JP5798952B2

JP5798952B2 - Infrared detector

Info

Publication number: JP5798952B2
Application number: JP2012049500A
Authority: JP
Inventors: 聡佑西田; 訓史八坂
Original assignee: Asahi Kasei EMD Corp
Current assignee: Asahi Kasei EMD Corp
Priority date: 2012-03-06
Filing date: 2012-03-06
Publication date: 2015-10-21
Anticipated expiration: 2032-03-06
Also published as: JP2013185874A

Description

この発明は赤外線検出装置に関する。 The present invention relates to an infrared detection device.

携帯電話やノートパソコン等の電子機器が有する赤外線検出装置は、プリント基板と、プリント基板上に実装された赤外線センサと、赤外線センサに赤外線を入射する開口部を有する筐体を備えている。プリント基板としては、リジッド基板やフレキシブル基板が使用されている。このような赤外線検出装置は、赤外線センサが実装されたプリント基板を筐体へ実装する工程を経て製造され、その際に、筐体の開口部と赤外線センサの受光部とを位置合わせする必要がある。 An infrared detection device included in an electronic device such as a mobile phone or a notebook computer includes a printed circuit board, an infrared sensor mounted on the printed circuit board, and a housing having an opening that allows infrared light to enter the infrared sensor. As the printed board, a rigid board or a flexible board is used. Such an infrared detection device is manufactured through a process of mounting a printed circuit board on which an infrared sensor is mounted on a housing, and at that time, it is necessary to align the opening of the housing and the light receiving portion of the infrared sensor. is there.

このような赤外線検出装置の従来品は、筒状の缶パッケージで包み込まれた赤外線センサを有するため、缶パッケージを嵌める硬い支持部材を筐体に設けることにより、赤外線センサの筐体への位置決めを簡単に行うことができる（特許文献１等を参照）。
一方、携帯電話やノートパソコン等の電子機器の小型化に伴い、赤外線センサへの小型化の要求が強くなっている。これに対応して、近年では、素子が樹脂パッケージで包み込まれ、受光面周囲の上方に樹脂製の視野制限部を有する赤外線センサ（樹脂モールドタイプの赤外線センサ）が提案されている（特許文献２等を参照）。 Since the conventional infrared detection device has an infrared sensor wrapped in a cylindrical can package, the infrared sensor is positioned on the casing by providing the casing with a hard support member for fitting the can package. This can be done easily (see Patent Document 1).
On the other hand, with the miniaturization of electronic devices such as mobile phones and notebook computers, there is an increasing demand for miniaturization of infrared sensors. In response to this, in recent years, an infrared sensor (resin mold type infrared sensor) has been proposed in which an element is encased in a resin package and a resin visual field limiting portion is provided above the periphery of the light receiving surface (Patent Document 2). Etc.).

特開２０１０−２５５３４号公報JP 2010-25534 A 特開２０１１−９５１４３号公報JP 2011-95143 A

上述の樹脂モールドタイプの赤外線センサは、缶パッケージタイプの赤外線センサのように硬い支持部材を使用することができない。また、樹脂モールドタイプの赤外線センサには、例えば、４．４ｍｍ×４．４ｍｍ×厚さ１．３２ｍｍといった極小サイズのものがあり、この場合は、赤外線センサの受光面と筐体の開口部との位置ずれが±０．５ｍｍ程度であっても問題になる。 The resin mold type infrared sensor described above cannot use a hard support member unlike the can package type infrared sensor. In addition, the resin mold type infrared sensor includes, for example, an extremely small size of 4.4 mm × 4.4 mm × thickness 1.32 mm. In this case, the light receiving surface of the infrared sensor, the opening of the housing, Even if the positional deviation is about. ±.

この発明の課題は、樹脂モールドタイプの赤外線センサを備えた赤外線検出装置において、赤外線センサが実装された基板を筐体へ実装する工程で、筐体の開口部と赤外線センサの受光部との位置決めが簡単に精度良く行われるようにすることである。 An object of the present invention is to position an opening of a housing and a light receiving portion of an infrared sensor in a process of mounting a substrate on which the infrared sensor is mounted on a housing in an infrared detecting device including a resin mold type infrared sensor. Is to be performed easily and accurately.

上記課題を解決するために、この発明の赤外線検出装置は、基板と、前記基板上に実装され、素子が樹脂パッケージで包み込まれ受光面が露出している赤外線センサと、前記赤外線センサに赤外線を入射する開口部を有する筐体と、前記筐体の前記開口部近傍の前記基板または前記樹脂パッケージと対向する面から突出する位置決め突起と、前記基板または前記樹脂パッケージに形成され、前記位置決め突起が係合されている位置規制部と、を有し、前記位置決め突起と前記位置規制部との係合により、前記筐体の前記開口部と前記赤外線センサの前記受光面とが位置決めされている。 In order to solve the above-described problems, an infrared detection device of the present invention includes a substrate, an infrared sensor mounted on the substrate, an element encapsulated in a resin package, and a light receiving surface exposed, and infrared rays to the infrared sensor. A housing having an incident opening; a positioning protrusion protruding from a surface facing the substrate or the resin package near the opening of the housing; and the positioning protrusion formed on the substrate or the resin package. A position restricting portion that is engaged, and the opening of the housing and the light receiving surface of the infrared sensor are positioned by the engagement of the positioning protrusion and the position restricting portion.

この発明の赤外線検出装置によれば、赤外線センサが実装された基板を筐体へ実装する際に、筐体の開口部近傍に固定された位置決め突起を、基板または赤外線センサに形成された位置規制部に係合することにより、筐体の開口部と赤外線センサの受光面とが位置決めされる。よって、前記位置決め突起および位置規制部を有さない赤外線検出装置と比較して、実装時の位置ずれが抑制される。また、位置決めを簡単に行うことができる。 According to the infrared detection device of the present invention, when mounting the substrate on which the infrared sensor is mounted on the housing, the positioning protrusions fixed in the vicinity of the opening of the housing are positioned on the substrate or the infrared sensor. By engaging with the part, the opening of the housing and the light receiving surface of the infrared sensor are positioned. Therefore, the positional deviation at the time of mounting is suppressed compared with the infrared detection device which does not have the positioning protrusion and the position restricting portion. Moreover, positioning can be performed easily.

この発明の赤外線検出装置において、前記赤外線センサが、素子が樹脂パッケージで包み込まれて受光面周囲の上方に樹脂製の視野制限部を有する場合、前記位置決め突起は、前記筐体の前記開口部近傍の前記基板または前記視野制限部と対向する面から突出し、前記位置規制部は、前記基板または前記樹脂パッケージまたは前記視野制限部に形成された構成にすることができる。 In the infrared detection device according to the present invention, when the infrared sensor has an element encased in a resin package and has a resin visual field limiting portion above the periphery of the light receiving surface, the positioning projection is in the vicinity of the opening of the housing. The position restricting portion may be formed on the substrate, the resin package, or the visual field restricting portion.

この発明の赤外線検出装置は、前記樹脂パッケージまたは前記視野制限部が前記筐体に接触していてもよい。
この発明の赤外線検出装置は、前記開口部が、前記筐体に接触する赤外線透過性の板材で塞がれていてもよい。
この発明の赤外線検出装置は、前記板材が、前記赤外線センサの前記視野制限部に接触していてもよい。 In the infrared detection device of the present invention, the resin package or the visual field limiting unit may be in contact with the casing.
In the infrared detection device of the present invention, the opening may be closed with an infrared transmissive plate material that contacts the housing.
In the infrared detection device of the present invention, the plate material may be in contact with the field-of-view restriction portion of the infrared sensor.

