JP5753268B2 - Diamond polishing equipment - Google Patents

Diamond polishing equipment Download PDF

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JP5753268B2
JP5753268B2 JP2013531329A JP2013531329A JP5753268B2 JP 5753268 B2 JP5753268 B2 JP 5753268B2 JP 2013531329 A JP2013531329 A JP 2013531329A JP 2013531329 A JP2013531329 A JP 2013531329A JP 5753268 B2 JP5753268 B2 JP 5753268B2
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Prior art keywords
polishing
diamond
support
polishing plate
holder
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JPWO2013031772A1 (en
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一仁 西村
一仁 西村
秀紀 笹岡
秀紀 笹岡
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高知Fel株式会社
ニンボ クリスダイアム インダストリアル テクノロジー カンパニー リミテッド
ニンボ クリスダイアム インダストリアル テクノロジー カンパニー リミテッド
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Priority to JP2011188847 priority
Application filed by 高知Fel株式会社, ニンボ クリスダイアム インダストリアル テクノロジー カンパニー リミテッド, ニンボ クリスダイアム インダストリアル テクノロジー カンパニー リミテッド filed Critical 高知Fel株式会社
Priority to PCT/JP2012/071707 priority patent/WO2013031772A1/en
Priority to JP2013531329A priority patent/JP5753268B2/en
Publication of JPWO2013031772A1 publication Critical patent/JPWO2013031772A1/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/16Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of diamonds; of jewels or the like; Diamond grinders' dops; Dop holders or tongs
    • B24B9/164Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of diamonds; of jewels or the like; Diamond grinders' dops; Dop holders or tongs of diamond tools
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/11Lapping tools
    • B24B37/20Lapping pads for working plane surfaces
    • B24B37/24Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00Component parts such as frames, beds, carriages, headstocks
    • B24B41/06Work supports, e.g. adjustable steadies
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/16Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of diamonds; of jewels or the like; Diamond grinders' dops; Dop holders or tongs
    • B24B9/161Dops, dop holders
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/16Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of diamonds; of jewels or the like; Diamond grinders' dops; Dop holders or tongs
    • B24B9/167Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of diamonds; of jewels or the like; Diamond grinders' dops; Dop holders or tongs with means for turning and positioning the gem stones

Description

  The present invention relates to a diamond polishing apparatus for polishing a rough diamond.
  Conventionally, a diamond tool is known in which a single-crystal diamond rough is provided with a cutting edge and brazed to a base metal or a shank. Such a diamond tool is used for ultra-precise machining of, for example, an aspheric lens mold, and is polished with high accuracy. Recently, the precision required for ultra-precision machining has become stricter year by year, and accordingly, the precision required for diamond tools has also become stricter.
  For example, Patent Literatures 1 and 2 disclose a technique related to a diamond polishing apparatus. A device called a Skyf board or a skif board is generally used for polishing diamond rough. This apparatus is intended to perform mechanical polishing with diamond free abrasive grains, and applies diamond free abrasive grains to the polishing surface of the upper surface of a cast iron polishing plate that rotates horizontally and pushes the abrasive grains into the polishing surface ( It is carried by embedding. Then, a rough diamond (diamond tool) is attached to the tip of a holder called a tongue, and the rough diamond is pressed against the polishing surface of the polishing plate for polishing. This diamond roughing work involves adjusting the angle of the diamond rough with respect to the polishing plate (polishing surface) while checking the surface to be polished (the surface to be polished in contact with the polishing plate) or polishing the diamond rough. It is necessary to adjust the contact pressure to be pressed against the plate (polishing surface), and the work efficiency and quality are affected by the skill of the worker.
JP-A-5-77127 Japanese Examined Patent Publication No. 6-59605
  In conventional diamond polishing equipment, cast iron is used for the polishing plate, but since the cast iron contains nests and flake graphite, the surface roughness of the polishing surface of the polishing plate is usually 5 μmRa (arithmetic mean roughness) Coarser. Therefore, when polishing the rough diamond, the stress applied to the polished surface (contact surface) of the rough diamond reaches the fracture strength due to the impact force generated between the polished plate and the rough diamond contacting the polishing plate. The diamond rough is easily damaged. In particular, when making a diamond tool, it is necessary to form a sharp cutting edge on the rough diamond. Skill is required.
  The present invention has been made in view of the above circumstances, and one of its purposes is to prevent the loss of the rough diamond by suppressing the generation of impact force between the polishing plate and the rough diamond. An object of the present invention is to provide a diamond polishing apparatus that can be used.
  The diamond polishing apparatus of the present invention includes a polishing plate having a horizontally rotating polishing surface, a holder for holding a rough diamond to be polished in contact with the polishing surface of the polishing plate, and a support that supports the holder. . The polishing plate is characterized in that the surface roughness of the polishing surface is 1 μmRa (arithmetic average roughness) or less.
  According to this configuration, since the polishing surface of the polishing plate has a surface roughness of 1 μmRa or less, it is possible to reduce the impact force generated between the polishing plate and the rough diamond due to the unevenness of the surface of the polishing surface. Therefore, it is possible to prevent the loss of the raw diamond. In the present invention, the case where the surface roughness is 1 μmRa or less is called “mirror surface”. The surface roughness of the polishing surface of the polishing plate is preferably 0.5 μmRa or less, more preferably 0.3 μmRa or less. In addition, the polishing plate is a material that easily forms carbides, such as steel, molybdenum (including Mo and Mo alloys), chromium (including Cr and Cr alloys), and tungsten (including W and W alloys). It is preferable to use a metal material such as carbon steel, and examples of the steel material include carbon steel and stainless steel. In order to finish the polished surface of the polishing plate to a mirror surface with a surface roughness of 1 μmRa or less, it is desirable to use a conditioned material with few defects such as nests. When using a steel material, a steel material from which stress has been removed by quenching and sub-zero treatment is preferable. On the other hand, when a molybdenum material, a chromium material, or a tungsten material is used, a material obtained by spraying the aforementioned material such as a molybdenum material on the upper surface of a steel substrate or a sintered body can be used.
  In the conventional diamond polishing apparatus, polishing is performed using diamond free abrasive grains, whereas in the present invention, the rough diamond is brought into contact with the polished surface of the mirror-polished polishing plate, and the rough diamond is heated to high temperature by frictional heat. Thus, polishing (removal processing) is performed mainly using thermal wear due to a chemical reaction. Therefore, in the present invention, when the surface roughness of the polished surface is 1 μmRa or less, vibration generated by polishing is reduced, and the impact force generated between the polishing plate and the rough diamond can be reduced. Furthermore, since the contact area between the rough diamond to be polished and the polishing plate is increased, heat generation due to frictional resistance is increased, and the processing speed of the rough diamond can be improved. Moreover, compared with the conventional diamond grinding | polishing apparatus, use of a diamond loose abrasive grain can be eliminated or the usage-amount can be reduced significantly.
  In the diamond polishing apparatus of the present invention, from the initial stage before the final stage (precision finishing) to the intermediate stage (rough / medium finishing), the diamond free abrasive grains are applied to the polishing surface of the polishing plate and interposed between them. Polishing can also be performed simultaneously to improve the processing speed. In this case, use abrasive grains whose sub-micron diameter is less than the surface roughness of the polished surface (maximum grain size is less than 1 μm), and make the abrasive grains into a paste (slurry) with olive oil or machine oil. Thus, it is preferable to uniformly apply to the polished surface. As a result, even when abrasive grains are present, the impact applied to the rough diamond can be minimized while obtaining a mechanical polishing action. The paste uniformly applied to the polished surface also functions as a protective film effective for rust prevention and mechanical protection of the polished surface. On the other hand, in the final precision finishing, since abrasive particles may cause chipping in the polished blade edge, avoid the use of abrasive grains as much as possible and use thermal wear caused by contacting the rough diamond with the polished surface. Processing in which the polishing process is dominant is desirable. The abrasive grains applied to the polished surface can be easily removed by wiping with, for example, a cloth or cotton soaked in anhydrous alcohol. In the polishing process using the thermal wear of diamond, the processing speed increases as the temperature increases. In the present invention, the surface roughness of the polished surface is 1 μmRa or less, and since the real contact area between the diamond raw stone and the polishing plate is large, the interface temperature due to frictional heat during processing is higher than that of a conventional diamond polishing apparatus. Thus, the processing speed can be improved.
