JP5647702B2 - Transparent resin molding, optical lens and optical film - Google Patents

Description

  The present invention relates to a transparent resin molded body used for forming an optical lens or an optical film mounted in an electronic component, and an optical lens and an optical film formed from the transparent resin molded body.

  In recent years, electronic components to be mounted have been downsized in order to cope with downsizing and high performance of various electronic devices. At the same time, as a method of mounting electronic components on a circuit board, so-called solder reflow, which is a method of obtaining high mounting density and good production efficiency, is becoming common. Further, in recent years, since use of lead-free solder having a high melting point is desired due to environmental problems, heating at a high temperature of 220 to 270 ° C. has been performed even by solder reflow. Therefore, the electronic component is also required to have heat resistance that can withstand this high temperature.

  The electronic component includes a component incorporating a member requiring transparency such as an optical lens or a transparent film. Conventionally, a molded body of inorganic glass or a transparent thermoplastic resin has been used for these members that require transparency. (Non-Patent Document 1)

“Transparent Resins That Have Been Here” Industrial Research Co., Ltd., page 48, 2001

  However, inorganic glass has a drawback that it has a large specific gravity and is fragile, so it is easily broken, and the broken surface has an acute angle. On the other hand, thermoplastic resins such as polymethyl methacrylate, polycarbonate, and polyethylene terephthalate are lightweight and have excellent mechanical properties and excellent processability, but they are inferior to glass in terms of heat resistance and optical properties (transparency, discoloration, etc.). There was a problem. Therefore, when these thermoplastic resins are used, a resin molded body having sufficient heat resistance (hereinafter referred to as reflow heat resistance) that can withstand the high temperature of solder reflow using lead-free solder is obtained. Not.

  Examples of the resin having better heat resistance than the above resin include polysulfone, polyethersulfone, polyimide, polyetherimide and the like. However, the resin moldings obtained from these have a problem of low transparency in the visible light region (380 to 740 nm) and high birefringence because the resin contains a benzene ring.

  An object of the present invention is to provide a transparent resin molded article having both excellent reflow heat resistance and optical characteristics. The present invention further provides an optical lens and an optical film which are made of the transparent resin molding and have excellent heat resistance and optical properties.

  As a result of diligent research, the present inventor obtained a molding material containing a crosslinkable thermoplastic resin having a high transmittance in the visible to near infrared range as a raw material, and obtained by crosslinking the thermoplastic resin. The present invention has been completed by finding that the above-mentioned problems can be achieved by a resin molded body having a high transmittance in the visible to near infrared range.

That is, the present invention provides the following claims.
While molding a molding material containing a thermoplastic resin, a resin molded body obtained by crosslinking the thermoplastic resin,
The thermoplastic resin is selected from resins whose average transmittance in a range of 600 to 1000 nm in a molded product having a thickness of 2 mm is 60% or more, and the resin molded product is heated at 200 ° C. for 10 minutes. An average transmittance in the range of 600 to 1000 nm when the thickness is 2 mm is 60% or more.

  Here, since the thermoplastic resin is cross-linked, it is a cross-linkable thermoplastic resin. A crosslinkable thermoplastic resin is a thermoplastic resin having a portion (crosslinking site) capable of forming a crosslink in its main chain or side chain, that is, the ability to cause a crosslinking reaction by heating, ionizing radiation irradiation, UV irradiation, etc. The thermoplastic resin which has this.

  After molding the molding material containing the crosslinkable thermoplastic resin, a crosslinked molded product can be obtained by heating, radiation irradiation, or the like. The molding method is not particularly limited, and a known molding method can be employed. For example, an injection molding method, an injection compression molding method, a press molding method, an extrusion molding method, a blow molding method, a vacuum molding method and the like can be mentioned. In the case of forming into a film shape, an extrusion molding method using a T-die, a calendar molding method, an inflation molding method, a press, casting, thermoforming, or the like can also be used.

  The molded product obtained by crosslinking is excellent in heat resistance and rigidity, and in good creep resistance and wear resistance. Molding is easy at the stage before cross-linking, so that a molded body having excellent characteristics can be easily obtained by performing predetermined molding at this stage and performing cross-linking by heating or irradiation after the molding. Can do.

