JP5718117B2 - Light emitting device and manufacturing method thereof - Google Patents

Description

The present invention relates to a light emitting device, a light emitting device having a wavelength conversion layer that converts part of light from the light emitting device into light of different wavelengths, and a method for manufacturing the same.

It has a wavelength conversion layer (resin layer) containing a light emitting element such as a GaN blue light emitting diode (LED) element and a wavelength conversion member (for example, YAG phosphor), and a part of the light from the light emitting element varies depending on the wavelength conversion layer There is known a light-emitting device that converts white light into light and combines it with light from a light-emitting element to obtain white light. In this case, brightness is increased by arranging a plurality of light emitting elements in a line.

17A and 17B show a light emitting device already proposed by the applicant of the present application, in which FIG. 17A is a top view showing a light emitting surface, and FIG. 17B is a cross-sectional view (refer to Patent Document 1).

In FIG. 17, four flip-chip blue light emitting elements 2-1, 2-2, 2-3 and 2-4 are mounted on a wiring substrate 1 made of aluminum nitride (AlN) or the like via bumps 3. It is. Moreover, the wavelength conversion layer 4 is provided in the upper surface and side surface of the light emitting elements 2-1, 2-2, 2-3, 2-4, and the plate-shaped glass plate 5 is provided on the wavelength conversion layer 4. . In this case, the wavelength conversion layer 4 and the glass plate 5 are rectangular. Moreover, the wavelength conversion layer 4 has the inclined surface 4a which faces the end surface of the glass plate 5 from the side surface of the light emitting elements 2-1, 2-4. Further, a frame 6 made of ceramic or resin is provided around the wiring substrate 1, and the frame 6 is connected to the light emitting elements 2-1, 2-2, 2-3, 2-4, the wavelength conversion layer 4 and the glass plate 5. A white resin layer 7 as a reflecting member is provided therebetween. The white resin layer 7 is made of a silicone resin containing a white pigment such as titanium oxide or zinc oxide.

In the light emitting device of FIG. 17, light emitted from the upper surface of the light emitting element 1 is emitted from the glass plate 5 through the wavelength conversion layer 4. In addition, a large amount of light emitted from the side surfaces of the light emitting elements 2-1, 2-2, 2-3 and 2-4 is also inclined surfaces of the white resin layer 7 corresponding to the inclined surfaces 4 a of the wavelength conversion layer 4 or element gap portions. The light is reflected from the curved surfaces 4 b of Y 1, Y 2, and Y 3 and is emitted from the glass plate 5 through the wavelength conversion layer 4. Thereby, the light extraction efficiency is improved.

Japanese Patent Application No. 2010-173852 specification, drawing

However, in the light emitting device already proposed, the white resin layer 7 is irradiated from the side surfaces of the light emitting elements 2-1, 2-2, 2-3 and 2-4 and is in contact with the inclined surface 4 a or the curved surface 4 b. The light path length through which the light emitted to the glass plate 5 by being reflected by the light passes through the wavelength conversion layer 4 is irradiated from the upper surface of the light emitting elements 2-1, 2-2, 2-3 and 2-4, and is white resin. The light emitted directly to the glass plate 5 without being reflected by the layer 7 is longer than the optical path length passing through the wavelength conversion layer 4. For example, the thickness of the wavelength conversion layer 4 on the upper surface of the light emitting elements 2-1, 2-2, 2-3, 2-4 is 50 μm, and If the thickness is 100 μm, the former optical path length is about 100 μm longer than the latter optical path length. Therefore, if the phosphor concentration of the wavelength conversion layer 4 is uniform, the phosphor excited at the glass plate edge portions X1, X2, X3, and X4 and the element gap portions Y1, Y2, and Y3 is excited at the Z immediately above the element. The glass plate edges X1, X2, X3, and X4 and the element gaps Y1, Y2, and Y3 produce a yellowish color that is the emission color of the phosphor, and as a result, light is emitted in the region immediately above the light emitting element. There is a problem that uneven color occurs.