  In one embodiment of the diamond polishing apparatus of the present invention, the support is a guide pin base on which two guide pins are erected. In addition, the holder includes two support portions supported by two guide pins standing on the guide pin base, and an attachment portion for attaching the rough diamond stone on the tip side, and the shaft of the support portion with respect to the guide pins It is mentioned that the position of the direction is adjustable.
  According to this configuration, the holder is supported at three points by the rough diamond stone and the two support portions that are in contact with the polishing plate. And the angle (pitch angle and bank angle) with respect to the polishing plate (polishing surface) of the diamond raw stone can be adjusted by independently adjusting the axial position of each support portion with respect to each guide pin. Specifically, by measuring the three-dimensional shape of the rough diamond attached to the attachment part of the holder and determining the angle of the surface to be polished based on the shape, the dimensional accuracy and shape accuracy can be obtained. Polishing can be performed. In particular, it is effective when natural diamond having a constant size and shape is used as a rough diamond or when facets are formed on a rough diamond. Moreover, the angle with respect to the polishing surface of the rough diamond can be arbitrarily adjusted by independently adjusting the axial position of each support portion with respect to each guide pin. For example, it is possible to change the other to a predetermined angle without changing one of the pitch angle and the bank angle. As the guide pin, for example, a screw can be used, and the axial position of the support portion with respect to the screw can be easily adjusted by rotating the screw.
  One embodiment of the diamond polishing apparatus of the present invention is that the holder is made of plastic or ceramics.
  According to this configuration, the holder is made of plastic or ceramics, so that it is lightweight. In the polishing apparatus described in Patent Document 1 described above, a spring is provided as means for supporting the holder in order to adjust the contact pressure. However, since the holder is made of metal and is heavy, the inertial mass is large. Therefore, even if a means for supporting the holder is provided, if an impact occurs due to a cause that cannot be completely suppressed (such as a minute foreign substance adhering to the polishing surface of the polishing plate during polishing), the impact force It is conceivable that defects occur in the rough diamond. On the other hand, in the above-described configuration, the holder can be made light by using the light material described above, so that the inertia mass of the holder can be reduced. When the portion is displaced (escapes) in a direction away from the polishing plate, it is possible to absorb and mitigate the impact received by the rough diamond. Therefore, it is possible to effectively prevent the diamond diamond from being lost.
  In the present invention, as described above, since polishing is mainly performed using thermal wear, the holder is preferably formed of a plastic having a high thermal resistivity (low thermal conductivity). This makes it difficult for heat generated in the diamond rough to escape through the holder, raises the temperature of the diamond rough, and promotes polishing due to thermal wear. Furthermore, if the plastic has a high vibration damping property, even if an impact force is generated between the polishing plate and the rough diamond, it can be quickly damped, and the loss of the rough diamond can be more effectively prevented. More preferably, the holder is formed of fiber reinforced plastic (FRP) in order to increase the vibration damping property of the holder and to give the holder strength (rigidity). As a result, bending, twisting, and shaking of the holder can be suppressed, and the rough diamond can be easily held stably.
  As one form of the diamond grinding | polishing apparatus of this invention, it is mentioned that the shape of the said holder is a triangular shape which makes an attachment part and each support part a vertex, respectively.
  As described above, the shape of the holder is not particularly limited as long as it is in a three-point support state between the diamond rough stone and the two support portions in contact with the polishing plate. Examples of the simple shape include a triangle shape, a T shape, and a V shape, and among these, a triangle shape is preferable from the viewpoint of difficulty in deformation (ensuring torsional rigidity). In the case of a triangular shape, in addition to a triangular plate shape, a triangular frame shape having an opening in the center may be used, and the triangular frame shape can reduce the weight.
  As one form of the diamond polishing apparatus of the present invention, the support is a linear guide extending in a direction perpendicular to the polishing surface of the polishing plate. Further, the holder is composed of a parallel leaf spring attached in a direction parallel to the polishing surface of the polishing plate, is supported so as to be movable along the linear guide, and has a mounting portion for attaching the rough diamond on the tip side. It is done.
  When using a cube or rectangular parallelepiped artificial diamond with a fixed size and shape for the rough diamond and polishing the surface of the diamond or re-grinding the rake face of the diamond tool's cutting edge, the polished surface of the holder and rough diamond The rough is held in the holder so that the two are parallel. In the case of the configuration described above, the height of the parallel leaf spring is adjusted by the linear guide, and the polished surface of the diamond raw stone is brought into contact with the polished surface of the polishing plate in parallel. The parallel leaf spring has a function to keep the angle of the mounting portion with respect to the polishing plate (polishing surface) constant even when the contact pressure between the diamond raw stone and the polishing plate is bent. The polishing process can be performed at a predetermined contact pressure while maintaining the angle of the polished surface (contact surface) of the rough diamond.
  One embodiment of the diamond polishing apparatus of the present invention includes a rocking means for rocking the rough diamond in the radial direction with respect to the polishing plate.
  According to this configuration, during the polishing process, by swinging the rough diamond in the radial direction of the polishing plate (direction from the center of the polishing plate toward the outer periphery), only the same region of the polishing surface of the polishing plate may be worn away. Therefore, the polishing efficiency can be increased and the life of the polishing plate can be extended.
  One embodiment of the diamond polishing apparatus of the present invention includes a processing pressure adjusting means for adjusting the contact pressure of the diamond raw stone with respect to the polishing plate.
In rough finishing in the initial stage and intermediate finishing in the intermediate stage, processing is performed at a large contact pressure that uses a diamond loose abrasive together to form a polishing streak, thereby improving the processing speed and making minute facets. In the final formation and final precision finishing, it is necessary to reduce the contact pressure and perform high-precision processing. According to the configuration described above, when a sufficient contact pressure cannot be obtained, a predetermined contact pressure can be obtained by adjusting the contact pressure by the processing pressure adjusting means. It is preferable that the processing pressure adjusting means is configured to be able to arbitrarily change the pressure applied to the contact surface of the diamond raw stone attached to the attachment portion of the holder when the diamond raw stone and the polishing plate are in contact with each other. Furthermore, it is more preferable that the impact is attenuated when the holder receives an impact via the rough diamond. As the processing pressure adjusting means, it is possible to use an air cylinder (damper) having high impact attenuation, for example, using compressed air, but for a simpler configuration, an elastic material such as a spring or rubber is used. It can also be realized by using a tensile force. For example, a helical spring made of resin with high impact damping due to internal friction is attached to the holder, and the tension of the spring is applied in the direction in which the rough diamond comes into contact with the polishing plate, so that the desired contact pressure can be obtained. The contact pressure is adjusted by setting. Furthermore, by attaching an impact absorbing material made of, for example, rubber, gel, elastomer or the like to a place where the end of the spring is fixed, a higher damping property can be provided. At that time, the natural frequency ((1 / 2π) x (k / M) 1/2 , k: spring constant [N / m], M: total inertia mass of the holder [kg]) is the loss coefficient of the shock absorber. By setting the spring constant so as to be in a high band, the impact attenuation can be enhanced. Moreover, it is possible to use the repulsive force of the magnet instead of using the tensile force of the spring or rubber. Since the lower limit of the contact pressure that can be applied to the rough diamond is determined by the total weight (total inertial mass) of the holder including the member attached to the holder, the weight of the member used for the processing pressure adjusting means is lighter than the holder. It is preferable. Furthermore, since it is lightweight, it is easy to obtain the effect of releasing the impact force generated between the polishing plate and the diamond rough as described above by the displacement of the holder. Such adjustment of the processing pressure by the processing pressure adjusting means promotes the processing speed by adjusting the contact pressure to be higher in rough and intermediate finishing, while reducing the contact pressure in precision finishing. To prevent chipping of the cutting edge and improve machining accuracy.
  An embodiment of the diamond polishing apparatus of the present invention includes a polishing plate support base that supports a polishing plate at the top, a work table to which the polishing plate support base and the support are attached, and the polishing surface of the polishing plate is an operator It is mentioned that it is higher than the upper surface of the work table so as to match the height of the eyes.
