JP5832864B2 - Screen printing machine - Google Patents

Description

  The present invention relates to a screen printer, and more particularly to an improvement of a screen printer that prints cream solder on a circuit board.

In the screen printing machine, a squeegee is moved along a mask by a squeegee moving device, and a printing agent is printed on a printing target member through a through hole of the mask. This screen printing machine is widely used for printing cream solder (hereinafter abbreviated as solder unless otherwise required) on a circuit board, and examples thereof are described in Patent Documents 1 and 2 below. However, the user's request is stricter than that of a general screen printing machine. For example, it is required to print solder very accurately on pads formed on a circuit board. The solder is required to be printed in a shape and amount accurately corresponding to the through hole of the mask. In order to satisfy this requirement, it is desired that the amount of solder on the mask be kept constant.
Therefore, the screen printing machine according to JP Trogir Document 1 is detected height of the solder which is a roll shape by a laser Soldering height sensor by squeegee, if lower than the set level activates the solder supply apparatus The solder is replenished.
In Patent Document 2, by measuring the weight of a circuit board after solder printing, the amount of solder consumed for printing is obtained for each circuit board, and the solder for the consumed amount is replenished. Alternatively, it is described that the amount of solder on the mask is kept constant by simply supplying a calculated amount of solder. Furthermore, it is described that the amount of solder printed for each circuit board is compared with a set amount to determine whether printing is good or bad.

Japanese Patent Laid-Open No. 05-261892 Japanese Patent Laid-Open No. 11-179879

  However, there is still room for improvement in the above prior art. For example, solder consumption is not uniform across the mask. Depending on the distribution of through-holes, some circuit boards have a part where the amount of consumption increases locally, and in particular, there may be a shortage of solder on the mask. There is a fuss that can not cope with such a situation sufficiently.

Needless to say, the lack of technology in screen printing of solder onto the circuit board is only an example, and there is room for further improvement.
The present invention has been made with the above situation as a background to reduce the shortage of the prior art.

In order to solve the above problems , the screen printing machine of the present invention provides:
A squeegee is moved along a mask by a squeegee moving device, and cream solder is printed on a circuit board through a plurality of through holes formed in the mask, and a solder supply device for supplying the cream solder onto the mask is provided. A screen printing machine,
Solder consumption prediction unit that predicts consumption of creamy solder accompanying the progress of a printing operation for each of a plurality of divided regions obtained by dividing the mask in a direction parallel to the moving direction of the squeegee by the squeegee moving device. When,
Among the plurality of divided areas, one or more divided areas whose predicted consumption predicted by the solder consumption amount prediction unit is larger than other divided areas are cream-like during the progress of the printing operation. A replenishment plan formulation department that formulates a replenishment plan that includes the time, position and amount of replenishment of solder;
A local replenishment command unit for instructing the solder supply device to perform local replenishment of cream solder according to the replenishment plan formulated by the replenishment plan formulation unit;
It is characterized by including.

As described above, the station unit to predict the partial consumption of the solder is large, established the solder replenishment plan based on the prediction, if supplemented with solder to solder supply apparatus in accordance with the replenishment plan, a local Occurrence of solder shortage can be suppressed in advance, and the printing accuracy of solder on the circuit board can be improved.

Aspects of the Invention

  In the following, an invention that is recognized as being capable of being claimed in the present application (hereinafter referred to as “claimable invention”. The “claimable invention” refers to the claimed invention that is the invention described in the scope of claims and its subordinates. The invention may include a concept invention or a superordinate concept invention, and may include another concept invention). As with the claims, each aspect is divided into sections, each section is numbered, and is described in a form that cites the numbers of other sections as necessary. This is for the purpose of facilitating understanding of the claimable invention, and is not intended to limit the combination of the constituent elements constituting the claimable invention to those described in the following sections. In other words, the claimable invention should be construed in consideration of the description accompanying each section, the description of the embodiment, the prior art, the common general technical knowledge, and the like. An aspect in which a constituent element is added and an aspect in which the constituent element is deleted from the aspect of each section can be an aspect of the claimable invention.

In each of the following items, item ( 2) corresponds to claim 1, item (7) in claim 2 , item (4) in claim 3 , item (5) in claim 4 , (6) is in claim 5 , (11) is in claim 6 , (12) is in claim 7 , (13) is in claim 8 , (14) is in claim 9 , Each corresponds.