  As a method of selectively adjusting the chromaticity while avoiding the portion immediately above the element Z with respect to the glass plate edge portions X1, X2, X3, and X4 and the element gap portions Y1, Y2, and Y3, that is, without absorbing blue light. As a method for selectively absorbing yellow light, blue light is absorbed in advance at the positions of the glass plate edge portions X1, X2, X3, and X4 and the element gap portions Y1, Y2, and Y3 before the glass plate 5 is mounted. When iron oxide or red phosphor and red pigment are used, blue color itself, which is the emission color of the light emitting element, is absorbed, and the position shift of iron oxide or red phosphor and red pigment occurs. The glass plate edge portions X1, X2, X3, and X4 and the element gap portions Y1, Y2, and Y3 are further yellowish, and the color unevenness is increased.

In order to solve the above-described problems, a light emitting device according to the present invention includes a wiring board, a blue light emitting element mounted on the wiring board, a wavelength conversion layer provided on an upper surface and a side surface of the light emitting element, and a wavelength. A plate-like optical member provided on the conversion layer, and the wavelength conversion layer forms an inclined surface connecting the side surface of the light-emitting element and the plate-like optical member, and is further provided in contact with the inclined surface . A blue resin layer that selectively absorbs light from the wavelength conversion layer without absorbing light is provided . Thereby, the yellowishness of light emission at the edge of the plate-like optical member from the side surface of the light emitting element is selectively absorbed by the blue resin layer.

The method for manufacturing a light emitting device according to the present invention includes a light emitting element mounting step for mounting a blue light emitting element on a wiring substrate, a potting step for potting a resin containing a wavelength conversion member on the light emitting element, and a wavelength conversion. A plate-shaped optical member mounting step of mounting the plate-shaped optical member on the resin containing the member, and mounting the resin containing the wavelength conversion member so that an inclined surface connecting the light emitting element side surface and the plate-shaped optical member is formed; A blue resin injection step of injecting a blue resin that selectively absorbs light from the wavelength conversion member without absorbing light from the light emitting element so as to be in contact with the inclined surface .

According to the present invention, uneven color at the edge of the plate-like optical member can be reduced.

BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows 1st Embodiment of the light-emitting device based on this invention, (A) is a top view which shows a light emission surface, (B) is the BB sectional drawing of (A). It is a figure which shows the absorption spectrum of the phthalocyanine used for the blue pigment of the blue resin layer of FIG. 1, and the emission spectrum of a normal white LED element. The light emitting device of FIG. 1, the light emitting device of FIG. 17, and a glass plate edge with respect to the average value of the chromaticity of the entire area immediately above the element of the light emitting device without a resin having no blue resin layer or white resin layer as a comparative example, It is a table which shows the chromaticity difference of a part. It is a figure which shows the example of a change of the light-emitting device of FIG. 1, (A) is a top view which shows a light emission surface, (B) is the BB sectional drawing of (A). The light emitting device of FIG. 1, the light emitting device of FIG. 17, and the luminance of the element gap with respect to the average value of the chromaticity of the entire area immediately above the element of the light emitting device without resin as a blue resin layer and no white resin layer as a comparative example. (A) is a diagram showing an element gap with respect to the light emitting surface, (B) is a graph showing relative luminance, and (C) is a graph showing average relative luminance. It is a figure which shows 2nd Embodiment of the light-emitting device based on this invention, (A) is a top view which shows a light emission surface, (B) is the BB sectional drawing of (A). It is a figure which shows 3rd Embodiment of the light-emitting device based on this invention, (A) is a top view which shows a light emission surface, (B) is the BB sectional drawing of (A). It is a figure which shows 4th Embodiment of the light-emitting device based on this invention, (A) is a top view which shows a light emission surface, (B) is the BB sectional drawing of (A). It is a figure which shows 5th Embodiment of the light-emitting device based on this invention, (A) is a top view which shows a light emission surface, (B) is the BB sectional drawing of (A). FIG. 9 is a diagram illustrating a light emitting surface in which light distributions of the light emitting device of FIG. 6, the light emitting device of FIG. 7, and the light emitting device of FIG. It is sectional drawing for demonstrating the manufacturing method of the light-emitting device of FIG. It is sectional drawing for demonstrating the manufacturing method of the light-emitting device of FIG. It is a figure which shows 6th Embodiment of the light-emitting device based on this invention, (A) is a top view which shows a light emission surface, (B) is the BB sectional drawing of (A). FIG. 10 is a diagram for explaining color unevenness due to the phosphor in the light emitting device of FIGS. 1, 6, 7, 8, and 9, wherein (A) is a cross-sectional view showing the phosphor on the edge of the glass plate; ) Is a cross-sectional view showing a phosphor in an element gap portion. It is a figure which shows 7th Embodiment of the light-emitting device based on this invention, (A) is a top view which shows a light emission surface, (B) is the BB sectional drawing of (A). It is a figure which shows 8th Embodiment of the light-emitting device based on this invention, (A) is a top view which shows a light emission surface, (B) is the BB sectional drawing of (A). It is a figure which shows the light-emitting device already proposed by this applicant, (A) is a top view which shows a light emission surface, (B) is a BB sectional drawing of (A).