  In a conventional diamond polishing apparatus (see, for example, FIG. 1 of Patent Document 1 and FIG. 7 of Patent Document 2), a polishing plate is attached to the upper surface of a work table (table). A polishing plate is arranged below the eye level. Therefore, it is difficult to observe the contact state of the rough diamond contacting the polishing plate visually or with a loupe from the side of the work table. According to the configuration described above, the polishing plate is placed at a position higher than the upper surface of the work table by the polishing plate support, and the polishing surface of the polishing plate is higher than the upper surface of the work table so as to match the eye level of the operator. Since it is in the position, it is possible to observe the contact state of the rough diamond stone with the polishing plate without being interfered with the work table. For this reason, it is easy to set the rough diamond surface to the polished surface of the polishing plate, improve work efficiency, and reduce the risk of loss of the rough diamond (diamond tool edge) during setting. can do. Specifically, the polishing surface of the polishing plate is raised by, for example, 10 cm to 40 cm higher than the upper surface of the work table.
  As an embodiment of the diamond polishing apparatus of the present invention, the support includes a rocking means for rocking the diamond rough in the radial direction with respect to the polishing plate, and is provided between the support or the polishing plate support and the work table. In other words, it is possible to provide a mounting base whose angle can be adjusted so that the rocking vector of the rough diamond and the polishing surface of the polishing plate are parallel to each other.
  If there is an error in the motion accuracy of the rocking means for rocking the rough diamond, or if the upper surface of the work table to which the support is attached is deformed due to bending or the like, the rocking vector of the rough diamond and the polishing surface May not be parallel to each other. If the polishing operation is performed while rocking the rough diamond in such a state, a moving component in a direction perpendicular to the polishing surface is generated in the rocking motion of the rough diamond. For this reason, when the diamond raw stone bites into the polishing plate excessively, the diamond raw stone is chipped or an error occurs in the angle setting of the diamond raw stone with respect to the polishing plate.
  According to the above-described configuration, by attaching the support body having the swinging means to the upper surface of the mount base capable of adjusting the angle, even if the swing vector of the diamond rough stone and the polished surface are not parallel, By adjusting the angle, it is possible to keep the rocking vector of the diamond rough parallel to the polished surface. The installation base may be provided so as to cover the entire upper surface of the work table (excluding the mounting position of the polishing plate support base), or may be provided only at the mounting position of the support body (that is, directly below the support body). . In the latter case, the installation base may be provided integrally with the support. Alternatively, a polishing table may be provided at the mounting position of the polishing plate support, and the angle of the mounting table may be adjusted so that the polishing surface is parallel to the rocking vector of the diamond raw stone.
  By the way, conventionally, in a diamond polishing apparatus using a cast iron polishing plate, an apparatus capable of correcting the polishing surface of the polishing plate on a real machine by dry cutting has been proposed. For example, the above-described polishing apparatus described in Patent Document 2 includes correction means (such as a bite) for correcting the polishing surface of the polishing plate on an actual machine, and cuts the polishing surface of the polishing plate. Similarly, in the diamond polishing apparatus of the present invention, a polishing surface correcting means having a grindstone or a tool for correcting the polishing surface of the polishing plate may be provided separately from the support for supporting the holder for holding the diamond original stone. Good. Thereby, especially when the corrected part of the polishing surface is small, the polishing surface can be corrected on the actual machine without removing the polishing plate from the apparatus, for example. In addition, the case where the corrected part of the polished surface is small is a small scratch that is invisible (scratches of approximately 50 μm or less), and the case where the damage to the extent that the fine finish of the rough diamond stone may be hindered is small. Say.
  The polishing surface correcting means may be attached to the upper surface of the work table or the erection table. Further, the polishing surface correcting means may be provided with rocking means for rocking a cutting tool such as a grindstone or a bite in the radial direction with respect to the polishing plate, similarly to the support. In this case, it is desirable that the rocking means in the polishing surface correcting means rocks with the same vector as the rocking direction of the rocking means for rocking the diamond rough. In other words, it is desirable that the swing vector of a cutting tool such as a grindstone during a grinding surface correction operation matches the rocking vector of the diamond original stone during a diamond rough grinding operation. As a result, the polishing surface correction means is mounted at the same position as the support mounting position before polishing the rough diamond, and the polishing surface is corrected while rocking a cutting tool such as a grindstone. The polished surface is modified to be parallel to the vector. That is, even if the rocking vector of the diamond rough stone and the polished surface are not parallel, the correction of the polishing surface described above can achieve the parallelism of the rocking vector of the diamond rough stone and the polished surface. .
  One embodiment of the diamond polishing apparatus of the present invention is that the polishing plate support is detachably attached to the work table.
  In the present invention, it is necessary to finish the polished surface of the polishing plate to a mirror surface with a surface roughness of 1 μmRa or less, but when the corrected portion of the polishing surface is large, the polished surface of the polishing plate made of hardened steel is mirror-finished by cutting on the actual machine In some cases, it is difficult to finish the film from the viewpoint of workability and practicality. Specifically, for example, when the above polishing surface correcting means is attached to a work table, and the polishing surface is corrected on an actual machine by providing the diamond polishing apparatus with a polishing surface correcting means, the polishing plate is operated with a large torque from the viewpoint of workability. Is preferably rotated. However, since the polishing surface correction means is provided on the actual machine, it is difficult to obtain a large power due to the restriction on the size, and since grinding (polishing) can be performed only with a small torque, the processing speed of the polishing surface is low, There is a problem that the time required for correction becomes long. In addition, the method of providing the polishing surface correction means on the actual machine cannot perform wet processing that requires a large-sized device, so that shavings and abrasive grains are likely to remain on the polishing surface, and the accuracy required for precision finishing It is difficult to obtain a high polished surface. In such a case, it is necessary to remove the polishing plate from the diamond polishing device, attach the polishing plate to a separate grinding device, and correct the polishing surface. For example, in a conventional diamond polishing apparatus, the polishing surface is corrected by scoring while only the polishing plate is removed and the polishing plate is fixed. However, in this method of correcting the polished surface, when the corrected polishing plate is reattached to the diamond polishing apparatus, there is a risk that surface vibration will occur in the rotational movement of the polishing plate. In addition, the case where the corrected part of the polished surface is large means that there are many visible scratches (scratches exceeding approximately 50 μm), which hinder the precision finishing of the rough diamond, such as rough diamond scratches. This refers to the case where some degree of damage is observed.
  According to the above configuration, the polishing plate support including the spindle on which the polishing plate is mounted is removed and attached to the grinding machine, and the polishing plate is rotated in the same manner as when polishing the rough diamond. It is possible to perform swaying (truing) in a wet manner. As a result, the polishing surface of the polishing plate can be finished in a mirror-like and non-smooth state, and the polishing surface of the polishing plate can be polished so that the vibration of the polishing surface is dynamically sub-micron or less. It is possible to suppress the loss of the rough diamond due to the impact caused by the surface wobbling.
  One form of the diamond polishing apparatus of the present invention is that a workbench is provided with a weight member that suppresses vibration.
  According to this configuration, since the weight member is provided on the work table, vibration due to the rotation of the polishing plate can be suppressed. The weight member is preferably formed of a material having a high vibration damping property and a large specific gravity, such as granite, concrete, cast iron or the like. Among them, concrete is advantageous in terms of cost because it is inexpensive.
  In the diamond polishing apparatus of the present invention, the polishing surface of the polishing plate has a surface roughness of 1 μmRa or less, so that the generation of impact force between the polishing plate and the diamond rough can be suppressed. Defects can be prevented.
BRIEF DESCRIPTION OF THE DRAWINGS It is the schematic for demonstrating the structure of the principal part in the diamond grinding | polishing apparatus which concerns on Example 1, (A) is a top view of a holder and a support body, (B) is a side view of a holder and a support body It is. It is the schematic for demonstrating the structure of the other principal part in the diamond polishing apparatus which concerns on Example 1, (A) is a top view of a polishing board and a polishing board support stand, (B) is a polishing board. It is a front view of the polishing plate support. It is the schematic for demonstrating the structure of the other principal part in the diamond grinding | polishing apparatus which concerns on Example 1, (A) is a front view of a worktable, (B) is a side view of a worktable. . It is a model top view for demonstrating the angle adjustment method with respect to the grinding | polishing board (polishing surface) of a rough diamond. It is a model side view for demonstrating the angle adjustment method with respect to the grinding | polishing board (polishing surface) of a rough diamond. It is a model rear view for demonstrating the angle adjustment method with respect to the grinding | polishing plate (polishing surface) of a rough diamond. It is a schematic diagram of the surface to be polished for explaining an angle adjustment method for the diamond rough stone with respect to the polishing plate (polishing surface). It is a schematic top view which shows another example of a holder. It is a model front view for demonstrating the grinding | polishing surface correction means with which the diamond grinding | polishing apparatus which concerns on the modification 3 is equipped. It is a schematic diagram for demonstrating the diamond grinding | polishing apparatus which concerns on Example 2, (A) is a top view of an apparatus, (B) is a front view of an apparatus. It is a schematic front view for demonstrating the case where the rocking | fluctuation vector of a diamond original stone and a grinding | polishing surface are not parallel in a diamond grinding | polishing apparatus. It is a schematic diagram for demonstrating the diamond grinding | polishing apparatus which concerns on Example 3, (A) is a front view of an apparatus, (B) is a top view of an apparatus. It is a model front view for demonstrating the diamond grinding | polishing apparatus which concerns on the modification 4. It is a model front view for demonstrating the diamond grinding | polishing apparatus which concerns on the modification 5. FIG.