  Examples of the crosslinking method include a heating method, a crosslinking method using an electron beam or other radiation, and the like. A method of crosslinking using an electron beam or other radiation is preferable because it is easy to control without being limited in temperature and fluidity during molding. Examples of radiation include γ rays in addition to electron beams. The degree of cross-linking is not particularly limited, and is set according to the intended resin molded product.

  When the transparent resin molded body of the present invention is heated at 200 ° C. for 10 minutes to a thickness of 2 mm, the average transmittance in the range of 600 to 1000 nm is 60% or more. Heating at 200 ° C. for 10 minutes is a condition considering solder reflow resistance. When this average transmittance is less than 60%, there is a problem that transparency after solder reflow is low.

  In addition, since the average transmittance | permeability in this range of the glass of thickness 2mm is 80% or more, in the range of 600-1000 nm when a transparent resin molding is heated at 200 degreeC for 10 minute (s), and it is 2 mm in thickness. A transparent resin molded product having an average transmittance of 80% or more is preferable.

Among the transparent resin moldings having the above average transmittance, those having a total light transmittance of 60% or more when heated at 200 ° C. for 10 minutes when the thickness of the transparent resin molding is 2 mm are visible. High transparency in the light region is preferable. The total light transmittance is an index representing transparency, and the measurement is performed using the measurement method defined in JIS K 7361. In the visible light range, the total amount of light passing through the test piece and the incident light amount T ₁ is measured. represented by a percentage of the ratio of the light amount T _2.

  On the other hand, when the transparent resin molded body is heated at 200 ° C. for 10 minutes to have a thickness of 2 mm, the transparent resin molded body having an average transmittance in the range of 700 to 1100 nm of 60% or more is in the near infrared region. Is highly transparent and is preferably used for near infrared.

  The transparent resin molded product of the present invention preferably has a storage elastic modulus at 270 ° C. of 0.1 MPa or more (Claim 2). By setting the storage elastic modulus at 270 ° C. to 0.1 MPa or more, satisfactory rigidity can be obtained from room temperature to a high temperature exceeding the reflow temperature. Therefore, the problem of thermal deformation hardly occurs even during reflow heating. More preferably, the storage elastic modulus at 270 ° C. is 1 MPa or more, the problem of thermal deformation is less likely to occur, and a more excellent molded body can be obtained.

  Here, the storage elastic modulus is a term (real number term) constituting a complex elastic modulus representing a relationship between stress and strain when a sinusoidal vibration strain is applied to a viscoelastic body, and a viscoelasticity measuring instrument ( (DMS). More specifically, it is a value measured at a rate of temperature increase of 10 ° C./min by a viscoelasticity measuring device by DVA-200 manufactured by IT Measurement Control Co., Ltd.

  As described above, the transparent resin molded product of the present invention is obtained from a crosslinkable thermoplastic resin, and this thermoplastic resin is 600 to 600 of the molded product when a molded product having a thickness of 2 mm is produced from the resin. It is selected from resins having an average transmittance in the range of 1000 nm of 60% or more. Here, the resin is mainly composed of a polymer, but may contain an oligomer or a monomer. Preferably, the weight average molecular weight is 5000 or more. By using this thermoplastic resin, a transparent resin molded body having an average transmittance in the range of 600 to 1000 nm of 60% or more when heated at 200 ° C. for 10 minutes and having a thickness of 2 mm is obtained. Can do.

  Specifically, the thermoplastic resin is preferably exemplified by a resin composed of one or more selected from the group consisting of transparent polyamide, cyclic polyolefin, fluororesin, polyester, acrylic, polycarbonate, and ionomer resin. Item 3).

Among them, the thermoplastic resin is preferably composed of a monomer composed only of a chemical bond having a main polarizability of 0.6 × 10 ⁻²³ or less (claim 4). As this monomer, in the case where the main polarizability differs depending on the direction with respect to the chemical bond, a monomer having only a chemical bond of 0.6 × 10 ⁻²³ or less in any direction is preferable. When a monomer having a chemical bond exceeding the main polarizability of 0.6 × 10 ⁻²³ is included in the constituent monomer of the thermoplastic resin, the photoelastic constant is increased, the birefringence due to molding or stress is increased, and a clear image is obtained. The problem that it is difficult to obtain is likely to occur.