  1A and 1B are diagrams showing a first embodiment of a light-emitting device according to the present invention. FIG. 1A is a top view showing a light-emitting surface, and FIG. 1B is a cross-sectional view taken along line BB in FIG.

  In FIG. 1, a low-viscosity blue resin layer 8 is provided instead of the white resin layer 7 of FIG. In this case, as shown in FIG. 1A, the blue resin layer 8 is in contact with the inclined surface 4a located at the glass plate edge portions X1, X2, X3, and X4 and the side surface of the glass plate immediately above the inclined surface 4a. It is provided so as to be in contact with the curved surface 4b located in the gaps Y1, Y2, and Y3.

  The blue resin layer 8 is made of a silicone resin mixed with a blue pigment having a relatively low concentration. This silicone resin has excellent heat resistance and light resistance and is fluid at room temperature. That is, it has a low viscosity. Further, the blue pigment selectively absorbs the wavelength of yellow light, and is made of, for example, phthalocyanine, Co—Zn—Si series, Co—Si series, vanadium siliconium or the like. Further, a white pigment made of titanium oxide, zinc oxide or the like is added to the blue resin layer 8 in order to improve reflectivity. Hereinafter, a resin containing a blue pigment is referred to as a blue resin, a pigment containing only a white pigment, and a resin not containing a blue pigment as a white resin.

  Next, phthalocyanine as a blue pigment will be described. As shown in FIG. 2A showing the absorption light spectrum of phthalocyanine, phthalocyanine mainly absorbs light having a wavelength of 550 nm or more. Usually, the emission spectrum of a white LED element that emits white light has a wavelength of about 400 to 800 nm, as shown in FIG. Among them, blue is about 400 to 480 nm, and is made of light emitted from the light emitting element without being absorbed by the phosphor. The wavelength range of yellow light is about 480 to 800 nm and is contained in the wavelength conversion layer 4. It consists of fluorescence from a phosphor. The dotted line frame in FIG. 2B is the wavelength range that phthalocyanine absorbs, and phthalocyanine selectively absorbs yellow light from the phosphor without absorbing blue light emission from the light emitting element.

  FIG. 3 shows the light emitting device of FIG. 1, the light emitting device of FIG. 17 using the white resin layer 7 as a comparative example, and the light emitting device without the white resin layer 7 on the inclined surface 4a and the curved surface 4b. The chromaticity differences of the glass plate edge portions X1, X2, X3, and X4 and the element gap portions Y1, Y2, and Y3 with respect to the average value of the chromaticity of the entire area are shown.

  As shown in FIG. 3, the average value 0.035 of the chromaticity difference at the glass plate edges X1, X2, X3, X4 of the blue resin layer 8 of FIG. 1 is the glass plate edge of the white resin layer 7 of FIG. Less than the average value of 0.058 chromaticity difference at X1, X2, X3, X4 and 0.068 the average value of chromaticity difference at the glass plate edges X1, X2, X3, X4 without resin. Can be seen to be relaxed.

  On the other hand, as shown in FIG. 3, the average chromaticity value 0.081 in the element gap portions Y1, Y2, Y3 of the blue resin layer 8 in FIG. 1 is the element gap portions Y1, Y2 in the white resin layer 7 in FIG. The average value of the chromaticity difference at Y3 is 0.64 and the average value of the chromaticity difference at the element gap portions Y1, Y2, and Y3 without resin is larger than 0.075. Therefore, the color unevenness is also largely different. Absent. As shown in FIG. 4, if the amount of resin applied to the wavelength conversion layer 4 is decreased, the curvature of the curved surface 4b increases, and the elements of the blue resin layer 8 in the element gaps Y1, Y2, and Y3 of FIG. Since the height d of the apex of the curved surface 4b from the bottom surface increases, and as a result, the contact area between the wavelength conversion layer 4 and the blue resin layer 8 in the element gap increases, the element gaps Y1, Y2, and Y3 It is considered that the average value of the chromaticity difference becomes small and the color unevenness of the element gap portions Y1, Y2, and Y3 is alleviated.