前記樹脂パッケージまたは前記視野制限部が前記筐体に接触していることにより、前記樹脂パッケージまたは前記視野制限部が前記筐体に接触していない場合と比較して、前記赤外線センサと筐体との温度差を小さくすることができる。温度差が小さくなることで、前記筐体の開口部から発生する赤外線の量と前記赤外センサから発生する赤外線の量との差を低減できる。これに伴い、被測定物から出射された赤外線以外の赤外線が受光面に入射される量が低減されるため、赤外線の検出精度が向上する。 Compared with the case where the resin package or the field-of-view restriction part is not in contact with the casing, the infrared sensor and the casing are formed by the resin package or the field-of-view restriction part being in contact with the casing. The temperature difference can be reduced. By reducing the temperature difference, the difference between the amount of infrared rays generated from the opening of the housing and the amount of infrared rays generated from the infrared sensor can be reduced. As a result, the amount of infrared rays other than the infrared rays emitted from the object to be measured is incident on the light receiving surface is reduced, so that the infrared detection accuracy is improved.

前記板材を有する場合は、前記板材が前記赤外線センサの前記視野制限部に接触していることにより、前記赤外線センサと前記筐体と前記板材との温度差を小さくすることができる。
前記筐体と前記赤外センサとの接触部に、熱伝動性の高い材料（金属、金属を含有させた樹脂等）からなる部材を介在させることによっても、前記筐体と前記赤外線センサとの温度差を小さくできる。 When the plate material is included, the temperature difference between the infrared sensor, the housing, and the plate material can be reduced because the plate material is in contact with the visual field limiting portion of the infrared sensor.
Also by interposing a member made of a material having high heat conductivity (metal, resin containing metal, etc.) between the casing and the infrared sensor, the casing and the infrared sensor The temperature difference can be reduced.

この発明の赤外線検出装置によれば、樹脂モールドタイプの赤外線センサが実装された基板を筐体へ実装する工程で、筐体の開口部と赤外線センサの受光部との位置決めを簡単に精度良く行うことができる。 According to the infrared detecting device of the present invention, the positioning of the opening of the housing and the light receiving portion of the infrared sensor is easily and accurately performed in the process of mounting the substrate on which the resin mold type infrared sensor is mounted on the housing. be able to.

この発明の第１実施形態の赤外線検出装置を示す平面図である。It is a top view which shows the infrared rays detection apparatus of 1st Embodiment of this invention. 図１のＡ−Ａ断面図である。It is AA sectional drawing of FIG. この発明の第２実施形態の赤外線検出装置を示す平面図である。It is a top view which shows the infrared rays detection apparatus of 2nd Embodiment of this invention. 図３のＢ−Ｂ断面図である。It is BB sectional drawing of FIG. この発明の第３実施形態の赤外線検出装置を示す平面図である。It is a top view which shows the infrared rays detection apparatus of 3rd Embodiment of this invention. 図５のＣ−Ｃ断面図である。It is CC sectional drawing of FIG. この発明の第４実施形態の赤外線検出装置を示す平面図である。It is a top view which shows the infrared rays detection apparatus of 4th Embodiment of this invention. 図７のＤ−Ｄ断面図である。It is DD sectional drawing of FIG.

以下、この発明の実施形態について説明する。
［第１実施形態］
図１および２に示すように、第１実施形態の赤外線検出装置は、リジッド基板１と、赤外線センサ２と、筐体３と、板材４とを有する。板材４はポリエチレン製（赤外線透過性）の正方形のシートである。 Embodiments of the present invention will be described below.
[First Embodiment]
As shown in FIGS. 1 and 2, the infrared detection apparatus of the first embodiment includes a rigid substrate 1, an infrared sensor 2, a housing 3, and a plate material 4. The plate material 4 is a square sheet made of polyethylene (infrared transparent).

リジッド基板１の基板面にプリント回路が形成されている。リジッド基板１の一方の基板面に形成されたプリント回路の所定位置に、赤外線センサ２が実装されている。
赤外線センサ２は、素子２１が樹脂製のパッケージ２２で包み込まれたものであり、受光面２１ａの周囲の上方に、樹脂製の視野制限部２３を有する。赤外線センサ２の平面形状は正方形である。視野制限部２３は、素子２１の受光面２１ａを露出させる正方形の開口部２３ａを有する。視野制限部２３はパッケージ２２の上部に固定されている。 A printed circuit is formed on the substrate surface of the rigid substrate 1. An infrared sensor 2 is mounted at a predetermined position of a printed circuit formed on one substrate surface of the rigid substrate 1.
The infrared sensor 2 is a device in which an element 21 is encased in a resin package 22, and has a resin visual field limiting unit 23 above the periphery of the light receiving surface 21a. The planar shape of the infrared sensor 2 is a square. The field-of-view restricting unit 23 has a square opening 23 a that exposes the light receiving surface 21 a of the element 21. The field-of-view restriction part 23 is fixed to the upper part of the package 22.

筐体３は、硬質プラスチック製の板状部材であり、赤外線センサ２に赤外線を入射する正方形の開口部３１を有する。筐体３の開口部３１の周囲に、板材４の正方形より僅かに大きな正方形の凹部３２が形成されている。凹部３２は、筐体３のリジッド基板１と対向する面とは反対側の面に形成されている。筐体３の凹部３２に板材４が配置されている。開口部３１の正方形は、赤外線センサ２の平面形状をなす正方形より小さい。 The housing 3 is a plate member made of hard plastic, and has a square opening 31 through which infrared rays are incident on the infrared sensor 2. A square recess 32 that is slightly larger than the square of the plate 4 is formed around the opening 31 of the housing 3. The recess 32 is formed on the surface of the housing 3 opposite to the surface facing the rigid substrate 1. The plate material 4 is disposed in the recess 32 of the housing 3. The square of the opening 31 is smaller than the square forming the planar shape of the infrared sensor 2.

筐体３のリジッド基板１と対向する面には、凹部３２の周囲（開口部３１の近傍）に、金属製の位置決めピン（位置決め突起）３３が四本固定されている。各位置決めピン３３は、凹部３２の壁面ラインをなす正方形の四つの角の外側に配置されている。
リジッド基板１は、赤外線センサ２の平面形状をなす正方形の四つの角の外側に、位置決めピン３３が入る円形の貫通穴（位置規制部）１１を有する。四つの貫通穴１１の位置は、各貫通穴１１に各位置決めピン３３が入った状態で、筐体３の開口部３１の中心がリジッド基板１上の赤外線センサ２の受光面２１ａの中心と、所定の誤差の範囲内で一致するように設定されている。 Four metal positioning pins (positioning protrusions) 33 are fixed around the recess 32 (near the opening 31) on the surface of the housing 3 facing the rigid substrate 1. Each positioning pin 33 is disposed outside the four corners of the square forming the wall surface line of the recess 32.
The rigid substrate 1 has a circular through hole (position restricting portion) 11 into which the positioning pin 33 is inserted outside the four corners of the square forming the planar shape of the infrared sensor 2. The positions of the four through holes 11 are such that the center of the opening 31 of the housing 3 is the center of the light receiving surface 21a of the infrared sensor 2 on the rigid substrate 1, with each positioning pin 33 inserted in each through hole 11. It is set so as to match within a predetermined error range.

