JP5720261B2 - 電子回路及び送受信システム - Google Patents
電子回路及び送受信システム Download PDFInfo
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- JP5720261B2 JP5720261B2 JP2011009278A JP2011009278A JP5720261B2 JP 5720261 B2 JP5720261 B2 JP 5720261B2 JP 2011009278 A JP2011009278 A JP 2011009278A JP 2011009278 A JP2011009278 A JP 2011009278A JP 5720261 B2 JP5720261 B2 JP 5720261B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structure Of Printed Boards (AREA)
- Waveguide Switches, Polarizers, And Phase Shifters (AREA)
- Transceivers (AREA)
Description
12 誘電体基板
13 第1の配線
14 第2の配線
15 チップ
16〜18 ボンディングワイヤ
19 制御バイアス印加回路
20 制御回路
Claims (7)
- 接地導体面と、
前記接地導体面上に設けられた誘電体基板と、
前記誘電体基板上に設けられた第1の配線及び第2の配線と、
前記誘電体基板上に設けられトランジスタを搭載した第1のチップと
を含み、前記第1の配線に前記トランジスタのソースが接続され前記第2の配線に前記トランジスタのドレインが接続され、前記接地導体面は前記トランジスタの前記ソース及び前記ドレインに前記誘電体基板を介して最も近い接地電位面であることを特徴とする電子回路。 - 前記接地導体面上に設けられトランジスタを搭載した第2のチップを更に含み、前記第2のチップのトランジスタのソースは前記接地導体面に接地されていることを特徴とする請求項1記載の電子回路。
- 前記第1のチップと前記第2のチップとは略同一の厚さの基板を有することを特徴とする請求項2記載の電子回路。
- 前記第1のチップは、前記誘電体基板の上面に設けられた金属パターンの上に設けられていることを特徴とする請求項1乃至3何れか一項記載の電子回路。
- 前記第1のチップの基板の厚みが200μm以下であることを特徴とする請求項1乃至4何れか一項記載の電子回路。
- 前記誘電体基板の厚みが前記第1の配線及び前記第2の配線を伝搬する信号の波長の1/10以下であることを特徴とする請求項1乃至4何れか一項記載の電子回路。
- 第1の増幅器と、
前記第1の増幅器により増幅された信号を通過又は遮断する第1のスイッチと、
前記第1のスイッチを通過した信号を送信するアンテナと、
前記アンテナにより受信された信号を通過又は遮断する第2のスイッチと、
前記第2のスイッチを通過した信号を増幅する第2の増幅器と
を含み、前記第1のスイッチ及び前記第2のスイッチの少なくとも一方は、
接地導体面と、
前記接地導体面上に設けられた誘電体基板と、
前記誘電体基板上に設けられた第1の配線及び第2の配線と、
前記誘電体基板上に設けられトランジスタを搭載した第1のチップと
を含み、前記第1の配線に前記トランジスタのソースが接続され前記第2の配線に前記トランジスタのドレインが接続され、前記接地導体面は前記トランジスタの前記ソース及び前記ドレインに前記誘電体基板を介して最も近い接地電位面であることを特徴とする送受信システム。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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JP2011009278A JP5720261B2 (ja) | 2011-01-19 | 2011-01-19 | 電子回路及び送受信システム |
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JP2011009278A JP5720261B2 (ja) | 2011-01-19 | 2011-01-19 | 電子回路及び送受信システム |
Publications (2)
Publication Number | Publication Date |
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JP2012151694A JP2012151694A (ja) | 2012-08-09 |
JP5720261B2 true JP5720261B2 (ja) | 2015-05-20 |
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Application Number | Title | Priority Date | Filing Date |
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JP2011009278A Active JP5720261B2 (ja) | 2011-01-19 | 2011-01-19 | 電子回路及び送受信システム |
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JP (1) | JP5720261B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JP7306289B2 (ja) | 2020-02-10 | 2023-07-11 | 住友電気工業株式会社 | 半導体装置及び増幅器 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0685501U (ja) * | 1993-05-07 | 1994-12-06 | 島田理化工業株式会社 | マイクロストリップ基板に対するpinダイオードの取付け部 |
JP2001177359A (ja) * | 1999-12-17 | 2001-06-29 | Mitsubishi Electric Corp | マイクロ波回路 |
JP2002208848A (ja) * | 2001-01-10 | 2002-07-26 | Toshiba Microelectronics Corp | 半導体スイッチ回路 |
JP2003110302A (ja) * | 2001-10-02 | 2003-04-11 | Alps Electric Co Ltd | スイッチ回路 |
JP2009159059A (ja) * | 2007-12-25 | 2009-07-16 | Samsung Electro Mech Co Ltd | 高周波スイッチ回路 |
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2011
- 2011-01-19 JP JP2011009278A patent/JP5720261B2/ja active Active
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