JP5737971B2 - 固体撮像装置およびカメラ - Google Patents
固体撮像装置およびカメラ Download PDFInfo
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- JP5737971B2 JP5737971B2 JP2011017112A JP2011017112A JP5737971B2 JP 5737971 B2 JP5737971 B2 JP 5737971B2 JP 2011017112 A JP2011017112 A JP 2011017112A JP 2011017112 A JP2011017112 A JP 2011017112A JP 5737971 B2 JP5737971 B2 JP 5737971B2
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- 238000003384 imaging method Methods 0.000 title claims description 50
- 238000001514 detection method Methods 0.000 claims description 32
- 238000006243 chemical reaction Methods 0.000 claims description 22
- 239000004065 semiconductor Substances 0.000 claims description 21
- 230000002093 peripheral effect Effects 0.000 claims description 20
- 239000013256 coordination polymer Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 230000035945 sensitivity Effects 0.000 description 7
- 239000000463 material Substances 0.000 description 4
- 210000001747 pupil Anatomy 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 206010034960 Photophobia Diseases 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 208000013469 light sensitivity Diseases 0.000 description 1
- 239000004038 photonic crystal Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
- H01L27/14627—Microlenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
- H01L27/14629—Reflectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
- H01L27/14645—Colour imagers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/60—Control of cameras or camera modules
- H04N23/67—Focus control based on electronic image sensor signals
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/60—Control of cameras or camera modules
- H04N23/67—Focus control based on electronic image sensor signals
- H04N23/672—Focus control based on electronic image sensor signals based on the phase difference signals
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/703—SSIS architectures incorporating pixels for producing signals other than image signals
- H04N25/704—Pixels specially adapted for focusing, e.g. phase difference pixel sets
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Automatic Focus Adjustment (AREA)
- Focusing (AREA)
Description
Claims (9)
- 位相差検出方式による焦点検出のための複数の画素を含む固体撮像装置であって、
前記画素は、
互いに独立して信号の読み出しが可能な複数の光電変換部を含む半導体領域と、
第1マイクロレンズと、
前記第1マイクロレンズと前記半導体領域との間に配置された第2マイクロレンズと、
前記第2マイクロレンズと前記半導体領域との間に配置され、平らな上面を有する絶縁膜とを含み、
前記第2マイクロレンズは、中央部と、前記中央部を取り囲む周辺部とを含み、前記中央部は、平らな上面と、前記絶縁膜の前記平らな上面に接触する平らな下面とを有し、前記周辺部は、上面と、前記絶縁膜の前記平らな上面に接触する平らな下面とを有し、前記周辺部の前記上面は、前記周辺部が正のパワーを有するように構成されている、
ことを特徴とする固体撮像装置。 - 前記画素は、前記第2マイクロレンズと前記半導体領域との間に、前記画素の前記複数の光電変換部に対して共通に設けられた導波路を更に含む、
ことを特徴とする請求項1に記載の固体撮像装置。 - 前記導波路は、第1部分と、前記第1部分の側面を取り囲む第2部分とを含み、前記第1部分の屈折率が前記第2部分の屈折率よりも高い、
ことを特徴とする請求項2に記載の固体撮像装置。 - 前記第2マイクロレンズは、回折格子を含む、
ことを特徴とする請求項1乃至3のいずれか1項に記載の固体撮像装置。 - 前記画素は、前記第1マイクロレンズと前記第2マイクロレンズとの間に配置された他の絶縁膜と、前記他の絶縁膜と前記第2マイクロレンズとの間に配置された反射防止構造とを含む、
ことを特徴とする請求項1乃至3のいずれか1項に記載の固体撮像装置。 - 裏面入射型撮像装置として構成されていることを特徴とする請求項1乃至5のいずれか1項に記載の固体撮像装置。
- Fナンバー値が5.6の撮影レンズが用いられた場合に前記第1マイクロレンズを通過する光線は、前記第2マイクロレンズの前記周辺部に入射せず、
Fナンバー値が5.6より小さい撮影レンズが用いられた場合に前記第1マイクロレンズを通過する光線の一部は、前記第2マイクロレンズの前記周辺部に入射する、
ことを特徴とする請求項1乃至6のいずれか1項に記載の固体撮像装置。 - Fナンバー値が5.6の撮影レンズが用いられた場合に前記第1マイクロレンズを通過する光線は、前記第2マイクロレンズの前記周辺部に入射せず、
Fナンバー値が1.4の撮影レンズが用いられた場合に前記第1マイクロレンズを通過する光線の一部は、前記第2マイクロレンズの前記周辺部に入射する、