第１実施形態の赤外線検出装置は、筐体３の開口部３１の近傍から突出する位置決めピン３３を、リジッド基板１の貫通穴１１に挿入することで、筐体３の開口部３１の中心と赤外線センサ２の受光面２ａの中心を一致させる位置決めを行った後に、リジッド基板１と筐体３を外縁部等でねじ止めすることにより組み立てられる。組立状態で、赤外線センサ２の視野制限部２３の上面と、開口部３１の周縁部をなす筐体３の下面が接触している。 In the infrared detection device of the first embodiment, the positioning pin 33 protruding from the vicinity of the opening 31 of the housing 3 is inserted into the through hole 11 of the rigid substrate 1 so that the center of the opening 31 of the housing 3 is After positioning is performed so that the centers of the light receiving surfaces 2a of the infrared sensor 2 coincide with each other, the rigid substrate 1 and the housing 3 are assembled by screwing at the outer edge portion or the like. In the assembled state, the upper surface of the field-of-view restricting portion 23 of the infrared sensor 2 and the lower surface of the housing 3 that forms the peripheral edge of the opening 31 are in contact.

したがって、第１実施形態の赤外線検出装置によれば、筐体３の開口部３１の近傍における位置決めピン３３と貫通穴１１による位置決めを行わないで、リジッド基板１と筐体３をねじ止めすることにより組み立てられた赤外線検出装置と比較して、筐体３の開口部３１と赤外線センサ２の受光部２１との位置ずれが抑制される。また、第１実施形態の赤外線検出装置の組立方法によれば、筐体３の開口部３１と赤外線センサ２の受光部２１との位置決めを簡単に行うことができる。 Therefore, according to the infrared detection device of the first embodiment, the rigid board 1 and the housing 3 are screwed without positioning by the positioning pins 33 and the through holes 11 in the vicinity of the opening 31 of the housing 3. Compared with the infrared detection device assembled by the above, the positional deviation between the opening 31 of the housing 3 and the light receiving unit 21 of the infrared sensor 2 is suppressed. Further, according to the method for assembling the infrared detection device of the first embodiment, the positioning of the opening 31 of the housing 3 and the light receiving unit 21 of the infrared sensor 2 can be easily performed.

第１実施形態の赤外線検出装置では、例えば、赤外線センサ２のサイズが４．４ｍｍ×４．４ｍｍ×厚さ１．３２ｍｍの場合、筐体３の厚さを１．００ｍｍとし、筐体３の開口部３１を３．５ｍｍ×３．５ｍｍの正方形とすることができる。その場合、筐体３の開口部３１の中心と赤外線センサ２の受光面２ａの中心との位置ずれを±０．５ｍｍ未満にすることが可能になる。
また、筐体３の開口部３１が、赤外線を透過するポリエチレン製の板材４で塞がれているため、赤外線センサ２の受光面２１ａにゴミが付着することが防止される。 In the infrared detection device of the first embodiment, for example, when the size of the infrared sensor 2 is 4.4 mm × 4.4 mm × thickness 1.32 mm, the thickness of the housing 3 is 1.00 mm, The opening 31 can be a 3.5 mm × 3.5 mm square. In that case, the positional deviation between the center of the opening 31 of the housing 3 and the center of the light receiving surface 2a of the infrared sensor 2 can be made less than ± 0.5 mm.
Further, since the opening 31 of the housing 3 is closed with the polyethylene plate material 4 that transmits infrared rays, it is possible to prevent dust from adhering to the light receiving surface 21 a of the infrared sensor 2.

［第２実施形態］
図３および４に示すように、第２実施形態の赤外線検出装置は、プリント回路が形成されたリジッド基板１と、赤外線センサ２と、筐体３と、板材４とを有する。板材４はポリエチレン製（赤外線透過性）の正方形のシートである。
リジッド基板１の基板面にプリント回路が形成されている。リジッド基板１の一方の基板面に形成されたプリント回路の所定位置に、赤外線センサ２が実装されている。
赤外線センサ２は、素子２１が樹脂製のパッケージ２２で包み込まれたものであり、受光面２１ａの周囲の上方に、樹脂製の視野制限部２３を有する。赤外線センサ２の平面形状は正方形である。視野制限部２３は、素子２１の受光面２１ａを露出させる正方形の開口部２３ａを有する。視野制限部２３はパッケージ２２の上部に固定されている。 [Second Embodiment]
As shown in FIGS. 3 and 4, the infrared detection device of the second embodiment includes a rigid board 1 on which a printed circuit is formed, an infrared sensor 2, a housing 3, and a plate material 4. The plate material 4 is a square sheet made of polyethylene (infrared transparent).
A printed circuit is formed on the substrate surface of the rigid substrate 1. An infrared sensor 2 is mounted at a predetermined position of a printed circuit formed on one substrate surface of the rigid substrate 1.
The infrared sensor 2 is a device in which an element 21 is encased in a resin package 22, and has a resin visual field limiting unit 23 above the periphery of the light receiving surface 21a. The planar shape of the infrared sensor 2 is a square. The field-of-view restricting unit 23 has a square opening 23 a that exposes the light receiving surface 21 a of the element 21. The field-of-view restriction part 23 is fixed to the upper part of the package 22.

筐体３は、硬質プラスチック製の板状部材であり、赤外線センサ２に赤外線を入射する正方形の開口部３１を有する。筐体３の開口部３１の周囲に、板材４の正方形より僅かに大きな正方形の凹部３２が形成されている。凹部３２は、筐体３のリジッド基板１と対向する面に形成されている。筐体３の凹部３２に板材４が配置されている。板材４は凹部３２に対して、凹部３２の側壁面に配置された接着剤により固定されている。開口部３１の正方形は、赤外線センサ２の平面形状をなす正方形より小さい。 The housing 3 is a plate member made of hard plastic, and has a square opening 31 through which infrared rays are incident on the infrared sensor 2. A square recess 32 that is slightly larger than the square of the plate 4 is formed around the opening 31 of the housing 3. The recess 32 is formed on the surface of the housing 3 that faces the rigid substrate 1. The plate material 4 is disposed in the recess 32 of the housing 3. The plate 4 is fixed to the recess 32 by an adhesive disposed on the side wall surface of the recess 32. The square of the opening 31 is smaller than the square forming the planar shape of the infrared sensor 2.

筐体３のリジッド基板１と対向する面には、凹部３２の周囲（開口部３１の近傍）に、金属製の位置決めピン（位置決め突起）３３が四本固定されている。各位置決めピン３３は、凹部３２の側壁面ラインをなす正方形の四つの角の外側に配置されている。
リジッド基板１は、赤外線センサ２の平面形状をなす正方形の四つの角の外側に、位置決めピン３３が入る円形の貫通穴（位置規制部）１１を有する。四つの貫通穴１１の位置は、各貫通穴１１に各位置決めピン３３が入った状態で、筐体３の開口部３１の中心がリジッド基板１上の赤外線センサ２の受光面２１ａの中心と、所定の誤差の範囲内で一致するように設定されている。 Four metal positioning pins (positioning protrusions) 33 are fixed around the recess 32 (near the opening 31) on the surface of the housing 3 facing the rigid substrate 1. Each positioning pin 33 is disposed outside the four corners of the square forming the side wall surface line of the recess 32.
The rigid substrate 1 has a circular through hole (position restricting portion) 11 into which the positioning pin 33 is inserted outside the four corners of the square forming the planar shape of the infrared sensor 2. The positions of the four through holes 11 are such that the center of the opening 31 of the housing 3 is the center of the light receiving surface 21a of the infrared sensor 2 on the rigid substrate 1, with each positioning pin 33 inserted in each through hole 11. It is set so as to match within a predetermined error range.

