JP5658477B2 - 圧力センサ - Google Patents
圧力センサ Download PDFInfo
- Publication number
- JP5658477B2 JP5658477B2 JP2010092429A JP2010092429A JP5658477B2 JP 5658477 B2 JP5658477 B2 JP 5658477B2 JP 2010092429 A JP2010092429 A JP 2010092429A JP 2010092429 A JP2010092429 A JP 2010092429A JP 5658477 B2 JP5658477 B2 JP 5658477B2
- Authority
- JP
- Japan
- Prior art keywords
- differential pressure
- diaphragm
- static pressure
- pressure diaphragm
- static
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
- G01L9/0052—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements
- G01L9/0054—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements integral with a semiconducting diaphragm
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/02—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning
- G01L9/04—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning of resistance-strain gauges
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L15/00—Devices or apparatus for measuring two or more fluid pressure values simultaneously
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/02—Arrangements for preventing, or for compensating for, effects of inclination or acceleration of the measuring device; Zero-setting means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L7/00—Measuring the steady or quasi-steady pressure of a fluid or a fluent solid material by mechanical or fluid pressure-sensitive elements
- G01L7/02—Measuring the steady or quasi-steady pressure of a fluid or a fluent solid material by mechanical or fluid pressure-sensitive elements in the form of elastically-deformable gauges
- G01L7/08—Measuring the steady or quasi-steady pressure of a fluid or a fluent solid material by mechanical or fluid pressure-sensitive elements in the form of elastically-deformable gauges of the flexible-diaphragm type
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Measuring Fluid Pressure (AREA)
- Micromachines (AREA)
- Pressure Sensors (AREA)
Description
まず、本発明の第1実施形態に係る圧力センサについて説明する。図1は、本実施形態に係る圧力センサに用いられているセンサチップの構成を示す上面図である。図2は図1のII−II断面図であり、図3はIII−III断面図である。本実施形態に係る圧力センサは、半導体のピエゾ抵抗効果を利用した半導体圧力センサである。
次に、本発明の第2実施形態に係る圧力センサの構成について、図8を用いて説明する。図8は、圧力センサに用いられるセンサチップの構成を示す上面図である。本実施の形態では、静圧用ゲージ15b・15dの配置が第1実施形態と異なっている。また静圧用ダイアフラム17が正方形状となった構成を有している。これらの配置以外の構成については、第1実施形態と同様であるため、説明を省略する。そして、図8(a)及び図8(b)では、静圧用ゲージ15b・15dがそれぞれ異なる配置になっている。
2…絶縁層
3…第2半導体層
4…差圧用ダイアフラム
5…差圧用ゲージ
5a…差圧用ゲージ(第2の差圧用ゲージ)
5c…差圧用ゲージ(第1の差圧用ゲージ)
9…レジスト
10…センサチップ
11…台座
15(15b・15d)…静圧用ゲージ
17…静圧用ダイアフラム
18 貫通孔
19 レジスト
29 マスク
Claims (5)
- 基板と、前記基板の中央部に設けられた差圧用ダイアフラムと、前記差圧用ダイアフラムの外側に設けられた唯一の静圧用ダイアフラムと、を備える圧力センサであって、