  Transparent polyamides are disclosed in JP-A-62-1121726, JP-A-63-170418, JP-A-2004-256812, etc., and these have rings such as aromatic rings and alicyclic rings. A polyamide obtained by using a monomer, which is amorphous and has a high glass transition point.

The transparent polyamide can be obtained, for example, by condensing a diamine and a dicarboxylic acid. As the diamine used here,
Branched or unbranched aliphatic diamines having 6 to 14 C atoms, such as 1,6-hexamethylenediamine, 2-methyl-1,5-diaminopentane, 2,2,4- Trimethylhexamethylenediamine, 2,4,4-trimethylhexamethylenediamine, 1,9-nonamethylenediamine, 1,10-decamethylenediamine, 1,12-decamethylenediamine;
Cycloaliphatic diamines having 6 to 22 C atoms, such as 4,4'-diaminodicyclohexylmethane, 3,3'-dimethyl-4,4'-diaminodicyclohexylmethane, 4,4'-diaminodicyclohexylpropane, 1 , 4-diaminocyclohexane, 1,4-bis (aminomethyl) -cyclohexane, 2,6-bis (aminomethyl) -norbornane, or 3-aminomethyl-3,5,5-trimethylcyclohexylamine;
Mention may be made of araliphatic diamines having 8 to 22 C atoms, such as m-xylylenediamine, p-xylylenediamine or bis (4-aminophenyl) propane.

In addition, as dicarboxylic acid,
Branched or unbranched aliphatic dicarboxylic acids having 6 to 22 C atoms, such as adipic acid, 2,2,4-trimethyladipic acid, 2,4,4-trimethyladipic acid, azelain Acid, sebacic acid, or 1,12-dodecanedioic acid;
Cycloaliphatic dicarboxylic acids having 6 to 22 C atoms, such as cyclohexane-1,4-dicarboxylic acid, 4,4'-dicarboxyldicyclohexylmethane, 3,3'-dimethyl-4,4'-dicarboxyldicyclohexyl Methane, 4,4'-dicarboxyldicyclohexylpropane, or 1,4-bis (carboxymethyl) cyclohexane;
Araliphatic dicarboxylic acids having 8 to 22 C atoms, such as 4,4'-diphenylmethane dicarboxylic acid;
Aromatic dicarboxylic acids having 8 to 22 C atoms, such as isophthalic acid, tributylisophthalic acid, terephthalic acid, 1,4-naphthalene dicarboxylic acid, 1,5-naphthalene dicarboxylic acid, 2,6-naphthalene dicarboxylic acid, 2 , 7-naphthalene dicarboxylic acid, diphenic acid, or diphenyl ether-4,4'-dicarboxylic acid.

The transparent polyamide can also be obtained by ring-opening polymerization of lactam or condensation of ω-aminocarboxylic acid. As a raw material monomer used at this time,
A lactam having 6 to 12 C atoms or the corresponding ω-aminocarboxylic acid, ε-caprolactam, ε-aminocaproic acid, capryllactam, ω-aminocaprylic acid, ω-aminoundecanoic acid, lauric lactam, or ω-amino And dodecanoic acid.

As a more specific example of the transparent polyamide that can be used in the present invention,
A polyamide comprising terephthalic acid and an isomer mixture of 2,2,4-trimethylhexamethylenediamine and 2,4,4-trimethylhexamethylenediamine;
A polyamide comprising isophthalic acid and 1,6-hexamethylenediamine,
A copolyamide comprising terephthalic acid / isophthalic acid and 1,6-hexamethylenediamine,
A copolyamide comprising isophthalic acid and 3,3′-dimethyl-4,4′-diaminodicyclohexylmethane and lauric lactam or caprolactam;
(Co) polyamides consisting of 1,12-dodecanedioic acid or 1,10-dodecanedioic acid and 3,3'-dimethyl-4,4'-diaminodicyclohexylmethane, optionally further lauric lactam or caprolactam,
A copolyamide comprising isophthalic acid and 4,4'-diaminodicyclohexylmethane and lauric lactam or caprolactam;
A polyamide comprising 1,12-dodecanedioic acid and 4,4'-diaminodicyclohexylmethane;
Mention may be made of terephthalic acid / isophthalic acid mixtures and 3,3'-dimethyl-4,4'-diaminodicyclohexylmethane, copolyamides composed of lauric lactam, and the like.

