JP5606560B2 - 電源icパッケージ - Google Patents
電源icパッケージ Download PDFInfo
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- JP5606560B2 JP5606560B2 JP2013004723A JP2013004723A JP5606560B2 JP 5606560 B2 JP5606560 B2 JP 5606560B2 JP 2013004723 A JP2013004723 A JP 2013004723A JP 2013004723 A JP2013004723 A JP 2013004723A JP 5606560 B2 JP5606560 B2 JP 5606560B2
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- 239000002245 particle Substances 0.000 claims description 30
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- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 13
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- 229910017082 Fe-Si Inorganic materials 0.000 claims description 2
- 229910017133 Fe—Si Inorganic materials 0.000 claims description 2
- 238000000034 method Methods 0.000 description 21
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- NIPNSKYNPDTRPC-UHFFFAOYSA-N N-[2-oxo-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 NIPNSKYNPDTRPC-UHFFFAOYSA-N 0.000 description 3
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- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 2
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- AWFYPPSBLUWMFQ-UHFFFAOYSA-N 2-[5-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]-1,3,4-oxadiazol-2-yl]-1-(1,4,6,7-tetrahydropyrazolo[4,3-c]pyridin-5-yl)ethanone Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C1=NN=C(O1)CC(=O)N1CC2=C(CC1)NN=C2 AWFYPPSBLUWMFQ-UHFFFAOYSA-N 0.000 description 1
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- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
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- H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
- H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
- H01F1/20—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Engineering & Computer Science (AREA)
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- Dispersion Chemistry (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Coils Or Transformers For Communication (AREA)
Description
表1に示す組成を有する各磁性材料粉末を篩い分けして表1に示す最大粒径L(最大径)および平均粒径Dを有する磁性粉末を調製した。なお、表1に示す最大粒径は篩いの目開き値とした。各磁性粉末に対してエチルセルロース溶液を16質量%の割合で混合して磁性粉末ペーストをそれぞれ調製した。
実施例1−3および参考例4〜5において作製した第1の磁性層3の上面に、絶縁層としてのポリイミド樹脂を厚さ10μmになるようにバーコーターにて塗布した。次に、その絶縁層上面に実施例1−3および参考例4〜5と同様な平面コイル4を作製した。さらに、その平面コイル4の上面に絶縁層としてのポリイミド樹脂を厚さが10μmになるように塗布した。ついで、その絶縁層の上面に実施例1−3および参考例4〜5と同様な第2の磁性層5を印刷することにより、比較例1−5に係る平面磁気素子としての薄型インダクタをそれぞれ調製した。
表2に示す組成を有する各磁性材料粉末を篩い分けして表2に示す最大粒径L(最大径)および平均粒径Dを有する磁性粉末を調製した。なお、表2に示す最大粒径は篩いの目開き値とした。各磁性粉末に対してエポキシ樹脂溶液を11質量%の割合で混合して磁性粉末ペーストをそれぞれ調製した。
実施例6〜8および参考例9〜10において使用した最大粒径32μmの磁性粉末に代えて、最大粒径が150μmの粗大な磁性粉末を使用した点以外は実施例6〜8および参考例9〜10と同様に処理することにより、比較例6〜10に係る平面磁気素子としての薄型インダクタをそれぞれ調製した。
表3に示す組成を有する各磁性材料粉末を篩い分けして表3に示す最大粒径L(最大径)および平均粒径Dを有する磁性粉末を調製した。なお、表3に示す最大粒径は篩いの目開き値とした。各磁性粉末に対してポリイミド樹脂溶液を12質量%の割合で混合して磁性粉末ペーストをそれぞれ調製した。
実施例11〜13および参考例14〜15において、磁性粉末の結合剤として使用したポリイミド樹脂溶液に代えてシリコーン樹脂を12質量%の割合で添加した点以外は、実施例11〜13および参考例14〜15と同様に第1磁性層、平面コイルおよび第2磁性層の形成乾燥、焼成した後に、基体として使用したポリイミドシートを剥離させることにより、実施例16〜18および参考例19〜20に係る平面磁気素子としての薄型インダクタ1をそれぞれ調製した。なお、各実施例および参考例に係るコイルにおいてはコイル配線同士の間隔Wの線分中に含まれる磁性粉末の個数を3個以上とした。
表4に示す組成を有する磁性粉末を篩い分けして表4に示す最大粒径L(最大径)および平均粒径Dを有する磁性粉末を調製した。なお、表4に示す最大粒径は篩いの目開き値とした。磁性粉末に対してエチルセルロース溶液を16質量%の割合で混合して磁性粉末ペーストをそれぞれ調製した。
実施例21において銅箔を打ち抜いて作製されたスパイラル型平面コイル4に代えてエッチング法によって作製したスパイラルコイルを使用した点以外は実施例21と同様に処理して実施例22に係る平面磁気素子としての薄型インダクタ1を調製した。
表4に示す材料仕様および寸法仕様でスパイラルコイルをエッチング処理により形成することにより図1に示すような実施例23〜24および参考例25〜26に係る薄型インダクタ1をそれぞれ調製した。
表4に示す材料仕様および寸法仕様で製造し、スパイラルコイルをミアンダー型コイルに変更した点以外は参考例25〜26と同様に処理して図4に示すような実施例27〜28に係る薄型インダクタ1aをそれぞれ調製した。
表4に示す材料仕様および寸法仕様で製造し、エッチング法によりスパイラルコイルを製造した点以外は比較例1と同様に処理することにより、比較例11〜12に係る平面磁気素子としての薄型インダクタをそれぞれ調製した。
コイル配線同士の間隔をWとしたときに、長さWの線分中に含有される磁性粒子数を表5に示すように変更した点以外は、実施例11と同様に処理して実施例11と同様に処理して図1に示すような実施例29〜32に係る薄型インダクタをそれぞれ調製した。
Claims (5)
- 磁性粉末と樹脂との混合物から成る第1の磁性層と第2の磁性層との間に平面コイルを有する平面磁気素子を用いた電源ICパッケージにおいて、上記平面コイルのコイル配線同士の間隔をWとする一方、上記磁性粉末の最大径をLとしたときに、関係式W>2Lを満たすと共に、長さWの線分中に含まれる磁性粉末の個数が3個以上であり、上記コイル配線同士の間隔Wが10〜200μmであり、上記磁性粉末は、アモルファス合金、微細結晶合金、純鉄、センダスト、Fe−Ni系合金およびFe− Si系合金の少なくとも1種から成り、上記磁性粉末の平均粒径が0.5μm以上35μm以下であり、上記磁性層中に含有され平面コイルに対向する磁性粉末と上記平面コイルとが、距離1μm以下(0を含む)に近接している一方、上平面磁気素子の厚さが0.4mm以下である平面磁気素子を用いたことを特徴とする電源ICパッケージ。
- 前記長さWの線分中に含まれる磁性粉末の個数が5個以上であることを特徴とする請求項1記載の電源ICパッケージ。
- 前記平面コイルは、金属粉末の焼成体から成ることを特徴とする請求項1乃至請求項2のいずれか1項に記載の電源ICパッケージ。
- 前記平面コイルは、金属箔をエッチングして形成されることを特徴とする請求項1乃至請求項3のいずれか1項に記載の電源ICパッケージ。
- IC一体型であることを特徴とする請求項1乃至請求項4のいずれかに記載の電源ICパッケージ。
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