前記差圧用ダイアフラムの第1の端辺上のみに差圧用ゲージが形成され、前記差圧用ゲージは、前記差圧用ダイアフラムの前記第1の端辺上に設けられ前記差圧用ダイアフラムの中心に対する径方向に沿って形成された第1の差圧用ゲージと、前記差圧用ダイアフラムの前記第1の端辺上において前記第1の差圧用ゲージの近傍に設けられ前記径方向と垂直な周方向に沿って形成された第2の差圧用ゲージと、を含み、
前記唯一の静圧用ダイアフラムは、前記差圧用ダイアフラムの中心を挟んで前記第1の端辺に対向する前記差圧用ダイアフラムの第2の端辺と、前記中心を挟んで前記第1の端辺に対向する前記基板の端部の頂点と、の間に配置されている、圧力センサ。 - 前記基板と接合された台座をさらに備え、
前記差圧用ダイアフラムの前記第1の端辺から前記基板の端部までの間に、前記台座と
前記基板との非接合領域が形成されている、請求項1に記載の圧力センサ。 - 前記静圧用ダイアフラムは、前記径方向に配置する端辺が前記周方向に配置する端辺よ
り短い形状であり、
前記静圧用ダイアフラムの中央部と前記周方向に配置する端部に、それぞれ静圧用ゲー
ジが設けられている、請求項2に記載の圧力センサ。 - 前記静圧用ダイアフラムは、長方形状に形成される、請求項3に記載の圧力センサ。
- 前記静圧用ダイアフラムは、正方形状に形成され、
前記静圧用ダイアフラムの隣接する2つの端辺上に、それぞれ配列方向を揃えて静圧用
ゲージが設けられている、請求項2に記載の圧力センサ。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010092429A JP5658477B2 (ja) | 2010-04-13 | 2010-04-13 | 圧力センサ |
KR1020110032786A KR101223862B1 (ko) | 2010-04-13 | 2011-04-08 | 압력 센서 |
US13/085,837 US8522619B2 (en) | 2010-04-13 | 2011-04-13 | Pressure sensor |
CN201110097553.XA CN102252789B (zh) | 2010-04-13 | 2011-04-13 | 压力传感器 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010092429A JP5658477B2 (ja) | 2010-04-13 | 2010-04-13 | 圧力センサ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011220935A JP2011220935A (ja) | 2011-11-04 |
JP5658477B2 true JP5658477B2 (ja) | 2015-01-28 |
Family
ID=44759943
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010092429A Expired - Fee Related JP5658477B2 (ja) | 2010-04-13 | 2010-04-13 | 圧力センサ |
Country Status (4)
Country | Link |
---|---|
US (1) | US8522619B2 (ja) |
JP (1) | JP5658477B2 (ja) |
KR (1) | KR101223862B1 (ja) |
CN (1) | CN102252789B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018169177A (ja) * | 2017-03-29 | 2018-11-01 | パナソニックIpマネジメント株式会社 | 圧力センサ素子と、これを用いた圧力センサ |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5454628B2 (ja) * | 2012-06-29 | 2014-03-26 | 株式会社デンソー | 圧力センサ |
CN103630274B (zh) * | 2013-12-06 | 2015-08-26 | 西安交通大学 | 一种基于微机电系统的挠曲电式微压力传感器 |
GB2521163A (en) * | 2013-12-11 | 2015-06-17 | Melexis Technologies Nv | Semiconductor pressure sensor |
US10317297B2 (en) | 2013-12-11 | 2019-06-11 | Melexis Technologies Nv | Semiconductor pressure sensor |
JP6922788B2 (ja) * | 2018-03-05 | 2021-08-18 | 三菱電機株式会社 | 半導体圧力センサ |
JP2022062350A (ja) * | 2020-10-08 | 2022-04-20 | アズビル株式会社 | 圧力測定装置 |
US11650110B2 (en) * | 2020-11-04 | 2023-05-16 | Honeywell International Inc. | Rosette piezo-resistive gauge circuit for thermally compensated measurement of full stress tensor |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10008A (en) * | 1853-09-13 | India-rtjbbee | ||
JPS60201229A (ja) * | 1984-03-27 | 1985-10-11 | Yokogawa Hokushin Electric Corp | 圧力センサ |
US4672853A (en) * | 1984-10-30 | 1987-06-16 | Burr-Brown Corporation | Apparatus and method for a pressure-sensitive device |