  The transparent polyamide may also be a blend of a number of different polyamides within the scope of the present invention. If the blend itself is transparent, the blend components may contain crystalline ones. As a specific product example of transparent polyamide, transparent nylon 12 (trade names Grillamide TR-55, TR-90 (manufactured by Ms. Chemie Japan)) and the like can be mentioned. These transparent polyamides are excellent in UV resistance, and hardly undergo discoloration or deformation even with respect to UV caused by xenon emission or the like.

  A cyclic polyolefin is a polyolefin resin that can be obtained by polymerizing a monomer containing a cyclic olefin monomer. The cyclic olefin monomer is known from JP-A-8-20692, and preferred examples include cyclopentene, 2-norbornene, and tetracyclododecene compounds.

  Specifically, 2-norbornene, 5-methyl-2-norbornene, 5,5-dimethyl-2-norbornene, 5-ethyl-2-norbornene, 5-butyl-2-norbornene, 5-ethylidene-2-norbornene 5-methoxycarbonyl-2-norbornene, 5-cyano-2-norbornene, 5-methyl-5-methoxycarbonyl-2-norbornene, 5-phenyl-2-norbornene, 5-phenyl-5-methyl-2-norbornene Dicyclopentadiene, 2,3-dihydrodicyclopentadiene, tetracyclo-3-dodecene, 8-methyltetracyclo-3-dodecene, 8-ethyltetracyclo-3-dodecene, 8-hexyltetracyclo-3-dodecene, 2,10-dimethyltetracyclo-3-dodecene, 5,10-dimethyltetra Clo-3-dodecene, 1,4: 5,8-dimethano-1,2,3,4,4a, 5,8,8a-2,3-cyclopentadienonaphthalene, 6-ethyl-1,4: 5,8-dimethano-1,4,4a, 5,6,7,8,8a-octahydronaphthalene, 1,4: 5,10: 6,9-trimethano-1,2,3,4,4a, 5,5a, 6,9,9a, 10,10a-dodecahydro-2,3-cyclopentadienoanthracene and the like. Furthermore, adducts of cyclopentadiene and tetrahydroindene, and derivatives and substitutes similar to those mentioned above can be mentioned.

The cyclic polyolefin resin can be obtained by polymerizing a monomer containing the cyclic olefin monomer. The monomer subjected to the polymerization reaction may contain a monomer other than the cyclic olefin monomer. As the monomer other than the cyclic olefin monomer, a monomer having an unsaturated group copolymerizable with the cyclic olefin monomer is used. Specifically,
Ethylene, propylene, 1-butene, 3-methyl-1-butene, 1-pentene, 3-methyl-1-pentene, 4-methyl-1-pentene, 1-hexene, 1-octene, 1-decene, 1- Α-olefins such as dodecene, 1-tetradecene, 1-hexadecene, 1-icocene;
Unsaturated carboxylic acids such as acrylic acid, methacrylic acid, maleic acid, fumaric acid, itaconic acid, citraconic acid, tetrahydrophthalic acid, methyltetrahydrophthalic acid;
Acrylic acid esters and methacrylic acid esters such as methyl acrylate, ethyl acrylate, hydroxyethyl acrylate, methyl methacrylate, ethyl methacrylate, hydroxyethyl methacrylate;
Unsaturated dicarboxylic acid diesters such as dimethyl maleate, dimethyl fumarate, diethyl itaconate, dimethyl citraconic acid;
Unsaturated carboxylic anhydrides such as maleic anhydride, itaconic anhydride, citraconic anhydride, tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride;
Vinyl alcohol and vinyl esters such as vinyl alcohol and vinyl acetate;
Styrenes such as styrene and α-methylstyrene are exemplified.

  More specifically, the cyclic polyolefin-based resin is, for example, a method of random addition copolymerization of the above-mentioned cyclic olefin monomer and another monomer, or ring-opening polymerization of a cyclic olefin monomer together with another monomer. It can be produced by a method of hydrogenating the polymer. As the polymerization conditions such as the catalyst and solvent to be used, and the reaction temperature, known conditions described in JP-A-8-20692 can be employed.

  Examples of the polyolefin resin thus obtained include resins represented by the following structural formula (1) or (2).