  Embodiments of the present invention will be described below with reference to the drawings. In each figure, the same reference numerals are used for the same or corresponding members.
<Example 1>
(Holder and support)
FIG. 1 is a diagram illustrating a holder 10 and a support that are the main parts of the diamond polishing apparatus according to the first embodiment. The holder 10 is a member that holds a rough diamond to be polished in contact with a polishing surface 41 of a polishing plate 40 described later, and the support is a member that supports the holder 10.
  In this example, the support is a screw base (guide pin base) 20 on which two screws (guide pins) 21A and 21B are erected. In addition, the holder 10 has two support portions 11A and 11B supported by two screws 21A and 21B erected on the screw base 20, and a mounting portion 12 for attaching a rough diamond (not shown) to the tip side. Have. The holder 10 can adjust the axial position of the support portions 11A and 11B with respect to the screws 21A and 21B by rotating the screws 21A and 21B.
  In the holder 10, a mounting tool 120 for mounting the rough diamond is fixed to the mounting portion 12 with screws, and through holes through which the screws 21A and 21B are inserted are formed in the support portions 11A and 11B, respectively. Nuts that are screwed into the respective screws 21A and 21B are embedded in the holes. Further, nuts 22 are arranged on the upper surfaces of the respective support portions 11A and 11B. The nuts 22 are screwed into the respective screws 21A and 21B, and the positions of the respective support portions 11A and 11B are adjusted by the respective screws 21A and 21B. Later, it acts as a double nut to prevent loosening. The rough diamond is attached to the attachment 120 while being held by a holder such as a base metal or a shank, and is attached to the attachment portion 12 by fixing the holder to the attachment 120 with a screw.
  Further, as shown in FIG. 1 (A), the holder 10 is a triangular frame having apexes at the attachment portion 12 and the support portions 11A and 11B, and specifically, the support portions 11A and 11B. Are formed in the shape of an isosceles triangle with the frame as a base. The holder 10 is made of plastic, and is specifically formed of a fiber reinforced phenol resin.
  The screw base 20 is supported on the upper part of the holder support base 30. The screw base 20 is provided with two V-shaped grooves 24 (see FIG. 1 (B)) for preventing displacement of the screws 21A and 21B in the swinging direction. The tip of is touching. The apex angle of the groove 24 has an angle more than double the screw tip angle so as not to interfere with the screw tip. As shown in FIG. 1B, the holder support base 30 includes a base 32 provided with a magnet base 31 at the base, and a slide base 33 slidably mounted on the base 32 in a horizontal direction. The screw base 20 is fixed on the slide base 33. Further, the holder support base 30 has a swinging motor 35, a crank 36 is attached to the rotating shaft of the motor 35, and the slide base 33 and the crank 36 are connected via a connecting rod 37. Then, by driving the motor 35 and rotating the crank 36, the slide base 33 can be slid in the front-rear direction via the connecting rod 37, so that the holder 10 can be removed from the support portion 11 on the base end side. It can be swung in the direction of the attachment portion 12 on the distal end side. The holder support base 30 is fixed to the upper surface of a worktable 60 described later by the magnetic force of the magnet base 31, and is detachably attached.
  As shown in FIG. 1 (A), the holder 10 has two first protrusions 13 projecting outward from the side surfaces of the frames connecting the mounting portion 12 and the support portions 11A and 11B. Two second protrusions 23 are provided on the slide base 33 in parallel with the first protrusions. A rough diamond or diamond held by the holder 10 is polished by attaching a vibration-damping rubber or a tension spring (not shown) between the first protrusion 13 and the second protrusion 23. A tensile force can be applied in the direction of contact with the plate 40, and a processing pressure adjusting means for adjusting the contact pressure of the rough diamond with respect to the polishing plate 40 can be configured. The rubber or spring used for the processing pressure adjusting means may be lighter than the holder 10.
(Polishing plate and polishing plate support)
FIG. 2 is a view showing a polishing plate 40 and a polishing plate support 50 which are the main parts of the diamond polishing apparatus according to the first embodiment.
  The polishing plate 40 has a polishing surface 41 on the upper surface, and the polishing surface 41 is mirror-finished. The surface roughness of the polished surface 41 is 1 μmRa or less, preferably 0.3 μmRa or less, and the polishing plate 40 is made of S45C carbon steel. The polishing plate 40 is supported on the upper portion of the polishing plate support 50.
  The polishing plate support 50 includes a spindle 51 fixed to the center of the polishing plate 40, a bearing 52 that rotatably supports the spindle 51, and a drive pulley 53 connected to the spindle 51. Integrated with 40. The polishing plate 40 is fixed to the upper end of the spindle 51, and the drive pulley 53 is connected to the lower end of the spindle 51. The bearing 52 is an air bearing. The drive pulley 53 is connected to a pulley attached to a rotating shaft of a polishing plate drive motor, which will be described later, by a belt. The polishing plate support 50 is fixed to the upper surface of a work table 60 described later by bolts 55 and is detachably attached. Further, the polishing plate support 50 is provided with a handle 54 to facilitate carrying of the removed polishing plate support 50. It is also possible to use a built-in motor spindle in which the spindle and the drive motor are integrally formed.
(Workbench)
FIG. 3 is a view showing a work table 60 that is a main part of the diamond polishing apparatus according to the first embodiment. In this figure, a state in which the polishing plate support 50 is attached to the work table 60 is shown. The work table 60 is attached with a holder support table 30 that supports the screw table 20 on the upper side (see FIG. 1) and a polishing plate support table 50. As shown in FIG. 1, the holder support 30 is attached to a position where the rough diamond held by the holder 10 contacts the polishing surface 41 of the polishing plate 40. The holder 10 is in a state where it is supported at three points by the rough diamond contacted with the polishing plate 40 and the two support portions 11A and 11B supported by the screws 21A and 21B. Further, the polishing surface 41 of the polishing plate 40 supported on the upper portion of the polishing plate support 50 is positioned higher than the upper surface of the work table 60 so as to match the eye level of the operator. Specifically, the polishing surface 41 of the polishing plate 40 is higher than the upper surface of the work table in a range of 10 cm to 40 cm. Further, in this example, two polishing plate support bases 50 are attached to the work table 60.
  The work table 60 is provided with a weight member (not shown) that suppresses vibrations. In this example, a concrete block is disposed inside the work table 60, and this is used as a weight member. Further, the above-described polishing plate drive motor 65 is attached to the work table 60, and the polishing plate 40 is rotated via the spindle 51 by rotating the driving pulley 53 of the polishing plate support table 50 in conjunction with the motor 65. Is rotated horizontally (see FIG. 2).
  The diamond polishing apparatus according to Example 1 described above has the following effects.
  (1) Since the polishing surface 41 of the polishing plate 40 has a surface roughness of 1 μmRa or less, vibration generated by polishing is reduced, and the impact force generated between the polishing plate 40 and the rough diamond can be reduced. Therefore, it is possible to prevent the loss of the raw diamond. In addition, the contact area between the rough diamond and the polishing plate 40 increases, heat generation due to frictional resistance increases, and the processing speed of the rough diamond can be improved.
  (2) The holder 10 is shaped to be in a three-point support state with the diamond rough stone contacting the polishing plate 40 and the two support portions 11A and 11B, and each of the support portions 11A and 11B is supported by the screws 21A and 21B. Since the axial position with respect to the screws 21A and 21B can be adjusted independently, the angle (pitch angle and bank angle) of the rough diamond mounted on the mounting portion 12 of the holder 10 with respect to the polishing plate 40 (polishing surface 41) can be adjusted. It can be adjusted arbitrarily.
