JP5679548B2 - 回路基板に実装する部品の固定金具 - Google Patents
回路基板に実装する部品の固定金具 Download PDFInfo
- Publication number
- JP5679548B2 JP5679548B2 JP2010173763A JP2010173763A JP5679548B2 JP 5679548 B2 JP5679548 B2 JP 5679548B2 JP 2010173763 A JP2010173763 A JP 2010173763A JP 2010173763 A JP2010173763 A JP 2010173763A JP 5679548 B2 JP5679548 B2 JP 5679548B2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- circuit board
- groove
- plate portion
- solder joint
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/7005—Guiding, mounting, polarizing or locking means; Extractors
- H01R12/7011—Locking or fixing a connector to a PCB
- H01R12/707—Soldering or welding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/1031—Surface mounted metallic connector elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Multi-Conductor Connections (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Connection Of Plates (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
図3はその従来例の固定金具を示す図で、(a)は固定金具の斜視図、(b)はその固定金具を用いてコネクタを回路基板上に固定している状態を示す斜視図である。
(1) 回路基板の表面にクリーム半田を用いて半田付け固定される半田接合板部と、回路基板上に実装しようとする部品に固定される部品固定部とを有し、
前記半田接合板部の下面の半田接合面に、毛細管現象により前記回路基板の表面に塗布されたクリーム半田を吸い上げる先細り断面のV溝が直線的に形成されると共に、前記半田接合板部の上面から下面に向けて、前記V溝に連通すると共に毛細管現象により前記クリーム半田を吸い上げることの可能な連通孔が、前記V溝の延びる方向に離間して複数穿設され、
前記V溝の頂部近傍が、前記連通孔を画成する底面と交差していることを特徴とする回路基板に実装する部品の固定金具。
図1は実施形態の固定金具の構成図で、(a)は斜視図、(b)は(a)のB−B矢視断面図、(c)は(b)で示す部分の斜視図、図2は同固定金具を用いて基板実装コネクタを回路基板上に固定した状態を示す図で、(a)は全体斜視図、(b)はその要部の拡大斜視図である。
2 コネクタ(回路基板上に実装しようとする部品)
10 固定金具
11 半田接合板部
11A 上面
11B 下面
11C,11E 外周縁
12 部品固定部
13 V溝
14 連通孔
Claims (3)
- 回路基板の表面にクリーム半田を用いて半田付け固定される半田接合板部と、回路基板上に実装しようとする部品に固定される部品固定部とを有し、
前記半田接合板部の下面の半田接合面に、毛細管現象により前記回路基板の表面に塗布されたクリーム半田を吸い上げる先細り断面のV溝が直線的に形成されると共に、前記半田接合板部の上面から下面に向けて、前記V溝に連通すると共に毛細管現象により前記クリーム半田を吸い上げることの可能な連通孔が、前記V溝の延びる方向に離間して複数穿設され、
前記V溝の頂部近傍が、前記連通孔を画成する底面と交差していることを特徴とする回路基板に実装する部品の固定金具。 - 前記連通孔が、前記半田接合板部の上面から下面に向かうほど先窄まりの断面形状に形成され、前記V溝の先細り部分に前記連通孔の先窄まり部分が連通していることを特徴とする請求項1に記載の回路基板に実装する部品の固定金具。
- 前記V溝が、前記半田接合板部の外周縁の複数箇所から反対側の外周縁に向けて互いに間隔を開けて直線的に形成されていることを特徴とする請求項2に記載の回路基板に実装する部品の固定金具。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010173763A JP5679548B2 (ja) | 2010-08-02 | 2010-08-02 | 回路基板に実装する部品の固定金具 |
US13/813,743 US9025338B2 (en) | 2010-08-02 | 2011-08-01 | Fixing fitting of parts mounted on circuit board |
KR1020137002598A KR101553754B1 (ko) | 2010-08-02 | 2011-08-01 | 회로 보드에 장착된 구성품에 대한 고정 부품 |
CN201180037854.1A CN103053080B (zh) | 2010-08-02 | 2011-08-01 | 安装在电路板上的部件的固定金具 |
PCT/JP2011/067628 WO2012017997A1 (ja) | 2010-08-02 | 2011-08-01 | 回路基板に実装する部品の固定金具 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010173763A JP5679548B2 (ja) | 2010-08-02 | 2010-08-02 | 回路基板に実装する部品の固定金具 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012033436A JP2012033436A (ja) | 2012-02-16 |
JP5679548B2 true JP5679548B2 (ja) | 2015-03-04 |
Family
ID=45559494