  FIG. 5 shows the light emitting device of FIG. 1, the light emitting device of FIG. 17 using the white resin layer 7 as a comparative example, and the light emitting device without resin without the white resin layer 7 on the inclined surface 4a and the curved surface 4b. The brightness | luminance of the element gap | interval part Y2 with respect to the average value of chromaticity of the whole area of the element direct upper part Z is shown. That is, the cross-sectional luminances in the P-axis direction shown in FIG. The P axis is set so that the horizontal line passes through the center 0 point of the light emitting surface. As a result, the relative luminance shown in FIG. 5B was obtained. 5B is based on the condition that the bottom surface temperature of the wiring board 1 is 70 ° C. and the currents of the light emitting elements 2-1, 2-2, 2-3, 2-4 are 10 mA. Obtained. As shown in FIG. 5C, the average relative luminance of the relative luminance shown in FIG. 5B is the highest in the case of the white resin layer 7, while the case of the blue resin layer 8 and the resin The average relative luminance in the case of none is small and equivalent. As described above, the luminance of the light emitting device of FIG. 1 having the blue resin layer 8 is equivalent to the luminance of the light emitting device without resin, but does not reach the luminance of the light emitting device of FIG. The reason for this is considered that the blue pigment of the blue resin layer 8 absorbs yellow light. Accordingly, the light emitting device in which the average luminance of the light emitting device of FIG. 1 having the blue resin layer 8 is made close to the average luminance of the light emitting device of FIG. This will be described with reference to FIGS.

  FIG. 6 shows a second embodiment of the light emitting device according to the present invention. In FIG. 6, the blue resin layer 8 is in contact with the inclined surface 4a located at the glass plate edge portions X1, X2, and X3 and the side surface of the glass plate, and the curved surface 4b located at the element gap portions Y1, Y2, and Y3. It is provided so that it may touch. On the other hand, the white resin layer 7 is provided in contact with the inclined surface 4a located at the glass plate edge X4. That is, by providing the white resin layer 7 on one side of the rectangular wavelength conversion layer 4 in the short direction, the glass plate edge X1, X2, X3 gives priority to alleviating color unevenness, and the glass plate edge In the part X4, priority is given to improving the luminance. In FIG. 6, the inclined surface 4a is covered with the white resin at the glass plate edge portion X4 and the glass plate side surface is covered with the blue resin. However, the white resin may be provided up to the height of the upper surface of the glass plate and covered to the glass plate side surface. Good.

  FIG. 7 shows a third embodiment of a light emitting device according to the present invention. In FIG. 7, the blue resin layer 8 is in contact with the inclined surface 4a located at the glass plate edge portions X1 and X3 and the side surface of the glass plate, and is in contact with the curved surface 4b located at the element gap portions Y1, Y2, and Y3. It is provided as follows. On the other hand, the white resin layer 7 is provided in contact with the inclined surface 4a located at the glass plate edge portions X2 and X4. That is, by providing the white resin layer 7 on both sides in the short direction of the wavelength conversion layer 4 which is a rectangular rectangle, priority is given to the relief of color unevenness at the glass plate edges X1 and X3, and the glass plate edge X2 , X4 is prioritized to improve luminance. In FIG. 7, at the glass plate edges X2 and X4, the inclined surface 4a is covered with white resin and the side surface of the glass plate is covered with blue resin, but the white resin is provided up to the height of the upper surface of the glass plate and covered to the side surface of the glass plate. May be.