第２実施形態の赤外線検出装置は、筐体３の開口部３１の近傍から突出する位置決めピン３３を、リジッド基板１の貫通穴１１に挿入することで、筐体３の開口部３１の中心と赤外線センサ２の受光面２ａの中心を一致させる位置決めを行った後に、リジッド基板１と筐体３を外縁部等でねじ止めすることにより組み立てられる。組立状態で、赤外線センサ２の視野制限部２３の上面に板材４の下面が接触し、板材４の上面に筐体３の凹部３２の底面が接触している。 In the infrared detection device of the second embodiment, the positioning pin 33 protruding from the vicinity of the opening 31 of the housing 3 is inserted into the through hole 11 of the rigid substrate 1, so that the center of the opening 31 of the housing 3 is After positioning is performed so that the centers of the light receiving surfaces 2a of the infrared sensor 2 coincide with each other, the rigid substrate 1 and the housing 3 are assembled by screwing at the outer edge portion or the like. In the assembled state, the lower surface of the plate material 4 is in contact with the upper surface of the visual field limiting portion 23 of the infrared sensor 2, and the bottom surface of the recess 32 of the housing 3 is in contact with the upper surface of the plate material 4.

したがって、第２実施形態の赤外線検出装置によれば、筐体３の開口部３１の近傍における位置決めピン３３と貫通穴１１による位置決めを行わないで、リジッド基板１と筐体３をねじ止めすることにより組み立てられた赤外線検出装置と比較して、筐体３の開口部３１と赤外線センサ２の受光部２１との位置ずれが抑制される。また、第２実施形態の赤外線検出装置の組立方法によれば、筐体３の開口部３１と赤外線センサ２の受光部２１との位置決めを簡単に行うことができる。 Therefore, according to the infrared detecting device of the second embodiment, the rigid board 1 and the housing 3 are screwed without positioning by the positioning pins 33 and the through holes 11 in the vicinity of the opening 31 of the housing 3. Compared with the infrared detection device assembled by the above, the positional deviation between the opening 31 of the housing 3 and the light receiving unit 21 of the infrared sensor 2 is suppressed. Further, according to the method for assembling the infrared detection device of the second embodiment, the positioning of the opening 31 of the housing 3 and the light receiving unit 21 of the infrared sensor 2 can be easily performed.

第２実施形態の赤外線検出装置では、例えば、赤外線センサ２のサイズが４．４ｍｍ×４．４ｍｍ×厚さ１．３２ｍｍの場合、筐体３の厚さを１．００ｍｍとし、筐体３の開口部３１を３．５ｍｍ×３．５ｍｍの正方形とすることができる。その場合、筐体３の開口部３１の中心と赤外線センサ２の受光面２ａの中心との位置ずれを±０．５ｍｍ未満にすることが可能になる。 In the infrared detection device of the second embodiment, for example, when the size of the infrared sensor 2 is 4.4 mm × 4.4 mm × thickness 1.32 mm, the thickness of the housing 3 is set to 1.00 mm, The opening 31 can be a 3.5 mm × 3.5 mm square. In that case, the positional deviation between the center of the opening 31 of the housing 3 and the center of the light receiving surface 2a of the infrared sensor 2 can be made less than ± 0.5 mm.

また、筐体３の開口部３１が、赤外線を透過するポリエチレン製の板材４で塞がれているため、赤外線センサ２の受光面２１ａにゴミが付着することが防止される。
さらに、板材４が赤外線センサ２の視野制限部２３に接触しているため、第１実施形態の赤外線検出装置と比較して、筐体３と板材４と視野制限部２３との温度差が小さくなり、筐体３の開口部３１から発生する赤外線の量と板材４から発生する赤外線の量と赤外センサ２から発生する赤外線の量との差を低減できる。これに伴い、被測定物から出射された赤外線以外の赤外線が受光面２１ａに入射される量が低減されるため、赤外線の検出精度が向上する。 Further, since the opening 31 of the housing 3 is closed with the polyethylene plate material 4 that transmits infrared rays, it is possible to prevent dust from adhering to the light receiving surface 21 a of the infrared sensor 2.
Furthermore, since the plate material 4 is in contact with the field-of-view restriction part 23 of the infrared sensor 2, the temperature difference between the housing 3, the plate material 4, and the field-of-view restriction part 23 is small as compared with the infrared detection device of the first embodiment. Thus, the difference between the amount of infrared light generated from the opening 31 of the housing 3, the amount of infrared light generated from the plate member 4, and the amount of infrared light generated from the infrared sensor 2 can be reduced. As a result, the amount of infrared rays other than infrared rays emitted from the object to be measured is incident on the light receiving surface 21a is reduced, so that the infrared detection accuracy is improved.

なお、貫通穴３１により板材４の上に形成された凹部内にゴミが付着することを防止するために、貫通穴３１内に赤外線透過性の板材等を嵌め入れて筐体３の上面を平坦にしてもよい。 In order to prevent dust from adhering to the recess formed on the plate member 4 by the through hole 31, an infrared ray transmitting plate member or the like is fitted into the through hole 31 to flatten the upper surface of the housing 3. It may be.

［第３実施形態］
図５および６に示すように、第３実施形態の赤外線検出装置は、フレキシブル基板５と、赤外線センサ２と、筐体３と、板材４と、支持部材６を有する。板材４はポリエチレン製（赤外線透過性）の正方形のシートである。
フレキシブル基板５の基板面にプリント回路が形成されている。フレキシブル基板５の一方の基板面に形成されたプリント回路の所定位置に、赤外線センサ２が実装されている。
赤外線センサ２は、素子２１が樹脂製のパッケージ２２で包み込まれたものであり、受光面２１ａの周囲の上方に、樹脂製の視野制限部２３を有する。赤外線センサ２の平面形状は正方形である。視野制限部２３は、素子２１の受光面２１ａを露出させる正方形の開口部２３ａを有する。視野制限部２３はパッケージ２２の上部に固定されている。 [Third Embodiment]
As shown in FIGS. 5 and 6, the infrared detection device of the third embodiment includes a flexible substrate 5, an infrared sensor 2, a housing 3, a plate material 4, and a support member 6. The plate material 4 is a square sheet made of polyethylene (infrared transparent).
A printed circuit is formed on the substrate surface of the flexible substrate 5. The infrared sensor 2 is mounted at a predetermined position of a printed circuit formed on one substrate surface of the flexible substrate 5.
The infrared sensor 2 is a device in which an element 21 is encased in a resin package 22, and has a resin visual field limiting unit 23 above the periphery of the light receiving surface 21a. The planar shape of the infrared sensor 2 is a square. The field-of-view restricting unit 23 has a square opening 23 a that exposes the light receiving surface 21 a of the element 21. The field-of-view restriction part 23 is fixed to the upper part of the package 22.

