long resin film with a metal film, and about 50 μm is appropriate even if it is thick.

  In such an arrangement, the conductive long substrate is guided by the non-conductive long substrate and is transported through the continuous plating apparatus 10, so that electroplating in a steady state is possible from the first feeding roll 16a, and gradually. Further, the film thickness of the copper plating layer is increased, so that a large excess current is not applied, and these problems do not occur.

Next, the connection part of a conductive elongate board | substrate and a nonelectroconductive elongate board | substrate is demonstrated using FIG.
FIG. 2 is a longitudinal sectional view (so-called longitudinal sectional view) of the connecting portion 21 between the long resin film F with metal film and the PET film P as described above. In FIG. 2, the conductive copper foil tape 23, the masking tape 26, the double-sided tape 25 of the connecting means, the overlapping portion 24, the step 22a on the conductive long substrate side, and the step 22b on the non-conductive long substrate side. In addition, the connection means can employ | adopt suitably methods, such as connection by an adhesive tape, an adhesive tape, thermocompression bonding, an adhesive agent.
The inventor has found that the connection portion 21 causes a dent defect in the copper electroplating layer from various examination results.

That is, the conductive copper foil tape 23 used to cover the step 22a of the connecting portion 21 shown in FIG. 2 is a laminate of the copper foil base 31a and the conductive adhesive layer 32a as shown in FIG. A conductive copper foil tape having a structure. The copper foil base material is an electrolytic copper foil, and the adhesive component of the conductive adhesive layer is preferably an acrylic adhesive, and the conductive adhesive layer contains a conductive component such as carbon.
As shown in FIG. 3B, this conductive copper foil tape 23 has an elastic adhesive layer 32b having elasticity depending on the cutting method, so that the end of the conductive adhesive layer 32b is about 50 μm from the cut surface. It may stick out. The protruding conductive adhesive layer 32b adheres to the surface by contact with a power supply roll or the like, and is reattached to the long resin film with a metal film conveyed later, thereby being taken into the plating layer. As a result, it becomes a cause of the dent due to the foreign matter.

  Therefore, in order to prevent the conductive adhesive layer 32 from protruding from the side surface of the cut surface of the conductive copper foil tape 23, in the present invention, the lengthwise end portion of the conductive copper foil tape 23 is 1 to 2 mm. Is cut with a punch die (die) from the surface of the copper foil base 31. With such cutting, the cross section (so-called vertical cross section) of the conductive copper foil tape 23 in the longitudinal direction of the long resin film with a metal film as shown in FIG. Thus, the conductive adhesive layer 32a is covered and the protrusion of the conductive adhesive layer 32a can be within 5 μm.

  FIG. 4 is a schematic diagram showing the positional relationship between the punch die 34 and the die die 35 used for press cutting of the conductive copper foil tape 23. The conductive copper foil tape 23 is viewed from the direction corresponding to FIG. It is a figure. Reference numeral 33 denotes a mount.

The conductive copper foil tape 23 is sandwiched and cut between a punch die 34 and a die die 35 (so-called die). The punch die 34 is provided with blades at substantially the same interval as the range in which the copper foil base material 31 is to be cut.
On the other hand, the die mold 35 opens at substantially the same interval as the range where the conductive adhesive layer 32 is desired to be cut, and has corners as blades.
Therefore, if the distance between the blades of the punch die 34 is wider than the distance between the openings of the die die 35, the conductive copper foil tape 23 is cut in a state where the copper foil base 31 is wider than the conductive adhesive layer 32. Can do. Furthermore, the copper foil base material 31 covers the side surface of the conductive adhesive layer 32 by pressing the copper foil base material 31 with a punch die during press cutting.

  It should be noted that any cutting method can be appropriately selected as long as the cut conductive copper foil tape 23 has a cross-sectional shape shown in FIG.

The width at which the copper foil base material 31 is cut wider than the conductive adhesive layer 32 at one end is 1 mm or more and less than 2 mm, and preferably 1 mm or more and 1.5 mm or less. Here, the width that the copper foil base material 31 cuts wider than the conductive adhesive layer 32 is one of two cut surfaces of the conductive copper foil tape 23 that is press-cut by the punch die 34 and the die die 35. It is the width | variety which the copper foil base material 31 in one cut surface protrudes from the electroconductive adhesion layer 32, and is cut | disconnected.
The width which the copper foil base material 31 cuts wider than the conductive adhesive layer 32 is 1 mm or more and less than 2 mm, which is much larger than the thickness of the conductive adhesive layer 32 of 30 μm to 100 μm. If the width of the copper foil base material 31 to be cut widely is 1 mm or more and less than 2 mm, the conductive adhesive layer is also shown in FIG. As shown, it deforms according to the deformation of the copper foil base material 31.
If the width of the copper foil base material 31 that is cut wider than the conductive adhesive layer 32 is less than 1 mm, the accuracy of the press-cut is difficult, and the copper foil base material 31 may be folded or wrinkled when press-cut with a punch die. I will enter. If the copper foil base material 31 is broken or wrinkled, the wrinkles are transferred to the metallized long resin film substrate taken up by the take-up roll 15 and become a defective product.