  (3) Since the holder 10 is made of plastic (a fiber reinforced phenol resin) and is lightweight, the inertial mass of the holder 10 is small. Therefore, when an impact due to a cause that cannot be completely suppressed (a minute foreign matter adheres to the polishing surface 41 of the polishing plate 40 during the polishing process), the mounting portion 12 of the holder 10 moves away from the polishing plate 40. By displacing (escape) in the direction (upward), the impact received by the rough diamond can be absorbed and relaxed. Also, because the holder 10 has a high thermal resistivity (low thermal conductivity), the heat generated in the rough diamond is difficult to escape through the holder 10, increasing the temperature of the rough diamond and promoting polishing due to thermal wear. Can do. Furthermore, the vibration damping property of the holder 10 is high, the generation of impact force between the polishing plate 40 and the rough diamond can be further suppressed, and the loss of the rough diamond can be more effectively prevented.
  (4) Since the holder 10 has a triangular shape, the torsional rigidity is high and the holder 10 is not easily deformed during polishing.
  (5) The slide base 33 to which the screw base 20 is fixed is slidable in the front-rear direction, and the holder 10 can be swung in the direction from the support portion 11 on the proximal end side to the attachment portion 12 on the distal end side. The rough diamond attached to the attachment portion 12 can be swung in the radial direction with respect to the polishing plate 40. As a result, it is possible to prevent only the same region of the polishing surface 41 of the polishing plate 40 from coming into contact with the diamond raw stone and wear away, thereby increasing the polishing efficiency and extending the life of the polishing plate 40.
  (6) By providing a processing pressure adjusting means for adjusting the contact pressure of the rough diamond stone with respect to the polishing plate 40, sufficient contact pressure can be obtained only with the holder 10 own weight (including the mounting tool 120, the rough diamond stone and its holder). When it cannot be obtained, a predetermined contact pressure can be obtained by adjusting the contact pressure with the processing pressure adjusting means. In addition, the processing pressure adjustment means uses a spring or rubber tensioning force with high vibration damping properties, so that a predetermined contact pressure can be obtained, but an impact due to a cause that cannot be completely suppressed as described above occurs. When this is done, it is possible to obtain an effect of absorbing and mitigating the impact received by the rough diamond. Further, since the rubber and spring used for the processing pressure adjusting means are lighter than the holder 10, the total weight (inertial mass) of the holder 10 can be kept relatively small.
  (7) Since the polishing surface 41 of the polishing plate 40 is positioned higher than the upper surface of the work table 60 so as to match the eye level of the operator, the contact state between the polishing plate 40 and the rough diamond is determined by the work table. It can be observed with a loupe from the side without being interfered by 60. For this reason, it is easy to face the rough diamond, work efficiency can be improved, and the risk of loss of the rough diamond (the cutting edge of the diamond tool) during setting can be reduced.
  (8) Since the polishing plate support 50 for supporting the polishing plate 40 is detachably attached to the work table 60, the polishing plate 40 is mounted when the polishing surface 41 of the polishing plate 40 is mirror-finished again. It is possible to remove the polishing plate support 50 including the spindle 51 and wet-grind the polishing surface 41 of the polishing plate 40 using a separate grinding machine. Thereby, the polished surface 41 can be finished to a mirror surface with a surface roughness of 1 μmRa or less.
  (9) Since the weight member of the concrete block is arranged inside the work table 60, vibration due to the rotation of the polishing plate 40 can be suppressed. Moreover, concrete has high vibration damping properties and is advantageous in terms of cost.
  (10) A plurality of (two) polishing plate support bases 50 are attached to the work table 60. By attaching the holder support base 30 to each polishing plate 40, each polishing plate 40 polishes the rough diamond stone. It is also possible to polish a plurality of diamond rough stones at the same time.
  In addition, since the holder support base 30 can be easily attached to and detached from the work table 60 by the magnetic force of the magnet base 31, the orientation of the holder 10 with respect to the polishing plate 40 can be appropriately changed. Further, by attaching a plurality of holders 10 (holder support table 30) to one polishing plate 40 (polishing plate support base 50), it is possible to simultaneously polish a plurality of diamond rough stones.
  Next, FIGS. 4 to 6 show a specific method for adjusting the angle of the diamond raw stone with respect to the polishing plate in the case of using a holder that is supported at three points by the diamond raw stone in contact with the polishing plate and the two support portions. It explains using.
  FIG. 4 is a schematic view of the holder 10 in which the support portions 11A and 11B are supported by the screws 21A and 21B and the rough diamond 100 is attached to the attachment portion 12 as viewed from above. FIG. 5 is a schematic view seen from the support portion 11B side to the support portion 11A side when the rough diamond 100 attached to the attachment portion 12 of the holder 10 shown in FIG. 4 is in contact with the polishing surface 41 of the polishing plate 40. is there. FIG. 6 shows the direction from the support portions 11A and 11B to the attachment portion 12 side when the rough diamond 100 attached to the attachment portion 12 of the holder 10 shown in FIG. 4 is in contact with the polishing surface 41 of the polishing plate 40. It is the seen schematic diagram.
  At this time, the length from the lower end of the screw 21A to the lower surface of the holder 10 is a (see FIG. 6), the length from the lower end of the screw 21B to the lower surface of the holder 10 is b (see FIG. 6), and the polished surface 41 of the rough diamond 100 is The distance from the contact surface (contact point) to the lower surface of the holder 10 is c (see FIG. 5), and the support portion (through hole) 11A through which the screws 21A and 21B are inserted from the mounting position of the rough diamond 100 on the lower surface of the holder 10 The length of the perpendicular line drawn to the line segment AB connecting the centers A and B of 11B is d (see Fig. 4), the length from the intersection D to A of this perpendicular line and the line segment AB is e, and the distance between AB is L, and the distance from the surface of the screw base 20 with which the lower ends of the screws 21A and 21B abut to the polishing surface 41 is g (see FIG. 5).
  Further, when the lower surface of the holder 10 is parallel to the polishing surface 41 of the polishing plate 40, the vector B → A direction from B to A is parallel to the vector perpendicular to the line segment AB on the lower surface of the holder 10 along the X axis. The direction toward the rough diamond 100 side is defined as the Y-axis, the X-axis and the Y-axis being perpendicular, and the direction from the rough diamond 100 toward the polishing plate 40 is defined as the Z-axis.
  The angle of the lower surface of the holder 10 can be defined by a direction cosine of a unit vector in a direction perpendicular to the lower surface of the holder 10. The direction cosine is a series of operations in which the bottom surface of the holder 10 and the polishing surface 41 are parallel to each other in the initial state (001), and this is first rotated by the angle φ with respect to the Y axis and then rotated by the angle θ with respect to the X axis. It is expressed by the assumption (θ, φ). The angle θ is the pitch angle, and the angle φ is the bank angle.
  As shown in FIG. 5 and FIG. 6, when the lower ends of the screws 21A and 21B are in contact with the screw base 20 and the rough diamond 100 is in contact with the polishing plate 40, the bank angle φ is Can be expressed as:
  On the other hand, the height of the intersection D between the perpendicular line and the line segment AB from the mounting position of the rough diamond 100 on the lower surface of the holder 10 to the line segment AB, from the surface of the screw base 20 and from the polishing surface 41 The following equation (2) can be obtained by connecting the two cases with equal signs.
  When the both sides of the above formula 2 are squared and summarized by tan θ, the following formula 3 is obtained.
  If the equation of the above equation 3 is solved for tan θ and defined as the following equation 4, the pitch angle θ becomes the following equation 5.
  According to the above formulas 1 and 2, the dimensions of the holder 10, the position of the rough diamond, and the lengths of the screws 21A and 21B from the lower surface of the holder 10 to the lower end projecting from the bottom (that is, the support portion 11A) , 11B adjustment position), the value of (θ, φ) that defines the angle of the lower surface of the holder 10 can be obtained.