(1) Solder supply that moves a squeegee along a mask by a squeegee moving device, prints cream-like solder on a circuit board through a plurality of through holes formed in the mask, and supplies the cream-like solder onto the mask A screen printing machine equipped with a device,
A screen printing machine comprising: a solder replenishment control unit that replenishes the solder supply device with a cream-like amount of solder that is not uniform with respect to the longitudinal direction of the squeegee during a printing operation on a plurality of circuit boards.
As the solder replenishment control unit, ones having the configurations described in the following items are suitable, but are not essential. For example, it is not essential to divide the mask into a plurality of divided regions. The amount of replenishment of solder can be changed continuously in the longitudinal direction of the squeegee, or the places where replenishment is required are continuously examined, but replenishment can be performed only at the places where replenishment is required. Therefore, it is not necessary to divide the mask into a plurality of divided areas.
(2) Solder supply that moves the squeegee along the mask with a squeegee moving device, prints the cream solder on the circuit board through a plurality of through holes formed in the mask, and supplies the cream solder onto the mask A screen printing machine equipped with a device,
Solder consumption prediction unit that predicts consumption of creamy solder accompanying the progress of a printing operation for each of a plurality of divided regions obtained by dividing the mask in a direction parallel to the moving direction of the squeegee by the squeegee moving device. When,
Among the plurality of divided areas, one or more divided areas whose predicted consumption predicted by the solder consumption amount prediction unit is larger than other divided areas are cream-like during the progress of the printing operation. A replenishment plan formulation department that formulates a replenishment plan that includes the time, position and amount of replenishment of solder;
And a local replenishment command unit for instructing the solder supply device to perform local replenishment of cream-like solder according to the replenishment plan formulated by the replenishment plan formulation unit.
In this section, the solder consumption prediction unit shall predict the solder consumption for continuous positions without dividing the mask in the direction parallel to the moving direction of the squeegee, It is also possible to formulate a supply plan for.
(3) An opening area sum-based consumption prediction unit that predicts the solder consumption based on a sum of opening areas of the plurality of through holes distributed in each of the plurality of divided regions. The screen printing machine as described in (2).
(4) The solder consumption amount prediction unit predicts the solder consumption amount based on the thickness of the mask at a position corresponding to each of the through holes in addition to the sum of the opening areas of the plurality of through holes. The screen printer according to (3), including a through hole volume sum-based consumption prediction unit.
When the mask has a constant thickness throughout, the sum of the opening areas of the plurality of through holes distributed in each of the divided regions is proportional to the amount of solder consumed. Based on this, it is possible to predict the solder consumption in each divided region.
However, if the mask thickness is not constant throughout, it is desirable to consider the thickness distribution. It is desirable to predict the amount of solder consumed in each divided region based on the sum of the volumes of the plurality of through holes.
(5) Obtained at the time of execution of a printing operation performed by the solder consumption prediction unit using a mask whose solder consumption is to be predicted and a mask in which the distribution state of the through holes and the distribution state of the thickness are the same The screen printing machine according to any one of (2) to (4), further including a preceding printing work result-based consumption prediction unit that predicts the solder consumption based on a work result.
(6) The change of the roll diameter, which is the diameter of the cream-like solder roll formed with the movement of the squeegee, before and after the execution of the printing work on the set number of circuit boards by the preceding printing work result-based consumption prediction unit Can be continuously measured along the longitudinal direction of the solder roll (in this case, it is considered as an infinite number of places, which is a special case of "multiple places") The screen printing machine according to (5), further including a roll diameter change distribution-based consumption prediction unit for a preceding printing operation that predicts the solder consumption based on the roll diameter change distribution detected in (1).
If the roll diameter distribution is obtained after executing the printing operation on the set number of circuit boards from a state where the roll diameter is constant with respect to the longitudinal direction of the solder roll, the roll diameter distribution itself corresponds to the solder consumption distribution. Consumption prediction is simplified and prediction accuracy is improved. However, it is not indispensable, and it is possible to predict the amount of solder consumption based on the change of the roll diameter from an arbitrary roll diameter distribution state. In that case, the roll diameter is previously fixed in the longitudinal direction of the solder roll. There is an advantage that it is not necessary to prepare the state.
Note that even if the term “roll” is used, the cross-sectional shape of the roll is not actually a circle, so the “roll diameter” or “roll diameter” is an expression commonly used in the technical field of cream solder screen printing. It was just followed, and in fact, it was “the cross-sectional dimension of the roll in the direction that affects the pressure applied to the through-holes of the cream solder by the squeegee”, and should be called the “roll thickness dimension” It is. The preceding printing operation may be a printing operation performed for an experiment or a printing operation performed as part of actual production.
(7) The solder consumption prediction unit relies on a print inspection result for predicting the amount of consumption of the creamy solder accompanying the progress of the printing operation based on the inspection result of the printing inspection apparatus that inspects the printing result of the screen printing machine. The screen printer according to any one of items (2) to (6), including a consumption prediction unit.
(8) Based on a state in which the deficiency level, which is a ratio of the deficient amount to the normal amount of the printed cream-like solder, exceeds the set value, the print inspection result-based consumption amount prediction unit causes the solder consumption amount to be changed to another part. The screen printing machine according to (7), including a deficiency-dependent consumption large amount prediction unit that predicts that the consumption amount is a large portion in comparison.
The shortage degree-dependent consumption large-scale forecasting unit has a print location where the deficiency exceeds the set value, and the frequency at which the deficiency at the same print location exceeds the set value is greater than the set frequency. It is desirable to predict that the amount of solder consumption is a portion that consumes more than other portions based on at least one of the increasing tendency of the deficiency at the same print location.
(9) The screen printer according to any one of (2) to (8), wherein the solder consumption prediction unit includes a mask dividing unit that divides the mask into a plurality of divided regions.
The mask dividing unit can also divide the mask according to a predetermined rule regardless of the formation state of the through holes. For example, it shall be equally divided.
(10) The screen printing machine according to (9), wherein the mask division unit includes a through-hole formation state-added division unit that divides the mask in consideration of a plurality of through-hole formation states.
(11) The through-hole formation situation-added division unit divides the mask into portions where the sum of the volumes of the plurality of through-holes arranged in a direction parallel to the movement direction of the squeegee is substantially uniform. The screen printer according to item (10), including a through-hole volume sum-based division section.
(12) The replenishment plan formulating unit includes a printed sheet number-based replenishment timing determining unit that determines a time at which the local replenishment is to be performed by the number of circuit boards printed from the start of a printing operation or the previous replenishment time. Or a screen printer according to any one of (11).
(13) The replenishment plan formulating unit determines the position to be locally replenished at a right angle to the moving direction of the squeegee in each of the one or more divided areas where the predicted consumption is larger than other divided areas. The screen printing machine according to any one of (2) to (12), further including a replenishment point determination unit that determines a central point in the width direction, which is a simple direction.
The replenishment plan determination unit determines a replenishment area determination in which a position to be locally replenished is determined as a replenishment area that is an entire width or a part of each of one or more divided areas whose predicted consumption is larger than other divided areas. It is also possible to include a part.
(14) The replenishment plan formulating unit increases the replenishment amount to be locally replenished as the predicted consumption amount of each of the one or more divided regions is larger than that of the other divided regions. The screen printer according to any one of items (2) to (13), including a supply amount determination unit corresponding to a predicted consumption amount that is determined as a supply amount.
It is also possible to set a single replenishment amount to a constant amount, and to shorten the replenishment interval as the predicted consumption amount increases, which has the advantage of reducing fluctuations in roll diameter and stabilizing print quality. On the other hand, according to the feature of this section, there is an advantage that the number of times of replenishment can be reduced and work efficiency can be improved.
(15) The replenishment plan formulation unit includes an appropriate roll diameter distribution storage unit that stores information on an appropriate roll diameter distribution in which the distribution of the roll diameter in the longitudinal direction of the solder roll is in an appropriate state. In contrast, in any of the items (2) to (14), the part including the roll diameter shortage amount corresponding supply amount determination unit that determines the supply amount to be locally replenished as a large supply amount as the portion where the roll diameter is largely insufficient is included. Screen printing machine.
(16) The screen printing according to any one of (1) to (15), further including a roll diameter detection device that detects a roll diameter that is a diameter of a cream-like solder roll formed with the movement of the squeegee. Machine.
(17) The screen printing machine according to (16), further including a roll diameter suitability determination unit that determines whether the detected part has a proper roll diameter based on a detection result by the roll diameter detection device.
(18) When the roll diameter detecting device detects the roll diameter of the replenishment target portion of the solder roll, which is a portion where the cream-like solder is replenished by the solder supply device, and the detected roll diameter is inappropriate The screen printing machine according to item (16) or (17), including a replenishment plan correction unit that corrects the replenishment plan determined by the replenishment plan formulation unit.
Once a supply plan is formulated, the supply plan may not be appropriate. In that case, it is desirable to modify the supply plan. One example is to correct when the roll diameter detected by the roll diameter detection device is inappropriate. In addition, as a result of continuing the printing operation while repeating the replenishment according to the replenishment plan, the replenishment plan is not appropriate. It is also possible to include a supply plan correction unit that corrects the supply plan when it is found out.
(19) An average diameter is obtained by averaging the roll diameter in the length direction of the solder roll based on the detection result by the roll diameter detector, and when the average diameter is smaller than the set diameter, the cream is applied to the entire solder roll. The screen printing machine according to any one of items (16) to (18), which includes an entire replenishment command section for instructing replenishment of the solder.
(20) The solder supply device
A solder dispenser that dispenses cream-like solder in a rod shape from the discharge port;
A discharger moving device for moving the solder discharger in a direction parallel to the longitudinal direction of the squeegee;
By controlling the solder discharge (start, stop and speed of discharge) of the solder discharger and the discharger movement (start, stop and speed of movement) by the discharger moving device, the discharged cream solder A screen printer according to any one of (1) to (19), including: a rod-shaped supply control unit configured to form a rod having a uniform thickness over the entire length.
(21) The bar-shaped replenishment control unit changes the thickness of the bar-shaped cream-like solder by changing the ratio of the solder discharge speed of the solder discharger and the discharger moving speed by the discharger moving device. The screen printing machine according to item (20), including a bar-shaped solder thickness changing portion.