  On the other hand, if the width at which the copper foil base material 31 is cut wider than the conductive adhesive layer 32 exceeds 2 mm, the width of the copper foil is wide and the copper foil base material 31 is not so much even if the conductive adhesive layer 32 is covered. Since it flutters at the time of conveyance, the electricity supply at the time of the copper foil base material 31 passing an electric power feeding roll will become unstable, and the external appearance defect will be brought about on the surface of the electrocopper plating of a long resin film with a metal film.

Next, a process for manufacturing a copper polyimide substrate, which is a kind of metallized long resin film substrate S, will be described with an example in which the plating apparatus 10 is used.
The connecting portion 21 is formed by overlapping the long resin film F with metal film F and the PET film P shown in FIG. 2 and bonding them with a double-sided tape 25, and the step of the overlapping portion 24 with the conductive copper foil tape 23 and the masking tape 26. 22a and 22b are covered. The masking tape is insulative.
A long resin film F with a metal film was manufactured by forming a base metal layer of nickel-chromium alloy on the surface of a polyimide film by a sputtering method, and forming a copper layer on the surface of the base metal layer by a sputtering method.

The long resin film will be described.
As the long resin film, a polyimide film, a polyamide film, a polyethylene naphthalate film, a polyester film, a polytetrafluoroethylene film, a liquid crystal polymer film, a polyether sulfone film, or the like can be used.
Of these resin films, a polyimide film is desirable in terms of electrical insulation, heat resistance, and flexibility. In addition, when a long resin film with a metal film is overlapped to form a connection portion, the thickness of the long resin film is preferably 50 μm or less in consideration of the film thickness of the metal film and the level difference of the connection portion.

The long resin film F with a metal film will be described.
The long resin film with a metal film F refers to a long resin film in which a metal film is formed (applied) on the surface of the long resin film. The formation of the metal film on the surface of the long resin film is as follows. It means that a metal film is formed without using an adhesive. That is, the long resin film F with a metal film is a long resin film in which a metal film is formed on the surface of the long resin film by a vacuum film formation method or the like.
This long resin film F with a metal film becomes a metallized long resin film substrate S through an electroplating process.

The long resin film F with a metal film is manufactured by forming a metal film on the long resin film by a vacuum film forming method.
Available vacuum film formation methods include physical film formation methods such as vacuum deposition and sputtering, and chemical film formation methods such as chemical vapor deposition (CVD).
Specifically, the vacuum deposition method is a method of forming a thin film on a substrate by heating and evaporating a film forming material of an evaporation source by resistance heating or electron gun irradiation. A plasma assisted vapor deposition method is also known in which a plasma is formed between an evaporation source and a substrate for the purpose of adhesion and densification of a thin film during vapor deposition. Of vacuum film formation methods, a sputtering method is desirable. .
The sputtering method uses a target obtained by forming a film forming material into a plate shape, generates plasma between the substrate and the target using the above plasma generation method using the target as an electrode for discharge, and uses the potential gradient to generate a target surface. In this method, the target material is knocked out by irradiating and colliding with ions to form a thin film of the target material on the substrate. The reason why the sputtering method is desirable is that the plasma can be controlled by a magnetic field or the like.

As the “metal film” of the long resin film F with the metal film, a metal selected from nickel, chromium and copper or an alloy containing any of nickel, chromium and copper can be selected.
For example, in the case of the metallized polyimide substrate (in the case where the outermost metal is copper, it is referred to as a copper polyimide substrate), the metal attached to the surface of the polyimide film by a vacuum film forming method includes nickel and chromium or It is desirable to use an alloy containing either nickel or chromium.
As the composition of the alloy containing either nickel or chromium, a known alloy composition can be appropriately selected from the use of the copper polyimide substrate. The reason for using nickel, chromium, or an alloy thereof is to improve the adhesion between the polyimide film and the metal.