In the formula, R ₁ , R ₂ and X are a hydrogen atom, a hydrocarbon group, or a polar group-substituted hydrocarbon group such as a halogen, a hydroxyl group, an ester group, an alkoxy group, a cyano group, an amide group, an imide group or a silyl group. And they may be the same or different.

In the formula, R _{3 to} R ₁₂ are hydrogen atoms or hydrocarbon groups, X is a hydrogen atom, hydrocarbon group, or halogen, hydroxyl group, ester group, alkoxy group, cyano group, amide group, imide group, silyl group. A polar group-substituted hydrocarbon group such as Specific examples of cyclic olefin products include Apel 6013T (manufactured by Mitsui Chemicals).

  Examples of the fluororesin include fluorinated polyimide, fluorinated acrylate, vinylidene fluoride, and ethylene-tetrafluoroethylene copolymer (ETFE).

  Examples of the ionomer resin include olefin ionomers (for example, trade name “Hylamine” manufactured by Mitsui DuPont Polychemical Co., Ltd., trade name “Surlin” manufactured by DuPont) and fluorine ionomers (for example, ETFE ionomer manufactured by Daikin). Can be mentioned.

  When the transparent polyamide is cross-linked, the water absorption decreases. Moreover, since ionomer and polyamide have polarity, the adhesion strength of plating and vapor deposition can be increased. Therefore, it is suitably used for applications such as reflecting mirrors and photoelectric conversion parts, and for forming circuits on lens parts.

  The transparent resin molded product of the present invention preferably further contains a filler, particularly a filler, as a reinforcing material (Claim 5). By containing the filler, it is possible to reduce the heating amount (heating temperature, time) and the irradiation amount of radiation necessary for the storage elastic modulus at 270 ° C. to be 0.1 MPa or more, and the moldability and Heat resistance is improved.

  As the filler, it is desirable to use a so-called transparent filler having a refractive index close to that of the resin in order not to impair the transparency of the molded body. A transparent glass fiber is mentioned as an example of a transparent filler. The addition amount is preferably 0.1 to 50 parts by weight, more preferably 1 to 50 parts by weight, based on 100 parts by weight of the resin. In addition, a filler, a fumed silica, a nanometal filler, or a nanocomposite filler in which the particle diameter of the filler is not more than the wavelength of light can also be used. An example of the organic filler may include bionanofiber (Kyoto University).

  When the content of the filler is less than 0.1 parts by weight, it is necessary to increase the amount of heating, irradiation with an electron beam or the like, and as a result, problems such as coloring of the molded body are likely to occur and the brittleness becomes brittle. There is a tendency. When the filler content exceeds 50 parts by weight, the resulting molded product tends to be brittle.

  The transparent resin molded product of the present invention may further contain a crosslinking aid. It is preferable to perform the crosslinking in combination with a crosslinking aid because the crosslinking is promoted and excellent heat resistance and rigidity can be obtained.

  Examples of crosslinking aids include oximes such as p-quinone dioxime and p, p'-dibenzoylquinone dioxime; ethylene dimethacrylate, polyethylene glycol dimethacrylate, trimethylolpropane trimethacrylate, cyclohexyl methacrylate, acrylic acid / zinc oxide Mixtures, acrylates or methacrylates such as allyl methacrylate; vinyl monomers such as divinylbenzene, vinyltoluene, vinylpyridine; hexamethylene diallyl nadiimide, diallyl itaconate, diallyl phthalate, diallyl isophthalate, diallyl monoglycidyl isocyanurate, triary Allyl compounds such as lucyanurate and triallyl isocyanurate; N, N′-m-phenylenebismaleimide, N, N ′-(4,4′-methyle Diphenylene) maleimide compound such as dimaleimides, and the like. These crosslinking aids may be used alone or in combination. As a method for promoting crosslinking and obtaining excellent heat resistance and rigidity, in addition to the use of a crosslinking aid, introduction of a double bond to the main chain of the thermoplastic resin, introduction of a reactive substituent, etc. Can be mentioned.

  In the transparent resin molded body of the present invention, other components such as an antioxidant, an ultraviolet absorber, a weather resistance stabilizer, a copper damage inhibitor, a flame retardant, a lubricant, as long as the gist of the present invention is not impaired. A conductive agent, a plating imparting agent, or the like can be added.

