JP5693807B2 - 基板処理装置用の部品及び皮膜形成方法 - Google Patents
基板処理装置用の部品及び皮膜形成方法 Download PDFInfo
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- JP5693807B2 JP5693807B2 JP2008011372A JP2008011372A JP5693807B2 JP 5693807 B2 JP5693807 B2 JP 5693807B2 JP 2008011372 A JP2008011372 A JP 2008011372A JP 2008011372 A JP2008011372 A JP 2008011372A JP 5693807 B2 JP5693807 B2 JP 5693807B2
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- film
- acid
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- alumite film
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Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/005—Apparatus specially adapted for electrolytic conversion coating
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/04—Anodisation of aluminium or alloys based thereon
- C25D11/18—After-treatment, e.g. pore-sealing
- C25D11/24—Chemical after-treatment
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/04—Anodisation of aluminium or alloys based thereon
- C25D11/18—After-treatment, e.g. pore-sealing
- C25D11/24—Chemical after-treatment
- C25D11/246—Chemical after-treatment for sealing layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/02—Heating or cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/16—Two dimensionally sectional layer
- Y10T428/162—Transparent or translucent layer or section
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/21—Circular sheet or circular blank
- Y10T428/218—Aperture containing
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Drying Of Semiconductors (AREA)
- Chemical Vapour Deposition (AREA)
Description
続されており、該高周波電源20は高周波電力をサセプタ12に供給する。これにより、サセプタ12は下部電極として機能する。また、整合器22は、サセプタ12からの高周波電力の反射を低減して高周波電力のサセプタ12への供給効率を最大にする。サセプタ12は高周波電源20から供給された高周波電力を処理空間Sに印加する。
W ウエハ
10 基板処理装置
11 チャンバ
36 クーリングプレート
37 上部電極体
48,57 アルマイト皮膜
49,56 アルミニウム基材
50 バリア層
51 ポーラス層
52,58 セル
53,59 ポア
55 結晶柱
60 酸化アルミニウム
61 シリコン粒
Claims (4)
- 基板にプラズマ処理を施す基板処理装置用の部品において、
アルミニウムにシリコンを含む合金を主成分とする基材と、
前記基材を、シュウ酸を含む有機酸を主成分とする溶液中に浸漬する陽極酸化処理によって前記基材の表面に形成され、前記基材上に形成されたバリア層と、該バリア層の上に形成されたポーラス層とを有するアルマイト皮膜とを備え、
前記アルマイト皮膜には封孔処理が施されずに、開口通路が確保され、
前記開口通路の径は、前記アルマイト皮膜の表面側から前記バリア層側まで略同じであり、
前記アルマイト皮膜にエチルシリケートを含浸させ、前記エチルシリケートのシリコンを前記アルマイト皮膜内に分散させてシリコン粒として存在させることを特徴とする基板処理装置用の部品。 - 前記合金におけるシリコンの含有質量%が0.4以上且つ0.8以下であることを特徴とする請求項1記載の基板処理装置用の部品。
- 前記基板処理装置用の部品はクーリングプレートであり、該クーリングプレートは複数の貫通孔を有することを特徴とする請求項1又は2記載の基板処理装置用の部品。
- 基板にプラズマ処理を施す基板処理装置用の部品へアルマイト皮膜を形成する皮膜形成方法において、
アルミニウムにシリコンを含む合金を主成分とする基材を準備し、
前記基材を、シュウ酸を含む有機酸を主成分とする溶液中に浸漬して陽極酸化し、
前記陽極酸化によって前記基材の表面に、前記基材上に形成されたバリア層と、該バリア層の上に形成されたポーラス層とを有するアルマイト皮膜を形成し、
前記アルマイト皮膜にエチルシリケートを含浸し、
前記エチルシリケートのシリコンを前記アルマイト皮膜内に分散させてシリコン粒として存在させ、
前記アルマイト皮膜には封孔処理が施されずに、開口通路が確保され、