It is a perspective view which shows the electronic circuit assembly line containing the screen printer which is one Embodiment of claimable invention. It is a top view which shows the board | substrate conveyance apparatus in the said screen printer and a shuttle conveyor. It is a side view which shows the main body frame of the said screen printer. It is a perspective view which shows the apparatus which moves the mask cleaning apparatus and reference mark imaging device in the said screen printer. It is a top view which shows the mask frame receptacle in the said screen printer, and the position adjustment apparatus of a mask. It is a top view which shows the squeegee apparatus in the said screen printer. It is a partial cross-sectional perspective view which takes out a part of the squeegee device and removes the connecting portion on the front side of the squeegee slide. It is a perspective view which shows the squeegee head of the said squeegee apparatus. It is a perspective view which shows the solder scraping apparatus in the said squeegee apparatus. It is a front view which shows the solder supply apparatus in the said screen printer. It is a partial cross section side view which shows the said solder supply apparatus. It is side surface sectional drawing which shows a part of cover apparatus in the said screen printer. It is a block diagram which shows the control apparatus of the said screen printer. It is a flowchart showing an example of the control program stored in the computer of the said control apparatus. It is a figure for demonstrating the rod-shaped supply which is one aspect | mode of the solder supply by the solder supply apparatus shown to FIG. 10 and FIG. It is a flowchart showing a part of another example of the control program stored in the computer of the said control apparatus. It is a flowchart showing another part of control program shown in FIG. It is a flowchart showing another part of control program shown in FIG. It is a figure for demonstrating the control program shown in FIG. It is a figure for demonstrating the control program shown in FIG. 16 thru | or FIG. It is a flowchart showing another example of the control program stored in the computer of the said control apparatus. It is a figure for demonstrating the control program shown in FIG.

Hereinafter, an embodiment of the claimable invention will be described with reference to the drawings.
In addition to the following embodiments, the claimable invention can be implemented in various modifications based on the knowledge of those skilled in the art, including the aspects described in the above [Aspect of the Invention] section. .

  FIG. 1 shows an electronic circuit assembly line including a printer (screen printer) which is an embodiment of the claimable invention. This electronic circuit assembly line includes a plurality of (two in the illustrated example) printing machines 10, a plurality of (two in the illustrated example) shuttle conveyors 12, and a plurality of (four in the illustrated example) shuttle conveyors 12. A mounting machine (electronic circuit component mounting machine) 14 is included. The printing machine 10 and the mounting machine 14 are a kind of board-to-board work machines that perform work on circuit boards, and the electronic circuit assembly line is a kind of board-to-board work lines. The two printing machines 10 are provided adjacent to each other on the upstream side with respect to the four mounting machines 14 in the conveyance direction of the circuit board in the electronic circuit assembly line, and one of the two shuttle conveyors 12 is 2 The other side is provided between the downstream printing press 10 and the mounting machine 12 adjacent to the printing press 10. In this specification, the board conveyance direction, which is the circuit board conveyance direction, is the left-right direction, and the direction orthogonal to the board conveyance direction is the front-rear direction. In the present embodiment, the left-right direction and the front-rear direction are both horizontal.

The two printing presses 10 and the shuttle conveyor 12 are configured in the same manner, and the upstream printing press 10 and the shuttle conveyor 12 will be described as a representative.
As shown in FIG. 2, the printing machine 10 includes a printing machine body 20, a front conveyor 22, and a rear conveyor 24. The front conveyor 22 is provided in the front part of the printing press main body 20, and the rear conveyor 24 is provided in the rear part. The front conveyor 22 includes a main conveyor 26, an in-conveyor 28 disposed on the upstream side of the main conveyor 26 in the substrate transport direction, and an out-conveyor 30 disposed on the downstream side. Each of the main conveyor 26, the in-conveyor 28, and the out-conveyor 30 is constituted by a belt conveyor, and includes a pair of conveyor belts 32 and a belt circulator 34 that circulates the conveyor belts 32. Transport in a posture where the printing surface is horizontal. Further, the conveyance width (the interval between the pair of conveyor belts 32) is changed by the width changing device including the width changing motor 36 and the belt 38 in accordance with the width of the circuit board 35 to be transferred. Similarly, the rear conveyor 24 is constituted by a belt conveyor capable of changing the conveyance width.

  The shuttle conveyor 12 includes a conveyor body 40, a guide 42, a movable conveyor 44, and a movable conveyor moving device 46. The movable conveyor 44 is configured by a belt conveyor whose conveyance width can be changed, like the front conveyor 22 and the like. The movable conveyor moving device 46 includes a shuttle motor 50 as a driving source, a belt 52 and a plurality of pulleys 54. One of the plurality of pulleys 54 is rotated by the shuttle motor 50, and the fixed side frame 56 and the support frame 58 connected to the belt 52 are moved, and the movable side frame 60 is moved via the conveyance width adjusting device 59. The entire movable conveyor 44 can be moved to an arbitrary position in the front-rear direction.

A main body frame 70 constituting the main body of the printing press main body 20 has a structure schematically shown in FIGS. 3 and 4. A guide 74 is provided for each of the pair of girders 72, and a feed screw 76 is provided for one of the pair of girders 72. And the feed screw 76 is rotated by the electric motor 78, whereby the slide 80 is moved in the front-rear direction. As the feed screw 76, a ball screw is suitable, and as the electric motor 78, an electric motor capable of controlling the rotation angle such as a servo motor is suitable. The same applies to the feed screw and the electric motor described below.
The mechanical configuration of the printing press 10 is the same as that described in the specification and drawings of Japanese Patent Application No. 2010-102298 filed earlier by the present applicant. The description of the parts that are not related to the possible invention is omitted.

  A mask cleaning device 82 is attached to the slide 80. The slide 80 is provided with another slide 90 guided by a guide 92 so as to be movable in the left-right direction, and is moved by a feed screw and an electric motor (not shown). A reference mark imaging device 94 for imaging a reference mark provided on the mask and the circuit board 35 is attached to the slide 90.

  The front conveyor 22 and the rear conveyor 24 are provided above the pair of girders 96 of the main body frame 70, and the substrate holding device 100 including a substrate supporting device and a substrate clamping device in a space between the girders 72 and 96. A lifting device 102 that lifts and lowers it is provided. A detailed description of these configurations is omitted, and only the position is indicated by a two-dot chain line. However, the substrate support device supports the circuit board 35 conveyed by the main conveyor 26 from below, and cooperates with the main conveyor 26. The substrate clamping device is thus configured. The elevating device also includes a first elevating drive unit that elevates the substrate support device relative to the main conveyor 26, and a second elevating drive unit that elevates the substrate support device and the main conveyor 26 integrally. It is out.