  FIG. 8 shows a fourth embodiment of a light emitting device according to the present invention. In FIG. 8, the blue resin layer 8 is in contact with the inclined surface 4a positioned at the glass plate edge portions X1, X3, and X4 and the side surface of the glass plate, and the curved surface 4b positioned at the element gap portions Y1, Y2, and Y3. It is provided so that it may touch. On the other hand, the white resin layer 7 is provided in contact with the inclined surface 4a located at the glass plate edge X2. That is, by providing the white resin layer 7 on one side of the rectangular wavelength conversion layer 4 in the short direction, priority is given to alleviating color unevenness at the glass plate edges X1, X3, and X4. In the part X2, priority is given to improving the luminance. In FIG. 8, at the glass plate edge X2, the inclined surface 4a is covered with white resin and the glass plate side surface is covered with blue resin. However, the white resin may be provided up to the height of the upper surface of the glass plate and covered to the glass plate side surface. Good.

  FIG. 9 shows a fifth embodiment of a light emitting device according to the present invention. In FIG. 9, the blue resin layer 8 is in contact with the inclined surface 4a located at the glass plate edge portion X1 and the side surface of the glass plate, and so as to be in contact with the curved surface 4b located at the element gap portions Y1, Y2, and Y3. Is provided. On the other hand, the white resin layer 7 is provided in contact with the inclined surface 4a located at the glass plate edge portions X2, X3, and X4. In other words, by providing the white resin layer 7 on both sides in the short direction and one end in the longitudinal direction of the wavelength conversion layer 4 that is a rectangular rectangle, priority is given to the relaxation of color unevenness at the glass plate edge X1, and the glass In the plate edge portions X2, X3, and X4, priority is given to improving the luminance. In FIG. 9, at the glass plate edges X2, X3, and X4, the inclined surface 4a is covered with white resin, and the glass plate side surface is covered with blue resin. However, the white resin is provided up to the height of the glass plate upper surface, up to the glass plate side surface. It may be covered.

  Accordingly, as shown in FIGS. 6 to 9, the resin in contact with the inclined surface 4a can be selected from the blue resin and the white resin depending on the edge of the glass plate where the inclined surface is located when viewed from above. . If a blue resin is selected, light emission from the edge of the glass plate will improve color unevenness, and if a white resin is selected, the luminance of light emission from the edge of the glass plate will be improved.

  FIG. 10 is a diagram for explaining the light distribution superimposed when the light emitting device of FIG. 6, the light emitting device of FIG. 7, and the light emitting device of FIG. 8 are arranged in the longitudinal direction in the reflector type lamp. In this case, the superimposed light distribution is divided into regions A, B, and C. In the regions A and C where the light emission at the end of the glass plate in the longitudinal direction overlaps, the light emitting devices of FIGS. 6, 7 and 8 are both on the inclined surface 4a of the glass plate edge X1 and X3 in the longitudinal direction. Since the blue resin is in contact with each other, the light from each device has already been improved in chromaticity, and there is no change in the improved chromaticity after overlapping. On the other hand, in the region B, light of different emission chromaticities from the portion directly above the device, the edge of the glass plate in the short direction, and the device gap overlap, so the chromaticity is averaged. Therefore, white resin is used for the edge of the glass plate located on the opposite side of the arranged light emitting devices, and the light emission is yellowish, but the light directly above the element overlaps this area. The yellowish color is alleviated. Further, since the luminance of the region using the white resin layer is improved, the average luminance in the P-axis direction is also improved. That is, in each individual light emitting device, a blue pigment is applied to the inclined surface 4a of the glass plate edge in the arrangement direction of the light emitting devices in advance, and white is applied to the glass plate edge located on the opposite side of the arranged light emitting devices. By applying the resin, the entire light emission in which the plurality of light emitting devices overlap with each other can be improved in luminance and free from color unevenness. Even when a plurality of light emitting devices are arranged, if the direction in which the color unevenness is to be improved is determined by the direction of light distribution, the blue pigment may be applied to only one of the regions in the arrangement direction of the light emitting devices. For example, if it is desired to improve the color unevenness of the area A and prioritize the brightness in the area C, the white resin may be in contact with the inclined surface 4a located at the glass plate edge X3 of each light emitting device. Thus, it is advantageous in the above-described reflector type lamp that the color unevenness of the light at the edge of the glass plate is alleviated.

  Next, a method for manufacturing the light emitting device of FIG. 1 will be described with reference to FIGS.