筐体３は、硬質プラスチック製の板状部材であり、赤外線センサ２に赤外線を入射する正方形の開口部３１を有する。筐体３の開口部３１の周囲に、板材４の正方形より僅かに大きな正方形の凹部３２が形成されている。凹部３２は、筐体３のフレキシブル基板５と対向する面とは反対側の面に形成されている。筐体３の凹部３２に板材４が配置されている。開口部３１の正方形は、赤外線センサ２の平面形状をなす正方形より小さい。 The housing 3 is a plate member made of hard plastic, and has a square opening 31 through which infrared rays are incident on the infrared sensor 2. A square recess 32 that is slightly larger than the square of the plate 4 is formed around the opening 31 of the housing 3. The recess 32 is formed on the surface of the housing 3 opposite to the surface facing the flexible substrate 5. The plate material 4 is disposed in the recess 32 of the housing 3. The square of the opening 31 is smaller than the square forming the planar shape of the infrared sensor 2.

筐体３のフレキシブル基板５と対向する面には、凹部３２の周囲（開口部３１の近傍）に、金属製の位置決めピン（位置決め突起）３３が四本固定されている。各位置決めピン３３は、凹部３２の側壁面ラインをなす正方形の四つの角の外側に配置されている。筐体３のフレキシブル基板５と対向する面には、また、各位置決めピン３３の外側に、金属製の結合ピン３４が四本固定されている。 Four metal positioning pins (positioning protrusions) 33 are fixed around the recess 32 (near the opening 31) on the surface of the housing 3 that faces the flexible substrate 5. Each positioning pin 33 is disposed outside the four corners of the square forming the side wall surface line of the recess 32. Four metal coupling pins 34 are fixed to the outer surface of each positioning pin 33 on the surface of the housing 3 facing the flexible substrate 5.

結合ピン３４は、位置決めピン３３より長く、軸部３４ａと、軸部３４ａの先端部に配置され、軸部３４ａの外周面から外側に突出する突起３４ｂとを有する。結合ピン３４の軸部３４ａの内部に、突起３４ｂを軸部３４ａから出し入れするバネ機構が配置されている。突起３４ｂは軸部３４ａの下端側から斜め上方に延びる斜面を有し、この斜面を押す力によって、バネ機構が作動して軸部３４ａ内に入る。 The coupling pin 34 is longer than the positioning pin 33, and includes a shaft portion 34a and a protrusion 34b that is disposed at the distal end portion of the shaft portion 34a and projects outward from the outer peripheral surface of the shaft portion 34a. Inside the shaft portion 34a of the coupling pin 34, a spring mechanism for inserting and removing the protrusion 34b from the shaft portion 34a is disposed. The protrusion 34b has a slope extending obliquely upward from the lower end side of the shaft portion 34a, and the spring mechanism is operated by the force pushing the slope to enter the shaft portion 34a.

フレキシブル基板５は、赤外線センサ２の平面形状をなす正方形の四つの角の外側に、位置決めピン３３が入る円形の貫通穴（位置規制部）５１を有する。フレキシブル基板５は、また、右側の二つの貫通穴５１の外側に、結合ピン３４が入る円形の貫通穴５２を有する。四つの貫通穴５１の位置は、各貫通穴５１に各位置決めピン３３が入った状態で、筐体３の開口部３１の中心がフレキシブル基板５上の赤外線センサ２の受光面２１ａの中心と、所定の誤差の範囲内で一致するように設定されている。 The flexible substrate 5 has a circular through hole (position restricting portion) 51 into which the positioning pin 33 is inserted outside the four corners of the square forming the planar shape of the infrared sensor 2. The flexible substrate 5 also has a circular through hole 52 into which the coupling pin 34 enters outside the two through holes 51 on the right side. The positions of the four through holes 51 are such that the center of the opening 31 of the housing 3 is the center of the light receiving surface 21a of the infrared sensor 2 on the flexible substrate 5 with each positioning pin 33 inserted in each through hole 51. It is set so as to match within a predetermined error range.

フレキシブル基板５の貫通穴５２は、各貫通穴１１に筐体３から突出する各位置決めピン３３が入った状態で、結合ピン３４の真下となる位置に形成され、結合ピン３４の先端部３４ｂが軸部３４ａから出ている状態で挿入できる大きさと形状を有する。
支持部材６は、硬質プラスチック製または金属製であり、板状部６１と四つの円柱体６２とを有する。板状部６１は、全ての結合ピン３４が含まれる大きさの正方形である。四つの円柱体６２は、板状部６１の一方の面の中央部であって、赤外線センサ２をなす正方形の各角部の内側に配置されている。板状部６１は、四本の結合ピン３４の位置に合わせて配置された貫通穴６１ａを有する。貫通穴６１ａの形状は、結合ピン３４の軸部３４ａに対して僅かな緩みを有する円形である。 The through hole 52 of the flexible substrate 5 is formed at a position directly below the coupling pin 34 in a state where each positioning pin 33 protruding from the housing 3 is inserted into each through hole 11, and the tip 34 b of the coupling pin 34 is formed. It has a size and shape that can be inserted in a state where it protrudes from the shaft portion 34a.
The support member 6 is made of hard plastic or metal and has a plate-like portion 61 and four cylindrical bodies 62. The plate-like portion 61 is a square having a size that includes all the coupling pins 34. The four cylindrical bodies 62 are arranged at the center of one surface of the plate-like part 61 and inside the square corners forming the infrared sensor 2. The plate-like portion 61 has a through hole 61 a arranged in accordance with the position of the four coupling pins 34. The shape of the through hole 61 a is a circular shape having a slight looseness with respect to the shaft portion 34 a of the coupling pin 34.

第３実施形態の赤外線検出装置を組み立てる際には、先ず、支持部材６の四つの円柱体６２の上にフレキシブル基板５を載せて、四つの円柱体６２の上に赤外線センサ２が配置された状態にする。次に、赤外線センサ２の上方に筐体３が配置された状態にする。
この状態で、筐体３をフレキシブル基板５に近づけて、右側の結合ピン３４の先端部３４ｂをフレキシブル基板５の貫通穴５２に通す。次に、筐体３をさらにフレキシブル基板５に近づけて、右側の結合ピン３４の先端部３４ｂを板状部６１の右側の貫通穴６１ａに入れるとともに、左側の結合ピン３４の先端部３４ｂを左側の貫通穴６１ａに入れる。結合ピン３４の先端部３４ｂは、貫通穴６１ａを通過する際にバネ機構より軸部３４ａに入り、板状部６１の下部に出た時点で軸部３４ａより外に出る。これにより、支持部材６の板状部６１と筐体３が結合ピン３４で結合される。 When assembling the infrared detecting device of the third embodiment, first, the flexible substrate 5 is placed on the four cylindrical bodies 62 of the support member 6, and the infrared sensor 2 is arranged on the four cylindrical bodies 62. Put it in a state. Next, the casing 3 is placed above the infrared sensor 2.
In this state, the housing 3 is brought close to the flexible substrate 5, and the tip end portion 34 b of the right coupling pin 34 is passed through the through hole 52 of the flexible substrate 5. Next, the housing 3 is further moved closer to the flexible substrate 5 and the tip end portion 34b of the right coupling pin 34 is inserted into the right through hole 61a of the plate-like portion 61, and the tip end portion 34b of the left coupling pin 34 is placed on the left side. Into the through hole 61a. The tip end portion 34 b of the coupling pin 34 enters the shaft portion 34 a from the spring mechanism when passing through the through hole 61 a, and exits from the shaft portion 34 a when it exits the lower portion of the plate-like portion 61. As a result, the plate-like portion 61 of the support member 6 and the housing 3 are coupled by the coupling pin 34.