  The mask frame receiver 120 and the position adjusting device 122 shown in FIG. 5 and the squeegee device 124 shown in FIG. 6 are supported by the pair of uppermost beams 106 of the main body frame 70. The mask frame receiver 120 receives a mask frame 134 that holds a mask 132 having a plurality of through holes 130 in the printing region 128 from below, and a pair of receiving portions 136 and the mask frame 134 are pressed and fixed to them. And a plurality of air cylinders 138 as fixing devices. The position adjusting device 122 is provided between the beam 78 and the mask frame holder 120. By adjusting the position of the mask frame holder 120, the position adjusting device 122 is attached to the mask 132 held by the mask frame holder 120 and the substrate holding device 110. This is to eliminate the relative positional deviation with respect to the held circuit board 35.

  A squeegee device main body 150 indicated by a two-dot chain line in FIG. As shown in FIG. 6, the squeegee device main body 150 is a U-shaped flat plate member, and two guides 152 are provided along two U-shaped arm portions. A squeegee slide 154 is movably supported by these two guides 152 and is moved in the front-rear direction by a squeegee slide driving device 156. As shown in FIG. 7, one first elevating member 160 and two second elevating members 162 are held on the squeegee slide 154 so that they can be moved up and down relatively. Each squeegee head 170 shown in FIG. 8 is held.

  Two guide rods 164 are fixed to each second elevating member 162 vertically upward at a distance in the left-right direction. The guide rods 164 are slidably fitted to two guide sleeves 166 provided on the first elevating member 160 and two guide sleeves 168 provided on the squeegee slide 154, respectively. Eventually, each of the two second elevating members 162 is guided by the two guide rods 164 and the two guide sleeves 166 to move up and down in the vertical direction with respect to the first elevating member 160, and The one elevating member 160 is guided by the four guide rods 164 and the four guide sleeves 168 and moves up and down in the vertical direction with respect to the squeegee slide 154. The guide rod 164 also serves as a guide for the first elevating member 160 and the second elevating member 162. Each of the two second elevating members 162 is translated in the vertical direction relative to the first elevating member 160 individually by the elevating drive device 180.

  Each second elevating member 162 has a longitudinal shape, and a squeegee head 170 shown in FIG. 8 is detachably attached to a central portion in the longitudinal direction via a head holding member 200. The head main body 212 of the squeegee head 170 is provided with two hooks 214 as attachment portions, and each of the hooks 214 is screwed into the head holding member 200 with two fixing screws 216 (in FIG. 7). The head main body 212 is attached to the head holding member 200 by being hooked on the shaft portion (only one is shown) and the fixing screw 216 being tightened by hand. Therefore, when the two second elevating members 162 are individually raised and lowered, the squeegee heads 170 held by the second elevating members are individually pressed against the mask 132 or separated from the mask 132. .

  The squeegee head 170 includes a squeegee holder 220 that can rotate relative to the head body 212. The squeegee holding body 220 detachably holds the squeegee 222, but the relative angle of the squeegee holding body 220 with respect to the head holding member 200, that is, the wedge angle formed by the squeegee 222 and the mask 132 can be arbitrarily changed. This change is performed by turning around the lower edge of the squeegee 222.

  A solder scraping member 230 is attached to the head holding member 200. The solder scraping member 230 is attached to a bracket 232 shown in FIG. 9, and the bracket 232 is attached to the back surface of the head holding member 200. The solder scraping member 230 is made of rubber, and in a free state, as shown in FIG. 9, the cross-sectional shape forming a straight bar is a trapezoidal member, but in the attached state, the solder scraping member 230 is attached to the side end surface of the squeegee 222. Abutted and elastically bent, and the bent portion is in a state parallel to the moving direction of the squeegee 222 as indicated by a two-dot chain line. As described above, the change in the wedge angle of the squeegee 222 is performed by rotation with the lower end edge of the squeegee 222 as the rotation center line. Therefore, the change in the wedge angle may change the height of the lower end edge of the squeegee 222. The solder scraping member 230 always contacts the side end face of the squeegee 222 and the mask 132, and functions to scrape the solder to the squeegee side.

  The solder is supplied onto the mask 132 by the solder supply device 240 shown in FIGS. The solder supply device 240 includes a solder container 242. The solder container 242 is an elongated cylindrical container, and has an opening for replenishing solder at one end, and this opening is normally covered with a cap 244 in an airtight manner. The solder container 242 has a discharge port 246 at the other end. A piston 248 is slidably fitted in the solder container 242, and pressurized air is supplied from an air supply device 250 as a discharge driving device via an air supply unit 252 provided in the cap 244. As a result, the solder 254 in the solder container 242 is pressurized via the piston 248 and discharged from the discharge port 246.

  The solder container 242 is detachably attached to the rotating member 258 by the container holding device 256, and the rotating member 258 is attached to the movable member 262 via a rotary cylinder 260 as a rotating member driving device. . The movable member 262 is held by the solder supply device main body 266 via the guide 264 so as to be movable in the left-right direction, and is moved by the movable member driving device 268. The movable member drive device 268 includes a belt 270 that is circulated by an electric motor (not shown) as a drive source fixed to the solder supply device main body 266, and the movable member 262 is coupled to one place of the belt 270. . Therefore, the movable member 262 and the solder container 242 are moved in the left-right direction by the rotation of the electric motor. In this embodiment, the solder supply device main body 266 is fixed to the front side of the squeegee slide 154 and is moved together with the squeegee head 170. However, the solder supply device main body 266 can be fixed to the squeegee device main body 150 or the main body frame 70. .

  As shown in FIG. 10, the solder container 242 is normally maintained in a lateral orientation in which the longitudinal direction is parallel to the left-right direction. This is to prevent the solder 254 of the solder container 242 from dripping from the discharge port 246 due to its own weight even when air is not supplied. When the solder 254 is supplied, the discharge port 246 is rotated to a vertically oriented posture. The solder container 242 interferes with surrounding members in the horizontal posture and cannot be moved with a sufficiently large stroke. However, in the vertical posture, the maximum solder supply scheduled on the mask 132 is not possible. It can be moved in the left-right direction with a stroke corresponding to the region. The solder 254 is supplied not to the space between the pair of squeegees 222 but to the outside of the space, and the squeegee head 170 is moved in a state in which one of the squeegees 222 is in a raised position away from the mask 132. In a state where the solder on 132 is positioned between the pair of squeegees 222 in plan view, the one squeegee 222 is lowered to be taken into the space between the pair of squeegees 222.

  In the printing machine 10, a printing unit including the front conveyor 22, the substrate holding device 100, the mask frame receiver 120, the squeegee device 124, and the like is provided at the front part of the main body frame 70 and covers the entire printing machine 10. An opening / closing door 284 is provided at the front of (see FIG. 1), and an opening / closing door 284 is provided with an operation panel 288 including a see-through window 286 and a display 358 that can be seen through. The opening / closing door 284 can be easily opened manually from the closed state shown in FIG. 12 (a) to the open state shown in FIG. 12 (b), and is a link mechanism constituted by the opening / closing door 284, the link 290 and the cover 282. Thus, it can be stably held in the state shown in FIG. A display 358 of the operation panel 288 is attached so that it can be seen from the front even when the open / close door 284 is opened. Therefore, the operator 292 can perform operations and monitoring necessary for operating the printing press 10 from the front of the printing press 10 and also perform maintenance and the like for the printing unit that needs to be opened and opened. It can be performed from the front while operating the operation panel 288 and monitoring the display 358.