  It is necessary to adjust the actual angle of the holder 10 with respect to the rough diamond 100 attached to the attachment portion 12 of the holder 10. Actually, since the angle of the rough diamond 100 with respect to the holder 10 is slightly different, after adjusting the angle of the rough diamond 100 by visual observation to some extent, trial grinding is performed, and the trial polished surface with respect to the target surface of the rough diamond 100 is polished. It is necessary to make fine adjustments to obtain an optimum angle while evaluating the position and angle. At this time, if the adjustment amounts of a and b for rotating at an arbitrary angle with respect to the polishing surface 41 are known, the angle adjustment of the rough diamond 100 becomes easy.
  As shown in FIG. 7, when the center of the surface to be polished is O ′, the portion polished by trial polishing is P, and the direction of O′P is expressed by Θ with respect to the X axis, it passes through O ′ and O ′. Consider adjusting the surface to be polished (surface to be polished) of the diamond rough by rotating ΔP about the axis perpendicular to P in the direction of moving away from the polishing plate. In order to express the change of Θ and ΔΨ by the change amounts Δa and Δb of a and b, first, the pitch angle θ ′ and the bank angle φ ′ after changing the angle due to Θ and ΔΨ are changed to θ before changing. , Φ and Θ, ΔΨ.
The unit vector of the rotation axis of the tilt angle in the O′P direction is a vector obtained by rotating the vector O′P by π / 2 radians with the Z axis as the rotation axis, and expressed as Θ, (cos (Θ + π / 2), sin (Θ + π / 2), 0). If the rotation matrix R Θ (ΔΨ) is expressed by the Rodriguez formula for obtaining a rotation matrix for an arbitrary axis, it can be expressed as the following formula 6.
Further, a rotation matrix R x (θ) R y (φ) representing an operation of rotating about φ around the Y axis and then rotating about θ about the X axis can be expressed as the following Expression 7.
  The pitch angle and bank angle (θ ′, φ ′) of the lower surface of the holder when the orientation of the lower surface of the holder at the angle of (θ, φ) is further rotated by the angle ΔΨ in the Θ direction can be expressed by the following equation (8). .
  From the above equation (8), (θ ′, φ ′) can be expressed by the following equation 9.
  If the lengths a ′ and b ′ from the lower surface of the holder 10 of the screws 21A and 21B at this time to the lower end protruding from the (θ ′, φ ′) are obtained, the following formula 10 is obtained.
From the difference between a ′ and b ′ obtained in this way and the lengths a and b extending from the lower surface of the holder 10 of the screws 21A and 21B before adjusting the angle, rotation of R Θ (ΔΨ) The change amounts Δa = a′−a and Δb = b′−b of a and b corresponding to can be obtained.
  Based on the above algorithm, the angle of the surface to be polished is determined based on the shape of the rough diamond with respect to the lower surface of the holder measured using, for example, a non-contact optical three-dimensional measuring machine, and a, b By adjusting the length or the amount of change of Δa and Δb, a polished surface having a predetermined angle can be obtained. In particular, it is effective when natural diamond having a constant size and shape is used as a rough diamond or when facets are formed on a rough diamond.
  In addition, if a calculation procedure is set in the program based on the above algorithm, the calculation can be automatically executed and the angle adjustment of the rough diamond can be easily performed.
<Modification 1>
In the first embodiment described above, the case where the triangular holder 10 is used as shown in FIG. 1A has been described, but the shape of the holder 10 is, for example, T-shaped as shown in FIG. Can do.
  The holder 10 shown in FIG. 8 has two support portions 11A and 11B supported by two screws 21A and 21B, and a mounting portion 12 for attaching a rough diamond (not shown) on the tip side. It is the same as Example 1, and is a shape which becomes a three-point support state with the diamond original stone and two support parts which contact a polishing board. The holder 10 has a frame extending in the orthogonal direction from the center of the frame connecting the support portions 11A and 11B, and the tip of the frame 10 is an attachment portion 12.
<Modification 2>
In the above-described first embodiment, the case where the tensile force of rubber or spring having high vibration damping property is used as the processing pressure adjusting means for adjusting the contact pressure of the rough diamond stone with respect to the polishing plate is described. The repulsive force of the magnet can be used.
  For example, a magnet is attached to the upper surface of the holder via an impact absorbing material (eg, rubber, gel, elastomer, etc.), and another magnet that repels the magnet is fixed on an appropriate base and arranged above it. The processing pressure adjusting means is configured by applying a repulsive force in a direction in which the raw stone is brought into contact with the polishing plate. The magnet attached to the holder may be lighter than the holder.
<Modification 3>
In the first embodiment described above, as shown in FIG. 2B, the polishing plate support 50 for supporting the polishing plate 40 is detachably attached to the upper surface of the work table 60, and the polishing surface 41 of the polishing plate 40 is corrected. In this case, the case where the polishing plate support 50 is removed from the apparatus (work table 60) and the polishing surface 41 is corrected using a separate grinding machine has been described. If the damage to the polishing surface is small (eg, scratches present on the polishing surface are 50 μm or less), instead of this, for example, as shown in FIG. 9, polishing surface correction means for correcting the polishing surface 41 of the polishing plate 40 90 may be provided in the apparatus, and the polishing surface 41 may be simply corrected on an actual machine.
  In this example, the polishing surface correcting means 90 includes a grindstone 91 that grinds the polishing surface 41 of the polishing plate 40, a grindstone holding portion 92 that holds the grindstone 91 on the polishing surface 41, and the grindstone holding portion 92 at the top. And a grindstone support base 93 to support. As in the case of the holder support base 30 of the first embodiment shown in FIG. 1, the grindstone support base 93 is mounted on a base 932 having a magnet base 931 at the base and slidable in the horizontal direction on the base 932. And a grindstone holding portion 92 is fixed on the slide base 933. The grindstone holding part 92 has an arm 921 extending in the horizontal direction toward the polishing surface 41, and a grindstone mounting tool 922 for mounting the grindstone 91 is provided on the tip side thereof. The grindstone 91 is held on the polishing surface 41. The grindstone 91 is a cup-type grindstone, but it is also possible to use a flat grindstone in addition to the cup-type grindstone. Also, the grindstone support base 93 can slide the slide base 933 in the front-rear direction by a swinging means (not shown) such as a swinging motor, like the holder support base 30 of the first embodiment. Thereby, the grindstone holding portion 92 can be swung in the longitudinal direction of the arm 921. That is, the grindstone 91 attached to the grindstone fixture 922 of the grindstone holding portion 92 (arm 921) can be swung in the radial direction with respect to the polishing plate 40 (indicated by the white arrow in FIG. 9). Further, the grindstone fixture 922 is provided with a rotating means (not shown) such as a rotation motor that rotates the grinding surface of the grindstone 91 that contacts the polishing surface 41 of the polishing plate 40. It is possible to rotate (indicated by black arrows in FIG. 9). The grindstone support base 93 is fixed to the upper surface of the work table 60 by the magnetic force of the magnet base 931 and is detachably attached in the same manner as the holder support base 30 of the first embodiment.
  In the diamond polishing apparatus, when the polishing surface 41 of the polishing plate 40 needs to be corrected, the polishing surface correction means 90 is attached to the work table 60, and the grindstone 91 is rotated while the polishing plate 40 is rotated. The polishing surface 41 is corrected while rocking. Accordingly, the polishing surface 41 can be corrected on the actual machine without removing the polishing plate 40 and the polishing plate support base 50 from the work table 60, and high-precision correction with little surface runout is possible.
<Example 2>
The diamond polishing apparatus according to the second embodiment shown in FIG. 10 differs from the configuration of the diamond polishing apparatus according to the first embodiment shown in FIG. Now, the differences will be mainly described.
  In this example, the support is a linear guide 80 extending in a direction perpendicular to the polishing surface 41 of the polishing plate 40. The holder includes a parallel leaf spring 70 attached in parallel to the polishing surface 41 of the polishing plate 40. The holder 12 is supported movably along the linear guide 80, and attaches the rough diamond 100 to the tip side. Have A fixture 120 for attaching the rough diamond 100 is fixed to the attachment portion 12. Here, the diamond original stone 100 is attached to the attachment portion 12 by fixing the shank 111 of the diamond tool 110 with the diamond original stone 100 fixed to the shank 111 to the fixture 120 with screws.
  The parallel leaf spring 70 is composed of a pair of leaf springs 71 arranged in parallel with each other at a predetermined interval, and both the leaf springs 71 are connected to each other by spacers 72 at both ends. Each plate spring 71 is made of spring steel. As shown in FIG. 10B, the linear guide 80 is provided with a magnet base 31 at the base, fixed to the upper surface of the work table 60 by the magnetic force of the magnet base 31, and detachably attached.