この動きに伴って、筐体３の開口部３１の近傍から突出する位置決めピン３３の先端部がフレキシブル基板５の貫通穴５１に入ることにより、筐体３の開口部３１の中心と赤外線センサ２の受光面２ａの中心を一致させる位置決めが行われる。この時、フレキシブル基板５は、支持部材６により赤外線センサ２が実装されている位置で支持されている。
このようにして、筐体３の開口部３１の近傍における位置決めピン３３と貫通穴５１による位置決めが行われるとともに、フレキシブル基板５と筐体３が結合されて、第３実施形態の赤外線検出装置が組み立てられる。 Along with this movement, the tip of the positioning pin 33 protruding from the vicinity of the opening 31 of the housing 3 enters the through hole 51 of the flexible substrate 5, and the center of the opening 31 of the housing 3 and the infrared sensor 2. Positioning is performed so that the centers of the light receiving surfaces 2a coincide. At this time, the flexible substrate 5 is supported by the support member 6 at a position where the infrared sensor 2 is mounted.
In this way, positioning by the positioning pin 33 and the through hole 51 in the vicinity of the opening 31 of the housing 3 is performed, and the flexible substrate 5 and the housing 3 are combined, so that the infrared detection device of the third embodiment is Assembled.

組立状態で、位置決めピン３３の先端部が板状部６１に接触している。また、赤外線センサ２の視野制限部２３の上面と、開口部３１の周縁部をなす筐体３の下面が接触している。第３実施形態の赤外線検出装置は、フレキシブル基板５からの配線をリジッド基板に接続することにより使用される。
したがって、第３実施形態の赤外線検出装置によれば、筐体３の開口部３１の近傍における位置決めピン３３と貫通穴５１による位置決めを行わないで、フレキシブル基板５と筐体３が結合された赤外線検出装置と比較して、筐体３の開口部３１と赤外線センサ２の受光部２１との位置ずれが抑制される。また、第３実施形態の赤外線検出装置の組立方法によれば、筐体３の開口部３１と赤外線センサ２の受光部２１との位置決めを簡単に行うことができる。 The tip of the positioning pin 33 is in contact with the plate-like portion 61 in the assembled state. Further, the upper surface of the field-of-view restriction part 23 of the infrared sensor 2 and the lower surface of the housing 3 that forms the peripheral edge of the opening 31 are in contact with each other. The infrared detection device of the third embodiment is used by connecting the wiring from the flexible substrate 5 to a rigid substrate.
Therefore, according to the infrared detection device of the third embodiment, the infrared rays in which the flexible substrate 5 and the housing 3 are combined without positioning by the positioning pins 33 and the through holes 51 in the vicinity of the opening 31 of the housing 3. Compared with the detection device, positional deviation between the opening 31 of the housing 3 and the light receiving unit 21 of the infrared sensor 2 is suppressed. Further, according to the method of assembling the infrared detection device of the third embodiment, the opening 31 of the housing 3 and the light receiving unit 21 of the infrared sensor 2 can be easily positioned.

第３実施形態の赤外線検出装置では、例えば、赤外線センサ２のサイズが４．４ｍｍ×４．４ｍｍ×厚さ１．３２ｍｍの場合、筐体３の厚さを１．００ｍｍとし、筐体３の開口部３１を３．５ｍｍ×３．５ｍｍの正方形とすることができる。その場合、筐体３の開口部３１の中心と赤外線センサ２の受光面２ａの中心との位置ずれを±０．５ｍｍ未満にすることが可能になる。 In the infrared detection apparatus of the third embodiment, for example, when the size of the infrared sensor 2 is 4.4 mm × 4.4 mm × thickness 1.32 mm, the thickness of the housing 3 is set to 1.00 mm, The opening 31 can be a 3.5 mm × 3.5 mm square. In that case, the positional deviation between the center of the opening 31 of the housing 3 and the center of the light receiving surface 2a of the infrared sensor 2 can be made less than ± 0.5 mm.

また、位置決め時に、フレキシブル基板５の赤外線センサ２が実装されている位置が、四つの円柱体６２により支持されているため、位置決めが安定的に行われる。また、支持部材６を有することで、フレキシブル基板５がしっかりと保持される。
さらに、筐体３の開口部３１が、赤外線を透過するポリエチレン製の板材４で塞がれているため、赤外線センサ２の受光面２１ａにゴミが付着することが防止される。 Moreover, since the position where the infrared sensor 2 of the flexible substrate 5 is mounted is supported by the four cylindrical bodies 62 at the time of positioning, positioning is performed stably. Moreover, the flexible substrate 5 is firmly held by having the support member 6.
Furthermore, since the opening 31 of the housing 3 is closed with the polyethylene plate 4 that transmits infrared rays, it is possible to prevent dust from adhering to the light receiving surface 21a of the infrared sensor 2.

［第４実施形態］
図７および８に示すように、第４実施形態の赤外線検出装置は、フレキシブル基板５と、赤外線センサ２と、筐体３と、板材４と、支持部材６を有する。板材４はポリエチレン製（赤外線透過性）の正方形のシートである。
フレキシブル基板５の基板面にプリント回路が形成されている。フレキシブル基板５の一方の基板面に形成されたプリント回路の所定位置に、赤外線センサ２が実装されている。
赤外線センサ２は、素子２１が樹脂製のパッケージ２２で包み込まれたものであり、受光面２１ａの周囲の上方に、樹脂製の視野制限部２３を有する。赤外線センサ２の平面形状は正方形である。視野制限部２３は、素子２１の受光面２１ａを露出させる正方形の開口部２３ａを有する。視野制限部２３はパッケージ２２の上部に固定されている。 [Fourth Embodiment]
As shown in FIGS. 7 and 8, the infrared detection device of the fourth embodiment includes a flexible substrate 5, an infrared sensor 2, a housing 3, a plate material 4, and a support member 6. The plate material 4 is a square sheet made of polyethylene (infrared transparent).
A printed circuit is formed on the substrate surface of the flexible substrate 5. The infrared sensor 2 is mounted at a predetermined position of a printed circuit formed on one substrate surface of the flexible substrate 5.
The infrared sensor 2 is a device in which an element 21 is encased in a resin package 22, and has a resin visual field limiting unit 23 above the periphery of the light receiving surface 21a. The planar shape of the infrared sensor 2 is a square. The field-of-view restricting unit 23 has a square opening 23 a that exposes the light receiving surface 21 a of the element 21. The field-of-view restriction part 23 is fixed to the upper part of the package 22.

筐体３は、硬質プラスチック製の板状部材であり、赤外線センサ２に赤外線を入射する正方形の開口部３１を有する。筐体３の開口部３１の周囲に、板材４の正方形より僅かに大きな正方形の凹部３２が形成されている。凹部３２は、筐体３のフレキシブル基板５と対向する面に形成されている。筐体３の凹部３２に板材４が配置されている。板材４は凹部３２に対して、凹部３２の側壁面に配置された接着剤により固定されている。開口部３１の正方形は、赤外線センサ２の平面形状をなす正方形より小さい。 The housing 3 is a plate member made of hard plastic, and has a square opening 31 through which infrared rays are incident on the infrared sensor 2. A square recess 32 that is slightly larger than the square of the plate 4 is formed around the opening 31 of the housing 3. The recess 32 is formed on the surface of the housing 3 that faces the flexible substrate 5. The plate material 4 is disposed in the recess 32 of the housing 3. The plate 4 is fixed to the recess 32 by an adhesive disposed on the side wall surface of the recess 32. The square of the opening 31 is smaller than the square forming the planar shape of the infrared sensor 2.