In a copper polyimide substrate, a copper thin film layer is formed on a surface of a film of nickel, chromium, or an alloy containing any of these by a vacuum film formation method.
The reason for forming the copper thin film layer is to ensure conductivity when performing electroplating.
Electroplating is applied to the surface of this copper thin film layer in a long resin film with a metal film. Copper has a lower electrical resistance than nickel, chromium, or alloys thereof, that is, high conductivity. The copper thin film layer of the copper layer is formed on the base metal layer because it is easy to handle, inexpensive and the like.

Here, a long resin film with a metal film for a copper polyimide substrate has been described, but a long resin film with a metal film for a copper polyimide substrate is a polyimide film, nickel or chromium, or an alloy film containing any of these, The copper thin film layers are laminated in this order.
Here, nickel, chromium, or an alloy film containing any of these is referred to as a base metal layer. The laminated film of the base metal layer and the copper layer is the “metal film” of the long resin film F with the metal film.
Furthermore, in addition to the vacuum film-forming method for producing a long resin film with a metal film, an electroless plating method or the like can also be performed.

The metallized long resin film substrate S will be described.
The metallized long resin film substrate is manufactured by forming a plating film on the metal film of the long resin film with metal film F by electroplating.
For example, in a copper polyimide substrate which is a kind of metallized long resin film substrate, a base metal layer made of an alloy layer containing nickel or chromium or any of these by sputtering method which is a kind of vacuum film forming method on a polyimide film and The copper thin film layer is formed on the copper thin film layer by forming the copper thin film layer on the base metal layer and the metal film-equipped long resin film F laminated on the polyimide film.
The base metal layer and the copper thin film layer of the long resin film F with the metal film have a total thickness of 0.1 nm to several hundred nm, and the thickness of the copper plating film forms a thickness of several μm to several hundred μm. To do. Prior to copper electroplating, a plating layer can be appropriately formed on the copper thin film layer by an electroless plating method.

So far, the present invention has been described by taking electroplating of a metallized resin film as an example. However, the conductive long substrate of the present invention is not limited to a long resin film with a metal film, and a metal strip, copper foil, etc. Can be used. Also, the electroplating is not limited to the copper electroplating, and any electroplating can be performed as appropriate.
Furthermore, after the conductive long substrate on the unwinding side is subjected to electroplating, when performing the same plating continuously, the end portion (rear end portion) of the conductive long substrate plated first and The use of the connecting portion 21 of the present invention that covers the overlapping step (step 22a in FIG. 2) is also suitable when connecting the end portion (tip portion) of a conductive long substrate to be newly plated.
Hereinafter, the present invention will be described in detail using examples.

  A polyimide film “150EN-F (thickness 38 μm, width 524 mm)” manufactured by Toray DuPont Co., Ltd. is used as the long resin film, and a 7% nickel base metal layer is formed on the surface by sputtering to a thickness of 7.5 nm. Then, a copper thin film layer was formed on the surface of the base metal layer, and a metal film-attached long resin (polyimide) film was obtained by laminating metal films (total film thickness 110 nm).

In electroplating, the plating apparatus of FIG. 1 is used, the produced long resin film with metal foil is used for the conductive long substrate, and the PET film is used for the non-conductive long substrate. The connection was made via the connection unit 21.
As shown in FIG. 2, the connecting portion 21 is formed by superposing a long resin film F with a metal film and a PET film P, and forming a step formed by the superposition with a conductive copper foil tape 23 (Dainippon Ink Chemical Co., Ltd.). The end part of E-1100CD (18 μm thick copper foil / adhesive layer 32 μm, width 50 mm) manufactured by company is press-cut so that the copper foil base 31 is 1 mm wider than the conductive adhesive layer 32, and FIG. A processed product having a vertical cross-sectional shape was manufactured, and the overlapping step 22a was covered with the copper foil base material 31 by the processed product to form the connection portion 24.

A copper-plated film was formed on the long resin film F with a metal film so as to have a film thickness of 8 μm to obtain a metallized long resin film substrate S.
The plating potential difference was 3V. Current density, power is set to be in stepwise in a range of 0.01 A / cm ² of 0.04 A / cm ^2.