  As in Example 1, the polishing plate 40 has a surface roughness of the upper polishing surface 41 of 1 μmRa or less. The polishing plate 40 is detachably attached to the work table 60 and supported by the polishing plate support table 50, and the polishing surface 41 of the work table 60 is adjusted so that the polishing surface 41 of the polishing plate 40 matches the eye level of the operator. Located higher than the top surface.
  When polishing using this diamond polishing apparatus, the height of the parallel leaf spring 70 is adjusted by the linear guide 80, and the polished surface of the rough diamond 100 of the diamond tool 110 held by the parallel leaf spring 70 is polished. The plate 40 is fixed at a position in contact with the polishing surface 41. The parallel leaf spring 70 has a function of keeping the angle of the mounting portion 12 with respect to the polishing plate 40 (polishing surface 41) constant even when the contact pressure between the diamond rough stone 100 and the polishing plate 40 is bent. By using the leaf spring 70, it is possible to perform polishing with a predetermined contact pressure while maintaining the angle of the surface to be polished (contact surface) of the rough diamond 100.
  The diamond polishing apparatus according to Example 2 described above is effective when the raw diamond is an artificial diamond having a constant size and shape, or when re-polishing a diamond tool (especially a rake face). Further, in the diamond polishing apparatus according to the above-described second embodiment, when sufficient contact pressure cannot be obtained, for example, a weight is placed on the parallel leaf spring, or the rubber described in the first and second modifications is used. The contact pressure may be adjusted by the processing pressure adjusting means by using the tension force of the spring or the repulsive force of the magnet.
<Example 3>
In the first embodiment described above (see FIG. 1 in particular), for example, the holder support base 30 (swinging means) capable of swinging the holder 10 (raw diamond) with respect to the polishing plate 40 in the radial direction by the slide base 33. ) Has been described. In Example 3, with reference to FIG. 12, when the rocking vector of diamond diamond (indicated by the white arrow in FIG. 12) and the polished surface 41 are not parallel, means for adjusting both to be parallel A diamond polishing apparatus comprising: First, prior to the description of the diamond polishing apparatus according to the third embodiment, with reference to FIG. 11, a specific example in the case where the rocking vector of the diamond raw stone and the polishing surface are not parallel will be described.
  FIG. 11 shows a state in which the holder support 30 is attached to the polishing plate 40 on the work table 60 to which the polishing plate support 50 is attached. In FIG. 11, the members such as the holder 10 and the holder support base 30, the polishing plate 40 and the polishing plate support base 50, and the work table 60 are the same as those described in the first embodiment with reference to FIGS. There is a simplified illustration (this is the same in FIGS. 12 to 14 described later). In the diamond polishing apparatus, as shown in FIG. 11, when the upper surface of the work table 60 to which the holder support base 30 is attached is inclined due to deformation or the like, this causes the swing vector of the rough diamond 100 (white in FIG. 11). (Shown by a blank arrow) may not be parallel to the polishing surface 41. Further, the rocking vector of the rough diamond 100 may not be parallel to the polishing surface 41 due to the design error or assembly error of the holder support 30. Thus, when the rocking vector of the rough diamond 100 is not kept parallel to the polishing surface 41, when the rough diamond 100 is swung, the angle of the rough diamond 100 with respect to the polishing surface 41 varies due to the movement. It will be. If such fluctuations occur during the formation of the cutting edge of the rough diamond 100, the cutting edge may excessively cut into the polishing plate 40, and one or both of the rough diamond 100 and the polishing plate 40 may be damaged.
  In the diamond polishing apparatus according to the third embodiment, for example, as shown in FIG. 12, a mounting base 66 capable of adjusting the angle is provided between a support body (holder support base 30) for supporting the holder 10 and the work table 60. A holder support 30 is attached to the upper surface of 66.
  In this example, the installation base 66 is sized to surround the outer periphery of the polishing plate 40, and a through hole 66o into which the polishing plate support base 50 is inserted is formed at the center thereof. The installation base 66 has three leg portions 67, and the height of each leg portion 67 is adjustable. Then, by installing the installation table 66 on the upper surface of the work table 60 and adjusting the height of each leg 67, it is possible to adjust the angle of the upper surface of the installation table 66 on which the holder support table 30 is supported. is there. Thereby, it is possible to adjust the swing vector (indicated by the white arrow in FIG. 12) of the diamond original stone 100 to be parallel to the polishing surface 41.
  Describe specific usage. A displacement meter (not shown) is attached to the attachment portion 12 to which the rough diamond 100 of the holder 10 is attached, the distance d from the polishing surface 41 when the holder 10 is swung is measured, and the fluctuation value Δd is obtained. When the length of the swing vector (the swing distance of the rough diamond 100) is L, the tilt of the swing vector with respect to the polishing surface 41, that is, Δd / L is within a predetermined range (for example, 0.005 or less). Then, the height of each leg 67 is adjusted to adjust the angle of the upper surface of the erection table 66. By performing this operation before grinding the rough diamond, the rocking vector of the rough diamond 100 is made parallel to the grinding surface 41 even if the worktable 60 is deformed or the holder support 30 has a design / assembly error. It is possible to adjust. Therefore, it is possible to avoid damage to one or both of the rough diamond 100 and the polishing plate 40 when the rough diamond 100 is swung.
  Furthermore, by changing the mounting position of the holder support 30 with the displacement meter attached to the holder 10 with respect to the polishing plate 40 (indicated by a two-dot chain line in FIG. 12B), the above operation is performed twice or more. In addition, the swing vector of the rough diamond 100 can be adjusted more accurately and parallel to the polishing surface 41. In this example, the number of the leg portions 67 of the erection table 66 is three. However, if the angle adjustment of the upper surface of the erection table 66 to which the holder support base 30 is attached can be achieved, the number of the leg portions 67 is For example, there may be four, for example.
<Modification 4>
In the above-described third embodiment, the case where the size of the erection table 66 is a size that surrounds the outer periphery of the polishing plate 40 has been described. However, the size of the erection table 66 matches the size of the holder support table 30 to be attached. The size may be different. Specifically, as shown in FIG. 13, the erection table 66 corresponding to the size of the holder support table 30 is installed on the upper surface of the work table 60 only at the mounting position of the holder support table 30. Even in such a configuration, by adjusting the height of each leg 67 and adjusting the angle of the upper surface of the gantry 66, the swing vector of the rough diamond 100 is made parallel to the polishing surface 41. It is possible to adjust so that it becomes. In this case, the erection base 66 may be provided integrally with the holder support base 30.
<Modification 5>
In the third embodiment and the fourth modification described above, as shown in FIG. 12 and FIG. 13, an installation base 66 capable of adjusting the angle is provided between the holder support base 30 and the work base 60, and the rocking vector of the rough diamond 100 is provided. In the above description, the height of each leg 67 is adjusted so that the angle of the upper surface of the erection table 66 is adjusted so that the angle is parallel to the polishing surface 41. Instead, as shown in FIG. 14, for example, the inclination of the polishing surface 41 may be adjusted so that the polishing surface 41 is parallel to the rocking vector of the rough diamond 100.
  In this example, before polishing the rough diamond stone, the polishing surface correcting means 90 described in the modification 3 is attached to the work table 60 at the same position as the mounting position of the holder support table, and the polishing plate 40 is rotated. While the grindstone 91 is rotated and swung, the polishing surface 41 is corrected on the actual machine. In this example, the polishing surface correcting means 90 is attached to the work table 60. However, for example, the polishing surface correcting means 90 may be attached to the upper surface of the erection table 66 described in Embodiment 3 with reference to FIG. Further, for example, as described with reference to FIG. 13 in the fourth modification, the erection table 66 is installed on the upper surface of the work table 60 only at the mounting position of the polishing surface correction means 90, and the polishing surface is corrected on the erection table 66 Means 90 may be attached. At this time, the rocking vector of the grindstone 91 in the polishing surface correcting means 90 is made to coincide with the rocking vector of the diamond raw stone at the time of polishing the raw diamond stone. Specifically, the rocking distance and rocking direction of the grindstone 91 (the horizontal direction with respect to the polishing plate 40 when rocked) are matched with the rocking distance and rocking direction of the diamond raw stone. As a result, the polishing surface 41 is modified so as to be parallel to the rocking vector of the diamond rough during the grinding operation of the diamond rough, so that the rocking vector of the diamond rough is polished during the polishing of the diamond rough. It will be kept parallel to the surface 41. In this case, the installation stand 66 can be omitted.