第４実施形態の赤外線検出装置を組み立てる際には、先ず、支持部材６の四つの円柱体６２の上にフレキシブル基板５を載せて、四つの円柱体６２の上に赤外線センサ２が配置された状態にする。次に、赤外線センサ２の上方に筐体３が配置された状態にする。
この状態で、筐体３をフレキシブル基板５に近づけて、右側の結合ピン３４の先端部３４ｂをフレキシブル基板５の貫通穴５２に通す。次に、筐体３をさらにフレキシブル基板５に近づけて、右側の結合ピン３４の先端部３４ｂを板状部６１の右側の貫通穴６１ａに入れるとともに、左側の結合ピン３４の先端部３４ｂを左側の貫通穴６１ａに入れる。結合ピン３４の先端部３４ｂは、貫通穴６１ａを通過する際にバネ機構より軸部３４ａに入り、板状部６１の下部に出た時点で軸部３４ａより外に出る。これにより、支持部材６の板状部６１と筐体３が結合ピン３４で結合される。 When assembling the infrared detecting device of the fourth embodiment, first, the flexible substrate 5 is placed on the four cylindrical bodies 62 of the support member 6, and the infrared sensor 2 is arranged on the four cylindrical bodies 62. Put it in a state. Next, the casing 3 is placed above the infrared sensor 2.
In this state, the housing 3 is brought close to the flexible substrate 5, and the tip end portion 34 b of the right coupling pin 34 is passed through the through hole 52 of the flexible substrate 5. Next, the housing 3 is further moved closer to the flexible substrate 5 and the tip end portion 34b of the right coupling pin 34 is inserted into the right through hole 61a of the plate-like portion 61, and the tip end portion 34b of the left coupling pin 34 is placed on the left side. Into the through hole 61a. The tip end portion 34 b of the coupling pin 34 enters the shaft portion 34 a from the spring mechanism when passing through the through hole 61 a, and exits from the shaft portion 34 a when it exits the lower portion of the plate-like portion 61. As a result, the plate-like portion 61 of the support member 6 and the housing 3 are coupled by the coupling pin 34.

この動きに伴って、筐体３の開口部３１の近傍から突出する位置決めピン３３の先端部がフレキシブル基板５の貫通穴５１に入ることにより、筐体３の開口部３１の中心と赤外線センサ２の受光面２ａの中心を一致させる位置決めが行われる。この時、フレキシブル基板５は、支持部材６により赤外線センサ２が固定されている位置で支持されている。
このようにして、筐体３の開口部３１の近傍における位置決めピン３３と貫通穴５１による位置決めが行われるとともに、フレキシブル基板５と筐体３が結合されて、第３実施形態の赤外線検出装置が組み立てられる。 Along with this movement, the tip of the positioning pin 33 protruding from the vicinity of the opening 31 of the housing 3 enters the through hole 51 of the flexible substrate 5, and the center of the opening 31 of the housing 3 and the infrared sensor 2. Positioning is performed so that the centers of the light receiving surfaces 2a coincide with each other. At this time, the flexible substrate 5 is supported by the support member 6 at a position where the infrared sensor 2 is fixed.
In this way, positioning by the positioning pin 33 and the through hole 51 in the vicinity of the opening 31 of the housing 3 is performed, and the flexible substrate 5 and the housing 3 are combined, so that the infrared detection device of the third embodiment is Assembled.

組立状態で、位置決めピン３３の先端部が板状部６１に接触している。また、赤外線センサ２の視野制限部２３の上面に板材４の下面が接触し、板材４の上面に筐体３の凹部３２の底面が接触している。第４実施形態の赤外線検出装置は、フレキシブル基板５からの配線をリジッド基板に接続することにより使用される。
したがって、第４実施形態の赤外線検出装置によれば、筐体３の開口部３１の近傍における位置決めピン３３と貫通穴５１による位置決めを行わないで、フレキシブル基板５と筐体３が結合された赤外線検出装置と比較して、筐体３の開口部３１と赤外線センサ２の受光部２１との位置ずれが抑制される。また、第４実施形態の赤外線検出装置の組立方法によれば、筐体３の開口部３１と赤外線センサ２の受光部２１との位置決めを簡単に行うことができる。 The tip of the positioning pin 33 is in contact with the plate-like portion 61 in the assembled state. Further, the lower surface of the plate material 4 is in contact with the upper surface of the field-of-view restriction portion 23 of the infrared sensor 2, and the bottom surface of the recess 32 of the housing 3 is in contact with the upper surface of the plate material 4. The infrared detection device of the fourth embodiment is used by connecting the wiring from the flexible substrate 5 to a rigid substrate.
Therefore, according to the infrared detection device of the fourth embodiment, the infrared rays in which the flexible substrate 5 and the housing 3 are combined without positioning by the positioning pins 33 and the through holes 51 in the vicinity of the opening 31 of the housing 3. Compared with the detection device, positional deviation between the opening 31 of the housing 3 and the light receiving unit 21 of the infrared sensor 2 is suppressed. Further, according to the method for assembling the infrared detection device of the fourth embodiment, the positioning of the opening 31 of the housing 3 and the light receiving unit 21 of the infrared sensor 2 can be easily performed.

第４実施形態の赤外線検出装置では、例えば、赤外線センサ２のサイズが４．４ｍｍ×４．４ｍｍ×厚さ１．３２ｍｍの場合、筐体３の厚さを１．００ｍｍとし、筐体３の開口部３１を３．５ｍｍ×３．５ｍｍの正方形とすることができる。その場合、筐体３の開口部３１の中心と赤外線センサ２の受光面２ａの中心との位置ずれを±０．５ｍｍ未満にすることが可能になる。 In the infrared detection device of the fourth embodiment, for example, when the size of the infrared sensor 2 is 4.4 mm × 4.4 mm × thickness 1.32 mm, the thickness of the housing 3 is set to 1.00 mm, The opening 31 can be a 3.5 mm × 3.5 mm square. In that case, the positional deviation between the center of the opening 31 of the housing 3 and the center of the light receiving surface 2a of the infrared sensor 2 can be made less than ± 0.5 mm.

さらに、板材４が赤外線センサ２の視野制限部２３に接触しているため、第３実施形態の赤外線検出装置と比較して、筐体３と板材４と視野制限部２３との温度差が小さくなり、筐体３の開口部３１から発生する赤外線の量と板材４から発生する赤外線の量と赤外センサ２から発生する赤外線の量との差を低減できる。これに伴い、被測定物から出射された赤外線以外の赤外線が受光面２１ａに入射される量が低減されるため、赤外線の検出精度が向上する。 Furthermore, since the plate material 4 is in contact with the field-of-view restriction part 23 of the infrared sensor 2, the temperature difference between the housing 3, the plate material 4, and the field-of-view restriction part 23 is small compared to the infrared detection device of the third embodiment. Thus, the difference between the amount of infrared light generated from the opening 31 of the housing 3, the amount of infrared light generated from the plate member 4, and the amount of infrared light generated from the infrared sensor 2 can be reduced. As a result, the amount of infrared rays other than infrared rays emitted from the object to be measured is incident on the light receiving surface 21a is reduced, so that the infrared detection accuracy is improved.