Furthermore, during electroplating, the current was controlled so that the voltage while the conductive tape (connecting portion 21) was in contact with the power supply roll 16 did not exceed 5 V, and continuous production was performed.
As a result, the foreign matter-induced dents per 50 mm × 50 mm in the range up to 10 m on the side of the conductive long substrate starting from the connection portion 21 (site where defects due to the connection portion are likely to occur) were 0.0007 pieces / m. . In this evaluation, a case where there is one or more foreign matter-caused dents within the range of 50 mm □ is counted as one “defect”, and “defect is present at a length of 10 m from the connecting portion 21 to the conductive long substrate side. The total number of "" is evaluated per unit length.
This result was in a practical range as a surface defect of the connection portion.

(Comparative Example 1)
Electroplating was carried out in the same manner as in Example 1 except that the end portion of the conductive tape was connected to a processed product that was press-cut so that the copper foil base 31 was wider than the conductive adhesive layer 32 by 0.5 mm. .
Since the wrinkles were generated at the end of the conductive tape and the wrinkles were transferred when the film was wound up, it was not practical.

(Comparative Example 2)
Electroplating was performed in the same manner as in Example 1 except that a processed product that was press-cut so that the copper foil base 31 was 2.2 mm wider than the conductive adhesive layer 32 was connected to the end of the conductive tape. .
Unevenness that can be confirmed by visual inspection of surface defects occurred over a range of up to 20 m on the conductive substrate side starting from the connection portion 21, so that it was not practical.

Electroplating was carried out in the same manner as in Example 1 except that the end portion of the conductive tape was connected to a processed product that was press-cut so that the copper foil base 31 was 1.5 mm wider than the conductive adhesive layer 32. .
Evaluation of the foreign substance-induced dents in the same manner as in Example 1 gave 0.0007 pieces / m, which was within the practical range.

(Comparative Example 3)
Electroplating was carried out in the same manner as in Example 1 except that the uncut product of the conductive tape was used.
Evaluation of the foreign substance-induced dents in the same manner as in Example 1 gave 0.2 pieces / m, which caused practical problems.

DESCRIPTION OF SYMBOLS 10 Plating apparatus 11 Plating solution tank 12 Unwinding roll 13 Roll 14a, 14b, 14c, 14d, 14e, 14f, 14g, 14h inside plating solution tank Anode (anode)
15 Winding rolls 16a, 16b, 16c, 16d, 16e Feeding roll 21 Connecting part 22 Controller 22a Step 22b on the side of the conductive long board 23 Step 23 on the side of the non-conductive long board 23 Conductive copper foil tape 24 Overlapping part 25 Double-sided tape 26 Masking tape 31, 31a, 31b Copper foil base material 32, 32a, 32b Conductive adhesive layer 33 Mount 34 Punch die 35 Die type L Plating solution F Long resin film with metal film S Metallized long resin film Substrate P PET film

Claims (5)

In the electroplating method of providing a plating layer on the conductive long substrate by electroplating while repeating immersion in an electroplating solution by transporting the conductive long substrate in the longitudinal direction by a roll-to-roll method,
A non-conductive long substrate connected via a connecting portion is provided at the front end of the conductive long substrate in the transport direction, and the non-conductive long substrate is transported to the top to perform the electroplating. And
The connecting portion has an overlapping portion in which an end portion of the conductive long substrate and an end portion of the nonconductive long substrate are connected using a connecting means,
In the structure where the step on the conductive long substrate side of the overlapped portion is covered with a conductive metal foil tape,
The conductive metal foil tape comprises a laminate of metal foil and a conductive adhesive layer,
The electroplating method according to claim 1, wherein the metal foil has a cross-sectional shape that covers an end portion of the conductive adhesive layer in a longitudinal cross-sectional shape of the conductive metal foil tape.   The electroplating method according to claim 1, wherein the electroplating solution is a copper electroplating solution. In the method for producing a metallized resin film, a base metal layer is formed on at least one surface of the long resin film without using an adhesive, and a copper coating layer is formed on the surface of the base metal layer.
The formation of the copper coating layer is performed by the electroplating method according to claim 2 using a conductive long substrate,
The electrically conductive long substrate is a long resin film with a metal thin film in which a base metal layer and a copper thin film layer are formed on the surface of the base metal layer without an adhesive on at least one surface of the long resin film The manufacturing method of the metallized resin film characterized by the above-mentioned.   The method for producing a metallized resin film according to claim 3, wherein the base metal layer and the copper thin film layer are formed using a dry plating method.   The long resin film is any one of a polyimide film, a polyamide film, a polyethylene naphthalate film, a polyester film, a polytetrafluoroethylene film, a liquid crystal polymer film, a polyether sulfone film, a polyether ether ketone film, and a polyphenylene ether film. The method for producing a metallized resin film according to claim 3 or 4, wherein:

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