  First, referring to the mounting process of FIG. 11A, the light emitting elements 2-1, 2-2, 2-3, and 2-4 are mounted on the wiring substrate 1 via the bumps 3.

  Next, referring to the potting step in FIG. 11B, for example, an appropriate amount of silicone resin 4 ′ containing a YAG phosphor dispersed therein is dropped by a dispenser 111. The potted resin remains in a state where the surface tension is maintained on the upper surface of the element.

  Next, referring to the glass plate mounting step of FIG. 11C, the glass plate 5 is pressed and mounted on the uncured silicone resin 4 ′ slowly using the collet chuck 112. As a result, the silicone resin 4 ′ wets and spreads on the lower surface of the glass plate 5 and also spreads on the upper and side surfaces of the light emitting elements 2-1, 2-2, 2-3 and 2-4. At this time, at the edge of the glass plate 5, the silicone resin 4 ′ has the inclined surface 4 a connecting the lower surface of the glass plate 5 and the side surface of the light emitting element, and at the same time, the meniscus curved surface 4 b at the element gap. The glass plate is mounted while maintaining the surface tension of the silicone resin 4 ′. The glass plate mounting step may be performed by removing the collet chuck 112 when the glass plate 5 is in contact with a part of the silicone resin 4 ′ and spreading the silicone resin 4 ′ by the weight of the glass plate 5.

  Next, referring to the frame mounting step in FIG. 12A, the frame 6 is mounted on the outer periphery of the upper surface of the wiring board 1 using an adhesive.

  Next, referring to the blue resin injection step of FIG. 12B, the blue resin is dispensed between the frame 6 and the light emitting elements 2-1, 2-4, the wavelength conversion layer 4 and the glass plate 5 by the dispenser 113. inject. As a result, the blue resin is filled under the edge of the glass plate 5 and covers the inclined surface 4 a and the side surface of the glass plate 5. At the same time, since the blue resin has a low viscosity as described above, the periphery of the bump 3 below the light emitting elements 2-1, 2-2, 2-3, 2-4 and the light emitting elements 2-1, 2-2. It fills so that it may also contact | adhere also to the curved surface 4b of the element gap | interval part between 2-3 and 2-4. When the blue resin is cured by a curing process, a blue resin layer 8 is formed.

  6, 7, 8, and 9, a white resin injection process for injecting the white resin layer 7 is performed before the blue resin injection process in FIG. Provide. The white resin injection step is performed by filling the white resin along the inclined surface 4a at the edge of the glass plate where the white resin is to be provided. In this case, the white resin used in the white resin injecting step is a highly viscous resin that does not spread out even before being cured. Therefore, it fills only under the predetermined glass plate edge, but does not fill the lower part of the light emitting elements 2-1, 2-2, 2-3, 2-4 and the lower part of the element gap.

FIG. 13 shows a sixth embodiment of a light emitting device according to the present invention. The blue resin layer 8 ′ is in contact with the inclined surface 4 a and the white resin layer 7 is in contact with the side surface of the glass plate 5 at the glass plate edges X 2 and X 4 at both ends in the short direction. In FIG. 13, the blue resin layer 8 ′ has a high viscosity unlike the low viscosity blue resin layer 8 of FIGS. 1, 6, 7, 8, and 9, and the glass plate edges X1, X2, X3. , X4. The white resin layer 7 is provided so as to be in close contact with the side surface of the glass plate 5. Thereby, the relief of the color unevenness of the glass plate edge portions X1, X2, X3, and X4 and the reflection effect of the side surface of the glass plate 5 are obtained.

When the light emitting device of FIG. 13 is manufactured, a high viscosity blue resin is injected and cured in the blue resin injection step of FIG. The blue resin injection step is performed by filling the blue resin along the inclined surface 4a in the region where the blue resin is to be provided. Further, after the blue resin injection step, a white resin injection step for injecting the white resin layer 7 is provided, and the white resin is injected onto the blue resin layer 8 ′ until the side surface of the glass plate 5 is covered and cured. The white resin layer 7 in this case uses a low viscosity resin. In the white resin injection step, the white resin is injected up to the periphery of the bumps on the lower surface of the element and the element gap. Further, in the glass plate edge portions X1 and X3 where the blue resin layer 8 is not provided, the white resin covers both the inclined surface 4a and the glass plate side surface. In FIG. 13, the glass plate edges X2 and X4 are used. However, the glass plate edge is such that the blue resin layer 8 ' is in contact with the inclined surface 4a and the white resin layer 7 is in contact with the side surface of the glass plate 5 above. Any combination of parts may be used, and not only two sides but also one side or three sides may be used. However, if the four directions are surrounded by a high-viscosity resin, the low-viscosity resin does not enter the periphery of the bumps on the lower surface of the element and the element gap, so that the four directions are not applied. Be sure to open at least one side so that a low-viscosity resin enters.