JPH0344530A (ja) * | 1989-07-12 | 1991-02-26 | Hitachi Ltd | 複合センサ |
CN1028447C (zh) * | 1990-03-19 | 1995-05-17 | 株式会社日立制作所 | 集成复合传感器以及使用该集成复合传感器的静压和差压传送器 |
JPH0572069A (ja) | 1991-09-17 | 1993-03-23 | Toshiba Corp | 半導体圧力センサ |
JP2865266B2 (ja) * | 1991-12-09 | 1999-03-08 | 富士電機株式会社 | 半導体加速度センサ |
CN1052538C (zh) * | 1993-09-10 | 2000-05-17 | 横河电机株式会社 | 半导体式差压测量装置 |
US5455410A (en) * | 1994-05-03 | 1995-10-03 | Schneider; Eric D. | Filing system scanner and improved bar code |
JP3238001B2 (ja) * | 1994-05-20 | 2001-12-10 | 株式会社日立製作所 | 複合センサ及びこれを用いた複合伝送器 |
JP3129613B2 (ja) * | 1994-11-02 | 2001-01-31 | 横河電機株式会社 | 差圧測定装置 |
JPH09218121A (ja) * | 1996-02-14 | 1997-08-19 | Yokogawa Electric Corp | 半導体差圧測定装置 |
DE753728T1 (de) | 1995-07-14 | 1997-06-26 | Yokogawa Electric Corp | Halbleiter-Druckdifferenzmessvorrichtung |
JP3359493B2 (ja) * | 1996-05-14 | 2002-12-24 | 株式会社山武 | 半導体圧力変換器 |
DE19701055B4 (de) * | 1997-01-15 | 2016-04-28 | Robert Bosch Gmbh | Halbleiter-Drucksensor |
JP3895937B2 (ja) | 2001-03-22 | 2007-03-22 | 株式会社山武 | 差圧・圧力センサ |
JP3891037B2 (ja) * | 2002-05-21 | 2007-03-07 | 株式会社デンソー | 半導体圧力センサおよび半導体圧力センサ用の半導体ウェハ |
JP3915715B2 (ja) * | 2003-03-07 | 2007-05-16 | 株式会社デンソー | 半導体圧力センサ |
JP4511844B2 (ja) | 2004-02-05 | 2010-07-28 | 横河電機株式会社 | 圧力センサ及び圧力センサの製造方法 |
US6988412B1 (en) * | 2004-11-30 | 2006-01-24 | Endevco Corporation | Piezoresistive strain concentrator |
DE102006012831A1 (de) * | 2006-03-21 | 2007-10-04 | Hottinger Baldwin Messtechnik Gmbh | Dehnungsmessstreifen und Messgrößenaufnehmer mit mindestens einem Dehnungsmessstreifen |
JP5227730B2 (ja) * | 2008-10-07 | 2013-07-03 | アズビル株式会社 | 圧力センサ |
JP5227729B2 (ja) * | 2008-10-07 | 2013-07-03 | アズビル株式会社 | 圧力センサ |
JP2011220927A (ja) * | 2010-04-13 | 2011-11-04 | Yamatake Corp | 圧力センサ |
-
2010
- 2010-04-13 JP JP2010092429A patent/JP5658477B2/ja not_active Expired - Fee Related
-
2011
- 2011-04-08 KR KR1020110032786A patent/KR101223862B1/ko active IP Right Grant
- 2011-04-13 US US13/085,837 patent/US8522619B2/en not_active Expired - Fee Related
- 2011-04-13 CN CN201110097553.XA patent/CN102252789B/zh not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018169177A (ja) * | 2017-03-29 | 2018-11-01 | パナソニックIpマネジメント株式会社 | 圧力センサ素子と、これを用いた圧力センサ |
Also Published As
Publication number | Publication date |
---|---|
JP2011220935A (ja) | 2011-11-04 |
US20110247422A1 (en) | 2011-10-13 |
KR20110114462A (ko) | 2011-10-19 |
KR101223862B1 (ko) | 2013-01-17 |
CN102252789B (zh) | 2015-01-07 |
CN102252789A (zh) | 2011-11-23 |
US8522619B2 (en) | 2013-09-03 |
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