JP5815329B2 - 弾性波デバイス - Google Patents
弾性波デバイス Download PDFInfo
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- JP5815329B2 JP5815329B2 JP2011180819A JP2011180819A JP5815329B2 JP 5815329 B2 JP5815329 B2 JP 5815329B2 JP 2011180819 A JP2011180819 A JP 2011180819A JP 2011180819 A JP2011180819 A JP 2011180819A JP 5815329 B2 JP5815329 B2 JP 5815329B2
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- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 51
- 239000000758 substrate Substances 0.000 claims description 34
- 239000010936 titanium Substances 0.000 claims description 19
- 229910052735 hafnium Inorganic materials 0.000 claims description 16
- 229910052719 titanium Inorganic materials 0.000 claims description 15
- 229910052726 zirconium Inorganic materials 0.000 claims description 14
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 8
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 claims description 8
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 3
- 239000010409 thin film Substances 0.000 description 86
- 230000008859 change Effects 0.000 description 55
- 239000010408 film Substances 0.000 description 47
- 230000008878 coupling Effects 0.000 description 29
- 238000010168 coupling process Methods 0.000 description 29
- 238000005859 coupling reaction Methods 0.000 description 29
- 239000010410 layer Substances 0.000 description 17
- 238000000034 method Methods 0.000 description 14
- 239000000203 mixture Substances 0.000 description 10
- 238000004544 sputter deposition Methods 0.000 description 9
- 239000011651 chromium Substances 0.000 description 8
- 239000013078 crystal Substances 0.000 description 7
- 229910004298 SiO 2 Inorganic materials 0.000 description 5
- 238000005530 etching Methods 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- 238000004364 calculation method Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000011575 calcium Substances 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 229910052733 gallium Inorganic materials 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- 238000004088 simulation Methods 0.000 description 3
- 239000011800 void material Substances 0.000 description 3
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- 235000019687 Lamb Nutrition 0.000 description 2
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 229910052791 calcium Inorganic materials 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 238000007687 exposure technique Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000010948 rhodium Substances 0.000 description 2
- 229910052707 ruthenium Inorganic materials 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 238000010897 surface acoustic wave method Methods 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 150000001342 alkaline earth metals Chemical class 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- -1 for example Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000004698 pseudo-potential method Methods 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 150000002910 rare earth metals Chemical class 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229910052706 scandium Inorganic materials 0.000 description 1
- SIXSYDAISGFNSX-UHFFFAOYSA-N scandium atom Chemical compound [Sc] SIXSYDAISGFNSX-UHFFFAOYSA-N 0.000 description 1
- VSZWPYCFIRKVQL-UHFFFAOYSA-N selanylidenegallium;selenium Chemical compound [Se].[Se]=[Ga].[Se]=[Ga] VSZWPYCFIRKVQL-UHFFFAOYSA-N 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02007—Details of bulk acoustic wave devices
- H03H9/02015—Characteristics of piezoelectric layers, e.g. cutting angles
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/171—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
- H03H9/172—Means for mounting on a substrate, i.e. means constituting the material interface confining the waves to a volume
- H03H9/173—Air-gaps
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/64—Filters using surface acoustic waves
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
- H10N30/853—Ceramic compositions
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
12 下部電極
14 圧電薄膜
16 上部電極
17 共振領域
18、32 空隙
19 温度補償膜
30 付加膜
31 圧電膜
34 音響反射膜
100、110、120、150 FBAR
130 SMR
140 弾性波共振子
Claims (7)
- 基板と、
前記基板上に設けられた下部電極と、
前記下部電極上に設けられ、a軸方向の格子定数とc軸方向の格子定数との比が1.6より小さく、チタン、ジルコニウム及びハフニウムの少なくとも1つが添加された窒化アルミニウムからなる圧電膜と、
前記圧電膜上に設けられ、前記圧電膜を挟んで前記下部電極と対向する上部電極と、を具備することを特徴とする弾性波デバイス。 - 基板と、
前記基板上に設けられた下部電極と、