In the first to sixth embodiments described above, the color unevenness in the glass plate edge portions X1, X2, X3, and X4 is alleviated, but the color unevenness in the element gap portions Y1, Y2, and Y3 is alleviated. Absent. The reason for this is that, as indicated by the black circles in FIG. 14A, the phosphors of the wavelength conversion layer 4 at the edge of the glass plate are distributed in a triangular cross-section, whereas, as indicated by the black circles in FIG. This is because the phosphor of the wavelength conversion layer 4 in the element gap is distributed in a square cross section, and as a result, the phosphor content in the element gap is greater.

  FIG. 15 shows a seventh embodiment of a light emitting device according to the present invention. In FIG. 15, a high density blue resin layer 8a and a low density blue resin layer 8b are provided. In this case, the high concentration blue resin layer 8a has a low viscosity, but the low concentration blue resin layer 8b may have a low viscosity or a high viscosity. The high concentration and low concentration of the blue resin layer are determined by the concentration of the blue pigment such as phthalocyanine.

  The low-viscosity high-concentration blue resin layer 8a is in contact with the periphery of the bump 3 of the light-emitting elements 2-1, 2-2, 2-3, and 2-4 and the curved surface 4b of the element gaps Y1, Y2, and Y3. As a result, the color unevenness of the element gaps Y1, Y2, and Y3 is alleviated.

  The low concentration blue resin layer 8b is formed on the inclined surface of the wavelength conversion layer 4 and the side surface of the glass plate 5 on the high concentration blue resin layer 8a. Thereby, the color unevenness of the glass plate edge portions X1, X2, X3, and X4 is alleviated.

  In this way, in FIG. 15, the uneven color at the edge of the glass plate and the uneven color at the element gap can be alleviated simultaneously.

  When the light emitting device of FIG. 15 is manufactured, in the blue resin injecting step of FIG. 12B, first, a low-viscosity high-concentration blue resin is applied to the periphery of the bumps on the lower surface of the element and the curved surface of the element gap. The inclined surface 4a is in contact with 4b and is cured so as to be opened, thereby forming a high-density blue resin layer 8a. Next, a low-concentration blue resin is injected and cured so as to be in contact with the inclined surface 4a, thereby forming a low-concentration blue resin layer 8b.

  FIG. 16 shows an eighth embodiment of a light emitting device according to the present invention. In FIG. 16, the high density blue resin layer 8a in FIG. 15 is provided, the high viscosity low density blue resin layer 8b ′ is provided in place of the low density blue resin layer 8b, and the white resin layer 7 in FIG. 13 is further provided. It has been.

  The low-viscosity high-concentration blue resin layer 8a is formed around the bumps 3 of the light emitting elements 2-1, 2-2, 2-3, 2-4 and the element gaps Y1, Y2, Y3, as in FIG. In this way, the uneven color of the element gap portions Y1, Y2, and Y3 is alleviated.

  The low-concentration blue resin layer 8b 'is formed on the inclined surface 4a of the wavelength conversion layer 4 below the glass plate edge portions X1, X2, X3, and X4. Thereby, the color unevenness of the glass plate edge portions X1, X2, X3, and X4 is alleviated. In the eighth embodiment, unlike the sixth embodiment, the resin is first injected into the lower surface of the element and the gap between the elements, so that low concentration blue resin is used for the glass plate edges X1, X2, X3. , X4 may be provided in four directions.

  The white resin layer 7 is provided between the side surface of the glass plate 5 and the side surface of the low-concentration blue resin layer 8 b and the frame 6, and a reflection effect on the side surface of the glass plate 5 is obtained.

  In this way, in FIG. 16 as well, the color unevenness at the edge of the glass plate and the color unevenness at the element gap can be alleviated at the same time, and the reflection effect of the side surface of the glass plate 5 can also be achieved.