  Since the transparent resin molding of the present invention is excellent in heat resistance and optical characteristics, an optical disk, an optical lens, an optical film, a prism, a light diffusion plate, an optical card, an optical fiber, an optical mirror, a liquid crystal display element substrate, a light guide plate, etc. It can be suitably used as various optical materials. Among them, Fθ lenses for laser beam printers, camera lenses, video camera lenses, viewfinder lenses, pickup lenses, collimating lenses, projection TV projection lenses, OHP projection lenses, strobe Fresnel lenses, LED lenses and potting, infrared It is particularly suitably used for optical films such as communication lenses (Claim 6), polarizing films, retardation films, light diffusion sheets, prism sheets, condensing sheets, lenticular lenses and the like (Claim 7).

  The transparent resin molded product of the present invention has excellent heat resistance that can withstand reflow using lead-free solder and ITO deposition, and also has high transparency. It is suitably used as a material for those requiring transparency. In particular, it can be suitably used as an optical material constituting an optical lens or an optical film, electronic paper, or a flexible display.

  Next, the best mode for carrying out the present invention will be described with reference to examples. It should be noted that the present invention is not limited to the embodiments described herein, and can be changed to other forms as long as the gist of the present invention is not impaired.

Examples 1-7 and Comparative Examples 1-3
As a crosslinkable thermoplastic resin,
a. Transparent polyamide resin a-1. Grillamide TR-90 (Ms Chemie Japan):
Tg = 155 ° C., average transmittance at 600 to 1000 nm (thickness 2 mm) 91%
a-2. Grillamide TR-55 (Ms Chemie Japan):
Tg = 160 ° C., average transmittance at 600 to 1000 nm (thickness 2 mm) 91%
b. Cyclic polyolefin resin b-1. Apel 6013T (Mitsui Chemicals):
Tg = 145 ° C., average transmittance at 600 to 1000 nm (thickness 2 mm) 90%
Was used.

Each of the crosslinkable thermoplastic resins was blended with the following components in the blending ratios (all parts by weight) shown in Table 1, and a 5 cm × 7 cm × 2 mm thick plate (sample) was molded by injection molding.
Glass fiber (trade name: ECS03T-287 / PL, manufactured by Nippon Electric Glass)
Crosslinking aid a. DA-MGIC: diallyl monoglycidyl isocyanurate (manufactured by Shikoku Chemicals)
B. TDI500: Trimethylolpropane triacrylate (Dainippon Ink Chemical Co., Ltd.)
C. TAIC: triallyl isocyanurate (Nippon Kasei)

  After molding, the sample was irradiated with an electron beam having an irradiation amount shown in Table 1 for crosslinking. Then, the reflow heat resistance, the transmission characteristics (transmittance), the total light transmittance, and the storage elastic modulus (270 ° C.) of the sample were measured by the following methods. The results are also shown in Table 1.

[Measurement method]
Reflow heat resistance:
The sample was left in a constant temperature bath at 260 ° C. for 1 minute to confirm the presence or absence of deformation, and the results are shown in Table 1 based on the following criteria.
○: Not deformed.
Δ: Deforms but maintains shape.
X: It melts completely.

Transmission characteristics (transmittance):
The samples of Example 1 and Example 7 in which a transparent polyamide resin (Grillamide TR-90) was used as the thermoplastic resin and TAIC was blended as a crosslinking aid were left in an atmosphere at 150 ° C. for 4 hours, and the humidity was 70% at 30 ° C. After being treated in this order for 72 hours in the atmosphere and immersed in a 260 ° C. solder bath for 1 minute, the transmittance in the wavelength range of 300 nm to 1200 nm was measured. The results are shown in FIG. 1 (Example 1) and FIG. 2 (Example 7) (in the figure, shown after heat treatment). Further, the transmittance of the sample before the treatment was measured in the same manner, and the results are also shown in FIG. 1 (Example 1) and FIG. 2 (Example 7) (in the figure, shown as before heat treatment).