  As shown in FIG. 1, the electronic circuit assembly line configured as described above includes a control device 300 that controls each printing machine 10, a control device 302 that controls each mounting machine 14, and these control devices 300. , 302 is controlled by a control system including an overall control device 304 for overall control. Each of the shuttle conveyors 12 is controlled by the control device 300 of the printing machine 10 on the upstream side thereof.

  A more detailed configuration of the control device 300 is shown in FIG. The control device 300 is mainly composed of a computer 310 including a CPU 316, a RAM 314, a ROM 312 and an I / O port 318. The I / O port 318 includes various detection devices and operation devices of the printing press 10, as well as overall control. A device 304 is connected, a program memory 330 for storing various programs is provided in the ROM 312, and various memories typically shown in FIG. 13 are provided in the RAM 314.

  In the printing machine 10, the solder placed on the mask 132 is held in the substrate holding device 100 through the through hole 130 formed in the mask 132 while being moved in a roll shape by the movement of the squeegee 222. However, if the amount of solder on the mask 132 is smaller than the appropriate amount, the printed circuit board 35 is not printed in the proper amount, that is, in the proper shape and thickness. . Therefore, in the printing press 10, the mask 132 is moved onto the mask 132 by executing a program selected automatically from a plurality of types of programs stored in the program memory 330 of the ROM 312 or based on a predetermined selection rule. The solder is automatically supplied.

  First, “consumption prediction, local supply plan formulation and supply execution routine” shown in FIG. 14 as one of them will be described. In this routine, solder consumption prediction is performed in S10 to S18, S24 and S30, S38 to S46, and based on the prediction results, a local supply plan is formulated in S20, S26 and S32, and the local supply plan is determined. Based on the above, local replenishment is performed in S54 to S58.

  First, in S10, both the integer M and ΣM are set to 0, the natural number P is set to 1, and M0, M1 and Mmax are stored. The integer M is an integer that increases by 1 every time a test result of one circuit board 35 is obtained, and ΣM is an integer that increases by 1 when the integer M increases by 1 and is not reset even when M is reset to 0. , Mmax is the total number of circuit boards 35 scheduled to be inspected. The inspection may be performed on all circuit boards printed by the printing machine 10, or may be performed on one circuit board 35 for every set number of printed circuit boards 35. In the former case, Mmax is the same as the planned number of production. In the latter case, Mmax may be input by the operator. Depending on the operator, the number of production of the circuit board 35 to be produced is once per Mmax. It may be calculated by the computer 310 based on information on whether or not to perform the inspection. M0, M1, and N0 will be described later.

  Next, in S11, M and ΣM are incremented by 1, and in S12, the inspection result of one circuit board 35 is read and stored. Reading of one inspection result of the circuit board 35 inspected by the printing machine 10 itself or the inspection device of the inspection machine provided downstream of the printing machine 10 and storage in the inspection result memory 340 of the ROM 312 are performed. It is. Since the inspection apparatus is a well-known inspection device, a detailed description thereof is omitted. However, it is also possible to take an image of the planar shape of the solder printed on the circuit board 35 and determine whether printing has been performed properly from the imaging result. The amount of solder printed is obtained by applying flat slit light to a plurality of printed solder locations from the direction inclined with respect to the surface of the circuit board 35, and image processing of the bright portion image formed thereby. It is suitable to acquire the print amount from the three-dimensional solder shape, such as detecting what the height of multiple points on the surface of the solder is non-contact and acquiring the print amount of the solder based on the detection result It is. In any case, the inspection apparatus assumes that there is a high possibility that a print defect or a print defect will occur on one circuit board 35. For each of the preset print places, data indicating the amount of solder printing is stored. Each circuit board 35 can be created and output.

  After reading and storing the inspection result in S12, it is determined in S14 whether or not the processing has been completed for all the Mmax circuit boards 35. However, since the initial determination result is NO, in S16, the solder is determined. It is determined whether or not there is a print location with a short print amount. The “shortage of printing amount” means that the printing amount is less than the normal amount for each printing portion, but is equal to or less than the threshold printing amount set to such a degree that does not lead to defective printing. If the determination result in S16 is YES, in S18, S24, and S30, (a) the amount of solder is insufficient at a plurality of print locations close to each other, or (b) a plurality of circuit boards that are inspected The frequency of occurrence of shortage at the same print location of 35 is equal to or higher than the set frequency, or (c) the degree of shortage tends to increase at the same print location of a plurality of circuit boards 35 inspected. A determination is made. These determinations are made while avoiding erroneous determinations due to accidental occurrence of printed portions where the solder printing amount is insufficient due to some reason other than the shortage of solder on the mask 132. This is performed in order to detect as much as possible the true shortage of printing.

  Hereinafter, each determination will be described. In S18, it is determined whether or not the print amount is deficient in a plurality of print locations close to each other in a preset state or more. If the determination result is YES, the state is determined in S20. In order to eliminate this, local replenishment of solder to the corresponding print area is performed. In the printing press 10, as shown in FIGS. 15A to 15C, the discharge start and discharge stop times are controlled in relation to the movement start and end times of the solder container 242, and solder is discharged from the discharge port 246. By moving the solder container 242 at an appropriate speed while discharging the solder, the solder 254 is made into a rod having a substantially constant thickness within a desired range (the discharged solder may overlap with each other and become locally thicker). (Without reverse cutting), and using this function, local replenishment of solder can be performed at a position and length corresponding to the above-mentioned “plurality of printing points close to each other”. A kind of local area replenishment is performed. However, when the area including the “plurality of printed portions close to each other” is sufficiently narrow, the solder container 242 may be stopped at one point, the solder may be discharged, and the solder may be replenished at one point. In the present specification, the former is referred to as area supply, and the latter is referred to as point supply.

  If the determination result in S18 is NO, the flag F2 is set to “1” in S22, and then in S24, the continuously set number M0 (here, “continuous” means “continuous inspection results are obtained”). In this sense, it is not necessarily the meaning of “printing continuously”), and it is determined whether or not the number of times that the print amount is insufficient at the same print location is equal to or greater than the set number N0. If YES, in S26, after the point replenishment at time T1 is determined at the position corresponding to the print location, the flag F2 is reset to “0” in S28.

If the determination result in S24 is NO, it is determined in S30 whether or not the print amount deficiency tends to increase at the same number of consecutive print positions M0. Specifically, for example, it is determined whether or not the slope of the approximate straight line of the print amount at the continuously set number M0 is negative. If the determination result is YES, in S32, after the point replenishment at time T2 is determined at the position corresponding to the print location, the flag F2 is reset to “0” in S34. Note that the time T2 can be the same as or different from the time T1.
Regardless of which of S20, S26, and S32 is executed, the flag F1 is set to “1” in S36.