  In addition, the polishing plate support may be attached to the work table so that the polishing surface is parallel to the rocking vector of the rough diamond. For example, the installation base described in the third embodiment and the fourth modification is provided between the polishing plate support and the work table, and the polishing plate support is attached to the upper surface of the installation table installed on the work table. Even in such a configuration, the polishing surface can be adjusted to be parallel to the rocking vector of the rough diamond by adjusting the angle of the upper surface of the erection table to which the polishing plate support is attached. Is possible.
  The embodiment described above can be modified as appropriate without departing from the gist of the present invention, and the scope of the present invention is not limited to the configuration described above. For example, the material of the polishing plate may be changed as appropriate.
  The diamond polishing apparatus of the present invention can be suitably used for manufacturing diamond tools, for example.
10 Holder
11A, 11B Support section 12 Mounting section 120 Mounting tool
13 First protrusion
20 Screw base (guide pin base)
21A, 21B Screw (guide pin) 22 Nut
23 Second protrusion 24 Groove
30 Holder support
31 Magnet base 32 Mounting base 33 Slide base
35 Oscillating motor 36 Crank 37 Connecting rod
40 Polishing plate
41 Polished surface
50 Polishing plate support
51 Spindle 52 Bearing 53 Drive pulley
54 Handle 55 Bolt
60 workbench
65 Polishing plate drive motor
66 Mounting base 66o Through hole 67 Leg
70 Parallel leaf spring
71 Leaf spring 72 Spacer
80 Linear guide
90 Polishing surface correction means
91 Whetstone
92 Wheel holder
921 Arm 922 Wheel mounting tool
93 Wheel support
931 Magnet base 932 Mounting base 933 Slide base
100 rough diamond
110 diamond tool 111 shank

Claims (10)

  1. A diamond polishing apparatus comprising: a polishing plate having a polishing surface that rotates horizontally; a holder that holds a rough diamond to be polished in contact with the polishing surface of the polishing plate; and a support that supports the holder. Because
    The polishing plate is formed of a metal material selected from a steel material, a molybdenum material, a chromium material, and a tungsten material, and the surface roughness of the polishing surface is 1 μmRa or less,
    The support is a guide pin base on which two guide pins are erected,
    The holder is made of plastic or fiber reinforced plastic, two support parts supported by the two guide pins erected on the guide pin base, an attachment part for attaching the diamond rough stone to the tip side, Have
    The diamond polishing apparatus, wherein an axial position of the support portion with respect to the guide pin is adjustable.
  2. The diamond polishing apparatus according to claim 1 , wherein the shape of the holder is a triangular shape having apexes of the attachment portion and the support portions, respectively.
  3. A diamond polishing apparatus comprising: a polishing plate having a polishing surface that rotates horizontally; a holder that holds a rough diamond to be polished in contact with the polishing surface of the polishing plate; and a support that supports the holder. Because
    The polishing plate has a surface roughness of the polished surface of 1 μmRa or less,
    The support is a linear guide extending in a direction perpendicular to the polishing surface of the polishing plate;
    The holder includes a parallel leaf spring attached in a direction parallel to the polishing surface of the polishing plate, and is supported movably along the linear guide, and has an attachment portion for attaching the rough diamond to the tip side. A diamond polishing machine.
  4. The diamond polishing apparatus according to any one of claims 1 to 3 , further comprising a swinging unit that swings the rough diamond in a radial direction with respect to the polishing plate.
  5. The diamond polishing apparatus according to any one of claims 1 to 4 , further comprising a processing pressure adjusting unit that adjusts a contact pressure of the diamond original stone with respect to the polishing plate.
  6. A polishing plate support for supporting the polishing plate on the top;
    A work table to which the polishing plate support and the support are attached;
    The diamond polishing apparatus according to any one of claims 1 to 5 , wherein the polishing surface of the polishing plate is positioned higher than the upper surface of the work table so that the polishing surface of the polishing plate matches the eye level of an operator. .
  7. The diamond polishing apparatus according to claim 6 , wherein the polishing plate support is detachably attached to the work table.
  8. The diamond polishing apparatus according to claim 6 or 7 , wherein a weight member for suppressing vibration is provided on the work table.
  9. The support includes swinging means for swinging the rough diamond in a radial direction with respect to the polishing plate,
    Between the support or the polishing plate support and the work table, there is provided a mounting table capable of adjusting the angle so that the rocking vector of the diamond raw stone and the polishing surface of the polishing plate are parallel to each other. The diamond polishing apparatus according to any one of claims 6 to 8 .
  10. A diamond polishing apparatus comprising: a polishing plate having a polishing surface that rotates horizontally; a holder that holds a rough diamond to be polished in contact with the polishing surface of the polishing plate; and a support that supports the holder. Because
    A polishing plate support for supporting the polishing plate on the top;
    A work table to which the polishing plate support and the support are attached;
    Rocking means for rocking the rough diamond in the radial direction with respect to the polishing plate;
    The polishing plate has a surface roughness of the polished surface of 1 μmRa or less,
    The polishing surface of the polishing plate is at a position higher than the upper surface of the work table so as to match the eye level of the operator,
    Between the support or the polishing plate support and the work table, there is provided a mounting table capable of adjusting the angle so that the rocking vector of the diamond raw stone and the polishing surface of the polishing plate are parallel to each other. Diamond polishing equipment.
JP2013531329A 2011-08-31 2012-08-28 Diamond polishing equipment Active JP5753268B2 (en)

Priority Applications (4)

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JP2011188847 2011-08-31
JP2011188847 2011-08-31
PCT/JP2012/071707 WO2013031772A1 (en) 2011-08-31 2012-08-28 Diamond polishing device
JP2013531329A JP5753268B2 (en) 2011-08-31 2012-08-28 Diamond polishing equipment

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Application Number Priority Date Filing Date Title
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Publication number Priority date Publication date Assignee Title
JP6487644B2 (en) * 2014-07-02 2019-03-20 東洋製罐グループホールディングス株式会社 Polishing equipment
CN104070428A (en) * 2014-07-17 2014-10-01 哈尔滨工业大学 Device suitable for mechanical blade sharpening of diamond slicing cutter

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Publication number Priority date Publication date Assignee Title
GB1207315A (en) * 1966-12-20 1970-09-30 Spectrum Diamonds Pty Ltd Faceting gem stones
CN2109282U (en) * 1991-08-20 1992-07-08 李正炳 Abrasive device for hard stone material button
JP2794505B2 (en) * 1991-09-20 1998-09-10 孝弘 今橋 Processing pressure control device
US5435774A (en) * 1994-02-04 1995-07-25 Naujok; Robert Apparatus for holding gemstones to be polished
JPH10134316A (en) * 1996-10-24 1998-05-22 Hitachi Metals Ltd Method for working magnetic head
IL147100A (en) * 2001-12-13 2005-12-18 Dialit Ltd System and method for automatic gemstone polishing
CN100400236C (en) * 2002-09-27 2008-07-09 小松电子金属股份有限公司 Polishing apparatus, polishing head, and polishing method
JP4242249B2 (en) * 2003-10-22 2009-03-25 東芝機械株式会社 Diamond processing method and apparatus
CN2721317Y (en) * 2004-09-07 2005-08-31 张革 High-accuracy gravity planar grinding polisher with double rotary oscillation
EP1871571A2 (en) * 2005-03-14 2008-01-02 Israel Diamond Institute A gemstone polishing device and a method of polishing
JP2010058203A (en) * 2008-09-02 2010-03-18 Osg Corp Lapping device for single-crystalline diamond
CN201257619Y (en) * 2008-09-28 2009-06-17 张安 Chucking appliance for grinding diamond
JP5343250B2 (en) * 2009-02-19 2013-11-13 国立大学法人 熊本大学 Catalyst-assisted chemical processing method and processing apparatus using the same
JP5426319B2 (en) * 2009-10-26 2014-02-26 住友電気工業株式会社 Diamond cutting tool and manufacturing method thereof

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WO2013031772A1 (en) 2013-03-07
CN103842131A (en) 2014-06-04
JPWO2013031772A1 (en) 2015-03-23

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