Total light transmittance:
For the sample (thickness 2 mm) after heating at 200 ° C. for 10 minutes, the ratio of the incident light amount T ₁ and the total light amount T ₂ that passed through the test piece in the visible light range is expressed as a percentage in accordance with JIS K 7361. Show.
Storage modulus:
Storage elastic modulus at 270 ° C. measured at a rate of temperature increase of 10 ° C./min with a viscoelasticity measuring device by DVA-200 manufactured by IT Measurement Control Co., Ltd. for a sample after heating at 200 ° C. for 10 minutes.

  In Comparative Examples 1 and 2 in which the crosslinking aid was not blended and the electron beam irradiation was not performed, as a result of not being crosslinked, it melted at 260 ° C. and was inferior in reflow heat resistance. On the other hand, as is clear from the results of Table 1, Examples 1 to 7 and Comparative Example 3 in which crosslinking was performed by electron beam irradiation were excellent in reflow heat resistance. Further, as is clear from the comparison between Example 5 and Example 6, the reflow heat resistance is improved by blending the inorganic filler.

As shown in Table 1, the molded products of Examples 1 and 7 have a total light transmittance of about 80 to 85%, and excellent transparency comparable to that of inorganic glass is obtained. 1 and FIG. 2 (1) The sample of Example 1 is about 450 nm, the sample of Example 7 is longer than about 470 nm, and the transmittance of the heat-treated sample exceeds 60%. Excellent transmittance is obtained over almost the entire visible range.
(2) In particular, the transmittance of each sample is longer than about 600 nm and shorter than about 1000 nm, and the transmittance of the heat-treated sample exceeds 85%, and excellent transmittance comparable to that of inorganic glass. Has been obtained,
(3) For any sample, on the wavelength side longer than about 700 nm, there is almost no difference in the transmittance before and after the heat treatment, and particularly excellent reflow heat resistance is obtained for the transmittance in this range.
It has been shown.

  In Examples 1 to 7 in which a crosslinking aid was blended and crosslinked, the storage elastic modulus at 270 ° C. after heating at 200 ° C. for 10 minutes is 1 MPa or more, and excellent molding that does not cause the problem of thermal deformation The body is obtained. In Comparative Example 3 in which crosslinking was performed by irradiation with an electron beam, the storage elastic modulus at 270 ° C. was less than 0.1 MPa in Comparative Example 3 in which no crosslinking aid was blended. On the other hand, Comparative Examples 1 and 2 which were not crosslinked were melted at 260 ° C. for 1 minute, and the storage elastic modulus at 270 ° C. could not be measured.

Example 8
Using a material having the same formulation as in Example 1, a Fresnel lens having a size of 15 mm × 7 mm × thickness 2 mm was injection molded. After injection molding, crosslinking was performed by irradiating an electron beam with a dose of 480 kGy. The sample irradiated with the electron beam was mounted with a mounter, and then reflowed at a peak temperature of 260 ° C. The sample thus obtained was subjected to a light emission test using xenon as a light source for a strobe of a digital camera, and was found to have a function as a strobe.

It is a graph which shows the relationship between the wavelength about the sample of Example 1, and the transmittance | permeability. It is a graph which shows the relationship between the wavelength about the sample of Example 7, and the transmittance | permeability.

Claims (5)

2/100 or more by weight of the transparent polyamide and the transparent polyamide, with a molded material containing 10/90 or less of the weight of the crosslinking aid, a resin molded article obtained by crosslinking the transparent polyamide And
The crosslinking aid is selected from the group consisting of diallyl monoglycidyl isocyanurate and triallyl isocyanurate ,
The transparent polyamide is selected from resins whose average transmittance in a range of 600 to 1000 nm in a molded product having a thickness of 2 mm is 60% or more, and the resin molded product is heated to 200 ° C. for 10 minutes to obtain a thickness. When the thickness is 2 mm, the average transmittance in the range of 600 to 1000 nm is 60% or more,
A transparent resin molded article having a storage elastic modulus at 270 ° C. of 1 MPa or more. The content of the crosslinking aid is 2.5% by weight or more based on the weight of the transparent polyamide ,
The transparent resin molding according to claim 1, wherein the storage elastic modulus at 270 ° C is 5 MPa or more. The transparent resin molded product according to claim 1 or 2 , further comprising a filler. An optical lens comprising the transparent resin molding according to any one of claims 1 to 3 . An optical film comprising the transparent resin molding according to any one of claims 1 to 3 .

Images