前記開口通路の径は、前記アルマイト皮膜の表面側から前記バリア層側まで略同じであることを特徴とする皮膜形成方法。
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JP2008011372A JP5693807B2 (ja) | 2008-01-22 | 2008-01-22 | 基板処理装置用の部品及び皮膜形成方法 |
CN2009100002862A CN101510501B (zh) | 2008-01-22 | 2009-01-09 | 基板处理装置用的部件以及皮膜形成方法 |
US12/355,210 US8999475B2 (en) | 2008-01-22 | 2009-01-16 | Component of substrate processing apparatus and method for forming a film thereon |
KR1020090004663A KR20090080899A (ko) | 2008-01-22 | 2009-01-20 | 기판 처리 장치용의 부품 및 피막 형성 방법 |
TW098102289A TWI579412B (zh) | 2008-01-22 | 2009-01-21 | Parts used for substrate processing devices |
KR1020110146591A KR101434008B1 (ko) | 2008-01-22 | 2011-12-29 | 기판 처리 장치용의 부품, 기판 처리 장치 및 알루마이트 피막 형성 방법 |
US14/676,900 US9828690B2 (en) | 2008-01-22 | 2015-04-02 | Component of substrate processing apparatus and method for forming a film thereon |
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JP2008011372A JP5693807B2 (ja) | 2008-01-22 | 2008-01-22 | 基板処理装置用の部品及び皮膜形成方法 |
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CN102312265B (zh) * | 2011-09-22 | 2014-10-01 | 珠海市赛日包装材料有限公司 | 一种铝或铝合金阳极氧化膜的制备方法 |
JP2013108359A (ja) * | 2011-11-17 | 2013-06-06 | Mikuni Corp | 気化器 |
US9850591B2 (en) | 2013-03-14 | 2017-12-26 | Applied Materials, Inc. | High purity aluminum top coat on substrate |
US9663870B2 (en) | 2013-11-13 | 2017-05-30 | Applied Materials, Inc. | High purity metallic top coat for semiconductor manufacturing components |
KR102320533B1 (ko) * | 2015-12-14 | 2021-11-03 | (주)위지트 | 서셉터 표면 처리방법 |
KR101726260B1 (ko) * | 2015-12-28 | 2017-04-12 | (주) 거산케미칼 | 피처리물의 양극산화 방법 |
CN107287641B (zh) * | 2016-03-31 | 2019-04-19 | 比亚迪股份有限公司 | 一种镁合金阳极氧化液、制备方法及镁合金阳极氧化的方法 |
US10262839B2 (en) * | 2016-06-14 | 2019-04-16 | Taiwan Semiconductor Manufacturing Co., Ltd. | Aluminum apparatus with aluminum oxide layer and method for forming the same |
CN107675228B (zh) * | 2017-10-24 | 2019-04-23 | 中泽电气科技有限公司 | 一种配电柜散热壳体的染色方法 |
CN108642542B (zh) * | 2018-05-14 | 2020-04-14 | 上海铝通化学科技有限公司 | 一种金属处理方法及金属塑胶复合材料 |
CN111041538B (zh) * | 2019-12-25 | 2021-01-26 | 八龙应用材料科技(海南)有限公司 | 一种有色合金防腐层的制备方法 |
JP2021195594A (ja) * | 2020-06-15 | 2021-12-27 | 東京エレクトロン株式会社 | プラズマ処理装置及びプラズマ処理方法 |
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KR20120013924A (ko) | 2012-02-15 |
KR20090080899A (ko) | 2009-07-27 |
TWI579412B (zh) | 2017-04-21 |
CN101510501A (zh) | 2009-08-19 |
JP2009173965A (ja) | 2009-08-06 |
KR101434008B1 (ko) | 2014-09-22 |
TW200946720A (en) | 2009-11-16 |
US20090186184A1 (en) | 2009-07-23 |
US20150203981A1 (en) | 2015-07-23 |
US8999475B2 (en) | 2015-04-07 |
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