If the determination result in S16 is NO, it is determined in S38 whether or not the flag F2 is set to "1". If the determination result is NO, it is read in S12 in S40. The stored inspection result is erased.
On the other hand, if the determination result in S38 is YES, S44 and S46 are executed, and only when the determination result in S16 continues to be NO for the continuously set number M0, is read and stored in S12. The inspection result is erased.
As a result, while it is necessary to execute the determinations in S24 and S30, the inspection results for the number of sheets necessary for the determination are held in the inspection result memory 340. If the determination is not necessary, the determination result in S16 is NO. The inspection result is erased every time.

  Along with the above execution, S48 to S58 are executed. In S48, it is determined whether or not ΣM is equal to or larger than the integer P times the set number M1, and if the determination result is YES, the whole replenishment is executed in S50 and then the integer P is increased by 1 in S52. . Here, the set number M1 is the number of circuit boards to which the solder is to be uniformly replenished over the entire solder roll every time this number of inspections is performed. For example, the set number M1 is based on the volume sum of the through holes 130 of the entire mask 132. It can be determined by calculation or by executing test printing.

Subsequently, in S54, it is determined whether or not the flag F1 is set to “1”. If the determination result is YES, the local replenishment determined in any of S20, S26, and S32 is executed. .
In this embodiment, since priority is given to the determinations in S18, S24 and S30, local replenishment is not determined at S20, S26 and S32 at the same time. Execution of replenishment is not required at the same time, but it is also possible not to give priority to the determination. In this case, it is necessary to simultaneously execute plural types of local replenishment in S20, S26 and S32. It is necessary to change the flowchart to one that can cope with the situation.
However, “the local replenishment is not determined simultaneously in S20, S26, and S32” means that the local replenishment having different determination rules executed in S18, S24, and S30 is required at the same time. This means that local replenishment may be required at a plurality of locations in the longitudinal direction of the solder roll based on the same determination rule.

  As is apparent from the above description, the portions of the computer 310 that execute S10 to S18, S24 and S30, S38 to S46 constitute a consumption prediction unit, and the portion that executes S20, S26, and S32 forms a local supply plan. The part which performs S48 thru | or S52 comprises a general replenishment command part, and the part which performs S54 thru | or S58 comprises the local replenishment command part.

Flowcharts representing another one of a plurality of types of programs for performing local solder replenishment are shown in FIGS.
In the local replenishment based on these flowcharts, as illustrated conceptually in FIG. 19, when the mask 132 is viewed in a direction parallel to the moving direction of the squeegee 222, the through holes 130 having a large opening area are intensively arranged. For this reason, the consumption of the solder 254 is increased compared to other parts, and as a result, as shown in an exaggerated manner in FIG. With the recognition that the portions 400a and 400b having smaller roll diameters than the other portions are generated, and therefore the printing amount is insufficient in the areas corresponding to the portions 400a and 400b. As illustrated in a) to (d), local replenishment of solder is performed. Note that FIG. 19 shows only the through hole 130 having a large opening area, and through holes having a small opening area are formed in other portions, but illustration thereof is omitted.

  Initial setting is performed in S1, in which input of data necessary for calculation of the volume of the through hole 130 in the mask 132, setting of a region where the solder roll 400 is to be formed on the mask 132, the region, etc. Initial setting such as selection of whether to divide or to divide in consideration of the formation status of the through hole 130 is performed. Subsequently, in S2, it is determined whether equal division is selected. If the determination result is YES, it is instructed in S3 that a desired number of divisions should be input, and if input is performed accordingly, The determination in S4 is YES, and in S5, a dividing line 402 (see FIG. 19) for dividing the region where the solder roll is to be formed into the inputted number of divisions is automatically set.

  On the other hand, if the determination result in S2 is NO, it is determined in S6 whether or not the division considering the formation status of the through hole 130 is selected. If the determination is NO, the other processes in S8 are performed. However, since it is not related to the claimable invention of the present application, the description is omitted.

  And if the determination result of S6 is YES, S10 and subsequent steps are executed. In S10, a subdivision region for subdividing the region in which the through hole 130 of the mask 132 is formed into a predetermined width is set at the end of the region in which the through hole 130 is formed. In S12, the through hole is formed. The volume sum of the portion belonging to the subdivision area 130 is automatically calculated and stored, and displayed on the display 358 as a graph. Subsequently, in S14, it is determined whether or not the subdivision work has been completed. However, since the determination is naturally NO at first, in S16, the subdivision area is moved by one width, and the new subdivision area is also volume summed. Is calculated, stored and displayed. Thereafter, the same is repeated, and the change state of the volume sum of the entire through hole forming region is shown on the display 358.

  If the graph indicating the change state of the volume sum of the entire through hole forming region is completed, the determination result in S14 is YES, and in S18, the volume sum of the through hole 130 is similar based on the graph indicating the change state of the volume sum. The operator is instructed to set a dividing line for grouping the subdivided areas into divided areas. If the operator inputs the setting of the dividing line based on the instruction, the determination in S20 is YES, and the dividing line 402 illustrated in FIG. 19 is set in S22, and the dividing area 404 is set accordingly.

  If the operator thinks that the region has been divided by repeating S18 to S22, in order to input the division end, a YES determination is made in S24, and the entire through hole forming region is divided by the dividing line 402 set in S22. The number Nmax of the areas 404 (Nmax = 6 in the case illustrated in FIG. 19) is obtained. Further, in S28, the volume sum ΣV of each divided region and the average volume sum ΣVmean in the entire through hole forming region are calculated. In S30, all divided regions satisfying the condition of ΣV <(1-a) ΣVmean and those Are stored in the volume sum memory 342 in association with each other.

In S32, it is determined whether or not one or more divided areas satisfying the condition of ΣV <(1-a) ΣVmean are stored. If YES, the flag F1 is set to “1” in S34, and NO. In the case of determination, the flag F1 is reset to “0” in S36. Note that (1-a) ΣVmean is the upper limit volume sum to be locally replenished in each divided region.
That is, the portion of the computer 310 that executes S2 to S5 constitutes an equally dividing portion, and the portion that executes S6 to S24 constitutes a through-hole formation situation-adding dividing portion. Moreover, the part which performs S28 thru | or S36 comprises the solder consumption prediction part with the said equal division part and the through-hole formation condition consideration division part.

Based on the prediction by the solder consumption amount prediction unit, the local supply plan formulation routine represented by the flowchart shown in FIG. 17 is executed, and the local supply plan is formulated.
In S42, the division area number N is set to 0. In S44, it is determined whether or not the flag F1 is set to "1". If the determination result is NO, the division amount area that requires local supply Since 404 is not present, the execution of the local supply plan formulation routine ends.