前記下部電極上に設けられ、c軸方向の格子定数が0.498nmより小さく、チタン、ジルコニウム及びハフニウムの少なくとも1つが添加された窒化アルミニウムからなる圧電膜と、
前記圧電膜上に設けられ、前記圧電膜を挟んで前記下部電極と対向する上部電極と、を具備することを特徴とする弾性波デバイス。 - 基板と、
前記基板上に設けられた下部電極と、
前記下部電極上に設けられ、c軸方向の格子定数が0.495nmより小さい窒化アルミニウムからなる圧電膜と、
前記圧電膜上に設けられ、前記圧電膜を挟んで前記下部電極と対向する上部電極と、を具備することを特徴とする弾性波デバイス。 - 前記圧電膜は無添加の窒化アルミニウムからなり、
前記圧電膜の残留応力は引張応力であることを特徴とする請求項3記載の弾性波デバイス。 - 前記チタン、ジルコニウム及びハフニウムの少なくとも1つの元素は前記窒化アルミニウムのアルミニウムサイトに配置されていることを特徴とする請求項1又は2記載の弾性波デバイス。
- 前記圧電膜には温度補償膜が挿入されていることを特徴とする請求項1から5いずれか一項記載の弾性波デバイス。
- 前記温度補償膜は酸化シリコンを含むことを特徴とする請求項6記載の弾性波デバイス。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011180819A JP5815329B2 (ja) | 2011-08-22 | 2011-08-22 | 弾性波デバイス |
KR1020120078110A KR101386754B1 (ko) | 2011-08-22 | 2012-07-18 | 탄성파 소자 |
US13/559,151 US9160298B2 (en) | 2011-08-22 | 2012-07-26 | Acoustic wave device |
CN201210298819.1A CN102957397B (zh) | 2011-08-22 | 2012-08-21 | 声波器件 |
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JP2011180819A JP5815329B2 (ja) | 2011-08-22 | 2011-08-22 | 弾性波デバイス |
Publications (2)
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JP2013046111A JP2013046111A (ja) | 2013-03-04 |
JP5815329B2 true JP5815329B2 (ja) | 2015-11-17 |
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JP2011180819A Active JP5815329B2 (ja) | 2011-08-22 | 2011-08-22 | 弾性波デバイス |
Country Status (4)
Country | Link |
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US (1) | US9160298B2 (ja) |
JP (1) | JP5815329B2 (ja) |
KR (1) | KR101386754B1 (ja) |
CN (1) | CN102957397B (ja) |
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JP6205937B2 (ja) * | 2013-07-22 | 2017-10-04 | セイコーエプソン株式会社 | 圧電膜製造方法、振動子製造方法、振動片、振動子、発振器、電子機器及び移動体 |
CN103532516B (zh) * | 2013-08-05 | 2017-10-24 | 天津大学 | 体波谐振器及其制造方法 |
JP6284726B2 (ja) * | 2013-09-11 | 2018-02-28 | 太陽誘電株式会社 | 窒化アルミニウム膜の成膜方法、弾性波デバイスの製造方法、及び窒化アルミニウム膜の製造装置 |
DE102014103229B3 (de) | 2014-03-11 | 2015-07-23 | Epcos Ag | BAW-Resonator mit Temperaturkompensation |
JP2015233042A (ja) | 2014-06-09 | 2015-12-24 | 株式会社村田製作所 | 圧電薄膜及びその製造方法、並びに圧電素子 |
JP6255319B2 (ja) * | 2014-08-01 | 2017-12-27 | 株式会社日立製作所 | 超音波探触子及び超音波探傷システム |
CN106257831B (zh) * | 2015-06-16 | 2019-04-02 | 三星电机株式会社 | 体声波谐振器及包括该体声波谐振器的滤波器 |
KR101922878B1 (ko) | 2016-07-14 | 2018-11-29 | 삼성전기 주식회사 | 탄성파 공진기 장치 |
KR102460752B1 (ko) | 2016-08-03 | 2022-10-31 | 삼성전기주식회사 | 박막 벌크 음향 공진기 및 이를 포함하는 필터 |
KR102066960B1 (ko) * | 2016-08-03 | 2020-01-16 | 삼성전기주식회사 | 박막 벌크 음향 공진기 및 이를 포함하는 필터 |
US11558031B2 (en) * | 2017-03-08 | 2023-01-17 | Samsung Electro-Mechanics Co., Ltd. | Film bulk acoustic resonator and method of manufacturing the same |
TWI757518B (zh) * | 2017-07-07 | 2022-03-11 | 美商天工方案公司 | 用於改良聲波濾波器之替代氮化鋁 |
DE102018203812A1 (de) * | 2018-03-13 | 2019-09-19 | Christian-Albrechts-Universität Zu Kiel | Ferroelektrisches material, mems-bauteil mit einem ferroelektrischen material, mems-vorrichtung mit einem ersten mems-bauteil, verfahren zur herstellung eines mems-bauteils und verfahren zur herstellung eines cmos-kompatiblen mems-bauteils |
KR20200011141A (ko) * | 2018-07-24 | 2020-02-03 | 삼성전기주식회사 | 체적 음향 공진기 |
CN111342808B (zh) * | 2018-12-18 | 2023-08-15 | 天津大学 | 基于元素掺杂缩小有效面积的谐振器、滤波器和电子设备 |
JP7097074B2 (ja) * | 2019-02-07 | 2022-07-07 | 国立研究開発法人産業技術総合研究所 | 窒化物圧電体およびそれを用いたmemsデバイス |
JP7425960B2 (ja) * | 2019-10-29 | 2024-02-01 | Tdk株式会社 | 圧電薄膜素子 |
JP7541342B2 (ja) | 2020-02-19 | 2024-08-28 | 国立研究開発法人産業技術総合研究所 | 窒化物圧電体およびそれを用いたmemsデバイス |
US11942919B2 (en) | 2021-01-11 | 2024-03-26 | Raytheon Company | Strain compensated rare earth group III-nitride heterostructures |
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US6936837B2 (en) | 2001-05-11 | 2005-08-30 | Ube Industries, Ltd. | Film bulk acoustic resonator |
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-
2011
- 2011-08-22 JP JP2011180819A patent/JP5815329B2/ja active Active
-
2012
- 2012-07-18 KR KR1020120078110A patent/KR101386754B1/ko active IP Right Grant
- 2012-07-26 US US13/559,151 patent/US9160298B2/en active Active
- 2012-08-21 CN CN201210298819.1A patent/CN102957397B/zh active Active
Also Published As
Publication number | Publication date |
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US20130049544A1 (en) | 2013-02-28 |
KR101386754B1 (ko) | 2014-04-18 |
KR20130021319A (ko) | 2013-03-05 |
CN102957397A (zh) | 2013-03-06 |
JP2013046111A (ja) | 2013-03-04 |
US9160298B2 (en) | 2015-10-13 |
CN102957397B (zh) | 2015-12-02 |
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