  When the light emitting device of FIG. 16 is manufactured, in the blue resin injecting step of FIG. 12B, first, a low-concentration high-concentration blue resin is injected and cured, and then the high-concentration blue resin layer 8a. Form. Next, a high-viscosity low-concentration blue resin is injected and cured to form a low-concentration blue resin layer 8b '. Further, a white resin injection step is provided after the blue resin injection step, and the white resin layer 7 is injected between the frame 6 and the side surface of the glass plate 5 and the side surface of the low-concentration blue resin layer 8b 'to be cured. In this case, the white resin layer 7 may have a high viscosity or a low viscosity.

  In the first to sixth embodiments described above, a plurality of light emitting elements are provided, but the present invention can also be applied to one light emitting element. In this case, color unevenness only at the edge of the glass plate is alleviated. Further, the phosphor concentration of the wavelength conversion layer 4 may be uniform or may be large in the lower part. Further, the glass plate 5 is not a glass but may be a plate-like optical member as long as it can transmit light from the light emitting element and light converted by the wavelength conversion layer.

1: Wiring board 2-1, 2-2, 2-3, 2-4: Light emitting element 3: Bump 4: Wavelength conversion layer 4a: Inclined surface 4b: Curved surface 5: Glass plate 6: Frame 7: White resin layer 8: Low viscosity blue resin layer 8 ′: High viscosity blue resin layer 8a: Low viscosity high density blue resin layer 8b: Low density blue resin layer 8b ′: High viscosity low density blue resin layer X1, X2, X3 , X4: Glass plate edge Y1, Y2, Y3: Element gap Z: Directly above the element

Claims (8)

A wiring board;
And blue light-emitting element mounted on the wiring substrate,
And a wavelength conversion layer provided on the upper and side surfaces of the light emitting element,
Comprising a plate-shaped optical member provided on said wavelength conversion layer,
The wavelength conversion layer forms an inclined surface connecting the light emitting element side surface and the plate-like optical member,
And a first blue resin layer that is provided in contact with the inclined surface and selectively absorbs light from the wavelength conversion layer without absorbing light from the light emitting element . The wavelength conversion layer has a rectangular shape that forms the inclined surfaces of four sides when viewed from above,
Further comprising a white resin layer provided in contact with at least one side of the inclined surface of the wavelength conversion layer,
The light emitting device according to claim 1, wherein the first blue resin layer is provided in contact with another side of the inclined surface. 2. The light emitting device according to claim 1, further comprising a white resin layer provided in contact with a side surface of the plate-like optical member above the first blue resin layer. The light emitting element is a plurality of,
Furthermore, the second blue resin layer provided between the wiring substrate and the wavelength conversion layer in the gap portion of the plurality of light emitting elements,
The light emitting device according to claim 1, wherein a concentration of the second blue resin layer is higher than a concentration of the first blue resin layer. A light emitting element mounting step of mounting a blue light emitting element on the wiring board;
A potting step of potting a resin containing a wavelength conversion member on the light emitting element;
A plate-like optical member is mounted on the resin containing the wavelength conversion member, and the plate-like optical member is mounted such that an inclined surface connecting the light-emitting element side surface and the plate-like optical member is formed by the resin containing the wavelength conversion member. An optical member mounting step;
A first blue resin injection step of injecting a first blue resin that selectively absorbs light from the wavelength conversion member without absorbing light from the light emitting element so as to be in contact with the inclined surface. A method for manufacturing a light emitting device. 6. The white resin injection step of injecting a white resin layer in contact with a part of the inclined surface of the wavelength conversion layer on the wiring board before the first blue resin injection step. Method for manufacturing the light emitting device. 6. The light emitting device according to claim 5, further comprising a white resin injection step of injecting a white resin layer in contact with an end portion of the plate-like optical member on the wiring board after the first blue resin injection step. Manufacturing method. The light emitting element mounting step mounts a plurality of light emitting elements,
And a second blue resin injection step of injecting a second blue resin having a higher concentration than the first blue resin between the wiring board and the wavelength conversion layer in the gaps of the plurality of light emitting elements. The manufacturing method of the light-emitting device of Claim 5 which comprises.

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