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010173763A Active JP5679548B2 (ja) | 2010-08-02 | 2010-08-02 | 回路基板に実装する部品の固定金具 |
Country Status (5)
Country | Link |
---|---|
US (1) | US9025338B2 (ja) |
JP (1) | JP5679548B2 (ja) |
KR (1) | KR101553754B1 (ja) |
CN (1) | CN103053080B (ja) |
WO (1) | WO2012017997A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104175032B (zh) * | 2014-08-21 | 2016-08-24 | 江苏天舒电器有限公司 | 一种黄铜分液头组件的焊接装置 |
CN107204532A (zh) * | 2016-03-17 | 2017-09-26 | 泰科电子(上海)有限公司 | 连接器 |
JP2020102389A (ja) * | 2018-12-25 | 2020-07-02 | 住友電装株式会社 | 基板用コネクタ |
JP2023170398A (ja) * | 2022-05-19 | 2023-12-01 | 株式会社オートネットワーク技術研究所 | 基板用コネクタ |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2529849Y2 (ja) * | 1990-12-25 | 1997-03-19 | ヒロセ電機株式会社 | 表面実装用コネクタの補強金具構造 |
US5120256A (en) * | 1991-07-16 | 1992-06-09 | Walden John D | Retention system for a connector housing |
JPH05326807A (ja) * | 1992-05-22 | 1993-12-10 | Mitsubishi Electric Corp | 面実装形lsiのリード |
JP3667786B2 (ja) | 1994-03-17 | 2005-07-06 | インテル・コーポレーション | Icソケットおよびそのプリント基板との導通接続状態の検査方法 |
JPH07283422A (ja) * | 1994-04-07 | 1995-10-27 | Nippondenso Co Ltd | 半導体装置およびその製造方法 |
JP3890909B2 (ja) * | 2001-03-19 | 2007-03-07 | カシオ計算機株式会社 | 電子部品およびその接合方法 |
JP2002334964A (ja) * | 2001-05-08 | 2002-11-22 | Hitachi Ltd | 半導体装置 |
CN101145416A (zh) * | 2006-09-15 | 2008-03-19 | 富葵精密组件(深圳)有限公司 | 表面贴装电子元件 |
US7338299B1 (en) | 2003-08-06 | 2008-03-04 | Foxconn Advanced Technology Inc. | Surface mounted electronic component |
JP4013914B2 (ja) | 2004-04-12 | 2007-11-28 | 住友電装株式会社 | 基板用コネクタ |
JP2006048971A (ja) * | 2004-07-30 | 2006-02-16 | Jst Mfg Co Ltd | 補強タブ、この補強タブを備えたコネクタ及び電気部品の回路基板への接続構造 |
JP2006086028A (ja) * | 2004-09-16 | 2006-03-30 | I-Pex Co Ltd | 電気コネクタ |
US7467956B2 (en) * | 2004-09-29 | 2008-12-23 | Autonetworks Technologies, Ltd. | Board connector |
JP4498914B2 (ja) * | 2004-12-27 | 2010-07-07 | 矢崎総業株式会社 | 固定金具 |
CN2824326Y (zh) * | 2005-07-25 | 2006-10-04 | 龚忠祥 | 连接器用焊接头结构改良 |
JP5745792B2 (ja) * | 2010-08-02 | 2015-07-08 | 矢崎総業株式会社 | 回路基板に実装する部品の固定金具 |
JP5656117B2 (ja) * | 2011-04-12 | 2015-01-21 | 住友電装株式会社 | 基板用コネクタ |
-
2010
- 2010-08-02 JP JP2010173763A patent/JP5679548B2/ja active Active
-
2011
- 2011-08-01 WO PCT/JP2011/067628 patent/WO2012017997A1/ja active Application Filing
- 2011-08-01 US US13/813,743 patent/US9025338B2/en active Active
- 2011-08-01 KR KR1020137002598A patent/KR101553754B1/ko active IP Right Grant
- 2011-08-01 CN CN201180037854.1A patent/CN103053080B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR20130033432A (ko) | 2013-04-03 |
KR101553754B1 (ko) | 2015-09-16 |
US9025338B2 (en) | 2015-05-05 |
CN103053080A (zh) | 2013-04-17 |
CN103053080B (zh) | 2015-05-27 |
WO2012017997A1 (ja) | 2012-02-09 |
US20130128481A1 (en) | 2013-05-23 |
JP2012033436A (ja) | 2012-02-16 |
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