  On the other hand, if the determination result in S44 is YES, S46 to S58 are repeatedly executed until the determination result in S60 becomes YES, whereby the division amount area 404 that requires local replenishment becomes ΣV <(1− 3a) ΣVmean, (1-3a) ΣVmean ≦ ΣV <(1-2a) ΣVmean, (1-2a) ΣVmean ≦ ΣV <(1-a) <ΣVmean. One local replenishment amount is set for the divided region 404 to which it belongs. Specifically, local replenishment is not necessary for the region of ΣV ≧ (1-a) <ΣVmean, and (1-2a) local replenishment at time T1 for the region of ΣVmean ≦ ΣV <(1-a) <ΣVmean. However, for the region of (1-3a) ΣVmean ≦ ΣV <(1-2a) ΣVmean, the local supply of time 2 × T1 is performed, and for the region of ΣV <(1-3a) ΣVmean, the local supply of time 3 × T1 is performed. Each is determined and stored in the local supply plan memory 344. The portion of the computer 310 that executes this local supply plan formulation routine constitutes a local supply plan formulation unit.

The local supply plan formulated as described above is executed according to the supply execution routine shown in FIG.
First, in S72, the division area numbers N, M, and ΣM are set to the initial value 0, the integer P is set to 1, and the scheduled production number Mmax, M0, Nmax of the circuit board is stored. Next, in S74, an integer M (corresponding to the number of circuit boards 35 increasing until the entire replenishment is executed) and ΣM (the number of circuit boards 35 continuing to increase without being reset even when the integer M is reset to 0). In step S76, it is determined whether or not printing on the number of circuit boards 35 to be produced has been completed. When printing is completed, the execution of the replenishment execution routine is terminated. Is NO, therefore, in S78, it is determined whether or not the integer M has reached an integer P times the number of printed sheets M0 of the circuit board 35 that is determined to be replenished in total. In S80, the solder 254 is replenished over the entire solder roll 400 in S80. This replenishment amount is an amount obtained by subtracting the sum of the amount of solder replenished by local replenishment until the implementation of the total replenishment from the total amount of solder consumed by printing the printed circuit board M0 of the number of printed sheets M0. Following S80, the integer P is incremented by 1 in S82.

  Next, in S84, it is determined whether or not the integer M has reached the number M0 of printed circuit boards 35 on which local replenishment is to be executed. If NO, the process returns to S74, but if YES, Local supply is performed in S86 to S94. First, in S86, it is determined whether or not the flag F1 is set to “1”. If the determination is NO, it means that there is no need for local replenishment, so S88 to S94 are skipped. If the determination is YES, the number of the divided area 404 is incremented by 1, and local replenishment for the first divided area is executed. If it is determined that local replenishment should be performed in the local replenishment plan formulation routine of FIG. 17 for the first divided area, any time of T1, 2 × T1, 3 × T1 in the center of the first divided area However, if it is not determined that the local replenishment should be performed for the first divided area, the solder replenishment 242 is actually only passed through the first divided area, and the local replenishment is not performed. Not done. Then, in S92, it is determined whether or not the local replenishment for all the divided areas 404 is completed. If the determination is NO, the process returns to S88.

Thereafter, S88 to S92 are repeatedly executed, and point replenishment that is one type of local replenishment for each divided region 404 is performed as illustrated in FIG. 20 while the solder container 242 is moved toward the Nmax divided region. . Then, after execution of local replenishment for the Nmax divided region, the integers N and M are reset to 0 in S94, and the execution of the program returns to S74.
As is apparent from the above description, the portion of the computer 310 that executes S74, S78, and S80 constitutes the entire replenishment portion, and the portion that executes S74, S84, and S94 constitutes the local replenishment portion.

In the present embodiment, the number of circuit boards M0 to be replenished is the same as the number M0 of circuit boards to be replenished locally, but this interrupts the printing operation for replenishment. This is to reduce the number of times and simplify the flowchart, and it is also possible to make the two different from each other.
Further, the total supply and the local supply are performed by moving the solder containers 242 respectively. However, by actively using the fact that the number M0 is common, the total supply and the local supply are performed. It is also possible for both to occur during a single movement of the solder container 242. For example, if the solder container 242 reaches a position where the local replenishment is to be performed during the execution of the total replenishment, the solder container 242 is stopped at that position and the local replenishment is performed.

Further, in the present embodiment, on the premise that the width of the divided areas becomes relatively narrow, point replenishment is performed at the center in the width direction of each divided area 404, but the width of the divided areas is If the area is wide, area replenishment may be performed.
Furthermore, the through-hole formation state-added division unit divides the region based on the operator's decision, and the change state of the volume sum of the entire through-hole formation region is displayed in a graph to assist the operator's decision. It is like that. However, for example, if conditions such as “the difference in volume sum of adjacent subdivision areas is within a set value” are set, subdivision areas can be automatically divided into divided areas. Accordingly, the division of the through hole forming region can be automated.

  FIG. 21 is a flowchart showing still another program for performing local solder replenishment. In the present embodiment, the roll diameter of the solder roll 400 is detected in a non-contact manner by the roll diameter detector 422 illustrated in FIG. To resupply locally. As the roll diameter detector 422, for example, a laser type three-dimensional distance meter described in JP-A-5-261892 can be used. For example, between the pair of second elevating members 162 is provided so as to be movable along the longitudinal direction of the squeegee 222. In the illustrated example, a guide 424 is fixed to one of the pair of second elevating members 162, and a roll diameter detector 422 is attached to a slider 426 that moves on the guide 424.

  The slider 426 is fixed to a part of the belt 428 that can circulate in the longitudinal direction of the second elevating member 162, and moves in the longitudinal direction of the squeegee 222 when the belt 428 circulates by a servo motor 352 (see FIG. 13). Be made. The position of the slider 426, that is, the position of the roll diameter detector 422 is detected based on a signal from an encoder 354 provided in a servo motor 352 connected to the I / O port 318 via a drive circuit 350. Therefore, the roll diameter distribution in the longitudinal direction of the solder roll 400 is continuously detected by the output signal of the roll diameter detector 422 and the output signal of the encoder 354.

In the consumption prediction and local supply plan formulation routine shown in FIG. 21, a solder roll 400 having a roll diameter preset in S10 is formed. The solder container 242 is moved in parallel with the longitudinal direction of the squeegee 222 and the solder 254 is discharged, and the squeegee head 170 is reciprocated along the mask 132 an appropriate number of times to form the squeegee 222. The solder roll 400 is enlarged to the set roll diameter. However, the circuit board 35 is not moved during this period, and the printing operation is performed on the same circuit board 35, so that the solder 254 is not consumed.
Subsequently, after printing on a predetermined number of circuit boards 35 in S12, the roll diameter distribution is continuously detected by the above-described method in S14, and the roll diameter distribution is stored in the roll diameter memory in S16. 356, and is displayed on the display 358, and the operator is required to input to instruct whether or not the through hole forming region of the mask 132 should be divided equally.