なお、貫通穴３１により板材４の上に形成された凹部内にゴミが付着することを防止するために、貫通穴３１内に赤外線透過性の板材等を嵌め入れて筐体３の上面を平坦にしてもよい。
以上のように、第１〜第４実施形態では、位置決め突起として、筐体３の開口部３１近傍の基板１と対向する面から突出する位置決めピン３３を設け、これを係合する位置規制部として、基板１に貫通穴１１を設けているが、例えば、位置決めピン３３を短くして、基板１の上に設けた筒状部（位置規制部）内に入るようにしてもよい。 In order to prevent dust from adhering to the recess formed on the plate member 4 by the through hole 31, an infrared ray transmitting plate member or the like is fitted into the through hole 31 to flatten the upper surface of the housing 3. It may be.
As described above, in the first to fourth embodiments, as the positioning protrusion, the positioning pin 33 protruding from the surface facing the substrate 1 in the vicinity of the opening 31 of the housing 3 is provided, and the position restricting portion that engages the positioning pin 33 The through hole 11 is provided in the substrate 1. However, for example, the positioning pin 33 may be shortened so as to enter the cylindrical portion (position restricting portion) provided on the substrate 1.

また、位置決め突起を、視野制限部２３と対向する面から突出させて、これが嵌まる凹部を視野制限部２３の上面に設けたり、視野制限部２３が位置決め突起で規制された空間に入るように構成したり、視野制限部２３に位置決め突起を案内するガイドを設けたりしてもよい。ここで、赤外線センサ２が視野制限部２３を備えていない場合は、パッケージ２２で同様のことができることは言うまでもない。 Further, the positioning protrusion is protruded from the surface facing the visual field restricting portion 23, and a concave portion into which the positioning protrusion is fitted is provided on the upper surface of the visual field restricting portion 23, or the visual field restricting portion 23 enters the space restricted by the positioning protrusion. You may comprise, or may provide the guide which guides a positioning protrusion in the visual field restriction part 23. Here, when the infrared sensor 2 does not include the visual field limiting unit 23, it is needless to say that the package 22 can do the same.

さらに、第１〜第４実施形態において、位置決めピン３３は、樹脂製であってもよいし、筐体３の成形時に筐体３と同じ材料で一体に形成されていてもよい。筐体３の開口部３１、視野制限部２３の開口部２３ａ、および板材４は、円形等であってもよい。
また、第３〜第４実施形態において、赤外線検出装置の組立は、筐体３の位置決めピン３３および結合ピン３４をフレキシブル基板５の貫通穴５１，５２に入れる位置決め工程を行った後に、フレキシブル基板５に円柱体６２側を向けて支持部材６を上昇させ、支持部材６の貫通穴６１ａに結合ピン３４を通すことで行ってもよい。 Furthermore, in the first to fourth embodiments, the positioning pin 33 may be made of resin, or may be integrally formed of the same material as the housing 3 when the housing 3 is molded. The opening 31 of the housing 3, the opening 23 a of the visual field limiting unit 23, and the plate material 4 may be circular.
In the third to fourth embodiments, the infrared detection device is assembled after the positioning step of inserting the positioning pins 33 and the coupling pins 34 of the housing 3 into the through holes 51 and 52 of the flexible substrate 5. Alternatively, the support member 6 may be raised with the cylindrical body 62 side facing 5, and the coupling pin 34 may be passed through the through hole 61a of the support member 6.

また、第３〜第４実施形態において、結合ピン３４はバネ機構を有さず、プラスチックの弾性変形力を利用するものであってもよい。支持部材６の赤外線センサを支持する部材は、四つの円柱体以外の構成以外に、二つまたは四つの直方体や一つの円筒体等が挙げられる。 Moreover, in 3rd-4th embodiment, the coupling pin 34 does not have a spring mechanism, but may utilize the elastic deformation force of a plastic. Examples of the member that supports the infrared sensor of the support member 6 include two or four rectangular parallelepipeds and one cylindrical body, in addition to the configuration other than the four columnar bodies.

１リジッド基板
１１リジッド基板の貫通穴（位置規制部）
２赤外線センサ
２１素子
２１ａ受光面
２２パッケージ
２３視野制限部
２３ａ視野制限部の開口部
３筐体
３１筐体の開口部
３２筐体の開口部周囲の凹部
３３位置決めピン（位置決め突起）
３４結合ピン
３４ａ結合ピンの軸部
３４ｂ結合ピンの突起
４板材（赤外線透過性の板材）
５フレキシブル基板
５１フレキシブル基板の位置決めピンを入れる貫通穴（位置規制部）
５２フレキシブル基板の結合ピンを入れる貫通穴
６支持部材
６１板状部
６１ａ板状部の貫通穴
６２円柱体 1 Rigid board 11 Rigid board through hole (position regulation part)
2 Infrared sensor 21 Element 21a Light-receiving surface 22 Package 23 Field-of-view restriction 23a Field-of-view restriction opening 3 Housing 31 Housing opening 32 Recess around housing opening 33 Positioning pin (positioning protrusion)
34 coupling pin 34a coupling pin shaft 34b coupling pin protrusion 4 plate material (infrared transmitting plate material)
5 Flexible substrate 51 Through hole (position restriction part) for positioning pin of flexible substrate
52 Through-hole for inserting coupling pin of flexible substrate 6 Support member 61 Plate-like portion 61a Through-hole in plate-like portion 62 Cylinder

Claims

A substrate,
An infrared sensor mounted on the substrate, wherein the element is wrapped in a resin package and the light receiving surface is exposed;
A housing having an opening for injecting infrared light into the infrared sensor;
A positioning protrusion protruding from a surface facing the substrate or the resin package in the vicinity of the opening of the housing;
A position restricting portion formed on the substrate or the resin package and engaged with the positioning protrusion;
Have
By the engagement between the positioning protrusion and the position restricting portion, the opening of the housing and the light receiving surface of the infrared sensor are positioned ,
An infrared detection device in which the resin package is in contact with the housing .

A substrate,
Infrared sensor mounted on the substrate, the element is encased in a resin package, and has a resin visual field limiting portion above the periphery of the light receiving surface;
A housing having an opening for injecting infrared light into the infrared sensor;
A positioning protrusion protruding from a surface facing the substrate or the field-of-view restriction portion in the vicinity of the opening of the housing;
A position restricting portion formed on the substrate or the resin package or the visual field restricting portion and engaged with the positioning protrusion;
Have
By the engagement between the positioning protrusion and the position restricting portion, the opening of the housing and the light receiving surface of the infrared sensor are positioned ,
An infrared detection apparatus in which the visual field restriction unit is in contact with the housing .

The infrared detection device according to claim 1, wherein the opening is closed by an infrared transmissive plate material that contacts the housing.

A substrate,
Infrared sensor mounted on the substrate, the element is encased in a resin package, and has a resin visual field limiting portion above the periphery of the light receiving surface;
A housing having an opening for injecting infrared light into the infrared sensor;
A positioning protrusion protruding from a surface facing the substrate or the field-of-view restriction portion in the vicinity of the opening of the housing;
A position restricting portion formed on the substrate or the resin package or the visual field restricting portion and engaged with the positioning protrusion;
Have
By the engagement between the positioning protrusion and the position restricting portion, the opening of the housing and the light receiving surface of the infrared sensor are positioned,
The opening is closed with an infrared transmissive plate that contacts the housing;
An infrared detecting device in which the plate material is in contact with the visual field limiting portion of the infrared sensor.