ことを特徴とする請求項1乃至6のいずれか1項に記載の固体撮像装置。 - 請求項1乃至8のいずれか1項に記載の固体撮像装置と、
前記固体撮像装置から出力される信号を処理する処理部と、
を備えることを特徴とするカメラ。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011017112A JP5737971B2 (ja) | 2011-01-28 | 2011-01-28 | 固体撮像装置およびカメラ |
US13/342,393 US9065992B2 (en) | 2011-01-28 | 2012-01-03 | Solid-state image sensor and camera including a plurality of pixels for detecting focus |
CN201210015490.3A CN102623464B (zh) | 2011-01-28 | 2012-01-18 | 固态图像传感器和照相机 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011017112A JP5737971B2 (ja) | 2011-01-28 | 2011-01-28 | 固体撮像装置およびカメラ |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2012160783A JP2012160783A (ja) | 2012-08-23 |
JP2012160783A5 JP2012160783A5 (ja) | 2014-03-13 |
JP5737971B2 true JP5737971B2 (ja) | 2015-06-17 |
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JP2011017112A Active JP5737971B2 (ja) | 2011-01-28 | 2011-01-28 | 固体撮像装置およびカメラ |
Country Status (3)
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US (1) | US9065992B2 (ja) |
JP (1) | JP5737971B2 (ja) |
CN (1) | CN102623464B (ja) |
Families Citing this family (14)
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JP5864990B2 (ja) | 2011-10-03 | 2016-02-17 | キヤノン株式会社 | 固体撮像装置およびカメラ |
US8890221B2 (en) * | 2012-09-21 | 2014-11-18 | Aptina Imaging Corporation | Backside illuminated image sensor pixels with dark field microlenses |
US9247121B2 (en) * | 2013-04-25 | 2016-01-26 | Ability Enterprise Co., Ltd. | Image sensor, electric device using the same and focusing method of the electric device |
US20140375852A1 (en) * | 2013-06-20 | 2014-12-25 | Canon Kabushiki Kaisha | Solid-state imaging apparatus, method of manufacturing the same, camera, imaging device, and imaging apparatus |
JP2015019143A (ja) * | 2013-07-09 | 2015-01-29 | ソニー株式会社 | 撮像装置、およびカメラシステム |
JP6338442B2 (ja) * | 2013-07-11 | 2018-06-06 | キヤノン株式会社 | 固体撮像素子、測距装置、および撮像装置 |
JP6347621B2 (ja) * | 2014-02-13 | 2018-06-27 | キヤノン株式会社 | 固体撮像素子及び撮像装置 |
JP6300564B2 (ja) * | 2014-02-18 | 2018-03-28 | キヤノン株式会社 | 固体撮像装置及びその製造方法 |
KR102306670B1 (ko) | 2014-08-29 | 2021-09-29 | 삼성전자주식회사 | 이미지 센서 및 그 제조 방법 |
KR20160028196A (ko) * | 2014-09-03 | 2016-03-11 | 에스케이하이닉스 주식회사 | 위상차 검출 픽셀을 구비한 이미지 센서 |
KR20160100569A (ko) * | 2015-02-16 | 2016-08-24 | 삼성전자주식회사 | 이미지 센서 및 이미지 센서를 포함하는 촬상 장치 |
US9883128B2 (en) | 2016-05-20 | 2018-01-30 | Semiconductor Components Industries, Llc | Imaging systems with high dynamic range and phase detection pixels |
US10567636B2 (en) * | 2017-08-07 | 2020-02-18 | Qualcomm Incorporated | Resolution enhancement using sensor with plural photodiodes per microlens |
CN116338833A (zh) * | 2021-12-24 | 2023-06-27 | 长鑫存储技术有限公司 | 微透镜组件、光电转换设备及制造方法和成像系统 |
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2011
- 2011-01-28 JP JP2011017112A patent/JP5737971B2/ja active Active
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2012
- 2012-01-03 US US13/342,393 patent/US9065992B2/en active Active
- 2012-01-18 CN CN201210015490.3A patent/CN102623464B/zh active Active
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CN102623464B (zh) | 2015-04-22 |
US20120194714A1 (en) | 2012-08-02 |
US9065992B2 (en) | 2015-06-23 |
JP2012160783A (ja) | 2012-08-23 |
CN102623464A (zh) | 2012-08-01 |
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