  Then, in S18, it is determined whether or not equal division is instructed. If YES, the equal roll is performed in S20, the average roll diameter for each divided region is calculated, and the execution of S12 is further performed. The amount of decrease from the previous set roll diameter is calculated. In S22, the consumption amount of the solder 254 in each divided area is calculated based on the amount of decrease in the roll diameter, and the local supply amount in each divided area is determined based on the calculated consumption amount. The position is determined at the center of each divided area, and the local supply amount and the supply position are associated with each other and stored in the local supply plan memory 360. The determination of the local supply amount of each divided area based on the calculated consumption amount may be performed in the same manner as in the local supply plan formulation routine described in FIG. 17, for example, but is not limited. It is only necessary to determine the local replenishment amount for the portion where the amount of consumption of the solder is larger than that of the other portion.

  On the other hand, if the determination result in S18 is NO, it is determined in S24 whether or not a division taking into account the through hole formation status has been instructed. If NO, other processing is performed in S26. If the determination is YES, division in consideration of the through-hole formation status is performed after S28. First, in S28, the operator is instructed to determine and input the position of the dividing line based on the roll diameter distribution displayed on the display 358. Each time the operator inputs the position of the dividing line based on the instruction, the roll reduction amount of the dividing area defined by the dividing line is calculated in the same manner as in S20, and the local replenishment is performed as in S22. The position to be supplied and the replenishment amount are stored in the local plan memory 360. If the operator inputs the end of division, the determination result in S36 is YES, and the division and the determination of the local replenishment amount taking the through hole formation status into consideration are completed.

In the case of equal division as described above and in the case of division that takes into account the through hole formation status, the position and amount of local replenishment are determined, and then the number Nmax of divided areas is stored in S38.
Solder replenishment according to the local replenishment plan formulated as described above can be performed in the same manner as in the replenishment execution routine shown in FIG. 18, for example.

However, in S22 or S32, after the consumption amount of the solder 254 in each divided region is calculated based on the amount of decrease in the roll diameter, the calculated consumption amount is used as the supply amount as it is. It may be stored in the supply plan memory 370 in association with the position).
In this case, since the replenishment amount of solder by both the general replenishment and the local replenishment is acquired together, the replenishment amount increases or decreases for each divided area during one movement of the solder container 242. Will be allowed to. The increase / decrease in the replenishment amount can be achieved, for example, by keeping the moving speed of the solder container 242 constant and changing the discharge speed from the discharge port 246 or keeping the discharge speed from the discharge port 246 constant. This can be realized by changing the moving speed of 242.

  However, in the solder supply device 240 that pushes out the solder 254 from the solder container 242 by supplying air pressure, the moving speed of the solder container 242 can be accurately controlled, but the discharge speed from the discharge port 246 is accurately controlled. There is a difficult envy. Therefore, for example, a positive displacement pump such as a screw pump or a gear pump is provided at the discharge port 246 of the solder supply device 240, and the discharge speed of the solder 254 from the discharge port 246 is controlled by controlling the rotational speed of the pump. It is desirable to control.

  DESCRIPTION OF SYMBOLS 10: Screen printer (printing machine) 12: Shuttle conveyor 14: Electronic circuit component mounting machine (mounting machine) 100: Substrate holding device 120: Mask frame holder 124: Squeegee device 128: Printing area 130: Through hole 132: Mask 134 : Mask frame 150 S: Key squeeze device main body 154: Squeegee slide 156: Squeegee slide drive device 160: First lift member 162: Second lift member 170: Squeegee head 180: Lift drive device 200: Head holding member 222: Squeegee 230: Solder scraping member 240: Solder supply device 242: Solder container 246: Discharge port 250: Air supply device 254: Solder 262: Movable member 266: Solder supply device main body 268: Movable member driving device 300 : Control device 304: Overall control device 310: Computer 312: ROM 314: RAM 316: CPU 330: Program memory 340: Inspection result memory 342: Volume sum memory 344: Local supply plan memory 350: Drive circuit 352: Servo motor 354: Encoder 356: Roll diameter memory 358: Display 360: Local supply plan memory 370: Supply plan memory 400: Solder roll 402: Dividing line 404: Divided area 422: Roll diameter detector

Claims (9)

A squeegee is moved along a mask by a squeegee moving device, and cream solder is printed on a circuit board through a plurality of through holes formed in the mask, and a solder supply device for supplying the cream solder onto the mask is provided. A screen printing machine,
Solder consumption prediction unit that predicts consumption of creamy solder accompanying the progress of a printing operation for each of a plurality of divided regions obtained by dividing the mask in a direction parallel to the moving direction of the squeegee by the squeegee moving device. When,
Among the plurality of divided areas, one or more divided areas whose predicted consumption predicted by the solder consumption amount prediction unit is larger than other divided areas are cream-like during the progress of the printing operation. A replenishment plan formulation department that formulates a replenishment plan that includes the time, position and amount of replenishment of solder;
And a local replenishment command unit for instructing the solder supply device to perform local replenishment of cream-like solder according to the replenishment plan formulated by the replenishment plan formulation unit. The solder consumption prediction unit predicts the consumption of cream solder with the progress of the printing operation based on the inspection result of the printing inspection apparatus that inspects the printing result of the screen printing machine. The screen printing machine of Claim 1 containing a part. The solder consumption prediction unit predicts the solder consumption based on the sum of the opening areas of the plurality of through holes and the thickness of the mask at the position corresponding to each of the through holes. The screen printing machine according to claim 1 , comprising a quantity prediction unit. The solder consumption prediction unit is configured to obtain a work result obtained at the time of executing a printing work performed using a mask whose solder consumption is to be predicted and a mask in which the distribution state of the through holes and the thickness distribution state are the same. The screen printing machine according to any one of claims 1 to 3 , further comprising a preceding printing work result-based consumption prediction unit that predicts the solder consumption based on the preceding printing work result. The preceding printing work result-based consumption prediction unit changes the roll diameter, which is the diameter of a cream-like solder roll formed along with the movement of the squeegee, before and after executing the printing work on the set number of circuit boards. 5. The screen printing machine according to claim 4 , further comprising a roll diameter change distribution-based consumption predicting unit for predicting the solder consumption based on the roll diameter change distribution detected at a plurality of locations in the longitudinal direction of the solder roll. . The solder consumption prediction unit includes a mask dividing unit that divides the mask into a plurality of divided regions, and the mask dividing unit has a volume of a plurality of through holes in which the mask is arranged in a direction parallel to the moving direction of the squeegee. The screen printing machine according to claim 1 , further comprising a through-hole volume sum-based division unit that divides the mask into portions each having a substantially uniform sum. Any The replenishment planning unit, when to the local supply, of claims 1 comprises a number of printed sheets rely supply timing determination part specified by the number of the circuit board printed from the start or the last replenishment time of the printing operation 6 A screen printing machine according to the above. The replenishment plan formulating unit determines the position to be locally replenished in a direction perpendicular to the moving direction of the squeegee in each of the one or more divided areas where the predicted consumption is large compared to other divided areas. The screen printing machine according to any one of claims 1 to 7 , further comprising a replenishment point determination unit that determines a central point in a width direction. The replenishment plan formulation unit sets the replenishment amount to be locally replenished to a larger replenishment amount as the predicted consumption amount of each of the one or more divided regions is larger than that of the other divided regions. 9. The screen printing machine according to claim 1 , further comprising a supply amount determination unit corresponding to a predicted consumption amount to be determined.

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