JP5752002B2 - 試験用キャリア - Google Patents
試験用キャリア Download PDFInfo
- Publication number
- JP5752002B2 JP5752002B2 JP2011220358A JP2011220358A JP5752002B2 JP 5752002 B2 JP5752002 B2 JP 5752002B2 JP 2011220358 A JP2011220358 A JP 2011220358A JP 2011220358 A JP2011220358 A JP 2011220358A JP 5752002 B2 JP5752002 B2 JP 5752002B2
- Authority
- JP
- Japan
- Prior art keywords
- test carrier
- region
- film
- base
- die
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
11…収容空間
12…導電路
20…ベース部材
30…ベースフレーム
31…中央開口
32…スルーホール
33…外部端子
40…ベースフィルム
40a…第1の領域
40b…第2の領域
401…外側面
41…配線パターン
42…ベース層
421…開口
43…カバー層
431…開口
44…バンプ
50…カバー部材
60…カバーフレーム
61…中央開口
70…カバーフィルム
80…接着部
81…接着剤
90…ダイ
91…電極パッド
92…エッジ
Claims (5)
- 電子部品の電極に接触する端子を一方の主面に有するフィルム状の第1の部材と、
前記第1の部材に重ねられたフィルム状の第2の部材と、を備え、
前記第1の部材と前記第2の部材との間に前記電子部品を収容する試験用キャリアであって、
前記第1の部材は、
第1の厚さを有する第1の領域と、
前記第1の厚さよりも薄い第2の厚さを有する第2の領域と、を有し、
前記第2の領域は、少なくとも前記電子部品の外周縁の近傍の前記電極に対向する部分及び前記電子部品に対向する領域外に連続して形成され、
前記第1の部材の外側面は、前記第2の領域で内側に向かって凹んでいることを特徴とする試験用キャリア。 - 請求項1に記載の試験用キャリアであって、
前記第2の領域は、前記電子部品の全ての前記電極に対向していることを特徴とする試験用キャリア。 - 請求項1又は2に記載の試験用キャリアであって、
前記第2の領域は、前記第1の部材を他方の主面から薄肉化することで形成されていることを特徴とする試験用キャリア。 - 請求項1又は2に記載の試験用キャリアであって、
前記第1の部材は、
第1の樹脂層と、
前記第1の樹脂層に積層された第2の樹脂層と、を少なくとも有しており、
前記第2の領域は、前記第1の部材から前記第2の樹脂層が除去されることで形成されていることを特徴とする試験用キャリア。 - 請求項1〜4の何れかに記載の試験用キャリアであって、
前記電子部品は、半導体ウェハからダイシングされたダイであることを特徴とする試験用キャリア。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011220358A JP5752002B2 (ja) | 2011-10-04 | 2011-10-04 | 試験用キャリア |
TW101131113A TWI476849B (zh) | 2011-10-04 | 2012-08-28 | Experimental vehicle |
KR1020120106871A KR101375098B1 (ko) | 2011-10-04 | 2012-09-26 | 시험용 캐리어 |
US13/644,140 US8952383B2 (en) | 2011-10-04 | 2012-10-03 | Test carrier |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011220358A JP5752002B2 (ja) | 2011-10-04 | 2011-10-04 | 試験用キャリア |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013079879A JP2013079879A (ja) | 2013-05-02 |
JP5752002B2 true JP5752002B2 (ja) | 2015-07-22 |
Family
ID=47991722
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011220358A Expired - Fee Related JP5752002B2 (ja) | 2011-10-04 | 2011-10-04 | 試験用キャリア |
Country Status (4)
Country | Link |
---|---|
US (1) | US8952383B2 (ja) |
JP (1) | JP5752002B2 (ja) |
KR (1) | KR101375098B1 (ja) |
TW (1) | TWI476849B (ja) |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4855867A (en) * | 1987-02-02 | 1989-08-08 | International Business Machines Corporation | Full panel electronic packaging structure |
JP3226628B2 (ja) * | 1992-10-15 | 2001-11-05 | 三菱電機株式会社 | テープキャリア、それを用いた半導体装置及びその製造方法 |
JP3491700B2 (ja) | 1994-03-18 | 2004-01-26 | 富士通株式会社 | 半導体集積回路装置の試験用キャリア |
JPH07283346A (ja) * | 1994-04-15 | 1995-10-27 | Toshiba Corp | 半導体装置及びその製造方法 |
EP1189270A3 (en) * | 1996-07-12 | 2003-07-16 | Fujitsu Limited | Semiconductor device |
JP2000180469A (ja) | 1998-12-18 | 2000-06-30 | Fujitsu Ltd | 半導体装置用コンタクタ及び半導体装置用コンタクタを用いた試験装置及び半導体装置用コンタクタを用いた試験方法及び半導体装置用コンタクタのクリーニング方法 |
JP3129305B2 (ja) | 1999-02-26 | 2001-01-29 | 日本電気株式会社 | テストキャリア及びベアチップの検査方法 |
JP3565086B2 (ja) * | 1999-04-16 | 2004-09-15 | 富士通株式会社 | プローブカード及び半導体装置の試験方法 |
US7489148B2 (en) * | 2006-07-28 | 2009-02-10 | Advanced Inquiry Systems, Inc. | Methods for access to a plurality of unsingulated integrated circuits of a wafer using single-sided edge-extended wafer translator |
JP2011086880A (ja) * | 2009-10-19 | 2011-04-28 | Advantest Corp | 電子部品実装装置および電子部品の実装方法 |
JP5616119B2 (ja) | 2010-05-10 | 2014-10-29 | 株式会社アドバンテスト | 試験用キャリア |
JP5629670B2 (ja) | 2011-04-20 | 2014-11-26 | 株式会社アドバンテスト | 試験用キャリア |
JP5702701B2 (ja) | 2011-04-20 | 2015-04-15 | 株式会社アドバンテスト | 試験用キャリア |
-
2011
- 2011-10-04 JP JP2011220358A patent/JP5752002B2/ja not_active Expired - Fee Related
-
2012
- 2012-08-28 TW TW101131113A patent/TWI476849B/zh not_active IP Right Cessation
- 2012-09-26 KR KR1020120106871A patent/KR101375098B1/ko not_active IP Right Cessation
- 2012-10-03 US US13/644,140 patent/US8952383B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US8952383B2 (en) | 2015-02-10 |
TWI476849B (zh) | 2015-03-11 |
KR101375098B1 (ko) | 2014-03-18 |
US20130082259A1 (en) | 2013-04-04 |
TW201320214A (zh) | 2013-05-16 |
KR20130036708A (ko) | 2013-04-12 |
JP2013079879A (ja) | 2013-05-02 |
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